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1.1 INTRODUCTION
Machining processes that involve chip formation have a number of inherent
limitations which limit their application in industry. Large amount of energy are
expended to produce unwanted chips which must be removed and discarded.
Much of the machining energy end up as undesirable heat that often
produces problems of distortion and surface cracking. Cutting force require
that the workpiece be held which can also lead to distortion. Unwanted
distortion, residual stress, and burrs can caused by the machining process
often require further processing. Finally, some geometry is too delicate to
machine while others are too complex.
NTM processes can be divided into four groups based upon the material
removal mechanism; - chemical, electrochemical, mechanical, and thermal. In
this unit students will be exposed to thermal processes which processing
involved applications of high temperatures in much localized regions
evaporate materials.
Common tool materials used in ultrasonic machining include brass, mild steel,
carbide and stainless steel. The abrasive grains in ultrasonic machining
include boron nitride, boron carbide, aluminium oxide, silicon carbide and
diamond. Ultrasonic machining is best suited for materials that are hard and
brittle such as ceramic, glass, carbide and hardened steel.
Major factors which influence the metal removal rate, surface roughness and
accuracy are:
Amplitude and frequency of the tool oscillation
Impact forces
Tool material
Abrasive and content of the slurry
The cutting action in ultrasonic machining affects the tool as well as the work.
As the abrasive particles erode the work surface, they also erode the tool,
thus affecting its shape.
machining include non-round holes, holes along a curved axis and coining
operations in which an image pattern on the tool is imparted to a flat work
surface.
1.3.1 ADVANTAGES/DISADVANTAGES
Advantages
1. Low tooling cost and cheap abrasives are used for the
machining operation.
2. Use of semiskilled workers for a precision work.
3. Absence of thermal stresses.
4. There is no appreciable rise in the temperature of the work,
hence no change in physical properties of the work material.
5. Good surface finish and dimensionally accurate profile could
be generated with ease.
6. Brittle materials like glass and ceramic can be machined quite
efficiently.
Disadvantages
1.4.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
FIGURE 1.4 Sequence of processing steps in chemical milling: (1) clean raw part.
(2) Apply maskant, (3) scribe, cut and peel the maskant from areas to be etched, (4)
etch and (5) remove maskant and clean to yield finished part.
Chemical milling produces a surface finish that varies with different work
materials. Surface finish depends on the depth of penetration. As the depth
increases, the finish becomes worse. Metallurgical damage from chemical is
very small, perhaps around 0.005mm into the work surface.
1.5.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
Methods used for applying the maskant in chemical blanking are either the
photoresist method or the screen resist method. For small and/or intricate
cutting patterns and close tolerances, the photoresist method is used. The
steps in chemical blanking for screen resist method are shown in figure below.
FIGURE 1.5 Sequence of processing steps in chemical blanking: (1) clean raw
part, (2) apply resist (maskant) by painting through screen, (3) etch (partially
completed) and (5) removed resist and clean to yield finished part.
1.6.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
Laser beam machining is widely used for drilling and cutting metals,
nonmetallic materials, ceramics and composite materials. Holes as small as
0.005mm, with hole depth-to-diameter ratios of 50:1, have been produced in
various materials, although a more practical minimum is 0.025mm. Steel
plates as thick as 32mm can be cut with laser beams.
1.7.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
FIGURE 1.8 Schematic illustration of the electro beam machining process. Unlike
LBM, this process requires a vacuum, so workpiece size is limited to the size of the
vacuum chamber
The lens is capable of reducing the area of the beam to a diameter as small
as 0.025mm. On impinging the surface, the kinetic energy of the electrons is
converted into thermal energy of extremely high density, which melts or
vaporizes the material in a very localized area. The interaction of the electron
beam with workpiece surface produces hazardous x-rays. Therefore only
highly trained personnel should use the equipment.
1.8.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
The plasma arc is generated between an electrode inside the torch and the
anode workpiece. The plasma flows through a water-cooled nozzle, which
constricts and directs the stream to the desired location on the work. The
resulting plasma jet is a high velocity, well-collimated stream with extremely
high temperatures at its centre.
Plasma arc cutting can be used to cut nearly any electrically conductive
metal. The metals frequently cut by PAC include plain carbon steel, stainless
steel and aluminium. Parts as thick as 150 mm can be cut by this process.
1.9.1 ADVANTAGES/DISADVANTAGES
Advantages
Disadvantages
1.10 SUMMARY
In this unit we have studied the:
1.13 REFERENCES
Serope Kalpakjian, Steven R. Schmidt (2001). Manufacturing Engineering
and Technology, (4th Edition), state: Prentice Hall.
Mikell P. Groover (2002). Fundamentals of Modern Manufacturing Materials,
Processes, and Systems, (2nd Edition), state: John Wiley & Son, Inc.
John A. Schey, (year). Introduction to Manufacturing Processes, (3rd Edition),
state: Mc Graw Hill.
E. Paul Degarmo, J T. Black, Ronald A. Kohser (2003). Materials and
Processes in Manufacturing, (9th Edition), state: John Wiley & Son, Inc.
1.14 ANSWER
Advantages
Lasers can machine through transparent material and
vaporize any known material.
They have small heat-affected zones and work easily with
non-metallic hard materials.
Disadvantages
High cost of equipment.
Low operating efficiency.
Difficulty in controlling accuracy.
Use primarily for small parts.