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Adhesive science
Structure of enamel
Direct bonding
molecular
structural
Viscosity
PHASE CHANGE
Physical means
Chemical setting mechanism
Dimensionally stable
Volumetric expansion/shrinkage
BONDING= ADHESION+ATTACHMENT
Enamel
Clinically visible
No regenerative capacity
Morphology of Enamel
Morphology of Enamel
Wider Prisms
Morphology of Enamel
Morphology of Enamel
Keyhole pattern
Prisms contain
hydroxyapatite crystals
Morphology of Enamel
Hydroxyapatite crystals
Acquired pellicle
Removed by pumicing
Patient
- salivary contamination
- contact with lips and
tongue
- exhalation vapor
Operator
- oil / water via spray
- rubbing /touching
etched surface
Negative factors
- Time and skill
- Impacted / partially erupted teeth
- Decalcification / discoloration
- Gingival irritation
- Closure of band spaces
- Unaesthetic
- Placement of separators is painful
Advantages of bonding
Esthetics
Faster and simpler
Less patient discomfort
Arch length not increased
No band space closure
Partially erupted or
fractured teeth can be controlled
Lingual orthodontics
Advantages of bonding
More hygienic
Disadvantages of bonding
No protection against
interproximal caries
Bonding Procedure
Cleaning
Enamel conditioning
moisture control
Sealing
Bonding
enamel pretreatment
Cleaning
REISNER et al
Buccal surfaces lightly abraded with TC bur at slow
speed (25000rpm) > Pumicing for 10 sec.
Enamel conditioning
1. Moisture control
Lip expanders
Cheek retractor
Saliva ejectors
Tongue guards
Salivary duct
obstructors(dri-angles)
Cotton or gauze rolls
AntisialagoguesBanthine, probanthine
Enamel conditioning
2.Enamel pretreatment
Acid etching
Acid Etching
Acid Etching
Procedure
Isolation
Gentle application of etchant
should not be rubbed
Rinsed with water spray
Dry with moisture and oil free source ( pref with chip
blower)
Avoid salivary contamination if it occurs, re etch the
tooth.
Acid Etching
Acid Etching
Rationale of etching
Rationale of etching
Conc. Of etchant
Most widely used concns. of phosphoric acid
from 30% - 50% with an application of 30 -60
seconds.
20 50% / 60 sec. Most retentive surface
( Silverstone )
> 50% phosphoric acid
Monocalcium phosphate monohydrate
< 27% phosphoric acid
Dicalcium phosphate dihydrate
Bond st
Morphological
pattern
similar
Depth of etched
surface
less
Phosphoric
37%
similar
Nitric acid
2.5%
less effective
Patterns of etching
According to Retief
Type 1
- Selective removal of enamel prism cores
- Peripheries intact (honey comb app.)
Patterns of etching
Type 2
- Reverse process
- Peripheries removed
- Cores intact (cobble stone app.)
Patterns of etching
Type 3
- surface loss w/o exposing underlying prisms
STUDIES:
SILVERSTONE:- 120 sec etch necessary to
establish proper enamel porosity
MUELLER(1977):- By increasing the etch time
an increase in tag formation was seen
NORDENVELL et al :- Compared pri. Young &
mature perm. Teeth using var. etch times b/w 1560 sec. found that 15 sec gave greatest surface
irreg. in pri. teeth.
REDFORD:- etch time of 15 sec with 38% phos
acid was adeq for pri. teeth.
Crystal growth
Laser etching
Iatrogenic factors
Maijer & Smith 1986 AJO-DO
1.Loss of enamel caused by etching
10-20 um lost - acid etch
6-50 um lost - after debonding
2.Retention of resin tags discoloration of enamel
Resin tags 80um or more
U/V cured resin didnt contain u/v absorber
Iatrogenic factors
Maijer & Smith 1986 AJO-DO
3.Leakage at the bracket interface Bracket
corrosion and staining
Small pores pathway for bact., stains etc.
Ceen & gwinnett and maijer & smith stain due
to biodgradation of the metals
Iatrogenic factors
Maijer & Smith 1986 AJO-DO
4.Enamel loss fracturing of enamel at time of
debonding.
Reported by Reteif(1974) and Reteif &
Denys(1979)
5.A rougher surface with enamel cracks
2 step procedure should be used
st
1 step debonding pliers,hand instru,u/s
scalers
nd
2 step abrasive cups/discs with polishing
medium
Iatrogenic factors
Maijer & Smith 1986 AJO-DO
6.A softer enamel surface with lower fluoride
content, more predisposed to decalcification
Acquired fluoride 10um
BONDING - I
Antisialogogues
SAMPLE: 60 Premolars
1st grp 10 teeth, used to study etching pattern with
5% & 37% H3PO4
2nd grp 50 teeth, used to study & compare SBS
after etching with 5% & 37% H3PO4
CONCLUSION :
5%H3PO4 can be used for etching tooth surface
before bonding instead of 37% H3PO4 concn; as with
5%H3PO4, there is minimal enamel loss & bond
strength is not affected
Crystal growth
Laser etching
Crystal growth
Crystal growth
Crystal growth
MECHANISM OF RETENTION
Calcium sulphate crystals must enucleate from
bound calcium
Crystal growth
No damage to enamel
Crystal growth
Laser etching
Sand blasting
Albert Feilzer,AJO Jan 2000
Bond strength
Sand blasting < Acid etching
Conclusion
Sandblasting
Crystal growth
Enamel loss
controlled by operator
Acid etching
remineralized
less
Bond strength
low than A E
Optimum
low than A E
Crystal growth
Laser etching
Laser etching
Laser etching
coherence
collimation
monochromacity
Laser etching
Laser etching
USE OF LASER SYSTEM
Caries prevention
Desensitization of teeth
Laser etching
Classification
According wavelength
1. UV range ( Krypton
fluoride, Argon fluoride)
2. Visible light ( Helium Neon,
argon laser )
3. Infrared range (carbon
dioxide , Nd: YAG )
Laser etching
Dr. Francis 2001
Bonding Procedure
Cleaning
Enamel conditioning
- Acid etching
- Crystal growth
- Sandblasting
- Laser etching
Sealing
Bonding
Sealing
Sealer / Primer / Intermediate resin
Low viscosity resin which is applied prior to bonding
VARIOUS CONCEPTS
l
l
l
l
Sealing
Sealants 2 types
light cured
chemically cured
Sealing
Prompt L Pop
Transbond self etch primer
ADVANTAGES:
Bonding Procedure
Cleaning
Enamel conditioning
- Acid etching
- Crystal growth
- Sandblasting
- Laser etching
Sealing
Bonding
Bonding Procedure
Four steps
1.
Transfer
2.
Positioning
3.
Fitting
4.
Removal of excess
Bonding
TRANSFER
Adhesive put on
bracket base
Bonding
POSITIONING
Bonding
FITTING
Bracket firmly
pushed towards the
tooth surface with
one point contact
Bonding
REMOVAL OF EXCESS
Gingival irritation
Plaque build up
Better esthetics
Curing Lights
Argon laser
Bulb quartz
Filament Tungsten
Gas Halogen
Lifetime 100hrs
Argon laser
Curing time
3 secs per bracket
1 min both arches
Argon laser
KELSEY ,POWELL
To equal bond strength of 40 sec exposure by
conventional curing light, argon laser must cure
for 10 seconds
Disadvantages
expensive
Exposure time
40 secs conventional curing light
3,6 & 9 secs xenon plasma light
Bond strength
Xenon light > with longer exposure time
To equal bond strength of conventional curing
light the exposure time with xenon had to be 6
9 secs
Disadvantages
1.
2.
3.
1.
2.
3.
Group I
Elipar Freelight
Group II-IV
Group V-VII
Bee Cool (Confident)
Apoza
Results
Bond strength of G I and G IV samples fall in the
optimal range.
Bond strength values of other groups were
suboptimal.
References
References
References
References