Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

FEATURES

SYMBOL

Low forward volt drop

Fast switching
Soft recovery characteristic
Reverse surge capability
High thermal cycling performance
Low thermal resistance

QUICK REFERENCE DATA

VR = 150 V/ 200 V
VF 0.895 V

a2
3

a1
1

IO(AV) = 10 A
IRRM = 0.2 A

k 2

trr 25 ns

GENERAL DESCRIPTION
Dual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power
supplies.
The BYQ28E series is supplied in the SOT78 conventional leaded package.
The BYQ28EB series is supplied in the SOT404 surface mounting package.
The BYQ28ED series is supplied in the SOT428 surface mounting package.

PINNING
PIN

SOT78 (TO220AB)

SOT404

SOT428

DESCRIPTION

anode 1

cathode 1

anode 2

tab

cathode

tab

tab

tab

2
1

1 23

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER

CONDITIONS

MIN.

BYQ28E/ BYQ28EB/ BYQ28ED

VRRM
VRWM
VR
IO(AV)
IFRM
IFSM
IRRM
IRSM
Tj
Tstg

Peak repetitive reverse

voltage
Working peak reverse
voltage
Continuous reverse voltage
Average rectified output
current (both diodes
conducting)
Repetitive peak forward
current per diode
Non-repetitive peak forward
current per diode
Peak repetitive reverse
surge current per diode
Peak non-repetitive reverse
surge current per diode
Operating junction
temperature
Storage temperature

MAX.

UNIT

-150
150

-200
200

150

200

150

200

square wave; = 0.5; Tmb 119 C

10

square wave; = 0.5; Tmb 119 C

10

t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied VRRM(max)
tp = 2 s; = 0.001

50
55

A
A

0.2

tp = 100 s

0.2

150

- 40

150

1. It is not possible to make connection to pin 2 of the SOT428 or SOT404 packages.

October 1998

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

ESD LIMITING VALUE

SYMBOL

PARAMETER

CONDITIONS

VC

Electrostatic discharge
capacitor voltage

Human body model;

C = 250 pF; R = 1.5 k

MIN.

MAX.

UNIT

kV

THERMAL RESISTANCES
SYMBOL PARAMETER

CONDITIONS

Rth j-mb

per diode
both diodes
SOT78 package, in free air
SOT404 and SOT428 packages, pcb
mounted, minimum footprint, FR4 board

Rth j-a

Thermal resistance junction

to mounting base
Thermal resistance junction
to ambient

MIN.
-

TYP. MAX. UNIT

60
50

4.5
3
-

K/W
K/W
K/W
K/W

ELECTRICAL CHARACTERISTICS
All characteristics are per diode at Tj = 25 C unless otherwise specified
SYMBOL PARAMETER

CONDITIONS

VF

Forward voltage

IR

Reverse current

Qrr
trr1
trr2
Irrm

Reverse recovered charge

Reverse recovery time
Reverse recovery time
Peak reverse recovery
current
Forward recovery voltage

IF = 5 A; Tj = 150C
IF = 5 A
IF = 10 A
VR = VRWM
VR = VRWM; Tj = 100C
IF = 2 A; VR 30 V; -dIF/dt = 20 A/s
IF = 1 A; VR 30 V; -dIF/dt = 100 A/s
IF = 0.5 A to IR = 1 A; Irec = 0.25 A
IF = 5 A; VR 30 V; -dIF/dt = 50 A/s

IF = 1 A; dIF/dt = 10 A/s

Vfr

October 1998

MIN.

TYP. MAX. UNIT

0.8
0.95
1.1
2
0.1
4
15
10
0.5

0.895
1.1
1.25
10
0.2
9
25
20
0.7

V
V
V
A
mA
nC
ns
ns
A

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

dI
F

BYQ28E, BYQ28EB, BYQ28ED series

R
F

dt
t

rr

D.U.T.
Voltage Pulse Source

time

Q
I

Current
shunt

100%

10%

rrm

Fig.4. Circuit schematic for trr2

Fig.1. Definition of trr1, Qs and Irrm

to scope

0.5A
IF
0A

time

I rec = 0.25A

VF
IR

fr

trr2

VF
I = 1A
R

time

Fig.2. Definition of Vfr

PF / W

Fig.5. Definition of trr2

Tmb(max) / C

BYQ28

Vo = 0.748 V

D = 1.0

Rs = 0.0293 Ohms

PF / W

0.5

Rs = 0.0293 Ohms

115

a = 1.57

3
2
1

4
IF(AV) / A

135

140

145

140
145
150
8

Fig.3. Maximum forward dissipation PF = f(IF(AV)) per

diode; square current waveform where
IF(AV) =IF(RMS) x D.

October 1998

130

2.8

135
tp
D=
T

tp

125

2.2

130

0.1

120

1.9

125

0.2

Tmb(max) / C

BYQ28

Vo = 0.748 V

120

110

3
IF(AV) / A

150
6

Fig.6. Maximum forward dissipation PF = f(IF(AV)) per

diode; sinusoidal current waveform where a = form
factor = IF(RMS) / IF(AV).

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

trr / ns

1000

Qs / nC

100

IF=5A
IF=2A
IF=1A

100

IF=5A

10

IF=1A
10

1.0

0.1

100

10
dIF/dt (A/us)

Fig.7. Maximum trr at Tj = 25 C; per diode

10
-dIF/dt (A/us)

100

Fig.10. Maximum Qs at Tj = 25 C; per diode

Irrm / A

10

1.0

10

Transient thermal impedance, Zth j-mb (K/W)

1
IF=5A

0.1

0.1

IF=1A
PD

0.01

0.01
10
-dIF/dt (A/us)

0.001
1us

100

Fig.8. Maximum Irrm at Tj = 25 C; per diode

15

tp

D=

10us

tp
T
t

100us 1ms
10ms 100ms
1s
pulse width, tp (s)
BYQ28E

10s

Fig.11. Transient thermal impedance; per diode;

Zth j-mb = f(tp).

BYQ28

IF / A
Tj=150C
Tj=25C

10

5
max

typ

0
0

0.5
VF / V

1.5

Fig.9. Typical and maximum forward characteristic

IF = f(VF); parameter Tj

October 1998

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

MECHANICAL DATA
Dimensions in mm

4,5
max

Net Mass: 2 g

10,3
max
1,3

3,7
2,8

5,9
min

15,8
max

3,0 max
not tinned

3,0

13,5
min
1,3
max 1 2 3
(2x)

0,9 max (3x)

2,54 2,54

0,6
2,4

Fig.12. SOT78 (TO220AB); pin 2 connected to mounting base.

Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".

October 1998

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

MECHANICAL DATA
Dimensions in mm

4.5 max
1.4 max

10.3 max

Net Mass: 1.4 g

11 max
15.4

2.5
0.85 max
(x2)

0.5

2.54 (x2)

Fig.13. SOT404 : centre pin connected to mounting base.

MOUNTING INSTRUCTIONS
Dimensions in mm

11.5

9.0

17.5
2.0

3.8

5.08

Fig.14. SOT404 : soldering pattern for surface mounting.

Notes
1. Epoxy meets UL94 V0 at 1/8".

October 1998

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

MECHANICAL DATA
Dimensions in mm

seating plane

Net Mass: 1.1 g

6.73 max

1.1

tab

2.38 max
0.93 max

5.4

4 min
6.22 max
10.4 max
4.6

2
1

0.5

0.5 min

0.3
0.5

0.8 max
(x2)
2.285 (x2)

Fig.15. SOT428 : centre pin connected to tab.

MOUNTING INSTRUCTIONS
Dimensions in mm

7.0

7.0

2.15

1.5

2.5

4.57

Fig.16. SOT428 : minimum pad sizes for surface mounting.

Notes
1. Plastic meets UL94 V0 at 1/8".

October 1998

Rev 1.300

Philips Semiconductors

Product specification

Rectifier diodes
ultrafast, rugged

BYQ28E, BYQ28EB, BYQ28ED series

DEFINITIONS
Data sheet status
Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification

This data sheet contains final product specifications.

Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1998
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

October 1998

Rev 1.300

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