Call for Papers

March 29-April 1, 2015

Austin, Texas USA
Organizing Committee
General Co-Chairs
Brian Evans, Univ. of Texas at Austin, USA
Alexis Kwasinski, Univ. of Texas at Austin, USA
Technical Program Co-Chairs
Naofal Al-Dhahir, Univ. of Texas at Dallas, USA
Anand Dabak, Texas Inst., Dallas, Texas USA
Haniph Latchman, Univ. of Florida, Gainesville, FL USA
IEEE Liaison Publicity, Registration, Management
Bridget Erlikh, USA
TPC Members
Kaywan Afkhamie, Qualcomm, Ocala, Florida USA
Jos Antonio Arrabal, Univ. of Mlaga, Spain
Anuj Batra, Texas Inst., Dallas, Texas USA
Mauro Biagi, Sapienza Univ. of Rome, Italy
Gerd Bumiller, Hochschule Ruhr West, Germany
Francisco Canete, Univ. of Mlaga, Spain
Marco Chiani, Univ. di Bologna, Bologna, Italy
Virginie Degardin, Univ. of Lille, Lille, France
Klaus Dostert, Karlsruhe Inst. of Tech., Germany
Gianluigi Ferrari, Univ. of Parma, Parma, Italy
Stefano Galli, ASSIA Inc., Redwood City, CA USA
Vincent Guillet, Landis + Gyr, France
Jean-Francois Helard, INSA, Rennes, France
Halid Hrasnica, Eurescom, Heidelberg, Germany
Salvador Iranzo, Marvell Hispania, Paterna, Spain
Makoto Itami, Tokyo Univ. of Science, Tokyo, Japan
Masaaki Katayama, Nagoya Univ., Japan
Cornelis Kikkert, James Cook Univ., Australia
Seong-Cheol Kim, Seoul Nat. Univ., Seoul, Korea
Michael Koch, DeVolo, Aachen, Germany
Lutz Lampe, Univ. British Columbia, Canada
Ralf Lehnert, Tech. Univ. of Dresden, Germany
Victor Loginov, Maxim Int. Prod., Irvine, CA USA
Josemaria Malgosa-Sanahuja, UPCT, Cartagena, Spain
Anil Mengi, DeVolo, Aachen, Germany
Fabienne Nouvel, INSA, Rennes, France
Riccardo Pighi, Selta, Milan, Italy
Pedro Jose Pinero, Atmel, Zaragoza, Spain
Srinivasa Prasanna, Indian Inst. Tech., Bombay, India
Riccardo Raheli, Univ. of Parma, Parma, Italy
Marco Raugi, Univ. of Pisa, Pisa, Italy
Moises Ribeiro, Univ. Fed. de Juiz de Fora, Brazil
Mehmet Safak, Hacettepe Univ., Ankara, Turkey
Alfredo Sanz, Univ. of Zaragoza, Zaragoza, Spain
Pierre Siohan, Orange Labs, Cesson Svign, France
Driton Statovci, FTW, Vienna, Austria
Hongjian Sun, Durham Univ., Durham, UK
Yuhao Sun, Univ. of Cambridge, Cambridge, UK
Theo Swart, Univ. of Johannesburg, South Africa
Andrea Tonello, Univ. of Udine, Udine, Italy
Shinji Tsuzuki, Ehime Univ., Matsuyama, Japan
Daisuke Umehara, Kyoto Inst. of Tech., Japan
Petrus Janse van Rensburg, WSU, South Africa
Fabio Versolatto, Univ. of Udine, Udine, Italy
Han Vinck, Univ. of Duisburg-Essen, Germany
Khurram Waheed, Freescale, Austin, Texas USA
Stephan Weiss, Univ. of Strathclyde, Scotland
Fang Yang, Tsinghua Univ., Beijing, P.R. China
Li Zhang, Univ. of Leeds, Leeds, UK

The 2015 IEEE International Symposium on Power Line Communications and its
Applications (ISPLC) is organized by the IEEE Technical Committee on Power Line
Communications ( http://committees.comsoc.org/plc). The conference will be
held March 29 to April 1, 2015, in downtown Austin. Downtown Austin has a
dynamic live music scene, hike & bike trails along the river, museums, and The
University of Texas at Austin campus.
ISPLC 2015 will focus on key aspects of communications theory, algorithms,
standards, measurements, and implementations pertaining to communications
via power lines. Acceptance of submissions will be based on quality, relevance
and originality. Accepted papers will be published in the ISPLC 2015 proceedings
and IEEE Xplore. Proposals for special sessions are invited. The conference will
also include keynote and plenary talks as well as an industry forum and exhibition.
Submissions are invited in, but not limited to, the following areas:
PLC for smart grids
Cognitive, cooperative, and autonomous approaches
Modulation, coding and signal processing for PLC
Electromagnetic compatibility, interference and coupling issues
Multiple access techniques and protocols for PLC networks
Cross-layer optimization and service integration
System architectures and security issues
PLC standardization
Channel characterization, modeling, experimental systems, field trials
Emerging PLC-related technologies
Important dates:
Proposals for special sessions October 20, 2014
Submission of full papers November 3, 2014
Notification of Acceptance January 5, 2015
Camera-ready papers due February 2, 2015
To be published in the IEEE ISPLC 2015 Conference Proceedings and to be eligible
for publication in IEEE Xplore, at least one of the authors of an accepted paper is
required to register for the conference at the full (member or non-member) rate
and the paper must be presented by an author of that paper at the conference
unless a TPC Co-Chair grants permission for a substitute presenter arranged in
advance of the event and who is qualified both to present and answer questions.
Non-refundable registration fees must be paid prior to uploading the final IEEE
formatted, publication-ready version of the paper. For authors with multiple
accepted papers, one full registration is valid for up to 3 papers. Accepted and
presented papers will be published in the IEEE ISPLC 2015 Conference
Proceedings and submitted to IEEE Xplore.