TD Line Schrack

Integral X-LINE Length Calculation
Technical Documentation
Version 1.3

Technical Documentation Integral X-LINE Length Calculation

B-TD-X-LINE-Laenge-EN_V1-3.doc SE / M. Riemer
Page 2 (12)

Table of Contents
1 Notes about versions............................................................................................................................. 3
2 General .................................................................................................................................................... 3
3 Operating Modes of a BMZ Integral Loop Module: ............................................................................. 4
3.1 DAI-compatible operating modes (DAI) ........................................................................................... 4
3.2 X-Line Operating Mode "Long Range" (LRX) .................................................................................. 4
3.3 X-Line Operating Modes "High Power" (HPX) ................................................................................. 4
4 Wiring length with the permissible voltage drop:............................................................................... 5
4.1 Calculation for Condition 1............................................................................................................... 5
5 Wiring length above the minimum short circuit current: ................................................................... 6
5.1 Calculation for Condition 2............................................................................................................... 6
6 Guaranteed and typical loop lengths ................................................................................................... 7
6.1 Measuring of the loop resistance ..................................................................................................... 7
7 Additional conditions for correct loop configuration:........................................................................ 7
7.1 Observance of the maximum device current ................................................................................... 7
7.2 Maximum quantity of Slaves on a Loop/Stub Line........................................................................... 7
7.3 Detector Equivalence....................................................................................................................... 8
7.4 Power consumption of modules with parallel indicator .................................................................... 8
8 LLC Parameters of the supported DAI loop devices: ....................................................................... 10
9 Appendix: Examples............................................................................................................................ 12
10 Document History................................................................................................................................. 12


B-TD-X-LINE-Laenge-EN_V1-3.doc
SE / M. Riemer
Page 3 (12)

1 Notes about versions

The version of the length calculation described herein describes version 7.2.x of the BMZ
Integral software packs.

2 General
To ensure the safe operation of a loop/stub of the BMZ Integral loop technology, the following conditions
must be satisfied:
Condition 1 - permissible voltage drop:
In the event of a wire break on the loop, no device is allowed to fail. The voltage drop over line resis-
tance Rx1 for the maximum permissible loop length may therefore only be so large as a maximum that
the remaining loop voltage after the last device Uout is higher than the minimum supply voltage of the
critical device (device with the highest Umin).
Condition 2 - short circuit current detection:
Line resistance Rx2 of the maximum permissible loop length is only allowed to be so large that the short
circuit current threshold in the event of a short circuit is also reached in the move unfavourable operating
case, thereby ensuring that a correct short circuit isolation occurs.
Other conditions
o Max. operating current:
The operating current of the installed devices may not exceed the thresholds listed hereafter, to
guarantee the loop function in every possible (and permissible) operating state of the devices
(modulation current, charging current of relay modules, sirens activated etc.)
o Alarm Current Pool for Optical Indicators
from version 7.2.x of the software, the software of the loop circuit module contains an "intelligent"
power management system, which automatically limits the number of simultaneously activated
LEDs based on the power consumption of the devices and a current limit that can be programmed
for each loop.
o Power consumption for acoustic indicators
A loop generally must be planned in such a way that all sirens can be simultaneously actuated.
For this the reason the activation current of these devices is added in full to the operating current.
o Observation of detector equivalence:
Controller modules have a detector equivalence (MeQ) based on their physical characteristics
(input impedance, power consumption) in their specification expressed as a multiple of the num-
ber of detectors, so that where there is an MeQ of 4 then a module is the equivalent of 4 detectors
(exceptions: RGW=5 and AIM=8).
The total number of controller modules and detectors based on their MeQ may not exceed the
permitted number of devices on the loop.

SE / M. Riemer
Page 4 (12)

3 Operating Modes of a BMZ Integral Loop Module:
3.1 DAI-compatible operating modes (DAI)
In the event that there is at least one detector or module on the loop circuit which is not X-Line compatible
and/or a DAI module irrespective of the number of connected detectors or modules, then the loop length is
calculated in accordance with the restrictions that apply for DAI operation.
Both loop operation, with power supplied from both sides, and stub line operation is possible.
For this operating mode the thresholds for loop technology (max. 128 detectors, max. 2,000m length) apply
and it is compatible with the loop length calculation for version 6.x of the software.

3.2 X-Line Operating Mode "Long Range" (LRX)
This operating mode is only possible on DXI modules and only using X-Line detectors or modules, which
have been equipped for a maximum of 250 modules (or the equivalent number of modules) on loops up to
3,500m in length. The equivalence factors of modules are higher, so therefore fewer modules can be con-
nected.
Only the following types of cable listed hereafter are permitted for "LRX" mode:
1x2 x 0.8mm twisted and shielded
2x2 x 0.8mm stranded in layers and shielded (standard cable D)

3.3 X-Line Operating Modes "High Power" (HPX)
This operating mode is only possible when using DXI modules and X-Line detectors or modules and is set
up in such a way to make the maximum operating current of 170mA available for devices. The HPX mode
is not configured, but is activated when the detector equivalence (see section 7.3) is exceeded in LRX
mode.
A loop length of a maximum 1,500m in length can be used for this operating mode.

For the "HPX" mode, cable types with the following specification are also permissible due to the lower loop
length:
max. 4 cores
shielded
Diameter >= 0.6 <=1 mm
Operating capacitance <= 200 nF / km

SE / M. Riemer
Page 5 (12)

4 Wiring length with the permissible voltage drop:
Being calculated is that Rx = the maximum permissible line resistance from the loop interface to the last
device including the longer supply line and from the line resistance maximum supply line, in which the
power at the last device Uout the minimum power Umin for the device with the highest minimum operat-
ing voltage.

The worst possible case is used in the calculation. This condition is therefore the same for a loop or a stub
line.
Rown
gesucht !
Uin Uout
Rx
Rt1
It1
Rt1 Rt2
It2
Rt2
Imod Iled
Rtn
Itn
Rtn

Output values DAI DXI Unit
Uin Output voltage to terminals LxCx = 27 V 27 29 [V]
Rown Internal resistance of the module 18.6 15.5 []
Imod Modulation current of device responses 25 25 [mA]
Rt Half internal series resistance of the device
Typ. 0.3 ... 0.35
module dependent
1

[]
It Power consumption of the device, the active current be-
ing counted for acoustic devices and indicators.
module dependent
[mA]
IAL Alarm current pool for LED and optical PIN, which the
module uses power management to manage. The default
value is 12 mA
7
IAL
70
7
IAL
80

[mA]
ILED Power consumption of the device on the loop with the
highest current uptake
Typ. 0.3 ... 6
module dependent
[mA]
Umin Minimum voltage of the critical device (module depend-
ent)
15 12 [V]

4.1 Calculation for Condition 1
AL
n
tn SUM
I I I I + + =
mod
1
= highest total current of all loop or stub line devices
=
n
tn SUM
R R
1
2 = total of the internal resistances of all devices
( )
own sum sum in x
R R I U U U + =
min
= maximum permitted drop on the line
sum
X
X
I
V U
R
] [
1
= = maximum permitted line resistance in the "worst case".
In the event of a "typical" loop length calculation this value can be multiplied by 1.5 (this takes into consid-
eration: the feed line is a maximum of 1/3 of the loop length, and then the modules are evenly (equidis-
tantly) distributed. A safety coefficient of approximately 10% is taken into consideration.
2
] [ * 56 * ] [
2
1
1
mm A R
L
X

= = max. wiring length [m], A ... conductor cross section of the loop cable

For module dependent parameters, also known as LLC parameters, see chapter 6
1


SE / M. Riemer
Page 6 (12)

5 Wiring length above the minimum short circuit current:

a) Loop, supplied from both sides
Rown Rown
gesucht ! gesucht !
Uin Uin
Rt1
IKS1
IKS1
Rtn
It1 Itn
Rt1 Rtn Rt2
It2
Rt2 Rtn/2 Rtn/2
Rt +1 n/2
Itn/2 Itn/2+1

The minimum short circuit current occurs in the event of a short circuit in the middle of the loop
(=middle of the cabling)
The current of the devices may not be calculated at the same time as this as as a result of the short
circuit (=OV!) the voltage for a large number of the devices falls below Umin and current uptake is
not guaranteed
b) Stub
Rown
Rown
gesucht !
Uin
L1C1
Uin
L2C2
Rt1
Rt1
IKS1
It
It1
It1
Rt1
Rt1
Rt2
Rt2
It2
It2
Rt2
Rt2
Rtn
Rtn
Rtn
Rtn
Itn
Itn

The minimum short circuit current occurs in the event of a short circuit at the end of the wire
Depending on the construction the respective two stub lines have a common current measurement,
and the currents are added to one another.
Every stub line must detect the short circuit regardless of the operating state of the second stub
line, i.e. also in the event of a disablement or wire break on the second stub line (It =0)

5.1 Calculation for Condition 2
Output values : DAI DXI Unit
I
KS
Short circuit current: [mA]
I
KS_SW
Software-based short circuit current threshold
of the module
120 135 [mA]

= = = 225
120
27 27
_
_
mA
V
I
V
R
SW KS
DAI KS
= = = 215
135
29 29
_
_
mA
V
I
V
R
SW KS
DXI KS

OWN Ring X
R
R
R R -
2
- 2
SUM
I * KS_D _
=
OWN I D KS Stich X
R R R R - -
SUM * _ _
=
2
56
2
2
A R
L
X

= = max. wiring length [m], with A ... Conductor cross section [mm]


SE / M. Riemer
Page 7 (12)

6 Guaranteed and typical loop lengths
The guaranteed loop length is the length at which the devices function regardless of their position. For a
typical construction 1/3 of the length is calculated for the supply line and an equidistant distribution across
the remaining 2/3 of the loop. The following lengths in metres result:
=
2 condition with accordance in n Calculatio
mode operating to according length maximum 1500 / 2000 / 3500
min
2
1 max
L
L L
=
1 condition with accordance in n Calculatio 5 , 1 *
mode operating to according length maximum 1500 / 2000 / 3500
min
2
1 max,
L
L L
typ

6.1 Measuring of the loop resistance
The line resistance can be determined by measuring the resistance of the C-core, with approximately the
following relationship applies:
2
Rx
Rcc =
In the Integral Application Center up from 7.3, the calculated line resistance Rccmax is shown, which is
easily to compare with with the measured line resitance (C-C).

7 Additional conditions for correct loop configuration:
7.1 Observance of the maximum device current
lim
I current limit of the loop circuit card (dependent on operating mode)
) (
lim AL tn
I I I +

For modules with energy storage (e.g. relay modules) a sufficient charging current reserve must be avail-
able.

DAI (B3-DAI2, B4-BCU*, B4-DAI2)
90 mA in the loop
60 mA in the loop with energy storage
2

45 mA in the stub line
30 mA in the stub line with energy storage
DXI (B5-DXI2, B6-BCU, )
170 mA in the loop
140 mA in the loop with energy storage
85 mA in the stub line
70 mA in the stub line with energy storage

7.2 Maximum quantity of Slaves on a Loop/Stub Line
Dependent on which module type (DAI2 or DXI2) the loop/stub line is, there are different threshold values.

2
Modules with charging capacitors are defined in the table LLC Parameters in Chapter 8

SE / M. Riemer
Page 8 (12)

Loop Line
DAI2 DXI2 (LRX, HPX) DAI2 DXI2 (LRX, HPX)
128 250 64 64

The maximum number of slave units given for the DXI2 only applies if all the slaves on the loop/line corre-
spond to the Extended SecuriLine specification. Even if there is only a single slave on the loop/line, which
does not conform to this specification, then the maximum total quantity of slaves is the same as if a DAI2
type module is being used. The types of slave unit that are compatible with Extended Securiline can be
found in the table in chapter 8.
7.3 Detector Equivalence
The overall total of all I/O modules is also dependent on the operating mode.
The cumulative total calculated in terms of detector equivalence may not exceed a maximum of 128 de-
vices in the case of a DAI2, and for a DXI loop (LRX, HPX) with X-Line peripherals a maximum of 256 de-
vices. In stub line operation a value of half this amount applies.

Loop Line
DAI2 DXI2 (LRX, HPX) DAI2 DXI2 (LRX, HPX)
128 256 64 128

It should, however, be noted that the addressing range of the X-Line protocol permits a maximum of 250
addresses and therefore this number of maximum physical devices.
For the DAI and "HPX" operating modes the MeQ standard factor applies, while the higher value MeQ-X
applies for the LRX mode.

7.4 Power consumption of modules with parallel indicator
Modules which have a parallel indicator output have a variable power consumption, dependent on whether
the parallel indicator is configured as an acoustic parallel indicator or not. The following table shows the
modules concerned and their respective power consumption. Function 0 corresponds to a configuration
without an acoustic parallel indicator and function 1 to an acoustic parallel indicator. Moreover, it should
also be ensured that in function 1 of the module that the device current of the parallel indicator in the con-
figuration must be added to the value contained the table.
If in function 0 two or more values are given, then it means that this type of slave has a different quiescent
current consumption depending on the release version of the slave. Two slave types (MTD533 and
MTD533X) also possess additional functions, as the power consumption of the parallel indicator can be
configured on these. In function 1 to 3 the current given in function 0 must be added.
Power Consumption [uA] Slave
type
Description
Function 0 Function 1 Function 2 Function 3
7 MCP (in input function) 250/500 F0 + 8500
14 SDI81 400 F0 + 8500
18 STD531 250 F0 + 9200
26 SDI82/1 400 F0 + 8500
29 MTD533 250/400 F0 + 8000
(AI = 0 -> 5mA)
F0 + 2900
(AI = 1 -> 2mA)

36 MTD533X 120 F0 + 6600
(AI = 0 -> 5mA)
F0 + 1600
(AI = 1 -> 1mA)
F0 + 400
(AI = 2 -> 0.1mA)
37 SDI82X 245 F0 + 8500
38 MCPX (in input function) 245 F0 + 2100
39 SDI81X 245 F0 + 8500
40 SDI81/1 400 F0 + 8500

SE / M. Riemer
Page 9 (12)

Predefined parallel indicators:
Description Function Alarm current
[uA]
Device current
[uA]
BX-API Loud 100 4000
BX-API Quiet 100 2000
When using a BX-API a minimum voltage Umin = 15 V is required. This is to be observed in the wiring
length calculation in accordance with condition 1. A minimum supply voltage of Umin = 15V is also valid,
if the option output A5 of MTD 533X to 6,8V is active.

SE / M. Riemer
Page 10 (12)

8 LLC Parameters of the supported DAI loop devices:
The following table contains a list of all supported devices. The name describes the relevant basic type.
The precise labelling of the devices can be found in the DAI2 specification (DAI2.doc).
Name Release Cur-
rent
Rt Umin MeQ MeQ-X Energy
Storage
Count
X-TN
[mA] [] [V]
SSDxxx 1 0.830 0.3 15 1 no yes no
2-7.16-18 0.250 0.3 15 1 no yes no
16 0.400 0.3 15 1 no yes no
17-18 0.250 0.3 15 1 no yes no
1-2 0.830 0.3 15 1 no yes no
3-4 0.150 0.3 15 1 no yes no
16 0.370 0.3 15 1 no yes no
17 0.220 0.3 15 1 no yes no
UTDxxx-1
18 0.220 0.3 15 1 no yes no
1-2 0.830 0.3 15 1 no yes no
3-4 0.150 0.3 15 1 no yes no
16 0.370 0.3 15 1 no yes no
17 0.220 0.3 15 1 no yes no
UTDxxx-2
18 0.220 0.3 15 1 no yes no
1-2 0.830 0.3 15 1 no yes no
3-4 0.150 0.3 15 1 no yes no
16 0370 0.3 15 1 no yes no
17 0.220 0.3 15 1 no yes no
UTDxxx-3
18 0.220 0.3 15 1 no yes no
1-4 0.250 0.3 15 1 no yes no
5.7 0.250 0.3 15 1 no yes no
6 0.500 0.3 15 1 no yes no
MCP
16,32,48 0.245 0.3 12 1 no yes no
BA-OI2 0.550 0.35 15 4 yes yes no
COM81 0.500 0.35 15 4 no yes no
BA-AIM 1-2, 16-18 1.800 0.35 20 5 no yes no
BA-AIM(opt) 1-2, 16-18 9.000 0.35 20 12 no yes no
BA-OI3 1-4 0.600 0.35 15 4 yes yes no
16 0.550 0.35 12 4 yes yes no
SDI81 1-5, 16 0.400 0.35 15 1 no yes no
BA-RGW 1-5, 16 0.950 0.35 15 4 no no no
DOW 0.050 0 15 1 1 no yes no
BA-REL4 1-2, 16 0.600 0.35 15 4 yes yes no
1-3 0.250 0.3 15 1 no yes no
16 0.400 0.3 15 1 no yes no
17 0.250 0.3 15 1 no yes no
STD531
32 0.400 0.3 15 1 no yes no
BA-IOM 1-4, 16 0.450 0.35 15 4 no yes no
BA-IM4 1-2, 16 0.370 0.35 15 4 no yes no
SMF 0.050 0 15 1 1 no yes no
1 0.300 0.3 15 4 no yes no ASD5xx-1
16.32 0.900 0.3 15 4 no yes no
1 0.300 0.3 15 4 no yes no ASD5xx-2
16 0.900 0.3 15 4 no yes no
1 0.300 0.3 15 4 no yes no ASD5xx-3
16.32 0.900 0.3 15 4 no yes no


SE / M. Riemer
Page 11 (12)

Name Release Cur-
rent
RD Umin MeQ MeQ-X Energy
Storage
Count
X-TN
[mA] [] [V]
SDI82/1 1 0.400 0.35 15 1 no yes no
1,32,48 2.400 0.35 15 4 no yes no BA-SOL
16 2.000 0.35 15 4 no yes no
1,32,48 4.800 0.35 15 8 no yes no BA-SOL(hi)
16 4.000 0.35 15 8 no yes no
BA-FOL 1.16 6.450 0.35 15 4 no yes no
1 0.400 0.3 15 1 no yes no
2 0.250 0.3 15 1 no yes no
MTD533
17 0.250 0.3 15 1 no yes no
SDI81/1 1 0.400 0.3 15 1 no yes no

The following table contains a listing of the X-devices.
Name Release Current RD Umin MeQ MeQ-X Energy
Storage
Count
X-TN
[mA] [] [V]
BX-OI3 1 0.550 0.35 12 4 8 yes yes yes
BX-RGW 1 0.950 0.35 12 4 8 no yes yes
BX-REL4 1 0.510 0.35 12 4 8 yes yes yes
1 2.500 0.35 12 4 8 no yes yes BX-SOL
17 2.500 0.35 12 4 8 no yes yes
1 5.100 0.35 12 8 16 no yes yes BX-SOL(hi)
17 5.100 0.35 12 8 16 no yes yes
BX-FOL 1 3.700 0.35 12 4 8 no yes yes
BX-ESL 1 1.300 0.35 12 4 8 yes yes yes
MTD533X 1 0.120 0.3 12 1 1 no yes yes
SDI82X 1 0.245 0.3 12 1 1 no yes yes
1 0.090 0.3 12 1 1 no yes yes MCPX
17 0.090 0.3 12 1 1 no yes yes
SDI81X 1 0.245 0.3 12 1 1 no yes Yes
BX-AIM 1-3 1.800 0.35 20 5 10 no yes yes
BXAIM(IO) 1-3 1.800 0.35 12 4 8 no yes yes
BXAIM(opt) 1-3 9.000 0.35 20 12 24 no yes yes
BX-IM4 1 0.450 0.35 12 4 8 yes yes yes
BX-IOM 1 0.430 0.35 12 4 8 no yes Yes
BX-O2I4 1 0.700 0.35 12 4 8 Yes Yes Yes
BX-O1 1 0,480 0,35 12 4 8 Ja Ja Ja
BX-I2 1 0,460 0,35 12 4 8 Ja Ja Ja
CMD533X 1 0,150 0,3 12 1 1 Nein Ja Ja
XLM35 1 0,200 0,3 12 1 1 Nein Ja Ja
ASD535-1/3 1 0,200 0,3 12 1 1 Nein Ja Ja
ASD535-2/4 1 0,200 0,3 12 1 1 Nein Ja Ja
SFD 1 0,200 0,3 12 1 1 Nein Ja Ja
BX-SOL-CT 1 2,9 0,35 16 4 8 Ja Ja Ja
BX-SOL-
CT(hi)
1 5,2 0,35 16 4 8 Ja Ja Ja
MTD533X-S


SE / M. Riemer
Page 12 (12)

9 Appendix: Examples
Example Type Mode Alarm
Cur-
rent
Extending the Sys-
tem
Status Mode Lengt
h
Rl
[mA] [m] [Ohm]
1 DXI Loop 20 250 MTD533X OK X-Line 861 30.58
3 DXI Line 20 64 MTD533X OK X-Line 2265 80.86
63 MTD533X 4 DAI Line 20
1 BX.OI3
OK DAI 2000
5 DAI Line 22
63
1
MTD533X
BX.OI3
power con-
sumption
exceeded
DAI -
7 DXI Loop 20
190
10
MTD533X
MTD533X+API
OK X-Line 212 7,52
8 DAI Loop 20
120
2
MTD533X
BX-SOL quiet
OK DAI 1983 70.46
9 DXI Loop 20
120
2
MTD533X
BX-SOL quiet
OK DXI 2464 87.54
10 DXI Loop 10
120
30
MTD533X
BX-SOL quiet
OK HPX 396 14.08
11 DXI Loop 10
120
25
5
MTD533X
BX-SOL quiet
BX-SOL loud
MeQ ex-
ceeded
HPX 214 7.61

10 Document History
Version Date Most important changes compared to the previous ver-
sion
1.0 13.08.2010 New edition based on the document "Technical Documenta-
tion Loop Length Calculation" by Franz Huber
1.1 21.01.2011 Updated: LRX and HPX operating modes, detector equiva-
lence
New module: BX-O2I4
Calculation of typical loop length
Power consumption updated, extended to include information
about the parallel indicator (BX-API)
Examples added
1.2 30.05.2011 Extended to include the minimum voltage of a BX-API
Default value for the alarm current pool decreased from
13mA to 12 mA.
1.3 16.04.2012 Minimum voltage defined at MTD533X with 6.8V output A5.
New Modules: BX-O1, BX-I2, CMD533X, XLM35, ASD535-
1/3, ASD535-2/4, SFD, BX-SOL-CT, MTD533X-S
Measureing of line resistance added.

TD Line Schrack

Transféré par

Informations du document

Description originale:

Titre original

Copyright

Formats disponibles

Partager ce document

Partager ou intégrer le document

Options de partage

Avez-vous trouvé ce document utile ?

Ce contenu est-il inapproprié ?

Droits d'auteur :

Formats disponibles

TD Line Schrack

Transféré par

Droits d'auteur :

Formats disponibles

Integral X-LINE Length Calculation

Vous aimerez peut-être aussi