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Air-Abraded Enamei
Klaus-R. JahnyBirgit GeitelVEckehard KostkaVRegine Wischnewski*"/
Jean-Franois Roulet^
Purpose: The purpose of this study was to test the tensile bond strength of composite resin to enamel surfaces treated with kinetic cavity preparation (KCP| and acid etching, respectively.
Materials and Methods: Plane labial surfaces of 280 human maxiiiary centrai incisors were treated with
either KCP by varying treatment conditions or phosphoric acid gel. Composite sampies were bonded to the
pretreated surfaces with a bonding resin. After 24 hours specimens were leaded in tension in an Instron
testing machine until bond failure, A two-way anaiysis of variance was used to determine significant differences. The failure sites were qualitativeiy evaluated by SEM,
Resuits: The determined tensile bond strengths and obsen/ed failure modes demonstrated that acid-etched
enamei has a significantly higher bond strength tc composite resih than KCP-treated enamei surfaces,
Conciusion: KCP-prepared enamei has to be acid etched before bondingto composite resin,
J Adhesive Denl 1999:1:25-30
Vol 1, No 1, 1999
25
RESULTS
The results are summarized in Tables 1 and 2. The
most important result is that regardless of the conditions used, the bond strength to etched enamel
was significantly higher than the bond to enamel
treated by KCP (one-way ANOVA, Student-Newmah
Keuls test). As shown in Table 1, the particle size
had a more important influence than the air pressure on the bond strength, as was revealed by a
two-way ANOVA (by pooling the other factors, distance and angle. Table 3). The 27-pm particles
yielded a higher bond strength than the 50-|jm particles. Single comparisons between groups (f test,
adjusted according to Bonferroni) revealed that the
27-Mm particles yielded a higher bond strength with
an air pressure of 0.97 MPa.
ahnet al
Table 1 Test parameters and tensile bond strength of composite to
blasted enamei
Distance
Angle
of nozzle of nozzle
( >
1
1
1
1
1
1
1
1
1
1
1
1
3
3
3
3
Air
pressure
(MPal
Particle
size
(pm)
0.28
0.55
0.69
0.83
0.97
1.10
0.28
0.55
0.69
0.83
0.97
1.10
0.S3
0.83
0.83
0.S3
27
27
27
27
27
27
50
50
50
50
50
50
27
50
27
50
SO
80
80
80
80
80
80
80
80
SO
SO
SO
SO
so
45
45
Strength (MPa)
(standard deviation)
3.25
3.25
3,50
3,24
4,82
3.86
2.5-1
3.52
3.02
2.72
2.46
2.33
2.46
1.98
2.54
3,36
(1.37)
(1.15)
n
(1,03)
(1.72) n
(1.45) J *
(1.86)
(1.04)
(1.66)
(1.03)
(0.82)
(0.68)
(1.54)
(1.51)
(0.90)
-|
(0.98)
(0.99)
J
- P 0.01
Etching tirhe(s)
20
40
60
untreated ehamel
19,54
19,66
14,44
1,12
(3,96)
n
(3,38) ~|
'
~\
(3.47) J " J -|_
(0.99)
J'J
- P 5 0.01
Bond strength
fhaih effects
(combined)
d
P
Two-way ihteractions, p*d
Model
Residual
Total
Sum of
squares
df
Mean
square
31,098
25.167
7.4S8
26.799
57.897
213.846
271.743
6
1
5
5
11
122
133
5.1S3
25,167
1,498
5.360
5.263
1,753
2.043
2.957
14.358
0.854
3,058
3.003
Sig.
0,010
0.000
0.514
0.012
0,001
d - particle sife.
p = arr pressure.
27
tching tim \^
Fig 2 Tensile bond strength of composites bonded to enamei treated with KCP applied with different conditions (particle size, air
pressure, beam angle) at a constant distance of 1 mrr and a constant time (10 seconds). As controis, tensile bond strength of
comoosites on etched enamei (positive) and untreated enamei (negative) are shown (* P < 0,01),
DISCUSSION
Based on our results, it is obvious that the bond
strength of composite to etched enamel is much
higher than to enamei treated with KOP, As compared to untreated enamel, a significant but small
increase of bond strength could be observed forthe
KCP sampies. It is more than questionabie whether
The Journal cf Adhesive Dentistry
the tensile bond values ofthe KCP samples are sufficient to withstand the polymerization shrinkage
stress^ in a clinical situation. Our results are congruent with those of Wiedemann et al,12 who
showed with profiiometry and tensile bond tests a
iow, but as compared with etched enamei, insufficient increase ofthe composite-enamei bond after
KCP treatment. Berry and Ward,i Nikado et al,^
Roeder et al,io and Valentino and Nathanson^ihave demonstrated that conditioning the enamei
with KCP IS not sufficient to obtain a good bond to
composites. The bond strength values reported by
Valentino and Nathanson,ii who used maleic and
orthophosphoric acid as a conditioning agent, were
much lower than those in the present study. This
couid be explained by either the thermocyciing or
the different test used (shear bond], Roeder et al^o
reported simiiar bond strength values also using
Optibond and Herculite. However, no details about
the air pressure used for biasting were given. Berry
and Ward^ reported values between 8.5 and 13.8
MPa based on tensiie tests. This is substantiaily
higher than the tensile strength reported in the present study. However, they did not specify the particie
size used for blasting.
In contradiction to our results, Laureli et a l ' and
Keen et al^ reported equal shear bond strength val29
CONCLUSION
Since the bond strength of composite bonded to
KCP-treated enamel is considerabiy lower than that
of composite bonded to etched enamel, KCP cannot be used as a substitute for etching technoiogy.
As a consequence, if the KOP technique were used
for cavity preparation, the enamel margins should
be etched before the insertion of the composite.
30
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