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Dow Corning
Electronics and Advanced Technologies
Contents
Why Use A Silicone Grease?
Why Choose Dow Corning?
Thermal Interface Material (TIM) Application
Product Overview
Testing Methodology
Product Processing
Frequently Asked Questions
Application versatility
There are many ways to apply grease making it great for the factory or field-work
Easy re-workability
Lower cost
Greases lack the extra manufacturing steps of pads, preforms, etc. giving them lower
cost structure
High Reliability
Silicones withstand heat & stresses better than organic greases
Thermal Pad
Heat Sink
Heat Sink
Heat Sink
Heat Source
Heat Source
Micro-gaps or surface
roughness prevent
effective heat transfer
potentially leading to
device failure.
Heat Source
TIM Applications
Use Dow
Corning TIMs
at any junction
between a heat
source and
cooling source
to overcome
contact
resistance and
improve heat
dissipation
away from vital
components
TIM
Heat Sink
Heat Source
TIM 2
Heat Sink
Heat Spreader or Casing
TIM 1
Heat Source
Casing
TIM Potting
Application
Heat Source
Thermally conductive grease,
gel or encapsulant
Example Of Possible
Thermal Grease Application
Flip Chip BGA Heat Spreader Attach TIM 1.5 or 2
Heat Source TIM - Heat Sink Direct
TIM 2
or TIM 1.5
Heat Spreader
Flip Chip Or Other Heat Source
Substrate
TIM 2
Heat Sink
TIM 1
Lid
Substrate
Thermal Resistance
Bond Line Thickness
Cost
Processing/Printability
Re-workability
BLT
=
+ Rc 1 + Rc 2
kTIM
BLT = Bond Line Thickness
kTIM = Thermal Conductivity
Rc = Contact Resistance between
the TIM and the two surfaces.
Higher TR
+Rc2
Lower TR
c2
10
Dow Corning
Thermally Conductive Grease Line Up
P
e
r
f
o
r
m
a
n
c
e
Product
Thermal Conductivity
(W/m-K)
Thermal
Resistance
(C-cm2/W)
2.89
0.032
4.0
0.061
2.5
0.096
1.7
0.32
0.8
0.62
0.54
0.162
11
0.30
DC TC-5121
Shin-Etsu MicroSi X23-7783D
0.25
DC TC-5022
DC TC-5026
0.20
0.15
0.10
0.05
0.00
0
20
40
60
80
100
120
12
0.07
CS=(TC-TS)/Power
0.06
0.057
0.054
0.049
0.05
0.045
0.045
TC-5022
Shin-Etsu
MicroSi X237853-W1
0.04
0.035
0.03
0.02
0.01
0
TC-5026
Shin-Etsu
MicroSi X237783D
TC-5121
Shin-Etsu
MicroSi G751
Shin-Etsu
MicroSi X237762D
TIM Material
13
Features
Potential Uses
Application Methods
Color: White
Additional Information
Can be used as a thin interface or encapsulant. For interface,
apply grease with a squeegee through a stencil or screen to
print a grease pad or spread out bulk material with a spatula.
14
Features
Potential Uses
Application Methods
Color: White
Additional Information
Dispense with syringe or apply grease with a squeegee
through a stencil or screen to print a grease pad or spread
out bulk material with a spatula.
15
Features
Potential Uses
Application Methods
Color: White
Additional Information
Dispense with syringe or apply grease with a squeegee
through a stencil or screen to print a grease pad or spread
out bulk material with a spatula.
16
Features
Potential Uses
Application Methods
Color: Gray
Additional Information
Dispense with syringe or apply grease with a squeegee
through a stencil or screen to print a grease pad or spread
out bulk material with a spatula. Allow the printed grease
pad to dry open to the air for 24 hours before assembling and
testing. The dry time allows the small amount of carrier
fluid in the grease to evaporate and will improve thermal
performance.
17
0.45
0.4
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
0
5000
10000
15000
20000
25000
Cycles
18
Features
Potential Uses
Application Methods
Color: Gray
Additional Information
Dispense with syringe or apply grease with a squeegee
through a stencil or screen to print a grease pad or spread
out bulk material with a spatula. Allow the printed grease
pad to dry open to the air for 24 hours before assembling and
testing. The dry time allows the small amount of carrier
fluid in the grease to evaporate and will improve thermal
performance. ** Please see following slides for reliability
testing on this high performing grease.
19
T C - 5 0 2 2 T h e r m a l R e lia b ilit y , T T V - P o w e r c y c le T e s t
( E a c h c y c le :
8 m in u t e h e a t in g , 2 m in u t e c o o lin g , ~ 9 2 C t o r . t . )
0 .5
0 .4
0 .3 5
0 .4 5
0 .3
0 .2 5
0 .2
0 .1 5
0 .1
0 .0 5
0
0
2500
5000
7500
10000
12500
15000
17500
20000
22500
25000
C y c le s
20
21
22
23
24
Features
Potential Uses
Application Methods
Color: Gray
Additional Information
Apply grease with a squeegee through a stencil or screen to
print a grease pad or spread out bulk material with a spatula.
Solvent free composition does not require drying.
* Please see additional test data in the following slides for
our premier thermally conductive grease TC-5026. ** For
non-planar mating surfaces and thicker bond lines please
see TC-5022.
25
0.4
0.35
0.45
0.3
0.25
0.2
0.15
0.1
0.05
0
0
5000
10000
15000
20000
25000
Cycles
26
TR on Hitachi, C-cm2/W
0.180
0.160
0.140
0.120
0.100
0.080
0.060
0.040
0.020
0.000
0
200
400
600
800
1000
27
Spreadability Study
Multiple greases were applied between glass slides in 0.05 ml samples. The slides were then compressed together at
a force of 5 psi. The diameter of the resulting sample was measured revealing the ability of different greases to
spread under minimal pressure. TC-5026s unique formulation exhibits continuous stability at room temperature and
allows it to reach minimal bond line thickness with minimal force even after aging. Its unique spread-ability makes
TC-5026 appropriate for a variety of non-traditional applications.
TC-5026
X23-7783
Fresh Sample
Spreads to 16mm
S p re a d D ia m e t e r / M illim e t e rs
@ 5 p si
Fresh Sample
Spreads to 28mm
Aged 1 day at
23 C 50% RH
Spreads to 13mm
30
25
Shin-EtsuMicroSi X23-7783D
Shin-EtsuMicroSi X23-7762D
20
Shin-EtsuMicroSi G751
15
10
5
0
Fresh
1 day
7 days
Aged 7 days at
23 C 50% RH
Spreads to 11mm
TC 5026
X23-7783
28
TC-5026 80C
TC-5022 80C
14000
TC-5026 50C
12000
TC-5022 50C
Shin-Etsu MicroSi X23-7783D 50C
10000
TC-5026 38C
TC-5022 38C
8000
6000
4000
2000
0
0
200
400
600
800
1000
Aging time, hr
29
Product Testing
Thermal Resistance
Hitachi Guarded Hotplate (ASTM # D5470).
Measures thermal resistance through TIM at different bond
lines and pressure loads
Desktop TTV
Measures thermal resistance in a real world application as the
TIM for a computer microprocessor
Power Cycling
Laptop TTV
Simulates laptop microprocessor
TIM is situated between heat sink and bare die
Bare die flexes due to CTE mismatch creating an environment to
induce pump-out
Test indicates long term reliability
30
32
Product Processing
Screen Printing
High volume processing
Applies a controlled amount of material to substrate
Produces consistent bond lines and patterns
33
34
35
Syringe Dispensing
Ease of spreadability = reliable surface coverage
Syringes are easy to carry for rework
36
37