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REG1117

REG1117A
SBVS001D OCTOBER 1992 REVISED JULY 2004

800mA and 1A Low Dropout Positive Regulator


1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable
FEATURES
D FIXED AND ADJUSTABLE VERSIONS
D 2.85V MODEL FOR SCSI-2 ACTIVE
D
D
D
D
D
D

TERMINATION
OUTPUT CURRENT:
REG1117: 800mA max
REG1117A: 1A max
OUTPUT TOLERANCE: +1% max
DROPOUT VOLTAGE:
REG1117: 1.2V max at IO = 800mA
REG1117A: 1.3V max at IO = 1A
INTERNAL CURRENT LIMIT
THERMAL OVERLOAD PROTECTION
SOT-223 AND DDPAK SURFACE-MOUNT
PACKAGES

DESCRIPTION
The REG1117 is a family of easy-to-use three-terminal
voltage regulators. The family includes a variety of fixedand adjustable-voltage versions, two currents (800mA and
1A) and two package types (SOT-223 and DDPAK). See
the chart below for available options.
Output voltage of the adjustable versions is set with two
external resistors. The REG1117 low dropout voltage
allows its use with as little as 1V input-output voltage
differential.
Laser trimming assures excellent output voltage accuracy
without adjustment. An NPN output stage allows output
stage drive to contribute to the load current for maximum
efficiency.
800mA
VOLTAGE

APPLICATIONS
D
D
D
D
D
D

SOT-223

1A

DDPAK

1.8V
2.5V

SCSI-2 ACTIVE TERMINATION


HAND-HELD DATA COLLECTION DEVICES
HIGH EFFICIENCY LINEAR REGULATORS
BATTERY-POWERED INSTRUMENTATION
BATTERY MANAGEMENT CIRCUITS FOR
NOTEBOOK AND PALMTOP PCs
CORE VOLTAGE SUPPLY: FPGA, PLD, DSP,
CPU

2.85V

3.3V

5V

Adjustable

SOT-223

DDPAK

n
n
n

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright 19922004, Texas Instruments Incorporated

 

           
                  
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SBVS001D OCTOBER 1992 REVISED JULY 2004

ABSOLUTE MAXIMUM RATINGS(1)


Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V
Operating Junction Temperature Range . . . . . . . . 40C to +125C
Storage Temperature Range . . . . . . . . . . . . . . . . . 65C to +150C
Lead Temperature (soldering, 10s)(2) . . . . . . . . . . . . . . . . . +300C
(1) Stresses above these ratings may cause permanent damage.
(2) See Soldering Methods section.

This integrated circuit can be damaged by ESD. Texas


Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.

CONNECTION DIAGRAM
Front View

Plastic SOT223

Plastic DDPAK
Tab is
VOUT

Tab is VOUT

Ground VOUT
(Adj.)(1)

VIN

Ground VOUT
(Adj.)(1)

NOTE: (1) AdjustableVoltage Model.

VIN

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SBVS001D OCTOBER 1992 REVISED JULY 2004

PACKAGE/ORDERING INFORMATION(1)
PRODUCT

VO/IO

PACKAGE-LEAD

PACKAGE
DESIGNATOR

OPERATING
TEMPERATURE
RANGE

PACKAGE
MARKING

REG1117-2.85

2.85/800mA

SOT223-3

DCY

40C to
+125C

BB11172

REG1117-3.3

3.3/800mA

SOT223-3

DCY

40C to
+125C

BB11174

KTT

40 C to
40C
+125C

REG1117F-3.3

3.3/800mA

DDPAK-3

REG1117-5

5V/800mA

SOT223-3

DCY

REG1117

Adj./800mA

SOT223-3

DCY

40C to
+125C

BB1117

REG1117A-1.8

1.8V/1A

SOT223-3

DCY

40C to
+125C

R111718

KTT

40 C to
40C
+125C

REG1117FA1.8

40C to
+125C

R111725

REG1117A-2.5

REG1117FA-2.5

REG1117FA-5

REG1117A

REG1117FA

1.8/1A

2.5/1A

2.5/1A

5/1A

Adj./1A

Adj./1A

DDPAK-3

SOT223-3

DDPAK-3

DDPAK-3

SOT223-3

DDPAK-3

DCY

KTT

KTT

40 C to
40C
+125C

40 C to
40C
+125C

DCY

40C to
+125C

KTT

40 C to
40C
+125C

BB11175

Rails, 80

REG1117-2.85

Tape and Reel,


2500

REG1117-3.3

Rails, 80

REG1117-3.3

Tape and Reel,


2500

REG1117F-3.3KTTT

Tape and Reel,


50

REG1117F-3.3/500

Tape and Reel,


500

REG1117-5

Rails, 80

REG1117-5

Tape and Reel,


2500

REG1117

Rails, 80

REG1117

Tape and Reel,


2500

REG1117A-1.8

Rails, 80

REG1117A-1.8

Tape and Reel,


2500

REG1117FA-1.8KTTT

Tape and Reel,


50

REG1117FA-1.8/500

Tape and Reel,


500

REG1117A-2.5

Rails, 80

REG1117A-2.5

Tape and Reel,


2500

REG1117FA-2.5KTTT

Tape and Reel,


50

REG1117FA-2.5/500

Tape and Reel,


500

REG1117FA-5/KTTT

Tape and Reel,


50

REG1117FA-5/500

Tape and Reel,


500

REG1117A

Rails, 80

REG1117A

Tape and Reel,


2500

REG1117FA/KTTT

Tape and Reel,


50

REG1117FA/500

Tape and Reel,


500

REG1117FA2.5

BB1117FA5.0

BB1117A

TRANSPORT
MEDIA,
QUANTITY

REG1117-2.85

BB1117F4

40C to
+125C

REG1117FA-1.8

ORDERING
NUMBER

REG1117FA

(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.

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SBVS001D OCTOBER 1992 REVISED JULY 2004

ELECTRICAL CHARACTERISTICS
At TJ = +25C, unless otherwise noted.
REG1117, REG1117A
PARAMETER

CONDITION

MIN

TYP

MAX

UNIT

REG1117-2.85

IO = 10mA, VIN = 4.85V

2.820

2.85

2.880

See Note 1

IO = 0 to 800mA, VIN = 4.05V to 10V

2.790

2.85

2.910

REG1117-3.3

IO = 10mA, VIN = 5.3V

3.270

3.30

3.330

See Note 1

IO = 0 to 800mA, VIN = 4.8V to 10V

3.240

3.30

3.360

IO = 10mA, VIN = 7V

4.950

5.00

5.050

See Note 1

IO = 0 to 800mA, VIN = 6.5V to 10V

4.900

5.00

5.100

REG1117A-1.8

IO = 10mA, VIN = 3.8V

1.782

1.8

1.818

OUTPUT VOLTAGE

REG1117-5

See Note 1

IO = 0 to 1A, VIN = 3.8V to 10V

1.764

1.8

1.836

REG1117A-2.5

IO = 10mA, VIN = 4.5V

2.475

2.5

2.525

See Note 1

IO = 0 to 1A, VIN = 4.5V to 10V

2.450

2.5

2.550

IO = 10mA, VIN = 7V

4.950

5.0

5.050

IO = 0 to 1A, VIN = 7V to 10V

4.900

5.0

5.100

IO = 10mA, VIN VO = 2V

1.238

1.250

1.262

IO = 10 to 800mA, VIN VO = 1.4 to 10V

1.225

1.250

1.280

IO = 10mA, VIN VO = 2V

1.238

1.250

1.262

IO = 10mA to 1A, VIN VO = 1.4 to 10V

1.225

1.250

1.280

IO = 0, VIN = 4.25 to 10V

mV

IO = 0, VIN = 4.8 to 10V

mV

IO = 0, VIN = 6.5 to 15V

10

mV

IO = 10mA, VIN VO = 1.5 to 13.75V

0.1

0.4

REG1117A-5
See Note 1
REFERENCE VOLTAGE
REG1117 (Adjustable)
See Note 1
REG1117A (Adjustable)
See Note 1
LINE REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)
REG1117 (Adjustable)(1)
REG1117A (Adjustable)(1)

IO = 10mA, VIN VO = 1.5 to 13.75V

0.1

0.4

REG1117A-1.8(1)
REG1117A-2.5(1)

IO = 0, VIN = 3.8V to 10V

mV

IO = 0, VIN = 4.5V to 10V

mV

REG1117A-5.0(1)

IO = 0, VIN = 7V to 15V

10

mV

IO = 0 to 800mA, VIN = 4.25V

10

mV

IO = 0 to 800mA, VIN = 4.8V

12

mV

LOAD REGULATION
REG1117-2.85(1)
REG1117-3.3(1)
REG1117-5(1)

IO = 0 to 800mA, VIN = 6.5V

15

mV

IO = 10 to 800mA, VIN VO = 3V

0.1

0.4

IO = 10mA to 1A, VIN VO = 3V

0.1

0.4

REG1117A-1.8(1)

IO = 0 to 1A, VIN = 3.8V

10

mV

REG1117A-2.5

IO = 0 to 1A, VIN = 4.5V

10

mV

REG1117A-5

IO = 0 to 1A, VIN = 7.0V

15

mV

IO = 100mA

1.00

1.10

IO = 500mA

1.05

1.15

IO = 800mA

1.10

1.20

IO = 1A

1.2

1.30

IO = 1A

1.2

1.55

REG1117 (Adjustable)(1)(2)
REG1117A (Adjustable)(1)(2)

DROPOUT VOLTAGE(3)
All Models(1)
See Note 1
REG1117 Models(1)
REG1117A
See Note 1

(1) Specification applies over the full specified junction temperature range, 0C to +125C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for 3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A),
VIN VO = 1.4V (reading taken 10ms after pulse).
4

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ELECTRICAL CHARACTERISTICS (continued)


At TJ = +25C, unless otherwise noted.
REG1117, REG1117A
PARAMETER

CONDITION

MIN

TYP

MAX

UNIT

REG1117 Models

VIN VO = 5V

800

950

1200

mA

REG1117A

VIN VO = 5V

1000

1250

1600

mA

1.7

mA

CURRENT LIMIT

MINIMUM LOAD CURRENT


Adjustable Models(1)(2)
QUIESCENT CURRENT
Fixed-Voltage Models(1)

VIN VO = 13.75V
VIN VO = 5V

10

mA

IO = 10mA, VIN VO = 1.4 to 10V

50

120

IO = 10mA to 800mA, VIN VO = 1.4 to 10V

0.5

IO = 10mA to 1A, VIN VO = 1.4 to 10V

0.5

30ms Pulse

0.01

0.1

%/W

f = 120Hz, VIN VOUT = 3V + 1VPP Ripple

62

dB

Fixed-Voltage Models

TJ = 0C to +125C

0.5

Adjustable Models

TJ = 0C to +125C

TA = 125C, 1000Hr

0.3

f = 10Hz to 10kHz

0.003

15

C/W

f > 50Hz

C/W

dc

C/W

65

C/W

ADJUSTABLE PIN CURRENT(1)(2)


vs Load Current, REG1117(1)
vs Load Current, REG1117A(1)
THERMAL REGULATION
All Models(4)
RIPPLE REJECTION
All Models
TEMPERATURE DRIFT

LONG-TERM STABILITY
All Models
OUTPUT NOISE
rms Noise, All Models
THERMAL RESISTANCE
Thermal Resistance, qJC

(Junction-to-Case at Tab)

3-Lead SOT-223 Surface-Mount


3-Lead DDPAK Surface-Mount
Thermal Resistance, qJA
3-Lead DDPAK Surface-Mount

(Junction-to-Case at Tab)
No Heatsink

(1) Specification applies over the full specified junction temperature range, 0C to +125C.
(2) REG1117 and REG1117A adjustable versions require a minimum load current for 3% regulation.
(3) Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage.
(4) Percentage change in unloaded output voltage before versus after a 30ms power pulse of IO = 800mA (REG1117 models), IO = 1A (REG1117A),
VIN VO = 1.4V (reading taken 10ms after pulse).

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SIMPLIFIED SCHEMATIC

VIN

Current
Limit

Thermal
Limit

VOUT

10X
(Substrate)

Ground (Fixedvoltage Models)


Adj. (Adjustablevoltage Model)

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TYPICAL CHARACTERISTICS
At TA = +25C, all models, unless otherwise noted.
LOAD REGULATION
( I LOAD = 800mA)

SHORTCIRCUIT CURRENT vs TEMPERATURE


1

1300
REG1117A

1200
1100

REG1117 Models

1000
900
800
50

25

Output Voltage Deviation (mV)

ShortCircuit Current (mA)

1400

25

50

75

REG11172.85

1
REG1117A1.8
2
3
4
5

REG11175

6
7
50

100

25

LINE REGULATION vs TEMPERATURE

VIN = 6.5V to 15V


REG11175

100

IOUT = 100mA
VRIPPLE = 1.0VPP

80
Ripple Rejection (dB)

Output Voltage Change (mV)

75

RIPPLE REJECTION vs FREQUENCY


90

3
2
1
REG1117A1.8
VIN = 3.8V to 10V

70
60
50
40
30
20

10
0
25

25

50

75

100

10

100

1k

Temperature (_C)

10k

100k

Frequency (Hz)

QUIESCENT CURRENT vs TEMPERATURE

OUTPUT VOLTAGE vs TEMPERATURE


8

2.0
IO = 10mA

7
FixedVoltage Models
Quiescent Current (mA)

Output Voltage Change (%)

50

100

2
50

25

Temperature (_C)

Temperature (_ C)

1.0

1.0

6
5
4
3
2
1

2.0
50

25

25

50

Temperature (_ C)

75

100

0
50

25

25

50

75

100

Temperature (_C)

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SBVS001D OCTOBER 1992 REVISED JULY 2004

TYPICAL CHARACTERISTICS (continued)


At TA = +25C, all models, unless otherwise noted.
LOAD TRANSIENT RESPONSE

LINE TRANSIENT RESPONSE


Output Voltage
Deviation (mV)

Output Voltage
Deviations (V)

60
0.1
0
0.1

CIN = 1F
COUT = 10F Tantalum
IOUT = 0.1A

40
20
0

0
0.5
0

20

40

60

80

100

Input Voltage (V)

Load Current (A)

20
CIN = 10F
COUT = 10F
Tantalum
VIN = 4.25V
Preload = 0.1A

0.5

40
5.25
4.25
3.25

20

40

60

Time (s)

Time (s)

Figure 2 shows a hookup diagram for the adjustable


voltage model. Resistor values are shown for some
commonly-used output voltages. Values for other voltages
can be calculated from the equation shown in Figure 2. For
best load regulation, connect R1 close to the output pin and
R2 close to the ground side of the load as shown.

APPLICATIONS INFORMATION
Figure 1 shows the basic hookup diagram for fixed-voltage
models. All models require an output capacitor for proper
operation, and for improving high-frequency load
regulation; a 10F tantalum capacitor is recommended.
Aluminum electrolytic types of 50F or greater can also be
used. A high-quality capacitor should be used to assure
that the ESR (Effective Series Resistance) is less than
0.5.

VIN

THERMAL CONSIDERATIONS
The REG1117 has current limit and thermal shutdown
circuits that protect it from overload. The thermal shutdown
activates at approximately TJ = 165C. For continuous
operation, however, the junction temperature should not
be allowed to exceed 125C. Any tendency to activate the
thermal shutdown in normal use is an indication of an
inadequate heat sink or excessive power dissipation. The
power dissipation is equal to:

VO

REG1117
+

10F
Tantalum

80 100 120 140 160 180 200

+ 10F
Tantalum

PD = (VIN VOUT) IOUT


The junction temperature can be calculated by:

TJ = TA + PD (qJA)
where TA is the ambient temperature, and qJA is the
junction-to-ambient thermal resistance.

Figure 1. Fixed-Voltage ModelBasic


Connections

VIN
C1 +
10F

REG1117
(Adj)
1
C3(1) +
10F

VO

R1

+ C2
10F
Load

R2

VO =

R1 + R2
R1

x (1.25V) + (50A) (R2)

This term is negligible with


proper choice of valuessee
table at right.

VOUT
(V )

R1
()(2)

R2
()(2)

1.25
1.5
2.1
2.85
3
3.3
5
10

Open
750
158
169
137
115
113
113

Short
147
107
215
191
187
340
787

NOTES: (1) C3 optional. Improves highfrequency line rejection. (2) Resistors are standard 1% values.

Figure 2. Adjustable-Voltage ModelBasic Connections


8

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SBVS001D OCTOBER 1992 REVISED JULY 2004

A simple experiment will determine whether the maximum


recommended junction temperature is exceeded in an
actual circuit board and mounting configuration: Increase
the ambient temperature above that expected in normal
operation until the devices thermal shutdown is activated.
If this occurs at more than 40C above the maximum
expected ambient temperature, then TJ will be less than
125C during normal operation.
The internal protection circuitry of the REG1117 was
designed to protect against overload conditions. It was not
intended to replace proper heat sinking. Continuously
running the REG1117 into thermal shutdown will degrade
reliability.

LAYOUT CONSIDERATIONS
The DDPAK (REG1117F-3.3 and REG1117FA) is a
surface-mount power package that has excellent thermal
characteristics. For best thermal performance, the
mounting tab should be soldered directly to a circuit board
copper area, as shown in Figure 3. Increasing the copper
area improves heat dissipation. Figure 4 shows typical
thermal resistance from junction-to-ambient as a function
of the copper area.

3Lead DDPAK(1)

0.2

0.085

0.45

0.51

All measurements
in inches.
0.155

0.05
0.10

NOTE: (1) For improved thermal performance increase


footprint area. See Figure 4 (Thermal Resistance vs
Circuit Board Copper Area).

Figure 3. DDPAK Footprint


THERMAL RESISTANCE vs
CIRCUIT BOARD COPPER AREA

Circuit Board Copper Area

Thermal Resistance, qJA (C/W)

60
REG1117F
DDPAK Surface Mount Package
1oz copper

50

40

30

20
REG1117F
DDPAK SurfaceMount Package

10
0

Copper Area (inches2)

Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area


9

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SBVS001D OCTOBER 1992 REVISED JULY 2004

The SOT-223 package derives heat sinking from


conduction through its copper leads, especially the large
mounting tab. These must be soldered to a circuit board
with a substantial amount of copper remaining, as shown
in Figure 5. Circuit board traces connecting the tab and the
leads should be made as large as practical. The mounting
tab of both packages is electrically connected to VOUT.

Total Area: 50 x 50mm

35 x 17 mm

16 x 10 mm

16 x 10 mm

Without backside copper: q


With solid backside copper: q

59_ C/W
JA 49_C/W

Table 1. SOT-223 qJA for Various Board


Configurations

TOTAL PC
BOARD
AREA

TOPSIDE(1)
COPPER
AREA

BACKSIDE
COPPER
AREA

SOT-223
THERMAL
RESISTANCE
JUNCTIONTO-AMBIENT

2500mm2

2500mm2

2500mm2

46C/W

2500mm2

1250mm2

2500mm2

47C/W

2500mm2

950mm2

2500mm2

49C/W

2500mm2

2500mm2

51C/W

2500mm2

1800mm2

53C/W

1600mm2

600mm2

1600mm2

55C/W

2500mm2

1250mm2

58C/W

2500mm2

915mm2

59C/W

1600mm2

600mm2

67C/W

900mm2

340mm2

900mm2

72C/W

900mm2

340mm2

85C/W

JA

(1) Tab is attached to the topside copper.

Figure 5. SOT-223 Circuit Board Layout Example

SOLDERING METHODS
Other nearby circuit traces, including those on the back
side of the circuit board, help conduct heat away from the
device, even though they may not be electrically
connected. Make all nearby copper traces as wide as
possible and leave only narrow gaps between traces.

Both REG1117 packages are suitable for infrared reflow


and vapor-phase reflow soldering techniques. The high
rate of temperature change that occurs with wave
soldering or hand soldering can damage the REG1117.

Table 1 shows approximate values of qJA for various circuit


board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting
conditions, and ventilation can dramatically affect the
actual qJA. Proper heat sinking significantly increases the
maximum power dissipation at a given ambient
temperature, as shown in Figure 6.

INSPEC Abstract Number: B91007604, C91012627.


Kelly, E.G. Thermal Characteristics of Surface 5WK9
Packages. The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive
Surface Mount Technology, April 36, 1990, Atlantic City,
NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,
IL, USA.

MAXIMUM POWER DISSIPATION


vs AMBIENT TEMPERATURE

Power Dissipation (Watts)

q JA = 27_ C/W
(4in2 one oz copper
mounting pad)

PD = (TJ (max) TA) / q JA


TJ (max) = 150_ C

qJA = 46_ C/W


(2500mm2 topside and
backside copper)

DDPAK
SOT223

3
qJA = 65_ C/W
(no heat sink)

qJA = 85_ C/W


(340mm2 topside copper,
no backside copper)

1
0
0

25

50

75

100

125

Ambient Temperature (_ C)

Figure 6. Maximum Power Dissipation versus Ambient Temperature


10

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SBVS001D OCTOBER 1992 REVISED JULY 2004
TERMPWR

5V

TERMPWR
110

2.85V

1N5817

110

2.85V

REG11172.85

10F

5V
1N5817

REG11172.85

10F

10F

(Up to 27 Lines)
110

10F

110

Figure 7. SCSI Active Termination Configuration

REG11175
In

VIN > 12V


10F

REG11175
Out

5V to 10V
+

GND

In

VIN > 9.0V

100F

10F

Out

7.5V
+

GND

100F

2.5VOUT
10F

1k

REF10042.5

Figure 8. Adjusting Output of Fixed Voltage Models

Figure 9. Regulator with Reference


REG11175

VIN

In
10F

5.2V Line
5.0V Battery

Out
GND

50

1k

REG11175
In
6.5V

10F

Out
GND

100F

Figure 10. Battery Backed-Up Regulated Supply

REG11175
In

VIN
10F

Out
GND

100F

Floating Input

VOUT = 5V

Figure 11. Low Dropout Negative Supply


11

PACKAGE OPTION ADDENDUM

www.ti.com

24-Apr-2015

PACKAGING INFORMATION
Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

REG1117

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117

REG1117-2.85

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11172

REG1117-2.85/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11172

REG1117-2.85G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11172

REG1117-3.3

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11174

REG1117-3.3/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11174

REG1117-3.3/2K5G4

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11174

REG1117-3.3G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11174

REG1117-5

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11175

REG1117-5/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11175

REG1117-5G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB11175

REG1117/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117

REG1117/2K5G4

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117

REG1117A

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117A

REG1117A-1.8

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111718

REG1117A-1.8/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111718

REG1117A-1.8G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111718

Addendum-Page 1

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

24-Apr-2015

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

REG1117A-2.5

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111725

REG1117A-2.5/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111725

REG1117A-2.5G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

R111725

REG1117A/2K5

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117A

REG1117A/2K5G4

ACTIVE

SOT-223

DCY

2500

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117A

REG1117AG4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117A

REG1117F-3.3

OBSOLETE

DDPAK/
TO-263

KTT

TBD

Call TI

Call TI

REG1117F-3.3/500

ACTIVE

DDPAK/
TO-263

KTT

500

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117F4

REG1117F-3.3KTTT

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117F4

REG1117F33KTTTG3

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117F4

REG1117FA

OBSOLETE

DDPAK/
TO-263

KTT

TBD

Call TI

Call TI

REG1117FA

REG1117FA-1.8

OBSOLETE

DDPAK/
TO-263

KTT

TBD

Call TI

Call TI

REG1117FA-1.8KTTT

ACTIVE

DDPAK/
TO-263

KTT

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117FA-2.5

OBSOLETE

DDPAK/
TO-263

KTT

TBD

Call TI

Call TI

REG1117FA-2.5/500

ACTIVE

DDPAK/
TO-263

KTT

500

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA2.5

REG1117FA-2.5KTTT

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA2.5

REG1117FA-5.0

OBSOLETE

DDPAK/
TO-263

KTT

TBD

Call TI

Call TI

REG1117FA-5.0/500

ACTIVE

DDPAK/
TO-263

KTT

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

50

500

Addendum-Page 2

REG
1117FA1.8

REG
1117FA5.0

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

24-Apr-2015

Orderable Device

Status
(1)

Package Type Package Pins Package


Drawing
Qty

Eco Plan

Lead/Ball Finish

MSL Peak Temp

(2)

(6)

(3)

Op Temp (C)

Device Marking
(4/5)

REG1117FA-5.0KTTT

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA5.0

REG1117FA-5.0KTTTG

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA5.0

REG1117FA/500

ACTIVE

DDPAK/
TO-263

KTT

500

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117FA

REG1117FA1.8KTTTG3

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA1.8

REG1117FA2.5KTTTG3

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG
1117FA2.5

REG1117FAKTTT

ACTIVE

DDPAK/
TO-263

KTT

50

Green (RoHS
& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

REG1117FA

REG1117G4

ACTIVE

SOT-223

DCY

80

Green (RoHS
& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

BB1117

(1)

The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 3

Samples

PACKAGE OPTION ADDENDUM

www.ti.com

24-Apr-2015

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 4

PACKAGE MATERIALS INFORMATION


www.ti.com

4-Jun-2014

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

REG1117-2.85/2K5

SOT-223

DCY

2500

330.0

12.4

REG1117-3.3/2K5

SOT-223

DCY

2500

330.0

REG1117-5/2K5

SOT-223

DCY

2500

330.0

REG1117/2K5

SOT-223

DCY

2500

REG1117A-1.8/2K5

SOT-223

DCY

REG1117A-2.5/2K5

SOT-223

DCY

REG1117A/2K5

SOT-223

DCY

REG1117F-3.3/500

DDPAK/
TO-263

REG1117F-3.3KTTT

7.1

7.45

1.88

8.0

12.0

Q3

12.4

7.1

7.45

1.88

8.0

12.0

Q3

12.4

7.1

7.45

1.88

8.0

12.0

Q3

330.0

12.4

7.1

7.45

1.88

8.0

12.0

Q3

2500

330.0

12.4

7.1

7.45

1.88

8.0

12.0

Q3

2500

330.0

12.4

7.1

7.45

1.88

8.0

12.0

Q3

2500

330.0

12.4

7.1

7.45

1.88

8.0

12.0

Q3

KTT

500

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

DDPAK/
TO-263

KTT

50

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FA-1.8KTTT

DDPAK/
TO-263

KTT

50

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FA-2.5/500

DDPAK/
TO-263

KTT

500

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FA-2.5KTTT

DDPAK/
TO-263

KTT

50

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FA-5.0/500

DDPAK/
TO-263

KTT

500

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FA-5.0KTTT

DDPAK/

KTT

50

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

Pack Materials-Page 1

W
Pin1
(mm) Quadrant

PACKAGE MATERIALS INFORMATION


www.ti.com

4-Jun-2014

Device

Package Package Pins


Type Drawing

SPQ

Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)

B0
(mm)

K0
(mm)

P1
(mm)

W
Pin1
(mm) Quadrant

TO-263
REG1117FA/500

DDPAK/
TO-263

KTT

500

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

REG1117FAKTTT

DDPAK/
TO-263

KTT

50

330.0

24.4

10.6

15.6

4.9

16.0

24.0

Q2

*All dimensions are nominal

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

REG1117-2.85/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117-3.3/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117-5/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117A-1.8/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117A-2.5/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117A/2K5

SOT-223

DCY

2500

358.0

335.0

35.0

REG1117F-3.3/500

DDPAK/TO-263

KTT

500

367.0

367.0

45.0

REG1117F-3.3KTTT

DDPAK/TO-263

KTT

50

367.0

367.0

45.0

REG1117FA-1.8KTTT

DDPAK/TO-263

KTT

50

367.0

367.0

45.0

REG1117FA-2.5/500

DDPAK/TO-263

KTT

500

367.0

367.0

45.0

REG1117FA-2.5KTTT

DDPAK/TO-263

KTT

50

367.0

367.0

45.0

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION


www.ti.com

4-Jun-2014

Device

Package Type

Package Drawing

Pins

SPQ

Length (mm)

Width (mm)

Height (mm)

REG1117FA-5.0/500

DDPAK/TO-263

KTT

500

367.0

367.0

45.0

REG1117FA-5.0KTTT

DDPAK/TO-263

KTT

50

367.0

367.0

45.0

REG1117FA/500

DDPAK/TO-263

KTT

500

367.0

367.0

45.0

REG1117FAKTTT

DDPAK/TO-263

KTT

50

367.0

367.0

45.0

Pack Materials-Page 3

MECHANICAL DATA
MPDS094A APRIL 2001 REVISED JUNE 2002

DCY (R-PDSO-G4)

PLASTIC SMALL-OUTLINE

6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)

0,10 (0.004) M

3,70 (0.146)
3,30 (0.130)

7,30 (0.287)
6,70 (0.264)

Gauge Plane
1

0,84 (0.033)
0,66 (0.026)

2,30 (0.091)
4,60 (0.181)

1,80 (0.071) MAX

3
010

0,10 (0.004) M

0,25 (0.010)

0,75 (0.030) MIN

1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)

0,10 (0.0040)
0,02 (0.0008)

4202506/B 06/2002
NOTES: A.
B.
C.
D.

All linear dimensions are in millimeters (inches).


This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.

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DALLAS, TEXAS 75265

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