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The 5th Asian Aerosol Conference Aug 26~29 2007

National Taipei
p University
y of Technology
gy
Department of Energy and Refrigerating Air-Conditioning Engineering.

Novell Air
N Ai Distribution
Di t ib ti System
S t for
f
Cleanrooms with high heat
heat-load
load
and high particle sources
Presenter: C.K Chang1,
Ad i
Adviser :S C H 2, Koji
S.C.Hu K ji T d 3
Toda
1.Master Student of National Taipei University of Technology ,
Department of Energy and Refrigerating Air-Conditioning Engineering.
2.Professor of National Taipei University of Technology
D
Department
t t off Energy
E and
d Refrigerating
R fi ti AiAir-Conditioning
C diti i E Engineering.
i i
3.General Manager of Taiwan Mika Engineering Consultant Co., Ltd.
Registered Building Services Engineer of Japan

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Contents The 5th Asian Aerosol Conference Aug 26~29 2007

• 1.Introduction
• 2.Description of existing
g system
y
• 3.Problems in existing system
• 4. Roadmap of semiconductor technology
• 5.Description of proposed system
• 6.Comparison
• 7.Conclusions

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1. Introduction The 5th Asian Aerosol Conference Aug 26~29 2007

Motivation and Reasons


1.Rapid Change of production Line In Taiwan IT Industries
2.Incerased Productivity in the same cleanroom space

Comments and Problems


● Fixed Location of Return Air Shaft/Wall and Dry Coiling Coil
● High heat-load demand
● Un-uniform
Un uniform temperature
● Un-steady humidity in the rainy day
● Cleanness Decline

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2. Description of existing system (FFU+DCC) The 5th Asian Aerosol Conference Aug 26~29 2007

FFU: Fan Filter Unit

DCC: Dry Cooling Coil


MAU to handle outside air dew point
RAG: Return Air Grille
to maintain humidity of cleanroom
MAU: Make Up Units

FFU to provide driving force to keep


DCC to treat sensible OA cleanroom positive pressure and
heat of process tools recirculation
i l i air
i to achieve
hi
cleanness level in the room
MAU

FFU
DCC
DCC 30~50 Pa

R FFU Ext.Sp 100Pa Vf =0.3 ~0.5 m/s R


A A
Heat Non-unidirectional
Non unidirectional CR Heat
S ISO Class: 6~8 S

RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa

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3. Problems in existing system - 1 The 5th Asian Aerosol Conference Aug 26~29 2007

Heating
/Coolin
1.External
1 External static pressure of g invasion
FFU to be over 100Pa to Air P i l
Particle
invasion
overcome pressure infiltration
resistance of RAG,RAS.DCC.
OA
Moisture
invasion

MAU

-85
85 Pa
FFU
DCC
DCC 30~50 Pa

R FFU Ext.Sp
Ext Sp 100Pa Vf =0.3 ~0.5 m/s R
A A
Heat Non-unidirectional CR Heat
S SO Class:
ISO C ass 66~8
8 S

RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa

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3. Problems in existing system - 2 The 5th Asian Aerosol Conference Aug 26~29 2007

2.Downward cold supply air


from FFU to encounter
upward air current due to the
heat-load from process tools.

T:10~36OC
OA Hu: 20%~90%
ADP:14.5OC
MAU

FFU
DCC DCC

R R
A Heat Non-unidirectional
Non unidirectional CR Heat A
S Particle ISO Class: 6~8 Particle S
T:23±3OC, Hu:50±5%
Pressure:+15Pa

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3. Problems in existing system - 3 The 5th Asian Aerosol Conference Aug 26~29 2007

3.Fixed position of return air


shaft and dry cooling coil

OA

MAU

FFU
DCC
DCC 30~50 Pa

R FFU Ext.Sp
Ext Sp 100Pa Vf =0.3 ~0.5 m/s R
A A
Heat Non-unidirectional CR Heat
S SO Class:
ISO C ass 66~8
8 S

RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa

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4. Roadmap of semiconductor technology (abstracted from ITRS2005)
The 5th Asian Aerosol Conference Aug 26~29 2007

Year 2005 2010 2015 2020


【Devices】
80nm 45nm 25nm 14nm
minimum feature size 1.2nm 0.7nm 0.6nm 0.5nm
gate oxide thickness
【Contamination control】
40nm 23nm 13nm (7nm)
minimum particle size
Chemical contamination (general environment)
Acid(SO4) 1000 pptM 500 pptM 500 pptM 500 pptM
Base(NH3) 5000 pptM 2500 pptM 2500 pptM 2500 pptM
Condensable Organics 4000 pptM 2500 pptM 2500 pptM 2500 pptM
Dopants(B,P) 10 pptM 10 pptM 10 pptM 10 pptM
Chemical contamination(local environment)
100 pptM
Acid(SO4, slicidation) 10 pptM 10 pptM 10 pptM
(430ng/m³)
2500 pptM
Base(NH3, reticle stocker) TBD TBD TBD
(1900 / ³)
(1900ng/m³)
Chemical contamination(wafer surface)
Organics (one-day exposed surface) 2 ng/cm² 0.5 ng/cm² 0.5 ng/cm² 0.5 ng/cm²
Dopants (one-day exposed surface) 2×10¹² atom/cm² 1×10¹² atom/cm² 1×10¹² atom/cm² 1×10¹² atom/cm²

【Cleanness of cleanroom】
Whole clean room ISO Class6 ISO Class6 ISO Class7 ISO Class8
Inside of minienvironment ISO Class2 ISO Class1 ISO Class1 ISO Class1

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5.Description of proposed system The 5th Asian Aerosol Conference Aug 26~29 2007

FFU: Fan Filter Unit


MAU to handle outside air dew point
to maintain humidity of cleanroom FDCU: Fan Dry Coil Units

MAU: Make Up Units

Low external p pressure of FFU to


provide driving force to keep
FDCU to treat sensible heat
cleanroom positive pressure and
of process tools and
recirculation air to achieve OA overcome the p pressure drop
p
cleanness
l level
l l in
i the
th room
of coiling coil
MAU

-15 Pa
FFU FDCU

FFU Ext.. Static


Pressure: 30Pa
Non-unidirectional CR
ISO Class: 6~8
T:23±3OC, Hu:50±5%
Pressure:+15Pa
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6.Comparison - 1 The 5th Asian Aerosol Conference Aug 26~29 2007

OA Supply air chamber pressure to


Existing system be -85 Pa

FFU External static pressure of FFU


to be over100Pa to overcome
pressure resistance of
R
A RAG,RAS.DCC.
S
+15Pa
RAG C/R Pressure to maintain
+15Pa

OA
Proposed system Supply air chamber pressure
down to -15 Pa

FDCU FFU
External static pressure of
FFU can be under 30Pa
+15Pa
C/R Pressure to maintain
+15Pa

Less negative pressure in the supply air chamber (from -85 Pa to -15 Pa)
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6.Comparison - 2 The 5th Asian Aerosol Conference Aug 26~29 2007

Existing system
Air infiltration OA

Air infiltration
-85 Pa =3600 α A 2.∆P/ρ
α=0.8, ρ=1.2kg/m3, .∆P: Pascal

IF A=10cmx10cmx10 =0.1 M2
Air infiltration =3600 x 0.8 x 0.1 x 2x85/1.2
=3428 CMH
Air OA
Proposed system
infiltration

Air infiltration
i filt ti =3600
3600 x 0.8 x 0.1 x 2x15/1.2
-15 Pa =1440 CMH

Reduced air infiltration


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6.Comparison - 3 The 5th Asian Aerosol Conference Aug 26~29 2007

Large air Infiltration Existing system


Heat invasion
Moisture invasion
Heat invasion =3428cmhx 1.2 x ∆h (Kcal/kg)
= 3428x1.2x12
-85 Pa = 49,363Kcal/hr
49,363Kcal/hr≈16.3USRT
16.3USRT

Moisture invasion =3428cmhx 1.2 x ∆χ (kg/kg)


= 3428x1.2x0.0045
= 18.5Kg/h

Smaller
S ll air i IInfiltration
filt ti P
Proposed
d system
t
Heat invasion
Moisture invasion Heat invasion=1440cmhx 1.2 x ∆h (Kcal/kg)
= 1440x1.2x12
1440x1 2x12
=20,736Kcal/hr≈6.9USRT
-15 Pa
Moisture invasion
i i =1440cmhx
1440cmhx 1
1.2
2 x ∆χ (kg/kg)
= 1440x1.2x0.0045
= 7.8Kg/h

Reduced the energy consumption


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6.Comparison - 4 The 5th Asian Aerosol Conference Aug 26~29 2007

Better cleanness level


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6.Comparison - 5 The 5th Asian Aerosol Conference Aug 26~29 2007
OA

Existing system

FFU 0.3M/S~0.5M/S
DCC
DCC 30~50 Pa
R R
A Heat Heat A
S S

RAG RAG
15~20 Pa

OA

Proposed system

FFU FDCU

FDCU

Uniform temperature distribution in the working area (BOF + 0.9m~1.5m)


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6.Comparison - 6 The 5th Asian Aerosol Conference Aug 26~29 2007

Existing system ADP 14.5OC ,10% of Supply volume


14.5x0.1+18x0.9/1=17.650C
To:180C

14.50C
FFU 0.3 M/S~0.5 M/S DCC To:180C
DCC
R Ts:17.650C R Ti:23.50C
A Heat Heat A
S S Ti:23.50C

ADP:14.50C 14 5 0 1 20 24 0 9/1 19 23 0C
14.5x0.1+20~24x0.9/1=19~23
Proposed system To:20~24 0C

FFU FDCU To:20~24 0C FDCU

19 45 230C Ti:26
Ts:19.45~23
T 300C
Ti:26~30 300C
Ti:26~30
Ti:26

According to heat-load of process


tools to design the dry coiling coil

Accuracy and high COP to treat heat of process tools


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6.Comparison - 7 The 5th Asian Aerosol Conference Aug 26~29 2007

Existing system

DCC FFU Return Air Shaft

Clean Room 1k
Return Air Grille

Proposed system
Fan Dry Cooling Unit to
treat sensible heat of
process tools
FFU FDCU

Return air shaft


Clean Room 1k cancelled to increase
production area

15% increased production area


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6.Comparison - 8 The 5th Asian Aerosol Conference Aug 26~29 2007

OA
Existing system

FFU Ext.Sp 100Pa


Fixed DCC FFU 0.35M/S~0.45M/
S
location

R R
Fixed RAS A Heat Heat A
location S S

RAG RAG
15~20 Pa

Proposed system

FDCU can be Ball room system


relocated with the
process tools

FDCU can be relocated with the process tools


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7.Conclusions The 5th Asian Aerosol Conference Aug 26~29 2007

Green Cleanroom , Innovation , Environmental Friendly

Increased Less negative Reduced Uniform Reduced Flexible


Production Area pressure Energy Temperature Initial cost Relocation

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National Taipei University of Technology
Department of Energy and Refrigerating Air-Conditioning Engineering. The 5th Asian Aerosol Conference Aug 26~29 2007

National
N i l Taipei
T i i University
U i i off Technology
T h l
Department of Energy and Refrigerating Air-conditioning Engineering
Shih-Cheng Hu, Ph.D
Andy Chang
Toda Koji
E-mail:f10870@ntun.edu.tw
E-mail:andy5310biz@gmail.com
E-mail:toda@ms49.hinet.net
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