TEST OPERATIONS Associate Process Engineer (Litho) - Ref: 0503
• Sustain and provide continuous process improvements through executing
Test Product Engineer (Verigy & Teradyne) - Ref: 0401 procedures to ensure that products meet all quantity, yield and cycle time • Co-ordinate / Execute new product offloads plan requirements • Interface with customers on product offloads and provide assessment • Provide interim and long-term corrective actions for any discrepancies and information on test capabilities including resolutions to barriers / • Assist the Process Engineer in liaising with customers & potential customers constraints on development and improvement of process, material and equipment • Perform required test correlation, evaluation and characterization capabilities on new product offloads, and communicate these results or test • In-charge of photo resist coat, exposure, developing and curing processes correlation issues and resolutions to customers • Perform basic investigations on day-to-day inline excursions and close IRR WALK-IN INTERVIEW • Generate test set-up specification based on customer test requirements for production to support the product within 12 hours • Able to set up / optimize production recipes for current production devices and create new recipes for NPI from potential customers • Evaluate and recommend process changes to improve yield, quality • Assist in process characterization and cost reduction / cycle time projects 27 March 2010 (Saturday) and cycle time • Provide required test support needs of Resident Engineers • Work closely with mask designer to continuously update wafer process design rules so as to improve process capability and productivity 9am – 11.30am & 1.30pm – 4pm • Sustain test programs, hardware and major set-up issues in mass production • Diploma in Material Sciences, Chemistry or equivalent • Minimum 2 years’ relevant experience in wafer bumping or wafer fabrication • Degree in Engineering or equivalent with 5 years’ experience • 2 – 3 years’ semiconductor-related or subcontracting industry • Positive working attitude with good analytical and logical reasoning skills The Grassroots’ Club, Dance Studio @ Level 2 working experience in an ATE test environment with good tester and • Able to perform 12 hours rotating shift test programming knowledge of Teradyne (IMAGE / IG-XL base) and 190 Ang Mo Kio Ave 8, S(568046) Verigy 93K (Near Yio Chu Kang MRT Station) • Experience in handling Mixed Signal / RF Devices FINANCE • Able to develop and modify test programs Please bring along your resume, original and photocopies of educational certificates, NRIC/Passport, employment testimonials, Senior Accountant (GA) - Ref: 0601 Equipment Engineers - LS (Verigy-93k / LTX-Fusion • Perform General Ledger accounting, co-ordinate and prepare monthly and latest payslip and a passport-sized photograph for the interview. CX / MX) - Ref: 0402 quarterly financial reports for audit purposes • Diagnose tester problems and perform repair works including • Review monthly financial reports and balance sheet accounts For those who are unable to attend the walk-in interview, you may also send your detailed resume by 10 April 2010 to replacing defective modules • Co-ordinate and prepare tax schedules for tax computation and liaise with Tax Consultant on taxation matters hr.sg@statschippac.com • Analyze and resolve tester-related device failures (e.g. low yield and marginality issues) • Handle cash management and banking matters • Perform periodic preventive maintenance and calibration • Perform reconciliation of accounts receivable accounts and follow up to • Perform system reconfiguration, hardware and software upgrading, resolve AR issues ASSEMBLY EMBEDDED WLB system installation • Supervise fixed asset and accounts Payable functions • Degree in Accountancy or equivalent • Provide engineering support in device offload, correlation and Staff / Senior Process Engineer (Electro Plating / Manufacturing Manager - Ref: 0301 migration projects • Provide 1st level application support to debug pass-checker-fail-device • Minimum 5 years’ relevant experience • Conversant with Excel and Powerpoint Strip Etching Process) - Ref: 0101 • Direct subordinates in the day-to-day operations to meet production or problems • Knowledge of SAP is preferred • Principal focus of co-developing Strip Etching technology from R&D / NPI to manufacturing objectives • Work with respective suppliers to improve system MTBF and cost of • Good communication skills Operations • Co-ordinate daily operational tasks for a production unit or maintenance • Committed and able to work in a fast-paced environment • Actively drive process development, inclusive of process / product characterization, manufacturing support units to achieve daily objectives • Perform system administration (O / S, System Level S / W, License, • Experience in leading a team of Accountants / Accounts Executives qualification and production pilot runs and volume ramp • Degree with minimum 2 years’ working experience in a managerial position TUTS, OEE, Invantest) • Manage Plating and Strip Etching Assembly processes to ensure process robustness, • Good knowledge of headcount planning and leadership skills • Degree in Engineering or equivalent with 2 years’ experience Accounts Executive (Manufacturing Costing) - Ref: 0602 excursion free, manufacturability, cost effectiveness and consistent yields • Proficient in Verigy-93k / LTX-Fusion CX / MX • Support monthly closing for inventory accounting • Yield analysis and lead troubleshooting of defects and yield issues and process • Able to work in a fast-paced environment • Monitor & prepare weekly PPV/material cost tracker and highlight variances excursions associated with new process/tools Associate Equipment Engineer - LS (Teradyne- • Degree with minimum 5 years’ experience in Electro Plating and Strip Etching Equipment Engineers (Litho / Thin Film / Wet Etch / • • Conduct weekly cycle count audits & assist in annual inventory count Monitor stock obsolescence provision and check provisions for proposed process and equipment background Cu Plating / Mold / Backgrind) - Ref: 0302 Flex, Catalyst, Tiger / HP / Verigy-PS800) - Ref: 0403 material scraps • Identify problems and areas for yield and quality improvements • Update monthly costing reports & schedules • Perform machine set-up and conversion to support production Associate Equipment Engineer - LS (Wirebond) - Ref: 0102 • Provide guidance to Associate Equipment Engineers in solving difficult as well as develop methods to improve productivity and reduce manufacturing costs. • Assist in management reporting as assigned by the Finance Manager • Perform machine set-up and conversion to support production problems through assessment of various techniques and approaches to • Diploma in Finance with minimum 3 years’ experience in a related field • Determine methods and procedures, and provide guidance if • Experience in SAP costing system is an added advantage • Support Equipment Engineers in solving daily equipment issues in production line develop appropriate, creative and practical solutions for Wafer Process necessary • Diploma with minimum 2 years’ experience in KNS and ASM wirebonders operations • Able to work in a fast-paced environment • Maintain and repair testers, handlers, probers, Tape-n-Reel, RVSI • Able to perform 12 hours rotating shift • Degree with minimum 2 years’ working experience in Semi-Tool, Sankyo scanners and laser vision inspection Wet Bench, EOL Compression molding, back grinding, singulation • Perform set-up and conversion to support production Billings Executive - Ref: 0603 processes, photo resist coat, exposure, develop and curing processes • Diploma in Engineering or equivalent with 2 years’ experience • Process billings and resolve billing issues with customers and cross-functional CENTRAL ENGINEERING • Able to perform 12 hours rotating shift • Proficient in Tiger, Catalyst, HP93k and Verigy groups • Work with various internal groups to implement billing process changes Associate Equipment Engineer (Backgrind / Wafer Saw / Process Engineers (NPI / Yield Enhancement / Litho) Manufacturing Supervisors (Test) - Ref: 0404 • Perform reconciliation of billings with customer billing reports - Ref: 0303 • Provide administrative support on billing matters Die Attach) - Ref: 0201 • Supervise and provide directions in production or manufacturing • Minimum Diploma in Business Administration, Supply Chain or Logistics • Maintain and repair Wafer Saw and Die Attach machines • Responsible for new product process flow, design review and mask / support to achieve daily operation targets Management • Perform set-up and conversion for Backgrind, Wafer Saw and Die Attach recticle database maintenance • Provide training and guidance to immediate staff • Minimum 3 years’ working experience in a high manufacturing environment • Develop creative and innovative solutions to problems • Order release, track and manage Customer Engineering build requests • Develop solutions to complex problems encountered in the production • Relevant experience in contract manufacturing environment is preferred • Determine methods and procedures, and provide guidance if necessary • Sustain and provide continuous process improvement through planning, line • Experience in business process improvement and supply chain planning is an • Identify problems and areas for yield and quality improvements as well as develop evaluating, verifying and executing procedures to ensure that products • Diploma holders. Fresh graduates / Entry level applicants are added advantage methods to improve productivity and reduce manufacturing costs meet all quantity, yield and cycle time requirements encouraged to apply • Good interpersonal and communication skills, both written and oral • Degree with minimum 2 years’ relevant experience in wafer bumping or • Good interpersonal skills to handle conflicts • Good analytical and problem-solving skills wafer fabrication • Able to perform 12 hours rotating shift Associate Equipment Engineer (TnR-iSort 8000 / Muehlbauer- • Excellent knowledge of statistical tools (SAS JMP) and FMEA • Knowledge of SAP is preferred DS 10k / MIT-Caerus-300) - Ref: 0202 • Maintain and repair Tape-n-Reel equipment such as Sort 8000 / Muehlbauer-DS Associate Equipment Engineers (Thin Film / Litho / WAFER PROCESS LOGISTICS 10k / MIT-Caerus-300 machines Wet Etch / Backend / Reconstitution / Cu Plating) - Ref: 0304 • Perform set-up and conversion for iSort 8000 / Muehlbauer-DS 10k / MIT-Caerus- 300 machines • Perform machine set-up and conversion to support production Staff Process Engineer (Backend) - Ref: 0501 Shipping Supervisor - Ref: 0701 • Develop creative and innovative solutions to problems • Support Equipment Engineers in solving daily equipment issues in • Lead a group of Process Engineers to sustain and continuously improve production line • Manage overall shipping / warehousing / distribution operation • Determine methods and procedures, and provide guidance if necessary quality, process capability, yield and productivity for wafer level solder • Support the Manager in managing a team of assigned staff to maintain a • Identify problems and areas for yield and quality improvements as well as develop • Diploma with minimum 2 years’ working experience in Semi-Tool, deposition processes (paste printing and solder ball attach) Sankyo Wet Bench, EOL compression molding, back grinding, high standard of service with ZERO quality / service failures methods to improve productivity and reduce manufacturing costs • Maintain metrology tools (e.g. X-ray, shear tool, 3D microscope) • Supervise day-to-day order processing operations to meet organizational singulation processes, photo resist coat, exposure, developing and • Degree in Material Sciences or Chemistry curing processes, ball drop and wafer mount goals Requirements for above two positions: • Minimum 5 years’ working experience in wafer level solder printing • Diploma or Advanced / Higher / Graduate Diploma in Business Studies / • Diploma in Engineering or equivalent • Able to perform 12 hours rotating shift and solder ball attach process in the wafer bumping industry Administration / Management / Logistics or equivalent • Minimum 3 years’ working experience in a related field • Good knowledge of flux, solder paste and solder reflow process • Minimum 3 years’ relevant working experience • Able to work on rotating shifts (day and night) and support overtime Associate Process Engineers (Thin Film / Litho / Wet • Comprehend quality system, especially process control and product • Strong knowledge and relevant experience in logistics, warehousing and Etch / Backend / Reconstitution / Cu Plating) - Ref: 0305 integrity distribution Pre-Assembly Process Engineer / • Set up / optimize production recipes for current production devices and • Motivated, independent and a fast-learner create new recipes for NPI from potential customers Process Engineer (Litho & Etch) - Ref: 0502 • Be prepared to work on weekends / public holidays / off working hours / shift Associate Process Engineer - Ref: 0203 • Assist in process characterization and cost reduction / cycle time projects • Sustain and provide continuous process improvements through work when required • Check internal documents vs. customer requests and specifications • Work closely with Engineer to continuously update wafer process planning, evaluating, verifying and executing procedures to ensure • Work with internal Process Engineers to prepare documents design rules so as to improve process capability and productivity that products meet all quantity, yield and cycle time requirements • Raise request for Product Definition System (PDS) device creation • Diploma with minimum 2 years’ relevant experience in wafer bumping • Provide interim and long-term corrective actions for any or wafer fabrication discrepancies • Assign Bill of Material (BOM), drawing of marking diagram and bond diagram attachment • Liaise with customers & potential customers on development and Only Singaporeans / SPRs / Malaysians • Inform and ask customer disposition for any document discrepancy encountered Senior Planner (IE & Costing experience) - Ref: 0306 improvement of process, material and equipment capabilities with relevant semiconductor • Schedule and release lots for production builds including lot trackers • Summarize monthly / weekly load and capacity plan based on latest • Degree in Electrical, Electronics, Mechanical, Materials Engineering, • Degree (PE) & Diploma (Associate PE) Company forecast plan Physics or equivalent • Minimum 3 years’ experience in assembly • Optimize resources utilization to meet manufacturing schedules • Minimum 2 years’ relevant experience in wafer bumping or wafer experience need apply. • Able to provide support on weekend for urgent requests • Alleviate constraints and bottleneck, maintain optimum inventory level fabrication • Able to take on additional task assigned by supervisor as and when need arises • Define and drive cycle time and delivery quotes • Knowledge of Photolithography and Wet Etch Local fresh graduates are welcome • Able to support overtime when required by operations • Degree with minimum 3 years’ experience in industrial engineering and costing to apply.