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/ VN920-B5 / VN920SO
RDS(on)
IOUT
VCC
VN920-B5
16m
30 A
36 V
VN920SO
P2PAK
PENTAWATT
SO-16L
ORDER CODES
PACKAGE
TUBE
PENTAWATT VN920
P2PAK
SO-16L
DESCRIPTION
The VN920, VN920-B5, VN920SO is a monolithic
device made by using STMicroelectronics
VIPower M0-3 Technology, intended for driving
any kind of load with one side connected to
VN920-B5
VN920SO
T&R
VN920-B513TR
VN920SO13TR
BLOCK DIAGRAM
VCC
OVERVOLTAGE
DETECTION
VCC
CLAMP
UNDERVOLTAGE
DETECTION
GND
Power CLAMP
DRIVER
INPUT
OUTPUT
LOGIC
CURRENT LIMITER
VDS LIMITER
IOUT
K
CURRENT
SENSE
OVERTEMPERATURE
DETECTION
February 2003
1/23
Value
P2PAK SO-16L
41
- 0.3
- 200
Internally Limited
- 21
+/- 10
-3
Parameter
PENTAWATT
DC Supply Voltage
Reverse DC Supply Voltage
DC Reverse Ground Pin Current
DC Output Current
Reverse DC Output Current
DC Input Current
Current Sense Maximum Voltage
Unit
V
V
mA
A
A
mA
V
+15
- INPUT
4000
- CURRENT SENSE
2000
- OUTPUT
5000
- VCC
Maximum Switching Energy
5000
Electrostatic Discharge
(Human Body Model: R=1.5K; C=100pF)
VESD
EMAX
PTOT
Tj
Tc
TSTG
364
96.1
96.1
Internally limited
- 40 to 150
- 55 to 150
OUTPUT
VCC
VCC
INPUT
GND
N.C.
CSENSE
PENTAWATT
16
VCC
OUTPUT
GND
OUTPUT
INPUT
OUTPUT
CSENSE
N.C.
OUTPUT
OUTPUT
OUTPUT
CSENSE
VCC
N.C.
INPUT
GND
VCC
OUTPUT
8
VCC
SO-16L
P2PAK
VCC
IOUT
OUTPUT
I IN
VOUT
INPUT
VIN
I SENSE
CURRENT SENSE
VSENSE
GND
IGND
2/23
352
mJ
8.3
W
C
C
C
Parameter
Thermal Resistance Junction-case
Thermal Resistance Junction-lead
Thermal Resistance Junction-ambient
Max
Max
Max
PENTAWATT
1.3
61.3
Value
P2PAK
1.3
Unit
SO-16L
C/W
C/W
C/W
15
65 (**)
51.3 (*)
(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick).
(**) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick) connected to all VCC pins.
Parameter
Operating Supply Voltage
Undervoltage Shut-down
Overvoltage Shut-down
IOUT=10A; Tj=25C
16
Unit
V
V
V
m
IOUT=10A
32
Clamp Voltage
IOUT=3A; VCC=6V
ICC=20mA (See note 1)
48
10
55
55
25
m
V
A
Supply Current
10
20
5
50
0
5
3
mA
A
A
A
A
Max
Unit
s
s
On State Resistance
Test Conditions
Min
5.5
3
36
41
IL(off1)
IL(off2)
IL(off3)
IL(off4)
VIN=VOUT=0V
VIN=0V; VOUT=3.5V
VIN=VOUT=0V; Vcc=13V; Tj=125C
VIN=VOUT=0V; Vcc=13V; Tj=25C
0
-75
Test Conditions
RL=1.3 (see figure 2)
RL=1.3 (see figure 2)
Min
Typ
13
4
Max
36
5.5
SWITCHING (VCC=13V)
Symbol
td(on)
td(off)
Parameter
Turn-on Delay Time
Turn-off Delay Time
Typ
50
50
See
relative
diagram
See
relative
diagram
V/s
V/s
LOGIC INPUT
Symbol
VIL
IIL
VIH
IIH
VI(hyst)
VICL
Parameter
Input Low Level
Low Level Input Current
Input High Level
High Level Input Current
Input Hysteresis Voltage
Input Clamp Voltage
Test Conditions
VIN=1.25V
Min
Typ
1
3.25
VIN=3.25V
IIN=1mA
IIN=-1mA
Max
1.25
10
0.5
6
6.8
-0.7
Unit
V
A
V
A
V
V
V
3/23
ISENSEO
VSENSE
VSENSEH
RVSENSEH
tDSENSE
Parameter
IOUT/ISENSE
Current Sense Ratio Drift
IOUT/ISENSE
Current Sense Ratio Drift
IOUT/ISENSE
Current Sense Ratio Drift
Analog Sense Leakage
Current
Test Conditions
IOUT=1A; VSENSE=0.5V;
Tj= -40C...150C
IOUT=1A; VSENSE=0.5V;
Tj= -40C...+150C
IOUT=10A; VSENSE=4V; Tj=-40C
Tj=25C...150C
IOUT=10A; VSENSE=4V;
Tj=-40C...+150C
IOUT=30A; VSENSE=4V; Tj=-40C
Tj=25C...150C
IOUT=30A; VSENSE=4V;
Tj=-40C...+150C
VCC=6...16V; IOUT=0A;VSENSE=0V;
Tj=-40C...+150C
Min
Typ
Max
3300
4400
6000
-10
+10
4200
4900
6000
4400
4900
5750
-8
+8
4200
4900
5500
4400
4900
5250
Unit
-6
+6
10
V
5.5
400
500
Typ
175
Max
200
15
45
75
Unit
C
C
C
A
75
PROTECTIONS
Symbol
TTSD
TR
Thyst
Ilim
Vdemag
VON
Parameter
Shut-down Temperature
Reset Temperature
Thermal Hysteresis
DC Short Circuit Current
Turn-off Output Clamp
Voltage
Output Voltage Drop
Limitation
Test Conditions
VCC=13V
Min
150
135
7
30
5V<VCC<36V
IOUT=2A; VIN=0V; L=6mH
IOUT=1A; Tj=-40C....+150C
50
mV
4/23
IOUT/I SENSE
6500
6000
max.Tj=-40C
5500
max.Tj=25...150C
5000
typical value
min.Tj=25...150C
4500
min.Tj=-40C
4000
3500
3000
0
10
12
14
16
18
20
22
24
26
28
30
32
IOUT (A)
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
tr
10%
tf
t
ISENSE
90%
INPUT
tDSENSE
td(on)
td(off)
5/23
INPUT
OUTPUT
SENSE
H
L
H
L
0
Nominal
H
L
L
L
VSENSEH
0
H
L
L
L
0
0
H
L
L
L
0
0
(Tj<TTSD) 0
H
L
L
H
(Tj>TTSD) VSENSEH
0
H
L
H
L
< Nominal
0
II
TEST LEVELS
III
IV
-25 V
+25 V
-25 V
+25 V
-4 V
+26.5 V
-50 V
+50 V
-50 V
+50 V
-5 V
+46.5 V
-75 V
+75 V
-100 V
+75 V
-6 V
+66.5 V
-100 V
+100 V
-150 V
+100 V
-7 V
+86.5 V
I
C
C
C
C
C
C
Delays and
Impedance
2 ms 10
0.2 ms 10
0.1 s 50
0.1 s 50
100 ms, 0.01
400 ms, 2
IV
C
C
C
C
C
E
CONTENTS
All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device is not performed as designed after exposure to disturbance
and cannot be returned to proper operation without replacing the device.
6/23
NORMAL OPERATION
INPUT
LOAD CURRENT
SENSE
UNDERVOLTAGE
VCC
VUSDhyst
VUSD
INPUT
LOAD CURRENT
SENSE
OVERVOLTAGE
VOV
VCC
VOVhyst
INPUT
LOAD CURRENT
SENSE
SHORT TO GROUND
INPUT
LOAD CURRENT
LOAD VOLTAGE
SENSE
SHORT TO VCC
INPUT
LOAD VOLTAGE
LOAD CURRENT
SENSE
<Nominal
<Nominal
OVERTEMPERATURE
Tj
TTSD
TR
INPUT
LOAD CURRENT
SENSE
ISENSE=
VSENSEH
RSENSE
7/23
VCC
Rprot
INPUT
Dld
C
Rprot
OUTPUT
CURRENT SENSE
RSENSE
GND
VGND
GND PROTECTION
REVERSE BATTERY
NETWORK
AGAINST
RGND
DGND
C I/Os PROTECTION:
If a ground protection network is used and negative
transients are present on the VCC line, the control pins will
be pulled negative. ST suggests to insert a resistor (Rprot )
in line to prevent the C I/Os pins to latch-up.
The value of these resistors is a compromise between the
leakage current of C and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up limit
of C I/Os.
-VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V
5k Rprot 65k.
Recommended Rprot value is 10k.
8/23
Iih (uA)
4.5
Vin=3.25V
3.5
3
5
2.5
4
2
3
1.5
0.5
0
-50
-25
25
50
75
100
125
150
175
-50
-25
25
Tc (C)
50
75
100
125
150
175
100
125
150
175
100
125
150
175
Tc (C)
Vicl (V)
3.6
8
7.8
3.4
Iin=1mA
7.6
3.2
7.4
3
7.2
2.8
7
6.8
2.6
6.6
2.4
6.4
2.2
6.2
6
-50
-25
25
50
75
100
125
150
-50
175
-25
25
50
75
Tc (C)
Tc (C)
Vil (V)
Vhyst (V)
2.6
1.5
1.4
2.4
1.3
2.2
1.2
2
1.1
1.8
1
0.9
1.6
0.8
1.4
0.7
1.2
0.6
0.5
-50
-25
25
50
75
Tc (C)
100
125
150
175
-50
-25
25
50
75
Tc (C)
9/23
Overvoltage Shutdown
Vov (V)
Ilim (A)
50
100
48
90
46
80
44
70
42
60
40
50
38
40
36
30
34
20
32
10
Vcc=13V
30
0
-50
-25
25
50
75
100
125
150
175
-50
-25
25
50
Tc (C)
75
100
125
150
175
100
125
150
175
Tc (C)
dVout/dt(on) (V/ms)
dVout/dt(off) (V/ms)
700
550
500
650
600
Vcc=13V
Rl=1.3Ohm
450
Vcc=13V
Rl=1.3Ohm
400
550
350
500
300
450
250
200
400
150
350
100
300
50
0
250
-50
-25
25
50
75
100
125
150
-50
175
-25
25
50
75
Tc (C)
Tc (C)
Ron (mOhm)
Ron (mOhm)
50
50
45
45
Iout=10A
Vcc=8V; 36V
40
40
35
35
30
30
25
25
20
20
15
15
10
10
Tc= 150C
Tc= 25C
Tc= - 40C
0
0
-50
-25
25
50
75
Tc (C)
10/23
100
125
150
175
10
15
20
25
Vcc (V)
30
35
40
ILMAX (A)
100
A
B
C
10
1
0.01
0.1
1
L(mH)
10
100
Demagnetization
Demagnetization
11/23
ILM AX (A)
100
A
B
C
10
1
0.01
0.1
10
100
L(mH)
A = Single Pulse at TJstart=150C
B= Repetitive pulse at TJstart=100C
C= Repetitive Pulse at TJstart=125C
Conditions:
VCC=13.5V
Values are generated with RL=0
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
VIN, IL
Demagnetization
Demagnetization
Demagnetization
12/23
Layout condition of Rth and Zth measurements (PCB FR4 area= 60mm x 60mm, PCB thickness=2mm,
Cu thickness=35m, Copper areas: 0.97cm2, 8cm2).
RTHj_amb (C/W)
55
Tj-Tamb=50C
50
45
40
35
30
0
10
13/23
Layout condition of Rth and Zth measurements (PCB FR4 area= 41mm x 48mm, PCB thickness=2mm,
Cu thickness=35m, Copper areas: 0.5cm2, 6cm2).
70
65
60
55
50
45
40
0
14/23
ZTH (C/W)
100
0.5 cm2
6 cm2
10
0.1
0.01
0.0001
0.001
0.01
0.1
10
100
1000
Time (s)
Thermal fitting model of a single channel HSD
in SO-16L
Z TH = R TH + Z THtp ( 1 )
where
= tp T
Thermal Parameter
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
Area/island (cm2)
R1 (C/W)
R2 (C/W)
R3 ( C/W)
R4 (C/W)
R5 (C/W)
R6 (C/W)
C1 (W.s/C)
C2 (W.s/C)
C3 (W.s/C)
C4 (W.s/C)
C5 (W.s/C)
C6 (W.s/C)
0.5
0.02
0.1
2.2
12
15
35
0.0015
7.00E-03
1.50E-02
0.14
1
5
20
15/23
ZTH (C/W)
1000
100
0.97 cm2
6 cm2
10
0.1
0.01
0.0001
0.001
0.01
0.1
1
Time (s)
10
100
1000
Z TH = R TH + Z THtp ( 1 )
where
= tp T
Thermal Parameter
Tj
C1
C2
C3
C4
C5
C6
R1
R2
R3
R4
R5
R6
Pd
T_amb
16/23
Area/island (cm2)
R1 (C/W)
R2 (C/W)
R3 ( C/W)
R4 (C/W)
R5 (C/W)
R6 (C/W)
C1 (W.s/C)
C2 (W.s/C)
C3 (W.s/C)
C4 (W.s/C)
C5 (W.s/C)
C6 (W.s/C)
0.97
0.02
0.1
0.22
4
9
37
0.0015
0.007
0.015
0.4
2
3
22
mm.
MIN.
TYP
A
a1
inch
MAX.
MIN.
TYP.
2.65
0.1
0.2
0.35
b1
0.23
a2
0.104
0.004
0.008
0.49
0.014
0.019
0.32
0.009
0.012
2.45
MAX.
0.096
0.5
0.020
c1
45 (typ.)
10.1
10.5
0.397
0.413
10.0
10.65
0.393
0.419
1.27
e3
8.89
7.4
0.5
M
S
0.050
0.350
7.6
0.291
1.27
0.020
0.75
0.300
0.050
0.029
8 (max.)
17/23
mm.
MIN.
TYP
MIN.
TYP.
MAX.
4.8
0.189
1.37
0.054
2.4
2.8
0.094
0.110
D1
1.2
1.35
0.047
0.053
0.35
0.55
0.014
0.022
0.8
1.05
0.031
0.041
F1
1.4
0.039
0.055
3.2
3.4
3.6
0.126
0.134
0.142
G1
6.6
6.8
0.260
0.268
0.276
H2
H3
10.4
10.05
10.4
0.409
0.396
0.409
17.85
L1
15.75
0.620
L2
21.4
0.843
L3
0.703
22.5
0.886
L5
2.6
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6.6
0.236
4.5
M1
Diam.
18/23
inch
MAX.
4
3.65
0.260
0.177
0.157
3.85
0.144
0.152
mm.
MIN.
TYP
MAX.
4.30
4.80
A1
2.40
2.80
A2
0.03
0.23
0.80
1.05
0.45
0.60
c2
1.17
1.37
8.95
D2
E
10.00
E1
e
9.35
8.00
10.40
8.50
3.20
3.60
e1
6.60
7.00
13.70
14.50
L2
1.25
1.40
L3
0.90
1.70
L5
1.55
2.40
0.40
R
V2
Package Weight
8
1.40 Gr (typ)
P010R
19/23
C
B
50
1000
532
3.5
13.8
0.6
1000
1000
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 ( 0.1)
P
D ( 0.1/-0)
D1 (min)
F ( 0.05)
K (max)
P1 ( 0.1)
16
4
12
1.5
1.5
7.5
6.5
2
End
Start
Top
No components
Components
No components
cover
tape
500mm min
Empty components pockets
saled with cover tape.
500mm min
20/23
Base Q.ty
Bulk Q.ty
Tube length ( 0.5)
A
B
C ( 0.1)
50
1000
532
18
33.1
1
21/23
Base Q.ty
Bulk Q.ty
Tube length ( 0.5)
A
B
C ( 0.1)
50
1000
532
18
33.1
1
1000
1000
330
1.5
13
20.2
24.4
60
30.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape Hole Spacing
Component Spacing
Hole Diameter
Hole Diameter
Hole Position
Compartment Depth
Hole Spacing
W
P0 ( 0.1)
P
D ( 0.1/-0)
D1 (min)
F ( 0.05)
K (max)
P1 ( 0.1)
24
4
16
1.5
1.5
11.5
6.5
2
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
22/23
No components
500mm min
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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23/23