TRAINING

IPC-A-610 E Acceptability of Electronics Assembly

Chapter 5: Soldering

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Chapter-Overview

Criterias for solderjoints

Defects

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Soldering

The classes 1, 2, 3 could have different applications, but the

criteria for an acceptable solderjoint could be the same

A non-acceptable solderjoint could be refused in all 3 classes

The type of soldering-process must be regarded

In all cases the criterias find application, independent from the
soldering-method.

Iron-soldering Manual/robot

Selective soldering / wave soldering

Reflow soldering

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Magnification for solderjoint-inspection:

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5 Soldering

Picture 5-1

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5 Soldering

The main difference between leaded and leadfree solderjoints is

the visual appearance

Leadfree PCBs have a specific symbol

Leadfree solderjoints have more often:

Rough surface

Contact angle bigger

All other criterias are the same, for example hole-filing

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5 Soldering

Typical leaded solderjoints look like:

Shiny appearance

Glossy surface

Good wetting

Meniscus between the parts is concave

High-temperature solderjoints could be matt

Touch-up or rework must be done carefully to avoid
additional problems.

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5.1 Acceptance criterias for solderjoints

Picture 5-2
Target class 1, 2, 3

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5.1 Acceptance criterias for solderjoints

Picture
Acceptable class 1, 2, 3
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5.1 Acceptance criterias for solderjoints

SnPb alloy: No Clean

Process

SnAgCu alloy: No Clean

Process

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5.1 Acceptance criterias for solderjoints

SnAgCu alloy: No Clean Process,

N2 Reflow

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SnAgCu alloy: No Clean Process;

Air Reflow

5.1 Acceptance criterias for solderjoints

SnPb alloy: No Clean Process

SnAgCu alloy: No Clean Process

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5.1 Acceptance criterias for solderjoints

SnAgCu Lot: No Clean Process

SnPb Lot: No Clean Process

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5.1 Acceptance criterias for solderjoints

SnPb alloy

SnAgCu alloy

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5.1 Acceptance criterias for solderjoints

SnAgCu alloy

SnPb alloy

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5.1 Acceptance criterias for solderjoints

SnPb alloy; OSP Finish

SnAgCu alloy; OSP Finish

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5.1 Acceptance criterias for solderjoints

SnAgCu alloy

SnAgCu alloy

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5.2.1 Anomalies solder-coverage

Some pins could have areas without solder-coverage, for

example pins of shieldings are cutted and can be wetted only on
2 sides of the pin

The wettability of PCBs could have a variation depending to the
finishing

For OSP, Nickel-Gold or silver-finishing we could have exposed
pads, which are not covered by the solder.

This is normal, when the criterias for the sodlerjoint are acceptable.

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5.2.1 Anomalies solder-coverage

Picture 5-4
Allowed class 1, 2, 3

Picture 5-5
Allowed class 1, 2, 3

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5.2.1 Anomalies solder-coverage

Picture 5-6
Allowed class 1
Processindicator class 2, 3

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5.2.2 Anomalies holes in solderjoints

Picture 5-10

Picture 5-8

Picture 5-11

Picture 5-12

Picture 5-9
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5.2.3 Anomalies Melting of solderpaste

Picture 5-13
Not allowed class 1, 2, 3

Picture 5-14
Not allowed class 1, 2, 3

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5.2.4 Anomalies Non wetting

Picture 5-18
Not allowed class 1, 2, 3

Picture 5-17
Not allowed class 1, 2, 3

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5.2.4 Anomalies Non wetting

Picture 5-18

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5.2.5 Anomalies Dewetting

Picture 5-23
Not allowed class 1,
2, 3

Picture 5-24
Not allowed class 1, 2,
3

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Picture 5-25
Not allowed class 1, 2, 3

5.2.6 Anomalies Too much solder

Solderballs/Solderresidues

Picture 5-28
Target class 1, 2, 3

Picture
Allowed class 1, 2, 3
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5.2.6.1 Anomalies Too much solder

Solderballs/Solderresidues

Picture 5-30
Not allowed class 1, 2, 3

Picture 5-29
Allowed class 1, 2, 3  when
solderballs are fixed in flux
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Picture 5-31
Not allowed class 1, 2, 3

Picture 5-33
Not allowed class 1, 2, 3  when solderballs are not fixed / could create short-circuit /
reduce the minimum electrical distance

5.2.6.1 Anomalies Too much solder

Solderballs/Solderresidues

Picture 5-32
Not allowed class 1, 2, 3

Picture
Not allowed class 1, 2, 3

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5.2.6.2 Anomalies too much solder short-circuit

Picture 5-34
Picture 5-37
Picture 5-36
Not allowed class 1, Not allowed class 1, 2, 3 Not allowed class 1, 2, 3
2, 3

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5.2.6.2 Anomalies too much solder solder webbing

Picture 5-39
Not allowed class 1, 2, 3

Picture 5-38
Not allowed class 1, 2, 3

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5.2.7 Anomalies disturbed solderjoint

Picture 5-40
Allowed class 1, 2, 3

Picture 5-41
Not allowed class 1, 2, 3

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5.2.7 Anomalies disturbed solderjoint

Picture 5-42
Not allowed class 1, 2, 3

Picture
Not allowed class 1, 2, 3

Picture 5-43
Not allowed class 1, 2, 3

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5.2.8 Anomalies crack in solderjoint

Picture 5-44
Not allowed class 1, 2, 3

Picture 5-45
Not allowed class 1, 2, 3

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5.2.9 Anomalies solderpike

Picture 5-47
Not allowed class 1,
2, 3

Picture 5-48
Picture 5-49
Not allowed class 1, 2, Not allowed class 1,
3
2, 3

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5.2.10 Anomalies Fillet Lifting leadfree

Picture 5-50
Allowed class 1, 2, 3
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5.2.11 Anomalies hot tear

Picture 5-53
Allowed class 1, 2, 3

Picture 5-52
Allowed class 1, 2, 3

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