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DCQ PACKAGE
SOT223
(TOP VIEW)
1 2 3 4 5
IN
OUT
GND
FB/NC
EN
TAB IS GND
Typical Application Circuit
TPS737xx
GND EN FB
IN OUT
V
IN
V
OUT
Optional
1.0 F m

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yyyz

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Servo
Error
Amp
Ref
Current
Limit
Thermal
Protection
Bandgap
OUT
FB
R
1
R
2
EN
GND
IN
80kW
8kW
27kW
4MHz
Charge Pump
Standard 1% Resistor Values for
Common Output Voltages
NOTE: V = (R + R )/R x 1.204;
OUT 1 2 2
R || R = 19k for best W
1 2
accuracy.
V
O
1.2V
1.5V
1.8V
2.5V
2.8V
3.0V
3.3V
R
1
Short
23.2kW
28.0kW
39.2kW
44.2kW
46.4kW
52.3kW
R
2
Open
95.3kW
56.2kW
36.5kW
33.2kW
30.9kW
30.1kW
Servo
Error
Amp
Ref
27kW
8kW
Current
Limit
Thermal
Protection
Bandgap
OUT
R
1
R
2
EN
GND
IN
R + R = 80kW
1 2
4MHz
Charge Pump

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DCQ PACKAGE
SOT223
(TOP VIEW)
1 2 3 4 5
IN
OUT
GND
FB/NC
EN
TAB IS GND

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0.5
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
C
h
a
n
g
e

i
n

V
(
%
)
O
U
T
0 100 200 300 400 500 600 700 800 900 1000
I (mA)
OUT
Referred to I = 10mA
OUT
-40 C
+125 C
+25 C
0.20
0.15
0.10
0.05
0
-0.05
-0.10
-0.15
-0.20
C
h
a
n
g
e

i
n

V
(
%
)
O
U
T
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
V V - (V)
IN OUT
+125 C
+25 C
- 40 C
Referred to V = V + 1.0V at I = 10mA
IN OUT OUT
180
160
140
120
100
80
60
40
20
0
V
(
m
V
)
D
O
-50 -25 0 25 50 75 100 150
Temperature ( C)
125
200
180
160
140
120
100
80
60
40
20
0
V
(
m
V
)
D
O
0 100 200 300 400 500 600 700 800 900 1000
I (mA)
OUT
+125C
+25C
V = 2.5V
OUT
-40 C
30
25
20
15
10
5
0
P
e
r
c
e
n
t

o
f

U
n
i
t
s

(
%
)
-
1
.
0
-
0
.
9
-
0
.
8
-
0
.
7
-
0
.
6
-
0
.
5
-
0
.
4
-
0
.
3
-
0
.
2
-
0
.
1
0
0
.
1
0
.
2
0
.
3
0
.
4
0
.
5
0
.
6
0
.
7
0
.
8
0
.
9
1
.
0
V Error (%)
OUT
I = 10mA
OUT
18
16
14
12
10
8
6
4
2
0
P
e
r
c
e
n
t

o
f

U
n
i
t
s

(
%
)
-
1
0
0
-
9
0
-
8
0
-
7
0
-
6
0
-
5
0
-
4
0
-
3
0
-
2
0
-
1
0 0
1
0
2
0
3
0
4
0
5
0
6
0
7
0
8
0
9
0
1
0
0
Worst Case dV /dT (ppm/C)
OUT
I = 10mA
OUT

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3000
2500
2000
1500
1000
500
0
I
(
A
)
m
G
N
D
-50 -25 0 25 50 75 100 125
Temperature (C)
I = 1A
OUT
V = 5.0V
IN
V = 3.3V
IN
V = 2.2V
IN
2500
2000
1500
1000
500
0
I
(
m
A
)
G
N
D
0 200 400 600 800 1000
I (mA)
OUT
V = 5.0V
IN
V = 3.3V
IN
V = 2.2V
IN
1
0.1
0.01
I
(
m
A
)
G
N
D
-50 -25 0 25 50 75 100 125
Temperature (C)
V = 0.5V
ENABLE
V = V + 0.5V
IN OUT
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
C
u
r
r
e
n
t

L
i
m
i
t

(
A
)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
V (V)
IN
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
C
u
r
r
e
n
t

L
i
m
i
t

(
A
)
-50 -25 0 25 50 75 100 125
Temperature (C)
V = 1.2V
OUT
10k 10
90
80
70
60
50
40
30
20
10
0
R
i
p
p
l
e

R
e
j
e
c
t
i
o
n

(
d
B
)
100 1k 100k 1M 10M
Frequency (Hz)
I = 1mA
OUT
C = 1mF
OUT
I = 1mA
OUT
C = Any
OUT
I = 1mA
OUT
C = 10mF
OUT
I = 100mA
OUT
C = Any
OUT
I = 100mA
OUT
C = 10mF
OUT
I = 100mA
O
C = 1mF
O

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1
0.1
0.01
e
V
/
m

(
H
z
)
N
10 100 1k 10k 100k
Frequency (Hz)
C = 1 F m
OUT
C = 10 F m
OUT
I = 150mA
OUT
40
35
30
25
20
15
10
5
0
P
S
R
R

(
d
B
)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
V V - (V)
IN OUT
Frequency = 100kHz
C = 10 F m
OUT
V = 2.5V
OUT
100 s/div m
1V/div
1V/div
2V
0V
V
OUT
V
EN
R = 20W
L
C = 10 F m
OUT
R = 20W
L
C = 1 F m
OUT
60
55
50
45
40
35
30
25
20
V
(
R
M
S
)
N
C (F)
FB
10p 100p 1n 10n
V = 2.5V
OUT
C = 0mF
OUT
R = 39.2kW
1
10Hz < Frequency < 100kHz
100 s/div m
1V/div
1V/div
V
OUT
V
EN
R = 20W
L
C = 10 F m
OUT
2V
0V
R = 20W
L
C = 1 F m
OUT
6
5
4
3
2
1
0
-1
-2
V
o
l
t
s
50ms/div
V
IN
V
OUT

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10
1
0.1
0.01
I
(
n
A
)
E
N
A
B
L
E
-50 -25 0 25 50 75 100 125
Temperature (C)
160
140
120
100
80
60
40
20
0
I
(
n
A
)
F
B
-50 -25 0 25 50 75 100 125
Temperature ( C)
10 s/div m
100mV/div V
OUT
I
OUT
250mA
10mA
C = 10 F m
OUT
C = 10nF
FB
R = 39.2kW
1
5 s/div m
100mV/div V
OUT
V
IN
4.5V
3.5V
C = 10 F m
OUT
V = 2.5V
OUT
C = 10nF
FB

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TPS737xx
GND EN
IN OUT
V
IN
V
OUT

TPS737xx
GND EN FB
IN OUT
V
IN
V
OUT
V =
OUT
1.204
(R + R )
1 2
R
1
R
1
C
FB
R
2
V
N
+32mV
RMS

(R
1
)R
2
)
R
2
+32mV
RMS

V
OUT
V
REF
V
N

mV
RMS

+ 27
mV
RMS
V
V
OUT
(V)

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dV
dT
+
V
OUT
C
OUT
80kW R
LOAD

dV
dT
+
V
OUT
C
OUT
80kW (R
1
)R
2
) R
LOAD

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P
D
+

V
IN
*V
OUT

I
OUT

PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
TPS73701DCQ ACTIVE SOT-223 DCQ 6 78 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TPS73701DCQG4 ACTIVE SOT-223 DCQ 6 78 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TPS73701DCQR ACTIVE SOT-223 DCQ 6 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TPS73701DCQRG4 ACTIVE SOT-223 DCQ 6 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
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to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Sep-2006
Addendum-Page 1
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