Applied Thermal Engineering 66 (2014) 493e498

Contents lists available at ScienceDirect

Applied Thermal Engineering

journal homepage: www.elsevier.com/locate/apthermeng

Thermal conductivity enhancement with different llers for epoxy

resin adhesives
Yuan-Xiang Fu, Zhuo-Xian He, Dong-Chuan Mo, Shu-Shen Lu*
School of Chemistry and Chemical Engineering, Sun Yat-sen University, Guangzhou 510275, China

h i g h l i g h t s
 Thermal conductive adhesives with 8 different llers were tested.
 The layer-shape ller is benecial to form the heat pathways.
 The sharp-corner-shape ller is most difcult to achieve the heat pathways.
 The adhesive lled with the natural graphite has higher thermal conductivity.

a r t i c l e i n f o

a b s t r a c t

Article history:
Received 9 September 2013
Accepted 18 February 2014
Available online 28 February 2014

Heat dissipation is an important issue for electronic devices. In the present work, we prepared eight
kinds of thermal adhesives by lling the epoxy resin with natural graphite, copper, aluminum, zinc oxide,
boron nitride, aluminum oxide, diamond and silver powders, and measured the thermal conductivity of
all samples. The results show the eight llers can efciently improve the thermal conductivity of the
epoxy resin. Meanwhile, we found the layer-shape ller is more favorable than the ball-shape ller and
the sharp-corner-shape ller to enhance the thermal conductivity of epoxy resin, and the low price layershape natural graphite-epoxy adhesive had the highest thermal conductivity up to 1.68 W m 1 K 1 at
weight 44.3% of the eight thermal adhesives. All the llers and the cross sections of thermal adhesives
morphologies images were characterized by scanning electron microscopy, and the thermal conductivities of all the samples were measured by Hot Disk TPS-2500 thermal constants analyzer.
2014 Elsevier Ltd. All rights reserved.

Keywords:
Filler
Thermal adhesive
Thermal conductivity
Powder shape
Filling load

1. Introduction
With the quick development of the micro-electronic technology,
the electronic components are gradually transformed from isolated
to highly integrated [1] and modularized [2,3], which cause high
heat ux from the electronic devices, and a great amount of heat is
produced [4,5] during the running of the electronic devices. According to the studies of Bar-Cohen et al. [6], the stability of the
electronic devices will be depressed by 10% as their temperature
rise by every 2  C. Heat cumulation will directly affect the stability
and lifetime of the electronic devices, or brings some others serious
consequences [7]. At present, how to realize the effective and
efcient heat dissipation from the electronic devices has become
the focus of the electronic capsulation [8e11], and the study on the
thermal conductive adhesive, an essential material of electronic

* Corresponding author.
E-mail address: lvshsh@mail.sysu.edu.cn (S.-S. Lu).
http://dx.doi.org/10.1016/j.applthermaleng.2014.02.044
1359-4311/ 2014 Elsevier Ltd. All rights reserved.

capsulation, has become more and more important. With the rapid
development of the material science and technology, many kinds of
new materials like carbon nanotubes (CNTs) [12,13], carbon ber
[14], and graphene sheet [15,16] are utilized to improve the thermal
conductivity of the thermal adhesives. However, there are also
some factors such as the mass production and the high price to
limit such new materials widely used in the electronic capsulation
at the present time.
The conventional thermal conductive adhesives are usually
prepared by lling the resins with one or several kinds of common
llers, such as graphite powders, carbon black [17], Aluminum
oxide (Al2O3) [18], Aluminum nitride (AlN) [19], Zinc oxide (ZnO)
[20], Boron nitride (BN) [21], and diamond powders [22], or metal
powders such as Copper (Cu) powders [23], Nickel (Ni) powders
[24], Aluminum (Al) powders [25], and Silver (Ag) powders [26].
Though a great amount (the proportion of the content 50%) is
needed to improve the thermal conductivity of the adhesives (1e
5 W m 1 K 1) for the traditional llers, the technique of the
preparation for these llers is easy and low-cost, therefore these

494

Y.-X. Fu et al. / Applied Thermal Engineering 66 (2014) 493e498

low price traditional llers are also widely used in the thermal
conductive adhesives which will be the main products used in the
electronic capsulation currently [27].
Herein we prepared eight kinds thermal conductive adhesives
by lling the epoxy resin (E-51) with conventional llers such as
natural graphite, Cu, Al, ZnO, BN, Al2O3, diamond, and Ag powders,
respectively. We measured the thermal conductivities of all samples by Hot Disk TPS-2500 thermal constants analyzer, and
demonstrated the variations and the enhancement of the thermal
conductivities of these thermal conductive adhesives as the lling
load of the llers are increased. We comparatively study the effects
of llers morphologies on the thermal conductivities of the thermal
conductive adhesives. Meanwhile, considering the prices of the
llers, we think the lamellar graphite is a kind of excellent thermal
conductive adhesive ller.

eld emission 20 kV; Thermal conductivities of all the samples

were measured by the Hot Disk TPS-2500 thermal constants
analyzer at room temperature.
2.3. Surface treatment of llers

All messages of materials used in the experiment are listed in

Table 1.

To facilitate the llers better dispersion in the epoxy resin

matrix, surface modication is essential and the process is as
following: ethanol solution with deionized water 10% was prepared rstly, and the potential of hydrogen (pH) of solution about
3.5e5.5 was regulated by acetic acid, then a certain amount of
llers powders were weighed up and put in the numbered beakers
separately, then weight (wt) 5% of the ller KH-550 solution was
added into the beakers separately, after that, put the beakers into
the ultrasonic cleaner for 30 min by mild ultrasonic dispersion,
then hydrolyzed for 2 h at 50  C in the thermostat, ltered and
washed them until neutral with deionized water and ethanol
several times, transferred the treated llers into the vacuum oven
at 60  C about 12 h. Owing to ZnO can hydrolyze in the acidic
condition, and Cu powders will be oxidized at the hydrolysis
process, we canceled the two type llers surface treatment
operation.

2.2. Characterization method

2.4. Preparation of the adhesives

The scanning electron microscope (SEM) morphologies of all

samples were characterized using FEI Quanta 400F with thermal

E-51 and curing agent (1:1) mixed for 10 min (mins) by mechanical stirrer rstly, then wt 5% reactive diluent was added, after
5 min mixed, eight treated llers were added the specifying beaker
separately, homogeneous mixture of the thermal adhesives can be
obtained after 30 min stirring. Put the prepared adhesives into the
vacuum chamber for de-aeration, and moulded the adhesives in the
polytetrauoroethylene (PTFE) moulds (35 mm in diameter and
10 mm in thickness), and transferred the moulds into oven with the
constant temperature of 80  C for 30 min, then increased the
temperature to 120  C and kept the temperature for 60 min, the
adhesives can be cured with the temperature naturally cooling
down with the oven nally.

2. Experiment
2.1. Materials

Table 1
Materials in the experiment.
Name of the material

Grade

Technical parameter Manufacturer

Graphite powders

Analytical
C > 98.0%
reagent (AR)

Cu powders

AR

Al powders

AR

Ag powders

AR

ZnO powders

BN powders

Industry
grade
AR

Al2O3 powders

AR

Diamond powders

Epoxy resin (E-51)

Cure agent: 650

polyamide

Silane coupling agent:

(3-aminopropyl)
triethoxy-silan
(KH550)
Reactive diluent:
propylene
oxide-butyl ether
Deionized water

AR

Epoxide number
0.41e0.47
mol/100 g
Amide value
200  20 mg
KOH/g
98%

Industry
grade

Qindao Yanxin
Graphite Product
Co., Ltd.
Tianjing Kemiou
Chemical reagent
Co., Ltd.
Tianjing Kemiou
Chemical reagent
Co., Ltd.
Sinopharm
Chemical reagent
Co., Ltd.
Wuxi zehui
Chemical co., Ltd.
Liaoning Yingkou
Liaobin Meticulous
Chemical Co., Ltd.
Tianjin Kemiou
Chemical Reagent
Co., Ltd.
Tianjin Chanyu
Superhard Sci-Tech
Co., Ltd.
Foshan Nanhai
Baosheng Chemical
Co., Ltd.
Foshan Nanhai
Baosheng Chemical
Co., Ltd.
Aladdin Chemistry
Co., Ltd.

Yancheng Hehai
Chemical Diluent
Co., Ltd.
Self-prepared

3. Results and discussion

3.1. Morphology of the ller
The morphologies of the eight llers samples were characterized by SEM after spray-gold treatment in Fig. 1. Fig. 1a shows that
the diameter of ZnO powders are about 0.5e1 mm and no aggregations is found in the gure, and the sample is with particles and
cylindrical shape mostly. Fig. 1b is the uffy structure powders of
BN, wherein the particle diameter is observed to be 400 nm and
with some aggregations in the gure, which may be caused by the
imperfect grind after the surface treatment. The Al2O3 powders are
nearly ball-like with the diameter in the range of 20e40 mm with
some crackles on the surface is observed in Fig. 1c. Fig. 1d is the
SEM image of the natural graphite powder, which has good layer
structure of about 70e100 mm, and some broken graphite ake
with smaller size. Fig. 1e shows the Al powders with ball shape and
well dispersed, and most of the diameters are about 20 mm. Fig. 1f
is the image of the Cu powders with laminate-shape structure and
some with branch shape, which may be favorable to construct the
heat pathways in the resin. From the image (Fig. 1g), it can be seen
that the diamond powders with sharp-corner shape, and the size is
about 40 mm. The Ag powders after surface treatment is well
dispersed and aggregations can also be observed in Fig. 1h, which
is probably due to the smaller size of Ag powders particle with
about 1 mm.

Y.-X. Fu et al. / Applied Thermal Engineering 66 (2014) 493e498

495

Fig. 1. SEM images of eight llers materials. (a) ZnO powders; (b) BN powders; (c) Al2O3 powders; (d) graphite ake; (e) Al powders; (f) Cu powders; (g) diamond powders; (h) Ag
powders.

3.2. Thermal conductivity analysis

Pure epoxy resin is a kind of low thermal conductivity material.
According to the theories of thermal conduction [28,29], To
improve the thermal conductivity of the epoxy resin, the most
efcient way is high thermal conductivity materials by lling in
the resin matrix, then form the connected thermal transport
pathways in the resin. In this study, we aim to investigate the
different eight kinds of llers to affect the thermal conductivity
enhancement of epoxy resin E-51 under the same conditions. For

comparison, the pure epoxy resin without ller adhesive is rstly

prepared. Fig. 2 is the optical images of the nine kinds of thermal
conductive adhesives after cutting and polishing. The light yellow
sample in Fig. 2a is the pure epoxy resin; the white samples in
Fig. 2b and c are ZnO and BN adhesive, respectively; Fig. 2d is the
Al2O3 adhesive; the sample with slight metal luster in Fig. 2e is the
graphite adhesive; Fig. 2f and g are the Al and Cu adhesive,
respectively; the slight yellow sample in Fig. 2h is the diamond
adhesive; Finally, Fig. 2i is the Ag adhesive with obvious metal
luster.

496

Y.-X. Fu et al. / Applied Thermal Engineering 66 (2014) 493e498

Fig. 2. Samples of as-prepared thermal adhesives. (a) Pure epoxy resin, (b) ZnO adhesive, (c) BN adhesive, (d) Al2O3 adhesive, (e) graphite adhesive, (f) Al adhesive, (g) Cu
adhesive, (h) diamond adhesive and (i) Ag adhesive.

Before the thermal conductivities measure, all the thermal adhesives samples must be treated by machinery cutting and
burnishing with the size of 35 mm in diameter and 8 mm in height.
The thermal conductivities of all the samples are measured by the
Hot Disk TPS-2500 thermal conductivity analyzer, which is based
on the Gustafsson transient plate heat source [30], and the detailed
measurements can be found previous paper [31]. In particular, the
thermal conductivity results of all samples will be with the ve
tests average value and the maximum relative error is 1%. To understand the improvement of the thermal conductivity of the epoxy
resin by the llers intuitively, we rst measure the thermal conductivity of the pure epoxy resin is about 0.17 W m 1 K 1 at room
temperature and it is a little lower than that of the previous reports
[17,25], which may be due to the system error of the thermal
conductivity analyzer or the sample with some bubbles from
preparation process.
In this research we focus on the thermal conductivities of all
thermal adhesives with llers different lling load and shape,
meanwhile the cost of llers is an important consideration for the
specic applications. From the market information, we obtain the
prices of natural graphite, Cu, Al, ZnO, Al2O3 powders less than 200
China Yuan (CNY) per kilogram, BN powder is about 500 CNY per
kilogram, Ag powder is about 3500 CNY per kilogram, and the
diamond powder is up to 11,000 CNY per kilogram. Fig. 3 shows the
thermal conductivities of the eight thermal conductive adhesives
change curves with different lling loads. All the curves start point
at 0.17 W m 1 K 1 (the blue circle), which is the thermal conductivity of the pure epoxy resin. Considering the price of silver
powder and diamond powder, we did not make high lling load
thermal adhesive samples in this study. From Fig. 3 it can be found
that the highest thermal conductivity of adhesive is up to
1.68 W m 1 K 1 at the lling load of wt 44.3% graphite powder,
which may be attributed to that the layer structure of graphite to
form the more heat pathways in the epoxy matrix easily, as we all
know that the layer structure llers are favored to be connected
with each other by relative fewer contact points to form the heat
pathway, which indicates that the thermal contact resistance of the
layer structure of graphite epoxy matrix is lower and thus the
thermal conductivity is higher [32]. For the diamond-epoxy resin,
the thermal conductivity is about 0.35 W m 1 K 1 at the lling load
of the diamond powders of wt 29.41%, not agree with the high
thermal conductivity of the diamond [33], which is due to the

Fig. 3. Thermal conductivity of eight kinds of thermal adhesives versus the lling load.

diamond powders with sharp-corner shape (as shown in Fig. 1g),

which is hard to form the effective heat pathways in the epoxy
matrix. Filling the epoxy resin with Cu powders at the lling load of
wt 68.25%, the thermal conductivity is about 0.74 W m 1 K 1,
which is also not in agreement with the intrinsic thermal conductivity of the Cu powder [34]. In addition, from the SEM image
(Fig. 1f) we can see that the Cu powders with the layer structure,
which is also favorable to form the heat pathways. However, the
low thermal conductivity is probably caused by the oxidation of the
Cu in air in the preparation to produce CuO with lower thermal
conductivity [35]. The thermal conductivity of the Al adhesive is
about 1.11 W m 1 K 1 at the lling load of wt 69.69%. From the SEM
image we know the Al powders are ball shape, which is not suitable
for forming the heat pathway. However, due to the low thermal
resistance of the Al powders and relative high thermal conductivity
of the Al2O3 [36], the thermal conductivity is about 50% higher than
that for the Cu adhesive with the corresponding lling load. The
thermal conductivity of the BN adhesive is about 0.59 W m 1 K 1 at
the lling load of wt 35.5%, which is 3.47 times larger than that of
the solidied pure epoxy resin. The thermal conductivity of the BN
is high [37], but the size of the BN powders are relatively small
which is not easy to form the heat pathways in the epoxy matrix,
even though existing on partial aggregations.
At the lling load of wt 67%, the thermal conductivity of the
Al2O3 adhesive can reach to about 0.57 W m 1 K 1, which is 3.35
times larger than that of the pure epoxy resin. Though the size of
the Al2O3 powders is larger and ball shape is not suitable for heat
pathways, we consider that the crackles on the surface of the Al2O3
after dispersion are suitable for forming the heat pathways to
improve the thermal conductivity of the epoxy matrix. The thermal
conductivity of the ZnO adhesive is about 0.81 W m 1 K 1 at the
lling load of wt 66.3%. The thermal conductivity of the ZnO is not
high, but the thermal conductivity of the ZnO adhesive is higher
than that of the Al2O3 adhesive at the corresponding lling load,
which is related to that the ller of ZnO has different shapes [20].
The Ag adhesive has been prepared and measured at only one lling
load to verify the enhancement of the thermal conductivity of the
epoxy resin as in the literature [26].
As shown in Fig. 3, with the lling load increasing, the thermal
conductivities of all the seven samples (only one point for Ag) rst
increase slowly, then increase rapidly, and nally converge to the
maximum values. It is believed the phenomena to be agreeable
with the lling theory [31,38], when the lling load is low, isolated
island effect are caused in the resin and only few heat pathways are

Y.-X. Fu et al. / Applied Thermal Engineering 66 (2014) 493e498

formed, and the enhancement of the epoxy matrix thermal conductivity at low lling loads is very slow. With the lling load
increased, the heat pathways are gradually increased, which cause
the rapid increase of the epoxy matrix thermal conductivity. When
the lling load reaches the maximum value, the llers will aggregate, and the thermal conductivity of the epoxy matrix cannot be
increased higher.
The cross-sectional images of all samples shown in Fig. 4, which
can directly reect the llers dispersion states in the resin matrix
and indirectly verify the above-mentioned thermal conductivity of
thermal adhesives results. Fig. 4a is pure epoxy resin crosssectional SEM images after the de-aeration, from which we can
nd some micro-scale bubbles (the red circles (in the web version
only)) scattered in the cross section, which may be can explain the
pure epoxy resin a little lower thermal conductivity than that of the
previous reports. Fig. 4b shows the cross section of the ZnO adhesive, from which many ZnO grains are well distributed in the epoxy
resin with some contact points (the red arrow) can be observed, in
addition, some ZnO aggregations (the white arrow) in certain areas
also can be seen surely. From Fig. 4c of the cross section of the BN
adhesive, it can be seen that the micro BN particles are well mixed
with the resin and the effective heat conduction areas (the red
region) have been formed. Al2O3 powders are not well distributed
in the epoxy resin as shown in Fig. 4d, which is probably due to that
the Al2O3 particle is bigger, and some larger cracks are easy to form
at the contact areas of the grains (the red arrow). In addition, the
aggregations (the red arrow) can also be found in the cross section.
Thus, ball shape llers are not suitable for forming the heat

497

pathways. Fig. 4e shows the cross section of the graphite adhesive,

from which we can see that layer graphite is well distributed in the
resin, and not many aggregations (the yellow arrow) can be found,
which is favored for heat pathways and one reason for the highest
thermal conductivity of the graphite adhesive among the eight
thermal conductive adhesives. From the cross-sectional image of
the Al adhesive as shown in Fig. 4f, it can be seen that the ball shape
aluminum powders are scattered in the resin and form the heat
pathway of point contacts (the yellow arrow). The hollows in the
cross section are caused by dropdown of the Al powders when
cutting, not the bubbles formed during the preparation. The Cu
powders are well distributed (the yellow arrow) in the resin, as
shown in Fig. 4g, which is probably due to the laminate-shape
structure of the Cu powder. The diamond powders are still
rhombus in the resin, as shown by the red arrow in Fig. 4h, which is
not favorable to form the heat pathways and may be the reason the
thermal conductivity of the diamond-epoxy resin is not so high.
There are some aggregations (the red arrow) observed in the crosssection of the Ag adhesive, as shown in Fig. 4i. No clear heat
pathways can be observed in the Ag adhesive, which probably due
to the relative low lling load and the Ag powders are sparsely
scattered in the resin.
4. Conclusions
Eight kinds of llers with different shape are studied in this
study to analyze the mechanism and effects of the thermal conductivity enhancement of epoxy resin thermal adhesives. The

Fig. 4. SEM images of thermal adhesives cross section. (a) Pure epoxy resin, adhesive with (b) ZnO, (c) BN, (d) Al2O3, (e) graphite, (f) Al, (g) Cu, (h) diamond and (i) Ag.

498

Y.-X. Fu et al. / Applied Thermal Engineering 66 (2014) 493e498

results show the layer structure llers are more favorable than the
ball-shape llers for the enhancement of the thermal conductivity
of epoxy matrix, while the llers with sharp-corner shape are the
most difcult to form the heat pathways in the epoxy resin. In
considering the ller cost and the thermal conductivity of thermal
adhesive, we can estimate the layer structure graphite-epoxy
thermal adhesive has a higher cost performance than the others
seven different thermal adhesives in the electron device heat
dissipation applications. Meanwhile the results of the effects of the
powder shape and lling load of the llers may be helpful for
choosing the potential ller candidate and evaluating their performance and economy to develop new thermal conductive adhesives for the industrial electronic packaging.
Acknowledgements
Financial supports from the Key Program of NSFC-Guangdong
Joint Fund (Grant no. U1034004) and NSFC (Grant no. 51206193)
are gratefully acknowledged.
References
[1] M. Ponce, A.J. Martinez, J. Correa, M. Cotorogea, J. Arau, High-efcient integrated electronic ballast for compact uorescent lamps, IEEE Trans. Power
Electron. 21 (2006) 532e542.
[2] B. Dercks, R. Zecirovic, G. Ruffert, M.P. Grun, M. Grunewald, A microstructured,
exible and modular device for desorption: the high efciency contactor,
Chem. Ing. Technol. 83 (2011) 1125e1128.
[3] D.H. Chow, J.A. Roth, S. Thomas, K. Kiziloglu, C.H. Fields, A. Arthur,
P.M. Enquist, G. Fountain, F. Reed, B. Johs, G.L. Olson, W.S. Williamson, Integrated multiple sensor controlled molecular beam epitaxy for high performance electronic devices, in: 2000 International Conference on Indium
Phosphide and Related Materials, Conference Proceedings, 2000, pp. 33e36.
[4] Y.C. Liang, J.N. Zhang, M. Li, Y.P. Guo, J.S. Yuan, Thermal analysis of the heat
exchanger for power electronic device with higher power density, Prz. Elektrotech. 88 (2012) 328e332.
[5] R.J. McGlen, R. Jachuck, S. Lin, Integrated thermal management techniques for
high power electronic devices, Appl. Therm. Eng. 24 (2004) 1143e1156.
[6] A.B. Cohen, A.D. Kraus, S.F. Davidson, Thermal frontiers in design and packaging of microelectronic equipment, J. Mech. Eng. 105 (1982) 53e59.
[7] Liyu Yang, Rui Niu, Jinsong Xie, Bin Qian, Baishi Song, Qingan Rong,
J. Bernstein, Design-for-reliability implementation in microelectronics packaging development, Microelectron. Int. 28 (2011) 29e40.
[8] F. Sarvar, D.C. Whalley, Thermal design of high power semiconductor packages for aircraft systems, J. Electron. Manuf. 9 (1999) 269e274.
[9] A.E. Bergles, Evolution of cooling technology for electrical, electronic, and
microelectronic equipment, IEEE Trans. Compon. Packag. Technol. 26 (2003)
6e15.
[10] A. Ammous, F. Sellami, K. Ammous, H. Morel, B. Allard, J.P. Chante, Developing
an equivalent thermal model for discrete semiconductor packages, Int. J.
Therm. Sci. 42 (2003) 533e539.
[11] T.J. Lu, Thermal management of high power electronics with phase change
cooling, Int. J. Heat Mass Transf. 43 (2000) 2245e2256.
[12] S. Choi, H. Im, J. Kim, The thermal conductivity of embedded nano-aluminum
nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles, Nanotechnology 23 (2012).
[13] A.P. Yu, P. Ramesh, X.B. Sun, E. Bekyarova, M.E. Itkis, R.C. Haddon, Enhanced
thermal conductivity in a hybrid graphite nanoplatelet-carbon nanotube ller
for epoxy composites, Adv. Mater. 20 (2008) 4740e4744.
[14] M. Wang, Q.J. Kang, N. Pan, Thermal conductivity enhancement of carbon ber
composites, Appl. Therm. Eng. 29 (2009) 418e421.

[15] K.M.F. Shahil, A.A. Balandin, Graphene-multilayer graphene nanocomposites as highly efcient thermal interface materials, Nano Lett. 12
(2012) 861e867.
[16] S.H. Song, K.H. Park, B.H. Kim, Y.W. Choi, G.H. Jun, D.J. Lee, B.S. Kong, K.W. Paik,
S. Jeon, Enhanced thermal conductivity of epoxy-graphene composites by
using non-oxidized graphene akes with non-covalent functionalization, Adv.
Mater. 25 (2013) 732e737.
[17] C. Lin, D.D.L. Chung, Graphite nanoplatelet pastes vs. carbon black pastes as
thermal interface materials, Carbon 47 (2009) 295e305.
[18] H. Im, J. Kim, The effect of Al2O3 doped multi-walled carbon nanotubes on the
thermal conductivity of Al2O3/epoxy terminated poly(dimethylsiloxane)
composites, Carbon 49 (2011) 3503e3511.
[19] X.Y. Huang, T. Iizuka, P.K. Jiang, Y. Ohki, T. Tanaka, Role of interface on the
thermal conductivity of highly lled dielectric epoxy/AlN composites, J. Phys.
Chem. C 116 (2012) 13629e13639.
[20] Q.H. Mu, S.Y. Feng, G.Z. Diao, Thermal conductivity of silicone rubber lled
with ZnO, Polym. Compos. 28 (2007) 125e130.
[21] K.C. Yung, H. Liem, Enhanced thermal conductivity of boron nitride epoxymatrix composite through multi-modal particle size mixing, J. Appl. Polym.
Sci. 106 (2007) 3587e3591.
[22] Y.X. Zhang, X.Y. Hu, J.H. Zhao, K. Sheng, W.R. Cannon, X.H. Wang, L. Fursin,
Rheology and Thermal conductivity of Diamond powder-lled liquid epoxy
encapsulants for electronic packaging, IEEE Trans. Compon. Packag. Technol.
32 (2009) 716e723.
[23] Y.S. Eom, K.S. Choi, S.H. Moon, J.H. Park, J.H. Lee, J.T. Moon, Characterization
of a hybrid Cu paste as an isotropic conductive adhesive, Etri J. 33 (2011)
864e870.
[24] H.G. Lee, K.W. Paik, Vertically aligned nickel nanowire/epoxy composite for
electrical and Thermal conducting material, in: 2012 IEEE 62nd Electronic
Components and Technology Conference (ECTC), 2012, pp. 2087e2090.
[25] W.Y. Zhou, Effect of coupling agents on the thermal conductivity of aluminum
particle/epoxy resin composites, J. Mater. Sci. 46 (2011) 3883e3889.
[26] J.L. Zeng, Z. Cao, D.W. Yang, L.X. Sun, L. Zhang, Thermal conductivity
enhancement of Ag nanowires on an organic phase change material, J. Therm.
Anal. Calorim. 101 (2010) 385e389.
[27] M.J. Yim, Y. Li, K.S. Moon, K.W. Paik, C.P. Wong, Review of recent advances in
electrically conductive adhesive materials and technologies in electronic
packaging, J. Adhes. Sci. Technol. 22 (2008) 1593e1630.
[28] D.A.G. Bruggeman, Berechnung verschiedener physikalischer Konstanten von
heterogenen Substanzen. I. Dielektrizittskonstanten und Leitfhigkeiten der
Mischkrper aus isotropen Substanzen, Ann. Phys. 416 (1935) 636e663.
[29] Y. Agar, T. Uno, Thermal conductivity of polymer lled with carbon materials:
effect of conductive particle chains on thermal conductivity, J. Appl. Polym.
Sci. 30 (1985) 2225e2235.
[30] S.E. Gustafsson, Transient plane source techniques for thermal conductivity
and thermal diffusivity measurements of solid materials, Rev. Sci. Instrum. 62
(1991) 797e804.
[31] Mattias Gustavsson, Ernest Karawacki, Silas E. Gustafsson, Thermal conductivity, thermal diffusivity, and specic heat of thin samples from transient measurements with hot disk sensors, Rev. Sci. Instrum. 65 (1994)
3856e3859.
[32] I. Novak, I. Krupa, Electro-conductive resins lled with graphite for casting
applications, Eur. Polym. J. 40 (2004) 1417e1422.
[33] Y. Yamamoto, T. Imai, K. Tanabe, T. Tsuno, Y. Kumazawa, N. Fujimori, The
measurement of thermal properties of diamond, Diam. Relat. Mater. 6 (1997)
1057e1061.
[34] W.M. Rohsenow, J.P. Hartnett, Y.I. Cho, Handbook of Heat Transfer, 1985, p. 122.
[35] M.J. Yim, Y. Li, K.S. Moon, C.P. Wong, Oxidation prevention and electrical
property enhancement of copper-lled isotropically conductive adhesives,
J. Electron. Mater. 36 (2007) 1341e1347.
[36] A. Arranz, C. Palacio, Characterization of the surface and interface species
formed during the oxidation of aluminum, Surf. Sci. 355 (1996) 203e213.
[37] C.P. Wong, R.S. Bollampally, Comparative study of thermally conductive llers
for use in liquid encapsulants for electronic packaging, IEEE Trans. Adv.
Packag. 22 (1999) 54e59.
[38] Y. Agari, M. Tanaka, S. Nagai, Thermal conductivity of a polymer composite
lled with mixtures of particles, J. Appl. Polym. Sci. 34 (1987) 1429e1437.