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jorge.rosero@epn.edu.ec
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MSc. Jorge Luis Rosero B. ( )
22/08/2013
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Thyristor
10MW
GTO/IGCT
10MW
1MW
IGBT
100kW
10kW
MOSFET
1kW
100W
10Hz
MSc. Jorge Luis Rosero B. ( )
1kHz
100kHz 1MHz
10MHz
22/08/2013
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Tiristor
GTO
5kV
4kV
IGBT
3kV
BJT
1kHz
10kHz
2kV
1kV
100kHz
MOSFET
1MHz
1kA
2kA
3kA
4kA
5kA
6kA
f
MSc. Jorge Luis Rosero B. ( )
22/08/2013
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SIT
SITH
MCT
1.2 kV
1.5 kV
3 kV
19
1988
des
mo
som
in
sm
sin
Power (kW)
300 A
300 A
2 kV
105
SCR
GTO
MCT
104
SITH
103
BJT
As frequency increases,
power decreases
Re
IGBT
102
1.
101
100
100
MOSFET
101
102
103
104
105
106
2.
107
108
Frequency (Hz)
6.31
Power Gate
vs frequency
for different power 22/08/2013
devices.
IGBT (Insulated
Bipolar Transistor)
3.
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100k
upply,
Fr High
eq
u
(F en
De ast cy
vic
es
)
100kW
1kW
10k
Sw 100
Fr itch
eq in
u g
in enc
Hz y
Figure 1.5
High
Current
(Parallel
Devices)
High
Power
100k
10k
1k
1k
source,
erence
tching.
1GW
In Amps
10MW
High
Voltage
(Series
Devices)
Medium
Power
10
20
200
2k
20k
100
10
Current
gnals
ithin
rol lines
ating
. These
is
0
200k
Voltage
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t
d
r
t
c
g
c
t
1
Emitter
Gate
n+
RChannel
RJFET
Rn-
n-
B
n+
p+
t
r
Collector
Conventional
Planar
Gate
IGBT Cell
IGBT (Insulated
Gate Bipolar
Transistor)
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(b)
Figure 1.20
22/08/2013
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ored charge from the N -drift region to improve the switching time. The only way the
ored charge can be removed is by recombination within the IGBT. Traditional lifetime
Conmutaci
Tpica
de un
IGBT
(2) charges at turn-off are
lling
techniques or o
ann N+
buffer layer
to collect
the minority
mmonly used to speed-up recombination time.
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VGG+
90% VGG+
10% VGG+
0
VCC , IO
Gate-emitter voltage
VCC
IO
VCC
90% IO
90% IO
10% IO
10% VCC
Collector-emitter voltage
10% IO
Collector current
td(on) tr
td(off)
tf
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the total g
Substituti
the avera
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Aplicaciones de un IGBT
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