Académique Documents
Professionnel Documents
Culture Documents
Theory
Any multilayer configuration involvs striplines and sources that definitely are exciting the parallel plate mode.
Electrical posts usually suppress this mode. Beyond the fabrication complexity involved, these posts create
imperfect waveguides, and imperfect cavities (around slots) which might considerably affect the predictability of
the circuit performances. One way to avoid the posts would be by using asymmetric striplines (the two substrates
are of different dielectric constants). This solution is acceptable as long as coupling to both sides of the stripline
is not necessary. However, in multilayer configurations the coupling to both sides is needed, and the side
adjacent to the lower dielectric substrate will have a lower coupling level.
The new solution proposed involves the use of an asymmetric stripline only in the vicinity of the microstrip-tostripline coupling slot. A small area surrounding the slot (a small plug) is designed to have a higher dielectric
constant than the rest of the circuit., The discontinuity between the area surrounding the slot and the rest of the
circuit excites the TEM parallel plate mode, but at a much lower level.
A non-homogeneous asymmetric coupler
The non-homogeneous two-port coupler shown in Figure 1 was built and tested. This multilayer configuration
consists of two microstrip-to-stripline transitionsconnected back-to-back through a homogeneous striplie. This
is a two-port circuit, with all other transmission line ends terminated in stubs. All lines are 50 R and the
substrates are 31 mils Polyflon Cuflon (E, 4 . 1 ) . The coupling slots are 2.4 cm by 0.1 cm. The microstrip as
well as the stripline stubs are 1.5 cm long. The plug insert is 3 cm in diameter and 25 mils in height. The
remaining gap between the plug and the ground-plane (6 mils) is filled with bonding film ( E ~=2.5). Figure 2
shows the measured insertion loss and return loss of the coupler
,
These losses include: dielectric losses, conductive losses, q r f a q ,wave losses (for microstrip) the slots radiation
and the power lost to the parasitic parallel plate mode (for stripline). The first three type of losses can be easily
computed and subtracted fiom the total loses (z 0.3 dB). These losses are inherent and depend only on the type
of the material used and should be excluded in the evaluation of the coupler performances. Overall, two
0-7803-6473-2/00610.00 02000 E E E
frequency bandwidths (which show a very low level of losses) are of interest: 2.18- 2.45 GHz and 3.5- 3.8 GHz.
The first one exhibit very low losses and the matching of the two ports is expected to produce an insertion loss,
better than 0.5 dB. In the second band, the coupler is very well matched already (S2+15 dB) and considering
the dielectricand ohmic losses, the insertion loss is at an acceptable level.
The 4x4 array
Firally a 4x4 elements microstrip array was built. All patches are 2.3 cm by 2.3 cm and are printed on a 31 mil
Polyflon W o n (er=2.1). Each patch is fed by a slot in the common ground-plane 1 cm long and 0.1 cm wide.
The feeding network is striplime made of two 31 mil layers of Polyflon Cuflon. The slot areas are replaced by
high dielectric plugs (Rogers 6010,&,=2.1). The diameter of the plug is 2 cm. Since the commercial available
6010 is 25 mils thick (or thicker than 31 mils) the 6 mils gap was filled with Teflon bonding film. The stripliinefeeding network is fed through a slot by 50 $2microstrip lime printed on a 31 mil Polyflon Cuilon. The stacked
layouts of the antenna are shown in Figure 3. The radiation patterns of this array are shown in Figure 4. A
crosspoldzation level of more than 30 dB is noticed in the H-plane and about 26 dl3 in E-plane. Another 4x4
microstrip array fed by a corporate microstrip feedimg network was also built to evaluate the efficiency of the
multilayer array. At resonance, the gain of the multilayer array is smaller by about 1 dB.
Conclusions and Future Work
Using the high-dielectric plugs instead of via-holes eliminates the need for ohmic contact, which sometimes is
difficult to insure in the vias. This technologic process requires one less plating round which considerably
reduces the price of the product. All the layers are simultaneously processed and bonded together in the same
way, striplines circuit are.
A 4x4 microstrip array fed by a feeding network which makes use of this new technology was built and tested.
The implementation of this technique at 66 GHz is being considered.
/--
Input
Slot
- High-dielectric Plug
Microstrip line
Frequency [GHz]
124
-10
P,
4n
-20
--
30
-90
-60
-30
'30
Angle[
60
01
125