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Q1a
SOLUTION:
(i) the hour angle, = 15(hour 12) = -45 degrees
(ii) d = 31 (jan) + 4 (Feb) = 35
Declination of the sun is given by:
(d 81)360
,
365
sin
where = 23.45
(35 81)360
= -16.7
365
23.45 sin
The altitude of the sun can be calculated using the following relation.
sin s = cos cos cos + sin sin = cos(-16.7)cos(12)cos(-45) + sin(-16.7)sin(12) = 0.603
Hence, s = 37.07
(iii) cos s =
A silicon solar cell (bandgap = 1.12 eV) with negligible parasitic resistances is uniformly
illuminated by monochromatic light of wavelength 400 nm and intensity 1 kW/m2. The cell has
area of 25 cm2, ideality factor of 1.1 and dark saturation current of 1 x 10-12 A at 300 K.
a. Calculate the short circuit current, open circuit voltage, fill factor and energy conversion
efficiency of the cell, assuming that all photons are absorbed and all e-h pairs are collected.
Given,
Bandgap, Eg = 1.12 eV
Wavelength of light, = 400 nm = 400 x 10-9 m
Intensity of light, I = 1 kW/m2
Cell area A = 25 cm2 = 25 x 10-4 m2
Ideality factor n = 1.1
Saturation current, I0 = 1 x 10-12 A
T = 300 K
[EQE =1]
ISC = 0.80 A
VOC = nkT/q [ln(ISC/I0+1] = 1.1 x 1.38 x 10-23x 300/[1.6 x 10-19 ln(0.08/1 x 10-12+1)]
VOC = 0.78 V
FF = (vOC-ln(vOC+0.72))/(vOC+1)
Where, vOC = VOC/(nkT/q) = 0.78/(1.1 x 1.38 x 10-23 x 300/1.6 x 10-19) = 27.41
Therefore,
FF = (27.41 ln(27.41+0.72))/(27.41+1)
FF = 0.85
Eff =ISCVOCFF/Pin = 0.80 x 0.78 x 0.85/2.5
Eff = 21.3%
b. Corrosion in the front metal contacts causes series resistance of RS = 0.01. What is the
fraction of power lost by the series resistance compared to the typical cell? [note: should
have used ideal cell]
Power at maximum power point with a series is given by:
PM(Rs) = PM (1-rs) = PM (1-Rs/Rch) = PM (1-RsIsc/Voc)
Where rs = Rs/Rch and Rch = Voc/Isc (characteristic resistance)
Therefore,
PM(Rs)/PM = (1-RsIsc/Voc) = 1- (0.01 x 0.80/0.78) ~0.99
Power loss ~ 1%
Q2a
Draw the cross-section of a typical commercial silicon solar cell. Label the relevant parts.
See lecture notes.
The diagram should include:
p-type substrate and n-type emitter layer
back metal contact (blanket)
top metal contact (grid/ finger)
antireflection coating/ texturing/ BSF would be useful
Example:
Q2b
Q2c
A commercial solar cell uses 300 m thick p-type substrate with resistivity of 0.5 cm and 0.5
m thick n-layer with sheet resistivity of 40 /. The voltage and current density at maximum
power points for typical cells are VMP = 0.50 V and JMP = 30 mA/cm2, respectively. Calculate the
finger spacing that can limit the fractional power loss due to resistance of the substrate and the
top n-layer below 5%.
The fractional power lost due to the resistance of the substrate is given by:
Pfrac(substrate) = I2MPRs/Pgen = I2MPRs/(IMPVMP) = (IMP/VMP)(pW/A)= JMPWp/VMP
(Rs = pW/A; and JMP = IMP/A)
Therefore, Pfrac(substrate) = (30 x 10-3 x 300x10-4 x 0.5)/0.50 = 9x10-4 W (negligible)
The fractional power lost due to the resistance of the n-layer is given by:
Pfrac(n-layer) = psS2JMP/12VMP
S = [12VMP Pfrac(n-layer)/(ps JMP)]1/2
This gives