1/7

ER128

Basics of Soldering

(1)

What is soldering?
Soldering is a technique in which metal is joined by making the use of solder and
is one type of brazing. Brazing is a joining technique to join a metal by using
braze whose melting point is lower than that of the metal to be joined. Braze in
the case of soldering is an alloy of tin and lead.

(2)

Why is metal joined by soldering?

If solder is melted and allowed to flow on after the surfaces of the base metals are
heated, the solder spreads over the metals and makes them wet with solder. This
condition is referred to as wetting. At this time, the tin component of the solder
produces an intermetallic compound on the surface of the base metals and forms
an alloy layer to join the metals.
(Ex.) When soldering is performed on a copper pattern:
Solder

layer

Alloy

Copper pattern
Tin
(3)

Lead

Copper

Why is flux required when soldering?

When soldering, if the surface of the metal to be joined is contaminated and rusted
(oxidized), solder cannot wet the metal and is repelled, and therefore an alloy
layer cannot be produced. Flux functions to remove the above adverse materials.
Flux functions to:
Remove greasy dirt, dust and oxidized film
Prevent re-oxidization
(If metal comes in contact with air at high temperatures, oxidation
speed is accelerated; therefore, covering the sections to be joined with
flux isolates the metal from air to prevent oxidization.)
Decrease the surface tension of solder to help solder wet to metal.
(Facilitate wetting of solder)
Therefore, flux is essential for soldering.

2/7
(4)

Selection of flux
Since there are low-corrosive and high-corrosive types of flux, it is necessary to
select the flux suitable for the application and types of metals to be joined.
General soldering for P.W.Bs., electronic components, copper wire,
switches, etc. ... HAKKO 001
Stainless steel or chrome-plated components ... HAKKO SUSSOL F
Sheet processing ... HAKKO SUSSOL F, HAKKO Paste
* Since HAKKO SUSSOL F and HAKKO Paste are high-corrosive
types, be sure to wash the materials after completion of soldering.
In addition, never use them for electric components such as
P.W.Bs., etc.

(5)

Metals that can be soldered

Metals vary in how easily they can be soldered as follows:
Excellent

Tin

Silver

Tinplate,
tinplate
buckets,
watering cans

*1
*2

Ease of soldering

Gold

Plated
Accessories
components
of AV devices
(components)

Copper

Copper plate,
P.W.Bs.

Poor

Lead

Zinc

Steel

Lead-based
products

Galvanized
iron sheets

Steel plates

Stainless
steel
Sinks,
stainlesssteel-based
products

Even metals which are difficult to solder can usually be soldered by using a special flux
(HAKKO SUSSOL F).
Materials that cannot be soldered
Aluminum, titanium, ceramic

3/7
(6)

Selection of solder
Types of solder
Generally, solder is an alloy of tin (Sn) and lead (Pb). The melting
temperature and soldering strength vary depending on the compounding
ratio of tin and lead and the types are used selectively as required for the
application.
Tin

Melting point
30 to 40%

Approx. 235C

50%

Approx. 215C

60%

Approx. 190C

63%
(eutectic solder)

Approx. 183C

Features/applications
Used for lead water pipes and processing of metallic
materials
Used for galvanized iron and tinplate
Excellent strength. Used for electronic components
and joining stainless steel.
Can be melted at the lowest temperature and provides
excellent strength.

Thread solder is classified into the type that already contains flux and the type for
stainless steel that does not contain flux. When soldering stainless-steel materials,
use SUSSOL F together with the solder.

Special solder
For certain applications, small amounts of metals are added in some
cases in addition to tin and lead.
(Ex.) Solder containing silver
In audio devices requiring good sound conduction, silver plating is used
on components; therefore, solder containing silver is used to prevent
the silver from being corroded.

Lead-free solder (Pb-free)

Lead-free solder is solder that does not contain any lead. The Electric
Appliance Recycling Law is currently being strongly enforced. Against
the background of environmental problems such as illegal disposal of
home appliances, etc. which can result in lead ions leaching out from
solder on P.W.Bs. and contaminating groundwater, rivers, etc.,
lead-free activities are being promoted in various fields as well as in the
electronic industry, etc.

Wire diameter of solder

If the wire diameter of solder is thick, a large quantity of solder is melted at
once to enable solder to be spread over the pattern promptly; however, solder
is excessively supplied and prevents flux from flowing evenly. On the contrary,
if the wire diameter of solder is thin, it is easier to control the solder supplying
amount, but it takes much time to feed solder and solder is insufficiently
supplied. It is necessary to select the wire diameter of solder suitable for the
number of sections to be soldered and the application.

Wire diameter

Application

0.5 or less

Used when soldering very small components and making corrections

0.6

Used when soldering chips and ICs on precision P.W.Bs.

0.8 to 1.2

Used most often when soldering components to P.W.Bs. and when

soldering lead wires.
Used when soldering large-scale components and for metal processing.

1.6 or more

4/7

(7)

Selection of soldering iron

The suitable soldering iron should be selected according to the objects to be
soldered and the application. The selection details have type of tip, type of
heater and wattage.
Tip
The size (thickness) and shape of end should conform to the size of the
object to be soldered. Two types of tips are available: one made of pure
copper and the other having a corrosion-resistant plating.

Copper tip .......................... The shape of tip can be changed with a

file, etc. and used. Corrosion is generated
during soldering.

Corrosion-resistant tip........ Iron plating on the copper surface is

performed, which prevents corrosion
during soldering and provides longer life
than copper tips.

Heater
Nichrome heater (20 to 500W)
A nichrome heater consists of a coil of nichrome wire and the tip is
heated from the outside.
Nichrome wire

Tip

* It is suitable for simple soldering such as model assembly and

metallic processing.

Ceramic heater (15 to 60W)

In a ceramic heater, the tungsten heating element is sealed inside
ceramic and has an excellent electrical insulation. In addition, in
comparison with nichrome heaters, the start-up time is shorter and heat
recovery is also excellent. However, since it is porcelain ware, it is
easily broken. It is necessary to be careful not to break it.

Tip

Ceramic
heater

* Since start-up is quick and has excellent insulation performance, it is

suitable for soldering of ICs and other electronic components.

5/7

Wattage
The suitable wattage should be selected according to the size of the object
to be soldered. For heaters of the same type, in most cases the higher
wattage, the larger the main body and tip.

As mentioned above, it is necessary to select the soldering iron after considering

the purpose and application.

(8)

Soldering method
Tools and materials to be prepared ...Soldering iron, iron holder, solder, flux
1.

Touch the tip to the position to be

soldered lightly and heat the joint
section.

2.

Feed solder to the heated section

and let it be melted.
Rosin-core
solder

Component lead
Tip

P.W.B.

3.

Apply heat for 1 to 2 sec again. If

solder spreads out and covers the
joined section, move the tip away
from the joint and wait until solder
hardens.
*

Caution
Do not move the soldered objects
until the solder has hardened. If the
objects are moved, the joined
section will be detached and joining
strength will be reduced, causing
soldering failure.

6/7

(9)

Soldering and change in temperature

330

300

Tip
temperature

240
190

Room
temperature

Start to apply

power
to
soldering
iron

0
Start of

soldering

Solder

P.W.B.

Start to feed

solder

Sec.
3

Completion of

soldering

The above diagram shows a concept image of the change in temperature during
soldering. In soldering, understanding the temperature is most important and it is
also the most basic knowledge.
General conditions for soldering are considered to be as follows:
(1) The optimal timing for supplying solder is when the temperature of the objects
to be soldered has been heated up to the melting temperature of the solder.
(2) The optimal temperature for soldering is the temperature 40C to 50C higher
than the melting temperature of solder.
(3) The temperature of the tip is set between 270C and 420C and temperature
control of the tip is preferable.

7/7

(10) Soldering example

(2)

(1)

P.W.B.
Acceptable
(3)

Insufficient solder
(4)

Insufficient heating

Excessive heating

(1) Acceptable ................ Solder is uniformly spread out.

(2) Unacceptable............ Solder amount is insufficient and strength may be weak.
(3) Unacceptable............ Since the P.W.B. is not fully heated, it is impossible to join the
lead wire and P.W.B.
(4) Unacceptable............ The temperature is too high or the time for touching the tip is
too long, which causes the joined sections to be subjected to
excessive heat and flux to evaporate, resulting in nonuniform
soldering. In addition, the P.W.B. may be damaged.
*

In ideal soldering, the built-up shape of solder on the soldered section shows
a uniform slope in all directions like Mount Fuji in Japan.

Established on June 24, 2002

Revised on March 4, 2009