Telefono Inalambrico Panasonic Tg4021me

ORDER NO.
KM41006127CE
Telephone Equipment
Model No. KX-TG4021MET
KX-TG4022MET
KX-TG4023MET
KX-TGA403MET
Expandable Digital Cordless Answering
System
T: Black Metallic Version
(for Mexico)
Panasonic System Networks Co., Ltd. 2010

Unauthorized copying and distribution is a violation
of law.
KX-TG4021MET/KX-TG4022MET/KX-TG4023MET/KX-TGA403MET
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit) -------------------------- 11
4.5. Block Diagram (Handset)-------------------------------18
4.6. Block Diagram (Handset_RF Part)-------------------19
4.7. Circuit Operation (Handset)----------------------------20
4.8. Circuit Operation (Charger Unit) ----------------------22
4.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------25
6 Installation Instructions ---------------------------------------25
7 Operating Instructions-----------------------------------------25
8 Test Mode ----------------------------------------------------------26
8.1. Engineering Mode ----------------------------------------26
9 Service Mode -----------------------------------------------------30
9.1. How to Clear User Setting (Handset Only)---------30
10 Troubleshooting Guide ----------------------------------------31
10.1. Troubleshooting Flowchart -----------------------------31
11 Disassembly and Assembly Instructions ---------------43
11.1. Disassembly Instructions -------------------------------43
11.2. How to Replace the Handset LCD -------------------47
12 Measurements and Adjustments---------------------------48
12.1. Equipment Required -------------------------------------48
12.2. The Setting Method of JIG -----------------------------48
12.3. Adjustment Standard (Base Unit)---------------------51
12.4. Adjustment Standard (Charger Unit)-----------------52
12.5. Adjustment Standard (Handset) ----------------------53
12.6. Things to Do after Replacing IC or X'tal ------------54
12.7. Frequency Table ------------------------------------------56
13 Miscellaneous ----------------------------------------------------57
13.1. How to Replace the Flat Package IC ----------------57
13.2. How to Replace the Shield Case ---------------------59
13.3. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------61
13.4. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------63
14 Schematic Diagram ---------------------------------------------64
14.1. For Schematic Diagram---------------------------------64
14.2. Schematic Diagram (Base Unit_Main) --------------66
14.3. Schematic Diagram (Base Unit_Operation) -------68
14.4. Schematic Diagram (Handset_Main) ----------------70
14.5. Schematic Diagram (Charger Unit) -----------------72
15 Printed Circuit Board-------------------------------------------73
15.1. Circuit Board (Base Unit_Main) -----------------------73
15.2. Circuit Board (Base Unit_Operation) ----------------75
15.3. Circuit Board (Handset_Main)-------------------------77
15.4. Circuit Board (Charger Unit) ---------------------------79
16 Exploded View and Replacement Parts List -----------80
16.1. Cabinet and Electrical Parts (Base Unit) -----------80
16.2. Cabinet and Electrical Parts (Handset) -------------81
PAGE
16.3. Cabinet and Electrical Parts (Charger Unit) ------- 82
16.4. Accessories------------------------------------------------ 83
16.5. Replacement Parts List--------------------------------- 84
1 Safety Precautions
1.1.
For Service Technicians
Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturers Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F 20 F (370 C 10 C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
3 Specifications
Note:
Design and specifications are subject to change without notice.
Note for Service:
Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
Analog telephone connection: Telephone Line
4 Technical Descriptions
4.1.
US-DECT Description
The frequency range of 1.91 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.56).
4.1.1.
TDD Frame Format
4.1.2.
TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 s, the 10 ms of voice data is transmitted.
2 - Handsets Link
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
4.1.3.
Signal Flowchart in the Radio Parts
Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
VBAT
RF_PART
RSTN
RESET
TXON
TXn
TXp
RXON
RXn
RXp
ANT2
ANT1
STM/CKM
3
KEY 1
VDD
FLASH
MEMORY
IC601
KEY C, D, E
CLK,DO
DL,CS
ANT1 ANT2
SPOUTP
SPOUTN
BBIC
EEPROM
MEMORY
IC611
VCC
X501
13.824 MHz
IC501
SP
SCL, SDA
WP
KEYS
ANS_LED
VCCA
MSG_LED
PDN DET
DOUBOUT
VBAT
VCCPA
VBAT_APU
VCC_IF
VCC_FE
VCC_VCO
LOUT
LIN
HOOK
DCIN 2
DCIN 1
BELL
HSMIP
HSMIN
3.0V
RECEIVE
AMP
Q171
SIDE TONE
CIRCUIT
Q161
RESET IC
IC331
3.0 V
REGULATOR
IC302
INUSE
DETECT 1
R131, R133
BELL
DETECT
Q111
D101
R371
R372
DCM
DCP
L1R
CHARGE_CONTACT
DC JACK
TEL JACK
L1T
KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_Main)
INUSE
DETECT 2
R151,R152
RLY
Q141
4.2.
Operational P.C. Board
Block Diagram (Base Unit_Main)
4.3.
Block Diagram (Base Unit_RF Part)

ANT2
TXp
ANT2
TXn
ANT1
DA801
TXON
RXON
RXp
RXn
ANT1
KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4.
Circuit Operation (Base Unit)
General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
4.4.1.
BBIC (Base Band IC: IC501)
Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.4.2.
Flash Memory (IC601)
Following information data is stored.

Voice signal
ex: Pre-recorded Greeting message, Incoming message
4.4.3.
EEPROM (IC611)
Following information data is stored.

Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.4.
Power Supply Circuit/Reset Circuit
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
12
4.4.4.1.
Charge Circuit
The voltage from the AC adaptor is supplied to the charge circuits.
13
4.4.5.
Telephone Line Interface
Telephone Line Interface Circuit:

Function
Bell signal detection
ON/OFF hook and pulse dial circuit
Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T L101 R111 C111 Q111 BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T L101 D101 Q141 Q161 R163 R167 D101 L102 P101 R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
14
4.4.6.
Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
15
4.4.7.
Calling Line Identification (Caller ID)/Call Waiting Caller ID
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
16
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line P101 L101, L102 C121, C122 R121, R122 IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
17
4.5.
Block Diagram (Handset)

3V
IC3
EEPROM
ANT1
X1
10.368 MHz
CHG_DET
CHG_CTL
WP, CLK, DATA
BATTERY
Power_adj
TXn
TXp
VDD_PADRV
PSEL
RESET
Q4
D7
CHARGE
IC801
PON
C144
TXON
RXON
RF_RXn
RF_RXp
BATTERY
1.8V
3V
RF PART
D1
AVD
Q2
CP_VOUT2
BATTERY
LD0_CTRL
BATTERY
IC1
BBIC
MIC
VDDPA
MICp
MICn
3V
1.8V
Receiver
LSRp
LSRn
LED
VDD2
VDD1
(KEY)
Q7
KEY_LED
3V
BELL_LED
Monitor SP
CKM/STM
PAOUTp
PAOUTn
CKM//STM
P3_3~P3_7
P1_1~P1_4
LED
(BELL)
3V
LCD
KEYS
KX-TGA403 BLOCK DIAGRAM (Handset)
18
4.6.
Block Diagram (Handset_RF Part)

TXON
ANT
DA801
RXON
RF_RXn
RF_RXp
KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)
19
4.7.
4.7.1.
Circuit Operation (Handset)

Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
RF Power Amp: IC801
- Amplifier for transmission
EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.7.2.
Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) F1 Q2 (1.8 V), IC1-43pin (2.5V)
The Reset signal generates IC1 (61 pin) and 1.8 V.
20
4.7.3.
Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) F301 R371 R372 CHARGE+(Base) CHARGE+(Handset) Q4 D7 F1 BATTERY+... Battery...
BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.7.4.
Battery Low/Power Down Detector
Circuit Operation:
Battery Low and Power Down are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
Battery Low
Battery voltage: V(Batt) 2.25 V 50 mV
The BBIC detects this level and "
" starts flashing.
Power Down
Battery voltage: V(Batt) 2.0 V 50 mV
The BBIC detects this level and power down.
4.7.5.
Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
4.8.
Circuit Operation (Charger Unit)
Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.20)
The route for this is as follows: DC+pin of J1(+) F1 R1 CHARGE+pad Handset CHARGE-pad DC-pin of J1(-).
22
4.9.
Signal Route
23
RF part signal route
24
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
25
8 Test Mode
8.1.
8.1.1.
Engineering Mode
Base Unit
26
Frequently Used Items (Base Unit)

ex.)
Items
Frequency
ID
Address
00 07 / 00 08
00 02 ~ 00 06
Default Data
00/01
Given value
New Data
-
Remarks
Use these items in a READ-ONLY mode to
confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)

A
B
C
D
E
F
27
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
8.1.2.
Handset
28
Frequently Used Items (Handset)

ex.)
Items
Address
Default Data
New Data
Battery Low
Frequency
ID
00 11 / 00 12
00 07 / 00 08
00 02 ~ 00 06
00 / 00
00 / 01
Given value
Possible Adjusted
Value MAX (hex)
-
Possible Adjusted
Value MIN (hex)
-
Remarks
(*2)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex.)

A
B
C
D
E
F
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
29
9 Service Mode
9.1.
How to Clear User Setting (Handset Only)
Handset
Press
, , ,
simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
30
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
Cross Reference:
Check Power (P.32)
Check Playback (P.34)
Check Record (P.33)
Check Battery Charge (P.34)
Check Link (P.35)
Check the RF part (P.37)
Check Handset Transmission (P.42)
Check Handset Reception (P.42)
Check Caller ID (P.42)
31
10.1.1. Check Power

10.1.1.1. Base Unit
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
Note:
BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.73).
10.1.1.2. Handset
Cross Reference:
32
10.1.2. Check Record

10.1.2.1. Base Unit
A) Not record Incoming Message
Note:
Flash Memory is IC601.
BBIC is IC501.
Cross Reference:
Signal Route (P.23)
Telephone Line Interface (P.14)
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.15)
33
10.1.3. Check Playback

10.1.3.1. Base Unit
Cross Reference:
Note:
Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Circuit Board (Base Unit_Main) (P.73).
10.1.4. Check Battery Charge

10.1.4.1. Base Unit
Cross Reference:
Charge Circuit (P.13)
10.1.4.2. Handset
Cross Reference:
Check Power (P.32)
10.1.4.3. Charger Unit
Cross Reference:
34
10.1.5. Check Link

10.1.5.1. Base Unit
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.54) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command SFR, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command SFR
until the frequency counter becomes13.824 MHZ55HZ.
35
10.1.5.2. Handset
Cross Reference:
Note:
*1 How to adjust the frequency of X1:
To see the frequency, execute the command SFR, then check the TP_CKM (IC1-46pin).
To adjust frequency, send command SFR
until the frequency counter becomes10.368 MHz55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.55) for Handset.
36
10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part
After All the Checkings or Repairing

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
Note:
(*1) HS: Handset
(*2) BU: Base Unit
37
10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.39).
Please refer to the each item.
Note:
(*1) Refer to Check Link (P.35).
38
10.1.6.3. Check Table for RF part

No.
Item
1 Link Confirmation Normal
HS, BU Mode [Normal Mode]
2
X'tal Frequency confirmation
HS, BU Mode: [Adjustment]

TX confirmation
Regular HS (BU) Mode:
[Test RX Mode]
BU (HS) Mode:
[Test TX_Burst Mode]
RX confirmation
Regular HS (BU) Mode:
[Test TX_Burst Mode]
BU (HS) Mode:
[Test RX Mode]
Range Confirmation Normal
HS, BU Mode: [Normal Mode]
BU (Base Unit) Check

1. Register Regular HS to BU (to be
checked).
2. Press [Talk] key of the Regular HS to
establish link.
Check X'tal Frequency.
(13.824000 MHz 100 Hz)
HS (Handset) Check
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
Check X'tal Frequency.
(10.368000 MHz 100 Hz)
1. Place Regular HS 15 cm away from a

checked BU.
2. Confirm "TXDATA" waveform of BU (*1)
and RXDATA waveform of Regular HS by
Digital Oscilloscope.
1. Place Regular BU 15 cm away from a

checked HS.
2. Confirm "TXDATA" waveform of HS (*2)
and "RXDATA" waveform of Regular BU by
1. Place Regular HS 15 cm away from a

checked BU.
2. Confirm "RXDATA" waveform of BU (*1)
and TXDATA waveform of Regular HS by
1. Place Regular BU 15 cm away from a

checked HS.
2. Confirm "RXDATA" waveform of HS (*2)
and "TXDATA" waveform of Regular BU by
1. Register Regular HS to BU (to be

checked).
2. Press [Talk] key of the Regular HS to
establish link.
3. Compare the range of the BU (being
checked) with that of the Regular BU.
1. Register HS (to be checked) to Regular

BU.
2. Press [Talk] key of the HS to establish link.
3. Compare the range of the HS (being
checked) with that of the Regular HS.
Note:
(*1) Adjustment Standard (Base Unit) (P.51)
(*2) Adjustment Standard (Handset) (P.53)
39
10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item
Range Confirmation TX TEST
(TX Power check)
HS, BU setting
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1)
Range Confirmation RX TEST

(RX sensitivity check)
HS, BU setting
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1)
BU (Base Unit) Check

1. Register Regular HS to BU (to be checked).
HS (Handset) Check
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS

according to CHART1.
2. Set TX Power of the HS and the Regular BU

3. At distance of about 20m between HS and BU,

Link OK = TX Power of the BU is OK.
No Link = TX Power of the BU is NG.
1. Register Regular HS to BU (to be checked).

Link OK = TX Power of the HS is OK.
No Link = TX Power of the HS is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS

2. Set TX Power of the Checking HS and the Regular BU according to CHART1.

Link OK= RX Sensitivity of the BU is OK.
No Link = RX Sensitivity of the BU is NG.

Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (Base Unit) TX Power Check

BU (Base Unit) RX Sensitivity Check
BU (to be checked)
TX Power
Low
High
Regular_HS
TX Power
High
Low
HS (Handset) TX Power Check

HS (Handset) RX Sensitivity Check
HS (to be checked)
TX Power
Low
High
Regular_BU
TX Power
High
Low
Note:
(*1) Refer to Commands (P.50).
40
10.1.7. Registering a Handset to the Base Unit
10.1.8. Deregistering a Handset
10.1.9. Deregistering All Handsets by the Base Unit
41
10.1.10. Check Handset Transmission
Cross Reference:
Signal Route (P.23)
10.1.11. Check Handset Reception
Cross Reference:
Signal Route (P.23)
Note:
When checking the RF part, Refer to Check the RF part
(P.37).
10.1.12. Check Caller ID
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.16)
Note:
Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
It is also recommended to confirm that the customer is really
a subscriber of the service.
42
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1.
Base Unit
43
44
11.1.2.
Handset
45
11.1.3.
Charger Unit
46
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
47
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.31)
12.1. Equipment Required

Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope.
Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm)
Hewlett Packard, 53131A is recommended.
DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
<Preparation>
Serial JIG cable: PQZZ1CD300E*
PC which runs in DOS mode
Batch file CD-ROM for setting: PNZZTG4021ME
Resistor
R2
R3
R4
R7
12.2.1. Connections (Base Unit)

Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
Note:
*: COM port names may vary depending on what your PC calls it.
48
Old value (k)

22
22
22
4.7
New value (k)

3.3
3.3
4.7
10
12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
Note:
*: COM port names may vary depending on what your PC calls it.
49
12.2.3. How to install Batch file into P.C.
Note:
***** varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name
rdeeprom
Function
Read the data of EEPROM
readid
writeid
Read ID (RFPI)
Write ID (RFPI)
hookoff
hookon
RdEeprom
Off-hook mode on Base

On-hook mode on Base
Read EEPROM
sendchar epw
sendchar RST
getchk
sendchar epw
Write EEPROM
Reset baseset
Read checksum
Write EEPROM
Example
Type rdeeprom 00 00 FF, and the data from address
00 00 to FF is read out.
Type readid, and the registered ID is read out.
Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E
98 is written.
Type hookoff.
Type hookon.
Type RdEeprom 03 e2 04, and the data from address
03 e2h to 03 e4is read out
*This command gets 4 byte "WW", "XX", "YY", "ZZ".
*Please NEVER forget these 4 byte data!
Type sendchar epw 03 e2 04 FF FF FF FF
Type sendchar RST
Type getchk.
Type sendchar epw 03 e2 04 WW XX YY ZZ
*"WW", "XX", "YY", "ZZ" is 4 byte data that already read
from same address.
50
CL2
YLW
ANT2
L362
D363
RED
CHG+2
C352
L372
D142
L361
C142
R161 R164
GND
C122
PbF
UTX
URX
C511
C510
C514
VCCA
C181
C171
R166
CHARGE-
C125
R121
C163 C165
Q161
C121
BLK
CHG-2
R112
L371
C351
D361
C112
R162
R115
C115
L1R
D143
GRN
L1T
C168
C530
L474
L476
C513
C661
VREF
R178
VBG
C478
SPP
RSTN
R136
C477
SPN
D133
R603
VDDC
DC
6.5V
DCM
PNLB1712Z
IC611
R612
C321
C322
ANT1
+6.5V
IC302
R605
R606
VBAT
TMS
TCK
TDI
TDO
CL1
R322
R321 C343
R302
DCDC_OUT
+3.0V
Q601
RTCK
RTCK
R502
R602
R335
RA504
IC601
FCT
3.0A
DCP
STM/CKM/P15
D472
C476
D153
RA151
R152
C152
R151
Volt
Meter
D473
C601
R165
C167
R167
C184
R163
C126
R601
R507
C521
F301
CHARGE+
R181
C186
C512
C475
C479
C473
C472
C120
C124 C123
C151
C133
C525
R607
R512
R604
C332
C301
R334
R305
CHG
R122
R503
C524
R505
RA502
R506
C611
R301
C307
SP
RED
51
R307
DC
RED WHT
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.39)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
R304
BLK
Oscilloscope
* Start Monitor
Oscilloscope (*2)
* Send command "SFR", then

the frequency output on this TP.
Frequency Counter (*1)
Spectrum Analyzer
12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View
12.4. Adjustment Standard (Charger Unit)

12.4.1. Bottom View

Digital
Volt Meter
/2 W
Charge+
Charge-
12
TP3
PNLP1029YA
1
2
PQUP11532Y
F1
PbF
TP4
J1
TP3
TP4 (GND)
DC POWER
DC 6.5 V
52
12.5. Adjustment Standard (Handset)

12.5.1. Component View

PNLB1734Y
BL
K
TP_ANT1
C152
CLK
R20
R332
Q11
R331
C331
CP3.0V
RA40
1.8V
IC3
1
Q7
RCV-
MIC+
RCV+
UTX
R4
GND
RX
TX
GND
R45
C35
R7
R30
R8
R3
C121
Q9
R31
F1
C150
BATT+
MICURX
BAT
Q4
C3
D7
R6
R2
RA61
C340
BATT-
R74
C75
C74
R73
CHG(+)
D3
2.7 V
Zener
C147
C5
CHG(-)
D4
C113
MIC
MIC+
MIC-
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.39)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
53
PC
URX
C1
DC 6.5V
C341
AF
Generator
DC Power
2.30~2.60V
D1
RA30 RA31
Current
Probe
R330
C342
GND
22pF
Frequency
Counter (*1)
100
CP 4.0V
CP 3.0V
R248
C172
C2
Q12
C51
CP4.0V
GND
R27
R249
Digital
Volt Meter
R23
C52
C53
C55
Q10
Power Key
R37
R36
C39 C30
R403
R404
(at battery low)
RA1
21
C188
L46
L47
C13
C11
C12
C18 R28
C97
C96
C49
C50
C17
R215
C40
C54
C332
GND
CLK
C48
Q2
DC POWER
2.00~2.25V
R64
IC1
R203
C43
C47
C38
R406
R407
Oscilloscope (*2)
RA32
C881
Q880
C45
C46
JTAG
STM
R63
R405
R66
C44 R225
Q401
POWER
C138
C819
C820
C826
C822
X1
R401
R402
R400
C400
R880
C834
C73
R807
C10
1.8V RA4
D400
Q400
IC801
C809
8
80 R806
C
C861 C825
L801
C860
C182
C837
D13
C72
R801
R808
C880
RA800
R802
R805
SPEAKER
C139
R232
R233
C802
RED
D14
C863 C864
C814
C805
C810
DA801
C827
C812
C803
C813
L802
C806
L803
C811
C804
BLK
Oscilloscope
R55
C204
R231C201C200
C105
C206
R54
C203
R53 R50
R236
C107
C103
AF Volt Meter
D22
56
D21
C106
C104
C71
R578
1 F
C70
150
C187
C580
TGA250XX
TGA251XX
TGA403XX
C175
56
TGA650XX
TGA651XX
ANT
R
ED
R
EC
EI
VE
R
PbF
C186
DECT Tester
CMD60
GND
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data

12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.48).
Then download the appropriate data according to the following procedures.
EEPROM (IC611)
X'tal (X1)
Items
How to download/Required adjustment
Adjusted parameter data is stored in memory. 1) Change the address 0001 of EEPROM to 55 to download
(country version batch file, default batch file, the data.
etc.)
2) Default batch file: Execute the command default.bat.
3) Country version batch file: Execute the command
TG4021USMErevXXX_YYY.bat. (*1)
4) Clock adjustment
System clock
Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 6.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz 100 Hz).
4) If the frequency is not 13.824 MHz 100 Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz 15 Hz.
Note:
(*1) XXX_YYY: revision number
XXX, YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.48).
54
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.48).
Then download the appropriate data according to the following procedures.
EEPROM (IC3)
Items
Adjusted parameter data is
stored in memory.
(country version batch file,
default batch file, etc.)
Battery Monitor Check
Battery Low Confirmation
Battery Clock Adjustment

(X1)
CLK
How to download/Required adjustment

1) Default batch file: Execute the command default.bat.
2) Default batch file (remaining): Execute the command
TGA402USDEFrevXXX_YYY.bat. (*2)
3) Country version batch file: Execute the command
TGA402USMErevXXX_YYY.bat. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write YY
Execute the command wreeprom 00 09 01 YY.
EEPROM = 000A (No Voltage) write YY - 1D
Execute the command xwreeprom 00 0A 01 ZZ.
Note:
No Voltage writing data limit is 00.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V 0.08 V between BATT+ and BATT-.
4) Confirm that there is flashing of Battery lcon.
1) Apply 2.6 V between BATT+ and BATT- with DC power.
2) Input Command sendchar sfr, then you can confirm the current value.
3) Check Xtal Frequency. (10.368 MHz 100 Hz).
4) If the frequency is not 10.368 MHz 100 Hz, adjust the frequency of CLK execute in the command sendchar sfr xx xx (where xx is the value) so that the reading
of the frequency counter is 10.368000 MHz 5 Hz.
Note:
(*2) XXX_YYY: revision number
XXX and YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.48).
55
12.7. Frequency Table

Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Ch. (hex)
00
01
02
03
04
TX/RX Frequency (MHz)

1928.448
1926.720
1924.992
1923.264
1921.536
56
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
PbF (: Pb free) Solder
Soldering Iron
Tip Temperature of 700 F 20 F (370 C 10 C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
57
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
58
13.2. How to Replace the Shield Case

13.2.1. Preparation
Soldering Iron
Tip Temperature of 700F 20F (370C 10C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
Hot Air Desoldering Tool
Temperature: 608F 68F (320C 20C)
13.2.2. Caution
To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.2.3. How to Remove the Shield Case

Note:
If you dont have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
59
13.2.4. How to Install the Shield Case

Note:
If you dont have special tools (ex. Hot air disordering tool), conduct the following operations.
Shield cases No. : PNMC1013Z
1. Put the shield case.
2. Solder the surroundings.
60
13.3. How to Replace the LLP (Leadless Leadframe Package) IC

Note:
This description is only applied on the model with Shield case.
13.3.1. Preparation
Soldering Iron
Tip Temperature of 700 F 20 F (370 C 10 C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
Hot Air Desoldering Tool
Temperature: 608 F 68 F (320 C 20 C)
13.3.2. Caution
To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.3.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
3. After removing the IC, clean the P.C.Board of residual solder.
61
13.3.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
When placing the IC, the positioning should be done very carefully.
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
4. After soldering, confirm there are no short and open circuits with visual inspection.
13.3.5. How to Remove a Solder Bridge

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
62
13.4. Terminal Guide of the ICs, Transistors and Diodes

13.4.1. Base Unit
13.4.2. Handset
63
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
64
Memo
65
14.2. Schematic Diagram (Base Unit_Main)

470
R892
ANT2
R807
470
C892
5p
ANT2
W 0.2mm
GND
L mm
1st layer
GND
RXON
C822
10p
W 0.15mm
L 20mm
3rd layer
GND
C827
10p
GND
RXn
C894
C826
2.2p
W 0.2mm
L 10mm
1st layer
C863
10p
C820
1.5p
1.5p
CL2
RXp
GND
GND
ANT1
2
DA802
GND
C893
CL1
3p
W 0.2mm
L 10mm
1st layer
1.2p
C896 C859
2.2p
W 0.2mm
L mm
1st layer
L809
C812
7.5n
0.9p
C805
2.7p
GND
2.2p
GND
GND
GND
GND
W 0.15mm
L 20mm
3rd layer
GND
GND
470
R891
R806
C891
5p
W 0.15mm
L 5.0mm
1st layer
W 0.15mm
L 5.0mm
1st layer
C825
10p
C810
2.4p
2p
C895
GND
TXp
DA801
2
3
1
C813
TXn
C806
2.7p
GND
GND
470
W 0.2mm
L 10.0mm
1st layer
GND
ANT1
TXON
TXn
TXp
RXp
RXn
RXON
ANT2
VBAT
TO RF BLOCK
C811
10p
GND
VBAT
(1)
(2)
(3)
(4)
GND
TXON
ANT1
45
* Start Monitor
* When "SFR" command
is executed, 13.824MHz
frequency will be output.
46
47
48
49
50
GND
51
52
+3.0V
53
C658 NC
C659 NC
C660 NC
*WBX01
10pin
PARALLEL WIRE
NC
K1u
C515
1k
C517
0.1u
57
59
61
62
63
64
C518 0.1u
RA502
10k
65
66
VDDC
(5)
*SW1
2
RA501 33
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
+3.0V
56
60
ANS_LED
C2 B2
55
0.1u
54
C516
58
FCT
680
680
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
C651
C652
C653
C654
C655
C656
*R651
*R652
NC
NC
NC
NC
NC
NC
2APVCC
MSG_LED
ANS_LED
NC
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
STM/CKM/P15
10
MSG_LED
NC
C1 B1
*R507
*Q651
5
VBAT
*R512
RSTN
TXp
RXp
RXn
GND_RF
TRSW_p
ANT_n
ATST_n
ATST_p
TEST
RSTN
*IC501
NC
VCC_VCO
GPIO[27]
VDDUSB
DM_USB/GPI28
DP_USB/GPI29
VDDC1
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
*C661
NC
NC: No Components
66
R502
33
JTAG_RTCK
JTAG_TDI
TDI
(6)
RTCK
JTAG_TMS
JTAG_TCK
TCK
TMS
JTAG_TDO
TDO
UTX
UTX
URX
GND
URX
AP1
4
*CE
SO
*C601
*IC601
VDD
*HOLD
*WP
SCK
VSS
SI
C
*R601
8M FLASH
Q601
NC
R602
NC
NC
R603
C611
4
A0
VCC
A1
WP
A2
SCL
GND
SDA
64K EEPROM
IC611
0.1u
7
+3.0V
+3.0V
1.2V
PDN_DET
+3.0V
R605
R606
67
R335
0
VBAT
*IC331
VOUT VIN
2.7V
NC
VSS
4
GND
3
DCDC_OUT
2
K
+6.5V
0.1u
C
VBAT
DC/DC CONVERTOR
L301
NC
NC
SA103
0.22u
R115
NC
100u
C301
33u
HOOK
Bell
L372
JJ301
IC301
5
11
12
6
10
9
8
7
2
3
4
5
VOUT 4
EXT
1u
5.6
*C306
+6.5V
*C351
5.6
R371
R112 100k
R372
C112
0.047u
R111 100k
R144 NC
R145 2.2k
R133 330k
C132 K0.01u
270V
SA101
L102
0.1u
NC
*D361
10k
C111
0.047u
C152 0.01u
C102 680p
*C352
NC
C113
0.022u
C171
12
R163
NC
0.022u
R166
R152 470k
R167 27
C168 NC
P101 22
F301
3.0A
*L361
*L371
L362
NC
10p
RA504
68
1
33u
C308
C302
INPUT
VOUT2
ADJ
*D363
3.0V
L101
NC
IC302
NC
PDN_DET
HOOK
BELL
KEYS_E
KEYS_D
KEYS_C
UTX
URX
4
D101
R301
2 VOUT1
R302
NC
R165 27k
C167 1000p
C161 10u
R131 10M
2.7k
R142
D142 NC
25V
C142 K0.01u
D143
100
R176
C164 NC
560
R175
C176 10u
27k
R162
Q141
C303
L501
100n
NC
K0.68u
R113
VDDC
NC
C501
0.1u
VBAT
C305
C304
2
1
Q142
NC
RA151
1k
NC NC
R304
4
3
100k
NC
17
2
R141
NC
10
Q111
C307 R307
16
BELL
10p
1u
18
E
K
+3.0V
C322
C321
R136
NC
A
VBG
47k
1u
K
680p
F100
19
A
680p
390k C122
D113
390k C121
R122
47k
R114
R121
F140
10u
C506
D133
NC
NC
C178
NC
VDDC
D153 NC
K1.0u
10p
C505
C525 NC
0
C181
C184
NC
*R331
NC
10p
C186
R181
Q143
NC
D331
VDDC
10p
C125
SPN
R151
68k
C331
C502
10u
C524 NC
1k
+3.0V
100k
R322
1u
1u
100k
C343
13
R161
2.7k
R321
14
R164
330u
20
C163 NC
R333
NC
Tx
*R332
C504
C521
C173
C165 NC
0.1u
21
Q161
C341
22
NC
NC
R178
X501
47k
R177
22
R171
C342
11
R334
15
NC
10p
NC
VREF
+3.0V
C172
C151
C133
VCCA
Rx
R305
C332
NC
12
3.0V
C523
R503
NC
C174
K0.22u
3.3k
3.3k
EEP_SCL
EEP_SDA
EEP_WP
MIN
VCCA
VREF
DCIN3/LIN1
DCIN2
DCIN1
DCIN0/LIN0
DOUBOUT
DOUBCAPP1
DOUBCAPP
DOUBCAPN
DOUBCAPN1
VBAT
COREOUT
VDDC2
GPIO[26]
GPIO[25]
GPIO[24]
GPIO[23]
GPIO[22]
GPIO[21]
GPIO[20]
Q171
10u
C126
C476 10p
220nH
100k
C503
10p
C123
L474
*L476
C479 10p
R501
10
NC
1000p
C124
C472 NC
C475 NC
R172
VCCA
NC
C185
K2.2u
10p
C120
910
R506 NC
23
24
25
C507
C522
C473 NC
*D472 NC
C175 1000p
R505 2.2k
89
*IC501
GND
88
87
86
26
27
28
29
30
31
32
33
34
35
C509 12p
10p
10p
*D473 5.1V
C477
C478
R160
10k
0.1u
C520
85
84
83
82
81
80
79
78
77
76
36
37
C514 0.1u
C513 K2.2u
C512 0.1u
C511 10u
C510 K1u
C530 10p
C508 10p
+3.0V
R612
+3.0V
FLASH_RST
SPI_CLK
SPI_DO
SPI_DI
SPI_CS
SPI_CS
FLASH_RST
KEYIN1
KEYIN2
KEYIN3
75
74
38
39
40
41
42
43
44
R509 NC
*R607
(5)
C519
0.1u
73
TXn
TRSW_n
ANT
VCC_FE
VDD_IF
VCC_IF
VDD_APU
VBAT_APU
XIN
XOUT
DCINS
PWM0
PWM1
SPOUTP
VCCPA
SPOUTN
LOUT
HSSPOUTP
MPWR
HSMIP
HSMIN
MIP
13.824M
NC
1
72
71
GPIO[0]/SCL_IIC
GPIO[1]/SDA_IIC
GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
GPIO[7]
GPIO[8]
VDDIO1
GPIO[9]
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
VDDIO2
GPIO[18]
GPIO[19]
(1)
(2)
(3)
(4)
70
69
68
67
SPP
MSG_LED
ANS_LED
SPI_DI
SPI_DO
SPI_CLK
EEP_SCL
EEP_SDA
EEP_WP
(6)
10k
*R604
REFERENCE
1XX : TEL LINE
3XX : POWER, CHARGE
4XX : MIC, SP
5XX : BBIC
6XX : FLASH, EEPROM, KEY, LCD
7XX : FOR DK
8XX : RF
C101 680p
L1T
(YELLOW)
L1R
C115
(GREEN)
27k
GAP
Caller ID
+6.5V
DCP
DCM
220nH
CHARGE+
220nH
CHARGE-
NC
CHG+2
NC
CHG-2
NC
+6.5V
Q301NC
ON/*OFF 5
VIN
NC
VSS
DCDC_IC
5
ZA1 NC
GND
NC: No Components
KX-TG4021/4022/4023ME SCHEMATIC DIAGRAM (Base Unit_Main)
14.3. Schematic Diagram (Base Unit_Operation)

2APVCC
MEG_LED
ANS_LED
KEYS_B
KEYIN1
KEYIN2
KEYIN3
KEYS_C
KEYS_D
KEYS_E
LED902
LED901 K
K
A
A
ERASE
1
2
ANS1
UP
1
MSG2
1
RPT
1
SKIP
MSG1
2
DOWN
1
2
STOP
1
LOCAT/INT
1
2
NC: No Components
KX-TG4021/4022/4023 SCHEMATIC DIAGRAM (Base Unit_Operation)
68
Memo
69
14.4. Schematic Diagram (Handset_Main)

Charge Current
BATTERY
F1
BATT+
GND
GND
GND
GND
R331
27k
R332
GND
27k
GND
C10
K2.2u
GND
GND
KEY_LED
ROW1
ROW2
ROW3
ROW0
NC
Q4
C2CP2
6.3V
330u
GND
C332
1u
CKM
LCD_CD
LCD_SCL
LCD_SDA
R2
Q2
D1
Q12
C331
1u
NC
SOCp
1.2k
SOCn
Q11
R404
NC
GND
GND
R7 CHARGE
NC
Q401
R403
NC
CHARGE_CTRL
R330
1M
Q400
C400
NC
C35
J56p
(MAX500mA
+1.8V
1.8V
LDO_CTRL
NC
R20
10
COL5
R400
NC
GND
1.8V
NC
D400
C342
NC
GND
BATTERY
R401
NC
BATT-
R45
0.1
R407
NC
GND
R402
GND
C341
J39p
GND
C340
NC
R406
NC
+1.8V
3.0V
C39 NC
NC
C3
C1CP1
6.3V
330u
NC
C150
5.6n
BATTERY
4.0V
CP+3.0V CP+4.0V
CP3.0V
CP4.0V
GND
D7
TX _RF
TXp
TXn
SHARP
2
1
TXON
BATTERY
To PA
COL3
R
TALK
1
2
2
1
SOFT_C
R215
0
1u
C50
1u
(9)
(10
LDO_CTRL
NC
RF-SHIELD
RE2
Q7
GND
NC: No Components
70
*LED23
*LED21
5
2
1
8
3
6
*RA32
120
1
8
*RA31
330
*RA30
330
4
NC *LED1
*LED4
*LED9
*LED5
*LED7
*LED8
*LED6
GND
(7)
(8)
(11
(12)
(13
(14)
(15
KEY_LED
NC
LCD B/L
NC
*LED3
*R249
NC
*LED2
*R248
0
KEY B/L
[RU]
CP+4.0V
VREFm
R27 820
R28 820
LEFT
1
2
2
1
ROW0 RIGHT
ROW1
BELL_LED_A
*C139
NC
*C138
1
3
2
10.368M
GND
0V
[EX /FX]
CP+3.0V
GND
VREFm
*X1
0.75V
*LED22
2
1
SOFT_B
2
1
SOFT_A
ROW2
ROW3
*LED12
C49
1
2
2
1
DOWN
SP
2
UP
GND
COL5
BELL LED
(Amber)
RA4
3.3k
250mVp-p
GND
D10p
C18
D10p
COL4
BATTERY
C17
RX _RF
TO RF BLOCK
1
2
3
4
5
R203
6
F56k
7
8
9
10
C47 1u 11
C43 10p 12
13
C48 NC 14
15
16
17
18
19
20
C182
GND
RF_RXp
RF_RXn
RXON
AST
2
7
2
4
1
COL2
81
2
1
2
5
1
COL1
C11
K0.1u
2
1
2
6
1
COL0
(4)
(5)
(6)
1k
100
GND
R23
PON
PSEL
VDD_PADRV
K10u
JTAG
C12
R63
JTAG
*IC1
S1
40
39
38
37
36
35
34
33
CHARGE
32
31 CHARGE_CTRL
SOCn
30 L46
SOCp
29 L47
28
27
COL0
26
COL1
25
COL2
24
COL3
23
COL4
22
21
C96
D10p
1k
C45
K0.1u
RA61
220
BELL_LED_A
3p
GND
LCD_RESET
VBAT2
CP_C1y
CP_C2x
CP_C1x
VBAT1
PAOUTn/P3_0
VDDPA
PAOUTp/P3_1
P1_7/CHARGE
CHARGE_CTRL
SOCn
SOCp
NTC/ADC2
ADC1/INT0/P1_0
ADC0/P3_3
PARADET/P3_4
RINGOUT/RINGING/P3_5
RINGn/P3_6
RINGp/P3_7
CIDINp/VREFp
C13
K0.1u
Power_adj
UTX
URX
RSTn
JTAG
P2_5/PCM_FSC/SF
P2_4/SCL1/PCM_DO/DP3
P2_3/SDA1/PCM_DI/DP2
P2_2/PCM_CLK/CLK100
P2_1/ECZ2/PWM1/LED4
P2_0/ECZ1/PWM0/LED3
VDD2
LDORF_CTRL
RF_SUPPLY2
RFP0n
RFP4
RFP3
VDD_PADR
VSS_PADR1
RF_TXp
RF_TXn
VSS_PADR2
RFP2
R66
10k
R64
STM
BAT
UTX
URX
GND
61
62
63
64
65
66
67
68
69
70
C46 71
72
10p
73
74
75
76
77
78
79
80
GND
P0_0/UTX
P0_1/URX
P0_2/SDA2
P0_3/SCL2
P0_4/SPI_EN
P0_5/SPI_CLK
P0_6/SPI_DO
P0_7/SPI_DI
P2_6/WTF_IN
P1_1/INT1/LE
P1_2/INT2/SK
P1_3/INT3/SIO
P1_4/INT4/TDOD
P1_5/INT5/RDI/VDDE
P2_7/BXTAL
VDD1
PON/P1_6
CP_VOUT2/LED2
CP_VOUT1/LED1
CP_C2y
C44
K0.1u
R225
0
LCD_CSB
NC
VSS_LNA1
RF_RXp
RF_RXn
VSS_LNA2
RFP1
RFP0
REF_RES
AVS_XTAL
XTAL2
XTAL1
AVD_XTAL
RF_SUPPLY1
LDO_CTRL
AVD
LSRn
LSRp
VREFm
MICh
CIDOUT/MICn
CIDINn/MICp
GND
R405 NC
100
R8
GND
+1.8V
C38
C55
D10p GND
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
1k
C51
K1u
C54 D10p
GND
Q9
GND
C52 K10u
1
2
3
4
R3
GND
C53 K10u
C97
D10p
+1.8V
GND
C121
NC
(1)
(2)
(3)
POWER
R31
100
C40
k0.1u
R6
NC
8
7
6
5
R4
NC
RA1
1k
R30
CHG(-)
1.5k
NC
C147
CHARGE
Terminal
C5 K1u
CHG(+)
GND
R807
1
DA801
R37
NC
C30
NC
GND
R36
NC CP+3.0V
2p
2p
GND
RF_RXp
GND
GND GND
BPF
W 0.15mm
L 5.0mm
1st layer
C172
K0.1u
GND RA40
10k
C802
C804
BATTERY
RF_RXn
C820
1.5p
RX_RF
4p
NC
C803
GND
*C826
C837
GND
10p
RXON
220
NC
27n
10p
C827
L801
TP_ANT1
C822
W 0.15mm
L 20+/-2mm
3rd layer
W 0.125mm
L 7.6mm
Gap 0.125mm
1st layer
GND
W 0.15mm
L 5.0mm
1st layer
3.3p
C881
TXn
*C834
1p
RA800
1k
TX_RF
R805 47
VDD_PADRV
GND
PSEL
PON
3
4
10p
2
1
W 0.15mm
L 3.0mm x2
1st layer
C819
1.6p
C805
C806
GND
GND
GND
R806
TXON
C864
10p
Power_adj
TXp
GND
C825
NC
GND
1
2
3
4
5
IC801
Pre-matching
220
VCC
PSET
PO
GND VCCS
POX
PI
PSEL
PIX
PAON
PRAMP
GND
C863 NC
W 0.15mm
L 20+/-2mm
3rd layer
GND
11
GND
10
9
8
7
6
1.6p
C813
Balun
C188
K1u
100n
C808
10p
3.6n
C810
3.6n
L803
GND
10p
(4)
(5)
(6)
3.3p
10p
C812
Q880
GNDGNDGND
GND
GND
GND
L802
BATTERY
C811
W 0.15mm
L 20+/-1mm
3rd layer
C809
GND
NC
R801:220k
R808:NC
*IC3
R880 NC
BATTERY
C880 NC
GND
100
SDA
R808 NC
A2
*R801 1.2k
SCL
*R802
A1
3.3n
A0
WP
C814
VCC
3p
C860
1
2
3
4
10p
C861
(1)
(2)
(3)
NC
NC
8
7
6
5
Q10
GND
GND
Sp-phone RX/Beep
1
+
SP-PHONE_SPEAKER
-
D13
D14
C72 NC
C73 NC
GND GND
GND
GND
LSRp
LSRp
(7)
(8)
LSRn
RX-AF (Handset)
(9)
(10)
LSRp
NC
TX _AF
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
CN5
1
2
3
4
5
6
7
8
9
10
11
12
*C580
NC
GND
MICn
RCVD21
C70
NC
D22
C71NC
RECEIVER
LSRn
MICp
GND
GND
GND
OPT_PWR
LCD_CSB
RESETB
A0
SCLK
SID
VDD
VDDA
VSS
V0
GND
GND
RS
/CS
SI
SCL
VDD
V0
VR
VOUT
CAP2CAP2+
CAP1CAP1+
VSS
/RES
GND
*C187
*C175
NC
*R578
NC
*C206*C203
1
NC
*C201
1
*C200 1
*R236
NC
430k*R231
*R232 820k
100p
*C105
NC
*C204
0.1
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
CN51
100p
*C103
R55
1k
*R233
GND GND GND GND GND
*C186
NC
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
*C106
*R54
10k
*R53
3.3k
J33p
*C107
*R52
1k
*R50
10k
*R51
470
10p
LCD_SDA
LCD_SCL
LCD_CD
LCD_RESET
LCD_CSB
*C104
(11)
(12)
(13)
(14)
(15)
C152
k1000p
RCV+
CP+3.0V
GND GND
GND
GND
MIC+
C113 D10p
R73
1
82
MIC AP1
R74
2
82
MICD4
D3
C74
C75
D10p
NC
NC D10p
VREFm
GND
VREFm
GND
to LCD UNIT (Monochrome 1.4inc 3Line/for TGA250) to LCD UNIT (Monochrome 1.8inc FullDot/for TGA651)
KX-TGA403 SCHEMATIC DIAGRAM (Handset_Main)
71
14.5.
Schematic Diagram (Charger Unit)
TP3
F1
R1 12
TP2
J1
TP4
TP1
SCHEMATIC DIAGRAM (Charger Unit)
72
15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)
CL2
YLW
ANT2
C351
CHG
CHARGE-
L476
RED
SP
RED WHT
DCP
DCM
BLK
3.0A
R301
ANT1
R321 C343
TDO
TDI
TCK
TMS
3
4
VBAT
CL1
R322
+6.5V
IC302
R605
R606
VBAT
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Component View))
73
STM/CKM
SPN
C477
D472
STM/CKM/P15
FCT
R305
C307
R302
DCDC_OUT
C322
C321
R307
SPP
RSTN
C476
R502
RTCK
RTCK
+3.0V
IC611
R612
Q601
R603
F301
C301
R304
C478
D473
8
R512
RA502
R601
R607
R507
DC
L474
IC601
4
R602
R335
VDDC
RA504
R334
L371
C514
C530
C521
D133
D153
RA151
C479
C601
R503
D361
Q161
C181
C513
C133
R604
C332
C611
C510
C151
R136
R152
C152
R151
PNLB1712Z
R506
C511
VCCA
VREF
R178
VBG
C661
+3.0V
C524
R505
C512
C475
C473
C472
C120
C124 C123
R166
URX
R181
C186
C525
R165
C167
C184
C171
C125
R121
UTX
R163
C163 C165
R161 R164
C122
C121
R167
C126
L361
C142
CHARGE+
R162
C168
R122
GRN
D143
R115
R112
C112
GND
PbF
VDDC
L1R
L372
C352
CHG-2
BLK
UTX
URX
L1T
D363
L362
CHG+2
RED
for JIG
GND
D142
C115
ANT1
C341
Q301
L301
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Main (Bottom View))

C331
R331
C892
SP
C502
C501
C517
IC331
R332
C523
C520
C519
C822
C504
ZA1
Q651
C820
C827
C826
C863
IC501
R892
NC
MSG_LED
10
KEYIN1 ANS_LED 2APVCC
KEYS_C KEYIN2
KEYS_D KEYIN3
KEYS_E
JJ301
IC301
C306
C303
C651
C302
C308
C305
C304
C342
C652
R333
D331
C653
C515
C894
C655
C516
DC
C654
RA501
C656
C518
R652
C658
C522
C507
C806
C811
C895
DA801
C805
C185
C505
R807
C172
R651
C812 L809
C859
C506
C660
WBX01
SW1
C891
C825
DA802
R177
C178
C132
R145
R133
Q111
C175
R172
R114
Q142
RED
R509
R371
YLW
PbF
PNLB1712Z
TEL
GRN
Q143
Q141
R141
R131
BLK
CHG
R372
C102
L102
RED
C111
C101
SA103
P101
C893
ANT2
KX-TG65XX/75XX/40XX
D101
C896
R501
R806
R891
C508
C509
C176
R144
X501
Q171
R142
C164
R171
C113
R113
C173
C503
C659
R175
R176
R160
C174
D113
HAK_CL1
SA101
WHT
C161
74
R111
81
81
RED
L101
BLK
15.1.2. Bottom View
15.2. Circuit Board (Base Unit_Operation)
PNLB1753Z
PbF
LED901
KX-TG4021/31H
ERASE
ANS1
MSG1
RPT
MSG2
SKIP
LED902
MSG3
UP
DOWN
MSG4
STOP
LOCAT/INT
KX-TG4021/4022/4023 CIRCUIT BOARD (Base Unit_Operation (Component View))
75
Memo
76
15.3. Circuit Board (Handset_Main)

KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
PNLB1734Y
RCV-
TGA650XX
TGA651XX
C175
C186
C187
C580
TGA250XX
TGA251XX
TGA403XX
C152
C70
D22
R55
C204
R231C201C200
C105
C206
R54
C203
R53 R50
R236
C107
C138
C73
RA32
Q880
C819
8
80 R806
C
C861 C825
C826
C822
R64
C45
C46
C820
JTAG
STM
R63
R405
R66
C44 R225
R807
RA1
IC1
C48
C40
C54
Q2
C49
C50
C97
C17
C96
R215
C12
C18 R28
X1
C47
R203
C43
21
C188
L46
L47
C13
C11
R401
R37
R36
C39 C30
R23
R27
R20
C2
R332
Q11
R331
C331
R249
C51
CP4.0V
R248 CP3.0V
C172
C332
Q12
C52
C53
C55
X_CLK
(10.368MHZ)
RA40
Q10
R403
R404
C38
R406
R407
CLK
Q401
POWER
D13
C881
C805
L801
C860
C182
C400
R880
C834
C10
1.8V RA4
D400
Q400
SP+
RED
C72
R801
R808
C880
RA800
R802
R805
C837
R402
R400
IC801
C802
SP-
D14
C863 C864
C814
C809
C810
DA801
C827
C812
C803
C813
L802
C806
L803
C811
C804
BLK
SPEAKER
C139
R232
R233
C103
C71
R578
D21
C106
C104
RCV+
BL
K
TP_ANT1
R
ED
R
EC
EI
VE
R
PbF
IC3
1
R330
C342
Q7
RA30 RA31
D1
C341
C1
RCV-
MIC+
RCV+
UTX
R4
GND
R45
C35
R7
R30
R8
R3
C121
F1
C150
BATT+
Q9
R31
BATT+
MICURX
BAT
Q4
C3
D7
R6
R2
RA61
C340
BATT-
URX
UTX
JIG
GND
BAT
BATT-
C147
R74
C75
C74
R73
CHG(+)
CHG (+)
C5
D3
CHG(-)
D4
C113
MIC
MIC+
CHG (-)
MIC-
KX-TGA403 CIRCUIT BOARD (Handset_Main (Component View))
77
15.3.2. Bottom View

LED12
PNLB1734Y
PbF
KX-TGA650XX
KX-TGA651XX
KX-TGA250XX
KX-TGA251XX
KX-TGA403XX
CN5
12
TGA650XX
TGA651XX
CN51
TGA250XX
TGA251XX
TGA403XX
R51
SOFT_A
LED23
LED3
LED2 LED22
LED1 LED21
R52
SOFT_B
SOFT_C
UP
TALK
S1
LEFT
RIGHT
LED6
LED8
SP
DOWN
3
LED7
LED5
LED9
LED4
MIC
KX-TGA403 CIRCUIT BOARD (Handset_Main (Bottom View))
78
15.4. Circuit Board (Charger Unit)

PQUP11532Y
R1
J1
PNLP1029YA
PbF
CIRCUIT BOARD (Charger unit (Component View))
15.4.2. Bottom View
TP4 (GND)
TP3
PNLP1029YA
1
2
PQUP11532Y
F1
PbF
TP4
J1
TP3
CIRCUIT BOARD (Charger unit (Bottom View))
79
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
2
9
5
6
10
7
11
A
12
8
PCB2
14(*1)
13
14(*1)
13
E1
A
PCB1
15
16
Ref.No.
Figure
A
2.6 x 8mm
Note:
(*1) The SPACERs (No.14) are cut from the excess parts of SPACER (No.108) of Cabinet and Electrical Parts (Handset)
(P.81).
80
16.2. Cabinet and Electrical Parts (Handset)

111
B
E106
107
E105
104
E101(*1)
E103
E107
106
105
103
102
E102
108
E104
MIC100
PCB100
110
109
112
101
120
118
116
(*2)
119 (*3)
115
114
117
Battery cover
Ref.No.
Figure
Spacer (No.119)
B
28
Stick it between
ribs.
mm
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.47).
(*2) The rechargeable Ni-MH battery HHR-4DPA or HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 119) to the exact location described above.
81
113
16.3. Cabinet and Electrical Parts (Charger Unit)

200
200-1
PCB200
B
200-3
200-2
B
200-4
Ref.No.
B
82
Figure
16.4. Accessories
A1
A2
A3
83
16.5. Replacement Parts List
Safety
1. RTL (Retention Time Limited)

Note:
The RTL marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will
continue to be available only for a specific period of
time.
This period of time depends on the type of item, and
the local laws governing parts and product retention.
At the end of this period, the item will no longer be
available.
2. Important safety notice
Components identified by the mark indicates special
characteristics important for safety. When replacing any
of these components, only use specified manufacture's
parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column
shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms () k=1000, M=1000k
All capacitors are in MICRO FARADS (F) p=F
*Type & Wattage of Resistor
Ref.
No.
13
14
15
16
Safety
Ref.
No.
PCB1
IC302
IC331
IC501
IC601
IC611
Q111
Q141
Q142
Q161
Q171
Q651
D101
D113
D133
D143
D473
DA801
DA802
SA101
16.5.1. Base Unit
R111
R112
R113
R114
R115
R121
R122
R131
R133
R141
R142
R145
R151
R152
R160
R161
R162
R163
R164
16.5.1.1. Cabinet and Electrical Parts
1
2
3
4
5
6
7
8
9
10
11
12
Part No.
PNKM1132W3
K2ECYZ000001
PQJJ1T039S
L0AA02A00087
PQHG10729Z
PQHR11313Z
PNKE1056Z1
PNJT1047Z
PNBC1307Z1
PNHR1259Z
PNBC1308Z1
PNJK1079Z
Part Name & Description Remarks

CABINET BODY
JACK, DC
JACK, MODULAR
SPEAKER
RUBBER PARTS, SPEAKER
GUIDE, SPEAKER
CASE, CHARGE TERMINAL
CHARGE TERMINAL
BUTTON, NAVIGATOR KEY
GUIDE, BUTTON HOLDER
BUTTON, MESSAGE
KEYBOARD SWITCH
ANTENNA
SPACER, ANTENNA
CABINET COVER
RUBBER
PARTS,
CUSHION
PS-HB
FOOT
16.5.1.2. Main P.C. Board Parts
RA151
RA501
RA502
RA504
Ref.
No.
PNLA1030Z
PNYE1027Z
PNKF1099Y1
PQHA10023Z
Note:
(*1) When replacing IC611 or X501, make the adjustment
using PNZZTG4021ME. Refer to How to download the
data (P.54) of Things to Do after Replacing IC or X'tal.
L101
L102
L361
L371
L476
L501
L809
Safety
Part No.
PS-HB
ABS-HB
PS-HB
PS-HB
PS-HB
AS-HB
84
Part No.
PNWP14021MEH MAIN
P.C.BOARD
ASS'Y
(RTL)
(ICs)
C0CBAYG00016 IC
C0EBE0000124 IC
C2HBCY000064 IC(BBIC)
PNWI24021MEH IC(FLASH)
PNWI14021MEH IC(EEPROM) (*1)
(TRANSISTORS)
2SC6054JSL
TRANSISTOR(SI)
B1ACGP000008 TRANSISTOR(SI)
PQVTBF822T7 TRANSISTOR(SI)
2SD0874AS
TRANSISTOR(SI)
2SC6054JSL
TRANSISTOR(SI)
B1GFCFEN0011 TRANSISTOR(SI)
(DIODES)
PQVDMD5S
DIODE(SI)
MA111
DIODE(SI)
MA111
DIODE(SI)
MANV250GEL
DIODE(SI)
MAZ805100L
DIODE(SI)
B0DDCD000001 DIODE(SI)
(COILS)
PQLQXF330K
COIL
PQLQXF330K
COIL
G1CR22J00006 COIL
G1CR22J00006 COIL
G1CR22J00006 COIL
G1CR10J00010 COIL
G1C7N5JA0044 COIL
(RESISTOR ARRAYS)
D1H410220001 RESISTOR ARRAY
EXB28V330
RESISTOR ARRAY
EXB28V103
RESISTOR ARRAY
(VARISTOR)
J0LF00000048 VARISTOR
(SURGE
ABSORBER)
(RESISTORS)
PQ4R10XJ104 100k
PQ4R10XJ104 100k
ERJ3GEYJ103 10k
ERJ3GEYJ473 47k
ERJ12YJ273U 27k
ERJ3GEYJ394 390k
ERJ3GEYJ394 390k
PQ4R18XJ106 10M
ERJ3GEYJ334 330k
ERJ3GEYJ104 100k
PQ4R18XJ272 2.7k
ERJ2GEJ222
2.2k
ERJ2GEJ104
100k
ERJ2GEJ474X 470k
ERJ3GEYJ911 910
ERJ3GEYJ104 100k
ERJ3GEYJ273 27k
ERJ12YJ120
12
ERJ3GEYJ272 2.7k
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Safety
Ref.
No.
R165
R167
R171
R172
R175
R176
R178
R181
R321
R322
R331
R332
R334
R335
R371
R372
R501
R502
R505
R512
R604
R605
R606
R607
R612
R651
R652
R806
R807
R891
R892
Part No.
ERJ3GEYJ273
ERJ12YJ270
ERJ2GEJ220
ERJ2GEJ104
ERJ2GEJ561
ERJ2GEJ101
ERJ2GEJ102
ERJ2GE0R00
ERJ2RKF1400
ERJ2RKF1000
ERJ3EKF4702
ERJ3EKF6802
ERJ2GEJ473
ERJ2GE0R00
ERJ1TYJ5R6U
ERJ1TYJ5R6U
ERJ3GEYJ100
ERJ2GEJ330
ERJ2GEJ222
ERJ2GEJ102
ERJ2GEJ103
ERJ2GEJ332
ERJ2GEJ332
ERJ2GE0R00
ERJ2GEJ103
ERJ3GEYJ681
ERJ3GEYJ681
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
ERJ2GEJ471
C101
C102
C111
C112
C113
C115
C120
C121
C122
C123
C126
C132
C142
C151
C152
C161
C167
C171
C173
C175
C176
C178
C184
C186
C302
C306
C321
C322
C341
C342
C343
C351
C352
C476
C477
C478
C479
C501
C502
C503
C504
F1K2H681A008
F1K2H681A008
F1J2A473A024
F1J2A473A024
PQCUV1A684KB
F1L2E2240004
ECUE1H102KBQ
F1K2H681A008
F1K2H681A008
ECUE1H100DCQ
ECUE1H100DCQ
ECUV1H103KBV
ECUV1H103KBV
ECUE1H100DCQ
ECUE1C103KBQ
F2G1H1000009
ECUV1H102KBV
ECUV1C223KBV
ECUV1A224KBV
ECUE1H102KBQ
PQCUV0J106KB
ECUE1C223KBQ
ECUV1A105KBV
ECUE1H100DCQ
ECUE1H100DCQ
F2A1C1010119
ECUV1A105KBV
ECUE1H100DCQ
F2A1A3310040
ECUV1C104KBV
ECUE1H100DCQ
ECUV1C105KBV
ECUV1C104KBV
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECJ1VB0G106M
ECJ1VB0G106M
ECUE0J105KBQ
Safety

27k
27
22
100k
560
100
1k
0
140
100
47k
68k
47k
0
5.6
5.6
10
33
2.2k
1k
10k
3.3k
3.3k
0
10k
680
680
470
470
470
470
(CAPACITORS)
680p
680p
0.047
0.047
0.68
0.22
0.001
680p
680p
10p
10p
0.01
0.01
10p
0.01
10
0.001
0.022
0.22
0.001
10
0.022
1
10p
10p
100
1
10p
330
0.1
10p
1
0.1
10p
10p
10p
10p
0.1
10
10
1
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Ref.
No.
C505
C506
C507
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C530
C601
C611
C805
C806
C810
C811
C812
C813
C820
C822
C825
C826
C827
C859
C863
C891
C892
C893
C894
C895
C896
Part No.
ECJ1VB0G106M
ECUV1A105KBV
ECUV1A225KB
ECUE1H100DCQ
ECUE1H120JCQ
ECUV1A105KBV
ECJ1VB0G106M
ECUE1A104KBQ
ECUV1A225KB
ECUE1A104KBQ
ECUV1A105KBV
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE0J105KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1A104KBQ
F1G1H2R7A480
F1G1H2R7A480
F1G1H2R4A480
F1G1H100A723
F1G1HR90A480
F1G1H2R0A480
F1G1H1R5A480
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H2R2A480
F1G1H1R5A480
F1G1H5R0A480
F1G1H5R0A480
F1G1H3R0A480
F1G1H2R2A480
F1G1H1R2A480
F1G1H2R2A480
E1
WBX10SH-3.5G
P101
F301
X501
D4DAY220A022
K5H302Y00003
H0J138500011

10
1
2.2
10p
12p
1
10
0.1
2.2
0.1
1
0.1
0.1
0.1
0.1
0.1
1
10p
10p
0.1
0.1
2.7p
2.7p
2.4p
10p
0.9p
2p
1.5p
10p
10p
10p
10p
2.2p
1.5p
5p
5p
3p
2.2p
1.2p
2.2p
(OTHERS)
LEAD
WIRE,
PARALLEL
WIRE
THERMISTOR (POSISTOR)
FUSE
CRYSTAL OSCILLATOR (*1)
16.5.1.3. Operational P.C. Board Parts

Safety
Ref.
No.
PCB2
LED901
LED902
Part No.
PNWP2TG4031H OPERATIONAL
ASS'Y (RTL)
(DIODES)
LNJ237W82RA LED
LNJ237W82RA LED
P.C.BOARD
S
S
16.5.2. Handset
Safety
85
Ref.
No.
101
102
103
104
105
106
107
108
109
Part No.
PNGP1087Y5
PNYE1026Z
PNKM1123Y6
PNHS1072Z
PQHS10467Z
L0AD02A00043
PQHG10729Z
PNYE1027Z
PNBC1003Y3

PANEL, LCD
TAPE, DOUBLESIDED
CABINET BODY
SPACER, RECEIVER NET
COVER, SPEAKER NET
RECEIVER
RUBBER PARTS, RECEIVER
SPACER, CUSHION LCD
BUTTON, VOLUME KEY
PMMA-HB
PS-HB
ABS-HB
Safety
Ref.
No.
110
111
112
113
114
115
116
117
118
119
120
Part No.
PNJK1071V
PNHX1165Z
PNJT1027Z
PNJT1026Z
PQHR11315Z
L0AA02A00095
PQHS10784Y
PQJC10056W
PNKF1093Z1
PNHS1079Z
PNKK1038Y1

KEYBOARD SWITCH
COVER, LCD SHEET
CHARGE TERMINAL (L)
CHARGE TERMINAL (R)
GUIDE, SPEAKER
SPEAKER
SPACER, SPEAKER NET
BATTERY TERMINAL
CABINET COVER
SPACER, BATTERY
LID, BATTERY
Safety
L46
L47
ABS-HB
R3
R7
R8
R20
R23
R27
R28
R30
R31
R45
R50
R51
R52
R53
R54
R55
R63
R64
R66
R73
R74
R203
R215
R225
R231
R232
R248
R330
R331
R332
R801
R802
R805
R806
R807
ABS-HB
ABS-HB

Note:
(*1) Reconfirm the model No. written on the handset's name
plate when replacing PCB100. Because the model No. of
the optional handset may differ from the included handset.
(*2) When replacing IC3 or X1, make the adjustment
using PNZZTG4021ME. Refer to Handset (P.55) of Things
to Do after Replacing IC or X'tal.
(*3) When replacing the handset LCD, See How to
Replace the Handset LCD (P.47).
(*4) When removing E106, use special tools (ex. Hot air
disordering tool).
Safety
Ref.
No.
PCB100
IC1
IC3
IC801
Q2
Q4
Q7
Q9
Q11
Q12
D1
D7
D13
D14
D21
D22
DA801
LED4
LED5
LED6
LED7
LED8
LED9
LED21
LED22
LED23
F1
L801
L802
L803
RA1
RA4
RA30
RA31
RA32
RA40
RA61
Part No.
PNWPGA403MER MAIN
P.C.BOARD
ASS'Y
(RTL) (*1)
(ICs)
C1CB00003361 IC (BBIC (FLASH))
PNWIGA403MER IC (EEPROM) (*2)
C1CB00001842 IC
(TRANSISTORS)
B1ADGE000004 TRANSISTOR(SI)
B1ADGE000004 TRANSISTOR(SI)
UN9219J
TRANSISTOR(SI)
2SC6054JSL
TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
B1ADCF000161 TRANSISTOR(SI)
(DIODES)
MA2YD2120L
DIODE(SI)
MA2ZD0200L
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
MA8043M
DIODE(SI)
(LEDS)
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000190 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
(COILS)
PQLQR2M5N6K COIL
G1C27NJ00010 COIL
G1C3N6ZA0063 COIL
G1C3N6ZA0063 COIL
(RESISTOR ARRAYS)
D1H83314A013 RESISTOR ARRAY
EXB28V121JX RESISTOR ARRAY
EXB28V103
RESISTOR ARRAY
Ref.
No.
RA800
C1
C2
C5
C10
C11
C12
C13
C17
C18
C35
C40
C43
C44
C45
C46
C47
C49
C50
C51
C52
C53
C54
C55
C72
C73
C74
C75
C96
C97
C103
C104
C105
S
S
S
S
S
S
86
Part No.

(IC FILTERS)
J0JDC0000045 IC FILTER
J0JDC0000045 IC FILTER
(RESISTORS)
ERJ2GEJ102
1k
ERJ2GEJ122
1.2k
ERJ2GEJ101
100
ERJ2GEJ100
10
ERJ2GEJ102
1k
ERJ2GEJ821
820
ERJ2GEJ821
820
ERJ3GEYJ152 1.5k
ERJ2GEJ101
100
ERJ6RSJR10V 0.1
ERJ2GEJ103
10k
ERJ2GEJ471
470
ERJ2GEJ102
1k
ERJ2GEJ332
3.3k
ERJ2GEJ103
10k
ERJ2GEJ102
1k
ERJ2GEJ101
100
ERJ2GEJ103
10k
ERJ2GEJ102
1k
ERJ2GEJ820
82
ERJ2GEJ820
82
D0GA563ZA006 56k
ERJ2GE0R00
0
ERJ2GE0R00
0
ERJ2GEJ824
820k
ERJ2GEJ434X 430k
ERJ2GE0R00
0
ERJ2GEJ105X 1M
ERJ2GEJ273X 27k
ERJ2GEJ273X 27k
ERJ2GEJ122
1.2k
ERJ2GEJ101
100
ERJ2GEJ470
47
ERJ2GEJ221
220
ERJ2GEJ221
220
(CAPACITORS)
F2A0J3310067 330
F2A0J3310067 330
ECUV1A105KBV 1
ECUV1A225KB 2.2
ECUE1A104KBQ 0.1
PQCUV0J106KB 10
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H560JCQ 56p
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUE1A104KBQ 0.1
ECUE1A104KBQ 0.1
ECUE1H100DCQ 10p
ECUV1A105KBV 1
ECUV1A105KBV 1
ECUV1A105KBV 1
ECUV1A105KBV 1
PQCUV0J106KB 10
PQCUV0J106KB 10
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H100DCQ 10p
ECUE1H101JCQ 100p
F1G1H100A723 10p
ECUE1H101JCQ 100p
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Safety
Ref.
No.
C107
C113
C152
C172
C182
C188
C200
C201
C203
C204
C331
C332
C341
C802
C803
C804
C805
C806
C808
C809
C810
C811
C812
C813
C814
C819
C822
C825
C826
C827
C834
C860
C861
MIC100
E101
E102
E103
E104
E105
E106
E107
X1
Part No.
Safety
ECUE1H330JCQ
ECUE1H100DCQ
ECUE1H102KBQ
ECUE1A104KBQ
F1G1H3R0A480
ECUE0J105KBQ
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUV1C104KBV
ECUE0J105KBQ
ECUE0J105KBQ
ECUE1H390JCQ
F1G1H2R0A480
F1G1H1R5A480
F1G1H2R0A480
F1G1H3R3A480
F1G1H3R3A480
ECUE1A104KBQ
F1G1H100A723
F1G1H1R6A480
F1G1H100A723
F1G1H100A723
F1G1H1R6A480
ECUE1H332KBQ
F1G1H100A723
F1G1H100A723
F1G1H100A723
F1G1H4R0A480
F1G1H100A723
F1G1H1R0A480
F1G1H100A723
F1G1H3R0A480
33p
S
10p
0.001
0.1
3p
1
1
1
1
0.1
1
1
39p
2.0p
1.5p
2.0p
3.3p
3.3p
0.1
10p
1.6p
10p
10p
1.6p
0.0033
10p
10p
10p
4p
10p
1p
10p
3p
(OTHERS)
L0CBAY000032 MICROPHONE
L5DYBYY00012 LIQUID CRYSTAL DISPLAY
(*3)
PNHR1247Z
TRANSPARENT PLATE, LCD PMMA-HB
PNHR1246Z
GUIDE, LCD
ABS-HB
PNHX1254Z
COVER, LCD
PNLA1020Z
ANTENNA
PNMC1013Z
CASE,MAGNETIC
SHIELD
(*4)
PNVE1002Z
BATTERY TERMINAL
H0J103500033 CRYSTAL OSCILLATOR (*2)
Ref.
No.
F1
Part No.
(FUSE)
K5H302Y00003 FUSE
16.5.4. Accessories
Note:
You can download and refer to the Operating Instructions
(Instruction book) on TSN Server.
Safety
Ref.
No.
A1
Part No.
PQLV219Y
AC ADAPTOR
A2
A3
PQJA10075Z
PNKL1010Z1
CORD, TELEPHONE
STAND, WALLMOUNT
ABS-HB
16.5.5. Screws
Safety
Ref.
No.
A
B
Part No.
XTB26+8GFJ
XTB2+8GFJ

TAPPING SCREW
TAPPING SCREW
16.5.6. Fixtures and Tools

Note:
(*1) See Equipment Required (P.48), and The Setting
Method of JIG (P.48)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.47)
Safety
Ref.
No.
Part No.
PQZZ1CD300E
JIG CABLE (*1)
PNZZTG4021ME BATCH FILE CD-ROM (*1)
PQZZ430PIR
TIP OF SOLDERING IRON
(*2)
PQZZ430PRB
RUBBER OF SOLDERING IRON
(*2)
16.5.3. Charger Unit

Safety
Ref.
No.
200
Part No.
PNLC1010ZT
200-1
200-2
200-3
200-4
PNKM1131Y2
PNJT1010Z
PNKF1098Z1
PQHA10023Z

CHARGER
UNIT
ASS'Y
without
NAME
PLATE
(RTL)
(for
KXTG4022MET)
(for
KXTG4023MET)
CABINET BODY
PS-HB
CHARGE TERMINAL
CABINET COVER
PS-HB
RUBBER
PARTS,
FOOT
CUSHION

Safety
Ref.
No.
PCB200
J1
R1
Part No.
PNWPTGA641CH MAIN
P.C.BOARD
(RTL)
(JACK)
K2ECYB000001 JACK
(RESISTOR)
ERG2SJ120
12
K.T
KXTG4021MET
KXTG4022MET
KXTG4023MET
KXTGA403MET
ASS'Y
87

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ORDER NO.

Panasonic System Networks Co., Ltd. 2010

For Service Technicians

1. Danger of explosion if battery is incorrectly replaced.

About Lead Free Solder (PbF: Pb free)

Suggested PbF Solder

TDD Frame Format

Signal Flowchart in the Radio Parts

KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_Main)

Operational P.C. Board

Block Diagram (Base Unit_Main)

Block Diagram (Base Unit_RF Part)

KX-TG4021/4022/4023 BLOCK DIAGRAM (Base Unit_RF Part)

Circuit Operation (Base Unit)

BBIC (Base Band IC: IC501)

Voice Message Recording/Play back

Flash Memory (IC601)

Following information data is stored.

Following information data is stored.

Power Supply Circuit/Reset Circuit

The voltage from the AC adaptor is supplied to the charge circuits.

Telephone Line Interface

Telephone Line Interface Circuit:

Parallel Connection Detect Circuit/Auto Disconnect Circuit

Calling Line Identification (Caller ID)/Call Waiting Caller ID

Call Waiting Caller ID

Block Diagram (Handset)

WP, CLK, DATA

KX-TGA403 BLOCK DIAGRAM (Handset)

Block Diagram (Handset_RF Part)

KX-TGA403 BLOCK DIAGRAM (Handset_RF Part)

Circuit Operation (Handset)

Power Supply Circuit/Reset Circuit

Battery Low/Power Down Detector

Circuit Operation (Charger Unit)

RF part signal route

5 Location of Controls and Components

Frequently Used Items (Base Unit)

Desired Number (hex)

Frequently Used Items (Handset)

Desired Number (hex.)

How to Clear User Setting (Handset Only)

10.1.1. Check Power

10.1.2. Check Record

10.1.3. Check Playback

10.1.4. Check Battery Charge

10.1.4.3. Charger Unit

10.1.5. Check Link

10.1.6. Check the RF part

After All the Checkings or Repairing

10.1.6.2. RF Check Flowchart

10.1.6.3. Check Table for RF part

X'tal Frequency confirmation

HS, BU Mode: [Adjustment]

BU (Base Unit) Check

1. Place Regular HS 15 cm away from a

1. Place Regular BU 15 cm away from a

1. Place Regular HS 15 cm away from a

1. Place Regular BU 15 cm away from a

1. Register Regular HS to BU (to be

1. Register HS (to be checked) to Regular

10.1.6.4. TEST RANGE Check

Range Confirmation RX TEST

BU (Base Unit) Check