4/2551

.  !"#
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& &'  (V.P. & GM)

1978 in Bangkok, Thailand.

(Stock Exchange of Thailand) in February 1993.
Ayutthaya, Bangkok, Lamphun, JiaXing and
Ohio

US$ 452 million (BHT 15,106 million) for 2008

7,677
I.C. Assembly & Test, Custom Products Assembly,
Microelectronics assemblies, Chip on Board, PCBA,
Chip on Flex, Hybrid Modules, Smart Card
Coil Winding, and Microdisplays

Sales by Division

Sales by Division

Employee Head Count Reduction

Jan 09 from Oct 08

Approx. 679

20 Km from downtown Bangkok.

Located in a Bonded Warehouse
Corporate Headquarters
Custom Products
Hybrid Assembly & Test
Optoelectronics Assembly & Test

Numerical Display for all applications

Super bright LED for Lighting &
Automotive products, Microwave
Components, Fiber optic component for networking

Sample End Application Products

Sample End Application Products

GBIC Transceivers

Wavelength Division Multiplexing or WDM combining multiple streams of optical data traffic or
channels onto one strand of single mode fiber.

Custom Product Group End Application

LED for
Alphanumeric
Display
16%

LED for Lighting

22%

Fiber Optic
62%

Approx. 2,968
30 Km south of Chiang Mai,
Thailands second largest city.
Located in the Northern Region
Industrial Estate. Duty free zone.
Chip On Board, Chip On Flex
SMT, PCB Assembly &Test
Hybrid Assembly , Flip Chip
Micromechanical Manufacturing

Automotive Sensors,
Computer Interface Components
Millimeter Wave Modules,
Industrial Meters,
Medical Devices

Total 1,601
PCBA Division 1,168
IC Division 433
100 Km SouthWest of Shanghai.
Located in a new economic zone
in the Yangtse River Delta.
Two hours to the Pudong
International Airport
Chip On Board, Chip On Flex,
PCB Assembly, Hybrid Modules,
Assembly and test of low to medium pin count ICs,
Customized packages and optoelectronic devices.

Sensors, Smart Cards, Optoelectronics Assembly,

Computer Security Devices,
Wafer Back Grinding, Dicing, RF Security Readers and
Cards, Optoelectronic packaging,
SOT, MSOP, QFN, SC70, TO-XXX, DDPAK Customized packages

Hana Microelectronics JiaXing is located South West of Shanghai

The Distance from Shanghai, is about 100km

Hana Microelectronics Jia-xing

Microelectronics Products
Hana assembly -Hybrid

End product hearing aid

Behind The Ear

Electronics assembly for hearing aid

Medical Equipment
Pregnancy & Ovulation

Medical Application

Hearing Aid

Blood Glucose Meter

Dental Curing System

Microelectronics Products
Hana assembly -COB

Notebook computer

Electronics assembly for touchpad

IC Division Products
Hana assembly - Mousejet

Optical Mouse

Electronics assembly for optical mouse

Microelectronics Products
Hana assembly base
station 10+ ghz
transmitter/receiver

Assembly for 2G and 3G base station

Smallest GPS radio frequency

receiver modules
For ever smaller GPS-enabled equipment,
e.g. motor vehicle, mobile phones, PDAs.

GPS receiver equipment

Microelectronics Products
Hana assembly 125khz & 13.56mhz
RFID Card

125khz Card & Reader

125khz & 13.56mhz RFID

card reader

RFID Access Control Cards & Readers

Automotive Application

Seat Pressure Sensor

Rear Mirror Sensor

Tail Light

Engine Sensor

Fuel Sensor
Brake Sensor

Industrial Application
Water Meter
Motor Controller Boards
Oil Pump Lubrication System

Shipping Container
Thermometer

Bar Code Scanner

Industrial Printer

Consumer Product Application

Digital Camera
Mobile Telephones

Gaming & PC Peripherals

Computer Touchpad

Mobile USB

Telecom/RF Application
Animals Tags
Mobile Phone &
Bluetooth Ear Piece

GPS Navigation

Access Card
Reader and RF Card

Wireless Infrastructure
Reader Programmer

HANA Microelectronics End Application

Consumer
3%

Industrial
13%

RFID
20%

Telecom
4%

Automobile
15%

Medical
5%

Computer
40%

Approx. 2,387
60 Km north of Bangkok. Located in
Ayutthaya Hi-Tech Park. A duty free
processing zone.
Assembly and test of low to medium pin count
ICs, Custom packages and optoelectronic
devices. Test capability include Non-Volatile
Memory, Flash Memory, Mix Signal, Discrete,
Linear and Analog Applications.

QFN, SOIC, VSOP, MSOP, SOT23, SOT223, SOT89, SOT5x3,

SOT9x3, SOD723, HOAX, LGA, Customized Packages,
MEMS Sensors, Wafer Sawing, Back Grinding, Wafer Probe

ISO14001

TS16949

Production Line

Average Loading based on Working Days

(K Units / Day)

12,000
10,000

1970

2534
2350

8,000

1756
1565

6,000
4,000

8733

7138

8165

9046
6222

2,000
0
Q4 07

Q1 08

Q2 08

Q3 08

Q4 08

JXG
AYT

IC Division Products
Mobile electronic
products
Hana assembly SC70

Hana assembly LGA, SOT

IC Assemblies for Mobile Applications

IC Division Products
All types of electronic
products
Hana assembly Opto-Coupler

IC Opto-couplers to prevent damage from

power fluctuations

SOT5x3
A = 1.6 mm
B = 1.6 mm
C = 1.2 mm

SOT9x3

Even Smaller Packages

A = 1.0 mm
B = 1.0 mm
C = 0.8 mm

Package Comparison

SOD723
A = 1.00 mm
B = 0.45 mm
C = 0.60 mm

SOT23

SC70

SOT5x3

SOT9x3

SOD723

Clear packages
Clear

QFN
SOIC
MSOP

Digital Photo Diode

Clear PDIP

HANA Semiconductor End Application

Optoelectronics
25%

Telecom
29%

Consumer
11%

Industrial
13%
Computer
22%

Microelectronics Products

Microsoft Windows 7 to have touch-screen

interface

GPS Child locator

LED Products

Display Case
Lighting low heat

NY Times Square - New Year Ball

Interior Lighting
custom design

LED
standard
light bulbs

Museum Lighting
low power
consumption

Bridge Lighting - low maintenance

Industry Challenges

Global economic recession

Consumer Electronics Demand
Industry Excess Capacity
Increased customer price pressures
Industry Profitability

Hanas Outlook
First Half 2009 weak demand from global
recession & inventory correction
IC Division Impacted more than PCBA
Division
Cost reduction actions taken
16% Headcount reduction
Management pay cuts
Diverse customer & product base will limit
impact from recession.
Strong balance sheet reduces financial risk

http://www.hanagroup.com
http://www.hanagroup.com
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