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TEST OPERATIONS Associate Process Engineer (Litho) - Ref: 0503

• Sustain and provide continuous process improvements through executing


Test Product Engineer (Verigy & Teradyne) - Ref: 0401 procedures to ensure that products meet all quantity, yield and cycle time
• Co-ordinate / Execute new product offloads plan requirements
• Interface with customers on product offloads and provide assessment • Provide interim and long-term corrective actions for any discrepancies
and information on test capabilities including resolutions to barriers / • Assist the Process Engineer in liaising with customers & potential customers
constraints on development and improvement of process, material and equipment
• Perform required test correlation, evaluation and characterization capabilities
on new product offloads, and communicate these results or test • In-charge of photo resist coat, exposure, developing and curing processes
correlation issues and resolutions to customers • Perform basic investigations on day-to-day inline excursions and close IRR
WALK-IN INTERVIEW • Generate test set-up specification based on customer test
requirements for production to support the product
within 12 hours
• Able to set up / optimize production recipes for current production devices
and create new recipes for NPI from potential customers
• Evaluate and recommend process changes to improve yield, quality
• Assist in process characterization and cost reduction / cycle time projects
27 March 2010 (Saturday) and cycle time
• Provide required test support needs of Resident Engineers • Work closely with mask designer to continuously update wafer process
design rules so as to improve process capability and productivity
9am – 11.30am & 1.30pm – 4pm • Sustain test programs, hardware and major set-up issues in mass
production • Diploma in Material Sciences, Chemistry or equivalent
• Minimum 2 years’ relevant experience in wafer bumping or wafer fabrication
• Degree in Engineering or equivalent with 5 years’ experience
• 2 – 3 years’ semiconductor-related or subcontracting industry • Positive working attitude with good analytical and logical reasoning skills
The Grassroots’ Club, Dance Studio @ Level 2 working experience in an ATE test environment with good tester and • Able to perform 12 hours rotating shift
test programming knowledge of Teradyne (IMAGE / IG-XL base) and
190 Ang Mo Kio Ave 8, S(568046) Verigy 93K
(Near Yio Chu Kang MRT Station)
• Experience in handling Mixed Signal / RF Devices FINANCE
• Able to develop and modify test programs
Please bring along your resume, original and photocopies of educational certificates, NRIC/Passport, employment testimonials, Senior Accountant (GA) - Ref: 0601
Equipment Engineers - LS (Verigy-93k / LTX-Fusion • Perform General Ledger accounting, co-ordinate and prepare monthly and
latest payslip and a passport-sized photograph for the interview. CX / MX) - Ref: 0402 quarterly financial reports for audit purposes
• Diagnose tester problems and perform repair works including • Review monthly financial reports and balance sheet accounts
For those who are unable to attend the walk-in interview, you may also send your detailed resume by 10 April 2010 to replacing defective modules • Co-ordinate and prepare tax schedules for tax computation and liaise with
Tax Consultant on taxation matters
hr.sg@statschippac.com • Analyze and resolve tester-related device failures (e.g. low yield and
marginality issues) • Handle cash management and banking matters
• Perform periodic preventive maintenance and calibration • Perform reconciliation of accounts receivable accounts and follow up to
• Perform system reconfiguration, hardware and software upgrading, resolve AR issues
ASSEMBLY EMBEDDED WLB system installation • Supervise fixed asset and accounts Payable functions
• Degree in Accountancy or equivalent
• Provide engineering support in device offload, correlation and
Staff / Senior Process Engineer (Electro Plating / Manufacturing Manager - Ref: 0301 migration projects
• Provide 1st level application support to debug pass-checker-fail-device
• Minimum 5 years’ relevant experience
• Conversant with Excel and Powerpoint
Strip Etching Process) - Ref: 0101 • Direct subordinates in the day-to-day operations to meet production or problems • Knowledge of SAP is preferred
• Principal focus of co-developing Strip Etching technology from R&D / NPI to manufacturing objectives • Work with respective suppliers to improve system MTBF and cost of • Good communication skills
Operations • Co-ordinate daily operational tasks for a production unit or maintenance • Committed and able to work in a fast-paced environment
• Actively drive process development, inclusive of process / product characterization, manufacturing support units to achieve daily objectives • Perform system administration (O / S, System Level S / W, License, • Experience in leading a team of Accountants / Accounts Executives
qualification and production pilot runs and volume ramp • Degree with minimum 2 years’ working experience in a managerial
position TUTS, OEE, Invantest)
• Manage Plating and Strip Etching Assembly processes to ensure process robustness,
• Good knowledge of headcount planning and leadership skills • Degree in Engineering or equivalent with 2 years’ experience Accounts Executive (Manufacturing Costing) - Ref: 0602
excursion free, manufacturability, cost effectiveness and consistent yields • Proficient in Verigy-93k / LTX-Fusion CX / MX • Support monthly closing for inventory accounting
• Yield analysis and lead troubleshooting of defects and yield issues and process • Able to work in a fast-paced environment
• Monitor & prepare weekly PPV/material cost tracker and highlight variances
excursions associated with new process/tools Associate Equipment Engineer - LS (Teradyne-
• Degree with minimum 5 years’ experience in Electro Plating and Strip Etching Equipment Engineers (Litho / Thin Film / Wet Etch / •

Conduct weekly cycle count audits & assist in annual inventory count
Monitor stock obsolescence provision and check provisions for proposed
process and equipment background Cu Plating / Mold / Backgrind) - Ref: 0302 Flex, Catalyst, Tiger / HP / Verigy-PS800) - Ref: 0403
material scraps
• Identify problems and areas for yield and quality improvements • Update monthly costing reports & schedules
• Perform machine set-up and conversion to support production
Associate Equipment Engineer - LS (Wirebond) - Ref: 0102 • Provide guidance to Associate Equipment Engineers in solving difficult
as well as develop methods to improve productivity and reduce
manufacturing costs.
• Assist in management reporting as assigned by the Finance Manager
• Perform machine set-up and conversion to support production problems through assessment of various techniques and approaches to • Diploma in Finance with minimum 3 years’ experience in a related field
• Determine methods and procedures, and provide guidance if • Experience in SAP costing system is an added advantage
• Support Equipment Engineers in solving daily equipment issues in production line develop appropriate, creative and practical solutions for Wafer Process necessary
• Diploma with minimum 2 years’ experience in KNS and ASM wirebonders operations • Able to work in a fast-paced environment
• Maintain and repair testers, handlers, probers, Tape-n-Reel, RVSI
• Able to perform 12 hours rotating shift • Degree with minimum 2 years’ working experience in Semi-Tool, Sankyo scanners and laser vision inspection
Wet Bench, EOL Compression molding, back grinding, singulation • Perform set-up and conversion to support production Billings Executive - Ref: 0603
processes, photo resist coat, exposure, develop and curing processes • Diploma in Engineering or equivalent with 2 years’ experience • Process billings and resolve billing issues with customers and cross-functional
CENTRAL ENGINEERING • Able to perform 12 hours rotating shift • Proficient in Tiger, Catalyst, HP93k and Verigy groups
• Work with various internal groups to implement billing process changes
Associate Equipment Engineer (Backgrind / Wafer Saw / Process Engineers (NPI / Yield Enhancement / Litho) Manufacturing Supervisors (Test) - Ref: 0404 • Perform reconciliation of billings with customer billing reports
- Ref: 0303 • Provide administrative support on billing matters
Die Attach) - Ref: 0201 • Supervise and provide directions in production or manufacturing • Minimum Diploma in Business Administration, Supply Chain or Logistics
• Maintain and repair Wafer Saw and Die Attach machines • Responsible for new product process flow, design review and mask / support to achieve daily operation targets Management
• Perform set-up and conversion for Backgrind, Wafer Saw and Die Attach recticle database maintenance • Provide training and guidance to immediate staff • Minimum 3 years’ working experience in a high manufacturing environment
• Develop creative and innovative solutions to problems • Order release, track and manage Customer Engineering build requests • Develop solutions to complex problems encountered in the production • Relevant experience in contract manufacturing environment is preferred
• Determine methods and procedures, and provide guidance if necessary • Sustain and provide continuous process improvement through planning, line • Experience in business process improvement and supply chain planning is an
• Identify problems and areas for yield and quality improvements as well as develop evaluating, verifying and executing procedures to ensure that products • Diploma holders. Fresh graduates / Entry level applicants are added advantage
methods to improve productivity and reduce manufacturing costs meet all quantity, yield and cycle time requirements encouraged to apply • Good interpersonal and communication skills, both written and oral
• Degree with minimum 2 years’ relevant experience in wafer bumping or • Good interpersonal skills to handle conflicts • Good analytical and problem-solving skills
wafer fabrication • Able to perform 12 hours rotating shift
Associate Equipment Engineer (TnR-iSort 8000 / Muehlbauer- • Excellent knowledge of statistical tools (SAS JMP) and FMEA
• Knowledge of SAP is preferred
DS 10k / MIT-Caerus-300) - Ref: 0202
• Maintain and repair Tape-n-Reel equipment such as Sort 8000 / Muehlbauer-DS Associate Equipment Engineers (Thin Film / Litho / WAFER PROCESS LOGISTICS
10k / MIT-Caerus-300 machines Wet Etch / Backend / Reconstitution / Cu Plating) - Ref: 0304
• Perform set-up and conversion for iSort 8000 / Muehlbauer-DS 10k / MIT-Caerus-
300 machines • Perform machine set-up and conversion to support production Staff Process Engineer (Backend) - Ref: 0501 Shipping Supervisor - Ref: 0701
• Develop creative and innovative solutions to problems • Support Equipment Engineers in solving daily equipment issues in • Lead a group of Process Engineers to sustain and continuously improve
production line • Manage overall shipping / warehousing / distribution operation
• Determine methods and procedures, and provide guidance if necessary quality, process capability, yield and productivity for wafer level solder • Support the Manager in managing a team of assigned staff to maintain a
• Identify problems and areas for yield and quality improvements as well as develop • Diploma with minimum 2 years’ working experience in Semi-Tool, deposition processes (paste printing and solder ball attach)
Sankyo Wet Bench, EOL compression molding, back grinding, high standard of service with ZERO quality / service failures
methods to improve productivity and reduce manufacturing costs • Maintain metrology tools (e.g. X-ray, shear tool, 3D microscope) • Supervise day-to-day order processing operations to meet organizational
singulation processes, photo resist coat, exposure, developing and • Degree in Material Sciences or Chemistry
curing processes, ball drop and wafer mount goals
Requirements for above two positions: • Minimum 5 years’ working experience in wafer level solder printing • Diploma or Advanced / Higher / Graduate Diploma in Business Studies /
• Diploma in Engineering or equivalent • Able to perform 12 hours rotating shift and solder ball attach process in the wafer bumping industry Administration / Management / Logistics or equivalent
• Minimum 3 years’ working experience in a related field • Good knowledge of flux, solder paste and solder reflow process • Minimum 3 years’ relevant working experience
• Able to work on rotating shifts (day and night) and support overtime Associate Process Engineers (Thin Film / Litho / Wet • Comprehend quality system, especially process control and product • Strong knowledge and relevant experience in logistics, warehousing and
Etch / Backend / Reconstitution / Cu Plating) - Ref: 0305 integrity distribution
Pre-Assembly Process Engineer / • Set up / optimize production recipes for current production devices and • Motivated, independent and a fast-learner
create new recipes for NPI from potential customers Process Engineer (Litho & Etch) - Ref: 0502 • Be prepared to work on weekends / public holidays / off working hours / shift
Associate Process Engineer - Ref: 0203 • Assist in process characterization and cost reduction / cycle time projects • Sustain and provide continuous process improvements through work when required
• Check internal documents vs. customer requests and specifications • Work closely with Engineer to continuously update wafer process planning, evaluating, verifying and executing procedures to ensure
• Work with internal Process Engineers to prepare documents design rules so as to improve process capability and productivity that products meet all quantity, yield and cycle time requirements
• Raise request for Product Definition System (PDS) device creation • Diploma with minimum 2 years’ relevant experience in wafer bumping • Provide interim and long-term corrective actions for any
or wafer fabrication discrepancies
• Assign Bill of Material (BOM), drawing of marking diagram and bond diagram
attachment • Liaise with customers & potential customers on development and Only Singaporeans / SPRs / Malaysians
• Inform and ask customer disposition for any document discrepancy encountered Senior Planner (IE & Costing experience) - Ref: 0306 improvement of process, material and equipment capabilities
with relevant semiconductor
• Schedule and release lots for production builds including lot trackers • Summarize monthly / weekly load and capacity plan based on latest • Degree in Electrical, Electronics, Mechanical, Materials Engineering,
• Degree (PE) & Diploma (Associate PE) Company forecast plan Physics or equivalent
• Minimum 3 years’ experience in assembly • Optimize resources utilization to meet manufacturing schedules • Minimum 2 years’ relevant experience in wafer bumping or wafer experience need apply.
• Able to provide support on weekend for urgent requests • Alleviate constraints and bottleneck, maintain optimum inventory level fabrication
• Able to take on additional task assigned by supervisor as and when need arises • Define and drive cycle time and delivery quotes • Knowledge of Photolithography and Wet Etch Local fresh graduates are welcome
• Able to support overtime when required by operations • Degree with minimum 3 years’ experience in industrial engineering and
costing to apply.

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