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TECHNOLOGY BOOK
Innovative Measurement Accurac y and Stabilit y
LK-G SE R I E S T EC HN O LO G Y B O O K
Light-receiving
element
Light-receiving
element
Light-receiving
element
Semiconductor
laser
Semiconductor
laser
Transmitter
lens
Transmitter
lens
Receiver lens
Semiconductor
laser
Transmitter
lens
Receiver lens
Receiver lens
Light-receiving
element
Light-receiving
element
Light-receiving
element
As the figures above show, a laser beam emitted from the semiconductor laser is applied to the target. The light reflected from the
target is collected by the receiver lens and focused on the light-receiving element. When the distance to the target changes, the
angle of the reflected light passing through the receiver lens changes, and the light is focused at a different position on the
light-receiving element.
Optical design
2-1
Light-receiving
element
Received light
waveform
Light-receiving
element
Received light
waveform
Light-receiving
element
Received light
waveform
With a single receiver lens, the spot diameter formed on the light-receiving element becomes larger when the measuring distance
is shorter or longer than the reference distance, due to the lens aberration. When the spot diameter on the light-receiving element
becomes larger, the measurement accuracy factors, such as "resolution", "linearity", and "scan resolution", become poorer than
those obtained at the reference distance. Consequently, it is necessary to develop an optical design which ensures a constant
spot size regardless of the measuring distance.
The high-precision
Ernostar lens
solves the problem!
Check page 4!
2-2
As described in "1. Basic principle of triangulation", a laser displacement sensor calculates the distance to a target by focusing
the light reflected from the target on the light-receiving element.
If the light reflected from the target changes due to the color, gloss, surface condition (roughness, tilt) of the target surface, the
condition of the beam spot formed on the light-receiving element (received light waveform) also changes. Such a change in the
beam spot condition (received light waveform) affects the measurement accuracy of laser displacement sensors.
Received light
waveform
Received light
waveform
Received light
waveform
As the figures above show, the condition of the beam spot formed on the light-receiving element changes depending on the
surface condition of the target, which affects the measurement accuracy.
Factors which affect the beam spot condition (received light waveform)
Color (color irregularity),
luster, gloss of a target
Adjustment of
laser emission power
Adjustment of
laser emission time
Adjustment of sensitivity of
light-receiving element
Adjustment of light
receiving time (exposure time)
ABLE control
solves the problem!
Check page 6!
LK-G SE R I E S T EC HN O LO G Y B O O K
Optical design
1-1
A new receiver lens has been designed to collect the light reflected from a target and focus it on the Li-CCD. A newly developed
high-accuracy Ernostar lens system drastically reduces spot distortion caused by aberrations. Moreover, the sensor
head-integrated, special die-cast housing provides high rigidity.
Light-receiving
element
Received light
waveform
Light-receiving
element
Received light
waveform
Light-receiving
element
Received light
waveform
The lens unit consisting of four lenses minimizes the influence of lens aberrations. The spot formed on the CCD remains the same
size regardless of whether a target is at the reference distance or at other distances.
Li-CCD
1-2
CCD
CCD
Out of focus
Sharp focus
High-accuracy
Ernostar lens
Attenuation caused
by surface reflection
Filter glass
* LK-G155/G405/G505 (Series)
The new housing design reduces the reflection on the filter glass surface in the receiver unit to allow the CCD to reliably receive
the light reflected even from a distant target.
1-3
Light received by
the adjacent pixel
Reflected light
CCD
A conventional
CCD output
The position of the reflected light in a pixel cannot be detected. As a result,
gradation changes are generated near the edge of the pixel, resulting in
measurement errors.
Li-CCD
output
The output of the adjacent pixel changes according to the position of the
reflected light in a pixel, providing more linear characteristics.
Since a CCD has digital output characteristics for each pixel, the errors caused by gradation outputs generated at the edge of the
pixel were the barrier to higher accuracy. As a countermeasure, KEYENCE has developed an Li-CCD that can detect the position
of reflected light in a pixel, achieving excellent accuracy that is two times higher than conventional models. In addition, the
dedicated sensor design has achieved a speed that is 25 times faster and sensitivity 10 times better than conventional models.
LK-G SE R I E S T EC HN O LO G Y B O O K
2-1
ABLE
Mirror-surfaced plate
Black rubber
Reflectance
High
Low
Emission power
Laser
power:
Low
Laser
power:
High
LK-G Series
Conventional model
Laser power
Emission time
Adjustment range
8 times
13296 times
150 times
Sampling time
Adjustment time
LK-G Series
20s
0.06ms
Conventional model
512s
7ms
Effect of ABLE control <Received light waveform obtained with a black rubber target>
Received light
waveform
2-2
STEP
Received light
waveform
W: Received
light intensity
Difference from
the optimal intensity
Ws: Optimal
intensity
"P x T x G" is calculated, where P is the laser power, T is the emission time, and G is the amplification factor, and the
received light intensity (W) for the case is measured. Then the received light intensity (W) is compared with the optimal
intensity (Ws) to calculate the multiplication factor.
STEP
The result of P x T x G and the received light intensity is stored for each sampling and compared with the optimal intensity.
Ws: Optimal
intensity
W: Received
light intensity
P
T
The multiplication factor calculated in STEP 1 is fed back to decide the emission time of the next sampling, and the resulted
received light intensity (W') is compared with the optimal intensity. Finally, fine adjustment is made during the next sampling.
2-3
Emission time
adjustment resolution
Real-time control by a
high-speed CPU
All of three parameters of laser power, emission time, and amplification factor, are digitized. A
high-speed CPU processes the digital data for real-time calculation and correction to control the
optimal setting instantly. This high-speed processing has achieved higher accuracy for all targets.
2-4
Angle characteristics
Not all targets have a flat and level surface. When a target with a curved or tilted surface is measured, the received light intensity
decreases. Excessively low intensity may disable measurement. The ABLE control is effective in this case.
<Shape measurement of a 10 mm diameter pin gauge>
Conventional model
Target shape
Position [mm]
Position [mm]
10 mm diameter pin gauge
High-speed
With a moving target, the received light intensity changes affecting scanning resolution. The laser reflection from connector pins or
patterned glass boards, moving at high speeds, can change to the point where the measurement may not be performed properly.
The ABLE control corrects these problems.
<Measurement of IC pins warpage>
The high-speed
response of the
light intensity
control allows
proper
measurement of
all IC pins without
lack of data.
Moving distance [m]
IC pins
LK-G SE R I E S T EC HN O LO G Y B O O K
Technology for improving ability for transparent target measurement (Multi-ABLE control)
When a transparent target is measured from a normal position, the laser beam passes through the target, resulting in failed
measurement. The measurement may also fail if there is another object in the background of the target, due to the difference in
the intensity of the reflection from the front surface and back surface. This section introduces techniques and measurement
algorithms effective for these targets.
1-1
Light-receiving
element
Semiconductor
laser
Transmitter
lens
Receiver lens
No waveform because
the receiver cannot receive
the reflected light.
Specular reflection
Transparent target
Front
surface
Back
surface
Light-receiving
element
Receiver lens
Specular reflection
Transparent target
Front
surface
Back
surface Light-receiving
element
Light-receiving
element
1-2
As described in the previous section, a transparent glass target generates two types of reflection, the reflection from the front
surface and the one from the back surface, resulting in two peaks of light intensity on the light-receiving element. The position of
the glass surface can be detected by measuring just one of these peaks, and the thickness of the target can be measured by
measuring the difference between the peaks. During actual measurement, however, the reflected light intensity may be different
between the front and back surfaces, because that a metal or other glossy object exist in the background of the glass, or that the
target is tinted glass. In these cases, the received light waveform becomes similar to the shape in the figure below, resulting in an
unstable peak condition and a failed measurement.
The receiver receives a light reflected from the surface of the metal object.
Light-receiving
element
Receiver lens
Specular reflection
Transparent
target
metal objec
Front
surface
Back
surface
Light-receiving
element
The intensity of the light reflected from the back surface decreases.
Light-receiving
element
Receiver lens
Specular reflection
Transparent
target
POINT
Front
surface
Back
surface
Light-receiving
element
1. It is necessary to correct light intensity individually for each peak of the received light waveform.
2. It is necessary to be able to specify the peak(s) used for measurement in the received light waveform.
Multi-ABLE
control solves
these problems!
LK-G SE R I E S T EC HN O LO G Y B O O K
1-3
Multi-ABLE control
Saturation level
1-4
Since the light intensity of each peak of the received light waveform can be corrected
to optimal levels individually, the measurement is stable even when the reflectance of
the target varies.
Gap
Gap
1st surface
2nd surface
3rd surface
4th surface
Measurement is impossible
because no light is received
from the 2nd surface.
Position (mm)
10
Optimal waveform
Measurement data
Measurement (m)
Optimal waveform
Measurement (m)
1-5
Position (mm)
Technology for improving the measurement ability of translucent targets (RPD algorithm)
With a translucent target, the measurement is sometimes not stable because the laser beam penetrates the target.
This section introduces a measurement algorithm effective for these targets.
2-1
Light reflected
inside the target
Opaque target
Transparent target
Light-receiving
element
Light reflected
inside the target
Light-receiving
element
As shown in the figure above, with an opaque target, the diffuse reflected light of from the target surface forms a spot on the
light-receiving element. With a translucent target, however, the light reflected inside the target also forms a spot on the
light-receiving element, resulting in a broader and more gradual waveform. This leads to a larger spot diameter on the
light-receiving element, which affects the measurement accuracy.
Peak value
2-2
Barycentric value
Common received
light waveform
Received
light intensity t
hreshold value
Peak value
LK-G SE R I E S T EC HN O LO G Y B O O K
Technology to improve measurement ability for targets generating multiple reflection (MRC algorithm)
If a target has microscopic projections or a V-shaped groove, multiple reflections occur which make measurements unstable
unstable. This section introduces a measurement algorithm effective for these targets.
3-1
Reflected light
with multiple
reflections
Reflected light
with multiple
reflections
Target with a
V-shaped groove
Opaque target
Light-receiving
element
Light-receiving
element
Received light
waveform
Received light
waveform
If a metal or other glossy target has a V-shaped groove or a sharp rise, the laser beam may cause irregular reflection on the target
surface, and the reflection may be received by the CCD as shown above. When the CCD receives the reflection from the area
other than the point where the laser beam reflects (multiple reflection), the measurement accuracy deteriorates.
3-2
Similar received
light waveform
12
Previous waveform
(dotted line)
4-1
Semiconductor
laser
Semiconductor
laser
Cylindrical lens
4-2
Abrasive pad
Wide spot
Wide spot
Small spot
Small spot
13
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