How to use solder paste stencil

Solder paste is a form of solder that is used in PCB assembly, and

including prototype PCB assembly, especially when using reflow
soldering techniques. The solder paste is a mixture a solder spheres
and a specialized form of flux. This means that the solder forms a
form of paste that can be printed onto the surface of the printed
circuit card in the required There are a number of types of solder
paste, but that used for electronics manufacture is a form that can
effectively be "printed" onto the surface of the electronic printed
circuit board in the required place.

Solder paste basics

The solder particles are a mixture of solder. Traditionally this used to
be tin and lead, but with the legislation being introduced around the
world, there is a move to lead free solders. These may be made from a

variety of mixtures. One is 99.7% tin and 0.3% copper, whereas there
are other mixtures that include other metals including tin.

Solder paste storage

In order to ensure that the solder paste is suitable for proving the
highest performance for PCB assembly it is necessary to ensure that it
maintains the required properties. To achieve this it is imperative
that the solder paste is stored correctly. It should always be stored in
an airtight container to prevent oxidation. The very large surface area
of the minute solder spheres, means that oxidation can present a very
great problem.
Additionally, the solder must be stored at low temperatures. Not only
does this reduce the rate of any oxidation there may be, but it also
reduces the rate at which the flux degrades. While a low temperature
is imperative, it should not be stored at a temperature below freezing.
In view of the way in which solder paste can degrade, it also has a
defined shelf life and it should not be used after its end date. If old
solder is used there is a distinct risk of a much higher defect rate, and
the cost of any rework incurred would be well beyond the cost of
replacing the solder paste.

How to use solder paste

you can go to take a look Rayming stencil

When solder paste is used in mass PCB assembly as well as prototype

PCB assembly there are a number of stages that are undertaken. First
solder paste is applied to the printed circuit boards. The solder paste
is only applied to the areas where solder is required. This is achieved
using a solder paste stencil that only allows the solder paste through
in certain areas. (Further information is available on another page in
this section of the website).
Once the solder paste has been applied to the printed circuit board, it
is then passed into the pick and place machine where the components
are added. The solder paste has sufficient tension that it holds the
components in place. However care should be taken not to knock the
board at this stage otherwise the components may move of fall off.
Additionally the board should be soldered within a few hours of being
placed, otherwise the solder paste may deteriorate.
Solder paste is widely used in PCB assembly - both in mass
production and also for prototype PCB assembly. When used with
care it enables very high quality soldered joints to be produced,
however very careful control of the process is required if this is to be
maintained. It is necessary to apply the correct amount, and in the
correct place. Additionally the solder paste must be within its "use
by" date.
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