How does the TEM work?

The TEM uses a beam of electrons to resolve structures far beyond the resolution of
conventional light microscopy (<200 nm). Electrons produced by heating a filament
(Tungsten or LaB 6) at voltages ranging from 60-120kV, are fired towards the sample down a
column held under vacuum. Electromagnetic lenses allow the beam to be focused and
magnification to be modulated. The images formed are resolved on a phosphor fluorescent
screen and can be recorded using either digital or film-based cameras.
The transmission electron microscope is in many ways analogous to a transmission optical
microscope but usually 'upside down", in the sense that the source of the electron beam is at
the top of the microscope 'column' while the recording system is at the bottom (Fig.1). The
electron gun replaces the light source and is maintained at a high voltage (typically 100-400
kV). A heated tungsten filament is capable of generating electron beam current densities of the
order of 5 x l04A m-2, while lanthanum hexaboride (LaB6,) crystals generate ca 1 x 106 A m-2.
A field-emission source, by comparison, can generate current densities of the order of 1 x 1010
A m-2. The high-energy electrons from the gun are focused by an electromagnetic condenser
lens system, whose focus is adjusted by controlling the lens currents (not the lens position, as
would be the case in the optical microscope). The specimen stage is much more complex than
indicated in the diagram, and allows for specimen tilt as well as some z-adjustment along the
optic axis. An important point to note is that fine focusing of the image in the transmission
electron microscope is not achieved by adjusting the position of the specimen along the z-axis
(to alter its distance from the objective lens), but rather by adjusting the electromagnetic
objective lens current in order to focus a first image from the elastically scattered electrons
transmitted through the thin film specimen. The final imaging system also employs
electromagnetic lenses, and the final image is observed on a fluorescent screen. Typical screen
current densities are of the order of 10-10 to 10-11 A m-2, but may be even lower at the highest
magnifications. Photographic emulsions are commonly used to record the final image, but as
in optical microscopy, advances in the development of charge-coupled devices combined with
computerized image processing are making digital-image recording increasingly competitive.

Prepared by Dr. Zhigang Xu April, 2007

Figure 1 Similar to the transmission optical microscope (on the right), the transmission
electron microscope (on the left) has a source, a condenser system, a specimen stage, an
objective lens and an imaging system, as well as a method for observing and recording the
image.

Figure 2 HITACHI H600 TEM

1. Condenser Lens System
2. Objective Lens Movable
Aperture
3. Imaging Lens System
4. X Fine Control Knob
5. Binocular
6. Focusing Screen Lever
7. Electron Gun
8. Grounding Bar
9. Gun Airlock Switch
10. 3rd Condenser Lens Movable
Aperture
11. Specimen Goniometer Stage
12. Selected Area Movable
Aperture
13. Cold Finger
14. Pumping System
15. Viewing Chamber
16. Y Fine Control Knob
17. Shutter Lever
18. Camera Chamber

Sample Preparation
1. Particulate materials
Study of particles or ground material with each grain being between 10 and ~500 nm
with features to be studied of the same order of magnitude, for example twinning or other
defects. The specimen preparation consists in transferring a suspension of the particles in
isopropanol to a carbon coated grid and letting the solvent evaporate.
2. Preparation from bulk material
Study of bulk ion milled samples (not cross sections). The sample needs cutting, grinding
and punching a disk with diameter 3mm, followed by polishing, dimpling and ion
milling. There should be a hole in the center and the transparent material should be <
100nm thick. The sample must not be thicker than 100 m at any place.
3. Cross section of thin films
The specimen preparation is highly dependent on the properties of the film and the

substrate. Therefore, a set of test sample preparations must be carried out for
determination of the best preparation method. The sample needs gluing together (film
towards film), grinding and punching or drilling via ultra sound a disk with diameter
3mm, followed by polishing, dimpling and ion milling. There should be a hole in the
center and the transparent material should be < 50nm thick, and it should include the thin
film. The sample must not be thicker than 100 m at any place.
4. Wedge Polishing
5. The specimen will be glued on a angled polishing mount. Polish the sample using
different sand papers from rough to fine and other find polishing films, such as, diamond,
SiC or alumina films, to remove the materials until the edge of the sample is < 50nm in
thickness.

Ion Milling