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National Taipei
p University
y of Technology
gy
Department of Energy and Refrigerating Air-Conditioning Engineering.
Novell Air
N Ai Distribution
Di t ib ti System
S t for
f
Cleanrooms with high heat
heat-load
load
and high particle sources
Presenter: C.K Chang1,
Ad i
Adviser :S C H 2, Koji
S.C.Hu K ji T d 3
Toda
1.Master Student of National Taipei University of Technology ,
Department of Energy and Refrigerating Air-Conditioning Engineering.
2.Professor of National Taipei University of Technology
D
Department
t t off Energy
E and
d Refrigerating
R fi ti AiAir-Conditioning
C diti i E Engineering.
i i
3.General Manager of Taiwan Mika Engineering Consultant Co., Ltd.
Registered Building Services Engineer of Japan
1
Contents The 5th Asian Aerosol Conference Aug 26~29 2007
• 1.Introduction
• 2.Description of existing
g system
y
• 3.Problems in existing system
• 4. Roadmap of semiconductor technology
• 5.Description of proposed system
• 6.Comparison
• 7.Conclusions
2
1. Introduction The 5th Asian Aerosol Conference Aug 26~29 2007
3
2. Description of existing system (FFU+DCC) The 5th Asian Aerosol Conference Aug 26~29 2007
FFU
DCC
DCC 30~50 Pa
RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa
4
3. Problems in existing system - 1 The 5th Asian Aerosol Conference Aug 26~29 2007
Heating
/Coolin
1.External
1 External static pressure of g invasion
FFU to be over 100Pa to Air P i l
Particle
invasion
overcome pressure infiltration
resistance of RAG,RAS.DCC.
OA
Moisture
invasion
MAU
-85
85 Pa
FFU
DCC
DCC 30~50 Pa
R FFU Ext.Sp
Ext Sp 100Pa Vf =0.3 ~0.5 m/s R
A A
Heat Non-unidirectional CR Heat
S SO Class:
ISO C ass 66~8
8 S
RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa
5
3. Problems in existing system - 2 The 5th Asian Aerosol Conference Aug 26~29 2007
T:10~36OC
OA Hu: 20%~90%
ADP:14.5OC
MAU
FFU
DCC DCC
R R
A Heat Non-unidirectional
Non unidirectional CR Heat A
S Particle ISO Class: 6~8 Particle S
T:23±3OC, Hu:50±5%
Pressure:+15Pa
6
3. Problems in existing system - 3 The 5th Asian Aerosol Conference Aug 26~29 2007
OA
MAU
FFU
DCC
DCC 30~50 Pa
R FFU Ext.Sp
Ext Sp 100Pa Vf =0.3 ~0.5 m/s R
A A
Heat Non-unidirectional CR Heat
S SO Class:
ISO C ass 66~8
8 S
RAG
T:23±3OC, Hu:50±5%
RAG
15~20 Pa Pressure:+15Pa
7
4. Roadmap of semiconductor technology (abstracted from ITRS2005)
The 5th Asian Aerosol Conference Aug 26~29 2007
【Cleanness of cleanroom】
Whole clean room ISO Class6 ISO Class6 ISO Class7 ISO Class8
Inside of minienvironment ISO Class2 ISO Class1 ISO Class1 ISO Class1
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5.Description of proposed system The 5th Asian Aerosol Conference Aug 26~29 2007
-15 Pa
FFU FDCU
OA
Proposed system Supply air chamber pressure
down to -15 Pa
FDCU FFU
External static pressure of
FFU can be under 30Pa
+15Pa
C/R Pressure to maintain
+15Pa
Less negative pressure in the supply air chamber (from -85 Pa to -15 Pa)
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6.Comparison - 2 The 5th Asian Aerosol Conference Aug 26~29 2007
Existing system
Air infiltration OA
Air infiltration
-85 Pa =3600 α A 2.∆P/ρ
α=0.8, ρ=1.2kg/m3, .∆P: Pascal
IF A=10cmx10cmx10 =0.1 M2
Air infiltration =3600 x 0.8 x 0.1 x 2x85/1.2
=3428 CMH
Air OA
Proposed system
infiltration
Air infiltration
i filt ti =3600
3600 x 0.8 x 0.1 x 2x15/1.2
-15 Pa =1440 CMH
Smaller
S ll air i IInfiltration
filt ti P
Proposed
d system
t
Heat invasion
Moisture invasion Heat invasion=1440cmhx 1.2 x ∆h (Kcal/kg)
= 1440x1.2x12
1440x1 2x12
=20,736Kcal/hr≈6.9USRT
-15 Pa
Moisture invasion
i i =1440cmhx
1440cmhx 1
1.2
2 x ∆χ (kg/kg)
= 1440x1.2x0.0045
= 7.8Kg/h
Existing system
FFU 0.3M/S~0.5M/S
DCC
DCC 30~50 Pa
R R
A Heat Heat A
S S
RAG RAG
15~20 Pa
OA
Proposed system
FFU FDCU
FDCU
14.50C
FFU 0.3 M/S~0.5 M/S DCC To:180C
DCC
R Ts:17.650C R Ti:23.50C
A Heat Heat A
S S Ti:23.50C
ADP:14.50C 14 5 0 1 20 24 0 9/1 19 23 0C
14.5x0.1+20~24x0.9/1=19~23
Proposed system To:20~24 0C
19 45 230C Ti:26
Ts:19.45~23
T 300C
Ti:26~30 300C
Ti:26~30
Ti:26
Existing system
Clean Room 1k
Return Air Grille
Proposed system
Fan Dry Cooling Unit to
treat sensible heat of
process tools
FFU FDCU
OA
Existing system
R R
Fixed RAS A Heat Heat A
location S S
RAG RAG
15~20 Pa
Proposed system
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National Taipei University of Technology
Department of Energy and Refrigerating Air-Conditioning Engineering. The 5th Asian Aerosol Conference Aug 26~29 2007
National
N i l Taipei
T i i University
U i i off Technology
T h l
Department of Energy and Refrigerating Air-conditioning Engineering
Shih-Cheng Hu, Ph.D
Andy Chang
Toda Koji
E-mail:f10870@ntun.edu.tw
E-mail:andy5310biz@gmail.com
E-mail:toda@ms49.hinet.net
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