Introduction to BYD Introduction to BYD Introduction to BYD Introduction to BYD

Microelectronics Microelectronics
BYD Company Limited BYD Company Limited
Division VI Division VI s o s o
March, 2009
Brief Review of BYD Microelectronics (BME)
BME started operation March 2003
To provide cost effective R&D and product solutions to
China and worldwide markets
To support BYD vertical integration strategy
ensuring its products cost and performance
combination
T f ll h PC d t bil k t To focus on cellphone, PC and automobile markets
BME currently has over 1500 employees
With 70% of design engineers
Located in 25,000 sq.m. facility
BME is located at former BYD Headquarter
q y
Focusing on semiconductor products
CMOS image sensor IC
LCD display driver and sensor IC
Power management IC Power management IC
Power MOSFET
Audio amplifier IC
Analog switch IC
BME has 120,000 sf space for manufacturing (A10 Building in Kuichong Campus)
Growth Record Growth Record
1 5 5 0
1600
1800
Employee ( person )
1 5 5 0
1200
1400
1600
MP Products
Revenue ( million RMB )
800
1000
1200
2 1 1
5 8 5
2 1 0
400
600
3 7
1 5 8
2 1 1
2 . 2
7 . 6
5 6
1 0 8
2 1 0
3
1 2
4 0
6 1
9 1
0
200
2004 2005 2006 2007 2008 2004 2005 2006 2007 2008
And Beyond And Beyond
BME Products Introduction
And Beyond And Beyond
Cellphone Camera
CIF Sensor
VGA Sensor
LCD/LCM
CSTN/STN Driver
UXGA Sensor
CSTN/STN Driver
TFT Driver
Touch Screen Controller
LED Driver
Analog Device
Audio Amplifier
Analog Switch
Power
Power MOSFET
Silicon Microphone
Ambient Noise Cancellation
Li-protection IC
Gas Gauge IC
Others
Memory Card IC
DC-DC
LDO
Charger IC
MOSFET
TVS
Zener Diode
Cellphone Structure and BME IC Products
RF
GPS
Battery Charger
Power Manager
Speaker
Audio
Amplifier
Ant ennas
Digital Baseband
Processor
Audio Codec
USB Tranciever
Key Pad
contr oller
LED Dri ver
LED
Silicon Microphone
ADC
TVS
Mobile TV
Color display
Cmos Sensor
(CIF,VGA,UXGA,QXGA)
Touch Panel
Contr oller
GAS Gauge
Bat t er y
LED
Opt ional
Audio
Zener
Diode
LCD dr iver
(STN,CSTN,TFT QVGA,
TFT QQVGA,TFT QCIF)
Audio Codec
Speaker
Headphone
Analog
Switch
Audio
Amplifier
LED Flash DTV Supply
LCD
Backlight
System
Power
Appli cat ions
and GPU
Pr ocessor
Power Management
BYD Pr oduct s
Products for Automobile Products for Automobile
Development
Planning
Discrete IC
DC-DC/LDO
LED driver
IGBT
Image sensor
Class D
Class
A/B
Battery
Management
Hall
LCD
LCD driver
Memory
BME Departments and Major Products
R&D Dept. Product Dept. III
GM
Other Depts. Product Dept. I Product Dept. II
Power MOSFET VGA 1/4
VGA1/6
STN/CSTN/TFT
Driver
CIS DSP PC
R&D Dept. Product Dept. III Other Depts. Product Dept. I Product Dept. II
Engineering &
Application Dept.
Li-Protection IC
Charger IC
DC/DC IC
VGA1/6
VGA 1/8
2MP 1/4
Resistive/CapacitiveTouch
Screen Controller
Silicon Microphone
Multimedia IC
RF technology
MEMS
Application Dept.
Quality Section
LDO/Motor IC
LED driver IC
IGBT hi / d l
3MP 1/4
VGA Auto
IR Sensor
Class AB/D Audio Amplifier
Analog Switch
A bi t N i C ll ti
HR Section
IGBT chip/module
Gas gauge IC
PMU
IR Sensor Ambient Noise Cancellation
CAN/LIN
MCU
Financial Section
Mass production
Hall Sensor TVS
Zener Diode
Mass production
Under development
In planning
IC Product Flow (Li Protection IC as Example)
BYD
Design
Taiwan2 month cycle time
Taiwan
Mask making
Wafer fab
Shenzhen
y
COB application Wafer testing
Backgrinding,
Highlights:
BYDf IC d i f d
Shenzhen
Shanghai
dicing
Packaging
BYD focuses on IC design, wafer and
product testing to ensure product quality
Product quality is also ensured by
industrys leading vendors
Testing, marking
SMT application
industrys leading vendors
BME Works Strategically with Worlds Most Advanced
P V d Process Vendors
As examples of these vendors:
TSMC (Taiwan) for CISLCD drivers, as well as power management ICs.
Ch t d S i d t (Si ) f LCDd i Chartered Semiconductors (Singapore) for LCD drivers
GEM Services of the US as the device package vendor