Philips Semiconductors

Product Specification

PowerMOS transistor

GENERAL DESCRIPTION
N-channel enhancement mode
field-effect power transistor in a
plastic envelope.
The device is intended for use in
Automotive and general purpose
switching applications.

PINNING - TO220AB
PIN

QUICK REFERENCE DATA

SYMBOL

PARAMETER

VDS
ID
Ptot
Tj
RDS(ON)

Drain-source voltage
Drain current (DC)
Total power dissipation
Junction temperature
Drain-source on-state
resistance

PIN CONFIGURATION

DESCRIPTION

gate

drain

source

tab

BUK456-60H

MAX.

UNIT

60
60
150
175
20

V
A
W
C
m

SYMBOL
d

tab

drain
s

1 23

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

VDS
VDGR
VGS
ID
ID
IDM
Ptot
Tstg
Tj

Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulse peak value)
Total power dissipation
Storage temperature
Junction Temperature

RGS = 20 k
Tmb = 25 C
Tmb = 100 C
Tmb = 25 C
Tmb = 25 C
-

- 55
-

60
60
30
60
46
240
150
175
175

V
V
V
A
A
A
W
C
C

THERMAL RESISTANCES
SYMBOL

PARAMETER

CONDITIONS

Rth j-mb

Thermal resistance junction to

mounting base
Thermal resistance junction to
ambient

Rth j-a

May 1993

MIN.

TYP.

MAX.

UNIT

1.0

K/W

60

K/W

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

BUK456-60H

STATIC CHARACTERISTICS
Tmb = 25 C unless otherwise specified
SYMBOL

PARAMETER

CONDITIONS

V(BR)DSS

Drain-source breakdown
voltage
Gate threshold voltage
Zero gate voltage drain current
Zero gate voltage drain current
Gate source leakage current
Drain-source on-state
resistance

VGS(TO)
IDSS
IDSS
IGSS
RDS(ON)

MIN.

TYP.

MAX.

UNIT

VGS = 0 V; ID = 0.25 mA

60

VDS = VGS; ID = 1 mA
VDS = 60 V; VGS = 0 V; Tj = 25 C
VDS = 60 V; VGS = 0 V; Tj =125 C
VGS = 30 V; VDS = 0 V
VGS = 10 V; ID = 25 A

2.1
-

3.0
1
0.1
10
17

4.0
10
1.0
100
20

V
A
mA
nA
m

MIN.

TYP.

MAX.

UNIT

DYNAMIC CHARACTERISTICS
Tmb = 25 C unless otherwise specified
SYMBOL

PARAMETER

CONDITIONS

gfs

Forward transconductance

VDS = 25 V; ID = 25 A

17

22

Ciss
Coss
Crss

Input capacitance
Output capacitance
Feedback capacitance

VGS = 0 V; VDS = 25 V; f = 1 MHz

1600
800
310

2200
1000
450

pF
pF
pF

td on
tr
td off
tf

Turn-on delay time

Turn-on rise time
Turn-off delay time
Turn-off fall time

VDD = 30 V; ID = 3 A;
VGS = 10 V;
RGS = 50 ;
Rgen = 50

30
90
190
140

40
120
250
180

ns
ns
ns
ns

Ld

Internal drain inductance

3.5

nH

Ld

Internal drain inductance

4.5

nH

Ls

Internal source inductance

Measured from contact screw on

tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad

7.5

nH

MIN.

TYP.

MAX.

UNIT

REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS

Tmb = 25 C unless otherwise specified
SYMBOL

PARAMETER

CONDITIONS

IDR

50

IDRM
VSD

Continuous reverse drain

current
Pulsed reverse drain current
Diode forward voltage

IF = 50 A ; VGS = 0 V

1.8

200
2.5

A
V

trr
Qrr

Reverse recovery time

Reverse recovery charge

IF = 50 A; -dIF/dt = 100 A/s;

VGS = 0 V; VR = 30 V

80
0.4

250
-

ns
C

MIN.

TYP.

MAX.

UNIT

150

mJ

AVALANCHE LIMITING VALUE

Tmb = 25 C unless otherwise specified
SYMBOL

PARAMETER

CONDITIONS

WDSS

Drain-source non-repetitive
unclamped inductive turn-off
energy

ID = 50 A ; VDD 25 V ;
VGS = 10 V ; RGS = 50

May 1993

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

120

BUK456-60H

Normalised Power Derating

PD%

10

Zth j-mb / (K/W)

BUKx56-lv

110
100
90

D=

80

0.5

70

0.2
0.1
0.05

60

0.1

50

0.02

40
30

0.01

tp

PD

10
0
0

20

40

60

80 100
Tmb / C

120

140

160

1E-05

1E-01

1E+01

Fig.4. Transient thermal impedance.

Zth j-mb = f(t); parameter D = tp/T

Normalised Current Derating

ID%

1E-03
t/s

tp
T
t

0.001

180

Fig.1. Normalised power dissipation.

PD% = 100PD/PD 25 C = f(Tmb)

120

D=

20

100

ID / A
20

BUK456-60H
10

110

VGS / V = 7.5

15

100

80

90

80

60

70

6.5

60

50

40

40

5.5

30

20

20

4.5

10

0
0

20

40

60

80 100
Tmb / C

120

140

160

180

0.1

ID

S/

10

RDS(ON) / Ohm
4.5

BUK456-60H
5.5

6.5

0.08

VD

tp = 10 us

100

S(

RD

0.06

100 us

0.04

1 ms

DC

10

10 ms
100 ms

0.02
VGS / V = 15

1
1

10

100

20

40

10
60

80

100

ID / A

VDS / V

Fig.3. Safe operating area. Tmb = 25 C

ID & IDM = f(VDS); IDM single pulse; parameter tp

May 1993

Fig.5. Typical output characteristics, Tj = 25 C.

ID = f(VDS); parameter VGS

BUK456-60H

ID / A

=
N)

4
VDS / V

Fig.2. Normalised continuous drain current.

ID% = 100ID/ID 25 C = f(Tmb); conditions: VGS 10 V

1000

Fig.6. Typical on-state resistance, Tj = 25 C.

RDS(ON) = f(ID); parameter VGS

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

BUK456-60H

VGS(TO) / V

BUK456-60H

ID / A

100

max.
4

Tj / C = 25

80

150

typ.
3

60
min.
2

40
1

20

0
0

-60

10

-20

20

VGS / V

gfs / S

BUK456-60H

30

100

140

180

Fig.10. Gate threshold voltage.

VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS

Fig.7. Typical transfer characteristics.

ID = f(VGS) ; conditions: VDS = 25 V; parameter Tj

35

60
Tj / C

Tj / C = 25

SUB-THRESHOLD CONDUCTION

ID / A

1E-01

1E-02

25
150

2%

1E-03

20
15

typ

98 %

1E-04

10
1E-05

5
1E-06

0
0

20

40

60

80

100

2
VGS / V

ID / A

Fig.8. Typical transconductance, Tj = 25 C.

gfs = f(ID); conditions: VDS = 25 V

2.0

Fig.11. Sub-threshold drain current.

ID = f(VGS); conditions: Tj = 25 C; VDS = VGS

Normalised RDS(ON) = f(Tj)

10000

BUK456-60H

C / pF

1.5

Ciss
1000

1.0

Coss
0.5

Crss
100

0
-60

-20

20

60
Tj / C

100

140

180

20

40
VDS / V

Fig.9. Normalised drain-source on-state resistance.

a = RDS(ON)/RDS(ON)25 C = f(Tj); ID = 25 A; VGS = 10 V

May 1993

Fig.12. Typical capacitances, Ciss, Coss, Crss.

C = f(VDS); conditions: VGS = 0 V; f = 1 MHz

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

15

BUK456-60H

VGS / V

BUK456-60H

120

WDSS%

110
100

VDS / V =12

90

10

80

48

70
60
50
40

30
20
10
0

0
0

20

40
QG / nC

60

20

80

Fig.13. Typical turn-on gate-charge characteristics.

VGS = f(QG); conditions: ID = 50 A; parameter VDS

100

IS / A

40

60

80

100
120
Tmb / C

140

160

180

Fig.15. Normalised avalanche energy rating.

WDSS% = f(Tmb); conditions: ID = 50 A

BUK456-60H

VDD

+
L

80

Tj / C = 25

150

VDS
60

VGS

-ID/100

40

T.U.T.

0
20

RGS

R 01
shunt

0
0

0.5

1.5

VSDS / V

Fig.16. Avalanche energy test circuit.

WDSS = 0.5 LID2 BVDSS /(BVDSS VDD )

Fig.14. Typical reverse diode current.

IF = f(VSDS); conditions: VGS = 0 V; parameter Tj

May 1993

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

BUK456-60H

MECHANICAL DATA
Dimensions in mm

4,5
max

Net Mass: 2 g

10,3
max
1,3

3,7
2,8

5,9
min

15,8
max

3,0 max
not tinned

3,0

13,5
min
1,3
max 1 2 3
(2x)

0,9 max (3x)

2,54 2,54

0,6
2,4

Fig.17. TO220AB; pin 2 connected to mounting base.

Notes
1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent
damage to MOS gate oxide.
2. Refer to mounting instructions for TO220 envelopes.
3. Epoxy meets UL94 V0 at 1/8".

May 1993

Rev 1.100

Philips Semiconductors

Product Specification

PowerMOS transistor

BUK456-60H

DEFINITIONS
Data sheet status
Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification

This data sheet contains final product specifications.

Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

May 1993

Rev 1.100