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Precision, Low Noise, CMOS, Rail-to-Rail,

Input/Output Operational Amplifiers


AD8605/AD8606/AD8608
FEATURES

APPLICATIONS

Low offset voltage: 65 V maximum


Low input bias currents: 1 pA maximum
Low noise: 8 nV/Hz
Wide bandwidth: 1000 V/mV
High open-loop gain: 120 dB
Unity gain stable
Single-supply operation: 2.7 V to 5.5 V
5-ball WLCSP for single (AD8605), and 8-ball WLCSP for
dual (AD8606)

Photodiode amplification
Battery-powered instrumentation
Multipole filters
Sensors
Barcode scanners
Audio

FUNCTIONAL BLOCK DIAGRAMS


BALL A1
CORNER

GENERAL DESCRIPTION

A2

OUTB
A3

INB

TOP VIEW
(Not to Scale)

V 2

4 IN

+IN 3

C2

C3

AD8606

TOP VIEW
(BUMP SIDE DOWN)

Figure 2. 8-Ball WLCSP (CB Suffix)


14 OUT D

OUT A 1

OUT

V+

IN A 2

+IN A 3

V+ 4

13 IN D

AD8608

12 +IN D

TOP VIEW
(Not to Scale)

11 V

+IN

IN

+IN B 5

10 +IN C

IN B 6

9 IN C

AD8605 ONLY

AD8606

TOP VIEW
(Not to Scale)
4
5

8 OUT C

OUT B 7

Figure 3. 5-Ball WLCSP (CB Suffix)

C1

TOP VIEW
(BALL SIDE DOWN)

Figure 1. 5-Lead SOT-23 (RJ Suffix)

OUT A
IN A
+IN A
V

+INB
02731-057

5 V+

V+
OUT B
IN B
+IN B

Figure 5. 8-Lead MSOP (RM Suffix)


8-Lead SOIC_N (R Suffix)

02731-004

AD8605

02731-001

OUT 1

B3

+INA

Figure 4. 14-Lead SOIC_N (R Suffix)


OUT A
IN A
+IN A
V+
+IN B
IN B
OUT B

14

AD8608
TOP VIEW
(Not to Scale)
7

OUT D
IN D
+IN D
V
+IN C
IN C
OUT C

02731-002

The AD8605, AD8606, and AD8608 are specified over the


extended industrial temperature range (40C to +125C). The
AD8605 single is available in 5-lead SOT-23 and 5-ball WLCSP
packages. The AD8606 dual is available in an 8-lead MSOP, an
8-ball WLSCP, and a narrow SOIC surface-mounted package.
The AD8608 quad is available in a 14-lead TSSOP package and
a narrow 14-lead SOIC package. The 5-ball and 8-ball WLCSP
offer the smallest available footprint for any surface-mounted
operational amplifier. The WLCSP, SOT-23, MSOP, and TSSOP
versions are available in tape-and-reel only.

V+

A1

B1

02731-003

The combination of low offsets, low noise, very low input bias
currents, and high speed makes these amplifiers useful in a
wide variety of applications. Filters, integrators, photodiode
amplifiers, and high impedance sensors all benefit from the
combination of performance features. Audio and other ac
applications benefit from the wide bandwidth and low
distortion. Applications for these amplifiers include optical
control loops, portable and loop-powered instrumentation,
and audio amplification for portable devices.

OUTA

INA

02731-006

The AD8605, AD8606, and AD8608 1 are single, dual, and quad
rail-to-rail input and output, single-supply amplifiers. They
feature very low offset voltage, low input voltage and current
noise, and wide signal bandwidth. They use the Analog Devices,
Inc. patented DigiTrim trimming technique, which achieves
superior precision without laser trimming.

Figure 6. 14-Lead TSSOP (RU Suffix)

Protected by U.S. Patent No. 5,969,657; other patents pending.

Rev. G
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.


Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 20022007 Analog Devices, Inc. All rights reserved.

AD8605/AD8606/AD8608
TABLE OF CONTENTS
Features .............................................................................................. 1

THD + Noise............................................................................... 14

General Description ......................................................................... 1

Total Noise Including Source Resistors ................................... 15

Applications....................................................................................... 1

Channel Separation.................................................................... 15

Functional Block Diagrams............................................................. 1

Capacitive Load Drive ............................................................... 15

Revision History ............................................................................... 2

Light Sensitivity .......................................................................... 16

5 V Electrical Specifications............................................................ 3

WLCSP Assembly Considerations........................................... 16

2.7 V Electrical Specifications......................................................... 5

I-V Conversion Applications ........................................................ 17

Absolute Maximum Ratings............................................................ 7

Photodiode Preamplifier Applications .................................... 17

ESD Caution.................................................................................. 7

Audio and PDA Applications ................................................... 17

Typical Performance Characteristics ............................................. 8

Instrumentation Amplifiers ...................................................... 18

Applications Information .............................................................. 14

DAC Conversion ........................................................................ 18

Output Phase Reversal............................................................... 14

Outline Dimensions ....................................................................... 19

Maximum Power Dissipation ................................................... 14

Ordering Guide .......................................................................... 21

Input Overvoltage Protection ................................................... 14

REVISION HISTORY
10/07Rev. F to Rev. G
Changes to Figure 2...................................................................... 1
Updated Outline Dimensions ................................................... 20
8/07Rev. E to Rev. F
Added 8-Ball WLCSP Package .................................... Universal
Changes to Features...................................................................... 1
Changes to Table 1........................................................................ 3
Changes to Table 2........................................................................ 5
Changes to Table 4........................................................................ 7
Updated Outline Dimensions ................................................... 19
Changes to Ordering Guide ...................................................... 21
1/06Rev. D to Rev. E
Changes to Table 1........................................................................ 3
Changes to Table 2........................................................................ 5
Changes to Table 4........................................................................ 6
Changes to Figure 12 Caption..................................................... 8
Changes to Figure 26 and Figure 27 Captions........................ 11
Changes to Figure 33 Caption................................................... 12
Changes to Figure 44.................................................................. 14
Updated Outline Dimensions ................................................... 19
Changes to Ordering Guide ...................................................... 20
5/04Rev. C to Rev. D
Updated Format............................................................. Universal
Edit to Light Sensitivity Section ............................................... 16
Updated Outline Dimensions ................................................... 19
Changes to Ordering Guide ...................................................... 20

7/03Rev. B to Rev. C
Changes to Features ...................................................................... 1
Change to General Description................................................... 1
Addition to Functional Block Diagrams .................................... 1
Addition to Absolute Maximum Ratings ................................... 4
Addition to Ordering Guide ........................................................ 4
Change to Equation in Maximum Power Dissipation
Section........................................................................................... 11
Added Light Sensitivity Section ................................................ 12
Added New Figure 8; Renumbered Subsequently .................. 13
Added New MicroCSP Assembly Considerations Section .... 13
Changes to Figure 9..................................................................... 13
Change to Equation in Photodiode Preamplifier
Applications Section ................................................................... 13
Changes to Figure 12................................................................... 14
Change to Equation in D/A Conversion Section.................... 14
Updated Outline Dimensions ................................................... 15
3/03Rev. A to Rev. B
Changes to Functional Block Diagram....................................... 1
Changes to Absolute Maximum Ratings.................................... 4
Changes to Ordering Guide ....................................................... 4
Changes to Figure 9 .................................................................... 13
Updated Outline Dimensions.................................................... 15
11/02Rev. 0 to Rev. A
Change to Electrical Characteristics........................................... 2
Changes to Absolute Maximum Ratings.................................... 4
Changes to Ordering Guide ........................................................ 4
Change to TPC 6 .......................................................................... 5
Updated Outline Dimensions.................................................... 15
5/02Revision 0: Initial Version

Rev. G | Page 2 of 24

AD8605/AD8606/AD8608
5 V ELECTRICAL SPECIFICATIONS
VS = 5 V, VCM = VS/2, TA = 25C, unless otherwise noted.
Table 1.
Parameter
INPUT CHARACTERISTICS
Offset Voltage
AD8605/AD8606 (Except WLCSP)
AD8608
AD8605/AD8606/AD8608
Input Bias Current
AD8605/AD8606
AD8605/AD8606
AD8608
AD8608
Input Offset Current

Symbol

Conditions

Min

Typ

Max

Unit

20
20
80

65
75
300
750
1
50
250
100
300
0.5
20
75
5

V
V
V
V
pA
pA
pA
pA
pA
pA
pA
pA
V
dB
dB
V/mV

4.5
6.0

V/C
V/C

VOS
VS = 3.5 V, VCM = 3 V
VS = 3.5 V, VCM = 2.7 V
VS = 5 V, VCM = 0 V to 5 V
40C < TA < +125C
IB

0.2
40C < TA < +85C
40C < TA < +125C
40C < TA < +85C
40C < TA < +125C

IOS

0.1
40C < TA < +85C
40C < TA < +125C

Input Voltage Range


Common-Mode Rejection Ratio
Large Signal Voltage Gain
Offset Voltage Drift
AD8605/AD8606
AD8608
INPUT CAPACITANCE
Common-Mode Input Capacitance
Differential Input Capacitance
OUTPUT CHARACTERISTICS
Output Voltage High

Output Voltage Low

Output Current
Closed-Loop Output Impedance
POWER SUPPLY
Power Supply Rejection Ratio
AD8605/AD8606
AD8605/AD8606 WLCSP
AD8608
Supply Current/Amplifier
DYNAMIC PERFORMANCE
Slew Rate
Settling Time
Gain Bandwidth Product
Phase Margin

CMRR
AVO

VCM = 0 V to 5 V
40C < TA < +125C
RL = 2 k, VO = 0.5 V to 4.5 V

0
85
75
300

VOS/T
VOS/T

VOH

VOL

IOUT
ZOUT

100
90
1000
1
1.5

IL = 1 mA
IL = 10 mA
40C < TA < +125C
IL = 1 mA
IL= 10 mA
40C < TA < +125C

4.96
4.7
4.6

8.8
2.6

pF
pF

4.98
4.79

V
V
V
mV
mV
mV
mA

20
170

40
210
290

80
1

f = 1 MHz, AV = 1

PSRR

ISY

SR
tS
GBP
M

VS = 2.7 V to 5.5 V
VS = 2.7 V to 5.5 V
VS = 2.7 V to 5.5 V
40C < TA < +125C
VO = 0 V
40C < TA < +125C
RL = 2 k
To 0.01%, 0 V to 2 V step

Rev. G | Page 3 of 24

80
75
77
70

95
92
92
90
1

5
<1
10
65

1.2
1.4

dB
dB
dB
dB
mA
mA
V/s
s
MHz
Degrees

AD8605/AD8606/AD8608
Parameter
NOISE PERFORMANCE
Peak-to-Peak Noise
Voltage Noise Density
Current Noise Density

Symbol

Conditions

en p-p
en
en
in

f = 0.1 Hz to 10 Hz
f = 1 kHz
f = 10 kHz
f = 1 kHz

Rev. G | Page 4 of 24

Min

Typ

Max

Unit

2.3
8
6.5
0.01

3.5
12

V p-p
nV/Hz
nV/Hz
pA/Hz

AD8605/AD8606/AD8608
2.7 V ELECTRICAL SPECIFICATIONS
VS = 2.7 V, VCM = VS/2, TA = 25C, unless otherwise noted.
Table 2.
Parameter
INPUT CHARACTERISTICS
Offset Voltage
AD8605/AD8606 (Except WLCSP)
AD8608
AD8605/AD8606/AD8608
Input Bias Current
AD8605/AD8606
AD8605/AD8606
AD8608
AD8608
Input Offset Current

Symbol

Conditions

Min

Typ

Max

Unit

20
20
80

65
75
300
750
1
50
250
100
300
0.5
20
75
2.7

V
V
V
V
pA
pA
pA
pA
pA
pA
pA
pA
V
dB
dB
V/mV

4.5
6.0

V/C
V/C

VOS
VS = 3.5 V, VCM = 3 V
VS = 3.5 V, VCM = 2.7 V
VS = 2.7 V, VCM = 0 V to 2.7 V
40C < TA < +125C
IB

0.2
40C < TA < +85C
40C < TA < +125C
40C < TA < +85C
40C < TA < +125C

IOS

0.1
40C < TA < +85C
40C < TA < +125C

Input Voltage Range


Common-Mode Rejection Ratio
Large Signal Voltage Gain
Offset Voltage Drift
AD8605/AD8606
AD8608
INPUT CAPACITANCE
Common-Mode Input Capacitance
Differential Input Capacitance
OUTPUT CHARACTERISTICS
Output Voltage High
Output Voltage Low
Output Current
Closed-Loop Output Impedance
POWER SUPPLY
Power Supply Rejection Ratio
AD8605/AD8606
AD8605/AD8606 WLCSP
AD8608
Supply Current/Amplifier
DYNAMIC PERFORMANCE
Slew Rate
Settling Time
Gain Bandwidth Product
Phase Margin

CMRR
AVO

VCM = 0 V to 2.7 V
40C < TA < +125C
RL = 2 k, VO = 0.5 V to 2.2 V

0
80
70
110

VOS/T
VOS/T

VOH
VOL
IOUT
ZOUT

95
85
350
1
1.5

IL = 1 mA
40C < TA < +125C
IL = 1 mA
40C < TA < +125C

2.6
2.6

8.8
2.6

pF
pF

2.66

V
V
mV
mV
mA

25

40
50

30
1.2

f = 1 MHz, AV = 1

PSRR

ISY

SR
tS
GBP
M

VS = 2.7 V to 5.5 V
VS = 2.7 V to 5.5 V
VS = 2.7 V to 5.5 V
40C < TA < +125C
VO = 0 V
40C < TA < +125C
RL = 2 k
To 0.01%, 0 V to 1 V step

Rev. G | Page 5 of 24

80
75
77
70

95
92
92
90
1.15

5
<0.5
9
50

1.4
1.5

dB
dB
dB
dB
mA
mA
V/s
s
MHz
Degrees

AD8605/AD8606/AD8608
Parameter
NOISE PERFORMANCE
Peak-to-Peak Noise
Voltage Noise Density
Current Noise Density

Symbol

Conditions

en p-p
en
en
in

f = 0.1 Hz to 10 Hz
f = 1 kHz
f = 10 kHz
f = 1 kHz

Rev. G | Page 6 of 24

Min

Typ

Max

Unit

2.3
8
6.5
0.01

3.5
12

V p-p
nV/Hz
nV/Hz
pA/Hz

AD8605/AD8606/AD8608
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
All Packages
Operating Temperature Range
All Packages
Junction Temperature Range
All Packages
Lead Temperature (Soldering, 60 sec)

Table 4.
Rating
6V
GND to VS
6V
Observe Derating Curves
65C to +150C
40C to +125C

Package Type
5-Ball WLCSP (CB)
5-Lead SOT-23 (RJ)
8-Ball WLCSP (CB)
8-Lead MSOP (RM)
8-Lead SOIC_N (R)
14-Lead SOIC_N (R)
14-Lead TSSOP (RU)
1

65C to +150C
300C

JA1
170
240
115
206
157
105
148

JC
92
44
56
36
23

Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W

JA is specified for the worst-case conditions, that is, a device soldered in a


circuit board for surface-mount packages.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings


may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

Rev. G | Page 7 of 24

AD8605/AD8606/AD8608
TYPICAL PERFORMANCE CHARACTERISTICS
4500

0.30
0.25
0.20
0.15

3000

0.10

VOS (mV)

NUMBER OF AMPLIFIERS

VS = 5V
4000 TA = 25C
VCM = 0V TO 5V
3500

2500
2000
1500

0.05
0
0.05
0.10
0.15

1000
02731-007

100
0
100
OFFSET VOLTAGE (V)

200

0.30

300

Figure 7. Input Offset Voltage Distribution


24

12

0.8

1.2

1.6

2.0 2.4 2.8 3.2


TCVOS (V/C)

3.6

4.0

4.4

AD8608
120
80

25

50
75
TEMPERATURE (C)

100

125

Figure 11. Input Bias Current vs. Temperature

1k

10
8
6

02731-009

5.0

160

12

4.5

AD8605/AD8606

4.8

14

4.0

200

OUTPUT SATURATION VOLTAGE (mV)

NUMBER OF AMPLIFIERS

16

3.5

40

VS = 5V
TA = 40C TO +125C
VCM = 2.5V

18

2.5
3.0
VCM (V)

VS = 2.5V

Figure 8. AD8608 Input Offset Voltage Drift Distribution

20

2.0

240

02731-008

0.4

1.5

280

1.0

320
INPUT BIAS CURRENT (pA)

NUMBER OF AMPLIFIERS

360

16

0.5

Figure 10. Input Offset Voltage vs. Common-Mode Voltage


(200 Units, 5 Wafer Lots, Including Process Skews)

VS = 5V
TA = 40C TO +125C
VCM = 2.5V

20

02731-011

200

0.25

VS = 5V
TA = 25C
100

10
SOURCE

0.1
0.001

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
TCVOS (V/C)

SINK

1
02731-012

0
300

02731-010

0.20

500

0.01

0.1

LOAD CURRENT (mA)

Figure 12. Output Saturation Voltage vs. Load Current

Figure 9. AD8605/AD8606 Input Offset Voltage Drift Distribution

Rev. G | Page 8 of 24

10

AD8605/AD8606/AD8608
6

5.00
VOH @ 1mA LOAD

VS = 5V

OUTPUT SWING (V p-p)

OUTPUT VOLTAGE (V)

4.95

4.90

4.85

4.80

VS = 5V
VIN = 4.9V p-p
TA = 25C
RL = 2k
AV = 1

VOH @ 10mA LOAD


02731-013

4.70
40

25

10

20

35

50

65

80

95

110

125

02731-016

4.75

1k

10k

TEMPERATURE (C)

100

0.25

80

OUTPUT IMPEDANCE ()

0.10

70
AV = 100

60
50

AV = 10

40

AV = 1

30
20

0
40

25

10

20

35

50

65

80

95

02731-014

VOL @ 1mA LOAD

110

02731-017

OUTPUT VOLTAGE (V)

0.15

0.05

10
0

125

1k

10k

TEMPERATURE (C)

120

180

110

135

100

40

90

20

45

70
60

90

50

60

135

40

80

180
225
100M

02731-015

40

10M

VS = 2.5V

80

45

1M
FREQUENCY (Hz)

100M

90

20

100k

10M

Figure 15. Open-Loop Gain and Phase vs. Frequency

30
20
1k

02731-018

60

225

CMRR (dB)

VS = 2.5V
RL = 2k
CL = 20pF
M = 64

PHASE (Degrees)

100
80

100k
1M
FREQUENCY (Hz)

Figure 17. Output Impedance vs. Frequency

Figure 14. Output Voltage Swing vs. Temperature

GAIN (dB)

10M

VS = 2.5V

90

VOL @ 10mA LOAD

0.20

100
10k

1M

Figure 16. Closed-Loop Output Voltage Swing

Figure 13. Output Voltage Swing vs. Temperature

VS = 5V

100k
FREQUENCY (Hz)

10k

100k
1M
FREQUENCY (Hz)

10M

Figure 18. Common-Mode Rejection Ratio (CMRR) vs. Frequency

Rev. G | Page 9 of 24

AD8605/AD8606/AD8608
140

1.0

VS = 5V

0.9

100

60
40
20
0

02731-019

20
40
60
1k

10k

100k
FREQUENCY (Hz)

0.7
0.6
0.5
0.4
0.3
0.2
0.1
0

10M

1M

2.0

2.5

3.0

3.5

4.0

4.5

5.0

VOLTAGE NOISE (1V/DIV)

30
25
+OS
20
OS
15
10
02731-020

02731-023

SMALL SIGNAL OVERSHOOT (%)

1.5

VS = 5V

VS = 5V
RL =
TA = 25C
AV = 1

5
0
10

100
CAPACITANCE (pF)

1k

TIME (1s/DIV)

Figure 23. 0.1 Hz to 10 Hz Input Voltage Noise

Figure 20. Small Signal Overshoot vs. Load Capacitance

2.0

VS = 2.5V
RL = 10k
CL = 200pF
AV = 1
VOLTAGE (50mV/DIV)

1.5

VS = 2.7V
1.0
VS = 5V

0.5

0
40

02731-021

SUPPLY CURRENT/AMPLIFIER (mA)

1.0

Figure 22. Supply Current/Amplifier vs. Supply Voltage

45

35

0.5

SUPPLY VOLTAGE (V)

Figure 19. PSRR vs. Frequency

40

02731-024

PSRR (dB)

80

0.8

02731-022

SUPPLY CURRENT/AMPLIFIER (mA)

120

25

10

20
35
50
65
TEMPERATURE (C)

80

95

110

TIME (200ns/DIV)

125

Figure 24. Small Signal Transient Response

Figure 21. Supply Current/Amplifier vs. Temperature

Rev. G | Page 10 of 24

AD8605/AD8606/AD8608
36

VS = 2.5V
RL = 10k
CL = 200pF
AV = 1

VS = 2.5V

02731-025

VOLTAGE (1V/DIV)

VOLTAGE NOISE DENSITY (nV/ Hz)

32
28
24
20
16
12

TIME (400ns/DIV)

02731-028

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

FREQUENCY (kHz)

Figure 25. Large Signal Transient Response

Figure 28. Voltage Noise Density vs. Frequency

53.6

VS = 2.5V
RL = 10k
AV = 100
VIN = 50mV

0V
0V

VIN
02731-026

50mV

46.9
40.2
33.5
26.8
20.1
13.4
6.7

02731-029

VOUT

VS = 2.5V

VOLTAGE NOISE DENSITY (nV/ Hz)

2.5V

TIME (400ns/DIV)

4
5
6
FREQUENCY (kHz)

10

90

100

Figure 29. Voltage Noise Density vs. Frequency

Figure 26. Positive Overload Recovery


119.2

VS = 2.5V
RL = 10k
AV = 100
VIN = 50mV

VS = 2.5V

50mV

02731-027

0V

104.3
89.4
74.5
59.6
44.7
29.8
14.9

02731-030

2.5V

VOLTAGE NOISE DENSITY (nV/ Hz)

0V

TIME (1s/DIV)

10

20

30

40
50
60
FREQUENCY (Hz)

70

80

Figure 30. Voltage Noise Density vs. Frequency

Figure 27. Negative Overload Recovery

Rev. G | Page 11 of 24

AD8605/AD8606/AD8608
1800

2.680
VS = 2.7V
TA = 25C
VCM = 0V TO 2.7V

VS = 2.7V
2.675

1400

OUTPUT VOLTAGE (V)

NUMBER OF AMPLIFIERS

1600

1200
1000
800
600

2.670

2.665
VOH @ 1mA LOAD
2.660

400
02731-031

0
300

200

100

100

200

2.650
40

300

02731-034

2.655
200

25

10

OFFSET VOLTAGE (V)

20

35

50

65

80

95

110

125

110

125

TEMPERATURE (C)

Figure 31. Input Offset Voltage Distribution

Figure 34. Output Voltage Swing vs. Temperature

0.045

300
VS = 2.7V
TA = 25C

VS = 2.7V
0.040
0.035
OUTPUT VOLTAGE (V)

INPUT OFFSET VOLTAGE (V)

200

100

100

0.030

VOL @ 1mA LOAD

0.025
0.020
0.015
0.010

200

1.8

0
40

2.7

25

10

COMMON-MODE VOLTAGE (V)

20

35

50

80

95

Figure 35. Output Voltage Swing vs. Temperature

1k

100

VS = 2.7V
TA = 25C

225
VS = 1.35V
RL = 2k
CL = 20pF
M = 52.5

80
60

100

GAIN (dB)

SOURCE
10
SINK

02731-033

0.1
0.001

65

TEMPERATURE (C)

Figure 32. Input Offset Voltage vs. Common-Mode Voltage


(200 Units, 5 Wafer Lots, Including Process Skews)

OUTPUT SATURATION VOLTAGE (mV)

0.01

0.1
LOAD CURRENT (mA)

10

135

40

90

20

45

20

45

40

90

60

135

80

180

100
10k

Figure 33. Output Saturation Voltage vs. Load Current

180

100k

1M
FREQUENCY (Hz)

10M

225
100M

Figure 36. Open-Loop Gain and Phase vs. Frequency

Rev. G | Page 12 of 24

PHASE (Degrees)

0.9

02731-036

300
0
0

02731-035

02731-032

0.005

AD8605/AD8606/AD8608
3.0

VS = 2.7V

VOLTAGE NOISE (1V/DIV)

OUTPUT SWING (V p-p)

2.5
VS = 2.7V
VIN = 2.6V p-p
TA = 25C
RL = 2k
AV = 1

2.0

1.5

1.0

02731-037

02731-040

0.5

0
1k

10k

100k
FREQUENCY (Hz)

1M

TIME (1s/DIV)

10M

Figure 40. 0.1 Hz to 10 Hz Input Voltage Noise

Figure 37. Closed-Loop Output Voltage Swing vs. Frequency

100

VS = 1.35V
RL = 10k
CL = 200pF
AV = 1

VS = 1.35V

90

VOLTAGE (50mV/DIV)

OUTPUT IMPEDANCE ()

80
70
AV = 100

60
50

AV = 10

40
30

AV = 1

02731-038

02731-041

20
10
0
1k

10k

100k
1M
FREQUENCY (Hz)

10M

100M

TIME (200ns/DIV)

Figure 41. Small Signal Transient Response

Figure 38. Output Impedance vs. Frequency

VS = 1.35V
RL = 10k
CL = 200pF
AV = 1

50

VOLTAGE (1V/DIV)

VS = 2.7V
TA = 25C
AV = 1

40
OS
30
+OS
20

02731-042

10
02731-039

SMALL SIGNAL OVERSHOOT (%)

60

10

100
CAPACITANCE (pF)

1k

TIME (400ns/DIV)

Figure 39. Small Signal Overshoot vs. Load Capacitance

Figure 42. Large Signal Transient Response

Rev. G | Page 13 of 24

AD8605/AD8606/AD8608
APPLICATIONS INFORMATION
OUTPUT PHASE REVERSAL

VS = 2.5V
VIN = 6V p-p
AV = 1
RL = 10k
VOLTAGE (2V/DIV)

Phase reversal is defined as a change in polarity at the output of


the amplifier when a voltage that exceeds the maximum input
common-mode voltage drives the input.
Phase reversal can cause permanent damage to the amplifier; it
can also cause system lockups in feedback loops. The AD8605
does not exhibit phase reversal even for inputs exceeding the
supply voltage by more than 2 V.

VOUT

VIN

02731-043

MAXIMUM POWER DISSIPATION


Power dissipated in an IC causes the die temperature to
increase, which can affect the behavior of the IC and the
application circuit performance.

TIME (4s/DIV)

The absolute maximum junction temperature of the AD8605/


AD8606/AD8608 is 150C. Exceeding this temperature could
damage or destroy the device.

TJ TA
JA

where:
TJ is the junction temperature.
TA is the ambient temperature.
JA is the junction-to-ambient thermal resistance.
Figure 44 compares the maximum power dissipation with
temperature for the various AD860x family packages.

105

130

Figure 44. Maximum Power Dissipation vs. Ambient Temperature

INPUT OVERVOLTAGE PROTECTION

0.1

VIN VS
5 mA
RS + 200
The remarkable low input offset current of the AD8605 (<1 pA)
allows the use of larger value resistors. With a 10 k resistor at
the input, the output voltage has less than 10 nV of error voltage.
A 10 k resistor has less than 13 nV/Hz of thermal noise at
room temperature.

VSY = 2.5V
AV = 1
BW = 22kHz

THD + NOISE (%)

The AD8605 has internal protective circuitry. However, if the


voltage applied at either input exceeds the supplies by more
than 2.5 V, external resistors should be placed in series with
the inputs. The resistor values can be determined by

THD + NOISE
Total harmonic distortion is the ratio of the input signal in V rms
to the total harmonics in V rms throughout the spectrum.
Harmonic distortion adds errors to precision measurements
and adds unpleasant sonic artifacts to audio systems.
The AD8605 has a low total harmonic distortion. Figure 45 shows
that the AD8605 has less than 0.005% or 86 dB of THD + N
over the entire audio frequency range. The AD8605 is configured
in positive unity gain, which is the worst case, and with a load
of 10 k.
Rev. G | Page 14 of 24

0.01

0.001

0.0001

02731-045

PDISS =

POWER DISSIPATION (W)

The maximum power dissipation of the amplifier is calculated


according to

1.8
1.7
SOIC-14
1.6
1.5
1.4
TSSOP-14
1.3
1.2
1.1
1.0
SOIC-8
0.9
0.8
0.7
0.6 MSOP-8
0.5
WLCSP-5
0.4
0.3
5-LEAD SOT-23
0.2
0.1
0
30
80
5
55
45
20
AMBIENT TEMPERATURE (C)

02731-044

Figure 43. No Phase Reversal

20

100

1k
FREQUENCY (Hz)

Figure 45. THD + Noise vs. Frequency

10k

20k

AD8605/AD8606/AD8608
TOTAL NOISE INCLUDING SOURCE RESISTORS
The low input current noise and input bias current of the
AD8605 make it the ideal amplifier for circuits with substantial
input source resistance, such as photodiodes. Input offset voltage
increases by less than 0.5 nV per 1 k of source resistance at
room temperature and increases to 10 nV at 85C. The total
noise density of the circuit is

en , TOTAL = en 2 + (in RS ) 2 + 4k TRS

A snubber network, shown in Figure 48, helps reduce the signal


overshoot to a minimum and maintain stability. Although this
circuit does not recover the loss of bandwidth induced by large
capacitive loads, it greatly reduces the overshoot and ringing.
This method does not reduce the maximum output swing of the
amplifier.
0

CHANNEL SEPARATION (dB)

20

where:
en is the input voltage noise density of the AD8605.
in is the input current noise density of the AD8605.
RS is the source resistance at the noninverting terminal.
k is Boltzmanns constant (1.38 1023 J/K).
T is the ambient temperature in Kelvin (T = 273 + C).

40
60
80
100
120

160

For RS < 3.9 k, en dominates and en, TOTAL en.

180
100

The current noise of the AD8605 is so low that its total density does
not become a significant term unless RS is greater than 6 M.

02731-046

140

For example, with RS = 10 k, the total voltage noise density is


roughly 15 nV/Hz.

1k

10k
100k
FREQUENCY (Hz)

VS = 2.5V
AV = 1
RL = 10k
CL = 1000pF

BW

where BW is the bandwidth in hertz.


Note that the previous analysis is valid for frequencies greater
than 100 Hz and assumes relatively flat noise, above 10 kHz. For
lower frequencies, flicker noise (1/f) must be considered.

CHANNEL SEPARATION

The AD8606 has a channel separation of greater than 160 dB


up to frequencies of 1 MHz, allowing the two amplifiers to
amplify ac signals independently in most applications.

02731-047

Channel separation, or inverse crosstalk, is a measure of the signal


feed from one amplifier (channel) to another on the same IC.
TIME (10s/DIV)

Figure 47. AD8606 Capacitive Load Drive Without Snubber

CAPACITIVE LOAD DRIVE

V+

The AD860x can drive large capacitive loads without oscillation.


Figure 47 shows the output of the AD8606 in response to a
200 mV input signal. In this case, the amplifier is configured
in positive unity gain, worst case for stability, while driving a
1000 pF load at its output. Driving larger capacitive loads in
unity gain can require the use of additional circuitry.

4
2
200mV
VIN

AD8605

1
RS

CS

Figure 48. Snubber Network Configuration

Rev. G | Page 15 of 24

RL

CL
02731-049

100M

VOLTAGE (100mV/DIV)

10M

Figure 46. Channel Separation vs. Frequency

The total equivalent rms noise over a specific bandwidth is


expressed as
En = en, TOTAL

1M

AD8605/AD8606/AD8608

VOLTAGE (100mV/DIV)

VS = 2.5V
AV = 1
RL = 10k
RS = 90
CL = 1000pF
CS = 700pF

4500
4000
3500

3mW/cm2

3000
2500
2mW/cm2
2000
1500

1mW/cm2

500
0

02731-048

Table 5 summarizes a few optimum values for capacitive loads.


Table 5.
RS ()
100
70
60

450

550
650
WAVELENGTH (nm)

750

850

Figure 50. AD8605ACB Input Bias Current Response to Direct Illumination of


Varying Intensity and Wavelength

Figure 49. Capacitive Load Drive with Snubber

CL (pF)
500
1000
2000

350

02731-050

1000

TIME (10s/DIV)

CS (pF)
1000
1000
800

An alternate technique is to insert a series resistor inside the


feedback loop at the output of the amplifier. Typically, the value
of this resistor is approximately 100 . This method also reduces
overshoot and ringing but causes a reduction in the maximum
output swing.

LIGHT SENSITIVITY
The AD8605ACB (WLCSP package option) is essentially a
silicon die with additional postfabrication dielectric and
intermetallic processing designed to contact solder bumps
on the active side of the chip. With this package type, the die
is exposed to ambient light and is subject to photoelectric
effects. Light sensitivity analysis of the AD8605ACB mounted
on standard PCB material reveals that only the input bias
current (IB) parameter is impacted when the package is
illuminated directly by high intensity light. No degradation in
electrical performance is observed due to illumination by low
intensity (0.1 mW/cm2) ambient light. Figure 50 shows that IB
increases with increasing wavelength and intensity of incident
light; IB can reach levels as high as 4500 pA at a light intensity of
3 mW/cm2 and a wavelength of 850 nm. The light intensities
shown in Figure 50 are not normal for most applications, that is,
even though direct sunlight can have intensities of 50 mW/cm2,
office ambient light can be as low as 0.1 mW/cm2.
B

5000

INPUT BIAS CURRENT (pA)

Figure 49 shows a scope of the output at the snubber circuit.


The overshoot is reduced from over 70% to less than 5%, and
the ringing is eliminated by the snubber. Optimum values for RS
and CS are determined experimentally.

When the WLCSP package is assembled on the board with the


bump side of the die facing the PCB, reflected light from the
PCB surface is incident on active silicon circuit areas and results
in the increased IB. No performance degradation occurs due to
illumination of the backside (substrate) of the AD8605ACB.
The AD8605ACB is particularly sensitive to incident light with
wavelengths in the near infrared range (NIR, 700 nm to 1000 nm).
Photons in this waveband have a longer wavelength and lower
energy than photons in the visible (400 nm to 700 nm) and near
ultraviolet (NUV, 200 nm to 400 nm) bands; therefore, they can
penetrate more deeply into the active silicon. Incident light with
wavelengths greater than 1100 nm has no photo-electric effect
on the AD8605ACB because silicon is transparent to wavelengths
in this range. The spectral content of conventional light sources
varies. Sunlight has a broad spectral range, with peak intensity
in the visible band that falls off in the NUV and NIR bands;
fluorescent lamps have significant peaks in the visible but not
the NUV or NIR bands.
Efforts have been made at a product level to reduce the effect of
ambient light; the under bump metal (UBM) has been designed
to shield the sensitive circuit areas on the active side (bump
side) of the die. However, if an application encounters any light
sensitivity with the AD8605ACB, shielding the bump side of the
WLCSP package with opaque material should eliminate this
effect. Shielding can be accomplished using materials such as
silica-filled liquid epoxies that are used in flip-chip underfill
techniques.

WLCSP ASSEMBLY CONSIDERATIONS


For detailed information on the WLCSP PCB assembly and
reliability, see Application Note AN-617, MicroCSP Wafer
Level Chip Scale Package.

Rev. G | Page 16 of 24

AD8605/AD8606/AD8608
I-V CONVERSION APPLICATIONS
At room temperature, the AD8605 has an input bias current of
0.2 pA and an offset voltage of 100 V. Typical values of RD are
in the range of 1 G.

PHOTODIODE PREAMPLIFIER APPLICATIONS


The low offset voltage and input current of the AD8605 make
it an excellent choice for photodiode applications. In addition,
the low voltage and current noise make the amplifier ideal for
application circuits with high sensitivity.

For the circuit shown in Figure 51, the output error voltage is
approximately 100 V at room temperature, increasing to about
1 mV at 85C.

CF
10pF

The maximum achievable signal bandwidth is


RF
10M

ID

CD
50pF

where ft is the unity gain frequency of the amplifier.


AD8605

AUDIO AND PDA APPLICATIONS

VOUT

The low distortion and wide dynamic range of the AD860x


make it a great choice for audio and PDA applications,
including microphone amplification and line output buffering.

02731-051

RD

VOS

Figure 51. Equivalent Circuit for Photodiode Preamp

Figure 52 shows a typical application circuit for headphone/


line-out amplification.

The input bias current of the amplifier contributes an error


term that is proportional to the value of RF.

R1 and R2 are used to bias the input voltage at half the supply,
which maximizes the signal bandwidth range. C1 and C2 are
used to ac couple the input signal. C1 and R2 form a high-pass
filter whose corner frequency is 1/2R1C1.

The offset voltage causes a dark current induced by the shunt


resistance of the diode RD. These error terms are combined at
the output of the amplifier. The error voltage is written as

R
E O = VOS 1 + F
RD

ft
2R F C T

+ RF I B

The high output current of the AD8606 allows it to drive heavy


resistive loads.
The circuit in Figure 52 is tested to drive a 16 headphone. The
THD + N is maintained at approximately 60 dB throughout the
audio range.

Typically, RF is smaller than RD, thus RF/RD can be ignored.

5V

C1
1F
V1
500mV

R1
20k

R2
20k

1/2
AD8606

C3
100F

R4
20

1
R3 HEADPHONES
1k

2
4

5V
5V
C2
1F

20k

V2
20k
500mV

8
5

1/2
AD8606

C4
100F

R6
20

6
4

R5
1k

Figure 52. Single-Supply Headphone/Speaker Amplifier

Rev. G | Page 17 of 24

02731-052

PHOTODIODE

f MAX =

AD8605/AD8606/AD8608
INSTRUMENTATION AMPLIFIERS
R

VREF

R
CF
RF

Difference amplifiers are widely used in high accuracy circuits


to improve the common-mode rejection ratio. Figure 53 shows
a simple difference amplifier. Figure 54 shows the commonmode rejection for a unity gain configuration and for a gain of 10.

R2

R2

R2

V+
VOS

AD8605

Making (R4/R3) = (R2/R1) and choosing 0.01% tolerance yields


a CMRR of 74 dB and minimizes the gain error at the output.
R1
1k

V1

R2
10k

Figure 55. Simplified Circuit of the DAC8143 with AD8605 Output Buffer

5V

To optimize the performance of the DAC, insert a capacitor in


the feedback loop of the AD8605 to compensate the amplifier
for the pole introduced by the output capacitance of the DAC.
Typical values for CF range from 10 pF to 30 pF; it can be
adjusted for the best frequency response. The total error at the
output of the op amp can be computed by

R4 R2
=
R3 R1
R2
(V2 V1)
R1

AD8605

R3
1k

V2

VOUT

R4
10k

02731-053

VOUT =

R
E O = VOS 1 + F
Req

Figure 53. Difference Amplifier, AV = 10


120
VSY = 2.5V

AV = 1

CMRR (dB)

80

Figure 56 shows the implementation of a dual-stage buffer


at the output of a DAC. The first stage is used as a buffer.
Capacitor C1 with Req creates a low-pass filter, and thus,
provides phase lead to compensate for frequency response.
The second stage of the AD8606 is used to provide voltage
gain at the output of the buffer.

60

40

02731-054

20

0
100

1k

10k
100k
FREQUENCY (Hz)

where Req is the equivalent resistance seen at the output of the


DAC. As previously mentioned, Req is code dependent and
varies with the input. A typical value for Req is 15 k. Choosing
a feedback resistor of 10 k yields an error of less than 200 V.

AV = 10

100

02731-055

The low offset voltage and low noise of the AD8605 make it an
ideal amplifier for instrumentation applications.

1M

Grounding the positive input terminals in both stages reduces


errors due to the common-mode output voltage. Choosing R1,
R2, and R3 to match within 0.01% yields a CMRR of 74 dB and
maintains minimum gain error in the circuit.

10M

Figure 54. Difference Amplifier CMRR vs. Frequency

DAC CONVERSION
15V

Figure 55 shows a typical implementation of the AD8605 at the


output of a 12-bit DAC.

VDD

The DAC8143 output current is converted to a voltage by the


feedback resistor. The equivalent resistance at the output of the
DAC varies with the input code, as does the output capacitance.

RCS

R3
20k
R2
10k

C1
33pF

VIN

RP

VREF

RFB

AD7545

AGND
DB11

R1
10k

OUT1

1/2
AD8606
R4
5k10%

Figure 56. Bipolar Operation

Rev. G | Page 18 of 24

VOUT

1/2
AD8606
02731-056

The low input bias current and offset voltage of the AD8605
make it an excellent choice for buffering the output of a current
output DAC.

AD8605/AD8606/AD8608
OUTLINE DIMENSIONS
0.50 REF

0.37
0.36
0.35

SEATING
PLANE

0.87
BALL 1
IDENTIFIER

0.23
0.18
0.14

1.33
1.29
1.25

0.50

0.21

0.17
0.14
0.12

TOP VIEW
(BALL SIDE DOWN)

B
C

0.20

0.50
BOTTOM VIEW
(BALL SIDE UP)

Figure 57. 5-Ball Wafer Level Chip Scale Package [WLCSP]


(CB-5)
Dimensions shown in millimeters

2.90 BSC

2.80 BSC

1.60 BSC
1

PIN 1
0.95 BSC
1.90
BSC

1.30
1.15
0.90

1.45 MAX

0.15 MAX

0.50
0.30

0.22
0.08
10
5
0

SEATING
PLANE

0.60
0.45
0.30

COMPLIANT TO JEDEC STANDARDS MO-178-A A

Figure 58. 5-Lead Small Outline Transistor Package [SOT-23]


(RJ-5)
Dimensions shown in millimeters

3.20
3.00
2.80

3.20
3.00
2.80

5.15
4.90
4.65

PIN 1
0.65 BSC
0.95
0.85
0.75

1.10 MAX

0.15
0.00

0.38
0.22

COPLANARITY
0.10

0.23
0.08

8
0

SEATING
PLANE

COMPLIANT TO JEDEC STANDARDS MO-187-AA

Figure 59. 8-Lead Mini Small Outline Package [MSOP]


(RM-8)
Dimensions shown in millimeters
Rev. G | Page 19 of 24

0.80
0.60
0.40

081607-A

0.94
0.90
0.86

AD8605/AD8606/AD8608
5.00 (0.1968)
4.80 (0.1890)

4.00 (0.1574)
3.80 (0.1497)

6.20 (0.2441)
5.80 (0.2284)

1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0040)

0.51 (0.0201)
0.31 (0.0122)

COPLANARITY
0.10
SEATING
PLANE

0.50 (0.0196)
0.25 (0.0099)

1.75 (0.0688)
1.35 (0.0532)

45

8
0
0.25 (0.0098)
0.17 (0.0067)

1.27 (0.0500)
0.40 (0.0157)

012407-A

COMPLIANT TO JEDEC STANDARDS MS-012-A A


CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 60. 8-Lead Standard Small Outline Package [SOIC_N]


Narrow Body (R-8)
Dimensions shown in millimeters and (inches)

0.675
0.595
0.515

1.480
1.430
1.380

SEATING
PLANE

BALL 1
IDENTIFIER

0.340
0.320
0.300

1.825
1.775
1.725

0.50
BALL PITCH
BOTTOM VIEW

0.380
0.355
0.330

(BALL SIDE UP)

0.27
0.24
0.21

090706-B

TOP VIEW
(BALL SIDE DOWN)

Figure 61. 8-Ball Wafer Level Chip Scale Package [WLCSP]


(CB-8-1)
Dimensions shown in millimeters

8.75 (0.3445)
8.55 (0.3366)
8

14
1

1.27 (0.0500)
BSC
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10

0.51 (0.0201)
0.31 (0.0122)

6.20 (0.2441)
5.80 (0.2283)

0.50 (0.0197)
0.25 (0.0098)

1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE

45

8
0
0.25 (0.0098)
0.17 (0.0067)

1.27 (0.0500)
0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-012-AB


CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 62. 14-Lead Standard Small Outline Package [SOIC_N]


Narrow Body (R-14)
Dimensions shown in millimeters and (inches)

Rev. G | Page 20 of 24

060606-A

4.00 (0.1575)
3.80 (0.1496)

AD8605/AD8606/AD8608
5.10
5.00
4.90

14

4.50
4.40
4.30

6.40
BSC
1

PIN 1
1.05
1.00
0.80

0.65
BSC
1.20
MAX
0.15
0.05

0.30
0.19

0.20
0.09

SEATING
COPLANARITY
PLANE
0.10

8
0

0.75
0.60
0.45

COMPLIANT TO JEDEC STANDARDS MO-153-AB-1

Figure 63. 14-Lead Thin Shrink Small Outline Package [TSSOP]


(RU-14)
Dimensions shown in millimeters

ORDERING GUIDE
Model
AD8605ACB-REEL
AD8605ACB-REEL7
AD8605ART-R2
AD8605ART-REEL
AD8605ART-REEL7
AD8605ARTZ-R2 1
AD8605ARTZ-REEL1
AD8605ARTZ-REEL71
AD8606ARM-R2
AD8606ARM-REEL
AD8606ARMZ-R21
AD8606ARMZ-REEL1
AD8606AR
AD8606AR-REEL
AD8606AR-REEL7
AD8606ARZ1
AD8606ARZ-REEL1
AD8606ARZ-REEL71
AD8606ACBZ-REEL1
AD8606ACBZ-REEL71
AD8608AR
AD8608AR-REEL
AD8608AR-REEL7
AD8608ARZ1
AD8608ARZ-REEL1
AD8608ARZ-REEL71
AD8608ARU
AD8608ARU-REEL
AD8608ARUZ1
AD8608ARUZ-REEL1
1

Temperature Range
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C
40C to +125C

Package Description
5-Ball WLCSP
5-Ball WLCSP
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Ball WLCSP
8-Ball WLCSP
14-Lead SOIC_N
14-Lead SOIC_N
14-Lead SOIC_N
14-Lead SOIC_N
14-Lead SOIC_N
14-Lead SOIC_N
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP
14-Lead TSSOP

Z = RoHS Compliant Part, # denotes RoHS compliant (except for CB-5). Product may be top or bottom marked.

Rev. G | Page 21 of 24

Package Option
CB-5
CB-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RM-8
RM-8
RM-8
RM-8
R-8
R-8
R-8
R-8
R-8
R-8
CB-8-1
CB-8-1
R-14
R-14
R-14
R-14
R-14
R-14
RU-14
RU-14
RU-14
RU-14

Branding
B3A
B3A
B3A
B3A
B3A
B3A#
B3A#
B3A#
B6A
B6A
B6A#
B6A#

B6A#
B6A#

AD8605/AD8606/AD8608
NOTES

Rev. G | Page 22 of 24

AD8605/AD8606/AD8608
NOTES

Rev. G | Page 23 of 24

AD8605/AD8606/AD8608
NOTES

20022007 Analog Devices, Inc. All rights reserved. Trademarks and


registered trademarks are the property of their respective owners.
D02731-0-10/07(G)

Rev. G | Page 24 of 24

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