L2 Moto G (3rd Generation) Global Service and Repair Manual V2.0

Moto G
(3rd Generation)
Moto G (3rd Generation)

Level 2 Service and Repair Manual

REVISION HISTORY
Revision
1
PAGE 2
Date
Notes
06/02/2015
Initial release.
06/19/2015
Removed Callisto Lens Adhesive Heating Plate (4-00-Y8-10000) and 7x7 Hot
Plate (4-00-Z2-10000 / 4-00-Z3-10000) from Tools Required for Disassembly.
Removed Pre-Heat Option A from Display Removal (With Display Removal
Fixture).
Revised title of Pre-Heat Method B to Display Pre-Heat Option in Display
Removal (With Display Removal Fixture).
Changed Generic Lens Removal Fixture (4-00-X2-10000 / 4-00-X7-10000) set
temperature from 100 C to 110 C.
Revised Final Press Pre-Heat Method A to use the Generic Lens Removal
Fixture (4-00-X2-10000 / 4-00-X7-10000) and bottom plate of Callisto Lens
Removal Fixture (4-00-Y2-10000).
Added Option Pre-Heat Method C to Final Press.
Added Callisto Pre-Heat Fixture (4-00-Y8-10000) to Tools Required for
Assembly.
Motorola Mobility Confidential Restricted:

Do not share without consent from Motorola

TABLE OF CONTENTS
Revision History ............................................................................................................................................................ 2
Table of Contents .......................................................................................................................................................... 3
List of Tables ................................................................................................................................................................. 6
Table of Figures ............................................................................................................................................................ 6
Safety Information ........................................................................................................................................................ 7
Cautions and Warnings ................................................................................................................................................. 7
Electrostatic Discharge ...........................................................................................................................................................................................7
Battery Safety Guidelines .............................................................................................................................................. 7

Introduction................................................................................................................................................................... 8
External Views .............................................................................................................................................................. 8
PSCD Gaps.................................................................................................................................................................. 10
Exploded Views ........................................................................................................................................................... 15
Disassembly and Recovery ........................................................................................................................................ 19
Disassembly and Recovery Map .................................................................................................................................. 19
Tools Required for Disassembly .................................................................................................................................. 20
Rear Cover Removal .................................................................................................................................................... 22
Water Detection Label Inspection ................................................................................................................................ 23
Display Removal (With Display Removal Fixture).......................................................................................................... 24
Lens Removal Fixture Setup .................................................................................................................................................................................24
Pre-Heat Option ....................................................................................................................................................................................................25
Display Removal ...................................................................................................................................................................................................26
Display Removal (Damaged Display Lens Only) ........................................................................................................... 29

Speaker Bezel Removal............................................................................................................................................... 31
Front-Facing Imager Gasket Removal .......................................................................................................................... 32
PCB Removal .............................................................................................................................................................. 33
Jumper Flex Removal.................................................................................................................................................. 35
Daughter Board Removal ............................................................................................................................................ 36
Front-Facing Imager Removal ..................................................................................................................................... 38
Rear-Facing Imager Removal ...................................................................................................................................... 39
Earpiece Speaker Removal .......................................................................................................................................... 40
Main-Microphone Gasket Removal .............................................................................................................................. 41
Top Frame Removal .................................................................................................................................................... 42
Bottom Frame Removal ............................................................................................................................................... 43
Loudspeaker Removal ................................................................................................................................................. 44
Loudspeaker Pad Removal .......................................................................................................................................... 45
USB Module Removal .................................................................................................................................................. 46
Battery Removal .......................................................................................................................................................... 48
Headset Jack Removal ................................................................................................................................................ 50
PAGE 3


Rear-Facing Imager Bezel Removal ............................................................................................................................. 51

Rear-Facing Imager Gasket Removal........................................................................................................................... 52
Rear-Facing Imager Lens Removal .............................................................................................................................. 53
Rear-Facing Imager Deco Ring Removal ..................................................................................................................... 54
Secondary-Microphone Gasket Removal ..................................................................................................................... 55
Snap Seal Removal ..................................................................................................................................................... 56
Vent Hole Pad Removal ............................................................................................................................................... 57
Jumper-Flex Pad Removal .......................................................................................................................................... 58
Speaker Pad Removal ................................................................................................................................................. 59
Side-Key Button Seal Removal .................................................................................................................................... 60
Side Key Removal ....................................................................................................................................................... 61
Parts Refresh .............................................................................................................................................................. 62
Tools Required for Parts Refresh ................................................................................................................................. 62
Housing Cleaning ........................................................................................................................................................ 63
PCB Cleaning .............................................................................................................................................................. 64
Battery Cleaning.......................................................................................................................................................... 67
Daughter Board Cleaning ............................................................................................................................................ 68
USB Module Cleaning .................................................................................................................................................. 69
Assembly ..................................................................................................................................................................... 71
Assembly Map ............................................................................................................................................................ 71
Tools Required for Assembly ....................................................................................................................................... 72
Rear-Facing Imager Deco Ring Assembly .................................................................................................................... 76
Rear-Facing Imager Lens Assembly ............................................................................................................................ 77
Rear-Facing Imager Bezel Assembly ........................................................................................................................... 78
Housing Seal Assembly ............................................................................................................................................... 79
Rear-Facing Imager Gasket Assembly ......................................................................................................................... 82
Secondary-Microphone Gasket Assembly .................................................................................................................... 83
Jumper-Flex Pad Assembly ......................................................................................................................................... 84
Speaker Pad Assembly................................................................................................................................................ 85
USB Module Assembly ................................................................................................................................................ 86
Headset Jack Assembly .............................................................................................................................................. 89
Battery Assembly ........................................................................................................................................................ 91
Loudspeaker Pad Assembly ........................................................................................................................................ 95
Loudspeaker Assembly ............................................................................................................................................... 97
Top Frame and Bottom Frame Assembly ..................................................................................................................... 99
Front-Facing Imager Assembly .................................................................................................................................. 105
Front-Facing Imager Gasket Assembly ...................................................................................................................... 106
Rear-Facing Imager Assembly................................................................................................................................... 107
Light Diffuser Assembly ............................................................................................................................................ 108
PAGE 4


Main-Microphone Gasket Assembly .......................................................................................................................... 109

Daughter Board Assembly ......................................................................................................................................... 110
Jumper Flex Assembly .............................................................................................................................................. 112
Water Detection Label Assembly ............................................................................................................................... 113
PCB Assembly ........................................................................................................................................................... 114
Speaker Bezel Assembly ........................................................................................................................................... 117
Final Press ................................................................................................................................................................ 126
Press Setup ........................................................................................................................................................................................................126
Pre-Heat Method A .............................................................................................................................................................................................127
Pre-Heat Method B .............................................................................................................................................................................................128
Optional Pre-Heat Method C ...............................................................................................................................................................................129
Phone Press .......................................................................................................................................................................................................130
USB Module Cover Assembly .................................................................................................................................... 131

Side Key Assembly .................................................................................................................................................... 132
Rear Cover Assembly ................................................................................................................................................ 134
PAGE 5


LIST OF TABLES
Table 1. External Views Parts List ................................................................................................................................... 9
Table 2. PSCD Gap Measurements ................................................................................................................................ 14
Table 3. Exploded View Parts List.................................................................................................................................. 15
Table 4. Subassembly Exploded View Parts List ............................................................................................................ 17
TABLE OF FIGURES
Figure 1. External Views.................................................................................................................................................. 8
Figure 2. PSCD Front View ............................................................................................................................................ 10
Figure 3. PSCD Rear View ............................................................................................................................................. 11
Figure 4. PSCD Side View ............................................................................................................................................. 12
Figure 5. Display Alignment .......................................................................................................................................... 13
Figure 6. Assembly Exploded View ................................................................................................................................ 15
Figure 7. Subassembly Exploded View .......................................................................................................................... 17
PAGE 6


SAFETY INFORMATION
Cautions and Warnings
Electrostatic Discharge
The phone components may be damaged by electrostatic discharge (ESD). Always use an ESD mat and ground strap
when working with internal components.
Battery Safety Guidelines

Handle Battery with care. Ensure Battery edges and surfaces are not dented or deformed. If the Battery Pack is dropped
to the floor, it may be internally damaged and must be scrapped.
Ensure all surfaces, fixtures, and phone components contacting the Battery are smooth and clean.
Ensure Battery and its insulation are not damaged (e.g. scratched, dented, punctured) prior to and throughout
assembly.
Prior to assembly, ensure Battery edges and surfaces are not dented or deformed, and that fixtures and parts that
will contact the Battery are free of foreign material.
Ensure screws and screwdrivers do not contact the Battery.
Failure to adhere to Safety Critical Note(s) may increase risk of rupture, burning, or failure to function safely when
used by the customer.
PAGE 7


INTRODUCTION
External Views
Figure 1. External Views
PAGE 8


Table 1. External Views Parts List
Reference #
Description
Earpiece Speaker
Front-Facing Imager
Main Display
Display Bezel
Loudspeaker
Power Key
Volume Key
Housing
Rear-Facing Imager
10
Rear-Facing Imager Deco Ring
11
Flash
12
Rear-Facing Imager Bezel
13
Motorola Logo
14
Rear Cover
15
Headset Jack
16
Secondary Microphone
17
USB Port
PAGE 9


PSCD Gaps
All dimensions are in millimeters (mm). The following gaps are considered maximum allowable without further approval
from a supervisor. Measure gaps at an angle perpendicular to the surface/area being measured. Feeler Gauges must
not be used at an angle as they will give false-positive results.
Figure 2. PSCD Front View
PAGE 10


Figure 3. PSCD Rear View
PAGE 11


Figure 4. PSCD Side View
PAGE 12


Figure 5. Display Alignment
PAGE 13


Table 2. PSCD Gap Measurements
Reference #
Description
Earpiece Bezel to Main Lens Perimeter
Earpiece Bezel to Main Lens (Recess) Perimeter
Front-Facing Imager Eye to Main Lens Artwork Concentricity
Main Lens to Front Housing Perimeter
Main Lens to Front Housing Recess (Left and Right)
Loudspeaker Bezel to Main Lens (Recess) Perimeter
Loudspeaker Bezel to Main Lens Perimeter
Main Lens to Front Housing Recess (Top and Bottom)
Rear-Facing Imager Eye to Camera Lens Artwork Concentricity
10
Trim Ring to Camera Bezel Perimeter
11
Camera Lens to Trim Ring Perimeter
12
Flash Lens to Camera Bezel Perimeter
13
Camera Bezel to Rear Cover Perimeter
14
Camera Bezel to Rear Cover Step
15
Motorola Logo (tips of M) to Side of Rear Cover Rotation
16
Power Key to Front Housing Perimeter
17
Volume Key to Front Housing Perimeter
18
Rear Cover to Front Housing (Top, Bottom, and Sides)

Rear Cover to Front Housing (In radius of 4 Corners)
19
Rear Cover to Front Housing Step
20
Lens Viewing Area Alignment (Horizontal)
21
Lens Viewing Area Alignment (Vertical)
PAGE 14


Exploded Views
Figure 6. Assembly Exploded View

Table 3. Exploded View Parts List
Reference #
Description
Recovery Part
ASSY,DISP,DISPLAY-LENS,BLACK PRODN
ASSY,DISP,DISPLAY-LENS,WHITE PRODN
YES
YES
ASSY,PCB,MN XCVR APAC UMTS DS 16GB

ASSY,PCB,MN XCVR LATAM UMTS DS 16GB (Brazil, Mexico)
ASSY,PCB,MN XCVR LATAM DS DTV (Brazil)
ASSY,PCB,MN XCVR LATAM UMTS DS (Brazil, Colombia)
ASSY,PCB,MN XCVR APAC UMTS DS
ASSY,PCB,MN XCVR LATAM DS DTV 16GB (Brazil)
ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS 16GB
ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS
ASSY,PCB,MN XCVR TMOB (TMO) UMTS SS
ASSY,PCB,MN XCVR EUROPE UMTS SS
ASSY,PCB,MN XCVR LATAM UMTS SS (Brazil, Chile)
ASSY,PCB,MN XCVR VZW CDMA SS
ASSY,PCB,MN XCVR VZW CDMA SS 16GB
ASSY,PCB,MN XCVR LATAM UMTS SS 16GB (Brazil)
2.1
PAD,SPEAKER, BOT
NO
PAGE 15


Reference #
Description
Recovery Part
YES
ASSY,HSG,ASSEMBLY, BCK HSG BLACK

ASSY,HSG,ASSEMBLY, BCK HSG WHITE
ASSY,HSG,ASSEMBLY, BCK HSG SS BLACK
ASSY,HSG,ASSEMBLY, BCK HSG SS WHITE
ASSY,HSG,BATTERY COVER LIC

ASSY,HSG,BATTERY COVER CHALK
YES
DIE CUT,ADHESIVE, LENS
NO
BZL,EARPIECE, DARK
BZL,EARPIECE, BRIGHT
NO
BZL,SPEAKER, DARK
BZL,SPEAKER, BRIGHT
NO
SCREW,THREAD FORMING (M1.2 L=4.2)
NO
SCREW (YELLOW ZINC PLATING)
NO
10
SUPPORT,FRAME,TOP AUDIO
YES
11
DIE CUT,ADHES,FRAME, TOP AUDIO
NO
12
SUPPORT,FRAME,BOTTOM AUDIO
YES
13
DIE CUT,ADHES,FRAME, BOTTOM AUDIO
NO
14
SEAL,MIC 1
NO
15
ASSY,HSG,CAMERA, 5M, KT LENS
YES
16
TRANSDUCER,OTHR,.566V,W/ ADHES AND LINER
NO
17
ASSY,HSG,CAMERA, 13MP
YES
18
ASSY,HSG,FLEX, JMPR
YES
19
TRANSDUCER,OTHR,2V,LOUDSPEAKER, 8OHM, 3.65 X 12 X 17MM, IP67,

IN"
NO
20
DIE CUT,ADHESIVE, DAUGHTER PCB
NO
21
ASSY,PWA,DEV DAUGHTER BRD 2 SIM

ASSY,PWA,DAUGHTER BRD 1 SIM
YES
22
SCR,SCREW, MACHINE, DAUG PCB (GREEN ZINC PLATING)
NO
23
BZL,BEZEL, CAMERA
BZL,BEZEL, CAMERA
NO
24
LBL,IMEI
NO
25
ASSY,BAT,LI POLY,FC40,SONY 2600MAH
YES
26
DIE CUT,ADHES,USB PCB 1
NO
27
ASSY,PWA,USB PCB MN BRD
YES
28
NO
29
SPRT,FRM,METAL, USB PCB
YES
PAGE 16


Figure 7. Subassembly Exploded View

Table 4. Subassembly Exploded View Parts List
Reference # Description
Recovery Part
3.1
PAD,PORON,JUMPER FLX BUCKET
NO
3.2
PAD,SNAP HSG SEAL
NO
3.3
PAD,PRESSURE VENT WHT PE8-0306
NO
3.4
SEAL,MIC 2
NO
3.5
DIE CUT,ADHES,BAT
NO
3.6
SEAL, BUTTON
NO
NA
PLATE, BUTTON BACKER
NO
NA
SCREW, MACHINE 4IP
NO
3.7
MAG, FRNT HOUSING,DVX
NO
3.8
CONT,SPKR
NO
3.9
PAD,PAD, SPKR BACKER
NO
3.10
BZL,CAMR RING
NO
3.11
LENS,CAMR ADHES
NO
3.12
BTN,PWR, DARK
BTN,PWR BRT CHRM
YES
3.13
BTN,VOLUME, DARK
BTN,VOLUME,BRIGHT CHRM
YES
PAGE 17


Reference # Description
Recovery Part
4.1
SEAL, SIM #1
SEAL, SIM #1
NO
4.2
SEAL, SIM #2
SEAL, SIM #2
NO
PAGE 18


DISASSEMBLY AND RECOVERY

Disassembly and Recovery Map
Rear Cover
Side Keys
Rear-Facing
Imager Lens
Rear-Facing
Imager Deco
Ring
Rear-Facing
Imager Bezel
Front-Facing
Imager Gasket
Lousdpeaker
Bezel
Earpiece Bezel
Display
PCB
Battery
Adhesive
Battery
Headset Jack
Headset Jack
Gasket
SecondaryMicrophone
Gasket
Bottom Frame
Adhesive
Bottom Frame
MainMicrophone
Gasket
Loudspeaker
Pad
Loudspeaker
Jumper Flex
Top Frame
Adhesive
Top Frame
Light Diffuser
Front-Facing
Imager
Earpiece
Speaker
Rear-Facing
Imager
Daughter
Board
Adhesives
Daughter
Board
Side-Key
Button Seals
Side-Key
Button-Seal
Retention
Bracket
Rear-Facing
Imager Gasket
Speaker Pad
Jumper-Flex
Pad
Vent-Hole Pad
Snap Seals
Display
Adhesive
USB Module
PCB
USB Module
Frame
Adhesive
USB Module
Frame
USB Module
Adhesive
USB Module
Cover
*Shaded parts may be eligible for parts recovery.
PAGE 19


Tools Required for Disassembly

The following tools are required to disassemble the Moto G (3rd Generation) phone.
Description
Part #
Generic Lens Removal Fixture*
4-00-X2-10000
(220V) /
4-00-X7-10000
(115V)
Vacuum O-Ring**
4-00-A2-10000
(19506580)
Callisto Lens Removal Fixture
4-00-Y2-10000
Oven
(optional - for reduction of process time)
--
Heat Gun (optional)
--
PAGE 20
Picture / Drawing


Description
Part #
Picture / Drawing
Blackstick
--
4IP Torx Bit
--
Thin Plastic Spudger
0-00-00-40826
Stainless Steel Dental Pick
--
Tweezers (Plastic or Plastic-Tipped)
--
--
Tweezers (Metal)
--
--
ESD Mat and Wrist Strap
--
--
Gloves or Finger Collets
--
--
Isopropyl (ISP) Alcohol
--
--
*Generic Lens Removal Fixtures 4-00-X2-10000 and 4-00-X7-10000 are identical tools. The only difference is the
voltage rating. Either the 220V 4-00-X2-10000 or the 115V 4-00-X7-10000 can be used with the Callisto Lens Removal
Fixture (4-00-Y2-10000).
**Sets of 5 Vacuum O-Rings (19506580) are available under the package part number 4-00-A2-10000.
PAGE 21


Rear Cover Removal

NOTE
The Rear Cover can be recovered
and reused after removal.
1.
Starting at the cutout near the USB Connector,

use a fingernail to release the Rear Cover snaps
from the Housing.
2.
Continue to release the Rear Cover snaps

around the edges of the phone.
3.
After the Rear Cover snaps have been released,

lift the Rear Cover towards the top of the
assembly to remove it from the Housing.
PAGE 22


Water Detection Label Inspection

Inspect the Water Detection Label (WDL) visible
through the opening next to the SIM slot, to verify
it is correctly placed and inspect it for signs of
activation.
PAGE 23


Display Removal (With Display Removal Fixture)

// CAUTION //
NOTE
If the Display Lens is damaged, continue to

Display Removal (Damaged Display Lens Only)
on page 29. Do not use the Display Removal
(With Display Removal Fixture) procedure if the
Display Lens is damaged.
Pre-Heat Option A and Pre-Heat Option B are

optional procedures that may be used to reduce
the Display Removal process time.
Lens Removal Fixture Setup

1.
Verify that the Vacuum O-ring (4-00-A2-10000) is

positioned in the Generic Lens Removal Fixture
(4-00-X2-10000/4-00-X7-10000) as shown.
NOTE
The Generic Lens Removal Fixture vacuum will
not perform correctly if the Vacuum O-ring is not in
position.
2.
Place the Callisto Lens Removal Fixture

(4-00-Y2-10000) into the Generic Lens Removal
Fixture.
3.
Press the black power switch (not shown) on the

back of the Generic Lens Removal Fixture to turn
the fixture ON.
4.
Turn the vacuum knob (circled) clockwise until it

stops.
5.
Wait 5-10 minutes for the Generic Lens Removal

Fixture to warm up to 110 C (230 F).
// CAUTION //
Damage to the assembly may occur if the Generic
Lens Removal Fixture is not warmed up to
operating temperature before use.
NOTE
If the controller on the Generic Lens Removal
Fixture must be adjusted, see the user manual on
page 137.
PAGE 24


Pre-Heat Option
1.
Pre-heat the Oven to 70 C (158 F).
// CAUTION //
If the Oven is not available or not appropriate, skip
to Display Removal on page 26.
2.
Place the phone in the Oven.
// CAUTION //
Do not set the Oven temperature higher than
70 C (158 F). Damage to the phone may occur.
3.
Wait 25 minutes for the Display to warm up.
4.
Remove the phone from the Oven.
// CAUTION //
Wear protective gloves when handling heated
phones.
5.
Continue to Display Removal on page 26.
NOTE
For phones with a damaged Display Lens,
continue to Display Removal (Damaged Display
Lens Only) on page 29.
PAGE 25


Display Removal
NOTE
The Display can be recovered and
reused after removal.
1.
Place the phone in the Callisto Lens Removal

Fixture with the Display facing down and the
Headset Jack facing the front of the fixture.
2.
Press down on the Callisto Lens Removal

Fixture and press the red button to turn on the
vacuum pump.
3.
Hold the Callisto Lens Removal Fixture down

until the gauge (circled) reaches -60 kPa. When
the gauge reaches -60 kPa, remove your hand
from the Callisto Lens Removal Fixture.
PAGE 26


4.
Wait for the Callisto Lens Removal Fixture to

spring up.
NOTE
The lid on the Generic Lens Removal Fixture is
spring loaded, and will automatically open when
the Display is separated from the Housing.
5.
Press the red button to turn off the vacuum

pump.
6.
Turn the vacuum knob counter-clockwise to

release the vacuum.
7.
Remove the phone from the Callisto Lens

Removal Fixture.
// CAUTION //
parts.
8.
Use the Thin Plastic Spudger to separate the

remaining adhesive from the USB side of the
phone.
// CAUTION //
Do not insert the Thin Plastic Spudger deeper
than 1 mm. Deeper insertion may separate the
Display and Lens and cause damage.
PAGE 27


9.
Use the Tweezers to remove the Kapton Tape

from the Display Flex ZIF Connector Door.
NOTE
After you remove the Kapton Tape, you
cannot reuse it.
10. Use the Blackstick to open the Display Flex ZIF
Connector Door.
11. Slide the Display Flex free from the ZIF
Connector.
// CAUTION //
Do not damage the Display Flex.
12. Verify that the Display Flex is disconnected and
that no other connection exists between the
Display and the phone assembly.
13. Lift the Display out of the Housing.
PAGE 28


Display Removal (Damaged Display Lens Only)

NOTE
The phone may be pre-heated before Display
removal. See Optional Pre-Heat on page 25 for
pre-heating instructions.
1.
Slide the Thin Plastic Spudger into the gap

between the Display and the Housing.
// CAUTION //
This procedure should only be performed if the
Display Lens is damaged.
2.
Move the Thin Plastic Spudger around the edge

of the Display to free the adhesive.
// CAUTION //
Do not insert the Thin Plastic Spudger deeper
than 1 mm. Deeper insertion may separate the
Display and Lens and cause damage.
NOTE
While moving the Thin Plastic Spudger around the
Display, insert a shim or Thin Plastic Spudger
between the separated edges to prevent the
Display from re-adhering to the Housing.
3.
When the adhesive has been freed, slightly lift

the Display from the Housing.
// CAUTION //
To avoid damage to the Display Flex, do not lift
the Display any higher than necessary to
disconnect the Display Flex.
PAGE 29


4.
Use the Tweezers to remove the Kapton Tape

from the Display Flex ZIF Connector Door.
NOTE
cannot reuse it.
5.
Use the Blackstick to open the Display Flex ZIF

Connector Door.
6.
Slide the Display Flex free from the ZIF

Connector.
// CAUTION //
Do not damage the Display Flex.
7.
Verify that the Display Flex is disconnected and

that no other connection exists between the
Display and the phone assembly.
8.
Lift the Display out of the Housing.
PAGE 30


Speaker Bezel Removal

1.
Use the flat end of the Blackstick and ISP

Alcohol to remove the Earpiece Speaker Bezel
(1) from the Display.
NOTE
After you remove the Earpiece Speaker
Bezel, you cannot reuse it.
2.
Use the flat end of the Blackstick and ISP

Alcohol to remove the Loudspeaker Bezel (2)
from the Display.
NOTE
After you remove the Loudspeaker Bezel,
you cannot reuse it.
PAGE 31


Front-Facing Imager Gasket Removal

Use the Tweezers to remove the Front-Facing
Imager Gasket.
NOTE
After you remove the Front-Facing
Imager Gasket, you cannot reuse it.
NOTE
Remove the Front-Facing Imager Gasket only if
the Front-Facing Imager will be reused. If the
Front-Facing Imager will be replaced, skip this
step.
PAGE 32


PCB Removal
NOTE
The PCB can be recovered and
1.
Remove the 10 4IP Machine Screws from the

PCB.
NOTE
After you remove the 4IP Machine
Screws, you cannot reuse them.
NOTE
Use the Tweezers or Blackstick to remove any
Display Adhesive covering the screws and
preventing removal.
2.
Remove the 4 4IP Thread-Forming Screws from

the PCB.
NOTE
After you remove the 4IP Thread-Forming
NOTE
Use the Tweezers or Blackstick to remove any
Display Adhesive covering the screws and
preventing removal.
3.
PAGE 33
Verify that all screws are removed from the PCB.


4.
Use the flat end of the Blackstick to lift the key

side of the PCB from the location shown.
5.
Lift the key side of the PCB and rotate the PCB
to the Display Flex side of the assembly.
// CAUTION //
Do not lift the Display Flex side of the PCB. Lifting
the Display Flex side of the PCB may damage the
Battery Connector.
6.
PAGE 34
Use the Plastic Tweezers to disconnect the

Battery.


Jumper Flex Removal

NOTE
The Jumper Flex can be recovered
1.
Use the Tweezers to remove the Kapton tape

from the Jumper Flex ZIF Connector.
NOTE
cannot reuse it.
2.
Use the flat end of the Blackstick to open the

Jumper Flex ZIF Connector door.
3.
Remove the Jumper Flex from the connector.
PAGE 35


Daughter Board Removal

NOTE
The Daughter Board can be
recovered and reused after removal.
1.
Remove the 3 4IP Machine Screws from the

Daughter Board.
NOTE
After you remove the 4IP Machine
2.
Verify that all 4IP Machine Screws are removed

from the Daughter Board.
3.
Insert the flat end of the Blackstick between the

Daughter Board and the PCB shield in the
location shown.
4.
Rotate the Blackstick to disengage the Daughter

Board BtB Connector and Daughter Board
Adhesive.
// CAUTION //
Do not rotate the Blackstick any farther than
necessary to disconnect the Daughter Board BTB
Connector. The Daughter Board may flex
excessively and become damaged.
5.
Insert the flat end of the Blackstick between the

Daughter Board and the PCB shield in the
location shown.
6.
Rotate the Blackstick to separate the Daughter

Board Adhesive from the PCB.
// CAUTION //
Do not rotate the Blackstick any farther than
necessary to separate the Daughter Board
Adhesive. The Daughter Board may flex
excessively and become damaged.
PAGE 36


7.
PAGE 37
Lift the Daughter Board from the PCB.


Front-Facing Imager Removal

NOTE
The Front-Facing Imager can be
1.
Use the flat end of the Blackstick to disengage

the Front-Facing Imager BtB Connector.
// CAUTION //
When lifting the Front-Facing Imager BtB
Connector, leverage the Blackstick against the
PCB at the location shown. Damage to the FrontFacing Imager or PCB may occur if the Blackstick
is leveraged against any other area.
2.
PAGE 38
Remove the Front-Facing Imager from the Top

Frame.


Rear-Facing Imager Removal

NOTE
The Rear-Facing Imager can be
1.
Use the Tweezers to remove the Kapton tape

from the Rear-Facing Imager ZIF Connector.
NOTE
cannot reuse it.
2.
Use the flat end of the Blackstick to open the

Rear-Facing Imager ZIF Connector door.
// CAUTION //
When opening the Rear-Facing Imager ZIF
Connector door, leverage the Blackstick against
the PCB at the location shown. Damage to the
Rear-Facing Imager or PCB may occur if the
Blackstick is leveraged against any other area.
3.
PAGE 39
Lift the Rear-Facing Imager from the retaining

tabs and remove it from the connector.


Earpiece Speaker Removal

Use the Thin Plastic Spudger to pry the Earpiece
Speaker out of the Top Frame.
NOTE
After you remove the Earpiece
Speaker, you cannot reuse it.
PAGE 40


Main-Microphone Gasket Removal

Use the Tweezers to remove the Main-Microphone
Gasket from the Bottom Frame.
NOTE
After you remove the Main-Microphone
Gasket, you cannot reuse it.
PAGE 41


Top Frame Removal

NOTE
The Top Frame can be recovered and
1.

Top Frame Adhesive from the PCB at the
locations shown.
// CAUTION //
Do not damage the Top Frame when removing it
from the PCB.
2.
PAGE 42
After the Top Frame Adhesive is separated, lift

the Top Frame from the PCB.


Bottom Frame Removal

NOTE
The Bottom Frame can be recovered
1.

Bottom Frame Adhesive from the PCB at the
locations shown.
// CAUTION //
Do not damage the Bottom Frame when removing
it from the PCB.
2.
PAGE 43
After the Bottom Frame Adhesive is separated,

lift the Bottom Frame from the PCB.


Loudspeaker Removal
Use the flat end of the Blackstick to pry the
Loudspeaker from the PCB at the contact side of
the Loudspeaker.
NOTE
After you remove the Loudspeaker, you
cannot reuse it.
PAGE 44


Loudspeaker Pad Removal

Use the Tweezers and ISP Alcohol to remove
the Loudspeaker Pad from the PCB.
NOTE
After you remove the Loudspeaker Pad,
PAGE 45


USB Module Removal

NOTE
The USB Module and USB Module
Cover can be recovered and reused
after removal.
1.
Remove the 3 4IP Screws from the USB Module

Cover.
NOTE
After you remove the 4IP Screws, you

cannot reuse them.
2.
Remove the USB Module Cover from the

Housing.
3.
Use the Heat Gun to heat the USB Module to a

maximum temperature of 49 degrees Celsius
(120 degrees Fahrenheit) for 2 minutes. The
Heat Gun must be held approximately 4 in. (10
cm) from the USB Module and Housing.
PAGE 46


4.
From the inside of the Housing, use the pointed

end of the Blackstick to push the USB Module
out of the Housing.
// CAUTION //
Do not damage the USB Module pins.
PAGE 47


Battery Removal
/// WARNING ///
// CAUTION //
Failure to adhere to Safety Critical Note(s) may increase

risk of rupture, burning, or failure to function safely when
used by the customer. Refer to the Battery Safety
Guidelines.
Handle the Battery Pack with care. If dropped to the

floor, it may be internally damaged and must be
scrapped.
Ensure Battery and its insulation are not damaged (e.g.
scratched, dented, punctured) prior to and throughout
assembly.
Prior to assembly, ensure Battery edges and surfaces
are not dented or deformed, and that fixtures and parts
that will contact the Battery are free of foreign material.
Ensure screws and screwdrivers do not contact the
Battery.
NOTE
The Battery can be recovered and
1.
PAGE 48
Insert the Thin Plastic Spudger between the

Battery and Housing to separate the Battery
Adhesive.


2.
Lift the Battery out of the Housing.
3.
Slide the Battery Connector tail out of the

Housing.
// CAUTION //
Do not damage the Battery Connector.
PAGE 49


Headset Jack Removal

NOTE
The Headset Jack and Headset Jack
Gasket can be recovered and reused
after removal.
1.
Use the Tweezers to remove the Headset Jack

Gasket.
2.
Turn the Housing over until the Headset Jack

falls out of the Housing.
NOTE
For parts recovery, do not
disassemble any additional parts from
the Housing after the Headset Jack.
Continue to Housing Cleaning to complete
Housing recovery.
PAGE 50


Rear-Facing Imager Bezel Removal

Use the flat end of the Blackstick to pry the RearFacing Imager Bezel from the Housing.
NOTE
After you remove the Rear-Facing
Imager Bezel, you cannot reuse it.
PAGE 51


Rear-Facing Imager Gasket Removal

Use the Tweezers to remove the Rear-Facing Imager
Gasket.
NOTE
After you remove the Rear-Facing Imager
Gasket, you cannot reuse it.
PAGE 52


Rear-Facing Imager Lens Removal

From the inside of the Housing, use the pointed end
of the Blackstick to push the Rear-Facing Imager
Lens out of the Housing.
NOTE
After you remove the Rear-Facing Imager
Lens, you cannot reuse it.
PAGE 53


Rear-Facing Imager Deco Ring Removal

Use the Tweezers to remove the Rear-Facing Imager
Deco Ring from the Housing.
NOTE
After you remove the Rear-Facing
Imager Deco Ring, you cannot reuse it.
PAGE 54


Secondary-Microphone Gasket Removal

Use the Tweezers to remove the SecondaryMicrophone Gasket from the Housing.
NOTE
After you remove the SecondaryMicrophone Gasket, you cannot reuse it.
PAGE 55


Snap Seal Removal

Use the Tweezers to remove the 2 Snap Seals
from the Housing.
NOTE
After you remove the Snap Seals, you
cannot reuse them.
PAGE 56


Vent Hole Pad Removal

Use the Tweezers to remove the Vent Hole Pad
from the Housing.
NOTE
After you remove the Vent Hole Pad,
PAGE 57


Jumper-Flex Pad Removal

Use the Tweezers to remove the Jumper-Flex
Pad from the Housing.
NOTE
After you remove the Jumper-Flex
Pad, you cannot reuse it.
PAGE 58


Speaker Pad Removal

Use the Tweezers to remove the Speaker Pad
from the Housing.
NOTE
After you remove the Speaker Pad,
PAGE 59


Side-Key Button Seal Removal

1.
Remove the 2 4IP Screws from the Side-Key

Button Seal Retention Bracket.
NOTE
After you remove the 4IP Screws, you
cannot reuse them.
2.
Use the Tweezers to remove the Side-Key

Button Seal Retention Bracket.
3.
Use the Tweezers to remove the 3 Side-Key

Button Seals.
NOTE
After you remove the Side-Key Button
Seals, you cannot reuse them.
PAGE 60


Side Key Removal

NOTE
The Side Keys can be recovered and
1.
Through the openings in the back of the

Housing, use Stainless Steel Dental Pick to push
the Volume Key out of the Housing.
2.
Through the openings in the back of the

Housing, use Stainless Steel Dental Pick to push
the Power Key out of the Housing.
PAGE 61


PARTS REFRESH
Tools Required for Parts Refresh
The following tools are required for parts refresh of the Moto G (3rd Generation) phone.
Description
Part #
Blackstick
--
--
--
--
--
--
--
--
--
PAGE 62
Image


Housing Cleaning
1.
Use the Blackstick and ISP Alcohol to remove

any remaining adhesive in the Battery pocket.
2.
Use the Blackstick and ISP Alcohol to clean any

remaining adhesive from the Display ledge.
NOTE
For parts recovery, assemble the
Battery Adhesive using steps 5
through 7 of Battery Assembly on
page 92 to complete the Housing
subassembly.
PAGE 63


PCB Cleaning
1.

any remaining adhesive from where the Top
Frame attaches to the PCB.
2.

any remaining adhesive from where the Bottom
Spacer attaches to the PCB.
3.

any remaining adhesive from where the
Loudspeaker and Loudspeaker Pad attach to the
PCB.
4.
Verify that the Jumper-Flex ZIF Connector Door

is open.
PAGE 64


Top Frame Cleaning

1.

the Top Frame Adhesive and any remaining
Display Adhesive from the Top Frame.
2.
Use the Tweezers to remove the Light Diffuser

from the Top Frame.
3.

any remaining Light Diffuser adhesive from the
Top Frame.
PAGE 65


Bottom Frame Cleaning

1.

the Bottom Frame Adhesive and any remaining
Display Adhesive from the Bottom Frame.
2.

any remaining Main-Microphone Gasket
adhesive from the Bottom Frame.
PAGE 66


Battery Cleaning
/// WARNING ///
// CAUTION //

Guidelines.

scrapped.
assembly.
Battery.
1.

any adhesive residue from the Battery.
// CAUTION //
To prevent damage, do not allow sharp tools or
screws to come in contact with the Battery.
2.
Remove the Battery Insulator Tape from the

Battery.
// CAUTION //
To prevent damage, do not allow sharp tools or
screws to come in contact with the Battery.
3.

any adhesive residue from the Battery.
4.
Inspect the Battery to verify it is not creased,

crushed, or punctured.
5.
If the Battery foil pack is wrinkled, slide the flat

edge of the Blackstick against the foil pack to
smooth out all wrinkles.
PAGE 67


Daughter Board Cleaning

any remaining adhesive from the Daughter
Board.
// CAUTION //
Do not bend the Daughter Board when removing
the adhesive. Damage to the Daughter Board may
occur.
PAGE 68


USB Module Cleaning

any remaining adhesive from the USB Module.
PAGE 69


Display Cleaning
1.

any remaining adhesive from the edge of the
Display.
// CAUTION //
Use care when cleaning the Display. Do not
separate the Display from the Lens or damage the
Display Flex.
2.
PAGE 70
Inspect the Display Flex to verify it is not torn,

creased, or otherwise damaged.


ASSEMBLY
Assembly Map
Battery
Insulator Tape
Housing
Housing Seals
Rear-Facing
Imager Gasket
Jumper-Flex
Pad
SecondaryMicrophone
Gasket
Headset Jack
Speaker Pad
Battery
Adhesive
Battery
USB Module
Loudspeaker
Pad
Loudspeaker
Top Frame
and Bottom
Frame
Front-Facing
Imager
Earpiece
Speaker
Rear-Facing
Imager
MainMicrophone
Gasket
Light Diffuser
Daughter
Board
Jumper Flex
PCB
Display
Adhesive
Display
Side Keys
Rear-Facing
Imager Deco
Ring
Rear-Facing
Imager Lens
Rear-Facing
Imager Bezel
Rear Cover
PAGE 71


Tools Required for Assembly

The following tools are required to assemble the Moto G (3rd Generation) phone.
Description
Part #
Picture / Drawing
Battery Press Head
Callisto Lens and Battery Press Fixture
4-00-Y4-10000
Lens Press Head
Lens and Battery Press Fixture
Callisto Lens Adhesive Fixture
4-00-Y5-10000
Callisto Daughter Board Assembly Fixture
4-00-Y6-10000
Callisto PCB Fixture
4-00-Y7-10000
PCB Fixture
Alignment Lid
PAGE 72


Description
Part #
Callisto PCB Fixture (continued)
4-00-Y7-10000
Picture / Drawing
PCB Press Head
Callisto Rear Housing Assembly Fixture

(optional)
4-00-Y9-10000
Housing Assembly Fixture
Housing Seal Press Head
Oven
(optional - if Hot Plate and Callisto Lens Adhesive
Heating Plate are not available)
--
Generic Lens Removal Fixture*
4-00-X2-10000
(220V) /
4-00-X7-10000
(115V)
PAGE 73


Description
Part #
Callisto Lens Removal Fixture (bottom plate only)
4-00-Y2-10000
Callisto Pre-Heat Fixture
4-00-Y8-10000
Press
19501980
Blackstick
--
3IP Torx Bit
--
Torque Driver (Adjustable)
--

Cotton Swabs
------
PAGE 74
Picture / Drawing
--
------


Description
Part #
3M AP-111 Adhesion Promoter
--
Picture / Drawing
*Generic Lens Removal Fixtures 4-00-X2-10000 and 4-00-X7-10000 are identical tools. The only difference is the
voltage rating. Either the 220V 4-00-X2-10000 or the 115V 4-00-X7-10000 can be used with the Callisto Lens Removal
Fixture (4-00-Y2-10000).
PAGE 75


Rear-Facing Imager Deco Ring Assembly
Description
Reference #

ADH, CAMERA RING, OSPREY
BZL,CAMR RING
1.
Remove the Rear-Facing Imager Deco-Ring

Adhesive liner.
2.
Use the Tweezers to place the Rear-Facing

Imager Deco Ring onto the Rear-Facing Imager
Deco Ring Adhesive.
3.
Press down on the Rear-Facing Imager Deco

Ring for 5 seconds to secure the adhesive.
4.
Lift the Rear-Facing Imager Deco Ring from the

carrier, making sure the adhesive is adhered to
the ring.
5.
Place the Rear-Facing Imager Deco Ring into

the pocket in the Housing.
6.
Press down on the Rear-Facing Imager Deco

Ring for 5 seconds to secure it to the Housing.
PAGE 76


Rear-Facing Imager Lens Assembly
Description
Reference #
LENS,CAMR ADHES
1.
Remove the Rear-Facing Imager Lens from the

carrier.
2.
Use the Tweezers to place the Rear-Facing

Imager Lens into the pocket of the Rear-Facing
Imager Deco Ring on the Housing.
3.
Press down on the Rear-Facing Imager Lens for

5 seconds to secure it to the Housing.
4.
Verify the Rear-Facing Imager outer liner is in

position.
PAGE 77


Rear-Facing Imager Bezel Assembly
Description
Reference #
BZL,BEZEL, CAMERA
BZL,BEZEL, CAMERA
1.
Remove the Rear-Facing Imager Bezel adhesive

liner.
2.
Place the Rear-Facing Imager Bezel onto the

Housing.
3.
Press down on the Rear-Facing Imager Bezel for

5 seconds to secure it to the Housing.
NOTE
The Rear-Facing Imager Bezel will be pressed in
Final Press after assembly of the phone is
complete.
PAGE 78


Housing Seal Assembly
Description
Reference #
PAD,PRESSURE VENT WHT PE8-0306
PAD, SNAP HSG SEAL
SEAL,BUTTON
PLATE, BUTTON BACKER
SCREW, MACHINE 4IP
5(x2)
1.
Remove the Vent Hole Pad from the carrier.
2.
Place the Vent Hole Pad in the pocket of the

Housing.
PAGE 79


3.
Remove a Snap Seal from the carrier.
4.
Place the Snap Seal into the pocket of the

Housing.
5.
Repeat steps 3 through 4 for the remaining Snap

Seal.
6.
Remove the adhesive liner from the Side-Key

Button Seal.
7.
Place the Side-Key Button Seal in the pocket of

the Housing.
8.
Repeat steps 6 and 7 for the 2 remaining SideKey Button Seals.
PAGE 80


9.
Place the Housing into the Callisto Rear Housing

Assembly Fixture (4-00-Y9-10000).
10. Place the Callisto Rear Housing Assembly

Fixture into the Press (19501980).
11. Place the Housing Seal Press Head (4-00-Y910000) into the Press.
12. Press the Housing for 5 seconds to secure the
Vent Hole Pad, Snap Seals, and Side-Key
Button Seals to the Housing.
13. Remove the Housing from the fixture.

14. Place the Side-Key Button Seal Retention
Bracket into the Housing. Align the tabs in the
bracket first, then roll the bracket into position,
using the holes in the bracket to align it to the
screw bosses.
15. Place the 2 4IP Screws in the Side-Key Button

Seal Retention Bracket and Housing.
16. Tighten the 4IP Screws to 1.10 in-lbs.
(0.12 Nm).
PAGE 81


Rear-Facing Imager Gasket Assembly
Description
Reference #
PAD, CAMERA, 13MP
1.
Remove the Rear-Facing Imager Gasket from

the carrier.
2.
Place the Rear-Facing Imager Gasket in the

Rear-Facing Imager Lens pocket.
3.
Press down on the Rear-Facing Imager Gasket

for 5 seconds to secure it to the pocket of the
Housing.
4.
Remove the liner from the Rear-Facing Imager

Gasket.
PAGE 82


Secondary-Microphone Gasket Assembly
Description
Reference #
SEAL,MIC 2
1.
Remove the Secondary-Microphone Gasket from

the carrier.
2.
Place the Secondary-Microphone Gasket into the

pocket of the Housing.
3.
Press down on the Secondary-Microphone

Gasket for 5 seconds to secure it to the Housing.
PAGE 83


Jumper-Flex Pad Assembly
Description
Reference #
PAD,PORON,JUMPER FLX BUCKET
1.
Remove the Jumper-Flex Pad from the carrier.
2.
Use the Tweezers to place the Jumper-Flex Pad

into the pocket of the Housing.
3.
Press down on the Jumper-Flex Pad for 5

seconds to secure it in the Housing.
PAGE 84


Speaker Pad Assembly
Description
Reference #
PAD,PAD, SPKR BACKER
1.
Remove the Speaker Pad from the carrier.
2.
Place the Speaker Pad into the pocket of the

Housing using the raised outline to align it.
3.
Press down on the Speaker Pad for 5 seconds to

secure it in the Housing.
PAGE 85


USB Module Assembly
Description
Reference #
ASSY,PWA,USB PCB MN BRD
SPRT,FRM,METAL, USB PCB
1.
Remove the USB-Module Frame Adhesive from

the carrier.
2.
Place the USB-Module Frame Adhesive in the

Daughter Board Assembly Fixture (4-00-Y610000), using the pins on side 1 side to align it.
PAGE 86


3.
Place the USB Module Frame in the fixture over

the USB-Module Frame Adhesive.
4.
Press down on the USB Module Frame for 5

seconds to secure the USB-Module Frame
Adhesive.
5.
Remove the USB Module Frame from the fixture.
6.
Remove the USB Module Adhesive from the

carrier.
7.
Place the USB Module Adhesive in the fixture,

using the pins on side 2 side to align it.
8.
Place the USB Module PCB in the fixture over

the USB Module Adhesive.
9.
Remove the adhesive liner from the USB-Module

Frame Adhesive.
10. Place the USB Module Frame into the fixture

over the USB Module PCB.
11. Press down on the USB Module Frame for 5
seconds to secure the USB Module Frame and
USB Module Adhesive to the USB Module PCB.
12. Remove the USB Module from the fixture.
PAGE 87


13. Remove the USB Module Adhesive liner.

14. Starting at the connector side of the module,
lower the USB Module into the pocket of the
Housing.
15. Press down on the USB Module for 5 seconds to
secure it in the Housing.
NOTE
The USB Module will be pressed in the Final
Press procedure after assembly of the phone is
complete.
// CAUTION //
Do not assemble the USB Module Cover at this
time. The USB Module must be press fit using the
Final Press procedure after assembly of the phone
is complete.
16. Verify that the USB Module connector is aligned
to the opening in the Housing. Make sure the
male connector pin is visible in the opening.
PAGE 88


Headset Jack Assembly
Description
Reference #
SEAL, HSJ, CALLISTO
HSJ, CALLISTO
1.
PAGE 89
Place the Headset Jack into the pocket of the

Housing, angling the top of the jack into the
pocket first.


2.
Place the Headset-Jack Gasket into the pocket

of the Housing.
3.
Verify that the Headset-Jack Gasket is fully

seated in the pocket.
PAGE 90


Battery Assembly
Description
Reference #
DIE CUT,ADHES,BAT
ASSY,BAT,LI POLY,FC40,SONY 2600MAH
TAPE,ADHES,KAPTON, CALLISTO BAT INSLTR
/// WARNING ///
// CAUTION //

Guidelines.

scrapped.
assembly.
Battery.
PAGE 91


1.
Remove the Battery Insulator tape from the

carrier.
2.
Place the Battery Insulator Tape on the Battery,

aligning the long edge of the tape to the long
edge of the Battery.
3.
Lower the Battery Insulator Tape onto the

Battery.
4.
Wipe the Battery Insulator Tape with a card to

smooth out any wrinkles and remove any air
bubbles.
5.
Remove the Battery Adhesive from the carrier.
6.
Place the Battery Adhesive into the Housing

pocket, aligning the long edge of the adhesive to
the long edge of the pocket.
7.
Press down on the Battery Adhesive to secure it

in the Housing.
PAGE 92


8.
Remove the Battery Adhesive Liner.
9.
Place the Battery into the Battery pocket in the

Housing, aligning the top edge of the Battery to
the top edge of the pocket.
10. Place the Housing into the Callisto Lens and

Battery Press Fixture (4-00-Y4-10000).
11. Place the Callisto Lens and Battery Press Fixture
into the Press (19501980).
12. Place the Battery Press Head (4-00-Y4-10000)
into the Press.
13. Verify that the Battery Connector is not between

the Housing and press head. Hold the Battery
Connector out and away from the press head.
// CAUTION //
Keep hands away from the press head during
operation. Injury and/or damage to equipment may
occur.
PAGE 93


14. Press the Battery for 10 seconds to secure it to

the Housing.
// CAUTION //
Do not damage the Battery Connector.

16. Feed the Battery Connector under and through
the Housing overpass.
PAGE 94


Loudspeaker Pad Assembly
Description
Reference #
PAD,SPEAKER, BOT
1.
Position the Callisto PCB Fixture (4-00-Y710000) with the cutout side facing up.
2.
Remove the Loudspeaker Pad from the carrier.
3.
Place the Loudspeaker Pad into the Callisto PCB

Fixture, using the pins in the fixture to align it.
PAGE 95


4.
Place the PCB in the fixture over the

Loudspeaker Pad.
5.
Press down on the PCB for 5 seconds to secure

the Loudspeaker Pad to the PCB.
PAGE 96


Loudspeaker Assembly
Description
Reference #
TRANSDUCER,OTHR,2V,LOUDSPEAKER, 8OHM, 3.65 X 12 X 17MM, IP67, IN"
1.
Position the Callisto PCB Fixture (4-00-Y710000) with the Bottom/Top side facing up.
2.
Place the PCB into the Callisto PCB Fixture (400-Y7-10000) with the shields facing up.
PAGE 97


3.
Place the Alignment Lid (4-00-Y7-10000) on the

fixture using the pins in the fixture to align it.
4.
Place the Loudspeaker into the pocket of the

Alignment Lid.
5.
Press down on the Loudspeaker to secure it to

the PCB.
6.
Remove the Alignment Lid from the fixture.
7.
Place the Callisto PCB Fixture into the Press

(19501980).
8.
Place the Callisto PCB Press Head (4-00-Y710000) into the Press.
9.
Press the Loudspeaker for 5 seconds to secure it

to the PCB.
PAGE 98


Top Frame and Bottom Frame Assembly
Description
Reference #
SUPPORT,FRAME,TOP AUDIO
DIE CUT,ADHES,FRAME, TOP AUDIO
SUPPORT,FRAME,BOTTOM AUDIO
DIE CUT,ADHES,FRAME, BOTTOM AUDIO
1.
2.
Remove the Top Frame Adhesive and Bottom

Frame Adhesive from the carriers.
3.
Place the Top Frame Adhesive and Bottom

Frame Adhesive in the Callisto PCB Fixture over
the PCB, using the pins in the fixture to align
them.
PAGE 99


4.
Place the PCB into the fixture over the adhesives

with the shield side facing up.
5.

(19501980).
6.
Place the PCB Press Head (4-00-Y7-10000) into

the Press.
7.
Press the PCB for 5 seconds to secure the Top

Frame Adhesive and Bottom Frame Adhesive to
the PCB.
NOTE
Leave the Callisto PCB Fixture and PCB Press
Head in the Press. They will be used again in
steps 11 through 13 of this procedure.
PAGE 100


8.
Remove the PCB from the fixture.
9.
Remove the adhesive liners from the Top Frame

Adhesive and Bottom Frame Adhesive.
10. Place the Bottom Frame on the PCB, aligning it

to the pins and PCB features.
11. Place the Top Frame into the Callisto PCB

Fixture.
PAGE 101


12. Place the PCB into the fixture over the Top
Frame with the shield side facing up.
13. Press the PCB for 5 seconds to secure the Top

Frame and Bottom Frame to the PCB.
PAGE 102


Earpiece Speaker Assembly
Description
Reference #
TRANSDUCER,OTHR,.566V,W/ ADHES AND LINER
1.
Remove the Earpiece Speaker Adhesive liner.
2.
Insert the left side of the Earpiece Speaker into

the pocket on the Top Frame.
NOTE
The Earpiece Speaker has a keying feature on the
side and only fits in the pocket one way.
3.
PAGE 103
Lower the Earpiece Speaker into the pocket on

the Top Frame.


4.
5.
Place the PCB into the Callisto PCB Fixture with

the shield side facing up.
6.

(19501980).
7.
Place the PCB Press Head (4-00-Y7-10000) into

the Press.
8.
Press the PCB for 5 seconds to secure the

Earpiece Speaker to the Top Frame.
PAGE 104


Front-Facing Imager Assembly
Description
Reference #
ASSY,HSG,CAMERA, 5M, KT LENS
1.
Place the Front-Facing Imager into the pocket of

the Top Frame.
2.
Align the Front-Facing Imager Flex tail to the

Front-Facing Imager BtB Connector.
3.
Starting from the left side of the flex tail, roll a

finger over the Front-Facing Imager Flex tail to
engage the Front-Facing Imager BtB Connector.
PAGE 105


Front-Facing Imager Gasket Assembly
Description
Reference #
GSKT, CAMERA, 5MP
1.
Remove the Front-Facing Imager Gasket from

the carrier.
2.
Use the Tweezers to place the Front-Facing

Imager Gasket on the Front-Facing Imager in the
pocket of the Top Frame.
3.
Press down on the Front-Facing Imager Gasket

for 5 seconds to secure it to the Front-Facing
Imager.
PAGE 106


Rear-Facing Imager Assembly
Description
Reference #
ASSY, HSG, CAMERA, 13MP
KAPTON, CAMERA 13MP
1.
Insert the Rear-Facing Imager Flex into the

Rear-Facing Imager ZIF Connector. Use the
white line on the Rear-Facing Imager Flex as a
guide for insertion depth.
2.
Lower the Rear-Facing Imager into the retaining

tabs on the PCB.
3.
Slide a fingertip across the Rear-Facing Imager

Flex ZIF Connector Door to close it.
4.
Place Kapton Tape over the Rear-Facing Imager

Flex ZIF Connector.
5.
Remove the Rear-Facing Imager protective liner

if present.
PAGE 107


Light Diffuser Assembly
Description
Reference #
FILM, LIGHT DIFFUSER
1.
Remove the Light Diffuser from the carrier.
2.
Use the Tweezers to place the Light Diffuser into

the pocket of the Top Frame.
3.
Press down on the Light Diffuser for 5 seconds

to secure it to the Top Frame.
PAGE 108


Main-Microphone Gasket Assembly
Description
Reference #
SEAL,MIC 1
1.
Remove the Main-Microphone Gasket from the

carrier.
2.
Use the Tweezers to place the Main-Microphone

Gasket in the pocket of the Bottom Frame.
PAGE 109


Daughter Board Assembly
Description
Reference #
ADHESIVE, SIM/SD PCB
ADHESIVE, SIM/SD PCB #2
ADHESIVE, SIM/SD PCB #3
ASSY,PWA,DEV DAUGHTER BRD 2 SIM

ASSY,PWA,DAUGHTER BRD 1 SIM
1.
Remove the 3 Daughter Board Adhesives from

the carriers.
2.
Place the 3 Daughter Board Adhesives on the

Daughter Board using the etched marks on the
board to align them.
// CAUTION //
Do not allow the Daughter Board Adhesives to
overlap the edges or contacts on the Daughter
Board.
PAGE 110


3.
Remove the adhesive liners from the Daughter

Board Adhesives.
4.
Place the Daughter Board on the PCB, aligning

the holes in the Daughter Board to the screw
bosses on the PCB.
5.
Press down on the highlighted area of the

Daughter Board to engage the Daughter Board
BtB Connector.
6.
Press down on the Daughter Board for 5

seconds to secure it to the PCB.
// CAUTION //
Do not damage the Daughter Board contacts, SIM
slots, or micro SD slot.
7.
Place the 3 4IP Screws in the Daughter Board.
8.
Tighten the 4IP Screws to 1.10 in-lbs. (0.12 Nm)

in the sequence shown.
PAGE 111


Jumper Flex Assembly
Description
Reference #
ASSY, HSG,FLEX, JMPR
KAPTON, JUMPER FLEX ZIF - PCB
1.
Insert the Jumper Flex into the Jumper Flex ZIF

Connector. Use the white line on the Jumper
Flex and the etched markings on the PCB as
guides for insertion depth.
2.
Slide a fingertip across the Jumper Flex ZIF

Connector Door to close it.
3.
Place Kapton Tape over the Jumper Flex ZIF

Connector.
PAGE 112


Water Detection Label Assembly
Description
Reference #
DIE CUT,LDL
Place the WDLs on the PCB and Daughter

Board in the locations shown.
PAGE 113


PCB Assembly
Description
Reference #
ASSY,PCB,MN XCVR APAC UMTS DS 16GB

ASSY,PCB,MN XCVR LATAM UMTS DS 16GB (Brazil, Mexico)
ASSY,PCB,MN XCVR LATAM DS DTV (Brazil)
ASSY,PCB,MN XCVR LATAM UMTS DS (Brazil, Colombia)
ASSY,PCB,MN XCVR APAC UMTS DS
ASSY,PCB,MN XCVR LATAM DS DTV 16GB (Brazil)
ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS 16GB
ASSY,PCB,MN XCVR NORTH AMERICA UMTS SS
ASSY,PCB,MN XCVR TMOB (TMO) UMTS SS
ASSY,PCB,MN XCVR EUROPE UMTS SS
ASSY,PCB,MN XCVR LATAM UMTS SS (Brazil, Chile)
ASSY,PCB,MN XCVR VZW CDMA SS
ASSY,PCB,MN XCVR VZW CDMA SS 16GB
ASSY,PCB,MN XCVR LATAM UMTS SS 16GB (Brazil)
SCREW,THREAD FORMING (M1.2 L=4.2)
1(x4)
SCREW (YELLOW ZINC PLATING)
2(x10)
1.
PAGE 114
Remove all protective liners from the Housing,

PCB, Rear-Facing Imager, and Front-Facing
Imager.


2.
Connect the Battery Connector tail to the Battery

Connector on the PCB.
3.
Place the PCB into the Housing, beginning with

the side opposite the Side-Key Switches.
4.
Lower the PCB into the Housing.
PAGE 115


5.
Verify that the Side-Key Switches align with the

Side-Key Button Seals, and the holes in the
PCB, Top Frame, and Bottom Frame align with
the screw bosses in the Housing.
6.
Place the 10 4IP Machine Screws and 4 4IP

Thread-Forming Screws in the assembly.
Tighten all screws to 0.8 in-lbs. (0.09 Nm) in the
sequence shown below.
Verify that all screws are fully seated.
7.
8.
// CAUTION //
All screws must be fully seated and not crossthreaded. Damage to the Display may occur when
the Lens Display is pressed into the Housing.
10
13
14
2
1
PAGE 116
11
12


Speaker Bezel Assembly
Description
Reference #
BZL,EARPIECE, DARK
BZL,EARPIECE, BRIGHT
BZL,SPEAKER, DARK
BZL,SPEAKER, BRIGHT
PAGE 117


1.
Remove the adhesive liner from the Earpiece

Bezel.
2.
Place the Earpiece Bezel in the opening at the

top of the Display (1).
3.
Press down on the Earpiece Bezel for 5 seconds

to secure it to the Display.
4.
Remove the adhesive liner from the

Loudspeaker Bezel.
5.
Place the Loudspeaker Bezel in the opening at

the bottom of the Display (2).
6.
Press down on the Loudspeaker Bezel for 5

seconds to secure it to the Display.
PAGE 118


Display Adhesive Assembly
Description
Reference #
DIE CUT,ADHESIVE, LENS
PAGE 119


1.
Remove the Main-Microphone Gasket and FrontFacing Imager liners if present.
2.
Use cotton swabs and ISP Alcohol to clean the

Display bonding ledge, Top Frame, and Bottom
Frame. The Display bonding ledge is highlighted
in the photo.
// CAUTION //
Display bonding ledge, Top Frame, and Bottom
Frame cleaning is critical to the phones water
resistance. You must thoroughly clean the
surfaces with ISP Alcohol and allow it to dry
completely before applying 3M AP-111 Adhesion
Promoter.
3.
Wait for the ISP Alcohol to dry completely.
// CAUTION //
Do not use the same cotton swabs to clean with
ISP Alcohol and apply 3M AP-111 Adhesion
Promoter. The Display will not properly adhere to
the Housing if the cotton swabs are reused. The
cotton swabs may be used for 2 applications but
then must be discarded.
4.
Use cotton swabs to apply 3M AP-111 Adhesion

Promoter to the Display bonding ledge.
5.
Wait for the 3M AP-111 Adhesion Promoter to

dry.
6.
Remove the Display Adhesive from the carrier.
7.
Place the Display Adhesive into the Callisto Lens

Adhesive Fixture (4-00-Y5-10000).
PAGE 120


// CAUTION //
Verify that the ISP Alcohol and 3M AP-111
Adhesion Promoter have dried completely before
proceeding. Failure to do so can cause the
Display to improperly adhere and reduce the
phones water resistance.
8.
Place the Housing into the fixture over the

Display Adhesive.
9.
Press down on the Housing for 5 seconds to

secure the Display Adhesive.

11. Place the Housing into the Callisto Lens and
Battery Press Fixture (4-00-Y4-10000).
12. Place the Callisto Lens and Battery Press Fixture
into the Press (19501980).
13. Place the Lens Press Head (4-00-Y4-10000) into
the Press.
14. Press the Display Adhesive for 8 seconds to
secure it to the Housing.
PAGE 121


Display Assembly
Description
Reference #

PAGE 122


1.
Use cotton swabs and ISP Alcohol to clean the

Display bonding surface. The Display bonding
surface is highlighted in the photo.
// CAUTION //
Display bonding surface cleaning is critical to the
phones water resistance. You must thoroughly
clean the bonding surface with ISP Alcohol and
allow it to dry completely before applying 3M AP111 Adhesion Promoter.
2.
Wait for the ISP Alcohol to dry.
// CAUTION //
Do not use the same cotton swabs to clean with
ISP Alcohol and apply 3M AP-111 Adhesion
Promoter. The Display will not properly adhere to
the Housing if the cotton swabs are reused. The
cotton swabs may be used for 2 applications but
then must be discarded.
3.
Use cotton swabs to apply 3M AP-111 Adhesion

Promoter to the Display bonding surface.
4.
Wait for the 3M AP-111 Adhesion Promoter to

dry.
// CAUTION //
Verify that the ISP Alcohol and 3M AP-111
Adhesion Promoter have dried completely before
proceeding. Failure to do so can cause the
Display to improperly adhere and reduce the
phones water resistance.
5.
Insert the Display Flex into the Display Flex ZIF

Connector.
NOTE
If the phone is accidentally powered on, shut it
down by holding the Power Key and tapping
Power Off on the Display.
// CAUTION //
Do not damage or tear the Display Flex.
PAGE 123


6.
Verify that the Display Flex is fully inserted into

the Display Flex ZIF Connector. The cutouts on
the side of the flex end should not be visible.
// CAUTION //
The Display Flex must be correctly aligned and
fully inserted into the Display Flex ZIF Connector.
7.
Slide the flat end of the Blackstick across the

Display Flex ZIF Connector Door to close it.
8.
Place Kapton Tape over the Display Flex ZIF

Connector.
9.
Starting near the Display Flex, remove the

Display Adhesive liner in a counter-clockwise
motion.
PAGE 124


10. Lower the Display into the Housing.
11. Press down on the Display for 10 seconds to

secure the Display to the Housing.
NOTE
The Display will be pressed in Final Press after
assembly of the phone is complete.
PAGE 125


Final Press
NOTE
NOTE
Pre-Heat Method A and Pre-Heat Method B are

required procedures used to pre-heat the Display
Adhesive before final pressing of the assembled
phone. Either method can be used to pre-heat the
phone.
Optional Pre-Heat Method C is an optional preheat procedure that may be used if an Oven is not
available or not appropriate.
This Final Press procedure is for press fitting the

Display, Rear-Facing Imager Bezel, and USB
Module in the assembled phone.
Press Setup
1.
Place the Callisto Lens and Battery Press Fixture

(4-00-Y4-10000) into the Press (19501980).
2.
Place the Lens Press Head (4-00-Y4-10000) into

the Press.
// CAUTION //
If the USB Module Cover is assembled to the
Housing, remove the USB Module press insert
from the fixture.
PAGE 126


Pre-Heat Method A
1.
Place the Callisto Lens Removal Fixture bottom

plate (4-00-Y2-10000) into the Generic Lens
Removal Fixture (4-00-X2-10000/4-00-X710000).
// CAUTION //
If the Generic Lens Removal Fixture and Callisto
Lens Removal Fixture bottom plate are not
available or not appropriate, use Pre-Heat Method
B or Optional Pre-Heat Method C.
2.

the fixture ON.
3.

4.
Place the phone on the Callisto Lens Removal

Fixture bottom plate in the Generic Lens
Removal Fixture.
5.
6.
Remove the phone from the fixture.
// CAUTION //
phones.
7.
PAGE 127
Continue to Phone Press on page 130.


Pre-Heat Method B
1.
Pre-heat the Oven to 70 C (158 F).
// CAUTION //
If the Oven is not available or not appropriate, use
Pre-Heat Method A or Optional Pre-Heat Method
C.
2.
Place the phone in the Oven.
// CAUTION //
Do not set the Oven temperature higher than
70 C (158 F). Damage to the phone may occur.
3.
4.
Remove the phone from the Oven.
// CAUTION //
phones.
5.
PAGE 128


Optional Pre-Heat Method C

1.
Place the Callisto Pre-Heat Fixture (4-00-Y810000) into the Generic Lens Removal Fixture
(4-00-X2-10000/4-00-X7-10000).
// CAUTION //
If the Generic Lens Removal Fixture and Callisto
Pre-Heat Fixture are not available or not
appropriate, use Pre-Heat Method A or Pre-Heat
Method B.
2.

the fixture ON.
3.

4.
Place the phone Callisto Pre-Heat Fixture.
5.
6.
Remove the phone from the fixture.
// CAUTION //
phones.
7.
PAGE 129


Phone Press
1.
Place the phone in the Callisto Lens and Battery

Press Fixture.
2.
Press the phone for 18 seconds to secure the

Display, USB Module, and Rear-Facing Imager
Bezel to the Housing.
PAGE 130


USB Module Cover Assembly
Description
Reference #
COVER, USB
SCREW, MACHINE 4IP
1.
Place the USB Module Cover over the USB

Module.
2.
Place the 3 4IP Screws in the USB Cover.
3.
Tighten the 4IP Screws to 1.10 in-lbs.

(0.12Nm) in the sequence shown.
PAGE 131


Side Key Assembly
Description
Reference #
BTN,PWR, DARK
BTN,PWR BRT CHRM
BTN,VOLUME, DARK
BTN,VOLUME,BRIGHT CHRM
1.
Align the barbed posts and contacts on the

Volume Key with the holes in the side of the
Housing.
2.
Push the Volume Key into the Housing until the

barbed posts snap into the holes.
PAGE 132


3.
Align the barbed posts and contacts on the

Power Key with the holes in the side of the
Housing.
NOTE
The chamfered corners on the Power Key must
face the Display side of the phone.
4.
Push the Power Key into the Housing until the

barbed posts snap into the holes.
5.
Press the Volume Key and Power Key several

times to verify the tactile response.
PAGE 133


Rear Cover Assembly
Description
Reference #
ASSY,HSG,BATTERY COVER LIC

ASSY,HSG,BATTERY COVER CHALK
NOTE
The Rear Cover and Folio Cover assembly
methods are the same. When assembling a Folio
Cover, hold the Display cover portion of the Folio
Cover away from the phone during assembly.
1.
Remove the protective liner from the RearFacing Imager Bezel if present.
2.
Engage the hook features in the top edge of the

Rear Cover with the cutouts in the top edge of
the Housing.
NOTE
The Rear Cover must engage the Housing at an
angle, top edge first, as shown.
PAGE 134


3.
While holding the top edge of the Rear Cover in

position, engage the bottom-left corner snaps.
4.
While holding the top edge of the Rear Cover in

position, engage the bottom-right corner snaps.
PAGE 135


5.
PAGE 136
Engage the remaining snaps around the

perimeter of the phone and the Rear-Facing
Imager Bezel.


L2 Moto G (3rd Generation) Global Service and Repair Manual V2.0

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L2 Moto G (3rd Generation) Global Service and Repair Manual V2.0

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Moto G

Moto G (3rd Generation)

Moto G (3rd Generation)

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Battery Safety Guidelines .............................................................................................................................................. 7

Display Removal (Damaged Display Lens Only) ........................................................................................................... 29

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Rear-Facing Imager Bezel Removal ............................................................................................................................. 51

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Main-Microphone Gasket Assembly .......................................................................................................................... 109

USB Module Cover Assembly .................................................................................................................................... 131

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Battery Safety Guidelines

Ensure screws and screwdrivers do not contact the Battery.

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Figure 1. External Views

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Table 1. External Views Parts List

Rear-Facing Imager Deco Ring

Rear-Facing Imager Bezel

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Figure 2. PSCD Front View

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Figure 3. PSCD Rear View

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Figure 4. PSCD Side View

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Figure 5. Display Alignment

Motorola Mobility Confidential Restricted:

Moto G (3rd Generation)

Table 2. PSCD Gap Measurements

Earpiece Bezel to Main Lens Perimeter

Earpiece Bezel to Main Lens (Recess) Perimeter

Front-Facing Imager Eye to Main Lens Artwork Concentricity

Main Lens to Front Housing Perimeter

Main Lens to Front Housing Recess (Left and Right)

Loudspeaker Bezel to Main Lens (Recess) Perimeter

Loudspeaker Bezel to Main Lens Perimeter

Main Lens to Front Housing Recess (Top and Bottom)

Rear-Facing Imager Eye to Camera Lens Artwork Concentricity

Trim Ring to Camera Bezel Perimeter

Camera Lens to Trim Ring Perimeter

Flash Lens to Camera Bezel Perimeter

Camera Bezel to Rear Cover Perimeter

Camera Bezel to Rear Cover Step

Motorola Logo (tips of M) to Side of Rear Cover Rotation

Power Key to Front Housing Perimeter

Volume Key to Front Housing Perimeter

Rear Cover to Front Housing (Top, Bottom, and Sides)

Rear Cover to Front Housing Step

Lens Viewing Area Alignment (Horizontal)