50-ME30-PRO-014-O Manufacturing Engineering Equipment and Tooling Buy-Off

50-ME30-PRO-014-O
Manufacturing Engineering Equipment & Tool BuyOf

Work Instruction
Re
v
Designation
Approver
Approval Signature
Sign Date
ME
KC Low
Signed
14-Sep-16
TE
Tue Hieu
Signed
14-Sep-16
IE
Quang Hung
Signed
13-Sep-16
QE
KL Soo
Signed
18-Sep-16
FC
Dat Bui
Signed
13-Sep-16
EHS
Triet Thieu
Signed
13-Sep-16
Release date
Originato
Change Details
r
-
18-Jul-13
Viet
Nguyen
Remove Site document 50-ME40-PRO-014-006 Wave

solder pallet design guideline.
Follow Global document 00-ME20-1000-008 Global
Design of Wave Solder Fixture

Add in Item : 8.5 Inspection Template Buy-off
Rename this document from Line, Equipment and

Tooling Buy-Off to Manufacturing Engineering
22-Aug-13
Thang
Hoang
Equipment & Tool Buy-Off

-
Remove Process Flow,8.6,8.7 and all relevant Line buyoff and Equipment registration instructions
Add new Stencil Buy-off requirements in 8.3.4, 8.3.5,

8.3.6, 8.3.7 and 8.3.8.
19-Feb-14
18-Jul-14
8-Aug-14
27-Aug-14
Tien Tran
Restructure the entire document.

Updated 8.4 Wave Fixture Buy-off
Added 50-ME80-PRO-014-012 into 9.0 &10.0
Added 50-ME80-PRO-014-013 into 10.0
Added measurement tool calibration-verification
Elwood
Gacayan
instruction on 8.2.1
-
Added 50-ME-80-PRO-014-014 into 8.2.2.5, 9.0 & 10.0
Modify section 8.2.1. Add in Lead free and leaded
Nguyen
Vuong
identification requirement.
Add 8.3 PCB Assembly Line Equipment Qualification
Nguyen
Add 50-ME80-PRO-014-015 PCB Assembly Line
Vuong
Equipment Qualification Template

-
Add 50-ME80-PRO-014-016 PCB Assembly Line
Jabil Proprietary and Confidential All rights reserved Printed copies are Reference only
Page 1 of 25
50-ME30-PRO-014-O
Work Instruction
Equipment Qualification Plan Template
L
05-Feb-15
flowchart to Section 7
Thang
- Add 8.3.8 PCB Assembly Line Equipment Qualification
Hoang
Instruction
-
10-Apr-15
07-Mar-16
Tam Le
Vu Lai
Move PCB Assembly Line Equipment Qualification
- Add 8.4.7 to clarify the lifespan of new stencil

Add in reference document : 00-ME20-00004 Global
Design Of Press Fit Fixture in section 5.6.
Add in PressFit Tool Buy-off in section 8.5
Add Pressfit Tool Buy-off Checklist in section 10.

Update section 5
Add in ING requirement for section 8.4.4

Update section 2.4
Update section 3.0 for SIS700 defination
Add in 7.2 Stencil Buy-off and Verification Process
Update 8.4.3 to require stencil aperture check during buyoff

- Add in VA 50-ME40-PRO-014-023 Stencil Inspection
System Operating Instruction
22-Sep-16
Vu Lai
Add in 8.4.4 to require stencil aperture check after 30000

or 60000 squeegee times
Add in 8.4.5 to require calibration and verification for

SIS700
Add in section 8.8
for Tool/Jig/Fixture Buy-Off.
+ Create VA 50-ME40-PRO-014-022 Jig And Fixture PM

Instruction
+ Create checklist 50-ME80-PRO-014-023 Jig And Fixture
PM Checklist.
Update section 9.0, 10.0 to cover 50-ME40-PRO-014-022
and 50-ME80-PRO-014-023
1.0PURPOSE
1.1 The purpose of this work instruction is to define process flow and handling method for new
process and equipment buy off before releasing to production.
1.2 To minimize incident and accident that may cause by equipment.
1.3 To reduce risk or hazard to personal safety and health or impact to the environment.
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50-ME30-PRO-014-O
Work Instruction
2.0 SCOPE
2.1 This work instruction covers to buy-off all ME, IE equipment & tools, directly or indirectly used to
produce a product in Jabil Vietnam.
2.2 This work instruction NOT cover to Jig/Fixture and equipment buy-off for Testing Engineering
Department (such as: ICT, FVT, AOI).
2.3 For Test equipment and test fixture refer to # 50-TE30-INS-002 Test Equipment and Fixture Work
Instruction.
2.4 This document shall not be altered without the approval from the following affected
functions/work cells: QE, IE, TE, ME, Facilities.
3.0
DEFINITION/ TERMINOLOGY
3.1 Equipment (machine) is defined as any structure consisting of a framework and various fixed and
moving parts, for which is doing some kind of mechanism.
3.2 Equipment (machine) owner is defined as any engineer or officer who request and has
responsibility over the machine operation.
3.3 NRE
Non Recurring Expenses
3.4 Jabil Own
Own Purchase/ Fabricate by Jabil Vietnam or Transfer from another site.
3.5 Assessment Team - Work cell member, Safety Officer, ESD Coordinator, PM coordinator
3.6 EOL
End of Line
3.7 DCC
Document Control Center
3.8 QACA Quality Assurance Calibration Administrator

3.9 Tools
Include as: Jig, Fixture use for SMT or Box build area, SMT, Wave, Wash
pallet, inspection template, plastic tool / mold & metal tool/ stamping and another
equipment support production.
3.10Stencil
Refers to the entire assembly consisting of frame, metal mask, and
polyester mounting mesh.

3.11
ME
Manufacturing Engineering.
3.12
IE
Industrial Engineering.
3.13
PM
Preventive Maintenance.
3.14
Cleaning operators who will perform cleaning, check tension for stencil and do PM for
pallet .
3.15
4.0
SIS700
Stencil Inspection System 700
TRAINING
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50-ME30-PRO-014-O
Work Instruction
4.1
Required all employees in ME,IE departments should be trained to this document.
4.2
This document should be trained upon hire and subsequent revision change.
5.0
REFERENCE DOCUMENTS
5.1 50-QE30-PRO-020 50-ME30-PRO-011
Site ESD Control Process

Site Equipment Control
5.3 00-MT20-1000-008
Jabil Production Part Approval process
5.4 00-ME20-1000-008
Global Design of Wave Solder Fixture
5.5 00-ME20-00004
Global Design Of Press Fit Fixture
5.6 00-ME20-00003
Global PCB Assembly Line Equipment Qualification
5.7 EX-IG-105
Stencil & Stencil Aperture Management SAP Guidelinesv3
6.0
RESPONSIBILITY
6.1 It is the responsibility of the Manager or Engineer who takes the ownership of the equipment for
ensuring that it is safe to operate as well as meet the requirement.
6.2 It is the responsibility of the equipment/ tool owner to ensure the equipment/ tool has been
properly set up, fully operational and has been approved by the assessment team before release
for production use. QE Workcell and WCM is responsibility to validate new line setup and approve
before run production.
6.3 The relevant owner of the equipment/tool shall be required to adhere to the decision made by the
Assessment Team taking necessary steps or precautions to achieve the best safety, health and
environment standards and benefits for the company and the employees.
6.4 Equipment/tool owner shall prepare the document to buy-off. Equipment/tool owner also shall
evaluate the performance of the equipment/tool.
6.5 QACA shall verify all documents buy-off provided by owner with full people signed and issue
stamp Accepted for use for equipment/tool.
6.6 QACA shall ensure the equipment/ tool performed PM/Calibration on time.
6.7 It shall be the responsibility of Facility Engineer to supply utilities for effective operation of
equipment/ tool. These include light, electricity, ventilation, air conditioning, and heated DI water.
7.0 PROCESS FLOW
7.1
PCB Assembly Line Equipment Qualification Flowchart
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50-ME30-PRO-014-O
Work Instruction
7.1
Page 5 of 25
50-ME30-PRO-014-O
Work Instruction
7.2
Stencil Buy-of and Verification Process
Start
No
New Stencil or Stencil
reached 30000 or 60000
squeegee times
Yes
Stencil set up on SIS700
Select vision magnification
Perform aperture check
No
Quarantine stencil for ME disposition
Pass?
Yes
Record in eStencil and Endorse for production use
END
Page 6 of 25
50-ME30-PRO-014-O
Work Instruction
8.0
INSTRUCTION
8.1 Set-up for equipment/tool

8.1.1
Engineer is responsible for receive the equipment/ tool from vendor through purchase,
transfer from another site or lent/ consigned to the site by customer.
8.1.2
Equipment/tool owner shall be labeled with the Under Engineering Evaluation or Under
Set up sign and remove only when all of that is completed.
8.1.3
Engineers responsible for the set-up equipment/tool correctly the location and notify to
Facility engineer supply correct the electric power, air pressure, ventilation.
8.2 Equipment/ tool buy-off

8.2.1
Equipment/ tool owners shall ensure technical and safety requirement for the process
and ensure buy-off process has been implemented. Equipment/Tool shall be subject for
PM, Verification or Calibration. Customized fabricated measuring tools such as slip gauge
and go no go jigs and same purpose tooling, after buy-off are subject for verification
every 6 months.
Any new equipment / tool brought in should be identified for Lead free or Leaded
application & visible markings should be available on the equipment / tool.
_Lead Free identification :
8.2.2
Each equipment/tool have required specific technical follow process request but not
limited to and if applicable, attach below should be used as acceptance criteria:
8.2.2.1
Equipment Cpk evaluate (Cpk > 1.33) application for all SMT machines (such as:
printer, pick &place, Reflow, Wave). And the Cpk data shall attached in
evaluation result follow specific format for each equipment/ tool. Evaluation Cpk
also need to perform after relocation/re-layout line or moved the machine.
8.2.2.2
Equipment GR&R, strain gauge test(if applicable).
8.2.2.3
Equipment buy-off checklist (50-ME80-PRO-014-003).
8.2.2.4
Tool buy-off Checklist (50-ME80-PRO-014-001).
8.2.2.5
Measurement Tool Verification (50-ME80-PRO-014-014).
8.2.2.6
EH&S Buy-off checklist (50-ME80-PRO-011-006).
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50-ME30-PRO-014-O
Work Instruction
8.2.3
Equipment/ tool after evaluated need to ensure that it is safe to operate and ESD
compliances.
8.2.4
Equipment / tool owner is responsible for trained and qualified personnel should use
equipment / tool.
8.2.5
Assessment team for equipment/ tool buy-off- QA Engineer, Production supervisor, ESD
coordinator, Safety officer and PM coordinator are responsible verify or precautions to
achieve the best safety, health and environment standards, ESD compliances.
8.2.6
Spare part
8.2.6.1
For spare part inventory: after finished equipment / tool buy-off, the
equipment/tool owners should be key in ME storecontrol.xlsx file as the link:
\\Hcmfile01\1.all_depts\5.ME\ME_Public\01.PLANT\13.ME Store. The spare parts
for each equipment/tools control and stock in ME store.
8.2.6.2
For spare part control: Spare part coordinator are responsible for import and
export part in ME store. The instruction spare part controls refer to # 50-ME40PRO-014-009 Spare Part Control Guideline.
8.3
PCB Assembly Line Equipment Qualification

8.3.1
Screen Printing Equipment:

8.3.1.1
Solder paste screen printing equipment is used to apply solder paste onto PCBs
through a metal stencil cut with a pattern of apertures. Solder paste is a
material consisting primarily of the metals and fluxes necessary to create the
mechanical and electrical connections between the PCB and components
subsequently placed onto a PCB.
8.3.1.2
Qualifying screen printing equipment entails establishing through objective

evidence key aspects of the equipment installation and operation adhere to the
manufacturers
regulatory
approved
requirements.
specifications,
This
is
Jabil's
accomplished
requirements
and
by
review
careful
local
of
manufacturer documentation and Jabil procedures and work instructions. All

system operations are to be verified prior to performing a final equipment
capability study.
8.3.1.3
The purpose of a screen printer capability study is to ensure the equipment can
repeatedly deposit material in the proper location across the range of parameter
settings expected during production. The primary measurable identified for
determining capability is the registration (X-Y axis) of the print deposits.
Additional characteristics include deposit volume, area and average height.
These additional characteristics are primarily a function of the stencil, squeegee
blades and parameter settings and as such may not directly represent the
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50-ME30-PRO-014-O
Work Instruction
mechanical capability of the screen printer across stencils, etc. The key
equipment parameters identified for the basis for the screen printing equipment
capability study are:
_Squeegee Print Speed
_Squeegee Print Force Separation
_Speed of the stencil from the PCB
8.3.1.4. The site qualification team may evaluate additional equipment parameters if
desired however, baring engineering rational for exclusion, the equipment
parameters listed here are to be included.
8.3.1.5
The capability study will evaluate the range including the upper and lower
settings, for all three parameters. Most production screen printing program
settings should fall within these identified limits. If a particular screen printer is
required to function at settings outside of identified limits, then the required
high and low settings must be used for the equipment capability study (Ex:
parameter settings are to be changed to account for environmental variation.)
8.3.1.6
For screen printing, information gathered in the equipment capability study can
be suitable for establishing initial process controls. If Statistical Process Control
(SPC) sampling is used in instead of 100% automated inspection, nominal runs
from the equipment capability are available as first entries to a proposed SPC
chart. The nominal runs used on an SPC chart must be in SPC control for use as
baseline data. If the nominal runs are not in SPC control, an investigation must
be performed and appropriate action must be based on the results of the
investigation. Consult an SPC expert for assistance.
8.3.1.7
There is no requirement for regularly scheduled re-qualifications. Ongoing

verification through subsequent inspection/testing or process controls are then
required to ensure consistent operation and identify the need to address
equipment issues. Qualification is required upon Equipment Qualification Trigger
as defined in this document if the process is not fully verified through
subsequent inspection or testing. Ongoing verification of screen printing process
output can be accomplished by either/or Automated Solder Paste Inspection
(SPI), Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection
and ICT / Functional Evaluation. Process controls require a minimum verification
of the first front stroke and first back stroke of each run on a paste inspection
system.
8.3.1.8
Refer to Template : 50-ME80-PRO-014-015 PCB Assembly Line Equipment

Qualification Template
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Work Instruction
8.3.2
Component Placement Equipment:

8.3.2.1
Component placement equipment is programmed to pick up and place

components onto a PCB at predetermined locations. The equipment picks
components from different types of carrier media such as reels, trays or a tube
containing the component. The equipment then uses an automated camera
vision system to align the component (X-Y axis, Theta rotation) and places the
component in the desired location.
8.3.2.2
Qualifying component placement equipment entails establishing through

objective evidence all key aspects of the equipment installation and operation
adhere to the manufacturers approved specifications, Jabil's requirements and
local regulatory requirements. This is accomplished by a careful review of
manufacturer documentation and Jabil procedures and work instructions. All
system operations are to be verified prior to performing a final equipment
capability study.
8.3.2.3
The purpose of a component placement capability study is to ensure the

equipment can repeatedly place components in the proper location across the
range of parameter settings expected to be used during production. The primary
measurable identified for determining capability is the X-Y axis placement of
components. An additional characteristic is the component rotation. Commonly
referred to as Theta, rotation is most critical for high precision placement of
critical components (Ex: fine pitch leaded components, ball grid array
component). Thus if the equipment is not identified for high precision
placement, Theta rotation may be considered less critical. Rotation information
is typically available along with X and Y axis rotation and can be useful to
maintain. The key equipment parameters identified for the basis for the
component placement equipment capability study are:
_Placement Speed (per Component Precision)
8.3.2.4
The site qualification team may evaluate additional equipment parameters if

8.3.2.5
The capability study will evaluate the upper speed at which the equipment will
run with a representative of the precision of components typically placed using
the equipment. The placement speed settings for high precision parts are
typically lower than placement speeds for low precision parts. If the equipment
will place both low and high precision parts, then representative low precision
parts (Ex: 0402 resistors) are to be placed at high speed for low precision parts
and a representative high precision parts (Ex: 100 pin TQFP) are to be placed at
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Work Instruction
high speed for high precision parts. For either low or high precision part type,
the speed setting should test the upper limit seen in production. Most
production placement program settings should fall within these equipment
speed limits. If particular placement equipment is required to run at settings
above the previously indicated component speed limit, then the required high
settings must be used for the equipment capability study.
8.3.2.6
For placement equipment, information gathered in the equipment capability

study can be suitable for establishing initial process controls. Placement
equipment typically have onboard-self monitoring of miss registration on nozzle
and miss pickups which are valuable tools to monitor performance trends.
Component
registration
monitoring
involves
measurement
typically
best
obtained by Automated Optical Inspection (AOI) systems. If SPC sampling is

used instead of 100% automated inspection, nominal runs from the equipment
capability are available as first entries to a proposed SPC chart. The nominal
runs used on an SPC chart must be in SPC control for use as baseline data. If the
nominal runs are not in SPC control, an investigation must be performed and
appropriate action must be based on the results of the investigation. Consult an
SPC expert for assistance.
8.3.2.7

verification through subsequent inspection/testing or onboard equipment
process monitoring controls are required to ensure consistent operation and
identify the need to address equipment issues. Qualification is required upon
Equipment Qualification Trigger as defined in this document if the process is not
fully verified through subsequent inspection or testing. Ongoing verification of
component placement process output can be accomplished by either/or
Automated Optical Inspection (AOI), Visual Inspection, X-Ray Inspection and ICT /
Functional Evaluation.
8.3.2.8

8.3.3
Oven Reflow Equipment

8.3.3.1
Reflow ovens follow the end of the surface mount technology process and form
electrical connections between the PCB surface terminations and placed
electrical components. Prior to reaching the reflow oven, a PCBA receives an
application of solder paste to the electrical connection lands. An electrical
component, such as a resistor or BGA, is then placed on top of the solder paste.
A reflow oven consists of a conveyor system on which the PCBA are moved
through multiple heating zones and a final cooling zone. The zones apply
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Work Instruction
increasing levels of heat to the populated PCBA. As the temperature rises, solder
paste is liquefied and then cooled until the liquid solder is solidified forming a
solder joint connection between the PCB land and component termination.
8.3.3.2
Qualifying reflow oven equipment entails establishing through objective

manufacturers
approved
specifications,
Jabil's
requirements
and
local
regulatory requirements. This is accomplished by careful review of manufacturer

documentation
and
Jabil
procedures
and
work
instructions.
All
system
operations are to be verified prior to performing a final equipment capability

study.
8.3.3.3
The purpose of a reflow oven capability study is to ensure the equipment can
repeatedly provide a temperature over time profile across the range of
parameter settings expected to be used during production. The primary
measurable identified to determine capability is the temperature consistency
per oven zone. Additional characteristics include temperature slope, soak
temperature, peak temperature and Time Above Liquidus (TAL) however these
characteristics are unique to a particular product reflow profiles. The key
equipment parameters identified for the basis for the reflow oven equipment
_Conveyor Speed
_Zone Temperature
8.3.3.4

8.3.3.5
The capability study will evaluate the high and low zone temperatures and
conveyor speeds in both a high and low thermal loading scenario. Thermal
loading simulates situations where the amount of product within oven at one
point of time may affect the environment by lowering zone temperatures. Most
production reflow profile settings should fall within the identified study limits. If
a particular temperature profile is required to run at settings outside of these
limits, then the required profile high and low settings must be used for the
equipment capability study.
8.3.3.6
For reflow ovens, information gathered in the equipment capability study can be
used for establishing initial process controls. Studies can then be repeated on a
consistent basis to monitor performance. If SPC sampling is used instead of
100% onboard monitoring, runs from the equipment capability are available as
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Work Instruction
first entries to a proposed SPC chart. The nominal runs used on an SPC chart
must be in SPC control for use as baseline data. If the nominal runs are not in
SPC control, an investigation must be performed and appropriate action must be
based on the results of the investigation. Consult an SPC expert for assistance.
Onboard monitoring systems are preferred to sampling as these systems
provide data relevant to individual profiles as well as traceability.
8.3.3.7
There is no requirement for regularly scheduled re-qualifications, process control

is to be used to ensure consistent operation and identify the need for requalification. Qualification is required upon Equipment Qualification Trigger as
defined in this document if the process is not fully verified through subsequent
inspection or testing. Ongoing verification of the reflow oven process output can
be accomplished by either/or Onboard monitoring systems, X-Ray Inspection
and ICT / Functional Evaluation.
8.3.3.8

8.3.4
Wave Solder Equipment:

8.3.4.1
Wave solder equipment is used to solder through-hole components after the

SMT reflow process. Though-hole components, such as connectors, LEDs or large
capacitors, have leads which pass though the PCB and within copper barrels
know as Plated Through Holes (PTH). The PCB, with the through-hole
components inserted, enters the wave solder process on a conveyor. The PCB
passes through a flux application unit (spray, foam or prior selective spray)
followed by a heating zone. The zones apply increasing levels of heat to the
previously populated PCBA. After heating, the PCBA immediately passes over a
cascading bath of molten solder. The molten solder then wicks up the protruding
leads and copper barrels forming a connection between the component lead and
barrel.
8.3.4.2
Qualifying wave solder equipment entails establishing through objective

manufacturers
approved
specifications,
Jabil's
requirements
and
local

documentation
and
Jabil
procedures
and
work
instructions.
All
system

study. If a separate selective flux spray unit is position prior to the solder
equipment, the selective spray unit is considered part of the equipment and is
not excluded from the wave solder equipment qualification
8.3.4.3
The purpose of a wave solder capability study is to ensure the equipment can
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Work Instruction
repeatedly provide flux coverage, temperature over time profiles and consistent
solder temperature across the range of parameter settings expected to be used
during production. The primary items identified to determine capabilities are the
flux spray coverage consistency, conveyor speed, temperature consistency per
oven
zone
and
temperature
consistency
of
the
solder
pot.
Additional
characteristics include temperature slope, soak temperature, peak temperature

and solder contact time however these characteristics are unique to a particular
product wave solder profiles. The key equipment parameters identified for the
basis for the wave solder equipment capability study are:
_Flux Coverage
_Conveyor Speed
_Zone Temperature
_Solder Pot Temperature
8.3.4.4

8.3.4.5
The capability study will evaluate flux coverage, the high and low zone
temperatures, conveyor speeds and solder pot temperatures. If a separate
selective spray unit is position prior to the solder equipment, the selective spray
unit is considered part of the equipment and is not excluded from the selective
solder equipment qualification. Most production reflow profile settings should fall
within the identified study limits. If a particular temperature profile is required to
run at settings outside of these limits, then the required high and low settings
must be used for the equipment capability study.
8.3.4.6
For wave solder equipment, information gathered in the equipment capability

study can be used for establishing initial process controls. Studies can then be
repeated on a consistent basis to monitor performance. If SPC sampling is used,
runs from the equipment capability are available as first entries to a proposed
SPC chart. The nominal runs used on an SPC chart must be in SPC control for
use as baseline data. If the nominal runs are not in SPC control, an investigation
must be performed and appropriate action must be based on the results of the
investigation. Consult an SPC expert for assistance.
8.3.4.7

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subsequent inspection or testing. Ongoing verification of wave solder process
output can be accomplished by either/or Automated Optical Inspection (AOI),
Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation
8.3.4.8

8.3.5
Selective Solder Equipment

8.3.5.1
Similar to Wave Solder equipment, selective solder equipment is used to solder

through-hole
components
after
the
SMT
reflow
process.
Though-hole
components, such as connectors, LEDs or large capacitors, have leads which

pass though the PCB and within PTHs. The PCB, with the through hole
components inserted, enters the selective solder process on a conveyor. The
PCB passes through a spray flux application unit followed by a heating zone.
Upon leaving the heating zone, a small solder pot with a nozzle travels to
preprogrammed locations and applies a fountain of molten solder. The molten
solder then wicks up the protruding leads and copper barrels forming a
connection between the component lead and barrel. There may be multiple
solder pots within the equipment to qualify. In addition, units may employ a
multi-chimney which simultaneously solders multiple locations.
8.3.5.2
Qualifying selective solder equipment entails establishing through objective

manufacturers
approved
specifications,
Jabil's
requirements
and
local

documentation
and
Jabil
procedures
and
work
instructions.
All
system

study. If a separate selective spray unit is position prior to the solder equipment,
the selective spray unit is considered part of the equipment and is not excluded
from the selective solder equipment qualification.
8.3.5.3
The purpose of a selective solder capability study is to ensure the equipment

can repeatedly provide flux coverage, temperature over time profiles and
consistent solder temperature across the range of parameter settings expected
to be used during production. The primary items identified to determine
capabilities
are
the
flux
spray
coverage
consistency,
the
temperature
consistency per oven zone and temperature consistency of the solder pot.
Additional characteristics include temperature slope and peak temperature
however these characteristics are unique to a particular product selective solder
profiles. The key equipment parameters identified for the basis for the selective
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solder equipment capability study are:
_Flux Coverage
_Zone Temperature
_Solder Pot Temperature
_Dwell Time
8.3.5.4

8.3.5.5
The capability study will evaluate flux coverage, evaluate the high and low zone
temperatures, solder pot temperatures, and dwell time over nozzle. Dwell time
over nozzle is a function of preprogrammed time as well as X-Y axis alignment.
Most production reflow profile settings should fall within the identified study
limits. If a particular temperature profile is required to run at settings outside of
these limits, then the required high and low settings must be used for the
equipment capability study.
8.3.5.6
For selective solder equipment, information gathered in the equipment

capability study can be used for establishing initial process controls. Studies can
then be repeated on a consistent basis to monitor performance. If SPC sampling
is used, runs from the equipment capability are available as first entries to a
proposed SPC chart. The nominal runs used on an SPC chart must be in SPC
control for use as baseline data. If the nominal runs are not in SPC control, an
investigation must be performed and appropriate action must be based on the
results of the investigation. Consult an SPC expert for assistance.
8.3.5.7

subsequent inspection or testing. Ongoing verification of wave solder process
output can be accomplished by either/or Automated Optical Inspection (AOI),
Visual Inspection, X-Ray Inspection and ICT / Functional Evaluation
8.3.5.8

8.3.6
Inline Wash Equipment:

8.3.6.1
Inline wash equipment is typically placed at the end of automated PCB assembly
lines in order to remove flux residues prior to evaluations such as functional test
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and further mechanical additions. PCBAs travel through the wash on a conveyor
belt and are pressure sprayed by temperature controlled jets of de-ionized water
with cleaning medium. After leaving the wash zones of the equipment, PCBs
pass under high pressure air driers to remove the majority of water. Failure of an
inline wash process has lead to latent field failures via dendritic growth
8.3.6.2
Qualifying inline wash
equipment
entails establishing through objective
manufacturers
approved
specifications,
Jabil's
requirements
and
local

documentation
and
Jabil
procedures
and
work
instructions.
All
system

study
8.3.6.3
The purpose of an inline wash capability study is to ensure the equipment can
repeatedly provide a temperature over time profile across the range of
parameter settings expected to be used during production. The primary
measurable identified to determine capability is the temperature consistency
per
wash
zone.
Additional
characteristics
include
contamination
levels,
temperature slope, soak temperature however these characteristics are unique

to a particular incoming contamination levels or product wash profiles. The key
equipment parameters identified for the basis for the Inline Wash equipment
_Conveyor Speed
_Zone Temperature
8.3.6.4

8.3.6.5
The capability study will evaluate the high and low zone temperatures and
conveyor speeds. Most production wash profile settings should fall within the
identified study limits. If a particular wash profile is required to run at settings
outside of these limits, then the required high and low settings must be used for
the equipment capability study.
8.3.6.6
Ionic Contamination meter data does not provide sufficient information to justify
equipment capability. Ionic Contamination meters provide a reading of the
surface contamination only, not contamination trapped under low profile parts.
Alternative approaches include the use of ionic chromatography testing or
Conductivity Testing of C3 extractions. Ion chromatography data may be used to
Page 17 of 25
50-ME30-PRO-014-O
Work Instruction
characterize
the
wash
Conductivity
Testing.
process
Where
and
followed
with
process
control
via
contamination level analysis is additionally
evaluated during wash qualification, be aware the product/process itself may

not produce sufficient contamination to alarm to a malfunctioning or inadequate
wash process. Refer to the PCB Assembly Line Equipment Qualification Template
8.3.6.7
For inline wash equipment, information gathered in the capability study can be
used for establishing initial process controls. Studies can then be repeated on a
consistent basis to monitor performance. If SPC data sampling is used, runs from
the equipment capability are available as first entries to a proposed equipment
SPC chart. The nominal runs used on an SPC chart must be in SPC control for
use as baseline data. If the nominal runs are not in SPC control, an investigation
must be performed and appropriate action must be based on the results of the
investigation. Consult an SPC expert for assistance. Alternatively, product may
be monitored using ionic contamination meters (or similar) to measure the
outgoing cleanliness with results charted.
8.3.6.8

subsequent inspection or testing. Ongoing verification of inline wash process
output can be accomplished by cleanliness measurements
8.3.6.8

8.3.7
Qualification Hypothesis Decision Guideline
Page 18 of 25
50-ME30-PRO-014-O
Work Instruction
8.3.8
PCB Assembly Line Equipment Qualification Instruction:

50-ME40-PRO-014-017
Wave Machine Qualification Instruction
50-ME40-PRO-014-018
Printing Machine Qualification Instruction
50-ME40-PRO-014-019
SPI Machine Qualification Instruction
50-ME40-PRO-014-020
Pick and place Machine Qualification Instruction
50-ME40-PRO-014-021
Reflow Machine Qualification Instruction
Page 19 of 25
50-ME30-PRO-014-O
Work Instruction
8.4.
Stencil Buy-off
8.4.1
ME Engineer have to contact stencil vendor during the stencil fabrication (send them
correct the gerber file_ last version, check plot, aperture opening and step up/step down,
special requirement ).
8.4.2 The instruction of stencil fabrication refer to #: 50-ME40-PRO-014-007 Stencil Fabrication

guideline.
8.4.3
When receive stencil from stencil vendor shall implemented buy-off (follow checklist: 50ME80-PRO-014-004).
8.4.3.1 Perform aperture check on critical locations as define by customer and/or ME. As
general requirement shall be checked sample measurement locations on: BGA aperture,
QFN aperture, fine pitch locations (Fine pitch location is define as = or <0.65mm), 0201
( or smaller 01005 ) aperture by SIS700. Follow 50-ME40-PRO-014-023 Stencil
Inspection System Operating Instruction
8.4.3.2 Measure the aperture vs. the stencil Gerber in reference to the following
guidelines:
- Laser type: 15m
- Electroformed type: 15m
8.4.4
Normal use of Stencil for production: At every 30,000 squeegees, perform a dimensional
control of the stencil aperture. The sample location is in reference to the location as
define in 8.4.3.1. Measure the aperture vs. the stencil Gerber in reference to the following
guidelines:
- Laser type: 15m
- Electroformed type: 15m
8.4.5
Calibration and verification for SIS700: Camera calibration shall be done in a yearly
period. A monthly verification for vision check shall be performed and record into 50ME80-PRO-014-014 Measurement Tool Verification Report.
8.4.6
For
the
new stencil request,
the
minimum
information
should
be included
on
the stencil marking :

_Manufacturer Name#
_Stencil Job ID#
_Nature of stencil#
_Thickness of stencil#
_PCB P/N and Revision#
_Date of Manufacturing#
_Customer Name#
_Process # Leaded or Lead Free
_Lead Free logo for Lead free stencil
*Note: As Ingenico requirement a marking on stencil display: The file name of the Gerber
Page 20 of 25
50-ME30-PRO-014-O
Work Instruction
used for fabrication
8.4.7
Information Location:
_Squeegee Side of the Stencil
_Front edge, left or right corner
8.4.8
Request to review and align the visual inspection procedures as defined for plant specification.
8.4.9
Lifespan for new stencil is to be decided by both parties (Jabil & Customer) based on the
quality of the stencil (whether the stencil is out of spec or not) and the reliability of the
stencil (the number of cycle the stencil has been used in production). In case customers
input is not available, the lifespan will be decided based on the workcellss requirement.
As default, stencil life span is 90000 cycles or failing tension check, whichever comes
first.
8.4.10 The decision to extend the lifespan for the stencil is to be reviewed by both parties (Jabil
&
Customer) on a case-to-case basis to avoid any impact on production resulting line
stop.
8.4.11 Said decision is integrated into Work cell SMT VA.
8.5 Pressfit Tool Buy-off.
8.5.1
The instruction of Press Fit Tool fabrication refer to 00-ME20-00004 Global Design
Of Press Fit Fixture.

8.5.2
WC ME Engineer have to contact Press Fit Tool vendor during Press Fit Tool
fabrication (send them the correct Gerber files with latest version, check plot, special
requirement)
8.5.3
When received Press Fit Tool from vendor, WC ME Engineer have to implement
buy-off (follow Pressfit Tool Buy-off checklist 50-ME80-PRO-014-022).

8.6
Wave Fixture Buy-off

8.6.1
ME Product Owner responsibility for the wave pallet fabrication:

8.6.2.1
Contact wave fixture vendor during the wave fixture fabrication (send
them correct the gerber files_ last version, check plot,).

8.6.2.2 Verify any special requirements for the wave pallet design
8.6.2.3
Verify the wave pallet suitable flow direction
8.6.2.4
Make sure all information engravedon wave pallet is correct
8.6.2.5
Make sure the pallet design will not impact components surrounding the
PTH components.
8.6.2.6 Verify suitable wave pallet thickness to run the product
8.6.2.7
Verify the top catch design
Page 21 of 25
50-ME30-PRO-014-O
Work Instruction
8.6.2.8
Pallet buy-off before release to production
8.6.2.9
Verify the need to fabricate new pallet if there is revision or PCB part No
change
8.6.2.10 Lead Free logo for Lead free wave pallet.
8.6.2
The instruction of wave fixture fabrication refer to #: 00-ME20-1000-008 Global Design of
Wave Solder Fixture and #50-ME40-PRO-014-013 Pallet Fabrication Guidelines VA

8.6.3
When receive wave fixture from wave fixture vendor shall implemented buy-off (follow
checklist: 50-ME80-PRO-014-012 Wave Pallets Buy-off Checklist)

8.6.4
8.7
Inform cleaning operator to register a new pallet into e-PTS software accordingly.
Inspection Template Buy-off

8.7.1 WC ME Engineer have to contact Inspection Template vendor during Inspection Template
fabrication (send them the correct gerber files with latest version, check plot, special
requirement)
8.7.2
When receive Inspection Templates from vendor, WC ME Engineer have to implement

buy-off (follow Tool buy-off checklist 50-ME80-PRO-014-001).
8.7.3
WC ME check for inspection template monthly according to 50-ME80-PRO-014-011

Monthly checklist for Inspection Template.
8.8
Tool/Jig/Fixture Buy-Off:
8.8.1
When receive Tool/Jig/Fixture from vendor, WC ME Engineer have to implement buy-off
(follow Tool buy-off checklist 50-ME80-PRO-014-001).

8.8.2
WC ME do maintenance for Tool/Jig/Fixture follow 50-ME40-PRO-014-022 Jig And Fixture
PM Instruction then record to 50-ME80-PRO-014-023 Jig And Fixture PM Checklist.

8.9
Production
8.9.1
The QE Engineer and WCM is responsibility to validate and approve new line setup and
buy-off report follow 50-ME80-PRO-014-008 The New Line Equipment and Tool buy-off
checklist prior to release for production
8.9.2
Production supervisors are responsible for ensuring proper storage, proper location and
all equipment/ tools/ stencil in assigned work cell.
8.9.3
Only use properly trained and qualified personnel should use the equipment/tool.
8.9.4
Do not use devices with a Under repair, Under set up, Under Evaluation signed on
them or PM/ Calibration stamp out of due date.
9.0
RECORD REQUIREMENTS
Page 22 of 25
50-ME30-PRO-014-O
Work Instruction
Doc #
50-ME80-PRO-014-001
50-ME80-PRO-014-003
50-ME80-PRO-014-004
50-ME80-PRO-011-005
Title
Retention time
Tools Buy-Off
Until EOL
checklist
(equipment/ Tool)
Equipment Buy-Off
checklist
(equipment/ Tool)
Stencil Buy-Off
Until EOL
checklist
(equipment/ Tool)
Equipment, Tools
Until EOL
acceptance form
(equipment/ Tool)
The New Line

50-ME80-PRO-014-008
Until EOL
Equipment and Tool

buy-off checklist
Until EOL (work

cell or line change)
Stored
by
Type
(Hard/Soft
copy)
DCC
Hard
DCC
Hard
DCC
Hard
DCC
Hard
DCC
Hard
Storage
location
DCC
room
DCC
room
DCC
room
DCC
room
DCC
room
Spare
50-ME80-PRO-014-010
part
Import/ Export
2 years
record Form
coordina
Hard
tor/ ME
ME store
room
support
50-ME80-PRO-014-011
Monthly Checklist
for Inspection
1 Year
ME WC
Hard
WC Store
DCC
Hard
DCC
Hard
ME
Hard
ME Room
ME
Hard
ME Room
DCC
Hard
ME WC
Hard
Template
50-ME80-PRO-014-012
50-ME80-PRO-014-014
Wave Pallets Buy-off

Checklist
Measurement
(equipment/ Tool)
Tool
Verification
PCB Assembly Line
50-ME80-PRO-014-015
Equipment Master
Qualification
PCB Assembly Line
50-ME80-PRO-014-016
Equipment Master
Qualification Plan
50-ME80-PRO-014-022
50-ME80-PRO-014-023
Pressfit Tool Buy-Off

Checklist
Jig And Fixture PM
Checklist
Until EOL
Until EOL
(equipment/ Tool)
Until EOL
(equipment/ Tool)
Until EOL
(equipment/ Tool)
Until EOL
(equipment/ Tool)
2 Years
Page 23 of 25
DCC
room
DCC
room
DCC
room
WC Store
50-ME30-PRO-014-O
Work Instruction
10.0
OTHER REQUIREMENTS (Materials, Equipment, Number 80 Forms Tied to the

Document, etc)
10.1
50-ME80-PRO-014-001
Tools Buy-Off checklist
10.2
50-ME80-PRO-011-006
EH & S Buy-Off checklist
10.3
50-ME80-PRO-014-003
Equipment Buy-Off checklist
10.4
50-ME80-PRO-014-004
Stencil Buy-Off checklist
10.5
50-ME80-PRO-011-005
10.6
50-ME40-PRO-014-007
Stencil Fabrication guideline
10.7
50-ME80-PRO-014-008
The New Line Equipment and Tool Buy-off
10.8
50-ME40-PRO-014-009
Spare Part Control Guideline
10.9
50-ME80-PRO-014-010
Import/ Export record Form
Equipment, Tools acceptance form
10.10 50-ME80-PRO-014-011
Monthly Checklist for Inspection Template
10.11 50-ME80-PRO-014-012
Wave Pallets Buy-off Checklist
10.12 50-ME40-PRO-014-013
Pallet Fabrication Guidelines VA
10.13
50-ME80-PRO-014-014
Measurement Tool Verification Report
10.14 50-ME80-PRO-014-015
PCB Assembly Line Equipment Master Qualification Template
10.15 50-ME80-PRO-014-016
PCB Assembly Line Equipment Master Qualification Plan
10.16 50-ME40-PRO-014-017
Wave Machine Qualification Instruction
10.17 50-ME40-PRO-014-018
Printing Machine Qualification Instruction
10.18 50-ME40-PRO-014-019
SPI Machine Qualification Instruction
10.19 50-ME40-PRO-014-020
Pick and place Machine Qualification Instruction
10.20 50-ME40-PRO-014-021
Reflow Machine Qualification Instruction
10.21 50-ME80-PRO-014-022
Pressfit Tool Buy-Off Checklist.
10.22 50-ME40-PRO-014-022
Jig And Fixture PM Instruction
10.23 50-ME80-PRO-014-023
Jig And Fixture PM Checklist.
10.24 50-ME40-PRO-014-023
Stencil Inspection System Operating Instruction
Page 24 of 25
50-ME30-PRO-014-O
Work Instruction
Page 25 of 25

50-ME30-PRO-014-O Manufacturing Engineering Equipment and Tooling Buy-Off

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50-ME30-PRO-014-O

Manufacturing Engineering Equipment & Tool BuyOf

Remove Site document 50-ME40-PRO-014-006 Wave

Follow Global document 00-ME20-1000-008 Global

Design of Wave Solder Fixture

Rename this document from Line, Equipment and

Equipment & Tool Buy-Off

Add new Stencil Buy-off requirements in 8.3.4, 8.3.5,

Restructure the entire document.

Added 50-ME80-PRO-014-012 into 9.0 &10.0

Added 50-ME80-PRO-014-013 into 10.0

Added measurement tool calibration-verification

Added 50-ME-80-PRO-014-014 into 8.2.2.5, 9.0 & 10.0

Modify section 8.2.1. Add in Lead free and leaded

Add 50-ME80-PRO-014-015 PCB Assembly Line

Equipment Qualification Template

Add 50-ME80-PRO-014-016 PCB Assembly Line

- Add 8.3.8 PCB Assembly Line Equipment Qualification

Move PCB Assembly Line Equipment Qualification

- Add 8.4.7 to clarify the lifespan of new stencil

Add in PressFit Tool Buy-off in section 8.5

Add Pressfit Tool Buy-off Checklist in section 10.

Add in ING requirement for section 8.4.4

Update section 3.0 for SIS700 defination

Add in 7.2 Stencil Buy-off and Verification Process

Update 8.4.3 to require stencil aperture check during buyoff

Add in 8.4.4 to require stencil aperture check after 30000

Add in 8.4.5 to require calibration and verification for

Add in section 8.8

for Tool/Jig/Fixture Buy-Off.

+ Create VA 50-ME40-PRO-014-022 Jig And Fixture PM

Non Recurring Expenses

3.4 Jabil Own

Own Purchase/ Fabricate by Jabil Vietnam or Transfer from another site.

Document Control Center

3.8 QACA Quality Assurance Calibration Administrator

Refers to the entire assembly consisting of frame, metal mask, and

polyester mounting mesh.

Stencil Inspection System 700

Required all employees in ME,IE departments should be trained to this document.

5.1 50-QE30-PRO-020 50-ME30-PRO-011

Site ESD Control Process

Jabil Production Part Approval process

Global Design of Wave Solder Fixture

Global Design Of Press Fit Fixture

Global PCB Assembly Line Equipment Qualification

Stencil & Stencil Aperture Management SAP Guidelinesv3

PCB Assembly Line Equipment Qualification Flowchart

Stencil Buy-of and Verification Process

Stencil set up on SIS700

Select vision magnification

Perform aperture check

Record in eStencil and Endorse for production use

8.1 Set-up for equipment/tool

8.2 Equipment/ tool buy-off

Equipment GR&R, strain gauge test(if applicable).

Equipment buy-off checklist (50-ME80-PRO-014-003).

Tool buy-off Checklist (50-ME80-PRO-014-001).

Measurement Tool Verification (50-ME80-PRO-014-014).

EH&S Buy-off checklist (50-ME80-PRO-011-006).

PCB Assembly Line Equipment Qualification

Screen Printing Equipment:

Qualifying screen printing equipment entails establishing through objective