No.

KWQA07-134

Engineering
Engineering Information
Information

Subject
MS3V1 DVD Distortion (Flashing Screen) at Ford Plant (B&A)

Date :
22/Aug/
Name: J. Grimaldo
Code: Ford Plant
PDI Code: DSA-08Quality Control Section 4
Mobile Business Group
PIONEER CORPORATION

Quality No.

Tamaulipas, Mexico, C.P. 87316

PH: (52) (868) 810-12-26 FAX: (52) (868) 810-09-88

PDI Ctrl No.

RMA No.

FIRST TIME ANLYSIS SHEET

DATE REVIEWED:
PERFORMED AT PLANT:

22/08/

TIME : 12:30 pm

PERFORMED BY PIONEER:

DVD PLAYER PART #:

Prod date:

VIN:

Not available
July 18
8L1T-10E947-AA35138
MECHANISMS PART #:
QTY:
MECHANIS LOT No:
28031138
1 pc
0956454CGE14 (May 14th )
ANALYZED AT: Engineer Lab
MEMBERS INVOLVED: (SQE) (Play back Eng)
FOUND AT: Ford Assembly Plant (B&A)
RADIO FAMILY: Ford FES
FAILURE DATE: Not available
SYMPTOM: DVD Distortion (Flashing Screen)

Appearance check:
* Table 1: Result of the appearance check

Check Item
External Appearance Damage

Status
OK

CRG Position
Discs Inside
Shutter Condition
PCB Connectors
Flex Cable Connections

Inner track
None
Close
OK
OK

Pict.1 Back-view from the

mechanism

Pict.2 Top-view from the defective mechanism

Pict.3 Bottom-view from the defecti

Pict.4 Front-view from the defective mechanism

OBSERVATIONS BY PIONEER:

History:
This FES unit was rejected from Ford Assembly Plant with the complain DVD Distortion and Flashing Screen.
The unit arrived to engineers made the first analysis at FES unit as f"ollowing:
Playability 8 cicles without any problem:
Turn-on>Load DVD>Play DVD>Eject DVD
Move the FES unit to temperature cabine and before of submit the unit to temperature test, Customer' engineer reepe
the playability but, at that time the screen was flashing, similar as Flash Rom issue (turn-on > turn-off...)
So, he back to Engineer Lab and the unit could be work OK (Turn-on>Load DVD>Play DVD>Eject DVD) so, he decid
FES top cover and taken some voltage of FES and everything were OK.
After that, continue with playability test in order to reproduce the failure condition and after some trieds, the unit send
display "o_boot_stby.c 98D2"
After that, the mechanism didnot initialize normally, I mean, some times it initialize, some times not initialize, and othe
the initialization. And same thing happen with the imagen, some times showed image, some times not and some time
(squared or frezer image).
When I arrivede to Customer, the FES never showed imagen and I confirmed the error "o_boot_stby.c 20725" to sen
FES and also the intermitten.
With Pioneer tester:
I also confirmed the Customer History including the error message as you can see below.
I have suposicion, maybe some insuficiente solder or short circute was affecting the mechanism or FES and that prov
problem so damaged some IC.
I took some pictures of IC's and I saw some soldaring potential cause on IC Main Micro, any way please see the pictu
Pioneer Matamoros Analysis:
I swap the PCB and get the following results:
* Initialize ---> OK
* Load---> OK
* Spin ---> OK
* Play CD (sound) --->OK
* Play DVD (sound and imagen) ---> OK
* Eject DVD ---> OK

Based on the above information, I can determinate that the problem following the PCB, and also I decided to sent bac
Japan in order to perform a deeper analysis.

* Play CD (sound) --->OK

* Play DVD (sound and imagen) ---> OK
* Eject DVD ---> OK

Based on the above information, I can determinate that the problem following the PCB, and also I decided to sent bac
Japan in order to perform a deeper analysis.

Result of the A-B-A swap test (P.C.B)

Defective PCB

Defect is present

Defective Mechanism

Master PCB
Play as NTF

Result: There was problem with the P.C.B.

First message on FES

Defective PCB

Defect is present

Second message on FES

IC pictures

Terminals of Main Micro

Ford Plant
No. KWQA07DSA-08-08

view from the defective

m the defective mechanism

g Screen.

neer reepeat the one time again

o, he decided to removed the

unit send a error message on

e, and others times did not stop

some times had distortion

725" to send the mechanism to

d that provoken some electrical

ee the pictures.

to sent back this mechanism to

to sent back this mechanism to

Analysis report : [ DVD Distortion (Flashing Screen) ]

Rev. 31/Aug/

Occurrence situation:
Customer Complain:
Customer's part No.:
Pioneer's part No:
Open Date:
Occurred Site:
Production date code:

DVD Distortion (Flashing Screen)

28031138-E
YPM-1357ZDD/XU/RA
22/08/
Ford Assembly Plant (B&A)
0956454CGE14(/5/14)

Appearance check:
* Table 1: Result of the appearance check

Check Item
External Appearance Damage
CRG Position
Discs Inside
Shutter Condition
PCB Connectors
Flex Cable Connections

Status
None
Inner track
0
Open
OK
OK

Pict.1 Back-view from the defective

mechanism

Pict.2 Top-view from the defective mechanism

Pict.3 Bottom-view from the defective mechanism

Pict.4 Front-view from the defective mechanism

3 Operation Check:
The mechanism was turned on, but it did not work at all. And it didnot initialize normally, I mean, some times it initialize,
some times not initialize. The customer complains was confirmed.
Check Items

Status

Initialize
Load Disc
Spin

NG

Play DVD&CD (sound and imagen)

NG

Eject Disc

NG

NG
NG

4 Voltage check
Check Item

Status

VCC33
VCC15
VDD33
SRVDD
Result: Voltage was no problem.

OK
OK
OK
OK

5 The wave forms of Sub Micro,Main Micro and Flash ROM when start-up mechanism
STOM, MTOS, XCSFM
Defective mechanism

Good mechanism

STOM

MainMicro was not able to access to

Flash ROM and Sub Micro

MTOS

XCSFM
MainMicro was able to access
to Flash ROM

Result: Based on the waveform figures above, it is determined that the "Sub Micro" to "Main Micro" Line is defective.
6 Soldering on IC
The soldering conditions were checked through suspected components.
Sub Micro

Result: There was no problem on Sub Micro.

Main Micro
64pin: Sub Micro to Main Micro line

64pin
Crack

Crack

Crack

Crack

Result: We confirmed crack on 64pin of Main Micro.

When the Sub Micro to Main Micro line open a circuit, the mechanism does not initialize.
In addition, if the 64pin open after the mechanism completed initialize, "o_boot_stby.c" error will be displayed.
Therefore it is determined that the 64pin is root cause of defective symptom.
Rev. 7/Sep/
7 PSG investigation and Countermeasures
Refer to "Investigation" sheet

Solder crack investigation result report

1 Occurrence situation:
Date: 8/22/
Place: Ford Assembly Plant
Model: CXK6454/XU
Symptom: DVD Distortion (Flashing Screen)
Number: 1
2 Appearance check:
2-1. Number impressed on the PCB: 208GE07A => Produced on 5/7/ at A shift
2-2. Solder crack was confirmed on 64 pin of the Main Micro.
2-3. Repair mark was confirmed on the PCB.

Repair Mark

3 Solder condition check:

Repair mark was confirmed on the Main Micro. As a photograph below, solder crack occurred in the 64 pin of the Main Micro.
It was judged that the solder crack stemmed from repairing error.
Returned PCB

4 Process check:
4-1.Details of the process work:
There was no problem following process.
Check 1. Soldering

Check 3. Cleaning flux

Known good PCB

Check 2. Cleaning fluid

Check 4. Writing a repair mark

4-2. Work rule check

After repairing, the experts inspect in the visual inspection process. (from March )
However, no records after repairs, so in spite of not completing inspection after repairs, there is a possibility that the inspection had been done.

4-3. Work qualification check

All repair workers have qualifications.
4-4. Work procedure check
No problem

(Refer to "5WHY sheet")

KWQA07-134

5-Why Analysis

Corrective Action
with Responsibility
Define Problem
DVD Distortion (Flashing
Screen)

Use this path for

the specific
nonconformance
being investigated

Root Cause

Poor solder on the terminal

of Main Micro

Date

A1.
Create specific repair work procedure.
[Effect: Repair work standard is set up.]

17/09/

A2.
Create work specification for each repair work.
[Effect: Repair work will be stable.]

17/09/

B1.
Record the result of repairs which were put into
production line again.
[Effect: 1. Enable to understand the number of
repairs. 2. Feedback on the result of mistakes in
repairs to repair person. 3. Enable to evaluate
the capability of repair person o

17/09/

Done

Done

WHY?

The repair person made mistake

to repair.
WHY?

Specific work procedure was not

clear.
WHY?

Use this path to

investigate why the
problem was not
detected.

The work had been conducted relying on

skilled workers' skills.
WHY?

Skill level of skilled workers was

low.

It wasn't rejected by the

inspection after repairs.
WHY?

Mistakes by skilled workers

were not considered.

A1

WHY?

In spite of not completing inspection after

repairs, it was judged that the inspection
had been done.

It wasn't rejected by the second

inspection in production line.

A2
17/09/

WHY?

No records after repairs.

WHY?

WHY?

Hard to find the repaired part in PCB.

Use this path to
investigate the
systemic root cause

Education to qualify for repairs

was not sufficient.

There was no system to check the

result of repairs.

B1
B2.
Change the place where a repair mark is
written. It should be closer to repaired part.
[Effect: 1. Enable to know the repaired part
easily. 2. Enable to understand the number of
repairs. 3. Feedback on the result of mistakes in
repairs to repair pers

WHY?

It is a rule that the repair mark should be written in

a certain place of PCB, which may be far from the
actual repaired part.
WHY?

Incomplete solder occurred.

It was judged that the repaired part

B2
could be found by visual
inspection.

WHY?

Insufficient solder was supplied to the

terminal of Main Micro.
WHY?

Visual inspection wasn't

performed after repairs.

B1

There was no fixed procedure of

how to put soldering iron and how
to supply solder.
There was no fixed standard
operation when repairing.

A1

Ref. No. (Spill, PR/R)

Date of Spill

Customer

Product / Process

Problem Resolution Complete

customer Location

Content Latest Rev Date

Communicate to Customer Date:

Process Change Break Point Date:

Implement System Change Date:

17/09/

Create work instructions regarding repairs

From 17th Sep

Contents: Important reminder after repairs. Definition of the rule for writing re
Target: repairs
[Important reminder after repairs]
1. Extra flux must not adhere to the repaired part. Check.
2. Clean the terminal of Main Micro by a cleaning brush after the repair was

3. Inspectors other than repair person must check the repaired part after rep
[Rule of writing marks]
1. After repairs, write a repair mark beside repaired part.
2. After visual inspection, write an inspection mark beside serial number.
3. Write a name of person who performed repair and visual inspection in an

Work instructions of IC replacement

From 17th Sep

Aim: Establish a procedure of IC replacement. Prevent repairs from becomin

Target: All IC

1. Heat around IC to be replaced (preheat).

2. Heat the terminal of IC, then remove the IC after the solder is melted.
3. After removing the IC, clear the solder left on the PCB.
4. Check the part number, design change document, serial number etc of th
5. Check the solder to be used is right kind. Place the IC in the exact positio
6. Apply flux to the terminal of the IC.
7. Solder the terminal by soldering iron, adding wire solder.
8. Repair if bridges occur.
9. After repairing, clean extra flux on the repaired part.

10. Check the solder condition on the repaired part by microscope.

(Check there is no bridge or incomplete solder. )

Notes for soldering IC

Aim: Create in order to prevent repairs of soldering IC from becoming defect
Target: All IC repaired
From 17th Sep

1. Check the condition of flux brush: the tip of brush should be clean and stra
2. Apply flux to defective parts.
3. Check the heat capacity of soldering iron which is used to replace IC, and
4. Repair the defective parts.
(Move the tip of soldering iron in parallel with terminal of IC.)
5. After repairs, clean the soldered parts by PCB cleaner.
6. Check the repaired soldering parts by microscope.

inition of the rule for writing repair marks.

ng brush after the repair was completed.

eck the repaired part after repairs.

ark beside serial number.

ir and visual inspection in an identification tag.

Prevent repairs from becoming defective.

after the solder is melted.

ment, serial number etc of the IC. (Check the IC to be mounted is right.)
ace the IC in the exact position and attach it temporarily.
wire solder.

part by microscope.

ring IC from becoming defective such as solder bridge by mistakes

rush should be clean and straight.

ich is used to replace IC, and the kind of solder.

erminal of IC.)

UNIT repair workflow

AM930
PM110

OK,

OK

OK

NG

AM 9:30
PM 16:10

OK

Explanation of the left sheet

A person responsible for Production line and for Repair line checks the number and models twice a day.

A person responsible for repair checks the number, models and identification tag of defectives before repair

Check the part number written in the specifications of replaced part.

Repair, following the repair procedure.

Repair the part indicated in defect sheet.

After repairs, check the solder condition in repaired points and parts around it by microscope. Then, repair person w

Record in the daily report of repair after repair OK is confirmed.

Stick blue identification tag on the box.

Repair inspection by visual inspector. (If OK, seal and write the name of inspector in blue identification tag. )
At the same time, record in the daily report of repair. (If NG, return the repaired part to the repair line.)

nd identification tag of defectives before repairing.

ts around it by microscope. Then, repair person writes repair marks.

Record of defective parts

Record the number of rejecte

the number of repaired part t

Daily report of repair

Record how many parts were

Daily report of inspection of r

Record the inspection of repa

If a part fails the inspection a

Record of defective parts

Record the number of rejected part from the production line and
the number of repaired part to be returned to the production line

Daily report of repair

Record how many parts were repaired and how they were repaired.

Daily report of inspection of repairs

Record the inspection of repairs was conducted.

If a part fails the inspection after repaired, it will be recorded.

MEC individual achievement record of repair

TU CORE
1 Daily repair status

Name
No: 0591

(number of unjit)

75
70
65
60
55
50
45
40
35
30
25
20
15
10
5

10/2/2006 1

target
value 60

9 10 11 12 13 ### 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

number of repair
Visual

F/C
Defective unit
number of rejection

Date

Point at issue

Action

complement

Prepared

Prepared

MS3 Confirmation of Failure IC Status

Model: CWX3508-/u
Occur date: 2007/5/8
Number of occurrence: 2
Incidence: 500PPM
Process: SAVO inspection
Symptom: step35 / Replacement of the IC
This defect is failure of IC which it found at SAVO checker.
Line layout (UNIT process):
Packing
ATAPI

ATAPI

Visual
inspectio
n

AV2
AV2

SAVO
inspection

Blow air
Coating

AV1

ATAPI

AV1

Visual
inspection

Furnace for heat treating

Cut of PCB

Impression of a
seal

The defect occurred at SAVO inspection

Number of failure occurrence from May : 9pcs (SAVO process)

Incidence: 622ppm
Result: It would appear that the defective symptom did not occur frequently.

Stepped-up measures of static electricity;

Frequency of static check;
Static check content
1. Electrostatic protection uniform check (3 points of uniform)
2. Apply Electrostatic protection spray on JIG and billboard

Frequency

Rule

once every three months

once every three months

200V or less
200V or less
100ohm or less
35M ohm or less

once every three months

Specific measuring instrument

once every three months

200V or less
35M ohm or less

once every fortnight

biannually

biannually


biannually
0 +/- 10%

once every three months

Specific measuring instrument

biannually
200V or less

annually
100ohm or less

5 5.186.207.208.17

824

917
815

815

91920050

Packing
Visual
inspectio
n
Blow air

ression of a
seal

Rule
200V or less
200V or less
100ohm or less
35M ohm or less
Specific measuring instrument

200V or less
35M ohm or less

0 +/- 10%
Specific measuring instrument

200V or less
100ohm or less