OPERATIONS SYSTEM DESIGN

TABLE OF CONTENTS
1.0

Company Background..........................................................2

History of Intel...........................................................................2
Main activities Intel Penang.......................................................3
2.0

Process Planning...................................................................4

Intel Process Planning................................................................5

The Stage of Fabricating............................................................6
Advantage................................................................................11
Disadvantage...........................................................................14
3.0

Facility Layout....................................................................15

Intel Facility Layout..................................................................15

Advantage................................................................................17
Disadvantage...........................................................................18
4.0

Discussions.........................................................................19

Strategy...................................................................................19
Decisions..................................................................................19
Application...............................................................................20
5.0

Conclusions........................................................................21

Recommendation.....................................................................21
References..................................................................................23

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1.0

COMPANY BACKGROUND

History of Intel
Intel Corporation (better known as Intel, stylized as intel) is
an American multinational technology company headquartered in
Santa Clara, California. Intel is one of the world's largest and
highest valued semiconductor chip makers, based on revenue
(Interl Corporation, 2007). It is the inventor of the x86 series of
microprocessors,

the

processors

found

in

most

personal

computers. Intel supplies processors for computer system

manufacturers such as Apple, Samsung, HP and Dell. Intel also
makes motherboard chipsets, network interface controllers and
integrated circuits, flash memory, graphics chips, embedded
processors and other devices related to communications and
computing. Intel Corporation was founded on July 18, 1968, by
semiconductor pioneers Robert Noyce and Gordon Moore and
widely associated with the executive leadership and vision of
Andrew Grove, Intel combines advanced chip design capability
with a leading-edge manufacturing capability.
Intel was an early developer of SRAM and DRAM memory
chips, which represented the majority of its business until 1981.
Although

Intel

created

the

world's

first

commercial

microprocessor chip in 1971, it was not until the success of the

personal computer (PC) that this became its primary business.
During the 1990s, Intel invested heavily in new microprocessor
designs fostering the rapid growth of the computer industry.
During this period Intel became the dominant supplier of
microprocessors for PCs, and was known for aggressive and anticompetitive tactics in defence of its market position, particularly
against Advanced Micro Devices (AMD), as well as a struggle with
Microsoft for control over the direction of the PC industry
(Graham, 1998).

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Intel was ranked #56 on the 2015 rankings of the world's most
valuable brands published by Millward Brown Optimor.

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Main activities Intel Penang

Intel Malaysia Sdn. Berhad engages in the manufacture and
sale of semiconductor chips; and development of integrated
digital

technology

platforms

for

the

computing

and

communications industries. It offers microprocessor products,

including dual-core microprocessors, quad-core microprocessors,
32-bit architecture microprocessors, and 64-bit architecture
microprocessors, which are used in computer systems, as well as
in embedded designs, such as industrial equipment, point-of-sale
systems,

panel

PCs,

automotive

information/entertainment

systems, and medical equipment. The company also offers

chipset products that send data between the microprocessor and
the input, display, and storage devices, such as keyboards,
mouse, monitors, hard drives, and CD or DVD drives; and
motherboards for use in the desktop, server, and workstation
platforms. In addition, it provides NOR flash memory products,
such as wireless memory for mobile phone designs, set-top
boxes, networking products, DVD players, and DSL and cable
modems; NAND flash memory products primarily for memory
cards, digital audio players, and cellular phones; and wired and
wireless connectivity products that are used to translate and
transmit data in packets across networks, as well as for the
traditional

LAN,

wireless

LAN,

metropolitan

area

network,

networked storage market, and mobile and fixed networks.

Further, the company offers communications infrastructure
products, including network processors, communications boards,
and optical transponders; and networked storage products for
use in a range of Internet devices. It serves original equipment
manufacturers, original design manufacturers, PC and network
communications products users, and other manufacturers. The
company is based in Penang, Malaysia. Intel Malaysia Sdn.
Berhad operates as a subsidiary of Intel Corporation (Bloomberg,
2016).
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2.0

PROCESS PLANNING
Intel currently using mass production to produces large

volumes of a standard product for a mass market. Intel product

demand is stable, and product volume is high (Russell & Taylor III,
2011). Goods that are mass produced are like automobiles,
televisions, personal computers, fast food, and most consumer
goods.
Mass production involves making many copies of products,
very quickly, using assembly line techniques to send partially
complete products to workers who each work on an individual
step, rather than having a worker work on a whole product from
start to finish.
Mass production of fluid matter typically involves pipes
with centrifugal pumps or screw conveyors (augers) to transfer
raw materials or partially complete products between vessels.
Fluid flow processes such as oil refining and bulk materials such
as wood chips and pulp are automated using a system of process
control which uses various instruments to measure variables
such as temperature, pressure, volumetric and level, providing
feedback.
Mass production is capital intensive and energy intensive,
as it uses a high proportion of machinery and energy in relation
to workers. It is also usually automated while total expenditure
per unit of product is decreased. However, the machinery that is
needed to set up a mass production line (such as robots and
machine presses) is so expensive that there must be some
assurance that the product is to be successful to attain profits.
The mass production process itself is characterized by
mechanization to achieve high volume, elaborate organization of
materials flow through various stages of manufacturing, careful
supervision of quality standards, and minute division of labour. To
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make it worthwhile, mass production requires mass consumption

(Thompson, 2005). Until relatively recent times the only largescale demand for standardized, uniform products came from
military organizations. The major experiments that eventually led
to mass production were first performed under the aegis of the
military.
Intel Process Planning
For decades, Intels research and development, advanced
silicon chips, and manufacturing have brought together the best
of computing, communications, and consumer electronics to
enable valuable benefits from technology. Intel continues to
introduce new process technologies that deliver more energyefficient, secure, and higher-performance products, which are
then designed into your increasingly connected, smarter devices.
Intel

creates

industry-leading

and

world-first

silicon

products that introduce more capabilities, are smaller, more

powerful, and use less energy. While advancing technology, Intel
incorporates environmental principles into each step of the
product life cycle. And by anticipating the needs for the next
generation, Intels success at advanced chip design has helped
drive other innovations in almost all industries (Cisco Global,
2015).
Before Intel makes chips, engineers ensure the accuracy of
the specification. They begin with a design or blueprint and
consider many factors: What type of chip is needed and why?
How many transistors can be built on the chip? What is the
optimal chip size? What technology will be available to create the
chip? When does the chip need to be ready? Where will it be
manufactured and tested? To answer these questions, Intel
teams work with customers, software companies, and Intels
marketing, manufacturing, and testing staff. The design teams

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take this input and begin the monumental task of defining a

chips features and design (Intel Corporation, 2015).
When the specifications for the chip are ready, Intel creates
a logic design, an abstract representation of the hundreds of
millions of transistors and interconnections that control the flow
of electricity through a chip. After this phase is complete,
designers prepare physical representations of each layer of the
chip and its transistors. They then develop stencil-like patterns,
or masks, for each layer of the chip that are used with ultraviolet
(UV) light during a fabrication process called photolithography.
To complete the design, testing, and simulation of a chip,
Intel uses computer-aided design (CAD) tools. CAD helps
designers create very complex designs that meet functional,
performance, and power goals. After extensive modelling,
simulation, and verification, the chip is ready for fabrication. It
can take hundreds of engineers working multiple years to design,
test, and ready a new chip design for fabrication.
The Stage of Fabricating
The process of making chips is called fabrication. Inside
Intels ultra-clean fabs, the worlds most complex, tiniest
machinesprocessors and other silicon chips are built in a
sustainable manner. Intel fabs are among the most technically
advanced manufacturing facilities in the world. Within these
sophisticated fabs, Intel makes chips in a special area called a
cleanroom. Because particles of dust can ruin the complex
circuitry on a chip, cleanroom air must be ultraclean. Purified air
is constantly recirculated, entering through the ceiling and
exiting through floor tiles. Technicians put on a special suit,
commonly called a bunny suit, before they enter a cleanroom.
This helps keep contaminants such as lint and hair off the wafers.
In a cleanroom, a cubic foot of air contains less than one particle
measuring about 0.5 micron (millionth of a meter) across. Thats
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thousands of times cleaner than a hospital operating room (Intel

Corporation, 2016).
Automation has a critical role in a fab. Batches of wafers
are kept clean and are processed quickly and efficiently by
traveling through the fab inside front-opening unified pods
(FOUPs) on an overhead monorail. Each FOUP receives a barcode
tag that identifies the recipe that will be used to make the chips
inside. This labelling ensures the correct processing at each step
of fabrication. Each FOUP contains up to 25 wafers and weighs
more than 25 pounds. Production automation machinery allows
for this FOUP weight, which is too heavy to be handled manually
by technicians.
Stage 1: Sand to Ingot
Sand- Sand has a high percentage of
siliconthe
computer

starting
chips.

material
Silicon

is

for
a

semiconductor, meaning that it can be

turned into an excellent conductor or insulator of electricity with
minor amounts of impurities added.
Melted Silicon- Silicon is purified to less than one alien atom per
billion. It is melted and cooled into a solid crystal lattice cylinder,
called an ingot.
Monocrystalline Silicon Ingot- The silicon ingot has a diameter of
300 millimetres (mm) and weighs about 100 kilograms (kg).
Stage 2: Ingot to Wafer
Slicing Ingots- The ingot is cut into
individual silicon discs called wafers.
Each wafer is about one mm thick.

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Polishing Wafers- The wafers are polished to a flawless, mirrorsmooth surface. Intel buys these manufacturing-ready wafers.
Stage 3: Photolithography
Applying Photoresist- Photolithography
is a process that imprints a specific
pattern on the wafer. It starts by
applying

light-sensitive,

etch-

resistant material called photoresist onto the wafer surface.

Exposing Photoresist- The photoresist is hardened and parts of it
are exposed to ultraviolet light, making it soluble. The light
passes through a mask (similar to a stencil), and then through a
lens to shrink and print circuit patterns on each layer of every
chip on the wafer.
Developing Resist- A chemical process removes the soluble
photoresist, leaving a patterned photoresist image as determined
by what was on the mask.
Stage 4: Ion Implantation
Implanting Ions- Ions (positively or
negatively

charged

atoms)

are

embedded beneath the surface of the

wafer

in

regions

not

covered

by

photoresist. This alters the conductive properties of the silicon in

selected locations.
Removing Photoresist- After the ion implantation, the photoresist
is removed, resulting in certain regions being doped with alien
atoms (green in the image).
The Transistor- Although hundreds of chips are usually built on a
single wafer, the next steps focus on a small piece of a chipa
transistor.
Stage 5: Etching
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Etching- To create a fin for a tri-gate

transistor, Intel applies a hard mask
material (blue in the image) using
photolithography. Then a chemical is
applied

to

etch

away

unwanted

silicon, leaving behind a fin with a layer of hard mask on top.

Removing Hard Mask- The hard mask is chemically removed,
leaving a tall, thin silicon fin that will contain the channel of a
transistor.
Stage 6: Temporary Gate Formation
Creating

Gate

Dielectric-

Photoresist is applied to portions of

the transistor, and a thin silicon
dioxide layer (red in the image) is
created by inserting the wafer in an oxygen-filled tube-furnace.
This layer becomes a temporary gate dielectric.
Creating a Gate Electrode- Using photolithography, a temporary
layer of polycrystalline silicon (yellow in the image) is created.
This becomes a temporary gate electrode.
Insulating the Transistor- In another oxidation step, a silicon
dioxide layer is created over the entire wafer (transparent red in
the image) to insulate the transistor from other elements.
Stage 7: Gate-Last High-K/Metal Gate Formation
Removing the Temporary Gate- The temporary gate electrode
and gate dielectric are etched away in preparation for forming
the final gate. This procedure is called gate-last.
Applying High-k Dielectric Material- Multiple layers of high-k
dielectric material (yellow in the image) are applied to the wafer
surface using a method called atomic layer deposition. This

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material is etched away in some

areas, such as the silicon dioxide
layer.
Forming a Metal Gate- A metal gate electrode (blue in the image)
is formed over the wafer and removed from regions other than
the gate electrode. The combination of this and the high-k
dielectric material improves performance and reduces leakage.
Stage 8: Metal Deposition
Preparing to Connect the TransistorThree holes are etched into the
insulation layer (red in the image)
above the transistor. The holes are
filled with copper or another material that creates metal
connections to other transistors.
Electroplating- The wafers are put into a copper sulphate
solution. Copper ions are deposited onto the transistor using a
process called electroplating.
After Electroplating- Copper ions settle as a thin layer of copper
on the transistor surface.
Stage 9: Metal Layers
Polishing- The excess material is
polished off, revealing a specific
pattern of copper.
Connecting with Metal Layers- Like a
multi-level highway, metal layers interconnect the transistors in a
chip (middle and right images). The design of the chip
determines how the connections are made. Although chips look
flat, they can have more than 30 layers of this complex circuitry.

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Stage 10: Wafer Sort Test and Singulation

Sort Testing- After wafer processing
is complete, each chip on a wafer is
tested for its functionality.
Slicing Wafers- The wafer is cut into
pieces called die.
Moving to Packaging- Based on the responses received in the
wafer sort test, die are selected for packaging.
Stage 11: Packaging Die
Individual Die- The silicon die shown here is a 3rd generation
Intel Core processor, Intels first 22nm microprocessor using
3-D transistors.
Packaging- The substrate, the die,
and a heat spreader are put together
to form a completed processor. The
green substrate creates the electrical
and mechanical connections so that the processor can interact
with the system. The silver-coloured heat spreader is a thermal
interface that helps dissipate heat.
Completed Processor- A completed processor, such as the 3rd
generation Intel Core processor, is one of the most complex
manufactured products on Earth.
Stage 12: Class Testing and Completed Processor
Package Testing- Processors undergo
final

testing

for

functionality,

performance, and power.

Binning- Based on final test results,
processors

with

the

same

capabilities

are

grouped

into

transporting trays.
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Retail Packaging- Intel processors, such as the 3rd generation

Intel

Core

processor

shown

here,

are

sent

to

system

manufacturers in trays, or they are boxed for retail stores.

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Advantage
Design for manufacturability (DFM)

Leading-edge

technologies

such

as

design

for

manufacturability allow Intel to set ever-higher standards and

expectations for our quality and reliability systems. Intel utilizes
this system because (Intel Corp, 2014):

It is a proactive system aimed at resolving issues early in

the product development cycle.

Not all process/layout interactions can be covered or

anticipated by design rules.

Manufacturability improvements are dynamic, and new

learning is included as a technology evolves.

Late introduction of new design rules into an existing
technology is difficult due to the critical mass of existing
design

collateral

and

lengthy

assessment

and/or

qualification process.
Product identification and unit-level traceability

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Intel employs systems to manage product identification,

with unit-level traceability for CPUs and chipsets and lot-level
traceability for boards and systems. A record retention system is
used to manage and store this information.
Intel's component traceability system enables product
identification and tracking through all stages of manufacturing,
storage, and shipment to the first point of sale. Identification
methods include lot-tracking numbers that allow forward and
reverse traceability of products. Periodic audits are performed at
each site to ensure compliance. Record retention guidelines
ensure lot history maintenance.
Intel moves component production material through the
factories in lots. For component products, Intel assigns a unique
fabrication plant (Fab) lot number. When assembly receives the
released lots, an assembly lot traveler is assigned to track the lot
through

the

assembly

operations.

At

selected

locations

throughout the assembly/test and finish processes, each unit is

identified

through

the

2-D

mark,

establishing

unit

level

traceability with critical data associated with these individual

units (Intel Corp, 2014).
Production materials move through the factories in work
order lots, which assign a unique serial number to individual
boards. This serial number is the key identifier linking the board
or system to a particular lot and its manufacturing history,
including components mounted on the board or system, and
shipment destination records.
Intel's records management policy requires keeping records
pertaining to product traceability for up to seven years unless
mandated otherwise.
In

components

manufacturing,

the

tracking

system

provides lot and unit genealogy, last known location, and status
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of products. This system facilitates tracing component products

from the customer back to the Fab lot and from the Fab lot to the
customer/location.

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Copy Exactly!

Fabrication (Fab), sort, and assembly test facilities follow a

Copy Exactly! (CE!) philosophy. Copy Exactly! enables delivery of
product from multiple production sites, which operate as a virtual
factory that performs consistently and independent of the
manufacturing source site. Additional benefits include faster
production ramps that improve product availability and improved
consistency to quality performance.
The Copy Exactly! methodology focuses on matching the
manufacturing site to the development site. Matching occurs at
all levels for physical inputs and statistically-matched responses
(outputs). This process enables continuous matching over time
by using coordinated changes, audits, process control systems,
and joint Fab management structures (Intel Corp, 2014).
Physical inputs such as equipment configuration, chemical
purity, facilities, and equipment hookups derive from the same
specifications. In-line processes or equipment monitors that
predict product performance, yield, or reliability must match at
all levels.

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Disadvantage
The cost could be high
Basically, almost all company and organizations want to target a
profit in their business. Although profit is important, the cost of
production important for organization in order to reduce the cost
of operation. From the beginning, the production process of
semiconductor microchips involves certain process that needs a
computer to deal with it. So the cost of production need to be
taken care and controlled it properly. Strategic management
process should be designed with the hope that it will help in the
pursuit of the target goals set by the company.

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3.0

FACILITY LAYOUT
Facility layout and design is an important component of the

overall business operations, both in terms of maximizing the

effectiveness of the production process and meet the needs of
workers. The basic objective of the layout is to ensure a smooth
work, materials and information through the system. The basic
meaning of the facilities is a space where business activities were
happening. Layout and design that gives the impression of space
is how the work is done workflow, materials and information
through the system. The key to a good facility layout and design
is the integration needs of people, materials, and equipment in
such a way that they have a system that works with both single.
Results layout will affect the quality and competitiveness of the
company (Russell & Taylor III, 2011). Effective layout also reduces
movement and handling costs, use of space and labour
efficiently, eliminate bottlenecks, improve product and service
quality and increase capacity. The company uses a flexible
layout. Organized layout of the function and not by the service or
product.
Intel Facility Layout
The crowning achievement of our civilization is the ability
to make microchips. It is by far the most complex object ever
made by mankind.

Probably second in complexity to the

microchip is the $10 billion dollar clean room theyre made

within. And third, the motherboard inside computers. Everything
else pales in comparison. Nearly any electronic device you can
think of depends on a microchip to function. Even toasters.
Somewhere along the line, even complex objects that dont have
one, like batteries, were made with equipment that used chips.
This industry is enormously expensive. Moores Law says
that over the history of computing hardware, the number of
transistors in a dense integrated circuit doubles approximately
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every two years.

Some say that Moores 2nd Law is the

escalating cost of a semiconductor fab plant, which doubles

every 3 years. Intels Fab 32 cost an estimated $3 billion in 2007,
revised to $3.5 billion in 2011. A 2009-2010 upgrade to an Intel
fab, Fab 11X, cost $2.5 billion (on top of a 2007 $2 billion
upgrade). The first stage of GlobalFoundries New York 1.3 million
square foot fab will cost >$4.6 billion dollars. TSMCs Fab 15 in
Taiwan is estimated at >$9.3 billion, and they are preparing to
start a fab in 2015 projected at >$26 billion.
A Brief description of some of Intels Fab facilities (Andrews,
2012)

400,000 square feet of cleanrooms a quarter-mile on a

side.
40 miles of pipes for ultrapure water
3 miles of internal monorail transportation
clean rooms constructed with custom

construction materials.
Cement consumption is so high that Intel builds cement

plants on their construction site

Chip fab energy consumption is 55-65 megawatts in one

case. I
The largest land-based crane in the world was used to pick
up

and

place

massive

roof

trusses

pre-cleaned

that

weigh

approximately 300 tons each.

The crane is so large it had to be delivered on trucks to the

site in pieces by 250 trucks

24,000 tons of steel rebar
21,000 tons of structural steel. And to make room for the

fab,
875,000 cubic yards of dirt had excavated to make room

for the fab plant

10.5 million man hours will be required to complete the

project.
Basic equipment

can

cost

over

$40,000,000

for

lithography machine, and over $50,000,000 for steppers

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Software.

In 1995 a chip that went into a stand-alone

product and required 100,000 lines of code, in 2002: a

typical

chip

for

networked

programmable

product

required a million lines of code (Fiddler)

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Advantage
Intel's

manufacturing

organization

encompasses

wafer

fabrication, assembly, high-volume testing, board manufacturing,

and outsourcing. This geographically dispersed manufacturing
organization consists of:

Wafer fabrication facilities in the United States, Ireland,

Israel, and China

Assembly and test facilities in the United States, Malaysia,

Costa Rica, China, and Vietnam

Subcontracting and outsourcing

facilities

in

multiple

worldwide locations
At each manufacturing site, the Quality and Reliability staff
monitors quality, provides feedback to the Product Design and
Technology Development organizations, and participates in
problem solving. The local quality and reliability organizations
report jointly to local site management and the Corporate Quality
Network management, thus meeting local needs and maintaining
policy consistency across Intel (Intel Corp, 2014).
Internal training organizations develop and provide training for
manufacturing job functions, including supervisors, engineers,
and factory support personnel. All manufacturing technicians and
production

operators

receive

training

for

their

jobs

and

certification to a set of competencies. Each factory has a training

group that is responsible for developing manufacturing skills
specific to its needs. Intel emphasizes training in statistics,
Statistical Process Control, structured problem solving, and team
building.
The local organizations have the responsibility and authority to
improve product quality and reliability through the following
actions:

Identify and record problems and corrective actions

Initiate and provide solutions and improvements
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Verify implementation of solutions

Control nonconforming products until deficiencies are

corrected
Initiate actions to prevent nonconformities
Share information and best-known methods across the
geographically dispersed organizations

Factory Certification
Intel uses the ISO 9001:2008 International Standard as the
baseline

for

manufacturing

our

quality

Wafer

system.

Fabrication,

All

of

Intel's

Assembly/Test

mature

sites,

and

Logistics centers are registered to ISO 9001:2008 by a third-party

registrar. The ISO 9001:2008 International Standard implements
a system of standards and procedures that ensures product
uniformity across manufacturing sites. Certificates are available
for viewing at Intel ISO Registrations (Intel Corp, 2014).
New sites implement an ISO 9001:2008-based quality system at
their start-up and are registered as soon as enough time has
passed to gather historical data. Sites must demonstrate that
their quality system has been in use for a minimum of six months
prior to registration.
Disadvantage
Expensive Layout
Due to the nature of the product, users have more options
in the use of layout fixed position. Space is an important thing to
do the job. Employees need space and comfortable conditions for
doing business. For many layouts fixed position, a crowded work
area so little storage space available. It also can cause handling
problems. In the administration, often dealing with issues to do
because it does not have a comfortable space to do the job. This
will make a higher administrative burden for the layout fixed
position. Term control can be cramped and difficult coordination.

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4.0

DISCUSSIONS

Strategy
As we know, the good facility layout will make the company in
good job because the employee easy to doing anything and the
time that they need to do any process can be save. The company
have done the good facility layout by that they have do from our
group sight. This is because the raw material, machine and more
place is easy for employee to get it. Through make the effective
facility layout this company will make the cost save, minimize
movement and material handling costs, utilize space and labor
efficiently, increase capacity and so on. I think that the company
is choose the right layout to fulfill the customer order which is
mass production and more efficiency.
In addition, as we know planning is a management process,
it is concerned with defining goals for company's future direction
and determining on the missions and resources to achieve those
targets. To meet the goals, managers may develop plans such as
a business plan or a marketing plan. Planning always has a
purpose. The purpose may be achievement of certain goals or
targets.

For

Intel

Penang

Corporation,

Intel's

Information

Technology organization had developed and implemented a new

strategic planning process to support a common vision and
direction across the organization, and to improve alignment with
the business units it enables.
Decisions
In term of making product, Intel had already come out with
their own product which is semiconductor microchip as their
main product of their brand. To produce the final product of
microchips that company want, they have several stages that
involve in it. Begin with raw material that is made from their
supplier then it undergoes transformation process through it
before it became a final product. At the Intel Penang Malaysia
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they doing many process to manufacture microchips and that

there 6 stage such as molten and to become silicon ingot,
creating

the

development

wafer,
and

photoresist

pattern,

coating,

functional

and

photolithography,
connection,

and

bonding and completion. The process that they have done is

good because the quality of the microchips and their product is
very goods in quality and very efficient.
From this, as we know Intel has produce many microchips
product such as in many computer and telephone such as in
ASUS, ACER, HP, and LENOVO. That prove that the process that
they have done is right and get to achieve their goal.
Application
Intel

goal

is

to

be

the

preeminent

provider

of

semiconductor chips and platforms for the worldwide digital

economy. As part of Intel overall strategy to compete in each
relevant market segment, Intel use their core competencies in
the design and manufacture of integrated circuits, as well as
their financial resources, global presence, and brand recognition.
Intel believe that they have the scale, capacity, and global reach
to establish new technologies and respond to customers needs
quickly.

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5.0

CONCLUSIONS
Intel Penang Sdn. Bhd. is electronic company that produces

the electronic product, all the product had produce by Intel

company are Bluetooth chipsets, flash memory, microprocessors,
motherboard chipsets, Network interface controllers, mobile
phones, solid state drives, central processing units. Intel is the
microprocessor maker widespread since four decades ago and
until now the most widely used architecture to run the Linux
operating system platform and used exclusively for Windows.
Furthermore, Intel Penang Corporation, Intel's Information
Technology organization had developed and implemented a new
strategic planning process to support a common vision and
direction across the organization, and to improve alignment with
the business units it enables. Strategic planning processes are
one of the most important processes in any organization, as they
directly integrate to or indirectly influence every other process,
role, and measurement.
Intel uses a photolithographic "printing" process to build
the chip layer by layer. Many layers deposited over the wafer and
then released in a small area to create transistors and
interconnects. Together, they will become an active part of the
circuit chip and the relationship between them, the threedimensional structure
Recommendation
For recommendation to the Intel Company, we all know
that Intel chip manufacturers own their own brand of intelligence.
But Intel still has not issued other gadgets such as mobile
phones, computer, and television and so on. Intel Company a
large and successful with its own R & D. Accordingly, Intel is able
to start a larger business by issuing Intel branded gadgets. Intel
also they are able to successfully supply the chip to other
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electronic equipment. They are more aware of the weakness of

their chips and are capable of better.
Through our observations, such as Intel workers in danger
because of the lack of regulation for use in factory when
operating. There are workers who do not wear masks, some
workers not even wear clothes that are reserved. Even though
they have insurance for all their employees, but the safety
precaution must be tightened because it involves worldwide
regulations. Therefore, as a successful company, Intel Penang
should give more attention to their employees.
The best from this company so it is their location strategy.
It is located in the industrial area in the Bayan Lepas. Their
facilities have adequate equipment such as roads, cargo ships,
planes close to their suppliers and good communication line. This
will make it easier for them to operate but also save on transport
costs. We were also told, that there is not much factory their
customers with them. It facilitates the cost of transmitting.
Finally, Intel Penang Corporation is a factory that should be
emulated because of well-equipped and clean. We have also
seen record the damage and found the risk of chip damage is
very less. More importantly equipment was operated by only
experienced and trained workers.

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REFERENCES
Andrews, E. (January, 2012). Whats Behind the Products you
Love?

Intel

Blog.

Retrieved

from

http://blogs.intel.com/technology/2012/01/what
%E2%80%99s-behind-the-products-you-love-2/
Bloomberg. (23 June, 2016). Company Overview of Intel Malaysia
Sdn.

Berhad.

Retrieved

from

Blooomberg

Web

Site:

http://www.bloomberg.com/research/stocks/private/snapsh
ot.asp?privcapId=22454059
Cisco Global. (2015). Cisco Global Cloud Index: Forecast and
Methodology,

2010

2015.

Retrieved

from

http://www.cisco.com/en/US/solutions/collateral/ns341/ns52
5/ns537/ns705/ns1175/Cloud_Index_White_Paper.html
Graham, L. ( 14 December, 1998). USA versus Microsoft: the
fourth week. BBC News.
Intel Corp. (2014). Intel Quality System Handbook 2014. New
York: Intel Corporation.
Intel Corporation. (2015). Worldwide Device Estimates Year 2020
- Intel One Smart Network Work forecast.
Intel Corporation. (2016). Transistors to Transformations- From
Sand to Circuits.
Interl Corporation. (2007). Performance Inside: 2007 Annual
Report.
Russell, R. S., & Taylor III, B. W. (2011). Operations Management
Creating Value Along the Supply Chain. Virginia: John Wiley
& Sons.
Thompson, F. (9 February, 2005). Mass Production. Salem,
Oregon, United States of America.

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