Planning and Installation Guide For Tri-GP v2 Systems

Triconex General Purpose v2
Systems
Planning and
Installation Guide
Assembly Number 9700122-003

June 2011
Information in this document is subject to change without notice. Companies, names and data used in
examples herein are fictitious unless otherwise noted. No part of this document may be reproduced or
transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express
written permission of Invensys Systems, Inc.
2010-2011 by Invensys Systems, Inc. All rights reserved.
Invensys, the Invensys logo, Foxboro, I/A Series, Triconex, Tricon, Trident, and TriStation are trademarks
of Invensys plc, its subsidiaries and affiliates. All other brands may be trademarks of their respective
owners.
Document Number 9720122-003

Printed in the United States of America.
Contents
Preface
ix
Summary of Sections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
Product and Training Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
We Welcome Your Comments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Chapter 1
Introduction
Controller Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Fault Tolerance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Controller Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
TriStation 1131 Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Main Processor Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Bus Systems and Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Controller Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
System Diagnostics and Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Analog Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Analog Input/Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Analog Output Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Digital Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Digital Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Pulse Input Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Solid-State Relay Output Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
International Certifications and Qualifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Canadian Standards Association. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Factory Mutual. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
TV Rheinland . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
European Union CE Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chapter 2
System Description
23
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
General Environmental and EMC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Typical Weight of Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Cable Flame Test Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Planning and Installation Guide for Triconex General Purpose v2 Systems
iv
Contents
Ground Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Standard Tri-GP Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Main Processor Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
MP Module Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
MP Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Communication Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Logic Power Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
CM Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
I/O Modules Common Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Wiring Terminals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Field Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Analog Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
AI Module 3351S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
AI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
AI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
RTD/TC/AI External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
AI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . . 65
AI HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Analog Input/Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
AI/DI Module 3361S2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
AI/DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
AI/DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . 81
Analog Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
AO Module 3481S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
AO Module 3482S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
AO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
AO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
AO HART Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
AO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 97
Digital Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
DI Module 3301S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
DI Module 3311S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
DI Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
DI External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Solid State Relay Input External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 112
DI Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . . 115
Digital Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
DO Module 3401S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
DO Module 3411S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
DO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
DO High-Current Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
DO Low-Current Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Contents
DO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Relay Output External Termination Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
DO Hazardous Location External Termination Panel . . . . . . . . . . . . . . . . . . . . . . . . 142
Pulse Input Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
PI Module 3382S2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148
PI Baseplate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
PI Hazardous Location Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158
Solid-State Relay Output Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
SRO Module Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
SRO Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
Interconnect Assemblies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
I/O Bus Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
I/O Bus Terminators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
MP Baseplate End Caps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173
I/O Baseplate and I/O Extender Module End Caps . . . . . . . . . . . . . . . . . . . . . . . . . 173
Covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
Chapter 3
Installation and Maintenance
175
System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

System Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176
Determining Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
General Cooling Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Determining Cooling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
General Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
Plant Power and Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
Tri-GP Field, Power, and Ground Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180
Application-Specific Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182
Component Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Mounting a Panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Installing Baseplates on a Column . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
Connecting Columns with I/O Extender Modules . . . . . . . . . . . . . . . . . . . . . . . . . . 192
Installing Modules on Baseplates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
Installing the Module Address Plug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
Installing Other Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Enclosing the Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 197
Controller Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
Grounding Baseplates to Protective Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198
Grounding Logic Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Grounding Field Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Connecting Shields to Earth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
Alarm Wiring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203
vi
Contents
Implementation and Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204

Disabling Output Voter Diagnostics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Checking Controller Power Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Enabling Disabled Output Voter Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 205
Toggling Field I/O Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
Verifying Spare Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Guidelines for Replacing Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Replacing a Main Processor Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Replacing a Communication Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
Replacing an I/O Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Chapter 4
Fault and Alarm Indicators
211
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
Fault and Alarm Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
Main Processor Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213
MP Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
MP System Mode Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
MP Alarm Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
MP Communication Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Communication Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
CM Status Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
CM Communication Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Analog Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
AI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
AI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Analog Input/Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
AI/DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
AI/DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 226
Analog Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
AO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 228
AO Field Alarm Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Digital Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230
DI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
DI Field Power Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
DI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Digital Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Status Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 235
Power/Load Indicator on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Point Indicators on DO and SDO Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Load Indicators on SDO Modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 236
Pulse Input Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
PI Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 238
PI Field Fault Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239
Contents
vii
PI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Solid-State Relay Output Module Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
SRO Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 241
SRO Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 242
Appendix A Pin-Outs for Cables and Connectors
243
Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244

10BaseT and 100BaseTX Ethernet Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
AUI 10 Megabit Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244
MII Ethernet MAU Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 245
Serial Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
RS232 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 247
RS485 Pin-Outs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 248
Ethernet Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
Cross-Over Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
Straight-Through Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
RS-232 Serial Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
RS-485 Serial Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
Diagread Cables and Debug Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
Diagread Cable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
Debug Connector for MP and Left-Position CMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . 255
Debug Connector for I/O and Right-Position CMs . . . . . . . . . . . . . . . . . . . . . . . . . . 255
Appendix B Non-Incendive Circuit Parameters
257
MP and CM Non-Incendive Circuit Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258

Hazardous Location HART Baseplate Non-Incendive Circuit Parameters . . . . . . . . . . . 259
Appendix C HART Communication
261
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 262
Triconex 4850 Hart Multiplexer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265
Installing the Triconex 4850 HART Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 266
Triconex 4850 HART Multiplexer Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 267
Appendix D Warning Labels
269
General Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269

Hazardous Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
Hot Surface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 270
Appendix E Recommended Parts for Replacement
271
Appendix F Panel Labels
273
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274
AI/DI Hazardous Location External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . 275
RTD/TC/AI External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 276
viii
Contents
SSR Input External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277
Glossary
279
Index
287
Preface
This guide includes information on planning and installing a version 2.x Triconex General
Purpose System.
Throughout the rest of this guide, the Triconex General Purpose System also may be referred to
as the Tri-GP.
Summary of Sections
Chapter 1, Introduction Describes the theory of operation supporting the controller.
Chapter 2, System Description Provides descriptions, illustrations, specifications,

and simplified schematics for components of the controller.
Chapter 3, Installation and Maintenance Provides guidelines for the person

responsible for installing and maintaining a controller.
Chapter 4, Fault and Alarm Indicators Provides information on responding to alarm

conditions.
Appendix A, Pin-Outs for Cables and Connectors Provides pin-out information for
standard cables and adapters used with the controller.
Appendix B, Non-Incendive Circuit Parameters Describes the parameters to be used

for non-incendive communication circuits in the field.
Appendix C, HART Communication Describes HART communication through

Tri-GP systems.
Appendix D, Warning Labels Provides a physical description of warning labels

required for systems in which certain hazards may occur.
Appendix E, Recommended Parts for Replacement Lists the parts recommended by

Invensys to replace existing parts and to customize your system.
Appendix F, Panel Labels Shows how to apply external termination panel (ETP)
labels.
Glossary Provides information for terms and topics used throughout the guide.
Preface
Related Documents
Communication Guide for Triconex General Purpose v2 Systems
Product Release Notice for Triconex General Purpose v2.x Systems
Safety Considerations Guide for Triconex General Purpose v2 Systems
TriStation 1131 Developers Guide
TriStation 1131 Libraries Reference
Product and Training Information

To obtain information about Invensys products and in-house and on-site training, see the
Invensys website or contact your regional customer center.
Web Site
http://www.iom.invensys.com
Technical Support
Customers in the U.S. and Canada can obtain technical support from the Invensys Global
Customer Support (GCS) center at the numbers below. International customers should contact
their regional Invensys support office.
Requests for support are prioritized as follows:
Emergency requests are given the highest priority
Requests from participants in the System Watch Agreement (SWA) and customers with
purchase order or charge card authorization are given next priority
All other requests are handled on a time-available basis
If you require emergency or immediate response and are not an SWA participant, you may
incur a charge. Please have a purchase order or credit card available for billing.
Telephone
Toll-free number 866-746-6477, or
Toll number
508-549-2424 (outside U.S.)
Fax
Toll number
508-549-4999
Web Site
http://support.ips.invensys.com (registration required)
Preface
xi
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xii
Preface
1
Introduction
Controller Features
Fault Tolerance
System Configuration
Theory of Operation
International Certifications and Qualifications
16
Chapter 1
Introduction
Controller Features
The Tri-GP version 2.x controller is a state-of-the-art programmable logic and process controller
that provides a high level of system fault tolerance. To ensure the highest possible system
integrity at all times, the Tri-GP controller includes these features:
Provides Triple Modular Redundant (TMR) architecture whereby each of three

identical system channels independently executes the control program, and specialized
hardware/software mechanisms vote all inputs and outputs.
Withstands harsh industrial environments.
Enables field installation and repair to be done at the module level while the controller
remains online. Replacing an I/O module does not disturb field wiring.
Supports I/O modules (analog and digital) and an optional Communication Module
that interfaces with Modbus masters and slaves, other Triconex controllers in Peer-toPeer networks, and external host applications on Ethernet networks.
Support for:
25 I/O baseplates maximum
416 AI points maximum (13 AI baseplates, 13 AI/DI baseplates, or any combination
that does not exceed 416 total AI or AI/DI points)
20 AO points maximum (5 baseplates)
640 DI points maximum (20 DI baseplates, 13 AI/DI baseplates, or any combination
that does not exceed 640 total DI points)
320 DO points maximum (20 baseplates)
30 PI points maximum (5 baseplates)
640 SRO points maximum (20 baseplates)
Integrates the I/O module with the termination assembly.
Executes control programs developed and debugged with TriStation 1131 software.
(For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on
the Invensys Global Customer Support (GCS) website.)
Allows normal maintenance while the Tri-GP controller is operating, without

disturbing the controlled process.
Provides TriStation 1131 and Modbus communication from the Main Processor (MP) or
from the Communication Module (CM).
Provides a dedicated co-processor which controls the input and output modules to
reduce the workload of the MP. Each I/O module is supported by custom applicationspecific integrated circuits (ASICs), which scan inputs and perform diagnostics to
detect hardware faults. Output module ASICs do the following:
Supply information for voting of output data.
Check I/O loop-back data from the output terminal for final validation of the
output state.
Perform diagnostics to detect hardware and field-wiring problems.
Fault Tolerance
Provides integral online diagnostics with adaptive-repair capabilities.
Supports hot-spare I/O modules for critical applications where prompt service may not
be possible.
Provides integral support for redundant field and logic power sources.
Fault Tolerance
Fault tolerance, the most important capability of the Tri-GP controller, is the ability to detect
transient and steady-state error conditions and take appropriate corrective action online. With
fault tolerance, there is an increase in safety and an increase in the availability of the controller
and the process being controlled.
The Tri-GP controller provides fault tolerance through Triple Modular Redundant (TMR)
architecture. The controller consists of three identical channels, except for the Power Modules
which are dual-redundant. Each channel independently executes the control program (also
referred to as the TriStation 1131 application) in parallel with the other two channels. Hardware
voting mechanisms qualify and verify all digital inputs and outputs from the field; analog
inputs are subject to a mid-value selection process.
Because each channel is isolated from the others, no single-point failure in any channel can pass
to another. If a hardware failure occurs in one channel, the faulty channel is overridden by the
other channels. Repair consists of removing and replacing the failed module in the faulty
channel while the controller is online and without process interruption. The controller then
reconfigures itself to full TMR operation.
Extensive diagnostics on each channel, module, and functional circuit immediately detect and
report operational faults by means of indicators or alarms. All diagnostic fault information is
accessible by the control program and the operator. If faults are detected, the operator can use
the diagnostic information to modify control actions or direct maintenance procedures.
Because the triplicated system operates as one control system, the Tri-GP controller can be
programmed with one control program that terminates sensors and actuators at a single wiring
terminal.
Chapter 1
Introduction
Physically, a basic Tri-GP version 2 controller consists of Main Processors, I/O modules, an
optional Communication Module, the baseplates on which the modules are mounted, field
wiring connections, and a PC running the TriStation 1131 software. This section briefly
describes these components.
A typical Tri-GP system is configured into one or more vertical I/O columns guided by DIN
rails and mounted on a sheet-metal panel. Tri-GP modules are field-replaceable units consisting
of an electronic assembly housed in a metal spine. Each module has a protective cover that
ensures no components or circuits are exposed even when a module is removed from the rail.
Offset backplane connectors make it impossible to plug a module in upside down, and keys on
each module prevent the insertion of modules into incorrect slots. The Tri-GP controller
supports digital and analog input and output points, as well as pulse and thermocouple inputs
and multiple communication protocols.
Controller Configuration
A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O
assemblies. Assemblies are configured into a system on a mounting plate using interconnect
assemblies, extenders, I/O bus cables, and I/O bus terminators. I/O modules communicate
with the MPs by means of a triplicated, RS-485, bi-directional communication bus, called the
I/O bus.
For more information, see System Specifications on page 176.
TriStation 1131 Software

TriStation 1131 software is required to develop and download the control program that runs on
the Tri-GP controller. TriStation 1131 software provides three programming languages which
comply with the IEC 61131-3 standard: Function Block Diagram, Ladder Diagram, and
Structured Text. An optional language, CEMPLE (Cause and Effect Matrix), can be purchased
separately.
For software compatibility, see the Product Release Notice for Tri-GP v2.x, available on the
Invensys Global Customer Support (GCS) website.
Theory of Operation
Theory of Operation
The Tri-GP controller is designed with a Triple Modular Redundant (TMR) architecture, which
is a fully triplicated architecture throughout, from the input modules through the Main
Processors, to the output modules. Each module houses the circuitry for three independent
channels. Each channel on the input modules reads the process data and passes that information
to its respective Main Processor. The three Main Processors communicate with each other using
a proprietary high-speed bus system called the TriBus.
Output Module
Input Module
Hot Spare
Hot Spare
Channel A I/O Bus
Input
Channel A
Output
Channel A
IOP A
(IOX)
Channel B IO/ Bus
MP B
(SX)
Input
Channel C
Output
Channel B
IOP B
(IOX)
Field
Output
Output
Channel C
Channel C I/O Bus
MP C
(SX)
Figure 1
Diagnostic Channel
Input
Channel B
TriBus &TriTime
Field
Input
Output Voter
MP A
(SX)
IOP C
(IOX)
Triplicated Architecture of the Tri-GP Controller
Once per scan, the Main Processors synchronize and communicate with their neighbors over the
TriBus. The TriBus sends copies of all analog and digital input data to each Main Processor, then
compares output data from each Main Processor. The Main Processors vote the input data,
execute the control program, and send outputs generated by the control program to the output
modules.
The Tri-GP controller votes the output data on the output modules as close to the field as
possible to detect and compensate for any errors that could occur between the TriBus voting and
the final output driven to the field.
Each I/O slot can contain two identical I/O modules which means if a fault is detected on one
module, control is automatically switched to the healthy module. A faulty module can also be
replaced online when only one module is installed in the slot. In this case, a healthy module is
inserted in the spare slot and the control is switched to this module, which allows the faulty
module to be pulled and sent for repair.
Chapter 1
Introduction
Main Processor Modules

A Tri-GP controller contains three Main Processors. Each Main Processor controls a separate
channel of the system and operates in parallel with the other Main Processors. A dedicated I/O
Processor on each Main Processor manages the data exchanged between the Main Processor
and the I/O modules. A triplicated I/O bus, located on the baseplates, extends from one column
of I/O modules to another column of I/O modules by means of I/O bus cables.
As each input module is polled, the appropriate channel of the I/O bus transmits new input
data to the Main Processor. The input data is assembled into a table in the Main Processor and
is stored in memory for use in the hardware voting process. The individual input table in each
Main Processor is transferred to its neighboring Main Processors over the TriBus. During this
transfer, hardware voting takes place. The TriBus uses a direct memory access programmable
device to synchronize, transmit, vote and compare data among the three Main Processors.
If a disagreement occurs, the signal value found in two out of three tables prevails, and the third
table is corrected accordingly. One-time differences which result from sample timing variations
are distinguished from a pattern of differing data. Each Main Processor maintains data about
necessary corrections in local memory. Any disparity is flagged and used at the end of the scan
by the controllers fault analyzer routines to determine whether a fault exists on a particular
module.
Program Processor
I/O Processor
Dual 24 V
Power Inputs
Redundant
Alarm
Relays
Alarm 1
Alarm 2
System
Alarm
Debug (RJ-12)
+3.3 V
+5 V
Dual-Power
Regulators
3.6 V
Battery
and Monitor
Program
Alarm
Debug (RJ-12)
I/O Bus
Modbus (DB-9)
MPC860A
Reserved (DB-9)
Ethernet
Network (RJ-45)
Clock/NVRAM
8 KB
Shared
Memory
128 K
36-Bit Bus
Flash
4/8 MB
Tribus
(to other MPS)
Figure 2
TriBus
FPGA
36-Bit Bus
DRAM
16 MB
Up Stream
Down Stream
Up Stream
Down Stream
Diagnostic Bus
Channels
(to other MPs)
MPC860A
Main Processor Architecture
DRAM
16 MB
Theory of Operation
The Main Processors send the corrected data to the control program. Each Main Processor
executes the control program in parallel with the neighboring Main Processor. The control
program generates a table of output values which are based on the table of input values
according to customer-defined rules built into the control program. The I/O Processor on each
Main Processor manages the transmission of output data to the output modules by means of the
I/O bus.
Using the table of output values, the I/O Processor generates smaller tables, each corresponding
to an individual output module in the system. Each small table is transmitted to the appropriate
channel of the corresponding output module over the I/O bus. For example, Main Processor A
transmits the appropriate table to Channel A of each output module over I/O Bus A. The
transmittal of output data has priority over the routine scanning of all I/O modules. The I/O
Processor manages the data exchanged between the Main Processors and the Communication
Module using the communication bus which supports a broadcast mechanism.
Each Main Processor provides a 16-megabyte DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is
stored in flash EPROM and loaded in DRAM for execution. The Main Processors receive power
from redundant 24 VDC power sources. If an external power failure occurs, all critical retentive
data is stored in NVRAM. A failure of one power source does not affect controller performance.
If the controller loses power, the control program and all critical data are retained indefinitely.
Chapter 1
Introduction
Bus Systems and Power Distribution

This figure depicts the three triplicated I/O bus systems which are carried baseplate-tobaseplate using Interconnect Assemblies, I/O Extender Modules, and I/O bus cables. The
redundant logic power distribution system is carried using Interconnect Assemblies and I/O
Extender Modules.
Power
Supply
#1
Power
Supply
#2
~~~
I/O Bus
Channel A
Channel B
Channel C
EM
CM
I/O
Communication
Bus
Interconnect
Assembly
I/O Bus
I/O
I/O Bus
MP
I/O
I/O
Power
Bus
Power
Bus
EM
Figure 3
EM
Tri-GP Bus Systems and Power Distribution
TriBus Operation
The TriBus, which is local to the MP Baseplate, consists of three independent serial links
operating at 25 megabits per second. The TriBus synchronizes the Main Processors at the
beginning of a scan, and performs either of these functions:
Transfers I/O, diagnostic, and communication data.
Compares data and identifies disagreements with the output data and program
memory from the previous scan.
An important feature of Tri-GP controller architecture is the use of a single transmitter to send
data to both the upstream and downstream Main Processors which ensures the same data is
received by the upstream processor and downstream processor.
Theory of Operation
I/O Bus Operation

Field signal distribution is local to each I/O baseplate. Each I/O module transfers signals to or
from the field through its associated baseplate assembly. Two positions on the baseplate tie
together as one logical slot. Each field connection on the baseplate extends to both positions,
which means that both the active module and the hot-spare module receive the same
information from the field termination wiring.
The triplicated I/O bus transfers data between the I/O modules and the Main Processors at 2
megabits per second. The I/O bus is contained within an I/O column and can be extended to
another I/O column by using a set of three I/O bus cables (one for each TMR channel.)
Communication Bus Operation

The communication bus runs between the Main Processors and the Communication Modules at
2 megabits per second.
Power Distribution
Power for the modules on each DIN rail is distributed using two independent power rails. Each
module along the DIN rail draws power from both power rails through dual power regulators.
There are four sets of power regulators on each input and output board: one set for each channel
(A, B, and C) and one set for the status indicators.
10
Chapter 1
Introduction
Logic Power
+24V #1
+24V #2
RTN
Each module is designed to operate directly from redundant 24 VDC power sources. Logic
power is carried baseplate-to-baseplate, allowing a single logic power connection per column.
The power conditioning circuitry is protected against over-voltage, over-temperature, and overload conditions. Integral diagnostic circuitry checks for out-of-range voltages and overtemperature conditions. A short on a channel disables the power regulator rather than affecting
the power sources.
+6.5V
+6.5V
Typical I/O Module

Leg A
REG
Vcc
Vcc
Isolated
DC DC
Converter
DC DC
Converter
REG
Leg B
REG
Vcc
Vcc
Isolated
DC DC
Converter
DC DC
Converter
REG
Logic
(System)
Functional
Earth
REG
Vcc
Vcc
Isolated
DC DC
Converter
Field
Functional
Earth
~~
~~~
Power
Bus
~ ~
Field
Functional
Earth
Leg C
REG
~~
Field
Functional
Earth
Isolation
Barrier
Figure 4
Logic Power Distribution
Controller Communication
The controller can communicate directly with a PC running TriStation 1131 software and other
devices through the Main Processor and the Communication Module.
Main Processor Modules

Each MP can provide direct TriStation 1131 and Modbus communication, including:
One TriStation 1131 (Ethernet) port for downloading an application to the controller
and uploading diagnostic information.
One Modbus RS-232/RS-485 serial port which acts as a slave to an external host
computer. Typically, a distributed control system (DCS) monitorsand optionally
updatesthe controller data directly though an MP.
Theory of Operation
11
Communication Module
The Communication Module (CM) provides an optional, three-to-one interface to the Main
Processors that supports serial and Ethernet communication protocols. A single controller
supports up to two CMs on one CM Baseplate with each CM operating independently. Two
CMs can provide redundant communication connections or independent communication ports.
Each CM provides three RS-232/485 serial ports and two Ethernet ports. These ports support a
variety of communication protocols and physical media types that enable the controller to
communicate with external host computers, distributed control systems, open networks,
network printers, and other Tri-GP, Trident, and Tricon v9v10 controllers.
For CM specifications, see Chapter 2, System Description. For details about communication
protocols, see the Communication Guide for Triconex General Purpose v2 Systems.
Physical Communication Interfaces

This table lists the physical communication interfaces included with the MP and CM.
Interfaces
MP
CM
RS-232/RS-485 Modbus Serial Port
10BaseT Ethernet Port
10BaseT/100BaseTX Auto-negotiable Ethernet Port
Attachment unit interface (AUI) for media access unit (MAU)
Media independent interface (MII) for MAU
Debug port
Communication Protocols
This table lists the protocols supported by serial and network ports on the MP and CM.
Protocols
Port Type
MP
CM
Modbus Slave (ASCII or RTU)
Serial
Modbus Master (RTU)
Serial
Modbus Master or Slave (TCP)
Network
TriStation 1131
Network
TCP/IP
Network
Triconex System Access Application (TSAA) (UDP/IP)
Network
Triconex System Access Application (TSAA) with IP Multicast

(UDP/IP)
Network
Triconex Time Synchronization via DLC
Network
Triconex Time Synchronization via UDP/IP or SNTP
Network
12
Chapter 1
Introduction
Protocols
Port Type
MP
CM
Triconex Peer-to-Peer via UDP/IP
Network
Triconex Peer-to-Peer via DLC
Networka
Hewlett-Packard JetDirect Network Printer Server Data Link Control

(DLC)/Logical Link Control (LLC)
Network
a. NET 1 only
System Diagnostics and Status Indicators

The Tri-GP controller incorporates online diagnostics and specialized fault monitoring circuitry
which are able to detect and alarm all single-fault and most multiple-fault conditions. The
circuitry includesbut is not limited toI/O loop-back, watch-dog timers, and loss-of-power
sensors. Using the alarm information, the response of the system can be customized to the
specific fault sequence and operating priorities of the application.
Each module can activate the system integrity alarm, which consists of normally closed (NC)
relay contacts on each MP. Any failure condition, including loss or brownout of system power,
activates the alarm to summon plant maintenance personnel.
Each controller module can activate the system integrity alarm. The alarm consists of a normally
closed or normally opened (NC or NO) relay contact on each Power Module. Any failure
condition, including loss or brownout of system power, activates the alarm to summon plant
maintenance personnel.
The front panel of each module provides LED (light-emitting-diode) indicators that show the
status of the module or the external systems to which it is connected. Pass, Fault, and Active are
common indicators. Other indicators are specific to each module.
Figure 5
Front Panel Indicators
Maintenance consists of replacing plug-in modules. A lighted Fault indicator shows that the
module has detected a fault and must be replaced. The control circuitry for the indicators is
redundant and is isolated from each of the three channels.
All internal diagnostic and alarm status data is available for remote logging and report
generation. This reporting can be done through a local or remote PC running TriStation 1131
software, or through a host computer. For more information, see the TriStation 1131 Developers
Guide.
Theory of Operation
13
Analog Input Module

For Analog Input Modules, each of the three channels asynchronously measures the input
signals and places the results into a table of values. Each of the three input tables is passed to its
associated Main Processor using the I/O bus. The input table in each Main Processor is
transferred to its neighbors across the TriBus. The middle value is selected by each Main
Processor and the input table in each Main Processor is corrected accordingly. In TMR mode,
the mid-value data is used by the control program; in DUAL mode, the average is used.
AI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test
diagnostic that detects and signals an alarm for all stuck-at and accuracy fault conditions
typically in less than 500 milliseconds. This safety feature allows unrestricted operation under
a variety of multiple-fault scenarios.
Each AI Module is guaranteed to remain in calibration for the life of the controller. Periodic
manual calibration is not required.
For specifications, see Analog Input Components on page 49.
Analog Input/Digital Input Module

The Analog Input/Digital Input Module has 16 digital input points (points 116) and 16 analog
input points (points 1732).
The AI/DI Module has three isolated sets of electronics, called channels, which independently
process field data input to the module. Sensing of each input point is performed in a manner
that prevents a single failure on one channel from affecting another channel.
For analog input points, each channel receives variable voltage signals from each point, converts
them to digital values, and transmits the values to the three MPs on demand.
For digital input points, an ASIC on each channel scans each input point, compiles data, and
transmits it to the MPs on demand.
For all points, the MPs vote the data before passing it to the control program. In TMR mode, the
data passed is mid-value. In DUAL mode, the data passed is the average.
AI/DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics
detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The
Fault indicator identifies a channel fault, not a complete module failure. AI/DI Modules are
guaranteed to operate properly in the presence of a single fault and may continue to operate
properly with multiple faults.
AI/DI Modules include the hot-spare feature which allows online replacement of a faulty
module. The AI/DI Module is mechanically keyed to prevent improper installation in a
configured baseplate.
For specifications, see Analog Input/Digital Input Components on page 72.
14
Chapter 1
Introduction
Analog Output Modules

For Analog Output Modules, each of the three channels includes a proprietary ASIC that
receives its output table from the I/O communication processor on its corresponding Main
Processor. AO Modules use special shunt circuitry to vote on the individual output signals
before they are applied to the load. Voter circuitry ensures only one output channel (A, B, or C)
is driving the field load. The shunt output circuitry provides multiple redundancy for all critical
signal paths, guaranteeing safety and maximum availability.
AO Modules continuously execute Forced Switch Diagnostics (FSD) on each point. By carefully
forcing error conditions and observing proper behavior of the voting circuitry, high reliability
and safe operation is ensured. This safety feature allows unrestricted operation under a variety
of multiple-fault scenarios.
Each AO Module is guaranteed to remain in calibration for the life of the controller. Periodic
manual calibration is not required.
For specifications, see Analog Output Components on page 82.
Digital Input Module

For Digital Input Modules, each of the three channels reside on the same module, however, the
circuitry is completely isolated from each other and operates independently. This isolation
means a fault on one channel cannot pass to another. In addition, each channel contains a
proprietary ASIC which manages communication with its corresponding Main Processor, and
supports run-time diagnostics.
Each of the three input channels asynchronously measures the input signals from each point on
the baseplate, determines the respective states of the input signals, and places the values into
separate input tables A, B and C respectively. Each input table is regularly interrogated over the
I/O bus by the I/O Communication Processor located on the corresponding Main Processor.
For example, Main Processor A interrogates Input Table A over I/O Bus A.
DI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test
diagnostic that detects and signals an alarm for all stuck-at fault conditions typically in less than
500 milliseconds. This safety feature allows unrestricted operation under a variety of multiplefault scenarios.
DI Module diagnostics are specifically designed to monitor devices which hold points in one
state for long periods of time. The diagnostics ensure complete fault coverage of each input
circuit even if the actual state of the input points never changes.
For specifications, see Digital Input Components on page 101.
Digital Output Module

For Digital Output Modules, each of the three channels includes a proprietary ASIC which
receives its output table from the I/O communication processor on its corresponding Main
Processor. All DO Modules use the patented Quad Voter circuitry, which is a quadruplicated
output circuitry which votes on the individual output signals just before they are applied to the
load. This voter circuitry is based on parallel-series paths which pass power if the drivers for
Theory of Operation
15
Channels A and B, or Channels B and C, or Channels A and C command them to closein other
words, 2-out-of-3 drivers voted On. The quadruplicated output circuitry provides multiple
redundancy for all critical signal paths, guaranteeing safety and maximum availability.
During Output Voter Diagnostics (OVD) execution, the commanded state of each point is
momentarily reversed on one of the output drivers, one after another. Loop-back circuitry on
the module allows each ASIC to read the output value for the point to determine whether a
latent fault exists within the output circuit. The output signal transition is guaranteed to be less
than 2 milliseconds (500 microseconds is typical) and is transparent to most field devices. For
devices that cannot tolerate a signal transition of any length, OVD can be disabled on a per-point
basis.
DO Module diagnostics are specifically designed to monitor outputs which remain in one state
for long periods of time. The OVD diagnostics ensure complete fault coverage of each output
circuit even if the actual state of the output points never changes.
Supervised Digital Output Modules

Supervised Digital Output Modules provide both voltage and current loopback, allowing
complete fault coverage for both energized-to-trip and de-energized-to-trip conditions. In
addition, a Supervised Digital Output Module verifies the presence of the field load by doing
continuous circuit-continuity checks. Any loss of field load causes an open-load field error and
the load indicator to illuminate.
Pulse Input Module

For Pulse Input Modules, each of the three channels independently receives pulse input
voltages from each point and converts the values to frequency (RPM) data. Special algorithms,
optimized for accurately measuring the speed of rotating machinery, are used to compensate for
the irregularly spaced teeth on timing gear or for periodic acceleration or de-acceleration. The
results are placed into a table of values. Each input table is passed to its associated Main
Processor using the corresponding I/O bus. The input table in each MP is transferred to its
neighbors across the TriBus. The middle value is selected by each MP and the input table in each
MP is corrected accordingly. In TMR mode, the mid-value is used by the control program; in
DUAL mode, the average is used.
Special self-test circuitry is provided to diagnose the health state of all input points, even when
an active signal is not present. Each Pulse Input Module is guaranteed to remain in calibration
for the life of the controller. Periodic manual calibration is not required.
For specifications, see Pulse Input Components on page 146.
Solid-State Relay Output Module

For Solid-State Relay Output Modules, output signals are received from the Main Processors on
each of three channels. The three sets of signals are voted and the voted data is used to drive the
32 individual relays. Each output has a loop-back circuit which verifies the operation of each
relay switch independently of the presence of a load. Ongoing diagnostics test the operational
status of the SRO Module.
16
Chapter 1
Introduction
The SRO Module is a non-triplicated module for use on non-critical points which are not
compatible with high-side, solid-state output switches; for example, interfacing with
annunciator panels.
For specifications, see Solid-State Relay Output Components on page 165.

The Tri-GP controller has been certified as complying with multiple internationally recognized
standards by the following internationally recognized certification agencies, these certifications
have qualified the Tri-GP for use around the world in safety critical applications. Test reports
from the various certification agencies are available upon request.
Topics include:
Canadian Standards Association on page 16
Factory Mutual on page 17
TV Rheinland on page 18
European Union CE Mark on page 20
Canadian Standards Association

CSA has certified that the Tri-GP v2.x controller is in full compliance with the following
internationally recognized electrical safety standards and is qualified for general use in North
American and other jurisdictions requiring compliance with these standards.
Standard Number
Title
CAN/CSA-C22.2 No.0-M91
General Requirements-Canadian Electrical Code, Part II
CSA Std C22.2 No.0.4-M1982
Bonding and Grounding of Electrical Equipment (Protective

Grounding)
CAN/CSA C22.2 No 1010.1-92
Safety Requirements for Electrical Equipment for Measurement,

Control, and Laboratory Use, Part 1: General Requirements
UL 3121-1 1998-07-14
Electrical Equipment for Laboratory Use, Part 1: General

Requirements
17
Factory Mutual
FM has certified that the Tri-GP v2.x controller is in full compliance with the following
internationally recognized standards and is qualified for use in Class I, Division 2 Temperature
T4, Groups A, B, C, and D hazardous indoor locations.
In North America, the field signals used with ATEX-compliant external termination panels are
certified for Class I, Division 2, Groups C and D.
Standard Number
Title
3611
Electrical Equipment for use in Class I-Division 2; Class II-Division 2; and

Class III-Divisions 1 and 2, Hazardous Locations
3810
Electrical and Electronic Test, Measuring and Process Control Equipment
3600
Electrical Equipment for Use in Hazardous (Classified) Locations-General

Requirements
Note
For hazardous location applications, redundant power sources should be used for
system power. Also, any signal going to or through a hazardous atmosphere must use
hazardous location protection, such as an IS Barrier.
18
Chapter 1
Introduction
TV Rheinland
TV has certified that the Tri-GP v2.x is in full compliance with the internationally recognized
standards listed below, and thus is qualified for use in the following applications and
jurisdictions.
Emergency safety shut-down or other critical control applications requiring SIL 1-2
certification per the functional safety requirements of IEC 61508.
Emergency safety shut-down or other critical control applications in the process sector
requiring SIL 12 certification per the functional safety requirements of IEC 61511.
Burner management applications requiring certification per the requirements of

EN 50156-1:2004
Burner management applications requiring certification per the requirements of NFPA

85:2007
Fire detection and fire alarm applications requiring certification per the requirements of
EN 54-2:1997/A1:2006a
Standard Number
Title
IEC 61508, Parts 1-7, 2000
Functional safety of electrical/electronic/programmable electronic

safety-related systems
IEC 61511:2004
Functional safety - Safety instrumented systems for the process

industry sector
IEC 61131-2:2007
Programmable Controllers Part 2: Equipment Requirements and Test.

Overvoltage Category II is assumed.
IEC 61326-3-1:2008
Electrical equipment for measurement, control and laboratory use EMC requirements - Part 3-1: Immunity requirements for safetyrelated systems and for equipment intended to perform safety-related
functions (functional safety) - General industrial applications
ANSI/ISA-84.00.01-2004
(IEC 61511-1 Mod)
Functional Safety: Safety Instrumented Systems for the Process

Industry Sector - Part 1: Framework, Definitions, System, Hardware
and Software Requirements
EN 50156-1:2004
Electrical equipment for furnaces and ancillary equipment.

Requirements for application design and installation
EN 50178:1998
Electronic equipment for use in power installations
EN 54-2:1997/A1:2006a
Fire detection and fire alarm systems. Control and indicating

equipment.
NFPA 72:2007
National Fire Alarm Code
NFPA 85:2007
Boiler and Combustion Systems Hazards Code, 2007 Edition
a. To comply with the requirements of EN 54-2:1997/A1:2006, the Tri-GP system must be installed in a
metal enclosure with a sealed bottom and a closed door, connected to Safety Ground, as described in
Enclosing the Controller on page 197, and it must be installed in an area with an access level greater
than 2.
Note
19
To comply with standards related to conducted disturbance, a Schaffner FN 2410 line

filter, or equivalent, must be installed between power supplies and baseplates.
For semiconductor manufacturing applications, compliance with these additional installation

guidelines is highly recommended:
Field and logic power supplies should be approved for use in safety extra-low-voltage
(SELV) circuits according to the requirements of IEC 61010-1.
For installations with voltages greater than 30 Vrms/36 VDC, the controller and
associated equipment must be installed in a locked cabinet restricting access to trained
personnel only, with a hazardous-voltage warning label attached prominently.
For installations with ambient temperatures exceeding 94 F (35 C), the controller and
associated equipment should be installed in a locked cabinet restricting access to
trained personnel only, with a hot-surface warning label attached prominently.
For applications in which continuous, correct system operation must be assured, the
controller and associated equipment should be installed in a locked cabinet restricting
access to trained personnel only, with a general-hazard warning label attached
prominently.
For a physical description of labels, see Appendix D, Warning Labels.
20
Chapter 1
Introduction
European Union CE Mark

Based upon the independent TV evaluation and test results, Invensys has certified the Tri-GP
v2.x controller suitable to use in the European Union and all other jurisdictions requiring
compliance with the European Union EMC Directive No. 2004/108/EC and Low Voltage
Equipment Directive No. 2006/95/EC. See the EC Declaration of Conformity for details.
To ensure maximum reliability and trouble-free operation, the Tri-GP and associated wiring
must be installed per the guidelines outlined in this manual. To comply with the CE Mark
requirement for emissions and radiated susceptibility, and EU directives, these guidelines must
be followed:
The entire Tri-GP system must be mounted in a metal enclosure with the door closed.
Field power supplies must be approved for use in safety extra-low-voltage (SELV)
circuits according to the requirements of IEC 61010-1.
EC Declaration of Conformity
The following declaration of conformity with the European Union directives for
electromagnetic compatibility and low-voltage equipment is provided as a convenience. The
declaration is the latest available at publication time and may have been superseded. For
updates, contact the Invensys Global Customer Support (GCS) center.
21
Invensys Operations Management, a business group of Invensys plc

26561 Rancho Parkway South
Lake Forest, CA 92630 USA
EC Declaration of Conformity
EU Directives Covered by this Declaration
2004/108/EC Electromagnetic Compatibility Directive
2006/95/EC Low Voltage Equipment Directive
Products Covered by this Declaration

Triconex General Purpose System (Triple Modular Redundant Controller) Version 2.x2101S2, 2201S2, 2301S2, 2302S2, 2302AS2, 2342S2,
2351S2, 2352S2, 2352AS2, 2361S2, 2381S2, 2381AS2, 2401S2, 2401LS2, 2402S2, 2402AS2, 2451S2, 2480AS2, 2481S2, 3101S2, 3201S2, 3301S2,
3311S2, 3351S2, 3361S2, 3381S2, 3382S2, 3401S2, 3411S2, 3451S2, 3481S2, 3482S2, 9764-510F, interconnect assemblies, extender modules,
I/O bus cabling, and termination products
Basis on which Conformity is being Declared

The product identified above complies with the requirements of the above EU Directives by meeting these standards.
1.
EN 61000-6-4:2007
EN 55011:2007 Gr. 1 Kl. A
IEC 61131-2:2007
IEC 61000--6-4:2007
IEC 61131-2:2007
EMC - Emissions
Conducted and radiated
Radiated interference (class A)
Radiated interference (class A)
Conducted interference (class A)
2.
EN 61131-2:2007
IEC 61131-2:2007 - 9.5
IEC 61326-3-2:2008
EN 50130-4:2003
EN 61000-4-2:2008
EN 61000-4-3:2006 + A1:2008 + IS1:2009
IEC 61131-2:2007 - 9.8
IEC 61326-3-1:2008
IEC 61326-3-2:2008
EN 50130-4:2003
EN 61000-4-4:2004
IEC 61131-2:2007 - 9.9
IEC 61326-3-2:2008
EN 50130-4:2003
EN 61000-4-5:2006
IEC 61131-2:2007
EN 61000-4-12:2006
IEC 61326-3-1:2008 - Table 1 b-e
EN 61000-4-16:1998 + A1:2004
EMC - Immunity
Electrostatic discharge
Radiated HF fields
Fast transient bursts
High-energy surges
High-energy surges
High-energy surges
High-energy surges
Damped oscillatory wave (Ringwave)
Damped oscillatory wave (Ringwave)
Conducted common mode voltage
Conducted common mode voltage
3.
EN 61131-2:2007
EN 61010-1:2007
Product Safety
Overvoltage Category II
The technical documentation required to demonstrate that the product meets the requirements of the above directives has been compiled
by the signatory below and is available for inspection by the relevant enforcement authorities. The CE mark was first applied in: 2010.
Special Measures and Limitations which Must be Observed

The product must be installed and operated as described in the Planning and Installation Guide for Triconex General Purpose v2 Systems.
Signed:
Gary Hufton, Director, Control H/W Development

Invensys Operations Management
14 September 2010
22
Chapter 1
Introduction
2
System Description
Overview
24
Main Processor Components
35
Communication Components
43
I/O Modules Common Specifications
47
Analog Input Components
49
Analog Input/Digital Input Components
72
Analog Output Components
82
Digital Input Components 101

Digital Output Components 119
Pulse Input Components 146
Solid-State Relay Output Components 165
Interconnect Assemblies 170
I/O Extender Modules 171
End Caps 173
Covers 174
24
Chapter 2
System Description
Overview
This chapter describes the hardware components available for Tri-GP v2.x systems. Physically,
a Tri-GP system consists of field-replaceable modules, the baseplates upon which modules are
mounted, field wiring connections, and a PC used to run the TriStation 1131 software. This
section briefly describes these major elements and provides general specifications.
A basic Tri-GP system consists of one MP assembly, an optional CM assembly, and I/O
assemblies. Assemblies consist of a one or two modules on a baseplate. Assemblies are installed
on a mounting plate using interconnect assemblies, extenders, I/O bus cables, and I/O bus
terminators. I/O modules communicate with the MPs by means of a triplicated, RS-485, bidirectional communication bus, called the I/O bus. The I/O bus cable can be used to join I/O
columns.
Each module is fully enclosed to ensure that no components or circuits are exposedeven when
a module is removed from the baseplate. Offset baseplate connectors make it impossible to plug
a module in upside down, and keys on each module prevent the insertion of modules into
incorrect slots.
Topics include:
General Environmental and EMC Specifications on page 24
Typical Weight of Components on page 25
Cable Flame Test Ratings on page 26
Ground Systems on page 26
Standard Tri-GP Products on page 28
General Environmental and EMC Specifications

The Tri-GP fully meets the requirements of IEC 61131, Part2: Programmable Controllers,
Equipment requirements and tests, for environmental withstand and immunity, and
electromagnetic compatibility. This table outlines the general environmental and EMC
specifications for the Tri-GP controller. For details, see IEC 61131.
Specifications
Parameters
Operating temperature
4 F to +158 F (20 C to +70 C) ambient (which is the air

temperature measured at the bottom of each baseplate), per IEC
60068-2-14, tests Na and Nb
Storage temperature
40 F to +185 F (40 C to +85 C) per IEC 60068-2-2, test Bb,

IEC 60068-2-1, test Ab, and IEC 60068-2-30, test Db
Relative humidity
5% to 95%, non-condensing
Corrosive environment
Class G3 Level as defined in ISA Standard S71.04, based on exposure

testing according to EIA Standard 364-65A, Class III
Overview
Specifications
Parameters
Sinusoidal vibrations per axis
1.75 mm displacement @ 5 to 8.4 Hz (continuous)
25
0.5 g acceleration @ 8.4 to 150 Hz (continuous)

3.5 mm displacement @ 5 to 8.4 Hz (occasional)
1.0 g acceleration @ 8.4 to 150 Hz (occasional)
All tests per IEC 60068-2-6, test Fc
Shock
15 g, 11 ms, half-sine, 3 axis, per IEC 60068-2-27, test Ea
IEC 61000-4-2, 4 kV contact, 8 kV air
Conducted susceptibility
IEC 61000-4-4, Fast Transient/Burst, 2 kV power & unshielded AC

I/O, 1 kV signal and communication lines
IEC 61000-4-5, Surge Withstand, 2 kV CM2/1 kV DM2 AC power and
I/O, 1 kV CM2 I/O, shielded and communication, 0.5 kV CM2/0.5
kV DM2 DC power
IEC 61000-4-6, RFI, 0.15-80 MHz, 10 V
IEC 61000-4-18, Damped Oscillatory Wave, 0.5 kV CM shielded, 2.5
kV CM/1 kV DM unshielded AC I/O & power, 1 kV CM/0.5 kV DM
I/O
Radiated susceptibility
IEC 61000-4-3, Radio Frequency Electromagnetic Fields, 801000

MHz: 10 V/m, 1.42.0 GHz: 3 V/m, 2.02.7 GHz: 1 V/m
Conducted emissions
CISPR 11, Group 1, Class A:

0.150.5 MHz: 79 dB(V) quazi-peak/66 dB(V) average
0.530 MHz: 73 dB(V)quazi-peak/60 dB(V) average
when installed following the guidelines in this manual.
Radiated emissions
CISPR 11, Class A:

30230 MHz: 40 dB(V/m) @ 10 m
2301000 MHz: 47 dB(V/m) @ 10 m
when installed following the guidelines in this manual.
Power interruptions
IEC 61000-4-29, 1 ms battery, 10 ms DC power supply
Typical Weight of Components

This table lists the typical weight of components. The baseplate weight is based on baseplate
only, not including modules.
Component
Weight in Pounds
Weight in Kilograms
Analog Input Module
3.0
1.4
Analog Input Baseplate
2.4
1.1
Analog Output Module
3.1
1.4
Analog Output Baseplate
2.1
1.0
3.3
1.5
26
Chapter 2
System Description
Component
Weight in Pounds
Weight in Kilograms
Communication Baseplate
2.8
1.3
Digital Input Baseplate
2.4
1.1
3.0
1.3
Digital Output Baseplate
2.1
1.0
3.2
1.4
Main Processor Baseplate
2.7
1.2
Main Processor Module
3.4
1.5
Pulse Input Module
3.0
1.4
Pulse Input Baseplate
2.8
1.3
Relay Output Baseplate
2.3
1.0
2.9
1.3
I/O Extender Module
0.4
0.2
Cable Flame Test Ratings

You can order standard Triconex interface cables and I/O bus cables that meet flame test ratings
as described in this table.
Cable
Rating
Interface cables
FT4 Vertical Flame Test-Cables in Cable Trays

per C.S.A. C22.2 No. 0.3-92 Para 4.11.4a
(connect external termination panels to baseplates)

I/O bus cables
(connect columns of baseplates)
FT6 Horizontal Flame & Smoke Test-per C.S.A.

C22.2 No. 0.3-92 Appendix Bb
a. Cables will be marked with FT4 or CMG rating, but they all actually meet the more stringent FT4
rating.
b. Cables will be marked with FT6 or CMP rating, but they all actually meet the more stringent FT6
rating.
Ground Systems
The Tri-GP has the following four, separate ground systems:
Protective earth
an AC safety ground
Field ground
Fa functional earth
Logic ground
La functional earth
Shield ground
Sa functional earth
Overview
27
The logic and field portions of each module use separate, isolated signal return paths. Each is
connected to its own functional earth. The metallic portions of the safety ground act as an
electrostatic shield for the internal circuitry. Communication cable shields are terminated to the
safety ground. The metallic portions of the Tri-GP controller are connected to the protective
earth.
For installation procedures, see:
Grounding Baseplates to Protective Earth on page 198
Grounding Logic Power on page 200
Connecting Shields to Earth on page 202
28
Chapter 2
System Description
Standard Tri-GP Products

The following table lists all of the standard Tri-GP products.
Table 1
Standard Tri-GP Products
Model
Product Name
Qty
Description
Consists of
5101S2
Main Processor TriPak
Main Processor Module
3101S2
Main Processor Baseplate Kit
2101S2
3201S2
Communication Module Baseplate Kit
2201S2
Analog Input Module
3351S2
Analog Input Baseplate Kit
2351S2
Analog Input/Digital Input

TriPak
3361S2
Analog Input/Digital Input Baseplate Kit
2361S2
Analog Input Tripak,

RTD/TC/4-20 mA
Analog Input Module
3351S2
Analog Input Baseplate, RTD/TC/4-20 mA
2352S2
Analog Input TriPak, HART
Analog Input Module
3351S2
Analog Input Baseplate Kit, HART,
2354S2
Triconex 4850 HART Multiplexer
1600106-001
Analog Input Module
3351S2
Analog Input Baseplate Kit, HART, Hazardous

Location
2354AS2
1600106-001
5201S2
5351S2
5361S2
5352S2
5354S2
5354AS2
5481-1S2
5482-1S2
5301S2
5311S2
5312S2
5302S2
5401S2
5401LS2
5411HS2
Communication Module TriPak

Analog Input TriPak
Analog Input TriPak, HART,

Hazardous Location
Analog Output TriPak
3481S2
AO Module Baseplate Kit
2481S2
Analog Output Tripak, HighCurrent
High-Current Analog Output Module
3482S2
AO Module Baseplate Kit
2481S2
Digital Input TriPak
3301S2
Digital Input Baseplate Kit
2301S2
Digital Input TriPak, High

Resolution
Digital Input Module, High Resolution
3311S2
2301S2

Resolution, High Voltage
3311S2
Digital Input Baseplate Kit, High Voltage
2302S2

Voltage
3301S2
Digital Input Baseplate Kit, High Voltage
2302S2
Digital Output TriPak
3401S2
Digital Output Baseplate Kit
2401S2
Digital Output TriPak, Low

Current
3401S2
Digital Output Baseplate Kit, Low Current
2401LS2
Digital Output TriPak,

Supervised, High Current
Digital Output Module, Supervised
3411S2
Digital Output Baseplate Kit, High Current
2401HS2
Overview
Table 1
29
Standard Tri-GP Products (continued)
Model
Product Name
Qty
Description
Consists of
5402S2
Digital Output TriPak, High

Voltage
3401S2
Digital Output Baseplate Kit, High Voltage
2402S2
5451S2
5382-1S2
5382AS2
5483S2
5483AS2
2101S2
2281
2291
2292
2301S2
Solid-State Relay Output TriPak

Pulse Input TriPak, Enhanced
Pulse Input TriPak, Enhanced,
Hazardous Location
Analog Output TriPak, HART
Analog Output TriPak, HART,

Hazardous Location
Main Processor Baseplate Kit
I/O Bus Extender Module Kit
I/O Bus Termination Kit, I/O

Baseplate
I/O Bus Termination Kit, MP

Baseplate
3451S2
Solid-State Relay Output Baseplate Kit
2451S2
Pulse Input Module, Enhanced
3382S2
Pulse Input Baseplate Kit
2381S2
3382S2
Pulse Input Baseplate Kit, Hazardous Location
2381AS2
3481S2
Analog Output Baseplate Kit, HART
2483S2
1600106-001
3481S2
Analog Output Baseplate Kit, HART,

Hazardous Location
2483AS2
1600106-001
MP Baseplate
3000671-110
MP Interconnect Assembly
2920
Triconex General Purpose Systems User

Documentation (hardcopy)
8910-6S2
Accessories Kit
8401
Top End Cap I/O
2910
Top End Cap MP
2912
Bottom End Cap I/O
2911
Bottom End Cap MP
2913
I/O Extender Module
3000678-100
2-ft. I/O Bus Cables
4000212-002
I/O Interconnect Assembly
2921
Top End Cap I/O
2910
Bottom End Cap I/O
2911
I/O Extender Module
3000678-100
2921
I/O Bus Terminator Kit (Set of 3)
3900064-003
I/O Extender Module
3000678-100
2920
I/O Bus Terminator Kit (Set of 3)
3900064-003
I/O Baseplate
3000673-030
2921
Slot Cover
2900
Terminal Cover
2901
30
Chapter 2
Table 1
System Description
Model
Product Name
Qty
Description
Consists of
2302S2
Digital Input Baseplate Kit,

High Voltage
I/O External Termination Baseplate
3000721-310
External Termination Panel (Solid State Relay

Input)
3000762-110
2921
Slot Cover
2900
Interface Cable, 10 ft
9105-310F
SSR Input Modules for use with SSR Input ETP

100 to 240 VAC (ordered separately)
2302AS2
2342S2
2342AS2
2351S2
2352S2
2352AS2
2354S2
2354AS2
1300447-001
3000989-315
External Termination Panel Kit
9573-610F
2921
Slot Cover
2900
Terminal Cover
2901

Baseplate Kit, External
Termination
3000721-140
2921
Slot Cover
2900

Baseplate Kit, Hazardous
Location
3000989-145
2921
Slot Cover
2900
AI/DI ETP Kit, Hazardous Location
9793-610F
Digital Input Baseplate Kit,

Hazardous Location
I/O Baseplate
3000675-030
2921
Slot Cover
2900
Terminal Cover
2901
Analog Input Baseplate Kit for

TC, RTD, and 4-20mA (requires
2 of part number 9764-510F)
3000721-110
2921
Slot Cover
2900
Analog Input Baseplate Kit,

Hazardous Location
3000989-115
9792-310F
2921
Slot Cover
2900
I/O HART Baseplate
3000851-020
2920
Slot Cover
2900
Terminal Cover
2901
I/O HART Baseplate
3000851-120
2920
Slot Cover
2900
Terminal Cover
2901
Analog Input Baseplate Kit

HART

HART, Hazardous Location
Overview
Table 1
31
Model
Product Name
Qty
Description
Consists of
2361S2

Baseplate Kit
I/O Baseplate
3000675-040
2921
Slot Cover
2900
Terminal Cover
2901
2381S2
2381AS2
2401S2
2401HS2
2401LS2
2402S2
Pulse Input Baseplate Kit
Pulse Input Baseplate Kit,

Hazardous Location
Digital Output Baseplate Kit
Digital Output Baseplate Kit,

High Current

Low Current

High Voltage
I/O Baseplate
3000719-110
2921
Slot Cover
2900
Terminal Cover
2901
I/O Hazardous Location Baseplate
3000719-210
2921
Slot Cover
2900
Terminal Cover
2901
I/O Baseplate
3000674-040
2921
Slot Cover
2900
Terminal Cover
2901
I/O Baseplate
3000975-040
2921
Slot Cover
2900
Terminal Cover
2901
I/O Baseplate
3000715-040
2921
Slot Cover
2900
Terminal Cover
2901
I/O Baseplate
3000764-310
External Termination Panel (Relay Output ETP)
3000763-110
2921
Slot Cover
2900
9106-310F
Relay Output Modules for use with Relay

Output ETP (ordered separately)
2402AS2

Hazardous Location
SSR, 2 A at 75 to 264 VAC
1300462-001
SSR, 2 A at 4 to 60 VDC
1300471-001
SSR, 1.5 A at 40 to 200 VDC
1300472-001
Power (Dry Contact) Relay; 440 VAC max, 125

VDC max
1300463-001
3000764-310
9671-610
2921
Slot Cover
2900
32
Chapter 2
Table 1
System Description
Model
Product Name
Qty
Description
Consists of
2451S2
Solid-State Relay Output

Baseplate Kit
I/O Baseplate
3000676-320
2921
Slot Cover
2900
Terminal Cover
2901
3000764-510
9863-610F
2921
Slot Cover
2900
2480AS2
2481S2
2483S2
2483AS2
8401
9573-610F
9671-610F
Analog Output Baseplate Kit,

Hazardous Location
I/O Baseplate
3000674-020
2921
Slot Cover
2900
Terminal Cover
2901
I/O HART Baseplate
3000852-030
2920
Slot Cover
2900
Terminal Cover
2901
I/O HART Baseplate
3000852-130
2920
Slot Cover
2900
Terminal Cover
2901
MTL4546 Intrinsic Safety BarrierIsolator
1600107-001
Set of Spare Fuses
Set of Address Plugs (1 through 10)
3000698-010
3000698-020
3000698-030
3000698-040
3000698-050
3000698-060
Digital Input Termination Panel

Kit, Hazardous Location
(for use with Model 2302AS2)
External Termination Panel, DI
3000771-880
Interface Cable, 10 ft, DI
4000195-310
Digital Output Termination

Panel Kit, Hazardous Location
External Termination Panel, DO
3000769-390
Interface Cable, 10 ft, DO
4000196-310
Analog Output Baseplate Kit

HART

HART, Hazardous Location
Trident/Tri-GP Accessory Kit
Overview
Table 1
33
Model
Product Name
Qty
Description
Consists of
9764-510F
RTD/TC/AI Termination Panel

Kit (for use with Model 2352S2)
External Termination Panel, RTD/TC/AI
3000712-100
4000189-510
Signal Conditioning Modules for use with 9764510F (ordered separately)

1600048-220
420 mA
320 F to 3920 F (00 C to 2000C), RTD
1600048-030
320 F
1600048-040
(00C
to
6000C),
RTD
320 F to 14000 F (00C to 7600C), Type J TC
1600048-110
320 F
1600048-120
320 F
9792-310F
to
11120 F
to
23720 F
to
7520 F
(00C
(00C
to
to
13000C),
4000C),
Type K TC
Type T TC
1600048-130
320 F to 16520 F (00C to 9000C), Type E TC
1600048-140
Shorting Plug
1600048-300
Analog Input Termination Panel

Kit, Hazardous Location
External Termination Panel, AI
3000771-710
Interface Cable, 10 ft, AI
4000197-510

Termination Panels Kit,
Hazardous Location
External Termination Panel, AI
3000771-710
External Termination Panel, DI
3000771-880
Interface Cable, 10 ft, AI
4000197-510
Interface Cable, 10 ft, DI
4000195-310
Analog Output Termination

Panel Kit, Hazardous Location
External Termination Panel, AO
3000770-960
Interface Cable, 10 ft, AO
4000198-510
Triconex 4850
Triconex 4850 HART

Multiplexer
1600106-001
7254-13S2
TriStation 1131 Developers

Workbench version 4.8.0 for
Tri-GP
CD containing:
3000755-829
9793-610F
9863-610F
7255-13S2
8910-5S2
8747-11
TriStation 1131 Developers

Workbench version 4.8.0 with
CEMPLE for Tri-GP
Developers Workbench (software)

TriStation 1131 Help Documentation (online)
1
TriStation 1131 v4.8.0 Documentation Set
3000760-930
CD containing:
3000755-828
Developers Workbench (software)

TriStation 1131 Help Documentation (online)
1
TriStation 1131 v4.8.0 Documentation Set
3000760-930
Triconex General Purpose

Systems User Documentation
(hardcopy)
Planning and Installation Guide for Triconex

General Purpose v2 Systems
9700122-003
Communication Guide for Triconex General

Purpose v2 Systems
9700123-002
TriStation 1131 version 4.8.0

User Documentation (hardcopy)
TriStation 1131 Developers Guide
9700100-011
TriStation 1131 Libraries Reference
9700098-010
Safety Considerations Guide for Trident v2
9700112-005
Safety Considerations Guide for Tri-GP v2
9700124-003
Safety Considerations Guide for Trident v1
9700096-002
Safety Considerations Guide for Tricon
9700097-009
34
Chapter 2
Table 1
System Description
Model
Product Name
Qty
Description
Consists of
7523-4
Triconex DDE Server 4.3.0
CD containing DDE Server software and

documentation
3000723-303
DDE Server, v4.3.0 Documentation Set

(hardcopy)
9700108-004
CD containing SOE Recorder and

documentation
3000708-430
SOE Recorder, v4.3.0 Documentation Set

(hardcopy)
9700081-008
CD containing Enhanced Diagnostic Monitor,

v2.5.0 (software)
3000796-009
Enhanced Diagnostic Monitor, v2.5.0

Documentation Set (hardcopy)
9700107-009
CD containing documentation in PDF format
7521-6
7260-7
Contact
Invensys for
current model
number
SOE Recorder version 4.3.0
Enhanced Diagnostic Monitor,

v2.5.0
Triconex Documentation Set
35

These Main Processor components are available with Tri-GP v2.x systems.
Model
Description
3101S2
Main Processor Module, Tri-GP
2101S2
Main Processor Baseplate, Tri-GP
Each of the three Main Processor Modules control a separate channel and operate in parallel
with the other two modules. They communicate with each other by using TriBus, which is a
high-speed, fault-tolerant bus. A dedicated I/O control processor on each Main Processor
manages the data exchanged between the Main Processor and the I/O modules. The I/O Bus
operates at 2 megabits per second.
Program Processor
I/O Processor
Dual 24 V
Power Inputs
Redundant
Alarm
Relays
Alarm 1
Alarm 2
System
Alarm
Debug (RJ-12)
Dual-Power
Regulators
+3.3 V
+5 V
3.6 V
Battery
and Monitor
Program
Alarm
Debug (RJ-12)
I/O Bus
Modbus (DB-9)
Clock/NVRAM
8 KB
MPC860A
Reserved (DB-9)
Ethernet
Network (RJ-45)
Shared
Memory
128 K
36-Bit Bus
Flash
6 MB
Tribus
(to other MPS)
Figure 6
TriBus
FPGA
MPC860A
DRAM
16 MB
Up Stream
Down Stream
Up Stream
Down Stream
Diagnostic Bus
Channels
(to other MPs)
36-Bit Bus
DRAM
16 MB
Main Processor Architecture
Each Main Processor includes 16 megabytes of DRAM for the control program, sequence-ofevents (SOE) and I/O data, diagnostics, and communication buffers. The control program is
stored in flash EPROM and loaded in DRAM for execution. The MP Modules receive power
from redundant 24 VDC power sources. In the event of an external power failure, all critical
retentive data is stored in NVRAM (Non-Volatile Random Access Memory).
36
Chapter 2
System Description
MP Module Specifications
This section includes specifications for the MP Modules, including:
Control Program Processor on page 36
Input/Output Processor on page 37
Logic Power on page 37
Control Program Processor

This table lists the specifications for the Control Program Processor on the MP Modules.
Table 2
Control Program Processor Specifications
Feature
Specification
SX Processor
Motorola MPC860, 32-bit, 50 MHz
Flash PROM
6 MB used for SX, IOX, and control application storage

CRC-protected
DRAM
16 MB used for SX control application execution and program and

SOE data
Byte parity
NVRAM
8 KB, used for retentive variables

CRC-protected
Clock calendar
Accuracy during power on
1 sec/day typical
2.2 sec/day maximum
Accuracy during power off,

with battery backed up
2.2 sec/day typical

9.2 sec/day maximum
Battery
AA lithium, 15-year predicted life
TriBus
25 megabits per second

CRC-protected
32-bit + parity DMA
TriStation 1131 port
1 10BaseT Ethernet connector

RJ-45 shielded connector on baseplate
Modbus port
1 RS-232/485 DTE
DB-9-pin shielded connector on baseplate
Debug port
Used to access diagnostic information

RJ-12 connector located on baseplate, shared with IOX debug port
Communication bus
RS-485 2 megabits per second HDLC
Alarm contacts
Redundant, normally closed
WARNING
37
There is a danger of explosion if the battery on MP Modules is replaced

incorrectly. To ensure a safe battery replacement, you must return MP
Modules to Invensys for servicing.
Input/Output Processor
This table lists the specifications for the Input/Output Processor on the MP Modules.
Table 3
Input/Output Processor Specifications
Feature
Specification
IOX Processor
Motorola MPC860, 32-bit, 50 MHz
DRAM
16 MB, used for IOX execution; byte parity
Shared Memory
128 KB, used to communicate with SX; byte parity
Diagnostic Bus
2 megabits per second HDLC, used to communicate I/O module diagnostic

information between MP channels
Debug Port
Used to access diagnostic information

RJ-12 connector located on baseplate, shared with SX debug port
I/O Bus
RS-485 2 megabits per second HDLC
Logic Power
This table lists the specifications for the logic power on the MP Modules.
Table 4
Logic Power Specifications for MP Modules
Feature
Specification
Nominal input voltage
24 VDC
Operational voltage range
24 VDC 15% to +20% + 5% AC ripple (+19.2 to +30 VDC)
Logic power
8 W maximum
Absolute maximum input voltage
33 VDC
Absolute maximum reverse input

voltage
0.6 VDC
Input power interruption time from

nominal
1 ms minimum
Repetition rate
1 sec maximum
Reverse current isolation input to input
500 A maximum
In-rush current per input
2.4 A maximum, 1.2 A for 50 ms, typical
Short circuit current limit per input
2.4 A maximum
Functional-earth-to-logic-ground
isolation
0 V, no isolation
38
Chapter 2
System Description
Table 4
Logic Power Specifications for MP Modules (continued)
Feature
Specification
Protective-to-functional-earth isolation
500 VDC
MP Baseplate
This figure depicts a front view of the model 2101S2 Main Processor Baseplate, which includes
connections for alarm contacts and logic power and communication ports. For details, see
Baseplate Connections and Ports on page 39.
Figure 7
Model 2101S2 MP Baseplate
39
Baseplate Connections and Ports

This figure depicts the connections for alarm contacts, logic power, and communication ports
on the MP Baseplate. For specifications, see:
Alarm Connections on page 40
Communication Ports on page 41
Logic Power Connections on page 42
Logic Power 1 Fuse

Logic Power 2 Fuse
Logic Power 1
DSP1
Logic Power 1 Blown Fuse Indicator
Logic Return 1
DSP2
Logic Power 2 Blown Fuse Indicator
Logic Power 2
Logic Return 2
+
DSP3
FUSE
DSP4
Safety
FUSE
Alarm 1
Alarm 1 Blown Fuse Indicator

Alarm 1 Fuse
Alarm 2 Blown Fuse Indicator
Alarm 2 Fuse
Alarm 2
Left Serial Port
Middle Serial Port
Right Serial Port
Left TriStation Port
Left Debug Port
Middle TriStation Port
Middle Debug Port

Right Debug Port
Right TriStation Port
Figure 8
Node Address
MP Baseplate Connectors and Ports
40
Chapter 2
System Description
Alarm Connections
Alarms are asserted when the controller detects either a system alarm or a program alarm. Each
MP contains a set of redundant alarm solid-state relays. The relays are normally closed and are
connected in series between MP Modules.
A system alarm indicates a fault in the controller, its power supplies, or field input.
A program alarm indicates a problem detected by the control program.
MP Baseplate
MP A
MP B
MP C
Alarm 1/NC
Alarm 1/C
Alarm 2/NC
Alarm 2/C
This table lists the alarm contacts on the MP Baseplate.

Table 5
Alarm Contact Specifications for MP Baseplates
Feature
Specification
Alarm contacts
2, redundant pair, isolated
Rated voltage
24 VAC/VDC
030 VDC
Maximum switch voltage
33 V
Maximum switching power
15 W resistive
Maximum off-state leakage
<50 A
Maximum nominal current
0.5 A per contact, continuous

0.7 A per contact for 100 ms
Voltage drop @ baseplate
<0.25 VDC @ 0.5 A
Fuses, mounted on baseplate
1 per contact, 1 A fast-acting
Blown-fuse indicator
On baseplate
Contact-to-protective-earth isolation
500 VDC, minimum
Contact-to-functional-earth (logic) isolation
800 VDC, minimum
41
Communication Ports
Ports on the MP Baseplate enable the Tri-GP controller to communicate with a PC running
TriStation 1131 software and with other external devices by means of Modbus and Ethernet
protocol.
Ports include:
One Ethernet (IEEE 802.3) TriStation 1131 port for downloading the control program to
the Tri-GP controller and uploading diagnostic information. This port can also be used
to download Tri-GP firmware to the Flash ROM.
One Modbus RS-232 or RS-485 serial port which acts as a Modbus slave while an
external device is the master.
Debug ports used for Technical Support.
Feature
Specification
Connector
DB-9-pin DTE standard, shielded, located on baseplate
RS-232 maximum cable length
50 ft (15 m)
4,000 ft (1.2 km)
Supported transmission rates (bps)
1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K
Protocols
Slave, RTU mode, optional parity, 1 stop bit
Galvanic isolation
500 VDC
Feature
Specification
10BaseT connector
RJ-45 standard, shielded, located on baseplate
10BaseT maximum cable length
330 ft (100 m) using category 5 twisted-pair cable
Protocol
TriStation 1131
Network address
Derived from baseplate address plug; range is 1 to 63
Galvanic isolation
500 VDC
Feature
Specification
Connector
RJ-12, Triconex proprietary pin-out
Maximum cable length
25 ft (8 m)
Protocol
RS-232, 9600 bps, ASCII, asynchronous
Galvanic isolation
500 VDC
42
Chapter 2
System Description
Logic Power Connections

The MP Baseplate provides redundant, fused logic power connectors for the MP and I/O
modules, which are directly connected to the MP Baseplate.
Feature
Specification
Logic power
125 W, maximum
Fuse
8 A, slow-acting
Blown fuse indicator
20 mA
43
These communication components are available with Tri-GP v2.x systems.
Model
Description
Type
3201S2
Single or redundant Configuration, non-TMR
2201S2
Communication Baseplate
This section describes the features and specifications for the Communication Module and
Communication Baseplate compatible with Tri-GP v2.x and later systems.
The Communication Module (CM) is an optional, three-to-one interface to the Main Processors.
Using a variety of communication methods, protocols, and physical media types, the CM
enables communication with external computers, distributed control systems (DCS), Ethernet
(open) networks, other Tri-GP, Trident, and Tricon v9v10 systems, and network printers.
A single Tri-GP controller supports up to two CMs on one CM Baseplate. Each CM operates
independently and supports three RS-232/485 serial ports and two Ethernet ports. Two CMs
can provide redundant communication connections or additional independent communication
ports.
Logic Power Specifications

This table lists specifications for logic power, which is supplied by the MP Baseplate.
Table 6
Logic Power Specifications for CM
Feature
Specification
24 VDC
Specified operational voltage range
24 VDC 15% or +20% + 5% AC ripple (19.2 to 30 VDC)
Logic power (without MAUs)
8 W maximum
10 Mb AUI-type MAU
6 W maximum additional per MAU
100 Mb MII-type MAU
3.75 W maximum additional per MAU
33 VDC
Absolute maximum reverse input voltage
0.6 VDC

nominal value
1 ms maximum
Repetition rate
1 sec minimum
500 A maximum
Inrush current per input
2.4 A maximum, typically 1.2 A for 50 ms
2.4 A maximum
Functional-to-logic ground isolation
0 V, no isolation
500 VDC
44
Chapter 2
System Description
Table 6
Logic Power Specifications for CM (continued)
Feature
Specification
+12 V AUI output power
12 V 10%, 6 W maximum, current limited
+5 V MII output power
5 V 5%, 3.75 W maximum, current limited
CM Baseplate
This figure depicts the Communication Module Baseplate, which includes three serial ports,
two Ethernet ports, and two multi-station access unit (MAU) ports. For details, see
Communication Ports on page 45.
Figure 9
Model 2201S2 CM Baseplate
45
Communication Ports
This figure depicts the ports on the CM Baseplate. For specifications, see:
CM Serial Port Specifications on page 46
CM Ethernet Port Specifications on page 46
Left Module
Serial 3
Serial 2
Serial 1
Right Module
Serial 3
Serial 2
Serial 1
Net 1 Left Module
AUI MAU
Net 1 Right Module
AUI MAU
Net 1 Left Module
10BaseT
Net 1 Right Module
10BaseT
Net 2 Left Module

10BaseT/100BaseTX
Net 2 Right Module
10BaseT/100BaseTX
Net 2 Right Module

MII MAU
Net 2 Left Module
MII MAU
Debug
Figure 10
Communication Module Port Connectors
46
Chapter 2
System Description
Table 7
CM Serial Port Specifications
Feature
Specification
Serial (Modbus) ports
3 optically isolated RS-232/485 ports, configurable from

TriStation 1131 software
Connector
DB-9-pin DTE standard, shielded, located on baseplate
50 ft (15 m)
4,000 ft (1.2 km)
Supported transmission rates (bps)
1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K
Protocols
TriStation 1131, Modbus Slave (ASCII or RTU), Modbus

Master (RTU)
Serial port Galvanic isolation
500 VDC
Table 8
CM Ethernet Port Specifications
Feature
Specification
10BaseT network port
Ethernet 10 megabits per second, protocol-configurable from

10BaseT connector
10BaseT maximum cable length
100 m, using Category 5 twisted-pair cable
10 Mb AUI-type MAU port
Supports AUI MAU located on baseplate

Disables 10BaseT RJ-45 connector
100BaseTX Ethernet port
100 or 10 megabits per second, speed auto-selected, configurable

from TriStation 1131 software
100BaseTX connector
100BaseTX maximum cable length
30 m, using Category 5 twisted-pair cable
100 Mb MII-type MAU port
Supports MII MAU located on baseplate

Disables 100BaseTX RJ-45 connector
Protocols
TriStation 1131
TSAA (UDP/IP)
TSAA with IP Multicast (UDP/IP)
Peer-to-Peer (UDP/IP)
Peer-to-Peer (DLC)
Modbus Master or Slave (TCP)
Triconex Time Synchronization via DLC
Triconex Time Synchronization via UDP/IP
SNTP Triconex Time Synchronization
Network Printing using JetDirect
Network address
Derived from MP Baseplate address plug
Galvanic isolation
500 VDC
47

This section includes specifications that are common to all I/O modules. For specifications, see:
Wiring Terminals on page 47
Logic Power on page 47
Field Power on page 48
Wiring Terminals
This table lists the wiring specifications for I/O modules.
Table 9
Wiring Specifications for I/O Modules
Feature
Specification
Compression terminals
Compatible with 24 to 12 (0.2 mm2 to 3.3 mm2) AWG wiring
Logic Power
This table lists the logic power specifications for I/O modules.
Table 10
Logic Power Specifications for I/O Modules
Feature
Specification
24 VDC
Voltage range
24 VDC 15% or +20% + 5% AC ripple (19.2 to 30 VDC)
Logic power
<3 W
33 VDC
0.6 VDC

nominal
1 ms maximum
Power interruption interval
1 sec minimum
500 A maximum
Inrush current per input
2.4 A maximum
2.4 A maximum
Functional-earth-to-logic-ground
isolation
0 V, no isolation
500 VDC, minimum
48
Chapter 2
System Description
Field Power
This table lists the field power specifications for I/O modules.
Table 11
Field Power Specifications for I/O Modules
Feature
Specification
Nominal field voltage
24 VDC
24 VDC 15% or +20% + 5% AC ripple

(19.2 to 30 VDC)
(For PI Modules, voltage ranges are configurable in
TriStation 1131 software.)
Power
See module specifications
33 VDC
0.6 VDC

nominal
Not applicable
Power interruption interval
Not applicable
Reverse current isolation
500 A maximum
Functional- to-protective-earth isolation
500 VDC, minimum
Functional-to-functional-earth (logic)
isolation
800 VDC, minimum
Analog Input Components 49
Analog Input Components

These analog input components are available for Tri-GP v2.x systems.
For installation procedures, see Component Installation on page 185.
Model
Description
Current
Type
3351S2
Analog Input Module
420 mA
Commoned
2351S2
Analog Input Baseplate
Direct Termination
n/a
Analog Input External Termination

Baseplate
External Termination
9764-510F
RTD/TC/AI External Termination

Panel
9792-310F
Analog Input Hazardous Location

External Termination Panel
2354S2
Analog Input HART Baseplate
Direct Termination
2354AS2
Analog Input HART Hazardous

Location Baseplate
Direct Termination
Note
When ordering the 9764-510F ETP or the 9792-310F ETP, you can order longer interface
cables, in increments of 10 feet, by changing the last two digits of the ETP model number
from 10 to the desired length of the cable. The maximum length for interface cables is
normally 100 feet. Contact the Invensys Global Customer Support (GCS) center if you
require cables longer than 100 feet.
The Analog Input (AI) Module has three isolated sets of electronics, called channels, which
independently process field data input to the module. Sensing of each input point is performed
in a manner that prevents a single failure on one channel from affecting another channel. Each
channel receives variable voltage signals from each point, converts them to digital values, and
transmits the values to the three MPs on demand. The MPs vote the data before passing it to the
control program. In TMR mode, the data passed is mid-value. In DUAL mode, the data passed
is the average.
AI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a
failure on any channel, the Fault indicator turns on and activates the system alarm. The Fault
indicator identifies a channel fault, not a complete module failure. AI Modules are guaranteed
to operate properly in the presence of a single fault and may continue to operate properly with
multiple faults.
AI Modules include the hot-spare feature which allows online replacement of a faulty module.
The AI Module is mechanically keyed to prevent improper installation in a configured
baseplate.
50
Chapter 2
System Description
AI Module 3351S2
This figure is a simplified schematic of the Model 3351S2 AI Module.
Analog Input Module Typical Point (1 of 32)
ADC
Triplicated
I/O Bus
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Isolation
Filtering
Individual Point
Field Terminations
DAC
ADC
DAC
ADC
DAC
Figure 11
3351S2 AI Module Simplified Schematic
This table lists the specifications for the Model 3351S2 AI Module.
Table 12
3351S2 AI Module Specifications
Feature
Specification
Points
32, commoned
Nominal input current
420 mA DC
Operational current range
221.2 mA DC
Absolute maximum field voltage
33 VDC
Recommended HART baseplate field voltage
28 VDC
Absolute maximum reverse field voltage
0.6 VDC
Absolute maximum input current
50 mA DC
Input bandwidth (3dB)
16 Hz
Source impedance
180
Input impedance (with baseplate)
250
I to V resistor
100 , 0.01%
Resolution
12 bits
Absolute error
0.15% of full scale (20 mA)
Diagnostic
Force-to-value diagnostic (FVD)
Scan time
<1 ms for all 32 points
Functional-to-protective-earth isolation (ATEX)
500 VDC, minimum (0 VDC)
Functional-to-functional-earth (logic) isolation
800 VDC, minimum
Input impedance (with HART baseplate)
350 , nominal (300400 )
Source impedance (with HART baseplate)
250 , nominal (200300 )
52
Chapter 2
System Description
AI Baseplate
The Model 2351S2 AI Baseplate is
typically used with 420 mA control
programs. The short circuit current
specifications for field short-to-ground
faults are:
130 mA, typical
200 mA, maximum
This figure is a simplified schematic of the Model 3351S2 AI Module and Model 2351S2 AI
Baseplate.
AI Baseplate
32-Point AI Module
Mux
1
Field Power (PS1) +

Field Power (PS2) +
32
To
Spare
180 7
+
In
150 7
Mux
1
100 7
.01%
32
Mux
Field Power (PS1)

Field Power (PS2)
To
Other
Points
1
32
Figure 12
3351S2 AI Module and 2351S2 AI Baseplate Schematic
Typical Field Connections

This figure depicts typical field connections for the Model 2351S2 AI Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
Typical Point
(1 of 32 Points Shown)
~
~~
~
~
~~
~
4-20 mA
Transmitter
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
32
~ ~~ ~ ~
Figure 13
2351S2 AI Baseplate Typical Field Connections
54
Chapter 2
System Description
AI External Termination Baseplate

The AI External Termination Baseplate is
typically used with the Model 9764-510F
RTD/TC/AI External Termination Panel
or the Model 9792-310F AI Hazardous
Location External Termination Panel.
This baseplate contains ELCO
connectors, which allows connection of
External Termination Panels.
This figure is a simplified schematic of the Model 3351S2 AI Module and the AI External
Termination Baseplate.
AI Baseplate
32-Point AI Module
Mux
1
Field Power (PS1) +

Field Power (PS2) +
32
To
Spare
Mux
1
From External
Termination Panels
Field Power (PS1)

Field Power (PS2)
Figure 14
32
Mux
V + To
External
Termination
Panels
1
32
3351S2 AI Module and AI External Termination Baseplate Schematic

This figure depicts typical field connections for the AI External Termination Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
S
F
~ ~~ ~ ~
Figure 15
AI External Termination Baseplate Typical Field Connections
56
Chapter 2
System Description
RTD/TC/AI External Termination Panel

The Model 9764-510F RTD/TC/AI External Termination Panel (ETP) includes industrystandard signal-conditioning modules which can be cabled to the Analog Input External
Termination Baseplate. The input-signal conditioners are manufactured by Analog Devices.
The RTD/TC/AI ETP supports 16 points and each AI Module can support up to two ETPs.
The Model 9764-510F RTD/TC/AI ETP has a barrier strip with four compression screw
terminals for connecting an AI Module to 16 analog inputs. The panel accepts power (+24 VDC)
from the AI Baseplate or from a direct connection to the panel. Each 24 volt power source must
be able to provide 0.5 amps minimally. Model 9764-510F RTD/TC/AI ETP includes a 10-foot
cable and mounting plate.
You must use two 16-point term panels for each 32-point AI module. Each term panel comes
with two sets of labels: 1-16 and 17-32. For information on how to apply the labels, see
Appendix F, Panel Labels.
AI
(420 mA)
16
16
13
12
14
15
14
15
13
12
R16
11
11
10
10
9
U16
R15
3
4
3
4
14
15
13
16
16
14
15
13
12
11
12
11
10
10
9
3
4
2
1
14
15
16
16
13
12
11
14
15
13
12
10
3
4
11
10
3
4
16
16
13
12
11
14
15
14
15
13
12
11
10
3
4
10
9
3
4
ISOLATED
RTD INPUT
ANALOG
DEVICES
ISOLATED
RTD INPUT
U15
R14
7B34
ANALOG
DEVICES
U14
R13
7B34
ISOLATED
RTD INPUT
U13
ANALOG
DEVICES
ISOLATED
RTD INPUT
U12
R12
7B34
ANALOG
DEVICES
ISOLATED
RTD INPUT
J5
7B34
ANALOG
DEVICES
R11
7B34
ISOLATED
RTD INPUT
U11
R10
J4
J3
ANALOG
DEVICES
ISOLATED
RTD INPUT
U10
R9
7B34
ANALOG
DEVICES
ISOLATED
RTD INPUT
U9
R8
SN
7B34
ANALOG
DEVICES
U8
R7
7B34
ISOLATED
PROCESS
ANALOG
DEVICES CURRENT INPUT
U7
R6
7B32
U6
R5
ISOLATED
PROCESS
ANALOG
ISOLATED
PROCESS
ANALOG
SHORTING
PLUG
U5
R4
7B32
7B32
ANALOG
DEVICES
ISOLATED
TC INPUT
U4
R3
7BDS
ANALOG
DEVICES
ISOLATED
TC INPUT
U3
R2
7B47
ANALOG
DEVICES
ISOLATED
TC INPUT
U2
7B47
ANALOG
DEVICES
ISOLATED
TC INPUT
U1
R1
J2
7B47
ANALOG
DEVICES
7B47
REV E
7400225-
3
4
TRICONEX 7B 16 MODULE BASEPLATE
J1
RTD
TC
J6
**
* A signal conditioning module or shorting plug 1600048-300 must be installed on all points.
** Unused points must be shorted at the +, , and x terminals. The diagram shows a typical unused point.
Figure 16
9764-510F RTD/TC/AI External Termination Panel
9764-510F RTD/TC/AI ETP Dimensions

Width (across DIN rail)
Length (along DIN rail)
Height (out from DIN rail)
5.22 in (13.26 cm)
19.00 in (48.26 cm)
3.24 in (8.23 cm)
This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 9764-510F
RTD/TC/AI ETP.
RTD/TC/AI Panel
Baseplate
32-Point AI Module
Mux
V+
To
Spare
V+A
32
V+B
V+
Mux
1
Com
32
Mux
7BXX
Typical Signal
Conditioner
32
y
rfu
CJ
Figure 17
3351S2 AI Module and 9764-510F RTD/TC/AI ETP Schematic
58
Chapter 2
System Description

These figures show typical field connections using the Model 9764-510F RTD/TC/AI ETP,
which can be used with the Model 3351S2 AI Module and the AI External Termination Baseplate
(these components are supplied together as the Model 5352S2 TriPak).
16
16
13
12
14
15
14
15
13
11
12
11
10
R12
10
U12
R11
3
4
3
4
ISOLATED
RTD INPUT
ANALOG
DEVICES
ISOLATED
RTD INPUT
U11
R10
7B34
ANALOG
DEVICES
ISOLATED
RTD INPUT
ISOLATED
RTD INPUT
U10
R9
7B34
ANALOG
DEVICES
7B34
ANALOG
DEVICES
7B34
U9
J5
Shield
Point #12 Typical, see 9764-510F RTD/TC/AI ETP PinOuts on page 60 for other points
9764-510F RTD/TC/AI ETP Typical RTD Field Connection
16
14
15
14
15
13
13
11
12
R4
12
11
10
9
J3
10
9
8
8
7
U4
R3
3
4
3
4
2
ISOLATED
TC INPUT
ANALOG
DEVICES
ISOLATED
TC INPUT
ISOLATED
TC INPUT
U3
R2
7B47
ANALOG
DEVICES
ISOLATED
TC INPUT
U2
R1
7B47
ANALOG
DEVICES
7B47
ANALOG
DEVICES
7B47
U1
16
Figure 18
Shield
* Install jumper
Point #4 Typical, see 9764-510F RTD/TC/AI ETP
Pin-Outs on page 60 for other points
Figure 19
9764-510F RTD/TC/AI ETP Typical TC Field Connection
16
16
13
14
15
14
15
11
13
12
R8
12
11
10
10
9
U8
R7
3
4
3
4
ISOLATED
PROCESS
ANALOG
U7
R6
7B32
U6
R5
ISOLATED
PROCESS
ANALOG
7B32
ISOLATED
PROCESS
ANALOG
7B32
ISOLATED
PROCESS
ANALOG
7B32
U5
J4
+
Field
Transmitter
Point #6 Typical, see 9764-510F RTD/TC/AI ETP

Pin-Outs on page 60 for other points
Figure 20
9764-510F RTD/TC/AI ETP Typical AI Field Connection
J2
+24V Power Supplies
Figure 21
9764-510F RTD/TC/AI ETP Typical Power Connections
60
Chapter 2
System Description
Pin-Out Information
This table lists pin-out information for the Model 9764-510F RTD/TC/AI ETP.
Table 13
Point
Point 1
Point 2
Point 3
9764-510F RTD/TC/AI ETP Pin-Outs

Connector
Pin #
TC
RTD
AI
J3A (upper)
NCa
NC
NC
J3B (lower)
Jump
NC
NC
J3A (upper)
NC
Xb
NC
J3B (lower)
Jump
NC
NC
J3A (upper)
and SHc
J3B (lower)
NC
NC
NC
J3A (upper)
+ and SH
J3B (lower)
NC
NC
NC
J3A (upper)
NC
NC
NC
J3B (lower)
Jump
NC
NC
J3A (upper)
NC
NC
J3B (lower)
Jump
NC
NC
J3A (upper)
and SH
J3B (lower)
NC
NC
NC
J3A (upper)
+ and SH
J3B (lower)
NC
NC
NC
J3A (upper)
NC
NC
NC
J3B (lower)
Jump
NC
NC
J3A (upper)
10
NC
NC
J3B (lower)
10
Jump
NC
NC
J3A (upper)
11
and SH
J3B (lower)
11
NC
NC
NC
J3A (upper)
12
+ and SH
J3B (lower)
12
NC
NC
NC
Table 13
Point
Point 4
Point 5
Point 6
Point 7
9764-510F RTD/TC/AI ETP Pin-Outs (continued)

Connector
Pin #
TC
RTD
AI
J3A (upper)
13
NC
NC
NC
J3B (lower)
13
Jump
NC
NC
J3A (upper)
14
NC
NC
J3B (lower)
14
Jump
NC
NC
J3A (upper)
15
and SH
J3B (lower)
15
NC
NC
NC
J3A (upper)
16
+ and SH
J3B (lower)
16
NC
NC
NC
J4A (upper)
NC
NC
NC
J4B (lower)
Jump
NC
NC
J4A (upper)
NC
NC
J4B (lower)
Jump
NC
NC
J4A (upper)
and SH
J4B (lower)
NC
NC
NC
J4A (upper)
+ and SH
J4B (lower)
NC
NC
NC
J4A (upper)
NC
NC
NC
J4B (lower)
Jump
NC
NC
J4A (upper)
NC
NC
J4B (lower)
Jump
NC
NC
J4A (upper)
and SH
J4B (lower)
NC
NC
NC
J4A (upper)
+ and SH
J4B (lower)
NC
NC
NC
J4A (upper)
NC
NC
NC
J4B (lower)
Jump
NC
NC
J4A (upper)
10
NC
NC
J4B (lower)
10
Jump
NC
NC
J4A (upper)
11
and SH
J4B (lower)
11
NC
NC
NC
J4A (upper)
12
+ and SH
J4B (lower)
12
NC
NC
NC
62
Chapter 2
System Description
Table 13
Point
Point 8
Point 9
Point 10
Point 11

Connector
Pin #
TC
RTD
AI
J4A (upper)
13
NC
NC
NC
J4B (lower)
13
Jump
NC
NC
J4A (upper)
14
NC
NC
J4B (lower)
14
Jump
NC
NC
J4A (upper)
15
and SH
J4B (lower)
15
NC
NC
NC
J4A (upper)
16
+ and SH
J4B (lower)
16
NC
NC
NC
J5A (upper)
NC
NC
NC
J5B (lower)
Jump
NC
NC
J5A (upper)
NC
NC
J5B (lower)
Jump
NC
NC
J5A (upper)
and SH
J5B (lower)
NC
NC
NC
J5A (upper)
+ and SH
J5B (lower)
NC
NC
NC
J5A (upper)
NC
NC
NC
J5B (lower)
Jump
NC
NC
J5A (upper)
NC
NC
J5B (lower)
Jump
NC
NC
J5A (upper)
and SH
J5B (lower)
NC
NC
NC
J5A (upper)
+ and SH
J5B (lower)
NC
NC
NC
J5A (upper)
NC
NC
NC
J5B (lower)
Jump
NC
NC
J5A (upper)
10
NC
NC
J5B (lower)
10
Jump
NC
NC
J5A (upper)
11
and SH
J5B (lower)
11
NC
NC
NC
J5A (upper)
12
+ and SH
J5B (lower)
12
NC
NC
NC
Table 13
Point
Point 12
Point 13
Point 14
Point 15

Connector
Pin #
TC
RTD
AI
J5A (upper)
13
NC
NC
NC
J5B (lower)
13
Jump
NC
NC
J5A (upper)
14
NC
NC
J5B (lower)
14
Jump
NC
NC
J5A (upper)
15
and SH
J5B (lower)
15
NC
NC
NC
J5A (upper)
16
+ and SH
J5B (lower)
16
NC
NC
NC
J6A (upper)
NC
NC
NC
J6B (lower)
Jump
NC
NC
J6A (upper)
NC
NC
J6B (lower)
Jump
NC
NC
J6A (upper)
and SH
J6B (lower)
NC
NC
NC
J6A (upper)
+ and SH
J6B (lower)
NC
NC
NC
J6A (upper)
NC
NC
NC
J6B (lower)
Jump
NC
NC
J6A (upper)
NC
NC
J6B (lower)
Jump
NC
NC
J6A (upper)
and SH
J6B (lower)
NC
NC
NC
J6A (upper)
+ and SH
J6B (lower)
NC
NC
NC
J6A (upper)
NC
NC
NC
J6B (lower)
Jump
NC
NC
J6A (upper)
10
NC
NC
J6B (lower)
10
Jump
NC
NC
J6A (upper)
11
and SH
J6B (lower)
11
NC
NC
NC
J6A (upper)
12
+ and SH
J6B (lower)
12
NC
NC
NC
64
Chapter 2
System Description
Table 13
Point
Point 16

Connector
Pin #
TC
RTD
AI
J6A (upper)
13
NC
NC
NC
J6B (lower)
13
Jump
NC
NC
J6A (upper)
14
NC
NC
J6B (lower)
14
Jump
NC
NC
J6A (upper)
15
and SH
J6B (lower)
15
NC
NC
NC
J6A (upper)
16
+ and SH
J6B (lower)
16
NC
NC
NC
a. NC = No connect
b. X = Third wire (sense signal)
c. SH = Shield
Temperature and Output Ranges

This table gives the temperature and output ranges for available signal conditioning modules.
Signal conditioners must be ordered separately and are available from Invensys or directly from
Analog Devices. For more information, contact your regional customer center.
For detailed specifications, see the Analog Devices catalog, Signal Conditioning and Data
Acquisition Solutions.
Table 14
Temperature and Output Ranges for Signal Conditioning Modules
Description
Part Number
Input Range
Output Range
Non-Isolated, Process Current Input

Module
1600048-220
(7B32NI)
4 mA to 20 mA
0.4 V to 2 V
Isolated, Linearized,
RTD Input,100 Platinum, 2- or 3Wire,
= 0.00385
1600048-030
(7B34)
32 F to 392 F
(0 C to 200 C)
0.4 V to 2 V
1600048-040
(7B34)
32 F to 1112 F
(0 C to 600 C)
0.4 V to 2 V
Type J, Thermocouple Input Module
1600048-110
(7B47)
(32 F to 1400 F
(0 C to 760 C)
0.4 V to 2 V
Type K, Thermocouple Input Module
1600048-120
(7B47)
32 F to 2372 F
(0 C to 1300 C)
0.4 V to 2 V
Type T, Thermocouple Input Module
1600048-130
(7B47)
32 F to 752 F
(0 C to 400 C)
0.4 V to 2 V
Type E, Thermocouple Input Module
1600048-140
(7B47)
(32 F to 1652 F
(0 C to 900 C)
0.4 V to 2 V
Shorting Plug for unused points
1600048-300
(7BDS)
Not applicable
0.0 V
AI Hazardous Location External Termination Panel

The Model 9792-310F ETP is suitable for use in Zone 2, and Class 1, Division 2 field circuits. The
ETP contains extra circuitry designed to limit power available to the field terminals. The circuits
have been examined and certified by TV Rhineland as being nonincendive. This guarantees
that if the field wires are accidentally opened, shorted, or grounded, and the Tri-GP is operating
normally, the wiring and attached devices will not release sufficient energy to cause ignition in
the specified flammable atmosphere.
Each positive terminal is current-limited with a 200-to-300-ohm positive temperature coefficient
(PTC) resistor. Each input has a precision 100-ohm resistor for current-to-voltage conversion.
The panel supports redundant 24 VDC power sources with diode ORing. However,
recommended field power connections are on the AI External Termination Baseplate and
routed to the ETP through the interface cable with ELCO connectors. Field energy will not be
limited if it is connected to the ETP; it will be limited only if it is connected to the baseplate.
You must use two 16-point term panels for each 32-point AI module. Each term panel comes
Dimensions for Term Panel 9792-310F
4.42 in (11.23 cm)
5.02 in (12.75 cm)
4.25 in (10.795 cm)
Specifications
This table describes general specifications for 9792-310F.
Table 15
General Specifications for Term Panel 9792-310F
Feature
Description
Panel type
Hazardous location, 4-20 mA current input, 2.5 V
Points
16
66
Chapter 2
System Description
This table describes cable and load parameters for 9792-310F.

Table 16
Cable and Load Parameters for Term Panel 9792-310F
Feature
IEC
Symbol
ISA
Symbol
Description for Zone 2 Group IIB
Operating temperature range
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
19 to 28 V
Maximum voltage
Um
Um
32 V
Maximum input voltage
Ui
Vmax
9V
Maximum input current
Ii
Imax
0.090 A
Maximum input power
Pi
Pi
0.324 W
C internal, maximum
Ci
Ci
0.088 F
L internal, maximum
Li
Li
43 H
Input Connection (F) Specifications
Output Connection (F+) Specifications
Maximum output voltage
Uo
Voc
32 V
Maximum output current
Io
Isc
0.160 A
Maximum output power
Po
Po
1.347 W
C external, maximum
Co
Ca
1.18 F
L external, maximum
Lo
La
4.95 mH
Simplified Schematic
This figure is a simplified schematic of the Model 9792-310F ETP and the Model 3351S2 AI
Module with an AI External Termination Baseplate.
ELCO
CABLE
TERMINATION PANEL
BASEPLATE
32-POINT ANALOG INPUT MODULES

to
spare
Isolation/filtering
Mux
200300 Ohms
F
1
30 V
Zener
Amp
ADC
Amp
ADC
Amp
ADC
To other
points
32
PS1
Hi-Ref
Low-Ref
PS2
Mux
3.3 V
Zener
32
100 ohm
0.01%
Hi-Ref
PS1
To other
points
To AI
modules
Low-Ref
PS2
PS1
Mux
PS2
1
0 ohm
PS1
PS2
32
0 ohm
Hi-Ref
Low-Ref
Figure 22
Simplified Schematic of a 9792-310F Panel and a 3351S2 AI Module with an AI External

Termination Baseplate
68
Chapter 2
System Description

This figure illustrates how to connect a 9792-310F to the field (1 of 16 module points shown).
TRICONEX
R25
18
R
R5
R29
R4
R28
R3
R27
R2
R26
TB1
R6
R7
R31
R8
16
R32
15
24
14
23
TB4
R30
22
R
13
R
DO NOT SEPARATE
WHEN ENERGIZED
19
R
20
R
3
21
R
12
R
R4
R5
R6
R7
J1
R8
SN
R
10
11
R
R3
R2
R1
SN
TB1
7400275
0 CTA+60 C
17
REV C
7400275
EXT TERM
ATEX/EMC
R1
EXT TERM TRICON

ATEX/EMC INPUT
12 AWG,
as short as possible
TB2 TB3 TB5 TB6
J2
J2
L+
L+
J3
J3
L-
P1
P2
L-
Second term panel

if using a 32-point
module
Typical point
(1 of 16 or 32 points shown)
+
-
Field Xmtr
(4-20 mA)
Note: Field power is routed from

the baseplate through the Elco cable
to the ETP. Do not connect field power
to the ETP.
Shield Ground
Energy limited
Figure 23
Not energy limited
Field Wiring for 9792-310F with a 3351S2 AI Module
CAUTION
For more information about installing the Tri-GP in hazardous locations,

see Application-Specific Installation Guidelines on page 182.
AI HART Baseplates
The Model 2354S2 AI HART Baseplate and the
Model 2354AS2 AI HART Hazardous Location
Baseplate are used with Model 3351S2 AI
Modules.
The Triconex 4850 HART Multiplexer mounts
directly onto the Model 2354S2 and 2354AS2
baseplates (the Multiplexer is supplied in the
Model 5354S2 and 5354AS2 TriPaks).
The Model 2354AS2 AI HART Baseplate
should be used in hazardous locations.
The short circuit current specifications for field
short-to-ground faults are:
70 mA, typical
110 mA, maximum
For more information, see Appendix C, HART Communication and the Triconex 4850 HART
Multiplexer Instruction Manual.
70
Chapter 2
System Description
This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 2354 AI
HART Baseplate with the Triconex 4850 HART Multiplexer.
AI HART Baseplate
Triconex 4850
32-Point AI Module
Mux
HART
Field Power (PS1) +
Field Power (PS2) +
32
To
Spare
250 7
In +
Mux
1
250 7
In
32
100 7
.01%
Mux
Field Power (PS1)
To
Other
Points
Field Power (PS2)
Figure 24
1
32
3351S2 AI Module and 2354S2 AI HART Baseplate Schematic
This figure is a simplified schematic of the Model 3351S2 AI Module and the Model 2354AS2 AI
HART Hazardous Location Baseplate with the Triconex 4850 HART Multiplexer.
AI HART Baseplate
Triconex 4850
32-Point AI Module
Mux
HART
Field Power (PS1) +
Field Power (PS2) +
32
To
Spare
250 7
In +
30V
zener
Mux
1
In
250 7
32
100 7
.01%
Mux
Field Power (PS1)

Field Power (PS2)
Figure 25
To
Other
Points
1
32
3351S2 AI Module and 2354AS2 AI HART Hazardous Location Baseplate Schematic
PWR
GND
TDA ()
TDB (+)
This figure depicts typical field connections for the Model 2354S2 AI HART Baseplate and the
Model 2354AS2 AI HART Hazardous Location Baseplate.
RS232/RS485
Converter
24V
DC
+24 V #1
+24 V #2
24 V Return
or
*
To other HART Baseplates or
terminated with 100W resistor
Shield
Safety
SHLD
TA
TB
SHLD
TA
TB
J22
J18
J27
Typical Point
1
2
~
~~
~
3
4
5
6
7
8
PWR
FAULT
HOST
HART
~
~~
~
4-20 mA
HART
Transmitter
10
11
12
13
14
15
16
17
18
4850
TRICONEX
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J19
~ ~~ ~ ~
HART AI Baseplate
* For RS485 communication wiring, use twisted-shielded conductors run in metal conduit.
Figure 26
2354S2 and 2354AS2 AI HART Baseplate Typical Field Connections
72
Chapter 2
System Description

These Analog Input/Digital Input components are available with Tri-GP v2.x systems.
Model
Description
Current
Type
3361S2
420 mA
Commoned
2361S2
Analog Input/Digital Input Baseplate
Direct Termination
n/a

Hazardous Location External
9793-610F

Hazardous Location External
Termination Panel Kit
The Analog Input/Digital Input (AI/DI) Module has 16 digital input points (points 116) and
16 analog input points (points 1732).
The AI/DI Module has three isolated sets of electronics, called channels, which independently
process field data input to the module. Sensing of each input point is performed in a manner
that prevents a single failure on one channel from affecting another channel.
For analog input points, each channel receives variable voltage signals from each point, converts
them to digital values, and transmits the values to the three MPs on demand.
For digital input points, an ASIC on each channel scans each input point, compiles data, and
transmits it to the MPs upon demand.
For all points, the MPs vote the data before passing it to the control program. In TMR mode, the
data passed is mid-value. In DUAL mode, the data passed is the average.
AI/DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics
detect a failure on any channel, the Fault indicator turns on and activates the system alarm. The
Fault indicator identifies a channel fault, not a complete module failure. AI/DI Modules are
AI/DI Modules include the hot-spare feature which allows online replacement of a faulty
module. The AI/DI Module is mechanically keyed to prevent improper installation in a
configured baseplate.
73
AI/DI Module 3361S2

This figure is a simplified schematic of the Model 3361S2 AI/DI Module.
Analog Input/Digital Input Module Typical Point (1 of 32)
ADC
Isolation
Filtering
Triplicated
I/O Bus
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Individual Point
Field Terminations
DAC
ADC
*
DAC
ADC
*
DAC
*On DI points only

Figure 27
3361S2 AI/DI Module Simplified Schematic
74
Chapter 2
System Description
This table lists the specifications for the Model 3361S2 AI/DI Module.
Table 17
3361S2 AI/DI Module Specifications
Features Common to all Points
Specification
Points
32, commoned
Functional earth to protective earth isolation
500 VDC, minimum
Functional earth to functional earth (logic) isolation
800 VDC, minimum
Features of AI Points
Specification
Nominal input current
420 mA DC
Specified operational current range
222 mA DC
Absolute maximum field voltage
33 VDC
Absolute maximum reverse field voltage
0.6 VDC
Absolute maximum input current
50 mA DC
Input bandwidth (3dB)
16 Hz
Source impedance
180
Input impedance (with baseplate)
250
I to V resistor
100 0.01%
Resolution
12 bits
Absolute error
0.15% of full scale (20 mA)
Diagnostic
Force-to-value diagnostic (FVD)
Scan time
< 1 ms for all 32 points
Features of DI Points
Specification
024 VDC
1530 VDC
33 VDC
0.6 VDC
Input Delay
< 10 ms, On to Off, Off to On
Input impedance
> 100 k without baseplate

~ 3 k with baseplate
Input power
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
Input threshold
05 VDC = Off region

614 VDC = transition region
1530 VDC = On region
Diagnostic (loss of view)
Force-to-value diagnostic (FVD),

< 2 ms/test
Features of DI Points (continued)
Specification (continued)
Maximum input toggle rate to maintain diagnostic

fault coverage
< 20/sec
75
FVD Off state glitch

Duration
Magnitude
Output impedance
< 2 ms
36% test voltage
05 VDC, 100 k
ADC scan time
< 1 ms for all DI points
AI/DI Baseplate
This figure depicts a front view of the
Model 2361S2 AI/DI Baseplate. The short
circuit current specifications for field
short-to-ground faults are:
130 mA, typical
200 mA, maximum
76
Chapter 2
System Description
This figure is a simplified schematic of the Model 3361S2 AI/DI Module and Model 2361S2
AI/DI Baseplate.
AI/DI Baseplate
32-Point AI/DI Module

Mux
1
Field Power (PS1) +

Field Power (PS2) +
32
To
Spare
180 7
+
In
***
Mux
1
*
32
**
***
Mux
Field Power (PS1)
To
Other
Points
Field Power (PS2)
1
32
*150 7 on AI points **100 7 on AI points

0 7 on DI points
Figure 28
3.01 k7 on DI points
***On DI points only
***
3361S2 AI/DI Module and 2361S2 AI/DI Baseplate Schematic
77

This figure depicts typical field connections for the Model 2361S2 AI/DI Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
Field
Contact
+
~
~
~
~
Typical DI Point
(1 of 16 DI Points Shown)
10
10
11
11
12
12
13
13
14
14
15
15
16
~
~~
~
16
4-20 mA
Transmitter
17
17
~
~~
~
18
19
20
21
22
Typical AI Point
(1 of 16 AI Points Shown)
23
24
25
26
27
28
29
30
31
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
32
~ ~~ ~ ~
Figure 29
2361S2 AI/DI Baseplate Typical Field Connections
78
Chapter 2
System Description
AI/DI External Termination Baseplate

The AI/DI External Termination
Baseplate is typically used with the
Model 9793-610F External Termination
Panel Kit.
This panel contains ELCO connectors,
which allows connection of External
Termination Panels.
79
This figure is a simplified schematic of the Model 9793-610F ETP Kit and the Model 3361S2
AI/DI Module with the AI/DI External Termination Baseplate.
ELCO
CABLE
TERMINATION PANEL
BASEPLATE
32-POINT AI/DI MODULE
**
200300 Ohms
Mux
3 kilohms
30 V
Zener
32
3.3 V
Zener
***
to
other
points
Mux
to
spare
module
PS1
32
PS2
PS1
***
PS1
PS2
PS2
Mux
to
modules
1
32
0 ohm
***
PS1
0 ohm
PS2
* 3.3 V zener on the AI ETP onlyno 3.3 V zener on the DI ETP

** 1 00 ohm 0.01% resist or on AI points 173 2
3.01 kilohm 1 % resi stor on DI points 116
*** On DI point s onl y
Figure 30
3361S2 AI/DI Module and AI/DI External Termination Baseplate Schematic
80
Chapter 2
System Description

This figure depicts typical field connections for the AI/DI External Termination Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
S
F
~ ~~ ~ ~
Figure 31
AI/DI External Termination Baseplate Typical Field Connections
81
AI/DI Hazardous Location External Termination Panels

To connect field wiring to the Model 3361S2 AI/DI Module in hazardous locations, you must
use one DI Hazardous Location ETPfor points 1-16and one AI Hazardous Location ETP
for points 17-32.
Model 9793-610F is an ETP kit that includes one AI Hazardous Location ETP (Model 9792-310F)
and one DI Hazardous Location ETP (Model 9573-610F).
For more information on these ETPs, including specifications, simplified schematics, and field
wiring diagrams, see:
AI Hazardous Location External Termination Panel on page 65
DI Hazardous Location External Termination Panel on page 115
You must use two 16-point term panels for each 32-point AI/DI module. Each term panel comes
82
Chapter 2
System Description

These Analog Output components are available with Tri-GP v2.x systems.
Model
Description
Current
Type
3481S2
4 @ 420 mA
Commoned
3482S2
High-Current Analog Output Module
2 @ 420 mA,
2 @ 440 mA
Commoned, High Current
2481S2
Analog Output Baseplate
Direct Termination
n/a
Analog Output External Termination

Baseplate
9863-610F
Analog Output Hazardous Location

2483S2
Analog Output HART Baseplate
Direct Termination
2483AS2
Analog Output HART Hazardous

Location Baseplate
Direct Termination
Note
When ordering the 9863-610F ETP, you can order longer interface cables, in increments
of 10 feet, by changing the last two digits of the ETP model number from 10 to the
desired length of the cable. The maximum length for interface cables is normally 100 feet.
Contact the Invensys Global Customer Support (GCS) center if you require cables longer
than 100 feet.
Analog Output (AO) Modules contain the circuitry for three identical, isolated channels. Each
channel includes a proprietary ASIC that receives its output table from the I/O communication
processor on its corresponding main processor. The AO Modules use special shunt circuitry to
vote on the individual output signals before they are applied to the load. This voter circuitry
insures only one output, A or B or C, is driving the field load. The shunt output circuitry
provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum
availability.
AO Modules continuously execute forced-switch diagnostics (FSD) on each point. By carefully
forcing error conditions and observing proper behavior of the voting circuitry, high reliability
and safe operation is insured. This safety feature allows unrestricted operation under a variety
of multiple-fault scenarios.
AO Modules support hot sparing for online replacement of a faulty module or continuous backup to an active module. The AO Modules are mechanically keyed to prevent improper
installation in a configured baseplate.
83
AO Module 3481S2
This figure is a simplified schematic of the Model 3481S2 AO Module.
Triplicated
I/O Bus
I/O Controller(s)
Isolated
Bus
Transceiver
ASIC
Field Circuitry Typical Point (4)
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
ASIC
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
ASIC
Output
Termination
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Figure 32
3481S2 AO Module Simplified Schematic
84
Chapter 2
System Description
This table lists specifications for the Model 3481S2 AO Module.

Table 18
3481S2 AO Module Specifications
Feature
Specification
Points
4, commoned-return, DC-coupled
Output current range
420 mA output, controlled

022 mA over-range
0 mA output capability (step function <2 mA)
Output accuracy
<0.25% (in range of 420 mA) of FSR (022 mA),

from 32 F to 158 F (0 C to 70 C)
Type
TMR
Resolution
12 bits
Diagnostic
Forced-switch diagnostic (FSD)
External loop power (reverse voltage-protected)
32 VDC, maximum
24 VDC, nominal
with 2483AS2 Hazardous Location Baseplate
30 VDC, maximum
Output loop power requirements for specified load
300 @ >16 VDC (1 A minimum)

Over-range protection
36 VDC, continuous
0 VDC, continuous
Switch time on leg failure
1 ms, typical
3 ms, maximum
Functional-to-protective-earth isolation
500 VDC, minimum
with 2483AS2 Hazardous Location Baseplate

0 VDC
800 VDC, minimum
85
AO Module 3482S2
This figure is a simplified schematic of the Model 3482S2 High-Current AO Module.
Triplicated
I/O Bus
I/O Controller(s)
Isolated
Bus
Transceiver
Proc
A
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
Proc
B
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Isolated
Bus
Transceiver
Proc
C
Output
Termination
Selector
Logic
DAC
Voltage Loopback
Current Loopback
Figure 33
3482S2 High-Current AO Module Simplified Schematic
86
Chapter 2
System Description
This table lists specifications for the Model 3482S2 High-Current AO Module.
Table 19
3482S2 High-Current AO Module Specifications
Feature
Specification
Points
4, commoned-return, DC-coupled
Output current range, Points 12

022 mA over-range
Output accuracy, Points 12
<0.25% (in range of 420 mA) of FSR

(022 mA), from 32 F to 158 F (0 C to +70C)
Output current range, Points 34

044 mA over-range
Output accuracy, Points 34
<0.25% (in range of 440 mA) of FSR

(044 mA), from 32 F to 122 F (0 C to 50C)
Type
TMR
Resolution
12 bits
Diagnostic
Forced-switch diagnostic (FSD)
External loop power (reverse voltage protected)
32 VDC, maximum
24 VDC, nominal
Output loop power requirements

for specified load, Points 12

Over-range protection, Points 12
36 VDC, continuous
0 VDC, continuous
Output loop power requirements for specified

load, Points 34

Over-range protection
36 VDC, continuous with thermal de-rating

0 VDC, continuous
Switch time on leg failure
1 ms, typical
3 ms, maximum
500 VDC, minimum
800 VDC, minimum
87
AO Baseplate
Model 2481S2 AO Baseplate.
88
Chapter 2
System Description
This figure is a simplified schematic of the Model 3481S2 or Model 3482S2 AO Module and
Model 2481S2 AO Baseplate.
4-Point AO Module
AO Baseplate
Loop Power
Field Power (PS1) +

Field Power (PS2) +
A
Selector
Logic
DAC
To
Other
Points
Load +
B
Selector
Logic
DAC
C
Selector
Logic
Load
Field Power (PS1)
Field Power (PS2)
DAC
Figure 34
3481S2 or 3482S2 AO Module and 2481S2 AO Baseplate Schematic
89

This figure depicts typical field connections for the Model 2481S2 AO Baseplate.
+24 V #1
+24 V #2
RTN
Safety
Unused Output Jumper *
Typical Point
~
~
Field
Load
~
~
9
10
11
12
13
14
15
16
**
9
10
11
12
13
14
15
16
~~~~
* Short unused outputs
** Use points 1 through 4 to wire field devices to the baseplate
Figure 35
2481S2 AO Baseplate Typical Field Connections
90
Chapter 2
System Description
AO External Termination Baseplate

The AO External Termination Baseplate is used with the Model 9863-610F AO Hazardous
Location ETP.
The baseplate contains ELCO connectors, which allows connection of External Termination
Panels.
Analog Output External Termination
Baseplate, which is available for use
with all Tri-GP systems.
91
This figure is a simplified schematic of the Model 3481S2 AO Module and the AO External
4-Point AO Module
AO External Termination Baseplate
Loop Power
Field Power (PS1)
Field Power (PS2)
A
Selector
Logic
V+
DAC
B
Selector
Logic
To External
Termination Panel
DAC
C
Selector
Logic
DAC
Figure 36
Field Power (PS1)

Field Power (PS2)
3481S2 AO Module and AO External Termination Baseplate Schematic
92
Chapter 2
System Description

This figure depicts typical field connections for the AO External Termination Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
S
F
~ ~~ ~ ~
Figure 37
AO External Termination Baseplate Typical Field Connections
93
AO HART Baseplates
The Model 2483S2 AO HART Baseplate and the
Model 2483AS2 AO HART Hazardous Location
Baseplate are used with Model 3481S2 AO
Modules.
The Triconex 4850 HART Multiplexer mounts
directly onto the Model 2483S2 and 2483AS2
baseplates (the Multiplexer is supplied in the
Model 5483S2 and 5483AS2 TriPaks).
The Model 2483AS2 AO HART Hazardous
Location Baseplate should be used in
hazardous locations.
CAUTION
The Model 2483S2 AO HART Baseplate and the Model 2483AS2 AO

HART Hazardous Location Baseplate can be used only with Model
3481S2 AO modules. Using it with other modules will destroy some of the
baseplate components.
For more information, see Appendix C, HART Communication and the Triconex 4850 HART
Multiplexer Instruction Manual.
94
Chapter 2
System Description
This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483S2 AO
HART Baseplate with the Triconex 4850 HART Multiplexer.
4-Point AO Module
AO HART Baseplate
Triconex 4850
HART
To
RS232-to-RS485
Converter
Connection
Loop Power
RS485
PWR
Selector
Logic
Address
To
Address Plug
Connection
Field Power (PS1) +
DAC
Field Power (PS2) +

B
Selector
Logic
To
Other
Points
Load +
DAC
HART Filter
C
Selector
Logic
Load
Field Power (PS1)
DAC
Field Power (PS2)
Figure 38
3481S2 AO Module and 2483S2 AO HART Baseplate Schematic
This figure is a simplified schematic of the Model 3481S2 AO module and the Model 2483AS2
AO HART Hazardous Location Baseplate with the Triconex 4850 HART Multiplexer.
4-Point AO Module
AO HART Hazardous Location Baseplate

Triconex 4850
Safe Area
HART
To
RS232-to-RS485
Converter
Connection
Loop Power
RS485
PWR
Selector
Logic
Address
To
Address Plug
Connection
Field Power
(PS1) +
DAC
30V
zener
Field Power
(PS2) +
B
Selector
Logic
Safe Area Hazardous

Area
To
Other
Points
Load +
DAC
IS
Isolator
HART Filter
C
Selector
Logic
Load
Load
Field Power (PS1)
DAC
Field Power (PS2)
Figure 39
3481S2 AO Module and 2483AS2 AO HART Hazardous Location Baseplate Schematic
95
PWR
GND
TDA ()
TDB (+)
This figure depicts typical field connections for the Model 2483S2 AO HART Baseplate.
24V
DC
+24 V #1
+24 V #2
RTN
or
***
Safety
Typical Point
SHLD
TA
TA
TB
TB
J22
SHLD
Shield
RS232/RS485
Converter
J18
J27
~
~
1
2
3
4
~
~
Field
Load
5
6
PWR
HOST
HART
FAULT
Unused Output Jumper **
10
11
12
13
14
15
16
4850
TRICONEX
F
J19
~~~~ ~
HART AO Baseplate
* Use points 1 through 4 to wire field devices to the baseplate
** On points 1 through 4, short any unused outputs
*** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit
Figure 40
2483S2 AO HART Baseplate Typical Field Connections
96
Chapter 2
System Description
PWR
GND
TDA ()
TDB (+)
This figure depicts typical field connections for the Model 2483AS2 AO HART Hazardous
Location Baseplate.
24V
DC
+24 V #1
+24 V #2
RTN
***
or
S
Safety
Typical Point
SHLD
TA
TA
TB
TB
J22
SHLD
Shield
RS232/RS485
Converter
J18
J27
~
~
1
2
3
4
~
~
Field
Load
5
6
PWR
HOST
HART
FAULT
Unused Output Jumper **
10
11
12
13
14
15
16
4850
TRICONEX
Intrinsic Safety (IS)

Isolators
****
S
MTL CPS04 Backplane

F
J19
Safe Area
~~~~ ~
Hazardous
Area
HART AO Baseplate
* Use points 1 through 4 to wire field devices to the baseplate
** On points 1 through 4, short any unused outputs
*** For RS485 communication wiring, use twisted-shielded conductors run in metal conduit
**** For ATEX compliance, IS isolators must be used. Triconex tested ATEX compliance using MTL4546 Isolators.
Figure 41
2483AS2 AO HART Hazardous Location Baseplate Typical Field Connections
97
AO Hazardous Location External Termination Panel

The Model 9863-610F ETP is compatible with the Model 3481S2 Analog Output Module. Each
ETP has:
Two, eight-position field terminals; support for eight points (only four points
supported on the 3481S2 Module)
Two terminals per point: Out, Rtn (L+, L)
A four-position terminal for redundant 24 VDC loop power
Two, one-position terminals for protective earth connection
recommended field power connections are on the AO External Termination Baseplate and
4.42 in (11.23 cm)
5.02 in (12.75 cm)
4.25 in (10.795 cm)
Specifications
Table 20
Feature
Description
Panel type
Hazardous location, current output
Points
98
Chapter 2
System Description

Table 21
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
30 V
Maximum voltage
Um
Um
32 V
Uo
Voc
32 V
Io
Isc
0.250 A
Po
Po
1.72 W
C external, maximum
Co
Ca
1.18 F
L external, maximum
Lo
La
4.95 mH
99
This figure is a simplified schematic of the Model 9863-610F ETP and the Model3481S2 AO
Module with an AO External Termination Baseplate.
4-POINT ANALOG OUTPUT MODULE
AO EXTERNAL
TERMINATION BASEPLATE
ELCO
CABLE
TERMINATION PANEL
Loop power
A
0 ohm
PS1 +
Selector
Logic
Current
loopback
to
module
0 ohm
PS2 +
DAC
PS1
Selector
Logic
PS2
Current
loopback
DAC
ATEX
Filter
OUT2
Typical point
RTN2
Selector
Logic
Current
loopback
DAC
Figure 42
Simplified Schematic of a 9863-610F Panel and a 3481S2 AO Module with an AO External

100
Chapter 2
System Description
Typical Connections
C17
L12
SN
C15
C14
REV D

L11
L5
C12
L4
C10
C5
C3
C2
L3
L1
TRICONEX

L15

L13
L14
L9
L10
L7
L8

C35
TB8
R1
TB1TB4
R2
C44
C43
C42
C41
C40
C39
TB7
C38
C37
L2
J1
C19
C22
C7
C24
L17
C20
L18
C8
EXT TERM

7400270

J4

C25
C27
C45
L-
P1
J5
P2
Typical unused point
Typical point
(1 of 8 points shown)
Note: Field power is routed

from the baseplate. Do not
connect field power to the ETP.
Load
Energy limited
Figure 43
Field Wiring for 9863-610F with a 3481S2 AO Module
CAUTION
Note
Not energy limited
Unused points must be shorted together.

For more information about installing the Tri-GP in hazardous
locations, see Application-Specific Installation Guidelines on page 182.
The Model 3481S2 AO Module has only four outputs, so points 5 through 8 on the ETP
are not connected and are not required to be shorted together.
Digital Input Components
101

These Digital Input components are available with Tri-GP v2.x systems.
Model
Description
Voltage
Type
3301S2
24 VDC
Commoned
3311S2
24 VDC
Commoned
2301S2
Digital Input Baseplate
Direct Termination
n/a
Digital Input External Termination

Baseplate
2302S2
High-Voltage DI Baseplate Kit, includes:

Digital Input External Termination
Baseplate, two Solid State Relay Input
External Termination Panels, two 10-foot
Interface Cables
9573-610F
Digital Input Hazardous Location

Note
115 VAC
External Termination,
Interposing Relays
When ordering the High-Voltage DI Baseplate Kit, you can order interface cables in
increments of 10 feet by specifying part number 4000195-3xx, where xx equals the length
in feet. When ordering the 9573-610F ETP, you can order interface cables in increments
of 10 feet by changing 9573-610F to 9573-6xx, where xx equals the length in feet. The
maximum length for interface cables is normally 100 feet. Contact the Invensys Global
Customer Support (GCS) center if you require cables longer than 100 feet.
Digital Input (DI) Modules have three independent channels which process all data sent to the
module. An ASIC on each channel scans each input point, compiles data, and transmits it to the
MPs upon demand. Input data is voted at the MPs before processing to ensure the highest
integrity.
DI Modules sustain complete, ongoing diagnostics for each channel. If the diagnostics detect a
failure on any channel, the Fault indicator is activated, which in turn activates the system alarm.
The Fault indicator points to a channel fault, not a complete module failure. The DI Module is
properly with certain multiple faults.
DI Modules continuously verify the ability of the system to detect transitions to the opposite
state. The DI Module supports hot sparing for online replacement of a faulty module or
continuous back-up to an active module. The DI Module is mechanically keyed to prevent
improper installation in a baseplate.
102
Chapter 2
System Description
DI Module 3301S2
This figure is a simplified schematic of the Model 3301S2 DI Module.
Triplicated
I/O Bus
Digital Input Module Typical Point (1 of 32)
ADC
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Isolation
Filtering
Individual Point
Field Terminations
DAC
ADC
DAC
ADC
DAC
Figure 44
3301S2 DI Module Simplified Schematic
103
This table lists the specifications for the Model 3301S2 DI Module.
Table 22
3301S2 DI Module Specifications
Feature
Specification
Points
32, commoned
24 VDC
19.230 VDC
33 VDC
0.6 VDC
Input delay
ON to OFF or OFF to ON
Time constant = 2.86 msec, - 3dB @ 55hz
Input impedance
>30 k without baseplate

3 k with baseplate
Input power
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
Input threshold
05 VDC = Off region


<2 ms/test
Maximum input toggle rate to maintain diagnostic fault

coverage
<20/sec
FVD Off-state glitch

Duration
<2 ms
Magnitude
36% test voltage
Output Impedance
05 VDC, 100 k
ADC scan time
500 VDC, minimum
800 VDC, minimum
104
Chapter 2
System Description
DI Module 3311S2
This figure is a simplified schematic of the Model 3311S2 DI Module.
Triplicated
I/O Bus
Digital Input Module Typical Point (1 of 32)
ADC
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Isolation
Filtering
Individual Point
Field Terminations
DAC
ADC
DAC
ADC
DAC
Figure 45
3311S2 DI Module Simplified Schematic
105
This table lists the specifications for the Model 3311S2 DI Module.
Table 23
3311S2 DI Module Specifications
Feature
Specification
Points
32, commoned
24 VDC
19.230 VDC
33 VDC
0.6 VDC
Input delay
ON to OFF or OFF to ON
Time constant = 0.13 msec, 3 dB @ 1.2 kHz
Input impedance
>30 k without baseplate

3 k with baseplate
Input power
0.2 W/pt, @ 24 VDC

0.5 W/pt, @ 33 VDC
Input threshold
05 VDC = Off region


<2 ms/test
Force-to-trigger diagnostic (FTD),
<2 ms/test
Maximum input toggle rate to maintain diagnostic

fault coverage
<20/sec
FVD and FTD Off-state glitch

Duration
<2 ms
Magnitude
36% test voltage
Output Impedance
05 VDC, 100 k
ADC scan time
500 VDC, minimum
800 VDC, minimum
The Model 3311S2 DI Module reports Sequence of Events (SOE) with a resolution of one
millisecond or less and with an accuracy of one millisecond or less.
These are key terms used to describe the operation of the Model 3311S2 DI Module:
Transitiona transition is defined as a point entering the user-defined trip state (SOE
Trigger State) for the minimum amount of user-specified time (SOE Trigger Time), with
an accuracy of 0/+1 milliseconds.
106
Chapter 2
System Description
Trip statethe trip state is a user-defined property (SOE Trigger State) in TriStation
1131 software that determines if the SOE function is enabled for a point and specifies
the state of transitions (Rising, Falling, Rising/Falling) to be reported.
Trigger timethe trigger time is a user-defined property (SOE Trigger Time) in

TriStation 1131 software that specifies the number of milliseconds that a signal must be
stable before its change in state (transition) causes the reporting of an event. This is also
known as the debounce period. A longer trigger time results in a longer debounce
period, so that pulse widths that fall within the debounce period will not be reported as
an event.
Dead time intervalthe dead time interval is a user-defined property (SOE Dead Time)
in TriStation 1131 software that specifies the length of time (in seconds) that must
elapse after a transition, before a subsequent transition will be reported. A longer dead
time interval is better able to prevent the higher-level SOE application from being
flooded with events, but it also means there is a greater chance of losing subsequent
transition events.
Unreported eventsunreported events are events that have been captured and are
being processed before being reported to the SOE function block in the control
program.
It can take up to three minutes for the Model 3311S2 DI Module to reach the Pass State upon
initial power up, which is indicated by a steady green Pass status indicator on the front panel of
the module.
When an event is triggered on a point, the amount of time before a subsequent event can be
captured on the same point is affected by the number of unreported events in the system and
the number of unreported events on the module.
This formula identifies the typical amount of time before a subsequent event can be captured on
the same point. However, in the presence of certain diagnostics, the worst case time will be 20
seconds or the calculated time, whichever is greater. The calculated time does not exceed 20
seconds until there are 154 unreported events in the system with 32 unreported events on the
individual module.
Time = (0.11 T) + (0.091 P) + 0.23 seconds
T = total number of unreported events in the system. The maximum number of T is the total
number of SOE-enabled points in the system. The maximum number of T is reached only if
all SOE-enabled points in the system are triggered at the same time.
P = unreported events on the individual module. The maximum number of P is the total
number of SOE-enabled points on the module. The maximum number of P is reached only
if all SOE-enabled points on the module are triggered at the same time.
Additional performance characteristics of the Model 3311S2 DI Module:
The module may miss transitions after the SOE function block in the control program
starts, for a period of time up to the amount of the dead time interval.
After the module captures a transition for an input point, a subsequent transition for
that point is reported only after the user-configured dead time interval (SOE Dead
Time) has elapsed.
107
When the trip state is set to detect both rising and falling transitions
(SOE Trigger State = Rising/Falling), the trailing transition is reported only if the
leading transition is reported, which means that if the point changed state but the
leading change did not meet the minimum transition timeso it was not reportedthe
change back to the original state is not reported.
The module may miss transitions during a change from TMR mode to DUAL mode, or
a change from DUAL mode to TMR mode. The module may not report events in correct
sequence if the events happen at the same time the module changes from TMR mode to
DUAL mode, when the mode change is caused by certain fault conditions.
In DUAL mode, the accuracy of the trigger time can be 1 millisecond if the runtime
diagnostics are running during the transition.
DI Baseplate
Model 2301S2 DI Baseplate.
The short circuit current specifications
for field short-to-ground faults are:
130 mA, typical
200 mA, maximum
108
Chapter 2
System Description
This figure is a simplified schematic of the Model 3301S2 or 3311S2 DI Module and 2301S2 DI
Baseplate.
DI Baseplate
32-Point DI Module
Mux
1
Field Power (PS1) +

Field Power (PS2) +
32
To
Spare
180
+
In
Mux
1
32
3K
Mux
Field Power (PS1)

Field Power (PS2)
To
Other
Points
1
32
Figure 46
3301S2 or 3311S2 DI Module and 2301S2 DI Baseplate Schematic
109

This figure depicts typical field connections for the Model 2301S2 DI Baseplate.
+24 V #1
+24 V #2
RTN
Safety
Field
Contact
~
~
~
~
Typical Point
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
~ ~~ ~
Figure 47
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
2301S2 DI Baseplate Typical Field Connections
DI External Termination Baseplate

The DI External Termination Baseplate is used with the Solid State Relay (SSR) Input External
Termination Panel (ETP) or the Model 9573-610F DI Hazardous Location ETP.
Panels.
110
Chapter 2
System Description

DI External Termination Baseplate,
which is available for use with all
Tri-GP systems.
This figure is a simplified schematic of the Model 3301S2 or 3311S2 DI Module and DI External
DI Baseplate
32-Point DI Module
Mux
1
Field Power (PS1) +

Field Power (PS2) +
32
To
Spare
External
Termination Panels
Mux
1
32
Mux
Field Power (PS1)

Field Power (PS2)
1
32
Figure 48
3301S2 or 3311S2 DI Module and DI External Termination Baseplate Schematic
111

This figure depicts typical field connections for the DI External Termination Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
S
F
~ ~~ ~ ~
Figure 49
DI External Termination Baseplate Typical Field Connections
112
Chapter 2
System Description
Solid State Relay Input External Termination Panel

The Solid State Relay (SSR) Input External Termination Panel (ETP) is compatible with
industry-standard solid state relays which can be cabled to the DI External Termination
Baseplate. The solid state relays are manufactured by OMRON.
The SSR Input ETP supports 16 points and each DI Module can support up to two SSR Input
ETPs.
The SSR Input ETP has a barrier strip with four compression screw terminals per point for
connecting a DI Module to 16 digital inputs. The SSR Input ETP accepts power (+24 VDC) from
the DI Baseplate. The 24-volt power source connected to the baseplate must be able to provide
0.5 amps minimally.
You must use two 16-point term panels for each 32-point DI module. Each term panel comes
This figure depicts a front view of the SSR Input ETP.
J1
DSP5
R4
CR4
R5
CR5
DSP6
DSP9
R9
CR7
CR9
NON-COM DI
RELAY ETP
CR10
DSP10
DSP11
R10
R11
CR11
DSP12
R12
CR12
CR13
BOTTOM VIEW
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
G3R-IAZR1SN
BOTTOM VIEW
OMRON
IN
F15
IN
F16
DSP14
R13
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
G3R-IAZR1SN
BOTTOM VIEW
IN
F14
DSP13
K16
MADE IN JAPAN
OMRON
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
F13
K15
G3R-IAZR1SN
BOTTOM VIEW
MADE IN JAPAN
OMRON
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
F12
K14
G3R-IAZR1SN
BOTTOM VIEW
MADE IN JAPAN
OMRON
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
F11
K13
G3R-IAZR1SN
BOTTOM VIEW
MADE IN JAPAN
OMRON
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
F10
K12
G3R-IAZR1SN
OMRON
BOTTOM VIEW
LOAD:0.1A
524VDC
INPUT:100240VAC~
MADE IN JAPAN
K11
G3R-IAZR1SN
BOTTOM VIEW
OMRON
AC
R8
7400256
PWR
MADE IN JAPAN
MADE IN JAPAN
DSP8
CR8
Figure 50
IN
F9
R7
CR6
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
K10
G3R-IAZR1SN
OMRON
BOTTOM VIEW
IN
F8
DSP7
R6
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
F7
K9
G3R-IAZR1SN
OMRON
BOTTOM VIEW
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
G3R-IAZR1SN
BOTTOM VIEW
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
G3R-IAZR1SN
BOTTOM VIEW
OMRON
IN
F6
K8
DSP15
R14
CR14
REV B
SN
Solid State Relay Input External Termination Panel
Dimensions of the SSR Input ETP

4.23 in (10.74 cm)
12.54 in (31.85 cm)
4.25 in (10.795 cm)
DSP16
R15
CONTACT
DSP4
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
CONTACT
CR3
IN
F5
K7
PWR
R3
K6
G3R-IAZR1SN
OMRON
BOTTOM VIEW
BOTTOM VIEW
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
G3R-IAZR1SN
IN
F4
DSP3
MADE IN JAPAN
K5
MADE IN JAPAN
OMRON
AC
R2
CR1
CR2
IN
F3
DSP2
R1
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
K4
G3R-IAZR1SN
BOTTOM VIEW
IN
F2
DSP1
MADE IN JAPAN
OMRON
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
IN
F1
K3
G3R-IAZR1SN
OMRON
BOTTOM VIEW
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
AC
K2
G3R-IAZR1SN
OMRON
MADE IN JAPAN
K1
R16
CR15
CR16
PWR
AC
Power
Supply
AC
DSP1
CR2
Figure 52
F2
IN
AC
R1
DSP2
CR1
R2
CR3
F3
IN
AC
DSP3
OMRON
F4
R3
DSP4
R4
CR4
Neutral
IN
AC
OMRON
F5
DSP5
R5
CR5
IN
AC
F6
IN
AC
DSP6
R6
CR6
F7
IN
AC
DSP7
OMRON
R7
CR8
F8
IN
AC
DSP8
R8
CR7
NON-COM DI
RELAY ETP
7400256
SN
F9
IN
AC
DSP9
R9
CR9
CR10
F10
IN
AC
DSP10
OMRON
R10
CR11
F11
IN
AC
DSP11
R11
OMRON
F12
IN
AC
DSP12
R12
CR12
OMRON
F13
IN
AC
DSP13
R13
CR13
OMRON
F14
IN
AC
F15
IN
AC
DSP14
R14
DSP15
CR14
LOAD:0.1A
524VDC
INPUT:100240VAC~
OMRON
BOTTOM VIEW
BOTTOM VIEW
MADE IN JAPAN
K15
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K14
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K13
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K12
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K11
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K10
G3R-IAZR1SN
OMRON
K9
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
1A
G3R-IAZR1SN
OMRON
MADE IN JAPAN
K8
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
V+
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K7
G3R-IAZR1SN
OMRON
K6
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
C+
G3R-IAZR1SN
OMRON
K5
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
V+
Other
Points
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K4
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
K3
G3R-IAZR1SN
OMRON
BOTTOM VIEW
MADE IN JAPAN
K2
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
K1
LOAD:0.1A
524VDC
INPUT:100240VAC~
BOTTOM VIEW
MADE IN JAPAN
Figure 51
Baseplate
CONTACT
IN
G3R-IAZR1SN
OMRON
MADE IN JAPAN
SSR Panel
PWR
F1
CONTACT
AC
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON

113
This figure depicts a simplified schematic of the Model 3301S2 or 3311S2 DI Module and the SSR
Input ETP.
32-Point DI Module
1
Mux
P+
32
To
Spare
1
Mux
C
32
1
Mux
32
3301S2 or 3311S2 DI Module and SSR Input ETP Schematic
Typical Connections
This figure shows how to connect 115 VAC discrete inputs to the SSR Input ETP, which is used
with the Model 3301S2 or 3311S2 DI Module and DI External Termination Baseplate.
J1
K16
F16
IN
R15
DSP16
R16
CR15
REV B
CR16
Hot
Typical point
(1 of 16 points shown).
Field
Contact
SSR Input ETP Typical Field Connections
114
Chapter 2
System Description
Input Ranges
This table lists the input ranges for available SSR modules. SSRs must be ordered separately and
are available from Invensys or directly from OMRON. For more information, contact the
Invensys Global Customer Support (GCS) center.
For detailed specifications, see the OMRON G3R-I/O data sheet.
Table 24
Input Ranges for Solid State Relay (SSR) Modules
Description
Part Number
Input Range
Must
Operate
Voltage
Must
Release
Voltage
Output
Range
Solid-State
Relay Input
Module
1300447-001
(G3R-IAZR1SN)
100 to 240 VAC
60 VAC max.
20 VAC min.
4 to 32 VDC
The OMRON family of input relays are limited to an ambient humidity

range of 45% to 85%, all other Tri-GP environmental and EMC
specifications remain unchanged.
CAUTION
Pin-Out Information
This table lists pin-out information for the SSR Input ETP.
Table 25
Pin-Out Information for the SSR Input ETP
Left
Power
Terminal
Right
Contact
Terminal
Point
1
Point
2
Point
3
Point
4
Point
5
Point
6
Point
7
Point
8
P+
C+
11
13
15
10
12
14
16
Right
Power
Terminal
Right
Contact
Terminal
Point
9
Point
10
Point
11
Point
12
Point
13
Point
14
Point
15
Point
16
P+
C+
11
13
15
10
12
14
16
115
DI Hazardous Location External Termination Panel

Termination panel 9573-610F is compatible with Model 3301S2 and Model 3311S2 24 VDC
Digital Input Modules. Each panel has:
Two, sixteen-position field terminals; support for sixteen points
Two terminals per point, for dry contact (F+, F)
Each positive terminal is current-limited with a 200-to-300-ohm positive temperature coefficient

(PTC) resistor.
recommended field power connections are on the DI External Termination Baseplate and
You must use two 16-point term panels for each 32-point DI module. Each term panel comes
4.42 in (11.23 cm)
5.02 in (12.75 cm)
4.25 in (10.795 cm)
Specifications
Table 26
Feature
Description
Panel type
Hazardous location, commoned 24 V
Points
16
116
Chapter 2
System Description

Table 27
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
19 to 28 V
Maximum voltage
Um
Um
32 V
Ui
Vmax
32 V
Ii
Imax
0.962 A
Maximum input power
Pi
Pi
0.03178 W
C internal, maximum
Ci
Ci
0.088 F
L internal, maximum
Li
Li
43 H
Input Connection (F) Specifications
Uo
Voc
32 V
Io
Isc
0.160 A
Po
Po
1.347 W
C external, maximum
Co
Ca
1.18 F
L external, maximum
Lo
La
4.95 mH
117
This figure is a simplified schematic of the Model 9573-610F ETP and the Model 3301S2 or
3311S2 DI Module with a DI External Termination Baseplate.
ELCO
CABLE
TERMINATION PANEL
BASEPLATE
200300 Ohms
32-POINT DIGITAL INPUT MODULE
Mux
3 kilohms
1
32
30 V
Zener
to
other
points
to
spare
Mux
1
module
PS1
32
PS2
PS1
PS1
PS2
PS2
to
modules
Mux
1
32
0 ohm
PS1
0 ohm
Figure 53
PS2
Simplified Schematic of a 9573-610F Panel and a 3301S2 or 3311S2 DI Module with a DI

External Termination Baseplate
118
Chapter 2
System Description

TRICONEX
REV D
7400275
18
R25
SN
R5
R29
R4
R28
R3
R27
R2

TB1

R30
19
R
20
R
21
3
R
22
R
23
TB4
R7
!
R
24
R31

WHEN ENERGIZED
9
R
10
11
12
13
14
15
R32
R8

R8
R7

R5
R4
R3
R2
R1
SN
TB1
EXT TERM

7400275
17
12 AWG,
as short as possible
R1
EXT TERM
"
J1
TB2 TB3 TB5
J2
J2

J3
J3
L-
P1
P2
L-
Second
term panel
Typical point
to the ETP.
Field
Contact
Energy limited
Figure 54
Not energy limited
Field Wiring for 9573-610F with a 3301S2 or 3311S2 DI Module
CAUTION

Digital Output Components
119

These Digital Output components are available with Tri-GP v2 systems.
Model
Description
Voltage
Type
3401S2
24 VDC
Commoned
3411S2
Digital Output Module, Supervised
24 VDC
Commoned
2401S2
Direct Termination
2401HS2
Direct Termination,
High Current Capable
2401LS2
Direct Termination,
Current Limited
n/a
Digital Output External Termination

Baseplate
2402S2
High-Voltage DO Baseplate Kit,

includes: Digital Output External
Termination Baseplate, Relay
Output External Termination Panel,
and 10 ft Interface Cable
9671-610
Digital Output Hazardous Location

Note
48 VDC, 120 VDC,

115 VAC, Dry Contact
External Termination,
Interposing Relays
When ordering the High-Voltage DO Baseplate Kit, you can order interface cables in
increments of 10 feet by specifying part number 4000196-3xx, where xx equals the length
in feet. When ordering the 9671-610 ETP, you can order interface cables in increments of
10 feet by changing 9671-610 to 9671-6xx, where xx equals the length in feet. The
maximum length for interface cables is normally 100 feet. Contact the Invensys Global
Customer Support (GCS) center if you require cables longer than 100 feet.
Digital Output (DO) Modules contain the circuitry for three identical, isolated channels. Each
channel includes a proprietary ASIC which receives its output table from the I/O
Communication Processor on its corresponding Main Processor. DO Modules use the patented
Quad Voter output circuitry to vote on the individual output signals just before they are applied
to the load. This voter circuitry is based on parallel-series paths which pass power if the drivers
for channels A and C, or channels B and D (D channel is a combination of A or C) command
them to close; in other words, two out of three drivers are voted on. The quad output circuitry
provides multiple redundancy for all critical signal paths, guaranteeing safety and maximum
availability.
DO Modules periodically execute an output voter diagnostic (OVD) routine on each point. This
safety feature allows unrestricted operation under a variety of multiple-fault scenarios.
OVD detects and provides alarms for the following:
Points all stuck-On and stuck-Off points are detected
120
Chapter 2
System Description
Switchesall stuck-On or stuck-Off switches or their associated drive circuitry are

detected
During OVD execution, the commanded state of each point is momentarily reversed
sequentially on one of the output drivers. Loop-back on the module allows each ASIC to read
the output value for the point to determine whether a latent fault exists within the output circuit.
The output signal transition is guaranteed to be less than two milliseconds and is transparent to
most field devices. For devices that cannot tolerate a signal transition of any length, OVD can be
disabled.
DO Modules include the hot-spare feature which allows online replacement of a faulty module.
DO Modules are mechanically keyed to prevent improper installation in a configured baseplate.
DO Module 3401S2
This figure is a simplified schematic of the Model 3401S2 DO Module, which is self-protected
against over-voltage and over-current conditions.
Triplicated
I/O Bus
I/O Controller(s)
Isolated
Bus
Transceiver

A
Output
Switch
Drive
Circuitry
+V
A
ASIC
A or C
Output
Switch
Drive
Circuitry
Isolated
Bus
Transceiver
ASIC
A
or
C
B
Output
Switch
Drive
Circuitry
Isolated
Bus
Transceiver
ASIC
C
Output
Switch
Drive
Circuitry
Load
A
B
C
Voltage
Loopback
Detector
To Other Points
Figure 55
3401S2 DO Module Simplified Schematic
Return
121
This table lists specifications for the Model 3401S2 DO Module.

Table 28
3401S2 DO Module Specifications
Feature
Specification
Points
16, commoned
Nominal output voltage
24 VDC
1930 VDC
Absolute maximum output voltage
33 VDC

voltage
0.6 VDC
Output current
Switching
<4.8 A, self-limiting; 3 A, typical
Carry
700 mA maximum, self limiting
Field alarms
Loss of field power, output point shorted On or Off
Loop-back thresholds
05 VDC = Off region

Leakage to load (Off-state)
<1 mA
Diagnostic glitch duration
<2 ms, maximum; 500 s, typical
Diagnostic fault coverage

Maximum toggle rate
>20 ms
Minimum toggle rate
Not applicable
On-state voltage drop
<1 VDC @ 1.5 A
Loop-back scan time
500 VDC, minimum
isolation
800 VDC, minimum
122
Chapter 2
System Description
DO Module 3411S2
This figure is a simplified schematic of the Model 3411S2 Supervised DO Module, which is selfprotected against over-voltage and over-current conditions.
I/O Controller(s)
Triplicated
I/O Bus
Isolated
Bus
Transceiver
Output
Switch
Drive
Circuitry
ASIC
Current
Sense
Circuitry
A
A or C
Output
Switch
Drive
Circuitry
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
A
or
C
B
Output
Switch
Drive
Circuitry
+V
C
Output
Switch
Drive
Circuitry
Load
A
B
C
Voltage
Loopback
Detector
Return
To Other Points
Figure 56
3411S2 Supervised DO Module Simplified Schematic
The Model 3411S2 DO Module is called supervised because fault detection includes potential
field problems such as:
Loss of power or blown fuse
Open or missing load
A field short resulting in the load being energized in error
A shorted load in the de-energized state
The module performs supervision of the field load health by using current measurement.
Current that is less than the minimum load (minus accuracy error) causes an open-load field
error and the load indicator to illuminate. The load indicator automatically clears once the field
error condition is removed.
Note that it can take up to three minutes for the Model 3411S2 DO Module to reach the Normal
State, which is indicated by steady green Pass and Active status indicators on the front panel of
the module.
123
This table lists specifications for the Model 3411S2 DO Module.

Table 29
3411S2 DO Module Specifications
Feature
Specification
Points
16, commoned
Nominal output voltage
24 VDC
19.230 VDC
Absolute maximum output voltage
45 VDC

voltage
0.6 VDC
Minimum required field load
30 mA
Output current
Switching
<4.8 A, self-limiting; 3 A, typical
Carry
700 mA maximum, self limiting; (See Maximum Ambient

Temperature for 3411S2 Module with 2401HS2 Baseplate
on page 124 for extended carry current limits and
conditions.)
Field alarms
Loss of field power, output point shorted On or Off, Open

load
Loop-back thresholds
05 VDC = Off region

Leakage to load (Off-state)
<1 mA
Diagnostic glitch duration
<2 ms, maximum
Diagnostic fault coverage

Maximum toggle rate
>20 ms
Minimum toggle rate
Not applicable
On-state voltage drop
<1.6 VDC @ 1.6 A
Loop-back scan time
500 VDC, minimum
isolation
800 VDC, minimum
124
Chapter 2
System Description
When using the Model 2401HS2 High-Current Baseplate with a Model 3411S2 DO Module, a
higher 1.6 A carry current is possible. Be careful not to exceed the recommended maximum
ambient temperatures, described in this table, as accuracy and component life will be degraded.
Table 30
Maximum Ambient Temperature for 3411S2 Module with 2401HS2 Baseplate
Number of points
@ 0.7 A
Number of points
@ 1.6 A
Maximum Ambient
Temperaturea
15
158 F (70 C)
14
158 F (70 C)
13
154.4 F (68 C)
12
150.8 F (66 C)
11
147.2 F (64 C)
10
143.6 F (62 C)
140 F (60 C)
138.2 F (59 C)
134.6 F (57 C)
10
131 F (55 C)
11
127.4 F (53 C)
12
123.8 F (51 C)
13
120.2 F (49 C)
14
116.6 F (47 C)
15
114.8 F (46 C)
16
111.2 F (44 C)
a. As measured at the bottom of the baseplate
125
DO Baseplate
This figure depicts the front view
of the Model 2401S2 DO
Baseplate.
126
Chapter 2
System Description
This figure is a simplified schematic of the Model 3401S2 DO Module and Model 2401S2 DO
Baseplate.
DO Baseplate
16-Point DO Module
Field Power (PS1)

Field Power (PS2)
A
or
C
A
To
Other
Points
Load +
B
~
Load
~
Figure 57
Voltage
Loopback
Detector
Field Power (PS1)

Field Power (PS2)
3401S2 DO Module and 2401S2 DO Baseplate Schematic
127

This figure depicts typical field connections for the Model 2401S2 DO Baseplate.
+24V #1
+24V #2
RTN
Safety
Typical Point
1
1
2
3
~
~
5
6
7
8
~
~
Low
Power
Field
Load
9
10
11
12
13
14
15
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
16
~~~~
Figure 58
2401S2 DO Baseplate Typical Field Connections
128
Chapter 2
System Description
DO High-Current Baseplate
of the Model 2401HS2 HighCurrent DO Baseplate, which is
recommended for use with highcurrent power loads.
129
This figure is a simplified schematic of the Model 3411S2 DO Module and the Model 2401HS2
DO High-Current Baseplate.
16-Point DO Module
DO Baseplate
~
~
Current
Sense
Circuitry*
Field Power (PS1)

Field Power (PS2)
A
or
C
To
Other
Points
C
B
Load +
~
Load
Voltage
Loopback
Detector
Field Power (PS1)

Field Power (PS2)
*Only on the 3411S2 module
Figure 59
3411S2 DO Module and 2401HS2 DO High-Current Baseplate Schematic
130
Chapter 2
System Description

This figure depicts typical field connections for the Model 2401HS2 DO High-Current Baseplate.
+24V #1
+24V #2
RTN
Safety
Typical Point
1
1
2
3
~
~
5
6
7
8
~
~
Low
Power
Field
Load
9
10
11
12
13
14
15
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
16
~~~~
Figure 60
2401HS2 DO High-Current Baseplate Typical Field Connections
131
DO Low-Current Baseplate
of the Model 2401LS2 DO LowCurrent Baseplate, which is
recommended for use only with
low-current power loads.
132
Chapter 2
System Description
This figure is a simplified schematic of the Model 3401S2 DO Module and Model 2401LS2 DO
Low-Current Baseplate.
DO Baseplate
16-Point DO Module
Field Power (PS1)

Field Power (PS2)
A
or
C
To
Other
Points
180
Load +
Load
Voltage
Loopback
Detector
Figure 61
Field Power (PS1)

Field Power (PS2)
3401S2 DO Module and 2401LS2 DO Low-Current Baseplate Schematic
133

This figure depicts typical field connections for the Model 2401LS2 DO Low-Current Baseplate.
+24V #1
+24V #2
RTN
Safety
Typical Point
1
1
2
3
~
~
5
6
7
8
~
~
Low
Power
Field
Load
9
10
11
12
13
14
15
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
16
~~~~
Figure 62
2401LS2 DO Low-Current Baseplate Typical Field Connections
134
Chapter 2
System Description
DO External Termination Baseplate

The DO External Termination Baseplate is used with the Relay Output External Termination
Panel (ETP) or the Model 9671-610 DO Hazardous Location ETP.
Panels.
Digital Output External Termination
Baseplate, which is available for use
with all Tri-GP systems.
135
This figure is a simplified schematic of the Model 3401S2 or 3411S2 DO Module and the DO
External Termination Baseplate.
16-Point DO Module
DO External Termination Baseplate
~
~
Current
Sense
Circuitry*
Field Power (PS1)

Field Power (PS2)
A
or
C
V+
To External
Termination Panel
~
~
Voltage
Loopback
Detector
Field Power (PS1)

Field Power (PS2)
Figure 63
3401S2 or 3411S2 DO Module and DO External Termination Baseplate Schematic
136
Chapter 2
System Description

This figure depicts typical field connections for the DO External Termination Baseplate.
+24 V #1
+24 V #2
24 V Return
Shield
Safety
S
F
~ ~~ ~ ~
Figure 64
DO External Termination Baseplate Typical Field Connections
137
Relay Output External Termination Panel

The Relay Output External Termination Panel (ETP) includes industry-standard relays which
can be cabled to the DO External Termination Baseplate. The interposing relays are
manufactured by OMRON. Each relay output contact is protected with a 2.5 A fast-acting fuse
with a blown fuse indicator1 and a 200 V Transient Voltage suppressor.
The Relay Output ETP supports 16 points and each DO Baseplate supports one Relay Output
ETP.
The Relay Output ETP has a barrier strip with four compression screw terminals per point for
connecting a DO Module to 16 digital outputs. The Relay Output ETP accepts power (+24 VDC)
from the DO Baseplate. The 24-volt power source connected to the baseplate must be able to
provide 0.5 amps minimally.
This figure depicts a front view of the Relay Output ETP.
J1
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
MADE IN JA PAN
K16
F16
DSP15
R14
DSP16
R15
CR14
AC
LOAD
CR13
BOTTOM VIE W
K15
F15
DSP14
R13
MADE IN JA PAN
DSP13
BOTTOM VIE W
CR12
MADE IN JA PAN
AC
IN
AC
IN
AC
IN
REV B
R16
CR15
CR16
PWR
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
IN
AC
IN
LOAD
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
PWR
IN
AC
IN
AC
IN
AC
IN
AC
IN
OMRON
R12
BOTTOM VIE W
MADE IN JA PAN
DSP12
K14
F14
AC
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
K13
F13
OMRON
OMRON
BOTTOM VIE W
MADE IN JA PAN
BOTTOM VIE W
BOTTOM VIE W
MADE IN JA PAN
MADE IN JA PAN
R11
CR11
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
DSP11
R10
OMRON
OMRON
BOTTOM VIE W
K12
F12
CR9
CR8
Figure 65
MADE IN JA PAN
CR10
CR7
K11
F11
DSP10
R9
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
DSP9
R8
7400255
K10
F10
OMRON
OMRON
BOTTOM VIE W
DSP8
R7
CR6
K9
F9
F8
DSP7
R6
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
MADE IN JA PAN
K8
F7
DSP6
OMRON
BOTTOM VIE W
CR5
MADE IN JA PAN
R5
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
DSP5
CR4
BOTTOM VIE W
K7
F6
R4
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
BOTTOM VIE W
K6
F5
DSP4
MADE IN JA PAN
MADE IN JA PAN
K5
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
BOTTOM VIE W
CR3
MADE IN JA PAN
R3
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
CR2
OMRON
CR1
K4
F4
DSP3
R2
BOTTOM VIE W
K3
F3
DSP2
R1
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
BOTTOM VIE W
MADE IN JA PAN
MADE IN JA PAN
BOTTOM VIE W
MADE IN JA PAN
BOTTOM VIE W
K2
F2
DSP1
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
OMRON
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPU T:100240 VAC~
K1
F1
SN
Relay Output External Termination Panel
Dimensions for Relay Output Term Panel
1.
4.23 in (10.74 cm)
12.54 in (31.85 cm)
4.25 in (10.795 cm)
When using AC, the blown fuse indicator will blink when a blown fuse is detected.
138
Chapter 2
System Description
Table 31
General Specifications for Termination Panel 2402
Feature
Specification
Panel Type
Non-commoned interposing relay
Points
16
Contact Fuse Rating
2.5 A fast-acting
Max Applied Contact Voltage
200 VAC/VDC
WARNING
This fuse must not be replaced with a larger value.

Continued output current in excess of 2.5 A will cause a loss of power due to
the fuse opening.
Contact voltages above 200 V will cause a loss of power due to engagment of
safety devices. If current is not limited, physical damage to the ETP will occur.
This figure depicts a simplified schematic of the Model 3401S2 DO Module and the Relay
Output ETP.
16-Point DO Module
DO External Termination Panel Baseplate
Relay Output Termination Panel
~
~
Current
Sense
Circuitry
Field Power (PS1+)

Field Power (PS2+)
OMRON
A
or
C
PWR +
2.5A
C
LOAD +
~
~
Figure 66
Voltage
Loopback
Detector
Field Power (PS1)
LOAD
Field Power (PS2)
PWR
3401S2 DO Module and Relay Output ETP Schematic
AC
AC
IN
PWR
LOAD
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
AC
IN
LOAD
AC
IN
PWR
AC
LOAD
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
PWR
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
MADE IN JAPAN
AC
IN
AC
IN
BOTTOM VIEW
CR16
LOAD
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
BOTTOM VIEW
MADE IN JAPAN
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
PWR
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
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SN
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
Relay Output ETP Typical DC Field Connections
Figure 68
REV B
7400255
CR15
CR14
CR13
CR12
CR11
CR10
CR7
CR6
CR5
CR4
CR3
CR1
DSP16
DSP15
DSP14
DSP13
R16
R15
R14
R13
R12
R11
DSP12
DSP11
DSP10
DSP9
R10
R9
R8
R7
R6
DSP8
DSP7
DSP6
DSP5
DSP4
R5
R4
R3
R2
R1
DSP3
DSP2
DSP1
SN
K16
K15
K14
K13
F16
F15
F14
F13
F12
F11
F10
K12
K11
K10
K9
K8
K7
F9
F8
F7
F6
F5
F4
CR9
CR8
CR2
Typical point
Hot
K6
K5
K4
K3
K2
K1
F3
F2
F1
Relay Output ETP Typical AC Field Connections

Figure 67
Typical point
Power
Supply
Neutral
Power
Supply
REV B
7400255
CR16
CR9
CR8
CR2
CR15
CR14
CR13
CR12
CR11
CR10
CR7
CR6
CR5
CR4
CR3
CR1
R16
R15
R14
R13
DSP16
DSP15
DSP14
DSP13
DSP12
DSP11
DSP10
R12
R11
R10
R9
R8
R7
DSP9
DSP8
DSP7
DSP6
DSP5
DSP4
R6
R5
R4
R3
R2
R1
DSP3
DSP2
DSP1
K16
K15
K14
K13
F16
F15
F14
F13
F12
F11
F10
K12
K11
K10
K9
K8
K7
F9
F8
F7
F6
F5
F4
K6
K5
K4
K3
K2
K1
F3
F2
F1
139
These figures show typical connections to the Relay Output ETP, which is used with the Model
3401S2 DO Module and DO External Termination Baseplate.
This figure shows how to connect AC discreet outputs to the Relay Output ETP.
J1
Load
This figure shows how to connect DC discreet outputs to the Relay Output ETP.
J1
Load
IN
IN
PWR
AC
LOAD
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AC
IN
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AC
IN
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AC
IN
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IN
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AC
IN
BOTTOM VIEW
AC
IN
AC
IN
AC
IN
AC
IN
LOAD
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
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IN
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AC
IN
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IN
BOTTOM VIEW
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OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
G3R-IAZR1SN
AC
IN
LOAD:0.1A
524VDC
INPUT:100240VAC~
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IN
BOTTOM VIEW
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AC
IN
BOTTOM VIEW
When switching reactive or DC loads, you should carefully observe the

maximum switching power specifications of the output contacts.
CAUTION
Typical point
C
C
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
LOAD:0.1A
524VDC
INPUT:100240VAC~
G3R-IAZR1SN
OMRON
G3R-IAZR1SN
LOAD:0.1A
524VDC
INPUT:100240VAC~
Relay Output ETP Typical Dry Contact Field Connections

Figure 69
SN
CR16
CR9
CR8
CR2
CR15
CR14
CR13
CR12
CR11
CR10
CR7
CR6
CR5
CR4
CR3
CR1
DSP16
DSP15
DSP14
DSP13
R16
R15
R14
R13
R12
R11
DSP12
DSP11
DSP10
DSP9
R10
R9
R8
R7
R6
DSP8
DSP7
DSP6
DSP5
DSP4
R5
R4
R3
R2
R1
DSP3
DSP2
DSP1
K16
K15
K14
F16
F15
F14
F13
F12
F11
K13
K12
K11
K10
K9
K8
F10
F9
F8
F7
F6
F5
K7
K6
K5
K4
K3
K2
K1
F4
F3
F2
F1
REV B
7400255
PWR
System Description
Chapter 2
140
This figure shows how to connect points requiring a dry contact to the Relay Output ETP.
J1
When switching incandescent lamps, the inrush current can be 10 to 15

times the rated nominal load current of the lamp. Use the inrush
current to calculate the required output switching power. Contact the
lamp manufacturer for detailed specifications regarding inrush
amplitude and duration.
IN
141
Interposing Relay Modules

This table gives the output ranges for available interposing relay modules. Relays must be
ordered separately and are available from Invensys or directly from OMRON. For more
information, contact the Invensys Global Customer Support (GCS) center.
For detailed specifications, see the OMRON G3R-I/O and G2R data sheets.
Table 32
Output Ranges for Interposing Relay Modulesa
Description
Invensys Part
Number
AC Solid State Relay

(SSR) Output Module
Max Inrush
Current
Rated Input
Applicable Output Load
1300462-001
(G3R-OA202SZN)
524 VDC
2 A at 75264 VAC
30 A, (60 Hz,
1 cycle)
DC SSR Output Module
1300471-001
(G3R-ODX02SN)
524 VDC
2 A at 460 VDC
8 A, 10 msec
DC SSR Output Module
1300472-001
(G3R-OD201SN)
524 VDC
1.5 A at 40200 VDC
8 A, 10 msec
a. Relay output contact ratings may be higher than module protection specification.
CAUTION
Table 33
When using the AC SSR Output Module, Invensys recommends disabling

the Output Voter Diagnostics (OVD) of the Model 3401S2 DO Module.
When de-energized, the normal execution of the OVD can glitch the AC
SSR output on for up to half of a cycle. For details, see Enabling
Disabled Output Voter Diagnostics on page 205.
Output Ranges for Power (Dry Contact) Relaysa
Description
Invensys
Part Number
Input Range
Logic Supply
Max
Switching
Voltage
Rated
Carry
Current
Power
(Dry Contact)
Relay
1300463-001
(G2R-1-SNDC24(S))
1726 VDC,
21.6 mA max
440 VAC,
125 VDC
10 A
Max
Switching
Capacity Resistive
Max
Switching
Capacity Inductive
2500 VA,
300 W
1875 VA,
150 W
a. Relay output contact ratings may be higher than module protection specification.
CAUTION
The OMRON family of output relays are limited to an ambient humidity

range of 45% to 85%, all other Tri-GP environmental and EMC
specifications remain unchanged.
142
Chapter 2
System Description
Pin-Out Information
This table lists pin-out information for the Relay Output ETP.
Table 34
Pin-Out Information for Relay Output ETP
Left
Power
Terminal
Left Load
Terminal
Point
1
Point
2
Point
3
Point
4
Point
5
Point
6
Point
7
Point
8
P+
C+
11
13
15
10
12
14
16
Right
Power
Terminal
Right
Load
Terminal
Point
9
Point
10
Point
11
Point
12
Point
13
Point
14
Point
15
Point
16
P+
C+
11
13
15
10
12
14
16
DO Hazardous Location External Termination Panel

Termination panel 9671-610 is compatible with the Model 3401S2 and Model 3411S2 24 VDC
commoned digital output modules. Each panel has:
Two, sixteen-position field terminals; support for 16 points
Two terminals per point, (L+, L)
recommended field power connections are on the DO External Termination Baseplate and
routed to the ETP through the interface cable with ELCO connectors.
Dimensions for Term Panel 9671-610
4.42 in (11.23 cm)
5.02 in (12.75 cm)
4.25 in (10.795 cm)
143
Specifications
This table describes general specifications for 9671-610.
Table 35
General Specifications for Term Panel 9671-610
Feature
Description
Panel type
Hazardous location, commoned, supervised
Points
16
This table describes cable and load parameters for 9671-610.

Table 36
Cable and Load Parameters for Term Panel 9671-610
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
1628 VDC
Maximum voltage
Um
Um
32 V
Uo
Voc
32 V
Io
Isc
0.160 A
Po
Po
1.347 W
C external, maximum
Co
Ca
1.18 F
L external, maximum
Lo
La
4.95 mH
144
Chapter 2
System Description
This figure is a simplified schematic of the Model 9671-610 ETP and the Model 3401S2 or 3411S2
DO Module with a DO External Termination Baseplate.
16-POINT DIGITAL OUTPUT MODULE
BASEPLATE
ELCO
CABLE
TERMINATION PANEL
~
Current
Sense
Circuitry*
A
PS1 +
Output
Switch
Drive
Circuitry
PS2 +
A
to other
points
L+
190310 Ohms
A "B
Output
Switch
Drive
Circuitry
L
PS1
to
hot
spare
Output
Switch
Drive
Circuitry
C
to other
points
PS2
Output
Switch
Drive
Circuitry
A
B
C
Voltage
Loopback
Detector
Figure 70
Simplified Schematic of a 9671-610 Panel and a 3401S2 or 3411S2 DO Module with a DO

External Termination Baseplate
145
Typical Connections
This figure illustrates how to connect a 9671-610 to the field (16 of 16 points shown).
TRICONEX
J1
7400274
REV C
TB2

!
15
DO NOT REMOVE FUSE WHEN ENERGIZED

12
13
11
10

TB5
TB4
14
EXT TERM ATEX/EMC

COMMONED DO ETP
TB1
TB3
DO NOT SEPARATE WHEN ENERGIZED
SN

J2
P1
Load
L-
P2
J3

to the ETP.
Not energy limited
Energy limited
* A load must be installed at every point to prevent missing-load alarm.

If a field load is not available, install a 470 Ohm, 10 W load resistor.
Figure 71
Field Wiring for 9671-610 with a 3401S2 or 3411S2 DO Module
CAUTION

146
Chapter 2
System Description
Pulse Input Components

These Pulse Input components are available with Tri-GP v2.x systems.
Model
Description
Frequency Range
Type
3382S2
0.5 Hz32 kHz
Commoned
2381S2
Pulse Input Baseplate
Direct Termination
2381AS2
Pulse Input Hazardous

Location Baseplate
Direct Termination
Pulse Input (PI) Modules provide six very sensitive, high-frequency inputs. The inputs can be
individually configured for non-amplified and amplified magnetic speed sensors common on
rotating equipment, such as turbines or compressors. PI Modules sense voltage transitions from
the speed sensors. Every input transition is sampled, and time is measured for an optimized
number of input gear pulses. The resulting count and time are used to generate a frequency
(revolutions per minute), which is transmitted to the Main Processors.
The type of speed sensor typically used with PI Modules consists of an inductive coil and
rotating teeth. The sensor is physically close to the teeth of a gear on the rotating shaft. As the
shaft rotates and the teeth move past the sensor, the resulting change in the magnetic field
causes a sinusoidal signal to be induced in the sensor.
The magnitude of the output voltage depends on:
How fast the teeth pass the sensor
The distance between the sensor and the teeth
The construction of the sensor
A typical gear has 30 to 120 teeth spaced at equal distances around its perimeter. The output
frequency is proportional to the rotational speed of the shaft and the number of teeth.
CAUTION
A PI Module uses fully differential, input-signal-conditioning circuitry

which is AC-coupled and has high bandwidth. The circuitry is designed
for high-frequency operation with de-bounced edge detection, but is still
sensitive to any type of waveform distortion that could result in
erroneous measurements. The module counts transitions by examining
one edge of each pulse, consequently, ringing on the input signal can
result in many additional transitions being counted. The module is
capable of counting over 32,000 transitions per second.
PI Modules have three independent input channels. Each input channel:
Receives pulse input voltages from each point
Converts the values to frequency (RPM) data
Transmits the values to the MPs on demand
147
To ensure correct data for each scan, one value is selected using a mid-value selection algorithm.
Sensing of each input point is designed to prevent a single failure on one channel from affecting
another channel.
For critical control programs, we recommend using redundant sensors.
PI Modules sustain complete, on-going diagnostics for each channel. If the diagnostics detect a
failure on any channel, the Fault indicator is activated, which in turn activates the system alarm.
The Fault indicator points to a channel fault, not a complete module failure. PI Modules are
PI Modules support hot sparing for online replacement of a faulty module or continuous backup to an active module. PI Modules are mechanically keyed to prevent improper installation in
a configured baseplate.
148
Chapter 2
System Description
PI Module 3382S2
This figure is a simplified schematic of the Model 3382S2 PI Module.
Triplicated
I/O Bus
PI Module Typical Point (1 of 6)
+
Isolation
Filtering
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
Individual Point
Field Terminations
Isolation
Filtering
Isolation
Filtering
Isolation
Filtering
Isolation
Filtering
Isolation
Filtering
Figure 72
3382S2 PI Module Simplified Schematic
149
This table lists specifications for the Model 3382S2 PI Module.

Table 37
3382S2 PI Module Specifications
Feature
Specification
Points
Input type
Differential, channel-isolated
Single-ended, commoned ground
Sensor compatibility
Magnetic, active, open collector
Maximum operating voltage
33 VDC
Minimum operating voltage

Differential
500 mV P-P, 2 Hz32,000 Hz

1 V P-P, 0.5 Hz2 Hz
Single-ended
1V P-P, 2 Hz32,000 Hz
2V P-P, 0.5 Hz2 Hz
Input frequency range
0.5 Hz32 kHz
Duty cycle
20% to 80%, or 10 sec minimum pulse width

(positive and negative)
Absolute error of input frequencya
0.01%, 2,00032,000 Hz
0.1%, 0.52,000 Hz
Maximum acceleration rate
4,000 Hz/sec
Absolute error of acceleration (Hz/sec)a
< 0.01 times the numeric value of the input

frequency when the frequency range is 3kHz32
kHz
Maximum jerk rate
500,000 Hz/sec2
Absolute error of jerk (Hz/sec2)a
< 2.5 times the numeric value of the input frequency

when the frequency range is 3 kHz32 kHz
Programmable number of gear teeth (G) per

point
1255b
Termination resistor
Baseplate configurable
Pull-up resistor
Baseplate configurable
Measurement algorithm
Gear multiple tracking
Diagnostic
Precision frequency reference test
500 VDC, minimum
Functional-to -functional-earth (logic) isolation
800 VDC, minimum
a. Absolute error of speed, acceleration, and jerk, does not include error introduced by the field device.
The reporting of speed acceleration and jerk is susceptible to noise and inaccuracies in the gear
manufacturing (tooth-tooth spacing).
b. Absolute error of acceleration and jerk may exceed the specified values if the number of gear teeth per
point G is not within the range of 255 > n*G >= 240, where n is an integer.
150
Chapter 2
System Description
The Model 3382S2 PI Module is compatible with Tri-GP v2.1 and later systems. For more
compatibility information, see the Product Release Notice for Tri-GP v2.x, available on the
Invensys Global Customer Support (GCS) website.
The Model 3382S2 PI Module measures speed, angular acceleration (rate of speed change), and
jerk rate (rate of acceleration change). The speed is reported to the control program in
revolutions per minute (RPM). Acceleration is reported in RPM/second and Jerk is reported as
RPM/second2.
The absolute error of the acceleration measurement is less than 0.01 times the numeric value of
the input frequency, with a frequency greater than 3000 Hz.
The absolute error of the jerk measurement is less than 2.5 times the numeric value of the input
frequency, with a frequency greater than 3000 Hz.
Note
To meet the specifications for absolute error of acceleration and absolute error of jerk,
the number of gear teeth per point must be a number that when multiplied by an integer
is greater than or equal to 240 and less than 255.
A formulaic expression of this is:
240 n G < 255

Where:
- n must be an integer
- G equals the number of gear teeth
Absolute error of acceleration and absolute error of jerk may exceed the specified value
if the number of gear teeth is not within this range.
Examples
Gear:120
Input Frequency:3,000 Hz
Frequency Error Calculations
Input frequency:3,000 Hz
Absolute error of Acceleration:[0.01 * (3,000 Hz)]/sec = 30 Hz/sec
Absolute error of Jerk:[2.5 * (3,000 Hz)]/sec2 = 7,500 Hz/sec2
RPM Error Calculations
RPM:(3,000 Hz * 60 sec/min)/Gear = 1,500 RPM
Absolute error of Acceleration:[0.01 * (1,5000 RPM)]/sec = 15 RPM/sec
Absolute error of Jerk:[2.5 * (1,500 RPM)]/sec2 = 3,750 RPM/sec2
It can take up to three minutes for the Model 3382S2 PI Module to reach the Pass State, upon
initial power-up, which is indicated by steady, green Pass status indicator on the front panel of
the module.
151
PI Baseplate
This figure depicts a front view of the Model
2381S2 PI Baseplate.
The short circuit current specifications for
field short-to-ground faults are:
130 mA, typical
200 mA, maximum
152
Chapter 2
System Description
This figure is a simplified schematic of the Model 3382S2 PI Module and Model 2381S2 PI
Baseplate.
PI Baseplate
6-Point PI Module
Field Power (PS1) +

Field Power (PS2) +
J29
J24
V+
J23
1
1
499
R+
Blown
Fuse
Indicator
Comparator
1
FE
To
Spare
IN+
Comparator
4
IN-
4
5
FE
4
Shield
Comparator
499
1
6
Field Power (PS1)

Field Power (PS2)
Figure 73
To
Other
Points
3382S2 PI Module and 2381S2 PI Baseplate Schematic
153

This figure depicts typical field connections for the Model 2381S2 PI Baseplate.
Note
Unused points must be terminated.

+24 V #1
+24 V #2
24 V Return
Safety
1
1
2
3
4
5
6
7
J23
Configuration Block
8
9
10
11
12
J24
Sensor Block
13
14
15
16
17
18
19
20
21
J26
Configuration Block
22
23
24
25
J25
Sensor Block
26
27
28
29
30
31
32
Figure 74
3
4
J29
Resistor Block
10
11
12
10
13
11
14
12
15
16
17
18
19
13
20
14
21
15
22
16
23
17
24
18
25
19
26
20
27
21
28
22
29
23
30
24
31
32
J30
Resistor Block
~~~~
2381S2 PI Baseplate Typical Field Connections
154
Chapter 2
System Description
Connecting an Unused Point

This figure depicts a typical connection for point 2.
J23
J24
1
3
4
5
6
7
8
9
10
11
12
13
14
15
16
6
7
10
11
12
10
13
11
14
15
16
Figure 75
12
J29
2381S2 PI Baseplate Unused Point Connection
Connecting a Passive Magnetic Sensor

J23
1
2
3
4
5
6
7
8
9
10
Passive
Magnetic
Sensor
11
In+
In
Shield
12
13
14
15
J24
1
2
3
4
6
7
10
11
12
10
13
11
14
15
16
12
Optional
Termination
Resistor
J29
16
Figure 76
2381S2 PI Baseplate Passive Magnetic Sensor Connection
155
Connecting an Active Open-Collector Sensor with an Internal Resistor

Active
OpenCollector
Sensor
J26
V+
In+
In
Shield
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Figure 77
J25
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
13
14
15
Internal
Pull-Up
Resistor
Jumper
16
17
18
19
20
21
22
23
24
J30
32
2381S2 PI Baseplate Active Open-Collector Sensor with an Internal Resistor Connection
Connecting an Active Open-Collector Sensor with an External Resistor

J26
17
18
19
20
Active
OpenCollector
Sensor
21
V+
In+
In
Shield
22
23
24
25
26
27
28
29
30
31
32
Figure 78
J25
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
13
14
15
16
17
18
19
20
External
Pull-Up
Resistor
21
22
23
24
J30
2381S2 PI Baseplate Active Open-Collector Sensor with an External Resistor Connection
156
Chapter 2
System Description
Connecting an Active Sensor

J26
17
18
19
20
21
22
23
24
25
26
27
V+
In+
In
Shield
Active
Sensor
28
29
30
31
32
Figure 79
J25
17
18
19
13
20
14
21
15
22
16
23
17
24
18
25
19
26
20
27
21
28
22
29
23
30
24
31
32
J30
2381S2 PI Baseplate Active Sensor Connection
Terminal Blocks
The Model 2381S2 PI Baseplate has three types of terminal blocks: configuration, sensor, and
resistor.
The configuration block is used to select passive or active magnetic sensors and to
select an internal pull-up resistor when using an active open-collector sensor.
The sensor block is used to connect sensors to the baseplate.
The resistor block is used to attach a user-supplied termination resistor for passive
sensors, or a user-supplied pull-up resistor for an active open-collector sensor.
The Model 2381S2 PI Baseplate is factory-configured with the configuration blocks set to
differential mode for each point. The sensory blocks are configured to no points (spare) with the
inputs shorted together. When a point is selected for use, the installed jumpers should be moved
or removed as appropriate.
157
Model 2381S2 PI Baseplate Terminal Block Pin-Out Information

This table contains pin-out information for the Model 2381S2 PI Baseplate terminal block.
Configuration
J23/J26 Signal
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
V+
12
17
22
28
R+
13
18
23
29
FE
14
19
24
30
IN1
15
20
25
31
FE
10
16
21
26
32
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
V+
13
17
23
29
IN+
14
18
24
30
IN
15
19
25
31
Shield
10
16
20
26
32
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
V+
13
17
22
IN+
10
14
18
23
IN+
11
15
19
24
IN
12
16
20
25
Sensor
J24/J25 Signal
Resistor
J29/J30 Signal
158
Chapter 2
System Description
PI Hazardous Location Baseplate

This figure depicts a front view of the Model
2381AS2 PI Hazardous Location Baseplate.
159
This figure is a simplified schematic of the Model 3382S2 PI Module and the Model 2381AS2 PI
Hazardous Location Baseplate.
PI Hazardous Location Baseplate
6-Point PI Module
Module Field Power
Field Power (PS1) +

Field Power (PS2) +
J29
J24
J23
1
499 :
R+
Comparator
1
FE
To
Spare
IN+
2
Comparator
4
IN-
4
5
FE
4
Shield
Comparator
499 :
1
6
Field Power (PS1)

Field Power (PS2)
Figure 80
To
Other
Points
3382S2 PI Module and 2381AS2 PI Hazardous Location Baseplate Schematic
160
Chapter 2
System Description
This table describes cable and load parameters for the Model 2381AS2 PI Hazardous Location
Baseplate.
Table 38
Cable and Load Parameters for Baseplate 2381AS2
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
4 F to 158 F (20 C to 70 C)
Working voltage
Uw
Uw
19 to 28 V
Maximum voltage
Um
Um
32 V
Input Connection (In+ In) Specifications
Uo
Voc
32 V
Io
Isc
2.13 mA
Po
Po
0.068 W
C external, maximum
Co
Ca
550 nF
L external, maximum
Lo
La
0.99 mH
161

This figure depicts typical field connections for the Model 2381AS2 Hazardous Location PI
Baseplate.
Note
Unused points must be terminated.

+24 V #1
+24 V #2
24 V Return
Safety
1
2
3
4
5
6
7
J23
Configuration Block
8
9
10
11
12
J24
Sensor Block
13
14
15
1
2
3
4
J29
Resistor Block
10
11
12
10
13
11
14
12
15
16
16
17
18
19
20
21
J26
Configuration Block
22
23
24
25
J25
Sensor Block
26
27
28
29
30
31
32
Figure 81
18
19
13
20
14
21
15
22
16
23
17
24
18
25
19
26
20
27
21
28
22
29
23
30
24
31
32
J30
Resistor Block
~~~~
17
2381AS2 PI Hazardous Location Baseplate Typical Field Connections
162
Chapter 2
System Description
Connecting an Unused Point

J23
J24
1
3
4
5
6
7
8
9
10
11
12
13
14
15
16
6
7
10
11
12
10
13
11
14
15
16
Figure 82
12
J29
2381AS2 Hazardous Location PI Baseplate Unused Point Connection
Connecting a Passive Magnetic Sensor

J23
1
2
3
4
5
6
7
8
9
10
Passive
Magnetic
Sensor
11
In+
In
Shield
12
13
14
15
16
Figure 83
J24
1
2
3
4
6
7
10
11
12
10
13
11
14
15
16
12
Optional
Termination
Resistor
J29
2381AS2 Hazardous Location PI Baseplate Passive Magnetic Sensor Connection
163
Terminal Blocks
The Model 2381AS2 Hazardous Location PI Baseplate has three types of terminal blocks:
configuration, sensor, and resistor.
The configuration block is used to select passive or active magnetic sensors and to
select an internal pull-up resistor when using an active open-collector sensor.
The sensor block is used to connect sensors to the baseplate.
The resistor block is used to attach a user-supplied termination resistor for passive
sensors, or a user-supplied pull-up resistor for an active open-collector sensor.
The Model 2381AS2 Hazardous Location PI Baseplate is factory-configured with the

configuration blocks set to differential mode for each point. The sensory blocks are configured
to no points (spare) with the inputs shorted together. When a point is selected for use, the
installed jumpers should be moved or removed as appropriate.
164
Chapter 2
System Description
Model 2381AS2 Hazardous Location PI Baseplate Terminal Block Pin-Out

Information
This table contains pin-out information for the Model 2381AS2 Hazardous Location PI
Baseplate terminal block.
Configuration
J23/J26 Signal
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
R+
13
18
23
29
FE
14
19
24
30
IN1
15
20
25
31
FE
10
16
21
26
32
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
IN+
14
18
24
30
IN
15
19
25
31
Shield
10
16
20
26
32
Point 1
Point 2
Point 3
Point 4
Point 5
Point 6
IN+
10
14
18
23
IN+
11
15
19
24
IN
12
16
20
25
Sensor
J24/J25 Signal
Resistor
J29/J30 Signal
Solid-State Relay Output Components
165

These Solid-State Relay Output components are available with Tri-GP v2.x systems.
Model
Description
Voltage
Type
3451S2
24 VDC
Commoned, in groups of 2
2451S2
Solid-State Relay Output Baseplate
Direct Termination
The Solid-State Relay Output (SRO) Module is a non-triplicated module for use on non-critical
points which are not compatible with high-side, solid-state output switches; for example,
interfacing with annunciator panels. The SRO Module receives output signals from the Main
Processors on each of three channels. The three sets of signals are then voted, and the voted data
is used to drive the 32 individual relays. Each output has an I/O loop-back circuit which verifies
the operation of each relay switch independently of the presence of a load. Ongoing diagnostics
test the operational status of the SRO Module.
The SRO Module supports hot sparing for online replacement of a faulty module or continuous
back-up to an active module. The SRO Module is mechanically keyed to prevent improper
installation in a configured baseplate.
SRO Module Schematic

This figure is a simplified schematic of the Model 3451S2 SRO Module.
Triplicated
I/O Bus
I/O Controller(s)
Field Circuitry Typical Point (2 of 32)
C1
A
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
Isolated
Bus
Transceiver
ASIC
ASIC
Com
C2
Figure 84
3451S2 SRO Module Simplified Schematic
166
Chapter 2
System Description
This table lists specifications for the Model 3451S2 SRO Module.
Table 39
3451S2 SRO Module Specifications
Feature
Specification
Points
32, commoned in pairs
24 V
30 V
Maximum switching voltage
33 V peak
Maximum switching power
15 W resistive
Maximum off-state leakage
<100 A
Maximum nominal current
0.5 A per channel
Maximum over current
0.7 A per channel
Voltage drop at baseplate
<0.25 V @ 0.5 A
Fuses, mounted on baseplate
1 per output, 0.75 A, fast-acting
500 VDC, minimum
800 VDC, minimum
167
SRO Baseplate
Model 2451S2 SRO Module Baseplate.
168
Chapter 2
System Description
This figure is a simplified schematic of the Model 3451S2 SRO Module and Model 2451S2 SRO
Baseplate.
32-Point RO Module
RO Baseplate
Blown
Fuse
Indicator
C1
Fuse
750 mA
Com
Blown
Fuse
Indicator
C2
Fuse
750 mA
Figure 85
3451S2 SRO Module and 2451S2 SRO Baseplate Schematic
169

This figure depicts typical field connections for the Model 2451S2 SRO Baseplate.
Note
Points on left terminal blocks are commoned together in pairs; for example, 1-2 and 3-4.
Safety
DC Power
Supply
1
2
3
4
5
Field
Load 2
Field
Load 1
6
7
8
9
10
DC Power
Supply
11
12
13
14
15
16
Field
Load 2
Field
Load 1
17
18
19
20
AC Power
Supply
AC Power
Supply
Field Load 1
22
23
21
Field Load
2
Field Load 1
24
25
26
27
28
29
30
Field Load
2
31
32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
~
Figure 86
2451S2 SRO Baseplate Typical Field Connections
170
Chapter 2
System Description
Interconnect Assemblies
These interconnect assemblies are available.
Model
Description
2920
2921
Interconnect Assemblies consist of a passive PCB in a molded plastic housing with two DIN-C
96-pin male connectors which enables I/O messages, logic power, and system power to be
carried from one baseplate to the next. For connections between I/O Baseplates, the I/O
Interconnect Assembly is used. For connections between an MP Baseplate and either an I/O or
CM Baseplate, the MP Interconnect Assembly is used which also carries communication
messages between the CM and MP Baseplates.
Each MP Baseplate assembly includes one MP Interconnect Assembly.
Each I/O Baseplate assembly includes one I/O Interconnect Assembly.
For installation procedures, see Connecting Columns with I/O Extender Modules on page 192.
Figure 87
2920 MP Interconnect Assembly and 2921 I/O Interconnect Assembly
I/O Extender Modules
171

These I/O Extender Modules Kits are available with Tri-GP v2.x systems.
Model
Description
2281
I/O Extender Module Kit (without termination)
2291
I/O Extender Module Kit for I/O Baseplate (with termination)
2292
I/O Extender Module Kit for MP Baseplate (with termination)
I/O Extender Modules are used to extend the I/O bus from one column to another, provide I/O
bus termination, provide additional input terminals for I/O module logic power, and provide
a protective earth (safety ground) connection. For installation procedures, see Connecting
Columns with I/O Extender Modules on page 192.
Figure 88
I/O Extender Module
An I/O Extender Module includes three DB-9-pin I/O bus connectors, two 24-volt logic power
input terminal blocks, each with fuse and blown-fuse indicators, and one protective earth
terminal block. This table identifies specifications for the logic power.
Table 40
Logic Power Specifications for I/O Extender Modules
Feature
Specification
Logic power
125 W maximum
Fuse
8 A, slow-acting
Blown fuse indicator
20 mA
172
Chapter 2
System Description
I/O Bus Cables

An I/O Bus Cable set includes three I/O bus extension cables, which can be from 2 feet
(.6 meters) to 650 feet (200 meters) in length. The terminators should be installed on the open
I/O bus connectors on the I/O Extender Modules at each end of the I/O bus.
For distances greater than 650 feet (200 meters) or for applications requiring isolation, fiberoptic transceivers are commercially available. For compatible units and supported distances,
contact the Invensys Global Customer Support (GCS) center.
I/O Bus Terminators

I/O Bus Terminators plug into the open connectors on I/O Extender Modules and provide a
known electrical load. The terminators consist of male 9-pin D connectors with two 120-ohm
resistors mounted in the boot (or shell) of the connector.
To maintain acceptable signal integrity when the I/O bus exceeds 20 feet (6 meters), you must
install terminators on both ends of the I/O bus. Invensys part number 3900064-003 is a set of
three terminators.
If your I/O bus length is less then 20 feet (6 meters), no terminators are required.
Figure 89
I/O Bus Terminator
End Caps
173
End Caps
These End Caps are available.
Model
Description
2910
I/O Baseplate/I/O Extender Module Top
2911
I/O Baseplate/I/O Extender Module Bottom
2912
MP Baseplate Top
2913
MP Baseplate Bottom
End Caps are used to protect the top and bottom of each end-of-column baseplate, cover the
Interconnect Assembly, and serve as a baseplate guide.
MP Baseplate End Caps

This figure depicts the MP Baseplate top and bottom end caps.
Bottom End Cap
Top End Cap
Figure 90
MP Baseplate End Caps
I/O Baseplate and I/O Extender Module End Caps

This figure depicts the I/O Baseplate and I/O Extender Module top and bottom End Caps.
Top End Cap
Figure 91
Bottom End Cap
I/O Baseplate and I/O Extender Module End Caps
174
Chapter 2
System Description
Covers
These covers are available.
Model
Description
2900
Slot Cover
2911
Terminal Cover
Covers minimize exposure to dust, dripping and splashing liquids, and corrosive atmospheres.
One Slot Cover and one Terminal Cover are included with each I/O Baseplate.
Slot Cover
Figure 92
Terminal Cover
Slot Cover and Terminal Cover
3
System Configuration 176

Installation Guidelines 179
Component Installation 185
Controller Grounding 198
Implementation and Maintenance 204
Module Replacement 207
176
Chapter 3
This section includes configuration information and guidelines for a Tri-GP system.
Topics include:
System Specifications on page 176
Determining Logic Power on page 177
General Cooling Guidelines on page 177
Determining Cooling Requirements on page 177
System Specifications
This table includes specifications for determining the number and types of components that can
be installed in a Tri-GP v2.x system.
Table 41
Tri-GP v2.x System Specifications
Component
Quantity
I/O baseplates, maximum
25 (requires TriStation 1131 v4.5

software or later)
Number of baseplates on column, maximum
Length of I/O bus, maximum
650 feet (200 meters)
Communication components, maximum
1 CM baseplate and 2 CMs
Analog Input points, maximum
416 (13 AI baseplates, 13 AI/DI

baseplates, or any combination that does
not exceed 416 total AI or AI/DI points)
Analog Output points, maximum
20 (5 baseplates)
Digital Input points, maximum
640 (20 DI baseplates, 13 AI/DI

baseplates, or any combination that does
not exceed 640 total DI points)
Digital Output points, maximum
320 (20 baseplates)
Pulse Input points, maximum
30 (5 baseplates)
Solid-State Relay Output points, maximum
640 (20 baseplates)
Interconnect Assemblies, maximum
32
177
Determining Logic Power

Logic power refers to the maximum power needed to power all the modules in the system. This
calculation is based on the assumption that only one of the redundant power sources is
operational. Under normal operating conditions, both power sources share the load.
This table can be used as a worksheet to determine the maximum logic power needed. To do so:
Enter the number of Communication Modules and I/O modules, including hot-spare
modules.
Multiply the number of modules by the maximum logic power for the type.
Add the logic power by type to get the total power requirement for the system.
Maximum Logic
Power (Watts)a
Module
Main Processor
Communicationb
All I/O Modules including hotspare modules
Number of
Modules
Logic Power
by Type
24
Total Power Requirement

a. To convert watts to British thermal units: BTU = watts x 3.414.
b. Without MAU connections.
General Cooling Guidelines

Adequate convection or forced-air cooling should be provided. These general guidelines can be
used for typical environments where the maximum ambient temperature is 120 F (50 C) with
20 C internal temperature rise.
In sealed environments, the external surface area of the enclosure should be at least
0.009 m2/watt.
In vented environments, the internal air flow should be at least 7 m3/watt. Air flow
should be directed to flow into vents at the bottom of the enclosure (for example, a vent
at the bottom of the door) and to exit at the top of the enclosure (for example, a pagoda
top).
For maximum reliability of the system, the average ambient temperature should be
below 120 F (50 C).
Determining Cooling Requirements

This table can be used to determine the total heat dissipation, which is the total logic and field
power used by the modules in the system. To do so:
Multiply the number of modules (primary and hot-spares) by the maximum logic
power to get the logic power by module type.
178
Chapter 3
Multiply the number of modules by the maximum field power to get the field power by
module type.
Add the field power and logic power by module type to get the total power
requirement for the system.
Maximum
Logic Power
(Watts)a
Maximum
Field Power
(Watts)
Main Processor; 3101S2
Communicationc; 3201S2
Analog Input; 3351S2
Analog Input/Digital Input;

3361S2
Analog Output; 3481S2
Analog Output; 3482S2
Digital Input; 3301S2, 3311S2
Digital Output; 3401S2
Digital Output; 3411S2
20
Pulse Input; 3382S2
Solid-State Relay Output;

3451S2
Module
Logic
Power by
Module
Field
Power by
Module
Total Heat Dissipation

a. To convert watts to British thermal units: BTU = watts x 3.414
b. Means not applicable or negligible.
c. Does not include MAU connections.
Logic
and Field
Power
Installation Guidelines
179
This section includes installation guidelines for the Tri-GP controller.
Topics include:
General Installation Guidelines on page 179
Plant Power and Grounding on page 179
Tri-GP Field, Power, and Ground Wiring on page 180Tri-GP Field, Power, and Ground
Wiring on page 180
Application-Specific Installation Guidelines on page 182
General Installation Guidelines

Due to the critical applications the Tri-GP is typically used in, it has been designed to operate
under worst cases conditions in the harsh environments typically found in industrial
environments.
To ensure adequate operational margins are maintained even under these worst case
conditions, the Tri-GP should be installed in a controlled environment according to the general
guidelines contained in:
IEC 61131, Part 4, Programmable controllers, User Guidelines
Section 7 of this standard includes checklists to help control the following environmental
conditions:
Temperature
Contaminants
Shock and vibration
Electromagnetic interference
Typical guidelines include:
Locate the Tri-GP away from obvious sources of heat: space heaters, solar radiation, etc.
Locate or isolate the Tri-GP from obvious sources of corrosive gases or dust.
Locate or isolate the Tri-GP from obvious sources of shocks or periodic vibrations:
rotating machinery, engines, compressors, presses, etc.
Locate or isolate the Tri-GP from obvious sources of electromagnetic interference: large
motors or motor controllers, power converters, radio controlled equipment, welding
equipment, etc.
Plant Power and Grounding

All plant and control room power distribution and safety grounding (protective earthing) must
be done according to the applicable national electric codes. Typical examples include:
IEC 60364, Electrical Installations of Buildings
180
Chapter 3
National Fire Protection Association, 2002 Edition of the National Electrical Code Handbook
For new construction, or where simple retrofits are feasible, the plant and/or control room
safety grounding system should employ a supplemental Zero Reference Signal Plane or Grid
(ZRSG). Installation of such a system for the plant or control room is not required for a
successful Tri-GP application, but does represent modern best industry practice and should be
followed wherever possible. Even when not implemented at the plant or control room level, the
concepts of a modern ZRSG should be included in the Tri-GP cabinet and interconnecting cable
routing. The ZRSG implementation should be extended to include all equipment racks and
interconnecting cable paths: metal conduits, cable trays, wireways, etc. Detailed installation
guidelines can be found in:
EPRI TR- 102400, Volume 2, Handbook for Electromagnetic Compatibility of Digital

Equipment in Power Plants, Implementation Guide for EMI Control
IEC 61000, Part 5, Section 2, Electromagnetic compatibility (EMC), Installation and

mitigation guidelines, Earthing and cabling
IEEE Std 1100-1999, IEEE Recommended Practice for Powering and Grounding
Electronic Equipment
Tri-GP Field, Power, and Ground Wiring

All Tri-GP power distribution and safety grounding (protective earthing) must be done
according to the applicable national electric codes and the information contained in this manual.
Typical examples include:
National Fire Protection Association, 2002 Edition of the National Electrical Code Handbook
IEC 60364, Electrical Installations of Buildings
Typically, the Tri-GP is installed in an equipment rack, cabinet, or wall-mounted box located in
a control or equipment room. All wiring internal to that cabinet and leading to and from that
cabinet should be segregated into different types and bundled accordingly, for example:
Measurement and low-power analog control signals. These signals require shielded
twisted pair cabling.
24 VDC discrete signals. These signals require twisted pair cabling.
High-power control signals and conditioned power distributiontypically nonsensitive higher-voltage signals: 48-120 V discrete signals, 24-120 VDC I/O power
distribution, and so on. These signals should always use twisted pair cabling.
Input coming power and miscellaneous circuitstypically noisy, higher power circuits:
115 VAC discrete signals, AC power distribution, cabinet fans or lights, and so on.
These signals should always use twisted-pair cabling, and the Grounding Electrode
Conductor (the green wire) should be twisted along with the power leads, wherever
possible.
Earth bonding connections.
181
All cable routing and installation should be done to minimize EMI, detailed guidelines can be
found in:
EPRI TR- 102400, Volume 2, Handbook for Electromagnetic Compatibility of Digital
Equipment in Power Plants, Implementation Guide for EMI Control
IEC 61000-5-2, Electromagnetic compatibility (EMC), Installation and mitigation guidelines,
Earthing and cabling
IEEE Std 1100-1999, IEEE Recommended Practice for Powering and Grounding Electronic
Equipment
Typical guidelines include the following:
Use ferrous metal cabinets, cable trays, and conduits.
Electrically bond all surfaces of the cabinet and it's contents together with multiple
conductive metal strapping, not simple wire. Particular attention should be paid to
doors, and removable panels. In turn the cabinet must be bonded to the control room or
plant safety ground system or ZRSG.
Routinely use twisted pair cabling, use shielded twisted pair cabling for all sensitive
signals. Allow the minimum amount of un-twisted wire that accommodates
connection.
Signals of different types should never be bundled together.
Bundles of different types should be separated by a minimum of 10 times the largest

lead diameter.
Bundles of different types of signals should only cross at right angles to each other.
All wires and/or bundles should be routed along the ZRSG, for example along the
along the cabinet walls, within a cable tray or conduit, along building steel or the floor
ground grid.
Where an inline filter or power conditioning is used, the input and output leads should
never be routed in the same bundle.
Maintain shield continuity and ensure that shield leads are not broken. Allow the
minimum amount of unshielded wire that accommodates connection. Terminate the
shield at both ends, use capacitive coupling at one end if potential ground loops are
suspected.
Where ferrites or line filters are to be installed on signals or cables entering or leaving
the cabinet, they must be installed as close to the cabinet egress point as possible.
Cables must be routed to minimize coupling between the filtered and non-filtered
signals. The non-filtered wire lengths in the cabinet must be minimized to the
maximum extent possible.
Note
To comply with standards related to conducted disturbance, a Schaffner FN 2410 line

filter, or equivalent, must be installed between power supplies and baseplates.
182
Chapter 3
Application-Specific Installation Guidelines

The following guidelines apply when installing the Tri-GP in application-specific locations.
Class 1 Division 2 Hazardous Locations

For North American hazardous location applications, the Tri-GP and associated equipment
must be mounted in an enclosure that provides protection from fire and from personal injury
resulting from access to live parts. The enclosure must require access via a tool, and if nonmetallic, have the appropriate flammability rating.
The replacement of fuses, I/O Modules, Main Processors, Power Modules, Communications
Modules, HART Multiplexers, or I/O Interconnects must not be attempted unless the area is
known to be free of ignitable gas concentrations.
All cabling connected between the Hazardous Location Baseplates and External Termination
Panels (ETPs) must be nonincendive as described in Appendix B, Non-Incendive Circuit
Parameters. Communication cabling that extends through a hazardous area must be certified as
being nonincendive.
Only these modules and baseplates, which are approved for use in Class 1 Division 2 hazardous
locations, can be used:
2201S2 Communication Baseplate
2281 I/O Extender Module Kit (without termination)
2291 I/O Extender Module Kit for I/O Baseplate (with termination)
2292 I/O Extender Module Kit for MP Baseplate (with termination)
2301S2 Digital Input Baseplate
2302S2 Digital Input External Termination Baseplate and Solid State Relay Input
2351S2 Analog Input Baseplate
2352S2 Analog Input External Termination Baseplate
2354AS2 Analog Input HART Hazardous Location Baseplate
2361S2 Analog Input/Digital Input Baseplate
2381S2 Pulse Input Baseplate
2401S2 Digital Output Baseplate
2401LS2 Digital Output Baseplate (low current)
2402S2 Digital Output External Termination Baseplate and Relay Output External
Termination Panel
2451S2 Solid-State Relay Output Baseplate
2481S2 Analog Output Baseplate
2483AS2 Analog Output HART Hazardous Location Baseplate
3101S2 Main Processor
3201S2 Communication Module
3301S2 24V Digital Input Module
3311S2 Digital Input Module, High Resolution
3351S2 Analog Input Module
3361S2 Analog Input/Digital Input Module
3382S2 Enhanced Pulse Input Module
3401S2 24VDC Digital Output Module
3411S2 Digital Output Module, Supervised
3451S2 Solid-State Relay Output Module
3481S2 Analog Output Module
3482S2 High-Current Analog Output Module
9764-510F RTD/TC/AI Termination Panel
WARNING
183
You must take additional explosion protection measures for field circuits
when the field apparatus are in a hazardous area.
Zone 2 European Hazardous Locations

For European (ATEX) hazardous location applications, the Tri-GP and associated equipment
must be installed in an enclosure that provides an IP54 minimum degree of protection per the
requirements of EN 60529, Specification of protection provided by enclosures (IP Code). Simply
stated, the enclosure must provide protection against dust and splashing water.
Additionally, the enclosure must meet the applicable requirements of EN 60079-15 or EN 50021.
The following points must be taken into account:
Mechanical strength
Non-metallic enclosures and non-metallic parts of enclosures
Earthing or equipotential bonding connection facilities
The ambient temperature range for European (ATEX) hazardous location applications is:
4 F Ta 158 F (20 C Ta 70 C)
The following warning label must be placed on the outside of the Tri-GP system enclosure:
DO NOT REMOVE OR REPLACE MODULES OR CABLES WHILE ENERGIZED UNLESS THE
AREA IS KNOWN TO BE FREE OF IGNITABLE GAS CONCENTRATIONS.
The replacement of fuses, I/O Modules, Main Processors, Power Modules, Communications
Modules, HART Multiplexers, or I/O Interconnects must not be attempted unless the area is
known to be free of ignitable gas concentrations.
All connecting screws must be securely tightened, so that loosening and separating are
prevented.
184
Chapter 3
Male ELCO connectors must have a gasket installed, and it must be replaced before the end of
its five-year life span. (Invensys part number 3000793-001 is a kit containing 25 gaskets.)
All cabling connected between the Hazardous Location Baseplates and External Termination
Panels (ETPs) must be nonincendive as described in Appendix B, Non-Incendive Circuit
Parameters. Communication cabling that extends through a hazardous area must be certified as
being nonincendive.
Only these modules and baseplates, which are approved for use in Zone 2 hazardous locations,
can be used:
2101S2 Main Processor Baseplate
2201S2 Communication Baseplate
2281 I/O Extender Module Kit (without termination)
2291 I/O Extender Module Kit for I/O Baseplate (with termination)
2292 I/O Extender Module Kit for MP Baseplate (with termination)
2302AS2 Digital Input External Termination Baseplate and Solid State Relay Input
2342AS2 Analog Input/Digital Input Baseplate Kit, Hazardous Location
2352AS2 Analog Input Baseplate Kit, Hazardous Location
2354AS2 Analog Input Baseplate Kit, HART, Hazardous Location
2381S2 Pulse Input Baseplate Kit
2381AS2 Pulse Input Hazardous Location Baseplate
2402AS2 Digital Output Baseplate Kit, Hazardous Location
2480AS2 Analog Output Baseplate Kit, Hazardous Location
2483AS2 Analog Output Baseplate Kit, HART, Hazardous Location
3101S2 Main Processor
3201S2 Communication Module
3301S2 24V Digital Input Module
3311S2 Digital Input Module, High Resolution
3351S2 Analog Input Module
3361S2 Analog Input/Digital Input Module
3382S2 Enhanced Pulse Input Module
3401S2 24VDC Digital Output Module
3411S2 Digital Output Module, Supervised
3481S2 Analog Output Module
9573-610F Digital Input Termination Panel Kit, Hazardous Location
9671-610F Digital Output Termination Panel Kit, Hazardous Location
9792-310F Analog Input Termination Panel Kit, Hazardous Location
Component Installation
185
9863-610F Analog Output Termination Panel Kit, Hazardous Location
When using the 2483AS2 Analog Output HART Hazardous Location Baseplate Kit, you must
use an external isolator, such as an MTL4546, to achieve Ex nL IIB T4 ATEX certification.
WARNING
You must take additional explosion protection measures for field circuits
when the field apparatus are in a hazardous area.
This section provides installation procedures for assembling the components in a Tri-GP
system. When unpacking materials, check the items against the shipping list to verify that
everything ordered is included. Keep the boxes and packing materials in case you need to return
items to Invensys.
Topics include:
Mounting a Panel on page 185
Installing Baseplates on a Column on page 191
Connecting Columns with I/O Extender Modules on page 192
Installing Modules on Baseplates on page 195
Installing the Module Address Plug on page 196
Installing Other Components on page 197
Enclosing the Controller on page 197
Mounting a Panel
The Tri-GP system is mechanically packaged into functional units that are aligned on DIN rails
on a panel mount. Each unit comprises one or more modules connected to a baseplate.
Baseplates are installed on a DIN rail to form vertical columns. Each rail can support up to eight
units, which are linked by MP Interconnect and I/O Interconnect Assemblies. Additional rails
can be connected in a daisy-chain fashion by using I/O Extender Modules.
These are guidelines for mounting components:
All assemblies should be mounted on a 12-gauge (or heavier) steel panel aligned
vertically using DIN 50 022-compatible rails.
All DIN system and field power supplies should be mounted on horizontal DIN 50 022compatible rails. DIN rails should be mounted on a 12-gauge (or heavier) steel panel.
The DIN rails and baseplate assemblies should be located on the panel to allow for the
installation of wiring channels (for example, Panduit) along the left side of vertical
columns and along the bottom of horizontal rails.
Clearance should be provided for adequate air flow around system modules.
186
Chapter 3
For typical environments, there should be at least 5 inches (15 centimeters) of clearance
between active modules and the walls of the enclosure.
For detailed specifications, see:
Mounting Panel Drill Template on page 186
Baseplate and Module Depth Dimensions on page 188
MP Baseplate Dimensions and Clearances on page 189
I/O Baseplates Dimensions and Clearances on page 190
I/O Extender Modules Dimensions and Clearances on page 191
Mounting Panel Drill Template

This figure shows where the mounting holes should be located on the panel.
187
DIN Rail
Tap, #10-32
MP or CM Baseplate
Number Equal Spaces

@ 9.84 in. = 39.50 in.
252.6 mm = 1002.2 mm
Ref
39.30 in.
995.7 mm
Ref for
5 Baseplates
As Illustrated
I/O Module Baseplate
2.50 in.
63.5 mm
7.30 in.
185.4 mm
Extender Module Baseplate
3.29 in.
83.6 mm
6.56 in.
166.6 mm
2.50 in.
63.5 mm
* Typical, non-accumulating
1.25 in.
31.8 mm
Ref
8.56 in.
217.4 mm
Figure 93
Mounting Panel Drill Template
188
Chapter 3
Baseplate and Module Depth Dimensions

This figure shows the depth dimensions for a baseplate and module, which is 7.10 inches
(18.03 cm). Vertically mounted I/O baseplates measure approximately 7.00 inches (17.78 cm)
wide by 9.79 inches (24.87 cm) long.
Figure 94
Baseplate and Module Dimensions
189
MP Baseplate Dimensions and Clearances

This figure shows dimensions and clearances for MP Baseplate installation. The vertically railaligned MP Baseplate measures approximately 9 inches wide by 9.79 inches long per logical slot.
9.02 in.
229.1 mm
9.76 in.
247.9 mm
7.30 in.
185.4 mm
8.53 in.
216.7 mm
1.23 in.
31.2 mm
8.56 in.
217.4 mm
0.23 in.
5.8 mm
3.29 in.
83.6 mm
3.52 in.
89.4 mm
C
L
Figure 95
MP Baseplate Dimensions and Clearances
190
Chapter 3
I/O Baseplates Dimensions and Clearances

This figure shows dimensions and clearances for I/O Baseplate installation.
7.02 in.
166.7 mm
7.30 in.
185.4 mm
9.76 in.
247.9 mm
8.53 in.
216.7 mm
1.23 in.
31.2 mm
6.56 in.
166.7 mm
0.23 in.
5.8 mm
3.29 in.
83.6 mm
3.52 in.
89.4 mm
C
L
Figure 96
I/O Baseplate Dimensions and Clearances
191
I/O Extender Modules Dimensions and Clearances

This figure shows dimension and clearances for I/O Extender Module installation.
1.23 in.
31.2 mm
1.23 in.
31.2 mm
6.56 in.
166.7 mm
Figure 97
0.23 in.
5.8 mm
I/O Extender Module Dimensions and Clearances
Installing Baseplates on a Column

This procedure explains how to install baseplates on a column.
Procedure
1
On a mounting panel, locate, drill, and tap mounting holes. For specifications, see
Mounting Panel Drill Template on page 186.
Install the DIN rail according to the manufacturers instructions.
Install the first baseplate, which is typically either the MP or CM Baseplate. The CM
Baseplate must be directly above or below the MP Baseplate.
Use four #10 mounting screws with flat and lock washers and positioning the baseplate
along the DIN rail so that the mounting screws are centered in the oblong mounting
holes. Tighten the screws to 16 inch-pounds of torque.
Install the next baseplate either at the top or bottom of the previous baseplate. Use four
#10 mounting screws with flat and lock washers and positioning the baseplate along the
DIN rail so that the mounting screws are centered in the oblong mounting holes. Do not
tighten the screws.
Attach an Interconnect Assembly between the two baseplates, allowing the second
baseplate to move until the Interconnect Assembly snaps into place.
For baseplates next to an MP Baseplate, use an MP Interconnect Assembly.
For baseplates next to an I/O Baseplate, use an I/O Interconnect Assembly.
Tighten the mounting screws on the second baseplate to 16 inch-pounds of torque.
Install additional baseplates and interconnect assemblies.
192
Chapter 3
Interconnect Assembly
Screws
(4 places)
Baseplate
Screws (4 places)
End Cap
Connecting Columns with I/O Extender Modules

This procedure explains how to use I/O Extender Modules to connect a column of baseplates to
another column, which is required if the system includes more than eight baseplates or more
than one column. I/O Extender Modules are used to extend the I/O bus from one column to
another. Logic power also may be connected through the I/O Extender Module.
Procedure
1
Determine the length of the I/O bus by adding these dimensions:
The length between the top and bottom of the first column and the top and bottom
of the second column
The length of the I/O Interconnect Modules
The length of the cable between the columns
If the length does not exceed 20 feet (6 meters), go to step 3. If it does, go to step 4.
If the length does not exceed 20 feet (6 meters), do this:
Install an I/O Extender Module at the top or bottom of each column, depending on
where you want the cables to be.
Connect the cables between the two I/O Extender Modules as shown in this figure.
193
If there are additional columns, repeat the steps.
194
Chapter 3
If the length exceeds 20 feet (6 meters), do this:
Install an I/O Extender Module at the top or bottom of each column, depending on
where you want the cables to be.
Connect the cables between the two I/O Extender Modules.
Install an I/O Extender Module at the other end of each column and insert an I/O
bus terminator (male 9-pin D connector) to each connection, as shown in this figure.
Note
To maintain acceptable signal integrity when the I/O bus exceeds 20 feet (6
meters), you must install terminators on both ends of the I/O bus. Invensys part
number 3900064-003 is a set of three terminators.
DB-9 Plug with Terminator
If there are additional columns, repeat the procedure as needed.
195
Installing Modules on Baseplates

This procedure explains how to install a module on a baseplate. Each baseplate is keyed to allow
only modules appropriate for the baseplate. For MP Baseplates, there are three slots. For
Communication and I/O modules, there are two slots for modules.
Procedure
1
Seat a module on its corresponding baseplate.
Turn the lock lever manually 90 to 180.
Insert a 1/4 inch flat-blade screwdriver into the lock and turn clock-wise to the locked
position (360).
Typically, 25 in./lbs. of torque are required to rotate the lock lever.
When the module is installed, the Fault indicator goes on while the diagnostics are
running. At the same time, the Point indicators go on briefly, go off, then resume the
normal state of blinking. The Pass Indicator should go on within about one minute. If it
does not, and the Fault light persists longer than five minutes, check the diagnostic log
to determine if there is a problem.
Figure 98
Module Assembly on Baseplate
196
Chapter 3
Installing the Module Address Plug

This procedure explains how to install the address plug, which is a device that identifies the I/O
baseplate to the Main Processors. Each baseplate, except the Communication Module, must
have an address plug. Invensys includes a package of address plugs to be used with the I/O
baseplates.
Procedure
1
Insert the desired address plug on to the baseplate.
Do either of these:
Cycle power or re-install the module
Change the node address for the module in the TriStation 1131 project
This figure shows the general location of an address plug on a baseplate.
Figure 99
Address Plug Location
197
Installing Other Components

Interconnect Assemblies
Attach the appropriate interconnect assembly between baseplates.
Installing End Caps

Each end-of-column baseplate should be covered with an end cap to protect the top and bottom
of each end-of-column baseplate, cover the interconnect connector, and serve as a card guide.
Installing Slot Covers

Unused baseplate slots should be covered with a Slot Cover to minimize exposure to dust,
dripping and splashing liquids, and corrosive atmospheres.
Installing Terminal Covers

On I/O baseplates, field terminals should be covered with a Terminal Cover to minimize
exposure to dust, dripping and splashing liquids, and corrosive atmospheres.
Enclosing the Controller

After all of the components are mounted on a panel, the entire system should be installed in a
user-supplied metal enclosure with a sealed bottom and a closed door, connected to Safety
Ground.
Either of these can be used:
For a single column, a floor-mounted enclosure such as a Rittal cabinet.
For two or more columns, a wall-mounted enclosure such as a Hoffman box.
Note
To comply with the requirements of EN 54-2:1998, the Tri-GP system must be installed
in a metal enclosure connected to Safety Ground, and it must be installed in an area with
an access level greater than 2.
198
Chapter 3
Controller Grounding
This section includes information about grounding the controller.
WARNING
During installation of a Tri-GP controller, take special care with all power
sources to minimize the hazard of electrical shock.
Topics include:
Grounding Baseplates to Protective Earth on page 198
Grounding Logic Power on page 200
Grounding Field Power on page 201
Connecting Shields to Earth on page 202
Grounding Baseplates to Protective Earth

The Tri-GP system should be permanently connected to a protective earth to protect operations
and maintenance personnel from electrical shock, and to protect the system from damage or
malfunction caused by lightning or other electrical noise transients.
WARNING
Do not operate a Tri-GP system without connecting each baseplate to a

protective earth (AC safety ground) with a low-impedance cable. Improper
grounding creates the potential for dangerous electrical shockthe Tri-GP
controller can produce significant leakage currents which must be shunted to
earth.
To ensure that the Tri-GP controller and the equipment connected to it operate
safely, you should follow all applicable local and national codes and
standards. At a minimum, these include national fire and electrical codes.
Because codes and standards vary geographically and change over time, it is
your responsibility to determine which standards apply to your specific case
and to comply with them. If necessary, contact your local Fire Marshall and
Electrical Inspector for assistance.
199
Procedure
Connect each baseplate in the system to a common tie point, such as a copper bar, according to
the applicable electrical codes. The same copper bar can be used to provide a protective earth
connection for the field devices and wiring.
The wire should be heavy, solid or stranded, bare or insulated. A 12 AWG (3.3 mm2) wire is
adequate in most environments.
EM
CM
Typical
Ground
Connection
AI
6
MP
DI
1
1
Green/Yellow Wire
AI
DO
DI
RO
EM
Protective Earth
(Safety Ground)
200
Chapter 3
Grounding Logic Power

This procedure explains how to ground logic power. An independent power source, equipped
with its own fuse and switch, can be shared by all the baseplates in the system. You should
connect each baseplate to two independent power sources. In critical environments, at least one
power source should be an uninterruptible power supply (UPS). The UPS should be rated for
the total number of baseplates to be powered and for the duration of the maximum expected
down time.
The internal signal grounds (logic and field) are allowed to float with respect to the protective
earth (safety ground). In most installations, it is best to tie the signal ground and safety ground
together at one and only one point. In simple environments, logic and field power can be
combined and treated as one ground system. For more information, see Grounding Field Power
on page 201.
Procedure
Ground logic power from the MP and I/O Extender Modules in either of these ways:
Connect L
to protective earth
Connect L
to a DCS master reference ground or other quiet earth.

Power
Supply 1
+
L
Distribution
Block
at only one place for the entire system
Power
Supply 2
+
Power
Disconnect
Power
Disconnect
J5
Extender
DSP1
DSP2
DSP3
DSP4
MP
Baseplate
1
1
2
Protective Earth
(Safety Ground)
Typical I/O
Baseplate
201
Grounding Field Power

This procedure explains how to ground field power, which must be done for all I/O baseplates.
Multiple I/O modules can share a single set of power supplies, or each I/O module or group of
modules can use separate power supplies referenced to alternate grounds. For more
information, see Grounding Logic Power on page 200.
Procedure
Ground field power from the I/O Baseplates in either of these ways:
Connect L
to protective earth
power supplies.
Connect L
to a DCS master reference ground or other quiet earth.

Power
Supply 1
F
Distribution
Block
at only one place for each set of redundant field
Power
Supply 2
+
Power
Disconnect
Power
Disconnect
J5
Extender
1
2
Typical I/O
Baseplate
2
3
202
Chapter 3
Connecting Shields to Earth

This procedure explains how to connect shields to earth, which may be required for some field
input connections.
Procedure
1
Connect a cable shield at one end of the cable, typically the controller.
Make a connection near the termination panel using an external shield bus bar, which is
available from Phoenix Contact or other terminal block suppliers.
Individually connect each shield bus bar to a suitable, quiet ground point, such as a
dedicated protective earth or a DCS master reference ground.
~~
~
~
Typical Point
1
2
3
4
5
6
4-20 mA
Transmitter
~~
~
~
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Shield Bus Bar
29
30
31
32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Dedicated Shield Ground,

DCS Master Reference Ground
(Functional Earth), or
Protective Earth
203
Alarm Wiring
Each Main Processor Module includes two sets of redundant alarm contacts; each with a
normally closed contact and common.
Typically, alarm wiring is connected to a local or remote annunciator. These devices can be
wired in parallel with the alarm wiring so that the designated alarm goes off when either contact
signals an alarm condition.
The Program Alarm indicator is lit when the control program detects a specified condition and
sets the MP.SET_PROG_ALARM_ON attribute to True.
For a simplified schematic and specifications, see Alarm Connections on page 40.
DSP1
DSP2
NC
Load
24 VDC +
Power Source
Alarm 1
DSP3
FUSE
C
NC
24 VDC +
DSP4
FUSE
Alarm 2
Power Source
Figure 100
Alarm Wiring
204
Chapter 3
Implementation and Maintenance

This section includes information about implementation and maintenance that should be
considered when installing a Tri-GP system. To ensure maximum safety and long service,
Invensys recommends you establish a schedule for routine maintenance at the time that the
Tri-GP controller is installed and adhere to it.
Topics include:
Disabling Output Voter Diagnostics on page 204
Checking Controller Power Sources on page 205
Enabling Disabled Output Voter Diagnostics on page 205
Toggling Field I/O Points on page 206
Verifying Spare Modules on page 206
Disabling Output Voter Diagnostics

Output Voter Diagnostics (OVD) is a set of tests that detect failures in the quad-output voting
mechanism of Digital Output Modules except Relay Output Modules. Because of glitches
caused by forcing simulated failures, OVD may affect the controlled process. If this is not
acceptable, OVD can be disabled, but should be enabled every three months. To ensure safety,
you should analyze the sensitivity of each load device attached to the controller for proper
operation.
WARNING
A safety program may not disable the Output Voter Diagnostic.
Invensys guarantees that an OVD-forced glitch has the following duration:

Less than 2 milliseconds, which is a period that is tolerated well by electro-mechanical
devices such as relays, solenoids and contactors.
For assistance with load devices that might be sensitive to such glitches, please contact the
Invensys Global Customer Support (GCS) center.
Procedure
1
From TriStation 1131 software, disable OVD on all or on specific Digital Output
Modules. For instructions, see the guide for the version of TriStation 1131 software being
used.
Log the date when OVD was disabled so that OVD can be enabled and tested at a later
period. For information on OVD enabling, see Enabling Disabled Output Voter
Diagnostics on page 205
Implementation and Maintenance
205
Checking Controller Power Sources

Typically, Tri-GP controllers use redundant sources to power the controller and field circuitry.
Under normal operating conditions, the required power is shared between the two power
sources. Under abnormal conditions, one of the power sources may be required to provide 100
percent of the controller power. To verify the integrity of the power source and the Power
Modules, you must periodically test each power source for its ability to provide power for the
entire system when the redundant source is disabled.
This procedure explains how to test the power sources used for the controller. Ideally, this test
is performed when the controlled process is offlinefor example, during a normally scheduled
plant maintenance period.
Procedure
1
If possible, take the control process offline.
Every three to six months, turn off one of the power sources and leave it off for several
minutes.
After restoring power, repeat the test for the other power source.
Turn on both power sources prior to restarting the controlled process.
Enabling Disabled Output Voter Diagnostics

This procedure explains how to enable disabled Output Voter Diagnostics (OVD) tests used
by Digital Output Modules. In some systems, these diagnostic can cause glitches that affect the
controlled process. If OVD has been disabled, it should be enabled periodically.
CAUTION
Invensys does not recommend running with OVD disabled for periods
greater than three months.
Procedure
1
Ensure the controlled process is shut down. (Do not stop the TriStation 1131 application
from running.)
In TriStation 1131 software, go to the Controller Panel and enable the disabled OVD
points or modules.
Leave OVD enabled for several minutes to verify the stability of the modules.
This action provides 100 percent failure detection for all components.
If required, disable OVD.
206
Chapter 3
Toggling Field I/O Points

During a normally scheduled plant maintenance period, you should toggle the field points from
the normal operational state to the opposite state to guarantee complete fault coverage of the
digital circuitry. Leave each point in the opposite state for several minutes. Ideally, this type of
testing is performed with the controlled process offline. For instructions, see the TriStation 1131
Developers Guide.
Verifying Spare Modules

The controller automatically tests all modules installed in the system. The only action needed to
guarantee the integrity of a spare module is to periodically install it in an online system. Spare
I/O modules should be installed as hot-spare modules because the controller automatically
shifts control between the active and hot-spare modules.
Control changes as follows:
Periodically, approximately once an hour
After a power failure
After an MP re-education
Spare MP and I/O modules that cannot be used as hot-spare modules should be periodically
rotated into an online system to ensure the integrity of spare inventory. A rotation schedule
should be established so that a spare module is not allowed to sit on the shelf more that six
months.
Module Replacement
207
Module Replacement
This section explains how to replace modules after a system has been installed.
Topics include:
Guidelines for Replacing Modules on page 207
Replacing a Communication Module on page 209
Replacing an I/O Module on page 210
Guidelines for Replacing Modules

Before installing any module, these guidelines should be observed.
WARNING
CAUTION
Wait until the Active indicator of the replaced module goes on, then
replace the second faulty module.
Inserting modules with damaged pins may cause the controller to

malfunction and may affected the controlled process. If the module has
damaged pins, return it to Invensys for repair.
If a controller has two faults, one in an MP and one in another type of module, replace
the MP first.
If an I/O module has a field fault and a module fault, resolve the field fault first. Before
replacing the I/O module, try clearing the fault by using the Diagnostic Monitor
(TriStation 1131 v4 software) or the Diagnostic Panel (TriStation 1131 v3 software). If
the I/O module fails to go to Pass or wont stay in Pass, replace it.
Before inserting any module into the baseplate, check for damaged pins. If damaged
pins are present, do not insert the module.
When replacing a module, you must use a 1/4 inch flat-blade screwdriver to lock or
unlock the module.
For optimal performance, store spare I/O modules in vacant slots of the controller as
hot-spare modules.
Store any remaining, unused modules in their original shipping cartons.
208
Chapter 3
Replacing a Main Processor Module

This procedure explains how to replace a Main Processor Module. Before replacing an MP,
verify that all I/O modules are locked.
CAUTION
After replacing an MP, allow the module to fully re-educate before

unlocking another MP. Never unlock more than one MP at a time.
Procedure
1
If the controlled process is online, verify that at least one MP has an Active indicator with
a blinking yellow light.
On the faulty module, use a 1/4 inch flat-blade screwdriver to rotate the lock lever
counter-clockwise until the module ejects from the baseplate.
Insert the replacement module and use the screwdriver to rotate the lock lever clockwise
to draw the module into the baseplate.
The following should occur:
The Pass indicator should go on and stay on within one to six minutes.
The Active indicator on the replacement module should blink at the same rate as
the other MP Modules within one to six minutes.
The Lock indicator goes off. (If the module is not properly seated, the Lock
indicator stays on and the Active indicator does not go on.)
For the faulty module, identify the model and serial numbers. Contact the Invensys
Global Customer Support (GCS) center to obtain a Returned Material Authorization
(RMA) number. Then return the module to Invensys for repair.
Module Replacement
209
Replacing a Communication Module

This procedure explains how to replace a Communication Module.
CAUTION
The CM does not have hot-spare capability which means communication

is disrupted while the module is being replaced.
Procedure
1
If possible, make a note of the diagnostic message, model, and serial numbers.
Detach all communication cables from the faulty module.
On the faulty module, use a 1/4 inch flat-blade screwdriver to rotate the lock lever
counter-clockwise until the module ejects from the baseplate.
Note
If communication has not been disrupted by the fault, removing the module
disrupts communication until the module is replaced. If redundant CM,
replacing the faulty module does not affect communication on this module.
Insert the replacement module and use the screwdriver to rotate the lock lever clockwise
to draw the module into the baseplate.
The following should occur:
The Pass indicator should go on and stay on within one minute.
The Active indicator should go on within one to two minutes.
The Lock indicator goes off. (If the module is not properly seated, the Lock
indicator stays on and the Active indicator does not go on.)
Re-attach all communication cables to the CM.
For the faulty module, identify the model and serial numbers. Contact the Invensys
Global Customer Support (GCS) center to obtain a Returned Material Authorization
(RMA) number. Then return the module to Invensys for repair.
210
Chapter 3
Replacing an I/O Module

This procedure explains how to replace an I/O module. If an I/O module has a field fault and
a module fault, the field fault should be resolved first.
You need a 1/4 inch flat-blade screwdriver to install the module.
Procedure
1
If two modules are installed and one has an Active indicator, remove the other (faulty)
module by turning the lock counter-clockwise with the screwdriver until the module
ejects from the baseplate. (If neither module has an Active indicator on, contact the
Invensys Global Customer Support (GCS) center.)
Install an identical type module in the empty slot and push the module in until it is
firmly seated. Turn the lock clockwise to lock the module on to the baseplate.
When the module is installed, the Fault indicator goes on while the diagnostics are
running. At the same time, the Point indicators go on briefly, go off, then resume the
normal state of blinking. The Pass Indicator should go on within about one minute. If it
does not, and the Fault light persists longer than five minutes, check the diagnostic log
to determine if there is a problem.
If the module is not properly seated, the Lock indicator stays on. The Active indicator
does not go on until the I/O module is properly seated and locked.
The Active indicator should go on within one to two minutes. Then the Active indicator
on the faulty module goes off. If the Active indicator on the newly inserted module does
not go on within five minutes, replace it with another module.
Identify the model and serial number of the faulty module. Contact the Invensys Global
Customer Support (GCS) center to obtain a Returned Material Authorization (RMA)
number. Then return the module to Invensys for repair.
4
Overview 212
Main Processor Indicators 213
Communication Module Indicators 218
Analog Input Module Indicators 221
Analog Input/Digital Input Module Indicators 224
Analog Output Module Indicators 227
Digital Input Module Indicators 230
Digital Output Module Indicators 233
Pulse Input Module Indicators 237
Solid-State Relay Output Module Indicators 240
212
Chapter 4
Overview
Indicators are lights on the front panel of each module that identify the state of each module.
Each module includes indicators that identify the general state of the module and other
indicators related to the function of the module.
CAUTION
The Tri-GP controller can be repaired while operating. However, the

integrity of the controller can only be assured if the operator follows
repair procedures correctly. If in doubt about the procedures, the
operator should take whatever steps are necessary to ensure the safety of
the plant and personnel, and then contact Invensys for assistance in
implementing the repair procedures.
The types of indicators include:
Status indicators which identify the processing state of the module. Each module
includes a Pass, Fault, and Active indicator.
A lock indicator which identifies whether the module is unlocked.
Mode indicators which identify the current operating state of the controller. (Only on
MP Modules.)
Field power and power load indicators which identify whether a power problem has
occurred. (Only on some I/O modules.)
Communication indicators which identify the type of communication occurring. (Only

on MPs and CMs.)
Points indicators which identify whether the point is energized.
Alarm indicators which identify alarm conditions for the controller. (Only on MP
Modules.)

Fault indicators identify potentially serious problems with a module. Alarm conditions identify
abnormal field conditions such as loss of power and loss of communication.
If a fault or alarm indicator is on, you should consult the appropriate section of this chapter and
take appropriate action. This action may include replacing a faulty module or repairing a faulty
circuit or device.
Identifying Fault and Alarm Conditions

You can identify alarm and fault conditions in these ways:
By examining the indicators on the front panel of each module and comparing the
indicators with the descriptions in this chapter
By using the Enhanced Diagnostic Monitor
Main Processor Indicators
213

This section describes indicators for the MP Module, including:
MP Status Indicators on page 214
MP System Mode Indicators on page 215
MP Alarm Indicators on page 216
MP Communication Indicators on page 217

Pass (Green)
PASS
MP Status
Indicators
Fault (Red)
FAULT
ACTIVE
Active (Yellow)
Remote Mode (Green)
MODE
REMOTE
System Mode
Indicators
Run Mode (Green)
RUN
Program Mode (Yellow)
PROGRAM
HALT
Halt Mode (Yellow)

Field Power (Red)
ALARMS
FIELD POWER
Alarm
Indicators
Logic Power (Red)
LOGIC POWER
System Alarm (Red)
SYSTEM ALARM
PROGRAM ALARM
Program Alarm (Blue)
OVER TEMPERATURE
Over Temperature (Red)
LOCK
Unlock (Red)
COMMUNICATIONS
IO BUS
COMM BUS
Communication
Indicators
SERIAL
TX
RX
TX
RX
TX
RX
LINK
TRISTATION
TX
RX
TX/RX I/O Bus (Green/Green)

TX/RX Communication Bus (Green/Green)
TX/RX Modbus (Green/Green)
Link TriStation(Green)
TX/RX TriStation (Green/Green)
MP3101S2
Figure 101
MP Front Panel Indicators
214
Chapter 4
MP Status Indicators
The MP status indicators identify the processing state for the MP Module.
A fault light indicates that the processor has an internal fault.
Normal States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Yellow
blinking
No
light
Module is operating normally.

Active indicator blinks once per
scan when executing a control
program.
Normal status. No action

is required.
Green
steady
No
light
No
light
No
light

Possible conditions include:
Control program has not been
loaded into the MP.
Load control program.
Control program has been

loaded into the MP, but has not
been started up.
Start control program.
Module has just been installed

and is currently being educated
by the other MP Modules.
Wait for the module to be

educated.
Fault States
Pass
Fault
Active
Lock
Description
Action
No
light
Red
steady
No
light
Module may have failed.

See mode indicator status

for power-up states.
Module may be in the process

of power-up self-test.
If the Pass indicator does

not go on within five
minutes, replace the
module.
Module has detected a fault.
Module is operational, but

should be replaced.
No
light
Red
steady
Red
steady
Module is unlocked from the

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
Indicators/signal circuitry on
the module are
malfunctioning.
Replace the module.
No
light
No
light
Indicators/signal circuitry on
the module are malfunctioning
Replace the module.
a. This symbol ( ) means the indicator is not important for this condition.
215
MP System Mode Indicators

The MP system mode indicators identify the current operating state of the controller.
(Operational modes are set in TriStation 1131 software. For more information, see the TriStation
1131 Developers Guide.)
Remote
Run
Program
Halt
Description
Green
steady
Green
steady
Yellow
steady
No
light
Normal operation with write capability.

Allows writes to program variables by TriStation 1131
software, Modbus master, and external hosts.
Allows control of the controller from TriStation 1131
software, including Download All and Download
Change.
Green
steady
Green
steady
No
light
No
light
Normal operation with read-write capability.
No
light
Green
steady
No
light
No
light
Normal operation with read-only capability.
No
light
No
light
Yellow
steady
Yellow
steady
Control program loading and checkout is enabled.
Green
slow
blinking
Green
slow
blinking
Yellow
slow
blinking
Yellow
slow
blinking
Indicators change every few seconds; module is in its

power-up state.
Green
fast
blinking
Green
fast
blinking
Yellow
fast
blinking
Yellow
fast
blinking
Module is ready to download new internal firmware.

Condition is caused by removing the MP Baseplate
address plug before module power-up.
No
light
No
light
No
light
Yellow
steady
Control program has stopped.
Green
steady
Green
steady
Yellow
steady
Yellow
steady
Module is faulty or has detected a bad address plug.
Allows writes to program variables by Modbus

masters and external hosts. (Download All and
Download Change by TriStation 1131 software are not
allowed.)
MP Modules execute the previously loaded control
program. Attempts to modify program variables by
Modbus masters and external hosts are rejected.
Allows control of the controller from the TriStation
1131 control program, including Download All and
Download Change. Control program has also been
stopped.
216
Chapter 4
MP Alarm Indicators
The MP alarm indicators identify alarm conditions for the controller.
Field
Power
Logic
Power
System
Alarm
Program
Alarm
Over
Temp
Red
steady
Red
steady
Red
steady
Red
steady
Red
steady
Description
Action
System power
supply is
missing/bad.
Correct the problem.
Field power supply

is missing/bad.
Correct the problem.
MP or I/O module
is malfunctioning.
Identify the condition by

looking at the Pass or
Fault indicators of other
modules or by using the
TriStation 1131
Diagnostic Panel.
Replace faulty module.
Red
steady
Blue
steady
Red
steady
I/O module has

detected a field
fault.
Correct field fault.
Control program
has detected an
alarm condition.
Check control program

for bypass or overridden
points or other abnormal
condition.
Control program
has detected an
alarm condition.
Alarm contacts also
indicate an alarm
(open contacts).
Identify the fault

condition by using the
control program.
Normal operation,
but the ambient
temperature is too
high (greater than
140F/60C).
Correct the
environmental problem
or the controller may fail
prematurely.
Correct the condition.
217
MP Communication Indicators
The MP communication indicators identify the type of communication occurring on the
controller. The TX light indicates the MP is transmitting a message and the RX light indicates
the MP is receiving a message.
IO Bus
Comm Bus
Serial
TriStation
RX/TX
RX/TX
RX/TX
Link
RX/TX
Description
Green
blinking
Normal response. MP is polling and

sending responses to the I/O
modules.
Green
blinking

sending responses to the CMs.
Green
blinking

sending responses to the Modbus
master.
Green
steady
Green
blinking
MP is communicating with TriStation

1131 software.
No
light
MP is not communicating with

TriStation 1131 software or a network
hub.
Note: The hub or Ethernet card in the
PC running the TriStation 1131
software has a link indicator that
shows whether a hardware connection
has been established with the MP.
218
Chapter 4
Communication Module Indicators

This section describes indicators for the CM, including:
CM Status Indicators on page 219
CM Communication Indicators on page 220

Pass (Green)
CM Status
Indicators
PASS
Fault (Red)
FAULT
ACTIVE
Active (Yellow)
LOCK
Unlock (Red)
COMMUNICATIONS
SERIAL
TX
RX
SERIAL
TX
RX
Communication
Indicators
SERIAL
TX
RX
LINK
NET 1 TX
RX
LINK
NET 2
TX
RX
Serial 1 (Green/Green)
Net 1 Link (Green)
Net 1 TX/RX (Green/Green)
Net 2 Link (Green)
Net 2 TX/RX (Green/Green)
CM 3201S2
Figure 102
CM Front Panel Indicators
Communication Module Indicators
219
CM Status Indicators
The CM status indicators identify the processing state for the CM.
A fault light indicates that the processor has an internal fault.
Normal States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Module is operating
normally.
Normal status. No action is

required.
Green
steady
No
light
Green
blinking
No
light
Module is downloading
firmware.
Normal status. To cancel,

pull module then re-seat
module.
Green
steady
No
light
No light
No
light
Module is operating
normally. Possible
conditions include:
Control program has not
been loaded into the MP.
Load control program.

loaded into the MP, but has
not been started up.
Start control program.
Module has just been

installed and is currently
being educated by the other
MP Modules.
Wait for module to be

educated.
Fault States
Pass
Fault
Active
Lock
Description
Action
No
light
Red
steady
No light
No
light

See mode indicator status for

power-up states.
Module may be in the

process of power-up selftest.
If the Pass indicator does not

go on within five minutes,
replace module.
No
light
Red
steady
Green
steady
No
light
Module has detected a

minor error.

should be replaced.
No
light
Red
steady
Red
steady

baseplate.
Lock module.
Green
steady
Red
steady
Indicators/signal circuitry
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
220
Chapter 4
CM Communication Indicators
The CM communication indicators identify the type of communication occurring on the
controller. The TX light indicates the CM is transmitting a message and the RX light indicates
the CM is receiving a message.
Serial 1
Serial 2
Serial 3
Net 1
RX/TX
RX/TX
RX/TX
Link
Green
blinking
Normal response. CM is
communicating with the
attached Modbus
master/slave device.
Green
blinking
attached Modbus
Green
blinking
attached Modbus
Green
steady
Green
blinking
CM is communicating
with TriStation 1131
software or with an
Ethernet device through
the Net 1 port.
Green
steady
Green
blinking
CM is communicating
with TriStation 1131
software or with an
Ethernet device through
the Net 2 port.
RX/TX
Net 2
Link
RX/TX
Description
Analog Input Module Indicators
221

This section describes the AI Module indicators including:
AI Status Indicators on page 222
AI Field Power Indicator on page 223

Pass (Green)
AI Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
FIELD PWR
Field Power (Yellow)
LOCK
Unlock (Red)
AI 3351S2
Figure 103
AI Front Panel Indicators
222
Chapter 4
AI Status Indicators
The AI status indicators identify the processing state for the AI Module.
A fault light indicates that the module has an internal fault.
Normal States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
No action is required.
Fault States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light

If this is the hot-spare

module, no action is
required.

If the module is active,

replace module.

running start-up diagnostics.
The other module is active.
No
light
Red
steady
No
light


replace the module.

should be replaced.
Module has detected

marginal input voltage in a
steady-state condition.
Check sensor signal

strength.
Check sensor positioning.
Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
223
AI Field Power Indicator

The AI field power indicator is lit when a field power problem has occurred.
Field
Power
Yellow
steady
Description
Action
Field power or logic power from one

or more of the redundant sources is
missing.
To isolate the missing power source, use the

TriStation 1131 software.
To determine the actual state, use a voltmeter,
then correct the problem in the external circuit.
If these steps do not solve the problem, replace
the module.
224
Chapter 4
Analog Input/Digital Input Module Indicators

This section describes the AI/DI Module indicators including:
AI/DI Status Indicators on page 225
AI/DI Field Power Indicator on page 226

Pass (Green)
AI/DI Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
FIELD PWR

1
2
3
4
5
6
7
Points
Indicators
116 DI Points (Green)
9
10
11
12
13
14
15
16
LOCK
Unlock (Red)
AI/DI 3361S2
Figure 104
AI/DI Front Panel Indicators
Analog Input/Digital Input Module Indicators
225
AI/DI Status Indicators

The AI/DI status indicators identify the processing state for the AI/DI Module.
Normal States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light


required.


replace module.

No
light
Red
steady
No
light


replace the module.

should be replaced.
Module has detected

Check sensor signal

strength.
Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
226
Chapter 4
AI/DI Field Power Indicator

The AI/DI field power indicator is lit when a field power problem has occurred.
Field
Power
Yellow
steady
Description
Action
Field power or logic power from one

or more of the redundant sources is
missing.

the module.
Analog Output Module Indicators
227

This section describes the AO Module indicators including:
AO Status Indicators on page 228
AO Field Alarm Indicator on page 229

Pass (Green)
AO Status
Indicators
Field Alarm
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
PWR/LOAD
Field Alarm (Yellow)
LOCK
Unlock (Red)
AO 3481S2
Figure 105
AO Front Panel Indicators
228
Chapter 4
AO Status Indicators
The AO status indicators identify the processing state for the AO Modules. A fault light
indicates that the module has an internal fault or is missing field power.
Normal State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No light
No
light
No
light


required.


replace module.

No light
Red
steady
No
light

If the Pass indicator

does not go on within
five minutes, replace the
module.
Field power is missing, if

field power light is also on.
Restore field power and

reseat the module.
Module is operational,
but should be replaced.
Module has detected

Check sensor signal

strength.
Check sensor
positioning.
Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
Pass
Fault
Active
Lock
Description
Action
No light
No light
on the module are
malfunctioning
Replace the module.
229
AO Field Alarm Indicator

The AO field fault indicator is lit when a field power problem has occurred.
Field
Alarm
Yellow
steady
Description
Action
Field power or logic power from one or

more of the redundant sources is
missing or a field error is detected. A
field error may be an open load or an
out-of-compliance error.

the module.
230
Chapter 4
Digital Input Module Indicators

This section describes the DI Module indicators including:
DI Status Indicators on page 231
DI Field Power Indicator on page 232
DI Point Indicators on page 232

Pass (Green)
DI Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
FIELD PWR

1
2
3
4
5
6
7
Points
Indicators
8
9
10
11
12
13
14
15
16
LOCK
Unlock (Red)
132 Points (Green)
17
18
19
20
21
22
Points
Indicators
23
24
25
26
27
28
29
30
31
32
DI 3301S2
Figure 106
24v
DI Front Panel Indicators
Digital Input Module Indicators
231
DI Status Indicators
The DI status indicators identify the processing state for the DI Module.
Normal State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light


required.


replace module.

Other module is active.
No
light
Red
steady
No
light


replace the module.

should be replaced.
Red
steady

baseplate.
Lock the module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
232
Chapter 4
DI Field Power Indicator

The DI field power indicator is lit when a field power problem has occurred.
Field
Power
Yellow
steady
Description
Action
Field power or logic power from

one or more of the redundant
sources is missing.

Correct the problem in the field circuit.
If these steps do not solve the problem, replace the
module.
DI Point Indicators
The DI point indicators identify whether the point is energized or not energized.
Point (1-32)
Description
Green steady
Field circuit is energized.
No light
Field circuit is not energized.
Digital Output Module Indicators
233

This section describes the DO Module 3401S2 and SDO Module 3411S2 indicators, including:
Status Indicators on DO and SDO Modules on page 235
Power/Load Indicator on DO and SDO Modules on page 236
Point Indicators on DO and SDO Modules on page 236
Point Indicators on DO and SDO Modules on page 236
Load Indicators on SDO Modules on page 236

Pass (Green)
DO Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
PWR/LOAD
Power/Load (Yellow)
1
2
3
4
5
6
7
Points
Indicators
116 Points (Green)
9
10
11
12
13
14
15
16
LOCK
DO3401S2
Figure 107
Unlock (Red)
24v
DO Module 3401S2 Front Panel Indicators
234
Chapter 4
Pass (Green)
Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
PWR/LOAD
Power/Load (Yellow)
1
2
3
4
5
6
7
Point
Indicators
POINTS
116 Points (Green)
9
10
11
12
13
14
15
16
LOCK
Unlock (Red)
1
2
3
4
5
6
7
Load
Indicators
LOAD
8
9
116 Points (Yellow)
10
11
12
13
14
15
16
SDO 3411S2 24VDC
Figure 108
SDO Module 3411S2 Front Panel Indicators
235
Status Indicators on DO and SDO Modules

The status indicators on the DO and SDO modules identify the processing state.
A fault light indicates that the module has an internal fault. If you have a field fault and a
module fault, resolve the field fault first.
Normal State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault States
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light


module, no action is required.


replace module.

Other module is active.
No
light
Red
steady
No
light


replace the module.
Excessive load current

required.
Correct field fault condition.

should be replaced.
Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
236
Chapter 4
Power/Load Indicator on DO and SDO Modules

The power/load indicator on DO and SDO modules is lit when a power/load problem has
occurred.
Power/Load
Description
Action
Yellow
steady
For at least one point, the

commanded state and the
measured state do not agree,
logic power for one or more of
the redundant sources is
missing, or field power for
one or both redundant
sources is outside the
operational range.
To isolate the suspected point or determine the

commanded state of the point, use the TriStation
1131 software.
To determine the actual state of the output, use a
voltmeter, then correct the problem in the external
circuit.
Verify that load current is within product
specification.
If these steps do not solve the problem, replace the
module.
Point Indicators on DO and SDO Modules

The point indicators on DO and SDO modules identify whether the point is energized or not
energized.
Point (1-16)
Description
Green steady
No light
Load Indicators on SDO Modules

The load indicators on SDO modules identify whether there is a fault in the field circuitry.
Point (1-16)
Description
Action
Yellow steady
A fault is detected in the field circuit or

the load is not connected to one or
more output points.
Check for shorted or open loads and fix.

Connect all output points that are not
connected.
Use the TriStation 1131 software to set the
DO Point Options to Non-Supervised for
unused points and points being used to
drive loads that do not draw the
minimum current required for
supervision.
No light
The field circuit is operating properly.
Pulse Input Module Indicators
237

This section describes the PI Module indicators including:
PI Status Indicators on page 238
PI Field Fault Indicator on page 239
PI Point Indicators on page 239

Pass (Green)
PI Status
Indicators
Field Power
Indicator
PASS
Fault (Red)
FAULT
Active (Green)
ACTIVE
FIELD PWR
1
2
Points
Indicators
16 Points (Green)
4
5
6
LOCK
Unlock (Red)
PI 3382S2
Figure 109
PI Front Panel Indicators
238
Chapter 4
PI Status Indicators
The PI status indicators identify the processing state for the PI Module.
Normal State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light


required.


replace module.

No
light
Red
steady
No
light


replace the module.

should be replaced.
Module has detected

Check sensor signal strength.

Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
239
PI Field Fault Indicator

The PI field fault indicator is lit when a field power problem has occurred.
Field
Description
Action
Yellow
steady
Field power or logic power from

one or more of the redundant
sources is missing.

PI Point Indicators
The PI point indicators identify whether the point is greater than or less than 0.5 hertz.
Point (1-6)
Description
Green steady
Input frequency is greater than 0.5 Hz.
No light
Input frequency is less than 0.5 Hz.
240
Chapter 4
Solid-State Relay Output Module Indicators

This section describes the SRO Module indicators including:
SRO Status Indicators on page 241
SRO Point Indicators on page 242

Pass (Green)
SRO Status
Indicators
PASS
Fault (Red)
FAULT
ACTIVE
Active (Green)
1
2
3
4
5
6
7
Points
Indicators
8
9
10
11
12
13
14
15
16
LOCK
Unlock (Red)
132 Points (Green)
17
18
19
20
21
22
23
Points
Indicators
24
25
26
27
28
29
30
31
32
RO 3451S2
Figure 110
24v
SRO Front Panel Indicators
Solid-State Relay Output Module Indicators
241
SRO Status Indicators

The SRO status indicators identify the processing state for the SRO Module.
Normal State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
Green
steady
No
light
Fault State
Pass
Fault
Active
Lock
Description
Action
Green
steady
No
light
No
light
No
light


required.


replace module.

No
light
Red
steady
No
light


replace the module.

should be replaced.
Module has detected

Check sensor signal strength.

Red
steady

baseplate.
Lock module using a

1/4-inch flat-blade
screwdriver.
Green
steady
Red
steady
on the module are
malfunctioning.
Replace the module.
No
light
No
light
on the module are
malfunctioning
Replace the module.
242
Chapter 4
SRO Point Indicators

The SRO point indicators identify whether the point is energized or not energized.
Point (1-32)
Description
Green steady
No light
A
Pin-Outs for Cables and Connectors
Ethernet Connectors 244

Serial Connectors 247
Ethernet Cables 250
Serial Cables 251
Diagread Cables and Debug Connectors 255
244
Appendix A
Ethernet Connectors
This section includes pin-out information for these Ethernet connectors:
10BaseT and 100BaseTX Ethernet Connectors on page 244
AUI 10 Megabit Ethernet MAU Connectors on page 244
MII Ethernet MAU Connectors on page 245
10BaseT and 100BaseTX Ethernet Connectors

This section includes pin-out information for 10BaseT and 100BaseTX Ethernet connectors. The
MP Baseplate and CM Baseplate include these type of connectors, which are typically used to
connect to a PC running the TriStation 1131 software.
Shield
1 TD+
2 TD
3 RD+
4
5
6 RD
7
8
Table 42
RJ-45 Pin
10BaseT and 100BaseTX Ethernet Connector Pin-Outs

Signal
Direction
Function
TD+
Out
Transmit data +
TD-
Out
Transmit data
RD+
In
Receive data +
NC
NC
RD-
In
NC
NC
Shield
Housing
Receive data
Safety ground
AUI 10 Megabit Ethernet MAU Connectors

This section includes pin-out information for AUI 10 megabit Ethernet MAU connectors, which
are included on the CM Baseplate.
Slide Clip
Table 43
DB15 Pin
1
2
3
4
5
6
7
8
Shield
9
10
11
12
13
14
15
AUI 10 Megabit Ethernet MAU Connector Pin-Outs

Signal
Direction
Ground
CI+
In
Transmit data
DO+
Out
Data output +
Ground
DI+
In
Data input +
Ground
Receive data
Function
Ethernet Connectors
Table 43
DB15 Pin
245
AUI 10 Megabit Ethernet MAU Connector Pin-Outs (continued)

Signal
Direction
Function
NC
Ground
In
MAU present detect
CI
In
Collision input
10
DO
Out
Data output
11
Ground
12
DI
In
Data input
13
+12 V
Out
MAU power
14
Ground
15
NC
MII Ethernet MAU Connectors

This section includes pin-out information for MII Ethernet MAU connectors, which are included
on the CM Baseplate.
Table 44
1
20
Shield
21
40
DB40Pin
MII Ethernet MAU Connector Pin-Outs

Signal
Direction
Function
+5 V
Out
MII MAU power
MDIO
In/Out
Management data
MDC
Out
Management data clock
RxD<3>
In
Receive data 3
RxD<2>
In
Receive data 2
RxD<1>
In
Receive data 1
RxD<0>
In
Receive data 0
Rx DV
In
Receive data valid
Rx_Clk
In
Receive clock
10
Rx_Er
In
Receive error
11
Tx_Er
Out
Transmit error
12
Tx_Clk
In
Transmit clock
13
Tx_En
Out
Transmit enable
14
TxD<0>
Out
Transmit data 0
15
TxD<1>
Out
Transmit data 1
16
TxD<2>
Out
Transmit data 2
17
TxD<3>
Out
Transmit data 3
246
Appendix A
Table 44
DB40Pin
MII Ethernet MAU Connector Pin-Outs (continued)

Signal
Direction
Function
18
Col
In
Collision (half-duplex)
19
CRS
In
Carrier receive sense
20
+5 V
Out
MII MAU power
21
+5 V
Out
MII MAU power
22
Logic ground
MII MAU logic ground
23
Logic ground
24
Logic ground
25
Logic ground
26
Logic ground
27
Logic ground
28
Logic ground
29
Logic ground
30
Logic ground
31
Logic ground
32
Logic ground
33
Logic ground
34
Logic ground
35
Logic ground
36
Logic ground
37
Logic ground
38
Logic ground
39
Logic ground
40
+5 V
Out
MII MAU power
Serial Connectors
247
Serial Connectors
This section includes pin-out information for these serial connectors:
RS232 Pin-Outs on page 247
RS485 Pin-Outs on page 248
RS232 Pin-Outs
This section includes pin-out information for RS232 serial connections, which are typically
used for Modbus communication. The serial ports on the MP and CM Baseplate can be
configured in TriStation 1131 software as RS232 or RS485.
Table 45
6
7
8
9
1
2
3
4
5
DB9 Pin
Shield
RS232 Pin-Outs
Signal
Direction
RS232 Function
CD
In
Carrier detect
RXD
In
Receive data
TXD
Out
Transmit data
DTR
Out
Data terminal ready
GND
Signal ground
DSR
Not used (data set ready)
RTS
Out
Request to send
CTS
In
Clear to send
RI
Not used (ring indicator)
Shield
Safety ground
Housing
Behavior and Effects of the RS232 Signals

This table describes the interaction between a module and RS232 signals. Spacing (on or 0)
occurs when RS232 signals are between +6 and +12 VDC; marking (off or 1) occurs when they
are between 6 and 12 VDC. The maximum cable length is 50 feet (15 meters), but can be
extended using modems.
Table 46
Behavior and Effects of the RS232 Signal
Signals
Designator
Description
Carrier Detect
CD
In HRDWR handshake mode, module ignores any data received

while CD is not asserted. The CD signal must be asserted by the
connected equipment for the module to receive messages.
When not in HRDWR handshake mode, the module ignores the
CD signal.
Receive Data
RXD
Module receives serial data
248
Appendix A
Table 46
Behavior and Effects of the RS232 Signal
Signals
Designator
Description
Transmit Data
TXD
Module transmits serial data
Data Terminal
Ready
DTR
Always asserted by the module when the port is configured.
Data Set Ready
DSR
Input signal to module. Ignored in all cases.
Request to Send
RTS
When in HRDWR handshake mode, the module set RTS on

when it has data to send.
When not in HRDWR handshake mode, the module asserts the
RTS signal continuously.
Clear to Send
CTS
When in HRDWR handshake mode, the module waits for CTS to

go on before transmitting data.
When not in HRDWR handshake mode, the module ignores CTS
and transmits data as soon as it is available.
Data Carrier
Detect
DCD
Module ignores DCD and always accepts data from RXD
Transmitted Data
TD
Transmitted data from the module
Received Data
RD
Received data from the equipment connected to the port
RS485 Pin-Outs
This section includes pin-out information for RS485 serial connections, which are typically
used for Modbus communication. The serial ports on the MP and CM Baseplate can be
configured in TriStation 1131 software as RS232 or RS485.
Table 47
6
7
8
9
Shield
1
2
3
4
5
DB9 Pin
RS485 Pin-Outs
Signal
Direction
RS485 Function
RD-A
In
Receive data
SD-A
Out
Transmit data
GND
Signal ground
SD-B
Out
Transmit data, invert
RD-B
In
Receive data, invert
OUT
Term
5 VDC through 1k
Shield
Safety ground
Housing
Serial Connectors
249
RS485 Signal Descriptions

This table describes RS485 signals, which are transmitted over a cable of twisted-pair-wires.
The polarity of the 2-to-6-volt differential between the two wires indicates whether the data is
marking or spacing. If terminal A is negative with respect to terminal B, the line is marking. If
terminal A is positive with respect to terminal B, the line is spacing. The maximum cable length
is dependent on the wire used. For example, using 24AWG twisted-pair wire, the maximum
length is 4,000 feet (1.2 kilometers), but can be extended using modems.
Table 48
RS485 Signal Descriptions
Signal
Designator
Description
Transmit Data
Transmit Data
Inverted
SD-A
SD-B
Module transmits serial data
Receive Data
Receive Data
Inverted
RD-A
RD-B
Module receives serial data
Signal Ground
GND
Signal ground
5 VDC through 1k
Not used
250
Appendix A
Ethernet Cables
Ethernet cables can be used to connect the MP Modules or CMs to a PC running the TriStation
1131 software or an Ethernet hub.
Cross-Over Cable
Cross-over cables can be used to link the Ethernet card on a PC to the Ethernet connectors on
the MP or CM Baseplate. The cable can be used for 10BaseT or 100BaseTX communication.
Crossover
cable
TD+ 1
TD 2
RD+ 3
4
5
RD 6
7
8
Shield
1 TD+
2 TD
3 RD+
4
5
6 RD
7
8
Shield
Crossover
cable
Crossover
cable
RJ-45
Connector
1
2
3
4
5
6
7
8
RJ-45
Connector
1
2
3
4
5
6
7
8
Shield
Straight-Through Cable
Straight-through cables can be used to link the Ethernet connector on the MP or CM Baseplate
to an Ethernet hub, or link the PC running TriStation 1131 software to an Ethernet hub. The cable
can be used for 10BaseT or 100BaseTX communication.
TD+ 1
TD 2
RD+ 3
4
5
RD 6
7
8
Shield
1 TD+
2 TD
3 RD+
4
5
6 RD
7
8
Shield
1
2
3
4
5
6
7
8
RJ-45
Connector
RJ-45
Connector
Shield
1
2
3
4
5
6
7
8
Serial Cables
251
Serial Cables
This section describes serial cables which are generally used for Modbus communication. Cable
types include:
RS-232 Serial Cable on page 251
RS-485 Serial Cables on page 251
RS-232 Serial Cable

This figure depicts the RS-232 serial cable, which is a standard null-modem cable used to link
the serial connector on the MP Baseplate to a PC acting as the Modbus master.
RS-232 Modbus Serial Cable

(Null Modem)
Housing D9
TXD 3
RXD 2
Signal Ground 5
DTR 4
DSR 6
CD 1
RTS 7
CTS 8
D9 Housing
2 RXD
3 TXD
5 Signal Ground
4 DTR
6 DSR
1 CD
7 RTS
8 CTS
MP Baseplate
Female Connector
P2 (9 pins) (molded hood)
PC Female Connector
P1 (9 pins)
Housing
Ground
RS-485 Serial Cables

RS485 serial cables are typically used for point-to-point (direct) and multi-point (network)
connections between a CM and a Modbus master, or point-to-point (direct) connections
between an MP and a Modbus master. The CM serial ports are configurable for multi-point RS485 operation without using modems.
252
Appendix A
This table identifies the RS-485 network specifications.

Table 49
RS-485 Serial Cable Specifications
Item
Specification
Nodes
One Modbus master and one slave
Cable length
Cable dependent4,000 ft (1.2 km) maximum using

24-AWG twisted-pair wire (shielding recommended)
Transmission rate (bps)
1200, 2400, 4800, 9600, 19.2 K, 38.4 K, 57.6 K, 115.2 K
The network trunk should consist of double twisted-pair wires. When the trunk consists of
double twisted pairs, one pair serves as the output line for the Modbus master (input line to all
slaves). The other pair serves as the input line to the Modbus master (output line from all
slaves). When the trunk consists of a single twisted pair, it serves as both the output and input
lines to the Modbus master and all slaves. The trunk accommodates up to 32 two-foot branches,
without restriction on the distance between branches.
RS485 Slave Network

When a CM is a slave in a multi-point network, multiple transmitters connect to the same
conductor. One transmitter can be active at any time; otherwise, the signal is distorted. Each
node must be in the tristate (or off) mode. To set the tristate mode for the CM, set the Handshake
mode to Hardware in the TriStation 1131 application.
Network Trunk
Trunk R
Trunk T
RD-A RD-B
SD-A SD-B
CM or MP
Serial Port
1
Shield
RD-A
SD-B
7
3
SD-A
RD-B
8
4
5 VDC through 1 K7 (optional)
9
5
Signal Ground (optional)

1 K7
Serial Cables
253
RS485 Master Network

Network Trunk
Trunk R
Trunk T
RD-A RD-B
SD-A SD-B
CM or MP
Serial Port
1
Shield
RD-A
SD-B
7
3
SD-A
RD-B
8
4
5 VDC through 1 K7 (optional)
9
5
Signal Ground (optional)

1 K7
RS485 Cable Selection

These are guidelines for selecting an RS485 cable for a Modbus network.
Maintain a cable impedance of greater than or equal to 100 ohms.
Supply a separate shield for each twisted pair.
Use double twisted-pair networks to house the pairs in a single sheath or in separate
sheaths.
Use branch cable of the same quality as the trunk cable, but of less rigid construction.
For example, use Belden 9182 (150-ohm) for the trunk and Belden 9729 (150-ohm) for
the branches.
Follow all applicable local codes.
Terminate the cable in the characteristic impedance of the cable.
RS485 Cable Termination

RS-485 trunk cable termination (point-to-point or multi-point for the CM, point-to-point for the
MP) greater than 650 feet (200 meters) requires termination at each end. Traditionally, resistors
are connected to each end of the cable. This technique matches the cable impedance and
prevents signal reflections which could cause data errors. However, this technique has the
following three undesirable side effects:
When no driver is active on the pair, the resistors pull the two wires together. Noise
even very low-level noisecan appear to be data when the wires are in this state.
When a driver is active on the pair but not sending data, the resistors cause 33 mA of
DC current to flow in the cable. This is an excessive load on the driver.
When a driver is transmitting data over the cable, the resistors lower the signal level
and consequently lower the immunity to noise.
254
Appendix A
A better technique for terminating the cable pair is to use an RC network and pull-up/pulldown resistors. This reduces power consumption and forces the pair to a valid data state when
no driver is active.
For both types of termination, resistor values must match the characteristic impedance of the
cable.
Traditional Network Termination

Cable R
Modbus
Master
SD-A
SD-B
Ground
RD-A
RD-B
+ 5 VDC through 1 kW
SD-A
SD-B
Ground
RD-A
RD-B
Cable T
MP
Slave
Recommended Network Termination Using a Double-Pair Network

.01 mf
.01 mf
Cable T
.01 mf
Modbus
Master
SD-A
SD-B
Ground
RD-A
RD-B
+ 5 VDC through 1 k
Cable R
SD-A
SD-B
Ground
RD-A
RD-B
.01 mf
MP
Slave
Diagread Cables and Debug Connectors
255
Diagread Cables and Debug Connectors

This section includes information about diagread cables and Debug connectors that are
available for the MP, CM, and I/O modules.
Diagread Cable
This figure depicts a diagread cable.
Diagread Cable
MP and
Left-Position CM
Debug Connector
1
2
3
4
5
6
1
2
3
4
5
6
2
3
5
9-pin D-Sub-to-Modular
Straight-Through RJ-12 Cable

(standard 6-wire telephone cable)
6-pin RJ12 Adapter
Debug Connector for MP and Left-Position CMs

For the MP and left-position CMs, the Debug connector uses pins 1, 2 and 3.
Table 50
1
2
3
4
5
6
RJ12 Pin
MP and Left-Position CM Debug Connector Pin-Outs

Signal
Direction
Description
TXD
Out
Module Diagread Transmit Data
RXD
In
Module Diagread Receive Data
GND
Module Ground
Debug Connector for I/O and Right-Position CMs

For I/O and right-position CMs, the Debug connector uses pins 4, 5 and 6.
Table 51
1
2
3
4
5
6
RJ12 Pin
I/O and Right-Position CM Debug Connector Pin-Outs

Signal
Direction
Description
TXD
Out
Module Diagread Transmit Data
RXD
In
Module Diagread Receive Data
GND
Module Ground
256
Appendix A
B
Non-Incendive Circuit Parameters
MP and CM Non-Incendive Circuit Parameters 258

Hazardous Location HART Baseplate Non-Incendive Circuit Parameters 259
258
Appendix B
MP and CM Non-Incendive Circuit Parameters

This figure depicts special parameters which apply to Main Processor and Communication
Modules for non-incendive communication circuits in the field. These parameters are extracted
from Triconex Drawing 9110043-001, REV. A.
MP
Model
3101S2
CM
Model
3201S2
Figure 111
CLASS 1, DIV 2
HAZARDOUS LOCATION
CLASS 1, DIV 2
OR NON-HAZARDOUS
NETWORK
(9) SHIELDED TWISTED PAIR IN/OUT SIGNALS
SERIAL PORT
(9) SHIELDED IN/OUT SIGNALS
RS-232 DIAG READ
(5) IN/OUT SIGNALS
NETWORK #1
NETWORK #2
SERIAL PORT #1
SERIAL PORT #2
SERIAL PORT #3
RS-232 DIAG READ
(3) IN/OUT SIGNALS
ASSOCIATED
APPARATUS
(NOTE 1)
ASSOCIATED
APPARATUS
(NOTE 1)
Non-Incendive Communication Circuits Simplified Schematic
Note 1 in the figure applies to FMRC-approved apparatus. The voltage (Vmax) and current
(Imax) that the load device can receive must be equal to or greater than the maximum open
circuit voltage (Voc) and maximum short circuit current (Isc) that can be delivered by the source
device. In addition, the maximum capacitance (Ci) and inductance (Li) of the load, which is not
prevented by circuit components from providing a stored energy charge to the field wiring (for
example, diode across a winding to clamp an inductive discharge), and the capacitance and
inductance of the interconnecting wiring must be equal to or less than the capacitance (Ca) or
inductance (La) that can be driven by the source device.
MP Model 3101S2
CM Model 3201S2
NETWORK
SERIAL PORT and

RS-232 DIAG READ
NETWORKS
1 and 2
SERIAL PORTS 1, 2, 3
and RS-232 DIAG READ
Voc/Vmax
1V/1V
10V/10V
1V/1V
10V/10V
Isc/Imax
1mA/1mA
30mA/30mA
1mA/1mA
30mA/30mA
Ca/Ci
11nf/11nf
15uF/0
11nf/11nf
15uF/0
La/Li
1.3mH/1.3mH
85mH/0
1.3mH/1.3mH
85mH/0
Figure 112
Signal Levels for Non-Incendive Communication Circuits
For detailed information on signal data (inputs or outputs), see the manufacturers
documentation.
Hazardous Location HART Baseplate Non-Incendive Circuit Parameters
259
Hazardous Location HART Baseplate Non-Incendive

Circuit Parameters
The following tables describe non-incendive circuit parameters for hazardous location HART
baseplates. While reading these tables, please note the following:
For C, ATEXmax = C internal, max (Ci) + C external, max (Co)
For L, ATEXmax = L internal, max (Li) + L external, max (Lo)
Note
The external maximums (Lo and Co) include field wiring and the field device.
This table describes non-incendive circuit parameters for the 2354AS2 Analog Input HART
Table 52
Cable and Load Parameters for AI HART Baseplate 2354AS2
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
19 to 30 V
Maximum voltage
Um
Um
32 V
Uo
Voc
32 V
Io
Isc
0.160 A
Po
Po
1.280 W
C external, maximum
Co
Ca
1.162 F
L external, maximum
Lo
La
4.969 mH
Ui
Vmax
9V
Ii
Imax
0.030 A
Maximum input power
Pi
Pi
0.270 W
C internal, maximum
Ci
Ci
0.0683 F
L internal, maximum
Li
Li
30.85 H
AI Field + Connection Specifications
AI Field Connection Specifications
260
Appendix B
This table describes non-incendive circuit parameters for the 2483AS2 Analog Output HART
Table 53
Cable and Load Parameters for AO HART Baseplate 2483AS2
Feature
IEC
Symbol
ISA
Symbol
Tamb
Tamb
32 F to 140 F (0 C to 60 C)
Working voltage
Uw
Uw
30 V
Maximum voltage
Um
Um
32 V
Uo
Voc
32 V
Io
Isc
0.256 A
Po
Po
1.856 W
C external, maximum
Co
Ca
1.15 F
L external, maximum
Lo
La
4.95 H
C internal, maximum
Ci
Ci
Additional isolation required; MTL 4546 or

similar.
L internal, maximum
Li
Li
Additional isolation required; MTL 4546 or

similar.
Output Connection (L+) Specifications
C
HART Communication
Overview 262
Triconex 4850 Hart Multiplexer 265
262
Appendix C
HART Communication
Overview
This appendix describes HART communication through Tri-GP systems.
Highway Addressable Remote Transducer protocol (HART) is a bi-directional industrial field
communication protocol used to communicate between intelligent field instruments and host
systems over 420 mA instrumentation wiring.
Invensys offers these components to enable HART communication between HART devices in
the field and Configuration and Asset Management Software running on a PC.
2354S2 Analog Input HART Baseplate
2483S2 Analog Output HART Baseplate

Workstation PC
running instrument management
software
RS232
RS232/RS485
converter
RS485
SHLD
TA
TB
SHLD
TA
TB
J22
J18
J27
1
TRICONEX
TRICONEX
PASS
FAULT
ACTIVE
FIELD PWR
PASS
FAULT
ACTIVE
FIELD PWR
2
3
4
420 mA
5
6
7
8
PWR
FAULT
HOST
HART
9
10
11
12
13
14
15
16
17
HART transmitter
and valve
18
4850
TRICONEX
19
20
21
22
23
24
25
26
27
28
29
30
31
32
J19
HART AI Baseplate
Figure 113
Typical Tri-GP HART Analog Input Installation
Overview
263
Workstation PC
software
RS232
RS232/RS485
converter
RS485
SHLD
TA
TB
SHLD
TB
TA
J22
420 mA
J18
J27
1
TRICONEX
TRICONEX
PASS
FAULT
ACTIVE
FIELD PWR
PASS
FAULT
ACTIVE
FIELD PWR
2
3
4
I
P
5
6
PWR
HOST
HART
FAULT
9
10
11
12
13
14
15
16
4850
TRICONEX
420 mA
I
P
HART transmitters
and valves
J19
HART AO Baseplate
Figure 114
Typical Tri-GP HART Analog Output Installation
264
Appendix C
HART Communication
Workstation PC
software
RS232
RS232/RS485
converter
RS485
SHLD
TA
TB
SHLD
TB
MTL4546
Isolator
TA
J22
420 mA
J18
J27
1
TRICONEX
TRICONEX
PASS
FAULT
ACTIVE
FIELD PWR
PASS
FAULT
ACTIVE
FIELD PWR
MTL4546
Isolator
MTL4546
Isolator
3
4
5
6
PWR
HOST
HART
FAULT
9
10
11
MTL4546
Isolator
12
13
14
15
16
4850
TRICONEX
420 mA
I
P
HART transmitters
and valves
J19
HART AO Baseplate
Figure 115
Typical Tri-GP HART Analog Output Hazardous Location Installation
If you are using HART communication in a safety-related application, see the Safety
Considerations Guide for Triconex General Purpose v2 Systems for more information.
Triconex 4850 Hart Multiplexer
265

The Triconex 4850 HART Multiplexer provides an interface between HART smart devices in the
field and Configuration and Asset Management Software running on a PC.
The Triconex 4850 HART Multiplexer mounts directly onto these Tri-GP baseplates:
2354S2 Analog Input HART Baseplate
2483S2 Analog Output HART Baseplate
Note
The Triconex 4850 HART Multiplexer operates independently of the AI and the AO
modules, so there is no interference from the multiplexer to these modules.
For more information about the HART compatible baseplates, including simplified schematics
and field connection diagrams, see Analog Input Components on page 49 and Analog Output
Components on page 82.
For more information about the Triconex 4850 HART Multiplexer, including PC software
installation and configuration, see the Triconex 4850 HART Multiplexer Instruction Manual.
266
Appendix C
HART Communication
Installing the Triconex 4850 HART Multiplexer

The Triconex 4850 HART Multiplexer mounts directly onto the Tri-GP baseplate in socket J42 as
shown in this figure.
Triconex 4850 Multiplexer
Figure 116
Triconex 4850 Multiplexer Mounted on Tri-GP Baseplate
After you mount the Triconex 4850 HART Multiplexer onto the baseplate, secure it by
tightening the screws on the back of the baseplate using a Phillips-head screwdriver with a shaft
smaller than 4 millimeters.
267
Triconex 4850 HART Multiplexer Indicators

This section describes the LED status indicators on the front of the Triconex 4850 HART
Multiplexer.
Table 54
Triconex 4850 HART Multiplexer Status Indicators
Indicator
Color
State
Description
PWR
Green
Off
Multiplexer is not receiving power.
On
Multiplexer is receiving power.
Off
Multiplexer is in the running state.
Steady flash
Multiplexer rebuild is in progress.
Short/long flash
No HART loops found.
On (steady)
A fault was detected and multiplexer operation

has halted.
Off
No communication on the channel.
Short flash (0.25 sec)
Correctly framed message received by the

multiplexer.
Long flash (1 sec)
Response transmittedthis is re-triggerable so

repeated transmissions will leave the indicator
permanently on.
Off
No communication on the channel.
Short flash (0.25 sec)
Message transmitted.
Long flash (1 sec)
Response receivedthis is re-triggerable so

repeated receptions will leave the indicator
permanently on.
FAULT
HOST
HART
Red
Yellow
Yellow
268
Appendix C
HART Communication
D
Warning Labels
This appendix provides a physical description of warning labels which must be prominently
attached to the controller for systems in which these hazards apply.
Labels must meet the requirements of ANSI Z535, ISO 3864, and IEC 1310-1.
Labels are available from Invensys upon request.
General Hazard
This figure is an example of a general hazard label.
Safety alert symbol

Black triangle, orange exclamation point
Signal word panel

Safety orange per ANSI Z535.1
Pantone 152C
13 parts yellow, 3 parts warm red, part black
Signal word
Sans serif font, all capital letters,
minimum letter height 1.5 x
message panel text height
White background
Yellow background
WARNING
GENERAL HAZARD.
Service restricted to
trained personnel only.
Optional
black border
Base width
30 mm (1.2 inch)
minimum
Figure 117
Black border
0.06 x base width
Black letters on
white background
Sans serif font
Upper or lower case
2.54 mm (0.10 inch) high
General Hazard Label
270
Appendix D
Warning Labels
Hazardous Voltage
This figure is an example of a hazardous voltage label.
Safety alert symbol

Signal word panel

Pantone 152C
Signal word
White background
Yellow background
WARNING
HAZARDOUS VOLTAGE.
Contact may cause electric shock
or burn.
Optional
black border
Base width
30 mm (1.2 inch)
minimum
Figure 118
Black border
0.06 x base width
Black letters on
white background
Sans serif font
Upper or lower case
Hazardous Voltage Label
Hot Surface
This figure is an example of a hot surface label.
Safety alert symbol

Signal word panel

Pantone 152C
Signal word
White background
Yellow background
WARNING
HOT SURFACE.
Contact may cause burns.
Optional
black border
Base width
30 mm (1.2 inch)
minimum
Figure 119
Black border
0.06 x base width
Black letters on
white background
Sans serif font
Upper or lower case
Hot Surface Label
E
Recommended Parts for Replacement
This table lists information on the recommended parts for replacement of Tri-GP components.
Part Description
Manufacturer
Part Number
Usage
Fuse, A
Invensys
1410054-001
Littlefuse
273.75
SRO Baseplate and MP

Baseplate
Fuse, 5x20 mm, 8 A,

slow-acting
Invensys
1410056-001
Littlefuse
218008
MP Baseplate and I/O

Extender Module
16-point plug connector
Invensys
1420048-016
I/O Baseplate
Phoenix
1901742
Expansion cable, 2-foot
Invensys
4000212-002
I/O Extender Module
Terminator
Invensys
4000138-001
I/O Extender Module
Address plug
(available only as part of
the Trident/Tri-GP
Accessory Kit)
Invensys
7400215-0xx
MP and I/O Baseplates
Trident/Tri-GP Accessory
Kitincludes one set of
spare fuses, two sets of
address plugs (1 through
10), one set of address
plugs (11 through 20), one
set of address plugs (21
through 32), one set of
address plugs (33 through
43), one set of address
plugs (44 through 54), and
one set of address plugs (55
through 63)
Invensys
(xx = address 01-63)
3000696-001
(Model 8401)
MP, I/O, and SRO Baseplates;

I/O Extender Module
272
Appendix E
Recommended Parts for Replacement
F
Panel Labels
AI/DI Hazardous Location External Termination Panels 275

RTD/TC/AI External Termination Panels 276
SSR Input External Termination Panels 277
274
Appendix F
Panel Labels
Overview
This appendix shows how to apply external termination panel (ETP) labels. Because some
modules require a two-panel arrangement to accommodate all points, each standard panel must
have a set of labels that indicate the correct range of points. Panels that are not used in a twopanel arrangement are labelled at the factory.
Standard panels that require labels include the appropriate labels as loose-piece parts. Since a
panel can be connected as the first or second panel, a set of labels appropriate for either range is
provided with every panel, with a duplicate label for each row of terminals on each terminal
block. Any unused labels can be stored or discarded.
Attach the appropriate labels to each panel as shown in these illustrations.
275

This figure illustrates placement of labels for 32-point AI and DI hazardous location ETPs.
TRICONEX
EXT TERM

17
REV B

R27
R28
23
TB4
R29
22
R
13
R
14
24
R
15
R32
R

19
R
20
R
3
21
R
12
R
R4
R5

R7
R8
R25
18
R
9
R
10
11
R
R3
R2
R1
SN
TB1
R30
7400275
R31
Panel
Type
9573-610F DI
9792-310F AI
J1
TB2 TB3 TB5
J2
J3
L-
P1
P2
Labels (for front and back row)

1
9 10 11 12 13 14 15 16
First Panel

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Second Panel
Figure 120
AI/DI Hazardous Location ETP Label Placement
276
Appendix F
Panel Labels
RTD/TC/AI External Termination Panels

This figure illustrates placement of labels for Model 9764-510F 16-point RTD/TC/AI ETPs.
16
16
13
12
14
15
14
15
13
12
11
R16
11
10
10
9
3
4
U16
R15
3
4
14
15
13
12
16
16
14
15
13
12
11
11
10
9
10
3
4
3
4
14
15
13
16
16
14
15
12
11
13
12
11
10
3
4
10
9
3
4
16
16
14
15
13
12
11
14
15
13
12
11
10
3
4
10
9
3
4
ISOLATED
RTD INPUT
ANALOG
DEVICES
ISOLATED
RTD INPUT
U15
R14
7B34
ANALOG
DEVICES
U14
R13
7B34
ISOLATED
RTD INPUT
ISOLATED
RTD INPUT
U13
ANALOG
DEVICES
ISOLATED
RTD INPUT
U12
R12
7B34
ANALOG
DEVICES
7B34
ANALOG
DEVICES
R11
7B34
ISOLATED
RTD INPUT
U11
R10
J4
J3
ANALOG
DEVICES
ISOLATED
RTD INPUT
U10
R9
7B34
ANALOG
DEVICES
ISOLATED
RTD INPUT
U9
R8
SN
7B34
ANALOG
DEVICES
U8
R7
7B34
ISOLATED
PROCESS
ANALOG
U7
R6
7B32
U6
R5
ISOLATED
PROCESS
ANALOG
7B32
U5
R4
ISOLATED
PROCESS
ANALOG
7B32
U4
R3
ISOLATED
ISOLATED
TC INPUT
PROCESS
ANALOG
7B32
ANALOG
DEVICES
ISOLATED
TC INPUT
ISOLATED
TC INPUT
U3
R2
7B47
ANALOG
DEVICES
7B47
ANALOG
DEVICES
ISOLATED
TC INPUT
U2
R1
J2
7B47
ANALOG
DEVICES
7B47
U1
REV E
7400225-
TRICONEX 7B 16 MODULE BASEPLATE
J1
J6
J5
First Panel
1
10 11 12 13 14 15 16

1
10 11 12 13 14 15 16
10 11 12 13 14 15 16

1
10 11 12 13 14 15 16
Second Panel
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 121

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
RTD/TC/AI ETP Label Placement

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
SSR Input External Termination Panels
277
SSR Input External Termination Panels

This figure illustrates placement of labels for 16-point SSR Input ETPs.
J1
DSP1
R1
DSP3
R5
CR5
R9
CR7
CR9
NON-COM DI
RELAY ETP
+2 +3
R10
DSP12
+6 +7
CR13
CR10
LOAD:0.1A
524VDC
G3R-IAZR1SN
OMRON
MADE IN JAPAN
F16
DSP15
R14
SN
+4 +5
AC
F15
DSP14
R13
CR12
LOAD:0.1A
524VDC
AC
F14
DSP13
R12
K16
G3R-IAZR1SN
OMRON
MADE IN JAPAN
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
K15
AC
F13
R11
CR11
LOAD:0.1A
524VDC
AC
F12
DSP11
K14
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
LOAD:0.1A
524VDC
OMRON
MADE IN JAPAN
AC
F11
DSP10
K13
DSP16
R15
CR14
R16
CR15
CR16
REV B

+1
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
R8
K12
AC
F10
DSP9
7400256
PWR
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
DSP8
CR8
K11
AC
F9
R7
CR6
K10
AC
F8
DSP7
R6
K9
AC
F7
DSP6
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
OMRON
MADE IN JAPAN
CR4
DSP5
K8
AC
F6
CONTACT
CR3
R4
K7
AC
F5
DSP4
R3
K6
AC
F4
R2
CR1
LOAD:0.1A
524VDC
AC
F3
DSP2
K5
G3R-IAZR1SN
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
G3R-IAZR1SN
AC
F2
CR2
K4
CONTACT
AC
F1
OMRON
MADE IN JAPAN
G3R-IAZR1SN
LOAD:0.1A
524VDC
K3
PWR
AC
OMRON
MADE IN JAPAN
LOAD:0.1A
524VDC
K2
G3R-IAZR1SN
OMRON
MADE IN JAPAN
K1

+8
+9
+ 10 +11
+ 12
+13
+ 14 + 15
+ 16
First Panel

+ 17
+ 18 + 19
+ 20 + 21
+22 + 23

+24
+ 25
+ 26 +27
+ 28
+29
+ 30 + 31
+ 32
Second Panel
Figure 122
SSR Input ETP Label Placement
278
Appendix F
Panel Labels
Glossary
AI Module
Analog Input Module.
AI/DI Module
Analog Input/Digital Input Module. Each AI/DI Module contains 16 AI points and 16 DI
points.
alias
Five-digit number that the system uses in place of a variable name when communicating with
an external host. The alias is a convention of Modbus, an industry-standard protocol adopted
by Invensys for use with its communication modules. Each alias contains a Modbus message
type and the address of the variable in the system.
ASIC
Application-specific integrated circuit.
availability
Probability that the controller is operational at some instant of time.
bin
Address range of system aliased variables based on class and type combinations. For example,
all Read Only Input Discrete variables are grouped into Bin 2, and all Read/Write Memory
Integer variables are grouped into Bin 12.
CE Mark
Certification by the European Union which ensures the electro-magnetic compatibility of the
system with other pieces of electrical/electronic equipment.
channel
Data path from input point to output point. Triple modular redundant (TMR) systems have
three channels.
CSA
Canadian Standards Association, a not-for-profit membership organization which develops
standards and tests in areas ranging from nuclear power, health care, occupational health and
safety, housing and construction materials to the electrical, electronic and telecommunications
fields. CSA certification of a product generates consumer confidence in many countries.
configuration
Arrangement of the programmable electronics within a system and the combination of
programmable and non-programmable equipment within the installation.
280
Glossary
control system
Governs the operation of plant, machinery or other equipment by producing appropriate
instructions in response to input signals.
coverage
Probability that a particular class of fault is successfully detected before a system failure occurs.
DCS
Distributed control system.
DDE
Dynamic data exchange (DDE) is an interprocess communication mechanism provided by the
Microsoft Windows operating system. Applications running the Windows operating system
can use DDE to send and receive data and instructions to and from each other.
debug
Act of locating and correcting faults: 1) one of the normal operations in software development;
such as editing, compiling, debugging, loading, and verifying; or 2) the identification and
isolation of a faulty physical component, including its replacement or repair to return the
system to operational status.
DI Module
Digital Input Module.
DO Module
Digital Output Module.
environment
Stimuli at an interface (or interfaces) of the system.
error
Element of a system resource assumes an undesired state. Such a state is then contrary to the
specification of the resource or the expectation (requirement) of the user.
event
State change of a discrete aliased variable which has been designated for event logging. An
event is said is to occur if such a variable changes from the normal state. If the variable later
changes back to the normal state, another event is said to have occurred.
event logger
Program that logs, displays and/or prints critical events in real time, based on state changes of
discrete variables in the program. Proper use of an event logger warns users about dangerous
conditions and printouts of events can help identify the sequence of events that led to a trip.
event variable
Discrete memory variable or discrete input point that has been assigned to an SOE block.
external host
Computer, such as a mainframe, minicomputer, workstation, or PC that communicates with the
controller over an Ethernet open network.
Glossary 281
fail-safe
Characteristic of a device or system to always revert to a safe, predictable state, even when one
or more of its internal elements has failed.
failure
System resource perceives that a service resource ceases to deliver the expected services. The
fault-tolerant system masks most failures. See fault.
failure rate
Rate at which failures occur over time. Usually expressed in failures per million hours. The
inverse of failure rate is MTTF.
fault
Cause of a resource failure or an error within the resource.
fault avoidance
Result of conservative design techniques using high-reliability components, system burn-in,
and careful design. The goal of fault avoidance is to reduce the possibility of a failure by
designing a device with performance margins so large that the probability of a detrimental
failure is negligible.
fault masking
Means of removing failed elements from influencing system operation while enabling properly
operating redundant elements to continue the control process.
fault tolerance
Ability to identify and compensate for failed control system elements and allow repair while
continuing an assigned task without process interruption. Fault tolerance is achieved by
incorporating redundancy and fault masking.
FE
Functional earth.
FSR
Full-scale range. Specifies an operating range for input or output signals. For example, if 0-5V
is the range, then 5V is the full scale.
HART
Highway Addressable Remote Transducer protocol is a bi-directional industrial field
communication protocol used to communicate between intelligent field instruments and host
systems over 420 mA instrumentation wiring.
host
See external host.
hot-spare modules
A unique feature of the Tri-GP controller which allows you to install a second identical I/O
module which becomes active if the other module fails.
282
Glossary
input poll time

Time required by the controller to collect input data from the controlled process. Input polling
is asynchronous and overlaps application execution.
I/A Series DCS
Foxboro Industrial Automation (I/A) Series Distributed Control System.
IEEE
Institute of Electrical and Electronics Engineers (IEEE) is a professional society for engineers.
ISO
International Organization for Standardization (ISO) is a world-wide federation of national
standards bodies (ISO member bodies) that promulgates standards affecting international
commerce and communications.
intermittent fault
Fault or error that is only occasionally present due to unstable hardware or varying software
states.
LED
Light-emitting diode. One of the color-coded signal lights on each controller circuit board that
indicates the boards status. Each system component includes at least the Pass, Fail, and Active
LEDs.
logical slot
Logical slot comprises a primary module, a hot-spare module, and associated field termination
components. A baseplate is a physical representation of a logical slot.
Markov model
Generalized modeling technique which can be used to represent a system with an arbitrary
number of modules, failure events, and repair events. A Markov model can be mathematically
solved to produce a resultant probability.
MP
Main Processor Module.
module
Active field-replaceable unit consisting of an electronic circuit assembly housed in a metal
cover.
MTBF
Mean-time-between-failure. The expected average time between failures of a system, including
the time taken to repair the system. Usually expressed in hours.
MTTF
Mean-time-to-failure. The expected average time to a system failure in a population of identical
systems. Usually expressed in hours.
Glossary 283
MTTR
Mean-time-to-repair. The expected time to repair a failed system or subsystem. Usually
expressed in hours.
node
Any of the machines on a network.
node number
Physical address of a node.
non-triplicated module
I/O module with a single set of field-interface circuitry for communication with all three main
processor modules. Non-triplicated modules provide a cost-effective alternative to the use of
TMR modules for non-critical environments.
open network
Network to which an external host can be connected.
output poll time
Time required by the controller to implement the outputs generated by the application in
response to inputs from the controlled process.
PE
Protective earth.
PES
Programmable electronic system.
peer-to-peer
Protocol that allow multiple systems on a proprietary network to exchange process and safety
information.
permanent fault
Failure, fault or error in the system that is continuous and stable.
PHA
Process hazard analysis.
process demand
Occurrence of a process deviation that results in the SIS initiating a trip of the process unit.
program
Basic programming unit within a project. A set of instructions, commands, and/or other
directions. In the TriStation 1131 software, programs are written in any of the available
languages, and are subsequently placed within a projects hierarchy.
programmable logic controller
Black box device which accepts analog or digital input signals, acts upon them in a welldefined way, and produces appropriate output signals as a result.
284
Glossary
proprietary network
Network of controllers.
protocol
Set of rules describing the format used for data exchange between two entities.
quad output circuit
Provides fault-tolerant outputs. Each output is composed of four identical switching elements
in a quad arrangement.
reliability
Probability that no failure of the system will occur in a given period of time.
scan time
Period of the controllers cycle of required control functions. Scan time is composed of three
elements:
Input poll time (asynchronous with program execution)
Time required to execute the program
Output poll time
SIL
Safety integrity level.
single module
Digital Input Module which is optimized for safety-critical environments where low cost is
more important than maximum availability. On a single module, only those portions of the
signal path which are required to ensure safe operation are triplicated. Special self-test circuitry
detects all stuck-On and stuck-Off fault conditions in less than half a second.
SIS
Safety instrumented system.
SRS
Safety requirements specification.
SRO Module
Solid-State Relay Output Module.
system
Set of components which interact under the control of a design.
TCP/IP
Transmission Control Protocol/Internet Protocol (TCP/IP) are protocols for the transport and
network layers of the OSI network model. TCP/IP provides reliable, sequenced data delivery.
time sync
Triconex Time Synchronization protocol.
Glossary 285
transient fault
Fault or error resulting from a temporary environmental condition.
TMR
Triple-Modular-Redundant architecture, which allows the system to achieve fault tolerance.
The complete system is triplicated; each of the three identical systems is called a channel. Each
channel independently executes the application in parallel with the other channels.
Tri-GP
State-of-the-art programmable logic and process controller that provides a high level of fault
tolerance.
trip
Safety-related shutdown of the controlled process, or a portion of the controlled process.
TriStation 1131 software is a Windows-based developers workbench for writing and
downloading applications and for performing maintenance and diagnostics on Triconex
systems.
TriStation 1131 protocol
Master/slave protocol used by TriStation 1131 software for communication with the system.
The TriStation 1131 protocol supports a maximum of 10 systems, but each master can
communicate with only one slave at a time.
TSAA
Triconex System Access Application (TSAA) protocol is a master-slave protocol in which the
master (an external host) communicates with one or more slaves over an open network. TSAA
supports a maximum of ten controllers.
TV Rheinland
Technischer berwachungs-Verein in German or Technical Supervisory Association in English.
In Germany, TV Rheinland is an authorized technical inspection agency for a wide variety of
products, processes, installations, plants, and equipment. In addition, the agency is authorized
to carry out statutory inspections and acceptance tests by more than 25 other countries.
UDP/IP
User Datagram Protocol/Internet Protocol (UDP/IP) are protocols for the Transport and
network layers of the OSI network model. UDP/IP provides best-effort datagram delivery.
voting
Mechanism whereby each channel of a TMR system compares and corrects the data in each
channel using a two-out-of-three majority voting scheme.
286
Glossary
Index
2481S2 schematic, 88
2483AS2 figure, 93
2483AS2 schematic, 94
2483S2 figure, 93
3481S2 specifications, 83
description, 82
external termination baseplate figure, 90
field connections, 89, 92, 95, 100
hazardous location termination panel, 97
indicators, 227229
operation, 14
Numerics
100BaseTX connectors, pin-outs, 244
10BaseT connectors, pin-outs, 244
A
addresses
node, 196
plugs, 196
alarms
definition, 212
MP Module contacts, 40
overview, 212
system integrity, 12
wiring, 203
Analog Input
2351S2 figure, 52
2354AS2 figure, 69
2354S2 figure, 69
description, 49
external termination baseplate schematic, 54
field connections, 53, 55, 68, 71
hazardous location termination panel, 65
indicators, 221223
operation, 13
2361S2 figure, 75
description, 72
field connections, 77, 80
hazardous location termination panels, 81
indicators, 224226
operation, 13
application., See control program

approvals, Factory Mutual, 17
architecture
MP Module, 6
system, 3, 5
assemblies
installing Interconnect, 197
Interconnect, 170
ATEX, installation guidelines, 183
AUI Ethernet MAU connectors, 244
B
baseplates
depth dimensions, 188
maximum number, 4
buses
I/O distribution, 8
TriBus, 5, 8
C
cables
CM diagread, 255
cross-over, 250
Analog Output
2481S2 figure, 87
288
Index
cables (continued)
flame test ratings, 26
guidelines for selection, 253
MP Module diagread, 255
RS-232 serial, 251
RS-485 serial, 251
shield, 202
straight-through, 250
terminating, 253
caps
description, 173
installing, 197
CD designator, 247
CE Mark certification, 20
certifications
CE Mark, 20
TV, 18
columns, connecting, 192
communication
bus operation, 9
Communication Module features, 11
controller, 10
MP Modules, 10
physcial interfaces, 11
AUI Ethernet MAU connectors, 244
baseplate figure, 44
communication ports, 45
Debug connectors, 255
description, 43
diagread cables, 255
indicators, 218220
installation, 209
MII Ethernet MAU connectors, 245
operations, 11
communication protocols
Communication Module, 11
Main Processor Modules, 11
connectors
AUI Ethernet MAU, 244
Ethernet, 244
MII Ethernet MAU, 245
Modbus RS-232 serial, 247
control program, TriStation 1131, 4
controller
configuration, 4
environmental specifications, 24
features, 2
safety certification, 16
cooling
convection, 177
forced-air, 177
covers
description, 174
installing, 197
customer support, x
D
Debug connectors, Communication Module, 255
debug ports, Main Processor, 41
diagnostics
fault tolerance, 3
Tri-GP controller, 12
diagread cables
CMs, 255
MP Modules, 255
Digital Input
2301S2 figure, 107
description, 101
field connections, 109, 111, 118
hazardous location external termination panel, 115
indicators, 230232
operation, 14
Digital Output
2401HS2 figure, 128
2401HS2 schematic, 129
2401LS2 figure, 131
2401LS2 schematic, 132
2401S2 figure, 125
description, 119120
field connections, 127, 130, 133, 136, 139, 145
indicators, 233236
operation, 14
dimensions
I/O baseplates, 190
I/O Extender Modules, 191
Main Processor Baseplates, 189
drill templates, mounting panels, 186
Index
ground (continued)
logic power, 200
system, 26
earth, connecting shield, 202

end caps
description, 173
installing, 197
H
HART
AI baseplates, 69
AO baseplates, 9396
overview, 262
Triconex 4850 Multiplexer description, 265
Triconex 4850 Multiplexer indicators, 267
Triconex 4850 Multiplexer installation, 266
environment, requirements, 24
Ethernet
100BaseTX connectors, 244
10BaseT connectors, 244
cross-over cables, 250
straight-through cables, 250
EU Declaration of Conformity, 20
hazardous locations
approved modules for, 184
installation guidelines, 182185
F
Factory Mutual approval, 17
fault tolerance, defined, 3
I/O baseplates, dimensions, 190
faults
definition, 212
overview, 212
field alarm indicator, AO Module, 229
field connections
2381AS2 pulse input, 161
2381S2 pulse input, 153
AI Baseplate model 2351S2, 53
analog input, 53, 55, 58, 68, 71
analog input/digital input, 77, 80
analog output, 89, 92, 95, 100
digital input, 109, 111, 113, 118
digital output, 127, 130, 133, 136, 139, 145
relay output, 139
solid-state relay input, 113
solid-state relay output, 169
field power, grounding, 201
field power indicator
Analog Input Module, 223
Analog Input/Digital Input Module, 226
Digital Input Module, 232
field signal distribution, 9
forced-air cooling, 177
G
ground
field power, 201
289
I/O Bus
cables, 172
distribution, 8
operation, 9
terminators, 172
connecting, 192
description, 171
dimensions, 191
I/O modules
common specifications, 47
installing, 210
I/O points, toggling to opposite, 206
I/O processors, MP Module, 37
indicators
AI Module, 221223
AI/DI Module, 224226
AO Module, 227229
DI Module, 230232
DO Modules, 233236
MP Modules, 213217
overview, 212
PI Module, 237239
SRO Module, 240242
installation
application-specific guidelines, 182
mechanical, 185
Interconnect Assemblies, description, 170
interconnect assemblies, installing, 197
interfaces, physical communication, 11
290
Index
L
logic power
determining, 177
grounding, 200
MP Baseplate, 42
MP Module, 37
overview, 10
M
Main Processor
alarm contacts, 40
application processors, 36
baseplate dimensions, 189
communication ports, 41
Debug connectors, 255
description, 35
I/O processors, 37
indicators, 213217
installing modules, 208
logic power, 37
logic power connectors, 42
Modbus ports, 41
overview, 6
maintenance, routine, 204
mechanical installation, 185
MII Ethernet MAU connectors, 245
Modbus ports
Main Processor Module, 41
ports on Communication Module, 45
Modbus RS-232 serial connectors, 247
modules
Analog Input, 49
Analog Input/Digital Input, 72
Analog Output, 82
Communication, 11, 43
depth dimensions, 188
Digital Input, 101
Digital Output, 119120
I/O Extender Modules, 171
Main Processor Module, 35
Pulse Input, 146147
Solid-State Relay Output, 165
spare, 206
mounting panels
drill templates, 186
guidelines, 185
network ports (continued)

Main Processor, 41
O
operations, Communication Module, 11
Output Voter Diagnostics
disabling, 204
enabling, 205
operation, 14
OVD. See Output Voter Diagnostics
overview, 16
P
panels, mounting, 185
parts, recommended, 271
physical interfaces, communication, 11
pin-outs
2381AS2 PI baseplate, 164
2381S2 PI baseplate, 157
RS-232, 247
RS-485, 248
RTD/TC/AI termination panel, 60
solid-state relay input termination panel, 114
point indicators, Digital Input Module, 232
ports
CM serial ports, 45
MP Module communication, 41
MP Module I/O and system executive, 41
power
distribution, 8, 9
MP Baseplate, 42
MP Module logic, 37
testing sources, 205
power/load indicators, DO and SDO Module, 236
processors
MP Module application, 36
MP Module I/O, 37
programs, alarms, 40
protective earth
connecting shield, 202
grounding baseplates, 198
Pulse Input
2381AS2 field connections, 161
2381AS2 figure, 158
2381S2 field connections, 153
network ports
Index
291
schematics (continued)
DO hazardous location external termination
baseplate, 135
DO hazardous location termination panel, 144
DO module 3401S2, 120
DO module 3411S2, 122
PI baseplate 2381S2, 151
PI hazardous location baseplate 2381AS2, 158
PI module 3382S2, 148
RTD/TC/AI termination panel, 57
Pulse Input (continued)

2381S2 figure, 151
description, 146147
indicators, 237239
operation, 15
SD-A designator, 249
RD-A designator, 249
SD-B designator, 249
RD-B designator, 249
shields, connecting, 202
recommended parts, 271
signals
connecting ground, 200
field distribution, 9
RS-232, 247
RS-485 description, 249
replacing modules, guidelines, 207

routine maintenance, 204
RS-232
pin-outs, 247
serial cables, 251
signals, 247
Slot Covers
description, 174
installing, 197
RS-485
pin-outs, 248
selecting cables, 253
serial cables, 251
signal description, 249
terminating cables, 253
solid state relay input external termination panel, 112

Solid-State Relay Output
2451S2 figure, 167
description, 165
field connections, 169
indicators, 240242
operation, 15
RTD/TC/AI Termination Panel

description, 56
pin-out information, 60
schematic, 57
spare modules, verifying, 206
safety certifications, 16
schematics
AI HART baseplates, 70
AI hazardous location termination panel, 67
AI module 3351S2, 50
AI/DI module 3361S2, 73
AO baseplate 2481S2, 88
AO HART Baseplates, 94
AO hazardous location external termination
baseplate, 91
AO hazardous location termination panel, 99
AO module 3481S2, 83
AO module 3482S2, 85
DI baseplate 2301S2, 108
DI Hazardous Location Termination Panel, 117
DI module 3301S2, 102
DI module 3311S2, 104
DO baseplate 2401LS2, 132
DO baseplate 2401S2, 126
specifications
environmental, 24
I/O common, 47
status indicators
AI/DI Module, 222, 225
AO Module, 228
DI Module, 231
diagnostic, 12
DO Module, 235
system executive debug ports, MP Module, 41
systems
ground, 26
overview, 24
T
technical support, x
temperature and output ranges, signal conditioning
modules, 64
292
Index
Terminal Covers, installing, 197

terminal covers, description, 174
termination panels
AI hazardous location, 65
AI/DI hazardous location, 81
AO hazardous location, 97
DI hazardous location, 115
DO hazardous location, 142
relay output, 137
RTD/TC/AI, 56
solid state relay input, 112
TMR.See Triple Modular Redundant architecture
training, x
TriBus
description, 5
operation, 8
Triconex contact information, x
Tri-GP controller
architecture, 5
fault tolerance, 3
triple modular redundant, architecture, 3
TriStation 1131
Ethernet connectors, 244
software, 4
TRM, architecture, 5
trunks, cables, 253
TV certification, 18
V
verifying spare modules, 206
W
wiring, alarms, 203
Invensys Operations Management

5601 Granite Parkway, Suite 1000
Plano, TX 75024
United States of America
http://www.iom.invensys.com
Global Customer Support

Inside U.S.: 1-866-746-6477
Outside U.S.: 1-508-549-2424 or contact your
local Invensys representative.
Website: http://support.ips.invensys.com

Planning and Installation Guide For Tri-GP v2 Systems

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Triconex General Purpose v2

Assembly Number 9700122-003

Document Number 9720122-003

Planning and Installation Guide for Triconex General Purpose v2 Systems

DO External Termination Baseplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Installation and Maintenance

System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 176

Planning and Installation Guide for Triconex General Purpose v2 Systems

Implementation and Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204

Fault and Alarm Indicators

Planning and Installation Guide for Triconex General Purpose v2 Systems

PI Point Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 239

Appendix A Pin-Outs for Cables and Connectors

Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244

Appendix B Non-Incendive Circuit Parameters

MP and CM Non-Incendive Circuit Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 258

Appendix C HART Communication

Appendix D Warning Labels

General Hazard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 269

Appendix E Recommended Parts for Replacement

Appendix F Panel Labels

SSR Input External Termination Panels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 277

Planning and Installation Guide for Triconex General Purpose v2 Systems

Chapter 1, Introduction Describes the theory of operation supporting the controller.

Chapter 2, System Description Provides descriptions, illustrations, specifications,

Chapter 3, Installation and Maintenance Provides guidelines for the person

Chapter 4, Fault and Alarm Indicators Provides information on responding to alarm

Appendix B, Non-Incendive Circuit Parameters Describes the parameters to be used

Appendix C, HART Communication Describes HART communication through

Appendix D, Warning Labels Provides a physical description of warning labels

Appendix E, Recommended Parts for Replacement Lists the parts recommended by

Planning and Installation Guide for Triconex General Purpose v2 Systems

Communication Guide for Triconex General Purpose v2 Systems

Product Release Notice for Triconex General Purpose v2.x Systems

Safety Considerations Guide for Triconex General Purpose v2 Systems

TriStation 1131 Developers Guide

TriStation 1131 Libraries Reference

Product and Training Information

Emergency requests are given the highest priority

All other requests are handled on a time-available basis

Planning and Installation Guide for Triconex General Purpose v2 Systems

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Planning and Installation Guide for Triconex General Purpose v2 Systems

Planning and Installation Guide for Triconex General Purpose v2 Systems

International Certifications and Qualifications

Planning and Installation Guide for Triconex General Purpose v2 Systems

Provides Triple Modular Redundant (TMR) architecture whereby each of three

Withstands harsh industrial environments.

Integrates the I/O module with the termination assembly.

Allows normal maintenance while the Tri-GP controller is operating, without

Planning and Installation Guide for Triconex General Purpose v2 Systems

Provides integral online diagnostics with adaptive-repair capabilities.

Planning and Installation Guide for Triconex General Purpose v2 Systems

TriStation 1131 Software

Planning and Installation Guide for Triconex General Purpose v2 Systems

Channel A I/O Bus

Channel B IO/ Bus

Channel C I/O Bus

Triplicated Architecture of the Tri-GP Controller