Sjzl20081400-Unitrans ZXMP S200 (V3.00) Product Descriptions - 514548

ZXMP S200
SDH Based Multi-Service Node Equipment

Product Descriptions
Version 3.00
ZTE CORPORATION
ZTE Plaza, Keji Road South,
Hi-Tech Industrial Park,
Nanshan District, Shenzhen,
P. R. China
518057
Tel: (86) 755 26771900
Fax: (86) 755 26770801
URL: http://ensupport.zte.com.cn
E-mail: support@zte.com.cn

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Copyright 2006 ZTE CORPORATION.

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licensee, the user of this document shall not acquire any license to the subject matter herein.

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The ultimate right to interpret this product resides in ZTE CORPORATION.
Revision History
Date Revision
No.
Serial No. Description
2009/01/08 R1.1 sjzl20081400
Second edition. Adds SMB board and EIE3
board.
2009/05/20 R1.2 sjzl20081400
Add the descriptions about the networking
application of Ethernet.

ZTE CORPORATION
Values Your Comments & Suggestions!
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documentation and offer better services to our customers.
Please fax to: (86) 755-26770801; or mail to ZTE University, ZTE CORPORATION,
ZTE Plaza, A Wing, Keji Road South, Hi-Tech Industrial Park, Shenzhen, P. R. China
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Thank you for your cooperation!
Document
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ZXMP S200 (V3.00) SDH Based Multi-Service Node Equipment Product
Descriptions
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Contents

About This Product Descriptions .................................................... i
Purpose........................................................................................................i
Intended Audience......................................................................................i
Prerequisite Skill and Knowledge...............................................................i
What is in This Manual ................................................................................i
Related Documentation .............................................................................ii
Conventions................................................................................................ii
Typographical Conventions...................................................................................... ii
Mouse Operation Conventions..................................................................................iii
How to Get in Touch..................................................................................iii
Customer Support ................................................................................................. iv
Documentation Support ......................................................................................... iv
Chapter 1........................................................................................ 1
Overview........................................................................................ 1
ZTEs Unitrans ZXMP Family ......................................................................1
Introduction to ZXMP S200 .......................................................................2
System Structure........................................................................................3
Structure of Hardware System.................................................................................3
Network Management System.................................................................................5
System Features.........................................................................................7
Chapter 2...................................................................................... 15
System Hardware......................................................................... 15
Outline and Structure.............................................................................. 15
Board Overview....................................................................................... 17
Main Board............................................................................................... 19
SMC Main Board................................................................................................... 22
SMB Main Board................................................................................................... 37
Front Panel .......................................................................................................... 50
DC Power Module (PWA/PWB) .............................................................. 54

Functions............................................................................................................. 54
Operating Principle................................................................................................ 54
Front Panel .......................................................................................................... 55
AC Power Module (PWC) ........................................................................ 58
Front Panel .......................................................................................................... 59
V.35 Data Interface Board (V35B) ......................................................... 60
Front Panel .......................................................................................................... 61
E1/T1 Electrical Tributary Board............................................................ 62
Types .................................................................................................................. 62
Functions............................................................................................................. 63
Front Panel .......................................................................................................... 64
E3/T3 Electrical Interface Board (EIE3) ................................................ 65
Functions............................................................................................................. 65
Front Panel .......................................................................................................... 66
4-Channel Transparent-Transmission Fast Ethernet Electrical Interface
Board (TFEx4) ......................................................................................... 67
Functions............................................................................................................. 67
Front Panel .......................................................................................................... 67
4-Channel Transparent-transmission Fast Ethernet Optical Interface
Board (TFEx4B)....................................................................................... 69
Functions............................................................................................................. 69
Front Panel .......................................................................................................... 69
Audio Interface Board (AI)..................................................................... 70
Functions............................................................................................................. 70
Front Panel .......................................................................................................... 72
Orderwire Board (OW)............................................................................ 74
Functions............................................................................................................. 74
Front Panel .......................................................................................................... 75
Enhanced Smart Ethernet Board (SEC).................................................. 77
Functions............................................................................................................. 77

Front Panel .......................................................................................................... 78
SHDSL Interface Board (SDB) ................................................................ 80
Functions............................................................................................................. 80
Front Panel .......................................................................................................... 81
Chapter 3...................................................................................... 83
Technical Specifications............................................................... 83
Dimensions & Weight.............................................................................. 84
Power Supply Requirements .................................................................. 85
Voltage Range...................................................................................................... 85
Power Consumption and Weight ............................................................................ 85
Environment Requirements.................................................................... 90
Grounding and Lightning Protection Requirements................................................... 90
Temperature/Humidity Requirements..................................................................... 94
Cleanness Requirements....................................................................................... 94
Application Environment Requirements................................................................... 95
Earthquake-Proof Performance.............................................................. 95
Reliability Indexes................................................................................... 96
Electromagnetic Compatibility................................................................ 96
Criterion .............................................................................................................. 96
Immunity Performance ......................................................................................... 97
Disturbance Characteristics.................................................................................... 99
Eye Pattern of Optical Launched Signals.............................................. 100
Optical Interfaces Specifications.......................................................... 101
Electrical Interfaces Specifications ...................................................... 104
Specification of STM-1 Electrical Interfaces............................................................ 104
Specification of E1 Electrical Interfaces ................................................................. 104
Specification of T1 Electrical Interfaces ................................................................. 105
Specification of E3 Electrical Interfaces ................................................................. 106
Specification of T3 Electrical Interfaces ................................................................. 107
Clock Timing & Synchronization........................................................... 108
Bit Error Performance........................................................................... 109
Protection Switching Time.................................................................... 109
Compliant Standards of Interfaces....................................................... 109
Chapter 4....................................................................................111
Networking and Configurations.................................................111

Functions as an SDH NE........................................................................ 111
Terminal Multiplexer (TM).................................................................................... 111
Add/Drop Multiplexer (ADM)................................................................................ 112
Regenerator (REG) ............................................................................................. 112
Networking Modes ................................................................................ 112
Point-to-Point Networking.................................................................................... 113
Chain Networking............................................................................................... 113
Ring Networking................................................................................................. 113
Hybrid Networking.............................................................................................. 115
Networking Application of Ethernet ..................................................... 115
Overview........................................................................................................... 115
Ethernet Private Line (EPL).................................................................................. 115
Ethernet Virtual Private Line (EVPL) ..................................................................... 116
Ethernet Private LAN (EPLAN).............................................................................. 117
Ethernet Virtual Private LAN (EVPLAN).................................................................. 118
Application Example.............................................................................. 119
Network Description............................................................................................ 119
Networking Analysis............................................................................................ 120
Board Configurations........................................................................................... 121
Installation Configurations................................................................................... 122
Configurations in the EMS.................................................................................... 122
Networking Features........................................................................................... 122
Appendix A.................................................................................125
Compliant Recommendations and Standards...........................125
Appendix B.................................................................................131
Abbreviations.............................................................................131

About This Product
Descriptions

Purpose
This manual provides the basic information you need for understanding
Unitrans ZXMP S200 (V3.00) SDH Based Multi-Service Node Equipment
(ZXMP S200 for short).
Intended Audience
This document is intended for engineers and technicians who want to
know the system information, hardware information, operating principle
and technical specifications of ZXMP S200.
Prerequisite Skill and Knowledge
To use this document effectively, users should have a general
understanding of SDH transmission system technology. Familiarity with
the following is helpful:
ZXMP S200 equipment and its various components
ZXONM E300 Network Element Management System (EMS)
What is in This Manual
This Manual contains the following chapters and appendixes:
TAB L E 1 CHA PTER AND APPENDI X SUMMARY
Chapter/Appendix Summary
Chapter 1 Overview Introduces the overall structures, features and
compliant standards of ZXMP S200.
Chapter 2 System Describes the hardware structure and mechanical
Confidential and Proprietary Information of ZTE CORPORATION i

ZXMP S200 (V3.00) Product Descriptions
ii Confidential and Proprietary Information of ZTE CORPORATION
Chapter/Appendix Summary
Hardware characteristics of ZXMP S200, including working
principles, functions, structures, panels and
indicators.
Chapter 3 Technical
Specifications
Lists and describes the specifications and
parameters of ZXMP S200.
Chapter 4 Networking and
Configurations
Introduces the networking modes, network
application of Ethernet, as well as a networking
example of ZXMP S200.
Appendix A Compliant
Recommendations and
Standards
Lists all compliant recommendations and
standards used in the design of ZXMP S200.
Appendix B Abbreviations Lists the abbreviations of technical terms you may
encounter in this manual.
Related Documentation
The following documentation is related to this manual:
Documentation Descriptions
Unitrans ZXMP S200
(V3.00) Installation
& Maintenance
Manual
Introduces the installation steps on site, including
installation preparation, hardware installation,
cable layout, installation checkup, the process of
power-on/power-off.
Introduces the main and common operations
during the routine maintenance, focusing on the
common alarms and performance information, in
addition, the reasons and handling way of some
typical faults.
Unitrans ZXMP S200
(V3.00)
Configuration Manual
Based on ZXONM E300, introduce the provisioning
methods, basic configuration of the NE, SDH
protection configuration and the data service
configuration, which are related to ZXMP S200.
Conventions
Typographical Conventions
ZTE documents employ with the following typographical conventions.

About This Product Descriptions
TAB L E 2 TYPOGRAPHI CAL CONVENTI ONS
Typeface Meaning
Italics References to other guides and documents.
Quotes Links on screens.
Bold Menus, menu options, function names, input fields,
radio button names, check boxes, drop-down lists,
dialog box names, window names.
CAPS Keys on the keyboard and buttons on screens and
company name.
Constant wi dth Text that you type, program code, files and directory
names, and function names.
[ ] Optional parameters
{ } Mandatory parameters
| Select one of the parameters that are delimited by it

Note: Provides additional information about a certain
topic.

Checkpoint: Indicates that a particular step needs to
be checked before proceeding further.

Tip: Indicates a suggestion or hint to make things
easier or more productive for the reader.

Mouse Operation Conventions
TAB L E 3 MOUSE OPERATI ON CONVENTI ONS
Typeface Meaning
Click Refers to clicking the primary mouse button (usually
the left mouse button) once.
Double-click Refers to quickly clicking the primary mouse button
(usually the left mouse button) twice.
Right-click Refers to clicking the secondary mouse button
(usually the right mouse button) once.
Drag Refers to pressing and holding a mouse button and
moving the mouse.
How to Get in Touch
The following sections provide information on how to obtain support for
the documentation and the software.
Confidential and Proprietary Information of ZTE CORPORATION iii

iv Confidential and Proprietary Information of ZTE CORPORATION
Customer Support
If you have problems, questions, comments, or suggestions regarding
your product, contact us by e-mail at support@zte.com.cn. You can also
call our customer support center at (86) 755 26771900.
Documentation Support
ZTE welcomes your comments and suggestions on the quality and
usefulness of this document. For further questions, comments, or
suggestions on the documentation, you can contact us by e-mail at
doc@zte.com.cn; or you can fax your comments and suggestions to (86)
755 26770801. You can also explore our website at
http://ensupport.zte.com.cn, which contains various interesting subjects
like documentation, knowledge base, forums and service request.

Ch a p t e r 1
Overview

In this chapter, you will learn about:
ZTEs SDH transmission product familyUnitrans ZXMP family,
Structure and system features of ZXMP S200.
ZTEs Unitrans ZXMP Family
ZTEs SDH based multi-service node equipment family (Unitrans ZXMP
family) can support all applications at the core layer, convergence layer
and access layer. It provides users with future-oriented and integrated
solutions for metro area network (MAN).
The Unitrans ZXMP family includes various SDH based multi-service node
equipment, such as ZXMP S390, ZXMP S385, ZXMP S380, ZXMP S330,
ZXMP S325, ZXMP S320, ZXMP S310, ZXMP S200, ZXMP S150 and ZXMP
S100, as illustrated in Figure 1.
FI GURE 1 ZTE S UNI TRANS ZXMP FAMI L Y

Confidential and Proprietary Information of ZTE CORPORATION 1

Introduction to ZXMP S200
ZXMP S200 is a kind of SDH transmission equipment for multi-service
access, supporting the rate up to STM-4. Besides serving as the
integrative transmission equipment in GSM, CDMA or 3G base stations, it
can also access multi-services for customers in buildings or communities
as well as private line services for business customers. Moreover ZXMP
S200 can replace existing PDH equipment for transmission.
ZXMP S200, designed as a platform, strictly complies with related ITU-T
recommendations and China national standards. It provides a main board
for accessing various services. The main board integrates all SDH
functions (including the transmission of data services) and provides the
bus, control and communication interfaces for extension plug-in cards.
Multiple plug-in cards, which provide more powerful service access
function, are optional. The main board and plug-in cards support the
remote online upgrade of card software, including software programs and
FPGA programs.
Currently, ZXMP S200 can be configured with SMB main board or SMC
main board. It can provide STM-1/STM-4 optical interfaces, STM-1
electrical interface, E3/T3 electrical interfaces, E1/T1 electrical interfaces,
and FE (Fast Ethernet) optical/electrical interfaces, SHDSL interfaces, V.35
data interface, RS232/RS485/RS422 interfaces, orderwire telephone
interfaces and audio interfaces.
Figure 2 shows the front view of ZXMP S200.
FI GURE 2 FRONT VI EW OF ZXMP S200

ZXMP S200 can be used as a network element, such as terminal
multiplexer (TM), regenerator (REG) or add/drop multiplexer (ADM), in
simple networking applications.
Note: The SMB and SMC have the same design principle. The differences
between them are the types and quantities of interfaces. Refer to Main Board.
ZXMP S200 has good network adaptive capability. It can be managed by
Unitrans ZXONM E300 Unified EMS/SNMS of Optical Network (ZXONM
E300 for short) developed by ZTE CORPORATION. The network
management information can be transmitted via E1 tributaries. ZXMP
S200 can also work without the network management system.
ZXMP S200 is a compact equipment with high integration. It has high
reliability and high cost to performance ratio. It can be applied to various
2 Confidential and Proprietary Information of ZTE CORPORATION

Chapter 1 Overview
situations and be configured flexibly. ZXMP S200 can be configured as
various network element, such as terminal multiplexer (TM), regenerator
(REG) or add/drop multiplexer (ADM).
ZXMP S200 can be powered by any of below power supply ways: AC
110/220 V, DC -48 V and DC +24 V.
ZXMP S200 supports various installation modes, that is, it can be installed
on the desktop, hung on the wall, inside an indoor cabinet, an
transmission outdoor cabinet (including outdoor functional cabinet and
field power supply cabinet).
System Structure
Figure 3 shows the structure of ZXMP S200.
FI GURE 3 STRUCTURE OF ZXMP S200
ZXMPS200
ZXONME300
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ZXMP S200 consists of the hardware system and the network
management software system, which are independent of each other while
working in a coordinated way.
The hardware system is the principal part of ZXMP S200, and it can work
independently without the network element management system.
Structure of Hardware System
The ZXMP S200 hardware system is composed of eight functional units.
Figure 4 illustrates the relationship among these units in the block diagram.

FI GURE 4 REL ATI ONSHI PS BETWEEN FUNCTI ONAL UNI TS I N ZXMP S200

The functions of each unit are described as follows.
1. NE control processing unit (NCP)
As the control management core of ZXMP S200, the NCP unit can:
Process ECC data,
Manage alarms, performances and configurations,
Provide interfaces for connections between equipment and EMS.
2. Micro control unit (MCU)
As the service management core of ZXMP S200, the MCU implements
the initialization, configuration, alarm and performance monitoring of
the service chips on the main board.
3. Service unit
This unit implements the accessing of SDH, PDH and Ethernet services,
which are translated into special format, and then sent to the cross-
connect unit for service convergence and distribution.
4. Cross-connect unit
Based on configuration information from the EMS and alarms in each
optical direction, cross-connect unit can:
Cross connect traffic from different optical directions,
Cross overheads,
Perform path protection switching,
Perform APS bridging/switching.
5. Overhead processing unit
This unit provides user with transparent data channel by means of the
overhead bytes in Section Over Head (SOH).
6. Orderwire unit

Chapter 1 Overview
This unit implements the orderwire and low-rate data transmission.
Audio interfaces are also provided by this unit.
7. Clock unit
This unit provides each functional unit in the equipment with the
standard system clock, to achieve the entire network synchronization
based on the configuration in the EMS. In addition, the clock unit
provides external clock input/output interfaces.
8. Power unit
Working as an independent unit, the power unit provides steady power
supply to all the other functional units in the system.
Network Management System
ZXONM E300 with the version V3.18R2 or above can manage and monitor
the ZXMP S200 (V3.00) hardware system and the transmission network,
thus coordinate the operation of the transmission network.
ZXONM E300 is designed with a four-layer structure, consisting of the
equipment layer, NE layer, NE management layer and the subnet
management layer. It also provides Corba interface for the network
management layer. Figure 5 illustrates the hierarchical structure of
ZXONM E300.
FI GURE 5 HI ERARCHI CAL STRUCTURE OF ZXONM E300
GUI(Cient)
EMS/SNMS
Manager 2
EMS/SNMS
Manager n
GNE/Agent
NE/Agent NE/Agent
NE/Agent
ECC
ECC ECC
ECC
ECC
S S
NE/Agent GNE/Agent
S S
F
F
LCT
f
Qx
Network
Management
Layer
Element
Management
Layer
NE Layer
Equipment
Layer
Qx
Corba
Subnet
Management
Layer
SNMS
Manager 3
GUI(Cient)
F
NMS
F
Corba
EMS/SNMS
Manager 1
GNE/Agent
NE/Agent NE/Agent
NE/Agent
MCU MCU
ECC
ECC ECC
ECC
S S
F
Qx
GUI(Cient)
F
F
MCU MCU MCU MCU
NMS

GUI(Cient) GUI(Cient)


Four-Layer Structure of NMS
The four-layer structure of the network management system is described
as follows.
Equipment layer (MCU)
It monitors alarms and performances of boards, receives instructions
from the network management system and controls the specific
operation of the boards.
Network element layer (Agent)
As the Agent in the network management system, it performs the
management function for the individual NE.
The agent initializes each board when the NE is powered on firstly.
Normally, it monitors alarm and performance status of the NE. In
addition, it receives and processes monitoring commands from the
element management layer (Manager) through the gateway network
element (GNE).
Element management layer (Manager)
It controls and coordinates the operation of multiple NEs. This layer
includes Manager, Graphical User Interface (GUI) and Local Craft
Terminal (LCT).
Manager: core of the element management layer, also called as
Server. It can manage multiple subnets simultaneously, controlling
and coordinating the NE equipment.
GUI: graphical user interfaces. It converts users management
requests into commands in the internal format, and then forwards
them to the Manager.
LCT: it is a simple combination of GUI and Manager by controlling
the user authority and software functional parts. The LCT provides
the reduced NE management function. It is usually used for
commissioning or maintenance of local NEs.
Subnet management layer
The structure of the subnet management layer is similar to that of the
NE management layer. The configuration and maintenance for NEs are
performed through the element management system (EMS) indirectly.
SubNet Management System (SNMS) sends a command to the EMS,
and then the EMS forwards it to the NE. Finally the NE responds to the
SNMS through the EMS. The SNMS can provide the network
management layer with the Corba interface to transmit subnet
monitoring command and operation information.
Interfaces in NMS
Table 4 lists the interfaces in a network management system and the
corresponding descriptions.

Chapter 1 Overview
TAB L E 4 I NTERFACES I N A NETWORK MANAGEMENT SYSTEM
Interface Description
Qx interface
It is the interface between Agent and Manager, as shown in
Figure 5, that is, the interface between the NCP and the
computer with the Manager program.
The Qx interface complies with the TCP/IP protocol.
F interface
It is the interface between GUI and Manager, or between the
Manager on the subnet management layer and the Manager on
the NE management layer, as shown in Figure 5.
The F interface complies with the TCP/IP protocol.
f interface
It is the interface between Agent and LCT, as shown in Figure 5,
that is, the interface between the NCP and the local craft
terminal. There is network management software on the LCT.
The f interface complies with the TCP/IP protocol.
S interface
It is the interface between Agent and MCU, as shown in Figure
5, that is, the communication interface between the NCP and
other boards.
The S interface adopts the point-to-multipoint communication
mode based on the High level Data Link Control (HDLC)
communication mechanism.
ECC
interface
It is the interface between Agents, as shown in Figure 5, that is,
the communication interface between NEs.
The ECC interface adopts Data Communication Channel (DCC)
for communication, be capable of supporting both the
customized communication protocol and the standard protocol.
It implements the network bridge function Agents.

You can get more information about the network management system in
the related manuals of ZXONM E300.
System Features
Small Size and Compact Structure
ZXMP S200 has small size and high integration. Equipped with various
mounting flanges, ZXMP S200 can be installed on the desktop, hung on
the wall, or in an IEC, ETS standard 19-inch cabinet and transmission
outdoor cabinet (including outdoor functional cabinet and field power
supply cabinet). It needs less space for accommodation.
All interfaces are located at the front, by which, operation and
maintenance of the equipment is very convenient.
Abundant Service Functions
ZXMP S200 can access multi-services, including traditional SDH
services and data services. Table 5 lists the cross-connect capacity of
ZXMP S200.

TAB L E 5 CROSS- CONNECT CAPACI TY OF ZXMP S200
Main Board
Higher-order Cross-
connect Capacity
Lower-order Cross-
connect Capacity
SMB 32 32 VC4 1008 1008 VC12
SMC 64 64 VC4 2037 2037 VC12

Table 6 and Table 7 respectively list the service interfaces and
corresponding maximum access capacities provided by ZXMP S200
with SMB or SMC main board.
TAB L E 6 SERVI CE I NTERFACES PROVI DED B Y ZXMP S200 ( SMB)
Interface
Max. Capacity
(Channel)
Remark
SDH optical
interface
4
ZXMP S200 supports 4 channels of
STM-1 and 2 channels of STM-4 optical
interfaces at most.
Thus, the allowable SDH interface
combinations are as follows:
4 STM-1 or
2 STM-1 + 2 STM-4 or
3 STM-1 + 1 STM-4
E1/T1
electrical interface
42 -
E3/T3
3
E3 or T3 rate is supported via the
EMS.
FE interface

8
FE interface include FE electrical
interface and FE optical interface. The
allowable combinations of 8 channels
of FE interfaces are as follows:
4 FE (electrical) + 4 FE (optical)
or
8 FE (electrical)
The main board provides 4 channels of
FE interfaces, and the SEC board
provides another 4 channels of FE
electrical interfaces, which supports L2
switch.
V.35 data
interface
(N 64 kbit/s)
2 N is an integer from 1 to 31
Audio interface 6
Set the interface type is two-line or
four-line via EMS, or set the output
electrical level gain.

Chapter 1 Overview
Interface
Max. Capacity
(Channel)
Remark
Data interface 6 or 3
The ZXMP S200 supports
6 RS232 interfaces or
6 RS485 interfaces or
3 RS422 interfaces.
The interface type can be set via the
EMS.
Orderwire
telephone
interface
1 -
TRK interface 1 -
SHDSL interface 4 -

Note:
Optical interfaces adopt Small form Factor Pluggable (SFP) modules,
supporting interface diagnosis function.
ZXMP S200 provides an extension slot. If the maximum capacity of one type of
interface is reached by using the extension slot, the other types of interfaces that
need to use the extension slot cannot reach the maximum capacity listed in Table
6.

TAB L E 7 SERVI CE I NTERFACES PROVI DED B Y ZXMP S200 ( SMC)
Interface
Max. Capacity
(Channel)
Remark
SDH optical
interface
4
Each of the optical interfaces can
be set to access the STM-4 or
STM-1 signal.
STM-1 electrical
interface
4 -
E1/T1
42
The main board provides 21 x
E1/T1, besides, the plug-in board
ET1 can provide another 21 x
E1/T1.
FE interface 8
FE interface include FE electrical
interface and FE optical interface.
The allowable combinations of 8
channels of FE interfaces are as
follows:
4 FE (electrical) + 4 FE
(optical) or
8 FE (electrical)
The main board provides 4 channels of
FE interfaces, and the SEC board

Interface
Max. Capacity
(Channel)
Remark
provides another 4 channels of FE
electrical interfaces, which supports L2
switch.
V.35 data interface
(N 64 kbit/s)
2 N is an integer from 1 to 31.
Audio interface 6
Set the interface type is two-line or
four-line via EMS, or set the output
electrical level gain.
Data interface 6 or 3
ZXMP S200 can provide:
6 RS232 interfaces or,
6 RS485 interfaces or,
3 RS422 interfaces.
The interface type can be set on
the EMS.
Orderwire
telephone interface
1 -
TRK interface 1 -
SHDSL interface 4 -

Note:
Optical interfaces and STM-1 electrical interfaces adopt Small form Factor
Pluggable (SFP) modules, supporting interface diagnosis function.
ZXMP S200 provides an extension slot. If the maximum capacity of one type of
interface is reached by using the extension slot, the other types of interfaces that
need to use the extension slot cannot reach the maximum capacity listed in Table
7.

ZXMP S200 supports E1/T1 and E3/T3 mapping and multiplexing
structure specified by ITU-T recommendations, as illustrated in Figure
6.

Chapter 1 Overview
FI GURE 6 MAPPI NG/ MUL TI PL EXI NG STRUCTURE OF ZXMP S200

In addition, with the SMC board, SDH optical interfaces of ZXMP S200
also support the application of single fiber bi-directional transmission of
STM-1/4 optical signal, which is a fiber-saving solution to transport the
receiving signal and transmitting signal in a same fiber.
ZXMP S200 can act as a terminal multiplexer (TM), add/drop
multiplexer (ADM) or a regenerator (REG) depending on the actual
networking requirements. It supports point-to-point, chain and ring
networking modes.
Perfect Network-Level Protection
At the Multiplex Section (MS) layer, ZXMP S200 supports the
following MS protection modes:
TAB L E 8 MS PROTECTI ON MODES SUPPORTED B Y ZXMP S200
Networking
mode
Rate Protection mode Remark
MS ring STM-4 Two-fiber
bidirectional MS
shared protection
ring
Revertive protection
without extra traffic
and the fault blocked
function
Four-fiber
bidirectional link MS
1+1 protection
Revertive or non-
revertive protection
Four-fiber
bidirectional link MS
1:1 protection
Revertive protection
with the extra traffic
Four-fiber
unidirectional link
MS 1+1 protection
-
MS link STM-1/
STM-4
Four-fiber
unidirectional link
MS 1:1 protection
It is divided into two
modes further: with
extra traffic and
without extra traffic

At the path layer, ZXMP S200 supports the Sub-Network
Connection (SNC) protection modes, such as SNC (I) protection at

the level of VC12/VC3 and SNC (N) and SNC (I) protection at the
level of VC4.
The SNC protection complies with ITU-T G.841 and G.842
recommendations. Table 9 lists the alarms that will trigger the SNC
protection switching.
TAB L E 9 AL A RMS TRI GGERI NG SNC PROTECTI ON SWI TCHI NG
Protection Mode Alarms Triggering Protection Switching
SNC (I) at VC12/VC3 level TU AIS, TU LOP
SNC (I) at VC4 level AU AIS, AU LOP
SNC (N) at VC4 level AU AIS, AU LOP, HP TIM, HP UNEQ, HP SD
Note: Currently, ZXMP S200 doesnt support SNC (N) at the level of
VC12/VC3.

Powerful Overhead Configuration Capability
The service unit of ZXMP S200 separates the SOH and payloads in SDH
frames, combines the overhead bytes into standard overhead bus and
then forwards them to the overhead unit.
The overhead bus not only includes the management, orderwire and
switching bytes complying with ITU-T recommendations, but also loads
orderwire and data services into idle overhead bytes.
The overhead unit of ZXMP S200 performs the overhead processing
function. It implements the cross-connection and dispatch of
overheads. The minimum cross-connect granularity is byte. The
overhead unit can cross-connect overheads to any port according to
the configuration in the EMS.
Multiple Power Supply Input Modes
The ZXMP S200 equipment adopts concentrated power supply mode. It
can be powered by multiple kinds of power supplies, including AC 110
V/220 V, DC -48 V and DC +24 V.
When DC power supply is used, ZXMP S200 supports the dual-input
mode, that is, dual paths of DC power supply are input to the
equipment for protection. Accordingly, the EMS indicates the input
status (normal or alarm) of each path of the two power supply inputs.
Various Alarm Modes
ZXMP S200 supports the alarms in visible and audible modes:
Indicators on the main board use different colors to indicate critical,
major and minor alarms. Indicators on plug-in cards are used to
indicate whether the cards report an alarm.
The buzzer provided by the equipment presents alarm sound when
an alarm occurs. User can enable or disable the audible alarm
function via the ring trip button (identified with B.OFF) on the
main board.

Chapter 1 Overview
In addition, ZXMP S200 provides one alarm input interface and one
alarm output interface, to support four alarm inputs (on-off signal
inputs) and two alarm outputs (on-off signal outputs).
SSM-based Timing Synchronization Processing
ZXMP S200 has multiple synchronous timing sources, including internal
timing source, timing signal extracted from line/tributary and external
timing source. It supports one external timing source (2 MHz or 2
Mbit/s), all of the extracted clocks from optical interfaces and STM-1
electrical interface (i.e. four line extracted clocks) and two tributary
clocks extracted from tributary 1 and 2.
ZXMP S200 supports the processing of the synchronization status byte
S1. It also identifies timing quality with synchronization status
message (SSM). By this way, NEs can select the synchronous path with
the highest quality level, to ensure the network synchronization
performance and avoid possible timing loop caused by timing reference
switching.
Powerful and Easy-to-Use Network Management System
ZXMP S200 (V3.00) can be managed by ZXONM E300 with the version
of V3.18R2 or above, which can manage all optical transmission
equipment of ZTE CORPORATION and support their hybrid networking.
ZXONM E300 has the element management layer functions and some
network management layer functions. It performs fault (maintenance)
management, performance management, configuration management,
security management and system management functions.
ZXONM 300 provides a graphical user interface (GUI) for easy
operation.
Good Network Adaptability
Provides network management channels suitable for hybrid
networking
Different SDH equipment manufacturers define the DCC (data
communication channel) bytes and process them in different ways.
Due to this, network management information interconnection may
be impossible in a hybrid network consisting of equipment provided
by different manufacturers.
ZXMP S200 adopts DCC bytes as embedded control channel (ECC)
for transmitting network management information. In addition,
timeslots of E1 tributaries can also be used as ECC.
In this way, the network management information is added in the
SDH payload, and then transmitted transparently through other
SDH equipment. Thus the integrated network management in
hybrid network is implemented.
Supports normal operation without EMS
ZXMP S200 can operate normally without the management of the
ZXONM E300.
Online Download and Upgrade of Board Software

The main board and plug-in cards of ZXMP S200 support remote online
download and upgrade of board software, including application and
logic programs.
Not interrupted traffic during the download of application programs
makes the maintenance and upgrade of the equipment more
convenient and guarantees the reliability during system upgrade. Only
downloading logic programs may cause transient interruption of traffic.

Ch a p t e r 2
System Hardware

Hardware structure and mechanical characteristics of ZXMP S200,
Operating principles, functions, structures, interfaces and indicators of
the boards in ZXMP S200.
Outline and Structure
ZXMP S200 can be flexibly configured according to the power board and
service interface type to meet different requirements of users. The outline
and structure of ZXMP S200 with different configurations are similar
except the power input mode, the type and quantity of service interfaces.
ZXMP S200 consists of the chassis, main board, plug-in cards (configured
as needed), power module, fan module and the dustproof module.
For example, Figure 7 shows the ZXMP S200 equipment configured with 4
optical interfaces, 21 E1 electrical interfaces and a power module for
accessing DC -48 V power supply.
FI GURE 7 OUTL I NE AND STRUCTURE OF ZXMP S200

1. Fan module 2. Power module
3. Dummy panel 4. Main board
5. Dustproof module 6. Chassis


Fan module
In order to meet the different installation conditions, ZXMP S200
supports middle-speed and high-speed fan module. The middle-speed
fan module is applied to the indoor environment under the
temperature between -5 and 45 degrees, meanwhile it has low noise.
On the other side, the high-speed fan module is applied to the
environment under the temperature between -5 and 50 degrees.
The middle-speed and high-speed fan modules have the same outline,
structure and size. They both contain three plastic fans to guarantee
heat dissipation of the chassis.
Figure 8 shows the structure of the fan module.
FI GURE 8 STRUCTURE OF THE FAN MODUL E
Fan

Power module
The power module consists of the power board and enclosure. It
provides power to all units in the ZXMP S200 equipment.
Figure 9 illustrates the structure of power module with a power board
(PWA).
The descriptions of PWA and PWB refer to DC Power Module
(PWA/PWB), and the descriptions of PWC in details refer to AC Power
Module (PWC).

Chapter 2 System Hardware
FI GURE 9 STRUCTURE OF THE POWER MODUL E ( PWA)

1. Knob 2. Handle
3. Power indicator (A path) 4. Power indicator (B path)
5. DC power socket (A path) 6. DC power socket (B path)
7. Power switch 8. Running and alarm indicator
9. Enclosure
Dustproof module
As shown in Figure 7, the dustproof module keeps the inner of the
equipment clean, and prevents dust accumulation, which may affect
the equipment performance. It is composed of a dustproof cover and
an air filter. The air filter is pluggable for periodical cleaning.
Board Overview
ZXMP S200 provides various main boards and plug-in cards for choice, as
listed in Table 10.
TAB L E 10 BOARD L I ST OF ZXMP S200
No. Board Code Description
1 SMCxD75E
System Main Center of Dual optical interfaces and Eight
75 E1 interfaces
2 SMCxD75T
System Main Center with Dual optical interface and
Twenty-one 75 E1 interfaces
3 SMCxF75E
System Main Center with Four optical interfaces and
Eight 75 E1 interface
4 SMCxF75T
5 SMCxD120E
System Main Center with Dual optical interfaces and
Eight 120 E1 interfaces
6 SMCxD120T
7 SMCxF120E

8 SMCxF120T
9 SMCxD100E
eight 100 T1 interfaces
10 SMCxD100T
Twenty-One 100 T1 interfaces
11 SMCxF100E
12 SMCxF100T
13 SMBxD75E0
System Main Board with Dual optical interfaces and
14 SMBxD75T0
System Main Board with Dual optical interface and
15 SMBxF75E0
System Main Board with Four optical interfaces and
Eight 75 E1 interface
16 SMBxF75T0
17 SMBxD120E0
18 SMBxD120T0
19 SMBxF120E0
20 SMBxF120T0
21 SMBxD100E0
22 SMBxD100F0
23 SMBxF100E0
24 SMBxF100F0
25 PWA Power Board A, -48 V DC power module
26 PWB Power Board B, +24 V DC power module
27 PWC Power Board C, 110 V/220 V AC power module
28 IBB 2 Mbit/s BITS interface board
29 IBBZ 2 MHz BITS interface board
30 ET1-75 21-channel E1 Electrical Tributary board (75 ohm)

31 ET1-120 21-channel E1 Electrical Tributary board (120 ohm)
32 TT1-100 21-channel T1 Electrical Tributary board (100 ohm)
33 EIE3 Electrical interface board of E3/T3
34 V35B 2-channel V.35 data interface Board
35 TFEx4
4-channel Transparent-transmission Fast Ethernet
electrical interface board
36 TFEx4B
4-channel Transparent-transmission Fast Ethernet
optical interface board
37 AI Audio Interface board
38 OW Order Wire interface board
39 SDB 4xSDB interface board
40 SEC 4xFE Enhanced Smart Ethernet board
41 MB Mother board
42 FAN Fan board
Main Board
The main board of ZXMP S200 integrates the functions of NCP, aggregate,
tributary, cross-connect, clock, and Ethernet service processing. In
addition, it supports the temperature detection function. Set the upper and
lower temperature thresholds on the EMS, once the temperature is over
threshold, the board will report an alarm.
ZXMP S200 supports two different main board types: SMB and SMC. They
have the same design and differ in interface types and interface quantities.
Table 11 and Table 12 list various SMC boards and SMB boards.
TAB L E 11 L I ST OF SMC MAI N BOARDS
Available Interfaces
No.
Board
Code
Optical
Interface
Electrical
Interface
Other Interface
1
SMCxD7
5E
2 optical
interfaces
Eight 75 non-
balanced E1
electrical interfaces
Each type of SMC main
board can provide:

No.
Board
Code
Optical
Interface
Electrical
Interface
Other Interface
2
SMCxD7
5T
2 optical
interfaces
Twenty-one 75
non-balanced E1
3
SMCxF75
E
4 optical
interfaces
Eight 75 non-
balanced E1
4
SMCxF75
T
4 optical
interfaces
Twenty-one 75
non-balanced E1
5
SMCxD1
20E
2 optical
interfaces
Eight 120
balanced E1
6
SMCxD1
20T
2 optical
interfaces
Twenty-one 120
balanced E1
7
SMCxF12
0E
4 optical
interfaces
Eight 120
balanced E1
8
SMCxF12
0T
4 optical
interfaces
Twenty-one 120
balanced E1
9
SMCxD1
00T
2 optical
interfaces
Twenty-one 100
balanced T1
10
SMCxD1
00E
2 optical
interfaces
Eight 100
balanced T1
11
SMCxF10
0T
4 optical
interfaces
Twenty-one 100
balanced T1
12
SMCxF10
0E
4 optical
interfaces
Eight 100
balanced T1
One 75 BITS
interface,
One alarm output
interface,
One RS232
interface/120
BITS interface,
One LCT interface,
One network
management
interface,
One alarm input
interface,
Four fast Ethernet
electrical
interfaces.

Note:
ZXMP S200 can support the STM-1 electrical service by being configured with
the SFP electrical interface module on the SMC board.
For the main board providing two optical interfaces, each of the optical
interfaces supports traffic at the rate of either STM-1 or STM-4. On the board panel,
they are identified as 5 and 6.

TAB L E 12 L I ST OF SMB BOARDS
No.
Board
Code
Optical
Interface
Electrical
Interface
Other Interface
1
SMBxD75
E0
Two optical
interfaces
Eight 75 non-
balanced E1
electrical
interfaces
2
SMBxD75
T0
Two optical
interfaces
Twenty-one 75
non-balanced E1
3
SMBxF75
E0
Four optical
interfaces
Eight 75 non-
balanced E1
electrical
interfaces
4
SMBxF75
T0
Four optical
interfaces
Twenty-one 75
non-balanced E1
electrical
interfaces
5
SMBxD12
0E0
Two optical
interfaces
Eight 120
balanced E1
electrical
interfaces
6
SMBxD12
0T0
Two optical
interfaces
Twenty-one 120
balanced E1
electrical
interfaces
7
SMBxF12
0E0
Four optical
interfaces
Eight 120
balanced E1
electrical
interfaces
8
SMBxF12
0T0
Four optical
interfaces
Twenty-one 120
balanced E1
electrical
interfaces
9
SMBxD10
0F0
Two optical
interfaces
Twenty-one 100
balanced T1
electrical
interfaces
10
SMBxD10
0E0
Two optical
interfaces
Eight 100
balanced T1
electrical
interfaces
11
SMBxF10
0F0
Four optical
interfaces
Twenty-one 100
balanced T1
electrical
interfaces
12
SMBxF10
0E0
Four optical
interfaces
Eight 100
balanced T1
electrical
interfaces
Each type of SMB
main board can
provide:
One 75 BITS
interface
One alarm output
interface
One RS232
interface/120
BITS interface
One LCT interface
One network
management
interface
One alarm input
interface
Four fast Ethernet
electrical
interfaces

Note: For the main board providing two optical interfaces, each of the
optical interfaces supports traffic at the rate of either STM-1 or STM-4. On the
board panel, they are identified as 5 and 6.

Table 13 lists the differences between SMB board and SMC board.
TAB L E 13 DI FFERENCES B ETWEEN SMB BOARD AND SMC BOARD
Main Board Type
Function.
SMC SMB
Cross-connect
capacity
Higher-order cross-connect:
6464 VC4
Lower-order cross-connect:
20372037 VC12
Higher-order cross-connect:
3232 VC4
Lower-order cross-connect:
10081008 VC12
Optical
interface unit
Accesses four channels of
STM-1/STM-4 optical signals
Accesses two channels of STM-
1 optical signals and two STM-
1/STM-4 optical signals
STM-1
electrical
interface unit
Accesses four channels of
STM-1 electrical signals
Does not support STM-1
Switching
mode
Supports SNC-I+SD and SNC-
N switching at both higher-
order (VC4) path and lower-
order (VC12) path
Supports SNC-N and SNC-I
switching at higher-order
(VC4) path, and SNC-I
switching at lower-order
(VC12) path
E3/T3 service
configuration
Does not support EIE3 board
which accesses E3/T3 service
Supports EIE3 board which
accesses E3/T3 service
EOS service
configuration
Supports configuration of 12
TUG3
Supports configuration of 12
TUG3
PRBS self-test
function
Supports PRBS self-test function
Does not support PRBS self-test
function
LCT
management
interface
Ethernet interface RS232 interface

SMC Main Board
Operating Principle
Figure 10 illustrates the operating principle of SMC board.

FI GURE 10 OPERATI NG PRI NCI PL E OF SMC BOARD

In Figure 10, SMC board of ZXMP S200 consists of the following functional
units.
NE control processor (NCP)
Optical interface unit
STM-1 electrical unit
Tributary unit
Ethernet interface unit
Cross-connect unit
Overhead unit
ECC-2M unit
HDLC unit
Clock unit
Micro control unit (MCU)
NCP Unit
Functions
The NCP unit is the control core of the main board, and it can:
Provide Qx interface, through which the EMS implements the
configuration and management of the NE,
Provide ECC to implement the communication between the NEs,
Issue the configuration commands to the optical interface unit,
tributary unit and Ethernet interface unit, meanwhile collect their
performances and alarms information,

Monitor the power module and fan module intelligently and detect
alarms reported by the fan board and power module, such as board
on-position information, DC power indication, power module type and
power module failure information,
Support online download and upgrade of board software,
Provide four external alarm input interfaces (on-off signal inputs),
Provide alarm output interfaces to column-head cabinet (on-off signal
outputs),
Provide real-time clock, which can be ensured even the power is down
due to its built-in battery,
Provide a buzzer and ring trip for audible alarm function.

Operating
Principle
Figure 11 illustrates the operating principle of the NCP in the block
diagram. And Table 14 lists the modules in the diagram.
FI GURE 11 OPERATI NG PRI NCI PL E OF THE NCP UNI T

TAB L E 14 FUNCTI ONS OF MODUL ES I N THE NCP
Module Function
Real-Time Clock
Used to ensure the accurate time when alarms occur or
disappear during the monitoring of NE.
This module will be powered by the spare rechargeable
battery once the power is down, so as to guarantee the
correct timing of the clock.

Module Function
Qx/f Interface
Qx is the interface between NE and Subnet Management
Control Center (SMCC), through which the main board
can report performances and alarms of the NE or the
subnet to the SMCC. In addition, the main board
executes the commands and configurations from the
SMCC.
f interface is the communication interface between the
NE and a portable computer.
ECC/S Interface
As the monitoring center, this module provides embedded
control channel and communication interface between the
NCP and other functional units.
Control &
Processing
Implements the initialization and startup of board software,
and cooperates with other functional modules.
Board-in-
Position
Detection
Detects whether the board is in position, that is, whether
the board is inserted into the slot.
External Alarm
Input
Monitors external alarms.
NE Alarm Output Outputs the alarms of the NE.
Board Reset
Control
Resets all boards in the NE (hard reset).
Fan/Power
Distribution Unit
Monitoring
Monitors the fan module and power module of the NE
intelligently.

Optical Interface Unit
The optical interface unit has the following functions.
Provide up to four STM-1/STM-4 compatible optical interfaces.
The optical interfaces marked as 5 and 6 on the panel can access
the signal at either STM-1 or STM-4 rate.
The optical interfaces marked as 4-1 and 4-2 on the panel only can
access the signal at the same rate level.
STM-4 optical interface can access up to 4 channels of STM-4 signal.
Adopt LC/PC fiber optic connectors and SFP lasers, supporting the
detection of optical received power, optical transmitted power, laser
temperature and transmit laser bias current. In addition, SFP lasers
support the detection of on-position status, LOS (loss of signal) alarm
and ALS (automatic laser shutdown) function.
Support SOH extraction and insertion functions, and process 28 section
overheads according to the system specifications. Table 15 lists the
overhead bytes processed by the optical interface unit.
Functions

TAB L E 15 OVERHEADS PROCESSED B Y OPTI CAL I NTERFACE UNI T
Overhead Type Number Overhead Byte
Standard byte 20 J0, D1-D12, E1, E2, F1, K1, K2, S1, M1
User-defined
byte
8
R2C6, R3C6, R3C8, R3C9, R5C5, R5C6,
R2C8 and R2C9 [Note]
Note: R represents the row and C represents the column of the STM-1
frame. For example, R2C6 means the byte lies at the 2
nd
row and the 6
th

column in the STM frame.
Support the transparent transportation of overheads except the byte
M1.
Support the function of DCC extraction and insertion.
The extraction mode of each DCC can be configured as DCCr (D1-D3),
DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMS
command. The DCC extraction mode of optical receiving interfaces and
optical transmitting interfaces can be configured independently.
Implement the transfer from DCC to ECC in a hardware way, thus
breaking through CPU resource limitation, avoiding ECC block and
finally improving the stability of ECC in optical transmission network.
Read signal degrade (SD) and signal failure (SF) alarms via board
software after the alarm led-out by the hardware connection lines,
which ensures protection switching implemented in the specified time.
Provide clock to the clock unit as the reference clock for phase locking.
Support channel-level loopback.
Optical interfaces support line side AU loopback and terminal side AU
loopback.
Support VC-4-4C concatenation of STM-4 optical interfaces.
Support the insertion and detection of pseudo-random binary sequence
of each AU-4 channel.
Figure 12 illustrates the operating principle of the optical interface unit in
the block diagram. And Table 16 lists the functional modules in the
diagram.
Operating
Principle

FI GURE 12 OPERATI NG PRI NCI PL E OF THE OPTI CAL I NTERFACE UNI T

TAB L E 16 FUNCTI ONS OF MODUL ES I N THE OPTI CAL I NTERFACE UNI T
Module Function
Optical
Interface
It converts STM-1/STM-4 optical signals to the
corresponding electrical signals, and checks the input
optical signals.
The key component of it is an integrated optical
receiving/transmitting module with general auto gain
control function.
Three types of STM-1 optical modules are available: S-
1.1, L-1.1 and L-1.2.
Three types of STM-4 optical modules are available: S-
4.1, L-4.1 and L-4.2.
Clock Recovery
&
Data
Regeneration
It extracts the line clock from the received data stream, and
regenerates the received data according to this clock.
SOH Processing
At the receiving end, it locks the frame alignment byte
in the received data to achieve frame synchronization,
and then extracts the section overheads after
unscrambling the data.
At the transmitting end, it inserts section overheads into
the launched data which will be framed after scrambled.
POH Processing
At the receiving end, it processes the AU-4 pointer,
separates the path overheads and payloads.
At the transmitting end, it justifies the AU-4 pointer and
inserts path overheads into the payloads.
Controlling &
Processing
It monitors the working status and mode of the optical
interface unit, and performs part functions of overhead
processing. In addition, it implements switching and statistic
of performance.

Module Function
Communication
Interface
It implements the communication between the optical
interface unit and the NCP.
Alarm Detecting
It outputs the alarm/status signals of the optical interface
unit, detects and responds to alarms/status of other units,
and provides reasons for switching control.

STM-1 Electrical Unit
The STM-1 electrical unit has the following functions:
Provide 4 channels STM-1 electrical interfaces, adopting SFP
transmitting/receiving module and supporting alarm detection.
Support SOH extraction and insertion functions, and process 28 section
overheads according to the system specifications. Table 17 lists the
overhead bytes processed by the STM-1 electrical interface unit.
TAB L E 17 OVERHEADS PROCESSED B Y STM- 1 EL ECTRI CAL I NTERFACE UNI T
User-defined
byte
8
R2C6, R3C6, R3C8, R3C9, R5C5, R5C6,
Note: R represents the row and C represents the column of the STM-1
frame. For example, R2C6 means the byte lies at the 2
nd
row and the 6
th

column in the STM frame.
Support the transparent transportation of overheads except the byte
M1.
Support the function of DCC extraction and insertion.
DCCm (D4-D12), DCCr+m (D1-D12) or disabled according to the EMS
command. The DCC extraction mode of electrical transmitting and
receiving interfaces can be configured independently.
Implement the transfer from DCC to ECC in a hardware way, thus
Read signal degrade (SD) and signal failure (SF) alarms via board
software after the alarm led-out by the hardware connection lines,
which ensures protection switching implemented in the specified time.
Provide clock to the clock unit as the reference clock for phase locking.
Support channel-level loopback.
Electrical interfaces support line side AU loopback and terminal side AU
loopback.
Functions

Support the insertion and detection of pseudo-random binary sequence
of each AU-4 channel.

Figure 13 illustrates the operating principle of the STM-1 electrical
interface unit in the block diagram. And Table 18 lists the functional
modules in the diagram.
FI GURE 13 OPERATI NG PRI NCI PL E OF THE STM- 1 EL ECTRI CAL I NTERFACE UNI T

TAB L E 18 FUNCTI ONS OF MODUL ES I N THE EL ECTRI CAL I NTERFACE UNI T
Module Function
STM-1 Electrical
the receiving and transmitting of STM-1 electrical signal.
Interface
It achieves
Its main component is common electrical transmitting and receiving
module.
Clock Recovery
ta
eration
It extracts the line clock from the received data stream, and
&
Da
Regen
SOH Processing
At the receiving end, it locks the frame alignment byte
it inserts section overheads into
in the received data to achieve frame synchronization,
and then extracts the section overheads after
unscrambling the data.
At the transmitting end,
the launched data which will be framed after scrambled.
POH Processi
ointer and
ng
separates the path overheads and payloads.
At the transmitting end, it justifies the AU-4 p
inserts path overheads into the payloads.
Controlling &
f the STM-1
Processing
It monitors the working status and mode o
electrical interface unit, and performs part functions of
overhead processing. In addition, it implements switching
and statistic of performance.
Operating
Principle

Module Function
Communication
Interface
It implements the communication between the optical
interface unit and the NCP.
Alarm Detecting
It outputs the alarm/status signals of the optical interface
unit, detects and responds to alarms/status of other units,
and provides reasons for switching control.

Tributary Unit
The E1/T1 tributary unit has the following functions.
Implement the mapping or demapping of E1/T1 signals.
Add/drop the dependent timeslots according to the different timeslot
No..
Analyze the performance and alarm of E1/T1 signals and report them
to the EMS.
Support up to 21 channels of E1 or T1 interfaces.
Support both non-balanced and balanced E1 interfaces and only
balanced T1 interfaces.
Support framing of E1/T1 signals.
Support the retiming function at the E1 tributaries.
Transmit the DCC bytes transparently through the first three timeslots
of the 5
th
to 8
th
E1 tributaries.
Extract the timing clock from the clock recovered from the 1
st
and 2
nd

E1 tributaries and send it to the clock unit.
Detect the pseudo-random binary sequence at all E1/T1 tributaries.

Figure 14 illustrates the operating principle of the tributary unit. And Table
19 lists the functional modules.
FI GURE 14 OPERATI NG PRI NCI PL E OF TRI B UTARY UNI T

Functions
Operating
Principle

TAB L E 19 FUNCTI ONS OF MODUL ES I N TRI B UTARY UNI T
Module Function
Tributary
Interface
Module
It codes/decodes line signals.
In the receiving direction, this module converts the line
signals into monopole signals and recovers the tributary
clock. After retiming the signals according to the recovered
clock, it forwards the line signals.
In the transmitting direction, this module converts monopole
signals into the line signals.
DCC
Detection &
Timing
Clock
Extraction
In the receiving direction, it detects whether there is DCC
information in the 5
th
-8
th
decoded tributary signals. If yes,
send them to the DCC Information Insertion/Extraction
module, if no, send them to the Mapping/Demapping module.
In the transmitting direction, it sends the DCC information
from the DCC Information Insertion/Extraction module and
tributary signals from the Mapping/Demapping module to the
Tributary Interface Unit.
In addition, this module extracts the timing reference clock.
DCC
Information
Insertion/Ex
traction
It extracts DCC information from the 5
th
-8
th
tributary signals or
inserts DCC information into them.
Mapping/De
mapping
Maps tributary services to the corresponding timeslots of AU,
or gets tributary services by demapping the corresponding
AU.
Reads and inserts the higher-order and lower-order path
overheads.

Ethernet Interface Unit
Functions The Ethernet interface unit has the following functions.
Process up to 8 channels of Fast Ethernet (FE) services. The main
board provides four FE interfaces while the TFEx4/TFEx4B board offers
the other four FE interfaces.
These interfaces are adaptive 10/100 Mbit/s Ethernet electrical
interfaces, complying with IEEE802.3. They support 10 M/100 M full
duplex mode as well as auto-negotiation and forced working status.
Access and process other FE data services via other plug-in cards.
Support Ethernet flow control and 802.3x flow control frame processing.
Support GFP or PPP/HDLC encapsulation.
Support Jumbo frame with 9600 bytes.

Support VLAN processing. It is optional for user port to add a VLAN tag
into a frame head under the Transparent LAN Service (TLS) access
mode.
Provide 8 system side directions and support service convergence
based on port.
The system side bandwidth is 12 VC3. Bandwidth in each system
direction can be concatenated virtually based on 2 M bandwidth at
least. The compensation time for virtual concatenation is up to 64 ms.
The system supports VC4, VC3 and VC12 virtual concatenation. Table
20 lists the supported virtual concatenation groups of different
concatenation modes.
TAB L E 20 DESCRI PTI ONS OF VI RTUAL CONCATENATI ON GROUP
Virtual
Concatenatio
n Group Mode
Group
Numbe
r
Number/Type of
Members in
Each Group
Maximum Number of
Group Supported
VC4 group 4 1/VC4 4/VC4
VC3 group 8 1-3/VC3 12/VC3
VC12 group 8 1-63/VC12 252/VC12

Support the function of scatheless Link Capacity Adjustment Scheme
(LCAS).
Support the Ethernet Private Line (EPL) function for FE services.
Support alarm and performance query for user ports and virtual
concatenation groups.
Provide loopback test for engineering applications

Operating
Principle
Figure 15 illustrates the operating principle of the Ethernet interface unit.
Table 21 lists the functional modules.
FI GURE 15 OPERATI NG PRI NCI PL E OF THE ETHERNET I NTERFACE UNI T
Interface
Module
EthernetControl
Module
MappingModule
ControlModule
LCASProcessing
Module
Backplane
Interface
Module
Overhead/
clockbus
Ethernet
datapacket
Cross-Connect
Unit
Cross-Connect
Unit
NCP


TAB L E 21 FUNCTI ONS OF MODUL ES I N THE ETHERNET I NTERFACE UNI T
Module Function
Interface Module Inputs/outputs Ethernet data packets.
Ethernet Control
Module
Processes the MAC layer of Ethernet.
At the receiving side, it implements the extraction,
verification, flow control detection and serial-parallel
conversion for data frames, and then sends the
processed data to the Mapping Module.
At the transmitting side, it generates the preamble
code, implements the verification, flow control and
parallel-serial conversion, and then sends the
processed data to the Ethernet optical module.
Mapping Module
Implements the translation between Ethernet frames
and SDH frames and processes path overheads,
including PPP/GFP-F encapsulation/de-encapsulation,
virtual concatenation mapping /demapping and LCAS
processing.
Transfers the payloads in SDH frames to service bus
and then sends them to the Cross-Connect Unit.
LCAS Processing
Module
When the LCAS is effective, the channel will be discarded
automatically in case that the channel in the virtual
concatenation group is detected damaged. Then the
bandwidth decreases automatically, thus guaranteeing the
other traffic in the virtual concatenation.
When the channel recovers, it will return to the virtual
concatenation group.
Backplane
Interface Unit
Receives the clock selected from the overhead bus and
clock bus of the Cross-Connect Unit in the main board, and
then sends it to the Mapping Module.
Control Unit
Provides channels for the communication between the
unit and the NCP of main board.
Implements performance statistic, alarm detection, and
the communication among modules.
Cross-Connect Unit
Functions The cross-connect unit has the following functions.
Implement cross-connection and protection switching for line signals
and tributary signals.
Support space division cross-connect capacity up to 6464 VC-4 and
time division cross-connect capacity up to 20372037 VC-12.
Support overhead cross-connection.
In the EMS, up to 20 overhead bytes of each optical interface can be
configured as full byte-based cross-connection.

Support the broadcast, uni-direction and bi-direction working modes
through configuration in the EMS.
The line signals from the optical interface unit and tributary signals from
the tributary unit are input to the cross-connect unit, where they are
cross-connected. The cross-connect unit implements corresponding cross-
connect and allocation of timeslots according to service configuration
requirements.
Operating
Principle
Overhead Unit
Functions The overhead unit has the following functions.
Extract and combine serial overheads from different directions, and
control the cross-connection, read/write of them.
Provide user with a transparent channel by using one of the seven
bytes (including F1 byte) in the section overheads.
Provide an RS232 interface (RJ45 socket) on the front panel of main
board.
The overheads extracted from STM-1/STM-4 optical interfaces are
converted to a standard highway (HW) and then sent to the overhead unit.
At the same time, send the HWs from interfaces on boards in extended
slots to the overhead unit too. Finally cross-connect all the overheads in
the overhead unit.
Operating
Principle
The overhead unit also processes F1 byte in section overheads or
configures the other six idle overhead bytes, converts them into RS232
data and then sends the data to the corresponding interface circuit.
ECC-2M Unit
Functions
The ECC-2M unit implements the transmission of SDH management
information through the 5
th
-8
th
2 M channels. Thus the network
management information can pass through equipment developed by other
manufacturers.
In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1
st
-3
rd

timeslots of the 2 M signal, implements framing and then forwards them to
the HDLC bus.
Operating
Principle
In the direction from ECC to 2 M, the unit extracts ECC information from
the HDLC bus, unframes it and converts it to DCC bytes. Then it inserts
the DCC bytes into the 1st-3rd timeslots of the 2 M signal.
HDLC Unit
Functions
The HDLC unit transmits ECC information received from multiple directions.
This unit combines ECC information from multiple directions to the HDLC
bus or extracts ECC information from the HDLC bus. Then the HDLC unit
forwards the ECC information directly through hardware.
Operating
Principle

Clock Unit
Functions
The clock unit provides the clock signal and system frame header
(complying with ITU-T G.813) for SDH NEs. It can implement the network
synchronization by limiting the frequency and phase of every NE in the
network within the predefined tolerance. In this way, the correct and
effective transmission and exchange of data flow in the network is
achieved by avoiding slip errors caused by unsynchronized clock.
ZXMP S200 adopts the master-slave synchronization mode. The available
clocks include line clock, tributary clock and external reference clock,
which can be selected and switched according to alarms of clock source
and the synchronization status message (SSM). The clock unit supports
extracted line clock in all optical directions and the tributary clock
extracted from the first or the second E1 tributary.
In addition, the clock unit provides BITS interfaces to implement an
external clock output (2.048 Mbit/s or 2.048 MHz) and an external clock
input (2.048 Mbit/s or 2.048 MHz). Get the 2.048 Mbit/s clock by installing
2 Mbit/s BITS interface board on the main board, and 2.048 MHz clock by
installing 2 MHz BITS interface board on the main board.
Two types of BITS interface are provided, 75 (coaxial socket) and 120
(RJ45 socket). The impedance 75 or 120 of a BITS interface can be
set through jumpers on the main board.
System clock or line clock can be exported from the clock unit.
Figure 16 illustrates the operating principle of the clock unit. Operating
Principle
FI GURE 16 OPERATI NG PRI NCI PL E OF THE CL OCK UNI T
VCXO
Timing
Reference
Selection Controlling
&
Processing
Frequency
Division
Drive
Output
Digital
Discriminator
Line/
tributary
clock
ExternalClock
InterfaceUnit
External
reference
clock
T
i
m
i
n
g
r
e
f
e
r
e
n
c
e

The clock unit selects the timing reference for the NE from the line clock,
tributary clock and external reference clock according to alarm information
of clock source and synchronization information. It implements the
synchronization of the local clock and clock source selected through the
phase locked loop, which consists of the digital discriminator and Voltage
Controlled Oscillator (VCXO). In addition, it distributes the timing
reference to other units.
The clock unit has four working mode during the synchronization and
phase locking described as follows.

Fast pull-in mode
The fast pull-in is the process from selecting the reference clock to
locking the reference clock source.
Tracking mode
After locking the reference clock source, the clock unit works in the
tracking mode. In this mode, the clock unit tracks small variance of the
reference clock source and keeps synchronization with it.
Hold-on mode
When all timing references are lost, the clock unit will work in the hold-
on mode. The last frequency saved before losing the timing reference
will be held on as the timing reference. The hold-on mode will last 24
hours at most.
Free-run mode
If the equipment loses all external timing references, it will work in the
hold-on mode for a certain time period. When it is up to the hold-on
time limitation and the timing reference does not recover yet, the
oscillator inside the clock unit will work in free-run mode, providing
timing reference for the system.
Micro Control Unit
Functions The micro control unit implements the initialization and configuration of
main service chips on the main board and monitors their alarms and
performances.
Figure 17 illustrates the operating principle of the micro control unit. And
Table 22 lists the functional modules.
Operating
Principle
FI GURE 17 OPERATI NG PRI NCI PL E OF THE MI CRO CONTROL UNI T
Controlling
&
Processing
Channel Alarm &
Performance Detection
Service Chip Control
Alarm & Perforamnce
Report

TAB L E 22 FUNCTI ONS OF MODUL ES I N THE MI CRO CONTROL UNI T
Module Function
Channel Alarm &
Monitors alarm and performance of each channel and
implements protection switching if necessary
Initializes and configures chips for PDH, SDH and
Ethernet services

Module Function
Controlling &
Processing
Controls other modules and allows the interactive
processing among these modules
Alarm & Performance
Report
Receives commands from the NCP and reports alarms
and performances

SMB Main Board
Operating Principle
Figure 18 illustrates the operating principle of the main board.
FI GURE 18 OPERATI NG PRI NCI PL E OF SMB BOARD
Cross-Connect
Unit
ClockUnit
Optical
InterfaceUnit
TributaryUnit
Overhead
Unit
NCP
Ethernet
InterfaceUnit
ECC-2M
Unitand
HDLCUnit
E1/T1
E3/T3
Ethernet
STM-1/
STM-4
Clock,service,
communication
information
MicroControlUnit

As shown in Figure 18, SMB board of ZXMP S200 consists of the following
functional units.
NE control processor (NCP)
Optical interface unit
Tributary unit
Ethernet interface unit
Cross-connect unit
Overhead unit
ECC-2M unit
HDLC unit
Clock unit

Micro control unit (MCU)
NCP Unit
Functions
NCP unit is the control core of the main board, which provides the
following functions.
Provides Qx interface, through which the EMS implements the
configuration and management of the NE
Provides ECC to implement the communication between the NE and the
EMS
Issues configuration commands to the optical interface unit, tributary
unit and Ethernet interface unit, and collects their performances and
alarms
Monitors the power module and fan module intelligently and detects
alarms reported by the fan board and power board, such as board on-
position information, DC power indication, power board type and power
board failure information
Supports online download and upgrade of board software
Provides four external alarm input interfaces (on-off signal inputs)
Provides alarm output interfaces to column-head cabinet (on-off signal
outputs)
Provides real-time clock, which can be ensured even the power is down
due to its built-in battery
Provides a buzzer and ring trip for audible alarm function
Figure 19 illustrates the operating principle of the NCP in the block
diagram. And the modules in the diagram are described in Table 23.
Operating
Principle
FI GURE 19 OPERATI NG PRI NCI PL E OF NCP UNI T
Controlling&
Processing
Real-TimeClock
Qx/fInterface
ECC/SInterface
Board-in-Position
Detection
BoardResetControl
NEAlarmOutput
ExternalAlarmInput
Fan/PowerDistribution
UnitMonitoring


TAB L E 23 FUNCTI ONS OF MODUL ES I N NCP UNI T
Module Function
Real-Time
Clock
Used to ensure the accurate time when alarms occur or
disappear during the monitoring of NE.
This module will be powered by the spare rechargeable
battery once power down is detected, so as to guarantee the
correct timing of the clock.
Qx/f Interface
Qx is the interface between NE and SMCC (Subnet
Management Control Center), through which the main board
can report performances and alarms of the NE or the subnet
to the SMCC. In addition, the main board executes the
commands and configurations received from the SMCC.
f interface is the communication interface between the NE and
a portable computer.
ECC/S
Interface
As the monitoring center, this module provides embedded
control channel and communication interface between the NCP
and other functional units.
Controlling &
Processing
Implements the initialization and startup of board software,
and cooperates with other functional modules
Board-in-
Position
Detection
Detects whether the board is in position, that is, whether the
board is inserted into the slot.
External Alarm
Input
Monitors external alarms
NE Alarm
Output
Outputs the alarms of the NE
Board Reset
Control
Resets all boards in the NE (hard reset)
Fan/Power
Distribution
Unit
Monitoring
Monitors the fan module and power module of the NE
intelligently

Optical Interface Unit
Functions
The optical interface unit has the following functions:

The optical interface unit provides up to four STM-1/STM-4 optical
interfaces. However, two STM-4 optical interfaces are available at the
same time at most. The following lists the available combination of
optical interfaces:
Four STM-1 optical interfaces
Two STM-1 optical interfaces and two STM-4 optical interfaces
Three STM-1 optical interfaces and one STM-4 optical interface
It adopts LC/PC fiber optic connectors and SFP lasers, supporting the
detection of optical received power, optical launched power, laser
temperature and transmit laser bias current. In addition, SFP lasers
support the detection of in-position status, LOS (loss of signal) alarm
and ALS (automatic laser shutdown) function.
Supports SOH extraction and insertion functions, and processes 28
section overheads according to the system specifications. Table 24 lists
the overhead bytes processed by the optical interface unit.
TAB L E 24 OVERHEADS PROCESSED B Y OPTI CAL I NTERFACE UNI T
User-defined
byte
8
R2C6, R3C6, R3C8, R3C9, R5C6, R5C7,
Note: R refers to the row and C refers to the column of the STM-1 frame

Supports the transparent transfer of overheads except the byte M1.
Supports the function of DCC extraction and insertion
DCCm (D4-D12), DCCr+m (D1-D12) or Disabled according to the EMS
command. The DCC extraction mode of optical receive interfaces and
optical transmit interfaces can be configured independently.
Implements the transfer from DCC to ECC in a hardware way, thus
Board software reads signal degrade (SD) and signal failure (SF)
alarms through hardware connection, which ensures protection
switching implemented in specified time.
Provides clock to the clock unit as the reference clock for phase locking
Supports port-level and channel-level loopback
Optical interfaces identified with 4-1 and 4-2 on the panel support
line side AU loopback, terminal side port loopback and AU loopback.
Optical interfaces identified with 5 and 6 supports line side port
loopback, line side AU loopback and terminal side port terminal.
STM-4 optical interfaces support VC-4-4C concatenation.

Each AU-4 channel supports the insertion and detection of pseudo-
random binary sequence.

Operating
Principle
Figure 20 illustrates the operating principle of the optical interface unit in
the block diagram. And the functional modules in the diagram are
described in Table 25.
FI GURE 20 OPERATI NG PRI NCI PL E OF THE OPTI CAL I NTERFACE UNI T
Optical
Interface
Clock
Recovery
&
Data
Regeneration
SOH
Processing
POH
Processing
Controlling&Processing
SOH( E1,E2,DCC)
STM-1/STM-4
Databus
Clocksignal Alarmmonitoring
Communicationinterface

TAB L E 25 FUNCTI ONS OF MODUL ES I N THE OPTI CAL I NTERFACE UNI T
Module Function
Optical
Interface
It converts STM-1/STM-4 optical signals to corresponding
electrical signals, and checks the input optical signals.
Integrated optical receive/transmit modules with general auto
gain control function are adopted as the key component.
Three types of STM-1 optical modules are available: S-1.1,
L-1.1 and L-1.2.
Three types of STM-4 optical modules are available: S-4.1,
L-4.1 and L-4.2.
Clock Recovery
&
Data
Regeneration
It recovers the line clock from the received data stream, and
SOH
Processing
At the receiving end, it locks the frame alignment byte in
the received data to achieve frame synchronization, and
then extract the section overheads after unscrambling the
data.
At the transmitting end, it inserts section overheads into the
launched data which will be framed after scrambled.

Module Function
POH Processing
separating the path overheads and payloads.
At the transmitting end, it justifies the AU-4 pointer
and inserts path overheads into the payloads.
Controlling &
Processing
It monitors the working status and mode of the optical
interface unit, and performs part functions of overhead
processing. In addition, it implements switching and statistic
of performance.
Communication
Interface
It is used to implement the communication between the
optical interface unit and the NCP.
Alarm
Detecting
It outputs alarm/status signals of the optical interface unit,
detects and responds to alarms/status of other units, and
provides reasons for switching control.

Tributary Unit
ZXMP S200 provides two kinds of tributary unit for accessing different
tributary services: E1/T1 tributary unit and E3/T3 tributary unit.
The following describes the functions and operating principle of E1/T1
tributary unit and E3/T3 tributary unit.
The E1/T1 tributary unit has the following functions:
Implements the mapping or demapping of E1/T1 signals.
Supports the adding/dropping of timeslots with different serial
numbers, and independent adding/dropping of timeslots
Analyzes the performance and alarms of E1/T1 signals and reports
them to the EMS
Supports for up to 21 channels of E1 or T1 interfaces. Supports both
non-balanced and balanced E1 interfaces and only balanced T1
interfaces
Supports framing of E1/T1 signals
E1 tributaries support the retiming function
Supports transmitting DCC bytes transparently through the first three
timeslots of the 5th to 8th E1 tributaries
Supports extracting timing clock from the received clock recovered
from the first and second E1 tributaries and sending it to the clock unit
All E1/T1 tributaries support the detection of pseudo-random binary
sequence
Figure 21 illustrates the operating principle of the E1/T1 tributary unit.
And the functional modules are described in Table 26.
E1/T1
Tributary Unit

FI GURE 21 OPERATI NG PRI NCI PL E OF E1/ T1 TRI B UTARY UNI T
Tributary
Interface
Module
DCCDetection
&
TimingClock
Extraction
Mapping/
Demapping
DCC
Infromation
Insertion/
Extraction
ClockUnit
E1/T1
DCC
information
Cross-Connect
Unit

TAB L E 26 FUNCTI ONS OF MODUL ES I N E1/ T1 TRI B UTARY UNI T
Module Function
Tributary
Interface
Module
It codes/decodes line signals.
In the receiving direction, this module converts line
signals into monopole signals and recovers tributary
clock. After retiming the signals according to the
recovered clock, it forwards the line signals.
In the transmitting direction, this module converts
monopole signals into line signals.
DCC
Detection &
Timing Clock
Extraction
In the receiving direction, it detects whether there is
DCC information in the 5-8 decoded tributary
signals. If DCC information is included, send them to
the DCC Information Insertion/Extraction module; if
no DCC information, send them to the
Mapping/Demapping module.
In the transmitting direction, it sends the DCC
information from the DCC Information
Insertion/Extraction module and tributary signals
from the Mapping/Demapping module to the
Tributary Interface Unit.
In addition, this module extracts the timing reference clock.
DCC
Information
Insertion/Ext
raction
Extracts DCC information from the 5-8 tributary signals or
inserts DCC information into them.
Mapping/De
mapping
Maps tributary services to corresponding timeslots of
AU, or gets tributary services by demapping the
corresponding AU.
Reads and inserts higher-order and lower-order path
overheads.


E3/T3
Tributary Unit
The E3/T3 tributary unit has the following functions:
Implements the mapping/demapping of E3/T3 signals. Each board
provides three E3/T3 interfaces, which support HDB3 and B3ZS
coding/decoding.
The mapping path can be set as AU4 or AU3 in the EMS. The unit
supports the mapping and demapping between three E3/T3 signals and
any timeslots of AU-4/AU-3.
The added and dropped timeslots can be independent and different.
The E3/T3 tributary unit can process lower-order overheads and
pointers, and report corresponding alarms and performance to the EMS.
Figure 22 illustrates the operating principle of the E3/T3 tributary unit.
And the functional modules are described in Table 27.
FI GURE 22 OPERATI NG PRI NCI PL E OF E3/ T3 TRI B UTARY UNI T
Control
Module
Clock
Module
Service
Processing
Module
InterfaceModule
E3/T3tributary
interfaceboard
(EIE3)
SystemClock
ReferenceClock
NCP
Cross-Connect
Unit

TAB L E 27 FUNCTI ONS OF MODUL ES I N E3/ T3 TRI B UTARY UNI T
Module Function
Clock Module
Distributes the system clock to the main board and
provides clocks needed by the board.
Interface Module
Implements the code pattern conversion, jitter attenuation
and coding between tributary analog signals and digital
signals.
Service Processing
Module
Implements the mapping/demapping of timeslots,
tributary path protection, and the processing of pointers
and path overheads.
Control Module
Provides channels for the communication between the unit
and the NCP of the main board, and implements the
performance statistic, alarm detection, and the
communication among modules.


Ethernet Interface Unit
Functions
The Ethernet interface unit has the following functions:
Processes up to eight channels of Fast Ethernet (FE) services. The
main board provides four FE interfaces while the TFEx4/TFEx4B board
offers the other four FE interfaces.
These interfaces are adaptive 10/100 Mbit/s Ethernet electrical
interfaces, complying with IEEE802.3. They support 10 M/100 M full
duplex mode as well as auto-negotiation and forced working status.
Accesses and processes other FE data services via other plug-in cards
Supports Ethernet flow control and 802.3x flow control frame
processing
Supports GFP or PPP/HDLC encapsulation
Supports Jumbo frame with 9600 bytes
Supports VLAN processing. It is optional for user port to add a VLAN
label into a frame head under the transparent LAN service (TLS) access
mode.
Provides eight system side directions and supports service convergence
based on port.
The system side bandwidth is 10 VC-3. Bandwidth in each system
direction can be cascaded virtually based on 2 M bandwidth at least.
The compensation time for virtual concatenation is up to 64 ms.
The system supports VC-4, VC-3 and VC-12 virtual concatenation.
Table 28 describes the supported virtual concatenation groups of
different cascade modes.
TAB L E 28 DESCRI PTI ON OF VI RTUAL CONCATENATI ON GROUP
Virtual
Concatenation
Group Mode
Group
Number
Number/Type of
Members in Each
Group
Maximum
Number of Group
Supported
VC-4 group 2 1/VC-4 2
VC-3 group 8 1-3/VC-3 10
VC-12 group 8 1-63/VC-12 210

Supports the function of scratchless Link Capacity Adjustment Scheme
(LCAS)
Supports Ethernet private line (EPL) function for FE services
Supports alarm and performance query for user ports and virtual
concatenation groups
Provides loopback test for engineering applications
Figure 23 illustrates the operating principle of the Ethernet interface unit.
The functional modules are described in Table 29.
Operating
Principle

FI GURE 23 OPERATI NG PRI NCI PL E OF THE ETHERNET I NTERFACE UNI T
Interface
Module
EthernetControl
Module
MappingModule
ControlModule
LCASProcessing
Module
Motherboard
Interface
Module
Overhead/
clockbus
Ethernet
datapacket
Cross-Connect
Unit
Cross-Connect
Unit
NCP

TAB L E 29 FUNCTI ONS OF MODUL ES I N THE ETHERNET I NTERFACE UNI T
Module Function
Interface Module Inputs/outputs Ethernet data packets
Ethernet Control
Module
Processes the MAC layer of Ethernet
At the receiving side, it implements the extraction,
verification, flow control detection and serial-parallel
conversion for data frames, and then sends the
processed data to the Mapping Module.
At the transmitting side, it generates the preamble
code, implements the verification, flow control and
parallel-serial conversion, and then sends the processed
data to the Ethernet optical module.
Mapping Module
Implements the translation between Ethernet frames
and SDH frames and processes path overheads,
including PPP/GFP-F encapsulation/de-encapsulation,
virtual concatenation mapping /demapping and LCAS
processing.
Transfers the payloads in SDH frames to service bus and
then sends them to the Cross-Connect Unit.
LCAS Processing
Module
When the LCAS is effective, the channel will be discarded
automatically in case that the channel in the virtual
concatenation group is detected damaged. Then the
bandwidth decreases automatically, thus guaranteeing the
other traffic in the virtual concatenation.
When the channel recovers, it will return to the virtual
concatenation group.

Module Function
Backplane
Interface Unit
Receives the clock selected from the overhead bus and clock
bus of the Cross-Connect Unit in the main board, and then
sends it to the Mapping Module.
Control Unit
Implements performance statistic, alarm detection, and
the communication among modules.

Cross-Connect Unit
The cross-connect unit has the following functions:
Implements cross-connection and protection switching for line signals
and tributary signals
Supports space division cross-connect capacity up to 1616 VC-4 and
time division cross-connect capacity up to 10081008 VC-12
Supports overhead cross-connection
In the EMS, up to 20 overhead bytes of each optical interface can be
configured as full byte-based cross-connection
Supports the broadcast, uni-direction and bi-direction working modes
through configuration in the EMS
The operating principle of the cross-connect unit is described below:
Line signals from the optical interface unit and tributary signals from the
tributary unit are input to the cross-connect unit, where they are cross-
connected. The cross-connect unit implements corresponding cross-
connection and allocation of timeslots according to service configuration
requirements.
Overhead Unit
The overhead unit has the following functions:
Extracts and combines serial overheads from different directions, and
controls the cross-connection, read/write of them
Provides user with a transparent channel by using one of the seven
bytes (including F1 byte) in the section overheads
Provides an RS232 interface (RJ45 socket) on the front panel of main
board
The operating principle of the overhead unit is described below:
Overheads extracted from STM-1/STM-4 interfaces are converted to a
standard highway (HW) and then sent to the overhead unit. At the same
Functions
Operating
Principle
Functions
Operating
Principle

time, the HWs from interfaces on boards in extended slots are sent to the
overhead unit too. The overhead unit cross-connects all the overheads.
The overhead unit also processes F1 byte in section overheads or
configures the other six idle overhead bytes, converts them into RS232
data and then sends the data to corresponding interface circuit.
ECC-2M Unit
Functions
The ECC-2M unit implements the transmission of SDH management
information through the 5th-8th 2 M channels. Thus the network
management information can pass through equipment developed by other
manufacturers.
In the direction from 2 M to ECC, the unit extracts DCC bytes in the 1st-
3rd timeslots of the 2 M signal, implements framing and then forwards
them to the HDLC bus.
Operating
Principle
In the direction from ECC to 2 M, the unit extracts ECC information from
the HDLC bus, unframes it and converts it to DCC bytes. Then it inserts
the DCC bytes into the 1st-3rd timeslots of the 2 M signal.
HDLC Unit
Functions
The HDLC unit transmits ECC information received from multiple directions.
This unit combines ECC information from multiple directions to the HDLC
bus or extracts ECC information from the HDLC bus. Then the HDLC unit
forwards the ECC information directly through hardware.
Operating
Principle
Clock Unit
Functions
The clock unit provides the clock signal and system frame header
(complying with ITU-T G.813) for SDH NEs. It is used to implement the
network synchronization by limiting the frequency and phase of every NE
in the network within the predefined tolerance. In this way, the correct
and effective transmission and exchange of data flow in the network is
achieved by avoiding slip errors caused by unsynchronized clock.
The ZXMP S200 adopts the master-slave synchronization mode. The
available clocks include line clock, tributary clock and external reference
clock, which can be selected and switched according to alarms of clock
source and the synchronization status message (SSM). The clock unit
supports extracted line clock in all optical directions and the tributary clock
extracted from the first or the second E1 tributary.
In addition, the clock unit provides BITS interfaces to implement an
external clock output (2.048 Mbit/s or 2.048 MHz) and an external clock
input (2.048 Mbit/s or 2.048 MHz). Two types of BITS interface are
provided, 75 (coaxial socket) and 120 (RJ45 socket). The impedance
75 or 120 of a BITS interface can be set through jumpers on the main
board.
System clock or line clock can be exported from the clock unit.

Figure 24 illustrates the operating principle of the clock unit. Operating
Principle
FI GURE 24 OPERATI NG PRI NCI PL E OF THE CL OCK UNI T
VCXO
Timing
Reference
Selection Controlling
&
Processing
Frequency
Division
Drive
Output
Digital
Discriminator
Line/
tributary
clock
ExternalClock
InterfaceUnit
External
reference
clock
T
i
m
i
n
g
r
e
f
e
r
e
n
c
e

The clock unit selects the timing reference for the NE from the line clock,
tributary clock and external reference clock according to alarm information
of clock source and synchronization information. It implements the
synchronization of the local clock and clock source selected through the
phase locked loop, which consists of the digital discriminator and Voltage
Controlled Oscillator (VCXO). In addition, it distributes the timing
reference to other units.
The clock unit has four working mode during the synchronization and
phase locking described as follows.
Fast pull-in mode
The fast pull-in is the process from selecting the reference clock to
locking the reference clock source.
Tracking mode
After locking the reference clock source, the clock unit works in the
tracking mode. In this mode, the clock unit tracks small variance of the
reference clock source and keeps synchronization with it.
Hold-on mode
When all timing references are lost, the clock unit will work in the hold-
on mode. The last frequency saved before losing the timing reference
will be held on as the timing reference. The hold-on mode will last 24
hours at most.
Free-run mode
If the equipment loses all external timing references, it will work in the
hold-on mode for a certain time period. When it is up to the hold-on
time limitation and the timing reference does not recover yet, the
oscillator inside the clock unit will work in free-run mode, providing
timing reference for the system.


Micro Control Unit
Functions
The micro control unit implements the initialization and configuration of
main service chips on the main board and monitors their alarms and
performances.
Figure 25 illustrates the operating principle of the micro control unit. And
the functional modules are described in Table 30.
Operating
Principle
FI GURE 25 OPERATI NG PRI NCI PL E OF THE MI CRO CONTROL UNI T
Controlling
&
Processing
Channel Alarm &
Alarm & Perforamnce
Report

TAB L E 30 FUNCTI ONS OF MODUL ES I N THE MI CRO CONTROL UNI T
Module Function
Channel Alarm &
Monitors alarm and performance of each channel
and implements protection switching if necessary
Initializes and configures chips for PDH, SDH and
Ethernet services
Controlling & Processing
Controls other modules and allows the interactive
processing among these modules
Alarm & Performance
Report
Receives commands from the NCP and reports
alarms and performances

Front Panel
Types and quantities of interfaces vary with different main boards.
Figure 26 illustrates the front panel of the main board with four optical
interfaces and twenty-one 75 E1 interfaces (SMCxF75T).
FI GURE 26 FRONT PANEL OF THE MAI N BOARD ( SMCXF75T)

Table 31 describes the components on front panel.
TAB L E 31 COMPONENTS ON THE FRONT PANEL OF MAI N BOARD
No. Component ID Descriptions
1
Captive
fastener
- Used to secure the main board in the chassis.
2 Ejector lever -
Used to help pull in/out the main board and fix
it in the chassis.
3
Ring trip
button
B.OFF
When some alarm occurs, the buzzer begins
ringing, and the alarm indicator glows in
corresponding color.
Press this button less than 2 second to stop
ringing. If a new alarm occurs, the buzzer
will ring again.
Press this button more than 2 seconds, the
alarm buzzer will never ring even a new
alarm occurs. However, the alarm indicator
will become to flicker 10 seconds per
minute when a new alarm occurs.
Press this button again, the permanent ring
trip status will be cancelled and then the
buzzer will ring if the alarm has not been
cleared yet.
During the reset of the main board, press
this button more than 40 seconds to enter
the Download status.
4 Reset button N.RST
SMB: Press this button to reset the NCP unit of
the main board.
SMC: Press this button to reset the main board.
5
NCP running
indicator
RUN
Green indicator
Flickering regularly (once per second) means
that the NCP unit runs normally.
6
NCP alarm
indicator
MAJ/MIN
Bi-color indicator (red-yellow)
OFF if the board runs normally,
ON if the critical alarm occurs,
Only yellow indicator ON if the major or
minor alarm occurs.
7
Optical
receiving/tran
smitting
interface
-
Four optical interfaces with LC/PC connectors
on the front panel, marked as 4-2, 4-1, 5
and 6 from left to right.
For SMC board, the optical interfaces all
can access STM-1 or STM-4 signal.
However, the optical interfaces marked as
4-1 and 4-2 must be set to access the
signal with the same rate.
For SMB board, the optical interfaces
marked as 5 and 6 can access STM-1 or
STM-4 signal, the optical interfaces marked
as 4-1 and 4-2 can only access STM-1
signal.
Types of the optical module supported by the

STM-1 interface are S-1.1, L-1.1 and L-1.2.
Types of the optical module supported by the
STM-4 interface are S-4.1, L-4.1 and L-4.2.
8
Indicator of
optical
receiving
interface
R
Green indicator
ON if the optical interface receives the
optical signal,
OFF if the signal is lost.
9
Indicator of
optical
transmitting
interface
T
Green indicator
ON if the laser is turned on,
OFF if the laser is turned off.
10
75 BITS
output
interface
Tx
75 clock output interface
Connector type: 1.0/2.3 angle PCB solder
female socket (with installed screw)
11
75 BITS
input
interface
Rx
75 clock input interface
Connector type: 1.0/2.3 angle PCB solder
female socket (with installed screw)
12
Alarm output
interface
OUT
It can output two channels of alarm signals,
one is critical alarm and the other is
major/minor alarm
Connector type: RJ11 socket with relay
isolation mode
13
RS232
interface/
120 BITS
interface
232
Connector type: RJ45 socket
It provides the function of either RS232
interface or 120 BITS clock interface.
On the lower part of the interface, there are
two green indicators, one on the left and the
other on the right.
The left indicator is for the alarm indication of
SMC board, marked as M-ALM.
ON if any unit of SMC board (except NCP
unit), TFEx4 and TFEx4B boards have the
alarms (including critical, major, minor and
prompt alarm).
OFF if the alarm is cleared or shielded.
The right indicator is for the status indication of
clock, marked as M-RUN.
Flickering 0.25 times per second indicates
internal clock or hold-on mode.
Flickering once per second indicates normal
locking of line clock or external clock.
Flickering 0.5 times per second indicates
that the clock is working in the free-run
mode.
Flickering five times per second indicates
that the clock is working in the pull-in or
tracking mode.
14
Interface for
local craft
terminal
LCT
Used to connect a Local Craft Terminal (LCT).

15 Qx interface Qx
Used to connect the EMS computer.
Under the Qx interface, there are two green
indicators on the left and right of the Qx
interface.
Left Indicator (LA): connection indicator.
ON if the interface is correctly connected.
OFF if the interface is not connected.
Right indicator: speed indicator.
ON if the data transmission speed is 100
Mbit/s.
OFF if the data transmission speed is 10
Mbit/s.
Note: Since the interface speed is 10 Mbit/s
forcibly, the right indicator is always OFF.
16
Alarm input
interface
IN
4 channels of external alarms (on-off signals)
are supported through this interface, such as
smoke alarm, entrance control alarm, fire
alarm and temperature alarm.
17
Fast Ethernet
electrical
interface
FE1
FE2
FE3
FE4
On the front panel, there are four 10M/100M
fast Ethernet electrical interfaces, which are
identified as FE1, FE2, FE3 and FE4 from left to
right.
On the top of each FE electrical interface, there
are two green indicators on the left and right
respectively.
Left Indicator (LINK/ACTIVE): connection
indicator
ON if the interface is correctly connected.
OFF if the interface is not connected.
Right Indicator: speed indicator
ON if the data transmission speed is 100
Mbit/s.
OFF if the data transmission speed is 10
Mbit/s.
18
E1 electrical
interface (1-
12)
-
Connector type: 50-pin angle PCB solder socket
(female)
Used to access 1-12 channels of E1 signals.
19
E1 electrical
interface (13-
21)
-
Connector type: 50-pin angle PCB solder socket
(female)
Used to access 13-21 channels of E1 signals.
20
Laser
warning sign
-
This sign warns users to beware of strong laser
beam and avoid burning eyes.

DC Power Module (PWA/PWB)
ZXMP S200 provides two kinds of DC power modules to meet different
power supply environment.
PWA module
It uses -48 V primary DC power supply.
Allowed voltage fluctuation range: -36 V to -72 V
PWB module
It uses +24 V primary DC power supply.
Allowed voltage fluctuation range: +18 V to +36 V
Functions
The DC power module supplies DC power, i.e. the secondary power supply,
to all the other boards in ZXMP S200.
The power module provides dual power inputs: path A as the active power
supply and path B as the standby power supply (such as storage battery).
When the path A fails, the power supply is switched to the path B
smoothly. Once the path A recovers, the power supply is switched back to
the A path. Above means that the path A and path B are 1:1 backup one
another.
Operating Principle
Figure 27 illustrates the functional block of PWA/PWB module.

Table 32 lists the function of each unit in the power module.
FI GURE 27 OPERATI NG PRI NCI PL E OF THE PWA/ PWB MODUL E
InputFilter&
Protection
Power
Transform
ControlCircuit Alarmoutput
-48V/-60Vor
+24V
Output
Filter
Primarypower
supply
Otherboards


TAB L E 32 UNI TS I N THE PWA/ PWB BOARD
Unit Function
Input Filter and
Protection
This unit consists of the input switch, fuses, lightning and
surging protection circuit, EMI filter circuit and soft start
circuit.
It implements the EMI filtering for the input power and
provides lightning/surging protection and over-
voltage/under-voltage protection, thus improving the
adaptability to the input power supply.
Power
Transform
Converts the primary power supply to the DC power needed
by other boards.
Output Filter
Improves the stability of output power by decreasing output
voltage ripple.
Control Circuit
Implements protection and control with the input over/under
voltage protection circuit and output over/under voltage
protection circuit.
In addition, it performs the function of failure alarming,
outputting alarm and board-in-position signal.

Front Panel
Figure 28 shows the front panel of PWA board and Table 33 lists the
components on the front panel.
Front Panel of
PWA Board
FI GURE 28 FRONT PANEL OF THE PWA BOARD
1 2 3 4 5 6 7
8
9
4
0
m
m
84.5mm

TAB L E 33 COMPONENTS ON THE FRONT PANEL OF PWA BOARD
No. Component Description
1 Handle Helps to pull in/out the power board.
2
Rotary
switch
Used to fix the fan module and the power module.
LOCK: to fix the fan module and the power module
UNLOCK: to unlock the fan module and the power
module

3
Power
indicator of B
path
Green indicator, used to indicate the working status of B
path power supply.
ON if there is the power supply at B path,
OFF if the output end of B path of power board is
disconnected, or the power switch is turned off.
4
Power
indicator of A
path
Green indicator, used to indicate the working status of A
path power supply.
ON if there is the power supply at A path.
OFF if the output end of A path of power board is
5
DC power
socket of A
path
Used to connect with active external power supply (A
path).
Connector type: D-type, 3-pin angle PCB solder socket
(pin-hole-pin)
The signal definition of the pin/hole from left to right is -
48 VGND, PGND and -48 V.
6
DC power
socket of B
path
Used to connect with standby external power supply (B
path).
(pin-hole-pin)
The signal definition of the pin/hole from left to right is -
48 VGND, PGND and -48 V.
7 Power switch
Turn the power switch to I to connect the external
power supply.
Turn it to O to disconnect the external power.
8
Running
status
indicator
(RUN)
Indicate the running status of the board.
ON in green means that the board is running normally.
9
Alarm
indicator
(ALM)
Indicates the alarm status of the board.
OFF means that the board is running normally, ON in red
means that the alarm occurs in the board.

Figure 29 shows the front panel of PWB board and Table 34 lists the
components on the front panel.
Front Panel of
PWB Board

FI GURE 29 FRONT PANEL OF THE PWB BOARD
1 2 3 4 5 6 7
8
9
4
0
m
m
84.5mm

TAB L E 34 COMPONENTS ON THE FRONT PANEL OF PWB BOARD
1 Handle Helps to pull in/out the power module.
2
Rotary
switch
Used to lock the fan module and the power module.
LOCK: to fix the fan module and the power module
UNLOCK: to unlock the fan module and the power
module
3
Power
indicator of B
path
Green indicator, used to indicate the working status of B
path power supply.
ON if there is the power supply at B path.
OFF if the output end of B path of power board is
4
Power
indicator of A
path
Green indicator, used to indicate the working status of A
path power supply.
ON if there is the power supply at A path.
OFF if the output end of A path of power board is
5
DC power
socket of A
path
Used to connect with active external power supply (A
path).
(pin-hole-pin)
The signal definition of the pin/hole from left to right is
+24 VGND, PGND and +24 V.
6
DC power
socket of B
path
Used to connect with standby external power supply (B
path).
(pin-hole-pin)
The signal definition of the pin/hole from left to right is
+24 VGND, PGND and +24 V.

7 Power switch
Turn the power switch to I to connect the external
power supply.
Turn it to O to disconnect the external power.
8
Working
status
indicator
(RUN, ALM)
The indicator identified as RUN indicates the running
status of the board. ON in green means that the
board is running normally.
The indicator identified as ALM indicates the alarm
status of the board. OFF means that the board is
running normally, ON in red means that the alarm
occurs in the board.
AC Power Module (PWC)
Besides the DC power module (PWA/PWB), ZXMP S200 also provides an
AC power module (PWC) to meet the environment where only 110 V or
220 V AC primary power supply is available. The allowed voltage
fluctuation range of the primary AC power supply is from 90VAC to
290VAC.
Caution: If the input voltage is higher than 280VAC, the PWC module will
start the power supply protection. Once the power supply protection is started, the
equipment can not be turned on.

Note: Additional voltage-regulated power supply (such as UPS) should be
configured when the PWC module is used in ZXMP S200. Besides, Class-B lightning
protector with the nominal discharge current of 60 kA should be installed in the
equipment room where ZXMP S200 is located.
The PWC module meets the requirements specified in the standards IEC
60950:1999, EN 60950: 2000 and GB 4943:2001.
Operating Principle
The PWC module converts the AC power (primary power supply) into DC
power needed by the other boards in ZXMP S200.
Figure 30 illustrates the operating principle of the PWC module.

FI GURE 30 OPERATI NG PRI NCI PL E OF THE PWC MODUL E
Input
Filter and
Protection
Control Circuit Alarm output
Output
Filter
AC power supply
Other
boards
Power
Converter
AC/DC
Converter
220V

Table 35 lists the function of each unit in the PWC module.
TAB L E 35 UNI TS I N THE PWC MODUL E
Unit Function
Input Filter and
Protection
This unit consists of the input switch, fuses, lightning and
surging protection circuit, EMI filter circuit and soft start
circuit.
It implements the EMI filtering for the input power and
provides lightning/surging protection and over-
voltage/under-voltage protection, thus improving the
adaptability to the input power.
AC/DC
Converter
Converts 220 V AC power supply into DC power supply, and
then outputs the DC power to the next module.
Power
Converter
Converts the -48 V DC power into DC power with proper
voltages needed by other boards.
Output Filter
Improves the stability of output power by decreasing output
voltage ripple.
Control Circuit
Implements protection and control with the input over/under
voltage protection circuit and output over/under voltage
protection circuit.
In addition, it performs the function of failure alarming,
outputting alarm and board-in-position signal.

Front Panel
Figure 31 shows the front panel of the PWC module. Table 36 describes
the components on front panel.

FI GURE 31 FRONT PANEL OF THE PWC MODUL E
5
6
4
0
m
m
84.5mm
1 2 3 4
TAB L E 36 COMPONENTS ON THE FRONT PANEL OF THE PWC MODUL E
1 Handle Helps to pull in/out the power board.
2 Rotary switch
Used to lock the fan module and the power module.
LOCK: to fix the fan module and the power
module
UNLOCK: to unlock the fan module and the
power module
3
AC power
socket
Used to connect with 220 V AC power supply.
Connector type: D-type 3-pin socket
4 Power switch
Turns the power switch to I to connect the
external power supply.
Turns the power switch to O to disconnect the
external power.
5
Working
status
indicator
(RUN)
Indicates the running status of the board.
ON in green means that the PWC board runs
normally.
6
Alarm
indicator
(ALM)
Indicates the alarm status of the board.
OFF means that the board is running normally, ON
in red means that the alarm occurs in the board.
V.35 Data Interface Board (V35B)
Operating Principle
V35B board provides two V.35 synchronous data interfaces of N 64K
(N=1-31), which can be connected to V.35 data interfaces of a router
directly. The board software and FPGA program can be upgraded remotely
online.

The V35B board uses E1 timeslots in SDH networks to transfer low-rate
transparent data services.
Figure 32 illustrates the operating principle of V35B board.
FI GURE 32 OPERATI NG PRI NCI PL E OF THE V35B BOARD
RateAdaptation
Unit
Mapping/
DemappingUnit
InterfaceUnit
2M&N64KDataService
AdaptationUnit
V.35data
Backplane
signals

The V35B board converts the high-rate signal received from the backplane
into low-rate service signals, and then demaps them to two channels of 2
M signals in the Mapping/Demapping Unit. After that, adapts the 2 M
signals to N64K data service signals, which are sent to the Interface Unit.
Finally, the Interface Unit converts the N64K signals into V.35 data and
output it.
In the opposite direction, the V35B board adapts two N64K data signals
into 2 M signals and then maps them to 2 M timeslots. The Rate
Adaptation Unit converts the signals into high-rate signals and then sent
them to the backplane.
Table 37 lists the functions of units of V35B board.
TAB L E 37 UNI TS I N THE V35B BOARD
Unit Function
Interface Unit Inputs/outputs V.35 data services.
2 M & N64K Data
Service Adaptation
Unit
Implements the adaptation between 2 M signals and
N64 K service signals. The timeslots of 2 M signals
occupied by N 64 K data service are configured
through software.
Mapping/Demapping
Unit
Maps/demaps two 2 M signals.
Rate Adaptation Unit
Implements the conversion between high-rate signals
from the backplane and low-rate service signals.
Front Panel
Figure 33 shows the front panel of V35B board.

FI GURE 33 FRONT PANEL OF THE V35B BOARD
1 2 3 4 5 6
156.7mm
2
0
.
6
m
m

Table 38 lists the components on the front panel of V35B board.
TAB L E 38 COMPONENTS ON THE FRONT PANEL OF V35B BOARD
1 Captive fastener Used to fix the board in the chassis.
2 Ejector lever
Helps to pull in/out the board into/from the chassis
and also used to fix the board in the chassis.
3
V.35 interface 1
(PORT1)
Connector type: D-type 26-pin angle PCB solder
socket (female)
4
V.35 interface 2
(PORT2)
Connector type: D-type 26-pin angle PCB solder
socket (female)
5
Working status
indicator (RUN,
ALM)
Indicate the running status of the board.
Flickering regularly (once per second) in green
means that the board is running normally.
6
Alarm indicator
(ALM)
Indicate the alarm status of the board.
OFF means that the board is running normally, ON in
red means that the alarm occurs in the board.
E1/T1 Electrical Tributary Board
Types
As an extension board of the main board, the E1/T1 electrical tributary
board can process 21 channels of E1 or T1 signals. In terms of function,
class the electrical tributary board into three types:
E1 electrical tributary board with interface impedance 75
E1 electrical tributary board with interface impedance 120
T1 electrical tributary board with interface impedance 100
These three kinds of the E1/T1 electrical tributary boards have the same
operating principle but different board identifiers on their front panels.

Table 39 lists the relations between the type and identifier of different
E1/T1 boards.
TAB L E 39 REL ATI ONS BETWEEN E1/ T1 EL ECTRI CAL TRI B UTARY BOARD AND I D
Board Type ID on Front Panel
E1 electrical tributary board
(Interface matching impedance 75 )
ET1-75
E1 electrical tributary board
ET1-120
T1 electrical tributary board
TT1

Functions
The E1/T1 electrical tributary board has the following functions:
Provides 21 E1 or T1 physical interfaces, which support HDB3 or B8ZS
encoding/decoding.
Supports the mapping/demapping and multiplexing/demultiplexing
between 21 E1/T1 signals and any timeslots in AU-4.
Supports the adding/dropping of timeslots with different serial
numbers, and supports independent adding/dropping of timeslots.
Supports remote online upgrade of board software and logic programs.
In addition, the mapping path can be configured as AU-4 on the EMS.
Operating Principle
Figure 34 illustrates the operating principle of the E1/T1 electrical tributary
board.
FI GURE 34 OPERATI NG PRI NCI PL E OF THE E1/ T1 EL ECTRI CAL TRI B UTARY BOARD
InterfaceUnit
ControlUnit
ClockUnit
Service
ProcessingUnit
E1/T1
Systemclock
Referenceclock
NCP
Cross-connectunit

Table 40 lists the functions of all units in E1/T1 electrical tributary board.

TAB L E 40 FUNCTI ONS OF UNI TS I N THE E1/ T1 EL ECTRI CAL TRI B UTARY BOARD
Unit Function
Clock Unit
Implements the distribution of system clock for the clock
needed by the board.
Interface Unit
Implements the code pattern conversion, jitter attenuation
and HDB3 coding between E1/T1 analog signals and digital
signals.
Service
Processing Unit
Implements the mapping/demapping between E1/T1
payloads and VC-4, and processes pointers.
Control Unit
Implements the performance statistic, alarm detection,
and the communication among modules.

Front Panel
The front panels of the electrical tributary boards are same with each
other except the identifiers on the panels. Take the ET1-75 board as an
example, the front panel is shown in Figure 35.
FI GURE 35 FRONT PANEL OF THE EL ECTRI CAL TRI B UTARY BOARD ( ET1- 75 BOARD)
156.7mm
2
0
6
m
m
1 2 3 4 5
Rx+
Rx-
Tx+
Tx-
6

Table 41 describes the components on front panel.
TAB L E 41 COMPONENTS ON THE FRONT PANEL OF ET1 BOARD
2 Ejector lever

3
E1/T1 electrical
interface
(channel 1-12)
Connector type: 50-pin angle PCB solder female
socket
This interface corresponds to the 1
st
to 12
th
channel
E1/T1 electrical ports from left to right.
Each E1/T1 signal occupies four pins with the signal
definition Rx+, Tx+, Rx- and Tx- in order.
Note: R represents for Receive while T
represents for Transmit. x=1, 2, 3, 12.
4
Running
indicator (RUN)
Indicate the running status of the ET1 board.
Flickering in green regularly (once per second)
means that the ET1 board runs normally.
5
Alarm indicator
(ALM)
Indicate the alarm in the ET1 board.
OFF means that the ET1 board runs normally
ON in red means that the alarm occurs in the
ET1 board.
6
E1/T1 electrical
interface
(channel 13-21)
Connector type: 50-pin angle PCB solder female
socket
This interface corresponds to the 13
th
to 21
st
channel
E1/T1 electrical ports from left to right.
Each E1/T1 signal occupies four pins with the signal
definition Rx+, Tx+, Rx- and Tx- in order.
Note: R represents for Receive while T
represents for Transmit. x=13, 14, 15, 21.
E3/T3 Electrical Interface Board
(EIE3)
Functions
EIE3 board has the following functions:
Provides three E3 or T3 physical interfaces, which support HDB3 or
B3ZS code/decode
The rate of each interface can be configured as 45 M (T3) or 34 M (E3)
through the EMS.
Supports the remote online download of board software and logic
programs
Supports channel protection
Operating Principle
The operating principle of EIE3 board is as follows:

At the receiving side, the EIE3 board receives three E3/T3 PDH signals.
After impedance matching and analog/digital conversion, the EIE3
board sends the digital E3/T3 signals to the main board for mapping
and cross-connection.
At the transmitting side, the EIE3 board receives three E3/T3 digital
signals from the main board. After the digital/analog conversion and
impedance matching, it sends the analog signals out from the board.
Front Panel
The front panel of EIE3 board is shown in Figure 36.
FI GURE 36 FRONT PANEL OF THE EI E3 BOARD
156.7mm
2
0
.
6
m
m
1 2 3 4 5 6

Table 42 describes the components on the front panel of EIE3 board.
TAB L E 42 DESCRI PTI ONS OF COMPONENTS ON THE FRONT PANEL OF EI E3 BOARD
1
Captive
fastener
Used to fix the board in the chassis
2 Ejector lever
Helps to pull in/out the board into/from the chassis and
also used to fix the board in the chassis
3
Electrical
receive
interface
Three electrical receive interfaces are available on the
front panel with the identifier INn, where n=1, 2, 3.
Connector type: 1.0/2.3 angle PCB solder female socket
(with screw installed)
4
Electrical
transmit
interface
Three electrical transmit interfaces are available on the
front panel with the identifier OUTn, where n=1, 2, 3.
Connector type: 1.0/2.3 angle PCB solder female socket
(with screw installed)
5
Running
indicator
(RUN)
Green indicator
Indicates the running status of EIE3 board
Flickering regularly (once per second): EIE3 board runs
normally.

Component Description No.
Red indicator
Alarm
indicator
(ALM)
Indicates alarm of EIE3 board
6
OFF: EIE3 board runs normally.
ON: Some alarm occurs in EIE3 board.

4-Channel Transparent-
Transmission Fast Ethernet
Electrical Interface Board (TFEx4)
Functions
The TFEx4 board has the following functions:
Provides four 10 M/100 M adaptive Ethernet electrical interfaces,
Supports 10 M/100 M, full duplex modes,
Supports auto-negotiation and forced working status,
Supports AutoMDIX (Auto-Medium Dependent Interface Crossover)
function of network cables, i.e. auto-identification of crossover and
straight-through network cables.
In addition, the Ethernet electrical interfaces comply with the standard
IEEE802.3.
Operating Principle
The operating principle of the TFEx4 board is as follows:
At the receiving side, the TFEx4 board receives four Ethernet signals.
After pulse transform, then sends the signals to the main board
through the backplane for Ethernet service processing.
At the transmitting end, the TFEx4 board receives Ethernet data
frames from the main board. After pulse transform, the signals are
output from the TFEx4 board.
Note: For the details of Ethernet service processing procedure, please
refer to the description of Ethernet interface unit in the section Main
Board.
Front Panel
The front panel of TFEx4 board is shown in Figure 37.

FI GURE 37 FRONT PANEL OF THE TFEX4 BOARD
1 2 3 4 5
156.7mm
2
0
.
6
m
m

Table 43 lists the components on the front panel of the TFEx4 board.
TAB L E 43 COMPONENTS ON THE FRONT PANEL OF TFEX4 BOARD
1
Captive
fastener
Used to fix the board in the chassis.
2 Ejector lever
3
LINK/ACK
indicator
Yellow indicator
Used to indicate the connecting and running status of
corresponding Ethernet electrical interface.
ON: The Ethernet interface is connected, that is,
in the LINK status.
OFF: The Ethernet interface is not connected.
Flickering: Data packets are being received or
transmitted through the Ethernet interface.
4
Ethernet
electrical
interface
Four Ethernet electrical interfaces are available on the
front panel, numbered with 5, 6, 7 and 8 respectively
from left to right.
5
Interface
speed
indicator
Green indicator
Used to indicate the data transmission speed of
ON: The data transmission speed of the Ethernet
interface is 100 Mbit/s.
OFF: The data transmission speed of the Ethernet
interface is 10 Mbit/s.
Note: If the TFEx4 board reports an alarm, the M_ALM indicator on the main board
will be ON continuously. For the description of the M_ALM indicator, please refer to
Table 31 in the section Main Board.

4-Channel Transparent-
transmission Fast Ethernet
Optical Interface Board (TFEx4B)
Functions
The TFEx4B board has the following functions.
It provides four Ethernet optical interfaces.
Ethernet optical interfaces comply with the standard IEEE802.3.
The interfaces works under the 100 M full duplex mode forcibly.
It supports hot-swappable SFP (small form-factor pluggable) optical
modules. The interfaces on the board support optical modules for the
transmission distance 2 km (multi-mode 1310 nm) and 15 km (single-
mode 1310 nm).
It can flexibly configure the optical modules for different transmission
distance according to users requirements.
Operating Principle
The operating principle of the TFEx4B board is as follows:
At the receiving side, the TFEx4B board receives four Ethernet optical
signals. It converts these optical signals into electrical signals and then
sends them to the main board (SMC) through the backplane for
Ethernet service processing.
At the transmitting side, the TFEx4B board receives four Ethernet
electrical signals returned by the main board through the backplane. It
converts these electrical signals into optical signals and then sends
them out from the board.
For the details of Ethernet service processing procedure, please refer to
the description of Ethernet interface unit in the section Main Board.
Front Panel
The front panel of TFEx4B board is shown in Figure 38.

FI GURE 38 FRONT PANEL OF THE TFEX4B BOARD
1 2 3 4
156.7mm
2
0
.
6
m
m

Table 44 lists the components on the front panel of the TFEx4B board.
TAB L E 44 COMPONENTS ON THE FRONT PANEL OF TFEX4B BOARD
2 Ejector lever
3
Ethernet optical
interface
Four Ethernet optical interfaces are available on
the front panel, numbered with 5, 6, 7 and 8
respectively from left to right.
Supports hot-swappable SFP optical modules.
Supportable optical module type: 2 km (multi-
mode 1310 nm) and 15 km (single-mode 1310
nm) module.
4
Indicator of
Ethernet optical
interface (LA)
Green indicator
Used to indicate the LINK/ACTIVE status of
corresponding Ethernet optical interface.
ON: The Ethernet interface is connected, that
is, the interface is in the LINK status.
transmitted through corresponding Ethernet
optical interface.
Note: If the TFEx4B board reports an alarm, the M_ALM indicator on the main
board will be continuously lit. For the description of the M_ALM indicator, please
refer to Table 31 in the section Main Board.
Audio Interface Board (AI)
Functions
The AI board provides analog audio interfaces without feed.
Each board provides six audio interfaces of two-line or four-line type,
which are optional.
The electrical level of interface:

Transmitting end: 0 dB
Receiving end: 0 dB, -3.5 dB or -7 dB, optional
The interface type and the electrical level at the transmit end can be set
through the EMS (ZXONM E300).
Operating Principle
The AI board uses idle overhead bytes in SDH frames to carry transparent
analog services. Table 45 lists the positions of the used overhead bytes in
the SDH frame.
TAB L E 45 POSI TI ONS OF THE USED OVERHEAD BYTES I N THE SDH FRAME
Codes of the
overhead
bytes
Positions in the
SDH frame
Codes of the
overhead bytes
Positions in the
SDH frame
R2C6 The 2
nd
row and
the 6
th
column
R3C9 The 3
rd
row and
the 9
th
column
R3C6 The 3
rd
row and
the 6
th
column
R5C5 The 5
th
row and
the 5
th
column
R3C8 The 3
rd
row and
the 8
th
column
R5C6 The 5
th
row and
the 6
th
column

Figure 39 illustrates the operating principle of the AI board.
FI GURE 39 OPERATI NG PRI NCI PL E OF THE AI BOARD
NCP unit
Interface
Processing
Unit
Control Unit
2/4-Line
Audio
Interface
Selection
Unit
2-Line
Audio
Interface
Unit
4-Line
Audio
Interface
Unit
Motherboard
Audio signal
Audio signal

The AI board provides non-feed 2-line or 4-line audio services in the
following way:
The interface processing unit separates and processes the overhead bytes
received from the motherboard bus, and then outputs the analog audio
signal to the 2/4-line audio interface selection unit, which selects the audio
interface unit for the audio signal. After converting the analog audio signal,
the 2/4-line audio interface selection unit outputs the audio signal to the
selected audio interface unit.

On the other hand, users audio service is input to the 2-line or 4-line
audio interface unit, which forwards it to the 2/4-line audio interface
selection unit. After conversion, the audio signal is output to the interface
processing unit by the 2/4-line audio interface selection unit. The interface
processing unit combines the audio signal into system signal and outputs it
to the motherboard for further processing.
Table 46 lists each functional unit in the AI board.
TAB L E 46 FUNCTI ONS OF UNI TS I N THE AI BOARD
Unit Function
2-Line/4-Line Audio
Interface Unit
Inputs/outputs audio signals.
2/4-Line Audio Interface
Selection Unit
Selects 2-line or 4-line audio signals.
Interface Processing
Unit
Implements A/D and D/A conversions of audio
signals, and the separation and combination
between system signals and audio signals.
Control Unit
Provides a channel for the AI board to
communicate with the NCP unit.
Supports the communication among functional
units in the AI board.
Front Panel
Figure 40 shows the front panel of the AI board.
FI GURE 40 FRONT PANEL OF AI BOARD
156.7mm
2
0
.
6
m
m
1 2 3 4 5

Table 47 lists the components on the front panel of AI board.
TAB L E 47 COMPONENTS ON THE FRONT PANEL OF AI BOARD
2 Ejector lever

3 Audio interface
Provides six channels of 2-line/4-line audio interface.
Connector type: 26-pin D-type angle PCB solder
female socket (blade hole)
4
Running
indicator (RUN)
Green indicator
Used to indicate the running status of the AI board.
Flickering regularly (once per second) means that the
AI board runs normally.
5
Alarm indicator
(ALM)
Red indicator
Used to indicate alarm in the AI board.
OFF: The AI board runs normally.
ON: Some alarm occurs in the AI board.

Table 48 lists the signal definition of each pin in the audio interface.
TAB L E 48 SI GNAL DEFI NI TI ONS OF PI NS I N THE AUDI O I NTERFACE
Pin Signal Definition Pin Signal Definition
1 ALINE1 14 BLINE1
2 ALINEG1 15 BLINEG1
3 ALINE2 16 BLINE2
5 ALINE3 18 BLINE3
7 ALINE4 20 BLINE4
9 ALINE5 22 BLINE5
11 ALINE6 24 BLINE6
13 PGND 26 PGND
Note:
ALINEn/ALINEGn (n=1-6) corresponds to the transmitting and
receiving signal lines of two-line audio interface, or transmitting signal
line pair of four-line audio interface. There is no polarity requirement
when they are connected.
BLINEn/BLINEGn (n=1-6) corresponds to receiving signal line pair of
four-line audio interface. When corresponding to two-line audio
interface, they will not be used. There is no polarity requirement when
they are connected.
PGND represents for protection ground.

The definition of transmitting and receiving is related to the AI board.
Orderwire Board (OW)
Functions
The OW board supports orderwire telephone and low-speed data
transmission. In addition, it supports the trunk (TRK) function,
implementing the orderwire communication between two SDH NEs without
optical connection, between SDH NE orderwire and the Public Switched
Telephone Network (PSTN).
One orderwire telephone interface and six channels of RS232/RS485
interface (or three channels of RS422 interface) are available on the OW
board.
Operating Principle
The OW board uses E1, E2, protection bytes and other idle overhead bytes
to carry orderwire data and low-speed data. Table 49 lists the positions of
the idle overhead bytes which are used to carry the low-speed data service.
TAB L E 49 POSI TI ONS OF THE I DL E OVERHEAD BYTES USED TO CARRY THE L OW- SPEED
DATA SERVI CE
Codes of the
overhead
bytes
Positions in the
SDH frame
Codes of the
overhead bytes
Positions in the
SDH frame
R2C6 The2
nd
row and
the 6
th
column
R3C9 The 3
rd
row and
the 9
th
column
R3C6 The 3
rd
row and
the 6
th
column
R5C5 The 9
th
row and
the 5
th
column
R3C8 The 3
rd
row and
the 8
th
column
R5C6 The 5
th
row and
the 6
th
column

Figure 41 illustrates the operating principle of the OW board.

FI GURE 41 OPERATI NG PRI NCI PL E OF THE OW BOARD
Control Unit
Orderwire Unit
Low-Speed Data
Processing Unit
Orderwire signal
Low-speed data signal
NCP unit

Table 50 describes the functions of each unit in the OW board.
TAB L E 50 UNI TS I N THE OW BOARD
Unit Function
Orderwire Unit
Implements the function of one channel two-line
analogue telephone interface.
Implements trunk (TRK) function.
Low-Speed Data
Processing Unit
Processes the services to or from 6 channels of RS232
interface, 6 channels of RS485 interface or 3 channels of
RS422 interface.
Control Unit
Provides a channel for the AI board to communicate with
the NCP unit.
Supports the communication between modules in the OW
board.
Front Panel
Figure 42 shows the front panel of the OW board.
FI GURE 42 FRONT PANEL OF THE OW BOARD
156.7mm
2
0
.
6
m
m
1 2 3 4 5 6 7

Table 51 describes the components on the front panel of OW board.


TAB L E 51 COMPONENTS ON THE FRONT PANEL OF OW BOARD
2 Ejector lever
Helps to pull in/out the board into/from the
chassis and also used to fix the board in the
chassis.
3
RS232/RS485/RS422
interface
Provides the service to or from 6 channels of
RS232 interface, 6 channels of RS485 interface
or 3 channels of RS422 interface.
Connector type: 26-pin D-type angle PCB solder
female socket (blade hole)
4 TRK interface (TRK) Connector type: RJ11 socket
5
Orderwire telephone
interface (PHONE)
6
Running indicator
(RUN)
Green indicator
Used to indicate the running status of the OW
board.
Flickering regularly (one time per second)
means that the OW board runs normally.
7 Alarm indicator (ALM)
Red indicator
Used to indicate alarms in the OW board.
OFF: The OW board runs normally.
ON: Some alarm occurs in the OW board.

Table 52 lists the signal definitions of pins in the RS232/RS485/RS422
interface.
TAB L E 52 SI GNAL DEFI NI TI ONS OF PI NS I N RS232/ RS485/ RS422 I NTERFACE
Pin Signal Definition
1 RS232_R1/RS422_R1+/RS485+_1
2 RS232_T1/RS422_R1-/RS485-_1
3 GND
4 RS232_R2/RS422_T1+/RS485+_2
5 RS232_T2/RS422_T1-/RS485-_2
6 GND
7 RS232_R3/RS422_R2+/RS485+_3
8 RS232_T3/RS422_R2-/RS485-_3
9 GND
10 RS232_R4/RS422_T2+/RS485+_4
11 RS232_T4/RS422_T2-/RS485-_4

Pin Signal Definition
12 GND
13 GND
14 RS232_R5/RS422_R3+/RS485+_5
15 RS232_T5/RS422_R3-/RS485-_5
16 GND
17 RS232_R6/RS422_T3+/RS485+_6
18 RS232_T6/RS422_T3-/RS485-_6
19 PGND
20 PGND
21 PGND
22 PGND
23 PGND
24 PGND
25 PGND
26 PGND
Note:
RS232_Tx (x=1-6) represents for the x
th
transmitting channel of
RS232 signal, while RS232_Rx (x=1-6) represents for the x
th
receiving
channel of RS232 signal.
RS422_Tx+ (x=1-3) represents for the positive polarity of the x
th

transmitting channel, while RS422_Tx- (x=1-3) represents for the
negative polarity of the x
th
transmitting channel.
RS422_Rx+ (x=1-3) represents for the positive polarity of the x
th

receiving channel, while RS422_Rx- (x=1-3) represents for the
negative polarity of the x
th
receiving channel.
RS485+_x (x=1-6) represents for the positive polarity of the x
th

channel, while RS485-_x (x=1-6) represents for the negative polarity
of the x
th
channel.
GND represents for ground. PGND indicates that the pin is connected
to the protection ground in the socket.
Enhanced Smart Ethernet Board
(SEC)
Functions
The SEC board has the following functions.

Provides 4 FE electrical interfaces at the user side. All of these
interfaces meet the requirements of IEEE 802.3, and support the rate
of 10 M/100 M, full duplex/half duplex modes as well as self-
negotiation and forced working status.
Provides 4 system ports at the system side. All of these ports support
the convergence in 4:1 mode.
Supports the Ethernet flow control and the processing of flow control
frames as specified in IEEE 802.3x.
Supports Jumbo frames with the length of 9600 bytes.
Supports VLAN processing and Q in Q.
Supports learning and searching in Independent VLAN Learning (IVL)
and Shared VLAN Learning (SVL) modes. The capacity of MAC address
table is 8 K.
Supports the special processing of L2 frames specified by users.
Supports Internet Group Management Protocol Snooping (IGMP)
protocol.
Provides the Trunk function for ports and supports the protection
based on Link Aggregation Control Protocol (LACP).
Provides the mirroring function for ports.
Supports Multi-Service Transport Platform (MSTP) protocol.
User ports support the access mode, TLS (Transparent LAN Services)
mode, trunk mode and the transparent transmission mode. The
function of querying user ports alarm and performance messages is
also provided.
Operating Principle
The operating principle of the SEC board is as follows:
At the receiving side, the SEC board accesses 4 channels of Ethernet
signal. After L2 switching, these signals are converted into differential
signals and then forwarded to the main board through the backplane
for Ethernet service signal processing.
At the transmitting side, cross-connect, de-map and de-capsulate the
Ethernet service signals in the main board firstly. Then send these
signals to the SEC board through the backplane. The SEC board
performs L2 switching for these signals and finally outputs them.
Note: For the details of Ethernet service processing procedure, please
refer to the description of Ethernet interface unit in the section Main
Board.
Front Panel
The front panel of the SEC board is shown in Figure 43.

FI GURE 43 FRONT PANEL OF THE SEC BOARD
156.7mm
2
0
.
6
m
m
1 2 3 4 5 6 7

Table 53 lists the components on the front panel of the SEC board.
TAB L E 53 COMPONENTS ON THE FRONT PANEL OF SEC BOARD
1
Captive
fastener
2 Ejector lever
and also is used to fix the board in the chassis.
3
LINK/ACK
indicator
Green indicator
Used to indicate the connecting and running status of
corresponding Ethernet interface.
ON: The Ethernet interface is connected, that is, in
the LINK status.
transmitted through the Ethernet interface.
4
Ethernet
electrical
interface
Four Ethernet electrical interfaces are available on the
front panel, numbered with 5, 6, 7 and 8 respectively
from left to right.
5
Interface
speed
indicator
Green indicator
Used to indicate the data transmission speed of
ON: The data transmission speed of corresponding
Ethernet interface is up to 100 Mbit/s after self-
negotiation.
OFF: The data transmission speed of
corresponding Ethernet interface is 10 Mbit/s.
6
Running
indicator
(RUN)
Green indicator
Used to indicate the running status of the SEC board.
Flickering regularly (once per second): The SEC board
runs normally.
7
Alarm
indicator
(ALM)
Red indicator
Used to indicate alarm in the SEC board.
OFF: The SEC board runs normally.
ON: Some alarm occurs in the SEC board.

SHDSL Interface Board (SDB)
G.SHDSL (Single-pair high-bit-rate Digital Subscriber Line) is a
telecommunication technology corresponding to ADSL and VDSL. It not
only supports the symmetrical data rates of 2.048 Mbit/s but also has the
longer transmission distance than ADSL. Replacing E1 lines by G.SHDSL
can access the high-speed data services for transmission over long
distance.
The SHDSL interface board (SDB) can act as a circuit-based SHDSL
Transceiver Unit-Central office (STU-C) equipment working in TDM (Time
Division Multiplexing) mode. The SDB board enables ZXMP S200 to
implement the long-distance transmission of E1 data by cooperating with
corresponding SHDSL terminal equipment, moreover, the transmission
distance is up to 2 km.
Functions
The SDB board has the following functions.
Provides up to 4 SHDSL data interfaces that meet the requirements of
ITU-T G.991.2; supports two lines mode and symmetric PSD (Power
Spectral Density).
Supports the rate symmetry for the upward and downward data of
each SHDSL.
Supports the payload transport rate of up to 2.048 Mbit/s.
Supports the framing of E1 signals.
Supports retiming four E1 signals, which is set on the EMS.
Supports the remote download of board software.
Provides two loopback configuration points at VC12 and SHDSL ports
for convenient test. Each loopback point supports two loopback modes:
terminal-side loopback and line-side loopback.
It is hot pluggable.

Operating Principle
Figure 44 illustrates the operating principle of the SDB board.

FI GURE 44 OPERATI NG PRI NCI PL E OF THE SDB BOARD
Mapping/
Demapping
Unit
Multiplexing/
Demultiplexing
Unit
Interface Unit
Microprocessor
Unit
Backplane
SHDSL
signal

Table 54 lists the functions of each unit in the SDB board.
TAB L E 54 UNI TS I N THE SDB BOARD
Unit Function
Interface Unit
Inputs/outputs SHDSL signals and completes the conversion
between E1 signals and SHDSL signals.
Mapping/ De-
mapping Unit
Performs the mapping/de-mapping of four E1 signals.
Multiplexing/
De-
multiplexing
Unit
Implements the conversion between traffic buses, the relay
overlay of up/down traffic buses.
It also performs the de-framing of E1 signals in the up
direction when the framing function is enabled, and the
retiming of E1 signals.
Microprocessor
Unit
Performs the functions of system configuration, monitoring
and management.
Front Panel
The front panel of the SDB board is shown in Figure 45.
FI GURE 45 FRONT PANEL OF THE SDB BOARD
156.7mm
2
0
.
6
m
m
1 2 3 4 5 6 7

Table 55 describes the components on the front panel of SDB board.
TAB L E 55 COMPONENTS ON THE FRONT PANEL OF SDB BOARD
1
Captive
fastener

2 Ejector lever
3
Interface
alarm
indicator
Yellow indicator
Used to indicate whether the interface has any alarm.
ON: Some alarm occurs in the interface.
OFF: No alarm occurs in the interface.
4
SHDSL
interface
Four SHDSL interfaces are available on the front
panel, identified with PORT1, PORT2, PORT3 and
PORT4 respectively from left to right.
Connector type: 8P8C angle PCB welding shielded
RJ45 socket with LED
Each RJ45 socket has eight metal contact sheets
numbered from left to right. The 4
th
and 5
th
metal
sheets correspond to A and B lines of SHDSL interface.
The other metal sheets are impending.
The cable used to connect SHDSL interface is a special
cable equipped with RJ45 plug.
5
Line
connection
indicator
Green indicator
Used to indicate whether the interface is connected.
ON: The interface is connected.
OFF: The interface is not connected.
6
Running
indicator
(RUN)
Green indicator
Used to indicate the running status of the SDB board.
Flickering regularly (once per second): The SBD board
runs normally.
7
Alarm
indicator
(ALM)
Red indicator
Used to indicate alarms in the SDB board.
OFF: The SBD board runs normally.
ON: Some alarm occurs in the SBD board.

Ch a p t e r 3
Technical Specifications

Dimensions and weight of ZXMP S200 and its components
Power supply requirements
Environment requirements, including
Grounding and lightning protection requirements
Temperature and humidity requirements
Cleanness requirements
Application environment requirements
Earthquake proof performance
Reliability Indexes
Electromagnetic compatibility (EMC) indexes
Eye pattern of optical launched signals
Technical specifications of optical interfaces and electrical interfaces
Clock timing and synchronization
Bit error indexes
Protection switching time
Compliant recommendations and standards of interfaces


Dimensions & Weight
Table 56 lists the dimensions and weight of ZXMP S200 and its
components.
TAB L E 56 DI MENSI ONS & WEI GHT OF COMPONENTS I N ZXMP S200
Equipment/Module
Dimension
(H W D, mm)
Weight
(kg)
ZXMP S200 subrack
(installed in cabinet)
49.5 (height) 442.5 (width) 240.0
(depth)
2.900[Note
1]
ZXMP S200 subrack
(installed on the
desktop or hung on
the wall)
49.5 (height) 482.6 (width) 240.0
(depth)
3.000
[Note 2]
PCB: 39 (width) 27.2 (depth) 229.9
(height)
Total: 44.5 (height) x 33.1 (width) x 229.9
(depth)
Fan module
Panel: 44.5 (height) x 33.1 (width) x 16.8
(depth)
0.154
Dustproof module 44.5 (height) 4.5 (width) 226.0
(depth)
-
Backplane PCB: 418.5 (width) x 38.3 (depth).0
(height)
-
PWA/PWB/PWC
PCB: 76 (width) x 210 (depth) x 2 (height)
Total:
40.1 (height) x 84.5 (width) x 206 (depth)
(ejector lever not counted)
(ejector lever counted)
Panel: 40.1 (height) x 84.5 (width) x 12.3
(depth)
Main board PCB: 306 (width) x 200 (depth) x 2
(height)
Panel: 40.1 (height)319.1 (width) x 25
(depth) (the length of captive screw not
counted)
40.1 (height) 319.1 (width) x 12.3
(depth) (the length of captive screw
counted)
Plug-in boards PCB: 149 (width) x 200 (depth) x height)
Panel:
( the depth of captive screw counted)
20.6 (height) x 156.7 (width) x 12.3
(depth) ( the depth of captive screw not
counted)
Refer to
Table 58.

Chapter 3 Technical Specifications
Note 1: The weight of subrack includes that of the backplane. And the subrack
dimensions include those of the removable feet washer. When installing the
subrack in the cabinet, remove the feet washer if necessary.
Note 2: Refer to the subrack that is installed in ZTE transmission cabinet, IEC
standard cabinet or hung on the wall. The weight of subrack includes that of both
backplane and installation hug. The dimensions include those of removable feet
washer.
Power Supply Requirements
Voltage Range
ZXMP S200 supports three kinds of power supply:
-48 V DC power supply (PWA)
+24 V DC power supply (PWB)
110 V/220 V AC power supply (PWC)
Table 57 lists the allowable fluctuation range for each kind of input voltage.
TAB L E 57 AL L OWAB L E VOL TAGE FL UCTUATI ON RANGE OF ZXMP S200
Power Module Input Voltage Fluctuation Range
PWA -48 V DC -72 V to -36 V
PWB +24 V DC +18 V to +36 V
PWC 110 V/220 V AC 90 V to 290 V, 45 Hz to 65 Hz

Power Consumption and Weight
Table 58 lists the power consumption and the weight of each board.
TAB L E 58 POWER CONSUMPTI ON AND WEI GHT OF EACH BOARD AVA I L AB L E FOR ZXMP
S200
Board Code
Max. Power
Consumptio
n under
Normal
Temperatur
e (25)(W)
Max. Power
Consumption
under High
Temperature
(45)(W)
Weig
ht
(kg)
Remark
SMBxD75E0 17.33 17.85 0.830
SMBxD75T0 18.83 19.39 0.830
SMBxF75E0 19.50 20.09 0.870
SMBxF75T0 19.54 20.13 0.870
SMB main
board
SMBxD120E 18.50 19.06 0.830
Descriptio
ns of the
main
board
refer to
Table 10.

Board Code
Max. Power
Consumptio
n under
Normal
Temperatur
e (25)(W)
Max. Power
Consumption
under High
Temperature
(45)(W)
Weig
ht
(kg)
Remark
0
SMBxD120T
0
19.50 20.09 0.830
SMBxF120E
0
19.84 20.44 0.790
SMBxF120T
0
20.18 20.79 0.870
SMBxD100E
0
17.49 18.01 0.830
SMBxD100F
0
19.17 19.75 0.830
SMBxF100E
0
19.17 19.75 0.870
SMBxF100F
0
19.84 20.44 0.870
SMCxD75E 19.50 20.09 0.760
SMCxF75E 20.85 21.48 0.800
SMCxD75T 20.18 20.79 0.760
SMCxF75T 21.52 22.17 0.800
SMCxD120E 19.17 19.75 0.760
SMCxF120E 19.84 20.44 0.800
SMCxD120T 19.84 20.44 0.760
SMCxF120T 20.51 21.13 0.800
SMCxD100E 19.92 20.52 0.760
SMCxF100E 20.70 21.32 0.800
SMCxD100T 21.07 21.70 0.760
SMC main
board
SMCxF100T 21.85 22.51 0.800
Descriptio
ns of the
main
board
refer to
Table 10.
2 M bit/s
BITS
interface
board
IBB 0.43 0.44 0.020
2 MHz
BITS
interface
board
IBBZ 0.43 0.44 0.025
BITS
interface
board
installed
on the
PCB of
the main
board
provides
the clock
interface.
-48 V
power
board
PWA

7.49 7.71 0.718
Efficiency
of PWA
75%

Board Code
Max. Power
Consumptio
n under
Normal
Temperatur
e (25)(W)
Max. Power
Consumption
under High
Temperature
(45)(W)
Weig
ht
(kg)
Remark
+ 24 V
power
board
PWB 8.14 8.38 0.700
Efficiency
of
PWB72
%
110 V/220
V power
board
PWC 9.11 9.38 0.710
Efficiency
of
PWC70
%
2-channel
V.35 data
board
V35B 2.21 2.28 0.250 -

21-
channel E1
electrical
tributary
board (75
ohm)
ET1-75 8.69 8.95 0.294 -
21-
channel E1
electrical
tributary
board (120
ohm)
ET1-120 8.70 8.96 0.290 -
21-
channel T1
electrical
tributary
board (100
ohm)
TT1-100 11.28 11.62 0.300 -
3-channel
E3/T3
electrical
interface
board
EIE3 2.16 2.20 0.290 -
4-channel
transparen
t-
transmissi
on fast
Ethernet
electrical
interface
board
TFEx4 0.86 0.89 0.220 -
4-channel
transparen
t-
transmissi
on fast
TFEx4B 2.59 2.67 0.294
The types
of the
optical
module
are S-1.1,

Board Code
Max. Power
Consumptio
n under
Normal
Temperatur
e (25)(W)
Max. Power
Consumption
under High
Temperature
(45)(W)
Weig
ht
(kg)
Remark
Ethernet
optical
interface
board
L-1.1 or
L-1.2,
and the
LC/PC
optical
interfaces
are
adopted.
Orderwire
board
OW 3.50 3.61 0.282 -
Audio
board
AI 1.78 1.83 0.368 -
4xFE
enhanced
smart
Ethernet
board
SEC 9.60 9.89 0.270 -
SHDSL
interface
board
SDB 3.94 4.06 0.300 -
Fan
module
FAN 3.46 3.56 0.154 -

The overall power consumption of ZXMP S200 depends on its configuration.
If SMB main board is equipped, Table 59 lists the power consumption
for the typical configuration of ZXMP S200, and Table 60 lists the
maximum power consumption of ZXMP S200.
TAB L E 59 POWER CONSUMPTI ON FOR THE TYPI CAL CONFI GURATI ON OF ZXMP S200
( SMB)
Component Name Component ID Unit Number
ZXMP S200 subrack (including fan
module and motherboard)
- Set 1
System Main Board with Four optical
interfaces and Twenty-one 75 E1
interfaces
SMBxF75T0 Piece 1
Fan module FAN Set 1
-48 V power module PWA Piece 1
2 Mbit/s BITS interface board IBB Piece 1
Total power consumption (w) 29.96

TAB L E 60 MAXI MUM POWER CONSUMPTI ON OF ZXMP S200 ( SMB)
- Set 1
System Main Board with Four optical
interfaces
SMBxF120T0 Piece 1
21-channel E1 electrical tributary
board (75 ohm)
ET1-75 Piece 1

If SMC main board is equipped, Table 61 lists the power consumption
for the typical configuration of ZXMP S200, and Table 62 lists the
maximum power consumption of ZXMP S200.
TAB L E 61 POWER CONSUMPTI ON FOR THE TYPI CAL CONFI GURATI ON OF ZXMP S200
( SMC)
- Set 1
System Main Center with Four optical
interfaces
SMCx75T Piece 1

TAB L E 62 MAXI MUM POWER CONSUMPTI ON OF ZXMP S200 ( SMC)
- Set 1
System Main Center with Four optical
interfaces
SMCxF120T Piece 1

21-channel E1 electrical tributary
board (75 ohm)
ET1-75 Piece 1

Environment Requirements
The environment requirements of ZXMP S200 include:
Grounding and lightning protection requirements
Temperature and humidity requirements
Cleanness requirements
Application environment requirements
Grounding and Lightning Protection
Requirements
Requirements for Grounding System in Equipment Room
All PCBs of boards and the cover of ZXMP S200 must be connected to
the protection ground in the equipment.
If the equipment room adopts the joint grounding mode, the following
requirements should be met:
The grounding resistance of the central equipment room should be
no more than 1 .
The grounding resistance of a far-end equipment room should be
no more than 5 .
If the equipment room adopts the independent grounding mode, the
grounding resistances should meet the requirements in Table 63.
TAB L E 63 GROUNDI NG RESI STANCE REQUI REMENTS I N I NDEPENDENT GROUNDI NG
MODE
Grounding Resistance Value ()
AC working ground resistance 4
DC working ground resistance 4
Security protection ground resistance 4

Grounding Resistance Value ()
Lightning protection ground resistance 4
Copper busbar with cross section area of no less than 120 mm
2
should
be used as earth busbar or earth bar. Galvanized flat steel with the
dimensions equal to or more than 40 mm4 mm can also be used.
Be sure to use copper flanges, bolts and spring washers to fasten the
connections between equipment grounding cables and the earth busbar
or earth bars. One bolt can only be used to connect one grounding
cable. Determine the joint grounding cable size and the number of
screws according to the quantity of equipments grounding cables in
the equipment room.
Requirements for Grounding and Lightning Protection of
Power Supply
Table 64 lists typical power supply lightning protection classes.
TAB L E 64 TYPI CAL POWER SUPPL Y L I GHTNI NG PROTECTI ON CL ASSI FI CATI ON
Class Parameter
Location of Lightning Protection
Circuit
Class B 40 kA (8 s /20 s) AC power distribution board/unit
Class C 20 kA (8 s/20 s) DC power cabinet
Class D
6000 V (combination
wave)
-48 V power rectifier

ZXMP S200 must meet the following power supply lightning protection
requirements.
A central equipment room should meet the following lightning
protection requirements:
AC power cables should be led into the cable vault or power room
underground.
Install Class B lightning protection unit in the AC power distribution
board/unit or at the entrance of it. The unit is grounded by
connecting the floor earth bar through the AC power distribution
board/unit.
Install Class C lightning protection unit in the DC power cabinet,
being grounded by connecting the floor earth bar through the DC
power cabinet.
Install Class D lightning protection unit in the rectifier, being
grounded by connecting the floor earth bar through the rectifier
and the DC power cabinet.
A far-end equipment room should meet the following lightning
protection requirements:
AC power cables should be led into the far-end equipment room
underground.

Connect Class B lightning protection unit to the protection
grounding bar in the equipment room through the AC power
distribution board/unit.
Connect Class C lightning protection unit to the protection
grounding bar in the equipment room through the DC power
cabinet.
Connect Class D lightning protection unit to the protection
grounding bar in the equipment room through the rectifier and the
DC power cabinet.
Connect the -48 V ground of the DC power cabinet to the working
grounding bar in the equipment room.
If there is no working grounding bar in the equipment room,
connect it to the protection grounding bar instead.
Figure 46 illustrates the connection for power supply lightning
protection in a far-end equipment room.
FI GURE 46 POWER SUPPL Y L I GHTNI NG PROTECTI ON CONNECTI ON I N A FAR- END
EQUI PMENT ROOM
AC DC
AC Power Distribution
Board/Unit
DC Power Cabinet
Class B Class C
Protection Grounding Bar
Working Grounding Bar
-48V
-48V GND

Since the AC power distribution board/unit and the DC power
cabinet in the same equipment room, the distance between Class B
and Class C lightning protection units should meet the following
decoupling distance requirements:
When the protection grounding bar is laid independently, the
distance between Class B and Class C lightning protection units
should no less than 5 m.
When the protection grounding bar and the power cords are laid in
parallel, the distance between Class B and Class C lightning
protection units should no less than 15 m.
If the required decoupling distance can not be satisfied due to some
restriction in the equipment room, additional decoupling
inductance(s) should be installed before the Class C lightning
protection unit by 1.5H/m.
Bunched copper wires with cross section area no less than 35 mm
2
should be used as the grounding cables of the Class B lightning

protection unit (AC power distribution board/unit), and the
protection grounding cables and working grounding cables of the
Class C lightning protection unit (DC power cabinet), which are
connected to the protection grounding bar in the equipment room.
Keep the length of grounding cables as short as possible.

ZXMP S200

The requirements for the lightning protection of subrack, indoor
cabinet and transmission outdoor cabinet where ZXMP S200 is installed
are as follows:
For ZXMP S200 installed in an indoor cabinet or transmission
outdoor cabinet, its protection grounding wire should be connected
to the protection grounding busbar in the cabinet.
For the indoor cabinet and transmission outdoor cabinet, their
protection grounding adopt bunched copper wires whose cross
section area is no less than 16 mm
2
.

The protection grounding
wires are connected to the earth busbar or earth bar (including
column-head power cabinet).
If the equipment uses DC power supply, its protection ground
should be short circuited with the ground of DC power supply and
then connected to the protection grounding busbar in the indoor
cabinet or transmission outdoor cabinet.
It is forbidden to lead the protection grounding wire of the
equipment out of the cabinet and connect it to the earth busbar or
earth bar (including column-head power cabinet) in the equipment
room directly.
The requirements for the lightning protection of ZXMP S200 installed
on desktop or mounted on wall are as follows:
If ZXMP S200 uses DC power supply, short circuit its protection
ground with the ground of DC power supply first, and then connect
it to the earth busbar or earth bar (including column-head power
cabinet) in the equipment room with bunched copper wires with
cross section area no less than 4 mm
2
.
For the wall-mounted ZXMP S200, it should be mounted on the
inner wall of the equipment room. Keep the expansion screws used
to fix the brackets away from reinforcing steel bars inside the wall
as far as possible.
Other Equipment

Implement strict equipotential connections among equipment
connected to ZXMP S200, such as DC power cabinet, switch and digital
distribution frame (DDF).

The protection grounds of DC power cabinet, switch and DDF should be
connected to the earth busbar in the equipment room with bunched
copper wires with cross section area no less than 35 mm
2
.
Other metal equipment and components in the equipment room, such
as the monitoring unit, metal door and windows and AC power
distribution unit, should be connected to the nearby earth busbar in
the equipment room with bunched copper wires with appropriate cross
section area.
Before being led into a central equipment room, external optical cables
in the cable vault must be connected to the earth busbar through lead-
in connection devices.
In a far-end equipment room, external optical cables must be
connected to the protection grounding busbar or outdoor lightning
protection ground through optical termination box, which is connected
to the protection grounding busbar or earth network with bunched
copper wires with cross section area no less than 16 mm
2
.
Temperature/Humidity Requirements
ZXMP S200 should operate in the environment meeting the following
temperature and humidity requirements, as listed in Table 65.
TAB L E 65 TEMPERATURE A ND HUMI DI TY REQUI REMENTS OF ZXMP S200
Item Requirement
Working temperature (on the desktop, in the indoor
cabinet or on the wall)
-5C to +50C
Working temperature (in the outdoor functional
cabinet)
-5C to +45C
Working temperature (in the field power supply
cabinet)
-40C to +45C
Performance-guaranteed
index
10% to 95%
Relative humidity
Operation-guaranteed index 5% to 95%

Cleanness Requirements
The cleanliness represents the requirement for the dust and harmful gas in
the air. The equipment room where ZXMP S200 works should meet the
following cleanliness requirements.
There is no explosive, conductive, magnetic-conductive and corrosive
dust in the equipment room.
The concentration of dust with dimension above 5 m should be no
more than 310
4
particles/m
3
.
There is no harmful gas which may destroy metal and insulation, such
as SO
2
, NH
3
, H
2
S and NO
2
.

Table 66 lists the requirements for the concentration of harmful gas in
the equipment room.
TAB L E 66 REQUI REMENTS FOR CONCENTRATI ON OF HARMFUL GAS I N EQUI PMENT
ROOM
Concentration
Harmful Gas
Average (mg/m
3
) Maximum (mg/m
3
)
SO
2
<0.2 <1.5
H
2
S <0.006 <0.03
NO
2
<0.04 <0.15
NH
3
<0.05 <0.15
Cl
2
<0.01 <0.3

Keep the equipment room clean, and confirm that the door and
windows are sealed.
Application Environment Requirements
According to China national standard GB/T 4798 and the application scope
of ZXMP S200, the application environment requirements are listed in
Table 67.
TAB L E 67 APPL I CATI ON ENVI RONMENT REQUI REMENTS OF ZXMP S200
Application Environment Condition Class Time Limit
Storage 1K5/1Z1/1B2/1C2/1S3/1M3 180 days
Transportation 2K4P/2B2/2C2/2S3/2M3 30 days
Use 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3 20 years
Note: For the meaning of the environment class in the above table, please refer to
the China national standard GB/T 4798 Environmental Conditions Existing in the
Application of Electric and Electronic Products, which is an equivalent standard of
IEC 60721.
Earthquake-Proof Performance
The earthquake proof performance meets the requirements specified in
the following China standards for telecommunication industry:
YD 5091-2000 Specification for Seismic Test of Optical Transmissions
Equipment
YD 5083-99 Specification for Seismic Test of Telecommunications
Equipment
ZXMP S200 meets the requirements during the seismic test with the
magnitude 8.

Reliability Indexes
The reliability indexes of ZXMP S200 are listed in Table 68.
TAB L E 68 REL I AB I L I TY I NDEXES OF ZXMP S200
Item Index
Mean Time Between Failures (MTBF) 20000 hours
Mean Time Between Critical Failures (MTBCF) 40000 hours
Service life 20 years
Electromagnetic Compatibility
Criterion
Performance A
At digital signal ports: The equipment operates normally under the
test. After each single disturbance, the bit error count does not
exceed the bit error number allowed during normal operation. For
ZXMP S200, the allowable bit error number is zero, which means no
bit error occurs.
At analog audio signal ports: Continuous connections are kept
under the test. The noise measured with 600 impedance from
the equipment under test does not exceed -40 dBm.
Performance B
At digital signal ports: Temporary function degradation caused by
the disturbance occurs under the test. However, the function of
equipment recovers automatically after the disturbance being
cancelled. Under the disturbance, there is no loss of the frame
queue and synchronization. No alarm occurs after electromagnetic
disturbance.
At analog audio signal ports: Continuous connections are kept
under the test. The connection interruption is allowable under the
surge test. After the disturbance finishes, the performance of
equipment under test should recover.
Performance C
Temporary function degradation caused by the disturbance occurs
under the test. After the disturbance being cancelled, the function of
equipment can recover automatically, or recover after being reset
manually.


Immunity Performance
Electrostatic discharge (ESD) immunity
It complies with the standard of IEC61000-4-2.
Table 69 shows the ESD immunity indices.
TAB L E 69 ESD I MMUNI TY I NDI CES
Contact Discharge Air Discharge Examination Criterion
6 kV 8 kV Performance B

Radiated Susceptibility (RS)
The radiated susceptibility of ZXMP S200 complies with the standard
IEC61000-4-3, as listed in Table 70.
TAB L E 70 RADI ATED SUSCEPTI B I L I TY I NDI CES
Frequency Range: 80 MHz - 1000 MHz, 1.4 GHz 2 GHz
Electric Field
Intensity
Amplitude Modulation Criterion
10 V/m 80% AM at 1 kHz rate Performance A

Electrical Fast Transient (EFT) immunity
The EFT immunity of ZXMP S200 complies with the standard
IEC60001-4-4.
Table 71 lists the EFT immunity indices on DC power supply ports.
TAB L E 71 EFT I MMUNI TY I NDI CES ON DC POWER SUPPL Y PORTS
Generator Waveform
Voltage Repetition
Rate
Criterion
5 ns/50 ns 1 kV 5 kHz Performance B

Table 72 lists the EFT immunity indices on signal and control ports
(with capacitive coupling clamp).
TAB L E 72 EFT I MMUNI TY I NDI CES ON SI GNAL AND CONTROL PORTS
Generator Waveform
Voltage Repetition
Rate
Criterion


Table 73 lists the EFT immunity indices on AC power supply ports
(direct coupling).
TAB L E 73 EFT I MMUNI TY I NDI CES ON AC POWER SUPPL Y PORTS
Generator Waveform
Voltage
Repetition
Rate
Criterion

Lightning strike and surge immunity
The lightning strike and surge immunity of ZXMP S200 complies with
the standard IEC61000-4-5.
Table 74 lists the lightning surge immunity indices of DC power supply.
TAB L E 74 DC POWER SUPPL Y L I GHTNI NG SURGE I MMUNI TY I NDI CES
Generator Waveform: 1.2 s/50 s (8 s/20 s)
Test Mode Source
Impedance
Test Voltage Criterion
Line to line 2 1 kV Performance B
Line to ground 12 2 kV Performance B

Table 75 lists the lightning surge immunity indices of AC power supply.
TAB L E 75 AC POWER SUPPL Y L I GHTNI NG SURGE I MMUNI TY I NDI CES
Test Mode Source
Impedance
Line to line 2 2 kV Performance B

Table 76 lists the surge immunity indices of outdoor signal line.
TAB L E 76 OUTDOOR SI GNAL L I NE SURGE I MMUNI TY I NDI CES
Generator Waveform: 10 s/700 s
Test Mode Source
Impedance

Table 77 lists the surge immunity indices of signal line with length
more than 10 m.

TAB L E 77 SI GNAL L I NE SURGE I MMUNI TY I NDI CES
Test Mode Source
Impedance

Conducted Susceptibility (CS)
The conducted susceptibility of ZXMP S200 complies with the standard
IEC61000-4-6, as listed in Table 78.
TAB L E 78 CONDUCTED SUSCEPTI B I L I TY I NDI CES
Frequency Range: 0.15 MHz - 80 MHz
Test Intensity Amplitude Modulation Criterion
3 V 80% AM at 1 kHz rate Performance A

AC voltage transient dropout immunity
This item is only applicable to the PWC board when AC power is
supplied to ZXMP S200. The immunity satisfies the standard IEC1000-
4-11.
Table 79 lists the AC voltage transient dropout immunity indices of the
PWC board.
TAB L E 79 AC VOL TAGE TRANSI ENT DROPOUT I MMUNI TY I NDI CES
Dropout Ratio Duration (ms) Criterion
30% 10 Performance B
30% 500 Performance C
60% 100 Performance C
>95% 50 Performance B
>95% 5000 Performance C

Disturbance Characteristics
Disturbance characteristics include conducted emission characteristic and
radiated emission characteristic.
The corresponding indices of ZXMP S200 satisfy the Class B specified in
the standard CISPR 22.
Conducted emission
Table 80 lists the conducted emission indices at DC/AC power ports.

TAB L E 80 CONDUCTED EMI SSI ON I NDI CES AT DC/ AC POWER PORTS
Voltage (dB V)
Frequency Range (MHz)
Quasi-peak Average
0.15 - 0.5 79 66
0.5 - 30 73 60

Table 81 lists the conducted emission indices at communication/control
ports.
TAB L E 81 CONDUCTED EMI SSI ON I NDI CES AT COMMUNI CATI ON/ CONTROL PORTS
Voltage (dB V) Current (dB A)
Frequency Range
(MHz)
Quasi-peak Average Quasi-peak Average
0.15 - 0.5 97 87 84 - 74 53 - 43 40 - 30
5 - 30 87 74 43 30

Radiated emission
Table 82 lists the radiated emission indices of ZXMP S200.
TAB L E 82 RADI ATED EMI SSI ON I NDI CES OF ZXMP S200
Quasi-Peak Limit (dB V/m)
Frequency Range (MHz)
Test Distance: 10 m Test Distance: 3 m
30 - 230 40 50
230 - 1000 47 57

Eye Pattern of Optical Launched
Signals
The eye patter of ZXMP S200 meets the specification in ITU-T G957, as
shown in Figure 47.

FI GURE 47 EYE PATTERN OF OPTI CAL L A UNCHED SI GNAL S
Time
1
1y1
UI
x3 x4 x2 x1
y1
-y1
0
0.5
y2
1
Mean level of
logical "1"
Mean level of
logical "0"
A
m
p
l
i
t
u
d
e

Table 83 lists the parameters specifying the eye diagram.
TAB L E 83 PARAMETERS OF TRANSMI TTI NG SI GNAL EYE PATTERN
Value
Parameter
STM-1 STM-4
x1/x4 0.15/0.85 0.25/0.75
x2/x3 0.35/0.65 0.40/0.60
y1/y2 0.20/0.80 0.20/0.80
Optical Interfaces Specifications
Table 84, Table 85, Table 86 and Table 87 list the specifications of optical
interfaces in ZXMP S200.
TAB L E 84 SPECI FI CATI ONS OF STM- 1 OPTI CAL I NTERFACES
Performance
type
Performance
item
Unit Specification
Code pattern Line code pattern - Scrambled NRZ code
Nominal rate kbps 155 520
Optical module - S-1.1 L-1.1 L-1.2
Operating wavelength range nm
1261
-1360
1280
-1335
1480
-1580
Transmission distance km 15 40 80
Maximum mean optical launched
power
dBm -8 -8 0
Minimum mean optical launched
power
dBm -15 -15 -5

Performance
type
Performance
item
Unit Specification
Worst sensitivity dBm -28 -34 -34
Minimum extinction ratio dB 8.2 10 10
Minimum overload point dBm -8 -8 -10
UI
0.50 (the filter for testing: 500
Hz-1.3 MHz)
Output jitter
UI
kHz-1.3 MHz)
Input jitter and wander
tolerance
-
Meets the requirement for STM-1
level network interface specified in
ITU-T G.825
Maximum frequency
offset of optical input
interface
ppm 20 ppm
Maximum AIS rate offset
of optical output
interface
- Rate offset within 20 ppm
1. The line code pattern of optical interfaces complies with the specification about
the synchronous scrambler in ITU-T G.707.
2. For STM-1 interface, 1 UI=6.43 ns
3. 1 ppm=110
-6

Table 85 lists the specification of STM-4 optical interfaces in ZXMP S200.
TAB L E 85 SPECI FI CATI ON OF STM- 4 OPTI CAL I NTERFACES
Parameter
type
Performance item Unit Specification
Code pattern Line code pattern - Scrambled NRZ code
Nominal rate kbps 622 080
Optical module - S-4.1 S-4.1 S-4.1
Operating wavelength range nm
1261
-1360
1280
-1335
1480
-1580
Transmission distance km 15 40 80
Maximum mean optical launched
power
dBm -8 2 2
Minimum mean optical launched
power
dBm -15 -3 -3
Worst sensitivity dBm -28 -28 -28
Minimum extinction ratio dB 8.2 10 10
Minimum overload point dBm -8 -8 -8
UI
Hz- 5 MHz)
Output jitter
UI

Parameter
type
Performance item Unit Specification
kHz-5 MHz)
tolerance
-
Meets the requirement for STM-1,
STM-4 level network interface
specified in ITU-T G.825
Maximum frequency offset of
optical input interface
ppm 20
Maximum AIS rate offset of
optical output interface
- Rate offset within 20 ppm
1. The line code pattern of optical interfaces complies with the specification about
the synchronous scrambler in ITU-T G.707.
2. 1 UI=1.61 ns
3.1 ppm=110
-6

TAB L E 86 SPECI FI CATI ONS OF STM- 4 SI NGL E FI B ER WI TH DUAL DI RECTI ONS OPTI CAL
I NTERFACES
Items Unit Performance Specifications
Module Name - Optical module A
achieving the
application of single
fiber with bi- direction
Optical module B achieving
the application of single
fiber with bi- direction
Transmission
distance
km 20 20
Transmitting
optical wavelength
nm 1550 1310
Receiving optical
wavelength
nm 1310 1550
Mean outputting
optical power
dBM -15 - -8 -15 - -8
Receiver
sensitivity
dBm -28 -28
Module A and module B should work cooperatively. For example, in order to
achieve the application of single fiber with bi-direction, if a site uses the optical
module A (or optical module B), then the opposite site should use the optical
module B (or optical module A) correspondingly.
TAB L E 87 SPECI FI CATI ONS OF 100 MB I T/ S ETHERNET OPTI CAL I NTERFACES
Module Name - 100Base-FX, multiple
mode
100Base-FX, single
mode
Transmission
distance
km 2 15
Mean launched
optical power
dBM -15 - -8 -15 - 0
Minimum
extinction ratio
dB 8.2 10

Receiver
sensitivity
dBm -28 -28
Receiver overload
optical power
dBm -8 -10
Electrical Interfaces
Specifications
Specification of STM-1 Electrical
Interfaces
Table 89 lists the specifications of STM-1 electrical interfaces.
TAB L E 88 SPECI FI CATI ONS OF STM- 1 EL ECTRI CAL I NTERFACES
Parameter Specification
Nominal rate 155520 kbit/s
Code pattern CMI [Note 1]
Allowable attenuation at
output port (square-root
attenuation)
0-12.7 dB, 78 MHz
Allowable frequency offset
at input port
> 20 ppm[Note 2]
Bit ratio tolerance at output
port
< 20 ppm
Mapping jitter at tributary
port
f1-f4: 0.4UI
f3-f4: 0.075UI
Combined jitter Meets the requirement specified in ITU-T G.783
Pulse shape at output port Complies with the mask specified in ITU-T G.703
Test load impedance 100
tolerance
Meet the requirement specified in ITU-T G.824
[Note 1]: CMI: Code Mark Inversion
[Note 2]: 1 ppm= 10
-6
, for 1544 kbit/s interface, 1UI=648 ns.

Specification of E1 Electrical Interfaces
Table 89 lists the specifications of E1 electrical interfaces.

TAB L E 89 SPECI FI CATI ONS OF E1 EL ECTRI CAL I NTERFACES
Nominal rate 2 048 kbit/s
Code pattern HDB3 [Note 1]
input port (square-root
attenuation)
0-6 dB, 1024 kHz
at input port
> 50 ppm [Note 2]
port
< 50 ppm
f1 High-pass, 20 Hz, 20 dB/dec
f3 High-pass, 18 kHz, 20 dB/dec
Filter
characteristic
f4 Low-pass, 100 kHz, -60 dB/dec
Mapping jitter at output
port
f1-f4: 1.5UI [Note 3]

f3-f4: 0.2UI
port
f1-f4: 0.4UI
f3-f4: 0.075UI
Test load impedance 75 or 120
Anti-interference capability
at input port (SNR)
18 dB
tolerance
Output
port
51 kHz to 102 kHz, 6 dB
Reflectance
attenuation
Input port
102 kHz to 2048 kHz, 18 dB
2048 kHz to 3072 kHz, 14 dB
[Note 1]: HDB3: High Density Bipolar of order 3
[Note 2]: 1 ppm= 10
-6

[Note 3]: 1UI=488 ns

Specification of T1 Electrical Interfaces
Table 90 lists the specification of T1 electrical interfaces.
TAB L E 90 SPECI FI CATI ON OF T1 EL ECTRI CAL I NTERFACES
Code pattern AMI, B8ZS

input port (square-root
attenuation)
0-6 dB, 772 kHz
at input port
> 32 ppm
Bit ratio tolerance at
output port
< 32 ppm
f3 High-pass, 8 kHz, 20 dB/dec
Filter
characteristic
Jitter at output port
f1-f4: 5.0UI
f3-f4: 0.1UI
port
f1-f4: 0.7UI

f3-f4: 0.1UI
tolerance
Note:
1. AMI: Alternate Mark Inversion; B8ZS: Bipolar with 8-Zero Substitution
2. 1 ppm= 10
-6

3. 1UI=648 ns

Specification of E3 Electrical Interfaces
The specification of E3 electrical interfaces is listed in Table 91.
TAB L E 91 SPECI FI CATI ON OF E3 EL ECTRI CAL I NTERFACES
Code pattern HDB3 [Note 1]
Allowable attenuation at output
port (square-root attenuation)
0-12 dB, 17 184 kHz
Allowable frequency offset at
output port
> 20 ppm [Note 2]
Bit ratio tolerance at output port < 20 ppm
f3 High-pass, 10 kHz, 20 dB/dec Filter characteristic
Jitter at output port f1-f4: 1.5UI [Note 3]

f3-f4: 0.15UI
Mapping jitter at tributary port
f1-f4: 0.4UI

f3-f4: 0.1UI
Combined jitter
Meets the requirement specified in ITU-T
G.783
Pulse shape at output port
Complies with the mask specified in ITU-T
G.703
Anti-interference capability at
input port (SNR)
20 dB
Input jitter and wander tolerance
Meets the requirement specified in ITU-T
G.823
Output port
1720 kHz to 51550 kHz, 8 dB
Reflectance
attenuation
Input port
860 kHz to 1720 kHz, 12 dB
1720 kHz to 34368 kHz, 18 dB
34368 kHz to 51550 kHz, 14 dB
[Note 1]: HDB3: High Density Bipolar of order 3
[Note 2]: 1 ppm= 10
-6

[Note 3]: 1UI=29.1 ns

Specification of T3 Electrical Interfaces
The specification of T3 electrical interfaces is shown in Table 92.
TAB L E 92 SPECI FI CATI ON OF T3 EL ECTRI CAL I NTERFACES
Code pattern B3ZS [Note 1]
output port (square-root
attenuation)
0-20 dB, 22 368 kHz
at output port
> 20 ppm [Note 2]
port
< 20 ppm
f3 High-pass, 30 kHz, 20 dB/dec Filter characteristic
Jitter at output port
f1-f4: 5.0UI [Note 3]

f3-f4: 0.1UI

port
f1-f4: 0.4UI

f3-f4: 0.1UI
tolerance
Meets the requirement specified in ITU-T G.824
[Note 1]: B3ZS: Bipolar with 3-Zero Substitution
[Note 2]: 1 ppm= 10
-6

[Note 3]: 1UI=22.4 ns
Clock Timing & Synchronization
The clock timing and synchronization specifications of ZXMP S200,
complying with ITU-T G.813, are as follows:
Output jitter
The output jitter does not exceed 0.05UI peak-peak when measured by
the interval of 60s through a single pole band-pass filter with corner
frequencies at 20 Hz and 100 kHz, where 1UI equals to 488 ns.
Excursion transfer characteristic
In the pass band range from 1 Hz to 10 Hz, the phase gain is smaller
than 0.2 dB.
Free oscillation output frequency deviation: < 4.6 ppm, where 1 ppm
equals to 110
-6
.
Pull-in and pull-out range: 4.6 ppm, where 1 ppm equals to 110
-6
.
Wander in locked mode
Table 93 and Table 94 list the mean time interval error (MTIE) limit
and time deviation (TDEV) limit respectively.
TAB L E 93 MTI E L I MI T I N L OCK ED MODE ( WI TH CONSTANT TEMPERATURE)
Observation Interval (s) MTIE Limit (ns)
0.1 < 1 40
1 < 100 40
0.1

100 < 1000 25.25
0.2

TAB L E 94 MTI E L I MI T I N L OCK ED MODE ( WI TH TEMPERATURE EFFECTS)
100 0.5

> 100 50
TAB L E 95 TDEV L I MI T I N L OCK ED MODE ( WI TH CONSTANT TEMPERATURE)
Observation Interval (s) TDEV Limit (ns)
0.1 < 25 3.2
25 < 100 0.64
0.1

100 < 1000 6.4
0.2

Bit Error Performance
ZXMP S200 reports no bit error in continuous 24 hours.
Protection Switching Time
The protection switching time of ZXMP S200 is less than 50 ms.
Compliant Standards of
Interfaces
Table 96 lists the standards which the interfaces of ZXMP S200 comply
with.
TAB L E 96 STANDARDS OF I NTERFACES PROVI DED B Y ZXMP S200
Interface Standard Remark
ITU-T G.707
Network node interface for the
synchronous digital hierarchy (SDH)
ITU-T G.957
Optical interfaces for equipments and
systems relating to synchronous digital
hierarchy (SDH)
Optical interfaces
at
155520 kbit/s
622080 kbit/s
ITU-T G.825
The control of jitter and wander within
digital networks which are based on the
synchronous digital hierarchy(SDH)
ITU-T G.703
Physical/electrical characteristics of
hierarchical digital interfaces
Electrical interface
(155520 kbit/s)
ITU-T G.707
Network node interface for the

Interface Standard Remark
ITU-T G.825
ITU-T G.703
ITU-T G.704
Synchronous frame structures used at
1544, 6312, 2048, 8448 and 44736
kbit/s hierarchical levels
Electrical
interfaces at
1544 kbit/s
2048 kbit/s
34368 kbit/s
44736 kbit/s

ITU-T G.825
2.048 MHz
network clock
synchronization
interface
ITU-T G.703
User data channel
interface (64
kbit/s)
ITU-T G.703
Ethernet interface
100BASE-TX
10BASE-T
IEEE 802.3
Meets the requirements related to
100BASE-TX and 10BASE-T physical
interfaces specified in IEEE 802.3
Orderwire
telephone
interface
-
Frequency range: 300 Hz to 3400 Hz
Pulse Mode Modulation (PCM)
Bit rate: 64 kbit/s

Ch a p t e r 4
Networking and
Configurations

Functions of the ZXMP S200 as an SDH NE,
Supportable networking modes of ZXMP S200,
A networking example of ZXMP S200.
Functions as an SDH NE
ZXMP S200 can act as a terminal multiplexer, an add/drop multiplexer or a
regenerator, performing corresponding functions in SDH networks.
Terminal Multiplexer (TM)
As a TM, ZXMP S200 terminates aggregate signals and SDH overheads at
the line side. It adds or drops E1/T1 tributary signals at the terminal side.
Figure 48 illustrates ZXMP S200 acting as a TM.
FI GURE 48 ZXMP S200 AS A TERMI NAL MUL TI PL EXER ( TM)


Add/Drop Multiplexer (ADM)
As an ADM, ZXMP S200 has two line directions. In each line direction, it
can add or drop E1/T1 tributary signals, or pass them straight without
damage.
In addition, ZXMP S200 can terminate, forward and originate SDH
overheads, or pass them directly through the equipment.
Figure 49 illustrates ZXMP S200 acting as an ADM.
FI GURE 49 ZXMP S200 AS AN ADD/ DROP MUL TI PL EXER ( ADM)
E1/T1
STM-1/STM-4
ZXMP S200
(ADM)
STM-1/STM-4

Regenerator (REG)
As a REG equipment, ZXMP S200 regenerates and amplifies optical signals.
It only processes regenerator section overheads (RSOH), instead of
service signals. Multiplex section overheads (MSOH) will pass through it
transparently.
Figure 50 illustrates ZXMP S200 acting as an REG.
FI GURE 50 ZXMP S200 AS A REGENERA TOR ( REG)

Networking Modes
ZXMP S200 supports multiple networking modes, such as point-to-point,
chain, ring networking mode and hybrid networking mode with other SDH
equipment, as shown in Figure 51.

Chapter 4 Networking and Configurations
FI GURE 51 NETWORK I NG MODES OF ZXMP S200
1.Point-to-Point 2.Chain 3.Ring
4.Hybridnetworking
SDH
transmission
network

Point-to-Point Networking
Point-to-point network can be used in inter-office trunk and capacity
expansion, or used to replace original PDH system.
The point-to-point networking of ZXMP S200 is shown in Figure 52.
FI GURE 52 POI NT- TO- POI NT NETWORK I NG OF ZXMP S200

Chain Networking
Chain network is applicable to communication networks with distributed
traffic in chains, or chain-shaped branch networks.
The chain networking of ZXMP S200 is shown in Figure 53.
FI GURE 53 CHAI N NETWORK I NG OF ZXMP S200

Ring Networking
Ring network is applicable to distributed NEs which can construct a ring.
Due to the self-closing feature of line interface in ring network, services

can be transmitted end-to-end in two directions (eastward and westward)
in the ring. Ring networks have strong survivability and self-healing ability.
The ring networking of ZXMP S200 is shown in Figure 54.
FI GURE 54 RI NG NETWORK I NG OF ZXMP S200
ADM
ADM
ADM ADM
ZXMP S200
ZXMP S200
ZXMP S200 ZXMP S200

The self-healing ring is divided into two categories: the path switched ring
and the multiplex section (MS) switched ring. In terms of abstract
functional structure, the path switched ring supports subnet connection
protection while the MS switched ring supports path protection.
ZXMP S200 can form two-fiber unidirectional path switched ring at STM-
1/STM-4 level and two-fiber bidirectional MS switched ring at STM-4 level.
Two-fiber unidirectional path switched ring
The path switched ring enables the fast and flexible protection
switching at various capacity levels. The switching is determined locally
and is independent of the topology. It is applicable to all kinds of
complicated network topologies and is not confined to the ring.
Therefore, it is more applicable to dynamic network environments,
such as cellular telecommunication networks.
However, because the principle of concurrent transmitting and
preferential receiving is adopted for all tributary signals, so all the
tributary signals are transmitted to the receiving node in two directions,
which is equivalent to transmission through the whole ring. Therefore
the total of the add/drop traffic in each NE can not exceed the system
capacity of ADM NEs.
Two-fiber bidirectional MS switched ring
The two-fiber bidirectional MS switched ring has the transmission
capability up to K/2 STM-N, where K is the quantity of nodes in the
ring, STM-N is the highest rate of the ring.
The MS switched ring supports the large transmission capacity and
flexible protection switching. However, fault response and recovering
time will be longer because it needs time to process APS protocol
during the switching.

Hybrid Networking
Hybrid networking is applied to capacity expansion or interconnection of
existing SDH networks. The hybrid networking can sufficiently utilize the
existing network resources, to compensate the ZXMP S200s limitations in
terms of capacity and networking capability.
ZXMP S200 can cooperate with other SDH equipment and DWDM
equipment of ZTE CORPORATION for hybrid networking. The same
network management system can be used to implement the unified
management.
When ZXMP S200 is used for hybrid networking with equipment of other
manufacturers, E1 network management channels can be used to transfer
the management information, so as to implement the integrated network
management in a hybrid network.
Networking Application of
Ethernet
Overview
If the ZXMP S200 equipment is configured with the SEC board, it functions
not only as traditional SDH equipment, but also as Multi-Service
Transportation Platform (MSTP) node equipment with Ethernet data
process functions.
As the MSTP node equipment, ZXMP S200 can access the service of
Ethernet Private line (EPL), Ethernet Virtual Private Line (EVPL), Ethernet
Private LAN (EPLAN) and Ethernet Virtual Private LAN (EVPLAN), moreover,
provides the flow control and QoS function according to the actual
requirements.
Ethernet Private Line (EPL)
EPL service has two accessing points through which the Ethernet service is
transparently transported point to point. Each users service is carried by
the private SDH channel in EPL, so different users have no need to share
bandwidth one another. Thus, EPL has the same bandwidth guarantee and
security performance as SDH.
Besides, it is a point-to-point transmission mode, so neither L2 switch nor
MAC address learning is needed.
Figure 55 shows a typical networking of EPL. The Ethernet service between
user X and user Y is transparently transmitted through MSTP equipment A
and J, as well as the passing-by sites such as B, C, D, E, F, G and H.

FI GURE 55- A TYPI CAL NETWORK I NG OF EPL

Ethernet Virtual Private Line (EVPL)
In EVPL, users can share the bandwidth with each other, which is the main
difference between EVPL and EPL. EVPL uses VLAN ID and other
mechanisms to distinguish the data from the different users. QoS
mechanism is adopted once the service varies with the user.
Because the user services are only separated logically, as another point-
to-point transmission mode, EVPL has the security performance lower than
EPL.
Figure 56 shows a typical networking of EVPL. User 1 has the service FE1
and FE2, and user 2 has the service FE3 and FE4. The service of user 1
and user 2 are isolated when passing by the sites A, B, C, D, E, F, G, H
and J.

FI GURE 56- A TYPI CAL NETWORK I NG OF EVPL

Ethernet Private LAN (EPLAN)
EPLAN, as a point to multi-point transmission mode, can guarantee the
bandwidth and isolate the service perfectly, so the users have no need to
share the SDH bandwidth. Meanwhile, QoS and security mechanism are
not needed.
Because multi points are involved in an EPLAN networking, the data is
transferred based on MAC address, so the functions of MAC address
learning and L2 switch are needed.
Figure 57 shows a typical networking of EPLAN. The services of two
braches Z and Y of the user pass through the SDH network formed by the
timeslots links, then converge at the central node X. Moreover, the
bandwidth is exclusive from each branch to the central.

FI GURE 57- A TYPI CAL NETWORK I NG OF EPL AN

Ethernet Virtual Private LAN (EVPLAN)
EVPLAN can be achieved in virtue of MPLS, VLAN stack (Q-in-Q) and other
technologies. From the point of user view, the network of the carriers is
like a LAN because of EVPLAN. The difference between EPLAN and EVPLAN
is that the user of EVPLAN should share the bandwidth. EVPLAN has the
especial attributes about protection, usability, bandwidth, MAC address
learning and data frame transferring.
Figure 58 shows a typical networking of EVPLAN. The traffic FE3 and FE5
of user 1 converge as the traffic FE1 at M through A and J. The traffic FE4
and FE5 of user 2 converge as the traffic FE2 at M through A and J. The
traffic of user 1 and user 2 are isolated by VLAN ID in the SDH
transmission channel.

FI GURE 58- A TYPI CAL NETWORK I NG OF EVPL AN

Application Example
This section introduces a simple networking example of ZXMP S200,
including the selection and analysis of networking mode and the
equipment configuration based on network requirements.
Network Description
Suppose three new sties A, B and C need to be constructed. -48 V DC
power supply is available for all equipment.
Site Locations
As shown in Figure 59, Sites A and B are connected directly through
optical cables, Sites B and C are connected through an SDH transmission
network. The network element management system (EMS) is configured at
Site A.

FI GURE 59 TOPOL OGY OF NETWORK I NG EXAMPL E
15km 15km 15km
A B C
SDHtransmission
network

There is 2 M bidirectional service between Site A and Site B as well as Site
B and Site C.
Networking Analysis
The network topology structure should be selected according to site
distribution and service allocation. Generally, ring networking is preferable
as long as the routes are permitted due to its excellent self-healing
capability. Some special condition is exceptional, for example, networks
along the railway or highway are often chain networks. However, ring
network is recommended if adequate optical fibers are available.
In this sample, Site A, B and C form a chain network.

Access NE is the NE that accesses the EMS computer in the network. It
should be selected according to users requirement and generally in major
site with centralized traffic.
In this sample, NE A (site A) is selected as the access NE.

Since Site B and C are connected through an SDH transmission network,
the whole network can be seemed as a hybrid network.
To implement the integrated management of ZXMP S200 equipment, the
network management channel between Site B and C adopts E1 mode, that
is, the 1st-3rd timeslots of the 5th-8th E1 channels are used to transmit
network management information.
The network management channel between Site A and B still adopts SDH
overhead mode.
Based on the above analysis, the system networking diagram is illustrated
in Figure 60.
Services
Determine the
Networking
Mode
Set the Access
NE
Select ECC
Networking
Configurations

FI GURE 60 NETWORK I NG DRAWI NG
EMS
NEA
NEC NEB
155Mbit/s
SDHtransmission
network
155Mbit/s 155Mbit/s

Board Configurations
While configuring the ZXMP S200 equipment, the following two factors
should be considered.
Power voltage
ZXMP S200 supports both AC power supply and DC power supply. You
can choose the power board according to actual power supply.
In this example, all the sites use -48 V DC power supply.
Optical module type
The STM-1 optical interface of ZXMP S200 supports three types of
optical modules: S-1.1, L-1.1, and L-1.2.
Select proper optical module type according to the actual transmission
distance.
Table 97 lists the transmission distance corresponding to each optical
module type for your reference.
TAB L E 97 TRANSMI SSI ON DI STANCE FOR DI FFERENT OPTI CAL MODUL E TYPES
Optical Module Type Reference Transmission Distance
S-1.1 15 km
L-1.1 40 km
L-1.2 80 km
Note: In actual use, the transmission distance of optical modules may change
due to fiber types or line quality.
In this example, S-1.1 optical modules are used in the site A, B and C.
Then determine the equipment type and boards to be used in each site
according to the interface type. Table 98 lists the configurations of site A,
B and C.
TAB L E 98 CONFI GURATI ONS OF SI TE A, B AND C
Configuration Site A Site B Site C
Power supply voltage -48 V -48 V -48 V
Optical module type S-1.1 S-1.1 S-1.1

Configuration Site A Site B Site C
Main board type SMCxD75E SMCxD75E SMCxD75E

Installation Configurations
After equipment configurations, the installation/mounting of equipment
should be completed.
The installation configurations include the mounting of equipment,
accessories, cables and fiber pigtails, uninterrupted power supply (UPS)
for network management system, as well as DDF and ODF.
Note: For detailed installation procedure, please refer to Unitrans ZXMP
S200 (V3.00) SDH Based Multi-Service Node Equipment Installation &
Maintenance Manual.
Configurations in the EMS
After installation, networking configurations in ZXONM E300 should be
implemented for the ZXMP S200 equipment, such as services and
connections. Based on the status of an NE (equipment), online or offline,
two configuration procedures are as follows.
Create online NE
Create online NE Select the access NE Install boards (cards)
Establish connections between NEs MS protection configuration
Configure services Configure overheads Set clock source Set
orderwire Extract NCP time
Create offline NE
Create offline NE Select the access NE Install boards (cards)
Establish connections between NEs MS protection configuration
Configure services Configure overheads Set clock source Set
orderwire Change the NE status to Online Download database of
NE Extract NCP time

Note: Refer to the ZXONM E300 EMS/SNMS operation manual for detailed
operations of networking configuration.

Networking Features
In this example, the ZXMP S200 equipment and other SDH equipment
form a hybrid network, to utilize the existing network resources sufficiently.
Through the usage of E1 ECC channels, the unified network element
management to all ZXMP S200 equipment is implemented.

On the other hand, the network consisting of ZXMP S200 can be regarded
as a chain network disregarding the network topology of other SDH
equipment in the example.

This page is intentionally blank.

A p p e n d i x A
Compliant Recommendations
and Standards

The design of ZXMP S200 complies with the recommendations and
standards listed in Table 99.
TAB L E 99 COMPL I ANT RECOMMENDATI ONS AND STANDARDS
Recommendation
/Standard
Title
ITU-T G.703
Physical/electrical characteristics of hierarchical digital
interfaces
ITU-T G.704
Synchronous frame structures used at 1544, 6312, 2048,
8448 and 44736 kbit/s hierarchical levels
ITU-T G.706
Frame alignment and cyclic redundancy check (CRC)
procedures relating to basic frame structures defined in
Recommendation G.704
ITU-T G.707
Network node interface for the synchronous digital
hierarchy (SDH)
ITU-T G.773
Protocol suites for Q-interfaces for management of
transmission systems
ITU-T G.774
Synchronous digital hierarchy (SDH) management
information model for the network element view
ITU-T G.774.01
Synchronous digital hierarchy (SDH) bidirectional
performance monitoring for the network element view
ITU-T G.774.02
Synchronous digital hierarchy (SDH) configuration of the
payload structure for the network element view
ITU-T G.774.03
Synchronous digital hierarchy (SDH) management of
multiplex-section protection for the network element view
ITU-T G.774.04
Synchronous digital hierarchy (SDH) management of the
subnetwork connection protection for the network
element view
ITU-T G.774.05
connection supervision functionality (HCS/LCS) for the
network element view

Recommendation
/Standard
Title
ITU-T G.774.06
Synchronous digital hierarchy (SDH) unidirectional
performance monitoring for the network element view
ITU-T G.774.07
lower order path trace and interface labelling for the
network element view
ITU-T G.780
Terms and definitions for synchronous digital hierarchy
(SDH) networks
ITU-T G.783
Characteristics of synchronous digital hierarchy (SDH)
equipment functional blocks
ITU-T G.784 Synchronous Digital Hierarchy (SDH) management
ITU-T G.803
Architecture of transport networks based on the
ITU-T G.805 Generic functional architecture of transport networks
ITU-T G.810 Definitions and terminology for synchronization networks
ITU-T G.811 Timing characteristics of primary reference clocks
ITU-T G.812
Timing requirements of slave clocks suitable for use as
node clocks in synchronization networks
ITU-T G.813
Timing characteristics of SDH equipment slave clocks
(SEC)
ITU-T G.823
The control of jitter and wander within digital networks
which are based on 2048 kbit/s hierarchy
ITU-T G.825
The control of jitter and wander within digital networks
which are based on the synchronous digital
hierarchy(SDH)
ITU-T G.826
End-to-end error performance parameters and objectives
for international, constant bit-rate digital paths and
connections
ITU-T G.831
Management capabilities of transport networks based on
the synchronous digital hierarchy (SDH)
ITU-T G.832
Transport of SDH elements on PDH networks - Frame and
multiplexing structures
ITU-T G.841
Types and characteristics of SDH network protection
system
ITU-T G.842 Interworking of SDH network protection architectures
ITU-T G.957
Optical interfaces for equipments and systems relating to
ITU-T G.958
Digital line systems based on the synchronous digital
hierarchy for use on optical fiber cables
ITU-T K.41
Resistibility of internal interfaces of telecommunication
centers to surge voltage
ITU-T M.20 Maintenance philosophy for telecommunication networks
ITU-T M.2100
Performance limits for bringing-into-service and
maintenance of international PDH paths, sections and
transmission systems

Appendix A Compliant Recommendations and Standards
Recommendation
/Standard
Title
ITU-T M.2101
Performance limits and objectives for bringing-into-
service and maintenance of international SDH paths and
multiplex sections
ITU-T M.2120
PDH path, section and transmission system and SDH path
and multiplex section fault detection and localization
procedures
ITU-T M.3010 Principles for a telecommunications management network
ITU-T M.3400 TMN management functions
ITU-T Q.811 Lower-layer protocol frame of the Q
3
interface
ITU-T Q.812 Higher-layer protocol frame of Q
3
interface
ITU-T X.214
(ISO 8072)
Information technology - open systems interconnection -
transport service definition
ITU-T X.215
(ISO 8326)
ITU-T application - Open Systems Interconnection -
Session service definition
ITU-T X.216
(ISO 8822)
Information technology - Open Systems Interconnection -
Presentation service definition
ITU-T X.217
(ISO 8649)
ITU-T application - Open Systems Interconnection -
Service definition for the Association Control Service
Element
ITU-T X.219
(ISO IS 9072-1)
Remote Operations: Model, notation and service definition
ITU-T X.224
(ISO 8073)
Protocols and specifications for information processing
system - interconnecting of open systems - connection
orientated transmitting
ITU-T X.225
(ISO 8327)
Connection-oriented Session protocol: Protocol
specification
ITU-T X.226
(ISO 8823)
Connection-oriented Presentation protocol: Protocol
specification
ITU-T X.229
(ISO IS 9072-2)
Remote operation: Protocol specification
ITU-T X.233
Information technology - Protocol for providing the
connectionless-mode network service: Protocol
specification
ITU-T X.511
(ISO9594-3)
Information technology - Open systems interconnection -
The directory: Abstract service definition
ITU-T X.519
(ISO9594)
Information technology - Open systems interconnection -
The directory: Protocol specifications
ITU-T X.622
Information technology - Protocol for providing the
connectionless-mode network service: Provision of the
underlying service by an X.25 Subnetwork
ITU-T X.710
(ISO 9595)
Management information service definition: Public
management information service definition

Recommendation
/Standard
Title
ITU-T X.710
(ISO 9596-1)
Management information service definition: Public
management information protocol
ISO 7498
Information processing system - open systems
interconnection Basic reference model
ISO 8073/AD2
Information technology Open systems interconnection
Protocol for providing the connection-mode transport
service Amendment 2
ISO 8348
Information technology Open systems interconnection
Network service definition
ISO 8473
Information technology Protocol for providing the
connectionless-mode network service
ISO 8571.1
Information processing systems Open systems
interconnection File transfer, access and management
Part 1: General introduction
ISO 8571.2
Information processing system - Open systems
interconnection - File transfer, access and management -
Part 2: Virtual filestore definition
ISO 8571.3
Part 3: File service definition
ISO 8571.4
Part 4: File protocol specification
ISO 8648
Information processing system - Open system
interconnection - Internal organization of the network
layer
ISO 8802.2
Information technology Telecommunications and
information exchange between systems Local and
metropolitan area networks Specific requirements Part
2: Logical link control
ISO 8802.3
Information technology - Telecommunications and
information exchange between systems - Local and
metropolitan area networks Specific requirements - Part
3: Carrier sense multiple access with collision detection
(CSMA/CD) access method and physical layer
ISO 9542
Information processing system - Telecommunications and
information exchange between systems - End system to
intermediate system routing exchange protocol for use in
conjunction with the protocol for providing the
connectionless-mode network service (ISO 8473)
ISO 9545
Information technology - Open systems interconnection
Application layer structure
ISO 9546-1
interconnection - Common management information
protocol specification
ISO 10172
Interconnection - Telecom and information switching
network/transport protocol interworking specification

Appendix A Compliant Recommendations and Standards
Recommendation
/Standard
Title
ISO 10589
Information technology Telecommunications and
information exchange between systems Intermediate
system to intermediate system intra-domain touting
information exchange protocol for use in conjunction with
the protocol for providing the connectionless-mode
network service (ISO8473)
YDN 099-1998 Optical synchronous transport network technical system
YD/T 1238-2000
Technical Requirements for SDH Multi-Service Transport
Platform
YD 5083-1999
Specification for Seismic Test of Telecommunications
Equipment
GB 4943
Safety Standard of the Information and Technology
Equipment
GB 9254
Information Technology Equipment Radio Disturbance
Characteristics Limits and Methods of Measurement
GB/T 2423
Environment Experiment for Electric and Electronic
Products
GB/T 47961984
Classification of environmental parameters and their
severities of electric and electronic products
GB 7247.1-2001
Safety of Laser Products--Part 1: Equipment
Classification, Requirements and User's Guide
GB/T 17618-1998
Information technology equipment--Immunity
characteristics--Limits and methods of measurement
GB 17625.1
Electromagnetic compatibility - Limits - Limits for
harmonic current emissions (equipment input current
16A per phase
GB 17625.2
Electromagnetic compatibility Limits Limitation of voltage
fluctuations and flash in low-voltage supply systems for
equipment with rated current 16A
GB/Z 17625.3
Electromagnetic compatibility Limits Limitation of voltage
fluctuations and flash in low-voltage supply systems for
equipment with rated current >16A
GB/T 17626.2
Electromagnetic compatibility Testing and measurement
techniques Electrostatic discharge immunity test
GB/T 17626.3
Electromagnetic compatibility - Testing and measurement
techniques - Radiated, radio-frequency, electromagnetic
field immunity test
GB/T 17626.4
techniques - Electrical fast transient/burst immunity test
GB/T 17626.5
techniques - Surge immunity test
GB/T 17626.6
techniques-Immunity tl conducted disturbances, induced
by radio - frequency fields
GB/T 17626.8
techniques - Power frequency magnetic field immunity
test

Recommendation
/Standard
Title
GB/T 17626.11
techniques Voltage dips, short interruptions and voltage
variations immunity tests
GJB/Z 299B-1998 Reliability Prediction of Electronic Equipment

A p p e n d i x B
Abbreviations

Abbreviation Full Name
A
ADM Add-Drop Multiplexer
ADSL Asymmetrical Digital Subscriber Line
ALS Automatic Laser Shutdown
AMI Alternate Mark Inversion
APS Automatic Protection Switching
ATM Asynchronous Transfer Mode
AU-n Administrative Unit, level n
AUG Administrative Unit Group
B
BBE Background Block Error
BER Bit Error
BITS Building Integrated Timing Supply
B8ZS Bipolar with 8-Zero Substitution
B3ZS Bipolar with 3-Zero Substitution
C
CDMA Code Division Multiple Access
Corba Common object request broker architecture
CMI Code Mark Inversion
CV Coding Violation
D
DCC Data Communications Channel
DDF Digital Distribution Frame
DWDM Dense Wavelength Division Multiplexing
E
ECC Embedded Control Channel
EFT Electrical Fast Transient

EPL Ethernet Private Line
EPLAN Ethernet Private Local Area Network
ETSI European Telecommunications Standards Institute
EUT Equipment Under Test
EVPL Ethernet Virtual Private Line
EVPLAN Ethernet Virtual Private Local Area Network
ES Errored Second
ESD Electro-Static Discharge immunity
F
FE Fast Ethernet
FEBBE Far End Background Block Error
FEES Far End Errored Second
FESES Far End Severely Errored Second
G
GFP Generic Framing Protocol
GNE Gateway Network Element
GUI Graphical User Interface
GSM Global System for Mobile communications
H
HDB3 High Density Bipolar of order 3
HDLC High level Digial Link Control
I
IC Integrated Circuit.
IEC International Electrotechnical Commission
IGMP Internet Group Management Protocol
IP Internet Protocol
ITU-T
International Telecommunication
Union-Telecommunication Standardization Sector
IVL Independent VLAN Learning
L
LAN Local Area Network
LACP Link Aggregation Control Protocol
LCAS Link Capacity Adjustment Scheme
LCT Local Craft Terminal
LST Link Status Transport
LOS Loss Of Signal
M

Appendix B Abbreviations
MAC Media Access Control
MCU Micro Control Unit
MSOH Multiplex Section OverHead
MS-PSC Multiplex Section - Protection Switching Count
MS-PSD Multiplex Section - Protection Switching Duration
MTBCF Mean Time Between Critical Failures
MTBF Mean Time Between Failures
N
NE Network Element
O
ODF Optical fiber Distribution Frame
P
PCB Printed Circuit Board
PCM Pulse Code Modulation
PDH Plesiochronous Digital Hierarchy
PGND Protection GND
PJE+ Positive Pointer Justification Event
PJE- Negative Pointer Justification Event
PPP Point-to-Point Protocol
PRBS Pseudo Random Binary Sequence
PSD Power Spectral Density
PSTN Public Switched Telephone Network
R
REG Regenerator
S
SDH Synchronous Digital Hierarchy
SD Signal Degrade
SES Severely Errored Second
SFP Small Form Factor Pluggable
SF Signal Failure
SHDSL Single-pair High-bit-rate Digital Subscriber Line
SMCC Sub-network Management Control Center
SNC (I) Sub-Network Connection Protection with Inherent monitoring
SNC (N)
Sub-Network Connection Protection with Non-intrusive
monitoring
SSM Synchronization Status Message
STM-N Synchronous Transport Module, level N (N=1, 4, 16, 64)

STU SHDSL Transceiver Unit
STU-C STU-Central Office
T
TCP Transfer Control Protocol
TDM Time Division Multiplexing
TM Terminal Multiplexer
TRK Trunk
TU-m Tributary Unit, level m
TUG-m Tributary Unit Group, level m
U
UAS Unavailable Second
UPS Uninterrupted Power Supply
V
VC-n Virtual Container, level n
VCXO Voltage Control Crystal Oscillator
VDSL Very-high-bit-rate Digital Subscriber Line
VLAN Virtual Local Area Network

Figures

Figure 1 ZTEs Unitrans ZXMP Family ............................................................ 1
Figure 2 Front View of ZXMP S200................................................................ 2
Figure 3 Structure of ZXMP S200.................................................................. 3
Figure 4 Relationships Between Functional Units in ZXMP S200......................... 4
Figure 5 Hierarchical Structure of ZXONM E300 .............................................. 5
Figure 6 Mapping/Multiplexing Structure of ZXMP S200...................................11
Figure 7 Outline and Structure of ZXMP S200................................................15
Figure 8 Structure of the Fan Module ...........................................................16
Figure 9 Structure of the Power Module (PWA) ..............................................17
Figure 10 Operating Principle of SMC Board ..................................................23
Figure 11 Operating Principle of the NCP Unit ................................................24
Figure 12 Operating Principle of the Optical Interface Unit...............................27
Figure 13 Operating Principle of the STM-1 Electrical Interface Unit ..................29
Figure 14 Operating Principle of Tributary Unit ..............................................30
Figure 15 Operating Principle of the Ethernet Interface Unit.............................32
Figure 16 Operating Principle of the Clock Unit ..............................................35
Figure 17 Operating Principle of the Micro Control Unit ...................................36
Figure 18 Operating Principle of SMB Board ..................................................37
Figure 19 Operating Principle of NCP Unit .....................................................38
Figure 20 Operating Principle of the Optical Interface Unit...............................41
Figure 21 Operating Principle of E1/T1 Tributary Unit .....................................43
Figure 22 Operating Principle of E3/T3 Tributary Unit .....................................44
Figure 23 Operating Principle of the Ethernet Interface Unit.............................46
Figure 24 Operating Principle of the Clock Unit ..............................................49
Figure 25 Operating Principle of the Micro Control Unit ...................................50
Figure 26 Front Panel of the Main Board (SMCxF75T) .....................................50
Figure 27 Operating Principle of the PWA/PWB Module....................................54
Figure 28 Front Panel of the PWA Board .......................................................55
Figure 29 Front Panel of the PWB Board .......................................................57
Figure 30 Operating Principle of the PWC Module ...........................................59
Figure 31 Front Panel of the PWC Module......................................................60
Figure 32 Operating Principle of the V35B Board............................................61
Figure 33 Front Panel of the V35B Board ......................................................62
Figure 34 Operating Principle of the E1/T1 Electrical Tributary Board ................63
Figure 35 Front Panel of the Electrical Tributary Board (ET1-75 Board)..............64
Figure 36 Front Panel of the EIE3 Board .......................................................66
Figure 37 Front Panel of the TFEx4 Board .....................................................68
Figure 38 Front Panel of the TFEx4B Board ...................................................70
Figure 39 Operating Principle of the AI Board ................................................71
Figure 40 Front Panel of AI Board................................................................72
Figure 41 Operating Principle of the OW Board ..............................................75
Figure 42 Front Panel of the OW Board.........................................................75
Figure 43 Front Panel of the SEC Board ........................................................79
Figure 44 Operating Principle of the SDB Board .............................................81
Figure 45 Front Panel of the SDB Board........................................................81
Figure 46 Power Supply Lightning Protection Connection in a Far-End Equipment
Room................................................................................................92
Figure 47 Eye Pattern of Optical Launched Signals ....................................... 101
Figure 48 ZXMP S200 as a Terminal Multiplexer (TM) ...................................111
Figure 49 ZXMP S200 as an Add/Drop Multiplexer (ADM) .............................. 112
Figure 50 ZXMP S200 as a Regenerator (REG)............................................. 112

Figure 51 Networking Modes of ZXMP S200................................................. 113
Figure 52 Point-to-Point Networking of ZXMP S200 ...................................... 113
Figure 53 Chain Networking of ZXMP S200 ................................................. 113
Figure 54 Ring Networking of ZXMP S200 ................................................... 114
Figure 55 Topology of Networking Example................................................. 120
Figure 56 Networking Drawing .................................................................. 121

Tables

Table 1 Chapter and Appendix Summary ........................................................ i
Table 2 Typographical Conventions...............................................................iii
Table 3 Mouse Operation Conventions...........................................................iii
Table 4 Interfaces in a Network Management System...................................... 7
Table 5 Cross-connect Capacity of ZXMP S200................................................ 8
Table 6 Service Interfaces Provided by ZXMP S200 (SMB)................................ 8
Table 7 Service Interfaces Provided by ZXMP S200 (SMC)................................ 9
Table 8 MS Protection Modes Supported by ZXMP S200 ..................................11
Table 9 Alarms Triggering SNC Protection Switching.......................................12
Table 10 Board List of ZXMP S200 ...............................................................17
Table 11 List of SMC Main Boards ................................................................19
Table 12 List of SMB Boards .......................................................................21
Table 13 Differences between SMB Board and SMC Board ...............................22
Table 14 Functions of Modules in the NCP.....................................................24
Table 15 Overheads Processed by Optical Interface Unit .................................26
Table 16 Functions of Modules in the Optical Interface Unit .............................27
Table 17 Overheads Processed by STM-1 Electrical Interface Unit.....................28
Table 18 Functions of Modules in the Electrical Interface Unit ..........................29
Table 19 Functions of Modules in Tributary Unit .............................................31
Table 20 Descriptions of Virtual Concatenation Group.....................................32
Table 21 Functions of Modules in the Ethernet Interface Unit ...........................33
Table 22 Functions of Modules in the Micro Control Unit ..................................36
Table 23 Functions of Modules in NCP Unit ....................................................39
Table 24 Overheads Processed by Optical Interface Unit .................................40
Table 25 Functions of Modules in the Optical Interface Unit .............................41
Table 26 Functions of Modules in E1/T1 Tributary Unit ....................................43
Table 27 Functions of Modules in E3/T3 Tributary Unit ....................................44
Table 28 Description of Virtual Concatenation Group ......................................45
Table 29 Functions of Modules in the Ethernet Interface Unit ...........................46
Table 30 Functions of Modules in the Micro Control Unit ..................................50
Table 31 Components on the Front Panel of Main Board..................................51
Table 32 Units in the PWA/PWB Board..........................................................55
Table 33 Components on the Front Panel of PWA Board ..................................55
Table 34 Components on the Front Panel of PWB Board ..................................57
Table 35 Units in the PWC Module ...............................................................59
Table 36 Components on the Front Panel of the PWC Module...........................60
Table 37 Units in the V35B Board ................................................................61
Table 38 Components on the Front Panel of V35B Board .................................62
Table 39 Relations Between E1/T1 Electrical Tributary Board and ID.................63
Table 40 Functions of Units in the E1/T1 Electrical Tributary Board...................64
Table 41 Components on the Front Panel of ET1 Board ...................................64
Table 42 Descriptions of Components on the Front Panel of EIE3 Board.............66
Table 43 Components on the Front Panel of TFEx4 Board................................68
Table 44 Components on the Front Panel of TFEx4B Board ..............................70
Table 45 Positions of the Used Overhead Bytes in the SDH Frame .....................71
Table 46 Functions of Units in the AI Board...................................................72
Table 47 Components on the Front Panel of AI Board .....................................72
Table 48 Signal Definitions of Pins in the Audio Interface ................................73

Table 49 Positions of the Idle Overhead Bytes Used to Carry the Low-Speed Data
Service..............................................................................................74
Table 50 Units in the OW Board...................................................................75
Table 51 Components on the Front Panel of OW Board ...................................76
Table 52 Signal Definitions of Pins in RS232/RS485/RS422 Interface ................76
Table 53 Components on the Front Panel of SEC Board...................................79
Table 54 Units in the SDB Board..................................................................81
Table 55 Components on the Front Panel of SDB Board ..................................81
Table 56 Dimensions & Weight of Components in ZXMP S200 ..........................84
Table 57 Allowable Voltage Fluctuation Range of ZXMP S200 ...........................85
Table 58 Power Consumption and Weight of Each Board Available for ZXMP S200
........................................................................................................85
Table 59 Power Consumption for the Typical Configuration of ZXMP S200 (SMB) 88
Table 60 Maximum Power Consumption of ZXMP S200 (SMB) ..........................89
Table 61 Power Consumption for the Typical Configuration of ZXMP S200 (SMC) 89
Table 62 Maximum Power Consumption of ZXMP S200 (SMC)..........................89
Table 63 Grounding Resistance Requirements in Independent Grounding Mode ..90
Table 64 Typical Power Supply Lightning Protection Classification.....................91
Table 65 Temperature and Humidity Requirements of ZXMP S200....................94
Table 66 Requirements for Concentration of Harmful Gas in Equipment Room....95
Table 67 Application Environment Requirements of ZXMP S200........................95
Table 68 Reliability Indexes of ZXMP S200....................................................96
Table 69 ESD Immunity Indices ..................................................................97
Table 70 Radiated Susceptibility Indices .......................................................97
Table 71 EFT Immunity Indices on DC Power Supply Ports ..............................97
Table 72 EFT Immunity Indices on Signal and Control Ports.............................97
Table 73 EFT Immunity Indices on AC Power Supply Ports...............................98
Table 74 DC Power Supply Lightning Surge Immunity Indices..........................98
Table 75 AC Power Supply Lightning Surge Immunity Indices ..........................98
Table 76 Outdoor Signal Line Surge Immunity Indices ....................................98
Table 77 Signal Line Surge Immunity Indices ................................................99
Table 78 Conducted Susceptibility Indices......................................................99
Table 79 AC Voltage Transient Dropout Immunity Indices ...............................99
Table 80 Conducted Emission Indices AT DC/AC Power Ports ......................... 100
Table 81 Conducted Emission Indices at Communication/Control Ports............ 100
Table 82 Radiated Emission Indices of ZXMP S200 ....................................... 100
Table 83 Parameters of Transmitting Signal Eye Pattern ............................... 101
Table 84 Specifications of STM-1 Optical Interfaces...................................... 101
Table 85 Specification of STM-4 Optical Interfaces ....................................... 102
Table 86 Specifications of STM-4 Single Fiber with Dual Directions Optical
Interfaces........................................................................................ 103
Table 87 Specifications of 100 Mbit/s Ethernet Optical Interfaces .................... 103
Table 88 Specifications of STM-1 Electrical Interfaces .................................... 104
Table 89 Specifications of E1 Electrical Interfaces ......................................... 105
Table 90 Specification of T1 Electrical Interfaces.......................................... 105
Table 91 Specification of E3 Electrical Interfaces.......................................... 106
Table 92 Specification of T3 Electrical Interfaces.......................................... 107
Table 93 MTIE Limit in Locked Mode (with Constant Temperature) ................. 108
Table 94 MTIE Limit in Locked Mode (with Temperature Effects) .................... 108
Table 95 TDEV Limit in Locked Mode (with Constant Temperature) ................. 109
Table 96 Standards of Interfaces Provided by ZXMP S200 ............................. 109
Table 97 Transmission Distance for Different Optical Module Types................. 121
Table 98 Configurations of Site A, B and C.................................................. 121
Table 99 Compliant Recommendations and Standards .................................. 125

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SDH Based Multi-Service Node Equipment

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