Académique Documents
Professionnel Documents
Culture Documents
1 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
By Sarang Shidore
ShareThis
Print This
Introduction
The challenge of accurately predicting junction temperatures of IC components
in system-level CFD simulations has engaged the engineering community
for a number of years. The primary challenge has been that near-exact
physical models of such components (known as detailed thermal models,
or DTMs) are difficult to implement directly in system designs due to
the wide disparity in length scales involved, which results in large computational
inefficiencies. A compact thermal model (CTM) attempts to solve this problem
by taking a detailed model and extracting an abstracted, far less grid-intensive
representation that is still able to preserve accuracy in predicting the
temperatures at key points in the package, such as the junction.
The article will discuss the concept and utility of compact thermal models
and illustrate their use by designers in industry.
6/17/2015 8:56 PM
2 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
(1)
6/17/2015 8:56 PM
3 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
(2)
6/17/2015 8:56 PM
4 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
6/17/2015 8:56 PM
5 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
Conclusions
Thermal modeling is now an integral part of the electronics design process.
In recent years, new thermal modeling methods have been proposed that
seek to predict temperatures and fluxes of packages with varying degrees
of accuracy and computational efficiency. These methods are being widely
used in the industry, although some important barriers to their universal
adoption remain. The JEDEC industry standards committee is engaged in
standardizing some of these methodologies.
Sarang Shidore
Flomerics Inc.
1106 Clayton Lane
Suite 525W
Austin, TX-78723
Tel: 512-420-9273, ext. 203
Fax: 512-420-9485
Email: sarang@flomerics.com
References
1. 1. www.jedec.org
2. Rosten H., Parry J., Lasance C. J. M. et al, Final Report to
SEMI-THERM XIII on the
European-Funded Project DELPHI The Development of Libraries and Physical
Models
for an Integrated Design Environment, Proc. of the Thirteenth
IEEE SEMI-THERM
Symposium, Austin, TX USA, January 28-30, 1997.
3. Pape H.and Noebauer G., Generation and Verification of Boundary
Condition Independent Compact Thermal Models for Active Components,
According to the DELPHI/SEED Methods, Proc. of SEMITHERM XV, San Diego,
CA, pp. 201-211,1999,.
4. Flomerics Inc., Internal Report on Flopack Usage, 2006.
6/17/2015 8:56 PM
6 di 6
http://www.electronics-cooling.com/2007/05/compact-thermal-modeling-...
variousREAD MORE
6/17/2015 8:56 PM