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SIPMOS Small-Signal-Transistor
Feature
Product Summary
P-Channel
Enhancement mode
Logic Level
Avalanche rated
dv/dt rated
VDS
RDS(on)
ID
-60
-0.17
PG-SOT-23
3
Type
Package
BSS 84 P
PG-SOT-23
H6327:3000pcs/r. YBs
BSS 84 P
PG-SOT-23H6433:10000pcs/r. YBs
VPS05161
Drain
pin 3
Marking
Gate
pin1
Source
pin 2
Symbol
ID
Value
TA=25C
-0.17
TA=70C
-0.14
I D puls
Unit
-0.68
TA=25C
mJ
EAS
2.6
EAR
0.036
dv/dt
-6
VGS
20
Power dissipation
Ptot
0.36
-55... +150
kV/s
TA=25C
Rev 2.6
Page 1
T j , Tstg
55/150/56
2011-06-01
BSS 84 P
Thermal Characteristics
Symbol
Parameter
Values
Unit
min.
typ.
max.
200
@ min. footprint
350
@ 6 cm 2 cooling area 1)
300
Characteristics
Thermal resistance, junction - soldering point
RthJS
K/W
(Pin 3)
SMD version, device on PCB:
RthJA
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
-60
VGS(th)
-1
-1.5
-2
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID =-250A
I DSS
-0.1
-1
-10
-100
I GSS
-10
-100
nA
RDS(on)
12
RDS(on)
5.8
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70 m thick) copper area for drain
connection. PCB is vertical without blown air.
Rev 2.6
Page 2
2011-07-11
BSS 84 P
Electrical Characteristics, at TA = 25 C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
0.065
0.13
S
pF
Dynamic Characteristics
Transconductance
gfs
VDS2*ID*RDS(on)max ,
ID=-0.14A
Input capacitance
Ciss
VGS=0, VDS=-25V,
15
19
Output capacitance
Coss
f=1MHz
Crss
td(on)
VDD=-30V, VGS=-4.5V,
6.7
10
Rise time
tr
ID=-0.14A, RG=25W
16.2
24.3
td(off)
8.6
12.9
Fall time
tf
20.5
30.8
0.25
0.37
0.3
0.45
1.5
-3.42
IS
-0.17 A
-0.68
ns
Qgs
Qgd
Qg
VDD=-48V, ID=-0.17A
VDD=-48V, ID=-0.17A,
nC
VGS=0 to -10V
Reverse Diode
Inverse diode continuous
TA=25C
forward current
Inv. diode direct current, pulsed ISM
Inverse diode forward voltage
VSD
VGS=0, IF=-0.17A
-0.93
trr
VR=-30V, IF=lS,
23
34
ns
Qrr
diF/dt=100A/s
10
15
nC
Rev 2.6
Page 3
-1.24 V
2011-07-11
BSS 84 P
1 Power dissipation
2 Drain current
Ptot = f (TA)
ID = f (TA)
0.38
parameter: VGS 10 V
BSS 84 P
BSS 84 P
-0.18
W
A
0.32
-0.14
-0.12
0.24
ID
P tot
0.28
-0.1
0.2
-0.08
0.16
0.12
-0.06
0.08
-0.04
0.04
-0.02
0
0
20
40
60
80
100
120
0
0
160
20
40
60
80
100
120
TA
ID = f ( VDS )
ZthJA = f (tp )
parameter : D = 0 , TA = 25 C
parameter : D = tp /T
1 BSS 84 P
-10
10 3
10 2
Z thJA
tp = 170.0s
/I D
-10
BSS 84 P
K/W
ID
-10
160
TA
-1
RD
o
S(
VD
1 ms
10 1
n)
D = 0.50
10 ms
0.20
0.10
-10 -2
10 0
0.05
single pulse
0.02
DC
-10 -3 -1
-10
-10
-10
0.01
-10
10
tp
VDS
Rev 2.6
10 -1 -5
-4
-3
-2
-1
0
1
2
10 10 10 10 10 10 10 10
Page 4
2011-07-11
BSS 84 P
5 Typ. output characteristic
ID = f (VDS)
RDS(on) = f (ID)
parameter: Tj = 25 C
parameter: VGS ; Tj = 25 C
BSS 84 P
Ptot = 0.36W
26
j i
W
h
VGS [V]
g a
-2.5
-0.32
f
ID
-0.28
-0.24
-3.5
-4.0
-4.5
-5.0
-5.5
-6.0
-6.5
-7.0
-8.0
-0.12
18
16
14
12
10
h
i
-10.0
j
k
4 V
GS [V] =
-0.04
-0.5
-1
-1.5 -2
-2.5
-3
-3.5
-4
0
0
-5
a
b
c
d
e
f
-2.5 -3.0 -3.5 -4.0 -4.5 -5.0
g
h
i
j
-5.5 -6.0 -6.5 -7.0
ID
gfs = f(ID)
parameter: Tj = 25 C
0.4
0.16
0.3
0.12
g fs
- ID
parameter: Tj = 25 C
0.25
0.1
0.2
0.08
0.15
0.06
0.1
0.04
0.05
0.02
0
0
0.04
0.08
0.12
0.16
0.22
-ID
- VGS
Rev 2.6
k
l
-8.0 -10.0
VDS
0
0
20
-0.08
0
0
-3.0
d g
-0.2
-0.16
BSS 84 P
22
R DS(on)
-0.4
Page 5
2011-07-11
BSS 84 P
9 Drain-source on-state resistance
RDS(on) = f (Tj )
VGS(th) = f (Tj )
21
BSS 84 P
2.4
V
18
98%
16
- V GS(th)
R DS(on)
14
12
1.8
1.6
1.4
10
98%
1.2
0.8
0.6
-20
20
60
2%
typ
0
-60
typ.
100
0.4
-60
180
-20
20
60
100
TA
160
TA
11 Typ. capacitances
C = f (VDS)
IF = f (VSD)
parameter: Tj , tp = 80 s
10
-10 0
BSS 84 P
A
pF
Ciss
C
IF
-10 -1
Coss
10
-10 -2
Tj = 25 C typ
Crss
Tj = 150 C typ
Tj = 25 C (98%)
Tj = 150 C (98%)
10
10
20
-0.4
-0.8
-1.2
-1.6
-2
-2.4 V
-3
VSD
- VDS
Rev 2.6
-10 -3
0
Page 6
2011-07-11
BSS 84 P
13 Typ. avalanche energy
VGS = f (QGate )
-16
BSS 84 P
mJ
V GS
E AS
-12
2
1.5
-10
-8
-6
1
-4
0.5
-2
0
25
45
65
85
105
125
165
0
0
0.2
0.4
0.6
0.8
1.2 nC
1.5
QGate
TA
-72
V (BR)DSS
-68
-66
-64
-62
-60
-58
-56
-54
-60
-20
20
60
100
180
TA
Rev 2.6
Page 7
2011-07-11
BSS 84 P
Published by
Infineon Technologies AG
81726 Munich, Germany
2010 Infineon Technologies AG
All Rights Reserved.
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conditions or characteristics. With respect to any examples or hints given herein, any typical
values stated herein and/or any information regarding the application of the device,
Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,
including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
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For further information on technology, delivery terms and conditions and prices, please
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Due to technical requirements, components may contain dangerous substances. For information
on the types in question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with
the express written approval of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support device or system or to affect
the safety or effectiveness of that device or system. Life support devices or systems are
intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user
or other persons may be endangered.
Rev 2.6
Page 7
2011-07-11