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AMAR PANDEY
SUMMER TRAINING REPORT,
ITI MANKAPUR, GONDA

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FIRST GENERATION
ELECTRONICS

SWITCH

E10B
INTRODUCTION:E10B is a digital switching system which supports only
voice communication and CIT ALKATEL of France develops
this system. E10B is a telephone switching system based
on electronics components and technique. Two main
operating principle are carried over platoon system use of
PCM digital technique separation of switching function
from operation and maintenance Function this switching
can be use to transmit a variety of signals telephone,
telegraph Data.
E10B EXCHANGE STRUCTURE DIAGRAM:-

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SALIENT FEATURES OF SYSTEM: It is a digital switching system with 3 stage (TST)

switch with a maximum possible connection of 384
PCMs.
It supports only analog subscribers with or without
reversal facilities.
System supports only R AND F signaling (channel
Associated signaling).
It provides data communication telephony and the
other value added services.
Geometrical parameter
Transmission parameter
1)Attenuation
2)Dispersion
Optical parameters
1) Numerical Aperture
2) Mode field diameter
Mechanical parameter

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E10B EXCHANGE STRUCTURE DIAGRAM:-

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SYSTEM STRUCTURE AND ORGANISATION:An E10B switching system center can be divided into 3
main blocks. The operation and maintenance center
constitute a fourth blocks which is shared by a number of
switching centers.

BLOCK 1: SUBSCRIBER AND MULTIPLEX

CONNECTIONS
The subscriber connection unit (URA) is the CSE 1000
electronics line connector.

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This provides for concentrating the traffic on 2,3or4

PCM links.
The interface with subscriber lines is via circuit boards
comprising16 ordinary subscriber equipments or 8
discriminated subscriber equipments.
A concentrator handling 1000subscribers is housed in
a standard 2 meter rack.

BLOCK 2:
NETWORK

TIMEDIVISION

SWITCHING

The time division switching network cx is 3 stage

systems (time-space time)
It provides 4 wire switching system between time slot
allocated to the calling party and the time slot
allocated to the called party.
368 PCM for speech channels.
16 PCM for ETAS.

BLOCK 3: CONTROL UNITS

The switching operation carried out in block 1and block 2
are monitored by control units which constitute block-3 .

Multi-register (MR)
Translator(TR)
Charging unit(TX)
Marker(MQ)
Matrix system handler(UGCX)
Time base(BT)
Monitoring unit(OC)
Frequency receiver/sender unit(ETA)

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OCB-283
INTRODUCTION: OCB-283 is a digital switching system developed by
Alcatel France.
Serves entire range from local to transit gateway.
Switches single t-stage switching.

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20 As PCM Links connectivity

Services provided Basic telephony, ISDN, Centre
called intelligent network ready for ATM Broad band.
CCS7 signaling.

FEATURES OF OCB -283:

Distributed control c (application of SN)

Modular and flexible design
Call processing by one processor or many
Regulation mechanism to avoid saturation.
Reduce hardware(32-type of boards &6-type of racks)
EMI protection.
User friendly MM1.

PCM CONTROLLER(URM):-

URM provide interface between PCM & OCB-283

AUX EQUIPMENT MANAGER(ETA):-

The function of ETA is tone generator

conference circuit (CCF) ,exchange clock

(GT)

MULTI REGISTER(MR):It is responsible for establishment and breaking of cells

Translator (TR): TR is responsible for analysis of cell subscriber

and service group data base management.
TX(CHANGING UNIT):TX is responsible for calculating the amount to be
charged.

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GX (matrix system handler):GX monitor access(LA) & LEXC links.

ARCHITECTURE OF OCB-283:-

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FUNCTIONAL ELEMENTS OF OCB-283:-

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TIME BASE (BT):distribution for LR &PCM.

BT insures time

SWITCHING NETWORK (MCX):-

MCX is a sequence connection matrix controlled by

com/matrix switch controller.

FUNCTIONAL DESCRIPTION OF CSN:-

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Introduction: ALCATEL subscriber access subsystem to

connect both analog & digital subscriber.
CCS7 signaling accessed.
CSN can be either local (CSN-L) or remote
(CSN-I) .
CS can be CNLC FOR local subscriber or CNB
(remote subscriber).
Processing incoming and outgoing calls.
Switching.
Setting up local calls.
CSN has two levels of concentrations.
Second level of remoting available making
considerable flexibility.

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C-DOT
CENTER
FOR
TELEMATICS

DEVELOPMENT

OF

General information: Universal digital switch applied as local and

transit switch.
Cost effective than analog switches.
Supports CCS#7,ISDN&V5.2
Connectivity
with
other
switches
like
565s,EWSD etc.
Used in basic and cellular telephony.
Low power dissipation
Single chip digital signal processor for mf
&DTMF receivers.
Highly reliable switch.

Technology: T-S-T switching configuration

32 channel PCM switches/structure and basic

rate 64kbps.
16/32mb dynamic ram.
ADC on line circuit by codec chip.

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Control is distributed over system by using

32bit ,16bit ,8 bit micro-processors.
A high density VLSI CHIP.

Basic growth modules:A) base module

B) Central module
C) Administrative module
D) Input output module

Special circuit cords:

CNF:-provides up to eight 4 party conference
circuit .

Technical test controller (TTC): used for testing analog terminal surface by test
are relays on terminal cards.

ANNC: Provide announcement on broadcast basis.

Digital terminal unit: It interfaces 4 PCM per DTU.
It consist of
Digital truck interface

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Duplicated terminal unit controller

CAs interface

CCS#7 signaling module (sum): Does not use speech or data path for signaling.

ISDN TERMINAL UNIT: Provides end to end digital connectivity as

digitalization process being eight at the user
end.

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SURFACE MOUNT
TECHNOLOGY (SMT)
Introduction
Surface mount technology reduces PCB size human
work and give accuracy.
This
technology
facilitates
greater
multifunctionality smaller size ,light component
mounting density.

Surface mount technology:-

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ADVANTAGE OF SMT:

PCB size reduction

RLC losses reduction
Component density increases
Assembly cost cheaper
Production is faster

DISADVANTAGE OF SMT:

Component identification is difficult

Component subsection is difficult
Rework is difficult
Maintenance is required
Capital cost is high

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THROUGH HOLE TECHNOLOGY

INTRODUCTION:In this technology electronics component are inserted
into plated through whole (PTH) in the PCB & soldering is
done at bottom side.
PROCESS FLOW CHART:This technology involve following process:
Cutting of component

Component forming

PCB preparation

1-stage component insertion

Inspection of assembly

Wave soldering

2-nd stage insertion

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Final inspection

Testing

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IN CIRCUIT TEST (ICT)

ICT FEATURES:In circuit testing helps to insure quality
products, by detecting fault in PCB board before it is
placed in final assembly.

Shorts and open circuit in board

Measuring improper inserted of component
Out of tolerance components
Incorrect programed component fault memory devices
Functional fault of devices
Time measurement of clocks

NEW MANUFACTURING APPROACH:Component insertion

Soldering

Visual inspection
testing

in circuit

Final assembly

Functional testing

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system /integration
testing

BASIC CONCEPT OF ICT:ICT equipment consist of two main port

The first is the tester itself .this consists of
matrix of driver and sensor that are used for
step up and perform the measurement. The set
ds point is receiver block.
Receiver block interface with the second port of
the tester
. Fixture and acts as an interface between the
board and in the circuit tester.
ADVANTAGE OF ICT:Improvement in yield
Reduction in quality cost.
Quick feedback to manufacturing area.
Accurate reliable and safe power up tester.

LIMITATION OF ICT: The quality of pin test depends on quality of test

probe.
The quality of electrical contacts cannot be
tested.

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GSM
(GLOBAL SYSTEM FOR MOBILE
COMMUNICATION)
GSM originally group special mobile ,is a standard
developed by the European telecommunication
standards institute (ETSI) to describe protocol for second
generation (2G) digital cellular network used by mobile
phones. the GSM standard are developed as a
replacement for first generation (1G) analog cellular
network ,and originally described a digital circuit switched
network. Optimized for full duplexer voice telephony.

OBJECTIVE OF GSM:

Good speech quality.

Low terminal and service cost.
Support for international roaming.
Ability to support handheld terminals.
Support for range of new services & facilities.
Spectral efficiency.
ISDN (integrated service digital networks)
compatibility.
TECHNIQUES USED IN GSM:In the GSM system the TDMA in combination
with FDMA is used. The use of each radio
channel is partitioned into multiple (eight) time

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slots and each user is assigned a specific

frequency/time slot combination.
Also the FDD technique is in use that is two
symmetric frequency band one band containing
the uplink channel and the other downlink
channels.
GSM ELEMENTS:Consist of the mobile equipment and SIM card.
MOBILE EQUIPMENT
Uniquely identified by IMEI(international mobile
subscriber identity)

SIM EQUIPMENT:Uniquely identified by IMSI(international mobile

subscriber identity)
Also contain secret key for authentication.
Can be protected against unauthorized use by a
PIN(personal identity number)
Can also store SMS message for later retrieval.
IMSI & IMEI are independent personal mobility.

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GSM-900
GSM-1800
Uplink band
890-915MHZ
1710-1785MHZ
Downlink band 935-960MHZ
1805-1880MHZ
Channel
200kHZ
200kHZ
spacing
Total channel
124
374
Duplex spacing 45MHZ
95MHZ
Time slots
8
8
st
1 ARFCN Tx
890.2MHZ
1710.2MHZ
1st ARFCN Rx
935.2MHZ
1805.2MHZ
Formula for
890+[0.2+ARF 1710+[0.2+AR
finding the
CN NO]
FCN NO]
ARFCN band
FEATURE OF DIGITAL CELLULAR SYSTEMS:

Small cell (macro/micro/Pico)

Frequency reuse in GSM
Battery powered handsets
Performance of seamless handovers
FREQUENCY REUSE:The spectrum allocated for a cellular network is
limited .for this reason each frequency is used
simultaneously by multiple base mobile pairs.
This frequency reuse allows a much higher
subscriber density per MHZ of spectrum.

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7-Cell cluster

SYSTEM ARCHITECTURE:-

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MS-mobile station
BTS-base trans-receiver station
BSC-base station control
MSC-mobile service switching center
HLR-home location registers

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EIR-equipment identity registers

AUC authentication center
SMS-short message services

GSM ELEMENT
BSS (BASE STATION
SUBSYSTEM)
BTS(BASE TRANS CEIVER STATION):It is radio transceiver which handles radio link
protocols with the MS.
BSC(BASE STATION CONTROLLER):-

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Manage the radio resources for one or more BTS.

HLR(HOME LOCATION REGISTER):Contain administrative information of each subscriber
register in corresponding GSM network.
VLR (VISITER LOCATION REGESTER):Contain selected information from HLR .provision of
the subscriber services for each mobile currently
located in the geographical area controlled by VLR.
EIR (EQUIPMENT IDENTITY REGISTER):Data base of all mobile valid equipment in the
network (IMIE))
STATUS OF EQUIPMENT =WHITE LIST, GREY LIST,BLACK
LIST.
AUC (AUTHENTICATION CENTRE):Protected database that stores a copy of a secret key
.number used for authentication and encryption.
OMC (OPERATION AND MAINTENANCE CENTRE):It is a centralized maintenance and diagnostic heart
of the base station system (BSS).it allows the
network provider to operate, administer and monitor
the functioning of the BSS.

PCB MANUFACTURING
PCB (PRINTED CIRCUIT BOARD):A PCB is used to mechanically support and electrically
connect electronics component using conductive path
ways or tracks. Etched from copper sheets laminated into

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a non-conductive substrate. The function of PCB is to

reduce the area in which electronics components are to
be installed.

PCB RAW MATERIAL:The raw material used for making PCB is CLAD
EPOXY LAMINATE .the dimension of laminate are
19201220sqmm
12201220sqmm
The thickness of these plates may be
0.8mm, 0.16mm, 0.24mm, 0.32mm
SEQUENCE OF OPERATION:o Cutting
o Drilling
o MOUNTER:In device mounting it is necessary to Conform
position deviation due to effect of Self
alignment of device and secure a mounting
precision within that range.
o SOLDERING PROCESS REFLOW:Reflow method allowing full heating are well
suited to mass production.
o INSPECTION PROCESS:Depending on appearance in section
equipment there are limits to item that can be
Inspected.

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o PHOTO IMAGE TRANSFER:The image of circuit is transferred on board by

master copy by using the process.
1) Surface preparation.
2) Polishing.
o ELECTROLYTIC PLATING:IT is applied generally after electrodes plating
to build up thickness. There Sn-Pb layer is
deposited on the un-polymerized section.

o STRIPING:-

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o
o

The electroplated sheet is passed through the

solution of NaoH to remove the hard layer or
poly-merised layer using stripping machine.
ETCHING:Unwanted Cu materials are removed.
CLEANING AND FLUXING :Using chemical cleaner machine dose cleaning
and fluxing of conduction pads.
HOT AIR LABELLING (HAL):Hot air is done which causes the solder (63%
Sn to 37% Pb) to Deposit on flux Actuated
(activated parts around the PTH.
LEGEND MARKING:It is done in same way as screen printing but
white ink is used for component marking.
ROUTING:The circuit cut-off from PCB as the
requirements as the holes are drilled .which are
required for fluxing of PCBs with screw.
FINAL INSPECTION AND QUALITY CONTROL:Minor breaks are detected & required using
track welding by the process known as base
board tester (BBT).