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SERVICESERVICE MANUALMANUAL FORFOR

85158515

SERVICE SERVICE MANUAL MANUAL FOR FOR 8515 8515 BY: Guangna Zhang Technical Maintenance Department/GTK MTC Oct.2007/R02

BY: Guangna Zhang Technical Maintenance Department/GTK MTC

Oct.2007/R02

SERVICE SERVICE MANUAL MANUAL FOR FOR 8515 8515 BY: Guangna Zhang Technical Maintenance Department/GTK MTC Oct.2007/R02

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Contents

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Contents 8515 8515 N/B N/B Maintenance Maintenance 1. Hardware Engineering Speci fication ………………

1. Hardware Engineering Specification …………………………………………………………………….

1.1 Introduction ………………………………………………………………………………………………………………

1.2 System Hardware Parts ………………………………………………………………………

1.3 Other Functions ……………………………………………………………………………………… ………………

1.4 Peripheral Components …………………………………………………………………………………………………

1.5 Power Management ………………………………………………………………

……………………………………

2. System View and Disassembly …………………………………………………………………………

2.1 System View ………………………………………………………………………………………………………………

2.2 Tools Introduction ………………………………………………………………………………………………… ……

2.3 System Disassembly ………………………………………………………………………………………………………

3. Definition & Location of Connectors/Switches ………………………………………………………….

3.1

Mother Board …………………………………………………………………………………………………

4. Definition & Location of Major Components …………………………………………………………

4.1

Mother Board …………………………………………………………………………………………………

5. Pin Description of Major Component …….……………………………………………………………

5.1 Intel Merom Processor CPU ………………………………………………………………….…………………………

5.2 VIA VN896 North Bridge ……………………………………………………………………… ………………………

5.3 VIA VT8237A South Bridge …………………………………………………………………………………………….

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Contents 8515 8515 N/B N/B Maintenance Maintenance 6. System Block Diagram

6. System Block Diagram …………………………………………………………………………………….

7. Trouble Shooting ………………………………………………………………………………………….

7.1 No Power …………………………………………………………………………………………………………….……

7.2 No Display ………………………………………………………………………………………………………………

7.3 Graphics Controller Test Error LCD No Display ……………………………………………

7.4 External Monitor No Display ……………………………………………………………………………………………

7.5 Memory Test Error …………………………………………………………………………………………… ………

7.6 Keyboard (K/B) or Touch-Pad (T/P) Test Error ………………………………………………………………….…

7.7 Hard Disk Drive Test Error …………………………………………………………………………………………….

7.8 ODD Drive Test Error …………………………………………………………………………………………….……

7.9 USB Port Test Error ………………………………………………………………………………………………… …

7.10 Audio Test Error ………………………………………………………………………………………………………

7.11 LAN Test Error …………………………………………………………………………………………….………

7.12 Mini Express (Wireless) Socket Test Error …………………………………………….………………….………….

7.13 Express Card Socket Test Error ………………………………………………………………….……………

8. Reference Material …………………………………………………………………………………………

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1. Hardware Engineer Specification

1.1 Introduction

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The 8515 motherboard implements CORE 2 DUO processor for mobile, 667 MT/s (667 MHz) and 800 MT/s (800 MHz) FSB support. 478-pin Micro-FCPGA packages.

8515 platform implements VN896CE/VT8237A core logic. The VN896CE integrates VIA’s most advanced system

controller with high-performance UniChrome Pro 3D/2D graphics and video controller, LCD panel and TV-Out

interfaces. The VN896 provides superior performance between the CPU, PCIe, DRAM, V-link and internal AGP 8x

graphics controller with pipelined, burst and concurrent operation.

The VN896CE supports 800/667 MHz FSB Intel Pentium M/Merom super-scalar processors. The VN896CE

implements a deep In-Order Queue and supports Intel Hyper-Threading Technology to maximize system performance

for multithreaded software applications. The VN896 supports 64-bit memory data bus access and up to 2 double-sided

DDR2 667 / 533 for 4 GB maximum physical memory. The VN896CE includes a PCI Express 1.0a compliant PCI

Express controller, which supports up to two high bandwidth PCIe ports. A 16-Lane port, with up to 4 GB/sec bi-

directional data transfer rate, is implemented to support high-end PCI Express compliant graphics controller, and

another 1-Lane port designed for PCIe peripheral devices. The VN896CE North Bridge interfaces to the South Bridge through a high speed (up to 533 MB/sec) 8x 66 MHz Data Transfer interconnect bus called V-link interface.

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The VT8237A integrates extensive peripheral controllers for modern, state-of-the-art PC systems:

Dual-channel serial ATA/RAID controller

Dual-channel enhanced IDE controller IEEE 802.3 compliant 10/100 Mbps Ethernet MAC with MII interface to external PHY receiver Universal serial bus controller with eight USB 2.0 ports Full System Management Bus (SMBus) interface

Keyboard controller with PS/2 mouse support

Real time clock with 256 bytes extended CMOS

Power management unit compliant with ACPI and legacy APM requirements

Plug and play functions with steerable PCI interrupts

User expendable peripheral interface built on 8515 system are 4 USB ports. 8515 system provides a New card/Express

card and Mini PCI-E card. User interface includes internal keyboard, touch pad. Realtek ALC268 High Definition

(Azalia) Audio Codec based multimedia interface includes built-in stereo speaker, Microphone-in and headphone-out

audio jacks. There are two communication VIA VT6103L Ethernet PHY to support RJ-45 LAN jack and Modem

module to support Modem RJ11 jack.

A full set of software drivers and utilities are available to allow advanced operating systems such as Windows Vista

and Windows XP to take full advantage of the hardware capabilities. Features such as bus mastering IDE, plug and

play, Advanced Configuration Power Interface (ACPI) with application restart, software-controlled power shutdown.

Following chapters will have more detail description for each individual sub-systems and functions.

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1.2 System Hardware Parts

CPU

Mobile Merom Celeron/Pentium M CPU Thermal spec 35 W TDP

Core Logic

VIA VN896CE + 8237A chipset

System BIOS

Phoenix BIOS

512

Include system BIOS

Plug & play capability

KB flash EPROM

ACPI

Memory

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MB DDRII 533 SDRAM memory on board

0

2

1.25-inch height memory module supported

200

Support 2048 MB

memory SO-DIMM slots for memory expansion

pins DDRII 533 SDRAM SO-DIMM memory module

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Support 2.5" 60 GB/80 GB/100 GB/120 GB HDD (9.5 mm)

5400/7200 rpm, PATA, SATA I/F

ODD

Combo/DVD-Dual, super multi (12.7 mm)

Display

15.4" WXGA, resolution: 1280x800

Clock Generator

ICS 953009 and DDRbuffer ICS 9P956, LVDS ICS MK1707

VGA Control

Internal VIA VN896CE

LVDS Transmitter

VIA VT1637

LAN

VIA VT6103L

Express Card

Power switch TPS2231

Audio System

Built-in sound system Azalia I/F (HD Audio codec, ALC268) Built-in stereo speaker Sound volume control by S/W

2

CH

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Modem

6 Kbps (V.92) fax modem (MDC (Azalia I/F)) and 10/100 (Reserved for 1000) Base-TX LAN

Wireless LAN

Wireless LAN Intel (Mini PCI-E Interface IEEE802.11 b, g)

Keyboard Controller (CIR)

WINBOND W83L951D

USB

USB2.0 x4 (Individual)

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1.2.1 CPU Mobile Intel Merom CPU Processor

1.2.1.1 Mobile Intel Merom CPU Processor

Processor support

CORE 2 DUO processor for mobile

667 MT/s (667 MHz) and 800 MT/s (800 MHz) FSB support

On-die, 2-MB second level cache with advanced transfer cache architecture shared between the two cores

Advance gunning transceiver logic (AGTL +) bus driver technology

Enhanced Intel speed step technology to enable real-time dynamic switching between multiple voltage and

frequency points

Source synchronous double-pumped (2×) address

Source synchronous quad-pumped (4×) data

Other key feature are:

Support for DBI (Data Bus Invor ersion)

Support for MSI (Message signaled interrupt)

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32-bit interface to address up to 4 GB of memory

A12 deep In-Order Queue to pipeline FSB commands

AGTL+ bus driver with integrated AGLT termination resist

478-pin Micro-FCPGA and 49-ball Micro-FCBGA packages

VCCA 1.5 V

VCCP 1.05 V

Merom based Intel Pentium M Processor Feature

On-die 1 MB second level cache with advance transfer cache architecture shared between the two cores

478-pin Micro-FCPGA packages

VCCA 1.5 V

VCCP 1.05 V

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1.2.2 Clock Generator

1.2.2.1 ICS 953009 System Frequency Synthesizer

Recommended Application

VIA VN896CE systems using Intel Merom processors

Output Features

2 – 0.7 V current-mode differential CPU pairs

1 – 0.7 V current-mode differential CPU/PCI-Express selectable pair

7 – PCI, 33 MHz

2 – REF, 14.318 MHz

3 – 3 V66, 66.66 MHz

1 – 48 MHz

1 – 24/48 MHz

5 – PCI-Express 0.7 V current mode differential pairs

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Features/Benefits

Programmable output frequency

Programmable asynchronous 3 V66&PCI frequency

Programmable asynchronous PCI-Express frequency

Programmable output divider ratios

Programmable output skew

Programmable spread percentage for EMI control

Watchdog timer technology to reset system if system malfunctions

Programmable watch dog safe frequency

Support I2C index read/write and block read/write operations

Uses external 14.318 MHz reference input, external crystal load caps are required for frequency tuning

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1.2.2.2 DDR II Buffer ICS 9P956 System Frequency Synthesizer

Low skew, fanout buffer

I2C for functional and output control

Single bank 1-6 differential clock distribution

1 pair of differential feedback pins for input to output synchronization

Supports up to 2 DDR DIMMs

667 MHz DDR II output frequency support

Switching characteristics

Output – Output skew: <100 ps

Output rise and fall time for DDR outputs: 650 ps – 950 ps

Duty cycle: 47% - 53%

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1.2.2.3 VIA VN896CE North Bridge

Defines highly integrated solutions for value notebook PC designs

High performance UMA north bridge: Integrated VIA C7 and Intel Pentium M north bridge with 800 / 667/ 533 / 400 MHz FSB support. PCI express bus controller and UniChrome Pro 3D / 2D graphics & video controllers in a single chip

Advanced 64-bit SDRAM controller supporting DDR2 667/533 and DDR 400/333/266/200 SDRAM

Combines with VIA VT8237A/VT8237R plus for 10/100 LAN, ATA133 IDE, LPC, USB 2.0, serial ATA

and high definition audio (VT8237A)

37.5x37.5 mm HSBGA package (Ball grid array with heat spreader) with 952 balls and 1.00 mm ball pitch

CPU interface

Supports 800/667/533/400 MHz FSB VIA C7 and Intel Pentium M processors

Supports Intel hyper-threading technology

Supports DBI (Dynamic Bus Inversion)

Supports trust configuration cycle

Deep In-order Command Queue (IOQ)

Integrated CPU-to-DRAM write buffers and CPU-to-DRAM read prefetch buffers

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Built-in phase lock loop circuitry for optimal skew control within and between clocking regions

Memory interface

Supports DDR2 mode

Supports DDR2 667/533 memory

Supports mixed 64/128/256/512/1024/2048x8/16 DDR2 SDRAMs

Supports 2 unbuffered double-sided DIMMs and up to 4 GB of physical memory

Supports CL 2/3/4/5 for DDR2 667/533

Programmable I/O drive capability for memory address, data and control signals

DRAM interface pseudo-synchronous with host CPU for optimal memory performance

Concurrent CPU, PCIe, internal graphics controller and V-link access for minimum memory access latency

Rank interleave and up to16-bank page interleave (i.e., 16 pages open simultaneously) based on LRU to

effectively reduce memory access latency

Seamless DRAM command scheduling for maximum DRAM bus utilization (e.g., precharge other banks while accessing the current bank)

CPU read-around-write capability for non-stalled operation

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Speculative DRAM read before snoop result to reduce PCI master memory read latency

Supports Burst Read and Write operations with burst length of 4 or 8

Optional dynamic Clock Enable (CKE) control for DRAM power reduction during normal system state (S0)

Supports self-refresh and CAS-before-RAS DRAM refresh with staggered RAS timing

Advanced High Bandwidth PCI Express Interface

Supports PCI express 1.0a

Supports up to two PCI express ports

1st port: A 16-Lane port for high end graphics interface. Configurable lane width, 16/8/4/2/1, through

hand-shaking for transfer rate up to 4 GB/sec bi-directional

Supports two upstream virtual channels

2nd port: A 1-Lane port for peripheral devices

Supports interconnect power management

Supports polarity reversal

Supports trust configuration cycle

Supports hot plug

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Loop-back testing mode for easy debugging mode for PCI express

High bandwidth 533 MB/sec 8-bit V-link host controller

Supports 66 MHz, 4x and 8x transfer modes, V-link interface with 533 MB/sec total bandwidth

Half duplex transfers with separate command/strobe for 4x 8-bit mode and full duplex for 8x 4-bit mode

Request/data split-transaction

Transaction assurance for V-link host-to-client access eliminates V-link host-client retry cycles

Intelligent V-link transaction protocol to minimize data wait-state and throttle transfer latency to avoid data

overflow

Highly efficient V-link arbitration with minimum overhead

Integrated graphics with 2D/3D/video controllers

Optimized Unified Memory Architecture (UMA)

Supports 16/32/64 MB frame buffers size

Graphics engine clocks up to 333 MHz decoupled from memory clock

Internal AGP 8x performance

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Two 128-bit internal data paths between north bridge and graphics core for frame buffer and texture/command access

2D acceleration features

128-bit 2D graphics engine

Supports ROP3, 256 operations

Supports 8 bpp, 15/16 bpp and 32 bpp color depth modes

BitBLT (Bit Block Transfer) functions including alpha BLTs

Color expansion, source color key and destination color key

Bresenham line drawing/style line function

Transparency mode

3D acceleration features

3D graphics processor

- 128-bit 3D graphics engine

- Dual pixel rendering pipes

- Dual texture units

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- Floating-point setup engine

- Internal full 32-bit ARGB format for high rendering quality

- 8 K texture cache

- Linear address

Capability

- Supports ROP2

- Supports various texture formats, including: 16/32 bbp ARGB, 8 bbp palletized (ARGB), YUV 422/420

and compressed texture (DXTC)

- Texture sizes up to 2048x2048

- High quality texture filter for Nearest, Linear, bi-linear, tri-linear and anisotropic modes

- Flat and gouraud shading

- Vertex fog and fog table

- Z-Bias, LOD-Bias, polygon offset, edge anti-aliasing and alpha blending

- Bump mapping and cubic mapping

- Hardware back-face culling

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- Specular Lighting

- 16/32-bit Z test and 24+8 Z+ stencil test support

Performance

- Two textures per pass

- Triangle rate up to 4.5 million polygons per second

- Pixel rate up to 400 million pixels per second for 2 textures each

- Texel bilinear fill rate up to 266 million texels per second

- High quality dithering

Extensive display support for external video output

A dedicated CRT interface

Supports three 12-bit digital video ports

- Multiplexed DVP0 and DVP1 for LVDS transmitter

- Dedicated DVP2 for TV encoder

CRT display

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- CRT display interface with 24-bit true-color RAMDAC up to 300 MHz pixel rate with gamma correction capability

- Supports CRT resolutions up to 2048x1536 at 75 Hz

12-bit DDR/18-bit/24-bit LVDS transmitter interface for LCD panel

- 12-bit DDR and clock rate up to 165 MHz

- Built-in digital phase adjuster to fine tune signal timing between clock and data bus

Advanced system power management support

ACPI 2.0 and PCI bus power management 1.1 compliant

Supports suspend-to-DRAM (STR) and DRAM self refresh

Supports dynamic Clock Enable (CKE) control for DRAM power reduction during normal system state (S0)

Supports SMI, SMM and STPCLK mechanisms

Supports enhanced Intel Speedstep technology

Low-leakage I/O pads

Advanced graphics power management support

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Built-in reference voltage generator and monitor sense circuits

Automatic panel power sequencing and VESA DPMS (Display Power Management Signaling) CRT power-down

External I/O signal controlling enabling graphics accelerator into standby/suspend-off state

Auto clock gating for each engine to achieve power saving

I2C serial bus and DDC monitor communications for CRT plug-and-play configuration

1.2.2.4 VIA VT8237A South Bridge

High bandwidth 1 GB/sec ultra V-link controller

Supports 16-bit, 66 MHz, 4x and 8x transfer modes, Ultra V-link interface with 1 GB/sec maximum bandwidth

Full duplex, with separate 8-bit Up and Down data path and command/strobe, in 8x mode

Half duplex, with 16-bit data bus, in 4x mode

Request/data split transaction

Transaction assurance for V-link host to client access eliminates V-link host-client retry cycles

Intelligent V-link transaction protocol to minimize data wait-state, throttle transfer latency to avoid data overflow

Highly efficient V-link arbitration with minimum overhead

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Dual channel serial ATA/RAID controller

Complies with serial ATA specification revision 1.0

Dual Channel master mode PCI

On-chip two-channel Serial ATA (S-ATA) PHY for support of up to two S-ATA devices directly

S-ATA devices can be configured in multiple RAID configurations – supports RAID Level 0, RAID Level 1

and JBOD

S-ATA drive transfer rate is capable of up to 150 MB/s per channel (serial speed of 1.5 Gbit/s)

External crystal input for serial ATA port operation

Supports defer spin up and port multiplier

High definition (HD) audio controller

High definition audio controller with 192 KHz sample rate, 24-bit per sample and up to 8 channels

Microsoft UAA (Universal Audio Architecture) driver support

Up to four independent playback streams and audio codecs

Multiple recording channels for array microphone

Supports jack sensing/retasking

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Universal serial bus controller

Eight USB 2.0 ports with integrated PHY

One USB 2.0 root hub and four USB 1.1 root hubs

USB 2.0 and Enhanced Host Controller Interface (EHCI) v1.0 compliant

USB 1.1 and Universal Host Controller Interface (UHCI) v1.1 compatible

Integrated physical layer transceivers with optional over-current detection status on USB inputs

Eighteen level (doublewords) data FIFO with full scatter and gather capability

Legacy keyboard and PS/2 mouse support

One USB 2.0 debug port

Fast Ethernet controller

High performance PCI master interface with scatter/gather and bursting capability

Standard MII interface to external PHYceiver

1/10/100 MHz full and half duplex operation

Independent 2 K byte FIFOs for receive and transmit

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Flexible dynamically loadable EEPROM algorithm

Physical, broadcast, and multicast address filtering using hashing function

Magic packet and wake-on-address filtering

Software controllable power down

Ultra DMA-133/100/66/33 bus master EIDE controller

Dual channel hard disk controller supporting up to four enhanced IDE devices

Data transfer rate up to 133 MB/sec to cover PIO mode 4, multi-word DMA mode 2 and UltraDMA-133 interface

Dual DMA engines for concurrent dual channel operation

Full scatter gather capability

Supports ATAPI compliant devices including DVD devices

Supports PCI native and ATA compatibility modes

Bus master programming interface for SFF-8038i rev.1.0 and Windows-95 compliant

Complete software driver support

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System management bus interface

Compliant with System Management Bus (SMBus) revision 2.0

I2C devices compatible

Supports SMBus Address Resolution Protocol (ARP) by using host commands through software

Supports slave interface for external SMBus masters to control resume events

Supports alert on LAN II through a SMBus-interfaced register

Sophisticated mobile power management

ACPI 2.0 and APM v1.2 Compliant

Supports On Now power management

Supports Intel enhanced SpeedstepTM with dedicated pins

Supports PCI Express WAKE suspend resume event

Supports CPU clock throttling and clock stop during ACPI C0 / C1 / C2 / C3 states

Supports PCI clock run, Power Management Enable (PME) control, and PCI/CPU clock generator stop control

Supports multiple system suspend types: power-on suspends (POS) with flexible CPU/PCI bus reset options, suspend to DRAM (STR), and suspend to disk (soft-off), all with hardware automatic wake-up

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Multiple suspend power plane controls and suspend status indicators

Integrates an idle timer, a peripheral timer and a general purpose timer, plus a 24/32-bit ACPI compliant timer

Supports normal, doze, sleep, suspend and conserve modes

Global and local device power control

Supports system event monitoring with two event classes

Primary and secondary interrupt differentiation for individual channels

Dedicated input pins for power and sleep buttons, external modem ring indicator, and notebook lid open/close

for system wake-up

32 general purpose input ports and 32 output ports

Multiple internal and external SMI sources for flexible power management models

Enhanced integrated Real Time Clock (RTC) with date alarm, month alarm, and century field

Thermal alarm on external temperature sensing circuit

I/O pad leakage control

Plug and play functions

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Steerable PCI interrupts

Steerable interrupts for integrated peripheral controllers

Microsoft Windows XPTM, Windows NTTM, Windows 2000TM, Windows 98TM and plug and play BIOS compliant

Integrated legacy functions

Integrated keyboard controller with PS2 mouse support

Integrated DS12885-style real time clock with extended 256 bytes CMOS RAM and day/month alarm for ACPI

Integrated DMA, timer, and interrupt controller

Serial IRQ for docking and non-docking applications

Fast reset and gate A20 operation

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1.2.3 VT1637 LVDS Transmitter

Supports single/dual LVDS transmitter function

Compatible with TIA/EIA-644 LVDS standard

Supports LVDS 18-bit Output

Supports dual channel UXGA panel display

Supports 2D dither for 18-bit Panel

Supports DVO input mode with 25 to 165 MHz input clock

Programmable input clock and strobe select

Narrow bus reduces cable size and cost

PLL requires no external components

2.5 V core power for low power consumption

48-pin LQFP package (7x7x1.4 mm)

Available for lead-free package

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1.2.4 TI TPS2231 Single-Slot PC Card Power Interface Switch

1.2.5

Meets the express card™ standard (Express card 34 or express card 54)

Available in a 32-pin power PAD™ HTSSOP (Dual)

Compliant with the express card™ compliance checklists

– 40°C to 85°C ambient operating temperature range

Available in a 20-pin TSSOP, a 20-pin QFN, or 24-pin power PAD™ HTSSOP (Single)

Fully Satisfies the express card™ implementation guidelines

Supports systems with wake function

TTL-logic compatible inputs

Short circuit and thermal protection

Realtek ALC268 High Definition Audio System

Single-chip multi-bit sigma-delta converters with high S/N ratio

1 stereo DAC supports 16/20/24-bit PCM format with 44.1/48/96/192 KHz sample rate

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2 stereo ADCs support 16/20-bit PCM format with 44.1/48/96 KHz sample rate

Applicable for 2-channel 192 KHz DVD-audio solutions

Line-out, HP-out, Line 1, Line 2, MIC1, and MIC2 are stereo input and output re-tasking

MONO line level output to subwoofer speaker for 2.1 channel applications

High-quality differential CD analog input

External PCBEEP input is applicable, and internal BEEP generator is integrated

Power-off CD mode supported (Only in ALC268 & ALC268-LF)

Power management and enhanced power saving features

Power support: digital: 3.3 V; analog: 3.8 V/5.0 V

Selectable 2.5 V/3.75 V VREFOUT

Two jack detection pins (Each designed to detect 4 jacks)

Supports 44.1/48/96/192 KHz S/PDIF output

Supports 44.1/48/96 KHz S/PDIF input

48-pin LQFP packages (lead (Pb)-free packages also available)

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Supports external volume knob control

External PCBEEP Pass-Through when link is in RESET state (Not supported in the ALC268(D)-VE and

ALC268(D)-VE-LF)

–64 dB ~ +30 dB with 1 dB mixer gain resolution for finer volume control

Impedance sensing capability for each re-tasking jack

Built-in headphone amplifier for each re-tasking jack

Supports external volume knob control

Supports GPIO (General Purpose Input/Output) for customized applications

1.2.6 ANPEC APA2056 Audio Power Amplifier

Compatible with PC 99 desktop line-out Into 10-KW load

Internal gain control, which eliminates external gain-setting resistors

2-W/Ch output power Into 3-W load

Input MUX select terminal

PC-beep input

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Depop circuitry

Stereo input MUX

Fully differential input

Low supply current and shutdown current

Surface-mount power packaging 24-Pin TSSOP power PAD

1.2.7 Keyboard System – Winbond W83L951D Universal Keyboard Controller

Core logic

8-bit turbo 8052 microprocessor code based, speed up to 24 MHz

256 bytes Internal RAM

64 K bytes embedded programmable flash memory

2 K bytes external SRAM

Host interface

Software optional with LPC interface

Primary programmable I/O address communication port in LPC mode

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SMBus

Support 2 SMBus interface support master mode

Timers

Support four timer signal with three pre-scalars

Timer 1 and 2 shard the same pre-scalar and are free-running only

Timer X and Y have individual pre-scalar and support up to four control modes, free. Running, pulse output,

event counter and pulse width measurement

PWM

Support four PWM channels

PWM 0 and 1 are 8-bits and programmable frequency from 62 Hz to 7.5 KHz

PWM 2 and 3 are 16-bits and programmable frequency from 6 Hz to 3 MHz

Fan Tachometer

Support two fan tachometer input

A/D converter

Firmware programmable optional with 10-bit or 8-bit resolution

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Support eight channels

D/A converter

8-bit resolution

Support two channels

PS2

Support three hardware PS2 channels

Optional PS2 clock inhibit by hardware or firmware

Keyboard controller

Support 16*8 keyboard matrix-scan, expanding to 18*8 and 20*8

GPIO

Support 104 useful GPIO pins totally and bit–addressable to facility firmware coding

Flash

Support external on-board 64 K flash via matrix interface (GP0, 1, 3)

CIR

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Support decoding for the NEC consumer IR remote control format

RTC

Real time clock generator with 32.768 KHz input

ACPI

Support ACPI appliance

Secondary programmable I/O address communication port in LPC mode

Package

128 pin QFP and 128 pin LQFP package options

1.2.8 System Flash Memory (BIOS) – SST49LF004B

512 K x 8 (4 Mbit)

Flexible erase capability

Uniform 4 KByte sectors

Uniform 64 KByte overlay blocks

Chip-erase for PP mode only

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Single 3.0-3.6 V read and write operations

Real time clock generator with 32.768 KHz input

Superior reliability

Endurance: 100,000 cycles (typical)

Greater than 100 years data retention

Low power consumption

Active read current: 6 mA (typical)

Standby current: 10 µA (typical)

Fast sector-erase/byte-program operation

Sector-erase time: 18 ms (typical)

Block-erase time: 18 ms (typical)

Chip-erase time: 70 ms (typical)

Byte-program time: 14 µs (typical)

Chip rewrite time: 8 seconds (typical)

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Two operational modes

Low Pin Count (LPC) interface mode forin-system operation

Parallel Programming (PP) mode for fast production programming

LPC interface mode

5-signal LPC bus interface supporting byte read and write

33 MHz clock frequency operation

WP# and TBL# pins provide hardware write protect for entire chip and/or top boot block

Block locking registers for individual block write-lock and lock-down protection

JEDEC standard SDP command set

Data# polling and toggle bit for end-of-write detection

5 GPI pins for system design flexibility

4 ID pins for multi-chip selection

Parallel Programming (PP) mode

11-pin multiplexed address and 8-pin data I/O interface

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Supports fast programming in-system on programmer equipment

CMOS and PCI I/O compatibility

1.2.9 VIA VT6103L 10Base – T/100Base – TX Integrated Ethernet LAN PHY/Transceiver

Single chip 100Base -TX/10Base -T physical layer solution

Dual speed – 100/10 Mbps

Half and full duplex

MII interface to Ethernet controller

MII Interface to Configuration & Status

Auto power saving mode

Auto negotiation: 10/100, full/half duplex

Meet all applicable IEEE 802.3, 10Base -T and 100Base -Tx standards

On chip wave shaping – no external filters required

Adaptive equalizer

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Baseline wander correction

LED outputs

Link status

Duplex status

Speed status

Collision

48 pin SSOP package

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1.3 Other Functions

1.3.1 Hot Key Function

Keys

Combination

Feature

Meaning

Fn + F1

Wireless LAN on/off

Enable or disable wireless LAN function

Fn + F2

Fn + F3

Volume down

Audio volume down

Fn + F4

Volume up

Audio volume up

Fn + F5

LCD/external CRT switching

Rotate display mode in LCD only, CRT only

and simultaneously display

Fn + F6

Brightness down

Decreases the LCD brightness

Fn + F7

Brightness up

Increases the LCD brightness

Fn + F8

Fn + F9

Fn + F10

Mute off/on

Toggle mute on/off

Fn + F11

Panel off/on

Toggle panel on/off

Fn + F12

Suspend to DRAM/HDD

Force the computer into either suspend to HDD or

suspend to DRAM mode depending on BIOS setup

1.3.2 Quick Key Function

Internet, e-mail, P1

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1.3.3 Power on/off/suspend/resume Button

1.3.3.1 APM Mode

At APM mode, power button is on/off system power

1.3.3.2 ACPI Mode

At ACPI mode, windows power management control panel set power button behavior. You could set "standby",

"power off“ or "hibernate” (Must enable hibernate function in power management) to power button function.

Continue pushing power button over 4 seconds will force system off at ACPI mode

1.3.4

Cover Switch

System automatically provides power saving by monitoring cover switch. It will save battery power and prolong

the usage time when user closes the notebook cover

At ACPI mode there are three functions to be chosen at windows XP power management control panel

None

Standby

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Off

Hibernate (Must enable hibernate function in power management)

1.3.5 LED Indicators

System has six status LED indicators to display system activity, which include six above keyboard

1.3.5.1 Six LED Indicators Above Keyboard

From left to right that indicates WLAN, power status, battery charge status, caps lock status, num lock status,

HDD/ODD status

WLAN power status

On: WLAN power on

Off: WLAN power off

Power status

On: System power on

Off: Suspend to RAM power management mode (Flash rate: 1 Hz)

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Off: System power off

Battery charge status

Green: Battery was fully charged (AC mode)

Orange: Battery was under charging (AC mode)

Red (Flash): Battery low (Under 10%, battery mode, flash rate: 1 Hz)

CAPS lock status

Green: Active state

NUM lock status

Green: Active state

HDD/ODD status

The LED light green when HDD or ODD is working

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1.3.6 Battery Status

1.3.6.1 Battery Warning

System also provides battery capacity monitoring and gives user a warning so that users have chance to save his data before battery dead. Also, this function protects system from mal-function while battery capacity is low

Battery warning: Capacity below 10%, battery capacity LED flashes per second, system beeps per 2 seconds

System will suspend to HDD after 2 minutes to protect users data

1.3.6.2

Battery Low State

After battery warning state, and battery capacity is below 5%, system will generate beep sound for twice per

second

1.3.6.3

Battery Dead State

When the battery voltage level reaches 7.4 volts, system will shut down automatically in order to extend the battery packs' life

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1.3.7 Fan Power on/off Management

1.3.7.1 CPU Fan

FAN is controlled by W83L951D embedded controller-using ADM1032 to sense CPU temperature and W83L951D PWM control fan speed. Fan speed is depended on CPU temperature. Higher CPU temperature will get faster fan speed

1.3.8 CMOS Battery

There is a standard CR2032 3 V 220 mAh lithium coin battery to supply RTC power. When AC in or system

main battery inside, CMOS battery consumes no power to save coin battery’s life cycle

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1.4 Peripheral Components

1.4.1 LCD Panel

15.4" WXGA, resolution: 1280x800

1.4.2 HDD

Support 2.5" 60 GB/80 GB/100 GB/120 GB HDD (9.5 mm) 5400/7200 rpm, PATA, SATA I/F

1.4.3 ODD

Combo/DVD-dual, super multi (12.7 mm)

1.4.4

DDR SO - DIMM

0 MB DDRII 533 SDRAM memory on board

2 memory SO- DIMM slots for memory expansion

200 pins DDRII 533 SDRAM SO-DIMM memory module

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1.4.5 Keyboard

European keyboard layout

19 mm key pitch/3 mm stroke

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1.5 Power Management

The 8515 system has built in several power saving modes to prolong the battery usage. User can enable and configure different degrees of power management modes via ROM CMOS setup (Booting by pressing F2 key). Following are the descriptions of the power management modes supported

1.5.1 System Management Mode

Full on mode

In this mode, each device is running with the maximal speed. CPU clock is up to its maximum

Doze Mode

In this mode, CPU will be toggling between on & stop grant mode either. The technology is clock throttling.

This can save battery power without loosing much computing capability. The CPU power consumption and

temperature is lower in this mode

Standby Mode

For more power saving, it turns of the peripheral components. In this mode, the following is the status of each device

- CPU: Stop grant

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- LCD: Backlight off

- HDD: Spin down

Suspend to DRAM

The most chipset of the system is entering power down mode for more power saving. In this mode, the following is the status of each device

- CPU: Off

- Twister K: Partial off

- VGA: Suspend

- PCMCIA: Suspend

- Audio: Off

- SDRAM: Self refresh

Suspend to HDD

All devices are stopped clock and power-down. System status is saved in HDD. All system status will be restored when powered on again

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1.5.2 Battery Only Power off Mode

The 8515 system has built in battery only power off mode to prolong the battery usage. In this mode, Universal Keyboard Controller (KBC) will be power off. In addition, the system leakage current shall be less than 0.5 mA, therefore system power consumption is lower in this mode

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2. System View and Disassembly

2.1 System View

2.1.1 Front View

Top Cover Latch

2.1.2

Left-side View

USB Port*1

Power Jack

Ventilation Openings

HP Jack

External MIC Jack

Express Card Socket

Latch 2.1.2 Left-side View USB Port*1 Power Jack Ventilation Openings HP Jack External MIC Jack Express
○

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2.1.3 Right-side View

ODD Drive

2.1.4 Rear View

Kensington Lock

RJ-11 Connector

RJ-45 Connector

USB Port*2

CRT Connector

USB Port*1

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RJ-11 Connector RJ-45 Connector USB Port*2 CRT Connector USB Port*1 8515 8515 N/B N/B Maintenance Maintenance

○

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2.1.5 Bottom View

Battery Park

CPU & DDR2 SO-DIMM & Mini Express Card (Wireless) & HDD

DDR2 SO-DIMM & Mini Express Card (Wireless) & HDD 2.1.6 Top-open View LCD Screen Device LED

2.1.6

Top-open View

LCD Screen

Device LED Indicators

Mail/Internet/P1 Button

Power Button

Keyboard

Stereo Speaker Set

Internal MIC

Touch Pad

Screen Device LED Indicators Mail/Internet/P1 Button Power Button Keyboard Stereo Speaker Set Internal MIC Touch Pad

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2.2 Tools Introduction

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1. Screw driver with bit size for notebook assembly & disassembly.

with bit size fo r notebook assembly & disassembly. 2 mm 2 mm 2. Auto screw
with bit size fo r notebook assembly & disassembly. 2 mm 2 mm 2. Auto screw
with bit size fo r notebook assembly & disassembly. 2 mm 2 mm 2. Auto screw
with bit size fo r notebook assembly & disassembly. 2 mm 2 mm 2. Auto screw

with bit size fo r notebook assembly & disassembly. 2 mm 2 mm 2. Auto screw

2 mm

2

mm

2. Auto screw driver for notebook assembly & disassembly.

Auto screw driver for not ebook assembly & disassembly. Bit Size #0 Screw Size Toolin g
Auto screw driver for not ebook assembly & disassembly. Bit Size #0 Screw Size Toolin g
Auto screw driver for not ebook assembly & disassembly. Bit Size #0 Screw Size Toolin g

Bit Size

#0

Screw Size

Tooling

Tor.

Bit Size

1. M2.0

Auto Screwdriver

2.0-2.5 kg/cm2

#0

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2.3 System Disassembly

The section discusses at length each major component for disassembly/reassembly and show corresponding illustrations.Use the chart below to determine the disassembly sequence for removing components from the notebook.

NOTE: Before you start to install/replace these modules, disconnect all peripheral devices and make sure the notebook is not turned on or connected to AC power.

NOTEBOOK

is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base
is not turned on or connected to AC power. NOTEBOOK Modular Components LCD Assembly Components Base

Modular Components

LCD Assembly Components

Base Unit Components

2.3.1 Battery Pack

2.3.2 Keyboard

2.3.3 CPU

2.3.4 DDR2-SDRAM

2.3.5 HDD Module

2.3.6 ODD Drive

2.3.7 LCD ASSY

2.3.8 LCD Panel

2.3.9 Inverter Board

2.3.10 System Board

2.3.11 Modem Card

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2.3.1 Battery Pack

Disassembly

1. Carefully put the notebook upside down.

2. Take the battery pack out of the compartment (

down. 2. Take the battery pack out of the compartment ( ). (Figure 2-1) Figure 2-1

). (Figure 2-1)

Figure 2-1 Remove the battery pack

Reassembly

1. Replace the battery pack into the compartment. The battery pack should be correctly connected when you hear a clicking sound.

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2.3.2 Keyboard

Disassembly

1. Remove the battery pack. (Refer to section 2.3.1 Disassembly)

2. Remove one screw then push firmly to slide the easy start buttons cover to the right ( ). Then lift the easy start buttons cover up ( ). (Figure 2-2, Figure 2-3)

Figure 2-2 Remove one screw Figure 2-3 Left the keyboard cover MiTac Secret Confidential Documen
Figure 2-2 Remove one screw
Figure 2-3 Left the keyboard cover
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3. Slightly lift up the keyboard and disconnect the cable from the system board to detach the keyboard. (Figure 2-4)

Reassembly

board to de tach the keyboard. (Figure 2-4) Reassembly Figure 2-4 Remove the keyboard 1. Reconnect

Figure 2-4 Remove the keyboard

1. Reconnect the keyboard cable and fit the keyboard back into place.

2. Replace the keyboard cover and secure with one screw.

3. Replace the battery pack. (Refer to section 2.3.1 Reassembly)

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2.3.3 CPU

Disassembly

1. Remove the battery pack. (Refer to section 2.3.1 Disassembly)

2. Remove four screws fastening the CPU cover. (Figure 2-5)

3. Remove three screws that secure the fan, disconnect the fan’s power cord from system board and remove four screws fastening the heatsink. (Figure 2-6)

and remove four screws fastening the heatsink. (Figure 2-6) Figure 2-5 Remove four screws Figure 2-6
and remove four screws fastening the heatsink. (Figure 2-6) Figure 2-5 Remove four screws Figure 2-6

Figure 2-5 Remove four screws

four screws fastening the heatsink. (Figure 2-6) Figure 2-5 Remove four screws Figure 2-6 Free the

Figure 2-6 Free the heatsink and fan

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4. To remove the existing CPU, loosen the screw by a flat screwdriver, upraise the CPU socket to unlock the CPU. (Figure 2-7)

Reassembly

the CP U socket to unlock the CPU. (Figure 2-7) Reassembly Figure 2-7 Remove the CPU
the CP U socket to unlock the CPU. (Figure 2-7) Reassembly Figure 2-7 Remove the CPU

Figure 2-7 Remove the CPU

1. Carefully, align the arrowhead corner of the CPU with the beveled corner of the socket, then insert CPU pins

into the holes. Tighten the screw by a flat screwdriver to locking the CPU.

2. Connect the fan’s power cord to the system board, replace the fan and heatsink, then secure with seven screws.

3. Replace the CPU cover and secure with four screws.

4. Replace the battery pack. (Refer to section 2.3.1 Reassembly)

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2.3.4 DDR2-SDRAM

Disassembly

1. Remove the battery pack. (Refer to section 2.3.1 Disassembly)

2. Remove four screws fastening the CPU cover. (Refer to section 2.3.3 Disassembly)

3. Pull the retaining clips outwards ( ) and remove the SO-DIMM ( ). (Figure 2-8)

Reassembly

) and remove the SO-DIMM ( ). (Figure 2-8) Reassembly Figure 2-8 Remove the SO-DIMM 1.
) and remove the SO-DIMM ( ). (Figure 2-8) Reassembly Figure 2-8 Remove the SO-DIMM 1.

Figure 2-8 Remove the SO-DIMM

1. To install the DDR2, match the DDR2's notched part with the socket's projected part and firmly insert the SO- DIMM into the socket at 20-degree angle. Then push down until the retaining clips lock the DDR2 into position

2. Replace the CPU cover and secure with four screws.

3. Replace the battery pack. (See section 2.3.1 Reassembly)

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2.3.5 HDD Module

Disassembly

1. Carefully put the notebook upside down. Remove the battery pack. (Refer to section 2.3.1 Disassembly)

2. Remove four screws fastening the CPU cover. (Refer to section 2.3.3 Disassembly)

3. Remove one screw fastening the HDD, then slide the HDD module out of the compartment. (Figure 2-9)

screw fastening the HDD, then slide the HDD module out of the compartment. (Figure 2-9) Figure

Figure 2-9 Remove HDD module

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4. Remove four screws to separate the hard disk drive from the bracket, remove the hard disk drive. (Figure 2-10)

Reassembly

rem ove the hard disk drive. (Figure 2-10) Reassembly Figure 2-10 Remove hard disk drive 1.
rem ove the hard disk drive. (Figure 2-10) Reassembly Figure 2-10 Remove hard disk drive 1.

Figure 2-10 Remove hard disk drive

1. Attach the bracket to hard disk drive and secure with four screws.

2. Slide the HDD module into the compartment and secure with one screw.

3. Replace the CPU cover and secure with four screws.

4. Replace the battery pack. (Refer to section 2.3.1 Reassembly)

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2.3.6 ODD Drive

Disassembly

1. Carefully put the notebook upside down. Remove the battery pack. (Refer to section 2.3.1 Disassembly)

2. Remove one screw fastening the ODD drive. (Figure 2-11)

3. Insert a small rod, such as a straightened paper clip, into ODD drive’s manual eject hole ( ) and push firmly to release the tray. Then gently pull out the ODD drive by holding the tray that pops out ( ).

(Figure 2-11)

Reassembly

the tray that pops out ( ). (Figure 2-11) Reassembly Figure 2-11 Remove the ODD drive
the tray that pops out ( ). (Figure 2-11) Reassembly Figure 2-11 Remove the ODD drive

Figure 2-11 Remove the ODD drive

1. Push the ODD drive into the compartment and secure with one screw.

2. Replace the battery pack. (Refer to section 2.3.1 Reassembly)

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2.3.7 LCD ASSY

Disassembly

1. Remove the battery pack, keyboard. (Refer to sections 2.3.1 and 2.3.2 Disassembly)

2. Remove four screws fastening the CPU cover. (Refer to step 2 of section 2.3.3 Disassembly)

3. Remove two hinge covers, then carefully put the notebook upside down. (Figure 2-12)

4. Remove four screws. (Figure 2-13)

down. (Figure 2-12) 4. Remove four screws. (Figure 2-13) Figure 2-12 Remove the hinge covers Figure

Figure 2-12 Remove the hinge covers

(Figure 2-12) 4. Remove four screws. (Figure 2-13) Figure 2-12 Remove the hinge covers Figure 2-13
(Figure 2-12) 4. Remove four screws. (Figure 2-13) Figure 2-12 Remove the hinge covers Figure 2-13

Figure 2-13 Remove four screws

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5. Disconnect LCD cable from the system board. Remove two screws to free the LCD assembly. (Figure 2-14)

Reassembly

screws to fr ee the LCD assembly. (Figure 2-14) Reassembly Figure 2-14 Free the LCD assembly

Figure 2-14 Free the LCD assembly

1. Attach the LCD assembly to the base unit and secure with six screws.

2. Reconnect the LCD cable and replace two hinge covers.

3. Replace the CPU cover and secure with four screws. (Refer to section 2.3.3)

4. Replace the keyboard and battery pack. (Refer to sections 2.3.2 and 2.3.1 Reassembly)

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2.3.8 LCD Panel

Disassembly

1. Remove the battery, keyboard and LCD assembly. (Refer to section 2.3.1, 2.3.2 and 2.3.7 Disassembly)

2. Remove two screws fastening the LCD cover. (Figure 2-15)

3. Insert a flat screwdriver to the lower part of the LCD cover and gently pry the frame out. Repeat the process until the cover is completely separated from the housing.

4. Remove six screws and disconnect two cables. (Figure 2-16)

Figure 2-15 Remove LCD cover

onnect two cables. (Figure 2-16) Figure 2-15 Remove LCD cover Figure 2-16 Remove six screws and
onnect two cables. (Figure 2-16) Figure 2-15 Remove LCD cover Figure 2-16 Remove six screws and

Figure 2-16 Remove six screws and disconnect two cables

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5. Remove four screws that secure with the LCD bracket. (Figure 2-17)

6. Disconnect the LCD cable to free the LCD panel. (Figure 2-18)

the LCD cable to free the LCD panel. (Figure 2-18) Figure 2-17 Remove four screws Reassembly
the LCD cable to free the LCD panel. (Figure 2-18) Figure 2-17 Remove four screws Reassembly
the LCD cable to free the LCD panel. (Figure 2-18) Figure 2-17 Remove four screws Reassembly
the LCD cable to free the LCD panel. (Figure 2-18) Figure 2-17 Remove four screws Reassembly

Figure 2-17 Remove four screws

Reassembly

1. Reconnect the LCD cable to the LCD panel.

Reassembly 1. Reconnect the LCD cab le to the LCD panel. Figure 2-18 Free the LCD

Figure 2-18 Free the LCD panel

2. Attach the LCD panel’s bracket back to LCD panel and secure with four screws.

3. Replace the LCD panel into LCD housing, fasten the LCD panel by six screws.

4. Replace the LCD cover and secure with two screws.

5. Replace the LCD assembly, keyboard, battery pack. (See sections 2.3.7, 2.3.2 and 2.3.1Reassembly)

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2.3.9 Inverter Board

Disassembly

1. Remove the battery, keyboard, LCD assembly and LCD panel. (Refer to section 2.3.1, 2.3.2, 2.3.7 and 2.38 Disassembly)

2. Remove three screws and free the inverter board. (Figure 2-19)

Reassembly

Figure 2-19 Remove three screws

1. Fit the inverter board back into place and secure with three screws.

2. Replace the LCD Panel, LCD assembly, keyboard and battery pack. (Refer to sections 2.3.8, 2.3.7, 2.3.2 and 2.3.1 Reassembly)

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2.3.10 System Board

Disassembly

1. Remove the battery, keyboard, CPU, DDR2, HDD, ODD drive and LCD assembly. (Refer to sections 2.3.1, 2.3.2, 2.3.3, 2.3.4, 2.3.5, 2.3.6 and 2.3.7 Disassembly) 2. Remove fifteen screws and two hex nuts fastening the housing. (Figure 2-20, Figure 2-21)

Figure 2-20 Remove fifteen screws Figure 2-21 Free the system board MiTac Secret Confidential Documen
Figure 2-20 Remove fifteen screws
Figure 2-21 Free the system board
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3. Remove two screws and disconnect the two speaker’s cables, then free the system board. (Figure 2-22)

Reassembly

then free the system board. (Figure 2-22) Reassembly Figure 2-22 Free the system board 1. Replace

Figure 2-22 Free the system board

1. Replace the system board back into the housing, secure with two screws and reconnect two speaker’s cables.

2. Replace the top cover into the housing.

3. Secure with fifteen screws and two hex nuts fasten the housing.

4. Replace the LCD assembly, DDR2, ODD, HDD, CPU, keyboard and battery pack. (Refer to previous section

reassembly)

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2.3.11 Modem Card

Disassembly

1. Remove the battery, keyboard, CPU, DDR2, HDD, ODD, LCD assembly and system board. (Refer to sections 2.3.1, 2.3.2, 2.3.3, 2.3.4, 2.3.5, 2.3.6, 2.3.7 and 2.3.10 Disassembly)

2. Disconnect the modem cable and remove two screws, then free the modem card. (Figure 2-23)

Reassembly

screws, then free the modem card. (Figure 2-23) Reassembly Figure 2-23 Remove the modem card 1.
screws, then free the modem card. (Figure 2-23) Reassembly Figure 2-23 Remove the modem card 1.

Figure 2-23 Remove the modem card

1. Replace the modem card back into the system board and secure with two screws, then reconnect the cable.

2. Replace the system board, the LCD assembly, ODD, HDD, DDR2, CPU, keyboard and battery pack. (Refer to previous section reassembly)

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3. Definition & Location of Connectors/Switches

3.1 Mother Board (Side A)

J512 J514 PJ501 J506 J510 J503 J513,J515 J501 J518 J504 J516 J519 J502 J505 PJ502
J512
J514
PJ501
J506
J510
J503
J513,J515
J501
J518
J504
J516
J519
J502
J505
PJ502
J507
J511
Confidential

PJ501 : Power Jack

PJ502 : Battery Connector

J501 : CRT Connector

J502 : RJ11 & RJ45 Connector

J503, J506 : USB Port

J504 : USB Port*2

J505 : MDC Jump Wire Connector J507 : MDC Connector J510 : SATA HDD Connector J512 : HP Jack J514 : External MIC Jack J513, J515 : DDR2 SO-DIMM Socket J516 : Mini Express (Wireless) Connector J518, J519 : Stereo Speaker Connector

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3. Definition & Location of Connectors/Switches

3.1 Mother Board (Side B)

J4 SW5 J1 SW2 SW3 SW6 SW4 J3 J2 SW7 Confidential
J4
SW5
J1
SW2
SW3
SW6
SW4
J3
J2
SW7
Confidential

J1 : LCD Inverter Connector

J2 : Internal Keyboard Connector

J3 : Touch-Pad Connector

J4 : Express Card Socket

SW2 : Mail Button

SW3 : Internet Button SW4 : P1 Button SW5 : Power Button SW6 : Touch-Pad Left Button SW7 : Touch-Pad Right Button

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4. Definition & Location of Major Components

4.1 Mother Board (Side A)

U507 U513 U512 U506 U514 Confidential
U507
U513
U512
U506
U514
Confidential

U506 : LAN Controller VT6103L

U507 : Intel Merom Socket

U512 : Clock Generator ICS953009

U513 : VIA VN896 North Bridge

U514 : VIA VT8237A South Bridge

MiTac Secret

Documen

85158515 N/BN/B MaintenanceMaintenance

4. Definition & Location of Major Components

4.1 Mother Board (Side B)

U21 U10 Confidential
U21
U10
Confidential

U10 : W83L951D Keyboard Controller

U21 : System BIOS

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Documen

Confidential

85158515 N/BN/B MaintenanceMaintenance

5. Pin Descriptions of Major Components

5.1 Intel Merom Processor CPU -1

CPU Pin Description

Signal Name

Type

Description