Académique Documents
Professionnel Documents
Culture Documents
Week of 1/26
Microfabrication Principles
for IC and MEMS
Hands-on Fabrication and
Testing of IC and MEMS
Devices
A Process Module
has many sub-steps!
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Example :
Deep UV Photolithography
(continued)
Example :
Deep UV
Photolithography
(continued)
*All baking
sub-steps
are similar
but with different
temperature and time
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EE143
Chip
Fabrication
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11
12
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After resist patterning on nitride/pad oxide
Process Simulation
* 3D Topography and Dopant Distribution
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n+
n+
~ 200 Transistors
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Generation:
1.5
1.0
0.8
0.6
0.35
0.25
Intel386 DX
Processor
Intel486 DX
Processor
Pentium
Processor
Pentium II
Processor
Professor Nathan Cheung, U.C. Berkeley
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EE143 S06 Lecture#1
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SIA roadmap
http://public.itrs.net/
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1999
180nm
2001
150nm
2003
130nm
2006
100nm
2009
70nm
2012
50nm
1.8-1.5
1.5-1.2
1.5-1.2
1.2-0.9
0.9-0.6
0.6-0.5
3-4
2-3
2-3
1.5-2
<1.5
<1.0
Equivalent Maximum
E-field (MV/cm)
>5
>5
>5
600/280
600/280
600/280
600/280
600/280
600/280
36-72
30-60
26-52
20-40
15-30
10-20
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23
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Bulk
Micromachining
Pyrex Glass
Si wafer
Surface
Micromachining
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MEMS Actuators
Movable Mirror
Turbine engine
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Acceleratometer
( Analog Devices)
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MEMS-IC Integration
(Sandia National Lab)
MEMS fabricated in 12m-deep trench
Filled with SiO2 and planarized using CMP
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http://www.optobionics.com/index.htm
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GeOI
Green LED
Blue LED
5mm
200 m
MOS IC
III-V
Encapsulated battery
with switch/LED
Micro
LED display
pump
Laser Array
Laser
Emitter
Arrays
Photonics on Si
Optical
Micro
mirrors
Modulator
Encapsulated
Power source
1 m
Si microfluidic
channels
EE143 S06200Lecture#1
m
32
Extension of Si Technology
Si circuits on plastic
Professor Nathan Cheung, U.C. Berkeley
Si Laser (Intel)
33
Nanoscale Fabrication
(i) Co-axial heterostructure nanowire (COHN); (ii) longitudinal heterostructure nanowire (LOHN).
Carbon Nanotube
Motor
A. Zettl, UCB
33