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Package Code
Lead Finish
J-STD-609 Category
Assembly Location
Material
Leadframe
Sub-Total
Integrated Circuit
Sub-Total
Die Attach
Sub-Total
Die Pad Plating
Sub-Total
Bond Wire
Sub-Total
Encapsulation
Sub-Total
Terminal Plating
Sub-Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
Silicon (Si)
Silver (Ag)
Epoxy Resin
t-Butyl Phenyl Glycidyl Ether
Butyl Cellosolve Acetate
Phenolic Resin
Dicyandiamide
Silver (Ag)
Gold (Au)
Silica Fused
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon Black
Tin (Sn)
Package
Percentage
ppm
27.06
270649
0.67
6669
0.03
278
0.03
278
27.79
277873
0.22
2179
0.22
2179
0.01
107
0.00
29
0.00
10
0.00
1
0.00
1
0.00
0
0.01
149
0.02
177
0.02
177
0.01
112
0.01
112
59.94
599376
3.81
38111
3.81
38111
1.52
15244
0.21
2079
69.29
692920
2.66
26591
2.66
26591
100.00
1000000
Date:
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb),
Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) and maximum concentration
value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of
0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and
Chlorine (Cl) in any homogeneous material.