Report Intra

INDUSTRIAL TRAINING (WIB39908)
CHAPTER 1
INTRODUCTION
1.1 Industrial training objective
The main objective of the Industrial Training is to experience and understand

real life situations in industrial organizations and their related environments and
accelerating the learning process of how students knowledge could be used in a
realistic way. In addition to that, industrial training also makes one understand the
formal and informal relationships in an industrial organization so as to promote
favorable human relations and teamwork. Besides, it provides the exposure to practice
and apply the acquired knowledge hands - on in the working environment. Industrial
training also provides a systematic introduction to the ways of industry and developing
talent and attitudes, so that one can understand how Human Resource Development
works.
Moreover, students can gain hands-on experience that is related to the students
majoring so that the student can relate to and widen the skills that have been learnt
while being in university. Industrial training also exposes the students to the real career
world and accustoms them to an organizational structure, business operation and
administrative functions.
Furthermore, students implement what they have learned and learn more
throughout this training. Besides, students can also gain experience to select the
optimal solution in handling a situation. During industrial training students can learn the
accepted safety practices in the industry. Students can also develop a sense of
responsibility towards society.
[Type text]
1.2 Important of industrial training to students
Industrial Training is very important to the students because the current training
conducted situations students will be exposed to real working environment. Students
are able to distinguish the situation in the learning of the world of work. Based on the
experience that students will try to equip themselves with the experience and
knowledge they have learned as a first step to go through the world of work.
Relationship amongst our employees to foster a sense of family among them.
Indirectly, students can see the relationship between the theories learned to the
work done in the course of industrial training. What has been learned in higher
education can be practiced in the training industry.
In practical training, there are some things cannot be acquired during the
studies, but the information can be obtained through a training session this industry.
Therefore, there is no denying industrial training for one semester can offer quite useful
to students pursuing training industry.
[Type text]

CHAPTER 2
COMPANY INFORMATION
2.1 Company Background
STATS ChipPAC Ltd. (STATS ChipPAC or the Company - SGX-ST:

STATSChP) is a leading provider of advanced semiconductor packaging and test
services. STATS ChipPACs full turnkey semiconductor solutions include package
design, bump, probe, assembly, test and distribution services. We have the scale to
provide a comprehensive range of semiconductor packaging and test solutions to a
diversified global customer base servicing the communication, consumer and
computing markets.
With a strong technology portfolio ranging from flip chip, wafer level and
advanced 3D packages to leadframe and laminate based packages, STATS ChipPAC
provides customers with innovative and cost-effective semiconductor solutions. We
have a leadership position in advanced packaging technology including fan-in and fanout wafer level packaging, flip chip interconnect, 3D integration and Through Silicon Via
(TSV) to meet the increasing market demand for next-generation electronic devices
with higher levels of integration, increased functionality and compact sizes. We provide
wafer probe and final testing on a diverse selection of test platforms, with expertise in
testing a broad variety of semiconductors for mixed-signal, radio frequency, analog and
high-performance digital devices.
[Type text]

With corporate headquarters in Singapore, our global manufacturing facilities
are strategically located in South Korea, Singapore, China, Malaysia and Taiwan (which
includes our 52%-owned subsidiary, STATS ChipPAC Taiwan Semiconductor
Corporation). We market our services through our direct sales force in the United
States, South Korea, Japan, China, Singapore, Malaysia, Taiwan and Switzerland. With
an established presence in the countries where strategic semiconductor markets are
located, we are in close proximity to the major hubs of semiconductor manufacturing
which allows us to provide customers with fully-integrated, multi-site, end-to-end
packaging and test services.
STATS ChipPAC Malaysia (SCM)
Located in the Ulu Kelang Free Trade Zone, STATS ChipPAC's 488,448 square
foot operation in Kuala Lumpur provides a full range of integrated test and assembly
services. STATS ChipPAC Malaysia (SCM) is STATS ChipPACs primary site for
advanced leadframe based packaging and test, offering high volume turnkey services
for BCC and QFN packaging and test. SCM also offers a full range of IC testing
capabilities for analog and mixed signal devices, and is STATS ChipPACs Center of
Excellence for RFTest. In operation since 1974, the Malaysian facility features a state of
the art automated product distribution center with 24 hour support.
figure 1 STATS ChipPAC Malaysia
[Type text]

2.1.1 Company Organization Chart
JA LEW
PRESIDEN /
Pengarah
Pamela Tan,
Urusan
Setiausaha Eksekutif
IC
Assembl
y
Operatio
s
QUALITY &
CL TEH
RELIABILITY
Pengarah
ASSURANCE
IC TEST
POWER
Customer
Service,
Operations
Operation
s
Planning &
Logistics
IE
IE &
&
PREMBAJ
KK WONG
ST GOH
Facilities
Facilities
Naib
Presiden
CL
Tan
CL Tan
Pengarah
R&D
Pengarah
Pengarah
Pengarah
SH NGU
FINANCE
Pengarah
PROCUREMENT
HUMAN
RESOURCE
S
BAHAROM
KY
CHUNG
Pengarah
CB SOH
INFORMATION
Pengurus
TECHNOLOGY
CV KWONG
KASIM
Naib
Presiden
Pengarah
KT KWAN
Pengarah
2.1.2 Company logo
figure 2 STATS ChipPAC logo
2.1.3 Company Profile

[Type text]
NAME
STATS ChipPAC Malaysia Sdn

Bhd
DATE INCORPORATED
July 1974
TYPE OF BUSINESS
Semiconductor Industry
BUSINESS ADDRESS
73 Lorong Enggang
Ulu Kelang Free Trade Zone
54200 Kuala Lumpur, Malaysia
TELEPHONE
603-4257-6222
FAXCIMILE
603-4256-2414
E-MAIL
hr.my@statschippac.com
WEBSITE
www.statschippac.com.my
HUMAN RESOURCE
STATS ChipPAC Malaysia Sdn

Bhd
73 Lorong Enggang
Ulu Kelang Free Trade Zone
54200 Kuala Lumpur, Malaysia
2.1.4 Company Vision & Mission
Vision :
[Type text]

"To be the premier packaging, test and back end supply chain solutions provider
delivering best in class service in our chosen markets"
Mission :
"To deliver differentiating backend solutions to our customers in our chosen markets
through leadership in innovative advanced packaging solutions, world class operational
excellence, cost competitiveness, and efficient and reliable supply chain solutions."
2.1.5 Company Core Values
Customer focus - "We owe our business to our customers, we strive to meet and
exceed to our customers expectations at all time. We understand our customers'
priorities and deliver to our commitments."
Integrity - "We mean what we say and say what we mean. We establish relationship of
trust, honesty and sincerity with people we deal with."
Teamwork - "We collectively work as a team, bringing our individual talent, experience
and expertise to achieve common goals,"
Ownership - "We are owners of statschippac, we own our responsibilities and are
accountable for our actions."
Passion to win - "We never give up till we succeed. We will strive to excel in everything
we do and perseverse till we do."
2.2 Department Background of IC Post Test
There are the major department in SCM :

[Type text]
FOL (front of line)
EOL (end of line)
Test
Post Test
2.2.1 IC Post Test
For STATS ChipPAC, every stage in the manufacturing process is critical,

including Post Test. Consequently, STATS ChipPAC has established highly-automated
Post Test systems to achieve extremely high throughput while maintaining a zero
defects standard of quality.
STATS ChipPAC has achieved this goal by working closely with technology
leaders in vision inspection, Final Marking and Tape and Reel systems to integrate
these Post Test functions into a fully-automated Post Test process that maximizes
throughput while minimizing manual handling. Integrated within this process is
automatic 3D (top, bottom and sides) inspection of every device package to eliminate
any packaging flaws before the devices are shipped to the end customer.
Each Post Test service is presented below, but it is important to realize that
many of these services are performed on the same equipment, seamlessly integrating
these services within a fully automated manufacturing process. For instance, it is
common at STATS ChipPAC for Tape and Reel equipment to include a built-in 3D vision
inspection system. Even Final Marking can be performed on the same Tape and Reel
equipment. Unless specifically stated otherwise, the following services apply to all
devices and all types of packages arriving from Final Test in trays or tubes.
There are some machine in the Post Test department :
VIS Dynamics Machine
STI Machine
[Type text]
Hexa Machine
ICOS Machine
2.2.2 Final Marking
STATS ChipPAC provides Final Marking services for customers who require
multiple good bins to segregate their good units based on performance such as speed
grading their devices. These services include:
Final laser mark to in-tray devices
Final ink mark to in-tray devices
Final laser mark to in-tube devices
Re-work ink mark for mold packages (using black top method)
2.2.3 Baking
STATS ChipPAC uses large capacity ovens in a fully automated baking process
with built-in oven control systems that control and monitor the entire bake cycle. This
system automatically tracks the baking process until the lot completes the dry packing
cycle and generates a moisture exposure tracking report at the end of the cycle.
2.2.4 3D Inspection System
[Type text]

STATS ChipPAC performs 100% 3D inspection of every device using automatic
scanners that check for planarity (warpage), pitch, orientation, marking and package
dimensions. STATS ChipPAC also offers the capability to correct and re-inspect small
defects in good devices to minimize waste (disposal of recoverable devices) at Post
Test.
2.2.5 Tape and Reel
STATS ChipPAC provides 100% taping and de-taping capability. High speed
tape and reel services are available for most package types to avoid late shipments due
to bottlenecks at Post Test. STATS ChipPAC continually replaces its older Tape and
Reel systems with highly integrated Tape and Reel systems that include many of the
services highlighted above to provide the highest possible throughput at the highest
possible quality level.
2.2.6 Customs Post Test Solutions
STATS ChipPAC also has the expertise and flexibility to support custom Post
Test solutions requested by customers, such as serialization of units and special IT data
management requirements. As a service provider, STATS ChipPAC designs into its
standard manufacturing processes the capability for flexibility to quickly support special
requests from customers.
2.2.7 Packing
[Type text]
Page

In its mission to eliminate the possibility of mistakes in Post Test, STATS
ChipPAC uses automated visual aid systems to display a customers specified packing
method and bill of materials. Label generation is also fully automated including the
automatic generation of device-dependent, Moisture Sensitivity Levels (MSL) labels. By
default, STATS ChipPAC uses vacuum aluminum packing bags with bar code labeling,
but can also support custom requirements.
2.2.8 Drop Ship
Drop ship means that STATS ChipPACs customers do not need to bear the
expenses of maintaining inventory at their own facilities. STATS ChipPAC can instead
ship your final products directly to your end customers. Of course, you can also choose
to have STATS ChipPAC ship your final products to your own facility.
CHAPTER 3
[Type text]
Page
PREVENTIVE MAINTENANCE
The care and servicing by personnel for the purpose of maintaining equipment
and facilities in satisfactory operating condition by providing for systematic inspection,
detection, and correction of incipient failures either before they occur or before they
develop into major defects. Maintenance, including tests, measurements, adjustments,
and parts replacement, performed specifically to prevent faults from occurring.
The primary goal of maintenance is to avoid or mitigate the consequences of
failure of equipment. This may be by preventing the failure before it actually occurs
which Planned Maintenance and Condition Based Maintenance help to achieve. It is
designed to preserve and restore equipment reliability by replacing worn components
before they actually fail. Preventive maintenance activities include partial or complete
overhauls at specified periods, oil changes, lubrication and so on. In addition, workers
can record equipment deterioration so they know to replace or repair worn parts before
they cause system failure. The ideal preventive maintenance program would prevent all
equipment failure before it occurs.
While preventive maintenance is generally considered to be worthwhile, there
are risks such as equipment failure or human error involved when performing
preventive maintenance, just as in any maintenance operation. Preventive maintenance
as scheduled overhaul or scheduled replacement provides two of the three proactive
failure management policies available to the maintenance engineer. Common methods
of determining what Preventive (or other) failure management policies should be
applied are; OEM recommendations, requirements of codes and legislation within a
jurisdiction, what an "expert" thinks ought to be done, or the maintenance that's already
done to similar equipment, and most important measured values and performance
indications.
In IC Post Test department, there are several equipment that requires preventive
maintenance, such as :
[Type text]
Page
Ionizer Blower Fan
Zebra Printer
Rework Machine (SP-300)
Transfer fixture / QQQ flute
3.1 Ionizer Blower Fan
Device that uses high voltage to ionize (electrically charge) air molecules.
Negative ions, or anions, are particles with one or more extra electrons, conferring a net
negative charge to the particle. Cations are positive ions missing one or more electrons,
resulting in a net positive charge. Most commercial air purifiers are designed to
generate negative ions. Another type of air ionizer is the ESD ionizer (balanced ion
generator) used to neutralise static charge.
Figure 3 Ionizer Blower Fan
The ionizer can operate with external sensors to maintain precise balance
(better than 1V) by altering ion output and adapting to environment changes. With the
[Type text]
Page

optional sensor and collimator, the Model 5802i delivers precisely balanced and
directed ionized air to your target without taking up valuable room in your environment.
A greater concentration of emitter points and internal circuitry suited for high humidity
applications makes the Model 5802i the standard choice for environments that need
quality ESD protection with solid design.
3.1.1 Basic Operation of ioniser
The Bench Top Blower ioniser employs the safe non-nuclear AC ionization
source. AC systems utilize emitter electrodes that are switched rapidly between positive
and negative high voltage, usually at the power line frequency (50Hz). The ionizer's
unique Faraday Balance System monitors ion output and automatically adjusts the unit
to teach an equilibrium at low offset voltage or balanced ion flow. The ionizer is
designed to achieve balance under extreme condition and is uniquely able to maintain
balance in most any environment.
Ions are emitted in an efficient laminar flow. This reduce air turbulence and ion
recombination, prolongs cleanliness and increases efficiency. The ionizer's unique trimetallic ion emitter electrodes produce a high ion output for rapid charge dissipation.
The Bench Top Ionizer is engineered for efficiency and durability, making the Bench Top
Ionizer highly dependable and cost effective.
3.1.2 Maintenance of ionizer
[Type text]
Page

As with all ionizer, periodic maintenance will be needed to provide optimum
performance. The frequency of monitoring ionizer's really depends on how and where
the are used. Since the majority of them use a fan to transport the ions to the working
area, the cleanliness of the air directly affects their performance over time and how
often the emitters should be cleaned.
The ionizer recommends checking in every 3 months, but this may not be
suitable for many programs particularly since an out of balance may exist for months
before it checked again. There are a few servicing methods should be followed for any
preventive maintenance :
General Cleaning
Use air gun to blow of the dusts accumulated inside the ionizer blower fan
Clean the ionising needle with erasing rubber or/and cotton stick dampened with
IPA
Performance Check
Place the blower at about 2 feet away from the charge plate of AM5000 or
equivalent with the direction of air flow towards the plate. Perform ion balance
and decay test.
Ion balance should be within +/- 35V
The decay time should not be greater than 5 sec when discharge from +/1000V to +/- 1000V
[Type text]
Page
Ion balance/time decay before cleaning
Ion balance/time decay after cleaning
[Type text]
Blow/clean the blower fan/grill
Clean the ionizer needle
Page

3.2 Zebra Printer
Zebra Technologies is a manufacturer of thermal bar code label and receipt

printers, RFID smart label printer/encoders, card and kiosk printers, based in Vernon
Hills, Illinois. Zebra has products in 100 countries around the world. Zebra-brand
printers are used by more than 90 percent of Fortune 500 companies.
figure 4 Zebra Label Printer
The enhanced of zebra printer are :

Extreme fast
Faster print speeds - up to 356mm per second for increase batch and print
productivity
Fast 10/100 network connectivity as standard.
Totally reliable
Dependable print quality - onboard diagnostics to ensure optimum print quality
Improved ribbon and media - low LCD/network alerts
[Type text]
Page

Incredibly robust
Construction - 12 gauge steel frame
Designed foe continuous use.
3.2.1 Maintenance of Zebra Printer
The Zebra printer recommends checking in every months. As with all zebra
printer, periodic maintenance will be needed to provide optimum performance. There
are some method that should to follow regarding on servicing :
Cleaning :
Remove dirt and lint from the interior of the printer using brush and vacuum
cleaner
Clean the print head using IPA or equivalent
Rotate the platen roller and clean with IPA
Rotate and clean the peel-off upper guide rod, plated guide rod, rewind power
roller and lower guide rod with IPA
Clean tear off/peel off plate with IPA
Blow media, ribbon and stuck media along the media path
[Type text]
Page
figure 5 Cleaning a typical printhead
Adjustment :
Check for ribbon spindle tension
Check for ribbon guide plate
figure 6 Ribbon flow
[Type text]
Page
Print quality verification :

Print test label by press the |pause| button while turning on the printer. Release the
button when the front panel LEDS turn on.
Check the test label and perform adjustment if missing print in printed area,
missing or light vertical line, missing horizontal line, light or no printing on the left
or right hand side, and illegible print.
Paste the test label on the PM checklist
figure 7 Test label
[Type text]
Page
figure 8 Test sample label
figure 9 Test sample label
[Type text]
Page
Cleaning process
Adjustment
process
Print quality
verification
[Type text]
Page
3.3 Rework machine (SP-300)
The ICs are directly processed from the sticks and for better performance the
ICs can be automatically fed into an empty stick after preforming. Due to the simple
design of the machine, the operation and setup of the machines are very easy and
large scale adjustments are not required.
The handling of different pitches is achieved by changing the feeding rails. The
standard sets the IC leads to the right pitch. For additional cutting and kinking of the
leads customized machines with special tooling are available.
Before mounting ICs to the PCB, it may be necessary to alter the pitch of the
leads. This product preforms the legs of ICs in order to present a correct entry angle
into the PCB saving valuable production labor time.
The performance of the model can be 3 sec for standard IC tube. The ICs are
directly processed from the sticks and automatically fed into an empty stick after
preforming. Simple and easy operation design.
Rework machine
[Type text]
Page
This machine is to rework the failure lead of ICs :
Lead pitch
Bent lead
Implied coplanarity
3.3.1 Maintenance of rework machine
As with all ionizer, periodic maintenance will be needed to provide optimum

performance. The ionizer recommends checking in every weeks,
General cleaning for 3 stations :
Combing (station1)
Initial forming (station2)
Final forming (station3)
Servicing method :
Clean air and vacuum filter
Check tubing for any leakage
Check sensor (working condition)
Check Indicator lamp (working condition)
[Type text]
Page
Station
1
Station
2
Station
3
[Type text]
Page
3.4 Transfer fixture / QQQ flute
A device used as an intermediate in the Transfer of a unit. The transfer unit of the flute
to the tube.
Servicing method of transfer fixture :
Loosen the screw at the top section of the transfer fixture
Remove all dirt on transfer fixture by using brush
Clean the transfer fixture track by using IPA
Blow the transfer fixture track by using airgun
tighten tall screw at the top section of transfer fixture
[Type text]
Page
Servicing method on QQQ flute :
Remove all dirt at flute using brush
Clean the flute track using IPA
Blow the flute track using airgun
[Type text]
Page
CHAPTER 4
VIS DYNAMIC MACHINE
4.1 Introduction
Machines for manufacturing, packing and packaging semiconductors; handling

machines used for processing and production of semiconductor chips and electronic
components in the semiconductor industry, namely, tape and reel machines, vision
inspection machines
Apparatus
for
testing
semiconductors,
namely,
automated
functional,
parametric, open/short or high frequency (HF) testers; electronic test equipment,

namely, automated testing machines for use in the semiconductor field; vision
inspection apparatus for use in the semiconductor industry; test handler machines for
functional, parametric, open/short or high frequency (HF) testing of semiconductor chips
and electronic components
ME2085 is an application that combines two applications listed below into one:
ME2083 On-Track 2D/3D Lead & Mark Inspection
ME2082 In-Pocket 2D Lead & Mark Inspection
It is the advanced vision inspection software specifically catered for
VisDynamics G6 Tape and Reel machine that incorporates two independent vision
inspection sites.
[Type text]
Page

ME2083 takes charge of on-the-track inspection of semiconductor devices as
the devices are being fed through singulation track on a conversion kit by gravitational
force.
After the device has been transferred into the embossed pocket of the carrier
tape, just before the device is being sealed up under the cover tape, ME2082 inspection
system performs another full inspection to ensure ultimate quality assurance from
possible visual mechanical defects on the device.
Though ME2085 is a single application, it provides a seamless graphical user
interface that accommodates two independent entities, ME2082 and ME2083.
[Type text]
Page
4.2 Capability of ME2083
ME2085 is a vision inspection application for semiconductor devices as they are

moving down along an inclined track by gravitational feeding. The range of device type
that can be inspected by ME2085 includes gull-wing leaded devices (such as SOIC,
SSOP, TSSOP, MSOP, TO220, TO263 etc) and dual-in line leaded devices (such as
PDIP).
VISDynamics machine is able to perform:
i.
Detection of lead defects including broken lead, missing lead and wrong lead
count.
ii.
2D lead measurements (Pitch, Skew, Sweep and Tip to Tip)
iii.
3D lead measurements (Lead Standoff, Body StandOff and Co-planarity)
iv.
Mark inspection
v.
Orientation inspection
ME2085 employs innovative optics technology in that front lighting for mark
inspection and back lighting for 2D/3D lead inspection are combined and blended to
produce a single high quality image by a single camera.
[Type text]
Page
4.3 Flow Operation of ME2085
[Type text]
Page
4.4 3D Vision System
Using ME2085, an advanced vision inspection software that employs innovative

optics technology in that front lighting for mark inspection and back lighting for 2D/3D
lead inspection are combined and blended to produce a single high quality image by a
single camera.
The optical station (where inspection takes place) consists of:
A track insert with flat top surface acting as seating pedestal
The track insert may be flanged by shoulders of known height above the seating
pedestal
2 inwardly inclined reflective surfaces below the pedestal
2 reflective surfaces (mirrors) at both sides of the track insert, with adjustable
inclining angle
LED illumination panel at the bottom of the track insert to provide even and
diffused back lighting for lead inspection
Programmable multi-channel LED light segments on top of track insert to

provide front illumination for mark and orientation inspection
Vision stopper, bottom vacuum and track guides (optionally moveable), all built
around the track insert to dynamically stabilize and precise device for inspection
[Type text]
Page
track
insert
side
reflector
[Type text]
Page
4.5 2D Vision System
It is important to have a focus image, before vision system can perform a good
inspection job. Tune the lens attached to the camera to adjust the focus. Before tuning
the focus, it is recommended to zoom the image to a larger scale (zoom-in). Do not
zoom out the image since it is hard to be observed whether the image is in focus or not.
If fixed focal lens are used instead of zoom lens, adjusting the distance between
camera and object for zoom effect. For focus effect, user needs to adjust the distance
between camera and lens.
There are type of 2D inpection :
Lead pitch
Lead skew
Tip to tip
[Type text]
Page

4.6 3D Lead Inspection Parameters
1. Lead standoff (from body)
Lead standoff is vertical distance of a lead tip from the plane (zero datum plane)
along the bottom side of the package.
Since during inspection, the device is vacuumed to ensure its bottom side is fully
resting on the surface of the vision track insert, it follows that lead standoff is
measured as vertical distance from the plane along the surface of the vision
track insert to the lead tip.
Typically, the vision track insert is designed with flanges (of mirror finishing) of 3
mils above the surface of track insert. This design allows negative lead standoff
(lead tip is above the surface of the bottom side of the package) to be
measurable.
2. Body standoff (from seating)
Body standoff is the vertical distance from the lead seating plane of the device
to the plane along the bottom side of the package (within the footprint of the
leads). Since body standoff concerns with the distance between two planes, to
meet complete measurement interest, minimum and maximum body standoffs
are computed.
[Type text]
Page
Since device being dealt with is with rigid and flat surface at the bottom side,
one way to measure this parameter on an external gauge (such as a profile
projector) for verification or correlation purposes is by measuring vertical
distances of the package body from its seating plane at four extreme corners, as
illustrated.
3. Coplan 1 (per side)

Coplan1 is the distance of a lead tip from the lowest lead tip on the same side,
measured in a direction vertical to the plane along the bottom side of the package
(which is also the plane along the surface of the vision track insert).
[Type text]
Page
4.7 2D Lead Inspection Parameters
1. Lead picth
Pitch is the distance between adjacent lead tips and is measured along Xdirection of
the package.
2. Lead skew
Skew is the deviation of a lead tip from its ideal position measured along Xdirection of
the package. Skew in clockwise direction is signed positive and vice versa.
[Type text]
Page
3. Tip to tip
Tip to tip is the distance between two opposite lead tips, measured along Ydirection of
the package.
4. Lead sweep
Sweep at a side is the average of lead skews of all the leads on the same side.
[Type text]
Page
4.8 Jam Rate analysis
In a machine, there are several related jam units used in the inspection process.
Each machine will normally occur jam. Jam resulting from various aspects, one aspect
may be the type of the unit itself, the type of machine for a hammer, or a pound of
negligence modifications of the machine. In addressing the jam, there are a number of
analytical solutions have been made. In this machine, Pareto diagram analysis chosen
as a way of determining a jam. Therefore, a solution to overcome the jam is to use your
method of 'fishbone' analysis.
4.8.1 Pareto Analysis
Pareto analysis is a formal technique useful where many possible courses of

action are competing for attention. In essence, the problem-solver estimates the benefit
delivered by each action, then selects a number of the most effective actions that
deliver a total benefit reasonably close to the maximal possible one.
Pareto analysis is a creative way of looking at causes of problems because it
helps stimulate thinking and organize thoughts. However, it can be limited by its
exclusion of possibly important problems which may be small initially, but which grow
with time. It should be combined with other analytical tools such as failure mode and
effects analysis and fault tree analysis for example.
Analysis can be used to identify the root causes of the problems. While it is
common to refer to pareto as "80/20" rule, under the assumption that, in all situations,
20% of causes determine 80% of problems, this ratio is merely a convenient rule of
thumb and is not nor should it be considered immutable law of nature.
[Type text]
Page
4.8.2 FishBone Analysis
Common uses of the fishbone diagram are product design and quality defect
prevention, to identify potential factors causing an overall effect. Each cause or reason
for imperfection is a source of variation. Causes are usually grouped into major
categories to identify these sources of variation. The categories typically include:
Man : Anyone involved with the process
Material : Raw materials, parts, pens, paper
Machine : Any equipment, computers, tools
Method : : How the process is performed and the specific requirements
From the pareto chart, the major errors that need to be analyzed are :
i.
Device jam at input tube inlet
[Type text]
Page
ii.
Device jam after 3D vision stopper
[Type text]
Page
iii.
Device jam at first singulator
[Type text]
Page
iv.
Device jam after first singulator
[Type text]
Page
v.
Device jam at reject tube inlet
[Type text]
Page
4.8.3 Corrective Actions Of Solution Problem
Corrective actions are implemented in response to customer complaints,

unacceptable levels of product non-conformance, issues identified during an internal
audit, or adverse or unstable trends in product and process monitoring such as would
be identified by SPC. Preventive actions are implemented in response to the
identification of potential sources of non-conformity.
To ensure that corrective and preventive actions are effective, the systematic
investigation of the root causes of failure is pivotal. CAPA is part of the overall quality
management system (QMS).
Result in this case, the jam should be dealt with in the right way for no repetitive
problems occur that will taken to reduce the frequency of jam and to improve the
efficiency of the machine operation. There are some problem solution that use the
corrective action :
[Type text]
Page

Device jam at several situation
Cause from (Man)
Corrective Actions
Does not clean input track
Blow the input track before and after
Does not replace worn out valve
running lot using airgun

Replace the valve with the new one in
Input tube alignment
every preventive maintenance

Align the input tube in every conversion
Does not clean 3D track
input stacker.
Clean the 3D
Track width adjustment
maintenance
Adjust the track width following the specific
Does not clean reject track
guide
Blow the reject tube in every changing of
Reject tube track alignment
reject tube
Align the reject tube track following the
in
every
preventive
specific guide
Cause from (Materials)
Corrective Actions
Mold flash
Cut holder tip slant to exert backward
Bent lead
pushing action to second device

Inspection by MA before
Tube worn out opening
damaged unit to machine

Only provide high quality material tubes for
Tube dimension
production
Only provide high quality material tubes for
Friction from unit base package
production
Check for base package
Unit package out of spec
Inspection
by
MA
before
inserting
inserting
damaged unit to machine
Cause from (Machine)
[Type text]
Corrective Actions
Page

Track alignment
Ensure that alignment of track following
Air purge (high/low)
the specific guide

Adjust the air pressure
Stopper pin worn out
conversion is done
Replace stopper pin with the new one in
Sensor detection faulty
every preventive maintenance

Airgun the every sensor located
Stopper cylinder sluggish
machine before start the new lot

Replace stopper with the new one in every
Faulty unit holder
preventive maintenance
Adjust the the holder to avoid being too
Output track alignment
tight or loose
Align the output track following the specific
every
time
at
guide
Cause from (Method)
Corrective Actions
Tube loading
Ensure the tube is used in correct position
Cleaning
Cleaning should be neatly and cleanly
Stopper replacement
Replacement of a device is in order and
Cylinder replacement
following the specific guide

Replacement of a device is in order and
Track adjustment

Adjustment of a device is in order and
Tube placement

Adjustment of a device is in order and
CHAPTER 5
RECOMMANDATION
[Type text]
Page
5.1 Comments
Statschippac is a reputable company in the world. Server of the relevant

industry training is a good knowledge of various aspects such as work ethic, know the
rules system department, arranging the machines, to recognize the wide range of
equipment industries. Here also can be applied to the learning sciences during college
days to the working world. Therefore, it can improve the performance of control
communication between employees and customers, which is very important in any
other industry. Following this, the place is a bit of learning can be applied to any other
company and it will provide useful experience in the future. Statschippac provide a good
environment to do any work. Statschippac also gives a free and relaxing environment to
worker as long as they get their job done at the specific time given by manager. All the
tasks have given is suitable to the trainee, if the task is too heavy for trainee,
Statschippac engineer will help and teach the trainee how to solve it.
5.2 Suggestion
My suggesting is Statschippac Malaysia must give training and schedule for new
trainee to make sure they can learn and get knowledge faster rather than self-centered
in the beginning, After two weeks then let the trainee be self-centered so they may
explore new thing and understanding the principle of works that were given.
Im also suggesting that Statschippac Malaysia assign each trainee to only one
engineer, it is to make sure the engineer and the company know the valuable and
potential of the trainee. The engineer can works as a mentor give new knowledge to
[Type text]
Page

trainee and make sure after three month the trainee itself can already be independent
and trust them to be on site without engineer or supervisor.
Statschippac Malaysia need to provide tools enough tools for trainee. This is
important because the trainee can do and solve the problem without any problem. Also
can solve the problem in a day without delay the problem two or three day. The most
important suggestion is always do the meeting each month with trainee. Discuss the
problem that trainee face. This will make all the work goes smooth.
CHAPTER 6
CONCLUSION
6.1 Conclusion
During training, STATSChippac Malaysia calibrated with the most experience

and knowledge. Training to assist in the preparation and presentation of the work itself.
[Type text]
Page

UniKL industry training exposes students to the world of work in order to relate the
theoretical knowledge and real industry application. Industrial training was a valuable
exposure for student to gain the working experience which we cannot find it by reading
any books or search on the internet. This kind of exposure should not be missed by any
student especially in technical area. Only by experience the real environment then
someone will more understand what they should do and what they should not do in
order to train themselves to be more independence especially when involving critical
thinking and decision. The industrial program have helped us to developed an
understanding of what is required in the industry.
[Type text]
Page

Report Intra

Transféré par

Informations du document

Copyright

Formats disponibles

Partager ce document

Partager ou intégrer le document

Options de partage

Avez-vous trouvé ce document utile ?

Ce contenu est-il inapproprié ?

Droits d'auteur :

Formats disponibles

Report Intra

Transféré par

Droits d'auteur :

Formats disponibles

INDUSTRIAL TRAINING (WIB39908)

1.1 Industrial training objective

The main objective of the Industrial Training is to experience and understand

INDUSTRIAL TRAINING (WIB39908)

1.2 Important of industrial training to students

INDUSTRIAL TRAINING (WIB39908)

2.1 Company Background

STATS ChipPAC Ltd. (STATS ChipPAC or the Company - SGX-ST:

INDUSTRIAL TRAINING (WIB39908)

figure 1 STATS ChipPAC Malaysia

INDUSTRIAL TRAINING (WIB39908)

2.1.2 Company logo

figure 2 STATS ChipPAC logo

2.1.3 Company Profile

INDUSTRIAL TRAINING (WIB39908)

STATS ChipPAC Malaysia Sdn

STATS ChipPAC Malaysia Sdn

2.1.4 Company Vision & Mission

INDUSTRIAL TRAINING (WIB39908)

2.1.5 Company Core Values

2.2 Department Background of IC Post Test

There are the major department in SCM :

INDUSTRIAL TRAINING (WIB39908)

FOL (front of line)

EOL (end of line)

2.2.1 IC Post Test

For STATS ChipPAC, every stage in the manufacturing process is critical,

There are some machine in the Post Test department :

VIS Dynamics Machine

INDUSTRIAL TRAINING (WIB39908)

2.2.2 Final Marking

Final laser mark to in-tray devices

Final ink mark to in-tray devices

Final laser mark to in-tube devices

2.2.4 3D Inspection System

INDUSTRIAL TRAINING (WIB39908)

2.2.5 Tape and Reel

2.2.6 Customs Post Test Solutions

INDUSTRIAL TRAINING (WIB39908)

2.2.8 Drop Ship

INDUSTRIAL TRAINING (WIB39908)

INDUSTRIAL TRAINING (WIB39908)

Ionizer Blower Fan

Rework Machine (SP-300)

Transfer fixture / QQQ flute

3.1 Ionizer Blower Fan

Figure 3 Ionizer Blower Fan

INDUSTRIAL TRAINING (WIB39908)

3.1.1 Basic Operation of ioniser

3.1.2 Maintenance of ionizer

INDUSTRIAL TRAINING (WIB39908)

Ion balance should be within +/- 35V

INDUSTRIAL TRAINING (WIB39908)

Ion balance/time decay before cleaning

Ion balance/time decay after cleaning

Blow/clean the blower fan/grill

Clean the ionizer needle

INDUSTRIAL TRAINING (WIB39908)

Zebra Technologies is a manufacturer of thermal bar code label and receipt

figure 4 Zebra Label Printer

The enhanced of zebra printer are :

Fast 10/100 network connectivity as standard.

Dependable print quality - onboard diagnostics to ensure optimum print quality

Improved ribbon and media - low LCD/network alerts