MRS Thermal

Thermal Effects of CMP as a Particle
Augmented Mixed Lubrication Tribosystem

Gagan Srivastava, C. Fred Higgs III
Mechanical Engineering
Carnegie Mellon University
Particle Flow & Tribology Laboratory
MRS Spring Meeting 2013

April 2, 2013
San Francisco, California
Overview
Motivation
Past works
Modeling
Results
Parametric Studies
Conclusion
Motivation: Impact of Temperature on CMP
Kim et al. (2002)

CMP Thermal Literature

Thermal Analyses in CMP
Quantifying Temperature
TEHL
Modeling
Cheng et al. '65
Cheng et al. '01
Kim et al. '01
Wang et al. 04
Habchi et al. '08
Khan et al. '09
Modeling
Hocheng et al. '99
White et al. '03
Borucki et al. '04
Li et al. '04
Oh and Seok '08
Effect of Temperature on CMP
Experiments
Modeling
Experiments
Sugimoto et al. '95

Kim et al. '02
Hocheng and
Huang '04
Sampurno et al. '05
Yeomans et al. '06
Lee et al. '12
Hocheng et al. '99

Oh and Seok '08
Kakireddy et al. '08

Hocheng et al. '99
Eom et al. '08
Kim et al. '02
Objective
To model the thermal changes in the pad, wafer and
the slurry during CMP
PAML lite
Physical Interactions Captured in the Model

PAML lite
Fluid Mechanics
Contact Mechanics
Film thickness
Particle Dynamics
Uniform
Concentration
Size distribution
Separation
h = h(r,)
d = d(r,)
Hydrodynamic
Pressure
Elastic Contact
Material Removal
Rate
MRR = f(,w,,V)
Active Particles
= (z, F, E)
p = p[h, , ]
Wear
Nactive=f (G, , )
Equilibrium
Particle Indentation
= f (, Hw*, pd)
PAML-lite is a wafer scale model

Physical Interactions Captured in the THERMAL Model

PAML lite
Fluid Mechanics
Contact Mechanics
Film thickness
Separation
h = h(r,)
d = d(r,)
Hydrodynamic
Pressure
Elastic Contact
= (z, F, E)
p = p[h, , ]
Equilibrium
Particle Dynamics
Uniform
Concentration
Size distribution
Wear
Material Removal
Rate
MRR = f(,w,,V)
Thermal Effects
Pad, Wafer, Slurry
Temperature
T = f(,)
Active Particles
Nactive=f (G, , )
Particle Indentation
= f (, Hw*, pd)
PAML-lite allows full wafer scale temperature analysis

PAML - lite : Model Flowchart
PAML - lite : THERMAL Model Flowchart

START
Guess ,,0
Compute
new: ,,
Film thickness : h (,,0)

Reynold's
Equation
Winkler
Foundation
Find: fluid pressure

p(r,)
Find: contact stress

(r,)
Integrator
Fz,Mx,
My = 0
NO
Root Finder
YES
Equilibrium orientation
{,,}, p(r,), (r,)
Calculate Active
Particles
Calculate Average
Wear
Calculate Total Wear
Calculate Temperatures
THERMAL MODELING
Case I: Pad and wafer temperatures without slurry
Case II: Pad and wafer temperatures with slurry
12
Case I: (Temperatures Without Slurry) Methodology
Domains: Wafer, Pad
Interactions
Heat generation at asperity tips
Heat dissipation into pad and wafer
Case I: (Temperatures Without Slurry) Heat Generation
Flash heating concept
Frictional heat generation

Heat partition based on bulk temperatures
and thermal properties of the material
T1
Assumptions
Ignored heat generation due to chemical

reactions, plastic deformation or abrasive action
Adiabatic edges of the solids
T2
Blok's conjecture Temperature at the

asperities are equal
Case I: (Temperatures Without Slurry) Heat Dissipation
Conductive heat transfer across the body
Individually solved for both pad and wafer
Coupled by the heat source (asperities)
Case I: (Temperatures Without Slurry) Temperatures
Pad Temperature
Wafer Temperature
After 6 sec of actual time
Case I: Temperatures in Pad and Wafer

TOO HOT!
Wafer
After 20 sec of actual time

Overview
Domains: Wafer, Pad, Slurry
Interactions
Heat generation at asperity tips
Dissipation of generated heat into pad and wafer
Extraction of heat through the fluid
Heat generation in the fluid
Case II: (Temperatures With Slurry) Heat Generation
Flash heating concept
Frictional heat generation

Heat partition based on bulk temperatures
and thermal properties of the material
T1
Assumptions
Ignored heat generation due to chemical

reactions, plastic deformation or abrasive action
Adiabatic edges of the solids
T2
Blok's conjecture Temperature at the

asperities are equal
Thermal Effects of CMP as a Particle

Augmented Mixed Lubrication Tribosystem
Gagan Srivastava, C. Fred Higgs III
Mechanical Engineering
MRS Spring Meeting 2013

April 2, 2013
San Francisco, California
20
Case II: (Temperatures With Slurry) Heat Dissipation
Conductive heat transfer across the body

- qconv
- qconv
Individually solved for both pad and wafer
Coupled by the heat source (asperities)

and source/sink (fluid)
Case II: (Temperatures With Slurry) Heat Extraction
Convective heat transfer from the solids to the fluid
Two-way coupling at the solid-fluid

interface
Solid Fluid (Temperature)
Twafer
Fluid Solid (Heat flux)
WAFER
q (flux)
FLUID
Tpad
PAD
Case II: Temperature Variation in the Pad
Case II: Temperature Variation in Wafer and Slurry
24
Results
25
Material Removal: Model Validation

Change in average temperature rise, with process parameters
Temperature Rise vs Energy Input

(In terms of applied pressure and platen speed)
0.09
0.08
Increase in Temperature (deg C)
0.07
0.06
0.05
0.04
Kim et al. (2002)
0.03
0.02
0.01
0
0
10000
20000
30000
40000
50000
60000
70000
80000
P*V (g/cm2 * m/min)
26
Parametric Studies
Heat generation properties

MRR and Temperature Rise vs Viscosity of the Slurry
0.008
45
MRR
deltaT
0.007
40
35
30
0.005
25
0.004
20
0.003
MRR (nm/min)
Temperature Rise (deg C)
0.006
15
0.002
10
0.001
0
0
0.002
0.004
0.006
0.008
0.01
0
0.012
Viscosity (Pa-s)
27
Parametric Studies
Conduction / Convection Properties

Temperature Rise for Different Fluid Conductivities
0.06
0.05
0.04
0.03
0.02
0.01
Kpad
0.1
10
100
Kwafer
Thermal Conductivity of Fluid (W/m-K)
28
Conclusion
A new approach to model thermal effects during CMP has

been presented
The approach was able to justify the presence of slurry as a heat
extraction medium
The model predictions match well with the experimental observations
The model showed higher average temperatures for higher
values of viscosities
Predictive capabilities of the model will allow us to engineer
consumables better
29
Acknowledgements
Philip and Marsha Dowd Seed Fund
Cabot Microelectronics (In kind contributions)
30
QUESTIONS ?
APPENDIX

MRS Thermal

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Thermal Effects of CMP as a Particle

Augmented Mixed Lubrication Tribosystem

MRS Spring Meeting 2013

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Motivation: Impact of Temperature on CMP

Kim et al. (2002)

Particle Flow & Tribology Laboratory

CMP Thermal Literature

Carnegie Mellon University

Effect of Temperature on CMP

Sugimoto et al. '95

Hocheng et al. '99

Kakireddy et al. '08

Particle Flow & Tribology Laboratory

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Physical Interactions Captured in the Model

PAML-lite is a wafer scale model

Particle Flow & Tribology Laboratory

Physical Interactions Captured in the THERMAL Model

PAML-lite allows full wafer scale temperature analysis

Particle Flow & Tribology Laboratory

PAML - lite : Model Flowchart

Carnegie Mellon University

Particle Flow & Tribology Laboratory

PAML - lite : THERMAL Model Flowchart

Film thickness : h (,,0)

Find: fluid pressure

Find: contact stress

Calculate Total Wear

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Case I: (Temperatures Without Slurry) Methodology

Domains: Wafer, Pad

Heat generation at asperity tips

Heat dissipation into pad and wafer

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Case I: (Temperatures Without Slurry) Heat Generation

Flash heating concept

Frictional heat generation

Ignored heat generation due to chemical

Blok's conjecture Temperature at the

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Case I: (Temperatures Without Slurry) Heat Dissipation

Conductive heat transfer across the body

Individually solved for both pad and wafer

Coupled by the heat source (asperities)

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Case I: (Temperatures Without Slurry) Temperatures

After 6 sec of actual time

Carnegie Mellon University

Particle Flow & Tribology Laboratory

Case I: Temperatures in Pad and Wafer

After 20 sec of actual time

Particle Flow & Tribology Laboratory

Domains: Wafer, Pad, Slurry

PV (g/cm2 m/min)