Académique Documents
Professionnel Documents
Culture Documents
Data Sheet
duagon
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Document history
Rev.
1
2
3
4
5
6
7
8
9
Date
Nov.21st , 2001
June 27th , 2002
June 30th, 2003
August 12th, 2004
th
Oct. 19 , 2005
August 20th, 2008
Sept. 10th, 2009
Sept. 6th, 2010
Nov. 24th, 2010
Author
Schlage
Schlage
Schlage
Heuri /
Rapka
Schlage
Klauser
Milani
Klauser
Klauser
Comments
see chapter
"Document
History"
Ident-Number
d-000351-001474
d-000351-001773
d-000351-002132
d-000351-002630
d-000351-003403
d-000351-005973
d-000351-007517
d-000351-008998
d-000351-009532
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Table of Contents
Introduction................................................................................4
Architecture................................................................................5
Hardware Structure..........................................................................5
Software Structure...........................................................................8
Physical Interfaces....................................................................12
PC/104 Host Interface (J1 and J2)..................................................12
MVB Interface................................................................................15
JTAG Interface...............................................................................23
Serial Line Interface SER.................................................................24
Software Protocols....................................................................26
MVB Software Protocols..................................................................26
Mechanical Data.......................................................................29
Environmental Data.................................................................35
Application Hints......................................................................36
Diagnostic by LEDs.........................................................................36
Reset Mechanism...........................................................................36
Power Up (PLD Loading).................................................................37
MVB Device Address.......................................................................37
EMI Considerations........................................................................38
Standards Reference................................................................39
Links to other Duagon Documents...........................................41
D113 Order Information..........................................................43
Document History.....................................................................52
Index ........................................................................................54
Appendix A: Document Numbering System.............................56
Appendix B: Software Licensing...............................................57
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duagon
Introduction
The D113 is multi-purpose MVB interface on a PC/104 footprint. All features
of the MVB architecture are available: Process Data, Message Data, Bus Administrator as an option, physical layer EMD or ESD+.
The D113 is available in different configurations:
The D113 complies to the TCN standard IEC61375. It is designed for the
harsh traction environment and conforms to the EN50121 / EN50155 / EN61373 standards, e.g. by:
Online Support
For additional information, please visit our web page www.duagon.com.
There you will find:
up to date documents
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Architecture
Hardware Structure
The figure below shows the top view of a D113 equipped with two SUB-D
connectors for MVB.
MVB2 SUB-D
Connector
Diagnostic
LEDs
MVB1 SUB-D
Connector
JTAG
Connector
Serial
Connector
PC/104 Connector
(8-bit)
PC/104 Connector
(16-bit extension)
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Supply
PC/104
JTAG
RS232
host interface
32-bit
RISC
Processor
ROM
(Flash)
RAM
PLD
UART
Traffic
Memory
MVB
MVB1,
MVB2
The PLD contains all relevant logic circuitry, like MVB controller, memory
controller, host interface controller, etc.
The 32-bit RISC Processor controls the information flow within the D113. It
has a data bus width of 16 bits and with its processing power of up to 20
VAX-MIPS covers a wide area of requirements.
The PC/104 host interface ensures a data communication path between
the D113 and the CPU of the host system. According to the operating mode,
the PC/104 interface connects directly to external IO and communication interfaces.
The Traffic Memory, stores all data transferred to and from the MVB. The
microprocessor can read and write the traffic memory through a 16-bit data
path.
The MVB interface supports both wire based standards, the ESD+ and the
EMD; both with galvanic insulation. The ESD standard (without galvanic insulation) is also available.
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Host Interface
In configuration MDFULL and SERVER, the D113 behaves like a UART device,
i.e. it maps an UART register set into the host system. This register set is
used for communication between the host processor and the MVB interface.
For details about the register map see the "Integration Guide for Duagon
PC/104 Products", d-000529-nnnnnn.
D113
Host
UART
Register Set
Ethernet
provided
PHY by
host interface
MVB
Host sees
8 registers
each 8 bit wide
Communication with the D113 over the Duagon UART device basically
means transferring data "as if it was sent through a serial line"; i.e. data
bytes are sent and received in a sequential manner.
The communication does not really pass a serial line, just the registers of the
Duagon UART device. Therefore the transmission is very fast (depending on
the host microprocessor: approx. 1 to 8 Mbaud).
Note: In case the D113 is used in configuration "CONTROLLER", the host
and MVB interface are integrated on the same board, i.e. the local CPU of
the D113 sees the UART register set.
Memory
The D113 local microprocessor includes memory spaces as follows:
Memory Type
Size
Flash
1 MByte
SRAM
general purpose memory
SRAM
traffic memory
1)
256 kByte
Notes:
1)
By default the general purpose memory is 256 kBytes. For configuration "CONTROLLER" (i.e. D113HF), all SRAM chips will be assembled resulting in 1280 kByte
Please call Duagon for more information.
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Software Structure
The software structure depends on the chosen configuration, passive interface (MDFULL), active interface (SERVER) or standalone device (CONTROLLER).
On the D113 MDFULL and SERVER, the overall concept follows the "Client-Server Model":
Client
on Host
D113
Software
on D113
Server
Configuration MDFULL
In case of the passive MVB interface MDFULL, the TCN Driver Software running on the host (see also section "MVB Software Protocols" on page 26) directly accesses the MVB controller on the D113:
Host Application
TCN
Driver
UART-emulation
bridge to D113
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The D113 just contains the MVB controller and a small operating system to
serve the diagnostic serial line and to access the local file system:
Custom
Application
(*)
MVB Controller
Flash File
System
OS
SER
MVB
Flash
Memory
Configuration SERVER
"Client" Software Running on the Host System
The drivers shown below are installed on the host side. The software itself as
well as the interface description is included in the particular "Driver Kit" (see
chapter "Links to other Duagon Documents" on page 41) and may need
simple adaptations in order to run on the host's operating system.
Host Application
MVB
process data
MVB
message
data
Arbitration
UART-emulation bridge to D113
The "Client" is very "thin", i.e. there are no complex requirements for the host
system to fulfill:
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MVB MD
MVB PD
MD RTP Stack
Flash File
System
OS
MVB Controller
SER
MVB
Flash
Memory
Configuration CONTROLLER
The D113 does not interact with any host device.
It can directly control IO signals on the PC/104 connector.
Direct IO signals
(5V level)
MVB
d113
Power supply
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Or the D113 is used as master CPU on the PC/104 bus and may therefore
interact with input/output boards, communication controllers, etc.
PC
IO
/10
4b
us
Peripherals
MVB
d113
Power supply
In this configuration, the D113 runs the application SW itself (in addition to
the MVB Driver, which includes the TCN Real-Time Protocols). This leads to
small, but complete MVB nodes.
Note: Please contact duagon for availability of this configuration.
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Physical Interfaces
PC/104 Host Interface (J1 and J2)
The D113 is compatible to the PC/104 Standard (see section "Standards Reference" on page 39), conformance
level "compliant". "PC/104" is a trademark of the PC/104
Consortium.
Notes:
The connector rows C and D are used for 16 bit operation. Please note: On D113, the connector rows C and D are omitted by
default. The reason for this is that they are not required for the UART
emulation. If the second connector is required, please add it as an option
with your order.
Signal source/sink current may differ from P996 (ISA) values, according
to Section 3.4. of the PC/104 standard.
Row A
Name
-/IOCHCHK
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
IOCHRDY
AEN
SA19
SA18
SA17
SA16
SA15
SA14
SA13
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
GND
Notes
nc
out $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
out $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
in $
power
Row B
Name
-GND
RESETDRV
+5V
IRQ9
-5V
DRQ2
-12V
/ENDXFR
+12V
(KEY)
/SMEMW
/SMEMR
/IOW
/IOR
/DACK3
DRQ3
/DACK1
DRQ1
/REFRESH
SYSCLK
IRQ7
IRQ6
IRQ5
IRQ4
IRQ3
/DACK2
TC
BALE
+5V
OSC
GND
GND
Notes
nc
power
in $
power
out $
nc
nc
nc
nc
nc
in $
in $
in $
in $
nc
nc
nc
nc
in $
nc
out $
out $
out $
out $
out $
nc
nc
in $
power
nc
power
power
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J2
Pin Number
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Row C
Name
GND
/SBHE
LA23
LA22
LA21
LA20
LA19
LA18
LA17
/MEMR
/MEMW
SD8
SD9
SD10
SD11
SD12
SD13
SD14
SD15
(KEY)
Notes
power
in $
in $
in $
in $
in $
nc
nc
nc
in $
in $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
bidir $
Row D
Name
Notes
GND
power
/MEMCS16
in $
/IOCS16
in $
IRQ10
out $
IRQ11
out $
IRQ12
out $
IRQ15
out $
IRQ14
out $
/DACK0
nc
DRQ0
nc
/DACK5
nc
DRQ5
nc
/DACK6
nc
DRQ6
nc
/DACK7
nc
DRQ7
nc
+5V
power
/MASTER
nc
GND
power
GND
power
''in'' and ''out'' directions are stated as seen from the D113 board.
Signals with a "$" in the column "notes" are generic IO pins and
may be redefined to a random function for customer specific versions of the D113.
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Operating Conditions
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
Supply voltage
with respect
to GND
4.75
5.25
tpu
Power up ramp
0 .. 4.75V;
monotonic rise
100
ms
VIN
Input voltage
with respect
to GND
-0.3
VCC +
0.3
VOUT
Output voltage
VCC
VIH
High level
input voltage
1.7
VCC +
0.3
2.0
VCC +
0.3
-0.3
0.8
Recommended to
keep for better
compatibility:
VIL
Low level
input voltage
VOH
High level
output voltage
IOH=-4.0mA DC,
VCC=min.
VOL
Low level
output voltage
IOL=12mA DC,
VCC=min.
IlN
VIN=GND or VCC
IOZ
Tristated output
leakage current
VOUT=GND or VCC
ISC
VCC=max.,
VOUT=0.5V
ICC
1)
VIN=VCC or GND,
no load
VIN=VCC or GND,
terminator voltage
short circuit
2.4
V
0.45
-10
10
-10
10
-30
-130
mA
200
(1W)
400
(2W)
mA
1300
tR
40
ns
tF
40
ns
RCONF
50
kOhm
VIN=0V, f=1.0MHz
10
pF
CIN
20
Remarks:
1)
Timings
For a detailed description of the timings, please refer to the document "Integration Guide for Duagon PC/104 Products", d-000529-nnnnnn.
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MVB Interface
The D113 can be equipped with the following types of connectors (see also
order information on page 43f):
SUB-D connectors (one
male, one female).
This is the recommended implementation when the connector on the D113 is directly
looking to the outside of the
housing.
Header connectors.
A short cable is used to route
the MVB lines from the hosts
housing to the D113.
Carrier Mount.
The D113 can be mounted upside down directly on a carrier
board.
Independent from the type of physical interface (ESD, ESD+ or EMD), the
D113 supports two redundant MVB lines A and B and the Device Status
Word.
Each line has its own decoder circuitry. Both redundant lines are monitored
at the same time and the D113 decides dynamically which line is the better
one.
In this way, the application gains optimal stability in "less than perfect" environments: noise, crosstalk and cable effects are reduced to a minimum.
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Header Option
In some applications, the D113 is mounted somewhere in the middle of a
bigger mechanical enclosure; i.e. the connectors located on the D113 do
not directly pass to the outside of the enclosure.
In this case, short cables are used to route the MVB lines from the outer surface to the D113. Due to the fact, that SUB-D connectors end up in a very
space-consuming size, the smaller solution of "headers" is available.
The headers have a 2.54mm pin raster, 10
pins in two rows of 5 pins. They are polarized
and comply to DIN41651. The mating connectors are available in a very wide range of
different manufacturers and products. The
most spread version is the IDC technique (insulation displacement connector).
The header pinout is prepared to use flat ribbon cables directly connecting the header on
the D113 and the IDC SUB-D connectors.
However, the IDC technique can be recommended for very short MVB cables, only (a few cm). A mismatch of impedance and shielding is introduced to the MVB lines. Much better behavior is
achieved with shielded cables, twisted wires and crimped connectors, being
recommended for distances beyond 10 to 20 cm.
The connectors are delivered with cable locks matching an IDC connector
without strain relief. This is the most space saving arrangement and fits
within the mechanical limits of the PC/104 definition.
If an IDC connector with strain relief is to be used, the cable locks must be
somewhat larger. They can be ordered as an option (option "L", see chapter
"D113 Order Information" on page 43f).
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ESD+ Description
This paragraph applies to the D113.D and D113.E versions, only.
Pin #
Header
SUB-D
Pin
Shortcut
A.data.P
A.data.N
NC
B.data.P
B.data.N
A.0V.term
A.5V.term
B.0V.term
B.5V.term
10
shel
l
Shield
Input / Output
as seen from
the D113
Description
bidirectional
Not connected
non-inverted MVB bus line,
with RS485 level
bidirectional
power output
According to the TCN standard, NC (pin 3) may optionally be used for a "TxE
signal". This signal is intended for controlling bus couplers (for example interfaces from ESD+ to EMD). Since the D113 is available in both EMD and
ESD+ version, the TxE signal is not required any more.
Note: Both connectors have the same pinout, and all pins except pin "NC"
are routed from one connector to the other.
Value
Unit
Remarks
Output voltage
5% tolerance
300
mA
See note
70
mA
The output power is sufficient for one terminator. Mounting two terminators
makes no sense; but this at least does not cause harm to the D113 (voltage
specifications not guaranteed).
Note: There are cases, where the output current specification is not sufficient. Some OGF interfaces (Optical Glass Fiber) require a supply current of
approx. 100mA. For this application, we recommend to bridge the normal
galvanic insulation and directly use the VCC power line from the PC/104 bus:
"D113.E". This leads to a higher possible current (close to what the PC/104
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connectors can deliver), but the "short circuit current limitation" spec (see
IEC61375) is not kept any more.
Terminators ESD+
The following terminator is recommended for the use with the D113 version
for ESD+:
Important Remarks:
Pin 3, 8 and 9 are not connected on the outside. Do not use cables
where all pins are connected, this may impair proper functionality
or even damage devices!
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Insulation ESD+
The two MVB lines A and B are galvanically insulated from the logic/IO and
from each other.
A
MVB
Transceiver
DCpower
MVB
MVB
node
logic
Transceiver
Insulation ESD
The ESD version without galvanic insulation is intended for use with external
interfaces, i.e. to connect to an OGF adapter. Since there is no galvanic insulation, the terminator power supply has an almost unlimited current capability!
A
MVB
Transceiver
DCpower
MVB
Transceiver
MVB
node
logic
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EMD Description
This paragraph applies to the D113.T versions, only.
Pin #
SUB-D
Input / Output
as seen from
the D113
Header
Pin
Shortcut
A.data.P
A.data.N
NC
B.data.P
B.data.N
2,
4
6,
7
A.term
Passive resistor
6,
8
8,
9
B.term
Passive resistor
10
she
ll
Shield
bidirectional
Description
bidirectional
Not connected
non-inverted MVB bus line,
with RS485 level
inverted MVB bus line,
with RS485 level
Termination resistor
between two pins.
According to the TCN standard, NC (pin3) may optionally be used for a "TxE
signal". This signal is intended for controlling bus couplers (for example interface from ESD+ to EMD). Since the D113 is available in both EMD and
ESD+ version, the TxE signal is not required any more.
The effective line termination matches the recommended cable impedance
of 120 .
Note: Both connectors have the same pinout, and all pins except pin "NC"
are routed from one connector to the other.
Terminators EMD
The following terminator is recommended for the use with the D113.T:
The appropriate pins from the MVB line are connected to the local terminating resistor within
the D113.
In case the D113 is the last of several MVB
nodes, one of the MVB connectors remains free.
The terminator is mounted on this connector
and delivers the correct line termination.
Please note:
The terminator is not included within the D113. Call Duagon for
availability and supply information.
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Important note:
Insulation EMD
The two MVB lines A and B are galvanically insulated to the logic and to
each other.
A
MVB
Transceiver
MVB
node
logic
MVB
Transceiver
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As a result, all housings are connected together. Within the vehicle concept,
it must be ensured, that there are no ground potential differences that may
harm the cable shield or the connectors.
The connection between the cable shield and the device housing is done via
the cable connector housing and the fixing screw / cable lock (as required by
the TCN standard).
Note: The other shielding concept (with the shield being insulated from the
housing) is also supported by the D113.
MVB Cabling
There is a wide variety of different manufacturers for "SUB-D" cable connectors. For the cable connector itself, the user may choose a supplier that fits
his own requirements: The various versions are selected according to obvious quality level versus cost considerations.
For the connector hoods, Duagon recommends to thoroughly check the following issues:
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JTAG Interface
The D113 series uses the JTAG interface for debugging and loading the
flash memory (at virgin state after production).
The connector is a 20 pin header (without plastic frame).
Important Remark:
As a matter of fact, new firmware versions may occur. In order to avoid dismounting and mounting for reprogramming, we strongly recommend to
keep the access to the JTAG connector free (when the D113 is mounted in
your system).
Pin Definition
Pin # JTAG
Signal Name
Comment
+3.3V
+3.3V
NC
Not connected
GND
TDI
GND
TMS
GND
TCK
10
GND
11
NC
Not connected
12
GND
13
TDO
14
GND
15
nRST
16
GND
17
NC
Not connected
18
GND
19
BURNIN
20
GND
Remarks:
The pin number 1 has a "square" pad, all other pins have a round
pad. The pin 1 corresponds to the red stripe of the flat cable connector.
The VCC pins are connected to the internal 3.3V . Do not load the
D113 internal 3.3V power supply with excessive current; use a separate power supply for the external debugging devices.
The BURNIN pin is used for production purposes. Leave this pin unconnected.
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Pin Definition
Pin #
nc
nc
SUB-D
Header
Pin
Shortcut
Description
Not connected
RxD
Input
RTS
Output
Request To Send
(not used by default)
TxD
Output
CTS
Input
Clear To Send
(not used by default)
nc
nc
GND
(power line)
Reference potential.
(power line)
10
+5V
Not connected
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Application Hint
SER
The picture shows a flat ribbon cable connected to the SER header.
The pinout is made in a way, that it directly matches male SUB-D connectors
of IDC type. This leads to a similar behavior like a standard PC COM line. In
order to connect to a PC, a "null modem" cable (female connectors on both
ends) must be used.
On the bottom side of the picture, you can see an example of how to power
the board for programming purposes. Connect pins 9 and 10 according to
the pinout description before.
In this example, it is the same flat ribbon cable passing through the header
connector on both sides. On the SUB-D side, pin 10 is ripped off. On the
power side, the pins 1 to 8 are ripped off.
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Software Protocols
MVB Software Protocols
Driver Software Structure
The MVB Driver provides an easy way to implement the communication
between the customer's application and the MVB.
The following figure shows the structure of the TCN/MVB driver:
Link Layer
Management
Process Data
(PD)
Message Data
(MD)
Application
Layer 7 (AL)
Application Layer
AL PD
Legend:
PD:
MD:
SV:
RTP:
LL:
AL:
Process Data
Message Data
Supervision
Real-Time Protocols
Link Layer
Application Layer
AL MD
MD RTP
Layer 2 (LL)
Link Layer
LL SV
LL PD
LL MD
Configuration "MDFULL"
For applications requiring PD only, the customer may prefer to use the "MDFULL" interfaces (AL / LL PD) of the MDFULL Driver Kit for D113. This integration is done in a few hours.
As an alternative, the customer may write its own driver based on the MVB
UART Emulation Protocol "MDFULL".
Complex applications requiring PD and/or MD variables preferably use the
Layer 7 API Interface of the provided driver software.
Note: The MDFULL Driver Kit for D113 does not contain the software part
"Message Data Real Time Protocol stack (MD-RTP)" ( also known as "TCN
Real-Time Protocols"). It can be licensed from a former JDP member, which
forced the TCN development (i.e. Bombardier, Siemens, Firema).
Configuration "SERVER"
The SERVER Driver Kit for D113 offers the Layer 7 API Interface to the customer system according to the "MVB Client-Server Model" (see next chapter).
Due to the "MVB Client-Server Model" the software part "MD RTP" (also
known as "TCN Real-Time Protocols") is integrated in the standard application (i.e. MVB Server) on the D113.
This is the preferred configuration for the D113, if the customer system
should support PD and MD without real-time requirements.
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Configuration "CONTROLLER"
The CONTROLLER Driver Kit for D113 supports PD and MD (Note: The D113
in configuration "CONTROLLER" means, that the host and MVB interface is
integrated on the same board).
Note: The software part "MD RTP" (also known as "TCN Real-Time Protocols") is available as a library for the standard real-time OS "eCos" on the
D113.
Host System
Application
Layer 7 (AL)
Application Layer
MVB
Device
Configuration
API
MVB Client
from
D2000
Configuration
Tool
MVB Server
MVB
Bus Administrator
Configuration
MVB Server
The D113 internal software (bottom part of the figure above) acts as an
"MVB Server" for the host system (top part of the figure above), i.e. it
provides the MVB Layer 7 API interface via Remote Procedure Calls.
Note: This software is fixed for all customer's application and delivered from
Duagon as a standard product firmware.
MVB Client
The host system contains the "MVB Client". The customer's application accesses the "MVB Client" through the standardized API for process and message data (see Layer 7 API Interface of IEC61375, enhanced by some propri-
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etary functions). The "MVB Client" maps its API via Remote Procedure Calls
over the host interface to the "MVB Server". By this way, the application software has the same interface as if "the MVB controller is within the host system".
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Mechanical Data
PC/104 Mechanical Data
The figure below shows the drawing as it is distributed by the
PC/104 Consortium (see chapter "Standards Reference" on page
39).
In general, the different D113 versions comply to the PC/104
mechanical specification. Version specific information is listed
on the following pages.
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Value
Remark
14mm
SUB-D connectors
10mm
other components
(PC/104 connector excluded)
2.5mm
component height
(PC/104 stackthrough
connector excluded)
1.6mm
Weight of board
2)
90g
Fully equipped
Remarks:
1)
2)
The precise weight of the board may vary according to the selected
connector options.
23.8 mm
95.9 mm
33.5 mm
SUB-D Connectors
90.2 mm
T
H1
H2
SUB-D type
(see order information
on page 43)
H1
H2
0.5
6.0
7.3
2.3
6.0
6.3
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52.46 mm
95.9 mm
22.85 mm
Header Connectors
90.2 mm
T1
T2
Header type
(see order information
on page 43)
T1 1)
T2
5.3
17.5
5.0
Header connectors
with long cable locks
(order code "L")
8.8
20.2
5.0
The maximum height is stated for fully open (unlocked) cable locks.
It is possible to connect the cables without fully opening the cable
locks. This allows to connect and disconnect cables without dismounting the D113 from your system.
In locked position the header easily complies to the maximum component height defined in the PC/104 Standard.
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duagon
d-000351-009532
PC/104 Mounting
The D113 is proposed to be mounted like standard PC/104 modules. The
drawing below shows the situation for "stackthrough" and "non-stackthrough" modules. Not shown in the drawing are the four standing bolts
which screw the stack together.
The drawing shows the distance between the modules as defined in the
PC/104 standard.
It depends on the particular application respectively the component height
of any adjacent board, what module distance is to be chosen.
Four sets of screws respectively standing bolts are required for fixture to the host board (not part of D113 scope of delivery).
By default, stackthrough
pins are delivered to stack
several PC/104 boards on
top of each other.
Stackthrough Pins
Non-Stackthrough Pins
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Option "S" ; height like PC/104 standard gives a board to board distance
of 15.2mm.
Remark:
The option "S" is available either as stackthrough or non-stackthrough (option "SX") version.
The option "C" is always non-stackthrough version, the "X" is not necessarily needed in the order code.
Shield-to-Case Strap
The single plated mounting hole can be used to connect the fieldbus connector's shields (MVB) to the device housing.
This allows the user to realize individual shielding concepts.
There is an assembly location for
a "Zero-Ohm" resistor (red box).
Per default, there is a small copper trace, which connects the
mounting screw to the MVB
shield.
The copper trace may be removed
during system integration of D113
in order to have an insulation
between housing and MVB shield.
The gap may be closed again with
a standard "MINIMELF" Zero-Ohm
resistor.
The picture shows the D113 from
the bottom side (solder side);
close to the plated mounting hole (the other three mounting holes do not
connect the screw to anything else).
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d-000351-009532
duagon
For more information see the ''Material and Components for Wiring Technical Note'', d-000842-nnnnnn.
duagon
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Environmental Data
Issue
min.
typ.
max.
Unit
Remarks
-40
+25
+85
EN50155:2007
4.1.2: Class TX
measurement
10min after power
on
EN50155:2007
4.1.1
For derating of
maximum temperature with respect
to altitude levels in
excess please call
duagon.
Temperature rise of
directly surrounding air
after power-on
1800
Relative humidity
<75%
95%
EN50155:2007
12.2.11
Vibration
Shock
RFI susceptibility from
0.15 to 2000 MHz.
20
2
50
mm
m/s2
50
m/s2
for 5-25 Hz
for 25-150 Hz
duration 50ms
V/m
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duagon
d-000351-009532
Application Hints
Diagnostic by LEDs
A set of eight general purpose diagnostic LEDs is used for self test purposes.
When an error is encountered during self tests, the LEDs display the test
number. This can be used in order to find the reason for a failure more efficiently.
The particular meaning of the LED diagnostic codes is highly application
specific. Please refer to the related documentation in the Driver Kits (see
chapter "Links to other Duagon Documents" on page 41).
LED00
LED
...
LED7
Reset Mechanism
The D113 board generates its own under-voltage supervision circuitry onboard. The switching level for the internal RESET is far below the lower V CC
limit. This enables fully stand-alone function, i.e. no external reset signal is
needed.
If the D113 is in slave mode, the pin "RESETDRV" of the ISA bus is monitored
by the onboard CPU in order to correctly reflect the system reset status.
We therefore recommend our customers to keep the RESETDRV pin controllable from both software and their own under-voltage detection.
Make sure to apply the reset signal for at least 700ns to perform a successful reset.
Assumed this is not done, a tricky situation may arise, if
the host detects an under-voltage situation and the D113 does not
(the reset levels are never perfectly matched)
and RESETDRV is not driven by the host in case of an host under-voltage condition
then it could happen, that the D113 "does not know anything" about this
condition and continues to communicate with the MVB. This is definitely
wrong!
Another tricky situation could theoretically arise "mirrored" from before:
The D113 dives through a reset, the host does not. The host software faces a "lost" D113 board.
This situation is not very likely, since the D113 internal under-voltage detection is fairly low (approx. 4V), i.e. the host supervision should have reset the
host CPU in any case before this condition.
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If the second approach is chosen, the D113 must get some "geographic" information. This is typically done by externally accessible input signals, the
drawing below shows the situation when using the D113 in slave mode:
MVB
MVB interface
set MVB
address
accordingly
+
-
binary inputs
+
+
+
-
location coding in
vehicle wiring
outside control
equipment
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d-000351-009532
duagon
This procedure leads to the fact, that all control equipment devices (including both the host CPU and the D113) are absolutely identical in stock. When
fitting to a certain location, they take automatically over the correct role.
EMI Considerations
We assume the following implementation for the D113:
The supply is filtered before any conversion of the voltage. This topology makes the host immune against any coupling of noise and
prevents the broadcast of noise on the supply. It also could be useful to add a folding ferrite.
The power supply of the host is galvanically insulated from the battery and the case.
Connect all power pins in a way, that the overall impedance of the
power lines is reduced to a minimum.
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Standards Reference
The D113 complies to the standards EN50155 and EN50121-3-2 in general.
For exceptions, not applicable subclauses etc. please refer to the following
paragraphs and, in more detail, to the "D113 MVB Type Test Report" with
the document number d-000935-nnnnnn:
Electromagnetic Compatibility
EN50121-3-2:2006: The D113 MVB interface product line complies to EN50121 under the precondition, that it is used in an environment being on
acceptable technical level. The reason for this restriction is, that our product
cannot be tested according to the mentioned standard as it is (it is a board
level product, not a device). A high amount of EMI will be generated from
other components like power supply, local CPU board, housing, cabling. We
do not have an influence on these parameters. In addition, these parameters change from application to application, which voids the statements from
previously made tests; i.e. the tests have to be repeated.
The statements apply in a similar way to both emission and immunity.
For a typical MVB interface application, most of the statements about "transients" have no influence to the D113. There are no battery referenced inputs or outputs from the D113 available on the outside of the devices. We
assume, that the D113 power supply is galvanically insulated and/ or the
D113 signal lines have no connection with unshielded cables to the outside.
Please note, that the MVB must be used with shielded cables. This leads to
the fact, that the successful survival under these tests depends from a well
working grounding structure. We therefore highly recommend to have a low
impedance path from the MVB cable shield to the housing ground.
Insulation
IEC61375-1:2007: MVB physical layer, applied to EMD and ESD in the
same way, according to IEC60571:2006, 500Vrms, 1M for 1 minute. Each
individual device is tested prior to shipment (routine testing). During routine
testing, the testing is optionally changed to sinusoidal 708Vrms or 1000Vdc,
1M for 10sec.
EN50155:2007 12.2.9: Insulation measurement test / Voltage withstand
test. Same as for IEC61375.
Note: From EN50155:2007 7.2.1 it is assumed that the power supply for the
D113 is galvanically insulated from the vehicle battery.
Useful Life
EN50155:2007 6.2: There are reprogrammable components used in the
D113. These are specified from the manufacturer with 20 years data retention at 125 Celsius, which fits clause 6.2. The actual "useful life" can be extended by reprogramming these devices.
There are no other components with a limited useful life. Particularly, there
are no electrolytic capacitors, which typically introduce a limitation to useful
life.
Components
EN50155:2007 8.1.5 and 8.1.7: There may be specialized components/
single source components included in the product. Contact Duagon for more
information about repair and long term shipment procedures.
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d-000351-009532
duagon
MVB
IEC61375-1:2007:, International Electrotechnical Commission, "Electric
Railway Equipment, Train bus, Train Communication Network": Clause 3 describes the MVB "Multifunction Vehicle Bus".
PC/104
PC/104 Specification, Version 2.3, June 1996, Copyright 1992-96, PC/104
Consortium, 849B Independence Ave, Mountain View, CA 94043
Manufacturing
The manufacturing of the PCB assembly is done according to IPC-A-610D:
2005 level 2.
The product complies to the European Union directive EC/2002/95 (RoHS
compliance).
REACH
Concerning the European Union directive EC/1907/2006 (REACH compliance), Duagon does not need to register any substance. Duagon's products
do not use quantities of more than 1 ton of a certain substance and the substances are not released under normal conditions of use. For a registration,
both criteria would have to be fulfilled.
Humidity
EN60068-2-30:2006: Provides a composite test procedure, primarily intended for component type specimens, to determine, in an accelerated manner,
the resistance of specimens to the deteriorative effects of high
temperature/humidity and cold conditions.
duagon
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Step 1:
Step 2:
The options from step 1 and 2 are required to be specified prior to manufacturing (normally at order time). These options may have an influence on pricing. Any changes at a later date may cause significant trouble with respect
to cost and / or delivery time.
Step 3:
D113
.T
-P4
2XL
MVB Function:
MDFULL
MDFULL+BA*)
SERVER
SERVER+BA*)
CONTROLLER+BA*)
D113L
D113LF
D113
D113F
D113HF
MVB Type:
EMD
ESD+
ESD
.T
.D
.E
Form Factor:
PC/104 Form Factor
-P4
Connector Type:
Header
SUB-D
Carrier Mount
Carrier Mount PC104
A
B
C
S
2
X
L
H
U
N
<empty>
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duagon
d-000351-009532
3
2
D113L:
D113:
D113H:
Then, choose the MVB physical layer: EMD ("T") or ESD+ ("D") or ESD ("E").
D113
.T -P4
MVB Function:
MDFULL
MDFULL+BA*)
SERVER
SERVER+BA*)
CONTROLLER+BA*)
D113L
D113LF
D113
D113F
D113HF
MVB Type:
EMD
ESD+
ESD
.T
.D
.E
Form Factor:
Connector Type:
Connector Options
2XL
duagon
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2
1
The second PC/104- connector may be used for 16-bit access ("2").
Note: The second connector may be used to route the 16-bit signals
to another PC/104- module being stacked on top of the D113.
If you have chosen header connectors for MVB, decide on the length of the
cable locks:
If you have chosen SUB-D connectors for MVB, decide on the type of screw
locks on the SUB-D and the hangover length:
default is M3
D113
.T
-P4
2XL
MVB Function:
MVB Type:
Form Factor:
PC/104 Form Factor
-P4
Connector Type:
Header
SUB-D
Carrier Mount
Carrier Mount PC104
A
B
C
S
2
X
L
H
U
N
<empty>
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duagon
d-000351-009532
Connector Options
-P4
-P4
-P4
2X
duagon
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Connector Options
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Connector Options
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3
2
1
Parameter
MDFULL
Default value
Bus type
PC/104 (ISA)
8 bit
Address type
IO mapped
Address range
0x04F8-0x4FF
When you need a custom specific adaptation to the bus type, please refer to
the document "Integration Guide for Duagon PC/104 Products", d-000529nnnnnn. It describes like a cook book how to modify the configurations in
order to make it fit. This includes especially versions for direct support of
other microprocessors, e.g. Siemens C167 family.
For any additional custom specific modifications, please call duagon. We will
submit an offer about your implementation.
D113L.T-P4B
d-000768-002403
If the user is not sure, what has been delivered: Locate the serial number of
the product and call duagon. We can give you the information back, what
downloadable options was programmed to the board at delivery time.
Page 50/58
duagon
d-000351-009532
D113L.D
Document number
downloadable options
(also known as
"OP")
d-000766-nnnnnn
Description
D113L.T
D113LF.D
d-000768-nnnnnn
d-000767-nnnnnn
D113LF.T
d-000769-nnnnnn
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D113.D
D113.T
D113F.D
D113F.T
Document number
downloadable options
(also known as
"OP")
d-002609-nnnnnn
d-002610-nnnnnn
d-000773-nnnnnn
Description
interrupt 9
interrupt 9
d-000774-nnnnnn
D113HF.D
Document number
downloadable options
(also known as
"OP")
d-000883-nnnnnn
Description
D113HF.T
d-000884-nnnnnn
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d-000351-009532
duagon
Document History
d-000351-009532
d-000351-008998
d-000351-007517
Standardization and actualization
regrouping of chapters
Removed
Added
EMI hint
Humidity
d-000351-005973
Update pictures
d-000351-003403
d-000351-002630
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Add Driver Kits for D113 (i.e. MDFULL, SERVER and CONTROLLER).
Delete all other references, which are part of these Driver Kits.
d-000351-002132
Changed:
Legal statements on second page.
The SER serial line connector is now always upright (in the old data sheet it
was a bended header like the "header option" for the MVB connectors).
More detailed comments to standards, like for example EMI issues.
Newly introduced:
Detailed information about "long hangover" connector option.
Information about Order options contains now several document number
examples for frequently used downloadable option sets.
Removed:
Chapter "Software Upgrade Recommendations": Previously intended for software engineers writing their own UART emulation software driver: limited
applicability within this document found for these statements; refer also to
the document "UART emulation".
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d-000351-009532
Index
0
I
0V.term....................................17
IDC...........................................25
IDC...............................................
Insulation displacement connector.................................16
Identification Number.........49, 56
IEC61375.................................40
Integration Guide PC/104.........41
IO pins.....................................13
IO signals.................................10
IPC-A-610D..............................40
1
16 bit operation........................12
3
3.3V.........................................23
5
5V.term....................................17
8
8 bit operation..........................12
JTAG.........................................23
A.data.N.............................17, 20
A.data.P..............................17, 20
A.term......................................20
API............................................27
B
B.data.N.............................17, 20
B.data.P..............................17, 20
B.term.......................................20
BURNIN....................................23
L
Labels.......................................41
LED...........................................36
Life Cycle..................................41
M
Mechanical Data.......................29
Mechanical Dimensions............30
Memory......................................7
Mounting hole..........................33
MVB Client................................27
MVB Driver...............................26
MVB Server...............................27
C
Cable.......................................18
Cable impedance................18, 20
Client-Server Model..................27
Component height....................30
Components.............................39
CTS...........................................24
Customers................................41
N
Non-stackthrough.....................32
Null modem.............................25
O
OP............................................49
Order Information.....................43
D
Device address..........................37
Device housing.........................22
Diagnostic.................................36
DIN41651................................16
P
PC/104.....................................12
PC/104 Consortium............12, 29
PC/104 Specification.................40
PCB thickness............................30
Pin description..............................
Serial line connector..............24
PLD load...................................37
PLD load time.....................14, 37
Power output............................17
Power supply............................23
E
EN50121..................................39
EN50155..................................39
EN61373:1999.........................40
F
Firmware..................................49
Flash...........................................7
Flat ribbon cable.......................25
Function blocks...........................6
G
GND.........................................24
Ground potential differences.....22
H
Hardware options.....................43
Header.....................................16
Hood........................................22
Host Interface.............................7
Humidity...................................35
Q
Quality Plan..............................41
R
REACH......................................40
Remote Procedure Call.............27
RESETDRV.................................36
Resistor.....................................18
RFI............................................35
RoHS........................................40
RS232.......................................24
RTS...........................................24
duagon
d-000351-009532
RxD...........................................24
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T
Temperature range...................35
Terminator..........................17, 20
Terminator....................................
ESD.......................................18
Test procedures.........................41
Testing......................................49
Traffic memory............................6
TxD...........................................24
S
SER...........................................25
Serial line interface...................24
Serial number.....................41, 49
Server.......................................27
Shield...........................17, 20, 22
Shield continuity.......................22
Shielding concept......................22
Shipment..................................41
Shock........................................35
Siemens C167..........................49
Software Licensing....................57
SRAM..........................................7
Stackthrough............................32
Standards.................................39
Structure...................................26
SUB-D connector................22, 25
SUB-D Connectors....................15
Supply voltage..........................14
U
UART device................................7
UART register set........................7
Useful life.................................39
V
Vibration...................................35
W
Weight of board........................30
+
+5V..........................................24
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d-000351-009532
Document number
Filing number
-000310
-001952
Always
constant
Always 6 digits.
d-000310001606
d-000310001952
d-000719
Recommendation:
In your order, you may specify for example "d-000584-nnnnnn" in order to
get the "newest" version of a specific product. When you do not want to follow the sequence of newer versions, i.e. you want to stick to a specific version, then specify the full identification number like "d-000584-002043".
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These software packages (source code and/or binary) and their license
agreement are available for registered download on Duagon's Web Site
(http://www.duagon.com/) as part of the product specific Driver Kit.
Note: The following software parts are delivered as binary, only:
"JDP MD-stack Software" of the CONTROLLER configuration (if
needed for the product at all)
MVB Server application
DUAGON SOFTWARE LICENSE
Duagon cedes the present software to the customer in source code and/or
binary form exclusively in order that the customer may modify or test it for
running on the customer's system containing the Duagon products.
The binary form of the software or the modified software, regardless of
whether the modifications to the software were made by the customer or
by Duagon, is ceded to the customer to be used exclusively under a run
time license
All rights, especially the intangible property rights to the software and the
modified software shall belong exclusively to Duagon regardless of whether
the modifications to the software were made by the customer or by
Duagon. Also the rights to the modified software shall belong exclusively to
Duagon.
The customer may not, either in source code or binary form - transmit the
software or the modified software to third parties, or - use the software or
the modified software for purposes other than those specifically mentioned
above.
This software is provided by Duagon as is and any express or implied warranties, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose are disclaimed. In no event shall
Duagon be liable for any direct, indirect, incidental, special, exemplary or
consequential damages (including but not limited to, procurement of substitute goods or services; loss of use, data or profits; or business interruption) however caused and on any theory of liability, whether in contract,
strict liability, or tort (including negligence or otherwise) arising in any way
out of the use of this software, even if advised of the possibility of such
damage.
By copying, installing or using the present software, the customer declares
that it has taken cognizance of these software license regulations and has
accepted them.
The general terms and conditions from duagon are an integrated part of
this DUAGON SOFTWARE LICENSE.
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MicroMonitor
The "MicroMonitor for D113 is based on the Original MicroMonitor software
as it was released by Bell Labs as open source software under the terms of
the LUCENT PUBLIC LICENSE
The Original MicroMonitor Software and its license agreement are available
for public download on Lucent Technologies' Research Software Distribution
Web Site (http://www.umonfw.com/).
Duagon distributes the Object Code as well as the modified Source Code of
the "MicroMonitor for D113" under the terms of the same LUCENT PUBLIC
LICENSE
Please contact Duagon to get a copy of the Source Code.