£97, SES cTONS ON TDA2030 14W Hi-Fi AUDIO AMPLIFIER The TDA2030 is a monolithic integrated circuit in Pentawatt® package, intended for use as a low frequency class AB amplifier. Typically it pro- vides 14W output power (d = 0.5%) at 14V/ 4Q; at * 14V the guaranteed output power is 12W on a 492 load and 8W on a 82 (DIN45500). The TDA2030 provides high output current and has very low harmonic and cross-over distortion. Further the device incorporates an original {and patented) short circuit protection system working point of the output transistors within their safe operating area. A conventional thermal shut-down system is also included. g Pentawatt ORDERING NUMBER: TDA2030H comprising an arrangement for automatically TDA2030V limiting the dissipated power so as to keep the ABSOLUTE MAXIMUM RATINGS Vv, Supply voltage +18 v vi Input voltage vy vi Differential input voltage 215 v lo Output peak current {internally 3.5 A Prot Power dissipation at Tease = 90°C 20 w Tyree 7) Storage and junction temperature -40 to 150 c June 1988 19 401 worw:chipdocs.com Be sure to visit ChipDocs web site for more information.TDA2030 CONNECTION DIAGRAM {top view) Ns ourPuT Vs INVERTING INPUT NON INVERTING INPUT 5-262" tab connected to pin 3 TEST CIRCUIT v 2/9 402 worwchipdocs.com Be sure to visit ChipDocs website for more informationTDA2030 THERMAL DATA Rin case Thermal resistance junction-case max 3 °C/W ELECTRICAL CHARACTERISTICS (Refer to the test circuit, V, = + 14V, Tamp= 25°C unless otherwise specified) Pwr Te coatoas | om | ve | mow [Un Nos Input offset current 420 +200 | nA GV nen 0 zs GV in ld og Tim [ms | | we ae en Input noise voltage B= 22 Hz to 22 KHz ~ 2 10) WW Vrippie= 0.5 Vert ri 8 —— {7 SGS-THOMSON 8 ‘9, pions 403 worwchipdocs.com Be sure to visit ChipDocs website for more informationTDA2030 Fig, 1 - Output power vs. Fig. 2 - Output power vs. supply voltage supply voltage Fig. 3 - Distortion vs. output power N Fig. 6 - Distortion vs. fre- quency Fig. 4 - Distortion vs. output Fig. 5 - Distortion vs. output power Wt soy + { anh} l Fig. 7 - Distortion vs. fre- Fig. 8 - Frequency response quency with different values of the rolloff capacitor C8 (see fig. 13) fetch e Shy Hoa ee worwchipdocs.com Be sure to visit ChipDocs web site for more information. Fig, 9 - Quiescent current vs. supply voltageFig. 10 - Supply voltage Fig. 11 - Power dissipation rejection vs. voltage gain and efficiency vs. output power th. Hs A TDA2030 Fig. 12 - Maximum power dissipation vs. supply voltage (sine wave operation) APPLICATION INFORMATION Fig. 13 - Typical amplifier Fig. 14 - P.C. board and component layout for with split power supply the circuit of fig. 13 (1:1 scale) h Bo oF 6. —— 47 SS.momson worwchipdocs.com Be sure to visit ChipDocs website for more information TS-0088/1 5/9 405TOAz30 0 — APPLICATION INFORMATION (continued) Fig. 15 - Typical amplifier Fig. 16 - P.C. board and component layout for with single power supply the circuit of fig. 15 (1:1 scale) Fig, 17 - Bridge amplifier configuration with split power supply (P,= 28W, V,= #14V) 69 G77 SES:THOMSON 406 - worwchipdocs.com Be sure to visit ChipDocs website for more informationworw:chipdocs.com PRACTICAL CONSIDERATIONS Printed circuit board The layout shown in Fig. 16 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. Assembly suggestion No electrical isolation is needed between the TDA2030 Package and the heatsink with single supply voltage configuration. Application suggestions The recommended values of the components are those shown on application circuit of fig. 13. Different values can be used. The following table can help the designer. Recomm. Larger than’ ‘Smaller than Component value Pur recommended value | recommended value RI 22ka Closed loop gain Increase of gain Decrease of gain (*) setting R2 680 2 Closed loop gain Decrease of gain (*) | Increase of gain setting R3 22ka2 Non inverting input Increase of input Decrease of input biasing impedance impedance Ra 12 Frequency stability Danger of oscillat. at high frequencies with induct. loads | RS = 3R2 Upper frequency Poor high frequen- | Danger of cutoff Gies attenuation _{ oscillation ci Tur Input DC Increase of low fre- decoupling quencies cutoff c2 22 F Inverting DC Increase of low fre- decoupling quencies cutoff C3,C4 O1 uF Supply voltage Danger of oscil- bypass lation €5,C6 100 nF Supply voltage Danger of oscil- bypass lation c7 Frequency stability Danger of osciliat. 8 Upper frequency | Smaller bandwidth | Larger bandwidth cutoff D1,02 1N4001 To protect the device against output voltage spikes (*) Closed top gain must be higher then 2408, THOMSON GmewoRcacTROMOCS 19 407 Be sure to visit ChipDocs web site for more information.TDA2030 SHORT CIRCUIT PROTECTION The TOA2030 has an original circuit which limits the current of the output transistors. Fig. 18 shows that the maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area (Fig. 2), This function can there- Fig. 18- Maximum output current vs. voltage [Vest] across each output transitor THERMAL SHUT-DOWN ‘The presence of a thermal limiting circuit offers the following advantages : 1. An overload on the output {even if it is per- manent), or an above limit ambient tem: erature can be easily supported since the T cannot be higher than 150°C. 2. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If 29 408 worw:chipdocs.com fore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short circuit from AC output to ground, Fig, 19- Safe operating area and collector characteristics of the pro tected power transistor for any reason, the junction temperature in- creases up to 150°C, the thermal shut-down simply reduces the power dissipation at the current consumption, The maximum allowable power di depends upon the size of the external heatsink {i.e. its thermal resistance); fig. 22 shows this dissipable power as a function of ambient tem- perature for different thermal resistance. ——— 497. SS-TOMSON ———- Be sure to visit ChipDocs web site for more information.__TDA2030 Fig. 20 - Output power and Fig. 21 - Output power and Fig, 22 - Maximum allowa- drain current vs. case tem- drain current vs. case tem- ble power dissipation vs. perature (RL = 42) perature (R, = 82) ambient temperature ae Fig. 23 - Example of heat-sink Dimension : suggestion. The following table shows the length that the heatsink in fig. 23 must have for several values of Prop and Ren. “ens ron ramen scnew | q | naw fae [eye LUEULUUUL corn fo fw : aha) yy of heating | 42] 62] 83 [ iat ul a) sme Led -THOMSO on - 57. SES;THOMSON 409 worwchipdocs.com Be sure to visit ChipDocs website for more information