What is burn-in testing related to electronics devices?

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Burn-in is an accepted practice for detecting early failures in a population of
semiconductor devices. It usually requires the electrical testing of a
product, using an expected operating electrical cycle (extreme of operating
condition), typically over a time period of 48-168 hours. Alternatively,
thermal (e.g. 125C for 168 hours) or environmental stress screening (e.g.
20 cycles from -10 to 70C ramped at +C/mm) is used. Burn-in is applied
to products as they are made, to detect early failures caused by faults in manufacturing practice.
As a general rule, it is best to burn-in at the component level when the cost of testing and replacing parts is lowest.
Burn-in of a board or an assembly is difficult because different components have different limits. However, burn-in at
this level can show faults that burn-in of components cannot find, such as dry or cold solder joints and contact
problems.
For more complex devices, dynamic burn-in is used where thermal stress is combined with dynamic simulation of
inputs to provide worst-case operating conditions.

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