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I. INTRODUCTION
This paper presents the design of a 25-31 GHz positive
slope gain low noise amplifier (LNA) with proposed noise
figure reduction technique. The proposed noise figure
reduction technique reduces the noise figure of the designed
LNA from 3.17 dB to 2.88 dB at 28 GHz. The desired
specifications were determined by considering the potential
requirements of a 5G mobile device. So, the power
consumption should be as small as possible while still
providing the competitor noise and gain performance.
Therefore, the designed LNA circuit should meet the following
specifications: less than 10 mW power consumption, more than
15 dB gain at the center frequency 28 GHz, less than 3 dB
noise figure, better than 10 dB matching bandwidth from 25
GHz to 31 GHz at both of input and output.
This paper is organized as follows. Section II is mainly
focused on the topology selection, technology information,
basic formulations, hand calculations, first and second stages
designs, layout and optimizations. Section III presents the
simulation results and comparison to other similar studies.
Finally, Section IV is conclusion.
II. DESIGN METHODOLOGY
A. Topology
There are two solutions to obtain positive slope gain. First
solution includes a high-pass filter which can be used at the
inter-stages or output of the LNA. If the high-pass filter is used
at the output of the LNA, there will be a limitation to realize
wideband impedance matching at the output. Because, the most
of the high-pass lumped element filter topologies only provide
narrow-band impedance matching. However, there are also
high-pass lumped element filters which can provide wideband
impedance matching. In the two stage LNA topologies, the
(2)
(3)
(4)
TABLE I
CALCULATED AND OPTIMIZED VALUES OF LNA SCHEMATIC
Calculated
Optimized
115 pH
135 pH
80 pH
60 pH
245 pH
260 pH
31 fF
34 fF
145 pH
135 pH
55 pH
55 pH
250
250
340 pH
300 pH
80 fF
70 fF
43 fF
27 fF
750 pH
750 pH
G. Post-Layout
After the layout of the cascode structures generated, the
simulations were run with their extracted models. The values of
the inductors and capacitors were again optimized to
compensate the effects of the parasitic elements caused by the
layout. DC, Ground and RF pads and GDSII files of the
inductors exported from Sonnet were putted to the layout. The
post-layout of the designed circuit is seen in Fig. 2. Small
capacitor values are custom designed by using metal2 and
metal3. Layout includes 10 inductors and the total chip area is
0.680 m x 0.600 m = 0.480 m2, including pads.
]
(
[
[
[
]
]
]
(6)
NF (dB)
I-P1dB (dBm)
24
30
26
30
28
2.7
2.9
6.4
2.0
2.88
-15
-28
-11
-12.7
14.3
23.5
10.3
11.4
17.4
11
7.9
98
9.04
65 nm
CMOS
120
nm
SiGe
0.25
um
SiGe
0.25 um
SiGe
0.25 um
-3.25
-6.23
-3.60
+8.46
Pdiss (mW)
Technology
FOM [dBm]
SiGe
IV. CONCLUSION
Fig. 7. S12 of the Schematic and Post-layout Circuits
[1]
[2]
[3]
[4]
[5]
[6]
[7]