The Institute For: Introduction To Surface Mount Assembly

THE INSTITUTE FOR
INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-33
INTRODUCTION TO SURFACE
MOUNT ASSEMBLY
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT-33
Introduction to Surface Mount Assembly
Introduction
The purpose of this video is to introduce the steps

required for the surface mount assembly process.
This workbook contains a review of the key
information shown in the video. Those key areas
are presented as objectives. The workbook
expresses each objective as a question and provides
an outline for your answers and any additional
notes.
Section 1 Objectives:
After viewing Section 1 of the video, you will

complete the following:
v Describe the characteristics of surface mount
components.
v Identify and explain the advantages and

disadvantages of using surface mount vs.
through-hole components.
V Describe gull wings and 3-leads.
V Name and briefly describe the various package
types for surface mount components utilizing
gull wings, I-leads and leadless.
VT-33
Describe the characteristics of surface mount

components.
Description:
-2-
VT-33
0
0
Identify and explain the advantages and
disadvantages of using surface mount vs. through
hole components.
Advantages:
Disadvantages:
VT-33
Describe gull wings and J-leads.
Gull Wings:
J-Leads:
-4-
VT33
Name and briefly describe the various package

types for surface mount components utilizing gull
wings, J-leads and leadless.
Gull Wing Packages:
J-Lead Packages:
Leadless Packages:
VT33
V Name and briefly describe the three basic
operations comprising surface mount assembly.
V Describe the construction of the stencil in the
solder paste printing process.
V Name the five variables involved in making
accurate prints.
V Describe the basic process for setting up the

printer.
V Describe the consequences of either too much or
too little squeegee pressure.
V Describe the purpose of regularly cleaning the
stencil during production runs.
V Describe the purpose of using adhesive on
certain components.
6-
VT-33
Name and briefly describe the three basic

operations comprising surface mount assembly.
Name Operation 1:
Description:
Name Operation 2:
Description:
Name Operation 3:
Description:
-7-
VT-33
Describe the construction of the stencil in the solder

paste printing process.
Description:
Company Specific Factors:
Describe the type of stencils used in your facility.
VT33
Five Variables:
Name the five variables involved in making

accurate prints.
VT-33
0
0
Describe the basic process for setting up the printer
for paste application.
Description:
Describe any differences in the set-up procedure at

your company.
10
VT-33
Describe the consequences of either too much or

too little squeegee pressure.
Too Much Squeegee Pressure:
Too Little Squeegee Pressure:
11
VT43
Describe the purpose of regularly cleaning the

stencil during production runs.
Description:
12
VT=33
0
0
Describe the purpose of using adhesive on certain
components.
Description:
13
VT43

V Describe the physical characteristics of the pick
and place machines.
V Describe the different ways parts are fed to the

placement machines.
s Name and briefly describe the two most
common methods of reflow soldering.
V Name and briefly describe the three zones in a

reflow soldering machine.
V Name and briefly describe the two types of tests
performed on an assembled board.
14-
VT-33
0
0
Describe the physical characteristics of pick and
place machines.
Description:
15
VT-33
Describe the different ways parts are fed to the

placement machines.
Description:
16
________
_______
VT-33
Name and briefly describe the two most common

methods of reflow soldering.
Name Method
1:
Description:
Name Method 2:
Description:
Describe the type of reflow system used at your

facility.
17
VT-33
introduction to Surface Mount Assembly

0
0
Name and briefly describe the three zones in a

reflow solder machine.
Name Zone 1:
Description:
Name Zone 2:
Description:
Name Zone 3:
Description:
18
VT-33
Name and briefly describe the two types of tests

performed on an assembled board.
Name Test 1:
Description:
Name Test 2:
Description:
19
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT71
SURFACE MOUNT SOLDER JOINT
EVALUATION, PART 1:
INTRODUCTION
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT71
Surface Mount Solder Joint Evaluation: Introduction
Surface Mount Solder Joint Evaluation
Introduction
The purpose of this video is to introduce you to

evaluation methods applicab1eitosurface mount
components. Common component types and
mounting methods are discussed. Critical concerns
regarding the use of surface mount technology are
reviewed. Solder joint characteristics are described
and industry standards defined, based upon the
ANSJJJ-STD-OO1 workmanship standards and
product classifications.
information shown in the video. Those key areas are
presented as objectives. The workbook expresses
each objective as a question and provides an outline
for your answers and any additional notes.
Objectives
After viewing the video, you will be able to

V Describe the physical characteristics of surface
mounted components.
V Define the term via and give examples of the
types of vias used with surface mounted
components.
V Describe the three advantages of using vias.
V Address the critical concerns affecting the use of
surface mount solder joints.
VT-71
I,
Identify the factors affecting surface mount

solder joint quality.
I,
Define the three classes of electronic products.
Be able to cite the industry standard for

acceptable surface mount solder joints.
V Define the term wetting and describe the

attributes of a properly wetted joint.
i/
Define the term contact angle and shall define

the maximum allowable contact angle.
V Define the term non-wetting and cite the

industry acceptance criteria for non-wetted
solder joints.
V Define the term dewetting and cite the industry
criteria regarding dewetted solder joints.
V Describe the three general types of passive chip
components.
V Describe the methods of reflow available for
surface mounted componefits.
V Describe auto placement mounting
technology.
V Describe the two principle methods of reflow
soldering.
V Describe three primary considerations used to
evaluate surface mount solder joints.
-2-
VT71
Surface
Mount
Solder
Joint
Evaluation:
Introduction
Describe the physical characteristics of surface

mounted components.
Physical Characteristics:
List the two principal advantages offered by surface

mounted components:
Advantage 1:
Advantage 2:
VTJ1
Define the term via. Give examples of the types of

vias used with surface mounted components.
What is a via?
Describe the three types of vias used with surface

mounted components:
ThroughHo1e Via:
Buried Via:
Blind Via:
VT-71
Describe the three advantages of using vias.
Advantage 1:
Advantage 2:
Advantage 3:
-5-
VT-71
Describe
surface
the
key
mount
concerns
affecting
the
use
of
solder joints.
Concern 1:
Concern 2:
What are the concerns your company has which

the
solder
affect
Company Specific Concerns:
use
of
surface
mount
joints?
VT71
Describe the factors affecting surface mount solder

joint quality.
Factor 1:
Factor 2:
Describe any additional factors addressed by your

company regarding the quality of surface mount
solder joints:
VT71
Define the three classes of electronic products.
Define the three classes of electronic products and

give an example of each:
Class 1:
Class 1 Product Example:
Class 2:
Class 3:
-8-
VT71
Surface
Mount
Solder
Joint
Evaluation:
Introduction
Cite the industry standard for acceptable surface

mount solder joints.
Industry standard:
Company Specific Standards:
VT-71
Define the term wetting. Describe the attributes of a

properly wetted joint.
What is wetting?
What are the two attributes of a properly wetted

solder joint:
Attribute 1:
Attribute 2:
VTJ1
Define the term contact angle. Define the maximum

allowable contact angle.
What is the contact angle?
What is the maximum allowable contact angle?
What is the relationship between solder contact

angle and the degree of wetting?
11
VT71
Surface
Mount
Solder Joint
Evaluation:
Introduction
Define the term non-wetting.

acceptance criteria for non-wetting.
Cite the industry
What is the condition of non

wetting?
What is the industry criteria for non-wetted solder

joints?
Define your companys acceptance criteria for non

wetting:
12
VT-71
dewetting.
regarding dewetted solder joints.
Define
the term
Cite the industry
criteria
What is the condition of

dewetting?
What is the industry criteria regarding for dewetted

solder joints?
What
dewetted solder
is
13
your companys
joints?
acceptance criteria for
VT-71
Describe the three general types of passive chip

components.
Chip resistor group:
Ceramic chip capacitors:
Inductors, potentiometers, etc:
14
VT-71
Describe the methods of reflow available for surface

mounted components.
Describe
the
reflow
soldering
process:
Describe the three types of reflow:

Vapor
Phase
JR
Reflow:
Reflow:
Convection Reflow:
Company Specific Methods:
What are the methods of reflow soldering used by

your company?
15
VT-71
Describe auto placement mounting technology.
What is auto placement mounting

technology?
16
VT-71
Describe the two principle methods of reflow

soldering.
Vapor
phase
joint
characteristics:
Wave solder joint characteristics:
Define shadowing and how it occurs:
17
VT-71
Describe
evaluate
three
primary
surface
mount
considerations
used
to
solder joints.
Inspection Guidelines:
Consideration
Consideration
1:
2:
Consideration 3:
Company Specific Requirements:
List additional considerations your company applies

when evaluating the quality of solder joints:
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-72
EVALUATION, PART 2:
RECTANGULAR CHIP
COM PONENTS
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT-72
Surface Mount Solder Joint Evaluation: Rectangular Chip Components
Introduction
The purpose of this video is to introduce the rectangular

chip component. Solder joint dimensional requirements
are covered, based upon the ANSI/J-STD-OOl
workmanship standards and product classifications.
Typical soldering problems and solder imperfections are
examined.
This workbook contains a review of the key information

shown in the video. Those key areas are presented as
objectives. The workbook expresses each objective as a
question and provides an outline for your answers and any
additional notes you may want to make.
Objectives
After viewing the first section of the video, you wifi

V Explain the need for solder joint flexibility

I,
I,
V
V
V
V
Explain the need for solder joint dimensional

requirements and cite the industry reference for these
requirements.
Describe the general considerations governing rework
for each class of electronic assembly.
Define the minimum end solder joint width
dimensional requirements for rectangular chip
components.
Define the minimum end overlap dimensional
requirements for rectangular chip components.
Define the minimum solder thickness dimensional
Defme the minimum fillet height dimensional
Defme the side fillet dimensional requirements for
rectangular chip components.
-1
VT-72
Explain the need for solder joint flexibility.
The Need for Solder Joint

Flexibifity:
VT-72
Explain the need for solder joint dimensional requirements

and cite the industry reference for these requirements.
Purpose of Dimensional
Requirements:
Industry Reference:
-3-
___
_____
VT72
Describe the general considerations governing rework for

each class of electronic assembly.
General Rework
Considerations:
Class 1 Consumer
Products:
Class 2 Commercial
Products:
Class 3 High Reliabifity

Products:
Company Specific
Requirements:
Describe any additional considerations your company uses

to determine product rework.
_______
____
VT-72
Defme the minimum end solder joint width dimensional

Definition:
Class Requirements:
Class 1:
Class 2:
Class 3:
Company Specific
Requirements:
Describe your companys workmanship standards for

minimum end solder joint width for rectangular chip
components:
-5-
VT-72
Surface
Mount Solder Joint Evaluation: Rectangular Chip Components
Defme the minimum end overlap dimensional

Definition:
Class
Requirements:
All Classes
of
Company Specific
Requirements:
Product:
Describe your companys dimensional requirements for

minimum end overlap:
_______
_
VT-72
Defme the minimum solder thickness dimensional

Definition:
Class Requirements:
Class 1:
Class 2:
Class3:
Company Specific
Requirements:

solder thickness in rectangular chip
components:
minimum
-7-
____
__
___________
_____
VT-72
Surface
Mount
Solder
Joint
Evaluation:
Rectangular
Chip
Components
Defme the fillet height dimensional requirements for

Definition:
All Classes (Max. Fifiet

Height):
Class Requirements (Mm.

Fifiet Height):
Class
1:
Class 2:
Class
Company Specific
Requirements:
3:

fillet height in rectangular chip components:
_________
____
VT-72
Surface
Mount
Solder
Joint
Evaluation:
Rectangular
Chip
Components
Defme the side fillet dimensional requirements for

Definition:
Presence of Side
Fifiets:
Class Requirements:
All Classes:
Company Specific
Requirements:
Describe your companys side fillet dimensional

requirements for rectangular chip components:
(-9-
VT-72
Surlace Mount Solder Joint Evaluation: Rectangular Chip Components
SECTION II
Typical Soldering Problems Ellcountered with

Rectangular Chip Components.
Objectives
After viewing the second section of the video, you wifi

V Describe the causes of component misalignment.

I
I,
V
i
I,
V
V
Cite causes for the presence of insufficient or

excessive solder volume.
Defme drawbridging and tombstoning, and address the
causes of these conditions.
Define solder webbing, and cite the causes of this
condition.
Describe the characteristics of disturbed solder joints,
and cite the causes of this condition.
Defme solder bridging, and cite the causes of this
condition.
Describe reasons for the presence of solder balls on the
assembly, and cite the class requirements governing
this condition.
Describe reasons for the presence of mounting
adhesive on the lands or inside the solder joints, and
cite the class requirements governing this condition.
Describe four typical solder joint imperfections
associated with rectangular chip components.
Describe the conditions of nonwetting and dewetting,
and cite the causes for these conditions.
VT-72
Describe the causes of component misa]ignment.
Definition:
Cause of Component
Misalignment:
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria for

misalignment of rectangular chip components:
11
VT-72
Surface
Mount
Solder
Joint
Evaluation:
Rectangular
Chip
Components
Cite causes for the presence of insufficient or excessive

solder volume.
Definition:
Causes
excessive solder volume:
of insufficient
or
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria for

insufficient or excessive solder volume in rectangular chip
components:
12
VT-72
Surface Mount Solder Joint Evaluation:
Rectangular Chip Components
Defme drawbridging and tombstoning, and address the

causes of these conditions.
Definition:
Causes of drawbridging or
tombstoning:
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria for the

conditions of drawbridging or tombstoning:
-13-
______
VT-72
Defme solder webbing, and cite the causes of this

condition.
Definition:
Causes of Solder Webbing:
Acceptabifity:
Company Specific
Requirements:
Describe your companys acceptance criteria regarding the

occurrence of solder webbing:
14
_____
VT-72
Surface
Mount
Solder
Joint
Evaluation:
Rectangular
Chip
Components
Describe the characteristics of disturbed solder joints, and

cite the causes of this condition.
Definition:
Causes of disturbed solder

joints:
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria for disturbed

solder joints:
-15-
_____
VT-72
Surface
Mount
Solder
Joint
Evaluation:
Rectangular
Chip
Components
Defme solder bridging, and cite the causes of this

condition.
Definition:
Causes:
V
I,
V
V
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria for solder

bridging:
-16-
_________
____
VT-72
Surface
Mount
Solder Joint
Evaluation:
Rectangular
Chip
Components
Describe the reasons for the presence of solder balls on

the assembly, and cite the class requirements for this
condition.
Definition:
Causes:
V
V
V
Class Requirements:
All Classes:
Company Specific
Requirements:

presence of solder balls:
17
VTJ2
Surface
Mount
Solder
Joint
Evaluation:
Describe
reasons
the
or
lands
for
inside
requirements
Rectangular
the
the
presence
this
Components
of mounting
solder joints,
governing
Chip
and
cite
adhesive
the
class
condition.
Definition:
Causes:
I,
Class Requirements:
All
Company Specific
Requirements:
Classes:
Describe
errors
in
your
companys
acceptance
adhesive application:
18-
criteria
governing
on
VT-72
Surface
Mount
Solder Joint Evaluation: Rectangular Chip Components
Describe four typical solder joint imperfections associated

with rectangular chip components.
Definitions:
Causes
of
solder
joint
imperfections:
Class Requirements:
All
Classes:
Class 2:
Class 3:
Company Specific
Requirements:

joint imperfections in rectangular chip components:
VT72
Describe the conditions of nonwetting and dewetting, and

cite the causes for these conditions.
Definition:
Causes of nonwetting and

dewetting:
V
V
V
Acceptabffity:
Company Specific
Requirements:

conditions of nonwetting and dewetting:
-20
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-73
EVALUATION, PART 3: BOTTOM
ONLY & MELFs
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http./Iwww.ipc.org
VT-73 Surface Mount Solder Joint Evaluation
Bottom-Only & MELF Components
Bottom Only and MELF Components
Introduction
This video introduces the Bottom-Only termination style

of rectangular chip component and the cylindrical surface
mount component (MELF). Dimensional requirements for
both styles are covered, based uponANSI?J-STD-OOl
shown in the video. The workbook expresses each
objective as a question and provides an outline for your
answers and any additional notes you may want to make.
Objectives
After viewing the first section of the video, you will

Define the term Bottom-Only, as applied to rectangular
chip components.
I, Describe Bottom-Only joint characteristics visible
during inspection.
%_ Define the three classes of electronic products and
provide examples of each.
/ Describe endjoint width and cite the class
requirements of minimum end joint width for BottomOnly components.
v Describe side overhang and cite the class requirements
of maximum side overhang for Bottom-Only
components.
v Describe end overhang and cite the class requirements
of maximum end overhang for Bottom-Only
components.
v Describe the characteristics of Metal Electrode Face
(MELF) components.
V Describe the three attributes to look for in a solder
joint.
i/
Define the term

chip components.
Bottom-Only,
as
applied
to
rectangular
Definition:
Performing a Visual
Inspection:
Company Specific
Requirements:
Describe the
specified by
performing a visual inspection of Bottom-Only
components:
procedure
your
company
when
__________
VT-73 Surface Mount Solder Joint Evaluation Bottom-Only & MELF Components
-
Describe Bottom-Only joint characteristics visible during

inspection.
Viewable
Characteristi
cs:
Company Specific
Requirements:
Describe any viewable characteristics your company

considers during solder joint inspection of Bottom-Only
components:
-3-
_
_______
_____
________
-
Define
the
examples
Classes
three
classes
of electronic
products
and
provide
of each.
of Electronic
Products:
Class
1:
Class 2:
Class 3:
Industry Standards
Reference:
Company Specific
Requirements:
Define the class of electronic products your company

produces:
-4-
____
________
____
___________
Describe end joint width and cite the class requirements of

minimum end joint width for Bottom-Only components.
Definition:
Class Requirements:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:
Describe your companys acceptance criteria for minimum

end joint width in Bottom-Only components:
-5-
__________
________
-
Describe side overhang and cite the class requirements of

maximum side overhang for Bottom-Only components.
Definition:
Class Requirements:
All Classes:
Company Specific
Requirements:
Describe your companys acceptance criteria for maximum

side overhang in Bottom-Only components:
-6-
____________
Describe end overhang and cite the class requirements of

maximum end overhand for Bottom-Only components.
Definition:
Class Requirements:
All Classes:
Company Specific
Requirements:
Describe your companys acceptance criteria for maximum

end overhang:
-7-
-
Describe the characteristics of Metal Electrode Face

(MELF) components.
Description:
Company Specific
Characteristics:
Describe any additional characteristics displayed by

MELF components used by your company:
-8-
Describe the three attributes to look for in a solder joint.
Solder Joint Attributes:
Company Specific
Requirements:
Describe the attributes your company looks for when

examining solder joints:
-9-
v-r-73
Surface Mount Solder Joint Evaluation Bottom=Only & MELF Components

-
SECTION II
MELF Solder Joint Dimensional Requirements
Objectives
After viewing the second section of the video, you will

I,,
V
v
V
Describe the primary concern governing MELF solder

joint dimensional requirements.
Define side overhang and cite the class requirements
of maximum side overhang for MELF components.
Define end overhang and cite the class requirements of
maximum end overlap for MELF components.
Define end joint width and cite the class requirements
of minimum end joint width for MELF components.
Define side joint length and cite the class requirements
of minimum side joint length for MELF components.
Define fillet height and cite the class requirements of
minimum fillet height for MELF components.
Describe the primary concern governing MELF solder

joint dimensional requirements.
Primary Concern:
Industry Standards
Reference:
Company Specific Concerns:
Describe the concerns your company addresses when

evaluating MELF solder joints:
-11
________
Define side overhang and cite the class requirements of

maximum side overhang for MELF components.
Definition:
The maximum side overhang requirement assures:
Class Requirements:
All Classes:
Company Specific
Requirements:

side overhang in MELF components:
-12-
__________
_____
__________
_____
__________
___
Define end overhang and cite the class requirements of

maximum end overhang for MELF components.
Definition:
Class Requirements:
All Classes:
Company Specific
Requirements:

end overhang in MELF components:
-13-
-
Define end joint width and cite the class requirements of

minimum end joint width for MELF components.
Definition:
Class Requirements:
Class 1:
Class 2:
Class 3:
Company Specific
Requirements:

minimum end joint width in MELF components:
-14-
-
Define side joint length and cite the class requirements of

minimum side joint length for MELF components.
Definition:
Class Requirements:
Class 1:
Class 2:
Class 3:
Company Specific
Requirements:

minimum side joint length:
15-
___________
______
__
______
VT73 Surface Mount Solder Joint Evaluation
Define fillet height

minimum
fillet
and
height
cite
for
the
class
MELF
requirements
of
components.
Definition:
Class Requirements:
Class 1:
Class 2:
Class
Company Specific
Requirements:
3:
Describe
dimensional
minimum fillet height for MELF components:
your
-16-
companys
requirements
of
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT74
EVALUATION, PART 4: GULL
WING COMPONENTS
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT-74
Introduction
Surface Mount Solder Joint Evaluation: Gull Wing Components
The purpose of this video is to introduce the gull wing

style of chip component and the criteria used to evaluate
the
gull wing solder joint. A review of gull wing
dimensional requirements is covered, based upon the
ANSI/J-STD-OOl workmanship standards and product
classifications

question and provides an outline for your answers and any
Objectives

V Describe four styles of components using the gull wing
lead configuration.
V Cite the advantages and disadvantages of using the
gull wing style of surface mount components.
V Describe the inspection considerations used when
evaluating gull wing solder joints.
VT-74
Describe
gull
wing
four
styles
of components
using
the
using
the
lead configuration.
Styles of Gull Wing

Components:
SOIC:
QFP:
SOT:
TSOP:
Company Specific
Considerations:
Describe the gull wing leaded components your

uses:
company
_
_
ponents
ion: Gull Wing Com
at
lu
va
E
t
in
Jo
r
de
Mount Sol
VT-74 Surface
the
Cite
ages
advant
and
s
antage
disadv
ing
of us
the
gull
nents.
wing
ull
Advantages of the G
Wing Lead Style:
style
of
surface
nt
mou
compo
e Gull
Disadvantages of th
Wing Lead Style:
Company Specific
Considerations:
advantages
Describe additional
gull
n
company faces whe
using
-3rn.
or
disadvantages
style
your
nents:
compo
wing
VT74
Describe the inspection considerations used when

evaluating gull wing solder joints.
Inspection Considerations:
Maximum Allowable
Variation:
Company Specific
Inspection Considerations:
Describe any additional inspection considerations your

company uses when evaluating gull wing components:
VT-74
SECTION II
Problems Encountered When Soldering Gull Wing

Leaded Components.
Objectives

v Describe the occurrence of solder bridging and factors
attributing to its presence.
V Describe the indications of insufficient solder paste.
V Describe the types of mounting misalignment affecting
component performance.
VT-74
Describe the occurrence of solder bridging and factors

attributing to its presence.
Solder Bridging:
Acceptability:
Company Specific
Procedures:
Describe your companys corrective procedures for

resolving the problem of solder bridging:
-6-
VT-74
Describe the indications of insufficient solder paste.
Insufficient
Solder
Paste:
Acceptability:
Company Specific
Requirements:
Describe your companys acceptance criteria regarding

insufficient solder paste:
-7-
VT-74
Describe the types of mounting misalignment affecting

component performance.
Misalignment:
Minimum Electrical
Spacing:
Company Specific
Requirements:
Define your companys minimum electrical spacing

requirements:
VT-74
SECTION III:
Dimensional Requirements for Gull Wing Leaded

Components.
Objectives
After viewing the third section of the video, you will

I,
V
V
V
V
V
Define the three classes of electronic assembly and cite

the national soldering standard for gull wing solder
joints.
Describe side overhang, and cite the class
requirements for this condition.
Describe endjoint width, and cite the class
requirements for this attribute.
Describe side joint length, and cite the class
Describe recommended heel fillet characteristics.
Describe heel fillet height, and cite the class
Describe guidelines for an effective solder joint
evaluation.
-9-
_____
VT-74
Define the three classes of electronic assembly and cite the

national soldering standard for gull wing solder joints.
Classes of Electronic
Assembly:
Class 1:
Class
2:
Class 3:
Industry Standards
Reference:
Company Specific
Requirements:
Cite the classes of electronic assemblies your company

manufactures:
-.10-
__________
_______
______
VT-74
Describe side overhang, and cite the class requirements for

this condition.
Definition:
Class Requirements:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:

side overhang in gull wing solder joints:
11
VT-74
Describe endjoint width, and cite the class requirements

for this attribute.
Definition:
Class Requirements:
Class 1:
Class 2:
Class 3:
Company Specific
Requirements:

end joint width in gull wing solder joints:
VT-74
Describe side joint length, and cite the class requirements

for this attribute.
Definition:
Class Requirements:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:
Describe your companys dimensional requirement for

minimum side joint length in gull wing solder joints:
___________
_______
VT74
Describe recommended heel fillet characteristics.
Recommended
Characteristics:
Effects of Excessive Solder:
Effects of Insufficient
Solder:
Company Specific
Requirement:
Describe your companys requirements regarding

recommended heel fillet characteristics for gull wing
solder joints:
-14-
VT-74
Describe
for this attribute.
heel fillet
height,
and cite the class requirements
Definition:
Class Requirements for

Maximum Heel Fillet
Height:
Classi:
Class 2:
Class
3:

Minimum Heel Fillet
Height:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:
Describe your companys dimensional requirements

governing heel fillet height in gull wing solder joints:
-15-
VT-74
Describe guidelines for an effective solder joint

evaluation.
Guidelines for Effective

Evaluation:
I,
I,
Company Specific
Guidelines:
Describe your companys recommended guidelines for

evaluating dimensional characteristics in gull wing solder
joint connections:
16-
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-75
EVALUATION, PART 5: JLEAD
COMPONENTS
2215 Sanders Road

Northbrook, 1L
60062-6135
Tel 847 509-9700

Fax 847 509-9798
httpi/www.ipc.org
VT-75
Introduction
Surface Mount Solder Joint Evaluation: J-Lead Components
The purpose of this video is to introduce the J-Lead style

of chip component and the criteria used to evaluate the J
Lead solder joint. A review of J-Lead dimensional
requirements is covered, based upon the ANSIIJ-STD-OO1

question
and provides an outline for your answers and any
Objectives

I.,
I,
v
v
v
V
Describe the physical characteristics of a J-Lead

Connection.
List the three advantages offered by the J-Lead
connection.
Identify the critical structural area of the J-Lead solder
joint.
Describe the procedures necessary to perform an
adequate J-Lead solder joint inspection.
Define contact angle and list the maximum
recommended contact between the lead and the land.
Define wetting.
Describe the recommended characteristics of a 3-Lead
solder fillet.
Describe the common defects associated with
improper solder texture and the causes of those
defects.
Describe the effects of inconsistent solder volume on
3-Lead performance.
-1-
VT-75
Describe the physical characteristics of a J-Lead solder

connection.
Physical Characteristics:
Parts of a J-Lead:
Heel:
Toe:
A Typical J-Lead
Component Package:
-2
VT-75
List the two advantages offered by the J-Lead connection.
Advantages of the J-Lead:
I,
-3-
VT-75
Identify the critical structural area of the J-Lead solder

joint.
Critical Structural Area:
Difficulty of Inspection:
Company Specific
Concerns:
Describe any additional concerns your company addresses

regarding the J-Lead connection:
________________
_______
VT-75
Describe the procedures necessary to perform a J-Lead

solder joint inspection.
Inspection Procedures:
Inspection Equipment:
Identify the types of equipment your company uses when

evaluating J-Lead connections:
X-Ray Machine
Microscope
Manual Inspection
Other:
Company Specific
Procedures:
What are the procedures your company uses to inspect J

Lead solder joints?
-5.-
VT-75
Define solder contact angle.
Definition:
Maximum Recommended
Contact Angle:
__
vT-75
Define wetting.
Definition:
Relationship Between
Wetting and Solder Contact
Angle:
Company Specific
Requirements:
Describe your companys requirements concerning

wetting:
VT-75
Describe
solder
Solder
the
recommended
characteristics
of
J-Lead
fillet.
Fillet
Characteristics:
Toe
Side
Fillet
Fillet
Company
Characteristics:
Requirements:
Specific
Requirements:
Describe any additional criteria

determine proper solder fillet characteristics:
your
-8-
company
uses
to
__________
_____
________
VT-75
Describe
solder
Common Solder Texture

Defects:
the
common
texture
and
the
defects
causes
associated
of
these
with
improper
defects.
Causes of Solder Defects:
Proper
Solder
Texture:
Company Specific
Requirements:

joint defects caused by improper solder texture:
VT-75
Describe the effects of inconsistent solder volume on J-Lead

performance.
Characteristics of
Inconsistent Solder
Volume:
Results of Insufficient
Solder Volume:
Results of Excessive Solder

Volume:
VT-75
SECTION II:
J-Lead Solder Joint Dimensional Requirements
Objectives
After viewing the second section of this video, you will

V Describe the procedure used to determine the

b
I_
a
.
acceptability of J-Lead solder joints.

Define the three classes of electronic assembly
Define the condition of side overhang and cite the
class requirements for maximum side overhang in J
Lead components.
Define the condition of toe overhang and cite the class
requirements for maximum toe overhang in J-Lead
components.
Describe how endjoint width is measured cite the
class requirements for minimum end joint width in J
Lead components.
Describe how side joint length is measured and cite the
class requirements for minimum side joint length in J
Lead components.
Describe how fillet height is measured and cite the
class requirements for maximum fillet height in J-Lead
components.
Describe how minimum fillet height is measured and
cite the class requirements for minimum fillet height in
I-Lead components.
-11-
VT-75
Describe the procedure used to determine the acceptability

of J-Lead solder joints.
Measuring Solder Joints:
Describe general considerations regarding solder joint

inspection:
Solder Joint Strength:
Identify the areas of a J-Lead which determine solder joint

strength:
Company Specific
Requirements:
Describe any additional acceptability procedures used by

your company:
12
VT-75
Define
the
three
classes
of electronic
assembly
Classes of Electronic
Products:
Class
1:
Product Examples:
Class
2:
Product Examples:
Class
3:
Product Examples:
Company Specific
Requirements:
Define the classes

your company:
-13-
of electronic
products assembled by
VT-75
Define the condition of side overhang and cite the class

requirements of minimum side overhang for J-Lead
components.
Definition:

Minimum Side Overhang:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:

minimum side overhang in J-Lead components:
14
____
VT-75
Define the condition of toe overhang and cite the class

requirements of maximum toe overhang for J-Lead
components.
Definition:
Class Requirements:
All
Company Specific
Requirements:
Classes:
Describe your companys dimensional requirements for toe

overhang in J-Lead solder joints:
-15-
_________
________
_____
VT-75
Describe how end joint width is measured and cite the

class requirements of minimum end joint width for J-Lead
components.
Definition:
Class Requirements:
Class 1:
Class 2:
Class 3:
Company Specific
Requirements:

minimum end joint width in I-Lead components:
-16-
VT-75
Describe
how
side joint length
class
requirements
Lead
components.
of
is
minimum
measured
side
joint
and
cite
length
for
the
Definition:
Class Requirements:
Class
1:
Class 2:
Class 3:
Company Specific
Requirements:

side
length J-Lead
minimum
-17-
joint
in
components.
_______________
_
VT-75
Describe how fillet height is measured and cite the class

requirements of maximum fillet height for J-Lead
components.
Definition:
Class Requirements:
All Classes:
Company Specific
Requirements:

maximum fillet height in J-Lead components:
-18-
VT-75
: J-Lead Components
Surface Mount Solder Joint Evaluation
Describ
cite
for
the
how
class
J-Lead
minimum heel fillet height

ts
requiremen
of
minimu
is
measure
heel
fillet
and
height
ents.
compon
Definition
Class
ments:
Require
Class
1:
Class
Class
Company Specific
Requirements:
2:
3:
requirements for
Describe your companys dimensional
ents:
minimum fillet height in J-Lead compon
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELEcTRONic CIRCUITS
VT-91
INTRODUCTION TO SURFACE
MOUNT REWORK
2215 Sanders Road

Northbrook, 1L
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT91
Introduction to Surface Mount Rework
SECTION ONE
Rework Decisions
Name and briefly describe the two proper reasons

for reworking a solder joint.
Reason 1:
Reason 2:
Where are acceptance criteria and rework

specifications kept in your area?
-1
VT91
Rework Criteria
What are. your companys criteria for these

common rework conditions
Misalignment
>>
Insufficient solder
>>
Excess solder
>>
Voids
>>
Blow holes I pin holes
>>
Dewetting
>>
Contamination
>>
Other conditions
VT91
nt Rework
Introduction to Surface Mou
utions
Surface Mount Rework Ca
blies require even

Why do surface mount assem
than conventional
greater caution during rework
through-hole technology?
cerns when
What are some of the key con
ponents?
reworking surface mount com
Key concern:
Key concern:
VT-91
SECTION TWO
Purpose of Flux
Purpose:
What is the purpose of flux?

-
What are the negative effects of flux residue, if

left uncleaned?
Effects of Flux Residue:
-4-
VT91
Cleaning
What is the pre-cleaning process used in your

operation?
Cleaning equipment:
Cleaning process:
What is the fmal cleaning process and the

maximum time allowed between pre-cleaning and
final cleaning?
Cleaning equipment:
Cleaning process:
Maximum time:
VT-91
SECTION THREE
What type(s) of flux-cored solder does your

operation use?
Solder
Type of solder:
What are the effects of using a solder wire gauge

which is too thin or too thick for the application?
Too thin solder:
Too thick solder:
Solder Paste
Solder paste is:
Role of solvents:
What is solder paste? What role do solder pastes

solvents play?
VT91
Solder Paste Precautions
Precautions:
What precautions need to be taken when using

solder paste?
s
How is solder paste used in your operation (if

used).
Method of application:
VT-91
SECTION FOUR
Heating Systems
List and defme the two primary heating methods

and the two categories of devices in each system.
Method 1:
Category
Category
Method 2:
Category
Category
VT-91
Tools Strengths and Limitations
Describe the strengths and limitations of

continuously heated, pulse heated and convection
heating tools.
Continuously Heated
Strengths:
Limitations:
Pulse Heated
Strengths:
.
m
Limitations:
Convection Heated
Strengths:
.
a
Limitations:
a
a
VT-.91
Oxidation
Solution
Describe the effect oxidation can have on a

continuously heated tip.
How it can be reduced/removed?
10
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-92
REWORK OF SURFACE MOUNT
CHIP COMPONENTS
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT-92
Introduction
Rework of Surface Mount Chip Components
The purpose of this video is to introduce procedures for

the removal and replacement of surface mount chip
components. A variety of chip component types are
identified and recommended techniques are addressed for
each one. Tools used for chip removal and replacement are
fully evaluated.

objectives. The workbook expresses each objective and
provides an outline for your answers and any additional
notes you may want to make.
Objectives

v Identify the reason why chip resistors are mounted
upward.
/ Describe the four digit size code for chip resistors.
v Explain why chip capacitors must be heated slowly
prior to rework.
-1
VT-92
0
0
Identify the reason why chip resistors are mounted
upward.
Composition of a Chip
Resistors
The Orientation of
Mounted Chip Resistors
-2-
VT-92
Describe the four digit size code for chip resistors.
The Four Digit Size Code
Describe an Example of the

Four Digit Size Code
-3-
VT92
Explain why chip capacitors must be heated slowly prior

to rework.
The Need for Gradual

Heating
Describe the Results of

Rapid Heating
-4-
VT-92
SECTION 2:
Soldering Iron Tip Types
Objectives

Describe a chisel tip, a conical tip and an bifurcated
tip.
V Explain how the shape and size of a soldering iron tip
affects heat transfer.
i/ Identify the preferred tip to land size ratio.
V
-5-
VT-92
Describe a chisel tip, a conical tip and a bifurcated tip.
Soldering Iron Tip types:
Describe the physical characteristics of the three main

soldering iron tip types:
The Chisel Tip
The Conical Tip
The Bifurcated Tip
-6-
VT-92
Explain how the shape and size of a soldering iron tip

affects heat transfer.
Selecting the Proper Shape

and Size of Tip
The Advantages of a Larger

Tip
The Advantages of a
Smaller Tip
The Consequences of Using

the Wrong Tip Size
-7-
VT-92
Identify the preferred tip to land ratio.
Hazards of Using a
Soldering Iron Tip That is
Too Small
Hazards of Using a
Soldering Iron Tip That is
Too Large
Suggested Tip to Land Fit
Company Specific
Requirements:
Describe your companys requirements regarding the

selection of soldering iron tip size:
-8
VT-92
SECTION 3:
Chip Component Removal
Objectives
After viewing the third section of the video, you will

S
Discuss the advantages and disadvantages of removing

chip components using an individual single point
soldering iron.
i
Discuss the advantages and disadvantages of chip
removal using two soldering irons.
V Describe the reasons for each process step during chip
component removal using a bifurcated tip.
. Discuss the steps in proper bifurcated tip preparation.
.1 Identify what it is that actually lifts the component off
the board during chip removal.
V Describe the process required to remove extremely
small chips that do not fit in a bifurcated tip.
V Identify chips which have been bonded onto the
printed circuit board.
V Describe the removal process for a bonded chip using
a bifurcated tip.
-9-
___
__
VT-92
Discuss the advantages and disadvantages of removing

chip components using an individual single point
soldering iron.
Recommended Method for

Chip Removal Using a
Single Soldering Iron
Advantage of This Method
Disadvantages of This
Method
Company Specific
Requirements
Cite your companys policy concerning the use of an

individual single point soldering iron for component
removal:
-10-
VT-92
Discuss the advantages and disadvantages of chip removal

using two soldering irons.
Recommended Removal
Method Using Two
Soldering Irons
Advantage of This Method
Disadvantages of This
Method
Company Specific
Requirements
Describe your companys policy regarding chip removal

using the two iron method:
-P11
VT-92
Cite the considerations affecting bifurcated tip preparation

for chip removal.
Tip Size
Fluxing the Solder Joint
Flux Types
Company Specific
Requirements
Describe your companys policy for tip sizing and fluxing

prior to component removal:
-12-
VT-92
Discuss the steps in proper bifurcated tip preparation.
Removing Old Solder From

the Cavity
Shocking the Tip
Filling the Cavity With

Solder
-13-
VT-92
Identify what actually lifts the component off the board

during chip removal.
Definition of Surface
Tension
Why Surface Tension Lifts

the Component
14-
VT-92
Describe the steps required to remove extremely small
chips that do not fit in a bifurcated tip.
Step
1:
Fluxing
the
Component
Step 2:
Cleaning the
Soldering Iron Tip
Step 3: Positioning the

Soldering Iron
Explain Why This

Technique Works
Company Specific Methods
Explain your company?s technique for removing extremely

chip
small
components:
-15-
VT-92
Identify chip which have been bonded onto the printed

circuit board.
Identifying Bonded Chips
The Stage in the Assembly

Process When Chips are
Bonded to the Board
Typical Location of Bonded

Chips
-16-
VT-92
Describe
the
bifurcated
Step
1:
Preparing
removal
process
for
a bonded
chip
using
tip.
and
Prefilling the Bifurcated

Tip
Step
2:
Applying
the
Tip
to
the Component
Step 3: Moving the

Component
Company Specffic
Procedures
Describe your companys procedures for removing bonded

chip components:
-17
VT-92
SECTION 4:
Land Preparation
Objectives
After viewing the fourth section of the video, you will

V Explain the need to remove old solder during the land

preparation process.
v Describe the preferred width of a solder removal braid
for chip land preparation.
V Describe the results of using a soldering tip which is
either too large or too small for the solder braid.
V Cite the reason for adding additional flux to the solder
braid.
V Explain why its important to avoid applying excess
pressure with the braid or tip during the solder removal
process.
V Identify the preferred tip size when using a vacuum
extractor and the proper amount of pressure applied
during the solder removal process.
V Cite the advantages of cleaning away the used flux
residue prior to replacing a chip component.
-18-
VT-92
Explain the need to remove old solder during the land

preparation process.
The Need to Remove Old

Solder
The Problem Posed by

Reheated Solder
Company Specific Policies
Describe your companys policy regarding the removal of

solder remaining from the chip removal process:
-19-
VT-92
Describe
chip
land
the
preferred
width
of
solder
removal
braid
preparation.
Definition of a Solder Braid
Selecting the Correct Solder

Braid Width
Company Specific
Recommendations
Cite
policy regarding the selection
solder removal braids:
your
companys
-20
of
for
VT-92
Describe the results of using a soldering tip which is either

too large or too small for the solder braid.
Recommended Method for

Sizing the Soldering Iron
Tip and Solder Braid
Results of Using a Too

Large Tip
Results of Using a Too

Small Tip
-21
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01 XflJJ
SUflOJJ
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ipjos qi 01 XflJj UUOflTpp1 2utppi iOj UOS1 T41 1TD
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sjueuodwo3 diq unoj
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VT-92
Explain why its important to avoid applying excess

pressure with the braid or tip during the solder removal
process.
Determining the Proper

Amount of Pressure
Results of Applying
Excessive Pressure
-23
VT-92
Identify the preferred tip size when using a vacuum

extractor, and the proper amount of pressure that should be
applied during the solder removal process.
Description of the Vacuum

Extractor
Selecting an Extractor Tip

Size
Application of Pressure
When Using a Vacuum
Extractor
-24
VT-92
Cite the advantages of cleaning away the used flux residue

prior to replacing a chip component.
Why Used Flux is Removed
Company Specific
Requirements
Discuss your companys policy regarding the removal of

used flux prior to chip replacement:
25-
VT-92
SECTION 5:
Chip Installation Using a Single Point Hand Soldering

Iron
Objectives
After viewing the fifth section of the video, you will

v Cite the reasons for cleaning flux residue from the
prefihl area before applying additional flux.
v Explain why its important to wait one or two seconds
after melting the prefill before removing the holding
tool.
V Discuss the cleaning procedures used after the solder
prefihl operation.
V Address the advantages and disadvantages of using a
single point hand soldering tool to install surface
mount chip components.
-26-
VT-92
Cite
the
area
before
reasons
for
cleaning
applying
flux
additional
residue
from
the
prefihl
flux.
The Effects of Flux Residue
Cleaning Flux Residue

From the Prefill Site
Company Specffic Policies
Describe
removal
your
of
companys
residual
-27-
flux
policy and procedure for the

solder prefihl
prior
to
operation:
VT-92
Explain why its important to wait one or two seconds after

melting the prefihl before removing the holding tool.
Description of the Prefihl

Operation
Why Contact is Maintained

with the Holding Tool
-28-
VT-92
Discuss
prefihl
the
cleaning
procedures
used
after the
solder
operation.
The Cleaning Procedure
When Cleaning Should

Occur
Company Specific
Requirements
Describe your companys procedures for removing flux

residue
prefihl
after
-29-
operation:
VT-92
Address the advantages and disadvantages of using a

single point hand soldering iron to install surface mount
chip components.
Advantages of the Single

Point Iron
Disadvantages of the Single

Point Iron
Company Specific Policy
Describe your companys policy regarding the use of the

single point soldering iron when replacing chip
components:
-30
VT-92
SECTION 6:
Chip Replacement Using a Bifurcated Soldering Iron

Tip
Objectives
After viewing the sixth section of the video, you will

V Summarize the steps required to perform a chip
installation using a bifurcated soldering iron tip.
V Describe how to determine the amount of solder to add
in the prefills and in the tip when preparing a
bifurcated tip.
V Explain why it is important to hold the component in
place for one or two seconds after removing the
heating tool.
V Describe the proper cleaning procedures after
completing component installation.
V Cite the advantages and disadvantages of using a
bifurcated soldering iron tip for component
installation.
-31
VT92
Summarize the steps required to perform a chip

installation using a bifurcated soldering iron tip.
Step 1: Cleaning and Prefihl
Step 2: Fluxing
Step 3: Component
Positioning
Step 4: Melting the Prefills
Step 5: Holding the

Component
Step 5: Cleaning
Procedures
-32
VT-92
Describe how to determine the amount of solder to add in

the prefills and in the tip when preparing a bifurcated tip.
Bifurcated Tip Preparation
Filling the Tip Cavity
Company Specific
Procedures
Describe your companys recommended procedures for

preparing a bifurcated soldering iron tip for use:
33
VT-92
Explain why its important to hold the component in place

for one or two seconds after removing the heating tool.
Maintaining Proper
Component Placement
The Cause of Grainy Solder

Connections
34
VT-92
Describe the proper cleaning procedures after completion

of component installation.
Removing Flux Residue
Company Specific
Procedures
Describe your companys cleaning procedures for the

removal of flux residue after component placement:
-35
VT92
Cite the advantages and disadvantages of using a

bifurcated tip for component installation.
Melting Solder Prefills
Technically Challenging in
Preparation and Use
Company Specific Policy
Describe your companys policy regarding the use of the

bifurcated tip for chip installation:
36
VT-92
SECTION 7:
The installation of Chip Components With the Use of

Adhesive Bonding.
Objectives
After viewing the seventh section of the video, you will

V Describe the steps required to secure a chip
components using adhesive.
i/ Identify the type of adhesive used for chip component
placement and the adhesive applicator type.
V Describe the process of curing adhesive.
V Explain why its important to keep adhesive off the
lands.
V Describe the size of the soldering wire used for hand
soldering chip components.
37
VT-92
Describe the steps required to secure chip components

using adhesive.
Using Adhesive to Install
Chip Components
Step 1: Applying the
Adhesive
Step 2: Placing the

Component
Step 3: Seating the

Component
Company Specific
Procedures
Describe your companys procedure for installing chip

components using an adhesive bond:
-38-
VT-92
Identify the type of adhesive used for chip component

placement and the adhesive applicator type.
Company Specific Usage
Identify the types of adhesive used by your company for

the placement and installation of chip components:
Company Specific Usage
Identify the type of adhesive applicator used at your

facility:
39
VT92
Describe the process of curing adhesive.
Company Specific
Procedures
Describe your companys procedures for the curing of

adhesive used in the installation of chip components:
40
VT92
Explain why its important to keep adhesive off the lands.
The Results of Using Excess

Adhesive
Recommended
Procedure
Company Specific
Procedures
Describe your companys policies regarding adhesive

bleeding onto surface mount lands:
-41
VT-92
Describe the size of the soldering wire used for hand

soldering chip components.
Affect of Wire Size During

hand Soldering
Solder Wire That is Too
Thick
Solder
Wire
That
is
Too
Thin
Company Specific
Requirements
Cite the solder wire sizes used at your facility for the hand
soldering of chip components:
-42-
VT-92
SECTION 8:
Using the Pulse Heated Tweezers
Objectives
After viewing the eighth section of the video, you will

Describe how to determine the right heat setting for
pulse heated tweezers when performing chip removal.
0 Cite the reason for adding flux during the chip removal
v
process using pulse heated tweezers.
i Describe what occurs when the tweezer tips touch
another component or solder joint during the tip
placement process.
i Determine how long it should take for solder to melt
after heat is applied using pulse heated tweezers.
V Describe where the removed component should be
placed to avoid damage to the work surface.
I_
43
VT92
Describe how to determine the right heat setting for pulse

heated tweezers when performing chip removal.
Using
the
Correct
Heat
Setting
Recommended Procedure
Company Specific
Procedures
Cite your companys procedures for adjusting the heat

setting for pulse heated tweezers:
44
VT92
Cite the reason for adding flux during the chip removal
process using pulse heated tweezers.
The Reason for Enhancing

Heat Transfer
Company Specific
Procedures
Describe your companys procedure for adding flux prior

to chip removal:
-45-
VT92
Describe what occurs when the tweezer tips touch another

component or solder joint during tip placement.
The Advantage of
Positioning Tweezer Tips
Before Heating
Recommended Procedure
for Positioning the Tips
Company Specific
Procedure
Describe your companys procedure for tweezer tip

placement prior to chip removal:
-46
VT-92
Describe how long it should take for solder to melt after

heat is applied using pulse heated tweezers,
The Time Required for

Solder Reflow
When Solder Flow is

Evident
-47
VT92
Describe where the removed component should be placed

to avoid damage to the work surface.
Removing the Desoldered

Component
Preserving the Component
Company Specific
Procedures
Describe your companys procedures for component

placement after removal using pulse heated tweezers:
48
VT92
SECTION 9:
Component Replacement with Pulse Heated Tweezers

Using the Solid Solder Prefill Technique
Objectives
After viewing the ninth section of the video, you will

is
is
is
is
Describe the solid solder prefill process for chip

replacement using pulse heated tweezers.
Cite the factors affecting the amount of solder used in
the prefill operation.
Describe what occurs if one side of the pulse heated
tweezer is removed before the other.
Describe the advantages and disadvantages of holding
the component with a holding tool prior to tweezer
release.
-49
VT92
Describe the solid solder prefill process for chip

replacement using pulse heated tweezers.
Advantage
of
Pulse
Heated
Tweezers
Solid Solder Prefill

Technique
Step 1: Melting Crowns of
Solder for the Lands
Step 2: Adding Flux
Company Specific
Requirements
Describe the techniques your company uses to create

solder prefihls:
50
VT-92
Cite the factors affecting the amount of solder used in the

prefihl operation.
Component Terminations
Experience and Practice
Company Specific
Procedures
Describe your companys practice for determining the

amount of solder prefihl required for specific component
sizes and shapes:
VT-92
Describe what occurs if one side of the pulse heated

tweezers is removed before the other.
Releasing the Component
Results of an Improper
Release
52
VT92
Describe the advantages and disadvantages of holding the

component with a holding tool prior to tweezer release.
Using a Holding Tool
Disadvantages of Using a
Holding Tool
The
Cause
of
Grainy
Solder
Joints
Company Specific Practices
Cite your companys policy for using a holding tool while

hand soldering. chip components:
-53
VT-92
SECTION 10:
Component Replacement with Pulse Heated Tweezers

Using the Solder Paste Prefill Technique
Objectives
After viewing the tenth section of the video, you will

e/ Describe the process for chip installation using pulse

heated tweezers and solder paste.
V Describe the type of dispenser used to apply solder
paste.
V Cite factors affecting the amount of solder paste to be
applied.
V Describe the proper procedure for installing the
component into the solder paste.
V Describe the recommended cleaning procedure
following component installation.
-54
VT-92
Describe the process for chip installation using pulse

heated tweezers and solder paste.
Step 1: Applying the Solder

Paste
Step 2: Grasping the

Component
Step 3: Component
Alignment
Step 4: Heat Activation
Step 5: Releasing the

Tweezers
Step 6: Cleaning Up the

Flux Residue
Company Specific
Procedures
Describe your companys procedures for hand soldering

using the pulse heated tweezers and solder paste:
-55
VT92
Describe the type of dispenser used to apply solder paste.
Experience in Using a
Solder Paste Dispenser
Company Specific
Procedures
Identify and describe the type of solder paste dispenser

used at your facility:
56
VT-92
Cite factors affecting the amount of solder paste to be

applied.
Determining the Necessary

Amount of Solder Paste
Company Specific
Procedures
Describe your companys reconunendations for

determining the amount of solder paste to be applied to the
land:
-57
__
__
VT-92
Describe the proper procedure for installing the

component into the solder paste.
Component Placement
Releasing the Component
The Action of Surface

Tension
Company Specific
Procedures
Describe your companys procedures for installing a chip

component using pulse heated tweezers and solder paste:
58
VT92
Describe the recommended cleaning procedure following

component installation.
Company Specific
Procedures
Describe your companys procedures for the removal of

flux residue after hand soldering:
-59
VT-92
SECTION 11:
Chip Removal Using Continuously Heated Tweezers
Objectives
After viewing the eleventh section of the video, you will

V Cite the recommended starting temperature for
continuously heated tweezers.
V Cite the recommended tip to termination spacing for
V Describe the process for chip removal using
V Describe the process for removal of adhesive bonded
chips using continuously heated tweezers.
-60-
VT.92
Cite
the
recommended
continuously
Setting
the
starting
temperature
for
the
heated tweezers.
Temperature for
Continuously Heated
Tweezers
Company Specific
Requirements
Cite
recommended working
for continuously heated
your companys
tweezers:
-61
temperatures
VT92
Cite the recommended tip to termination spacing for

Tip to Termination Spacing
Company Specific
Requirements
Describe your companys recommended tip to termination

spacing when using continuously heated tweezers:
62
VT-92
Describe the process for chip removal using continuously

heated tweezers.
Removing Chips Using

Continuously Heated
Tweezers
Step 1: Component Fluxing
Step 2: Contacting the

Terminations
Step
3:
Lifting
the
Component
Step 4: Land Preparation
Company Specific
Procedures
Describe your companys recommended procedures for the

removal of chip components using continuously heated
tweezers:
63
VT92
Describe the process for removal of adhesive bonded chips

using continuously heated tweezers.
Removing Adhesive Bonded

Chips using Continuously
Heated Tweezers
Step 1: Component Fluxing
Step 2: Contacting the

Terminations
Step 3: Softening the

Adhesive
Step 4: Loosening the

Adhesive
Step 5: Removing the

Component
Step 6: Land Preparation
64
VT92
SECTION 12:
Chip Removal Using a Hot Air Pencil
Objectives
After viewing the twelfth section of the video, you will

I,
I,
v
V
i/
v
i/
Cite the recommended starting temperature for chip

removal or replacement using a hot air pencil.
Address some of the factors regarding tip selection for
the hot air pencil.
Describe the procedure for adjusting the air pressure of
a hot air pencil for any specific tip.
Describe the circumstances when its inappropriate to
use the hot air pencil.
Describe the process of chip removal using a hot air
pencil.
Describe the proper action to take if the solder does
not melt within ten seconds.
Describe the results of attempting to remove a
component before the solder is thoroughly melted.
Address the effects of using a hot air pencil when the
air pressure is set too high or too low.
-65
VT-92
Cite the recommended starting temperature for chip

removal or replacement using a hot air pencil.
Setting the Proper

Temperature
Company Specific
Requirements
Cite your companys recommended starting temperature

for the hot air pencil:
66-
VT-92
Address some of the factors regarding tip selection for the

hot air pencil.
Selecting a Tip for the Hot

Air Pencil
Small Diameter Tips
Dual Tips
Flat Tips
Company Specific
Requirements
Cite your companys recommendations for the selection of

a hot air pencil tip:
67-
VT-92
Rework
of
Surface
Mount
Chip
Components
Describe the procedure for adjusting the air pressure of a

hot air pencil for any specific tip.
Adjusting
Air
Pressure
Using a Tissue to Check Tip

Temperature
Company Specific
Procedures
Describe your companys recommended procedure for

adjusting the air pressure on a hot air pencil:
-68
VT-92
Describe the circumstances when its inappropriate to use

the hot air pencil.
Avoiding Tightly Packed

Chips
Company Specific
Procedures
Cite your companys policy regarding the use of the hot air
pencil in high density situations:
-69
____
__
VT-92
0
0
Describe the process of chip removal using a hot air
pencil.
Chip Removal Using the
Hot Air Pencil
Step 1: Adding Flux
Step 2: Approaching the

Solder Joint
Step 3: Moving the Tip
Step 4: Melting the Solder
StepS: Removing the

Component
Company Specific
Procedures
Describe your companys procedure for removing chip

components using a hot air pencil:
-70
VT-92
Describe the proper action to take if the solder does not

melt within ten seconds.
Action to Take When the

Solder Does Not Melt
Promptly
Compensating for the

Presence of Large
Conductors or Ground
Planes
Multilayer Boards
Company Specific
Procedures

resolving solder reflow problems when using the hot air
pencil:
71
VT-92
Describe the results of attempting to remove a component

before the solder is thoroughly melted.
The Effects of Premature

Removal
72
VT92
Describe the effects of using a hot air pencil when the air
pressure is set too high or too low.
Finding the Right Air

Pressure
The Effects of Air Pressure

That is Too High
The Effects of Air Pressure

That is Too Low
73
VT-92
0
0
SECTION 13:
Component Replacement Using the Hot Air Pencil
Objectives
After viewing the thirteenth section of the video, you will

v Specify where the hot air pencil should be positioned
when performing chip replacement.
V Describe why its important to predry the solder paste
before melting it.
V Describe the typical cleaning procedure after
74
VT-92
Specify
when
where
the
performing
hot
chip
air pencil
tip
should
be
positioned
replacement.
Positioning the Hot Air

Pencil Tip
Moving
the
Tip
Closer
to
Melt All the Solder
Company Specific
Procedures

placement the hot air pencil tip:
of
75
VT-92
Describe why its important to predry the solder paste

before melting it.
The Solder Paste Predrying

Procedure
The Purpose of Predrying

Solder Paste
Company Specific
Procedures
Describe your companys recommended procedures

regarding the predrying of solder paste before component
installation:
-76
VT92
Describe the typical cleaning procedure following

Company Specific
Procedures

cleaning flux residue subsequent to chip installation:
-77
VT92
SECTION 14:
Chip Installation Using the Hot Air Pencil and Solder

Prefills
Objectives
After viewing the fourteenth section of the video, you will

V
V
V
V
V
Describe the process for replacing a chip component

using the hot air pencil and solder prefills.
Discuss the use of a holding tool during chip
installation using the hot air pencil and solder prefills.
Be able to determine where the tip should be placed
when using the hot air pencil with solder prefills.
Be able to determine when all of the solder has melted.
Discuss specific cleaning procedures following chip
-78
VT92
Describe the process for replacing a chip component using

the hot air pencil and solder prefills.
Prefuiling the Lands
After preparing and prefilling the lands, the chip

installation procedure using a hot air pencil is described
as:
Step 1: Removing Flux

Residue
Step 2: Component
Positioning
Step 3: Flux Application
Step 4: Positioning the Hot

Air Pencil
Step 5: Melting the Prefills
Step 6: Residue Cleanup
-79-
VT-92
Discuss the use of a holding tool during chip installation

using the hot air pencil and solder prefills.
The Use of a Holding Tool
Company Specific
Procedures
Describe your companys policy regarding the use of

holding tools during the installation of chip components
onto prefihled lands:
80
VT92
Be able to determine where the tip should be placed when

using the hot air pencil with solder prefills.
Air Pencil Tip Placement

During Chip Installation
Company Specific
Requirements
Describe your companys recommended starting tip

distance when using the hot air pencil with solder prefills:
-81
VT-92
Be able to determine when all the solder has melted
Determining Complete
Solder Reflow
Company Specific
Requirements
Describe your companys recommended procedure for

determining complete solder reflow:
82-
VT-92
Discuss specific cleaning procedures following chip

Company Specific
Procedures

cleaning flux residue subsequent to chip installation using
the hot air pencil:
-83
VT-92
SECTION 15:
Heating Requirements for Ceramic Chip Capacitors
Objectives
After viewing the fifteenth section of the video, you will

e/ Discuss company specific policy regarding the
preheating of ceramic chip capacitors.
v Identify the type of equipment used for the installation
of ceramic chip capacitors.
v Identify the specific temperature ramp-up and
preheat temperature recommended for the installation
i/ Describe why its important to turn the heat on after
the component is placed on the heating device.
i Describe any special considerations for soldering
ceramic chip capacitors after preheating.
-84
VT-92
Discuss company specific policy regarding the preheating

The Need for Gradual

Heating
Company Specific
Procedures
Cite your companys policy regarding the preheating of

ceramic chip capacitors:
85
VT-92
Identify the type of equipment used for the installation of

ceramic chip capacitors.
Equipment Used to Install

Ceramic Chip Capacitors
The Recommended Tool

Used to Move the
Component After
Preheating
Company Specific
Procedures
Describe the tools and devices your company uses for the
preheating and installation of ceramic chip components:
86-
___
VT92
Identify the specific temperature ramp-up and preheat

temperature recommended for the installation of ceramic
chip capacitors.
The Need to Control

Temperature
Company Specific
Procedures
Identify your companys recommended ramp-up and

preheat temperatures for the installation of ceramic chip
capacitors:
-87-
VT-92
Describe why its important to turn the heat on after the

component is placed on the heating device.
Gradually Heating the

Ceramic Capacitor
88
VT92
Rework
of
Surface
Mount
Chip
Components
Describe any special considerations for soldering ceramic

chip capacitors after preheating.
for
Soldering Ceramic Chip
Special Considerations
Capacitors
Company Specific
Considerations
Describe concerns addressed by your company when

preheating and installing ceramic chip capacitors:
89
THE INSTITUTE FOR

INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-36
HAND SOLDERING WITH LOW
RESIDUE FLUX
2215 Sanders Road

Northbrook, IL
60062-6135
Tel 847 509-9700

Fax 847 509-9798
http://www.ipc.org
VT-36
Hand Soldering With Low Residue Fluxes
0
S
.

*
Introduction
The purpose of this video is to show what is

involved with hand soldering using low residue
fluxes
as part of a no-clean process.
information shown in the video. Those key areas are
presented as objectives. The workbook expresses
each objective as a question and provides an outline
for your answers and any additional notes.

b
Describe why low residue fluxes are beginning

to be used in the electronics manufacturing
industry.
Discuss the differences between a low residue

flux and traditional rosin based fluxes.
i/
Discuss the characteristics of halide activated

fluxes versus low residue fluxes with low
amounts of weak organic acids as activators.
Describe the ways in which the possibility of

contamination can be reduced when hand
soldering with low residue fluxes.
1
i
Discuss the differences in final inspection

criteria in a no-clean process.
VT36
0
0
Explain why low residue fluxes are beginning to be
used in the electronics manufacturing industry.
Explanation:
VT-36
0
0
Discuss the differences between a low residue flux
and traditional rosin based fluxes.
Discussion:
VT-36
Discuss the characteristics of halide activated fluxes

versus low residue fluxes with low amounts of weak
organic acids.
Discussion:
VT36
Discuss the ways in which the possibility of

contamination can be reduced when hand soldering
with low residue fluxes.
Discussion:
VT36
0
0
Discuss the differences in final inspection criteria
for a no-clean process.
Discussion:
VT-36
0
0
V Describe the main areas of concern when

operators change to low residue fluxes.
V Name and describe the three variables for
soldering iron tip selection.
V Discuss the characteristics of temperature and
dwell time as they relate to hand soldering with
low residue fluxes
V Discuss how the feed rate affects the soldering
operation.
VT-36
0
0
Describe the main areas of concern when operators
change to low residue fluxes.
Description:
VT-36
Name and describe the three variables for soldering

iron tip selection.
Name Variable 1:
Description:
Name Variable 2:
Description:
Name Variable 3:
Description:
VT36

0
Discuss the characteristics of temperature and dwell

time as they relate to hand soldering with low
residue fluxes.
Discussion:
10-
VT-36
Discuss how the feed rate affects the soldering

operation.
Discussion:
11
VT-36

V Explain why it is important to tin the tip of the
soldering iron.
V Describe the methods used to recondition an
abused tip.
i/
Describe the steps required for making a typical

hand solder connection.
V Describe the three methods of making a solder

heat bridge.
V Explain the purpose of applying heated air to the
connection area during the soldering process.
V Describe the requirements for visually
inspecting solder joints made using low residue
fluxes.
12-
VT46
Hand Solderinci With Low Residue Fluxes
0
0
Explain why it is important to tin the tip of the
soldering iron.
Explanation:
13
VT-36
0
0
Describe the methods used to recondition an abused
tip.
Description:
-14-
VT36
Describe the steps required for making a typical

hand solder connection.
Describe Step 1:
Describe Step 2:
Describe Step 3:
Describe Step 4:
15
VT36
0
0
Describe the three methods for making a solder heat
bridge.
Description:
16
VT-36
0
0
Explain the purpose of applying heated air to the
connection area during the soldering process.
Explanation;
17-
VT-36
0
0
Describe the requirements for visually inspecting
solder joints where low residue fluxes were used.
Description:
How is inspection done at your

company?
18-
cc
THE INSTITUTE FOR
INTERCONNECTING
AND PACKAGING
ELECTRONIC CIRCUITS
VT-44
Overview of
Component
Preparation and
Manual Insertion
2215 Sanders Road

Northbrook,IL
60662-6135
Tel
847.509.9700
Fax
847.509.9798
Telex 214814 IPCUR
Vf44
Overview of Component Preparation and Manual Insertion
Section 1.
(The Assembly Process. General Considerations. Manual Insertion: When?
Kitting And Picking. Temporary Solder Mask.)
A. The Assembly Process.

All companies that manufacture electronic assemblies do not handle the assembly process in the
same way. Why?
B. General Considerations.
Safety.
List at least four areas of safety considerations that every person who works in the
assembly process should understand.
ESD.
Why is ESD such an important consideration for every one who works in assembly?
Board Handling.
How should boards be handled and why?
VT-44 Overview of Component Preparation and Manual Insertion
Checking all work.

How should an assembler check their work?
Teamwork.
What is the main goal of teamwork?
C. Manual Insertion.
List three times in the assembly process when manual insertion may be done.
D. Kitting And Picking.

Kits include:
What is typically included in a kit?
Component Identification.
Why is component identification such an important issue for all assemblers?
What resources are available to aid in component identification?
VT-44
E. Temporary Solder Mask.

Why is temporary solder mask used?
Where is temporary solder mask used?
List the types of temporary solder mask.
How is temporary solder mask applied?
-3-
VT-44
What should assemblers remember about the application of temporary solder mask?
How is temporary solder mask removed?
What problems might occur with the application of liquid resist?
What is the main problem that might occur with other types of solder resist materials?
-4-
VT-44
Section 2.
(Component Preparation: Clipping Leads. Preforming Leads. Checking.)
A. Clipping Leads.
What could happen if component leads are clipped:
Too short?
Too long?
t
Why is heat shrink sleeving used on component leads?
B. Pre-forming leads.
Why are the following types of lead preforms used?
Stress relief.
Lock-in Crimping.
Above-board shapes.
-5-
Vf-44
Why are lead center to center measurements important?
What are o types of preforming machines?
What part of a preform machine is responsible for a preform shape?
List the action steps in preform machine operation.
Vf-44
What types of hand tools are sometimes used to preform leads?
C. Checking Procedure.
Describe the checking procedure used during preform machine operation.
What errors might occur during preforming operations?
-7-
V-1:44
Section3.
(Manual Insertion: Polarity. Orientation. Polarity And Orientation Markings. Some Simple Rules. Clinching
Leads; Adhesive Bondin& Semi-Automated Manual Insertion Machines. Assembly Line. Wave Soldering.
A. Polarity.
List several examples of polarized components.
Polarized components have what types of leads?
(true or false) Polarized component leads are never marked.
(true or false) Board legends never show lead location.
(true or false) Polarized components will work properly if they are reversed when inserted.
B. Orientation.
(true or false) Polarity determines orientation.
(true or false) Component leads and holes are never numbered.
(true or false) Any component lead can go in any board through hole.
(true or false) Board legends often show component shape and lead markings.
-8-
VT-44
C. Some Simple Rules:

List several important rules to follow during the insertion process.
D. Clinching Leads; Adhesive Bonding.

Give two important reasons why lead clinching or adhesive bonding is done during the
assembly process.
What is involved in lead clinching?
What is involved in adhesive bonding?
(true or false) There are no rules that govern lead clinching or adhesive bonding.
VT44
E. Semi-Automated Manual Insertion Machines.

How are lasers used in semi-automated manual insertion machines?
How do the special bins work in some semi-automated manual insertion machines?
E Assembly Line.
Why are boards often mounted in pallets on an assembly line?
(true or false) Each assembly line operator is responsible for certain number of parts or a
certain area of board.
(true or false) An assembly line operator has choice about whether or not to follow instructions
on an assembly line.
List two ways that boards move down an assembly line?
What must each assembly line operator know about the other assembly line team members
work?
-10-
0
0
Vf44
G. Wave Soldering.
What are the two functions of a good solder filet?
11

The Institute For: Introduction To Surface Mount Assembly

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THE INSTITUTE FOR

2215 Sanders Road

Tel 847 509-9700

Introduction to Surface Mount Assembly

Introduction to Surface Mount Assembly

The purpose of this video is to introduce the steps

After viewing Section 1 of the video, you will

v Identify and explain the advantages and

Introduction to Surface Mount Assembly

Describe the characteristics of surface mount

Introduction to Surface Mount Assembly

Introduction to Surface Mount Assembly

Describe gull wings and J-leads.

Introduction to Surface Mount Assembly

Name and briefly describe the various package

Gull Wing Packages:

Introduction to Surface Mount Assembly

V Describe the basic process for setting up the

Introduction to Surface Mount Assembly

Name and briefly describe the three basic

Introduction to Surface Mount Assembly

Describe the construction of the stencil in the solder

Company Specific Factors:

Describe the type of stencils used in your facility.

Introduction to Surface Mount Assembly

Name the five variables involved in making

Introduction to Surface Mount Assembly

Company Specific Factors:

Describe any differences in the set-up procedure at

Introduction to Surface Mount Assembly

Describe the consequences of either too much or

Too Much Squeegee Pressure:

Too Little Squeegee Pressure:

Introduction to Surface Mount Assembly

Describe the purpose of regularly cleaning the

Introduction to Surface Mount Assembly

Introduction to Surface Mount Assembly

After viewing Section 3 of the video, you will

V Describe the different ways parts are fed to the

V Name and briefly describe the three zones in a

Introduction to Surface Mount Assembly

Introduction to Surface Mount Assembly

Describe the different ways parts are fed to the

Introduction to Surface Mount Assembly

Name and briefly describe the two most common

Company Specific Factors:

Describe the type of reflow system used at your

introduction to Surface Mount Assembly

Name and briefly describe the three zones in a

Introduction to Surface Mount Assembly

Name and briefly describe the two types of tests