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DriverICPackageService(COF)

TurnkeyService

TCPandCOFarebothICpackagingtechnology.ItutilizesflexibleprintedcircuitfilmasthemediumforpackagingIC

BumpingManufacturing

chips.Thebondingisperformedonthegoldbumpsonthechipandtheinnerleadonthecircuitfilmbyuseofheatand

Service
GoldBumping

pressure.

Service
GoldBump
SolderBumping
Service
SolderBump
SolderBumpwith
Ballmount
CopperBumping
Service
CopperPillarwith
LeadFreeSolder
Cap
RedistributionLayer(RDL)
Service
Gold(Au)RDL
ThickCopper(Cu)
RDL
WaferSurfaceProcessing
Service
BackSideMetal
Process
DielectricLayer
CoatingProcess
WaferGrinding,Dicingand
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Pick&Place(forCOG...etc)
Service
Package&TestService
DriverICTesting
NonDriverICTesting
DriverICPackage
Service(COF)
WaferLevelChip
ScalePackages
(Tape&Reel)Service
FinalInspectionandFailure
AnalysisService
ChipTrayDesign&
ManufacturingService
Certificate

TCPandCOFareproducedbyreeltoreelmethod.WhentheLCDpanelmodulefactoriesreceivetheIC,theywill
punchthetapedICintosinglepieces.Normally,theouterleadofTCPandCOFcircuitfilmwillhaveaninputsideand
anoutputsidetheoutputsidewillconnecttoLCDpanelglassandtheinputsidewillcontactwithcontrolleronthePCB.

Thispackagemethodisprovidedwiththepropertyofthehighdensity,highpingcount,finepitch,gongbond,high
throughputandhighreliability.Furthermore,itisalsoprovidedlightweightandsmall,flexibleandcanbeproducedby
reeltoreel,whichareimpossibletoachievebytraditionalpackagingmethods.Inparticular,COFproductsarecapable
topackmultichiporpassivecomponentsonthecircuitfilm.

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3.1LCDPanel,PDPpanelsorOLEDpaneldriverICpackage
3.2PrinterheadICpackage
3.3Fingerprintsensors
3.4Medicaldevices(hearingaid,bloodglucosemeasuringdevice)

4.1TCP/COFproduction
4.2QTCP/QCOFproduction
4.3DesignTCP/COFtape
4.4PurchaseTCP/COFtape
4.5Productreliabilitytest
4.6ProductFailureAnalysis

5.1TCP/COFDesignGuide
5.2FinePitchproductengineerevaluation
5.3FailureAnalysisprocess
5.4LOCbonderandFlipChipbonderabilitycomparison
5.5ParticleContinuousImprovementProgramreport.

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