Блоки питания и характеристики ATX (ENG)

Power Supply
Design Guide for Desktop Platform Form Factors
Revision 1.2
February 2008
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2
Contents
1 Introduction .............................................................................................................. 9
1.1 Reference Documentation..................................................................................... 9
1.2 Terminology ..................................................................................................... 10
2 Platform Configurations........................................................................................... 13
2.1 Digital Home and Digital Office Platform Configurations - RECOMMENDED ................. 13
3 Electrical ................................................................................................................. 19
3.1 AC Input - REQUIRED ........................................................................................ 19
3.1.1 Input Over Current Protection - REQUIRED ................................................ 19
3.1.2 Inrush Current - REQUIRED ..................................................................... 19
3.1.3 Input Under Voltage - REQUIRED ............................................................. 19
3.2 DC Output - REQUIRED ...................................................................................... 20
3.2.1 DC Voltage Regulation ............................................................................ 20
3.2.2 Output Transient Response - REQUIRED .................................................... 20
3.2.3 Remote Sensing - REQUIRED ................................................................... 21
3.2.4 Other Low Power System Requirements - RECOMMENDED ........................... 21
3.2.5 Output Ripple Noise - REQUIRED .............................................................. 21
3.2.6 Capacitive Load - REQUIRED.................................................................... 22
3.2.7 Closed Loop Stability - REQUIRED ............................................................ 22
3.2.8 +5 VDC / +3.3 VDC Power Sequencing - REQUIRED ................................... 23
3.2.9 Voltage Hold-up Time - REQUIRED ........................................................... 23
3.3 Timing, Housekeeping and Control - REQUIRED..................................................... 23
3.3.1 PWR_OK ............................................................................................... 23
3.3.2 Power-up Cross Loading Condition ............................................................ 24
3.3.3 PS_ON#................................................................................................ 24
3.3.4 +5 VSB................................................................................................. 25
3.3.5 Power-on Time....................................................................................... 25
3.3.6 Rise Time .............................................................................................. 26
3.3.7 Overshoot at Turn-on / Turn-off ............................................................... 26
3.4 Reset after Shutdown ........................................................................................ 26
3.4.1 +5 VSB at Power-down ........................................................................... 26
3.5 Output Protection - REQUIRED ............................................................................ 26
3.5.1 Over Voltage Protection........................................................................... 26
3.5.2 Short Circuit Protection ........................................................................... 27
3.5.3 No-load Situation ................................................................................... 27
3.5.4 Over Current Protection .......................................................................... 27
3.5.5 Over Temperature Protection ................................................................... 27
3.5.6 Output Bypass ....................................................................................... 27
3.5.7 Separate Current Limit for 12V2 - RECOMMENDED...................................... 27
3.5.8 Overall Power Supply Efficiency and ENERGY STAR ..................................... 28
3.5.9 Overall Power Supply Efficiency and Climate Savers§ .................................. 30
4 Mechanical .............................................................................................................. 33
4.1 Labeling and Marking - RECOMMENDED................................................................ 33
4.2 Connectors - REQUIRED ..................................................................................... 33
4.2.1 AC Connector ........................................................................................ 33
4.2.2 DC Connectors ....................................................................................... 33
4.2.2.1 Main Power Connector ............................................................... 34
4.2.2.2 Peripheral Connectors................................................................ 35
4.2.2.3 Floppy Drive Connector.............................................................. 35
4.2.2.4 +12 V Power Connector ............................................................. 36
4.2.2.5 Serial ATA* Power Connectors .................................................... 36
3
4.3 Airflow and Fans - RECOMMENDED.......................................................................37
4.3.1 Fan Location and Direction .......................................................................37
4.3.2 Fan Size and Speed ................................................................................37
4.3.3 Venting .................................................................................................38
5 Acoustics .................................................................................................................39
5.1 Acoustics - RECOMMENDED.................................................................................39
6 Environmental .........................................................................................................41
6.1 Temperature - RECOMMENDED............................................................................41
6.1.1 Thermal Shock (Shipping)........................................................................41
6.2 Humidity - RECOMMENDED .................................................................................41
6.3 Altitude - RECOMMENDED ...................................................................................41
6.4 Mechanical Shock - RECOMMENDED .....................................................................41
6.5 Random Vibration - RECOMMENDED.....................................................................41
7 Electromagnetic Compatibility .................................................................................43
7.1 Emissions - REQUIRED .......................................................................................43
7.2 Immunity - REQUIRED .......................................................................................43
7.3 Input Line Current Harmonic Content - OPTIONAL ..................................................43
7.4 Magnetic Leakage Fields - REQUIRED ...................................................................43
7.5 Voltage Fluctuations and Flicker - REQUIRED .........................................................44
8 Safety ......................................................................................................................45
8.1 North America - REQUIRED .................................................................................45
8.2 International - REQUIRED ...................................................................................45
8.3 Proscribed Materials ...........................................................................................46
8.4 Catastrophic Failure Protection - RECOMMENDED ...................................................46
9 Reliability ................................................................................................................47
9.1 Reliability - RECOMMENDED ................................................................................47
10 CFX12V Specific Guidelines 1.41 ..............................................................................49
10.1 Typical Power Distribution - RECOMMENDED..........................................................49
10.2 Physical Dimensions - REQUIRED .........................................................................53
11 LFX12V Specific Guidelines 1.21...............................................................................55
12 ATX12V Specific Guidelines 2.31 ..............................................................................63
13 SFX12V Specific Guidelines 3.21 ..............................................................................75
13.2 Lower Profile Package - Physical Dimensions - REQUIRED........................................79
13.3 Fan Requirements - REQUIRED............................................................................79
13.4 Top Fan Mount Package - Physical Dimensions - REQUIRED .....................................81
13.6 Reduced Depth Top Mount Fan - Physical Dimensions - REQUIRED ...........................83
13.8 Standard SFX Profile Package - Physical Dimensions - REQUIRED .............................84
13.10 PS3 Form Factor- Physical Dimensions - REQUIRED ................................................86
14 TFX12V Specific Guidelines 2.31 ..............................................................................89
4
14.2 Physical Dimensions - REQUIRED ........................................................................ 94
14.3 Mounting Options - RECOMMENDED..................................................................... 97
14.4 Chassis Requirements - RECOMMENDED............................................................... 97
15 Flex ATX Specific Guidelines 1.01 ............................................................................ 99
15.1 Typical Power Distribution - RECOMMENDED ......................................................... 99
15.2 Physical Dimensions - REQUIRED ...................................................................... 103
Figures
1 Differential Noise Test Setup ..................................................................................... 22
2 Power Supply Timing ................................................................................................ 23
3 PS_ON# Signal Characteristics................................................................................... 25
4 PSU Efficiency as Percentage of Output ....................................................................... 28
5 PSU Efficiency per Power for 450 W PSU ..................................................................... 29
6 PSU Efficiency per Power for 250 W PSU ..................................................................... 30
7 Connectors (Pin-side view, not to scale) ...................................................................... 34
8 Serial ATA* Power Connector..................................................................................... 36
9 Cross Loading Graph for 180 W Configurations............................................................. 49
13 CFX12V Mechanical Outline ....................................................................................... 54
17 Mechanical Outline ................................................................................................... 59
18 Mechanical Details.................................................................................................... 60
19 PSU Slot Feature Detail............................................................................................. 60
20 Recommended Chassis Tab Feature ............................................................................ 61
28 Power Supply Dimensions for Chassis that does not Require Top Venting ......................... 72
29 Power Supply Dimensions for Chassis that Require Top Venting...................................... 73
32 Cross Loading Graph for 270 W Configuration .............................................................. 77
34 40 mm Profile Mechanical Outline............................................................................... 80
35 Chassis Cutout ........................................................................................................ 80
36 Top Mount Fan Profile Mechanical Outline .................................................................... 82
37 Chassis Cutout ........................................................................................................ 83
38 Recessed Fan Mounting............................................................................................. 83
39 Reduced Depth Top Mount Fan Profile Mechanical Outline .............................................. 84
40 Chassis Cutout ........................................................................................................ 84
41 60 mm Mechanical Outline ........................................................................................ 85
42 Chassis Cutout ........................................................................................................ 86
43 PS3 Mechanical Outline ............................................................................................. 87
5
46 Cross Loading Graph for 270 W Configuration...............................................................91
48 Mechanical Outline....................................................................................................94
49 Dimensions & Recommended Feature Placements (not to scale)......................................95
50 Power Supply Mounting Slot Detail..............................................................................96
51 Fan Right and Fan Left Orientations of Power Supply in a Chassis....................................97
52 Suggested TFX12V Chassis Cutout ..............................................................................97
53 Suggested Mounting Tab (chassis feature) ...................................................................98
55 Cross Loading Graph for 220 W Configurations ........................................................... 100
56 Cross Loading Graph for 270 W Configuration............................................................. 101
57 Mechanical Outline.................................................................................................. 103
58 Dimensions & Recommended Feature Placements (not to scale).................................... 104
Tables
1 Conventions and Terminology ....................................................................................10
2 Support Terminology ................................................................................................11
3 Digital Office Platform Configurations for 2008..............................................................13
4 Digital Home Platform Configurations for 2008 .............................................................14
5 Digital Home Platform Configurations for 2007 - Lifestyle EPC Mainstream .......................14
7 Digital Home Platform Configurations for 2007 - Lifestyle EPC Premium ...........................15
6 Digital Home Platform Configurations for 2007 - CE EPC ................................................15
8 Digital Home Platform Configurations for 2007 - Extreme Gaming and Media ....................16
9 Digital Office Platform Configurations for 2007 - Entry ...................................................16
10 Digital Office Platform Configurations for 2007 - Fundamental ........................................17
11 Digital Office Platform Configurations for 2007 - Professional ..........................................17
12 Digital Office Platform Configurations for 2007 - High Performance..................................17
13 12V2 Current for Processor Configurations ...................................................................18
14 AC Input Line Requirements.......................................................................................19
15 DC Output Voltage Regulation ....................................................................................20
16 DC Output Transient Step Sizes..................................................................................20
17 Recommended 5 VSB Efficiency..................................................................................21
18 DC Output Noise/Ripple.............................................................................................21
19 Output Capacitive Loads ............................................................................................22
20 PWR_OK Signal Timing..............................................................................................24
21 PWR_OK Signal Characteristics...................................................................................24
22 PS_ON# Signal Characteristics ...................................................................................25
23 Over Voltage Protection.............................................................................................26
24 Efficiency Versus Load...............................................................................................28
25 Power Supply Sizes for ENERGY STAR Desktop System Categories ..................................30
26 Main Power Connector Pin-out ....................................................................................34
27 Peripheral Connector Pin-out......................................................................................35
28 Floppy Connector Pin-out...........................................................................................35
29 +12 V Power Connector Pin-out..................................................................................36
30 Serial ATA* Power Connector Pin-out ..........................................................................36
31 Recommended Power Supply Acoustic Targets..............................................................39
32 EMC Requirements by Country ...................................................................................43
33 Typical Power Distribution for 180 W Configurations ......................................................49
37 180 W Loading for Efficiency Measurements .................................................................52
6
38 220 W Loading for Efficiency Measurements ................................................................ 53
41 Typical Power Distribution for 180 W Configurations ..................................................... 55
77 Typical Power Distribution for 180 W Configurations ................................................... 100
80 180 W Loading for Efficiency Measurements .............................................................. 101
7
Revision History
Revision Description Date
• Initial release of combined power supply design guide

• Combined CFX12V, LFX12V, ATX12V, SFX12V, and TFX12V content into one desktop
power supply design guide
• CFX12V content derived from revision 1.2
— - Updated 12V1 current for 300 W configuration
— - Updated efficiency loading for 300 W configuration
• LFX12V content derived from revision 1.1
• ATX12V content derived from revision 2.2
0.5 • SFX12V content derived from revision 3.1 January 2006
• TFX12V content derived from revision 2.1
— - Updated 12V1 current for 300 W configuration
— - Updated efficiency loading for 300 W configuration
• Updated Capacitive Load section to use standard capacitor values
• Updated 5 VSB efficiency recommendations for Digital Office platforms
• Removed power-down warning from power supply timing diagram
• Marked sections with labels to indicate REQUIRED, RECOMMENDED, or OPTIONAL
items
• Added 12V2 Current for Processor Configurations table

• Added revision numbers to form factor specific chapters
1.0 June 2006
• Changed Input Line Current Harmonic Content to OPTIONAL to better reflect
geographical requirements
• Removed outdated ENERGY STAR* requirements and added some new ENERGY
STAR information.
• Updated Typical Power Distribution tables for all power supply form factors and
updated minimum loads.
• Updated cross regulation figures.
1.1 • Added Flex ATX power supply form factor. March 2007
• Updated capacitive loading table.
• Clarified over voltage and over current verbiage.
• Added Power-up Cross Loading Condition section.
• Other changes shown in red with change bars.
• 3.3.1 and .3 Added max of 400 mV Ripple/Noise to PS_ON and PWR_OK signals
• 14.2 Figure 49 replaced to implement change in dimension C
• 3.3 Added Power-down timing to Figure 2 and Table 20 (T6 > 1 ms)
• 7.3 Clarified Class D requirements. Added additional references for EMC
requirements by country
1.2 Februrary 2008
• 3.5.9 Added Climate Savers Computing text
• Updated all Cross-regulation graphs
• 2.0 updated configuration charts
• Removed dates from reference documentation. Refer to latest version available
• Updated figure 58
8
Introduction
1 Introduction
This document provides design suggestions for various power supply form factors. The
power supplies are primarily intended for use with desktop system designs. It should
not be inferred that all power supplies must conform exactly to the content of this
document, though there are key parameters that define mechanical fit across a
common set of platforms. Since power supply needs vary depending on system
configuration, the design specifics described are not intended to support all possible
systems.
1.1 Reference Documentation

The following documents are referenced in various sections of this design guide. For
guidelines not specifically mentioned here, please reference the appropriate document.
Document
Document Number/Source or
Password
European Association of Consumer Electronics Manufacturers

(EACEM*) AB13-94-146
Hazardous Substance List / Certification
IEEE* Recommended Practice on Surge Voltages in Low-
ANSI* C62.41
Voltage AC Circuits
IEEE Guide on Surge Testing for Equipment Connected to Low-
ANSI C62.45
Voltage AC Power Circuits
Nordic national requirement in addition to EN 60950 EMKO-TSE (74-SEC) 207/94
American National Standard for Methods of Measurement of
Radio-Noise Emissions from Low-Voltage Electrical and
ANSI C63.4
Electronic Equipment in the Range of 9 kHz to 40 GHz for EMI
testing
UL 60950-1 First Edition –CAN/CSA-C22.2 No. 60950-1-03
First Edition,
IEC 60950-1: 2001 + Amendments and National Deviations,
EN 60950-1: 2001 + Amendment A11:
EU Low Voltage Directive (73/23/EEC) (CE Compliance)
GB-4943 (China)
CNS 14336: (Taiwan BSMI)
FCC*, Class B, Part 15 (Radiated & Conducted Emissions)
CISPR* 22 / EN55022, 5th Edition (Radiated & Conducted
Emissions)
EN55024 (ITE Specific Immunity)
EN 61000-4-2 – Electrostatic Discharge
EN 61000-4-3– Radiated RFI Immunity
EN 61000-4-4– Electrical Fast Transients
EN 61000-4-5 – Electrical Surge
9
Introduction
Document
Document Number/Source or
Password
EN 61000-4-6 – RF Conducted
EN 61000-4-8 – Power Frequency Magnetic Fields
EN 61000-4-11 – Voltage Dips, Short Interrupts and
Fluctuations
EN61000-3-2 (Harmonics)
EN61000-3-3 (Voltage Flicker)
EU EMC Directive ((8/9/336/EEC) (CE Compliance)
1.2 Terminology
Table 1 defines the acronyms, conventions, and terminology that are used throughout
the design guide.
Table 1. Conventions and Terminology
Acronym, Convention/
Definition
Terminology
AWG American Wire Gauge

Declared sound power, LwAd. The declared sound power level shall
BA be measured according to ISO* 7779 for the power supply and
reported according to ISO 9296.
CFM Cubic Feet per Minute (airflow).
A waveform changes from one level to another in a steady fashion,
Monotonically
without oscillation.
MTBF Mean time between failure.
The periodic or random signals over frequency band of 0 Hz to 20
Noise
MHz.
A condition in which a supply attempts to provide more output
current than the amount for which it is rated. This commonly
Overcurrent
occurs if there is a “short circuit” condition in the load attached to
the supply.
PFC Power Factor Corrected.
PWR_OK is a “power good” signal used by the system power supply
PWR_OK to indicate that the +5VDC, +3.3 VDC and +12VDC outputs are
within the regulation thresholds of the power supply.
The periodic or random signals over a frequency band of 0 Hz to 20
Ripple noise
MHz.
Rise time is defined as the time it takes any output voltage to rise
Rise Time
from 10% to 95% of its nominal voltage.
The condition where the AC line voltage rises above nominal
Surge
voltage.
An output voltage that is present whenever AC power is applied to
VSB or Standby Voltage
the AC inputs of the supply.
10
Introduction
Table 2. Support Terminology
Category Description
The status given to items within this design guide, which are not
required to meet design guide, however, some system applications
Optional
may optionally use these features. May be a required or
recommended item in a future design guide.
The status given to items within this design guide, which are not
required to meet design guide, however, are required by many
Recommended
system applications. May be a required item in a future design
guide.
The status given to items within this design guide, which are
Required required to meet design guide and a large majority of system
applications.
11
Introduction
12
Platform Configurations
2 Platform Configurations
2.1 Digital Home and Digital Office Platform
Configurations - RECOMMENDED
Table 3 through Table 12 show power supply recommendations for various platform
configurations. The configurations here and the recommended power supplies are
suggestions. System designers should perform engineering analysis based on the
specific system configuration to determine the appropriate power supply for their
needs.
Table 3. Digital Office Platform Configurations for 2008
Line Item Config 1 Config 2
Processor TDP 95 W 65 W
Chipset Eaglelake-Q/ICH10DO
DDR2, 4 GB or DDR2, 2-4 GB or
Memory
DDR3, 4 GB DDR3, 4 GB
Graphics Integrated
Audio Intel® High Definition Audio
LAN Intel® 82567 Gigabit LAN
Add-in cards None
Hard drive 2 SATA Drives
Optical drive SATA ODD
USB devices 3 high power, 7 low power USB
Fans ATX thermal solution fan and chassis fan
ATX12V, SFX12V, TFX12V, CFX12V, ATX12V, SFX12V, TFX12V, CFX12V,
Power Supply LFX12V, Flex ATX LFX12V, Flex ATX
Recommendation
220 W 180 W
13
Table 4. Digital Home Platform Configurations for 2008
Line Item HEDT Config Config 2 Config 3 Config 4
Processor TDP 130 W 95 W 65 W

Eaglelake-G/
Chipset Tylersburg/ICH9 Eaglelake-P/ICH10
ICH10
DDR3, 6 DIMMs,
Memory DDR3, 4 GB DDR2, 2 GB
up to 24 GB
Graphics 2x300W graphics 75 W 50 W Integrated
Audio Intel® High Definition Audio 7.1
LAN Intel® 82567 Gigabit LAN
Add-in cards Wireless LAN, 1394, TV tuner
Hard drive 2 SATA hard drives
Optical drive SATA Blueray or HD DVD ODD
4 high power, 8
USB devices 3 high power, 7 low power USB
low power USB
Fans ATX thermal solution fan and chassis fan
ATX12V, SFX12V, ATX12V, SFX12V,
Power Supply EPS12V1 ATX12V TFX12V, CFX12V, TFX12V, CFX12V,
Recommendation ≥ 850 W 350 W LFX12V, Flex ATX LFX12V, Flex ATX
220 W 220 W
NOTES:
1. The EPS12V power supply design guide can be found at the SSI Forum website:
http://ssiforum.oaktree.com/ViewUserDocuments.aspx
Table 5. Digital Home Platform Configurations for 2007 - Lifestyle EPC Mainstream
Line Item Description
Processor TDP 65 W 105 W 65 W 105 W

Chipset Intel® G35 chipset
Memory 2 DDR3 DIMMs, 1066 MHz, 1 GB
Graphics Integrated 1 PCI Express* x16 add-in (75 W)
LAN Intel® 82566 1 Gb LAN
Add-in cards Wireless LAN, 1394, TV tuner/capture
Hard drive 1 SATA hard drive
Optical drive 1 SATA optical drive
USB devices 2 high power and 10 low power USB devices
Fans 1 processor fan and 1 chassis fan
ATX12V, SFX12V,
Power Supply TFX12V, CFX12V, TFX12V, CFX12V, ATX12V
TFX12V, CFX12V
Recommendation LFX12V, Flex ATX LFX12V, Flex ATX 350 W
300 W
270 W 270 W
14
Table 6. Digital Home Platform Configurations for 2007 - CE EPC
Processor TDP 65 W 95 W 65 W 95 W
Chipset Intel® G35 chipset
Graphics Integrated 1 PCI Express* x16 add-in (75 W)
Fans 1 processor fan
ATX12V, SFX12V,
TFX12V, CFX12V
300 W
270 W 270 W
Table 7. Digital Home Platform Configurations for 2007 - Lifestyle EPC Premium

Chipset Intel® X38 chipset
2 PCI Express*
Graphics Integrated x16 add-in (150
W total W)
270 W 270 W
15
Table 8. Digital Home Platform Configurations for 2007 - Extreme Gaming and Media
Processor TDP 130 W

Graphics 1 PCI Express* x16 add-in (300 W total)
Power Supply EPS12V1

Recommendation ≥ 600 W
NOTES:
1. The EPS12V power supply design guide can be found at the SSI Forum website:
http://ssiforum.oaktree.com/ViewUserDocuments.aspx
Table 9. Digital Office Platform Configurations for 2007 - Entry
Chipset Intel® 946GZ chipset
Memory 1 DDR2 DIMM, 667 MHz, 512 MB
Graphics Integrated
LAN 10/100M LAN
Add-in cards None
Fans 1 processor fan, 1 chassis fan
Power Supply TFX12V, CFX12V, TFX12V, CFX12V,
Recommendation LFX12V, Flex ATX LFX12V, Flex ATX
180 W 220 W
16
Table 10. Digital Office Platform Configurations for 2007 - Fundamental
Chipset Intel® Q33 chipset
Graphics Integrated
Add-in cards None
Fans 1 processor fan, 1 chassis fan
SFX12V, TFX12V, SFX12V, TFX12V,
Power Supply CFX12V, LFX12V, Flex CFX12V, LFX12V,
Recommendation ATX Flex ATX
180 W 220 W
Table 11. Digital Office Platform Configurations for 2007 - Professional
Chipset Intel® Q35 chipset
Graphics Integrated
Add-in cards Wireless LAN
Power Supply LFX12V, Flex ATX LFX12V, Flex ATX

Recommendation 180 W 220 W
Table 12. Digital Office Platform Configurations for 2007 - High Performance

Memory 4 DDR3 DIMMs, 1066 MHz, 2GB
17
Table 12. Digital Office Platform Configurations for 2007 - High Performance
Graphics Integrated
Add-in cards Wireless LAN, Media Expansion Card
Power Supply LFX12V, Flex ATX LFX12V, Flex ATX LFX12V, Flex ATX
Recommendation 180 W 220 W 270 W
Table 13. 12V2 Current for Processor Configurations
12V2 Current Recommendation
Processor
Processor TDP Continuous Peak1
Configuration
04A 84 W 13 A -
04B 115 W 13 A -
05A 95 W 13 A 16.5 A
105 W2 14 A 18 A
05B
130 W 16 A 19 A
06 65 W 8A 13 A
NOTES:
1. The power supply should be able to supply peak current for at least 10 ms.
2. The 05B processor configuration full TDP is 130 W. However, some processors that fall into this configuration
will have lower TDP values such as 105 W.
18
Electrical
3 Electrical
The following electrical requirements are required and must be met over the
environmental ranges as defined in Chapter 6 (unless otherwise noted).
3.1 AC Input - REQUIRED

Table 14 lists AC input voltage and frequency requirements for continuous operation.
The power supply shall be capable of supplying full-rated output power over two input
voltage ranges rated 100-127 VAC and 200-240 VAC rms nominal. The correct input
range for use in a given environment may be either switch-selectable or auto-ranging.
The power supply shall automatically recover from AC power loss. The power supply
must be able to start up under peak loading at 90 VAC.
Note: OPTIONAL - 115 VAC or 230 VAC only power supplies are an option for specific
geographical or other requirements.
Table 14. AC Input Line Requirements
Parameter Minimum Nominal1 Maximum Unit
Vin (115 VAC) 90 115 135 VACrms

Vin (230 VAC) 180 230 265 VACrms
Vin Frequency 47 - 63 Hz
Iin (115 VAC) - - 6 Arms
Iin (230 VAC) - - 3 Arms
NOTES:
1. Nominal voltages for test purposes are considered to be within ±1.0 V of nominal.
3.1.1 Input Over Current Protection - REQUIRED

The power supply is required to incorporate primary fusing for input over current
protection to prevent damage to the power supply and meet product safety
requirements. Fuses should be slow-blow-type or equivalent to prevent nuisance trips.
3.1.2 Inrush Current - REQUIRED

Maximum inrush current from power-on (with power-on at any point on the AC sine)
and including, but not limited to, three line cycles, shall be limited to a level below the
surge rating of the AC switch if present, bridge rectifier, and fuse components.
Repetitive ON/OFF cycling of the AC input voltage should not damage the power supply
or cause the input fuse to blow.
3.1.3 Input Under Voltage - REQUIRED

The power supply is required to contain protection circuitry such that the application of
an input voltage below the minimum specified in Table 14, shall not cause damage to
the power supply.
19
Electrical
3.2 DC Output - REQUIRED

3.2.1 DC Voltage Regulation
The DC output voltages are required to remain within the regulation ranges shown in
Table 15, when measured at the load end of the output connectors under all line, load,
and environmental conditions specified in Chapter 6.
Table 15. DC Output Voltage Regulation
Output Range Min Nom Max Unit
+12V1DC1 ±5% +11.40 +12.00 +12.60 V
+12V2DC2 ±5% +11.40 +12.00 +12.60 V
+5VDC ±5% +4.75 +5.00 +5.25 V
+3.3VDC3 ±5% +3.14 +3.30 +3.47 V
-12VDC ±10% -10.80 -12.00 -13.20 V

+5VSB ±5% +4.75 +5.00 +5.25 V
NOTES:
1. At +12V1DC peak loading, regulation at the +12V1DC and +12V2DC outputs can go to
±10%.
2. At +12V2DC peak loading, regulation at the +12V1DC and +12V2DC outputs can go to
±10%.
3. Voltage tolerance is required at main connector and SATA connector (if used).
3.2.2 Output Transient Response - REQUIRED

Table 16 summarizes the expected output transient step sizes for each output. The
transient load slew rate is = 1.0 A/µs.
Table 16. DC Output Transient Step Sizes1
Maximum Step Size

Output (% of rated output Maximum Step Size (A)
amps)
+12V1DC 40% -
+12V2DC 60% -
+5 VDC 30% -
+3.3 VDC 30% -
-12 VDC - 0.1
+5 VSB - 0.5
NOTES:
1. For example, for a rated +5 VDC output of 14 A, the transient step would be 30% × 14 A = 4.2 A.
Output voltages should remain within the regulation limits of Table 15, for
instantaneous changes in load as specified in Table 16 and for the following conditions:
• Simultaneous load steps on the +12 VDC, +5 VDC, and +3.3 VDC outputs (all
steps occurring in the same direction)
• Load-changing repetition rate of 50 Hz to 10 kHz
• AC input range per Section 2.1 and Capacitive loading per Table 19.
20
Electrical
3.2.3 Remote Sensing - REQUIRED

The +3.3 VDC output should have provisions for remote sensing to compensate for
excessive cable drops. The default sense should be connected to pin 13 of the main
power connector (Figure 7). The power supply should draw no more than 10 mA
through the remote sense line to keep DC offset voltages to a minimum.
3.2.4 Other Low Power System Requirements - RECOMMENDED

To help meet the Blue Angel* system requirements, RAL-UZ 78, US Presidential
executive order 13221, ENERGY STAR* requirements, and other low Power system
demands, It is recommended that the +5 VSB standby supply efficiency should be as
high as possible. Standby efficiency is measured with the main outputs off (PS_ON#
high state). Standby efficiency should be as shown in Table 17.
Table 17. Recommended 5 VSB Efficiency
Load Efficiency
100 mA ≥ 50%
250 mA ≥ 60%
≥1 A ≥ 70%
3.2.5 Output Ripple Noise - REQUIRED

The output ripple noise requirements listed in Table 18 should be met throughout the
load ranges specified for the appropriate form factor and under all input voltage
conditions as specified in Table 14.
Ripple and noise are defined as periodic or random signals over a frequency band of 10
Hz to 20 MHz. Measurements shall be made with an oscilloscope with 20 MHz of
bandwidth. Outputs should be bypassed at the connector with a 0.1µF ceramic disk
capacitor and a 10 µF electrolytic capacitor to simulate system loading. See Figure 1 for
the differential noise measurement setup.
Table 18. DC Output Noise/Ripple
Output Maximum Ripple and Noise (mV p-p)
+12 V1DC 120

+12 V2DC 120
+5 VDC 50
+3.3 VDC 50
-12 VDC 120
+5 VSB 50
21
Electrical
Figure 1. Differential Noise Test Setup
Load Load must be

Power Supply isolated from the
Vout
ground of the
AC Hot power supply.
10 uF 0.1 uF
AC Neutral Vreturn
AC Ground
Oscilloscope
General Notes:
1. Load the output with its minimum load current.
2. Connect the probes as shown.
3. Repeat the measurement with maximum load on the
output.
Filter Note:
0.1 uF – Kemet* C1206C104K5RAC or equivalent
±10%, 1206 pkg, 50 V, X7R
10 uF – Vishay* 293D106X0025D2T or equivalent
±20%, D case, 25 V, tantalum
Oscilloscope Note:
Use Tektronix* TDS460 or equivalent and a P6046
probe or equivalent.
3.2.6 Capacitive Load - REQUIRED

The power supply should be able to power up and operate with the regulation limits
defined in Table 15, with the following capacitances simultaneously present on the DC
outputs.
Table 19. Output Capacitive Loads
Output Capacitive Load (μF)
+12 V1DC 10,000

+12 V2DC 10,000
+5 VDC 10,000
+3.3 VDC 10,000
-12 VDC 330
+5 VSB 10,000
3.2.7 Closed Loop Stability - REQUIRED

The power supply shall be unconditionally stable under all line/load/transient load
conditions including capacitive loads specified in Section 3.2.6. A minimum of 45
degrees phase margin and 10 dB gain margin is recommended at both the maximum
and minimum loads.
22
Electrical
3.2.8 +5 VDC / +3.3 VDC Power Sequencing - REQUIRED

The +12V1 DC / +12V2 DC and +5 VDC output levels must be equal to or greater than
the +3.3 VDC output at all times during power-up and normal operation. The time
between any output of +12V1 DC / +12V2 DC and +5 VDC reaching its minimum in-
regulation level and +3.3 VDC reaching its minimum in-regulation level must be ≤ 20
ms.
3.2.9 Voltage Hold-up Time - REQUIRED

The power supply should maintain output regulations per Table 15 despite a loss of
input power at the low-end nominal range-115 VAC / 47 Hz or 230 VAC / 47 Hz - at
maximum continuous output load as applicable for a minimum of 16 ms.
3.3 Timing, Housekeeping and Control - REQUIRED
Figure 2. Power Supply Timing
T1 T5
VAC
…
PS_ON#
…
…
+12 VDC
+5 VDC
+3.3 VDC
} Outputs
95%
10%
…
T2
T3
PWR_OK
T4 T6
T1: Power-on time

PWR_OK Sense level = 95% of nominal T2: Rise time
T3: PWR_OK delay
T4: PWR_OK rise time
T5: AC loss to PWR_OK hold-up time
T6: PWR_OK inactive to DC loss delay
3.3.1 PWR_OK
PWR_OK is a “power good” signal. This signal should be asserted high by the power
supply to indicate that the +12 VDC, +5 VDC, and +3.3 VDC outputs are within the
regulation thresholds listed in Table 15 and that sufficient mains energy is stored by the
converter to guarantee continuous power operation within specification for at least the
duration specified in Section 3.2.9. Conversely, PWR_OK should be de-asserted to a
low state when any of the +12 VDC, +5 VDC, or +3.3 VDC output voltages falls below
its under voltage threshold, or when mains power has been removed for a time
sufficiently long such that power supply operation cannot be guaranteed. The electrical
and timing characteristics of the PWR_OK signal are given in Table 21 and in Figure 2.
23
Electrical
Table 20. PWR_OK Signal Timing
Parameter Description Value
T1 Power-on time < 500 ms

T2 Rise time 0.2 - 20 ms
T3 PWR_OK delay 100 - 500 ms
T4 PWR_OK rise time < 10 ms
AC loss to PWR_OK hold-up
T5 > 16 ms
time
PWR_OK inactive to DC loss
T6 >1 ms
delay
Table 21. PWR_OK Signal Characteristics

Signal type +5 V TTL compatible
Logic level low < 0.4 V while sinking 4 mA
Between 2.4 V and 5 V
Logic level high
output while sourcing 200 μA
High state output impedance 1 kΩ from output to common
Max Ripple/Noise 400 mV pk-pk
3.3.2 Power-up Cross Loading Condition

In the time frame between PS_ON# assertion and PWR_OK assertion (T1+T3), the
power supply may be subjected to a cross load condition on the 12 V and 3.3/5 V rails.
The power supply should be able to successfully power-up and assert PWR_OK when 12
V (or combination of 12V1 and 12V2) is loaded to ≤ 0.1 A and 3.3 V and/or 5 V are
loaded to 0-5 A.
3.3.3 PS_ON#
PS_ON# is an active-low, TTL-compatible signal that allows a motherboard to remotely
control the power supply in conjunction with features such as soft on/off, Wake on
LAN*, or wake-on-modem. When PS_ON# is pulled to TTL low, the power supply
should turn on the four main DC output rails: +12 VDC, +5 VDC, +3.3 VDC, and -12
VDC. When PS_ON# is pulled to TTL high or open-circuited, the DC output rails should
not deliver current and should be held at zero potential with respect to ground.
PS_ON# has no effect on the +5 VSB output, which is always enabled whenever the AC
power is present. Table 22 lists PS_ON# signal characteristics.
The power supply shall provide an internal pull-up to TTL high. The power supply shall
also provide de-bounce circuitry on PS_ON# to prevent it from oscillating on/off at
startup when activated by a mechanical switch. The DC output enable circuitry must be
SELV-compliant.
The power supply shall not latch into a shutdown state when PS_ON# is driven active
by pulses between 10 ms to 100 ms during the decay of the power rails.
24
Electrical
Table 22. PS_ON# Signal Characteristics
Parameter Minimum Maximum
VIL 0 0.8 V
IIL (VIN = 0.4 V) - -1.6 mA1
VIH (IIN = - 200 uA) 2.0 V -
VIH open circuit - 5.25 V
Ripple / Noise 400 mV pk-pk
NOTES:
1. Negative current indicates that the current is flowing from the power supply to the
motherboard.
Figure 3. PS_ON# Signal Characteristics
Hysteresis = 0.3 V
Disable
ed
= 0.8 V = 2.0 V
PS is f in PS is
de
enabled disabled
Un
Enable
0.8 2.0 5.25 = Maximum
Open Circuit Voltage
PS_ON# Voltage
3.3.4 +5 VSB
+5 VSB is a standby supply output that is active whenever the AC power is present.
This output provides a power source for circuits that must remain operational when the
five main DC output rails are in a disabled state. Example uses include soft power
control, Wake on LAN, wake-on-modem, intrusion detection, or suspend state
activities.
The power supply must be able to provide the required power during a “wake up”
event. If an external USB device generates the event, there may be peak currents as
high as 2.5 A., lasting no more than 500 ms.
Over current protection is required on the +5 VSB output regardless of the output
current rating. This ensures the power supply will not be damaged if external circuits
draw more current than the supply can provide.
3.3.5 Power-on Time

The power-on time is defined as the time from when PS_ON# is pulled low to when the
+12 VDC, +5 VDC, and +3.3 VDC outputs are within the regulation ranges specified in
Table 15. The power-on time shall be less than 500 ms (T1 < 500 ms).
+5 VSB shall have a power-on time of two seconds maximum after application of valid
AC voltages.
25
Electrical
3.3.6 Rise Time

The output voltages shall rise from 10% of nominal to within the regulation ranges
specified in Table 15 within 0.2 ms to 20 ms (0.2 ms ≤ T2 ≤ 20 ms).
There must be a smooth and continuous ramp of each DC output voltage from 10% to
90% of its final set point within the regulation band, while loaded as specified.
The smooth turn-on requires that, during the 10% to 90% portion of the rise time, the
slope of the turn-on waveform must be positive and have a value of between 0 V/ms
and [Vout, nominal / 0.1] V/ms. Also, for any 5 ms segment of the 10% to 90% rise
time waveform, a straight line drawn between the end points of the waveform segment
must have a slope ≥ [Vout, nominal / 20] V/ms.
3.3.7 Overshoot at Turn-on / Turn-off

The output voltage overshoot upon the application or removal of the input voltage, or
the assertion/de-assertion of PS_ON#, under the conditions specified in Table 15, shall
be less than 10% above the nominal voltage. No voltage of opposite polarity shall be
present on any output during turn-on or turn-off.
3.4 Reset after Shutdown

If the power supply latches into a shutdown state because of a fault condition on its
outputs, the power supply shall return to normal operation only after the fault has been
removed and the PS_ON# has been cycled OFF/ON with a minimum OFF time of one
second.
3.4.1 +5 VSB at Power-down

After AC power is removed, the +5 VSB standby voltage output should remain at its
steady state value for the minimum hold-up time specified in Section 3.2.9 until the
output begins to decrease in voltage. The decrease shall be monotonic in nature,
dropping to 0.0 V. There shall be no other disturbances of this voltage at or following
removal of AC power.
3.5 Output Protection - REQUIRED

3.5.1 Over Voltage Protection
The over voltage sense circuitry and reference shall reside in packages that are
separate and distinct from the regulator control circuitry and reference. No single point
fault shall be able to cause a sustained over voltage condition on any or all outputs. The
supply shall provide latch-mode over voltage protection as defined in Table 23.
Table 23. Over Voltage Protection
Output Minimum (V) Nominal (V) Maximum (V)
+12 VDC (or 12V1DC &

13.4 15.0 15.6
12V2DC)
+5 VDC 5.74 6.3 7.0
+3.3 VDC 3.76 4.2 4.3
5 VSB1 5.74 6.3 7.0
26
Electrical
NOTES:
1. Over voltage protection is RECOMMENDED but not REQUIRED for this output. While over voltage
protection is not required for this output, system damage may occur in the case of an over voltage event.
3.5.2 Short Circuit Protection

An output short circuit is defined as any output impedance of less than 0.1 ohms. The
power supply shall shut down and latch off for shorting the +3.3 VDC, +5 VDC, or +12
VDC rails to return or any other rail. The +12V1 DC and 12V2 DC should have separate
short circuit and over current protection. Shorts between main output rails and +5 VSB
shall not cause any damage to the power supply. The power supply shall either shut
down and latch off or fold back for shorting the negative rails. +5 VSB must be capable
of being shorted indefinitely. When the short is removed, it is recommended that the
power supply shall recover automatically or by cycling PS_ON#. Optionally, the power
supply may latch off when a +5 VSB short circuit event occurs. The power supply shall
be capable of withstanding a continuous short circuit to the output without damage or
overstress to the unit (for example, to components, PCB traces, and connectors) under
the input conditions specified in Table 14.
3.5.3 No-load Situation

No damage or hazardous condition should occur with all the DC output connectors
disconnected from the load. The power supply may latch into the shutdown state.
3.5.4 Over Current Protection

Current protection should be designed to limit the current to operate within safe
operating conditions.
Over current protection schemes where only the voltage output that experiences the
over current event is shut off may be adequate to maintain safe operation of the power
supply and the system; however, damage to the motherboard or other system
components may occur. The recommended over current protection scheme is for the
power supply to latch into the shutdown state.
3.5.5 Over Temperature Protection

As an option, the power supply may include an over-temperature protection sensor,
which can trip and shut down the power supply at a preset temperature point. Such an
overheated condition is typically the result of internal current overloading or a cooling
fan failure. If the protection circuit is non-latching, then it should have hysteresis built
in to avoid intermittent tripping.
3.5.6 Output Bypass

The output return may be connected to the power supply chassis, and will be connected
to the system chassis by the system components.
3.5.7 Separate Current Limit for 12V2 - RECOMMENDED

The 12 V rail on the 2x2 power connector should be a separate current limited output to
meet the requirements of UL and EN 60950.
27
Electrical
3.5.8 Overall Power Supply Efficiency and ENERGY STAR

The efficiency of the power supply should be tested at nominal input voltage of 115
VAC input and 230 VAC input, under the load conditions defined in the form factor
specific sections, and under the temperature and operating conditions defined in
Chapter 6. The loading condition for testing efficiency shown in the form factor specific
guidelines sections represent fully loaded systems, typical (50%) loaded systems, and
light (20%) loaded systems. Refer to Chapter 10 through Chapter 15 for the efficiency
loading for each power supply form factor.
Table 24. Efficiency Versus Load
Loading Full Load Typical Load Light Load PFC
REQUIRED Minimum Efficiency 70% 72% 65% -

RECOMMENDED Minimum Efficiency 80% 80% 80% ≥0.9
The RECOMMENDED minimum efficiency levels shown in Table 24 are required for
ENERGY STAR system compliance based the version 4.0 specification.
The ENERGY STAR computer specification requires at least 80% efficiency at 20%, 50%
and 100% of the rated output capacity. This effectively provides a window of high
efficiency that extends from 20% to 100% of the rated capacity of the power supply.
Generally the efficiency of the power supply drops off significantly as the load falls
below 20%. Because the power supply is one of the largest contributors to power loss
in the system, it is important to maximize the efficiency in order to comply with the
power targets for the various system categories. Below are two case examples for the
desktop category B system to illustrate this concept. For these two cases, assume the
efficiency curve in terms of percentage of the output is equivalent. This curve is shown
in Figure 4.
Figure 4. PSU Efficiency as Percentage of Output
Efficiency as Percentage of Output
100%
90%
80%
70%
Efficiency (%)
60%
50%
40%
30%
20%
10%
0%
0% 20% 40% 60% 80% 100% 120%
Perce nta ge of Output Ca pacity (%)
NOTES:
1. Graph is an estimated representation for illustrative purposes only.
2. This is not a recommended PSU efficiency curve. It is just included here as an example for
the discussion of properly sizing the PSU for power savings.
28
Electrical
CASE 1
For Case 1, suppose the system we are trying to configure to meet the desktop
category B has a 450 W internal power supply. The category B idle power specification
is 65 W AC wall power. The AC wall power is calculated or derived as shown in the
following equation:
(W)
AC ( W ) = DC
-------------
η PSU
In order to minimize the AC wall power, we need to maximize the power supply
efficiency. As can be seen from Figure 5, for a 450 W power supply, the efficiency is low
when the system is at 65 W AC wall power. Because the category B system at idle is on
the part of the power supply efficiency curve where the efficiency is low, the remaining
power budget for the other system components is much less than if the power supply
efficiency was higher.
Figure 5. PSU Efficiency per Power for 450 W PSU
NOTE: Graph is an estimated representation for illustrative purposes only.
CASE 2
For Case 2, assume the system we are trying to configure for category B has a 250 W
power supply. In this case, Figure 6 shows that for an idle state of 65 W AC wall power,
the system is within the high efficiency window of the power supply.
Since the system is operating within the high efficiency window of the power supply
when in the idle state, the power supply losses are minimized which allows additional
budget for other system components.
29
Electrical
Figure 6. PSU Efficiency per Power for 250 W PSU
NOTE: Graph is an estimated representation for illustrative purposes only.
The examples in Case 1 and Case 2 above show that building the system with a power
supply that is the proper size will maximize the power supply efficiency and allow the
most flexibility for selecting other components in the system.
In order to stay within the ≥ 80% efficiency window generally, the power supply sizes
for each of the desktop system categories are shown in Table 25.
Table 25. Power Supply Sizes for ENERGY STAR Desktop System Categories
AC Wall Power -
System Category Maximum Power Supply Size1
System Idle
A 50 W ≤ 200 W
B 65 W ≤ 260 W
C 95 W ≤ 380 W
NOTES:
1. The power supply sizes shown this table represent the maximum size in order to stay within the ≥ 80%
efficiency window. It is important; however, to ensure that the power supply also has sufficient capacity to
handle the active or heavy workloads that the system may be subjected to. Larger power supplies are
sometimes needed to allow for future system upgrades though a trade-off for efficiency in the idle state may
be necessary.
3.5.9 Overall Power Supply Efficiency and Climate Savers§

The Climate Savers Computing Initiative operates in a manner similar to the U.S.
Government’s Energy Star program. It is intended to promote both the deployment of
existing technologies and investment in new energy-efficiency technologies. The new
Energy Star standard for desktops, laptops, and workstations, which takes effect in July
2007, requires power supplies to be at least 80% efficient for most of their load range.
In addition, it puts limits on the energy used by devices when inactive and requires
systems to be shipped with power management features enabled. The Challenge starts
with the 2007 Energy Star requirements for desktops, laptops, and workstations
(including monitors), and gradually increases the efficiency requirements over the next
4 years, as follows:
30
Electrical
1. From July 2007 through June 2008, PCs must meet the Energy Star requirements.
This means 80% minimum efficiency for the power supply unit (PSU) at 20%, 50%,
and 100% of rated output, a power factor of at least 0.9 at 100% of rated output, and
meeting the maximum power requirements in standby, sleep, and idle modes.
2. From July 2008 through June 2009 the standard increases to 85% minimum
efficiency for the PSU at 50% of rated output (and 82% minimum efficiency at 20%
and 100% of rated output).
3. From July 2009 through June 2010, the standard increases to 88% minimum
4. From July 2010 through June 2011, the standard increases to 90% minimum
For more information on the Climate Savers Computing Initiative, visit their website at
www.climatesaverscomputing.org.
31
Electrical
32
Mechanical
4 Mechanical
This section contains mechanical guidelines that apply to desktop power supplies
regardless of form factor. For form factor specific design guides refer to Chapter 10
through Chapter 14.
4.1 Labeling and Marking - RECOMMENDED

The following is a non-inclusive list of suggested markings for each power supply unit.
Product regulation stipulations for sale into various geographies may impose additional
labeling requirements.
Manufacturer information: manufacturer's name, part number and lot date code, etc.,
in human-readable text and/or bar code formats
Nominal AC input operating voltages (100-127 VAC and 200-240 VAC) and current
rating certified by all applicable safety agencies
DC output voltages and current ratings
Access warning text (“Do not remove this cover. Trained service personnel only. No user
serviceable components inside.”) must be in English, German, Spanish, French,
Chinese, and Japanese with universal warning markings.
4.2 Connectors - REQUIRED

4.2.1 AC Connector
The AC input receptacle should be an IEC 320 type or equivalent. In lieu of a dedicated
switch, the IEC 320 receptacle may be considered the mains disconnect.
4.2.2 DC Connectors
Figure 7 shows pin outs and profiles for typical power supply DC harness connectors.
The power supply requires an additional two-pin, power connector.
UL Listed or recognized component appliance wiring material rated min 85 °C, 300 VDC
shall be used for all output wiring.
There are no specific requirements for output wire harness lengths, as these are largely
a function of the intended end-use chassis, motherboard, and peripherals. Ideally,
wires should be short to minimize electrical/airflow impedance and simplify
manufacturing, yet they should be long enough to make all necessary connections
without any wire tension (which can cause disconnections during shipping and
handling). Recommended minimum harness lengths for general-use power supplies is
150 mm for all wire harnesses. Measurements are made from the exit port of the
power supply case to the wire side of the first connector on the harness.
33
Mechanical
Figure 7. Connectors (Pin-side view, not to scale)
1 13
1 +12V1 DC
+3.3 VDC +3.3 VDC
Pin 1
+3.3 VDC -12 VDC +3.3 VDC
COM
+3.3 VDC
COM COM
COM +3.3 VDC
+5 VDC PS_ON# COM
COM
COM COM 4 +5 VDC
COM
+5 VDC COM +5 VDC
COM COM Peripheral +5 VDC

+5 VDC
PWR_OK NC
Connector COM
COM
+5 VSB +5 VDC
COM
+12V1 DC +5 VDC +12V1 DC
+12V1 DC
+12V1 DC +5 VDC 1 +5 VDC +12V1 DC
COM
+3.3 VDC COM
COM
+12V1 DC
4
Main Power
Connector Floppy Drive Serial ATA
Connector Connector
1 3
COM +12V2 DC
COM +12V2 DC
+12V2 DC
Connector
4.2.2.1 Main Power Connector

Connector: Molex* Housing: 24 Pin Molex Mini-Fit Jr. PN# 39-01-2240 or equivalent.
Contact: Molex 44476-1112 (HCS) or equivalent (Mating motherboard connector is

Molex 44206-0007 or equivalent).
18 AWG is suggested for all wires except for the +3.3 V supply and sense return wires
combined into pin 13 (22 AWG).
Table 26. Main Power Connector Pin-out
Pin Signal Color Pin Signal Color
+3.3 VDC
13 [+3.3 V Orange
1 +3.3 VDC Orange
[13] default [Brown]
sense]
2 +3.3 VDC Orange 14 -12 VDC Blue
3 COM Black 15 COM Black
4 +5 VDC Red 16 PS_ON# Green
6 +5 VDC Red 18 COM Black
34
Mechanical
Table 26. Main Power Connector Pin-out
Pin Signal Color Pin Signal Color
8 PWR_OK Gray 20 Reserved NC

9 +5 VSB Purple 21 +5 VDC Red
10 +12 V1DC Yellow 22 +5 VDC Red
11 +12 V1DC Yellow 23 +5 VDC Red
12 +3.3 VDC Orange 24 COM Black
4.2.2.2 Peripheral Connectors

Connector: AMP* 1-480424-0 or Molex* 15-24-4048 or equivalent.
Contacts: AMP 61314-1 or equivalent.
Table 27. Peripheral Connector Pin-out
Pin Signal Color1
1 +12 V1DC Yellow

2 COM Black
3 COM Black
4 +5 VDC Red
NOTES:
1. 18 AWG wire.
4.2.2.3 Floppy Drive Connector

Connector: AMP* 171822-4 or equivalent.
Table 28. Floppy Connector Pin-out
Pin Signal Color1
1 +5 VDC Red
2 COM Black
3 COM Black
4 +12 V1DC Yellow
NOTES:
1. 20 AWG wire.
35
Mechanical
4.2.2.4 +12 V Power Connector

Connector: Molex* 0039012040 or equivalent.
Contact: Molex 44476-1112 (HCS) or equivalent (Mating motherboard connector is

Molex 39-29-9042 or equivalent).
Table 29. +12 V Power Connector Pin-out
Pin Signal Color1 Pin Signal Color1
1 COM Black 3 +12 V2DC Yellow

2 COM Black 4 +12 V2DC Yellow
NOTES:
1. 18 AWG wire.
4.2.2.5 Serial ATA* Power Connectors

This is a required connector for systems with Serial ATA devices.
The detailed requirements for the Serial ATA Power Connector can be found in the
“Serial ATA: High Speed Serialized AT Attachment” specification, Section 6.3 “Cables
and connector specification”.
http://www.serialata.org/
Note: Connector pin numbers and wire numbers are not 1:1. Carefully check to confirm the
correct arrangement.
Assembly: Molex* 88751 or equivalent.
Table 30. Serial ATA* Power Connector Pin-out
Wire Signal Color1
5 +3.3 VDC Orange

4 COM Black
3 +5 VDC Red
2 COM Black
1 +12 V1DC Yellow
NOTES:
1. 18 AWG wire.
Figure 8. Serial ATA* Power Connector
Molex* Housing #675820000 or equivalent

Molex* Terminal #675810000 or equivalent
36
Mechanical
4.3 Airflow and Fans - RECOMMENDED

The designer's choice of a power supply cooling solution depends in part on the
targeted end-use system application(s). At a minimum, the power supply design must
ensure its own reliable and safe operation.
4.3.1 Fan Location and Direction

In general, exhausting air from the system chassis enclosure via a power supply fan at
the rear panel is the preferred, most common, and most widely applicable system-level
airflow solution. However, some system/chassis designers may choose to use other
configurations to meet specific system cooling requirements.
4.3.2 Fan Size and Speed

A thermally sensitive fan speed control circuit is recommended to balance system-level
thermal and acoustic performance. The circuit typically senses the temperature of the
secondary heatsink and/or incoming ambient air and adjusts the fan speed as
necessary to keep power supply and system component temperatures within
specification. Both the power supply and system designers should be aware of the
dependencies of the power supply and system temperatures on the control circuit
response curve and fan size and should specify them carefully.
The power supply fan should be turned off when PS_ON# is de-asserted (high). In this
state, any remaining active power supply circuitry must rely only on passive convection
for cooling.
37
Mechanical
4.3.3 Venting
In general, more venting in a power supply case yields reduced airflow impedance and
improved cooling performance. Intake and exhaust vents should be large, open, and
unobstructed as possible so as not to impede airflow or generate excessive acoustic
noise. In particular, avoid placing objects within 0.5 inches of the intake or exhaust of
the fan itself. A flush-mount wire fan grill can be used instead of a stamped metal vent
for improved airflow and reduced acoustic noise.
The limitations to the venting guidelines above are:

• Openings must be sufficiently designed to meet the safety requirements described
in Chapter 8.
• Larger openings yield decreased EMI-shielding performance (see Chapter 7).
• Venting in inappropriate locations can detrimentally allow airflow to bypass those
areas where it is needed.
38
Acoustics
5 Acoustics
5.1 Acoustics - RECOMMENDED
It is recommended that the power supply be designed with an appropriate fan, internal
impedance, and fan speed control circuitry capable of meeting the acoustic targets
listed in Table 31.
The power supply assembly shall not produce and prominent discrete tone determined
according to ISO 7779, Annex D.
Sound power determination is to be performed at 43 C, at 50% of the maximum rated

load, at sea level. This test point is chosen to represent the environment seen inside a
typical system at the idle acoustic test condition, with the 43 C being derived from the
standard ambient assumption of 23 C, with 20 C added for the temperature rise within
the system (what is typically seen by the inlet fan). The declared sound power shall be
measured according to ISO 7779 and reported according to ISO 9296.
Table 31. Recommended Power Supply Acoustic Targets
Typical (50% load)

Idle (BA) Maximum (BA)
(BA)
Minimum 3.5 4.0 5.0
Target 3.0 3.8 4.5
39
Acoustics
40
Environmental
6 Environmental
The following subsections define environmental specifications and test parameters,
based on the typical conditions to which a power supply may be subjected during
operation or shipment.
6.1 Temperature - RECOMMENDED

• Operating ambient +10 °C to +50 °C (At full load, with a maximum temperature
rate of change of 5 °C/10 minutes, but no more than 10 °C/hr.)
• Non-operating ambient -40 °C to +70 °C (Maximum temperature rate of change of
20 °C/hr.)
6.1.1 Thermal Shock (Shipping)

• Non-operating -40 °C to +70 °C
• 15 °C/min ≤ dT/dt ≤ 30 °C/min
• Tested for 50 cycles; Duration of exposure to temperature extremes for each half
cycle shall be 30 minutes.
6.2 Humidity - RECOMMENDED

• Operating To 85% relative humidity (non-condensing)
• Non-operating To 95% relative humidity (non-condensing)
• Note: 95% relative humidity is achieved with a dry bulb temperature of 55 °C and
a wet bulb temperature of 54 °C.
6.3 Altitude - RECOMMENDED

• Operating To 10,000 ft
• Non-operating To 50,000 ft
6.4 Mechanical Shock - RECOMMENDED

• Non-operating 50 g, trapezoidal input; velocity change ≥ 170 in/s
• Three drops on each of six faces are applied to each sample.
6.5 Random Vibration - RECOMMENDED

• Non-operating 0.01 g²/Hz at 5 Hz, sloping to 0.02 g²/Hz at 20 Hz, and maintaining
0.02 g²/Hz from 20 Hz to 500 Hz. The area under the PSD curve is 3.13 gRMS. The
duration shall be 10 minutes per axis for all three axes on all samples.
41
Environmental
42
Electromagnetic Compatibility
7 Electromagnetic Compatibility
The following subsections outline applicable product regulatory requirements for the
power supplies. Additional requirements may apply dependent upon the design,
product end use, target geography, and other variables.
7.1 Emissions - REQUIRED

The power supply shall comply with FCC Part 15, EN55022 and CISPR 22, 5th ed.,
meeting Class B for both conducted and radiated emissions with a 4 dB margin. Tests
shall be conducted using a shielded DC output cable to a shielded load. The load shall
be adjusted as follows for three tests: No load on each output; 50% load on each
output; 100% load on each output. Tests will be performed at 100 VAC 50Hz, 120 VAC
60 Hz, and 230 VAC 50 Hz power. Additionally, for FCC certification purposes, the power
supply shall be tested using the methods in 47 CFR 15.32(b) and authorized under the
Declaration of Conformity process as defined in 47 CFR 2.906 using the process in 47
CFR 2.1071 through 47 CFR 2.1077.
7.2 Immunity - REQUIRED

The power supply shall comply with EN 55024 and CISPR 24 prior to sale in the EU
(European Union), Korea, and possibly other geographies.
7.3 Input Line Current Harmonic Content - OPTIONAL

Class D harmonic limits will be determined at the time of measurement based on the
actual power draw from the mains.
Table 32 is a partial list of countries and their current EMC requirements. Additional
requirements may apply dependent upon the design, product end use, target
geography, and other variables.
Table 32. EMC Requirements by Country
Country Requirements Document
EU (European Union) EN61000-3-2

Japan JEIDA MITI
China CCC & GB 17625.1
Russia GOST R 51317.3.2
7.4 Magnetic Leakage Fields - REQUIRED

A PFC choke magnetic leakage field should not cause any interference with a high-
resolution computer monitor placed next to or on top of the end-use chassis.
43
Electromagnetic Compatibility
7.5 Voltage Fluctuations and Flicker - REQUIRED

The power supply shall meet the specified limits of EN61000-3-3 (IEC 61000-3-3) and
amendment A1 to EN 61000-3-3 (IEC 61000-3-3/A1) for voltage fluctuations and
flicker for equipment drawing not more than 16AAC, connected to low voltage
distribution systems.
44
Safety
8 Safety
The following subsections outline sample product regulations requirements for a typical
power supply. Actual requirements will depend on the design, product end use, target
geography, and other variables. Consult your company’s Product Safety and
Regulations department or an accredited third party certification agency for more
details.
8.1 North America - REQUIRED

The power supply must be certified by an NRTL (Nationally Recognized Testing
Laboratory) for use in the USA and Canada under the following conditions:
• The power supply UL report “Conditions of Acceptability” shall meet in the intended
application of the power supply in the end product.
• The supply must be recognized for use in Information Technology Equipment
including Electrical Business Equipment per UL 60950-1 First Edition. The
certification must include external enclosure testing for the AC receptacle side of
the power supply (see Appendices A, B, C, and D).
• The supply must have a full complement of tests conducted as part of the
certification, such as input current, leakage current, hi-pot, temperature, energy
discharge test, transformer output characterization test (open-circuit voltage,
short-circuit performance), and abnormal testing (to include stalled-fan tests and
voltage-select–switch mismatch).
• The enclosure must meet fire enclosure mechanical test requirements per clauses
2.9.1 and 4.2 of the above-mentioned standard.
• Production hi-pot testing must be included as a part of the certification and
indicated as such in the certification report.
• There must not be unusual or difficult conditions of acceptability such as mandatory
additional cooling or power de-rating. The insulation system shall not have
temperatures exceeding their rating when tested in the end product.
• The certification mark shall be marked on each power supply.
• The power supply must be evaluated for operator-accessible secondary outputs
(reinforced insulation) that meet the requirements for SELV.
• The proper polarity between the AC input receptacle and any printed wiring boards
connections must be maintained (that is, brown=line, blue=neutral, and
green=earth/chassis).
• The fan shall be protected by a guard to prevent contact by a finger in compliance
with UL accessibility requirements.
8.2 International - REQUIRED

The vendor must provide a complete CB certificate and test report to IEC 60950-1. The
CB report must include ALL CB member country national deviations as appropriate for
the target market. All evaluations and certifications must be for reinforced insulation
between primary and secondary circuits.
The power supply must meet the RoHS requirements for the European Union, Peoples
Republic of China and other countries which have adopted the RoHS requirements for
banned materials.
45
Safety
8.3 Proscribed Materials

The following materials must not be used during design and/or manufacturing of this
product:
• Cadmium should not be used in painting or plating - REQUIRED.
• Quaternary salt and PCB electrolytic capacitors shall not be used - REQUIRED.
• CFC's or HFC's shall not be used in the design or manufacturing process -
REQUIRED.
• Mercury shall not be used - REQUIRED.
• Some geographies require lead free or RoHS compliant power supplies -
REQUIRED.
8.4 Catastrophic Failure Protection - RECOMMENDED

Should a component failure occur, the power supply should not exhibit any of the
following:
• Flame
• Excessive smoke
• Charred PCB
• Fused PCB conductor
• Startling noise
• Emission of molten material
• Earth ground fault (short circuit to ground or chassis enclosure)
46
Reliability
9 Reliability
9.1 Reliability - RECOMMENDED
The de-rating process promotes quality and high reliability. All electronic components
should be designed with conservative device de-ratings for use in commercial and
industrial environments.
Electrolytic capacitor and fan lifetime and reliability should be considered in the design
as well.
47
Reliability
48
CFX12V Specific Guidelines 1.41
10 CFX12V Specific Guidelines

1.41
For Compact Form Factor with 12-volt connector power supplies.
10.1 Typical Power Distribution - RECOMMENDED

DC output power requirements and distributions will vary based on specific system
options and implementation.
Significant dependencies include the quantity and types of processors, memory, add-in
card slots, and peripheral bays, as well as support for advanced graphics or other
features. Figure 9 through Figure 12 shows the power distribution and cross loading
tables for power supplies in the range of 180 W to 300 W. These are recommendations
but it is ultimately the responsibility of the designer to define a power budget for a
given target product and market.
Figure 9. Cross Loading Graph for 180 W Configurations
180 W Cross Regulation
90
80 95, 80
5 V + 3.3 V power (W)
45, 80
70
60
120, 55
50
20, 45
40
7.2, 26
30
20 120, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150
Total 12 V power (W)
Table 33. Typical Power Distribution for 180 W Configurations
Minimum Rated Current

Output Peak Current (A)
Current (A) (A)
+12 VDC1 0.6 10.0 13.0

+5 VDC2 0.2 14.0 -
49

Current (A) (A)
+3.3 VDC 0.1 13.0 -

-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
1. Peak currents may last up to 17 seconds with not more than one occurrence per
minute.
2. Total combined output of 3.3 V and 5 V is ≤ 80 W.
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200

Current (A) (A)
+12 VDC1 0.6 14.0 16.0

+5 VDC2 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
50
120
5 V + 3.3 V power (W)
100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250
T otal 12 V power (W)

Current (A) (A)
+12 VDC1 0.6 17 A 18 A

2
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
1. Peak currents may last up to 17 seconds with not more than one occurrence per minute.
51
300 W C ross R egulation
120
5 V + 3.3 V power (W)
70, 103 192, 103

100
80 216, 79
60
20, 50
40 7.2, 30
20 216, 16
7.2, 5.4
0 20.4, 5.4
0 50 100 150 200 250

T otal 12 V powe r (W)

Current (A) (A)
+12 V1DC 0.1 11.0 -

+12 V2DC1 0.5 8.0 13.0
+5 VDC2 0.2 15.0 -
+3.3 VDC 0.1 21.0 -
-12 VDC 0 0.3 -
+5 VSB3 0 2.0 2.5
NOTES:
1. 12V2 supports processor power requirements and must have a separate current limit and
provide 19 A peak current lasting for 10 ms. The minimum voltage during peak is > 10.8 VDC.
Table 37. 180 W Loading for Efficiency Measurements1
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
1. Loading calculated by method available at http://
www.efficientpowersupplies.org.
52
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:
Loading +12 V1 +12 V2 +5 V +3.3 V -12 V +5 VSB
Full (A) 9.6 7.0 9.3 13.0 0.3 1.7

Typical (A) 4.8 3.5 4.7 6.5 0.1 0.9
Light (A) 1.9 1.4 1.9 2.6 0.1 0.3
NOTES:
1. Loading calculated by method available at http://www.efficientpowersupplies.org.
10.2 Physical Dimensions - REQUIRED

The power supply shall be enclosed and meet the physical outline shown in Figure 13.
53
Figure 13. CFX12V Mechanical Outline
54
LFX12V Specific Guidelines 1.21
11 LFX12V Specific Guidelines 1.21

For Low Profile Form Factor with 12-volt connector power supplies.

90
80 95, 80
5 V + 3.3 V power (W)
45, 80
70
60
120, 55
50
20, 45
40
7.2, 26
30
20 120, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150

Current (A) (A)
+12 VDC1 0.6 10.0 13.0

+5 VDC2 0.2 14.0 -
55

Current (A) (A)
+3.3 VDC 0.1 13.0 -

-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200

Current (A) (A)
+12 VDC1 0.6 14.0 16.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
56
120
5 V + 3.3 V power (W)
100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250

Current (A) (A)
+12 VDC1 0.6 17 A 18 A

2
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
57
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:

The power supply shall be enclosed and meet the physical outline shown in Figure 17,
applicable. Mechanical details are shown in Figure 18. Details on the power supply slot
feature are shown in Figure 19. The recommended chassis slot feature details are
shown in Figure 20.
58
Figure 17. Mechanical Outline
59
Figure 18. Mechanical Details
Figure 19. PSU Slot Feature Detail
60
Figure 20. Recommended Chassis Tab Feature
61
62
ATX12V Specific Guidelines 2.31
12 ATX12V Specific Guidelines

2.31
For ATX Form Factor with 12-volt connector power supplies.

1 8 0 W C ro ss R eg u la tio n
90
80 95, 80
5 V + 3.3 V power (W)
45, 80
70
60
120, 55
50
20, 45
40
7.2, 26
30
20 120, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 1 50
Minimum Current Maximum Current

(A) (A)
+12 VDC1 0.6 10.0 13.0

+5 VDC2 0.2 14.0 -
63

(A) (A)
+3.3 VDC 0.1 13.0 -

-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
220 W C ro ss R eg u latio n
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200

(A) (A)
+12 VDC1 0.6 14.0 16.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
64
270 W C ro ss R eg u latio n
5 V + 3.3 V power (W) 120

100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250

(A) (A)
+12 VDC1 0.6 17.0 18.0

+5 VDC2 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
1
+5 VSB 0 2.0 2.5
NOTES:
65
5 V + 3.3 V power (W) 120

70, 103 192, 103
100
80 216, 79
60
20, 50
40 7.2, 30
20 216, 16
7.2, 5.4
0 20.4, 5.4
0 50 100 150 200 250

Output Minimum Current (A) Maximum Current (A) Peak Current (A)
+12 V1DC1, 4 0.1 11.0 13.0

+12 V2DC1, 2 0.5 8.0 13.0
+5 VDC3 0.2 15.0 -
+3.3 VDC 0.1 21.0 -
-12 VDC 0 0.3 -
+5 VSB4 0 2.5 3.5
NOTES:
1. 12V1DC and 12V2DC should have separate current limit circuits.
2. 12V2DC supports processor power requirements and must have a separate current limit and provide 13 A peak
current for 10 ms; minimum voltage during peak is > 10.8 VDC.
66
350 W C ro ss R egu latio n
120
5 V + 3.3 V power (W)
100, 103 242, 103
100
80 264, 81
60 40, 60
40 7.2, 27
20 264, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250 300
+12 V1DC1, 4 0.1 11.0 15.0

+12 V2DC1, 2 0.5 14.0 18.0
3
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 21.0 -
-12 VDC 0 0.3 -
+5 VSB4 0 2.5 3.5
NOTES:
2. 12V2DC supports processor power requirements and must have a separate current limit and provide 16.5 A
peak current for 10 ms; minimum voltage during peak is > 10.8 VDC.
67
4 0 0 W C ro s s R e g u la tio n
140
5 V + 3.3 V power (W)
120 120, 120 275, 120
100 300, 95
80
50, 65
60
40 7.2, 26
20 7.2, 5.4 300, 16
0 20.4, 5.4
0 100 200 300 400

+12 V1DC1 0.1 17.0 -

1, 2
+12 V2DC 0.5 14.0 18.0
3
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 24.0 -
-12 VDC 0 0.3 -
+5 VSB4 0 2.5 3.5
NOTES:
68
45 0 W C ro ss R eg u latio n
5 V + 3.3 V power (W) 14 0

12 0 130, 120 325, 120
10 0
360, 85
80
50, 65
60
40
7.2, 26
20 7.2, 5.4 360, 16
20.4, 5.4
0
0 10 0 2 00 3 00 400
1
+12 V1DC 0.1 17.0 -
1, 2
+12 V2DC 0.5 16.0 19.0
3
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 24.0 -
-12 VDC 0 0.3 -
+5 VSB4 0 2.5 3.5
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
69
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:
Full (A) 9.6 7.0 9.3 13.0 0.3 1.7

Typical (A) 4.8 3.5 4.7 6.5 0.1 0.9
Light (A) 1.9 1.4 1.9 2.6 0.1 0.3
NOTES:
Full (A) 9.5 11.2 9.2 12.9 0.3 2.1

Typical (A) 4.7 5.6 4.6 6.4 0.1 1.1
Light (A) 1.9 2.2 1.8 2.6 0.1 0.4
NOTES:
Full (A) 14.0 9.9 9.6 15.4 0.2 2.1

Typical (A) 7.0 5.0 4.8 7.7 0.1 1.0
Light (A) 2.8 2.0 1.9 3.1 0.0 0.4
NOTES:
70
Full (A) 14.4 13.5 9.9 15.8 0.3 2.1

Typical (A) 7.2 6.8 4.9 7.9 0.1 1.1
Light (A) 2.9 2.7 2.0 3.2 0.1 0.4
NOTES:
71
Figure 28. Power Supply Dimensions for Chassis that does not Require Top Venting
Air inlet grill, 55% open area. 53 REF
WIRE HARNESS
16 REF
150 REF
20.0
4.0X6 (2X)
(2X)
Optional air Optional air

inlet area. inlet area.
146.0
140 REF
Preferred locations of 86 REF

138.0
manufacturer label
No. 6-32 UNC-2B THREADED HOLE (4X) See Note 4.
Notes; unless otherwise

specified:
1. Dimensions are in mm.
2. Drawing is not to scale. 64.0
74.0
3. Tolerances:
X +/- 1
X.X +/- 0.5
4. If a wire grill is required
for acoustics or thermals,
the grill and screws must 16.0 114.0
6.0
be flush mounted.
6.0 (2X) psu_grills
72
Figure 29. Power Supply Dimensions for Chassis that Require Top Venting
53 REF
WIRE HARNESS
11.0 x 5.0 cutouts (4X);

min 6.0 clearance under 16 REF
cutout from inside top cover.
150 REF
20.0
4.0X6 (2X) See Note 5.
94.0
5.0
Area on top surface

inside dotted lines should
146.0 have 60% minimum open
Preferred location of
manufacturer label area for proper venting. 80.0
140 REF
Eight rectangular holes
are for air duct mounting
to direct airflow across
5.0 processor heatsink.
45.0
8.0 114.0
No. 6-32 UNC-2B THREADED HOLE (4X) 138.0 86 REF
Notes; unless otherwise specified: 9.0 x 3.2 cutouts (4X);

1. Dimensions are in mm. See Note 4. min 5.0 clearance under
2. Drawing is not to scale. cutout from inside top cover.
3. Tolerances:
X +/- 1
X.X +/- 0.5
4. If a wire grill is required
for acoustics or thermals, 64.0 74.0
the grill and screws must
be flush mounted.
5. Bottom side (not pictured)
may be user-accessible in
final system installation.
114.0
Cover openings as 16.0 6.0
necessary to prevent 6.0 (2X)
access to non-SELV
circuitry and to meet product
safety requirements. psu_duct_mount
73
74
SFX12V Specific Guidelines 3.21
13 SFX12V Specific Guidelines 3.21

For Small Form Factor with 12-volt connector power supplies.

tables for power supplies in the range of 180 W to 300W. These are recommendations
90
80 95, 80
5 V + 3.3 V power (W)
45, 80
70
60
120, 55
50
20, 45
40
7.2, 26
30
20 120, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150

Current (A) (A)
+12 VDC1 0.6 10.0 13.0

2
+5 VDC 0.2 14.0 -
75

Current (A) (A)
+3.3 VDC 0.1 13.0 -

-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200
T otal 12 V power (W)

Current (A) (A)
+12 VDC1 0.6 14.0 16.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
76
Figure 32. Cross Loading Graph for 270 W Configuration
120
5 V + 3.3 V power (W) 100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250

Current (A) (A)
+12 VDC1 0.6 17 A 18 A

+5 VDC2 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
1
+5 VSB 0 2.0 2.5
NOTES:
77
120
5 V + 3.3 V power (W)
70, 103 192, 103

100
80 216, 79
60
20, 50
40 7.2, 30
20 216, 16
7.2, 5.4
0 20.4, 5.4
0 50 100 150 200 250

T o tal 12 V p owe r (W)

Current (A) (A)
+12 V1DC 0.1 11.0 -

+12 V2DC1 0.5 8.0 13.0
2
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 21.0 -
-12 VDC 0 0.3 -
3
+5 VSB 0 2.0 2.5
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
78
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:
Full (A) 9.6 7.0 9.3 13.0 0.3 1.7

Typical (A) 4.8 3.5 4.7 6.5 0.1 0.9
Light (A) 1.9 1.4 1.9 2.6 0.1 0.3
NOTES:
13.2 Lower Profile Package - Physical Dimensions -

REQUIRED
13.3 Fan Requirements - REQUIRED

The fan will draw air from the computer system cavity pressurizing the power supply
enclosure. The power supply enclosure shall exhaust the air through a grill located on
the rear panel. See Figure 35. The movement of the fan to the computer system cavity
is to help limit the acoustic noise of the unit.
The fan will be 40 mm.
79
Figure 34. 40 mm Profile Mechanical Outline
85.0
40mm Fan
OP Wire Harness -
Location is at
manufacturer's discretion
100.0
85.0 Airflow
4.0X6
6.0
Venting holes
OPTIONAL -
to outside of
chassis
125.0
Airflow
Notes:
1. Unless otherwise specified, all
dimensions are in mm. 115/220 No. 6-32 UNC-2B
Tolerance: Threaded Hole (3X)
Whole No.: XX +/- 1 50.0
Decimal No.: X.X +/- 0.5 38.0
6.0 31.8
2. Do not scale drawing.
3. A stamped SM fan guard may be

used subject to approval.
6.0
88.0
100.0
Figure 35. Chassis Cutout
Ø4x3
Note: all features of P/S enclosure 8.5

that are outside bold cutout must be
46.0 flush with wiht P/S face. Flush mount
38.0 screws if necessary
4.0 135 x 4 34.3
R 5.0 29.8
25.3
4.0
14.5
88.0
96.0
80
13.4 Top Fan Mount Package - Physical Dimensions -

REQUIRED

the rear panel. See Figure 37. Moving the fan to the computer system cavity helps to
limit the acoustic noise of the unit.
The fan will be 80mm.
To prevent damage to the fan during shipment and handling, the power supply designer
should consider recessing the fan mounting, as shown in Figure 38.
81
Figure 36. Top Mount Fan Profile Mechanical Outline
OP Wire Harness-
Location is at
100.0 11.0 X 5.0 cutout

clearance under cutout
59.0 4.0X6 minimum of 6.0 from
inside cover
15.0
12.0
6.0
80mm Fan
125.0 95.8
Airflow
45.5
9.0 X 3.2 cutout
clearance under cutout Airflow
minimum of 4.5 from
17.1
inside cover
No. 6-32 UNC-2B

115/220
Threaded Hole (3X)
63.5
51.5
6.0 31.8
6.0
88.0
100.0
82
Ø4x3
8.5
Note: all features of P/S enclosure
59.5 that are outside bold cutout must be
flush with wiht P/S face. Flush mount
4.0 135 x 4 34.3
R 5.0 29.8
25.3
4.0
14.5
88.0
96.0
Figure 38. Recessed Fan Mounting
Fan recessed into

top cover
17.1
63.5
13.6 Reduced Depth Top Mount Fan - Physical

Dimensions - REQUIRED

the rear panel. See Figure 40. Moving the fan to the computer system cavity helps to
limit the acoustic noise of the unit.
83
Figure 39. Reduced Depth Top Mount Fan Profile Mechanical Outline
125.0
OP Wire Harness -
Location is at manufacturer's
discretion
Mounting Tab 11.0 X 5.0 cutout

Optional clearance under cutout
15.0
minimum of 6.0 from
4.0X6
inside cover 9.0 X 3.2 cutout
clearance under cutout
minimum of 4.5 from
6.0
inside cover
12.0
100.0
59.0 Airflow
15.0 45.5
95.8
80mm Fan
125.0 Airflow
17.1
Notes:
No. 6-32 UNC-2B
dimensions are in mm. 115/220
63.5
Whole No.: XX +/- 1
Decimal No.: X.X +/- 0.5 51.5
2. Do not scale drawing. 6.0

31.8

used subject to approval. AC Input Connector -
6.0 Location is at manufacturer's
113.0 discretion
Ø4x3

flush with wiht P/S face. Flush mount
51.5
135 x 4
29.8 34.3
4.0 R 5.0 25.3
4.0
14.5
113.0
121.0
13.8 Standard SFX Profile Package - Physical

Dimensions - REQUIRED
84

the rear panel. See Figure 42. The movement of the fan to the computer system cavity
is to help limit the acoustic noise of the unit.
Figure 41. 60 mm Mechanical Outline
85.0
68.5
60mm Fan
OP Wire Harness -
9.0 X 3.2 Cutout Location is at manufacturer's
Clearance under discretion
cutout minimum
4.5 from inside 42.5
cover
27.3 5.0
3.50
11.0 X 5.0 Cutout (2x)

100.0 Clearance under
85.0 cutout minimum 6.0
4.0X6 from inside conver
6.0
Venting holes
OPTIONAL - to
outside of chassis
125.0
Notes:
No. 6-32 UNC-2B
dimensions are in mm. 115/220
Whole No.: XX +/- 1 63.5
Decimal No.: X.X +/- 0.5
51.5
2. Do not scale drawing. 6.0 31.8

used subject to approval. 6.0
88.0
100.0
85
Ø4x3

59.5 flush with wiht P/S face. Flush mount
4.0 135 x 4 34.3

R 5.0 29.8
25.3
4.0
14.5
88.0
96.0
13.10 PS3 Form Factor- Physical Dimensions -

REQUIRED

An 80 mm axial fan is typically needed to provide enough cooling airflow through a high
performance Micro ATX system. Exact CFM requirements vary by application and end-
use environment, but 25-35 CFM is typical for the fan itself.
For consumer or other noise-sensitive applications, it is recommended that a thermally

sensitive fan speed control circuit be used to balance system-level thermal and acoustic
performance. The circuit typically senses the temperature of an internal heatsink and/
or incoming ambient air and adjusts the fan speed as necessary to keep power supply
and system component temperatures within specification. Both the power supply and
system designers should be aware of the dependencies of the power supply and system
temperatures on the control circuit response curve and fan size and should specify
them very carefully.
The power supply fan should be turned off when PS_ON# is de-asserted (high). In this
state, any remaining active power supply circuitry must rely only on passive convection
for cooling.
86
Figure 43. PS3 Mechanical Outline
OP Wire Harness-
Location is at
150.0
4.0X6
6.0
101.4
No. 6-32 UNC-2B

138.0 THREADED HOLE (4X)
Notes:
dimensions are in mm. 80mm Fan
Tolerance:
Whole No.: XX +/- 1
Decimal No.: X.X +/- 0.5 86.0 115/220
64.0 74.0
2. Do not scale drawing.
3. If a wire grill is required for 16.0

acoustics or thermals, the grill and 6.0
screws must be flush mount.
6.0 114.0
87
88
TFX12V Specific Guidelines 2.31
14 TFX12V Specific Guidelines 2.31

For Thin Form Factor with 12-volt connector power supplies.

90
80 95, 80
5 V + 3.3 V power (W)
4 5, 8 0
70
60
12 0, 5 5
50
20, 45
40
7.2 , 26
30
20 12 0, 1 6
10 7.2 , 5.4
20 .4, 5 .4
0
0 50 100 150
T o tal 12 V p o w e r (W )

Current (A) (A)
+12 VDC1 0.6 10.0 13.0

2
+5 VDC 0.2 14.0 -
89

Current (A) (A)
+3.3 VDC 0.1 13.0 -

-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200

Current (A) (A)
+12 VDC1 0.6 14.0 16.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
minute.
90
120
5 V + 3.3 V power (W)
100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250

Current (A) (A)
+12 VDC1 0.6 17 A 18 A

2
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
+5 VSB1 0 2.0 2.5
NOTES:
91
120
5 V + 3.3 V power (W)
70, 103 192, 103

100
80 216, 79
60
20, 50
40 7.2, 30
20 216, 16
7.2, 5.4
0 20.4, 5.4
0 50 100 150 200 250

T o tal 12 V p o we r (W)

Current (A) (A)
+12 V1DC 0.1 11.0 -

+12 V2DC1 0.5 8.0 13.0
+5 VDC2 0.2 15.0 -
+3.3 VDC 0.1 21.0 -
-12 VDC 0 0.3 -
+5 VSB3 0 2.0 2.5
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
92
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:
Full (A) 9.6 7.0 9.3 13.0 0.3 1.7

Typical (A) 4.8 3.5 4.7 6.5 0.1 0.9
Light (A) 1.9 1.4 1.9 2.6 0.1 0.3
NOTES:
93
94
A PUNCHED FAN GUARD IN THE CASE MAY BE USED
IN PLACE OF THE WIRE FAN GUARD
4.4
A
12.8
B
54.8
Figure 49.
C
59.664
D
65
E 6-32 UNC 2-B

69.8 57.2 13.5
F N 2 PLACES P
4.5 15.8 15.2
G Q S
5.5 70.5 46.294
6-32 UNC 2-B
H R T
75.3
3 PLACES
53.5
J U
80.5
175
K V
85
L
28.8
ITEM DIMENSION ITEM DIMENSION

A 4.40 REF M 28.80
B 12.80 N 57.20 65
W
C 56.80 P 13.50
D 59.70 REF Q 15.00 REF
E 65.00 R 70.50
UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD.
F 70.00 S 14.50 INTERPRET DIMENSIONS AND TOLERANCES P.O. BOX 58119
IN ACCORDANCE WITH ASME Y14.5M-1994
-
G 5.20 T 46.30 REF SANTA CLARA, CA 95052-8119
DIMENSIONS ARE IN MILLIMETERS DRAWN BY DATE
TITLE
H 5.50 REF U 53.50 ALL UNTOLERANCED LINEAR - -
DIMENSIONS ± 0.1
ANGLES ±0.5 CHECKED BY DATE
J 76.00 V 175.00
THIRD ANGLE PROJECTION - - TFX
K 80.50 REF W 65.00 REF
- -
L 85.00 APPROVED BY DATE
SIZE DRAWING NUMBER REV
- -
MATERIAL FINISH A1 TFX_CASE
Dimensions & Recommended Feature Placements (not to scale)
SEE NOTES SEE NOTES SCALE: 1 DO NOT SCALE DRAWING SHEET 1 OF 2
95
96
53.5
D
Figure 50.
ITEM DIMENSION
34.542
A 2.55 E
B 14.02
C 18.62
D 53.50
E 30.50
3.1
A SEE DETAIL A
A
18.6
C
Power Supply Mounting Slot Detail
14
DETAIL A SECTION A-A

SCALE 2
UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD.
INTERPRET DIMENSIONS AND TOLERANCES P.O. BOX 58119
IN ACCORDANCE WITH ASME Y14.5M-1994
-
SANTA CLARA, CA 95052-8119
TITLE
ALL UNTOLERANCED LINEAR - -
DIMENSIONS ± 0.1
ANGLES ±0.5 CHECKED BY DATE
THIRD ANGLE PROJECTION - - TFX

- -
APPROVED BY DATE
- -
MATERIAL FINISH A1 TFX_CASE
14.3 Mounting Options - RECOMMENDED

The TFX12V mechanical design provides two options for mounting in a system chassis.
The unit can be mounted using one of the mounting holes on the front end (non-vented
end) or a chassis feature can be designed to engage the slot provided in the bottom of
the supply. In order to accommodate different system chassis layouts, the TFX12V
power supply is also designed to mount in two orientations (fan left and fan right) as
shown in Figure 51. A mounting hole and slot should be provided for each orientation
as shown in Figure 49. Details of a suggested geometry for the mounting slot are
shown in Figure 50.
Figure 51. Fan Right and Fan Left Orientations of Power Supply in a Chassis
14.4 Chassis Requirements - RECOMMENDED

To ensure the power supply can be easily integrated, the following features should be
designed into a chassis intended to use a TFX12V power supply:
• Chassis cutout (normally in the rear panel of the chassis) as shown in Figure 52.
• EITHER a mounting bracket to interface with the forward mounting hole on the
power supply OR a mounting tab as shown in Figure 53 to interface with the
mounting slot on the bottom of the power supply.
Figure 52. Suggested TFX12V Chassis Cutout
97
Figure 53. Suggested Mounting Tab (chassis feature)
98
Flex ATX Specific Guidelines 1.01
15 Flex ATX Specific Guidelines

1.01
For Flex ATX Form Factor with 12-volt connector power supplies.

90
80 95, 80
5 V + 3.3 V power (W)
45, 80
70
60
120, 55
50
20, 45
40
7.2, 26
30
20 120, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150
99

Current (A) (A)
+12 VDC1 0.6 10.0 13.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
1
+5 VSB 0 2.0 2.5
NOTES:
minute.
90
80 135, 80
5 V + 3.3 V power (W)
70
60
50 168, 47
20, 45
40
7.2, 28
30
20 168, 16
10 7.2, 5.4
20.4, 5.4
0
0 50 100 150 200

Current (A) (A)
+12 VDC1 0.6 14.0 16.0

2
+5 VDC 0.2 14.0 -
+3.3 VDC 0.1 13.0 -
-12 VDC 0 0.3 -
1
+5 VSB 0 2.0 2.5
NOTES:
minute.
100
120
5 V + 3.3 V power (W)
100 60, 97 168, 97
80
60 204, 61
20, 45
40
7.2, 28
20 204, 16
7.2, 5.4
20.4, 5.4
0
0 50 100 150 200 250

Current (A) (A)
+12 VDC1 0.6 17 A 18 A

2
+5 VDC 0.2 15.0 -
+3.3 VDC 0.1 19.0 -
-12 VDC 0 0.3 -
1
+5 VSB 0 2.0 2.5
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 8.4 8.4 7.8 0.3 1.7

Typical (A) 4.2 4.2 3.9 0.1 0.8
Light (A) 1.7 1.7 1.6 0.1 0.3
NOTES:
101
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 11.8 8.3 7.7 0.3 1.7

Typical (A) 5.9 4.2 3.9 0.1 0.8
Light (A) 2.4 1.7 1.5 0.1 0.3
NOTES:
Loading +12 V +5 V +3.3 V -12 V +5 VSB
Full (A) 14.6 9.1 11.5 0.3 1.7

Typical (A) 7.3 4.5 5.7 0.1 0.9
Light (A) 2.9 1.8 2.3 0.1 0.3
NOTES:
102
103
104
150
M
68.1
J
75.9 15.1
Figure 58.
E K 6-32 UNC-2B
35.9 59.9 81.5
W F L 2 PLACES
15.2 47 66.5
37
X G N R
16.88
4.4 9 50.5 15
A V P Q S
6-32 UNC-2B
4 PLACES
40.5 32
B T
36.1 7
C U
4.1
D PREFERRED MFG LABEL

LOCATION
CABLE OUTLET MAY EXIST

IN EITHER LOCATION
ITEM DIMENSION ITEM DIMENSION
A 17.0 REF M 150.00
B 40.5 N 47.00 REF
C 36.1 P 9.00 REF
D 4.1 Q 50.50 REF
E 76.0 R 66.50
F 60.0 REF S 15.00
G 15.2 T 32.00 REF
J 68.10 REF U 7.00 UNLESS OTHERWISE SPECIFIED DESIGNED BY DATE DEPARTMENT R 2200 MISSION COLLEGE BLVD.
K 15.10 REF V 4.40 INTERPRET DIMENSIONS AND TOLERANCES - P.O. BOX 58119
IN ACCORDANCE WITH ASME Y14.5M-1994 SANTA CLARA, CA 95052-8119
Dimensions & Recommended Feature Placements (not to scale)

L 81.50 W 35.90 ALL UNTOLERANCED LINEAR
TITLE
- -
X 37.00 DIMENSIONS ±0.1
CHECKED BY DATE
ANGLES ±0.5
THIRD ANGLE PROJECTION - - FLEX ATX
- -
APPROVED BY DATE
- -
MATERIAL FINISH A1 FLEX_ATX_A1

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Power Supply

Design Guide for Desktop Platform Form Factors

• Initial release of combined power supply design guide

• Added 12V2 Current for Processor Configurations table

1.1 Reference Documentation

European Association of Consumer Electronics Manufacturers

Table 1. Conventions and Terminology

AWG American Wire Gauge

Table 2. Support Terminology

Table 3. Digital Office Platform Configurations for 2008

Line Item Config 1 Config 2

Table 4. Digital Home Platform Configurations for 2008

Line Item HEDT Config Config 2 Config 3 Config 4

Processor TDP 130 W 95 W 65 W

Line Item Description

Processor TDP 65 W 105 W 65 W 105 W

Table 6. Digital Home Platform Configurations for 2007 - CE EPC

Line Item Description

Line Item Description

Processor TDP 65 W 105 W 95 W

Line Item Description

Processor TDP 130 W

Power Supply EPS12V1

Table 9. Digital Office Platform Configurations for 2007 - Entry

Line Item Description

Table 10. Digital Office Platform Configurations for 2007 - Fundamental

Line Item Description

Table 11. Digital Office Platform Configurations for 2007 - Professional

Line Item Description

Power Supply LFX12V, Flex ATX LFX12V, Flex ATX

Line Item Description

Processor TDP 65 W 95 W 105 W

Line Item Description

Table 13. 12V2 Current for Processor Configurations

12V2 Current Recommendation

3.1 AC Input - REQUIRED

Table 14. AC Input Line Requirements

Parameter Minimum Nominal1 Maximum Unit

Vin (115 VAC) 90 115 135 VACrms

3.1.1 Input Over Current Protection - REQUIRED

3.1.2 Inrush Current - REQUIRED

3.1.3 Input Under Voltage - REQUIRED

3.2 DC Output - REQUIRED

Table 15. DC Output Voltage Regulation

Output Range Min Nom Max Unit

+12V1DC1 ±5% +11.40 +12.00 +12.60 V

+12V2DC2 ±5% +11.40 +12.00 +12.60 V

+5VDC ±5% +4.75 +5.00 +5.25 V

+3.3VDC3 ±5% +3.14 +3.30 +3.47 V

-12VDC ±10% -10.80 -12.00 -13.20 V

3.2.2 Output Transient Response - REQUIRED

Table 16. DC Output Transient Step Sizes1

Maximum Step Size

3.2.3 Remote Sensing - REQUIRED

3.2.4 Other Low Power System Requirements - RECOMMENDED

Table 17. Recommended 5 VSB Efficiency

3.2.5 Output Ripple Noise - REQUIRED

Table 18. DC Output Noise/Ripple

Output Maximum Ripple and Noise (mV p-p)

+12 V1DC 120

Figure 1. Differential Noise Test Setup

Load Load must be