Académique Documents
Professionnel Documents
Culture Documents
Rev.1.0Aug.2008
General Description
Features
Mono/stereo switch
Soft mute
High cut
76 -108 MHz
Image-reject down-converter
Bass boost
Standby mode
Reference clock
Copyright RDA Microelectronics Inc. 2008. All rights are reserved.
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
1.2
Applications
Cellular handsets
Portable radios
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 2 of 20
Table of Contents
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 2 of 20
Functional Description
I
PGA
LNAN C1
I
ADC
0/90
LNA
Q
PGA
Limiter
32.768 KHz
RCLK
stereo/mono
audio
Q
ADC
VCO
ROUT
GPIO
Synthesizer
GPIO
RST
SEN
2.7-5.5 V
DVDD
AVDD
R
DAC
digital filter
MPX
decoder
C2
LOUT
Audio
DSP
Core
LNAP
L
DAC
LDO
RDA5807P
RSSI
Interface
Bus
SCLK
MCU
SDIO
VIO
FM Receiver
Synthesizer
3.3
Power Supply
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 3 of 20
STOP condition.
3.5
Mode.
Details refer to RDA5807P Programming Guide.
Control Interface
3.6
GPIO Outputs
LEFTCHANNEL
WS
RIGHTCHANNEL
1 SCK
SD
1 SCK
MSB
LSB
MSB
LSB
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 4 of 20
Electrical Characteristics
Table 4-1
SYMBOL
MIN
TYP
MAX
UNIT
AVDD
2.7
3.3
5.5
DVDD
2.7
3.3
5.5
VIO
1.5
3.6
Tamb
Ambient Temperature
-20
27
+70
VIL
0.3*DVDD
VIH
0.7*VDD
DVDD
VTH
Table 4-2
SYMBOL
0.5*VDD
MIN
TYP
MAX
UNIT
VIO
-0.5
+4
Tamb
Ambient Temperature
IIN
-40
+90
(1)
-10
+10
mA
(1)
-0.3
VIO+0.3
-20
dBm
Input Current
VIN
Input Voltage
Vlna
Notes:
1. for Pin: SCLK, SDIO, SEN, RST.
Table 4-3
DESCRIPTION
CONDITION
TYP
UNIT
IA
ENABLE=1
15
mA
ID
ENABLE=1
2.5
mA
IVIO
IAPD
ENABLE=0
IDPD
ENABLE=0
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 5 of 20
part without prior written permission of RDA.
Receiver Characteristics
Table 5-1
Receiver Characteristics
PARAMETER
CONDITIONS
MIN
BAND=0
BAND=1
TYP
MAX
UNIT
87
108
MHz
76
91
MHz
V EMF
General specifications
Fin
FM Input Frequency
1,2,3
Vrf
(S+N)/N=26dB
Sensitivity
Rin
Cin
Input IP3
AGCD=1
80
m=0.3
40
200KHz
45
1,2
am
AM Suppression
S200
150
IP3in
1.5
pF
dBV
dB
dB
VAFL; VAFR
Volume_dac[3:0] =1111
110
mV
(S+N)/N
SCS
to Noise Ratio
60
dB
35
dB
0.3
0.5
dB
THD
AOI
54
1,3,6
Distortion
RL
Resistance
Single-ended
32
Vcom_rfin
Vcom
Vcom_nc
Mode Voltage8
Pins NC (22, 23) Common
Mode Voltage
Float
1.25
1.3
0.45
0.5
0.55
6
6.1
Serial Interface
I2C Interface Timing
Table 6-1
SYMBOL
TEST CONDITION
MIN
TYP
MAX
UNIT
SCLK Frequency
fscl
400
KHz
thigh
0.6
tlow
1.3
tsu:sta
0.6
thd:sta
0.6
tsu:sto
0.6
tsu:dat
100
ns
thd:dat
900
ns
tbuf
1.3
tf:out
20+0.1Cb
250
ns
tr:in / tf:in
20+0.1Cb
300
ns
tsp
50
ns
Cb
50
pF
pF
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 7 of 20
part without prior written permission of RDA.
Pins Description
Table 7-1
SYMBOL
GND
LNAN,LNAP
RFGND
MODE
PIN
1,5,6,14,17,24
2,4
3
DESCRIPTION
SEN
SCLK
SDIO
10
RCLK
11
VIO
12
DVDD
13
ROUT,LOUT
AVDD
GPIO1,GPIO2,GPIO3
NC
15,16
18
19,20,21
22,23
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 8 of 20
part without prior written permission of RDA.
Table 7-2
SYMBOL
PIN
LNAN/LNAP
2/4
RCLK
11
SCLK/SDIO
DESCRIPTION
9/10
in
GPIO1\2\3
GPIO1/GPIO2/GPIO3
19/20/21
Out
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 9 of 20
part without prior written permission of RDA.
Application Diagram
8.1
Notes:
J1
C5 125uF
Headphone;
L3 100nH
C3 24pF
GPIO1
GPIO2
GPIO3
V1
Supply (2.7~5.5V);
4. FM Choke (L3 and C3) for Audio
Common and LNA Input
C6
24nF
Common;
5. Pins NC(22, 23), Should be
Leaved Floating;
13
MODE
SEN
SCLK
SDIO
RCLK
VIO
8.1.1
Bill of Materials:
COMPONENT
U1
VALUE
RDA5807P
J1
DESCRIPTION
SUPPLIER
RDA
L3/C3
100nH/24pF
Murata
C4,C5
125F
Murata
C6
24nF
Murata
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 10 of 20
part without prior written permission of RDA.
Notes:
1. J1: Resistance Lower than 32
Audio Speaker or Headphone
2. U1: RDA5807P Chip
3. V1: Analog and Digital Power
Supply (2.7~5.5V)
4. FM Choke (L3 and C3) for Audio
Common and LNA Input
Common
5. Pins NC(22, 23),Should be
Leaved Floating;
6.Set MODE to select control
interface(GNDI2C,VIOSPI);
7. Place C6 Close to AVDD pin
8. Changing the Resistor R4 and
R5 Value can Change the
Output Volume.
9. Place U2 Close to U1
Bill of Materials:
COMPONENT
VALUE
DESCRIPTION
SUPPLIER
U1
RDA5807P
RDA
U2
RDA2892
Audio Amplifier
RDA
J1
Audio Speaker
L1/C1; L2/C2
100nH/24pF
Murata
L3/C3
100nH/24pF
Murata
C6
24nF
Murata
R4,R5
20K
Murata
R2/C7; R3/C8
20K/0.39F
Murata
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 11 of 20
part without prior written permission of RDA.
Notes:
1. J1: Common 32 Resistance
Headphone;
2. U1: RDA5807P Chip;
3. U2: 32.768KHz Crystal oscillator
4. V1: Analog and Digital Power
Supply (2.7~5.5V);
5. FM Choke (L3 and C3) for Audio
Common and LNA Input
Common;
6. Pins NC(22, 23) Should be
Leaved Floating;
7.Set MODE to select control
interface(GNDI2C,VIOSPI);
8. Place C2 Close to AVDD pin.
8.3.1
Bill of Materials:
COMPONENT
VALUE
DESCRIPTION
SUPPLIER
U1
RDA5807P
RDA
U2
DCXO
<=50PPM
J1
L3/C3
100nH/24pF
Murata
C4,C5
125F
Murata
C2
24nF
Murata
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 12 of 20
part without prior written permission of RDA.
Notes:
1. J1: Common 32 Resistance
Headphone;
2. U1: RDA5807P Chip;
3. U2: 32.768KHz Crystal oscillator
3. V1: Analog and Digital Power
Supply (2.7~5.5V);
4. FM Choke L3 for LNA Input
Common;
5. Pins NC(22, 23) Should be
Leaved Floating;
6.Set MODE to select control
interface(GNDI2C,VIOSPI);
7. Place C2 Close to AVDD pin.
8.4.1
Bill of Materials:
COMPONENT
VALUE
DESCRIPTION
SUPPLIER
U1
RDA5807P
RDA
U2
DCXO
<=50PPM
J1
L3
1800R/100M
Murata
C4,C5
125F
Murata
C2
24nF
Murata
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 13 of 20
part without prior written permission of RDA.
Figure 9-1 illustrates the package details for the RDA5807P. The package is lead-free and
RoHS-compliant.
MIN
NOM
MAX
4.00 BSC
4.00 BSC
D2
2.00
2.15
2.25
E2
2.00
2.15
2.25
0.50 BSC
0.30
0.40
0.50
0.18
0.25
0.30
0.80
0.90
1.00
A1
0.00
0.02
0.05
A3
0.20 ref
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 14 of 20
part without prior written permission of RDA.
Profile Feature
Pb-Free Assembly
3 oC/second max.
3 oC/second max.
100 oC
150 oC
100 oC
200 oC
60-120 seconds
60-180 seconds
-Temperature (TL)
183 oC
217oC
-Time (tL)
60-150seconds
60-150 seconds
Peak /Classification
Temperature(Tp)
See Table-II
See Table-III
10-30 seconds
20-40 seconds
Ramp-Down Rate
6 oC/second max.
6 oC/seconds max.
Time 25 oC to Peak
Temperature
6 minutes max.
8 minutes max.
(TSmax to Tp)
Preheat
Volume mm3
Volume mm3
<350
350
2.5mm
240 + 0/-5 o C
225 + 0/-5 o C
2.5mm
225 + 0/-5 o C
225 + 0/-5 o C
Package Thickness
Volume mm3
Volume mm3
Volume mm3
Thickness
350
350-2000
2000
1.6mm
260 + 0 o C *
260 + 0 o C *
260 + 0 o C *
1.6mm 2.5mm
260 + 0 o C *
250 + 0 o C *
245 + 0 o C *
2.5mm
250 + 0 o C *
245 + 0 o C *
245 + 0 o C *
C, - X
is required to control the profile process but at no time will it exceed 5 o C. The
producer assures process compatibility at the peak reflow profile temperatures defined
in Table III.
Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non
integral heat sinks.
Note 4: The maximum component temperature reached during reflow depends on package the
thickness and volume. The use of convection reflow processes reduces the thermal
gradients between packages. However, thermal gradients due to differences in
thermal mass of SMD package may sill exist.
Note 5: Components intended for use in a lead-free assembly process shall be evaluated
using the lead free classification temperatures and profiles defined in Table-I II III
whether or not lead free.
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 16 of 20
part without prior written permission of RDA.
RoHS Compliant
The product does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB)
or polybrominated diphenyl ethers (PBDE), and are therefore considered RoHS compliant.
ESD Sensitivity
Integrated circuits are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should
be used when handling these devices.
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 17 of 20
part without prior written permission of RDA.
11 Change list
REV
V1.0
DATE
AUTHOR
2008-8-26
Xiaoqi You
CHANGE DESCRIPTION
Original Draft.
12 Notes
1:
VIO
7
8
SCLK
SDIO
9
10
MODE
SEN
SEN
SCLK
SCLK
SDIO
SDIO
I2C
8
9
10
MODE
SEN
SCLK
SDIO
SPI
I2C
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 18 of 20
part without prior written permission of RDA.
13 Contact Information
RDA Microelectronics (Shanghai), Inc.
Suite 1108 Block A, e-Wing Center, 113 Zhichun Road Haidian District, Beijing
Tel:
86-10-62635360
Fax:
86-10-82612663
86-21-50271108
Fax:
86-21-50271099
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
Page 19 of 20
part without prior written permission of RDA.