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XDM-500

Version 8.3

Installation and Maintenance Manual


417006-2304-0H3-B02

XDM-500 (ETSI) Installation and Maintenance Manual


V8.3
Catalog No: X39171
November 2011
1st Edition

Copyright by ECI, 2004-2011. All rights reserved worldwide.


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Contents
About This Manual ................................................................... xv

Overview ............................................................................................................ xv
Intended Audience ............................................................................................. xv
Document Organization ..................................................................................... xvi
Document Conventions ..................................................................................... xvi
Related Documentation .................................................................................... xvii
Obtaining Technical Documentation ................................................................xviii
Technical Assistance........................................................................................xviii

Installing XDM-500: Before You Start Safety Guidelines ..... 1-1


Overview .......................................................................................................... 1-1
Warning Definition ............................................................................................ 1-2
Qualified Personnel Warning ............................................................................ 1-3
Installation Warning .......................................................................................... 1-4
General Safety Requirements .......................................................................... 1-5
Jewelry Removal Warning ................................................................................ 1-6
Grounding Requirements ................................................................................. 1-7
Power Supply Requirements .......................................................................... 1-11
TUV Statutory Warnings and Requirements .................................................. 1-17
ITU-T/Telcordia Statutory Warnings and Requirements ................................ 1-19
Laser Safety Requirements ............................................................................ 1-21
Protection Against Electrostatic Discharge .................................................... 1-26
Environmental and Health Concerns .............................................................. 1-31

Introduction to the XDM Platform .......................................... 2-1


Overview .......................................................................................................... 2-1
XDM Product Lines .......................................................................................... 2-2
Features and Functions.................................................................................... 2-3
Implementation Principles ................................................................................ 2-4
Cards and Modules .......................................................................................... 2-5
XDM-500 .......................................................................................................... 2-7

XDM-500 Installation Overview .............................................. 3-1


Overview .......................................................................................................... 3-1
Preliminary Preparations .................................................................................. 3-2
Stages of a Typical Installation ......................................................................... 3-3
Outline of Installation Procedure ...................................................................... 3-5

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Contents

XDM-500 Installation and


Maintenance Manual

Site Preparation and Rack Installation .................................. 4-1


Overview .......................................................................................................... 4-1
Tools and Test Equipment ............................................................................... 4-8
Unpacking and Visual Inspection ..................................................................... 4-9
XDM Rack Installation Options ....................................................................... 4-10
Cable and Fiber Preparation .......................................................................... 4-23
Installing Equipment Racks ............................................................................ 4-37
Installing Ancillary Units in Racks ................................................................... 4-44

XDM-500 Platform Installation ................................................ 5-1


Overview .......................................................................................................... 5-1
Assembling the XDM Platform in a Rack ......................................................... 5-2
Installing Air Filters ........................................................................................... 5-6
Connecting Power and Rack Alarm Cables to the Platforms ......................... 5-10

Card and Module Installation ................................................. 6-1


Overview .......................................................................................................... 6-1
Card Installation Precautions ........................................................................... 6-3
XDM-500 Slot Utilization .................................................................................. 6-4
Installation Data for XDM-500 I/O Cards and Associated Modules .................. 6-6
Using Electrical Interface Protection Modules .................................................. 6-9
Preparing Cards and Modules for Installation ................................................ 6-10
Installing CMBR40 and TRP40_2 Cards for Different Configuration Options 6-69
Installing xMCP Cards .................................................................................... 6-73
Installing xMCP-B/B2G Cards ........................................................................ 6-75
Installing MECP Cards ................................................................................... 6-78
Installing Aurora-G Cards ............................................................................... 6-79
Installing I/O Cards and Modules ................................................................... 6-90
Installing a Card in the CCP Cage ................................................................. 6-92

Optical Fiber and Cable Installation and Routing................. 7-1


Connecting Cables ........................................................................................... 7-1

Commissioning Tests ............................................................. 8-1


Overview .......................................................................................................... 8-1
Tools and Equipment ....................................................................................... 8-2
Prerequisites .................................................................................................... 8-3
Site Commissioning Tests ................................................................................ 8-5
Network Commissioning ................................................................................. 8-10

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Maintenance Manual

Contents

Maintenance ............................................................................. 9-1


Overview .......................................................................................................... 9-1
Required Test Equipment, Tools, and Materials .............................................. 9-2
Preventive Maintenance ................................................................................... 9-2
Troubleshooting.............................................................................................. 9-11
Replacing a Network Element ........................................................................ 9-40
Replacing Cards, Modules, Fans, and Other Components ............................ 9-43

XDM Accessories ................................................................... A-1

Typical Installation Setup ................................................................................. A-2


Rack Alarm Panel Power and Alarm Connection Options ............................... A-4
Rap Features.................................................................................................... A-5
xRAP-D ............................................................................................................ A-7
xRAP-B........................................................................................................... A-13
xRAP-HP ........................................................................................................ A-16
xRAP-100 ....................................................................................................... A-19
miniRAP ......................................................................................................... A-22
FST................................................................................................................. A-25
Heat Buffer ..................................................................................................... A-26
Cable and Fiber Guiding Accessories ............................................................ A-26
Optical Distribution Frames (ODFs) ............................................................... A-29
Digital Distribution Frames (DDF) .................................................................. A-33

Connector Pin Assignments ................................................. B-1

Overview .......................................................................................................... B-1


Platform Connectors......................................................................................... B-2
xECB Connectors ............................................................................................. B-5
MECP Connectors.......................................................................................... B-10
ACP Connectors............................................................................................. B-11
M2_84 Interface Module Connection Data ..................................................... B-12
Alarms Handling Principles ............................................................................ B-19
xRAP-D Connectors ....................................................................................... B-21
xRAP-HP Connectors..................................................................................... B-28
xRAP-100 Connectors.................................................................................... B-34
miniRAP Connectors ...................................................................................... B-40

Upgrades and Expansions .................................................... C-1

Overview ..........................................................................................................C-1
16- to 32-Channel Mux/DeMux Expansion ....................................................... C-2
Upgrading and Expanding Optical Networks .................................................... C-3
Matrix and SDH Data Card Upgrades .............................................................. C-7

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Maintenance Manual

Integrating XDM Equipment in SYNCOM Networks ............ D-1


Overview ..........................................................................................................D-1
Network Implementation Considerations .......................................................... D-2
Network Timing Considerations ....................................................................... D-5
Network Management Considerations ............................................................. D-5
Recommended Integration Procedures ............................................................ D-8

Slot Designation Conversion Table .......................................E-1

Slot Designation Conversion Table .................................................................. E-1

Standards and References ..................................................... F-1

Overview .......................................................................................................... F-1


Broadband Forum ............................................................................................ F-1
Environmental Standards ................................................................................. F-2
ETSI: European Telecommunications Standards Institute ............................... F-2
IEC: International Electrotechnical Commission .............................................. F-3
IEEE: Institute of Electrical and Electronic Engineers ...................................... F-4
IETF: Internet Engineering Task Force ............................................................ F-5
ISO: International Organization for Standardization ......................................... F-7
ITU-T: International Telecommunication Union ................................................ F-7
MEF: Metro Ethernet Forum ........................................................................... F-12
NIST: National Institute of Standards and Technology .................................. F-12
North American Standards ............................................................................. F-13
OMG: Object Management Group ................................................................. F-14
TMF: TeleManagement Forum ....................................................................... F-14
Web Protocol Standards ................................................................................ F-14

Index .......................................................................................... I-1

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List of Figures
Figure 1-1: Optical rack grounding bar and rack frame grounding post ........................ 1-8
Figure 1-2: Grounding the optical rack to the site grounding bar................................... 1-9
Figure 1-3: XDM shelves warning labels ..................................................................... 1-17
Figure 1-4: Power input warning label ......................................................................... 1-17
Figure 1-5: Basic ESD warning symbol ....................................................................... 1-26
Figure 1-6: Typical temporary EPA arrangement ........................................................ 1-29
Figure 1-7: Pollution control logos ............................................................................... 1-32
Figure 1-8: WEEE recycling symbol ............................................................................ 1-33
Figure 2-1: XDM-500 platform........................................................................................ 2-7
Figure 2-2: XDM-500 slot allocation ............................................................................... 2-8
Figure 3-1: A typical XDM-1000 product line installation components .......................... 3-4
Figure 4-1: Deep vs. standard door ............................................................................... 4-3
Figure 4-2: Optical rack components ........................................................................... 4-13
Figure 4-3: Type A ETSI rack general view ................................................................. 4-15
Figure 4-4: Type A ETSI rack internal view ................................................................. 4-16
Figure 4-5: ETSI A rack closed view ............................................................................ 4-18
Figure 4-6: XDM-1000 and XDM-500 shelves in a 2600 mm rack .............................. 4-21
Figure 4-7: Two XDM-500 shelves in a 2200 mm rack ................................................ 4-22
Figure 4-8: Rack and platform grounding posts on the XDM-1000 ............................. 4-25
Figure 4-9: Short boot characteristics .......................................................................... 4-32
Figure 4-10: Mounting diagrams for ETSI racks .......................................................... 4-38
Figure 4-11: Mounting diagrams for 19 in. and 23 in. racks ........................................ 4-39
Figure 4-12: Rack mounting diagram for attachment to suspended overhead
tray (2200 mm rack) ..................................................................................................... 4-41
Figure 4-13: Optical rack grounding bar and rack frame grounding post .................... 4-42
Figure 4-14: Grounding the optical rack to the site grounding bar............................... 4-43
Figure 4-15: xRAP-D power supply flow ...................................................................... 4-46
Figure 4-16: xRAP-D power supply with bridge, two variations ................................... 4-47
Figure 4-17: Location of xRAP-D grounding stud ........................................................ 4-48
Figure 4-18: xRAP-D power supply flow ...................................................................... 4-49
Figure 4-19: Identification of xRAP-D cable routes ...................................................... 4-50
Figure 4-20: Connecting DC power cables .................................................................. 4-51
Figure 4-21: xRAP-D power supply with bridge, two variations ................................... 4-53
Figure 4-22: Identification of xRAP-D cable routes ...................................................... 4-54
Figure 4-23: Connecting DC power cables .................................................................. 4-55
Figure 4-24: Side screws highlighted on left side of xRAP-D unit ............................... 4-57
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List of Figures

XDM-500 Installation and


Maintenance Manual

Figure 4-25: Replacement spacer screw ..................................................................... 4-57


Figure 4-26: Replacement spacer screws in place in xRAP-D unit ............................. 4-58
Figure 4-27: Protection cover for xRAP-D ................................................................... 4-58
Figure 4-28: xRAP-D protective covers in place .......................................................... 4-59
Figure 4-29: Bottom panel for xRAP-D ........................................................................ 4-59
Figure 4-30: xRAP-D connectors ................................................................................. 4-60
Figure 4-31: Installation of xRAP-D circuit breakers .................................................... 4-61
Figure 4-32: Location of xRAP-B grounding stud ........................................................ 4-65
Figure 4-33: Identification of xRAP-B cable routes ...................................................... 4-65
Figure 4-34: Connecting DC power cables .................................................................. 4-66
Figure 4-35: Side screw highlighted on left side of the xRAP-B .................................. 4-67
Figure 4-36: Replacement spacer screw ..................................................................... 4-67
Figure 4-37: Replacement spacer screw in place in the xRAP-B ................................ 4-68
Figure 4-38: Protective cover for xRAP-B .................................................................... 4-68
Figure 4-39: xRAP-B protective cover in place ............................................................ 4-69
Figure 4-40: Bottom panel for xRAP-B ........................................................................ 4-70
Figure 4-41: xRAP-B connectors ................................................................................. 4-70
Figure 4-42: Installation of xRAP-B circuit breakers .................................................... 4-71
Figure 4-43: xRAP-HP slide switches .......................................................................... 4-74
Figure 4-44: Location of xRAP-HP grounding stud ...................................................... 4-77
Figure 4-45: Identification of xRAP-HP cable routes ................................................... 4-78
Figure 4-46: Connecting DC power cables to the xRAP-HP ....................................... 4-78
Figure 4-47: xRAP-HP circuit breakers installation ...................................................... 4-80
Figure 4-48: DC input power connectors pin functions ................................................ 4-81
Figure 4-49: Location of xRAP-100 grounding stud ..................................................... 4-84
Figure 4-50: Identification of xRAP-100 cable routes .................................................. 4-85
Figure 4-51: Connecting DC power cables to the xRAP-100 ...................................... 4-86
Figure 4-52: xRAP-100 connector identification .......................................................... 4-87
Figure 4-53: xRAP-100 circuit breakers installation ..................................................... 4-88
Figure 4-54: Location of miniRAP grounding stud ....................................................... 4-92
Figure 4-55: Identification of miniRAP cable routes ..................................................... 4-92
Figure 4-56: Connecting DC power cables to the miniRAP ......................................... 4-93
Figure 4-57: miniRAP connectors ................................................................................ 4-94
Figure 4-58: Installing miniRAP circuit breakers .......................................................... 4-95
Figure 4-59: Threading optical fibers in the FST.......................................................... 4-97
Figure 4-60: Attaching rack mount brackets to the ODF ............................................. 4-98
Figure 4-61: ODF front panel ....................................................................................... 4-99
Figure 4-62: ODF open view ........................................................................................ 4-99
Figure 4-63: ODF fiber routes .................................................................................... 4-100
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List of Figures

Figure 5-1: XDM shelf and rack grounding (NEBS-compliant) ...................................... 5-5
Figure 5-2: Air filter and installation kit ........................................................................... 5-7
Figure 5-3: Installing the air filter frame ......................................................................... 5-8
Figure 5-4: Installing the air filter in its frame ................................................................. 5-9
Figure 5-5: Grounding connections at typical site ........................................................ 5-10
Figure 5-6: Auxiliary connector panel .......................................................................... 5-12
Figure 6-1: XDM-500 slots identification ........................................................................ 6-4
Figure 6-2: Inserting an SFP into an optical module .................................................... 6-12
Figure 6-3: Installing extractable OM01_4 and OM04_1 optical modules in
SIO1&4 cards ............................................................................................................... 6-14
Figure 6-4: Installing extractable OMS01_4 and OMS04_1 optical modules
in SIO1&4 cards ........................................................................................................... 6-16
Figure 6-5: Installing an extractable optical OM16_1 module in SIO16 card .............. 6-18
Figure 6-6: Installing an extractable optical OM16_1SFP module in SIO16 card ....... 6-20
Figure 6-7: Installing an OMSC16_4 module on SIO164 ............................................ 6-22
Figure 6-8: Installing an optical module on SIO164 ..................................................... 6-24
Figure 6-9: Installing extractable optical modules in the XIO192................................. 6-26
Figure 6-10: Installing an optical module on XIO384F ................................................. 6-28
Figure 6-11: Identifying the installation positions on the SIO1&4B card ...................... 6-30
Figure 6-12: Identifying the installation positions on the SIO16_2B card .................... 6-31
Figure 6-13: Identifying the installation positions on the SIO16_4B card .................... 6-32
Figure 6-14: Identifying the installation positions on the SIO64B card ........................ 6-33
Figure 6-15: Identifying the installation positions on typical EIS cards ........................ 6-35
Figure 6-16: Identifying the installation positions on DIO cards................................... 6-37
Figure 6-17: Identifying the installation positions on typical DIOB cards ..................... 6-39
Figure 6-18: Identifying the installation positions on typical MCS5/MCS10 cards....... 6-41
Figure 6-19: Identifying installation positions on the MCS30_X10G ........................... 6-43
Figure 6-20: Installing an extractable module in a CMBR10_D card ........................... 6-45
Figure 6-21: Identifying optical transceiver plug-in installation positions in
CMBR10_D/DO cards .................................................................................................. 6-46
Figure 6-22: Installing an extractable module in a CMBR10_B/BO card ..................... 6-47
Figure 6-23: Identifying optical transceiver plug-in installation positions in
CMBR10_B/BO cards .................................................................................................. 6-48
Figure 6-24: Installing a typical extractable optical module in a CMBR25_2 card....... 6-49
Figure 6-25: Installing extractable modules in a CMTR25 card ................................... 6-51
Figure 6-26: Identifying the installation positions on the CMBR40 card ...................... 6-53
Figure 6-27: Installing plug-in modules in a TRP10_2B card ...................................... 6-54
Figure 6-28: Identifying the installation positions on a TRP10_4R card ...................... 6-55
Figure 6-29: Identifying the installation positions on a TRP10_4M card ..................... 6-56
Figure 6-30: Installing plug-in modules in a TRP10_LAN card .................................... 6-57
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List of Figures

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Maintenance Manual

Figure 6-31: Identifying the optical transceiver plug-in (XFP) position in


the TRP10_LAN card ................................................................................................... 6-58
Figure 6-32: Installing a typical plug-in module in a TRP25_4 card ............................ 6-59
Figure 6-33: Installing modules into the AoC card ....................................................... 6-61
Figure 6-34: Installing an optical module in the AoC (upper half) ................................ 6-62
Figure 6-35: Identifying SFP installation positions on AoC (lower half) ....................... 6-63
Figure 6-36: AUX_2X card, location of optical plug-in modules .................................. 6-64
Figure 6-37: AUX_2X card, installing a typical optical plug-in module ........................ 6-65
Figure 6-38: Installing an OADM plug-in module in an OADM1&4 card ...................... 6-67
Figure 6-39: Installing a typical plug-in in an MO_CW2 module .................................. 6-68
Figure 6-40: TRP40_2/2B front view ............................................................................ 6-70
Figure 6-41: TRP40_2/2B front view ............................................................................ 6-71
Figure 6-42: CMBR40/40B front view .......................................................................... 6-72
Figure 6-43: NVM card installation ............................................................................... 6-74
Figure 6-44: Installation of an NVM on xMCP-B card .................................................. 6-76
Figure 6-45: NVM card installation ............................................................................... 6-77
Figure 6-46: Aurora-G card insertion ........................................................................... 6-81
Figure 6-47: Aurora-G connectors ............................................................................... 6-83
Figure 6-48: Aurora-G with cover plate in place .......................................................... 6-84
Figure 6-49: Aurora-G LED indicators ......................................................................... 6-85
Figure 6-50: Management port default gateway .......................................................... 6-88
Figure 6-51: Inserting cards with reset control ............................................................. 6-91
Figure 7-1: Removing side covers of a Type A ETSI rack ............................................. 7-3
Figure 7-2: Type A ETSI rack cable routing details ....................................................... 7-4
Figure 7-3: Cable routing details for regular rack........................................................... 7-5
Figure 7-4: MECP_OSC card optical connections ......................................................... 7-8
Figure 7-5: Opening OFA_R protective cover.............................................................. 7-12
Figure 7-6: OFA_R connectors .................................................................................... 7-13
Figure 7-7: ODF_HP view with open panel.................................................................. 7-15
Figure 7-8: Detailed view of fiber tray with lid removed ............................................... 7-15
Figure 7-9: Fastening the fiber harness to the exit of the fiber tray ............................. 7-16
Figure 7-10: Reaching the ATS card RJ-45 connectors .............................................. 7-21
Figure 7-11: Management workstation and protection components ............................ 7-23
Figure 7-12: Connecting management workstation to MECP on the GNE .................. 7-23
Figure 8-1: Input sensitivity test setup ......................................................................... 8-14
Figure 8-2: Test setup modified to support LOS and sensitivity tests.......................... 8-32
Figure 9-1: Removing the filter for cleaning/replacement .............................................. 9-8
Figure 9-2: Installation of xRAP-D circuit breakers ...................................................... 9-44
Figure 9-3: Replacing xRAP-HP circuit breakers ......................................................... 9-45

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List of Figures

Figure 9-4: Replacing xRAP-100 circuit breakers ........................................................ 9-46


Figure 9-5: Installing miniRAP circuit breakers ............................................................ 9-47
Figure 9-6: Replacing xINF/xINF-H unit ....................................................................... 9-49
Figure 9-7: Replacing an NVM on xMCP card ............................................................. 9-52
Figure 9-8: Replacing an NVM on xMCP-B card ......................................................... 9-54
Figure 9-9: Replacing NVM on ATS card..................................................................... 9-56
Figure 9-10: Typical MECP_OSC card optical connections ........................................ 9-57
Figure 9-11: Replacing typical optical transceivers ..................................................... 9-60
Figure A-1: Typical installation of a single XDM-500 shelf ............................................ A-3
Figure A-2: xRAP-D power supply flow.......................................................................... A-7
Figure A-3: xRAP-D front panel ................................................................................... A-10
Figure A-4: xRAP-D connectors ................................................................................... A-11
Figure A-5: Y-cable connection ................................................................................... A-12
Figure A-6: Double-Y cable connection ....................................................................... A-12
Figure A-7: xRAP-B front panel.................................................................................... A-14
Figure A-8: xRAP-B connectors ................................................................................... A-15
Figure A-9: xRAP-HP front panel ................................................................................. A-17
Figure A-10: xRAP-HP connector panel ...................................................................... A-18
Figure A-11: xRAP-HP connector and slide switch panel ............................................ A-18
Figure A-12: xRAP-100 front panel .............................................................................. A-20
Figure A-13: xRAP-100 connectors ............................................................................. A-21
Figure A-14: miniRAP front panel ................................................................................ A-23
Figure A-15: miniRAP connectors ................................................................................ A-24
Figure A-16: Fiber Storage Tray front view .................................................................. A-25
Figure A-17: Fiber Storage Tray top view .................................................................... A-25
Figure A-18: Heat buffer.............................................................................................. A-26
Figure A-19: Typical cable guide ................................................................................. A-26
Figure A-20: Fiber guide for 19-inch rack ................................................................... A-27
Figure A-21: Fiber guide for ETSI rack ........................................................................ A-27
Figure A-22: Typical cable guiding rod ....................................................................... A-28
Figure A-23: Using the rod for guiding fibers .............................................................. A-28
Figure A-24: Using the rod for guiding cables............................................................. A-29
Figure A-25: ODF internal view ................................................................................... A-30
Figure A-26: ODF front panel ...................................................................................... A-30
Figure A-27: ODF_HP general view ........................................................................... A-31
Figure A-28: ODF_HP view with open panel .............................................................. A-32
Figure A-29: Detailed view of fiber tray with lid removed ............................................ A-32
Figure A-30: Typical 84-channel DDF unit for balanced E1 interfaces
general view ................................................................................................................. A-33

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List of Figures

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Maintenance Manual

Figure A-31: DDF general view with cover closed ...................................................... A-34
Figure A-32: DDF general view with cover open ........................................................ A-34
Figure A-33: Typical 84-channel patch panel for balanced E1 interfaces
general views ............................................................................................................... A-35
Figure B-1: 3-pin power connector ................................................................................. B-2
Figure B-2: 5-pin power connector ................................................................................. B-2
Figure B-3: ALARMS connector pin identification .......................................................... B-3
Figure B-4: RAP connector pin identification ................................................................. B-4
Figure B-5: F-CHANNEL connector pin identification .................................................... B-5
Figure B-6: T3_1/T4_1 and T3_2/T4_2 connector pin identification.............................. B-6
Figure B-7: OW connector pin identification .................................................................. B-7
Figure B-8: OHA connector pin identification ................................................................. B-8
Figure B-9: MECP ETHERNET connector pin identification........................................ B-10
Figure B-10: ACP900 connector pin identification ....................................................... B-11
Figure B-11: M2_84 14-tributary connector pin identification ...................................... B-12
Figure B-12: Alarm In principle circuit .......................................................................... B-19
Figure B-13: Alarm Out principle circuit ....................................................................... B-20
Figure B-14: xRAP-D and xRAP-B shelf DC input power connector pin functions...... B-21
Figure B-15: SHELF alarm connector pin identification ............................................... B-21
Figure B-16: ALARMS connector pin identification ...................................................... B-23
Figure B-17: SHELF EXTERNAL ALARM/CONTROL connector pin identification..... B-28
Figure B-18: RAP connector pin identification ............................................................. B-30
Figure B-19: CONTROL CONNECTION connector pin identification.......................... B-31
Figure B-20: 3-pin power connector ............................................................................. B-34
Figure B-21: 5-pin power connector ............................................................................. B-34
Figure B-22: xRAP-100 SHELF ALARM connector pin identification .......................... B-35
Figure B-23: xRAP-100 ALARM IN/OUT connector pin identification ......................... B-36
Figure B-24: miniRAP shelf DC input connector pin functions .................................... B-40
Figure B-25: SEVERITY IN alarm connector pin identification .................................... B-40
Figure B-26: SEVERITY OUT alarm connector pin identification ................................ B-41
Figure C-1: Connections for 16- to 32-channel expansion ........................................... C-2
Figure D-1: Typical rack layout with a patch panel ....................................................... D-4

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List of Tables
Table 1-1:

XDM shelves circuit breaker rating...................................................... 1-11

Table 4-1:

Environmental requirements ................................................................. 4-2

Table 4-2:

Main equipment dimensions .................................................................. 4-2

Table 4-3:

Comparison deep vs. standard door ..................................................... 4-4

Table 4-4:

Maximum power consumption data....................................................... 4-6

Table 4-5:

Equipment rack data............................................................................ 4-11

Table 4-6:

Rack space requirements .................................................................... 4-12

Table 4-7:

Traffic cables, fibers, and mating connector data ............................... 4-32

Table 4-8:

xRAP input and output alarm allocation .............................................. 4-75

Table 5-1:

Connecting power and rack alarm cables ........................................... 5-12

Table 6-2:

Installation Data for XDM-500 I/O Cards and Associated Modules ...... 6-6

Table 6-3:

Aurora-G cables .................................................................................. 6-80

Table 6-4: Serial port parameters ................................................................................ 6-86


Table 6-5:

IP address command line parameters................................................. 6-89

Table 8-1:

Card and module inventory ................................................................... 8-5

Table 8-2:

Visual inspection and mechanical checks ............................................. 8-7

Table 8-3:

Measured optical levels ......................................................................... 8-8

Table 8-4:

Signal characteristics at monitoring points ............................................ 8-9

Table 8-5:

Throughput and latency test results .................................................... 8-29

Table 8-6:

Frame loss rate test results ................................................................. 8-29

Table 9-1:

Preventive maintenance inspection and checks ................................... 9-3

Table 9-2:

Preventive maintenance procedures via EMS-XDM ............................. 9-4

Table 9-3:

Preventive maintenance inspection and checks ................................... 9-5

Table 9-4:

General troubleshooting procedures for cards/modules ..................... 9-13

Table 9-5:
General troubleshooting procedures for optical
transceiver plug-ins ...................................................................................................... 9-15
Table 9-6:

Troubleshooting procedures for electrical interface modules.............. 9-16

Table 9-7:

Troubleshooting procedure for optical OADM and Mux/DeMux ......... 9-17

Table 9-8:

Troubleshooting procedures for EIS cards .......................................... 9-19

Table 9-9:

Troubleshooting procedures for DIO cards ......................................... 9-20

Table 9-10:

Troubleshooting procedures for DIOB cards ....................................... 9-22

Table 9-11:

Troubleshooting procedures for MCS5/MCS10 cards ........................ 9-23

Table 9-12:

Troubleshooting procedures for ROADM cards .................................. 9-25

Table 9-13:

Understanding the Aurora-G indicator lights ....................................... 9-27

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Maintenance Manual

Table 9-14:

Diagnostic codes ................................................................................. 9-28

Table 9-15:

Management access troubleshooting.................................................. 9-29

Table 9-16:

Configuration troubleshooting ............................................................. 9-30

Table 9-17:

Traffic troubleshooting ......................................................................... 9-31

Table 9-18:

Certificate troubleshooting ................................................................... 9-32

Table 9-19:

Card failure troubleshooting ................................................................ 9-32

Table 9-20:

Troubleshooting procedures for ATS cards......................................... 9-33

Table 9-21:

Troubleshooting transmission and traffic alarms ................................. 9-34

Table 9-22:

Troubleshooting power problems ........................................................ 9-36

Table 9-23:

Troubleshooting procedures for timing subsystem ............................. 9-38

Table 9-24:
Table A-1:
Table A-2:
Table A-3:
Table A-4:
Table A-5:
Table A-6:
Table A-7:
Table A-8:
Table A-9:
Table A-10:
Table A-11:

Troubleshooting management communication ................................... 9-39


RAP features ......................................................................................... A-5
xRAP-D front panel component functions ........................................... A-10
xRAP-D connector functions ............................................................... A-11
xRAP-B front panel component functions ........................................... A-14
xRAP-B connector functions ............................................................... A-15
xRAP-HP front panel component functions ......................................... A-17
xRAP-HP connectors........................................................................... A-18
xRAP-100 front panel component functions ........................................ A-20
xRAP-100 connectors.......................................................................... A-21
miniRAP component functions ............................................................ A-23
miniRAP connector functions .............................................................. A-24

Table B-1:

ALARMS connector pin assignment...................................................... B-3

Table B-2:

RAP connector pin assignment ............................................................. B-4

Table B-3:

F-CHANNEL connector pin assignment ................................................ B-5

Table B-4:

T3_1/T4_1 and T3_2/T4_2 connector pin assignment ......................... B-6

Table B-5:

OW connector pin assignment .............................................................. B-7

Table B-6:

OHA connector pin assignment............................................................. B-8

Table B-7:

ETHERNET connector pin assignment ............................................... B-10

Table B-8:

ACP900 Ethernet connector pin assignments .................................... B-11

Table B-9:
M2_84B interface module, 14-tributary connector
pin assignment ............................................................................................................. B-12
Table B-10:

Patch panel wiring ............................................................................... B-15

Table B-11:

SHELF alarm connector pin assignment ............................................. B-22

Table B-12:

ALARMS connector pin assignment.................................................... B-24

Table B-13:
SHELF EXTERNAL ALARM/CONTROL connector
pin assignment ............................................................................................................. B-28
Table B-14:

xii

SHELF EXTERNAL ALARM/CONTROL - ALARMS cable wiring ...... B-29

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List of Tables

Table B-15:

RAP connector pin assignments ......................................................... B-30

Table B-16:

RAP shelf cable wiring diagram .......................................................... B-30

Table B-17:

CONTROL CONNECTION connector pin assignment ....................... B-31

Table B-18:

xRAP-100 SHELF ALARM connector pin assignment ........................ B-35

Table B-19:

xRAP-100 ALARM IN/OUT connector pin assignment ....................... B-37

Table B-20:

SEVERITY IN alarm connector pin assignment .................................. B-40

Table B-21:

SEVERITY OUT alarm connector pin assignment .............................. B-41

Table E-1:

Conversion from XDM-1000 slot marking to slot codes ........................ E-1

Table E-2:

Conversion from XDM-500 slot marking to slot codes .......................... E-2

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About This Manual


In this chapter:
Overview .......................................................................................................... xv
Intended Audience ............................................................................................ xv
Document Organization ................................................................................... xvi
Document Conventions ................................................................................... xvi
Related Documentation .................................................................................. xvii
Obtaining Technical Documentation ............................................................. xviii
Technical Assistance ..................................................................................... xviii

Overview
The XDM-500 Installation and Maintenance Manual (IMM) describes how to
set up, configure, and install the XDM-500 and its components and accessories.
The manual also provides task-oriented instructions for testing, troubleshooting
hardware-related problems, and replacing hardware components (cards,
modules, accessories).

Intended Audience
This manual is intended for installation and other qualified service personnel
responsible for installing the system and its accessories.
The instructions require you to understand and follow the safety practices
included here, as well as any applicable national regulations and those enforced
at your site. They also require that you understand the physical, optical, and
electrical requirements of the installation site.

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About This Manual

XDM-500 Installation and


Maintenance Manual

Document Organization
This Installation and Maintenance Manual contains the following information:

Before you start/safety guidelines (page 1-1)

Introduction to the XDM Platform (page 2-1)

XDM-500 Installation Overview (page 3-1)

Installation procedures, including:

Site preparation and rack installation (page 4-1)

XDM-500 platform installation (page 5-1)

Card and module installation (page 6-1)

Optical fiber and cable installation and routing (page 7-1)

Commissioning Tests (page 8-1)

Maintenance (page 9-1)

XDM Accessories (page A-1)

Connector pin assignments (page B-1)

Upgrades and expansions (page C-1)

Standards and References (page F-1)

Document Conventions
When applicable, this manual uses the following conventions.
Convention

Indicates

Example

Bold

Names of windows, dialog On the Alarms menu...


boxes, menus, buttons, and
most other GUI elements

Menu > Option

Selection from a menu, or


leading to another
command

Italics

New terms, emphasized


Examples in text
text, and names of manuals
and documents

Borders around text

Notes, cautions, and


warnings

Select Update > View


Objects

See examples below

NOTE: Text set off in this manner presents clarifying


information, specific instructions, commentary, sidelights, or
interesting points of information.

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About This Manual

CAUTION: Text set off in this manner indicates that failure


to follow directions could result in damage to equipment or
loss of information.

WARNING: Text set off in this manner indicates that failure

to follow directions could result in bodily harm or loss of life.

LASER WARNING: Text set off in this manner indicates


how to avoid personal injury. All personnel involved in
equipment installation, operation, and maintenance must be
aware that laser radiation is invisible. Therefore, although
protective devices generally prevent direct exposure to the
beam, personnel must strictly observe the applicable safety
precautions and, in particular, must avoid staring into optical
connectors, either directly or using optical instruments.
ESD: Text set off in this manner indicates information on
how to avoid discharge of static electricity and subsequent
damage to the unit.
TIP: Text set off in this manner includes helpful information
and handy hints that can make your task easier.
IMPORTANT: Text set off in this manner presents essential
information to which you must pay attention.

Related Documentation
The following publications may be of assistance to you in the installation and
commissioning processes. Some of these documents present information
supplied in this installation manual in greater or lesser detail.

XDM Multiservice Packet-Optical Transport Platform General Description

XDM-1000 Product Line Reference Manual

XDM System Specifications

EMS-XDM (Element Management System) User Manual

LightSoft Network Management System User Manual

IEC Publication 825-Laser Safety Requirements

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xvii

About This Manual

XDM-500 Installation and


Maintenance Manual

Obtaining Technical
Documentation
To obtain technical documentation related to ECI products, contact:
ECI Ltd.
Documentation Department
30 Hasivim St.
Petach Tikva 49130
Israel
Fax: +972-3-9268060
Email: techdoc.feedback@ecitele.com

Technical Assistance
The configuration, installation, and operation of the XDM-500 and its
operation in a network are highly specialized processes. Due to the different
nature of each installation, some planning aspects may not be covered in this
manual.
If you have questions or concerns about your network design or if you require
installation personnel to perform the actual installation process, ECI maintains
a staff of design engineers and highly trained field service personnel. The
services of this group are available to customers at any time.
If you are interested in obtaining design assistance or a network installation
plan from ECI's Customer Support team, contact your ECI sales representative.
With any support related issues, technical or logistic, contact the ECI Customer
Support center at your location or our central customer support center action
line at:
Telephone

+972-3-9266000

Telefax

+972-3-9266370

Email

on.support@ecitele.com

ECI's XDM and BroadGate product lines are certified to


comply with MEF9 and MEF14 standards.

ECI Telecom's qualification lab is accredited by A2LA for


competence in electrical testing according to the International
Standard ISO IEC 17025-2005 General Requirements for the
Competence of Testing and Calibration Laboratories.

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1
Installing XDM-500: Before
You Start Safety Guidelines
In this chapter:
Overview ......................................................................................................... 1-1
Warning Definition .......................................................................................... 1-2
Qualified Personnel Warning .......................................................................... 1-3
Installation Warning ........................................................................................ 1-4
General Safety Requirements .......................................................................... 1-5
Jewelry Removal Warning .............................................................................. 1-6
Grounding Requirements ................................................................................. 1-7
Power Supply Requirements ......................................................................... 1-11
TUV Statutory Warnings and Requirements ................................................. 1-17
ITU-T/Telcordia Statutory Warnings and Requirements .............................. 1-19
Laser Safety Requirements ............................................................................ 1-21
Protection Against Electrostatic Discharge ................................................... 1-26
Environmental and Health Concerns ............................................................. 1-31

Overview
This chapter describes the XDM safety guidelines. The safety rules and
warnings in this chapter must be read before beginning any platform
installation or maintenance work. These safety guidelines must be adhered to
carefully.
WARNING: XDM equipment (the "XDM equipment" or the

"Equipment") is intended for installation in restricted access areas only.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

WARNING: XDM equipment has two power sources. Disconnect both


before servicing.

Before starting installation, make sure that the DC power is not


connected to the rack, and that the circuit breakers in the xRAP or in
the user-provided power distribution panel are set to OFF.

NOTE: This chapter includes translations of some of the warnings that


appear in this guide. The translated warnings are presented with the
English text first, followed by these languages:

Danish
Dutch
Finnish
French
German
Italian
Portuguese
Spanish
Swedish

Warning Definition
WARNING: This symbol means danger. You are in a situation that
could result in severe bodily injury. Before you work on any
equipment, be aware of the potential electrical hazards and become
familiar with accident prevention measures.

ADVARSEL: Dette symbol betyder fare. Der er risiko for alvorlig

legemsbeskadigelse. Vr opmrksom p potentielle elektriske risici,


og st dig ind i forholdsreglerne til uheldsforebyggelse, fr du arbejder
p nogen form for udstyr.

WAARSCHUWING: Dit symbool betekent gevaar. U verkeert in een

situatie die ernstig lichamelijk letsel kan veroorzaken. Voordat u met de


apparatuur gaat werken dient u zich bewust te zijn van mogelijke
elektriciteitsrisicos en zich op de hoogte te stellen van maatregelen ter
voorkoming van ongelukken.

VAROITUS: Tm merkki tarkoittaa vaaraa. Olet tilanteessa, joka voi


johtaa vakavaan loukkaantumiseen. Ennen kuin kytt mitn laitetta,
ota huomioon mahdolliset shkiset vaaratekijt ja tutustu ennalta
onnettomuuden ehkisemisohjeisiin.

ATTENTION: Ce symbole est signe de danger. Vous risquez de

graves blessures corporelles. Avant de travailler sur un appareil, vous


devez avoir conscience des risques lectriques encourus et vous
familiariser avec les mesures de prvention des accidents.

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Installing XDM-500: Before You Start


Safety Guidelines

WARNUNG: Dieses Symbol bedeutet Gefahr. Sie befinden sich in

einer Situation, die zu schwerwiegenden Verletzungen fhren kann.


Bedenken Sie vor dem Gebrauch der Gerte mgliche Gefahren durch
elektrischen Strom und machen Sie sich mit den Manahmen zur
Unfallverhtung vertraut.

AVVERTENZA: Questo simbolo indica una situazione di pericolo.

Tale situazione potrebbe provocare gravi danni fisici. Prima di


utilizzare qualsiasi dispositivo, fare attenzione ai potenziali rischi
elettrici e acquisire familiarit con le eventuali misure di prevenzione.

AVISO: Este smbolo significa perigo. Encontra-se numa situao em

que a sua sade corre srios riscos. Antes de comear a trabalhar com o
equipamento, verifique o risco potencial de choque elctrico e
familiarize-se com as medidas de preveno de acidente.

ADVERTENCIA: Este smbolo significa peligro. Est expuesto a sufrir


daos corporales serios. Antes de utilizar el equipo, tenga en cuenta la
posibilidad de riesgo elctrico potencial y lea atentamente las medidas
de prevencin de accidentes.

VARNING: Denna symbol betyder livsfara. Du befinner dig i en

situation som kan leda till allvarliga kroppsskador. Innan du arbetar


med utrustningen mste du vara medveten om potentiella faror och
knna till olycksfrebyggande tgrder.

Qualified Personnel Warning


WARNING: Only trained qualified personnel must install, maintain, or
replace the equipment.

ADVARSEL: Kun uddannet, kvalificeret personale m installere,


vedligeholde eller udskifte udstyr.
WAARSCHUWING: Installatie, onderhoud of vervanging van de
apparatuur mag uitsluitend worden uitgevoerd door opgeleid en
bevoegd personeel.

VAROITUS: Vain koulutettu, ptev henkilkunta saa asentaa,


yllpit tai vaihtaa laitteella.
ATTENTION: Seules des personnes formes et qualifies sont
habilites installer, entretenir ou changer l'quipements.

WARNUNG: Nur geschultes, qualifiziertes Personal sollte den


Ausrstung installieren, warten oder ersetzen.

AVVERTENZA: Il apparecchiature pu essere installato, controllato o


sostituito solo da personale qualificato.

AVISO: S pessoal especializado e qualificado deve instalar, fazer a


manuteno ou substituir o equipamento.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

ADVERTENCIA: La instalacin, el mantenimiento y la sustitucin de


este equipo slo deber realizarlo personal cualificado.

VARNING: Endast utbildad, kvalificerad personal fr installera,


underhlla eller erstta utrustning.

Installation Warning
WARNING: Before you connect the equipment to a power source, read
the installation information in this guide.

ADVARSEL: Gennemls installationsoplysningerne i denne


vejledning, fr udstyr sluttes til en strmkilde.
WAARSCHUWING: Lees de aanwijzingen voor de installatie in deze
handleiding voordat u de apparatuur aansluit op een voedingsbron.

VAROITUS: Ennen kuin liitt laitteella virtalhteeseen, lue


asennusohjeet tst oppaasta.

ATTENTION: Avant de brancher l'quipements une source

d'alimentation, lisez les instructions d'installation de ce manuel.

WARNUNG: Lesen Sie die Hinweise zur Installation in diesem

Handbuch, bevor Sie den Ausrstung an eine Stromquelle anschlieen.

AVVERTENZA: Prima di collegare il apparecchiature alla presa di


alimentazione, leggere le informazioni relative all'installazione
riportate in questa guida.

AVISO: Antes de ligar o equipamento a uma fonte de energia, leia as


instrues para instalao neste guia.

ADVERTENCIA: Antes de conectar el equipo a la fuente de

alimentacin, lea la informacin sobre instalacin en esta gua.

VARNING: Innan du ansluter utrustning till en strmklla ska du lsa


installationsinformationen i denna handbok.

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Installing XDM-500: Before You Start


Safety Guidelines

General Safety Requirements


XDM platforms contain power sources of varying voltages. Make sure to
install the platforms in compliance with the following guidelines:

Use the equipment in restricted access locations only.

Note that the equipment racks and XDM platforms are suitable for
mounting on concrete or other noncombustible surfaces only.

Ensure the integrity of the grounding connections.

XDM platforms must be installed in accordance with the National


Electrical Code.

Sufficient lighting is available while working on the equipment.

Do not work on any equipment connected to a voltage source (DC or AC),


except for inserting/removing cards or modules (these activities can be
performed on operating equipment).

Ensure that the maximum working temperature does not exceed 50C.

Use only insulated tools during installation.

Wear protective clothing as required by the requisite safety regulations.

Do not install or maintain equipment connected to external lines (for


example, electrical tributaries) during thunderstorms.

Avoid contact with high voltage sources when installing platforms, cards,
and modules.

Make sure you are familiar with the warning signals and labels affixed to
the equipment, and strictly observe the procedures to avoid the indicated
hazards.

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1-5

Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

Jewelry Removal Warning


WARNING: Before you work on equipment that is connected to power

lines, remove all jewelry (including rings, necklaces, and watches).


When connected to power and ground, metal objects may heat up and
cause serious burns, or weld the objects to the terminals.
ADVARSEL: Fr du arbejder p udstyr, der er sluttet til
strmledninger, skal du tage evt. smykker af (f.eks. ringe, halskder og
ure). Ved tilslutning til strm og jord kan metalobjekter blive varme og
forrsage alvorlige forbrndinger, eller objekterne kan blive svejset
fast til terminalerne.
WAARSCHUWING: Voordat u aan apparatuur gaat werken die met
elektrische leidingen is verbonden, dient u sieraden (zoals ringen,
kettingen en horloges) af te doen. Metalen voorwerpen worden warm
wanneer deze met stroom en aarde verbonden zijn en kunnen ernstige
brandwonden veroorzaken of het metalen voorwerp aan de
aansluitklemmen vastlassen.
VAROITUS: Ennen kuin tyskentelet laitteella, joka on kytketty
virtajohtoihin, riisu kaikki korut (mukaanlukien sormukset, kaulanauhat
ja rannekellot). Ollessaan kosketuksissa sek shkvirtaan ett maahan,
metalliesineet saattavat kuumentua ja aiheuttaa vakavia palovammoja
tai hitsautua kiinni napoihin.
ATTENTION: Avant de travailler sur un quipement connect au
secteur, enlevez tous vos bijoux (y compris les bagues, les colliers et
les montres). Lorsque vous tes connect au secteur et la masse, les
objets mtalliques peuvent chauffer et causer de srieuses brlures ou
se souder l'appareil.
WARNUNG: Legen Sie jeglichen Schmuck (wie Ringe, Ketten und
Uhren) ab, bevor Sie bei bestehender Stromzufuhr an dem Gert
arbeiten. Wenn eine Verbindung zur Stromversorgung und zur Masse
besteht, knnen sich Gegenstnde aus Metall erhitzen und
Verbrennungen verursachen oder an die Anschlsse angeschweit
werden.
AVVERTENZA: Prima di utilizzare apparecchiature collegate
all'alimentazione, togliersi anelli, collane e orologi e altri oggetti. Dopo
aver eseguito il collegamento all'alimentazione e la messa a terra, tali
oggetti metallici possono riscaldarsi e provocare la fusione di oggetti
sui terminali.
AVISO: Antes de iniciar o trabalho com o equipamento que estiver
ligado corrente elctrica, retire qualquer tipo de artigos de joalharia
(tais como anis, colares e relgios). Quando esto ligados corrente e
terra, os objectos em metal podem aquecer e provocar graves
queimaduras ou at mesmo ficar soldados aos terminais de corrente.
ADVERTENCIA: Antes de trabajar con un equipo que est conectado a
la alimentacin, deber uitarse todas las joyas que lleve (incluidos
anillos, collares y relojes). Los objetos metlicos que estn conectados
a la alimentacin y a una toma de tierra, se podran calentar y causar
quemaduras graves o soldar objetos a los terminales.

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Installing XDM-500: Before You Start


Safety Guidelines

VARNING: Innan du utfr arbete p utrustning som r ansluten till


ntsladdar ska du ta av smycken (inkl. ringar, halsband och klockor).
Nr apparaten r ansluten till strm och jord kan metallfreml bli heta
och orsaka allvarliga brnnskador eller svetsa fast fremlen till
terminalerna.

Grounding Requirements
All equipment, including XDM platforms, ancillary units, and equipment from
other vendors, must be properly grounded at all times. Good grounding is
necessary to protect personnel and equipment, minimize noise, and allow the
discharge of accumulated static charges to earth.
Proper operation of the XDM equipment requires that the positive supply line
be connected to the common ground (CGND) of the site at the power source, in
accordance with ETS300132-2.
WARNING: When installing the equipment, the ground connection must
always be made first and disconnected last.

ADVARSEL: Nr udstyr installeres, skal jordledningen altid monteres


frst og afmonteres sidst.
WAARSCHUWING: Bij het installeren van de apparatuur moet de aarde
als eerste worden aangesloten en als laatste worden afgekoppeld.

VAROITUS: Kun reititint asennetaan, maaliitnt pit aina tehd ensin


ja laitteella viimeisen.

ATTENTION: Lors de l'installation du quipements, la mise la terre


doit toujours tre effectue en premier et dconnecte en dernier.

WARNUNG: Bei der Installation des Ausrstung muss der Masseleiter


stets zuerst angeschlossen und zuletzt entfernt werden.

AVVERTENZA: Durante l'installazione del apparecchiature, la

connessione a terra deve essere eseguita per prima e disconnessa per


ultima.

AVISO: Ao instalar o equipamento, a ligao terra deve ser sempre a


primeira a ser ligada e a ltima a ser desligada.

ADVERTENCIA: Al instalar el equipo, la conexin de tierra se deber


hacer en primer lugar y se deber desconectar en ltimo lugar.

VARNING: Nr du installerar utrustning mste jordsladden kopplas in


frst och kopplas ur sist.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

Rack Grounding Requirements


The rack is supplied with a main copper or brass grounding bolt ('grounding
stud') welded to the rack frame. The grounding stud is identified on the rack by
the ground symbol label. The stud must be free of paint. The rack also has a
rack grounding bar, which includes a set of grounding connection points for
grounding all the different equipment used in the rack. The following figure
highlights the rack grounding stud and rack grounding bar on an optical rack
used in a typical XDM installation.

Figure 1-1: Optical rack grounding bar and rack frame grounding post

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XDM-500 Installation and


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Installing XDM-500: Before You Start


Safety Guidelines

A connection must be made between the rack grounding bar and the site
grounding bar in compliance with TUV/ETSI recommendations. For example,
grounding may be completed by means of a copper cable with green/yellow
insulation having the same diameter as the power feeding cables or thicker, and
as short as possible. A length of appropriate gauge grounding cable is included
with the platform accessories. A different connection bar may also be used, as
long as the grounding connection is in compliance with TUV/ETSI
recommendations. The rack grounding stud is connected to the rack grounding
bar by means of a metal panel. These rack grounding connections are
highlighted in the following figure.

Figure 1-2: Grounding the optical rack to the site grounding bar

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

Equipment Grounding Requirements


XDM platforms and accessories are mounted on the rack mounting rails. Each
Equipment unit mounted on the rack is grounded to the rack frame by the
mounting brackets, retaining bolts, and nuts attaching the unit to the rack
frame. These rack mounting rails, as well as the mounting brackets' internal
surfaces facing the rails and the Equipment, must all be free of paint and
provide electrical continuity to the Equipment frame and to the rack grounding
stud and grounding bar.
Check that the resistance between any mounting bracket and the Equipment
frame (chassis), as well as the resistance between any rail and the rack
grounding stud, is lower than 0.1 .
Particular attention must be paid to the area in which the xRAP (when used) is
attached. Paint must be removed from this area of the rack to ensure efficient
electrical contact.
NOTES: ECI offers a few different types of Rack Alarm Panels

(xRAPs) for use with XDM platforms: PRAP, xRAP-D, xRAP-B,


xRAP-HP, xRAP-100, and miniRAP. The generic name xRAP is used
whenever the information applies to all types.

CAUTION: Connect the xRAP grounding bolt to the rack grounding

bar with a grounding cable in compliance with UL/ETSI


recommendations. The cable must include lug terminals on both ends
and be securely fastened with a flat washer, serrated lock washer, and
nut or bolt, depending on the connection point. If necessary, the gauge
of the grounding lead can be reduced to the gauge of the xRAP power
leads.

In addition to the basic grounding protection offered through the mounting


connection between the equipment and the rack, XDM grounding procedures
for the rack and for each component mounted within the rack are designed to
meet UL/ETSI grounding requirements. Detailed descriptions of the grounding
procedures for each piece of equipment, as well as the rack itself, are included
with the installation instructions in Site Preparation and Rack Installation (page
4-1) and XDM-500 Platform Installation (page 5-1).
WARNING: To prevent possible damage to XDM Equipment, all

racks and equipment must be completely grounded before


connecting to the platform any external devices powered from any DC
source (40.5 V - 75 V) or AC source (100 V - 230 V). All grounding
procedures described in Grounding the Platform (page 5-3) must be
completed before, for example, connecting an external PC to configure
and initialize the NE management system.

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XDM-500 Installation and


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Installing XDM-500: Before You Start


Safety Guidelines

Power Supply Requirements


Connection via RAP
XDM platforms require two power sources with voltage of -40.5 VDC ranging
to -72 VDC, with the positive line connected to the site ground. The nominal
feeding voltage is -48 VDC.
NOTE: The working voltage range for the USA market is 40.5 VDC to -60 VDC.

Each power source must be protected by a TUV-listed circuit breaker installed


in the RAP. These circuit breakers are included in the installation kit supplied
with the equipment, and their current ratings are therefore in accordance with
the order.
In addition, the site operator must provide a readily accessible TUV-listed
disconnect device incorporated in the fixed power wiring of the site. The
device limits the maximum delivered current to a safe value.

Connection via User-provided Power


Distribution Panel
The requirements described in Connection via xRAP (page 1-11) also apply
when a user-provided power distribution panel is used.
The circuit breakers to be used for the various XDM platforms must be
TUV-listed. Examples of TUV-listed circuit breakers are provided in the
following table.
Table 1-1:

XDM shelves circuit breaker rating

Platform

Circuit breaker
rating (A)

Circuit breaker example


Heineman (part no.)

XDM-40

20

AM1R-B3-AC-21-K-A-20-2

XDM-400

25

AM1R-B3-AC-21-K-A-25-2

XDM-450

16

AM1R-B3-AC-21-K-A-16-2

XDM-500

30

AM1R-B3-AC-21-K-A-30-2

XDM-1000

55

AM1R-B3-AC-21-K-A-55-2

XDM-2000

60

AM1R-B3-AC-21-K-A-60-2

XDM-3000

50

AM1R-B3-AC-21-K-A-50-2

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

DC Power Warnings
WARNING: Follow this wiring sequence when connecting power:

ground to ground, positive lead to +RTN terminal, and negative lead to 48 V terminal. To disconnect power, perform the sequence in reverse
order. Always connect the ground wire first and disconnect it last.

ADVARSEL: Ledningsfring ved strmtilslutning: Jord til jord, positiv


ledning til +RTN-terminalen og negativ ledning til -48V-terminalen.
Foretag dette i omvendt rkkeflge ved frakobling af strmmen.
Jordledningen skal altid monteres frst og afmonteres sidst.
WAARSCHUWING: Houd u bij het aansluiten van de stroom aan de

volgende bedradingsvolgorde: aarde naar aarde, de positieve draad naar


de klem +RTN en de negatieve draad naar de klem -48 V. Voor het
afkoppelen past u de omgekeerde volgorde toe. De aarddraad moet altijd
het eerst worden aangesloten en het laatst worden afgekoppeld.

VAROITUS: Noudata seuraavaa johdotusjrjestyst kytkiesssi virtaa:


maasta maahan, positiivinen johdin +RTN-napaan ja negatiivinen johdin
-48 V -napaan. Tee edellinen knteisess jrjestyksess, kun olet
katkaisemassa virtaa. Maajohto tulisi aina kytke ensimmisen kiinni ja
viimeisen pois.
ATTENTION: Lorsque vous vous connectez au secteur, suivez les

instructions suivantes : terre la terre, cble positif vers connexion


+RTN et cble ngatif vers connexion 48V. Suivez ces instructions dans
l'ordre inverse pour vous dconnecter du secteur. Le cble la terre doit
toujours tre connect en premier et dconnect en dernier.

WARNUNG: Beachten Sie beim Anschluss an das Stromnetz folgende

Reihenfolge der Verkabelung: Masseleiter an Masseanschluss, positiver


Pol an +RTN-Anschluss und negativer Pol an -48 V-Anschluss.
Verwenden Sie bei der Unterbrechung der Stromversorgung die
umgekehrte Reihenfolge. Der Masseleiter sollte immer zuerst
angeschlossen und zuletzt entfernt werden.

AVVERTENZA: Quando si collega il router alla presa di alimentazione,


seguire la sequenza di fili elettrici indicata di seguito: terra a terra, polo
positivo sul terminale +RTN e polo negativo sul terminale -48 V. Per
scollegare il router dalla presa di alimentazione, seguire la sequenza
nell'ordine inverso. Il filo della terra deve essere sempre collegato per
primo e scollegato per ultimo.

AVISO: Ao ligar a corrente elctrica, observar a seguinte sequncia de


cablagem: fio de terra a fio de terra, plo positivo com terminal +RTN, e
plo negativo com terminal -48 V. Para desligar a corrente, executar a
sequncia em ordem inversa. O fio de terra deve ser sempre ligado em
primeiro lugar e desligado em ltimo lugar.
ADVERTENCIA: Cuando conecte la alimentacin, siga la secuencia de
cableado que se indica a continuacin: tierra a tierra, toma positiva a
terminal +RTN, y toma negativa a terminal -48 V. Para desconectar la
alimentacin, realice la secuencia en orden inverso. La toma de tierra
siempre deber conectarse en primer lugar y desconectarse en ltimo.

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Installing XDM-500: Before You Start


Safety Guidelines

VARNING: Nr du ansluter strmmen ska du flja denna sekvens: jord

till jord, positiv sladd till +RTN-terminalen och negativ sladd till -48 Vterminalen. Utfr dessa steg i motsatt ordning nr du kopplar frn
strmmen. Jordsladden br alltid kopplas in frst och kopplas ur sist.

WARNING: Ensure the DC input wiring is connected in the correct

polarity, as reversed polarity may trip the circuit breaker or damage the
equipment.

ADVARSEL: Kontrollr, at jvnstrmstilfrselsledningen er tilsluttet


med korrekt polaritet, da omvendt polaritet kan udlse brydekontakten
eller beskadige udstyr.
WAARSCHUWING: Controleer of de ingangsbedrading voor

gelijkstroom is aangesloten op de juiste polariteit, aangezien omgekeerde


polariteit de stroomonderbreker kan uitschakelen of de apparatuur kan
beschadigen.

VAROITUS: Varmista, ett tasavirran syttjohdotus on kytketty

oikeisiin napoihin, sill vastakkainen napaisuus saattaa suojalaukaista


katkaisijan (tripata) tai aiheuttaa vahinkoa laitteella.

ATTENTION: Assurez-vous que le cble de l'entre de courant continu


se trouve dans la bonne polarit, sinon vous risquez d'allumer le
disjoncteur ou d'endommager l'quipements.

WARNUNG: Vergewissern Sie sich, dass das Gleichstromkabel an die

richtige Polaritt angeschlossen ist. Andernfalls kann der Trennschalter


ausgeschaltet oder der Ausrstung beschdigt werden.

AVVERTENZA: Assicurarsi che i fili CC siano collegati alla polarit

corretta, in caso contrario pu scattare l'interruttore automatico o si pu


danneggiare il apparecchiature.

AVISO: Certifique-se de que a ligao de entrada de corrente feita com


a polaridade adequada, pois a polaridade invertida pode fazer com que o
circuito dispare ou danificar o equipamento.

ADVERTENCIA: Asegrese de que el cable de entrada de CC est

conectado con la polaridad adecuada ya que la polaridad contraria podra


provocar un cortacircuitos o daar el equipo.

VARNING: Kontrollera att ingngssladdarna fr likstrm r anslutna till


rtt pol. Fel pol kan leda till att strmbrytaren stngs av eller att
utrustning skadas.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

WARNING: When stranded wiring is used, make sure that no stray


strands protrude from the DC power entry terminals.

ADVARSEL: Nr der bruges flertrdede ledninger, skal det kontrolleres,


at der ikke stikker trde ud af stikkene.
WAARSCHUWING: Wanneer er geslagen bedrading wordt gebruikt,
moet u ervoor zorgen dat er geen lekdraden uit de
gelijkstroomingangsklemmen steken.

VAROITUS: Jos kytetn johdotusta, jossa on sikeit, varmista, ettei


yksikn sie harota tasavirran syttnavoista.

ATTENTION: Lorsque vous utilisez des cbles toronns, assurez-vous


qu'aucun brin ne dpasse des entres de courant continu.

WARNUNG: Achten Sie bei verseilten Kabeln darauf, dass keine Litzen
aus den Gleichstromanschlssen hervorstehen.
AVVERTENZA: Se si utilizzano cavi a connettori multipli, assicurarsi
che nessun cavo sporga dai terminali dell'alimentazione CC.

AVISO: Quando for utilizado fio entranado, certifique-se que no ficam


pontas soltas aparentes nos terminais de entrada de energia de CC.
ADVERTENCIA: Si se utiliza cable trenzado, asegrese de que no se ha
salido ningn hilo de los terminales de entrada de CC.

VARNING: Om du anvnder tvinnade kablar ska du kontrollera att inga


lsa filament sticker ut frn ingngsterminalerna fr likstrm.

WARNING: Before working on the equipment or near the power entries,


ensure that the power cables have been disconnected from both DC
power entry terminals. Do not touch the DC power entries while the
power cables are connected. Voltages may be present within the power
entries when the power is switched off and the power cables are
connected.

ADVARSEL: Fr der arbejdes p udstyr eller nr strmindgangene, skal


det kontrolleres, at ledningerne er taget ud af begge strmtilfrsler. Rr
ikke ved strmtilfrslerne, mens ledningerne er tilsluttet. Der kan vre
spnding i strmtilfrslerne, nr der er slukket for strmmen, og
strmledningerne er tilsluttet.
WAARSCHUWING: Controleer of de stroomkabels zijn afgekoppeld
van beide gelijkstroomingangen, voordat u aan de apparatuur of in de
buurt van de stroomingangen gaat werken. Raak de
gelijkstroomingangen niet aan terwijl de stroomkabels worden
aangesloten. De stroomingangen kunnen onder spanning staan wanneer
de stroom wordt uitgeschakeld en de stroomkabels worden aangesloten.
VAROITUS: Ennen laitteella tai sen virtalhteiden lhell tyskentely

varmista, ett virtakaapelit on irrotettu molemmista tasavirran


syttnavoista. l koske tasavirran syttkohtiin kun virtakaapelit on
kytketty kiinni. Virransyttkohdissa saattaa olla viel jnnitett silloin,
kun virta on kytketty pois ja virtakaapelit ovat kiinni.

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Installing XDM-500: Before You Start


Safety Guidelines

ATTENTION: Avant de travailler sur l'quipements ou prs de ses

entres lectriques, assurez-vous que les cbles d'alimentation sont


dconnects des deux entres de courant continu. Ne touchez pas les
entres de courant continu lorsque les cbles d'alimentation sont
connects. Il risque d'y avoir encore du courant dans les entres
d'alimentation lorsque l'interrupteur est teint et que les cbles sont
connects.

WARNUNG: Entfernen Sie vor allen Arbeiten am Ausrstung oder nahe


der Stromanschlsse die Stromkabel aus beiden Gleichstromanschlssen.
Berhren Sie die Gleichstromeingnge nicht, wenn die Stromkabel
angeschlossen sind. An den Stromeingngen knnen Spannungen
anliegen, wenn die Stromzufuhr unterbrochen ist und die Stromkabel
angeschlossen sind.
AVVERTENZA: Prima di eseguire interventi sul apparecchiature o di

avvicinarsi agli ingressi della corrente, assicurarsi che i cavi


dell'alimentazione siano stati scollegati da entrambi i terminali
dell'alimentazione CC. Non avvicinarsi agli ingressi dell'alimentazione
CC mentre i cavi dell'alimentazione sono collegati. possibile che la
tensione sia presente negli ingressi quando l'alimentazione scollegata
ma i cavi sono collegati.

AVISO: Antes de iniciar o trabalho com o equipamento que estiver


ligado corrente elctrica, retire qualquer tipo de artigos de joalharia
(tais como anis, colares e relgios). Quando esto ligados corrente e
terra, os objectos em metal podem aquecer e provocar graves
queimaduras ou at mesmo ficar soldados aos terminais de corrente.
ADVERTENCIA: Antes de trabajar en el equipo o cerca de las entradas

de alimentacin, compruebe que los cables de alimentacin estn


desconectados de los dos terminales de entrada de CC. No toque las
entradas de CC mientras que los cables de alimentacin estn
conectados. Es posible que haya corriente en las entradas de alimentacin
cuando el equipo est apagado y los cables de alimentacin estn
conectados.

VARNING: Innan du arbetar med utrustning eller i nrheten av

strmingngarna ska du kontrollera att ntsladdarna har kopplats ur frn


bda ingngsterminalerna fr likstrm. Rr inte ingngsterminalerna fr
likstrm nr ntsladdarna r inkopplade. Det kan finnas strm kvar i
strmingngarna nr strmmen r av och ntsladdarna r inkopplade.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

Electricity Safety Warning


WARNING: Do not touch uninsulated wiring or ports when they have
not been disconnected from a power source; doing so may result in
electrical shock.

ADVARSEL: Rr ikke ved uisolerede ledninger eller porte, nr de ikke


er koblet fra strmkilden, da det kan medfre elektrisk std.
WAARSCHUWING: Raak geen ongesoleerde bedrading of poorten aan
wanneer deze niet zijn afgekoppeld van de voeding, aangezien dit een
elektrische schok kan veroorzaken.

VAROITUS: l koske eristmttmiin johtoihin tai napoihin, jos ne


ovat kytkksiss virtalhteeseen, sill tst voi seurata shkisku.
ATTENTION: Ne touchez pas les cbles ou ports non isols lorsqu'ils ne
sont pas dconnects du secteur, car vous risquez de vous lectrocuter.

WARNUNG: Berhren Sie keine unisolierten Kabel oder Anschlsse,

wenn sie noch an eine Stromquelle angeschlossen sind, da dies zu einem


Stromschlag fhren knnte.

AVVERTENZA: Evitare di toccare i cavi o le porte non isolate quando


sono ancora collegati alla presa di alimentazione, poich si potrebbero
verificare scosse elettriche.

AVISO: No tocar na cablagem aparente ou nas portas de entrada de

corrente que no tiverem sido desligadas da fonte de energia, pois desse


facto podem resultar choques elctricos.

ADVERTENCIA: No toque los puertos ni los cables que no estn

aislados si no estn desconectados de la fuente de alimentacin ya que


podra provocar una descarga elctrica.

VARNING: Rr inte sladdar eller portar som inte r isolerade om de inte


har kopplats ur frn strmkllan. Det kan leda till elektriska sttar.

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Installing XDM-500: Before You Start


Safety Guidelines

TUV Statutory Warnings and


Requirements
This section outlines the TUV statutory warnings and requirements
applicable to XDM platforms.

MET/TUV Listing Identification


XDM platforms are MET/TUV-listed. Typical MET/TUV labels for XDM
platforms are shown in the following figure.

Figure 1-3: XDM shelves warning labels

Warning Label
The following warning label is affixed alongside the XDM power input
connectors and the RAP circuit breakers.

Figure 1-4: Power input warning label

CAUTION: XDM equipment has two power sources.


Disconnect both before servicing.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

Overcurrent Protection Requirements


NOTE: Rating and type of overcurrent protection are

according to Classification Level 5 (L5) for power supplies


having output circuits that meet the requirements for SELV
circuits.

WARNING: Observe the following precautions when


replacing circuit breakers:

Replace only with a circuit breaker of the same type and


rating.
Disconnect power before changing a circuit breaker.

ATTENTION: Pour ne pas compromettre la protection


contre les risques dincendie, remplacer par un fusible de
mme type et de mmes caractristiques nominales.

Equipment Grounding Requirements


CAUTION: The equipment must have a connection between
the grounded conductor of the DC power supply circuit and
the equipment grounding conductor.

Connect the equipment directly to the DC supply system grounding electrode


conductor or to a bonding jumper from a grounding terminal bar or bus to
which the DC supply system grounding electrode is connected.
Locate the equipment in the same immediate area (for example, in adjacent
racks) as any other equipment that has a connection between the grounding
conductor of the same DC supply circuit and the grounding conductor, and as
the grounding point of the DC system. The DC system must not be grounded
elsewhere.
Position the DC supply source in the same premises as this equipment.
There must be no switching or disconnecting devices in the grounded circuit
conductor between the DC source and the point of connection of the grounding
electrode conductor.

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Installing XDM-500: Before You Start


Safety Guidelines

Grounded Conductors Requirements


Connect the equipment directly to the DC supply system grounding electrode
conductor or to a bonding jumper from a grounding terminal bar or bus to
which the DC supply system grounding electrode conductor is connected.
Locate the DC supply source within the same premises as the equipment. There
must be no switching or disconnecting devices in the grounded circuit
conductor between the DC source and the point of connection of the grounding
electrode conductor.

ITU-T/Telcordia Statutory
Warnings and Requirements
This section outlines the ITU-T and Telcordia statutory warnings and
requirements applicable to XDM platforms. The source for these requirements
can be found in IEC 60950-1/3.2.1.2.

Ethernet Port Precautions


WARNINGS:

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Ethernet ports must be cabled with shielded cables and the


shield grounded at both ends.
Intra-building ports of the equipment or subassembly are
suitable for connection to intra-building or unexposed
wiring or cabling only. Intra-building ports of the
equipment or subassembly MUST NOT be connected
metallically to interfaces that connect to the OSP or its
wiring. These interfaces are designed for use as
intra-building interfaces only (Type 2 or Type 4 ports as
described in GR-1089-CORE, Issue 4) and require
isolation from the exposed OSP cabling. The addition of
Primary Protectors is not sufficient protection in order to
connect these interfaces metallically to OSP wiring.

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Installing XDM-500: Before You Start


Safety Guidelines

XDM-500 Installation and


Maintenance Manual

DC Supply Circuit Connection to the


Grounding Conductor
WARNING: There must be a connection between the grounded

conductor of the DC power supply circuit and the equipment grounding


conductor. See installation instructions for more details.
When this connection is made, all the following conditions must be met:

The equipment is connected directly to the DC supply system


grounding electrode conductor or to a bonding jumper from a
grounding terminal bar/bus to which the DC supply system grounding
electrode is connected.
The equipment is located in the same immediate area (such as
adjacent cabinets) as any other equipment that has a connection
between the grounded conductor of the same DC supply circuit and
the grounding conductor, as well as the point of grounding of the DC
system. The DC system must not be grounded elsewhere.
The DC supply source is located within the same premises as this
equipment.
There is no switching or disconnecting devices in the grounded
circuit conductor between the DC source and the point of connection
of the grounding electrode conductor.

WARNING: Cet appareil est conu pour permettre le raccordement du


conducteur reli la terre du circuit dalimentation c.c. au conducteur
de terre de lappareil.
Pour ce raccordement, toutes les conditions suivantes doivent tre
respectes:

1-20

Ce matriel doit tre raccord directement au conducteur de la prise


de terre du circuit dalimentation c.c. ou une tresse de mise la
masse relie une barre omnibus de terre laquelle est raccorde
llectrode de terre du circuit dalimentation c.c.
Les appareils dont les conducteurs de terre respectifs sont raccords
au conducteur de terre du mme circuit dalimentation c.c. doivent
tre installs proximit les uns des autres (p.ex., dans des armoires
adjacentes) et proximit de la prise de terre du circuit
dalimentation c.c. Le circuit dalimentation c.c. ne doit comporter
aucune autre prise de terre.
La source dalimentation du circuit c.c. doit tre situe dans la
mme pice que le matriel.
Il ne doit y avoir aucun dispositif de commutation ou de
sectionnement entre le point de raccordement au conducteur de la
source dalimentation c.c. et le point de raccordement la prise de
terre.

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Installing XDM-500: Before You Start


Safety Guidelines

Laser Safety Requirements


Laser Classification
ECI equipment and components equipped with laser devices described in this
manual comply with the International Electrotechnical Commission (IEC)
safety standards, including IEC 60825-1 and IEC 60825-2 (AS/NZS
2211.2) - Safety of Laser Products.
Except for certain high power EDFA and Raman optical amplifiers, XDM
equipment is classified as Class 1 laser products. The product and its
accessories do not emit hazardous light and the beam is totally enclosed during
normal operating modes of customer operation. As long as the equipment is
operated in accordance with the applicable safety instructions, the Hazard
Level in equipment access locations is inherently Class 1M or lower.
The high power EDFA and Raman optical amplifiers are also classified as
Class 1M (or lower) laser products. However, note that these units emit power
within Hazard Level 3B and Hazard Level 4. The hazard level might be higher
than the product class, depending on network implementation and fiber
accessibility.
ECI provides product and installation information so that the products may be
installed and serviced safely.

Laser Information
See the XDM System Specification for information regarding the laser
transmitters of the various optical cards.

Warning Labels for Laser Products


The following labels are affixed near the
optical connectors of optical cards and
modules to indicate that the product is
classified as a Class 1 laser product.

The following labels are affixed near the


optical connectors of optical cards and
modules with a laser to indicate that the
product is classified as a Class 1M laser
product.

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Laser Safety Statutory Warning


All personnel involved in equipment installation, operation, and maintenance
must be aware that laser radiation is invisible. Therefore, although protective
devices generally prevent direct exposure to the beam, personnel must strictly
observe the applicable safety precautions and, in particular, must avoid staring
into optical connectors, either directly or using optical instruments.
Remember that observing safety precautions is not a matter of personal choice;
ignoring safety puts all the people within line of sight in danger!

Training for Laser Safety


Personnel must be trained for safety before being authorized to operate, install,
and/or maintain laser products. The IEC 60825 (AS/NZS 2211.2) standards
require organizations to appoint a laser safety officer who is responsible for
training personnel, establishing safe operational procedures, and supervising
the implementation of these procedures during routine work.
Untrained personnel must not be allowed to operate, install, and/or maintain
laser products.

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Laser Device Operating Precautions


In addition to the general precautions described in this section, be sure to
observe the following warnings when operating a product equipped with a laser
device. Failure to observe these warnings could result in bodily injury and
damage to equipment.
WARNING: To reduce the risk of exposure to hazardous radiation:

Protection goggles with nominal OD2 for the wavelength range of


1300 nm to 1600 nm are recommended. Protection goggles are
mandatory for tasks performed on equipment with up to 30 dBm
optical power lasers.
Hot insertion or swapping of a DWDM module or optical interface
module must be carried out only by authorized personnel.
During hot removal and insertion of a fiber termination, avoid
looking into the fiber to prevent irremediable damage to your eyes.
Place plastic covers on module fiber ports and fiber terminations not
currently in use.
Do not operate controls, make adjustments, or perform procedures
associated with the laser device other than those specified herein.
Only ECI authorized service technicians must repair the unit.
To avoid potential fiber fusing, burnt connectors, or loss of laser
power, ensure all high power connections are clean before you
power on the optical amplifier.

It is strictly forbidden to override any protective devices and interlocks


used to prevent direct exposure to the laser beam.

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WARNING: Invisible laser radiation may be emitted from the aperture


of optical ports when no fiber cable is connected. Avoid exposure and
do not stare into open apertures.

ADVARSEL: Der kan forekomme usynlige laserstrler fra de optiske


portes bninger, nr der ikke er tilsluttet et lyslederkabel. Undg at
blive udsat for disse strler, og kig ikke ind i bninger.
WAARSCHUWING: Er kan onzichtbare laserstraling uit de opening
van de optische poorten komen wanneer er geen fiberkabel is
aangesloten. Vermijd blootstelling aan straling en kijk niet in de
openingen.
VAROITUS: Optisten porttien aukoista saattaa steill nkymtnt
lasersteily silloin, kun niiss ei ole kuitukaapeleita kiinni. Vlt
altistumista ja l tuijota nihin avoimiin aukkoihin.
ATTENTION: Un rayonnement laser invisible peut tre mis partir
de l'ouverture des ports optiques lorsque aucun cble fibres optiques
n'est connect. vitez de vous y exposer et ne fixez pas les ouvertures.
WARNUNG: Wenn kein Faserkabel angeschlossen ist, knnen aus der
ffnung der optischen Anschlsse Laserstrahlen austreten. Vermeiden
Sie Bestrahlungen und schauen Sie nicht in diese ffnungen.
AVVERTENZA: Le aperture delle porte ottiche possono emettere
radiazioni laser invisibili quando i cavi in fibra non sono collegati.
Evitare lunghe esposizioni davanti alle aperture.
AVISO: Podem ser emitidas radiaes invisveis de laser a partir das

aberturas das portas pticas se no estiver ligado qualquer cabo de fibra


ptica. Evitar a exposio e no olhar directamente pelas aberturas
aparentes.

ADVERTENCIA: Es posible que la radiacin lser invisible se emita

desde la apertura de puertos pticos cuando no haya ningn cable de


fibra conectado. Evite la exposicin y no mire fijamente a las aberturas.

VARNING: Osynlig laserstrlning kan spridas frn ppningen p

optiska portar om ingen fiberoptikkabel r ansluten. Undvik exponering


och stirra inte in i ppningarna.

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Safety Guidelines

Additional Safety Precautions for High


Power Raman and EDFA Amplifiers
High Power Raman and EDFA amplifiers might generate up to 30 dBm of
optical power. This is considered within Hazard Level 3B (up to 27 dBm) or
Level 4 (beyond 27 dBm).
Since all the optical power generated by the optical amplifier is confined within
the fiber in normal operation, the amplifier is defined as a Class 1 (or
Class 1M) laser product. However, its Hazard Level is potentially 3B or 4.
Since a laser beam at this hazard level might cause irreparable eye and skin
damage, special attention is required when performing any task (whether
operation, installation, or maintenance) on these amplifiers, or in any part of a
system that carries signals from these amplifiers. Moreover, personnel must be
specifically trained for laser safety before being allowed to perform tasks on or
around these optical amplifiers.
This section provides additional safety instructions that will help you prevent
dangerous situations and possible injury to yourself and to your colleagues.
Always use protective goggles with minimum OD2 when working on OFA
cards or on parts of the system that carry their signals (such as fibers and
ODFs). Inspect the goggles for integrity (scratches, broken lenses, and any
other type of damage). Replace the goggles if in doubt.
Work on OFA cards must be carried out only in a restricted access area.
Only people trained in laser safety may be allowed to enter such an area.
The optical path carrying these amplifier signals must be fully installed
before starting to connect fibers to the OFA. All fibers carrying such
signals must be inspected to ensure that they are in good condition. Replace
any fiber section if in doubt as to its condition.
Alongside all the connectors of the fibers that carry OFA signals, affix
labels with the following warning:
HAZARD LEVEL 3B (or Level 4 if applicable)
DO NOT DISCONNECT UNDER OPERATION
Under all circumstances (installation, operation, measurements, and
maintenance activities), it is forbidden to apply power to these amplifiers
unless fibers are connected or protective caps are installed on its
connectors. Observe the following precautions:

Complete all optical connections between these amplifiers and an ODF,


another card, test jig, or test equipment, and so on, before applying
power.

If the connections to the amplifiers have not yet been made, for
example, during platform installation activities, always install
protective caps on the amplifier optical connectors.

When the time comes to connect fibers to the amplifiers, first make sure
the platform is not powered and cannot be powered while you work on
it.

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When it is necessary to disconnect a fiber or replace a component along the


path of the amplifier signals while the amplifier is powered, first disconnect
the fiber from the LINE connector, and only then disconnect the far end of
the fiber.
NOTE: A fiber might include optical power from both EDFA
and Raman amplifiers.

Whenever the APR mechanism is temporarily disabled, for example during


maintenance, place a warning label that notifies other persons and serves as
a reminder to reactivate APR after the maintenance activity has ended.

To avoid potential fiber fusing, burnt connectors, or loss of laser power,


ensure that all high power connections are clean before you power up the
optical amplifier.

Protection Against Electrostatic


Discharge
This section provides guidelines for protecting XDM equipment and its
components against damage from electrostatic discharge (ESD) during
handling, packaging/unpackaging, transportation, installation, commissioning,
inspection, servicing, and maintenance activities.
Items sensitive to ESD are identified by the basic ESD warning symbol shown
in the following figure.

Figure 1-5: Basic ESD warning symbol

The information in this section presents generally accepted workmanship


practices and procedures that, when properly applied, minimize the probability
of electrostatic damage to XDM equipment and its components.
The information is also in line with CENELEC Electronic Components
Committee (CECC) specification CECC 00 015 that deals with protection of
devices sensitive to electrostatic discharge (ESDS devices).

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General
Most types of electronic equipment, assemblies, and components can be
damaged by ESDs. An ESD between two objects occurs when an object
carrying static electrical charges touches, or is brought near the other object.
Static electrical charges appear as a result of friction between surfaces of
insulating materials or separation of two such surfaces, and may also be
induced by electrical fields. Routine activities, such as walking across an
insulating floor, friction between garment parts, friction between objects, and
so on, can easily build up charges to levels that may cause damage, especially
when humidity is low.
In many cases, the buildup of charges can be avoided by using special
materials, for example, garments and packaging made of antistatic materials or
materials that have high resistivity but are not insulators.
The best approach to avoiding damage by ESD includes a combination of
means and procedures that:

Avoids build-up of electrostatic charges

Creates a protected work environment preventing ESD

Provides means for controlled discharge of any accumulated electrostatic


charges when entering the protected work environment
NOTE: An area in which ESDS devices can be handled with
minimum risk of damage and in which the operator is not
exposed to additional risks, is called an ESD Protected Area
(EPA).

Personnel Training
During production and assembly, equipment is handled in work spaces
especially prepared and certified to serve as a permanent EPA. However, in
many cases, the environment in which the same equipment is installed or
maintained cannot be assumed to form an EPA with a permanently controlled
boundary.
Therefore, all the work requiring the handling of unprotected ESDS devices
must be considered as field work.
Field work in this context includes activities such as service and maintenance,
installation, site inspection, and commissioning of components and assemblies
classified as ESDS, together with the packing and unpacking activities
associated with such activities.
All the staff involved in field work must be trained to perform field work in the
same way as work performed in permanent EPAs with respect to the material
quality and personal responsibilities, training, labeling, and packaging.

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Use of Temporary EPA


Where necessary, a temporary EPA must be used. A typical temporary EPA
arrangement suitable for field work on XDM Equipment is shown in the
following figure.
The EPA tool kit includes:

Wrist strap with 1 M series resistor

Bonding strap with 1 M series resistor

ESD carpet (work surface), m2 minimum

The temporary EPA must include temporary controlled work surfaces and/or
flooring capable of providing protection against ESD.
CAUTION: The temporary EPA must be constructed in a

way that ensures electrical bonding among all the materials


used, and prevents any sudden changes in potential within the
EPA that could cause unacceptable voltages or discharges to
be applied to the ESDS.

A means of equipotentially bonding the operator and any work surface and
flooring to ground must be used. For this purpose, the work surface and wrist
straps must be bonded, either to a designated ground bonding point or to the
Equipment being serviced, as shown in the following figure.
Whenever available, the main ground serves as the ESD grounding facility.
WARNING: While the operator is within the temporary EPA,
the minimum value of resistance used for bonding to ground
must limit the current to ground produced by voltages
accessible to the operator to limits specified as safe by the
applicable regulations (see, for example, CECC 00 015).

The same approach is applicable to the surface resistivity and


resistance to ground of materials used for temporary work
surfaces and flooring.

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To enable ESD bonding to ground of Equipment racks and any other


nonmovable Equipment including ESDS, an ESD ground bonding facility must
be located near such Equipment, or the Equipment must be fitted with a
designated ground bonding point presenting a resistance to ground not greater
than 1 M.

Figure 1-6: Typical temporary EPA arrangement

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Work Arrangements within a Temporary


EPA
To ensure that effective ESD protection is indeed achieved, the following
arrangements must be observed by persons entering and/or performing field
work within a temporary EPA:

1-30

All operators working within a temporary EPA must wear, as a minimum,


an antistatic protecting garment made of cotton.

If the extent of the temporary work area is such that the operator needs to
walk and move within that area, the floor must be capable of providing
protection against ESD.

The operator must be bonded to ground at all times when handling an


ESDS device.

If it becomes necessary to remove an ESDS device from equipment and


transfer it to a temporary work surface away from the equipment, the ESDS
device must be given protective packaging unless equipotential bonding of
the operator to ground is maintained.

An ESDS device must be placed directly into protective packaging upon


removal from equipment. A replacement ESDS device must be kept in its
protective packaging until required for immediate installation in the
equipment.

The field service operator must ensure that the materials and tools
necessary to maintain and control the temporary EPA are available at the
place of the field work at service time.

All tools intended for use within the EPA must, as far as is practical, be so
constructed that they do not generate or hold an induced electrostatic
charge.

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Safety Guidelines

Environmental and Health


Concerns
ECI is committed to achieving high standards of environmental quality and
product safety.
The International Standardization Organization (ISO) has developed the
internationally recognized standards ISO 9001 and ISO 14001. These are
quality management standards that are administered by independent
accreditation and certification bodies.
ISO 9000 is a family of standards for quality management systems that has
been accepted as a model when assessing the adequacy of quality management
systems. Some of the requirements in ISO 9001 (one of the standards in the
ISO 9000 family) include:

Procedures that cover all key business processes

Process monitoring to ensure effectiveness

Adequate record-keeping

Monitoring output for defects, with appropriate and corrective action where
necessary

Regular review of individual processes and the complete quality system as


a whole

Facilitating continual improvement

ISO 14000 is the international specification for an Environmental Management


System (EMS). It specifies requirements for establishing an environmental
policy, determining environmental aspects and impacts of products, activities,
and services, planning environmental objectives and measurable targets,
implementation and operation of programs to meet objectives and targets,
checking and corrective action, and management review. ECI Quality and
Environmental Management Systems were certified to these ISO standards and
are periodically audited by third-party organizations.
ECI policies and products meet the spirit of the U.S. Environmental Protection
Agency's Design for the Environment (DfE) Program to reduce risk to people
and the environment by preventing pollution and improving energy efficiency.
ECI is certified to OHSAS 18000, which was developed as a standard against
which occupational safety management systems can objectively be assessed.
OHSAS 18000 (compatible with ISO 9001 and ISO 14001) is being developed
through a concerted effort from a number of the world's leading national
standards bodies, certification bodies, and specialist consultancies.

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As a part of ECIs environmental commitment and in pursuit of compliance


with applicable environmental legislation, ECI makes every effort to ensure
that its products supplied to the EU market are compliant with the RoHS
Europe directive restricting use of certain hazardous substances in electrical
and electronic equipment. ECI also requires RoHS compliance from all its
suppliers. All new electrical and electronic equipment delivered to locations
within the EU do not contain any cadmium (Cd), lead (Pb), hexavalent
chromium compounds (Cr6+), mercury (Hg), polybrominated biphenyls (PBB),
or polybrominated diphenyl ethers (PBDE), subject to certain exemptions and
limitations as outlined in the RoHS directive.
Without limiting the generality of the preceding statement, we wish to stress
that use of lead in solders in network infrastructure equipment has been
exempted by the RoHS directive and may be found in certain ECI products.
All equipment delivered to locations within the EU complies with the
requirements of the RoHS Europe directive. Similarly, ECI equipment is
compliant with the RoHS California directive and RoHS Chinese directive
where relevant. All ECI equipment included in the Electronic Information
Products (EIP) category includes a table of Toxic and Hazardous Substances
and Elements, verifying hazardous substance levels in accordance with the
RoHS China directive. Equipment documentation includes the appropriate
Environmental Protection Use Period (EPUP) lifespan symbol indicating the
point in time when the equipment may be expected to enter the recycling
system. The following are examples of these pollution control symbols.

Figure 1-7: Pollution control logos

NOTE: The number in Logo 2 is for illustrative purposes

only. When in actual use, the number indicates the


corresponding environmental protection use period of the
product.

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ECI adheres to the Waste Electrical and Electronic equipment (WEEE)


directive requiring that all new products introduced into the EU market be
labeled with the crossed-out wheeled bin recycling symbol defined by
CENELEC standard EN 50419 and accepted by the member states. Note that
specific WEEE procedures may differ from state to state, depending on the
local implementation of the WEEE requirements.

Figure 1-8: WEEE recycling symbol

Do not dispose of ECI equipment and accessories together with standard


household waste. Check with ECI technical support for information about
product disposal, including recycling and reuse. For more information about
ECI's environmental, healths, and safety policy, see the quality policy pages on
the ECI website. (Environmental, Health, and Safety Policy
http://www.ecitele.com/AboutECI/Quality/Pages/EnvironmentalHealthSafetyP
olicy.aspx)
For any further information regarding ECI's environmental and safety policies,
please contact technical support.
WARNING: The ultimate disposal of this product should be handled
according to national laws and regulations.

ADVARSEL: Endelig bortskaffelse af dette produkt skal ske i


overensstemmelse med nationale love og regler.
WAARSCHUWING: Dit product dient overeenkomstig de nationale
wetgeving en voorschriften te worden weggegooid.
VAROITUS: Tmn tuotteen lopullinen hvittminen tulee tehd
kansallisten lakien ja asetusten mukaisesti.

ATTENTION: La mise au rebut de ce produit devrait se faire


conformment aux lois et rglementations de chaque pays.

WARNUNG: Entsorgen Sie dieses Produkt entsprechend den geltenden


Gesetzen und Vorschriften.

AVVERTENZA: L'utilizzo di questo prodotto deve essere conforme


alle leggi e alle normative nazionali.
AVISO: A destruio final deste produto deve ser feita de acordo com
as leis e regulamentos nacionais.
ADVERTENCIA: Este producto debe utilizarse de acuerdo a las
normas y leyes nacionales.

VARNING: Slutlig kassering av denna produkt br hanteras enligt


nationella lagar och riktlinjer.

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2
Introduction to the XDM
Platform
In this chapter:
Overview ......................................................................................................... 2-1
XDM Product Lines......................................................................................... 2-2
Features and Functions .................................................................................... 2-3
Implementation Principles ............................................................................... 2-4
Cards and Modules .......................................................................................... 2-5
XDM-500 ........................................................................................................ 2-7

Overview
ECI's XDM is a family of next-generation converged optical networking
platforms that integrate all the transport functions of a complete Point of
Presence (POP) in a single shelf-size element. The XDM easily accommodates
the growing demand for bandwidth mainly driven by emerging data
applications, while maintaining the compatibility and the enhanced flexibility
needed to transport all types of traffic, including voice, ATM, Ethernet, IP, and
data.
Advances in access equipment bring increased bandwidth to the service-centric
customer, and regional networks are fleshing out capacity with Wavelength
Division Multiplexing (WDM). Connectivity has therefore become the
bottleneck in service provisioning.

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The new XDM concept combines the wealth of bandwidth offered by WDM;
the manageability, fast protection, and restoration times of Time Division
Multiplexing (TDM); the enhanced connectivity and availability of cross
connects (DXC); and the efficient transport of Ethernet, IP, and ATM traffic.
Moreover, it provides an ideal platform for migration from ring to mesh
networks. These capabilities result in a single powerful, flexible, and highly
intelligent platform, with unparalleled basic functionality.
XDM platforms are equipped with high capacity nonblocking matrixes that
enable operators to build extremely flexible and transparent optical networks.

XDM Product Lines


The XDM product lines provide a comprehensive selection of platforms that
address all your networking needs, for all ranges of size, configuration, and
service level requirements. XDM platforms are organized into two groups:

XDM-100 product line, All-Native multiservice packet optical transport


system for metro aggregation and metro networks:

XDM-300: Compact high-capacity All-Native Packet-OTS for metro


aggregation
XDM-900: Compact high-capacity All-Native Packet-OTS for the
metro

XDM-1000 product line, All-Native multiservice packet optical transport


system for metro and metro-core networks:

XDM-40: WDM OTN for metro-access and inline amplifiers

XDM-450: ROADM extension shelf

XDM-500: Compact All-Native Packet-OTS for the metro

2-2

XDM-100: Compact All-Native Packet-OTS for metro aggregation

XDM-1000: All-Native all-range Packet-OTS for metro and


regional/long-haul networks
XDM-2000: Compact high-capacity All-Native Packet-OTS for the
metro
XDM-3000: High-capacity All-Native Packet-OTS for the metro and
metro-core

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Features and Functions


XDM shelves support a multitude of features for today's bandwidth-hungry
networks, including:

Transparent support of transmission channels for SDH, PDH, ATM, Fast


Ethernet, Gigabit Ethernet (GbE), MPLS, IP, SAN (FC, FICON, ESCON),
digital video, and more.

Supporting any service; VPWS, VPLS, IPTV MPLS multicast, 3G mobile


backhaul, bandwidth services, and Ethernet leased lines.

Transport of Ethernet traffic and support of Ethernet services over SDH.

Wavelength services for all bandwidth demands

Add and drop of any signal (SDH, PDH, data, wavelength) at any node
using a single shelf.

10 Gbps Add/Drop Multiplexer (ADM) service on a double card for GbE,


1GFC, 2GFC, OTU1, and STM-16 services. ADM on a Card (AoC)
benefits include the ability to route client signals to different locations
along the optical ring, as well as per-service selectable protection and
drop-and-continue features. The AoC can also be used as a multi-rate
combiner up to OTU2. The AoC combines the cost efficiency of an optical
platform with the granularity and flexibility previously available only in
SDH networks.

Up to 240 Gbps capacity with 10 Gbps per slot.

ATM capabilities for 3G access networks.

High Order (HO) and Low Order (LO) transmission paths available for
both high-order and low-order subnetworks, with a high-capacity matrix
that maintains LO connectivity.

Comprehensive MPLS Carrier Ethernet capabilities, including use of


MPLS technology to carry Ethernet services across the network metro and
core.

HO transmission paths for IP networks (for example, LAN-to-LAN


connectivity at the GbE-to-GbE level).

HO transmission paths for ATM networks.

GbE Layer 2 encryption for Ethernet traffic.

Multireach, for metro, regional, and national applications spanning up to


2000 km without electrical regeneration.

Flexible wavelength transport, with multidegree Reconfigurable Optical


Add/Drop Multiplexer (ROADM) capabilities that enable operators to
build a flexible and forecast-tolerant backbone.

Supporting cost-effective access CWDM applications and core networks of


up to 40/80 channels.

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Transport of Ethernet traffic over WDM.

Subrate traffic aggregation over optical cards.

Channel by channel, non-traffic-affecting upgrade, starting from a single


channel.

Full compliance with applicable ITU-T and Telcordia standards for optical
equipment and safety standards.

ASON architecture and GMPLS protocols that enable efficient planning


and intelligent optical network operation to greatly reduce CAPEX and
OPEX.

Extremely powerful management that renders the system easy to control,


monitor, and maintain.

Implementation Principles
The XDM platforms have a fully modular design based on a redundant routing
core implemented as a proprietary cross-connect matrix surrounded by I/O
ports located on plug-in I/O cards. The function of the I/O cards is to provide
interfaces to the various types of signals that can be transported by the
platforms. Internally, all the I/O cards exchange information with the routing
core using a proprietary format that does not depend on the characteristics of
the external interfaces.
The use of a single proprietary format for all the information flowing through
the XDM results in a highly flexible system that supports a wide range of
applications and can easily be expanded to suit virtually any customer need.
Moreover, support for new signal formats can be added simply by developing
new I/O cards. This protects customer investment in the XDM platform against
obsolescence, and ensures cost-effective upgrade paths.
The XDM platforms consist of the following main subsystems:

2-4

Traffic processing

Control and communication

Timing and synchronization

Routing core

Power feed

Cooling

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All the subsystems are modular and implemented as plug-in cards. Except for
the traffic interfaces, all the subsystems are fully redundant and/or are
implemented as distributed functions with no single point of failure, thereby
ensuring the high availability needed to meet the stringent requirements of
telecom operators.
Moreover, XDM platforms are designed to permit live insertion and hot
swapping of cards and modules, and their software can be downloaded from a
remote location. In addition to maintenance efficiency, these characteristics
enable non-traffic-affecting in-service upgrading and expansion of system
capabilities.

Cards and Modules


XDM shelves achieve unparalleled functionality and cost-effectiveness with an
assortment of cards and modules carefully designed for virtually every
application:

PDH I/O (PIO) cards: 2 Mbps, 34 Mbps, 45 Mbps.

SDH I/O (SIO) cards: STM-1e, STM-1o, STM-4, STM-16, STM-64.

MPLS and Ethernet cards: Data I/O (DIO and DIOB) cards for Layer 1
Ethernet (GbE/FE) services; Ethernet Interface Switch (EIS) cards for
Layer 2 Ethernet services; and MPLS Carrier-Class Switch (MCS) cards
for full MPLS as well as Carrier Ethernet services.

ATM Traffic Switch (ATS) cards for direct processing of ATM traffic,
addressing the requirements of 3G cellular networks. The ATS is a singleslot card that concentrates Node B traffic into VC-4s or large Inverse
Multiplexing over ATM (IMA) groups.

Optical (TRP and CMBR) cards: 10 GbE LAN, GbE, STM-256, STM-64,
STM-16, OTU1, OTU2, OTU3, 1G, 2G, 10G Fiber Channel, any rate.

Optical (OFA and ROADM) cards: metro and regional/long-haul amplifiers


as well as Raman amplifiers, multidegree WSS and PLC ROADMs,
Mux/DeMuxes, and OADMs.

Optical accessories: a wide range of accessories (including splitters,


couplers, splitter and coupler combination modules, variable optical
attenuators, auxiliary cards, and filters) available either as compact
standalone components or in a physical form that matches the physical
form of other XDM components.

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Aurora-G cards provide Layer 2 encryption for Ethernet traffic at a GbE


rate through a single encryption port, thereby replacing expensive
standalone encryption units.

ASON Control Plane cards implement ASON architecture and GMPLS


protocols that help carriers reduce CAPEX and OPEX by enabling efficient
optical network planning and operation, with automatic discovery and
distributed dynamic routing capabilities that enable rapid cost-effective
addition of new nodes and additional bandwidth.

For an introduction to XDM card and module functionality, see System


Architecture.
NOTE: The information in this book includes cards,

components, and modules that are at an EOL stage and no


longer marketed commercially. However, due to their high
quality, durability, reliability, and utility, some of these
components are still in use.
ECI continues to provide technical support when necessary.
As a result, we are leaving technical information about these
components in the reference documentation for the
convenience of users still working with these components.

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Introduction to the XDM Platform

XDM-500
The XDM-500 is a compact multiservice Packet-OTS with integrated all-range
WSS ROADM, for high capacity aggregation of TDM and Ethernet/MPLS
services over optical infrastructure in metro and regional networks. The
XDM-500 is optimized for the metro-edge, where it collects multiple services
and delivers them to the COs and POPs in the core. The XDM-500 provides
traditional broadband services as well as sophisticated optical capabilities such
as multidegree ROADM technology and highly advanced data services such as
adaptive rate GbE, sophisticated Layer 2 Ethernet, and Packet over SDH (PoS).
It can be used either as a simple ADM or as a multi-ADM/TM for distributed
ring cross connectivity.

Figure 2-1: XDM-500 platform

The XDM-500 compact shelf is located in a 285 mm deep, 450 mm wide, and
725 mm high equipment cage. Platform components are arranged as follows:

Six slots (IC1 to IC6) flexibly allocated to I/O cards and/or transponders
(depending on the configuration)

Four slots (MC1 to MC4) allocated to electric interface connection modules


or DWDM/OADM modules

Two slots (X1 and X2) allocated to the HLXC or XIO matrix cards

Two slots (C1 and C2) allocated to the xMCP cards

One slot (C3) allocated to the MECP card, for connecting the OHA and
OW interfaces to the active xMCP card

Two xINFs designed for power supply redundancy

Three xFCUs to support cooling system redundancy

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The XDM-500 standard card layout is illustrated in the following figure.

Figure 2-2: XDM-500 slot allocation

Typical power consumption for the XDM-500 is 720 W.

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XDM-500 Installation
Overview
In this chapter:
Overview ......................................................................................................... 3-1
Preliminary Preparations ................................................................................. 3-2
Stages of a Typical Installation ....................................................................... 3-3
Outline of Installation Procedure ..................................................................... 3-5

Overview
The following sections provide general instructions for the installation of the
XDM-500 and auxiliary equipment.
The procedures for equipment replacement and upgrades are similar to those
described for installation of the equipment. When relevant, notes regarding live
replacement or upgrade are inserted in the installation procedure descriptions.
This manual contains important information that will help you carry out a safe
and trouble-free installation, including:

Safety guidelines

Protection against electrostatic discharge

Environmental, physical, and power requirements

Specific tools and test equipment for XDM equipment installation

Information regarding cable preparation

Outline of the main steps needed to install XDM equipment

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XDM-500 Installation Overview

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The information appearing in these sections should be used in conjunction with


specific site installation plans in the particular customer network. If you are
interested in obtaining design or installation assistance from the ECI Customer
Support team, or wish to prepare a network installation plan, contact your ECI
sales representative.
The XDM-500 platform, cards, modules, and ancillary equipment are described
in the XDM-1000 Product Line Reference Manual.

Preliminary Preparations
The installation procedures provided here assume that:

All technical personnel have read, understood, and are complying with the
safety guidelines in Before You Start/Safety Guidelines (page 1-1).

The sites in which the installation procedures are carried out comply with
the requirements listed in Site Preparation and Rack Installation (page 4-1).

The required preparations have been completed, including:

Selection of specific locations for each rack

Availability of grounding and power sources at the selected locations

Preparation and routing of cables under customer responsibility

Routing of traffic cables to the rack locations

Before you start, determine what equipment is to be installed in the rack by


referring to the site installation plan, and note the exact position of each unit.
To avoid errors, it is recommended that you mark the prescribed positions on
the rack rails using a soft pencil.

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Stages of a Typical Installation


The installation of XDM equipment at a typical network site comprises the
following general stages, listed in the required order of execution:
1. Unpacking and visual inspection (page 4-9)
2. Installing equipment racks (page 4-37)
3. Installing ancillary units in racks (page 4-44), including xRAP component
and heat buffers
4. XDM-500 platform installation (page 5-1)
5. Card and module installation (page 6-1) in XDM-500 platforms
Each component of the XDM-500 system is supplied separately and must be
installed in the correct sequence, according to the site plan.
The equipment illustrated in the following figure (using the the XDM-1000)
are components that might be used in a typical high-density installation. The
installation steps are described following the figure.
TIP:

If you are not installing an FST for a particular XDM-500


platform, it is recommended that you leave empty space in
the rack in case optical modules are added to the platform
in the future.

CAUTION:

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If additional equipment is used in the rack, a heat buffer or


a buffer plate must be installed between any such
additional equipment and the XDM-500 platform to
minimize the transfer of heat from platform to platform.
This heat buffer must be purchased from ECI.
During the installation of equipment in the rack, make
sure all the optical connectors are closed by protective
caps. Do not remove the cap until an optical fiber is
connected to the corresponding connector.

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Additional rack installation options are illustrated in Installing Equipment


Racks (page 4-37).

Figure 3-1: A typical XDM-1000 product line installation components

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Outline of Installation Procedure


The main steps to install XDM equipment at a typical network site are:
1. Prepare the installation site and check the physical location, environmental
compliance, and availability of power sources (see "Site Preparation" page
4-1).
2. Prepare and route power, alarm, management and transmission cables at the
installation site (see "Cable and Fiber Preparation" page 4-23).
3. Install the equipment racks in accordance with the site installation plans
(see "Installing Equipment Racks" page 4-37).
4. In each rack, install the power distribution and alarm panels (xRAP) and
other equipment needed, in accordance with the site installation plans (see
"Installing Ancillary Units in Racks" page 4-44).
5. Install the XDM platforms in the appropriate racks in accordance with the
site installation plans (see "XDM-500 Platform Installation" page 5-1).
6. Install the air filter units in the XDM shelves (see "Installing Air Filters"
page 5-6).
7. Install the cards and modules in each XDM platform, in accordance with
the rack installation plans (see "Card and Module Installation" page 6-1).
Card installation may include any of the following cards and modules,
depending on the site installation plan:

Installing common cards, including xMCP, MECP, XIO, and/or HLXC


cards (see "Card and Module Installation" page 6-1).

Installing Aurora-G Cards (page 6-79).

Installing I/O Cards and Modules (page 6-90).

Installing a Card in the CCP Cage (page 6-92).

8. Route the optical fibers among the connectors of the equipment installed in
each rack, in accordance with the site installation plans (see "Optical Fiber
and Cable Installation and Routing" page 7-1).
9. Connect coaxial and multipair cables to the electrical interface modules of
each XDM shelf installed in the rack, in accordance with the rack
installation plans (see "Connecting Traffic Cables to Electrical Interfaces"
page 7-17).
10. Connect management cables between the equipment installed in the racks
and the management station, in accordance with the site installation plans
(see "Connecting Management Cables" page 7-22).

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11. Connect power and alarm monitoring cables from the rack power
distribution and alarm panels to each equipment unit installed in the rack, in
accordance with the rack installation plans.
12. Connect power, alarm, and traffic cables to the new equipment racks, in
accordance with the site operational procedures.
13. Mount the door or doors on the XDM platform, and close it (see also Deep
doors vs. standard doors (page 4-3)). Note that this step only applies to
closed-cabinet installations, and may not be relevant at your site.
14. Perform power-on and initialization procedures.
15. Complete any relevant commissioning tests (page 8-1).
16. Install the LCT-XDM and element management station (EMS-XDM) and
configure the equipment. For more information, refer to the EMS-XDM
User Manual and the LCT-XDM User Manual.

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4
Site Preparation and Rack
Installation
In this chapter:
Overview ......................................................................................................... 4-1
Tools and Test Equipment ............................................................................... 4-8
Unpacking and Visual Inspection .................................................................... 4-9
XDM Rack Installation Options .................................................................... 4-10
Cable and Fiber Preparation .......................................................................... 4-23
Installing Equipment Racks ........................................................................... 4-37
Installing Ancillary Units in Racks ............................................................... 4-44

Overview
The following sections describe the conditions required for installing the
equipment at the site, including site preparation, power sources, rack
installation, preparing cables and fibers, installing ancillary units and more.

Site Preparation
Perform a preliminary survey of the installation site, taking into consideration
the following issues:

System environmental requirements

Physical location of the XDM equipment

Location of power sources

Types of interfaces used at the site (optical, electrical, management, alarm


monitoring, and so on)

Work and equipment safety requirements

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Environmental Requirements
The following environmental conditions are applicable to XDM equipment and
must be provided at the installation site.
Table 4-1:

Environmental requirements

Parameter

Compliance requirements

Electromagnetic interference

FTZ 1TR9, EN 55022-2/2003, EN 50082-1/97

Temperature

ETSI ETS 300-19-2-3 Test Spec. T3.1

Main Equipment Dimensions


The following table summarizes the dimensions and space requirements of the
XDM-500 and associated components.
Table 4-2:

4-2

Main equipment dimensions

Equipment type

Height
(mm)

Width
(mm)

Depth
(mm)

Max. weight
(kg)

XDM-500

725

450

285

60

xRAP-100

133

445

185

10

miniRAP

90

445

150

2.8

xRAP-B (EOL)/ xRAP-D

133

445

185

9.5

xRAP-HP (EOL)

125

450

120

10

FST

44.5

440

240

Heat buffer

70

437

285

Cable guide

100

450

80

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Deep Doors vs. Standard Doors


Two door options are available for the XDM platforms, standard doors and
deep doors. These two options are described in this section.
Starting from V5, expanded DWDM support entails use of an attenuator in
combination with certain optical modules. This combination utilizes more
space. For facilities working with closed-door cabinets, this combination leaves
less space available between the edge of the component and the internal side of
the door. The resulting mechanical interference may cause the door to press
onto the fibers and cause physical damage to equipment.
The current XDM platform door is affected in the following ways when new
optical modules are installed:
1. It is not possible to use boots with regular length (28 mm) on the patch
cords.
2. It is not possible to use short boots (19 mm) on the patch cords when
optical attenuators are installed directly on the XDM base card connectors.
3. Patch cords with regular boot length may not comply with the standard
bending angle of the fiber.
The only way to prevent mechanical interference is not to close the cabinet
door, an option that, in most cases, is not acceptable.
A deep door (illustrated in the following figure) protruding 22.3 mm beyond
the current door is offered by ECI. This solution can be supplemented by the
use of patch cords with the short boot.

Figure 4-1: Deep vs. standard door

However, the new design does not comply with ETSI rack standards as it
bulges beyond the depth allowed for equipment in ETSI racks. This prevents
the user from closing the rack door. In addition, the new design presents
thermal restrictions because airflow is less effective. It is thus less
recommended at sites with heavy power consumption.
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Door selection may require a trade-off, as presented in the following table. In


order to decide, check your specific system configuration against the table.
Choose the type of door best suited to your local installation configuration. Be
sure to note the appropriate door type when you complete your order. Specify
in your order if you wish a standard size door or a deep door.
Table 4-3:

4-4

Comparison deep vs. standard door

Type of
interface

Short boot
sufficient to
close
standard
XDM door

Compliance
with
standard
bending
angle

Deep door required


when using the
regular boot
without attenuators
on XDM cards

Deep door
required with
attenuators
on XDM cards

SDH card for


STM-1 with
SFP

Yes

Yes (with
short boot)

Yes

Yes (with
short boot)

SDH card for


STM-4 with
SFP

Yes

Yes (with
short boot)

Yes

Yes (with
short boot)

SDH card for


STM-16 with
SFP

No

Yes

No

Yes (with long


boot)

Combiners

Yes

Yes (with
short boot)

Yes

Yes (with
short boot)

Transponders

Yes

Yes (with
short boot)

Yes

Yes (with
short boot)

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Door Installation
For greater convenience, XDM platforms are shipped without any doors
attached. Doors of the appropriate type as selected in the site specifications are
packaged separately from the basic platform, and attached on site during
platform installation.
To install a platform door:
1. Lift the door and hold it carefully in front of the platform.
2. Align the holes on the hinge side of the door with the hinge posts on the
side of the platform.
3. Gently slide the door into place, with the hinge posts fitting smoothly into
the door holes.
4. The door should swing open and close easily.
To remove a platform door, simply open the door and lift the door gently from
the hinge posts.
The XDM-3000 platform is designed with two doors, one for the upper half of
the platform and one for the lower half. This design ensures that the door size
and weight is manageable when installing or removing a door, even though the
XDM-3000 platform is larger than the other platforms in the XDM product
line. When installing a new XDM-3000 platform, simply repeat the door
installation procedure for both platform doors.

Physical Location
WARNING: XDM platforms are intended for installation
only in restricted access areas.

Choose the physical location of the XDM equipment, taking the following
aspects into consideration:

Plan of equipment installation.

Required floor loading capacity of 200 kg/440 lb minimum.

Routing requirements for grounding, power, alarm monitoring,


management, coaxial, multipair, and fiber-optic cables. To ensure
convenient access to cables, whenever possible, it is recommended to use
overhead cable ladders to bring cables to the top of each rack.

When a network management station, for example, an EMS-XDM, is


installed on the site, consider the method of connection to the local network
management station and the maximum allowed distance.

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Power Consumption Data


XDM equipment must be powered only by DC sources in compliance with the
applicable sections of ETSI 300 132-2 and FTZ 19PFL1, and the SELV
requirements of EN 60950-1. The nominal supply voltage is -48 VDC (positive
lead grounded); the allowed supply voltage range is -40 VDC to -72 VDC. For
redundancy, two separate DC power sources should be available.
NOTE: If the input power connected to one of the xINFs

exceeds -72 VDC, all xINFs are shut down and the platform
is switched off.

The following table lists the maximum allowed power consumption data for the
XDM-500 platforms, the required xRAP type, and the supply line protection
circuit breaker.
Table 4-4:

Maximum power consumption data

Shelf type

Maximum power RAP type

FCU

Circuit breaker

XDM-500

950 W

Regular or HP

30A

HP, B, or D

The actual power consumption for each shelf is limited by the client power
infrastructure. Limiting factors may include the client power supply capacity,
circuit breaker size, and type of backplane, xRAP, FCU, and INF.
Beginning with V7.2, platform power supply limitations are enforced by the
EMS-XDM management software to protect against over-demand. Upper
bound limits for maximum platform power usage are defined through the
management configuration variables and enforced through software protection.
The preceding table lists maximum power consumption settings, based on a
typical combination of XDM-500 component types. The actual maximum
power limitation for each specific installation is calculated as follows:
1. The EMS-XDM identifies the backplane, xRAP, FCU, and INF type
automatically.
2. The circuit breaker size must be manually identified for the EMS-XDM by
a system administrator (by setting a configuration variable). By default,
circuit breakers for the XDM-500 are assumed to be 25A unless
explicitly defined otherwise. The software by default limits the maximum
XDM-500 shelf power consumption to 950 W.
3. The EMS-XDM calculates a tentative maximum platform power
capacity value for this platform, based on the backplane, xRAP, FCU, INF,
and circuit breaker information.

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4. The client's maximum input power capacity is calculated, based on the


client's power supply and circuit breakers.
5. A final value for the maximum power usage to be allowed by the
EMS-XDM is determined, using the lower of the two power capacity
values defined in Steps 3 and 4 (the tentative maximum platform power
capacity and the client's maximum input power capacity).
For more information, see the EMS-XDM User Guide.
NOTEs:
1. When a single shelf is installed in the rack, a miniRAP equipped
with the appropriate circuit breakers can also be used.
2. An xRAP-100 equipped with the appropriate circuit breakers can be
used instead of a regular xRAP-HP, xRAP-D, or xRAP-B.
3. A comprehensive table listing the power requirements of the main
equipment components is provided in the System Specifications.
Use this table to determine the expected power requirements of the
equipment installed in the shelf. If the planned power consumption
of the equipment installed in the shelf is 80% or more of the
maximum listed value, it is recommended to consult ECI's Transport
Networking Division Customer Support team.
4. An xFCU-HP is required when working with SIO1&4B, SIO164,
DIOB, or MCS5/MCS10 cards.

The XDM Element Management (EMS-XDM) station and the test equipment
are powered from an AC source; their nominal supply voltage may range from
100-230 VAC, 50/60 Hz.
Typical power consumption for the XDM-500 is 720 W. Typical power
dissipation of the XDM-500 shelf is 2460 Btu/hr.
Power consumption can range up to a maximum of 950 W, depending on the
installed components and platform configuration, as explained in this section.
Maximum power dissipation of the XDM-500 shelf is 3240 Btu/hr.
For more information about power consumption requirements, please refer to
the XDM System Specifications. Power consumption is monitored through the
management software.
WARNING: When replacing circuit breakers, observe the following
precautions:
For continued protection against risk of fire, replace only with a
circuit breaker of the same type and rating.
Disconnect power before changing a circuit breaker.

ATTENTION: Pour ne pas compromettre la protection contre les

risques dincendie, remplacer par un fusible de mme type et de mmes


caractristiques nominales.

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Tools and Test Equipment


No special purpose tools beyond a standard technician toolbox and those
described in the following sections are required for the installation of XDM
equipment.

Tools for Traffic Cable Assembly


Since traffic cables can be prepared on site, suitable tools kits should be
available. Make sure to include the following tools:

Tools for coaxial cables type NCX1 (typically include cable stripper, nipper
(cutter for center contact), and die)

Tools for the assembly of DIN 1.0/2.3 coaxial connectors on coaxial cables
(typically include cable stripper, center contact crimp tool (blue), and crimp
tool for outer contact)

Tools for the preparation of optical patch cords (including fiber splicing
and optical connector attachment)

Suitable tools are available from various manufacturers. If necessary, contact


ECI Customer Support Team.

Cleaning Optical Connectors


When handling optical fibers, clean the optical connectors using the standard
cleaning kits recommended by the optical connector manufacturers.

Extractor Tool for Optical Connectors


A special extractor tool is provided with each XDM platform to help you
disengage LC and SC optical plugs from the mating connectors in the various
cards where the connectors cannot conveniently be reached by hand. The
extractor tool is placed in a special holder, located in the external left-hand wall
of the XDM platform.
This tool has the general appearance of a pair of tweezers, with the tip of one of
its legs bent inwards.

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Unpacking and Visual Inspection


Before you start:
Before unpacking, make a preliminary inspection of the shipping boxes.
Evidence of damage should be noted and reported immediately to the carrier,
the project manager, and/or your local ECI representative.
CAUTION - STATIC SENSITIVE DEVICES
PROPER HANDLING AND GROUNDING PRECAUTIONS
REQUIRED
XDM equipment contains components sensitive to
electrostatic discharge (ESD). To prevent ESD damage,
strictly observe all the precautions listed in Protection Against
Electrostatic Discharge (page 1-26). Keep parts and cards in
their antistatic packaging material until you are ready to
install them.
The use of an antistatic wrist strap connected to a grounded
equipment frame or rack is recommended when handling
cards and modules during installation, removal, or connection
to internal connectors.

Unpack the equipment on a clean flat surface.


To unpack the equipment:
1. Place the shipping boxes with the top upwards. Cut the sealing tape using a
short knife so as not to damage the internal items, and then open the top
flaps.
2. Remove the items contained in the box, and inspect each one for damage.
Check for loose parts or any visual damage to the rack, platform, and
auxiliary equipment. Also check the integrity of all the connectors, leads,
and cables.
NOTE: Do not remove plastic covers from optical connectors
until the optical fibers are connected to them.

3. Search the shipping boxes for any additional small items that may be
present.

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4. Open each of the card packages (shipped separately from the XDM
platforms in which they will be installed) for inspection, but do not remove
the cards.
To protect the cards against possible damage, keep the cards in their
protective package until they can be inserted in the platform.
5. Check the contents of the shipping boxes against the packing list attached
to each box. If you detect any damaged or missing parts, notify the project
manager and/or your local ECI representative.

XDM Rack Installation Options


XDM platforms can be installed in the following rack types:

ECI's recommended enhanced ETSI optical racks (hereafter referred to as


the optical rack), or the improved ETSI racks (hereafter referred to as
ETSI A). These racks have been specially adapted by ECI and are tailored
to meet platform requirements and simplify platform installation and
maintenance, including the following benefits:

4-10

Removable rear and side panels for tidy routing and efficient
maintenance of all rack cables, including:

Control cables

Power cables

Data cables (where relevant)

Two channels on the racks front rails for routing up to 400 (ETSI A) or
800 (optical rack) optical fibers.
Open frame top and bottom for easy routing of cables from suspension
floors and/or ceiling ladders.
Perforated door for free air flow to the installed equipment (see
Environmental Requirements (page 4-2)).
Front door for left or right opening mounting.

Standard ETSI racks (hereafter referred to as ETSI B).


ISO 19 racks and standard US racks. These racks should be used only in
consultation with and when approved by ECI's Mechanical Department.

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XDM racks options are summarized in the following table.


Table 4-5:

Equipment rack data

Type

Height

Width

Depth

Available space

Optical Rack

2200 mm

600 mm

300 mm

47U (2100 mm)

ETSI A

2200 mm

600 mm

300 mm

46U (2050 mm)

ETSI A

2600 mm

600 mm

300 mm

55U (2450 mm)

ETSI B

2200 mm

600 mm

300 mm

46U (2050 mm)

ETSI B

2600 mm

600 mm

300 mm

55U (2450 mm)

US

7 ft
(2134 mm)

23 in.
(585 mm)

12 in.
(305 mm)

44U
(6.5 ft/1960 mm)

US

7 ft
(2134 mm)

19 in.
(483 mm)

12 in.
(305 mm)

44U
(6.5 ft/1960 mm)

ISO 19

7.25 ft
(2200 mm)

24 in.
(600 mm)

24 in.
(600 mm)

47U
(6.85 ft/2089 mm)

The loading of a fully equipped rack is 7.35 kn/m2, or 55.35 kn/ft.2.


NOTES:

Not all XDM platforms can be installed in all types of


racks. This section includes a general list of the rack
options available. The installation instructions for each
platform include a list of the racks appropriate for that
platform.
The installation instructions in this manual are written on
the basis of an installation using an ECI enhanced rack.
Some of these instructions may not be relevant if you are
using a standard rack supplied by other vendors.
Before any installation plan can be completed, a site
survey by ECI technical support team is required, to
verify rack accessibility and accessory compatibility at that
site. If you are working with standard racks from other
vendors, the site survey is also essential to determine what
changes are required to adapt the rack to XDM platform
installation requirements.

All ECI XDM equipment racks may be installed on wooden, concrete, or


suspended floors, or suspended from overhead mountings. Some of these
installation options are described in Installing Equipment Racks (page 4-37). If
your facility uses a different installation paradigm, contact the ECI Technical
Support team for additional information.

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Rack Space Requirements


The following table summarizes the dimensions and space requirements of the
XDM-1000 product line and its associated components.
Table 4-6:

Rack space requirements

Equipment type

Height (U)

Height (mm/in.)

XDM-40

256/10.1

XDM-450

8.5

374/14.72

XDM-500

18

800/31.5

XDM-1000

26

1100/43.3

XDM-2000

19

845/33.3

XDM-3000

35

1550/61

PRAP

133/5.25

xRAP-B/D

133/5.25

xRAP-HP

2.8

125/4.92

xRAP-100

133/5.25

miniRAP

90/3.5

Spooler

2.8

125/4.92

FST

44.5/1.75

Fiber optic guide

90/3.5

Heat buffer

70/2.7

Cable guide

120/4.7

In addition, make sure at least 1U (approximately 50 mm or 2 in.) free space is


left between the bottom of the last unit installed in the rack and the rack floor.
NOTE: The miniRAP is not used with XDM-1000 and
XDM-2000 shelves.

XDM systems can be installed in any of the racks listed in XDM Rack
Installation Options (page 4-10).

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Optical Rack
ECI offers a special optical rack designed to accommodate the potentially large
number of fiber cables that may be required for the installation of XDM
equipment. An added advantage of the optical rack is easy access to all the
components and cables during installation, maintenance, and when adding new
cards and modules. The following figure shows a general view of an optical
rack.

Figure 4-2: Optical rack components

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The rack has two side covers that cover the two cable conduits. These covers
are normally installed when using standalone racks or when the rack is the end
unit in a group. When two racks are installed side by side, the covers are
removed.
NOTE: When necessary, the rear cover of the rack can also
be removed.

In addition to the wide cable conduits, two easily accessible fiber channels are
located at the rack sides in front of the conduits.

ETSI A Rack
ECI offers a special ETSI rack with improved cable routing features. The
following figure shows a general view of a standalone rack with its door
closed.
NOTE: The rack is normally supplied with the door opening

to the right. However, when necessary, the opening direction


can be changed in the field. Contact ECI's Customer Support
for field modification instructions.

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An added advantage of the type A ETSI rack is easy closure of the rack door
even when the XDM shelf is equipped with an extended door (the extended
door occupies 22.3 mm more than the standard door - see Deep doors vs.
standard doors (page 4-3)). The only requirement is to ensure that the extended
door is not located directly behind the door lock (it can be higher or lower than
the lock).

Figure 4-3: Type A ETSI rack general view

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The following figure shows the same rack with the door open.

Figure 4-4: Type A ETSI rack internal view

The rack has two side covers that cover the two cable conduits at the rack sides.
These covers are normally installed when using standalone racks or when the
rack is the end unit in a group. When two racks are installed side by side, the
covers are normally removed.
NOTE: When necessary, the rear cover of the rack can also
be removed.

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In addition to the wide cable conduits, two fiber conduits are located at the rack
sides before the cable conduits. To protect fibers that have to cross from one
rack side to the other, two additional fiber conduits (the upper and lower
conduits) are provided.
The side fiber conduits can easily be reached. The front side of the right
conduit is exposed when the door is opened, and the left conduit is exposed
when the side panel is opened. (To open the side panel, turn the release handles
on the upper and lower fiber conduits.)

Environmental Considerations
Observe the following guidelines when installing the XDM-500 in racks:
1. Free airflow through the rack must be guaranteed at all times.
2. XDM-500 shelves can be installed in open or closed (with door) racks.
When installed in a closed rack, the door must be perforated. An example
of a rack with a perforated door is the ETSI A rack shown in the following
figure.
3. Always install the first XDM-500 platform in the lower part of the rack,
leaving a space of at least 1U from the bottom of the rack.
4. In mixed (horizontal and vertical airflow) equipment installations, always
install the equipment with the horizontal airflow in the lower part of the
rack, and the equipment with the vertical airflow above it.
5. Leave a space of at least 1U between the upper accessory of the XDM-500
and the next platform.
6. Leave as much space as possible between the racks cable supports and the
XDM-500 sidewalls.
7. Always consider the platform airflow requirements when organizing the
cable and fiber routes near the XDM-500 sidewalls.

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Figure 4-5: ETSI A rack closed view

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Considerations for Installing Multiple


Shelves in a Single Rack
The XDM shelf and the associated set of installation accessories do not
completely occupy the space available in a rack. Therefore, additional
equipment may be installed in the remaining rack space, provided that the
following requirements are met:

The additional heat can efficiently be dissipated, and thermal isolation is


provided between the various equipment units installed in the same rack.
For thermal isolation purposes, install a heat buffer (a 70 mm/2.7 in. high
unit) between any two shelves. When more room is available in the rack, a
larger heat buffer (125 mm/5 in. high unit) can be used. If there is not
enough room in the rack, a smaller buffer plate, which occupies only
50 mm (2 in.), can be used instead of a heat buffer.

Suitable arrangements are made for routing the cables connecting to the
equipment units installed in the rack. This aspect is particularly important
in installations handling E1 tributary lines (connected to M2_21 and
M2_84 interface modules), because a single XDM platform can easily
handle hundreds of E1 tributaries.

The following multiple shelf installation options have been evaluated by ECI
for compliance with the requirements listed above:

2600 mm ETSI racks can accommodate at least two XDM shelves within
the XDM-1000 product line. However, to install two XDM-1000 shelves, it
is necessary to install the xRAP using extendable installation rails.

One 2200 mm ETSI rack, or one 7 ft. (2134 mm) rack, can accommodate
two XDM-500 or XDM-2000 shelves. One XDM-1000 shelf and one
XDM-500 or XDM-2000 shelf can also be installed in this type of rack, but
this configuration requires a special version of the xRAP.

You can find typical rack layouts for several equipment configurations in
Typical XDM Installations in Racks (page 4-20). Contact ECI Customer
Support team or your ECI sales representative for help in meeting your specific
installation requirements.

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Typical XDM Installations in Racks


NOTES:

All the layouts shown include an xRAP (xRAP-D,


xRAP-B, xRAP-HP, or xRAP-100). However, a userprovided power distribution panel may also be used
instead of the ECI xRAP unit.
The xRAPs are specifically designed for XDM shelves.
They provide not only the power connection functions, but
also enable connection to the shelf alarm and alarm
monitoring interfaces. Such connections require special
protected interfaces and are only allowed when xRAPs are
used. If necessary, consult the ECI Customer Support
team.
XDM shelves may also be installed in 7 ft. US racks (see
"Rack Space Requirements" page 4-12). A different
installation accessories kit is used for this purpose.

If necessary, contact ECI Customer Support team or your ECI sales


representative for help with your specific installation requirements.
In a typical basic installation, a single XDM shelf (for example, an XDM-500)
is installed in one rack.

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The following figure shows one XDM-1000 shelf and one XDM-500 shelf
installed in a 2600 mm rack.

Figure 4-6: XDM-1000 and XDM-500 shelves in a 2600 mm rack

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The following figure shows two XDM-500 shelves installed in a 2200 mm


rack.

Figure 4-7: Two XDM-500 shelves in a 2200 mm rack

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Cable and Fiber Preparation


NOTE: This section provides information for preparing

cables. The necessary cables can also be ordered from ECI.


For details, contact ECI Customer Support team or your ECI
sales representative.

The following main types of cables are required for XDM installations:

Grounding cables (page 4-24)

DC power cables (page 4-28)

Alarm cables (page 4-30)

Management cables (page 4-31)

Timing (clock) cables (page 4-31)

Traffic cables (page 4-32)

DC power and traffic cables should be prepared on site. AC power cables


suitable for connection to the power outlet types specified when placing the
order (according to the site specifications) and the control and alarm cables
used within XDM equipment racks, are included in the shipment with power
outlets provided according to the site specifications.
The following sections provide information to enable you to prepare cables on
site. Refer to Connector Pin Assignments (page B-1) for a description of the
equipment connector types and cable wiring.
WARNING: When preparing cables, in particular power and
grounding cables, use only UL-listed components of the
specified types. Components must also comply with any
applicable national and local safety codes and regulations.

Only qualified trained personnel may be involved in the


preparation of the various cable types. Personnel must use
only approved procedures, in accordance with the applicable
workmanship practice.

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Grounding Cables
WARNING: To prevent possible damage to XDM

equipment, all racks and equipment must be completely


grounded before connecting to the platform any external
devices powered from any DC or any AC source
(100-230 V). All grounding procedures described in
Grounding the Platform (page 5-3) must be completed before,
for example, connecting an external PC to configure and
initialize the NE management system.

Equipment installed in a rack is bonded through the screws used to fasten the
equipment chassis to the frame of the rack, as described in Equipment
Grounding Requirements (page 1-10). Therefore, it is necessary to provide a
reliable low-impedance connection between the rack frame and the site
grounding bus using copper conductors. It is essential that the metal surfaces of
the rack installation elements, including the rack frame, the metal screws, and
the equipment mounting brackets, be completely clean and free of any paint or
any other coating that may impede the grounding connection, to provide
electrical continuity between the equipment and the rack frame. For more
information, see Grounding Requirements (page 1-7).

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A connection must be made between the rack grounding bar and the site
grounding bar in compliance with UL/ETSI recommendations. For example,
grounding may be completed by means of a copper cable with green/yellow
insulation having the same diameter as the xRAP input power cables or thicker.
A length of appropriate 50 mm2 grounding cable is included with the platform
accessories. Grounding cables are connected using two-hole compression lug
terminals on both ends, securely fastened with flat washers, serrated lock
washers, and nuts or bolts, depending on the connection point.

Figure 4-8: Rack and platform grounding posts on the XDM-1000

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WARNING: The thickness of the protecting grounding cable


must be at least the same thickness as the corresponding
power cable. This means:

The thickness of the rack grounding cable must at least


match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at least
match the thickness of the power cable from the xRAP to
the platform.

The end of the lead connected to the xRAP used in the rack must be terminated
in a lug suitable for the gauge of the lead in use. Typical grounding cable sizes
are as follows.

For the PRAP, xRAP-D, xRAP-B, and xRAP-HP power supply units,
0 AWG (50 mm2/.078 in.2) or thicker cable

For the xRAP-100 and miniRAP power supply units,


2 AWG (35 mm2/.054 in.2) or thicker cable

To prepare a grounding cable:


1. Route grounding conductors along the shortest possible route.
2. Cut appropriate cable lengths from the roll of grounding cable included
with the platform accessories.
3. Strip about 22 mm of the cable jacket from one end of the cable length.
4. Treat the bare portion of the conductor with antioxidant.
5. Connect a listed two-hole compression lug as follows:
a. Insert all the cable strands into the lug sleeve.
b. Press at two or three different points on the lug sleeve using an
appropriate crimping tool and die. The recommended tools are Panduit
CT-720 crimping tool with CD-720-2 die, Klauke K18 crimping tool
with D50 die, or equivalent.
6. If the lug is not plated, bring it to a bright finish and coat it with antioxidant
before connecting it to the grounding points.
7. Repeat Steps 3 to 6 for each cable lead.
8. Repeat these steps for each ground cable being used.

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WARNING: There must be a connection between the

grounded conductor of the DC power supply circuit and the


equipment grounding conductor. See installation instructions
for more details.
When this connection is made, all the following conditions
must be met:

The equipment is connected directly to the DC supply


system grounding electrode conductor or to a bonding
jumper from a grounding terminal bar/bus to which the
DC supply system grounding electrode is connected.
The equipment is located in the same immediate area
(such as adjacent cabinets) as any other equipment that
has a connection between the grounded conductor of the
same DC supply circuit and the grounding conductor, as
well as the point of grounding of the DC system. The DC
system must not be grounded elsewhere.
The DC supply source is located within the same premises
as this equipment.
There is no switching or disconnecting devices in the
grounded circuit conductor between the DC source and
the point of connection of the grounding electrode
conductor.

WARNING: Cet appareil est conu pour permettre le

raccordement du conducteur reli la terre du circuit


dalimentation c.c. au conducteur de terre de lappareil.
Pour ce raccordement, toutes les conditions suivantes doivent
tre respectes:

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Ce matriel doit tre raccord directement au conducteur


de la prise de terre du circuit dalimentation c.c. ou une
tresse de mise la masse relie une barre omnibus de
terre laquelle est raccorde llectrode de terre du circuit
dalimentation c.c.
Les appareils dont les conducteurs de terre respectifs sont
raccords au conducteur de terre du mme circuit
dalimentation c.c. doivent tre installs proximit les
uns des autres (p.ex., dans des armoires adjacentes) et
proximit de la prise de terre du circuit dalimentation c.c.
Le circuit dalimentation c.c. ne doit comporter aucune
autre prise de terre.
La source dalimentation du circuit c.c. doit tre situe
dans la mme pice que le matriel.
Il ne doit y avoir aucun dispositif de commutation ou de
sectionnement entre le point de raccordement au
conducteur de la source dalimentation c.c. et le point de
raccordement la prise de terre.

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DC Power Cables
NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB), and
HD 308 S2:2001 (EU) standards the positive lead (+48 V)
should be connected with a blue cable, and the negative lead
(-48 V) with a gray cable. In the sections that describe DC
power cable connections, use cables with appropriate colors
to comply with the standards in your area of residence.

DC power cables should be prepared on site. Two types of DC power cables


are needed:

Input power cables

Platform input power cables

Input Power Cables


The input power cables are prepared on site. They connect the input power
from the site power distribution subsystem to the DC input terminals of the
rack xRAP unit supplied by ECI, or to the user-provided power distribution
panel, when used instead of an ECI xRAP unit.
NOTE: The generic name xRAP is used when the text is

applicable for any one of the ECI xRAP units (PRAP,


xRAP-D, xRAP-B, xRAP-HP, xRAP-100, or miniRAP).

xRAP input power cables


Redundant sources of input power should be used for each rack, with one main
and one backup power source. Two sets of input power cables are required for
each rack, one for each source. The cables must use copper leads in compliance
with UL/ETSI recommendations. Use a red lead for the positive conductor and
a black lead for the negative conductor. The xRAP cable ends must be
terminated in cable lugs matching the conductor gauge. Input power cable
requirements are as follows.

PRAP, xRAP-D, xRAP-B, and xRAP-HP power supply units require


0 AWG (50 mm2/.078 in.2) or thicker

xRAP-100 and miniRAP, 2 AWG (35 mm2/.054 in.2) or thicker

This gauge ensures that the voltage drop across the rack power cable at full
power consumption does not exceed 2 V, even for cable runs up to 30 meters
(99 feet) connected to an xRAP providing power to two XDM platforms.
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When an xRAP is used to provide power to a single XDM-40/500/1000/2000


platform with lower power consumption values, lower lead gauges may be
used:

For cable runs not exceeding 20 meters (66 feet), it is sufficient to use
16 mm2 (.025 in.2) copper leads.

For cable runs not exceeding 30 meters (99 feet), it is sufficient to use
25 mm2 (.039 in.2) copper leads.
NOTES:

If necessary, the gauge of the grounding lead can also be


reduced to the gauge of the power leads, that is, 16 mm2
(.025 in.2) for lengths up to 20 meters (66 feet), and
25 mm2 (.039 in.2) for lengths up to 30 meters (99 feet).
The thickness of the protecting grounding cable must be at
least the same thickness as the corresponding power cable.
This means:
The thickness of the rack grounding cable must at
least match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must
at least match the thickness of the power cable from
the xRAP to the platform.

Input power cables for user-provided distribution


panel
The cables used to connect to a user-provided power distribution panel must
have characteristics similar or superior to those specified for connection to an
xRAP.

Platform Power Cables


Use two appropriate cables to connect the input power from the rack xRAP
panel to each POWER IN connector of each platform installed in the rack. Two
cables are required for each platform.
Appropriate cables are available from ECI. The same cables must be used even
when connecting to a user-provided power distribution panel.

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Alarm Cables
When an xRAP unit is installed in the rack, it provides the special interfaces
needed for connecting to the platform alarm interfaces. In this case alarm
indications are carried by the following cables:

Platform alarm indication cable. One alarm indication cable is required


for each XDM platform installed in the rack. Cable length is 2 m/6.6 feet.
Refer to Appendix A for a description of this cable. One end of the cable is
always connected to the ALARM and RAP connectors on the XDM
platform. Connection of the other end depends on the cable type, as
follows:

xRAP-D/xRAP-B alarm cable. Connects to one of the SHELF


connectors on the xRAP-D/xRAP-B.
xRAP-HP alarm cable. The cable end is split into two cables, one of
which connects to one of the xRAP connectors on the xRAP, and the
other to one of the EXTERNAL ALARM/CONTROL connectors on
the xRAP.
xRAP-100 alarm cable. Connects to one of the SHELF connectors on
the xRAP-100.
miniRAP alarm cable. Connects to the SEVERITY IN connector on the
miniRAP.
Client alarms cable. Connects to the client's alarm collecting facility.

External alarm connection cable. One external alarm cable is required for
each rack. This cable carries the alarm indications and monitoring lines of
the rack. One end of the cable is connected to the xRAP, the other end is
open and connects to the client's alarm collecting facility. Three types of
this cable are available:

xRAP-D/xRAP-B bay alarm cable. Connects to the ALARMS


connector on the xRAP-D/xRAP-B.
xRAP-HP bay alarm cable. Connects to the CONTROL
CONNECTION on the xRAP-HP.
xRAP-100 bay alarm cable. Connects to the ALARM IN/OUT
connector on the xRAP-100.

In general, when a user-provided power distribution panel is used, it is not


allowed to connect to the platform alarm interfaces. For further information,
consult with the ECI Customer Support team.

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Management Cables
The connection of out-of-band management traffic to an XDM platform is
made to the RJ-45 ETHERNET connectors located on the MECP card.
Each ETHERNET connector is wired as a 10BaseT station port:

For direct connection to a port of a 10BaseT Ethernet hub, use one


RJ-45-to-RJ-45 straight cable (cable wired point-to-point).

For connection to the Ethernet port of a PC, use an RJ-45-to-RJ-45


cross-wired cable.

Suitable standard Ethernet station cables are available from many sources.
Category 3 or better cables must be used. In any case, the length of the cables
must not exceed the maximum recommended for the cable type and hub port in
use (up to a few dozens of meters or feet).

Timing (Clock) Cables


Each XDM platform has two timing reference connectors:

The connectors designated T3_1/T4_1 and T3_2/T4_2 are used for


2.048 Mbps signals and have balanced (120 ) G.703 interfaces.

The connectors designated BITS1 IN/OUT and BITS2 IN/OUT are used
for 1.544 Mbps signals and have balanced 100 interfaces.

The cables used to connect to these connectors are prepared on site, using
cables comprising individually shielded twisted pairs (the same type of pairs
needed for connection to the balanced E1 tributary interfaces).
If the site timing reference distribution subsystem has unbalanced (75 ) G.703
interfaces, a 120 /75 adapter can be supplied for mounting on the
T3_1/T4_1 and T3_2/T4_2 connectors. This permits using coaxial cables
(BT3002 or equivalent) of the same type used for connection to balanced E1
tributary interfaces.

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Traffic Cables
Traffic cables can be prepared on site. The following table lists the cables and
mating connectors needed for each XDM traffic interface type.
Use only 2 mm optical fibers for optical cables connecting to optical interfaces.
For each optical interface, ECI supplies patch cords with mating optical
connectors already attached to the fiber. Therefore, only the optical termination
on the Optical Distribution Frame (ODF) side, which is installation-dependent,
must be installed on site.
NOTE: ECI recommends using only fibers with short boots

(19 mm boot, instead of the 28 mm boot previously used for


patch cords). The following figure identifies the required boot
characteristics.

Figure 4-9: Short boot characteristics

Optical fibers for connecting to equipment installed in a given rack should


enter the rack from the top, and end at Fiber Storage Trays (FST). The storage
trays must contain enough fiber for routing within the rack (through cable
guides running along the rack side rails) down to the mating equipment
connectors, and for fiber replacement in case of damage (splicing repairs).
When routing fibers, make sure to observe the minimum bending radius
(35 mm).
Table 4-7:

Traffic cables, fibers, and mating connector data

I/O card

Interface type

Interface
unit/module

Cable type

Mating
connector

Qty/card

PIO2_84

E1 balanced
(2.048 Mbps)

M2_84B

Multipair cable
(14 pairs of
shielded 120
twisted pairs)

68-pin SCSI
male

6 cables

----------

----------

M2_84BR
E1 unbalanced M2_84U
(2.048 Mbps)

4-32

2 cables
84 pairs of 75
coaxial cables

BT43 male

6 cables

----------

----------

M2_84UR

2 cables

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I/O card

Interface type

Interface
unit/module

Cable type

Mating
connector

Qty/card

PIO2_21

E1 balanced
(2.048 Mbps)

M2_21B 1

Multipair cable
(14 pairs of
shielded 120
twisted pairs)

68-pin SCSI
male

2 cables

E1 unbalanced M2_21U 2
(2.048 Mbps)

21 pairs of 75
coaxial cables

BT43 male

2 cables

E3 and DS-3
(34/45 Mbps)

M345_16BT
---------M345_16DI

16 pairs of NCX
coaxial cables

BT43 male
---------DIN 1.6/5.6
mm male

2 cables
(multi-coax)

M345_8BT
---------M345_8DI

8 pairs of NCX
coaxial cables

BT43 male
---------DIN 1.6/5.6
mm male
---------BNC male

1 cable
(multi-coax)

M1_16BT
------------M1_16DI

16 pairs of NCX
coaxial cables

BT43 male
------------DIN 1.6/5.6
mm male

2 cables
(multi-coax)

M1_8BT
------------M1_8DI

8 pairs of NCX
coaxial cables

BT43 male
------------DIN 1.6/5.6
mm male

1 cable
(multi-coax)

M1_16SFP
and ETR
electrical SFP

32 single NCX
coaxial cables

DIN 1.023/3.5 32 cables


8 mm male

PIO345_16
PIO345M_16

---------M345_8BN
SIO1&4
SIO1&4M

STM-1
electrical

SIO1&4B

STM-1
electrical

SIO1&4
SIO1&4M

STM-1 optical OM1_4


OMS01_4

4 pairs of fiber
patch cords (one
pair per interface)

LC

8 fibers

STM-4 optical OM4_1


OMS04_1

1 pair of fiber
patch cords per
interface

LC or SC
male 3

4 fibers

STM-1 optical OTR1_S3


OTR1_L3
OTR1_L5
OTR1_X5
OTR1_VL5

1 pair of fiber
patch cords per
interface

LC

32 fibers 5

OTR_S3BD
OTR_S5BD
OTR_L3BD
OTR_L5BD

1 pair of fiber
patch cords per
interface

LC

16 fibers 6

SIO1&4B
(with
M1_16SFP) 4

M2_21 modules can also be used with PIO2_84 cards.


M2_21 modules can also be used with PIO2_84 cards.
3
Connector type depends on OM version.
4
SIO1&4B includes 16 STM-1 optical SFPs directly on the card itself. In addition, the corresponding M1_16SFP
module also supports 16 STM-1 optical or electrical SFPs.
5
No module. Direct SFP installation.
6
No module. Direct SFP installation.
2

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7
8

XDM-500 Installation and


Maintenance Manual

I/O card

Interface type

SIO1&4B
(without
M1_16SFP)

Interface
unit/module

Cable type

Mating
connector

Qty/card

STM-4 optical OTR4_S3


OTR4_L3
OTR4_L5

1 pair of fiber
patch cords per
interface

LC

32 fibers 7

SIO16
SIO16M

STM-16
optical

OM16_1
OM16_1SFP

1 pair of fiber
patch cords per
interface

LC or SC
male 8

4 fibers

SIO16_2B
SIO16_4B

STM-16
optical

OTR16_I3
OTR16_S3
OTR16_L3
OTR16_L5
OTR25_AVxx
OTR25_ABxx
OTC25_PSxx

1 pair of fiber
patch cords per
interface

LC male

4 fibers
(SIO16_2B)
8 fibers
(SIO16_4B)

SIO64
SIO64M
SIO64MF

STM-64
optical

OM64_1

1 pair of fiber
patch cords per
interface

SC male

2 fibers

SIO64B

STM-64
optical

OTR64_PI3
OTR64_PS5
OTR64_AL5
OTR10_ASxx
OTX10_ALxx

1 pair of fiber
patch cords per
interface

LC male

2 fibers

SIO164

STM-16/
OTU1 optical

OMSC16_4

1 pair of fiber
patch cords per
interface

LC male

8 fibers

STM-64

OMTX10_S

2 fibers

STM-64/
OTU2 optical

OMTX10
OMTX10_EF

2 fibers

DIO1_61

STM-16
optical

DOM16_I3

1 pair of
single-mode fiber
patch cords

DIO1_40,
DIO1_61 and
DIO1_80

Short-haul
GbE optical

OMGE-1 (SX)

1 pair of 50/125 or LC male


62.5/125 micron
multimode fiber
patch cords per
interface

Long-haul
GbE optical

OMGE-1
(LX, ZX)

1 pair of
single-mode fiber
patch cords per
interface

LC male

2 fibers

8, 12, or
16 fibers

No module. Direct SFP installation.


Connector type depends on OM version.

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Installation

I/O card

Interface type

Interface
unit/module

Cable type

EIS2_8, EIS8_8,
EIS2_14

Short-haul
GbE optical

OMGE-1 (SX)

1 pair of 50/125 or LC male


62.5/125 micron
multimode fiber
patch cords per
interface

Long-haul
GbE optical

OMGE-1
(LX, ZX)

1 pair of
single-mode fiber
patch cords per
interface

Electrical
(1000BaseT,
100BaseT,
10BaseT)

ME_8
---------ME_14

Category 5 twisted RJ-45 male


pairs, 1 cable per
port

8 cables
---------14 cables

Short-haul
GbE optical

OMGE-1 (SX)

1 pair of 50/125 or LC male


62.5/125 micron
multimode fiber
patch cords per
interface

8 pairs

DIOB
MCS5
MCS10

Long-haul and OMGE-1


extended GbE (LX, ZX)
optical
Electrical
(10BaseT,
100BaseT,
1000BaseT)

ME16

Mating
connector

Qty/card

8, 12, or
16 fibers

1 pair of
single-mode fiber
patch cords per
interface
UTP 4-pairs with
overall shield

RJ-45 male

16 cables

MCS30_X10G

Long haul and OTR103


extended GbE (SR,LR, ZR,ER)
optical

1 pair of single
mode, or multi
mode (depends on
the transceiver
type) fiber patch
cords

LC male

2 fibers

ACP1000

Electrical
(10BaseT,
100BaseT)

Not applicable

UTP 4-pairs with


overall shield

RJ-45 male
(10-pin)

up to
4 cables

Aurora-G

DCN 10/100
Ethernet
management
port

Not applicable

Category 5
shielded straight
through cable
(STP)

RJ-45 male

1 cable

2 GbE
Ethernet ports

Dual fiber optical


SFPs
OTGBE_SX
OTGBE_LX
OTGBE_ZX

9/125 m single
mode duplex fiber
pair
or
62.5/125 m
multimode duplex
fiber or simplex
fiber pair

LC male

1 cable per
port

Electrical
1000BaseT SFP
ETGBL

UTP 4-pairs with


overall shield

RJ-45 male

1 cable per
port

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I/O card

XIO192
(I/O section)

Interface type

Interface
unit/module

Cable type

Mating
connector

Qty/card

Local PC port

Not applicable

RS-232 shielded
copper null model
cable

DB-9 male

1 cable

1 pair of fiber
patch cords per
interface

LC or SC
male 9

8 fibers

STM-1 optical OM1_4


OMS01_4
STM-4 optical OM4_1
OMS04_1

2 fibers

STM-16
optical

OM16_1
OM16_1SFP

2 fibers

STM-16/
OTU1 optical

OMSC16_4

STM-64

OMTX10_S

2 fibers

STM-64/
OTU2 optical

OMTX10
OMTX10_EF

2 fibers

MO_BAC
MO_PAC
MO_BAS
MO_PAS

optical

Not applicable

1 pair of fiber
patch cords per
module

LC

2 fibers

OFA_2

optical

OM_BAC
OM_ILC_23
OM_ILC29

1 pair of fiber
patch cords per
module

LC

4 fibers

OFA_M

optical

1st stage,
2nd stage

1 pair of fiber
patch cords

LX.5

4 fibers

MO_OFA_M

optical

MO_OFA_M

1 pair of fiber
patch cords per
module

2 LC

2 fibers

OFA_R
OFA_RM
OFA_HRM

optical

OM_OFA_R

1 fiber patch cord


of each connector
type

LX.5
E2000

2 fibers

MO_OFA_FBC

optical

OM_OFA_FBC

1 pair of fiber
patch cords

2 LC

2 fibers

MO_OFA_FHB
C

optical

MO_OFA_FHB
C

1 pair of fiber
patch cords

3 LC

3 fibers

MO_OFA_
PHBC

optical

OM_OFA_P

1 pair of fiber
patch cords

2 LC

2 fibers

OM_OFA_B

1 pair of fiber
patch cords

LC and LX.5

2 fibers

OM_OFA_B

1 pair of fiber
patch cords

LC and LX.5

2 fibers

XIO384F
(I/O section)

MO_OFA_
HBC

XDM-500 Installation and


Maintenance Manual

optical

1 pair of fiber
patch cords per
interface

LC male

8 fibers

Connector type depends on OM version.

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I/O card

Interface type

Interface
unit/module

Cable type

Mating
connector

Qty/card

MO_OFA_
MH

optical

1st stage,
2nd stage

1 pair of fiber
patch cords per
stage

1st stage:
2 LC
2nd stage:
LC and LX.5

4 fibers

MO_OFA_MHe

optical

Through
1st stage,
2nd stage

1 pair of fiber
patch cords per
stage

Through
2 LC
1st stage:
2 LC
2nd stage:
LC and LX.5

6 fibers

Installing Equipment Racks


Marking the Rack Floor
You must mark out the rack floor plan before installing the rack.
Before you start:
1. Find the prescribed location of each equipment rack.
2. If you have not yet unpacked the rack and the associated mounting kits, do
it now (see Unpacking and Performing Visual Inspection).
To mark out the rack floor plan:
1. For each rack, mark out the floor at the rack location(s) according to the
floor plan template corresponding to the type of rack being installed:

ETSI use the template shown in Mounting diagrams for ETSI racks
(page 4-38) (diagram a).
23 in. use the template shown in Mounting diagrams for 19 in. and 23
in. racks (page 4-39) (diagram a).
19 in. use the template shown in Mounting diagrams for 19 in. and 23
in. racks (page 4-39) (diagram b).

The marked locations are a helpful guide for positioning the racks.
2. If the installation is located at a site with a raised floor, mark out all cable
entry slots as well.
3. For concrete or wooden floors, mark out all the points designated for
equipment bolting.

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Figure 4-10: Mounting diagrams for ETSI racks

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Figure 4-11: Mounting diagrams for 19 in. and 23 in. racks

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Installing Racks on Concrete Floors


See the relevant figures when performing this procedure.
To mount the rack on a concrete floor:
1. Plan where to drill holes by referring to the appropriate template figure.
Choose the relevant template sketch from the diagrams included in
Mounting diagrams for ETSI racks (page 4-38) (diagram a) and Mounting
diagrams for 19 in. and 23 in. racks (page 4-39) (diagram a or b).
2. Drill the mounting holes using a 5 mm (0.2 in.) drill bit.
3. Insert expansion shields into the holes.
4. Position the rack over the mounting holes.
5. Secure the rack to the floor with the bolts supplied in the mounting kit (see
diagram b of Mounting diagrams for ETSI racks (page 4-38) or diagram c
of Mounting diagrams for 19 in. and 23 in. racks (page 4-39)).
NOTE: ETSI racks have leveling points that can be adjusted
after installation to compensate for an uneven floor.

Installing Racks on Wooden Floors


See the relevant figures when performing this procedure.
To mount the rack on a wooden floor:
1. Plan where to drill holes by referring to the appropriate template figure.
Choose the relevant template sketch from the diagrams included in
Mounting diagrams for ETSI racks (page 4-38) (diagram a) and Mounting
diagrams for 19 in. and 23 in. racks (page 4-39) (diagram a or b).
2. Drill the mounting holes using a 5 mm (0.2 in.) drill bit.
3. Position the rack over the mounting holes.
4. Secure the rack to the floor using appropriate wood screws (refer to
diagram d of Mounting diagrams for ETSI racks (page 4-38)).

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Installing Racks on Raised Floors


See the relevant figures when performing this procedure.
To mount the rack on a raised floor:
1. Plan where to drill holes by referring to the appropriate template figure.
Choose the relevant template sketch from the diagrams included in
Mounting diagrams for ETSI racks (page 4-38) (diagram a) and Mounting
diagrams for 19 in. and 23 in. racks (page 4-39) (diagram a or b).
2. Drill the mounting holes using a 5 mm (0.2 in.) drill bit.
3. Position the rack over the mounting holes.
4. Secure the rack to the floor (see diagram c of Mounting diagrams for ETSI
racks (page 4-38)).

Attaching Suspended Overhead Trays


See the relevant figure when performing this procedure.
To mount the rack on a suspended overhead tray:
1. Refer to the following suspended overhead tray diagram and position the
overhead rack securing brackets.

Figure 4-12: Rack mounting diagram for attachment to suspended overhead


tray (2200 mm rack)

2. Secure the rack to the overhead cabling trays using the adjustable brackets.
Note that 2200 mm (87 in.) high racks may also be attached to the ceiling;
2600 mm (102.5 in.) racks are generally attached only to the ceiling.

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Installing Extendable Rails


In high-density installations it is necessary to install the xRAP above the rack,
using the extendable installation rails available from ECI.
In this case, attach the extendable installation rails to the top of the rack before
starting the equipment installation.

Grounding the Rack


Immediately after installing the rack, ground the rack as described here. The
optical rack grounding points are illustrated in the following figure.

Figure 4-13: Optical rack grounding bar and rack frame grounding post

Use a grounding cable that meets the grounding requirements listed in Rack
Grounding Requirements (page 1-8) and prepared appropriately, based on the
instructions in Grounding Cables (page 4-24). The relevant accessory washers
(both flat and serrated), nuts, and bolts are delivered attached to the
corresponding grounding points.
To ground the rack:
1. The rack is delivered with one grounding connection already in place. This
is a metal panel that connects the rack grounding stud to the first grounding
point on the far left side of the rack grounding bar. Verify that this panel is
in place and tightened. The nut over the lug on the rack grounding stud, and
the bolt over the grounding point in the rack grounding bar must both be
tightened with a torque of 450 N cm to 550 N cm.
2. Use the grounding cable to connect the first pair of grounding points on the
left side of the rack grounding bar to the site grounding bar. To secure the
grounding cable lug to the grounding bar, hold the cable lug against the
panel and place the flat washer above the cable lug, followed by the
serrated lock washer. Screw in the bolt to hold everything in place. Tighten
the bolt with a torque of 450 N cm to 550 N cm.
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The grounding mechanism is illustrated in the following figure. The metal


panel and the end of the grounding cable are both highlighted.

Figure 4-14: Grounding the optical rack to the site grounding bar

WARNINGS:

To prevent possible damage to XDM equipment, all racks and


equipment must be completely grounded before connecting any
external devices powered from any DC or AC source (100 V to
230 V) to the platform. All grounding procedures described in
Grounding the Platform (page 5-3) must be completed before, for
example, connecting an external PC to configure and initialize the
NE management system.
The thickness of the protecting grounding cable must be at least the
same thickness as the corresponding power cable. This means:
The thickness of the rack grounding cable must at least match
the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at least
match the thickness of the power cable from the xRAP to the
platform.
For more information, see Grounding Cables (page 4-24).

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Installing Ancillary Units in


Racks
Before starting, determine the ancillary units to be installed in the specific rack
by referring to the specific site installation plan, and note the exact position of
each unit (to prevent errors, it is recommended to mark the prescribed positions
on the rack rails using a soft pencil). The equipment installed in a rack may
include:

Rack Alarm Panel (RAP) (not needed when a user-provided power


distribution panel is used), located at the top of the rack.

FSTs and ODFs for connecting fibers to the rack.

One or more XDM shelves.

DDF units for tributary cables.

Heat buffers. A heat buffer must be installed between each pair of shelves
to minimize the transfer of heat from shelf to shelf. Note that the heat
buffer for XDM-1000, XDM-500, and XDM-2000 shelves occupies 70 mm
(approx. 2U or 2.7 in.). If more room is available, a larger heat buffer of
125 mm (approx. 3U or 5 in.) can be used. If there is not enough space for
a heat buffer, a buffer plate, which occupies 50 mm (approx. 1U or 2 in.),
must be installed.

Dispersion compensation units (DCF) used on long-haul links to


compensate for fiber dispersion.

Ethernet hubs for management access.

VoIP gateway and VoIP terminal (IP phone).

Other customer-provided equipment units.


CAUTION: When installing equipment in the rack, make sure
all optical connectors are closed by protective caps or springloaded covers. Do not remove the cap until an optical fiber is
connected to the corresponding connector.

In general, ancillary units are attached to the rack side rails by four M6 Philips
screws. No preparations are required before installation.
The following sections provide mechanical installation instructions for units
that require additional procedures. Skip sections that are not relevant to your
particular application.

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Installing the xRAP-D


NOTE: Skip this section if the xRAP-D is not used.

Before connecting DC power cables, refer to DC Power Cables (page 4-28).


The installation of an xRAP-D unit includes the following steps:
1. Prepare DC power cables.
2. Install the xRAP-D in the prescribed location, either at the top of the rack
or on the extendable installation rails.
3. Ground the xRAP-D to the rack grounding stud.
4. Connect DC input power cables to the xRAP-D. Depending on the site
power requirements, one of the following cable connections options should
be chosen:
a. In most configurations, either one or two standard (25mm2) input power
cables are connected to each side of the xRAP-D unit. This option is
described in Connecting DC Input Power Cables to the xRAP-D (page
4-49).
b. Alternatively, a single power input cable may be connected to the
xRAP-D using a bridge component. This option is described in
Connecting DC Input Power Cable to the xRAP-D with a Bridge
Component (page 4-53).
5. Attach protective covers to the sides and bottom of the xRAP-D unit.
(From V7.15 only, required for NEBS; optional for all others.)
6. Connect the DC power cables of the XDM-500 shelves to the xRAP-D.
7. Install circuit breakers.
8. Check DC voltage polarity.
9. Connect the alarm cables.
For a description of the xRAP-D, refer to the XDM-100 or XDM-1000 Product
Line Reference Manual.

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Preparing DC Input Power Cables


The DC input power cables connect between the two DC power sources and
the xRAP-D source A and source B inputs. When working with the xRAP-D,
four sets of cables are typically required, two for each source.
NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB) and
HD 308 S2:2001 (EU) standards, the positive lead (+48 V)
should be connected with a blue cable, and the negative lead
(-48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.

Before you start:


In the xRAP-D, two 25 mm2 power cables are typically used for each power
source. When working in the recommended redundant mode with all power
cables connected, the xRAP-D works with a full set of input power cables and
backup power cables. This option, illustrated in the following figure, is
described in Connecting DC Input Power Cables to the xRAP-D (page 4-49).

Figure 4-15: xRAP-D power supply flow

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Another power configuration option supported by the xRAP-D enables use of a


single power input cable to support either one or two XDM platforms. The
single power cable is connected to the xRAP-D using a bridge component. Two
variations of this option are illustrated in the following figure. This option is
described in Connecting DC Input Power Cable to the xRAP-D with a Bridge
Component (page 4-53).

Figure 4-16: xRAP-D power supply with bridge, two variations

NOTE: When necessary, the xRAP-D is able to work with


only a single 25 mm2 power cable from each power source.
This supplies enough power to support a single XDM
platform with 2250 W, or two XDM platforms where each
platform is limited to a maximum of 1100 W for per platform.
In many cases, this configuration is sufficient.
However, it is recommended, if at all possible, to connect all
input power cables from all power sources to the xRAP-D
unit upon the initial system installation. Connecting all cables
from the beginning is an easy step that greatly simplifies any
later system upgrades, since the power cables are already in
place and ready to supply power to a second XDM platform,
if the network configuration is ever changed.

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Each input power cable consists of two stranded copper leads with a cross
section of 25 (or 50) mm2, one red and the other black. Each lead is terminated
with a two-hole compression lug from the installation parts kit supplied with
the equipment.
If appropriate leads have already been prepared at the prescribed rack location,
make sure that the leads are not connected to any live voltage source before
attaching the lugs.
To prepare a DC power cable:
1. Strip about 22 mm of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. The recommended tools are Panduit CT-720
crimping tool with CD-720-2 die, Klauke K18 crimping tool with D50 die,
or equivalent.
4. Repeat Steps 1 to 3 for the black lead.
5. Repeat these steps for each DC power cable being used.
To install the xRAP-D:

Attach the xRAP-D to the rack side rails in the top position, and secure it
with the four screws, washers, and nuts supplied in the installation parts kit.

To ground the xRAP-D:


1. The xRAP-D grounding stud is located on its bottom cover. Use the
following figure of the xRAP-D to identify the grounding stud.
2. If necessary, prepare a grounding lead in accordance with the requirements
described in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the xRAP-D grounding
stud using a spring washer and nut.
4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.

Figure 4-17: Location of xRAP-D grounding stud

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Connecting DC Input Power Cables to the


xRAP-D
In the xRAP-D, two 25 mm2 power cables are typically used for each power
source. When working in the recommended redundant mode with all power
cables connected, the xRAP-D works with four sets of input power cables. This
typical configuration option is described in this section.

Figure 4-18: xRAP-D power supply flow

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NOTE: When necessary, the xRAP-D is able to work with


only a single 25 mm2 power cable from each power source.
This supplies enough power to support a single XDM
platform with 2250 W, or two XDM platforms where each
platform is limited to a maximum of 1100 W for per platform.
In many cases, this configuration is sufficient. The
instructions in this section apply to this configuration option
also. (This configuration option is only available from V7.2,
when the management software enforces limitations on
maximum power consumption.)
However, it is recommended, if at all possible, to connect all
input power cables from the power sources to the xRAP-D
unit upon the initial system installation. Connecting all cables
from the beginning is an easy step that greatly simplifies any
later system upgrades, since the power cables are already in
place and ready to supply power to a second XDM platform,
if the network configuration is ever changed.
Alternatively, a single power input cable supporting two
XDM platforms may be connected to the xRAP-D using a
bridge component. This option is described in Connecting DC
Input Power Cable to the xRAP-D with a Bridge Component
(page 4-53).

To connect DC input power cables to the xRAP-D:


1. Before starting, identify the openings used to route power cables to the
xRAP-D by referring to the following figure.

Figure 4-19: Identification of xRAP-D cable routes

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2. Open the two captive screws fastening the xRAP-D front cover and remove
the cover.
Identify the various terminals located on the power source terminal board in
accordance with the following figure. This figure shows the terminals at the
source A side (main); the same board is used at the source B side
(protection).
Note that there are two complete sets of power terminals and circuit
breakers on each side. Separate input power cables from the user's input
power supply feed through the two sets of input power terminals into the
two circuit breakers on the source A side, supplying independent power
sources for up to two XDM shelves. Each circuit breaker feeds into a
separate power output connection for the power cable that connects to the
XDM platform.
Similarly, separate input power cables from the user's input power supply
feed through separate input terminals into the two circuit breakers on the
source B side, and from the circuit breakers feed into the additional power
output connections that provide an optional protective backup power
supply for up to two XDM shelves.

Figure 4-20: Connecting DC power cables

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The preceding figure portrays the electrical connections on the left side of
the xRAP-D, the side that connects to the user's main power supply for the
XDM shelves being powered. The right side of the xRAP-D contains a
mirror image of the connections illustrated in the preceding figure. The
right side connects to the user's (optional) backup protective power supply
for the shelves.
CAUTION: Before connecting the power leads, make sure to

identify the terminal polarity on the xRAP-D power terminal


board.

3. Bring the two leads of one DC source input power cable to the appropriate
xRAP-D opening.
4. Attach the lug of the red lead to the positive stud terminals, marked (+) on
the power terminal board. Note that the xRAP-D works with two sets of
positive terminals, used with two 25 mm2 power cables.
5. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
6. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board. Note that the xRAP-D works with two sets of
negative terminals, used with two 25 mm2 power cables.
7. Repeat Step 6 for the black lead lug.
8. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
9. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-D (see To ground the xRAP-D (page 4-48)), and attach them to
the retainers with cable ties.

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Connecting DC Input Power Cable to the


xRAP-D with a Bridge Component
Users who prefer to work with a single power cable from their main power
supply (and optionally, a single power cable from the protective power supply)
can still work with a single cable if they either:

Work with a single 25 mm2 power cable to support a single XDM platform
only, with a maximum of 2250 W for that platform. This configuration
option is described in Connecting DC Input Power Cables to the xRAP-D
(page 4-49).

Work with a single 25 mm2 power cable to support two XDM platforms,
where each platform is limited to a maximum of 1100 W for per platform.
(Note that this configuration option is only available from V7.2, when the
management software enforces limitations on maximum power
consumption.) This configuration option requires the use of an optional
metal bridge component designed by ECI for this purpose.

Work with a single 50 mm2 power cable to support two XDM platforms,
with a maximum of 2250 W for each platform. This configuration option
requires the use of an optional metal bridge component designed by ECI
for this purpose.

Figure 4-21: xRAP-D power supply with bridge, two variations

This section describes the bridge-component configuration option.


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To connect DC input power cables to the xRAP-D using a


bridge component:
1. Before starting, identify the openings used to route power cables to the
xRAP-D by referring to the following figure.

Figure 4-22: Identification of xRAP-D cable routes

2. Open the two captive screws fastening the xRAP-D front cover and remove
the cover.
Identify the various terminals located on the power source terminal board in
accordance with the following figure. This figure shows the terminals at the
source A side (main); the same board is used at the source B side
(protection).
Note that there are two complete sets of power terminals and circuit
breakers on each side. Separate input power cables from the user's input
power supply feed through the two sets of input power terminals into the
two circuit breakers on the source A side, supplying independent power
sources for up to two XDM shelves. Each circuit breaker feeds into a
separate power output connection for the power cable that connects to the
XDM platform.

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Similarly, separate input power cables from the user's input power supply
feed through separate input terminals into the two circuit breakers on the
source B side, and from the circuit breakers feed into the additional power
output connections that provide an optional protective backup power
supply for up to two XDM shelves.

Figure 4-23: Connecting DC power cables

The preceding figure portrays the electrical connections on the left side of
the xRAP-D, the side that connects to the user's main power supply for the
XDM shelves being powered. The right side of the xRAP-D contains a
mirror image of the connections illustrated in the preceding figure. The
right side connects to the user's (optional) backup protective power supply
for the shelves.
CAUTION: Before connecting the power leads, make sure to

identify the terminal polarity on the xRAP-D power terminal


board.

3. Unscrew the washers that come already attached to the negative power
terminals.
4. Attach the metal bridge unit to the xRAP-D board by placing the openings
on the bridge unit over the screw posts of the negative power terminals of
the xRAP-D.

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5. Bring the two leads of one DC source input power cable to the appropriate
xRAP-D opening.
6. Attach the lug of the red lead to the positive input power stud terminals for
shelf 1, marked (+) on the power terminal board. Note that in this
configuration the xRAP-D works with one set of positive terminals, used
with one power cable. No cable is attached to the second set of positive
terminals.
7. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
8. Attach the lug of the black lead to the negative stud terminals on the back
of the bridge unit. Note that in this configuration the xRAP-D works with a
single set of negative terminals on the bridge unit, used with one power
cables.
9. Repeat Step 7 for the black lead lug.
10. If an additional backup power source (source B) is used, repeat Steps 3 to 9
for source B.
11. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-D (see To ground the xRAP-D (page 4-48)), and attach them to
the retainers with cable ties.

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Attaching Protective Covers


From V7.15 only, as required for NEBS. Optional for all others.
To attach protective covers on the xRAP-D:
1. From the open back end, look at the inside panel of the xRAP-D unit. Find
the four screws in the left and right sides of the power panel. The two
screws on the left side are highlighted in the following figure.

Figure 4-24: Side screws highlighted on left side of xRAP-D unit

2. Find the replacement spacer screws included in the protective cover kit.
Note that four replacement spacer screws are included with the xRAP-D. A
replacement spacer screw is illustrated in the following figure.

Figure 4-25: Replacement spacer screw

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3. Replace the side screws with the replacement spacer screws. The following
figure illustrates the inside of the xRAP-D unit, highlighting the left side
replacement spacer screws in place.

Figure 4-26: Replacement spacer screws in place in xRAP-D unit

4. Find the small L-shaped protective covers included in the kit. Four
protective covers are included for the xRAP-D. The protective covers are
illustrated in the following figure.

Figure 4-27: Protection cover for xRAP-D

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5. Place the protective covers into the xRAP-D, two covers on each side. For
each protective cover, the smaller hole fits onto the top of the spacer screw
on one side and the two larger holes are anchored on top of the two
terminals above the spacer screw. The jutting-out edge of the protective
cover fits into the opening on the edge of the xRAP next to the terminals.
The following figure illustrates protective covers inserted into the xRAP-D
unit.

Figure 4-28: xRAP-D protective covers in place

6. Secure the protective covers in place by screwing on the wing nuts supplied
in the kit onto the tops of the spacer screws on each side.
7. Find the protective bottom panel in the kit. The bottom panel for the
xRAP-D is illustrated in the following figure.

Figure 4-29: Bottom panel for xRAP-D

8. Secure the bottom panel into place with the four screws supplied in the kit.

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To connect the DC power cable for an XDM-500 platform:


1. Before starting, identify the platform power connectors on the xRAP-D
board in accordance with the following figure.

Figure 4-30: xRAP-D connectors

2. Insert the end of the DC power cable terminating with a 5-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector Shelf 1 (see preceding figure).
3. Fasten the screws of the D-type connector.
4. If you are connecting an additional platform to the xRAP-D, repeat the
above steps for the second platform. Note that a maximum of 55A is
supplied from the power sources to each XDM platform. Power is supplied
independently to each XDM platform connected to the xRAP unit. Power is
not shared between XDM platforms.
5. If an additional power source is used, repeat the above steps to connect the
shelves to source B.
6. Route the DC power cables towards the cable retainers at the rear of the
xRAP-D and attach them to the retainers with cable ties (see To ground the
xRAP-D (page 4-48)).
7. Route each platform power cable along the rack side rails down to the
corresponding platform position, and securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
NOTE: Connect the cables to the shelves only after

completing the installation of the shelves and all other


components.

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To install the xRAP-D circuit breakers:


1. If the xRAP-D front panel has not been removed, open the two captive
screws fastening the xRAP-D front cover to its chassis and remove the
cover (see the following figure).

Figure 4-31: Installation of xRAP-D circuit breakers

2. Identify the circuit breaker corresponding to the power circuit A of shelf 1


(the circuit breaker is included in the installation parts kit supplied with the
equipment); its rating is in accordance with the ordered platform
configuration.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-D source A power terminal board, as shown in the previous figure.
4. If an additional platform is powered from source A, repeat Steps 2 and 3 to
insert the other circuit breaker into the corresponding platform position of
the power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.

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To check the DC voltage polarity:


1. Connect the DC input power to the xRAP-D.
2. Set all xRAP-D circuit breakers to ON.
3. Use a digital multimeter (DMM) to test the voltage between the positive
and negative pins of each power cable.
CAUTION: Pay attention not to short-circuit the multimeter
leads when checking the voltage.

NOTE: The power cable terminates with a 3-pin (3W3), or a


5-pin (5W5) connector in accordance with the connected
XDM shelf. For a 3W3 connector the positive pin is A3 and
the negative pin A2; for a 5W5 connector the positive pins are
A4, A5, and the negative pins A2, A3.
4. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC)
and that it has the correct polarity.
5. Return all xRAP-D circuit breakers to OFF.
6. Disconnect the xRAP-D input power sources.
7. Reinstall the xRAP-D front cover and fasten it using the two captive
screws.
During the following procedure, refer to the figures illustrating the connectors
in Connecting DC Input Power Cables to the xRAP-D (page 4-49).
To connect the alarm cables to the xRAP-D:
1. Before starting, make sure you have all the necessary cables.
2. Connect the 68-pin SCSI connector of the facility alarm monitoring cable
to the ALARMS connector, and then securely attach the cable to the rack
inner wall using cable ties.
3. Connect the 36-pin SCSI connector of the alarm monitoring cable intended
for Shelf 1 to the Shelf 1 connector on the xRAP-D.
4. Route the alarm cables towards the cable retainers at the rear of the
xRAP-D (see the figure in To ground the xRAP-D (page 4-48)), and attach
them to the bracket with cable ties.
5. Route the alarm cables along the side of the rack down to the corresponding
platform position. Attach a tag to each connector in accordance with its
function.
6. If an additional platform is installed in the rack, repeat Steps 2, 3, 4, and 5
for the cables serving the additional platform. Make sure to attach
identification tags to each cable end.

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Installing the xRAP-B


NOTE: Skip this section if the xRAP-B is not used.

Before connecting DC power cables, refer to DC Power Cables (page 4-28).


The installation of an xRAP-B unit includes the following steps:
1. Prepare DC power cables.
2. Install the xRAP-B in the prescribed location, either at the top of the rack or
on the extendable installation rails.
3. Ground the xRAP-B to the rack grounding stud.
4. Connect DC input power cables to the xRAP-B.
5. Attach protective covers to the sides and bottom of the xRAP-B unit.
(From V7.15 only, required for NEBS; optional for all others.)
6. Connect the DC power cables of the XDM-500 shelves to the xRAP-B.
7. Install circuit breakers.
8. Check DC voltage polarity.
9. Connect the alarm cables.
For a description of the xRAP-B, refer to the XDM-100 or XDM-1000 Product
Line Reference Manual.
NOTE: The xRAP-B is no longer included in new XDM
deliveries (EOL). This information is included here if needed
for a current installation.
The DC input power cables connect between the two DC power sources and
the xRAP-B source A and source B inputs. When working with the xRAP-B,
two cables are required, one for each source.
NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB) and
HD 308 S2:2001 (EU) standards, the positive lead (+48 V)
should be connected with a blue cable and the negative lead
(-48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.

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Before you start:


In the xRAP-B, a single 50 mm2 cable is used for each power source. Since the
xRAP-B is designed for redundancy through the use of two power sources, this
means that when working in the recommended redundant mode, the xRAP-B
works with two input power cables.
Each input power cable consists of two stranded copper leads with a cross
section of 50 mm2, one red and the other black. Each lead is terminated with a
two-hole compression lug from the installation parts kit supplied with the
equipment.
If appropriate leads have already been prepared at the prescribed rack location,
make sure that the leads are not connected to any live voltage source before
attaching the lugs.
To prepare a DC power cable:
1. Strip about 22 mm of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. The recommended tools are Panduit CT-720
crimping tool with CD-720-2 die, Klauke K18 crimping tool with D50 die,
or equivalent.
4. Repeat Steps 1 to 3 for the black lead.
5. Repeat these steps for each DC power cable being used.
To install the xRAP-B:

Attach the xRAP-B to the rack side rails in the top position, and secure it
with the four screws, washers, and nuts supplied in the installation parts kit.

To ground the xRAP-B:


1. The xRAP-B grounding stud is located on its bottom cover. Use the
following figure of the xRAP-B to identify the grounding stud.
2. If necessary, prepare a grounding lead in accordance with the requirements
described in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the xRAP-B grounding
stud using a spring washer and nut.

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4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.

Figure 4-32: Location of xRAP-B grounding stud

To connect DC input power cables to the xRAP-B:


1. Before starting, identify the openings used to route power cables to the
xRAP-B by referring to the following figure.

Figure 4-33: Identification of xRAP-B cable routes

2. Open the two captive screws fastening the xRAP-B front cover and remove
the cover.

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Identify the various terminals located on the power source terminal board in
accordance with the following figures. These figures show the terminals at
the source A side; the same board is used at the source B side.

Figure 4-34: Connecting DC power cables

CAUTION: Before connecting the power leads, make sure to

identify the terminal polarity on the xRAP-B power terminal


board.

3. Bring the two leads of one DC source input power cable to the appropriate
xRAP-B opening.
4. Attach the lug of the red lead to the positive stud terminals, marked (+) on
the power terminal board. Note that the xRAP-B works with a single set of
positive terminals, used with a 50 mm2 power cable.
5. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
6. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board. Note that the xRAP-B works with a single set of
negative terminals, used with a 50 mm2 power cable.
7. Repeat Step 6 for the black lead lug.
8. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
9. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-B (see the figure in To ground the xRAP-B (page 4-64)), and
attach them to the retainers with cable ties.
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Attaching Protective Covers


From V7.15 only, as required for NEBS. Optional for all others.
To attach protective covers on the xRAP-B:
1. From the open back end, look at the inside panel of the xRAP-B unit. Find
the two screws in the center of the left and right sides of the power panel.
The screw on the left side is highlighted in the following figure.

Figure 4-35: Side screw highlighted on left side of the xRAP-B

2. Find the replacement spacer screws included in the protective cover kit.
Note that two replacement spacer screws are included with the xRAP-B. A
replacement spacer screw is illustrated in the following figure.

Figure 4-36: Replacement spacer screw

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3. Replace the side screws with the replacement spacer screws. The following
figure illustrates the inside of the xRAP-B unit, highlighting the left side
replacement spacer screw in place.

Figure 4-37: Replacement spacer screw in place in the xRAP-B

4. Find the small L-shaped protective covers included in the kit. Two
protective covers are included for use with the xRAP-B. The protective
covers are illustrated in the following figure.

Figure 4-38: Protective cover for xRAP-B

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5. Place the protective covers into the xRAP-B, placing one cover on each
side. For each protective cover, the smaller hole fits onto the top of the
spacer screw on one side and the two larger holes are anchored on top of
the two terminals above the spacer screw. The jutting-out edge of the
protective cover fits into the opening on the edge of the xRAP next to the
terminals. The following figure illustrates a protective cover inserted into
the xRAP-B unit.

Figure 4-39: xRAP-B protective cover in place

6. Secure the protective covers in place by screwing on the wing nuts supplied
in the kit onto the tops of the spacer screws on each side.

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7. Find the protective bottom panel in the kit. The bottom panel for the
xRAP-B is illustrated in the following figure.

Figure 4-40: Bottom panel for xRAP-B

8. Secure the bottom panel into place with the four screws supplied in the kit.
To connect the DC power cable for an XDM-500 platform:
1. Before starting, identify the platform power connectors on the xRAP-B
board in accordance with the following figures.

Figure 4-41: xRAP-B connectors

2. Insert the end of the DC power cable terminating with a 5-pin D-type male
connector near the SOURCE A power connectors and connect it to
connector Shelf 1 (see preceding figures).
3. Fasten the screws of the D-type connector.
4. If you are connecting an additional platform to the xRAP-B, repeat the
above steps for the second platform. Note that a maximum of 55A is
supplied from the power sources to each XDM platform. Power is supplied
independently to each XDM platform connected to the xRAP unit. Power is
not shared between XDM platforms.
5. If an additional power source is used, repeat the above steps to connect the
shelves to source B.
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6. Route the DC power cables towards the cable retainers at the rear of the
xRAP-B and attach them to the retainers with cable ties (see the figure in
To ground the xRAP-B (page 4-64)).
7. Route each platform power cable along the rack side rails down to the
corresponding platform position, and securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
NOTE: Connect the cables to the shelves only after

completing the installation of the shelves and all other


components.

To install the xRAP-B circuit breakers:


1. If the xRAP-B front panel has not been removed, open the two captive
screws fastening the xRAP-B front cover to its chassis and remove the
cover (see the following figure).

Figure 4-42: Installation of xRAP-B circuit breakers

2. Identify the circuit breaker corresponding to the power circuit A of shelf 1


(the circuit breaker is included in the installation parts kit supplied with the
equipment); its rating is in accordance with the ordered platform
configuration.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-B source A power terminal board, as shown in the previous figures.
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4. If an additional platform is powered from source A, repeat Steps 2 and 3 to


insert the other circuit breaker into the corresponding platform position of
the power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
To check the DC voltage polarity:
1. Connect the DC input power to the xRAP-B.
2. Set all xRAP-B circuit breakers to ON.
3. Use a digital multimeter (DMM) to test the voltage between the positive
and negative pins of each power cable.
CAUTION: Pay attention not to short-circuit the multimeter
leads when checking the voltage.

NOTE: The power cable terminates with a 3-pin (3W3), or a


5-pin (5W5) connector in accordance with the connected
XDM shelf. For a 3W3 connector the positive pin is A3 and
the negative pin A2; for a 5W5 connector the positive pins are
A4, A5, and the negative pins A2, A3.
4. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC)
and that it has the correct polarity.
5. Return all xRAP-B circuit breakers to OFF.
6. Disconnect the xRAP-B input power sources.
7. Reinstall the xRAP-B front cover and fasten it using the two captive
screws.
To connect the alarm cables to the xRAP-B:
Use the figures illustrating the xRAP-B connectors (in Connecting DC power
cables (page 4-66)) to identify the xRAP-B connector functions.
1. Before starting, make sure you have all the necessary cables.
2. Connect the 68-pin SCSI connector of the facility alarm monitoring cable
to the ALARMS connector, and then securely attach the cable to the rack
inner wall using cable ties.
3. Connect the 36-pin SCSI connector of the alarm monitoring cable intended
for Shelf 1 to the Shelf 1 connector on the xRAP-B.
4. Route the alarm cables towards the cable retainers at the rear of the
xRAP-B, (see figure in To ground the xRAP-B (page 4-64)), and attach
them to the bracket with cable ties.

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5. Route the alarm cables along the side of the rack down to the corresponding
platform position. Attach a tag to each connector in accordance with its
function.
6. If an additional platform is installed in the rack, repeat Steps 2, 3, 4, and 5
for the cables serving the additional platform. Make sure to attach
identification tags to each cable end.

Installing the xRAP-HP


NOTE: Skip this section if the xRAP-HP is not used.

Before connecting DC power cables refer to DC Power Cables (page 4-28).


For a description of the xRAP-HP, refer to the XDM-1000 Product Line
Reference Manual.
For Rev.C02, the input and output alarm lines are divided into two groups. The
first four alarms are assigned to the first XDM platform installed in the rack,
and the second four alarms are assigned to the second XDM platform installed
in the rack.
If you are using xRAP-HP units up to Rev.C01, alarm lines are allocated
through internal switch settings. This step, relevant only to this subset of
xRAP-HP units, is included in the following xRAP-HP installation instructions.
If you are using and xRAP-HP Rev.C02, skip the irrelevant step.
To install the xRAP-HP:
1. Check and/or change the internal switches that route alarm inputs and
outputs.
(Relevant for xRAP-HP units up to Rev.C01 only.)
2. Prepare DC power cables.
3. Install the xRAP-HP in the prescribed location: either at the top of the rack
or on the extendable installation rails.
4. Ground the xRAP-HP to the rack grounding stud.
5. Connect input DC power cables to the xRAP-HP.
6. Connect the DC power cables of the XDM shelves to the xRAP-HP.
7. Install circuit breakers.
8. Check power wiring.
9. Connect the alarm cables.

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NOTE: The xRAP-HP is no longer included in new XDM


deliveries (EOL). This information is included here if needed
for a current installation.

Checking and/or Changing Slide Switch


Settings
NOTE: Skip this section if the xRAP-HP Rev.C02 is used.

The slide switches, located on the rear side of the xRAP-HP, are used to route
the facility alarm lines to the alarm input and output lines of the XDM shelves
installed in the rack.
Before you start:
When the xRAP-HP is shipped, the switches are already set to meet the site
planning specifications. Use the following procedure to check the settings
before installing the xRAP-HP, and/or change the settings in accordance with
the current requirements.

Figure 4-43: xRAP-HP slide switches

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To check and/or change slide switch settings:


1. Identify the four slide switches, designated 1&2, 3&4, 5&6, and 7&8, and
their positions, referring to the previous figure. Use the table to identify the
required switch settings, for example:

Setting switches 1&2 and 3&4 to position 1 connects the inputs and
outputs 1 through 4 in the CONTROL CONNECTION connector to
inputs and outputs 1 through 4 in the EXTERNAL
ALARM/CONTROL SHELF 1 connector.
Setting switch 5&6 to position 2 connects the inputs and outputs 5 and
6 in the CONTROL CONNECTION connector to the inputs and
outputs with the same numbers in the EXTERNAL
ALARM/CONTROL SHELF 2 connector.

Setting switch 7&8 to position 3 connects the inputs and outputs 7 and
8 in the CONTROL CONNECTION connector to the inputs and
outputs with the same numbers in the EXTERNAL
ALARM/CONTROL SHELF 3 connector.
2. Check the slide switch settings and verify that they meet the site planning
specifications.
3. If required, change the switch settings to the required position.

Table 4-8:

xRAP input and output alarm allocation

Slide switch

Input and output lines in


CONTROL CONNECTION

Switch
position

SHELF
connector

1&2

1, 2

SHELF 1

SHELF 2

SHELF 3

SHELF 1

SHELF 2

SHELF 3

SHELF 1

SHELF 2

SHELF 3

SHELF 1

SHELF 2

SHELF 3

3&4

5&6

7&8

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3, 4

5, 6

7, 8

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Preparing DC Input Power Cables


NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB), and
HD 308 S2:2001 (EU) standards the positive lead (+48 V)
should be connected with a blue cable, and the negative lead
(-48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.

The DC input power cables connect the two DC power sources and the
xRAP-HP source A and source B inputs. Two cables are required, one for each
source. Each cable consists of two stranded copper leads with a cross section of
50 mm2 (.078 in.2), one red and the other black. Each lead is terminated with a
two-hole compression lug from the installation parts kit supplied with the
equipment.
NOTE: When the xRAP-HP provides power to a single XDM
shelf, lower gauge cables may be used. Refer to DC Power
Cables (page 4-28) for DC power cable requirements.
CAUTION: If appropriate leads have already been prepared

at the prescribed rack location, before attaching the lugs make


sure that the leads are not connected to any live voltage
source.

To prepare a DC power cable:


1. Strip about 22 mm (1 in.) of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. The recommended tools are Panduit CT-720
crimping tool with CD-720-2 die, Klauke K18 crimping tool with D50 die,
or equivalent.
It is recommended to use insulation tape (of same color as the lead jacket)
between the cable lug and the cable itself.
4. Repeat Steps 1 to 3 above for the black lead.

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Installing the xRAP-HP


The xRAP-HP is attached either to the rack side rails in the top position of the
rack or on the extendable installation rails.
To install the xRAP-HP:

Attach the xRAP-HP to the side rails and secure it with the four screws,
washers, and nuts supplied in the installation parts kit.

To ground the xRAP-HP:


1. The xRAP-HP grounding stud is located on its bottom cover. Use the
following figure to identify it.
2. If necessary, prepare a grounding lead in accordance with the requirements
described in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the xRAP-HP
grounding stud using a spring washer and nut.
4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.

Figure 4-44: Location of xRAP-HP grounding stud

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To connect DC input power cables to the xRAP-HP:


1. Before starting, identify the openings used to route power cables to the
xRAP-HP by referring to the following figure.

Figure 4-45: Identification of xRAP-HP cable routes

2. Open the two captive screws fastening the xRAP-HP front cover and
remove the cover.
3. Identify the various terminals located on the power source terminal board
by referring to the following figure (shows the terminals at the source A
side; the same board is used at the source B side).

Figure 4-46: Connecting DC power cables to the xRAP-HP

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CAUTION: Before connecting the power leads, make sure to

identify the terminal polarity on the xRAP-HP power terminal


board.

4. Bring the two leads of one DC source input power cable to the appropriate
xRAP-HP opening.
5. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board (see the previous figure).
6. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 1150 N cm to 1300 N cm.
7. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board (see the previous figure).
8. Repeat Step 5 for the black lead lug.
9. If an additional power source (source B) is used, repeat Steps 3 to 8 for
source B.
10. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-HP (see figure in To Ground the xRAP-HP (page 4-77)), and
attach them to the retainers with cable ties.
11. Securely attach the DC input power cables to the rack inner wall using
cable ties.
During the following procedure, refer to the figures illustrating the connectors
in To connect DC input power cables to the xRAP-HP (page 4-78).
To connect the DC power cable for a platform:
1. Before starting, identify the openings used to route power cables to the
xRAP-HP.
2. Insert the DC power cable end terminated in lugs of one XDM platform
through the source A xRAP-HP opening. If two shelves are installed in the
rack, start by connecting the shelf 1 cable.
3. Attach the red lead lug of the platform power cable to the positive stud
terminal of shelf 1 on the power terminal board.
4. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 800 N cm to 870 N cm.
5. Attach the black lead lug of the power cable to the negative stud terminal of
shelf 1 on the power terminal board.
6. Repeat Step 3 for the black lead lug.
7. Attach the grounding (shield) lead lug of the platform power cable to the
ground stud terminal located on the xRAP-HP side panel.
8. Repeat Step 3 for the grounding lead lug.
9. If a second XDM platform is installed in the rack, repeat Steps 2 to 7 for
the shelf 2 power cable.

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10. If an additional power source is used, repeat Steps 2 to 8 to connect the


shelves to source B.
11. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-HP (see figure in To Ground the xRAP-HP (page 4-77)), and
attach them to the retainers with cable ties.
12. Route each platform power cable along the rack side rails down to the
corresponding platform position, and then securely attach the power cable
to the rack inner wall using cable ties. Attach a tag to each power connector
in accordance with its function.
To install the xRAP-HP circuit breakers:
1. If the xRAP-HP front panel has not been removed, open the two captive
screws fastening the xRAP-HP front cover to the xRAP-HP chassis and
remove the cover (see the following figure).

Figure 4-47: xRAP-HP circuit breakers installation

2. Identify the circuit breaker corresponding to the power circuit A of shelf 1


(the circuit breaker is included in the installation parts kit supplied with the
equipment); its rating is in accordance with the ordered platform
configuration.
3. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-HP source A power terminal board, as shown in the previous figure.
4. If two shelves are powered from source A, repeat Steps 2 and 3 to insert the
second circuit breaker into the shelf 2 position of the power terminal board.
5. If an additional power source is used, repeat Steps 2, 3, and 4 above for
source B circuit breakers.

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To check DC voltage polarity:


1. Make sure the correct site grounding test (see Checking site grounding
wiring (page 5-10)) has been passed successfully.
2. Connect the DC input power to the xRAP-HP.
3. Set all the xRAP-HP circuit breakers to ON.
4. Use a digital multimeter (DMM) to test the voltage between the positive
and negative contacts of each power cable.
The following figure identifies the functions of the power cable connector
contacts, as seen when looking into the connector.

Figure 4-48: DC input power connectors pin functions

5. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC),
and that it has the correct polarity.
6. Return all the xRAP-HP circuit breakers to OFF.
7. Disconnect the xRAP-HP input power sources.
8. Reinstall the xRAP-HP front cover and fasten it using the two captive
screws.
To connect the alarm cables to the xRAP-HP:
1. Before starting, make sure you have all the necessary cables.
2. Refer to the figure in To connect DC input power cables to the xRAP-HP
(page 4-78) to identify the xRAP-HP connector functions.
3. Connect the 50-pin D-type connector of the facility alarm monitoring cable
to the xRAP-HP CONTROL CONNECTION connector, and then securely
attach the cable to the rack inner wall using cable ties.
4. Connect the 25-pin connector of the alarm monitoring cable for shelf 1 to
the xRAP-HP EXTERNAL ALARM/CONTROL SHELF 1 connector.
5. Connect the 9-pin D-type connector of the alarms indications cable for
shelf 1 to the xRAP-HP RAP SHELF 1 connector.

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6. Route the two cables along the side of the rack down to the corresponding
shelf position. Attach a tag to each connector in accordance with its
function.
7. If you are installing additional shelves in the rack, repeat Steps 2, 3, 4, and
5 for the cables serving them. Make sure to attach identification tags to
each cable end.

Installing the xRAP-100


NOTE: Skip this section if the xRAP-100 is not used.

Before connecting DC power cables refer to DC Power Cables (page 4-28).


The installation of an xRAP-100 unit consists of the following steps:
1. Prepare DC power cables.
2. Install the xRAP-100 in the prescribed location: either at the top of the rack
or on the extendable installation rails.
3. Ground the xRAP-100 to the rack grounding stud.
4. Connect DC input power cables to the xRAP-100.
5. Connect the DC power cables of the XDM shelves to the xRAP-100.
6. Install circuit breakers.
7. Check power wiring.
8. Connect the alarm cables.
For a description of the xRAP-100, refer to the XDM-1000 Product Line
Reference Manual.

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Preparing a DC Power Cable for xRAP-100


NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB), and
HD 308 S2:2001 (EU) standards the positive lead (+48 V)
should be connected with a blue cable, and the negative lead
(-48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.

The DC input power cables connect between the two DC power sources and
the xRAP-100 source A and source B inputs. Two cables are required, one for
each source.
Each cable consists of two stranded copper leads with a cross section of
35 mm2 (.055 in.2), one red and the other black. Each lead is terminated with a
two-hole compression lug from the installation parts kit supplied with the
equipment.
CAUTION: If appropriate leads have already been prepared

at the prescribed rack location, before attaching the lugs make


sure that the leads are not connected to any live voltage
source.

To prepare a DC power cable for xRAP-100:


1. Strip about 22 mm (1 in.) of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. The recommended tools are Panduit CT-720
crimping tool with CD-720-2 die, Klauke K18 crimping tool with D50 die,
or equivalent.
4. Repeat Steps 1 to 3 for the black lead.
To install the xRAP-100:

Attach the xRAP-100 to the rack side rails in the top position and secure it
with the four screws, washers, and nuts supplied in the installation parts kit.

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To ground the xRAP-100:


1. Use the following figure to identify the xRAP-100 grounding stud that is
located on its bottom cover.

Figure 4-49: Location of xRAP-100 grounding stud

2. If necessary, prepare a grounding lead in accordance with the requirements


of Equipment Grounding Requirements (page 1-10).
3. Connect the lug at one end of the grounding lead to the xRAP-100
grounding stud using a spring washer and nut.
4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.

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Connecting the DC Input Power Cables to


the xRAP-100
Before you start:
Before starting, identify the openings used to route power cables to the
xRAP-100.
To connect DC input power cables to the xRAP-100:
1. Open the two captive screws fastening the xRAP-100 front cover and
remove the cover.

Figure 4-50: Identification of xRAP-100 cable routes

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2. Identify the various terminals located on the power source terminal boards
in accordance with the following figure. This figure shows the terminals at
the source A side; the same board is used at the source B side.

Figure 4-51: Connecting DC power cables to the xRAP-100

CAUTION: Before starting the connection of the power


leads, make sure to identify the terminal polarity on the
xRAP-100 power terminal board.

3. Bring the two leads of one DC source input power cable to the appropriate
xRAP-100 opening.
4. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board.
5. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
6. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminals board.
7. Repeat Step 5 for the black lead lug.
8. If an additional power source (source B) is used, repeat Steps 3 to 7 above
for source B.
9. Route the DC input power cables towards the cable retainers at the rear of
the xRAP-100, and attach them to the bracket with cable ties.
10. Securely attach the DC input power cables to the rack inner wall using
cable ties.
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Connecting the DC Power Cable for an XDM


Platform
Before you start:
Before starting, identify the platform power connectors on the xRAP-100 board
in accordance with the following figure.

Figure 4-52: xRAP-100 connector identification

To connect the DC power cable for an XDM platform:


1. Insert the end of the DC power cable near the SOURCE A power
connectors and connect it to the prescribed SHELF power connector (see
previous figure).
CAUTION: The only connector that should be used to

connect power from the xRAP-100 to an XDM-1000 or


XDM-2000 platform is the 5-pin SHELF 4 connector. Other
shelves can be connected with either a 5-pin or 3-pin D-type
connector.

WARNING: It is strictly forbidden to simultaneously connect


two XDM shelves to the same SHELF 4 power connector.

2. Fasten the screws of the D-type connector.


3. If you are connecting additional shelves to the xRAP-100, repeat the above
steps for each platform.

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4. If an additional power source is used, repeat the above steps to connect the
shelves to source B.
5. Route the DC power cables towards the cable retainers at the rear of the
xRAP-100, and attach them to the retainers with cable ties.
6. Route each platform power cable along the rack side rails down to the
corresponding platform position, then securely attach the power cable to the
rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
NOTE: Connect the cables to the shelves only after

completing the installation of the shelves and all other


components.

Installing the xRAP-100 Circuit Breakers


Before you start:
If the xRAP-100 front panel has not been removed, open the two captive
screws fastening the xRAP-100 front cover to its chassis and remove the cover
(see the following figure).

Figure 4-53: xRAP-100 circuit breakers installation

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To install the xRAP-100 circuit breakers:


1. Identify the circuit breaker corresponding to the power circuit A of shelf 1
(the circuit breaker is included in the installation kit supplied with the
equipment); its rating is in accordance with the ordered platform
configuration.
2. Insert the circuit breaker into the circuit breaker sockets located on the
xRAP-100 source A power terminal board, as shown in the previous figure.
3. If more than one platform is powered from source A, repeat Steps 2 and 3
to insert the other circuit breaker into the corresponding platform position
of the power terminal board.
4. If an additional power source is used, repeat Steps 2, 3, and 4 for source B
circuit breakers.
To check the DC voltage polarity:
1. Make sure the correct site grounding test (see Checking site grounding
wiring (page 5-10)) has been passed successfully.
2. Connect the DC input power to the xRAP-100.
3. Set all xRAP-100 circuit breakers to ON.
4. Use a digital multimeter (DMM) to test the voltage between the positive
(A3) and negative (A2) pins of each power cable.
5. Make sure the voltage is within the allowed range (-40 VDC to -72 VDC),
and that it has the correct polarity.
6. Return all xRAP-100 circuit breakers to OFF.
7. Disconnect the xRAP-100 input power sources.
8. Reinstall the xRAP-100 front cover and fasten it with the two captive
screws.

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Connecting Alarm Cables to the xRAP-100


Before you start:
1. Make sure you have all the necessary cables.
2. Use the figure in Connecting the DC Power Cable for an XDM Platform
(page 4-87) to identify the xRAP-100 connector functions.
To connect alarm cables to the xRAP-100:
1. Connect the 68-pin SCSI connector of the facility alarm monitoring cable
to the ALARM IN/OUT connector, and then securely attach the cable to the
rack inner wall using cable ties.
2. Connect the 36-pin SCSI connector of the alarm monitoring cable intended
for shelf 1 to the SHELF 1 connector on the xRAP-100.
3. Route the alarm cables towards the cable retainers at the rear of the
xRAP-100 and attach them to the retainers with cable ties.
4. Route the alarm cables along the side of the rack down to the corresponding
platform position. Attach a tag to each connector in accordance with its
function.
5. If additional shelves are installed in the rack, repeat Steps 2, 3, and 4 for the
cables serving the additional shelves. Make sure to attach identification tags
to each cable end.

Installing the miniRAP


Before connecting DC power cables, refer to DC Power Cables (page 4-28).
The installation of a miniRAP consists of the following steps carried out in this
order:
1. Prepare DC power cables.
2. Install the miniRAP in the prescribed location, either at the top of the rack
or on the extendable installation rails.
3. Ground the miniRAP to the rack grounding stud.
4. Connect DC input power cables to the miniRAP.
5. Connect the DC power cables of the XDM-500 shelf to the miniRAP.
6. Install the circuit breakers.
7. Check the DC voltage polarity.
8. Connect the alarm cables.
For a description of the miniRAP, refer to the XDM-100 or XDM-1000
Product Line Reference Manual.

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Preparing the DC Power Cables


Before you start:
The DC input power cables connect the two DC power sources to the miniRAP
source A and source B inputs. Two cables are required, one for each source.
NOTE: According to accepted industry standards for

connecting DC power, the positive lead (+48 V) should be


connected with a red cable, and the negative lead (-48 V) with
a black cable. However, according to the BS7671 (GB) and
HD 308 S2:2001 (EU) standards, the positive lead (+48 V)
should be connected with a blue cable and the negative lead (48 V) with a gray cable. In the following sections that
describe DC power cable connections, use cables with
appropriate colors to comply with the standards in your area
of residence.

Each cable consists of two stranded copper leads with a cross section of
35 mm2 (.055 in.2), one red and the other black. Each lead terminates with a
two-hole compression lug from the installation parts kit supplied with the
equipment.
CAUTION: If appropriate leads have already been prepared

at the prescribed rack location, make sure that the leads are
not connected to any live voltage source before attaching the
lugs. If appropriate leads have already been prepared at the
prescribed rack location, make sure that the leads are not
connected to any live voltage source before attaching the lugs.

To prepare the DC power cables:


1. Strip about 22 mm (.9 in.) of the red lead jacket.
2. Insert all the lead strands into the lug sleeve.
3. Press at two or three different points on the lug sleeve using an appropriate
crimping tool and die. (The recommended tools are Panduit CT-720 with
CD-720-2 die, Klauke K18 with D50 die, or equivalent.)
4. Repeat Steps 1 to 3 for the black lead.
To attach the miniRAP to the rack:

Attach the miniRAP to the rack side rails in the top position of the rack,
and secure it with the four screws, washers, and nuts supplied in the
installation parts kit.

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To ground the miniRAP:


1. Use the following figure to identify the miniRAP grounding stud, which is
located on its bottom cover.

Figure 4-54: Location of miniRAP grounding stud

2. If necessary, prepare a grounding lead in accordance with the requirements


in Grounding Requirements (page 1-7).
3. Connect the lug at one end of the grounding lead to the miniRAP
grounding stud using a spring washer and nut.
4. Connect the lug at the other end of the grounding lead to the rack
grounding stud.

Connecting DC Input Power Cables to the


miniRAP
Before you start:
Identify the openings used to route power cables to the miniRAP by referring
to the following figure.

Figure 4-55: Identification of miniRAP cable routes

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To connect DC input power cables to the miniRAP:


1. Open the two captive screws fastening the miniRAP front cover and
remove the cover.
2. Identify the various terminals located on the power source terminal board
by referring to the following figure. This figure shows the terminals at the
source A side; the same board is used at the source B side.

Figure 4-56: Connecting DC power cables to the miniRAP

CAUTION: Before you start connecting the power leads,

make sure to identify the terminal polarity on the miniRAP


power terminal board.

3. Bring the two leads of one DC source input power cable to the appropriate
miniRAP opening.
4. Attach the lug of the red lead to the positive stud terminal marked (+) on
the power terminal board (see the previous figure).
5. Secure the lug using a flat washer, a spring washer, and a nut. Tighten the
nut with a torque of 450 N cm to 550 N cm.
6. Attach the lug of the black lead to the negative stud terminal marked (-) on
the power terminal board (see the previous figure).
7. Repeat Step 5 for the black lead lug.
8. If you are using an additional power source (source B), repeat Steps 2 to 7
for source B.
9. Route the DC input power cables towards the cable supports at the rear of
the miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
attach them to the supports with cable ties.

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Connecting the DC Power Cable


Before you start:
Identify the openings used to route power cables to the miniRAP by referring
to figure Identification of miniRAP cable routes (page 4-92).
To connect the DC power cable for the shelf:
1. Insert the end of the DC power cable terminating with a male 3-pin D-type
connector near the SOURCE A power terminals and connect it to the shelf's
power connector (see the following figure).

Figure 4-57: miniRAP connectors

2. Fasten the screws of the D-type connector.


3. If you are using an additional power source, repeat the above steps to
connect the shelf to source B.
4. Route the DC power cables towards the cable supports at the rear of the
miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
attach them to the supports with cable ties.
5. Route each shelf power cable along the rack side rails down to the
corresponding shelf position, and then securely attach the power cable to
the rack inner wall using cable ties. Attach a tag to each power connector in
accordance with its function.
NOTE: Connect the cables to the shelf only after installing it
and all other components.

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To install the miniRAP circuit breakers:


1. If the miniRAP front panel has not been removed, open the two captive
screws fastening the miniRAP front cover to its chassis and remove the
cover (see the following figure).

Figure 4-58: Installing miniRAP circuit breakers

2. Identify the circuit breaker corresponding to the shelf's power circuit A.


The circuit breaker is included in the installation parts kit supplied with the
equipment, and its rating corresponds to the ordered shelf configuration.
3. Insert the circuit breaker into the circuit breaker sockets located on the
miniRAP source A power terminal board, as shown in the previous figure.
4. If you are using an additional power source, repeat Steps 2 and 3 for source
B circuit breaker.
To check the DC voltage polarity:
1. Connect the DC input power cable to the miniRAP.
2. Set all miniRAP circuit breakers to ON.
3. Use a digital multimeter (DMM) to test the voltage between the positive
(pin A3) and negative (pin A2) pins of each power cable.
4. Make sure the voltage is within the allowed range (-40 VDC to -75 VDC)
and that it has the correct polarity.
5. Return all miniRAP circuit breakers to OFF.
6. Disconnect the miniRAP input power sources.
7. Reinstall the miniRAP front cover and fasten it using the two captive
screws.

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Connecting the Alarm Cables to the miniRAP


Before you start:
Refer to the miniRAP connectors (page A-24) to identify their functions, and
make sure you have all the necessary cables.
To connect the alarm cables to the miniRAP:
1. Connect the 26-pin SCSI connector carrying the shelf's severity alarms to
the miniRAP SEVERITY IN connector.
2. Connect the 26-pin SCSI connector of the client's facility severity alarms
monitoring cable to the miniRAP SEVERITY OUT connector.
3. Route the alarm cables towards the cable supports at the rear of the
miniRAP (see Location of miniRAP grounding stud (page 4-92)), and
attach them to the supports with cable ties.
4. Route the alarm cables along the side of the rack down to the corresponding
shelf position. Attach a tag to each connector in accordance with its
function.

Installing the FST


The installation of an FST unit consists of the following steps:
To mount the FST on the rack:
1. Attach the FST to the rack rails and secure it using the four supplied
screws, washers, and nuts.
2. Prepare the necessary fibers according to the site cabling diagram and the
detailed cabling diagrams or tables of each platform. When preparing the
fiber, refer also to the safety information appearing in Before You
Start/Safety Guidelines (page 1-1).
3. Label the cables in accordance with the cabling diagrams or tables.
4. Thread the optical fibers into the conduits running along the front supports
of the ECI's recommended rack.
5. Push the front panel of the FST to release the latch, and then pull the FST
towards you to open it.
NOTE: The FST has two opening positions. The tray latches
with a click at the halfway position. Pull it again to open it
fully so that you can thread the fibers.

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6. Thread the fibers into the FST, as illustrated in the following figure.

Figure 4-59: Threading optical fibers in the FST

7. Run the fibers up to the level of the corresponding optical connector.


8. Return the FST to the rack until it latches in place with a click.
CAUTION: Make sure that all the optical connectors are

closed at all times with the appropriate protective caps or with


the mating cable connector. Do not remove the protective cap
until an optical fiber is connected to the corresponding
connector, and immediately install a protective cap after a
cable is disconnected.
The minimum bending radius of optical fibers is 35 mm
(1.4 in.). Sharp bending of fibers may degrade the optical
transmission characteristics.

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Installing the ODF


Identify the prescribed ODF locations in the rack before performing the
following procedures.
The ODF is supplied with two sets of rack mount brackets: one for 19 in. and
ETSI racks, and the other for 23 in. 7 ft. racks. The 19 in./ETSI rack mount
brackets can be used for both ETSI and 19 in. racks.
To attach the rack mount brackets to the ODF:
1. Refer to the following figure to identify the required set of rack mount
brackets.
2. Attach each bracket with three screws to the corresponding ODF side
panel, as shown in the figure.

Figure 4-60: Attaching rack mount brackets to the ODF

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To connect optical fibers to the ODF:


1. Push the release button on the ODF front panel to the left to release the
latch and pull it towards you. The cover opens downwards.

Figure 4-61: ODF front panel

Figure 4-62: ODF open view

2. Hold the end of the swing-out tray and pull it out to gain access to the ODF
components.
3. Open the two cover thumb nuts and remove the protective cover from the
ODF splice support.

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4. Insert the external fibers cable through the protective tube.

Figure 4-63: ODF fiber routes

5. Route the fiber ends through the cable guides to the splice support area.
6. Identify the adapter panel pigtail to be spliced to each user fiber.
7. Insert splicing sleeves over the pigtail, splice the user fiber to the pigtail,
and slide the splicing sleeve over the splice.
8. Place the splicing sleeve in one of the slots in the splice support.
NOTE: When more than 12 fibers are connected to the ODF,

first start filling the slots of the lower splice support. After the
slots are occupied, reinstall the top splice support and
continue filling the support slots.

9. After splicing all the fibers, reinstall the protective cover removed in Step
3.
10. Push the swing-out tray back into the unit.
11. Close the ODF front cover by pushing it up till it clicks to the unit.
12. Refer to Attaching rack mount brackets (page 4-98) and secure the user
fibers with cable ties to the fiber-fastening bracket at the rear of the ODF.
CAUTION: To prevent damage to fibers, do not tighten the
cable ties.

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To install ODF units in a rack:

Install each ODF in the prescribed rack position and fasten it to the rack
side rails with four screws.

Installing DDF Units


The Digital Distribution Frame (DDF) is supplied with two sets of rack mount
brackets: one for 19 in. racks, and the other for ETSI racks.
To install the DDF units:
1. Attach the appropriate brackets to each DDF as explained for the ODF in
Installing the ODF (page 4-98).
2. Install the DDF units in the prescribed rack positions. Each DDF is
fastened to the rack side rails by four screws.
Each DDF has openings on its sidewalls for routing the cables to be
connected to its panel. Therefore, it is not necessary to leave free space
between stacked DDF units.

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5
XDM-500 Platform
Installation
In this chapter:
Overview ......................................................................................................... 5-1
Assembling the XDM Platform in a Rack ....................................................... 5-2
Installing Air Filters......................................................................................... 5-6
Connecting Power and Rack Alarm Cables to the Platforms ........................ 5-10

Overview
This section provides installation instructions for the XDM-200, XDM-500,
XDM-1000, and XDM-2000 platforms. As a standard, XDM platforms are
supplied with the INF, FCU, and ECB already installed. Therefore, the
installation activities covered in this section include:
1. Assembling an XDM platform in a rack.
2. Grounding.
3. Installing air filters in the platform.
4. Installing xMCP and MECP cards in the XDM platform.
5. Connecting power and rack alarm cables to the platform.
6. Installing heat buffers and cable guides (when relevant).
Once you have performed these activities, the XDM platform is ready for the
installation of the prescribed cards and modules. The platform front door will
be installed only after completing the installation of cards and modules, and
after connecting cables to the cards cage.

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WARNING: Before starting, make sure that the DC power is

not connected to the rack, and that the circuit breakers in the
xRAP or in the user-provided power distribution panel are set
to OFF.

CAUTION: Before installing the XDM platform, visually

inspect the pins of the backplane connectors for bent pins and
any other signs of physical damage. Do not install the
platform if connector pins are bent or touching, as this may
cause severe damage to the backplane.

Assembling the XDM Platform in


a Rack
Before you start:
NOTE: A dedicated installation kit (the US installation kit) is
needed for installing XDM platforms in 19 in. racks.

To assemble the XDM platform in the rack:


1. Identify the prescribed position of the XDM platform in the rack based on
the rack installation plan.
CAUTION: When installing the XDM platform at the bottom
of the rack, leave sufficient free space below the platform.
The minimum required space is obtained when you skip two
mounting holes from the bottom of the rack.

2. Locate the cage nut holes in the rack frame. The cage nut holes appear at
intervals running up and down the front of the two sides of the rack frame.
Cage nut holes are used to hold the cage nuts with which the different
accessories are attached to the rack frame.
3. Insert cage nuts into the holes located at intervals along the length of the
rack frame, on both sides of the rack. Install cage nuts in the holes at the
correct height for the equipment being installed in the rack, based on your
specific equipment installation plan.

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4. Obtain help from an additional person to place the XDM platform in its
prescribed position, and then insert the platform guide posts in the
matching holes in the rack side rails. This will help keep the platform in
position until fastened to the rack with the screws.
5. Have the other person hold the XDM platform in place, and fasten the
platform to the rack side rails with four M6 screws, washers, and nuts.
6. Repeat Steps 1 and 2 above for each platform to be installed in the rack
(when relevant).

Grounding the Platform


Before you start:
1. Review the instructions in Grounding Requirements (page 1-7) and
Grounding Cables (page 4-24).
2. Obtain the required materials and make sure to perform the grounding
connections according to these requirements.
NOTE: The information presented below is illustrated by
means of an XDM platform in a rack with an ECI xRAP unit.
If a user-provided power distribution panel is used, it is the
user's responsibility to meet the grounding requirements in
accordance with the instructions given below.
WARNINGS:

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To prevent possible damage to XDM equipment, all racks


and equipment must be completely grounded before
connecting to the platform any external devices powered
from any DC or AC source (100-230 V). All grounding
procedures described here must be completed before, for
example, connecting an external PC to configure and
initialize the NE management system.
The thickness of the protecting grounding cable must be at
least the same thickness as the corresponding power cable.
This means:
The thickness of the rack grounding cable must at least
match the thickness of the xRAP power cable.
The thickness of the platform grounding cable must at
least match the thickness of the power cable from the
xRAP to the platform.
For more information, see Grounding Cables (page 4-24).

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To ground the connections:


1. Verify that the rack and xRAP are grounded correctly, as described in
Grounding the Rack (page 4-42) and the relevant grounding section in
Installing Ancillary Units in Racks (page 4-44).
2. For each XDM platform installed in the rack, prepare a 50 mm2 grounding
cable according to the instructions in Grounding Cables (page 4-24).
The grounding cable nuts, washers, lugs, and bolts are all included with the
XDM platform. These accessories are delivered attached to the
corresponding grounding points. Remove the parts as needed from the
grounding points. Attach the lugs to the cable ends, in accordance with the
instructions in Grounding Cables (page 4-24).
3. Connect the lug at the end of the grounding cable to one of the pairs of
grounding points on the right side of the rack grounding bar. To secure the
grounding cable lug to the grounding bar, hold the two holes in the cable
lug against the two grounding points on the bar and place the flat washers
above the cable lug, followed by the serrated lock washers. Screw in the
bolts to hold everything in place. Tighten the bolts with a torque of 450 N
cm to 550 N cm.
4. Run the platform grounding cable from the rack grounding bar to the right
side of the rack.
5. Thread the grounding cable through an opening into the cable conduit. The
cables should now run down the right side of the rack.
6. Draw the grounding cable out of the cable conduit by gently threading it
through one of the openings level with the grounding studs on the XDM
platform.

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7. Connect the lug at the free end of the grounding cable to the grounding
studs on the platform. Note that the lug at the end of the grounding cable
must be inserted over both grounding studs.

Figure 5-1: XDM shelf and rack grounding (NEBS-compliant)

8. Secure each lug connection using the flat washer, serrated lock washer, and
nut. Tighten the nuts with a torque of 450 N cm to 550 N cm.

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Installing Air Filters


This section describes the air filters offered by ECI and provides instructions
for installing them.
Air filters are available as an ordering option for XDM-500 platforms. They
can also be separately ordered for installation on platforms at customers
premises.
The purpose of the air filter is to reduce the accumulation on the internal
components of dust and dirt carried by the cooling air flowing through the
platforms. The combination of dust and humidity produces a
capacitive/conductive layer between components installed on cards that may
degrade equipment performance or even cause malfunctions. Moreover, the
insulating effect of a dust layer causes components to operate at higher
temperatures, and this may decrease equipment reliability.
An air filter reduces dirt accumulation preventing degradation of equipment
reliability and performance. On the other hand, filters increase the resistance to
airflow, and therefore the appropriate type should be selected in accordance
with the actual operating conditions. ECI offers two types of air filters (both
suitable for XDM-500 platforms):

Low-density foam filter, with a density of 10 pores per inch (PPI)

High-density foam filter (45 PPI), for extremely dusty sites and when
NEBS compliance is required
NOTE: It is not recommended to use air filters in

environments that enable normal operation without direct air


filtering, for example, in air-conditioned sites.

The air filter is attached under the platform below the xFCU units, using a
dedicated installation kit.

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The following figure shows a general view of the air filter and its installation
kit. This kit includes a frame with a removable front panel and the hardware
(seven spacers) needed for its installation under the platform.

Figure 5-2: Air filter and installation kit

Installing the Air Filter


Before you start:
1. Obtain the air filter and its installation kit.
2. Prepare a Philips screwdriver.

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Installing the Filter Frame


For the procedure steps, refer to the following figure.

Figure 5-3: Installing the air filter frame

To install the air filter frame on the platform:


1. Open the installation kit and remove the supplied hardware.
2. Attach the front panel to the air filter frame, using the two captive screws
located on the panel.
3. Insert the seven spacers into the filter frame. When properly inserted, a
spacer snaps in place and is permanently locked.
4. Align the spacers located on the frame with the mating holes under the
platform, and then press the frame until the spacers snap in place and
secure the frame to the platform.

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To install the air filter in its frame:


1. Release the two captive screws fastening the filter front panel, and remove
the panel.
2. Identify the filter's air intake side, indicated by two coding tabs.
3. Insert the clean filter in the holding frame with the air intake side facing
downwards, and slide it backwards until its front edge is flush with the
front frame edges. For air filter maintenance please refer to Recommended
Cleaning Methods (page 9-7).

Figure 5-4: Installing the air filter in its frame

4. Reinstall the filter front panel and fasten it to the frame with its two captive
screws.
CAUTION: Install only a filter of the original type. Failure to
do so can impair equipment reliability and performance.

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Connecting Power and Rack


Alarm Cables to the Platforms
Checking Site Grounding Wiring
Proper operation of XDM equipment requires that the positive supply line be
connected to the common ground (CGND) of the site at the power source, in
accordance with ETS300132-2.
The following figure shows a simplified diagram of the connections to CGND
suitable for the installation of XDM platforms.

Figure 5-5: Grounding connections at typical site

Correct grounding is critical, and therefore it is necessary to check the


connections before applying power to the equipment installed in the rack.
When two independent power sources are used, the test must be performed
separately for each source.
If a problem is detected during the test, the site wiring must be repaired before
continuing.
The check is made with a standard DVM, using the following procedure.

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To check for proper grounding wiring:


1. Measure and record the output voltage of the power supply at the power
supply terminals. Make sure that it is within the specified limits (XDM
equipment can use -40 VDC to 72 VDC).
2. At the xRAP: Measure and record the voltage between the positive (red)
lead of the power source and the xRAP metallic body. The voltage
difference must not exceed 5 V.
3. At the xRAP: Measure and record the voltage between the negative (black)
lead of the power source and the xRAP metallic body. The voltage
difference must not exceed the supply voltage measured in Step 1, and must
be within 5 V of the measured voltage.
For example, if the power supply voltage is -48 VDC, the voltage measured
in this step cannot be more negative than -48 VDC, nor more positive than
-43 VDC.

Connecting via XDM-500 xRAP


Connect the power cables to the XDM-500 shelf through an xRAP unit through
the following steps.
To connect the power and bay alarm cables to the shelves:

Connect the power and bay alarm cables from the xRAP to the xINF and
xFCU units of each XDM platform. The xRAP-D installation procedure is
described in Installing the xRAP-D (page 4-45), the xRAP-B installation
procedure is described in Installing the xRAP-B (page 4-63), the xRAP-HP
installation procedure is described in Installing the xRAP-HP (page 4-73),
and the xRAP-100 installation procedure is described in Installing the
xRAP-100 (page 4-82).
As part of the xRAP installation procedure, cables are routed from the
appropriate xRAP connectors, as specified in the rack installation plan,
toward each XDM platform installed in the rack. At this stage, connect the
free ends of these cables, in accordance with the rack installation plan and
the cable tags, to the appropriate XDM platform connectors.
NOTE: At this stage, you may also install accessories such as
heat buffers and cable guides which sit above the XDM
platforms.

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The complete list of cables connecting between the XDM platforms and the
xRAP unit is shown in Connecting power and bay alarm cables.

The DC power connectors are located on the xINF units.


The ALARM and RAP connectors of the XDM-500 shelves are located
on the auxiliary connectors panel. See XDM-500 slots identification
(page 6-4).

Figure 5-6: Auxiliary connector panel


Table 5-1:

Connecting power and rack alarm cables

XDM platform side

xRAP connector

xINF 1 POWER IN

Connection of DC power
from source A to the
XDM platform.

SOURCE A power terminal


board - PLATFORM 1
terminals

xINF 2 POWER IN

Connection of DC power
from source B to the
XDM platform.

SOURCE B power terminal


board - PLATFORM 1
terminals

ALARMS

Connection of platform
alarm inputs and outputs.

EXTERNAL
ALARM/CONTROL PLATFORM 1

RAP

Connection of platform
alarm indications (relays
and buzzer).

RAP - SHELF 1

xINF 1 POWER IN

Connection of DC power
from source A to the
XDM platform.

SOURCE A power terminal


board - PLATFORM 2
terminals

xINF 2 POWER IN

Connection of DC power
from source B to the
XDM platform.

SOURCE B power terminal


board - SHELF 2 terminals

ALARMS

Connection of platform
alarm inputs and outputs.

EXTERNAL
ALARM/CONTROL SHELF 2

RAP

Connection of platform
alarm indications (relays
and buzzer).

RAP- SHELF 2

Connector

5-12

Cable function

Platform

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Connecting via Client-provided Power


Distribution Panel
The connection of power to the XDM platforms can also be made by means of
a client-provided power distribution panel. In this case make the connections in
accordance with the procedure given in Connecting via XDM-500 xRAP (page
5-11), but with appropriate modifications to your specific installation.
Note, however, that the XDM xRAP unit provides not only power connection
functions, but also enable connecting to the platform alarm and alarm
monitoring interfaces. Such connections require special protected interfacing,
and therefore are possible only when an XDM xRAP unit is used. Therefore
skip the rack alarm cable connection instructions given in Connecting via
XDM-500 xRAP (page 5-11).

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6
Card and Module Installation
In this chapter:
Overview ......................................................................................................... 6-1
Card Installation Precautions ........................................................................... 6-3
XDM-500 Slot Utilization ............................................................................... 6-4
Installation Data for XDM-500 I/O Cards and Associated Modules............... 6-6
Using Electrical Interface Protection Modules ................................................ 6-9
Preparing Cards and Modules for Installation ............................................... 6-10
Installing CMBR40 and TRP40_2 Cards for Different Configuration Options6-6
Installing xMCP Cards .................................................................................. 6-73
Installing xMCP-B/B2G Cards ...................................................................... 6-75
Installing MECP Cards .................................................................................. 6-78
Installing Aurora-G Cards ............................................................................. 6-79
Installing I/O Cards and Modules .................................................................. 6-90
Installing a Card in the CCP Cage ................................................................. 6-92

Overview
This chapter describes how to insert cards into XDM platform slots.
Card insertion is essentially not complicated. Take the card, make sure that all
pins and connectors are straight, and gently insert the card into the appropriate
slot. It should slide in easily. The same standard installation instructions
generally apply to all cards of the same type.

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This chapter explains standard installation of cards. One or more of the


following steps apply:

Identify the slot into which you wish to insert the I/O card. Specific
information about slot capacities and limitations are provided in XDM-500
Slot Utilization (page 6-4).

Prepare the electrical interface protection modules (if any) that you plan to
use, as described in Using Electrical Interface Protection Modules.

XDM I/O cards often work with a variety of slide-in or plug-in modules
and components. Most of these modules and components can be inserted
and replaced while the system is running (hot insertion). However, when
initially installing and starting a system, you should first prepare the I/O
cards by inserting the modules and components, and only afterwards insert
the cards into the appropriate slots. This simplifies the initial system setup
and configuration. Instructions for sliding these modules and components
into the relevant I/O cards are provided in Preparing Cards and Modules for
Installation (page 6-10). The CMBR40 and TRP40_2 cards can require
special installation steps when installed for certain configurations. These
steps are provided in Installing CMBR40 and TRP40_2 Cards for Different
Configuration Options (page 6-69)

Insert any xMCP or xMCP-B cards included with your system into the
selected C1 and/or C2 slots, as described in Installing xMCP Cards (page
6-73) and Installing MECP Cards (page 6-78).

Insert any Aurora cards included with your system into the selected I/O
card slots and configure the cards for use, as described in Installing AuroraG Cards (page 6-79).

Insert any I/O cards included with your system into the selected I/O card
slots, as described in Installing I/O Cards and Modules (page 6-90).

Insert any CCP cards included with your system into the selected modules
cage slots, as described in Installing a Card in the CCP Cage (page 6-92).

Before you begin to install cards, be sure to read the precautions in Card
Installation Precautions (page 6-3).

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Card Installation Precautions


After the platform has been installed and grounded, you can install the cards.
Before you start:
When installing cards, make sure to carefully align the card with the platform
guide rails. Hold the card straight during insertion and removal, and pull or
push it slowly and carefully to avoid touching components located on adjacent
cards/modules.
CAUTION: If you feel resistance when inserting cards,
immediately retract the card and repeat the process.

CAUTION:

Do not use excessive torque when tightening the card


fastening screws.
Do not exert excessive torque when tightening the screws
that secure the optical transceiver plug-in modules to the
base card.

Excessive tightening torque may cause permanent damage


to the equipment.

CAUTION: STATIC SENSITIVE DEVICES


PROPER HANDLING AND GROUNDING
PRECAUTIONS REQUIRED
XDM equipment contains components sensitive to
electrostatic discharge (ESD). To prevent ESD damage, avoid
touching the internal components, and before handling cards,
touch the frame of a grounded equipment or rack. Keep parts
and cards in their antistatic packaging material until you are
ready to install.
The use of an antistatic wrist strap connected to a grounded
equipment frame or rack is recommended when handling
cards during installation, removal, or connection to internal
connectors.

NOTE: Do not remove plastic covers from optical connectors


until optical fibers are connected to them.

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XDM-500 Installation and


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XDM-500 Slot Utilization


The following figure shows a general view of the XDM-500 shelf and
identifies its slots. For more information, see the XDM-1000 Product Line
Reference Manual and the XDM System Specifications.

Figure 6-1: XDM-500 slots identification

Most optical I/O slot cards can be installed in any I/O slot. Some optical cards
are double I/O slot cards that can only be installed in specific pairs of slots. For
more information about slot requirements for optical cards, see each card's
description in the XDM-1000 Product Line Reference Manual.
NOTE: If you are installing two TRP40_2 or CMBR40 cards as
an OCH 1 + 1 protection pair, see Installing Two TRP40_2 or
CMBR40 Cards as an OCH 1+1 Protection Pair (page 6-71) for
slot information and other installation instructions.
If you are installing two TRP40_2 cards in regenerator mode, see
Installing TRP40_2 Cards for Regenerator Mode (page 6-69) for
slot information and other installation instructions.

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Common cards, such as HLXC and XIO cards, affect the capacity of each I/O
slot. The following table provides installation data for certain XDM-500 I/O
cards and associated modules. Use this data to determine which slots you can
use for each type of card. For more information about DWDM modules, see the
XDM Reference Manual and the XDM System Specifications.
NOTE: When an XIO card is installed in the shelf, the table

lists the slots that enable PIO and SIO cards to use their full
service bandwidth. However, PIO and SIO cards may also be
installed in slots with a lower service bandwidth, provided the
bandwidth configured for the card does not exceed the slot
service bandwidth.

NOTE: The information in this book includes cards,

components, and modules that are at an EOL stage and no


longer marketed commercially. However, due to their high
quality, durability, reliability, and utility, some of these
components are still in use.
ECI continues to provide technical support when necessary.
As a result, we are leaving technical information about these
components in the reference documentation for the
convenience of users still working with these components.

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Installation Data for XDM-500 I/O Cards and


Associated Modules
Table 6-2:

Installation Data for XDM-500 I/O Cards and Associated Modules

Service type

Card

Slots with HLXC192

Slots with XIO192 10

Slots with XIO384F 11

Electrical interface
module type

Protection module type

SDH

SIO1&4, SIO1&4M optical

IC1 to IC6

IC1 to IC6

IC1 to IC6

None (optical interface)

Not applicable

SIO1&4, SIO1&4M electrical 12

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

M1_16BT, M1_16DI

M1_16P

M1_8BT, M1_8DI

None

13

SIO1&4B optical

IC1 to IC6

IC2 to IC5

With xMCP-B:
IC1 to IC6
With xMCP:
IC3 and IC4 only

None (optical interface)

Not applicable

SIO1&4B with CCP module

IC1, IC2, IC5, IC6

IC2, IC5

With xMCP-B:
IC1, IC2, IC5, IC6
With xMCP:
not available

M1_16SFP

Not applicable

SIO16, SIO16M

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

SIO16_2B

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

SIO16_4B

Not applicable

Not applicable

IC3 and IC4

None (optical interface)

Not applicable

10

XIO192 supports two configurations; one STM-16 with one STM-4 interface, or one STM-16 with four STM-1 interfaces.
XIO384F supports one STM-64/OTU2 or four STM-16/OTU1 ports in each slot.
PIO345 and SIO1&4 (DS-3 and E3 electrical interfaces) can only be installed in slots IC2 or IC5.
13
SIO1&4B requires use of xMCP-B or regular xMCP with minimum of 256 MB RAM memory. A Regular xMCP with only 128 MB RAM cannot support the SIO1&4B.
11
12

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Service type

XDM-500 Installation and Maintenance Manual

Card

Slots with HLXC192

Slots with XIO192 10

Slots with XIO384F 11

Electrical interface
module type

Protection module type

SIO64, SIO64M, SIO64MF

IC2+IC3 or IC4+IC5
(double-slot card)

IC2+IC3 and/or
IC4+IC5 (double-slot
card)

IC2+IC3 and/or
IC4+IC5 (double-slot
card)

None (optical interface)

Not applicable

None (optical interface)

Not applicable

SIO64B

PDH

SIO164

Not applicable

Not applicable

IC3+IC4 (double-slot
card)

None (optical interface)

Not applicable

PIO2_21

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

M2_21B, M2_21U,
M2_84

M2_84P

M2_84P

Not applicable

M2_84B, M2_84U

M2_84P

M2_84BR, M2_84UR

Not applicable

PIO2_84

PIO345_16, PIO345M_16

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

IC1, IC2, IC5, IC6

M345_16BT, M345_16DI M345_16P


M345_8BT, M345_8DI,
M345_8BN

Data/MPLS

14

DIO1_40

IC1 to IC6

IC2 to IC5

Not applicable

None (optical interface)

Not applicable

DIO1_61

IC1 to IC6

IC1 to IC6

Not applicable

None (optical interface)

Not applicable

DIO1_80

IC1 to IC6

IC2 to IC5

Not applicable

None (optical interface)

Not applicable

EIS2_8, EIS2_14 (optical interfaces IC1 to IC6


only)

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

EIS2_8, EIS2_14 (optical and


electrical interfaces)

IC1, IC2, IC5, IC6

IC2, IC5

IC1, IC2, IC5, IC6

ME_8, ME_14 14

Not applicable

EIS8_8 (optical interfaces only)

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

EIS8_8 (optical and electrical


interfaces)

IC1, IC2, IC5, IC6

IC2, IC5

IC1, IC2, IC5, IC6

ME_8, ME_14

Not applicable

To use the full EIS capacity, use ME_14.

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Card

Slots with HLXC192

Slots with XIO192 10

Slots with XIO384F 11

Electrical interface
module type

Protection module type

DIOB (optical interfaces only)

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

DIOB (optical and electrical


interfaces)

IC1, IC2, IC5, IC6

IC2, IC5

IC1, IC2, IC5, IC6

ME16

Not applicable

DIOBH 15 (optical interfaces only)

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

DIOBH (optical and electrical


interfaces)

IC1, IC2, IC5, IC6

IC2, IC5

IC1, IC2, IC5, IC6

ME16

Not applicable

MCS5 (optical interfaces only)

IC1 to IC6

IC2 to IC5

IC1 to IC6

None (optical interface)

Not applicable

MCS5 (optical and electrical


interfaces)

IC1, IC2, IC5, IC6

IC2, IC5

IC1, IC2, IC5, IC6

ME16

Not applicable

MCS10 (optical interfaces only)

Not applicable

Not applicable

IC3, IC4

None (optical interface)

Not applicable

MCS30_x10G (optical interfaces


only)

Not applicable

Not applicable

IC3, IC4

None (optical interface)

Not applicable

ASON

ACP1000

MC1 to MC4

MC1 to MC4

MC1 to MC4

Not applicable

Not applicable

Encryption

Aurora-G

IC1 to IC6

IC1 to IC6

IC1 to IC6

Not applicable

Not applicable

ATM

ATS

IC1 to IC6

IC1 to IC6

IC1 to IC6

Not applicable (no


external interfaces)

Not applicable

Service type

15

Card and Module Installation

DIOBH is a software configuration of DIOB for use in 2.5 Gbps slots.

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Using Electrical Interface


Protection Modules
Protection modules are available for I/O cards with electrical interfaces. The
protection module enables the automatic replacement of a malfunctioning I/O
card with an I/O card of the same type associated with the slot in which the
protection card is installed.
The protection capabilities for XDM-500 shelves equipped with HLXC/XIO
cards are as follows:

Protection for E1 I/O cards. The protection module for this type of I/O
interface, designated M2_84P, can serve both balanced and unbalanced
interfaces. The M2_84P module can be installed in any one of the M1 to
M6 slots, and the associated PIO2_84 card protects all the other PIO2_84
cards. For an XDM-500 fully equipped with PIO2_84 cards, the resulting
protection ratio is 1:4; higher protection ratios are achieved when the
number of PIO2_84 cards installed in the shelf is lower than 4.
Protection for E3/DS-3/STS-1 I/O cards. The protection module for this
type of interface is designated M345_16P. The M345_16P module can be
installed in slots M1 or M2 or M5 or M6; in this case, the PIO345_16 card
installed in slot I1, I2, I5 or I6 protects all the other PIO345_16 cards.
For an XDM-500 fully equipped with PIO345_16 cards, the resulting
protection ratio is 1:4; higher protection ratios are achieved when the
number of PIO345_16 cards installed in the shelf is less than 4.

Protection for STM-1 electrical I/O cards. The protection module for this
type of interface is designated M1_16P. The M1_16P module can be
installed in slots M1 or M2 or M5 or M6; in this case, the SIO1_16e card
installed in slot I1, I2, I5 or I6 protects all the other SIO1_16e cards.
NOTE: In the XDM-500 there is no option to protect a
PIO345 card and a SIO1&4 card on the same shelf. Unlike
the XDM-1000, the XDM-500 has only one high order
protection for STM-1 or DS-3/E3 interfaces.

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Preparing Cards and Modules for


Installation
In order to provide cost-effective performance in various application
environments, ECI offers different types of optical transceivers for I/O cards
with optical interfaces. The optical transceivers are provided as plug-in
modules that are installed directly in the base card or on extractable optical
modules. If not yet installed, the optical transceiver plug-in modules must be
installed on the I/O base card before inserting the card in the platform. The
auxiliary (AUX_2X) and OADM1&4 cards can also be equipped with various
types of plug-in modules.
Some of the plug-in and extractable modules can be installed in operating
cards, provided the appropriate safety precautions (see "Installing XDM-500:
Before You Start Safety Guidelines" page 1-1) are strictly observed. This
enables field upgrading of installed equipment, either by adding new interfaces
to increase the number of ports or by replacing the optical transceivers with
units having improved performance or higher capacity.
The following sections provide instructions for installing optical transceivers
and extractable plug-in modules in the various types of cards that support this
capability.

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Card and Module Installation

Installing and Removing Optical


Transceivers
This section provides general instructions for installing SFP and XFP plug-in
transceivers on optical modules and base cards.
The instructions are illustrated for SFPs. However, the same procedure applies
to XFPs as well.
CAUTION: During the installation of SFP or XFP

transceivers, make sure that all optical connectors are closed


by protective caps.
Do not remove the covers until an optical fiber is connected
to the corresponding connector. Be aware that the SFP/XFP
transmitter may start transmitting as soon as it is inserted into
a working card.

To install an SFP transceiver:


1. Identify the prescribed SFP installation position according to the site
installation plan.
2. Check that the SFP has not been physically damaged during shipment, and
that the antistatic protection bag of the original packaging is sealed.
3. Remove the SFP from its antistatic protection packaging and perform a
visual inspection to detect damage during shipping. Report any problems.
4. Record the hardware and software versions indicated on the SFP
identification labels.
5. Remove the protective covers from the SFP cage and from the SFP
electrical connector.
6. Open the bail wire/tab to serve as a handle. This is illustrated in Step 1 in
the following figure.
7. Insert the rear end of the SFP into the cage, and push slowly backwards to
mate the connectors until the SFP clicks into place. This is illustrated in
Step 2 in the following figure.
If you feel resistance before the connectors are fully mated, retract the SFP
and repeat the procedure.

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8. Push up the bail wire/tab. This is illustrated in Step 3 in the following


figure.

Figure 6-2: Inserting an SFP into an optical module

NOTE: SFP installation follows the same procedure no

matter what type of base contains the SFP cage and


connector. SFPs are modular components used on a wide
range of cards and modules that all share the same installation
method.

To remove an SFP transceiver:


1. Open the bail wire/tab to serve as a handle.
2. Gently remove the SFP from the slot, using the special extractor tool
provided with each XDM platform.
This tool has the general appearance of a pair of tweezers, with the tip of
one of its legs bent inwards. Use the extractor tool to help you disengage
LC and SC optical plugs from the mating connectors in the various cards
where the connectors cannot conveniently be reached by hand. The
extractor tool is placed in a special holder, located in the external left-hand
wall of the XDM platform.

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Preparing SIO1&4 Cards for Installation


SIO1&4 cards intended for use with optical interfaces can be equipped with up
to four extractable optical modules. Live insertion and hot swapping are
allowed. Two main types of optical modules are available for SIO1&4 cards:

Quad STM-1 extractable optical module with four independent transceivers

STM-4 extractable optical module with a single transceiver

Each type of extractable module is available in two versions: with built-in


transceivers, or with transceivers located on removable SFPs.

Installing Extractable Modules in SIO1&4


Cards
The following figure shows how to install extractable modules (quad STM-1
optical modules in positions 1 and 2, and STM-4 optical modules in positions 3
and 4).

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To install an extractable optical module:


1. Identify the prescribed position on the base card (see the following figure).

Figure 6-3: Installing extractable OM01_4 and OM04_1 optical modules in


SIO1&4 cards

2. Insert the rear end of the module into the card guides, and push slowly
backward to mate the connectors. Make sure the fastening screw is free to
move backward as the module slides in. If resistance is felt before the
connectors are fully mated, retract the module and repeat the insertion.
3. Fasten the module with its captive screw.

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Card and Module Installation

Upgrading to Optical Modules with


Removable SFPs
The optical modules with removable SFPs are available from V5. These
modules can be installed as an upgrade on existing SIO1&4 cards. The upgrade
involves:
1. Removing the existing optical module.
2. Installing the replacement.
3. Inserting the required SFP(s) in the module.
NOTE: The optical modules with removable SFPs are

slightly longer and it is therefore recommended to connect


only patch cords with short boots. Install optical attenuators
only at the ODF but not on the transceiver connectors
(placing the attenuators on the transceiver may require using
the special extended door on the shelf, as explained in Deep
doors vs. standard doors (page 4-3)).

The upgrade procedure can be performed on working SIO1&4 cards. However,


after installing the new extractable modules, it is necessary to perform a cold
reset to the card (including the interfaces located on the modules that have not
been replaced).
With regard to the OM16, it is necessary to reassign the OM16-1SFP and the
OTR16.
NOTE: If the interfaces to be replaced are protected, it is
recommended to switch to protection before starting the
upgrade procedure.

To upgrade to optical module with removable SFPs:


1. Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver for use when reconnecting the fibers.
2. Identify the position of the optical module to be replaced on the base card
(see the following figure).
3. Disconnect the fibers connected to the optical module.
4. Release the captive screw fastening the optical module to the base card.
5. Pull out the optical module to be replaced and remove it.
6. Insert the rear end of the replacement optical module into the card guides
and push slowly backward to mate the connectors. Make sure the fastening
screw is free to move backward as the optical module slides in. If you feel
resistance before the connectors are fully mated, retract the optical module
and repeat the insertion.

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7. Fasten the optical module with its captive screw.


8. Insert the prescribed SFPs in the optical module positions as explained in
Installing and removing optical transceivers (page 6-11).
9. Reconnect the fibers disconnected in Step 3.

Figure 6-4: Installing extractable OMS01_4 and OMS04_1 optical modules in


SIO1&4 cards

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Preparing SIO16 Cards for Installation


NOTE: See Installing and removing optical transceivers
(page 6-11) for instructions regarding the installation of
optical transceivers and extractable optical modules on
SIO164 cards.

SIO16 cards can be equipped with one or two extractable optical modules. Live
insertion and hot swapping of modules is allowed.
CAUTION: Do not install an OM16 optical transceiver

equipped with an LC connector (I3 or S3 interfaces) in the


lower position when the transceiver in the upper position is
equipped with an SC connector. If, for any reason,
transceivers with SC and LC connectors are installed in the
upper and lower positions respectively, contact ECI's
representative.

The extractable module is available in two versions: with built-in transceiver or


with the transceiver located on a removable SFP.

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Installing Extractable Modules in SIO16


Cards
The following figure shows how to install an extractable module on the SIO16.
To install an optical module:
1. Identify the module position on the base card (see the following figure).

Figure 6-5: Installing an extractable optical OM16_1 module in SIO16 card

2. Insert the rear end of the transceiver into the card guides, and push slowly
backward to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the transceiver and repeat the insertion.
3. Fasten the transceiver with its captive screw.

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Upgrading to an Optical Module with a


Removable SFP
The optical module with removable SFP is available from release 5. This
module can be installed as an upgrade on existing SIO16 cards. The upgrade
involves:
1. Removing the existing optical module.
2. Installing the replacement.
3. Inserting the required SFP in the module.
NOTE: The OM16_1SFP module is slightly longer than the

OM16_1 and it is therefore recommended to connect only


patch cords with short boots. Install optical attenuators only at
the ODF and not on the transceiver connectors (placing
attenuators on the transceiver connectors may require using
the special extended door on the platform, as explained in
Deep doors vs. standard doors (page 4-3)).

The upgrade procedure can be performed on working SIO16 cards. However,


after installing the new extractable module, it is necessary to perform a cold
reset on the card.
NOTE: If the interfaces to be replaced are protected, it is
recommended to switch to protection before starting the
upgrade procedure.

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To upgrade to an optical module with a removable SFP:


1. Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver for use when reconnecting the fibers.
2. Identify the position of the optical module to be replaced on the base card
(see the following figure).

Figure 6-6: Installing an extractable optical OM16_1SFP module in SIO16 card

3. Disconnect the fibers connected to the optical module.


4. Release the captive screw fastening the optical module to the base card.
5. Pull out the optical module to be replaced and remove it.

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6. Insert the rear end of the replacement optical module into the card guides
and push slowly backward to mate the connectors. Make sure the fastening
screw is free to move backward as the optical module slides in. If you feel
resistance before the connectors are fully mated, retract the optical module
and repeat the insertion.
7. Fasten the optical module with its captive screw.
NOTE: A special SFP locker may be installed on the

OM16_1 SFP. This locker prevents SFP extraction and


insertion and must be removed before performing these
activities. Contact ECI Customers Support Team for
additional details.

8. Insert the prescribed SFPs in the optical module positions as explained in


Installing and removing optical transceivers (page 6-11).
9. Install the locker, if applicable.
10. Reconnect the fibers disconnected in Step 3.

Preparing SIO164 Cards for Installation


SIO164 includes a single position for an extractable module. The type of the
installed module determines the configuration:

An STM-16/OTU1 card providing four STM-16/OTU1 interfaces, working


with an OMSC16_4 module.

An STM-64 card providing one STM-64 interface, working with an


OMTX10_S module.

An STM-64/OTU2 card providing one STM-64/OTU2 interface, working


with an OMTX10 or OMTX10_EF module.

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Installing Extractable Modules in SIO164 in


4 x STM-16/OTU1 Configuration
When the SIO164 is configured as a 4 x STM-16/OTU1 card, an OMSC16_4
optical module is installed in the module position. Live insertion and hot
swapping is allowed.
NOTE: If you are replacing interfaces that are protected, it is
recommended to switch to protection before starting the
upgrade procedure.

The following figure shows how to install an extractable module on the


SIO164.

Figure 6-7: Installing an OMSC16_4 module on SIO164

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To install an OMSC16_4 module on SIO164:


1. If the card is installed in a working platform, turn the reset control to the
reset (up) position. This causes switching to the protection module (if this
option is used).
2. Fully release the screws until the two extractors of the optical module are in
the horizontal position.
3. Inspect the connectors of the optical module and the mating connector on
the base card, and clean any foreign matter and dust.
4. Insert the rear end of the optical module into the guides of the module
installation position and push slowly backward to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the module
and repeat the insertion.
5. Press the two extractors to lock the optical module in place. When the
module is properly inserted, the extractors are vertical and touch the
module edge.
6. Secure the optical module extractors with the two screws.
7. If the card is installed in a working platform, you can return the reset
control to the normal (horizontal) position.

Installing Extractable Modules in SIO164 in


1 x STM-64 or OTU2 Configuration
When the SIO164 is configured as a 1 x STM-64 card, an OMTX10_S optical
module is installed in the module position. When the SIO164 is configured as a
1 x STM-64/OTU2 card, an OMTX10 or OMTX10_EF optical module is
installed in the module position. See the XDM-1000 Product Line Reference
Manual and the XDM Technical Specifications for a description of the module
capabilities.
Live insertion and hot swapping is allowed.
NOTE: If you are replacing interfaces that are protected, it is
recommended to switch to protection before starting the
upgrade procedure.

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The following figure shows how to install the extractable module (the figure
uses the OMTX10_S for illustration).

Figure 6-8: Installing an optical module on SIO164

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To install an optical module on SIO164:


1. If the card is installed in a working platform, turn the reset control to the
reset (up) position. This causes switching to the protection module (if this
option is used).
2. Fully release the screws until the two extractors of the optical module are in
the horizontal position.
3. Inspect the connectors of the optical module and the mating connector on
the base card, and clean any foreign matter and dust.
4. Insert the rear end of the optical module into the guides of the module
installation position and push slowly backward to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the module
and repeat the insertion.
5. Press the two extractors to lock the optical module in place. When the
module is properly inserted, the extractors are vertical and touch the
module edge.
6. Secure the optical module extractors with the two screws.
7. If the card is installed in a working platform, you can return the reset
control to the normal (horizontal) position.

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Installing Optical Transceivers in XIO192


Cards
NOTE: If you are replacing interfaces, it is recommended to
switch to protection before starting.

To install OM16_1 optical plug-in transceivers:


1. Identify the prescribed position in the base card (see the following figure).

Figure 6-9: Installing extractable optical modules in the XIO192

2. Insert the rear end of the module into the card guides and push slowly
backward to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the transceiver and repeat the insertion.
3. Fasten the transceiver with its captive screw.

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To install optical modules:


NOTE: The optical modules with removable SFPs are

slightly longer and it is therefore recommended to connect


only patch cords with short boots. Install optical attenuators
only at the ODF and not on the transceiver connectors
(placing the attenuators on the transceiver may require using
the special extended door on the platform, as explained in
Deep doors vs. standard doors (page 4-3)).

1. Identify the prescribed position in the base card.


2. Insert the rear end of the optical module into the card guides and push
slowly backward to mate the connectors. Make sure the fastening screw is
free to move backward as the optical module slides in. If resistance is felt
before the connectors are fully mated, retract the transceiver and repeat the
insertion.
3. Fasten the optical module with its captive screw.
4. If you are installing an OMS01_4, OMS04_1, or OM16_1SFP, insert the
prescribed SFPs in the optical module positions as explained in Installing
and removing optical transceivers (page 6-11).

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Installing Extractable Modules in XIO384F


Cards
XIO384F can be equipped with one extractable optical module. The following
extractable module versions are offered: OMSC16_4, OMTX10_S, OMTX10,
and OMTX10_EF. See the XDM-1000 Product Line Reference Manual and the
XDM Technical Specifications for a description of their capabilities.
Live insertion and hot swapping is allowed.
NOTE: If the interface to be replaced is protected, it is

recommended to switch to protection before starting the


upgrade procedure.

The following figure shows how to install an extractable module (the figure
uses the OMTX10_EF for illustration).

Figure 6-10: Installing an optical module on XIO384F

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To install an optical module on XIO384F:


1. If the card is installed in a working platform, turn the reset control to the
reset (up) position. This causes switching to the protection module (if this
option is used).
2. Fully release the screws until the two extractors of the optical module are in
the horizontal position.
3. Inspect the connectors of the optical module and the mating connector on
the base card, and clean any foreign matter and dust.
4. Insert the rear end of the optical module into the guides of the module
installation position and push slowly backward to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the module
and repeat the insertion.
5. Press the two extractors to lock the optical module in place. When the
module is properly inserted, the extractors are vertical and touch the
module edge.
6. Secure the optical module extractors with the two screws.
7. If the card is installed in a working platform, you can return the reset
control to the normal (horizontal) position.

Installing Optical Transceivers in SIO1&4B


Cards
SIO1&4B cards can be equipped with the desired types of optical interfaces
and/or electrical interfaces. For a description of the cards and interface module
characteristics, refer to the XDM-1000 Product Line Reference Manual and the
XDM System Specification.
NOTE: The M1_16SFP modules, which include the

SIO1&4B electrical interfaces, are located in the


corresponding slot of the platform modules cage. These
modules are used in the XDM-500 and XDM-1000 platforms
only.

SIO1&4B cards have 16 positions for the installation of optical transceiver


plug-ins (SFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required.
Do not install optical transceiver plug-ins for ports that are served by electrical
interfaces located in the M1_16SFP module (where relevant).

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To install an optical transceiver plug-in module in SIO1&4B


cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-11: Identifying the installation positions on the SIO1&4B card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Installing Optical Transceivers in SIO16_2B


Cards
SIO16_2B cards have two positions for the installation of optical transceiver
plug-ins (SFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required.
To install an optical transceiver plug-in module in SIO16_2B
cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-12: Identifying the installation positions on the SIO16_2B card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Installing Optical Transceivers in SIO16_4B


Cards
SIO16_4B cards have four positions for the installation of optical transceiver
plug-ins (SFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required.
To install an optical transceiver plug-in module in SIO16_4B
cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-13: Identifying the installation positions on the SIO16_4B card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).
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Installing Optical Transceivers in SIO64B


Cards
SIO64B cards have one position for the installation of an optical transceiver
plug-in (XFP). The optical transceiver plug-in can be installed and replaced in
the field as required.
To install an optical transceiver plug-in module in an
SIO64B card:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-14: Identifying the installation positions on the SIO64B card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Installing Optical Transceivers in EIS Cards


EIS cards are available in three versions: EIS2_8, EIS2_14, and EIS8_8. Each
version can be equipped with the desired types of optical interfaces and/or
electrical interfaces. For a description of the cards and interface module
characteristics, refer to the XDM-1000 Product Line Reference Manual and the
XDM System Specifications.
NOTE: The ME_8 or ME_14 modules, which include the

EIS electrical interfaces, are located in the corresponding slot


of the platform modules cage.

All the EIS card versions have eight positions for the installation of optical
transceiver plug-ins (SFPs). The following figure identifies these positions.
The optical transceiver plug-ins can be installed in the various positions:

Fast Ethernet or GbE for the four upper positions (1 to 4)

Fast Ethernet only for the four lower positions (5 to 8)

The optical transceiver plug-ins can be installed and replaced in the field as
required.
Do not install optical transceiver plug-ins for ports that are served by electrical
interfaces located in the ME_8 module.

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To install an optical transceiver plug-in module in EIS cards:


1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-15: Identifying the installation positions on typical EIS cards

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Installing Optical Transceivers in DIO Cards


DIO cards are available in the following versions: DIO1_61, DIO1_80, and
DIO1_40.

For DIO1_40: GbE optical interface modules in the two upper positions,
each equipped with two optical transceiver plug-ins (SFPs).

For DIO1_80: GbE optical interface modules in all of the four positions,
each equipped with two optical transceiver plug-ins (SFPs).

For DIO1_61: one STM-16 optical interface module (DM16) in position 1,


and GbE optical interface modules in the other three positions. The STM16 optical interface module can be equipped with only one optical
transceiver plug-in (SFP).
NOTE: Earlier versions of the DIO card have been replaced
with the current versions: the DIO1_20 has been replaced
with the DIO1_40, the DIO1_31 with the DIO1_61, and the
DIO1_40F with the DIO1_80.

The optical transceiver plug-in can be installed and replaced in the field as
required. You cannot replace the optical interface modules.

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To install an optical transceiver plug-in module in DIO


cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in (see the following figure).
2. To replace or install a transceiver, see Installing and removing optical
transceivers (page 6-11).

Figure 6-16: Identifying the installation positions on DIO cards

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Installing Optical Transceivers in DIOB


Cards
Each DIOB version card can be equipped with the desired types of optical
interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, refer to the XDM-1000 Product Line
Reference Manual and the XDM System Specification.
NOTE: The ME16 modules, which include the electrical

interfaces, are located in the corresponding slot of the


platform modules cage. These modules are used in the XDM500 and XDM-1000 platforms only.

The DIOB card has eight positions for the installation of optical transceiver
plug-ins (SFPs). The following figure identifies these positions.
The optical transceiver plug-ins can be installed and replaced in the field as
required.
To install an optical transceiver plug-in module in DIOB
cards:
1. Identify the prescribed installation position of the optical transceiver
plug-in (see the following figure).
2. To install or replace a transceiver, refer to Installing and removing optical
transceivers (page 6-11).
NOTE: If you replace a transceiver on a card installed in a

working platform, first turn the reset control to the reset (up)
position. After inserting the SFP, you can return the reset
control to the normal (horizontal) position.

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Figure 6-17: Identifying the installation positions on typical DIOB cards

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Installing Optical Transceivers in


MCS5/MCS10 Cards
Each MCS5/MCS10 card version can be equipped with the desired types of
optical interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, refer to the XDM-1000 Product Line
Reference Manual and the XDM System Specification.
NOTE: The ME16 modules, which include the electrical

interfaces, are located in the corresponding slot of the


platform modules cage. These modules are used in the XDM500 and XDM-1000 platforms only.

The MCS5/MCS10 card has eight positions for the installation of optical
transceiver plug-ins (SFPs). The optical transceiver plug-ins can be installed
and replaced in the field as required.

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To install an optical transceiver plug-in module in an


MCS5/MCS10 card:
1. Identify the prescribed installation position of the optical transceiver
plug-in (see the following figure).

Figure 6-18: Identifying the installation positions on typical MCS5/MCS10


cards

2. To install or replace a transceiver, refer to Installing and removing optical


transceivers (page 6-11).
NOTE: If you replace a transceiver on a card installed in a

working platform, first turn the reset control to the reset (up)
position. After inserting the SFP, you can return the reset
control to the normal (horizontal) position.

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Installing Optical Transceivers in


MCS30_X10G Cards
MCS30_X10G cards can be equipped with the desired types of optical
interfaces and/or electrical interfaces. For a description of the cards and
interface module characteristics, see the XDM-1000 Product Line Reference
Manual and the XDM System Specification. MCS30_X10G cards have one
position for the installation of an optical transceiver plug-in (XFP). The optical
transceiver plug-in can be installed and replaced in the field as required.

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To install an optical transceiver plug-in module in an


MCS30_X10G card:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-19: Identifying installation positions on the MCS30_X10G

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).
NOTE: If you replace a transceiver on a card installed in a

working platform, first turn the reset control to the reset (up)
position. After inserting the XFP, you can return the reset
control to the normal (horizontal) position.

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Preparing Transponders and Combiners for


Installation
Most of the transponders and combiners offered by ECI are based on the
CHTR_B base card. This base card has two installation positions for two
extractable optical modules. These modules are installed in accordance with the
required functionality, for example, TRP10_2B, TRP10_LAN, TRP25_4, and
so on. Refer to the XDM-1000 Product Line Reference Manual and the XDM
System Specifications of the platform for information on the optical modules
that need to be installed for each functionality.
The following sections includes examples of installation procedures for the
CMBR10_B/BO, CMBR10_D/DO, CMBR10_T, CMBR25_2/2O, TRP10_2B,
TRP10_LAN, TRP25_4, CMTR25, and AoC components. For simplicity, this
manual sometimes refers to the whole group of 10 Gbps combiners as
CMBR10_x.

Preparing CMBR10_x Cards for Installation


CMBR10_x cards have one or two modules according to the specific card
version. The module plugs into a mating connector located in the base card.
You select and install an extractable module according to the required
functionality. After installing an extractable module, install the desired optical
transceiver plug-ins (SFPs) in the prescribed positions.
To install an extractable module in a CMBR10_D/DO card:
1. Fully release the screws until the two extractors of the module are in the
horizontal position.
2. Inspect the connectors of the module and the mating connector on the base
card, and clean any foreign matter and dust.
3. Insert the rear end of the module into the card guides, and push slowly
backwards to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the module and repeat the insertion.
4. Press the two extractors to lock the module in place. When the module is
properly inserted, the extractors are vertical and touch the module edge.
5. Secure the module extractors with the two screws.

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This installation procedure is illustrated in the following figure.

Figure 6-20: Installing an extractable module in a CMBR10_D card

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To install an optical transceiver plug-in module:


1. Identify the prescribed installation position of the optical transceiver
plug-in module (refer to the following figure).

Figure 6-21: Identifying optical transceiver plug-in installation positions in


CMBR10_D/DO cards

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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To install an extractable module in a CMBR10_B/BO or


CMBR10_T card:
1. Identify the prescribed installation position of the module on the base card.
2. Install the module using the same procedure as for the CMRB10_D/DO
card (see To install an extractable module in a CMBR10_D/DO card (page
6-44)).
The following figure shows a typical module before and after it is installed in
position. Note that the following figure depicts a CMBR10_B/BO card. A
comparable illustration for the CMBR10_T card would be almost identical,
with only slight differences apparent in the spacing of the SFP plug-in
modules.

Figure 6-22: Installing an extractable module in a CMBR10_B/BO card

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To install an optical transceiver plug-in module:


1. Identify the prescribed installation position of the optical transceiver
plug-in (refer to the following figure). Note that the following figure
depicts the optical transceiver plug-in positions for the CMBR10_B/BO
cards. A comparable illustration for the CMBR10_T card would be almost
identical, with only slight differences apparent in the spacing of the SFP
plug-in modules.
2. To install or replace a transceiver, see Installing and removing optical
transceivers (page 6-11).

Figure 6-23: Identifying optical transceiver plug-in installation positions in


CMBR10_B/BO cards

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Preparing CMBR25_2/2O Cards for


Installation
The CMBR25_2/2O cards house two extractable optical modules. Each module
plugs into a mating connector located in the base card. You can install the
desired extractable optical modules according to the required functionality.
After installing the extractable optical modules, install the desired optical
transceiver plug-ins (SFPs) in the prescribed positions.
Installation of an optical module in a CMBR25_2 card is shown in the
following figure.

Figure 6-24: Installing a typical extractable optical module in a CMBR25_2 card

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To install an extractable optical module in a CMBR25_2


card:
1. Identify the prescribed installation position of the extractable optical
module in the base card.
2. Fully release the screws until the two extractors of the extractable optical
module are in the horizontal position.
3. Inspect the connectors of the extractable optical module and the mating
connector on the base card, and clean any foreign matter and dust.
4. Insert the rear end of the extractable optical module into the guides of the
module installation position, and push slowly backwards to mate the
connectors. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Press the two extractors to lock the extractable optical module in place.
When the module is properly inserted, the extractors are vertical and touch
the module edge.
6. Secure the extractable optical module extractors with the two screws.
7. If necessary, repeat the procedure for the second extractable optical
module.
To install the optical transceiver plug-in (SFP) module:

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(page 6-11).

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Preparing CMTR25 Cards for Installation


The CMTR25 cards house two extractable optical modules. Each module plugs
into a mating connector located in the base card. You can install the desired
extractable optical modules according to the required functionality. After
installing the extractable optical modules, install the desired optical transceiver
plug-ins (SFPs) in the prescribed positions.
Installation of an optical module in a CMTR25 card is shown in the following
figure.

Figure 6-25: Installing extractable modules in a CMTR25 card

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To install an extractable optical module in a CMTR25 card:


1. Identify the prescribed installation position of the extractable optical
module in the base card.
2. Fully release the screws until the two extractors of the extractable optical
module are in the horizontal position.
3. Inspect the connectors of the extractable optical module and the mating
connector on the base card, and clean any foreign matter and dust.
4. Insert the rear end of the extractable optical module into the guides of the
module installation position, and push slowly backwards to mate the
connectors. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Press the two extractors to lock the extractable optical module in place.
When the module is properly inserted, the extractors are vertical and touch
the module edge.
6. Secure the extractable optical module extractors with the two screws.
7. If necessary, repeat the procedure for the second extractable optical
module.
To install the optical transceiver plug-in (SFP) module:

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Follow the instructions in Installing and removing optical transceivers


(page 6-11).

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Preparing CMBR40 Cards for Installation


CMBR40 cards have four positions for the installation of optical transceiver
plug-ins (XFPs). The optical transceiver plug-ins can be installed and replaced
in the field as required. For a description of the optical transceiver plug-in
modules supported by the CMBR40, refer to the XDM-1000 Product Line
Reference Manual and the XDM System Specification.
To install an optical transceiver plug-in module in a CMBR40
card:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-26: Identifying the installation positions on the CMBR40 card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Preparing TRP10_2B Cards for Installation


TRP10_2B cards have one or two modules according to the specific card
version. The module plugs into a mating connector located in the base card.
You can install an extractable module according to the required functionality.
After installing an extractable module, install the desired optical transceiver
plug-ins (SFPs) in the prescribed positions.
The installation of an extractable module in a TRP10_2B card is shown in the
following figure.

Figure 6-27: Installing plug-in modules in a TRP10_2B card

To install an extractable module in a TRP10_2B card:


1. Fully release the screws until the two extractors of the module are in the
horizontal position.
2. Inspect the connectors of the module and the mating connector on the base
card, and clean any foreign matter and dust.
3. Insert the rear end of the module into the card guides, and push slowly
backwards to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the module and repeat the insertion.
4. Press the two extractors to lock the module in place. When the module is
properly inserted, the extractors are vertical and touch the module edge.
5. Secure the module extractors with the two screws.

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Preparing TRP10_4M/R Cards for


Installation
TRP10_4M/R cards have four positions for the installation of optical
transceiver plug-ins (XFPs). The optical transceiver plug-ins can be installed
and replaced in the field as required. For a description of the optical transceiver
plug-in modules supported by the TRP10_4M/R, refer to the XDM-1000
Product Line Reference Manual and the XDM System Specification.
To install an optical transceiver plug-in module in a
TRP10_4M/R card:
1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figures).

Figure 6-28: Identifying the installation positions on a TRP10_4R card

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Figure 6-29: Identifying the installation positions on a TRP10_4M card

2. To install or replace a transceiver, see Installing and removing optical


transceivers (page 6-11).

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Preparing TRP10_LAN Cards for Installation


TRP10_LAN cards have one or two modules according to the specific card
version. The module plugs into a mating connector located in the base card.
You can install an extractable module according to the required functionality.
After installing an extractable module, install the desired optical transceiver
plug-ins (XFPs) in the prescribed positions.
The installation of an extractable module in a TRP10_LAN card is shown in
the following figure.

Figure 6-30: Installing plug-in modules in a TRP10_LAN card

To install an extractable module in a TRP10_LAN card:


1. Fully release the screws until the two extractors of the module are in the
horizontal position.
2. Inspect the connectors of the module and the mating connector on the base
card, and clean any foreign matter and dust.
3. Insert the rear end of the module into the card guides, and push slowly
backwards to mate the connectors. If resistance is felt before the connectors
are fully mated, retract the module and repeat the insertion.
4. Press the two extractors to lock the module in place. When the module is
properly inserted, the extractors are vertical and touch the module edge.
5. Secure the module extractors with the two screws.

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To install an optical transceiver plug-in module:


1. Identify the prescribed installation position of the optical transceiver
plug-in module (see the following figure).

Figure 6-31: Identifying the optical transceiver plug-in (XFP) position in the
TRP10_LAN card

2. Follow the instructions in Installing and removing optical transceivers


(page 6-11).

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Preparing TRP25_4 Cards for Installation


The TRP25_4 cards house two extractable optical modules in accordance with
the specific card version (see the XDM-1000 Product Line Reference Manual
for a description of TRP25_4 versions).
Each module plugs into a mating connector located in the base card. You can
install the desired extractable optical modules according to the required
functionality. After installing the extractable optical modules, install the
desired optical transceiver plug-ins (SFPs ) in the prescribed positions.
Installation of an optical module in a TRP25_4 card is shown in the following
figure.

Figure 6-32: Installing a typical plug-in module in a TRP25_4 card

To install an extractable optical module in a TRP25_4 card:


1. Identify the prescribed installation position of the extractable optical
module in the base card.
2. Fully release the screws until the two extractors of the extractable optical
module are in the horizontal position.
3. Inspect the connectors of the extractable optical module and the mating
connector on the base card, and clean any foreign matter and dust.

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4. Insert the rear end of the extractable optical module into the guides of the
module installation position, and push slowly backwards to mate the
connectors. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Press the two extractors to lock the extractable optical module in place.
When the module is properly inserted, the extractors are vertical and touch
the module edge.
6. Secure the extractable optical module extractors with the two screws.
7. If necessary, repeat the procedure for the second extractable optical
module.
To install the optical transceiver plug-in (SFP) module:

6-60

Follow the instructions in Installing and removing optical transceivers


(page 6-11).

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Preparing the AoC Card for Installation


The AoC cards house one extractable optical module, located on the upper half
of the AoC card, plus up to eight SFP plug-in modules inserted directly into
slots built into the lower half of the AoC card. The extractable module plugs
into a mating connector located in the AoC card. You can install the desired
extractable optical module according to the required functionality. After
installing the extractable optical module, install the desired optical transceiver
plug-ins (SFPs) in the prescribed positions.

Figure 6-33: Installing modules into the AoC card

To install an extractable optical module in the upper half of


an AoC card:
1. Identify the prescribed installation position of the extractable optical
module in the base card.
2. Fully release the screws until the two extractors of the extractable optical
module are in the horizontal position.
3. Inspect the connectors of the extractable optical module and the mating
connector on the base card, and clean any foreign matter and dust.

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4. Insert the rear end of the extractable optical module into the guides of the
module installation position, and push slowly backwards to mate the
connectors. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Press the two extractors to lock the extractable optical module in place.
When the module is properly inserted, the extractors are vertical and touch
the module edge.
6. Secure the extractable optical module extractors with the two screws.

Figure 6-34: Installing an optical module in the AoC (upper half)

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To install an optical transceiver plug-in module in the lower


half of an AoC card:
1. Identify the prescribed installation position of the optical transceiver
plug-in (see the following figure).
2. To replace or install a transceiver, see Installing and removing optical
transceivers (page 6-11).

Figure 6-35: Identifying SFP installation positions on AoC (lower half)

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Installing Extractable Modules in AUX Cards


AUX cards are available in two main versions:

AUX_2I for installation in I/O slots

AUX_2X for installation in X1 and X2 slots

Refer to XDM-1000 Product Line Reference Manual for a description of the


cards.
Both AUX card versions have two positions for optical auxiliary plug-in
modules. The card construction is similar and both accept the same optical
plug-in modules. The position of the plug-in modules is identified in the
following figure (the figure shows an AUX_2X card).

Figure 6-36: AUX_2X card, location of optical plug-in modules

By following the following instructions, you can install the desired plug-in
modules according to the required functionality.

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To install an optical plug-in module:


1. Identify the prescribed installation position of the optical plug-in module
(see the previous figure).
2. Insert the rear end of the optical plug-in module into the card guides, and
push slowly backward to mate the connectors. Make sure the fastening
screws are free to move backward as the module slides in. If resistance is
felt before the connectors are fully mated, retract the module and repeat the
insertion.
3. Fasten the optical plug-in module with its captive fastening screws.

Figure 6-37: AUX_2X card, installing a typical optical plug-in module

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Installing Extractable Modules in OADM1&4


Cards
OADM1&4 cards house an OADM plug-in module. Two main types of
OADM plug-in modules are available: single-channel OADM and four-channel
OADM. For a description of the OADM1&4 characteristics, refer to the XDM1000 Product Line Reference Manual and the XDM System Specifications.
The OADM module plugs into an optical connector located in the base card. If
the OADM module is not installed, or the currently installed module must be
replaced, install the desired plug-in module according to the following
procedure. Refer to Installing a typical OADM plug-in module in an
OADM1&4 card (page 6-67).
To install an OADM plug-in module:
1. Fully release the two extractors of the plug-in module.
2. Remove the protective cover of the optical connectors located in the base
card and on the plug-in module by pulling the attached tape.
CAUTION: Failure to remove the protective cover before
module insertion may damage the card.

3. Inspect the rear optical connector of the plug-in module, and clean foreign
matter and dust using an approved cleaning compound.
4. Insert the rear end of the plug-in module into the card guides, and push
slowly backward to mate the connector.
Make sure the fastening screws are free to move backward as the module
slides in. If resistance is felt before the connectors are fully mated, retract
the module and repeat the insertion.
5. Fasten the plug-in module with its two captive screws.

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Figure 6-38: Installing an OADM plug-in module in an OADM1&4 card

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Installing Extractable Modules in MO_CW2


Modules
The MO_CW2 base module houses two plug-in modules (refer to the XDM1000 Product Line Reference Manual for a description of the various versions).
Each plug-in plugs into a mating connector located in the base module. You
can install the desired plug-in modules according to the required functionality,
as shown in the following figure.

Figure 6-39: Installing a typical plug-in in an MO_CW2 module

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To install a plug-in in the MO_CW2 module:


1. Identify the prescribed installation position of the plug-in on the module.
2. Inspect the connectors of the plug-in and the mating connector on the base
MO_CW2 module, and clean any foreign matter and dust.
3. Retract the two screws on the plug-in panel to ensure that they will not
prevent full insertion into the base MO_CW2 module.
4. Insert the rear end of the plug-in into the guides of the prescribed
installation position, and push slowly backwards to mate the connectors. If
resistance is felt before the connectors are fully mated, retract the plug-in
and repeat the insertion.
5. Secure the plug-in with the two screws.
6. If necessary, repeat the procedure for the second plug-in.

Installing CMBR40 and TRP40_2


Cards for Different Configuration
Options
If you need to install two TRP40_2 or CMBR40 cards as an OCH 1+1
protection pair or a pair of TRP40_2 cards to be used in regenerator mode, read
the following sections.

Installing TRP40_2 Cards for Regenerator


Mode
To install a pair of TRP40_2 cards to be configured in regenerator mode, you
need an optical fiber cable.
To install two TRP40_2 cards for use in regenerator mode:
1. Insert one of the TRP40_2 cards in slots IC2 and IC3.
2. Insert the other TRP40_2 card in slots IC4 and IC5.

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3. Connect an optical fiber from the client port of one of the cards to the client
port of the other card. The following figure shows the position of the client
port on each card:

Figure 6-40: TRP40_2/2B front view

The two TRP40_2 cards are now installed correctly for configuration in
regenerator mode.

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Installing Two TRP40_2 or CMBR40 Cards as


an OCH 1+1 Protection Pair
To install two TRP40_2 or CMBR40 cards as an OCH 1+1 protection pair, you
need an IOP cable.
To install two TRP40_2 or CMBR40 cards as a protection
pair:
1. Insert one of the cards in slots IC2 and IC3.
2. Insert the other card in slots IC4 and IC5.
3. Connect the IOP cable from the IOP cable port on one card to the IOP cable
port on the other card. The following figure shows the position of the IOP
cable port on the TRP40_2 card.

Figure 6-41: TRP40_2/2B front view

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The following figure shows the position of the IOP cable port on the
CMBR40 card.

Figure 6-42: CMBR40/40B front view

The cards are now installed correctly to be configured as an OCH 1+1


protection pair. The card on the right can be configured as the main card.
The card on the left can be configured as the standby card.
CAUTION: If you need to remove either of the cards in the

protection pair, disconnect any optical fiber connecting the


card to a client transceiver before disconnecting the IOP
cable. Disconnecting the IOP cable before disconnecting the
optical fiber can cause unnecessary protection switching.

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Installing xMCP Cards


Before you start:
Visually inspect the cards and the mating backplane connectors to make sure
there are no signs of physical damage. In particular, check for bent or damaged
connector pins.
xMCP cards are installed in slots C1 and C2.
NOTES:

When the XDM platform is equipped with a single xMCP


card, always install it in slot C1.
You may install xMCP cards in slot C2 only when the
card supports redundancy.
If two xMCP cards are installed in the XDM platform they
must be of the same type.

CAUTION: When inserting cards, make sure to carefully

align the card with the platform guide rails. If resistance is felt
during insertion, immediately retract the card/module and
repeat the process.
Hold the card straight during insertion and removal, and pull
or push it slowly and carefully to avoid touching components
located on adjacent cards.
Do not use excessive torque when tightening fastening
screws.

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To install the xMCP:


1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
identification labels.
4. If the NVM card is not installed in the xMCP module, install it as follows:
a. Check that the NVM card has not been physically damaged during
shipment.
b. Remove the NVM card from its antistatic protection packaging and
perform a visual inspection to detect damage during shipping. Report
any problems.
c. Orient the NVM card as shown, and then insert its rear end (the end
with the connector) in the card guides. Push it in until it is locked in
place.

Figure 6-43: NVM card installation

5. Bring both extractor handles of the card to the horizontal position.


6. Identify the assigned slot (C1 or C2) and insert the rear end of the card in
the corresponding card guides.
7. Push the card in until it mates the chassis connectors. If resistance is felt
before the connectors are mated, pull the card out and repeat the procedure.
8. Press the ends of the two extractor handles to fully insert the card and lock
it in place.

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Installing xMCP-B/B2G Cards


Before you start:
Visually inspect the cards and the mating backplane connectors to make sure
there are no signs of physical damage. In particular, check for bent or damaged
connector pins.
xMCP-B/B2G cards are installed in slots C1 and C2.
NOTES:

When the XDM platform is equipped with a single xMCP


card, always install it in slot C1.
If two xMCP cards are installed in the XDM platform they
must be of the same type.

CAUTION: When inserting cards, make sure to carefully

align the card with the platform guide rails. If resistance is felt
during insertion, immediately retract the card/module and
repeat the process.
Hold the card straight during insertion and removal, and pull
or push it slowly and carefully to avoid touching components
located on adjacent cards.
Do not use excessive torque when tightening fastening
screws.

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Refer to the following figure when performing the procedure.

Figure 6-44: Installation of an NVM on xMCP-B card

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To install the xMCP-B/B2G:


1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
identification labels.
4. If the NVM card is not installed in the xMCP-B/B2G card, install it as
follows:
a. Check that the NVM card has not been physically damaged during
shipment.
b. Remove the NVM card from its antistatic protection packaging and
perform a visual inspection to detect damage during shipping. Report
any problems.
c. Orient the NVM card in front of the card guides, and then insert its rear
end (the end with the connector) in the card guides. Push it in until it is
locked in place (the release push button is flush with the NVM).

Figure 6-45: NVM card installation

d. Place the NVM cover on the NVM and close it with its two captive
screws, as illustrated.
NOTE: If the NVM cover is not closed properly the system
will not operate.

5. Bring both extractor handles of the card to the horizontal position.


6. Identify the assigned slot (C1 or C2) and insert the rear end of the card in
the corresponding card guides.
7. Push the card in until it mates the chassis connectors. If resistance is felt
before the connectors are mated, pull the card out and repeat the procedure.
8. Press the ends of the two extractor handles to fully insert the card and lock
it in place.
9. Push the reset control and rotate it counter-clockwise to lock the lower
extractor handle.

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Installing MECP Cards


Before you start:
Visually inspect the cards and the mating backplane connectors and make sure
that there are no signs of physical damage. In particular, check for bent or
damaged connector pins.
MECP cards are installed in dedicated slots located above slots C1 and C2.
CAUTION: When inserting cards, make sure to carefully

align the card with the platform guide rails. If resistance is felt
during insertion, immediately retract the card/module and
then repeat the process.
Hold the card straight during insertion and removal, and pull
or push it slowly and carefully to avoid touching components
located on adjacent cards.
Do not use excessive torque when tightening fastening
screws.

To install the MECP:


1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and perform a
visual inspection to detect damage during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
identification labels.
4. Bring the extractor handle of the MECP to the horizontal position.
5. Identify the assigned slot (located above slots C1 and C2), and insert the
rear end of the MECP in the corresponding card guides.
6. Push the MECP in until it mates the chassis connector. If resistance is felt
before the connectors are mated, pull the card out and repeat the procedure.
7. Press the end of the extractor handle to fully insert the MECP and lock it in
place.

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Installing Aurora-G Cards


The following sections describe the steps of a typical Aurora-G installation.
Before you begin installation, verify that you have all required components, as
described in Unpacking and Visual Inspection (page 4-9). Review the safety
guidelines provided in Before You Start/Safety Guidelines (page 1-1). When
working with the Aurora-G card, be sure to keep the following safety
guidelines in mind.
CAUTION: STATIC SENSITIVE DEVICES. PROPER
HANDLING AND GROUNDING PRECAUTIONS
REQUIRED.

XDM equipment contains components sensitive to


electrostatic discharge (ESD). To prevent ESD damage, avoid
touching the internal components, and before handling cards,
touch the frame of a grounded equipment or rack. Keep parts
and cards in their antistatic packaging material until you are
ready to install. The use of an antistatic wrist strap connected
to a grounded equipment frame or rack is recommended when
handling cards during installation, removal, or connection to
internal connectors. For more information, see Protection
Against Electrostatic Discharge (page 1-26).

CAUTION: During the installation of SFP transceivers, make


sure that all optical connectors are closed by protective caps.
Do not remove the covers until an optical fiber is connected
to the corresponding connector. Be aware that the SFP
transmitter may start transmitting as soon as it is inserted into
a working card.

WARNING: The Aurora-G contains a lithium battery, which

users should not attempt to replace. Battery replacement must


be performed by qualified ECI personnel. There is a risk of
explosion if a battery is replaced by the incorrect type.
Dispose of used batteries according to the instructions.

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Unpacking and Visual Inspection


Before you start:
Verify that you have the correct cables and SFP modules.
The standard SFPs and cables used by the Aurora-G are listed in the following
table. The listed connector type indicates only what is required to connect
directly to the Aurora-G ports, and may or may not be the same connector type
required for the other end of the cable.
Table 6-3:

Aurora-G cables

Aurora-G port

SFP

Cable

Mating
connector

Quantity
per card

RS-232 local PC
port

---

RS-232 shielded copper null


modem cable

DB-9 male

Gigabit Ethernet
local and remote
ports

Dual fiber optical SFPs


OTGBE_SX: 1000BaseSX
(850 nm MM)
OTGBE_LX: 1000BaseLX
(1310 nm SM) 10 km
OTGBE_ZX: 1000BaseZX
(1550 nm SM) 80 km

9/125 m single mode duplex LC male


fiber pair
(1 transmit, 1 receive)
or
62.5/125 m multimode
duplex fiber or simplex fiber
pair
(1 transmit, 1 receive)

ETGBE: Electrical 1000BaseT


SFP

UTP 4-pairs with overall


shield

RJ-45 male

---

Shielded Category 5 straight


through cable (STP) 16

RJ-45 male

10/100 Ethernet
Management ports

2
(1 per port)

NOTE: To meet the requirements of FCC Part 15 and the EU


EMC Directive 89/336/EEC, use only shielded cables (DB-9
null modem cables and Category 5 STP cables).

16

The 10/100 Management port is autosensing for polarity. You can use either a crossover cable or a shielded
Category 5 straight through cable when connecting to this port.
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Installing the Aurora-G Card


Standard Aurora-G installation includes the following steps.
To install the Aurora-G card:
1. Install SFP transceivers in the Aurora-G card.
For detailed SFP installation instructions, see Installing and removing
optical transceivers (page 6-11).
2. Install the Aurora-G card in the I/O card cage.
For detailed Aurora-G card installation instructions, see Installing I/O
Cards and Modules (page 6-90). During installation, you may refer to the
following figure.

Figure 6-46: Aurora-G card insertion

Aurora-G cards can be installed in any I/O slot of the XDM-500 cage. The
procedures in this section can also be used to replace cards in an operating
platform, provided the safety precautions are strictly obeyed. Refer to the
safety guidelines provided in Before You Start/Safety Guidelines (page
1-1).
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3. Connect the cables to the Aurora-G ports.


When connecting the card cables, you may refer to the port labels included
in the following figure.
a. Connect the RS-232 port (located at the bottom of the front panel)
directly to a PC using a DB-9 null modem cable.
b. Connect the 10/100 Ethernet management port (located at the top of the
front panel) to the DCN or directly to a management station using a
Category 5 STP cable with an RJ-45 connector. If connecting directly,
the workstation and management port IP addresses must be on the same
subnet.
c. Connect the remote port fiber cable (located on the upper SFP module)
to the XDM Layer 1 or Layer 2 card (EIS, DIOB, etc.).
d. Connect the local port fiber cable (located on the lower SFP module) to
the local network router or switch.

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Figure 6-47: Aurora-G connectors

4. Set the management IP address.


The IP address of the management port must be set to an IP address
suitable for your network. Setting the IP address of the management port is
described in detail in Configuring the Management IP Address (page 6-86).

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5. Install the cover plate.


After assigning the management IP address, disconnect the serial port cable
and install the cover plate. The cover plate is necessary to comply with
electromagnetic compatibility (EMC) requirements. To install the cover
plate on the Aurora-G front panel:
a. Disconnect the serial port cable from the Aurora-G.
b. Guide the remaining three cables from the remote, local, and
management ports to the top of the card.
c. Using the two screws provided, attach the cover plate to the front panel,
as illustrated in the following figure.

Figure 6-48: Aurora-G with cover plate in place

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Understanding the Aurora-G LED Indicators


Whenever the Aurora-G is initialized or reset it reports a failure until it has
successfully completed a (re)boot. While (re)booting, the Aurora-G runs a
series of built-in diagnostic tests. As the tests are run, the diagnostic code
displayed on the card's front panel cycles through codes 01-09, reflecting the
number of the test currently being run. Note that the diagnostic code display is
only visible when the Aurora-G cover plate is removed.
After (re)booting, the Aurora-G card alarm indicators should accurately reflect
the results of the built-in diagnostic tests. The Aurora-G indicator lights are
identified in the following figure.

Figure 6-49: Aurora-G LED indicators

A successful (re)boot is indicated as follows:

Green power LED illuminated

Red card failure LED off

Diagnostic code set to 00

EMS-Aurora reports no card alarms

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A failed (re)boot is indicated as follows:

Red card failure LED illuminated

Diagnostic code indicates the number of the test that failed

EMS-Aurora reports the appropriate card alarm

In case of a card failure, refer to Troubleshooting procedures for Aurora-G


cards (page 9-26).
NOTE: While (re)booting, the Aurora-G discards all traffic
on its data ports. Traffic is discarded until the Aurora-G
successfully negotiates a secure tunnel with its peer.

Configuring the Management IP Address


Before you put the Aurora-G into operation in the network, you must change
the IP address of the management port from its factory default to an IP address
suitable for your network. Management port configuration is performed
through a serial link to the RS-232 port.
To log in to the CLI via a serial link:
1. Connect the RS-232 port directly to the terminals serial port using a DB-9
null modem cable.
2. Open a terminal session through a VT-100 terminal emulation program
such as HyperTerminal. Enter the connection name, the appropriate serial
port (usually COM1 or COM2), and the serial port parameters defined in
the following table.
Table 6-4: Serial port parameters

6-86

Parameter

Value

Baud speed

115,200

Parity

None

Data bits

Stop bits

Flow control

None

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3. In the terminal session window, press ENTER. The CLI Username:


prompt appears.
User Access Verification
Username:

NOTE: User names and passwords are case sensitive.

4. At the Username: prompt, type the user name admin and press
ENTER. The CLI Password: prompt appears.
User Access Verification
Username: admin
Password:

5. At the Password: prompt, type the default password admin and press
ENTER.
When you have successfully logged in, the admin> prompt appears as
follows.
User Access Verification
Username: admin
Password:
admin>

Note that the password text is not displayed.

Management IP Address Guidelines


Management port configuration involves the following components:

IP address: This is the 10/100 Ethernet management port IP address that


identifies the Aurora-G to the management workstation.
Subnet mask: This is the portion of the IP address that identifies the
network or subnetwork for routing purposes.
Default gateway: This is used to route packets to the workstation if you
manage the Aurora-G remotely and the Aurora-G and the management
workstation are on different subnets. When the management port and the
workstation are on the same subnet, a default gateway is not needed to
route packets between the two devices.

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The default gateway identifies the local router port on the same subnet as
the Aurora-G 10/100 management port. The Aurora-G sends all packets to
the specified router for forwarding to the management station. The
following figure illustrates a default gateway when the Network
Management Host and Aurora-G are on different subnets. The Network
Management Hosts IP address is 192.168.1.10, and the management port
IP address is 192.168.10.10. To send packets between the two devices, the
local port on Router #1 is specified as the default gateway (192.168.10.1).
The gateway address must match the subnet of the management port.

Figure 6-50: Management port default gateway

NOTE: If the Aurora-G management port is directly

connected to the management workstation, the host IP address


and the management port IP address must be on the same
subnet.

To configure the management port IP address after the first


initial installation:
1. At the CLI admin> prompt, type configure terminal to enter
configuration mode.
2. At the config> prompt, type interface management.
3. At the config-ifMan> prompt, type the following command line:
ip address <ip address> <subnet mask> <gateway>

Replace the command line parameters in the preceding command line with
the appropriate values, as explained in the following table.

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Table 6-5:

Card and Module Installation

IP address command line parameters

Parameter

Description

<ip address>

Management port IP address, entered in dotted decimal notation.

<subnet mask>

IP subnet mask, entered in dotted decimal notation.

<gateway>

Specifies how to route traffic between the Aurora-G and the


management station. If the two devices are on the same subnet,
specify none as the gateway. When the Aurora-G and
management station are on different subnets, specify the IP
address of the routers local port on the same subnet as the
Aurora-G management port.

1. Type the exit command twice to return to the command prompt.


2. To save the configuration, type the following command:
copy system:running nvram:config
You can also use the command shortcut copy s n.
3. Type exit to log off.
The following example illustrates how to define and save an IP address
configuration. The values used in this example match the management port IP
address, subnet mask, and gateway for the Aurora-G configuration illustrated in
Management IP address guidelines (page 6-87).
admin> configure terminal
config> interface management
config-ifMan> ip address 192.168.10.10 255.255.255.0
192.168.10.1
config-ifMan> exit
config> exit
admin> copy s n
admin: exit

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Installing I/O Cards and


Modules
Before you start:
Make sure that all the cards specified for this XDM platform are available.
Identify the relevant XDM-500 slots (page 6-4). You may also need blank
panels to cover unused slots in the modules cage, for your safety and to comply
with electromagnetic compatibility (EMC) requirements (where relevant).
The following procedures can also be used to replace cards in an operating
platform, provided the safety precautions are strictly obeyed (see "Installing
XDM-500: Before You Start Safety Guidelines" page 1-1).
CAUTION: Visually inspect the card and the mating

backplane connectors and make sure that there are no signs of


physical damage. In particular, check for bent connector pins.

CAUTION: When inserting cards, make sure to carefully


align the card or module with the platform guide rails. If
resistance is felt during insertion, immediately retract the
card/module and repeat the process.

Hold the card/module straight during insertion and removal,


and pull or push it slowly and carefully to avoid touching
components located on adjacent cards.
Do not use excessive torque when tightening the fastening
screws.

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To install a card in the cards cage:


1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and inspect it
visually for damage incurred during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
identification labels.
4. For cards with reset control, for example HLXC, SIO164, Aurora-G, and so
on, first turn the reset control to the vertical position as shown in the
following figure

Figure 6-51: Inserting cards with reset control

5. The cards have either one or two extractors. Move all extractor handles to
the horizontal position before inserting the card in its slot.
6. Identify the assigned slot and insert the rear end of the card in the
corresponding card guides.
7. Push the card in until it mates the chassis connectors. If resistance is felt
before the connectors are mated, pull the card out and repeat the procedure.

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8. For cards with reset control, for example HLXC, SIO164, Aurora-G, and so
on, return the reset control to the horizontal position to release the extractor
handle.
9. Press the ends of all extractor handles to fully insert the card and lock it in
place.
10. After inserting all the cards, check the card insertion diagram that
everything is correct.

Installing a Card in the CCP Cage


Before you start:
Before starting, make sure that all the cards and modules specified for
installation in this XDM platform according to the platform card installation
plan are available.
Identify the relevant XDM-500 slots (page 6-4). You may also need blank
panels to cover unused slots in the CCP cage, for your safety and compliance
with electromagnetic compatibility (EMC) requirements.
The following procedures can also be used to replace cards and modules in an
operating platform, provided the safety precautions are strictly obeyed (see
"Installing XDM-500: Before You Start Safety Guidelines" page 1-1).
CAUTION: Visually inspect the card and the mating

backplane connectors and make sure that there are no signs of


physical damage. In particular, check for bent connector pins.

CAUTION: When inserting cards and modules, make sure to

carefully align the card or module with the platform guide


rails. If resistance is felt during insertion, immediately retract
the card/module and repeat the process.
Hold the card/module straight during insertion and removal,
and pull or push it slowly and carefully to avoid touching
components located on adjacent cards/modules.
Do not use excessive torque when tightening the fastening
screws of cards and modules.

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To install a card in the CCP cage:


1. Check that the card has not been physically damaged during shipment.
2. Remove the card from its antistatic protection packaging and inspect it
visually for damage incurred during shipment. Report any problems.
3. Record the hardware and software versions as indicated on the card
identification labels.
4. The modules have two extractors. Bring both extractor handles to the
horizontal position before inserting the module in its slot.
5. Identify the assigned slot, and insert the rear end of the module in the
corresponding card guides.
6. Push the module in until it mates the chassis connectors. Make sure the two
fastening screws are free to move backward as the module slides in. If
resistance is felt before the connectors are mated, pull the module out and
repeat the procedure.
7. Press the ends of the two card extractors to fully insert the module, and then
fasten the module to the chassis by tightening the two fastening screws.
8. After inserting all the modules, check for correct installation against the
module insertion diagram. Install blank panels over all the free slots.

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7
Optical Fiber and Cable
Installation and Routing
In this chapter:
Connecting Cables ........................................................................................... 7-1

Connecting Cables
This section provides instructions for connecting cables to XDM platforms.
The information presented in this section supplements the information
regarding the connection of power, alarm, traffic, and grounding cables given
in Installing Ancillary Units in Racks (page 4-44).
Connect the cables to the equipment connectors according to the information
appearing in the relevant cabling diagrams or tables. To identify the physical
location of connectors, use the equipment panel figures appearing in this
section and in the XDM-1000 Product Line Reference Manual.

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Connecting Traffic Cables to Optical


Interfaces
Routing Guidelines for Type A ETSI Rack
The Type A ETSI rack offered by ECI (see description in the XDM-1000
Product Line Reference Manual) has been designed to enable efficient and
clean routing of cables and optical fibers.
The cables and optical fibers are routed through easily reached conduits
identified in the general view of the rack.
Before you start:
1. Obtain the site cabling diagram and the detailed cabling diagrams or tables.
For shelves with optical interfaces, you also need the internal cabling
diagrams for each platform.
2. Prepare the necessary cables. During cable preparation, refer to the
information appearing in Site Preparation (page 4-1) and Connector Pin
Assignments (page B-1). Cables should be labeled according to the cabling
diagrams or tables.
To reach the fiber conduits:
1. Open the front door.
2. Release the two side panel locking handles.
3. Turn the side panel to the left.
To remove the side covers and reach the cable conduits:
1. Hold the cover by its handle, and raise it slightly (about 1.5 cm or in.)
until its three bolts clear the matching slots.
2. Retract the cover and place it in a safe position.
3. Repeat the procedure for the other cover.

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Figure 7-1: Removing side covers of a Type A ETSI rack

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4. At the desired exit point, route the fibers through one of the conduit slots.
The following figure shows details of cable and fiber routing within the
rack:

Cables are pulled through the cable conduit down to the level of the
connectors to which they will be connected.
Fibers are taken from the nearest FST and routed through the side fiber
conduit. To open the conduit, temporarily remove the relevant sections
of its cover.

Figure 7-2: Type A ETSI rack cable routing details

NOTE: It is recommended to fasten the group of fibers with


Velcro strips. Make sure to avoid stressing the fibers,
especially while bending.

5. When done, close the conduit covers.

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Routing in Standard Racks


The following figure shows how cables are routed in standard racks, using the
accessories described in the XDM-1000 Product Line Reference Manual.

Figure 7-3: Cable routing details for regular rack

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Routing and Connecting Optical Fibers


This section describes the general optical fiber routing and connection
procedure. The following sections present specific connection procedures for
optical components that require special attention.
Before you start:
Make sure to use the special extractor tool for optical connectors (page 4-8).
Before installing optical fibers, it is recommended to thoroughly clean their
connectors using an approved cleaning kit.
NOTE: The LINE connector of the OFA_R, as well as the

mating connector on the fiber connected to this connector and


any other connectors handling this optical within the site, for
example, at ODF panels, require thorough cleaning. A
microscope must be used to enable more complete cleaning.

Imperfect cleaning may cause the OFA_R APR mechanism to


operate as a result of excessive back reflections. This will
shut down the link, until a restart command is given.

All external optical fibers are terminated on FSTs. The fibers are then routed
through the fiber guides that run along the rack sides down to the level of the
equipment to which they are connected.
CAUTION: Make sure that all the optical connectors are

closed at all times by the appropriate protective caps or by the


mating cable connector. Do not remove the protective cap
until an optical fiber is connected to the corresponding
connector, and immediately install a protective cap after a
cable is disconnected.

Some optical connectors, mainly connectors in which


high-level optical signals may be present, have spring-loaded
covers. For your protection, do not impede the free movement
of the covers, and make sure the covers are free to return to
their normal position (over the connector opening) as soon as
the optical fiber is disconnected.
The minimum bending radius of optical fibers is 35 mm
(1.4 in.). Sharp bending of fibers may degrade the optical
transmission characteristics.

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To bring an optical fiber to the desired location:


1. Slowly pull the fiber end or remove the desired length from the FST.
2. Insert the end in the appropriate fiber guide, and route it to the desired
level.
3. At the desired level, pass the fiber through one of the slots in the fiber
guide, and bring its end to the designated connector. Leave some slack to
prevent stress.
NOTE: Some of the LC connectors installed in the optical

cards and plug-in modules have spring-loaded covers. Make


sure to open the cover and hold it in the open position until
the mating fiber is connected.

4. Connect the fiber connector to the designated equipment connector. For LC


and SC connectors, use the special extractor tool to ensure reliable mating
of the connectors (see "Extractor Tool for Optical Connectors" page 4-8).

Connecting Fibers to the MECP_OSCxx and


MECP_OCxxOW
The optical connectors of the MECP_OSCxx and MECP_OCxxOW card are
installed on a swivel mechanism. This facilitates connection of the fibers.
NOTE: The following procedure is illustrated on an
MECP_OSC card.

To connect the fibers to the MECP_OSCxx/MECP_OCxxOW


card:
1. Install the MECP_OSCxx/MECP_OCxxOW card according to instructions
in Installing MECP Cards (page 6-78).
2. Refer to the following figure and press the handle to bring the optical
connector assembly to the CONNECTION position.
3. Connect the prescribed optical fibers to the MECP_OSCxx or
MECP_OCxxOW connectors.
4. Raise the handle to return the connector assembly to the NORMAL
position.

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Figure 7-4: MECP_OSC card optical connections

Connecting Fibers to the OADM1&4


The upper set of optical connectors of OADM1&4 cards (designated ADD IN,
ADD OUT, DROP IN, DROP OUT) are also installed on a swivel mechanism
similar to that of the MECP_OSCxx/MECP_OCxxOW card (see "Connecting
Fibers to the MECP_OSCxx and MECP_OCxxOW" page 7-7). Therefore, you
can use the procedure described above to connect fibers to these connectors.

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Connecting Fibers to the SIO16


A very large number of fibers need to be connected to a fully equipped SIO16
card. It is therefore very important to carefully plan their routing.
The best approach is to split the fibers in several bundles, for example three,
and route each bundle through a separate cable exit slot of the platform cards
cage.

Connecting Fibers to the OFA_R/RM/HRM


The OFA_R, OFA_RM, and OFA_HRM each require three fibers:

Fiber for connecting the OFA_R/RM/HRM EDFA connector to the LINE


connector of an OFA_M or OFA_2 card

Fiber for connecting the OFA_R/RM/HRM SVC connector to the


prescribed SVC connector

Fiber for connecting the external line to the OFA_R/RM/HRM LINE


connector
NOTE: The connection to the external line should pass
through an ODF capable of handling the high-power signals
generated by the OFA_R card. ECI offers a special ODF
version, ODF-HP, for this purpose.

The additional OFA_R/RM/HRM connector, MON, is used only during


maintenance activities.
The OFA_R/RM/HRM card is shipped with caps installed on all the
connectors. Make sure to keep the caps on until the fibers are connected. Keep
the removed caps for use, in particular the caps of the SVC and MON
connectors.

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Specific safety precautions for OFA_R/RM/HRM


cards
This section provides additional safety instructions related to the
OFA_R/RM/HRM that supplement the general laser safety information (see
"Laser Safety Requirements" page 1-21).
These instructions will help you prevent dangerous situations and possible eye
injury to yourself and to your colleagues.

Always use protective goggles with minimum OD6 when working on


OFA_R/RM/HRM cards or on parts of the system that carry
OFA_R/RM/HRM signals (fibers, ODFs, and so on). Inspect the goggles
for integrity (scratches, broken lenses, and any other type of damage);
replace the goggles if in doubt.

Work on OFA_R/RM/HRM cards must be carried out only in a restricted


access area. Only people trained in laser safety may be allowed to enter the
work area.

The optical path carrying OFA_R/RM/HRM signals must be fully installed


before starting to connect fibers to the OFA_R/RM/HRM. All the fibers
carrying such signals must be inspected to ensure that they are in good
condition. Replace any fiber section if in doubt.

Place warning labels alongside all the connectors of fibers that carry
OFA_R/RM/HRM signals, in particular on the ODF connectors, as follows:
HAZARD LEVEL 3B.
DO NOT DISCONNECT UNDER OPERATION.

Under no circumstances (installation, operation, measurements, and


maintenance activities) should you apply power to an OFA_R/RM/HRM
card unless fibers are connected or protective caps are installed on its
connectors. Observe the following precautions:

Complete all the optical connections between the OFA_R/RM/HRM


and an ODF, another card, test jig, or test equipment before applying
power.
If the connections to the OFA_R/RM/HRM have not yet been made, for
example during platform installation activities, always install protective
caps on the OFA_R optical connectors.
When time comes to connect fibers to the OFA_R/RM/HRM, first
make sure the platform is not powered and cannot be powered while
you work on it.

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When it is necessary to disconnect a fiber or replace a component along the


path of the OFA_R/RM/HRM signals while the OFA_R/RM/HRM is
powered, first disconnect the fiber from the LINE connector and only then
disconnect the far end of a fiber.
NOTE: Opening the protective cover of the

OFA_R/RM/HRM LINE connector automatically turns off


the OFA_R/RM/HRM pump lasers. However, when the
OFA_R is used in the forward mode, significant optical
power (generated by the EDFA amplifier connected to the
OFA_R) may still be present until the ALS function turns the
EDFA amplifier off.

When the APR mechanism is temporarily disabled, for example during


maintenance, place a warning label that notifies other persons and serves as
a reminder to reactivate APR after the maintenance activity has ended.

Connection instructions
Before you start:
1. Use a microscope to check that the LINE connector and the mating fiber
connector are clean.
2. Familiarize yourself with the items identified in the following figures.
3. Read the OFA_R/RM/HRM specific safety instructions.
To connect fibers to the SVC and EDFA connectors:
1. Bring the end of the fiber intended for connection near the SVC connector.
2. Remove the SVC connector cap and immediately connect the fiber to the
connector.
3. Route the fiber intended for connection to the EDFA connector along the
right-hand side of the card, through the upper fiber guide, and bring its end
near the connector.
4. Remove the EDFA connector cap and immediately connect the fiber to the
connector.

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To connect the fiber to the LINE connector:


1. Open the lock screw of the LINE connector cover.
2. Open the protective cover of the LINE connector.
3. Route the fiber intended for connection to the LINE connector along the
right-hand side of the card, through the upper and lower fiber guides, and
bring its end near the LINE connector.
4. Remove the LINE connector cap and immediately connect the fiber to the
connector.
5. Close the protective cover and fasten it with its lock screw.

Figure 7-5: Opening OFA_R protective cover

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Figure 7-6: OFA_R connectors

Connecting Fibers to the ODF_HP


Specific safety precautions
ODF_HP is an optical distribution frame for fibers carrying high-power optical
signals (Hazard Level 3B). A typical application for the ODF_HP is to handle
the connections to the line side of the OFA_R Raman amplifiers offered by
ECI.
This section provides additional safety instructions relating to the ODF_HP and
OFA_R that supplement the general laser safety information (see "Laser Safety
Requirements" page 1-21).

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These instructions will help you prevent dangerous situations and possible eye
injury to yourself and to your colleagues.

Always use protective goggles with minimum OD6 when working on the
ODF_HP, on the fibers that connect to the ODF_HP, and on any parts of
the system that carry OFA_R signals. Inspect the goggles for integrity
(scratches, broken lenses, and any other type of damage); replace the
goggles if in doubt.

Work on the ODF_HP must be carried out only in a restricted access area.
Only people trained in laser safety may be allowed to enter the work area.

Do not connect fibers to the LINE connector of an OFA_R until the


ODF_HP and the optical paths carrying OFA_R signals are fully installed.
All the fibers carrying such signals must be inspected to ensure that they
are in good condition. Replace any fiber section if in doubt.

Place warning labels alongside the connectors of the fibers that carry
OFA_R signals, in particular on the ODF_HP front panel and near the
connectors, as follows:
HAZARD LEVEL 3B.
DO NOT DISCONNECT UNDER OPERATION.

When it is necessary to disconnect a fiber or replace a component along the


path of the OFA_R signals while the OFA_R is powered, first disconnect
the fiber from the LINE connector of the OFA_R, and only then disconnect
the far end of a fiber.

Connection instructions
Before you start:
1. Use a microscope to check that the ODF_HP fiber tray connectors and the
mating fiber connectors are clean.
2. Bring the ends of the fibers to be interconnected at the ODF_HP to the
level of the ODF_HP: the fibers terminated in connectors must be routed
along the right-hand side of the rack, and fibers to be spliced along the
left-hand side.
3. Familiarize yourself with the items identified in the following figures.
4. Read the ODF_HP and OFA_R specific safety instructions.

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To splice fibers to the ODF_HP pigtails:


1. Open the two locks securing the front panel of the ODF_HP.
2. If the ODF_HP has two fiber trays, identify the fiber tray on which you will
work in accordance with the site installation plan, and then pull the fiber
tray out to the position shown in the following figure.

Figure 7-7: ODF_HP view with open panel

3. Open the lid of the fiber tray (see internal details in the following figure).

Figure 7-8: Detailed view of fiber tray with lid removed

4. Route each fiber to be spliced to a pigtail through the fiber harness exit into
the ODF_HP.
5. Route each fiber to the splices comb, as shown in the previous figure. Make
sure to leave enough slack.
6. Splice the fiber to the pigtails connecting to the prescribed connector in
accordance with the site installation plan. Record the fiber identification
data on the label located on the fiber tray lid.

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7. Repeat the process until all the fibers have been spliced.
8. Form the fibers into a harness, and secure the harness with cable ties as
shown in the following figure.

Figure 7-9: Fastening the fiber harness to the exit of the fiber tray

To connect the fibers from the OFA_R to the tray:


1. Route each fiber to be connected to a tray connector into the ODF_HP
through the fibers entry on the right-hand side.
2. Identify the appropriate fiber tray connector in accordance with the site
installation plan.
3. Bring the end of the fiber intended for connection near the corresponding
connector.
4. When ready to connect, remove the connector cap and immediately connect
the fiber connector to the tray connector.
5. Repeat the process until all the fibers have been connected.
To reinsert the fiber tray into the ODF_HP:
1. After completing all the connections to the fiber tray, inspect the work and
then reinstall the fiber tray lid.
2. Neatly arrange the fibers and then raise the fiber tray to the horizontal
position.
3. Slowly push the tray inward until it is fully inserted. At all times, observe
the fibers and guide them so as to prevent sharp bends.
To connect fibers to the additional tray of the ODF_HP:

If the ODF_HP has an additional fiber tray, make the necessary


connections as explained above.
If not, skip directly to Closing the ODF_HP procedure.

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To close the ODF_HP:


1. Make sure the ODF_HP fiber trays are fully inserted and that the fibers
attached to each tray are properly routed, with enough slack and without
any sharp bends.
2. Raise the front panel of the ODF_HP and lock it in place.

Connecting Traffic Cables to Electrical


Interfaces
Routing and Connecting Multipair Cables
Multipair cables are used to connect to the balanced E1 (2.048 Mbps)
interfaces in M2_21B and M2_84B electrical connection modules. Up to six
cables can be connected to each M2_84B module, and up to two cables to each
M2_21B module.
Each multipair cable consists of 14 quads (a quad comprises two twisted pairs),
for a total of 28 twisted pairs per cable. The cable end connecting to the XDM
platform is terminated in a 68-pin SCSI male connector.
As part of the site preparations, suitable cables should be routed from the
relevant DDF to the intended rack location. Sufficient length should be
available to permit routing the cables to the appropriate level in the rack.
To route and connect multipair cables:
1. Arrange the multipair traffic cables in two groups and route them through
the cables guides (combs) attached to the rack side rails.
2. Pull each multipair cable down to the level of the corresponding electrical
connection module.
3. Bend the cable and thread it through the side cable combs of the rack and
through the appropriate opening of the special cable guide serving the
platform, until the cable connector is positioned against the appropriate
slot. Use cable ties as required to fasten the cable to the rack side rails.
4. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
5. Assemble 68-pin SCSI male connectors on the multipair cables (see
"Connector Pin Assignments" page B-1).
6. Connect the cable connector to the corresponding electrical connection
module connector.
CAUTION: Exerting excessive tightening torque to secure
the cable connector may damage the electrical connection
module.

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7. Secure the cable connector to the module connector by means of the two
cable connector screws. Tighten the screws by hand. If the screws cannot
be reached with your bare hand, use an adjustable-torque flatblade
screwdriver (maximum blade size 0.6). Set the tightening torque to 40-44
Newton-cm.

Routing and Connecting Multicoax Cables


Multicoax cables are used to connect to the unbalanced E1 (2.048 Mbps)
interfaces in M2_21U and M2_84U electrical connection modules. Up to six
cables can be connected to each M2_84U module and up to two cables to each
M2_21U module.
Each cable consists of 14 pairs of 2-mm 75 coaxial cables, and the cable end
connecting to the XDM platform is terminated in a 68-pin SCSI male connector
supporting multicoax cables.
As part of the site preparations, suitable cables should be routed from the
relevant DDF to the intended rack location. Sufficient length should be
available to permit routing the cables to the appropriate level in the rack.
To route and connect multicoax cables:
1. Arrange the multicoax cables in two groups and route them through the
cables guides (combs) attached to the rack side rails.
2. Pull each multicoax cable down to the level of the corresponding electrical
connection module.
3. Bend the cable and thread it through the side cable combs of the rack and
through the appropriate opening of the special cable guide serving the
platform, until the cable connector is positioned against the appropriate
slot. Use cable ties as required to fasten the cable to the rack side rails.
4. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
5. Assemble the appropriate type of 68-pin SCSI male connectors on the
multicoax cables (see "Connector Pin Assignments" page B-1).
6. Connect the cable connector to the corresponding electrical connection
module connector.
CAUTION: Exerting excessive tightening torque to secure
the cable connector may damage the electrical connection
module.

7. Secure the cable connector to the module connector by means of the two
cable connector screws. Tighten the screws by hand. If the screws cannot
be reached with your bare hand, use an adjustable-torque flatblade
screwdriver (maximum blade size 0.6). Set the tightening torque to 40-44
Newton-cm.
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Routing and Connecting Coaxial Cables


Individual coaxial cables are used to connect to the electrical interfaces in
M1_8 and M1_16 electrical connection modules. Use 2-mm (.08-in.) 75
coaxial cables terminated in coaxial connectors matching those of the electrical
interface module (BT-43 or DIN 1.6/5.6 mm/.22 in.).
Considering the large number of coaxial cables, it is recommended to form a
separate harness from the cables connecting to the same module, and route the
harness as explained previously for multipair and multicoax cables to the level
of the required slot. Use cable ties as required to fasten the harnesses to the
rack side rails.

Routing and Connecting Ethernet Cables


Ethernet cables are used to connect to electrical interfaces on data cards and
electrical interface connection modules. Each cable consists of 4 twisted pairs.
The cable end connecting to the XDM platform is terminated in a RJ-45 plug.
As part of the site preparations, suitable cables should be routed from the
relevant DDF to the intended rack location. Sufficient length should be
available to permit routing the cables to the appropriate level in the rack. In any
case, the length of the cables must not exceed the maximum recommended for
the cable type (up to 100 meters).
NOTE: To support the Autonegotiation feature on electrical
ports, use CAT5E SFTP 2-pair or 4-pair straight cable to
connect 10/100BaseT ports, or CAT5E SFTP 4-pair straight
cable to connect 1000BaseT ports.
To route and connect Ethernet cables:
1. Based on the site cabling diagram, arrange the Ethernet cables in two
groups according to the designated data cards or modules, and route them
through the cables guides (combs) attached to the rack side rails.
2. Pull each Ethernet cable down to the level of the corresponding electrical
connection module.
3. Bend the cable and thread it through the side cable combs of the rack and
through the appropriate opening of the special cable guide serving the
platform, until the cable edge is positioned against the appropriate slot. Use
cable ties as required to fasten the cable to the rack side rails.
4. Use a cabling diagram of the site to associate module connectors with the
appropriate DDF connections. Cut excess cable length if necessary.
5. Assemble RJ-45 connectors on the Ethernet cables.
6. Connect the cable connector to the corresponding electrical connection
module connector.

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Routing and Connecting Clock Cables


The clock cables are connected to the T3_1/T4_1 and T3_2/T4_2 connectors of
the xECB. Each cable is terminated in a 9-pin D-type female connector.
To route and connect clock cables:
1. Arrange the clock cables in two groups and route them through the cables
guides (combs) attached to the rack side rails.
2. Pull each clock cable down to the level of the corresponding electrical
connection module.
3. Bend the cable and thread it through the side cable combs of the rack and
through the appropriate opening of the special cable guide serving the
platform, until the cable connector is positioned against the appropriate
slot. Use cable ties as required to fasten the cable to the rack side rails.
4. Use a cabling diagram of the site to associate module connectors with the
appropriate xECB connections. Cut excess cable length if necessary.
5. Assemble the appropriate type of 68-pin SCSI male connectors on the clock
cables (see "Connector Pin Assignments" page B-1).
6. Connect the cable connector to the prescribed connector.
CAUTION: Exerting excessive tightening torque to secure
the cable connector may damage the electrical connection
module.

7. Secure the cable connector to the mating connector by means of the two
cable connector screws. Tighten the screws by hand. If the screws cannot
be reached with your bare hand, use an adjustable-torque flatblade
screwdriver (maximum blade size 0.6). Set the tightening torque to 40-44
Newton-cm.
Use cable ties as required to fasten the cables to the rack side rails.
CAUTION: Exerting excessive tightening torque to secure
the cable connector may damage the xECB.

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Connecting Electrical Cables to ATS Cards


The ATS card has two RJ-45 connectors located on its edge. One of the
connectors is located under a protective cover, as shown in the following
figure.
When it is necessary to connect a cable to this connector, open the cover
carefully, making sure to prevent the cover from touching the lower RJ-45
connector.

Figure 7-10: Reaching the ATS card RJ-45 connectors

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Connecting Management Cables


The EMS-XDM management software is run on a workstation. The
workstation is connected to a gateway network element (GNE). The other NEs
communicate with the EMS-XDM through the network link. For more
information, refer to the EMS-XDM User Guide.
Ethernet cables are used to connect the workstation to the GNE. The
connection of out-of-band management traffic to an XDM platform is made to
the RJ-45 ETHERNET connectors located on the MECP card.
Each ETHERNET connector is wired as a 10BaseT station port:

For direct connection to a port of a 10BaseT Ethernet hub, use one


RJ-45-to-RJ-45 straight cable (cable wired point-to-point).

For connection to the Ethernet port of a PC, use an RJ-45-to-RJ-45


cross-wired cable.

Suitable standard Ethernet station cables are available from many sources.
Category 3 or better cables must be used. In any case, the length of the cables
must not exceed the maximum recommended for the cable type and hub port in
use (up to a few dozens of meters or feet).
Management cables are run from the workstation to the MAIN MNG and
PROT MNG ports on the MECP card installed in the XDM platform.
Protective components for the power supply and hard drive disks are also
recommended, and included in the following connection procedure description.

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To connect the UPS to the EMS-XDM computer, terminal,


and RAID:
As part of a comprehensive approach to network resiliency and protection,
network operators should always work with power supply protection (such as
an Uninterrupted Power Supply (UPS) unit), as well as with hard drive/data
backup protection (such as a Redundant Array of Independent Disks (RAID)
unit).
Arrange and connect each component as illustrated in the following figure.

Figure 7-11: Management workstation and protection components

To connect the EMS-XDM to the GNE through an Ethernet


cable:

Route the cables from the workstation to the MECP card on the designated
GNE.
The management network connection can either be direct from the
workstation to the GNE, or via a switch and through the internal IP
Ethernet network onsite, as illustrated in the following figure.

Figure 7-12: Connecting management workstation to MECP on the GNE

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8
Commissioning Tests
In this chapter:
Overview ......................................................................................................... 8-1
Tools and Equipment ....................................................................................... 8-2
Prerequisites .................................................................................................... 8-3
Site Commissioning Tests ............................................................................... 8-5
Network Commissioning ............................................................................... 8-10

Overview
After completing the installation and preliminary configuration of a new
network, a formal commissioning test procedure should be followed to ensure
the network has been properly installed and operates according to
specifications.
The Field Engineering Department of ECI's Transport Networking Division
usually prepares detailed commissioning test procedures for each specific
project, as well as the related acceptance forms.
The procedures in this section serve as the basis for the preparation of specific
commissioning tests for any particular network.

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If problems are detected during the tests, refer to Troubleshooting (page 9-11)
for instructions that will help you identify the source of the problem and take
corrective actions.
NOTES:

Personnel involved in the execution and supervision of


commissioning tests must be familiar with the applicable
safety precautions and requirements (see "Installing XDM500: Before You Start Safety Guidelines" page 1-1).
Unless otherwise indicated, the tests described in these
sections apply to all XDM platforms and to both SDH and
SONET.

Tools and Equipment


The following test equipment is required for the commissioning test
procedures:

PDH transmission analyzer for testing PDH transmission performance

SDH transmission analyzer for testing SDH transmission performance

Data transmission test equipment for testing GbE and 10/100 Mbps
transmission performance

Optical Power Meter (OPM)

Optical Laser Source (OLS)

Optical spectrum analyzer (recommended for measurements at points


carrying multiple wavelengths, for example, inputs and outputs of optical
amplifiers)

Optical BER tester

Set of optical attenuators with various values

Variable optical attenuator

FC-to-LC and FC-to-SC adapters

FC/FC optical patch cords

Multimeter

Equipment with suitable characteristics is available from a wide range of


manufacturers, and therefore no specific test equipment models are listed. If
necessary, contact ECI's Field Engineering Department for specific
recommendations.

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In general, you can use any equipment model meeting the applicable
international standards and having satisfactory measurement accuracy over the
range of operating parameters and environmental conditions that apply to the
network.
In addition to test equipment, make sure that the tools and materials used for
equipment installation are also available during the commissioning test
procedures.

Prerequisites
Management Requirements
Before performing the commissioning test procedures, it is necessary to set up
the management network needed to control the installed equipment. The
management network must include the functionality of ECI's network
management system.
When the network also has SYNCOM equipment, the XDM management
network may be integrated within the SYNCOM management network. For a
description of XDM integration in SYNCOM networks, see Integrating XDM
equipment in SYNCOM networks (page D-1).

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Customer Assistance
The commissioning tests perform all the tests that can be done in the customer's
network.
You may need to provide certain specific parameters to integrate the network
into existing operations. In particular, you may have to provide IP addresses for
the management of the network's equipment. Two types of IP addresses can be
used:

Global addresses: addresses unique in the whole Internet and managed by


IANA.
Private addresses: addresses allocated for internal use only and not usable
on the Internet.
Although no restrictions need to be imposed on private IP addresses except
that they conform to standardized IP address structure, the following
address spaces have been specifically put aside by IANA for use as private
addresses:

Class A addresses in the range of 10.0.0.0 to 10.255.255.255 (this


group of addresses is formally referred to as 10/8). This address space
is actually one Class A network number.
Class B addresses in the range of 172.16.0.0 to 172.31.255.255 (this
group of addresses is formally referred to as 172.16/12). This address
space defines 16 contiguous Class B network numbers.
Class C addresses in the range of 192.168.0.0 to 192.168.255.255 (this
group of addresses is formally referred to as 192.168/16). This address
space defines 256 contiguous Class C network numbers.

For its own purposes, including internal XDM IP addressing, ECI uses the
following IP Class C networks:

192.168.10.0

192.168.11.0

192.68.1.0

192.9.90.0

To prevent possible addressing conflicts and ensuing malfunctions, it is


forbidden to assign NEs and gateways any IP addresses within these
networks.

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Commissioning Tests

Site Commissioning Tests


The purpose of the site commissioning tests is to verify the normal operation of
the XDM NEs. The following procedures should be performed on each NE at
each site.
1. Checking cards and modules installed in each platform (page 8-5).
2. Performing visual inspection and mechanical checks (see "Unpacking and
Visual Inspection" page 4-9).
NOTE: It is recommended to document the final installation

using a digital camera. The information collected in this way


may be useful during troubleshooting and maintenance
activities.

3. Measuring optical levels (page 8-8). Use the reference data in the XDM
System Specification.
4. Measuring signals at monitoring points.
5. Performing the platform power-on test procedure (page 8-10).
Any problems detected during the site commissioning tests must immediately
be corrected before proceeding to other commissioning tests.

Checking Cards and Modules Installed in


Each Platform
The purpose of this check is to confirm that the required cards and modules
have been installed in each site, and to record their firmware versions and serial
numbers.
The following table provides a typical form for manually recording the cards
and modules installed in an XDM platform.
Table 8-1:

Card and module inventory

Card/Module type

Slot

Boot version

Serial number

1
2
3
4
5
6

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NOTES:

Make sure that the boot version of each card matches the
embedded version.
If the equipment is already connected to a management
station, you may use the Inventory window to collect the
information and print the relevant data. Refer to the ECI
management system user's manual for detailed
instructions.

Visual Inspection and Mechanical Checks


The purpose of the visual inspection is to check for proper installation of the
equipment, check correct routing and connection of cables, and other tasks
related to equipment installation.
The criteria for proper execution of the installation works is according to the
instructions in the Installation chapter.
The criteria for proper cabling routing are according to the site cabling
diagram.
A typical list for recording the results of a typical set of checks performed on
an XDM shelf is described in the following table. Use the table as follows:
1. Perform the visual inspection (items 1 to 9 in the following table).
2. Power on the XDM shelves and execute the acceptance tests (items 10 to
13 in the following table). These tests check the functions needed for
continuing the execution of the network commissioning tests.
3. Perform the remaining tests (items 14 to 21 in the following table). The
criteria for normal LED indications (items 17 and 18), as well as a
description of the various card indicators and their functions, are provided
in the XDM-1000 Product Line Reference Manual.
NOTE: If user-provided power distribution panels are used
instead of xRAP/xRAP-100, perform the steps related to the
xRAP/xRAP-100 on the power distribution panels.

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Table 8-2:

Commissioning Tests

Visual inspection and mechanical checks

No.

Description of inspection/check

Mechanical mounting of the rack

DC power cable installation (main fuse to xRAP/xRAP-100;


xRAP/xRAP-100 fuse to shelf)

Ground cable connections

2, 34, 45, 52, 140, 155 Mbps tributary cables installation and
routing between the shelf connector panel and the DDF

622 Mbps, 2.5 Gbps, 10 Gbps optical interface fiber


installation, connections, and routing to the ODF

DDF installation and cable connections

ODF installation and cable connections

Network manager station installation (when applicable)

Unpacking of cards and insertion in shelves

10

DC supply voltage provision by the first DC source to the


xRAP/xRAP-100 (-40 V to -57.6 V)

___V

11

DC supply voltage provision by the second DC source to the


xRAP/xRAP-100 (-40 V to -57.6 V)

___V

12

Shelves power-on

13

Checking proper operation of both xRAP/xRAP-100 power


sources by disconnecting one source at a time

14

Checking communication between the shelf and the


LCT-XDM via the shelf SLIP interface

15

Checking proper operation of all the xFCU units

16

Checking increase in speed of remaining xFCU units when


one xFCU is removed (not relevant when SIO16_1 cards are
inserted)

17

Checking LED operation by pressing the LED TEST


pushbutton on the MECP

18

Visual testing of normal LED indications

19

Checking installation of Cisco ATA-186/Cisco 2600/Call


Manager (when applicable)

20

Checking slot assignment for all the relevant cards

21

Checking there are no abnormal alarms

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Measuring Optical Levels


The purpose of these measurements is to check for proper optical signal levels
at the various equipment ports. Proper optical levels, within the limits specified
in the XDM System Specification, must be achieved for each optical component
before starting any other commissioning tests.
The measurements are made using an OPM configured in accordance with the
wavelength at the measurement port. For reliable measurement, do not connect
the OPM directly to a port but use a 2-meter/6.6-foot cable. When measuring
high optical power levels, use attenuators to ensure that the power does not
exceed the maximum OPM input level.
The following table provides a typical data form for recording the results of the
optical level measurements on an XDM platform.
Table 8-3:
Slot

Measured optical levels

Card type

Port (1 to 16 or
lower/upper)

Wavelength

Optical transmit
level (dBm)

Receive level
(dBm)

The measured power levels must be evaluated against two types of criteria:

It is within the range of minimum and maximum levels specified in the


XDM System Specification for the transceiver plug-in type installed on the
corresponding port.

It is within the range expected in accordance with the optical network


planning.

If necessary, contact ECI's Field Engineering Department for relevant port and
optical transceiver plug-in specifications and network planning data. An OK
result means that the port meets both criteria.
To minimize the number of measurements, it is usually sufficient to measure
only the optical levels at the transmit and receive ports of I/O cards,
transponders, and optical amplifiers installed in each platform. A good port
receive level also indicates that the components in the optical path up to that
port are properly connected and operate normally. If the result is not
satisfactory, make the additional measurements at all the other ports along the
optical signal paths.

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Commissioning Tests

Measuring Signals at Monitoring Points


These measurements may be used to supplement the formal measurements
needed to ensure compliance with the network design objectives. Their main
purpose is to collect additional information that may be used to facilitate
troubleshooting in case of unsatisfactory performance.
The measurement of signals at monitoring points is performed only when ECI's
technical support personnel determine that they are needed.
Since these measurements check signal levels and waveforms at the monitoring
ports (electrical or optical) defined as internal equipment points, they are not
subject to customer acceptance.
The following table lists the relevant monitoring points for the cards and
modules that support this function, the measurement method and, where
applicable, the expected signal characteristics. For the physical identification of
each monitoring point, refer to the XDM-1000 Product Line Reference Manual.
Table 8-4:

Signal characteristics at monitoring points

Card/Module

Monitoring point function

PIO2_21, PIO2_84

Test jack for monitoring the drop path of a selected tributary.


Expected signal: in accordance with ITU-T Rec. G.772.

PIO345 (all types)

Test jack for monitoring the drop path of a selected tributary.


Expected signal: in accordance with ITU-T Rec. G.772.

SIO1&4 (all types)

SMA connector (75 ) for monitoring the drop path of a


selected tributary. Expected signal: in accordance with
Deutsche Telekom V.99.

SIO16 (all types)

Two SMA connectors (75 ), one for each transceiver.


Expected signal: in accordance with Deutsche Telekom V.99.

SIO64 (all types)

One SMA connector (75 ) for monitoring 622.08 clock


signal. Expected signal: in accordance with Deutsche
Telekom V.99.
Optical monitoring connector through 95%/5% splitter.

TRP10_2 (all types)

Optical monitoring connector through 95%/5% splitter.

OFA_2 cards and


optical amplifier
modules (all types)

Optical monitoring connector through 95%/5% splitter.

MO_OFA_M/OFA_M
cards (all types)

Optical monitoring connector through 99%/1% splitter.

MO_OFA_HBC
MO_OFA_PHBC

Optical monitoring connector through 99%/1% splitter.

MUX

Optical monitoring connector through 95%/5% or 50%/50%


splitter, depending on the version.

DEMUX (all types)

Optical monitoring connector through 95%/5% splitter.

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Note that the SIO1&4B and SIO164 cards do not include any physical
monitoring points. Optical Rx and Tx power levels for the SIO1&4B and
SIO164 cards are monitored through the EMS-XDM management system.
Refer to the EMS-XDM User Manual for more information.

Platform Power-On Test Procedure


For each platform, perform the platform power-on test as follows:
1. Perform slot assignments for all the relevant cards in the platform.
2. Turn the platform circuit breaker off.
3. After 30 seconds, turn the platform circuit breaker on.
The equipment should return to normal operation automatically, without user
intervention and without any abnormal alarm on any card in the system.

Network Commissioning
SDH Network Commissioning Tests
The SDH network commissioning includes functional tests that check network
operation at the PDH/SDH level to ensure its functional objectives are
achieved.
Perform these tests only after the site acceptance tests have successfully been
completed.

Required Test Equipment


The tests require the use of test equipment capable of measuring the stated
performance parameters. For additional information, see Tools and Equipment
(page 8-2).

Standard test conditions for E1 ports

8-10

Framing

Unframed

Coding

HDB3

Pattern

215-1 PRBS

Signal rate

Nominal rate 2.048 Mbps

Timing

Received clock

Inject error

Code error

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Commissioning Tests

Standard test conditions for E3 ports


Framing

Unframed

Coding

HDB3

Pattern

215-1 PRBS

Signal rate

Nominal rate 34.368 Mbps

Timing

Received clock

Inject error

Code error

Standard test conditions for DS-3 ports


Framing

Framed

Coding

DS-3 framing mode C-bit


X-bit 11

Pattern

215-1 PRBS

Signal rate

Nominal rate 44.736 Mbps

Timing

Received clock

Inject error

Code error

Standard test conditions for SDH ports


Signal and bitrate

According to the interface type being tested:


STM-1: 155.520 Mbps
STM-4: 622.08 Mbps
STM-16: 2488.32 Mbps
STM-64: 9953.28 Mbps

Mapping

Any mapping (preferably bulk)

Framing

Off

Pattern

223-1 PRBS

Timing

Received clock

Inject error

Code error

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Standard test conditions for SONET ports


Signal and bitrate

According to the interface type being tested:


STS-1: 51.84 Mbps
OC-3: 155.520 Mbps
OC-12: 622.08 Mbps
OC-48: 2488.32 Mbps
OC-192: 9953.28 Mbps

Mapping

Any mapping (preferably bulk)

Framing

Off

Pattern

223-1 PRBS

Timing

Received clock

Inject error

Code error

Preparations for Test


Before you start:
1. Perform the preliminary configuration using an LCT-XDM terminal
connected directly to each XDM platform.
2. After completing the preliminary configuration and throughout the network
commissioning tests, use the management station to manage the XDM
platforms under test.

Test Sequence
The list of tests performed at the network commissioning stage depends on the
network functionality. Procedures for the following tests are listed below:

8-12

Network Timing Synchronization Test (page 8-13)

Loss of Signal (LOS) Detection Test (page 8-14)

Input Sensitivity Test (page 8-14)

Equipment Power-on Test (page 8-16)

Stability Test (page 8-17)

Path Protection and Nonretrieval Operation Test (page 8-18)

MSP 1+1 Test (page 8-19)

IOP Hardware Protection Test (page 8-20)

Severity Assignment Test (page 8-21)

Handling Transmission Alarms Test (page 8-22)

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Commissioning Tests

Maintenance Handling Test (page 8-23)

xMCP Redundancy Test (page 8-24)

HLXC/XIO Redundancy Test (page 8-25)

Cisco ATA 186/Cisco2600/CallManager test (page 8-25)

MS-SPRing protection test (page 8-26)

Network Timing Synchronization Test


The purpose of this test is to verify that the XDM platforms synchronize
properly and switch to the next priority timing source when the original timing
source fails.
No.

Test procedure

1.

Configure one of the


interconnected XDM platforms to
use its internal clock as the
timing source (an external source
may also be used).

2.

Configure all the other XDM


platforms in the network to
synchronize to the XDM
platform using the internal clock.

3.

Configure several priorities for


the timing source.

4.

For each XDM platform,


disconnect the Rx fiber arriving
from the XDM platform serving
as the main timing source.

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If the platform has a single timing


source:
Check the reporting of the alarm
regarding loss of main timing
source.
Check for switching to holdover
mode.
If XDM platform has several timing
sources:
Check for switching to the second
priority timing source.
Check the reporting of the alarm
regarding loss of main timing
source.

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Commissioning Tests

XDM-500 Installation and


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Loss of Signal (LOS) Detection Test


The purpose of this test is to verify that the XDM platforms recognize alarms
and send the proper alarm notification to the management station for viewing.
No.

Test procedure

1.

Create the NEs and links using


the management station.

2.

Disconnect the optical fiber from The management station receives a LOS
the receive input connector of the alarm at the SPI level of the
port to be tested.
corresponding optical port. Additional
alarms caused by the LOS condition also
After completing the test,
appear.
reconnect the optical fiber.

3.

Expected results

Input Sensitivity Test


The purpose of this test is to verify that the input sensitivity of the XDM
optical cards and/or modules is according to their technical specifications (as
listed in the XDM System Specification). See test setup in the following figure.

Figure 8-1: Input sensitivity test setup

8-14

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No.

Test procedure

1.

Create an unprotected trail at a


rate supported by one of the
tributary cards in use between
two interconnected XDM
platforms.

2.

Connect test equipment to a trail


endpoint on one of the two XDM
platforms.

3.

Connect a loopback at the other


endpoint of the trail on the other
XDM platform.

4.

Insert a variable optical


attenuator in series with the
receive input of the XDM
platform connected to the PDH
analyzer.

5.

Set the optical attenuation to


0 dB.

6.

Slowly increase the attenuation


until the PDH analyzer starts
displaying bursts of errors.
Record the attenuation at which
this occurs.

No alarms at the SPI, MS, and RS levels


are activated when the test equipment
first starts displaying bursts of errors.

7.

Connect an optical power meter


to the first Rx port after the
optical attenuator and measure
the total power.

The measured optical power is the input


sensitivity of the card. Check that the
results equal those defined in the XDM
System Specification.

417006-2304-0H3-B02

Expected results

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Commissioning Tests

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Equipment Power-on Test


This test checks that, after being turned on, the XDM equipment automatically
returns to operation in accordance with the last configuration.

8-16

No.

Test procedure

Expected results

1.

Create an unprotected trail at any


rate supported by the tributary
cards in use between two
interconnected XDM platforms.
Make sure that neither XDM
platform serves as a management
gateway.

2.

Connect test equipment to a trail


endpoint on one of the two XDM
platforms.

3.

Connect a loopback at the other


endpoint of the trail on the other
XDM platform.

The test equipment displays no errors.

4.

Turn off one of the XDM


platforms on the trail (make sure
that this platform does not serve
as a gateway).

The test equipment displays errors and


reports an AIS alarm.

5.

Wait approximately seven


minutes.

An NE Disconnected alarm appears in


the current alarm log, and the NE icon
on the management station is gray (no
management communication).

6.

Power on the XDM platform


again.

7.

Wait for the XDM platform to


perform initial software
download, and complete the
tributary cards software
downloading (this may take 20
minutes).

8.

Check for alarms on the test


equipment.

The test equipment reports no alarms.

9.

Wait for management


communication to be established
with all the XDM platforms that
were disconnected from the
management station while the
XDM platform was off.

The equipment returns to normal


operation automatically, without
operator intervention.

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Commissioning Tests

Stability Test
The purpose of this test is to verify that the XDM network carries traffic in
accordance with the ITU-T standards.
No.

Test procedure

1.

Create a trail at any rate supported by


the tributary cards in use between two
interconnected XDM platforms in the
network.

2.

Connect the test equipment to one


endpoint of the trail, and perform a
loopback at the other endpoint of the
trail.

3.

Check for alarms on the test equipment.

The test equipment reports no


alarms.

4.

Run this test for time specified below:


2 Mbps: 14 hours
34 Mbps and 45 Mbps: 7 hours
STM-1: 120 minutes
STM-4: 30 minutes
STM-16: 8 minutes
STM-64: 2 minutes
These intervals check for error rate
lower than 1x10-11 at 2 Mbps, and
1x10-12 at the other rates.

Neither the test equipment nor


the management station report
any alarms throughout the test
interval.

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Expected results

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Commissioning Tests

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Path Protection and Nonretrieval Operation


Test
The purpose of this test is to verify that SNCP traffic in the XDM network
continues smoothly during a network failure.

8-18

No.

Test procedure

1.

Create one protected trail at any


rate supported by the tributary
cards in use between two
interconnected XDM platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Disconnect one of the optical


fibers in the active path of the
trail.

4.

Check that the trail carries traffic


properly on the protection path.

5.

Reconnect the previously


disconnected optical fiber.

Expected results

Switching to the protection path occurs,


and short bursts of errors (less than 50
msec) are reported by the test
equipment. The management station
reports an alarm on the active path of the
trail.

The trail continues using the protection


path, and the test equipment indicates no
alarm.

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Commissioning Tests

MSP 1+1 Test


The purpose of this test is to verify that MSP traffic in the XDM network
continues smoothly during a network failure.
MSP can also be used in point-to-point configurations.
No.

Test procedure

1.

Create one unprotected trail at


any rate supported by the
tributary cards in use between
two interconnected XDM
platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Disconnect one of the optical


fibers in the active path of the
trail.

4.

Check that the trail carries traffic


properly on the protection path.

5.

Reconnect the previously


disconnected optical fiber.

417006-2304-0H3-B02

Expected results

Switching to the protection path occurs,


and short bursts of errors (less than 50
msec) are reported by the test
equipment. The management station
reports an alarm on the active path of the
trail.

The trail continues using the protection


path, and the test equipment indicates no
alarm.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

IOP Hardware Protection Test


The purpose of this test is to verify that the traffic carried by an XDM card with
hardware protection is properly handled when a failure occurs.

8-20

No.

Test procedure

Expected results

1.

Create one unprotected trail at


any rate between two
interconnected XDM platforms
on a card with hardware
protection.
You may use either a card with a
trail passing through it (SIO
card), or one that terminates the
trail (PIO card).

2.

Connect test equipment to one


end of the trail.

3.

Perform a loopback at the other


end of the trail, and check
whether the test equipment
detects alarms.

The test equipment detects no alarms.

4.

Extract the protected (working)


card.

Switching to the protection path occurs,


and short bursts of errors (less than 50
msec) are reported by the test
equipment. The management station
reports an alarm on the trail.

5.

Check that the trail carries traffic The orange PROT indicator on the
properly on the protection
electrical interface module lights up.
(standby) card.

6.

Reinsert the protected (working)


card.

After 5 minutes (a default value, which


may be changed), the traffic reverts to
the protected card.
Switching to the protection path occurs,
and short bursts of errors (less than 50
msec) are reported by the test
equipment. The management station
reports no alarm on the trail.

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Commissioning Tests

Severity Assignment Test


The purpose of this test is to determine the urgency assigned to each alarm and
to create an alarm-handling protocol.
When detecting or removing a fault, the XDM platform updates the status of
the LEDs and reports the alarm activation/clearing to the management station.
This test is performed on one XDM platform.
CAUTION: To prevent disruption of data stored on the NVM

card, in the following procedures make sure you do not press


the NVM release pushbutton while the xMCP accesses the
NVM. Before attempting to remove the NVM card, monitor
the yellow xMCP indicator. Press the release pushbutton only
after the yellow xMCP indicator is off for at least 2 minutes.
When removing/inserting an NVM card, hold the card
straight and make sure to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP
card; such contact may cause the xMCP card to be reset.
No.

Test procedure

Expected results

1.

Extract an NVM card from the


xMCP.

The management station displays an


NVM Card Out alarm with Major
severity.

2.

Reinsert the NVM card into the


xMCP.

The management station no longer


displays the NVM Card Out alarm
severity.

3.

Change the severity of the Card


out alarm to Minor.

4.

Extract an NVM card from the


xMCP.

The management station displays an


NVM Card Out alarm with Minor
severity.

5.

Reinsert the NVM card into the


xMCP.

The management station no longer


displays the NVM Card Out alarm
severity.

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Commissioning Tests

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Handling Transmission Alarms Test


The purpose of this test is to verify that the XDM platforms can recognize an
alarm and send an alarm notification to the management station, and that the
management station displays it properly.
This procedure tests the following alarms: PDH-LOS, PDH-AIS, and SPI-LOS.

8-22

No.

Test procedure

Expected results

1.

Create an unprotected trail at any


rate supported by PDH tributary
cards in use between two
interconnected XDM platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Disconnect the transmit cable


from the test equipment.

4.

Reconnect the transmit cable to


the test equipment.

5.

Configure the test equipment to


send an AIS.

6.

Disconnect the receive fiber of an The management station reports an


optical port.
SPI-LOS alarm for the corresponding port.
If ALS is off, the management station
reports a far-end optical port MS-RDI.
If ALS is on, the management station
reports a far-end optical port LOS
alarm.

The management station reports a LOS


alarm for the corresponding port.

The management station reports an AIS


alarm for the corresponding port.

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Commissioning Tests

Maintenance Handling Test


The purpose of this test is to verify that maintenance actions can be performed
on the XDM platforms using the management station.
This procedure tests the following functions:

Near-end loopback

Forced PDH AIS

Forced low-rate RDI (SDH only)

Forced high-rate RDI

Forced MS-RDI

No.

Test procedure

1.

Create an unprotected trail at any


rate supported by tributary cards
in use between two
interconnected XDM platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Perform a near-end loopback at


the other end of the trail.

4.

Using the management station,


The test equipment detects an AIS
activate a forced AIS on the PDH alarm.
port connected to the test
equipment.

5.

Using the management station,


An LP-RDI or VC-12 RDI alarm is
activate a forced low-rate RDI on detected at the far-end port of the trail.
the port connected to the test
equipment. (SDH only)

6.

Using the management station,


activate a forced high-rate RDI
on the port connected to the test
equipment.

An HP-RDI or VC-4 RDI alarm is


detected at the far-end node.

7.

Using the management station,


activate a forced MS-RDI on the
port connected to the test
equipment.

An MS-RDI alarm is detected at the


far-end node.

417006-2304-0H3-B02

Expected results

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

xMCP Redundancy Test


The purpose of this test is to verify that the backup xMCP operates properly
and that the database is not lost when the xMCP fails.
No.

Test procedure

1.

Create an unprotected trail at any


rate supported by tributary cards
in use between two
interconnected XDM platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Select an XDM platform that


carries the trail, and extract the
xMCP card installed in slot C1.

Expected results

8-24

No traffic alarm is detected by


either the test equipment or the
management station, but a Card
Out alarm for the xMCP card is
displayed by the management
station.
After several minutes, the XDM
platform disconnects from the
management station (becomes
gray), and then reconnects to the
management with the same
database (after switching to the
redundant xMCP). The Info
windows of both xMCP cards show
the correct status.

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Commissioning Tests

HLXC/XIO Redundancy Test


The purpose of this test is to verify that the matrix protection mechanism in the
XDM network operates properly when a failure occurs.
NOTE: For XIO cards, the test trail should not pass through
an XIO I/O port.

No.

Test procedure

1.

Create an unprotected trail at any


rate supported by tributary cards
in use between two
interconnected XDM platforms.

2.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

3.

Select an XDM platform that


carries the trail, and extract the
active HLXC/XIO card (the card
with the lit orange indicator)
from the XDM platform.

Expected results

The management station displays a


Card Out alarm.
The test equipment detects a burst of
errors of less than 50 msec.

Cisco ATA 186/Cisco2600/CallManager Test


The purpose of this test is to verify that the Voice Over IP network operates
properly.
No.

Test procedure

1.

Select two sites with Cisco ATA 186, The Cisco ATA 186 in site B rings.
and dial from site A to site B.

2.

Pick up the Cisco ATA 186 handset


at site B.

417006-2304-0H3-B02

Expected results

The speakers at the two sites can


converse via the Cisco ATA 186
without noise.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

MS-SPRing Protection Test


The purpose of this test is to verify that the MS-SPRing traffic in the XDM
network continues smoothly during a network failure.
This procedure uses SIO16M or SIO64M I/O modules.
No.

Test procedure

1.

Define the ring as MS-SPRing


(nodes linked east and west in a
clockwise direction).

2.

Create an unprotected trail at any


rate supported by tributary cards
in use between two
interconnected XDM platforms.

3.

Connect test equipment to one


endpoint of the trail, and perform
a loopback at the other endpoint
of the trail.

4.

Disconnect one of the fibers in


the path of the trail.

Expected results

5.

Reconnect the disconnected fiber.

8-26

The duration of the errors and


alarms reported by the test
equipment should be less than 50
msec. After 50 msec, the trail should
return to normal operation over the
protection path.
The management station reports an
alarm in the active path of the trail,
together with alarms related to the
disconnected fibers (LOS).
The trail operates properly after
switching to the protection path.
The alarms related to the
disconnected fibers disappear.
After the retrieve time (can be
defined by the customer), the trail
switches back to the main path.
The test equipment detects a short
alarm burst of less than 50 msec,
and the trail switches to the
protection path.
The trail operates properly after
switching back to the main path.

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Commissioning Tests

Data Network Commissioning Tests


The data network commission tests include various functional tests at the data
transport level to ensure proper functionality of the integrated network.
All tests are performed according to RFC-2544.
The tests listed below are applicable to all the types of XDM data cards (DIO,
EIS, DIOB, and MCS).

Required Test Equipment


The tests require the use of test equipment capable of measuring the stated
performance parameters. The test equipment must be configured as follows:
Frame size:

Random (64 bytes to 1518 bytes)

Data/Payload:

Random

Destination address:

Fixed and unique

Source address:

Fixed and unique

Line rate:

According to customers router (default automatic


selection)

Test Sequence
The list of tests performed at the data network commissioning stage depends on
the network functionality. Procedures for the following tests are listed below:

Throughput and latency

Frame loss rate

System recovery and reset

Stability

Alarm handling

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Throughput and Latency Tests


The purpose of these tests is to determine the maximum amount of data that
can pass through the network before frames start to be discarded, and the time
required for frames to pass through the network.
No.

Test procedure

Expected results

1.

Create two unprotected trails at any


rate supported by data cards in use
between two interconnected XDM
platforms.

2.

Connect the test equipment to the


two ports of the trails on one of the
two XDM platforms.

3.

Connect a cross cable between the


two ports of the trails on the other
XDM platform.

4.

Configure the test equipment for


measurement of throughput and
latency in accordance with
RFC-2544.

5.

Inject traffic in accordance with the When calculating the latency, take into
assigned bandwidth (one VC-12 =
consideration:
2.048 Mbps), and measure
The measured latency is measured for
throughput and latency for the
the forward and return paths. The
following frame sizes: 64 bytes, 128
latency for a single path is half the
bytes, 256 bytes, 512 bytes, 1024
total.
bytes, 1280 bytes, and 1518 bytes.
The latency result depends on the
throughput results. For example, when
testing at 10 Mbps and the throughput
is 40%, the latency test is made for 4
Mbps (the bandwidth of two VC-12s
is 4 Mbps).

NOTES:

8-28

Measured latency is for both the forward and return paths.


For a single path, the latency is 50% of the measured
value.
The latency test is dependent on the throughput results.
For example, if 10 Mbps is tested and the throughput is
4%, the latency test is for 4 Mbps (2 x VC-12 = 4 Mbps).
Inject traffic according to the assigned bandwidth
(VC-12 = 2.048 Mbps).

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Table 8-5:

Commissioning Tests

Throughput and latency test results

LAN port and 64 bytes/ 128


speed
frame
bytes/
frame

256
bytes/
frame

512
bytes/
frame

1024
bytes/
frame

1280
bytes/
frame

1518
bytes/
frame

Throughput
Latency

Frame Loss Rate Test


The purpose of this test is to determine the rate of lost frames when the system
is overloaded.
No.

Test procedure

1.

Create two unprotected trails at


any rate supported by data cards
in use between two interconnected
XDM platforms.

2.

Connect the test equipment to the


two ports of the trails on one of
the two XDM platforms.

3.

Connect a cross cable between the


two ports of the trails on the other
XDM platform.

4.

Configure the test equipment for


measurement of frame loss in
accordance with RFC-2544. Set
for 100%.

Table 8-6:
Frame size

Expected results

The measured frame loss rate is calculated


as follows:
Frame Loss Rate = [(Input fps) (Output
fps)] x 100/(Input fps)
where fps stands for frames per second.

Frame loss rate test results


64 bytes/
frame

128
bytes/
frame

256
bytes/
frame

512
bytes/
frame

1024
bytes/
frame

1280
bytes/
frame

1518
bytes/
frame

Frame rate
(% MFR)
100%

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

System Recovery and Reset Test


The purpose of this test is to determine the time needed for recovery from a
buffer overflow condition and from power failures.
No.

Test procedure

Expected results

1.

Create two unprotected trails at


any rate supported by data cards
in use between two interconnected
XDM platforms.

2.

Connect the test equipment to the


two ports of the trails on one of
the two XDM platforms.

3.

Connect a cross cable between the


two ports of the trails on the other
XDM platform.

4.

Configure the test equipment for


manual testing at the port rate,
and for any frame size.

5.

Power off one of the XDM


platforms.

Check for the ensuing frame loss, using


the test equipment.

6.

Turn the XDM platform on and


wait for two minutes.

The test equipment no longer reports


errors.

Stability Test
The purpose of this test is to check that no errors occur in the network for a
defined period of time.

8-30

No.

Test procedure

1.

Create two unprotected trails at any


rate supported by data cards in use
between two interconnected XDM
platforms.

2.

Connect the test equipment to the


two ports of the trails on one of the
two XDM platforms.

3.

Connect a cross cable between the


two ports of the trails on the other
XDM platform.

4.

Configure the test equipment for


manual testing at the port rate, and
for any frame size.

5.

Run the test for two hours.

Expected results

Check that the test equipment reports


no errors.

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Commissioning Tests

Alarm Handling Test


The alarm handling test checks the alarm report and the subsequent action
undertaken by the XDM platform under the following forced fault conditions:

Signal loss at the data LAN port

Signal loss at the optical interfaces

No.

Test procedure

Expected results

1.

Create two trails at any rate


supported by data cards in use
between two interconnected
XDM platforms.

2.

Connect the test equipment to the


two ports of the trails on one of
the two XDM platforms.

3.

Connect a cross cable between


the two ports of the trails on the
other XDM platform.

4.

Disconnect the test equipment to


create a signal loss at the data
LAN port.

A 10/100Mbps Link Down alarm is


reported (provided a VLAN has been
created).

5.

Disconnect the optical cable to


create a signal loss at the optical
interface.

An SPI-LOS alarm is reported for the


optical interface.

Optical Network Commissioning Tests


The optical network commissioning tests include various functional tests at the
optical level to ensure proper functionality of the integrated network.
The signal levels measured during the optical network commissioning tests
should be within the limits specified in the XDM System Specification.

Network Configuration
Before starting the optical network commissioning tests, configure the XDM
equipment for operation according to the specific customers requirements and
for using the network management station assigned to manage the XDM
equipment.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Test Setup and Required Test Equipment


The tests performed during optical network commissioning check the
performance of transmission paths within the network. The tests require the use
of test equipment capable of measuring the stated performance parameters (see
"Tools and Equipment" page 8-2).

Connect the test equipment to each transponder installed at one end of the
tested transmission path. The test equipment must be configured to operate
at the transponder transmission rate (for example, STM-16 when connected
to a TRP25, and STM-64 when connected to a TRP10).

Connect a short section of patch fiber between the transmit and receive
ports of the corresponding transponder located at the other end of the tested
path to form an optical loopback. It is recommended to insert an
appropriate attenuator in the loopback path to ensure that the received
signal is within the normal operating range of the port.

When testing sensitivity and LOS, modify the test setup to include a variable
optical attenuator. The resulting test setup is shown in the following figure.

Figure 8-2: Test setup modified to support LOS and sensitivity tests

After completing the tests on a specific transponder, make sure to restore the
original connections.

8-32

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Commissioning Tests

Measuring Optical Power


Perform the following checks for each optical card or module of each NE
installed on the site.
No.

Test procedure

Expected results

1.

Using an OPM, measure the input and


output optical levels of each optical
component (card, module, and so on).
Record the results of all the
measurements; these results provide the
information needed to evaluate the
optical budget of the network.

The measurement results are


within the range of minimum and
maximum levels specified for
each type of optical component
(see XDM System Specification).

2.

Using an optical spectrum analyzer,


measure the following parameters for
each link:
Spectrum of the composite line
signal
Power per channel
OSNR (Optical Signal to Noise
Ratio)
Gain tilt
For this purpose, measure the optical
signals at the input and output of each
active and passive optical component
(optical booster, preamplifier, OADM,
Mux, DeMux, supervisory channel
interfaces, and so on).

The measured levels are within


the range expected in accordance
with the planned optical network
power budget.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Equipment Power-on Test


The purpose of this test is to verify that the XDM platforms continue operating
smoothly without operator intervention after power failure.
No.

Test procedure

1.

Select one of the optical


transmission paths in the
network.

2.

Connect the test equipment at the


input of a transponder, and
connect an optical loopback to
the corresponding transponder at
the remote location.

3.

Check for correct optical levels,


and make sure the test equipment
does not detect errors.

4.

Turn off the DC power of one of


the NEs along the path, and wait
at least seven minutes.

5.

Turn the DC power on again,


wait for the completion of the
initial software downloading
(may take up to about 20
minutes), and then repeat the
checks.

Expected results

The test equipment must indicate


alarms while the DC power is off.
The management station reports an
NE Disconnected alarm, and then
displays the NE icon in gray
(signifying no management
communication).

After the NE is powered up and completes


downloading, it is reconnected to the
management station. The test equipment
and the management station should detect
no alarm.

LOS Detection Test


The purpose of this test is to verify that the XDM platforms recognize alarms
and send alarm notifications to the management system for viewing.

8-34

No.

Test procedure

Expected results

1.

Disconnect the optical fiber from An SPI-LOS alarm appears for each
the receive input (Rx line) of
optical card, together with other alarms
each optical card.
caused by the disconnection.

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Commissioning Tests

Input Sensitivity Test


The purpose of this test is to verify that the input sensitivity of the XDM
optical cards is according to their technical specifications (see XDM System
Specification for reference).
No.

Test procedure

1.

Select one of the optical


transmission paths in the
network.

2.

Connect the test equipment at the


input of a transponder, and
connect an optical loopback to
the corresponding transponder at
the remote location.

3.

Insert a variable optical


attenuator in series with one of
the fibers of the selected path.

4.

Set the optical attenuation to


0 dB.

5.

Slowly increase the attenuation


until the test equipment displays
a burst of errors.

6.

Connect an OPM to the first Rx


port after the variable optical
attenuator and measure the total
power.

417006-2304-0H3-B02

Expected results

The measured optical power is the input


sensitivity of the card. Check that the
results equal those defined in the XDM
System Specification document.

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8-35

Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Path Protection Test


The purpose of this test is to verify that the protected traffic in the XDM
network is properly handled when a failure occurs.

8-36

No.

Test procedure

1.

Select one of the protected


optical transmission paths in the
network.

2.

Connect the test equipment at the


input of a transponder serving the
selected path, and connect an
optical loopback to the
corresponding transponder at the
remote location.

3.

Disconnect one of the optical


fibers in the active path of the
optical channel.

4.

Check that the optical channel


carries traffic properly on the
protection path.

5.

Reconnect the previously


disconnected optical fiber.

Expected results

Switching to the protection path occurs,


and short bursts of errors (less than 50
msec) are reported by the test equipment
and the management station.

The trail continues using the protection


path, and the test equipment indicates no
alarm.

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Commissioning Tests

Maintenance Test
The purpose of this test is to verify that maintenance actions can be performed
on XDM platforms using the management system.
This procedure tests the following functions:

Manual switch

Forced switch

Switch lockout

No.

Test procedure

1.

Select one of the protected


optical transmission paths in the
network.

2.

Connect the test equipment at the


input of a transponder serving the
selected path, and connect an
optical loopback to the
corresponding transponder at the
remote location.

3.

On the management station, send Switching to the protection path occurs,


a manual switch command.
and short bursts of errors (less than 50
msec) are reported by the test equipment
and the management station.

4.

Check that the optical channel


carries traffic properly on the
protection path.

5.

Disconnect the line input of the


nonactive transponder from its
Mux.

6.

On the management station, send Switching to the main (protected) path


a manual switch command.
occurs, and short bursts of errors (less
than 50 msec) are reported by the test
equipment and the management station.

7.

Check that the optical channel


carries traffic properly on the
main (protected) path.

8.

Disconnect the line input of the


inactive transponder from its
DeMux.

417006-2304-0H3-B02

Expected results

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

No.

Test procedure

Expected results

9.

On the management station, send Switching to the main (protected) path


a manual switch command.
occurs, and the test equipment reports a
LOS alarm.

10.

On the management station, send


a switch lockout command.

11.

Disconnect the line input of the


active transponder from its
DeMux.

Check that the active path has not


changed.
The active path changes only when
the other path is not operating
properly.

No switching to the main (protected)


path; a LOS alarm is reported by the test
equipment.

BER and Stability Test


The purpose of this test is to verify that the optical channels in the XDM
optical network operate properly without errors (according to the ITU-T
performance standards).

8-38

No.

Test procedure

Expected results

1.

Select one of the protected


optical transmission paths in the
network.

2.

Connect the test equipment at the


input of a transponder serving the
selected path, and connect an
optical loopback to the
corresponding transponder at the
remote location.

3.

Check for alarms on the test


equipment.

The test equipment reports no alarms.

4.

Run this test for the time


specified below:
STM-1: 120 minutes
STM-4: 30 minutes
STM-16: 8 minutes
STM-64: 2 minutes
These intervals check for error
rate lower than 1x10-12.

Neither the test equipment nor the


management station report any alarms
throughout the test interval.

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Commissioning Tests

Management Commissioning Tests


The purpose of these tests is to verify that all management stations and the
applications installed on them, LightSoft, and EMS in the customer XDM
network, work properly, and all features operate as required.

Management to NEs Communication Test


The purpose of this test is to verify communication between the management
station and the XDM NEs.
No.

Test procedure

Expected results

1.

Select three XDM NEs from the


network.

2.

Activate the PING feature for the Make sure packet loss for all three XDM
three NEs simultaneously.
NEs is less than 1%.

Security Test
The purpose of this test is to verify that the user can define a user with different
capabilities.
No.

Test procedure

1.

Create a new user with limited


resources and capabilities.

2.

Log out from the management.

3.

Log in using the new user.

Expected results

Make sure the resources and capabilities


are defined for this user only.

Alarm Log Test


The purpose of this test is to verify that the user can define any filter in the
alarm log.
No.

Test procedure

Expected results

1.

Open the Alarm Log window.

All alarms are shown according to the


default filter.

2.

Set the filter to events only.

Only events are shown.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Management Power-off and Recovery Test


The purpose of this test is to verify that all the management stations can start
properly after power-off (same database).
No.

Test procedure

1.

Shut down all management stations


- NMS server, client, and EMSs.

2.

Start the management stations.

Expected results

Verify that all the management stations


start from the last database.

Trail Creation Test


The purpose of this test is to verify that any trail can be created using the
management station.
No.

Test procedure

1.

Create one trail of any rate between


two NEs.

2.

Connect test equipment to one NE


and perform loopback at the other
NE (in the relevant endpoint ports).

Expected results

Verify that there are no alarms in the test


equipment and at the management station
related to the relevant trail.

Trail Consistency Indication (TCI) Test


The purpose of this test is to verify that every cross connect created at the EMS
level is automatically reflected in the NMS and can be imported into the NMS
database.

8-40

No.

Test procedure

Expected results

1.

Create one trail of any rate between


two NEs.

2.

Connect test equipment to one NE


and perform loopback at the other
NE (in the relevant endpoint ports).

Confirm there are no alarms in the test


equipment and at the management station
related to the relevant trail.

3.

Operate the TCI feature.

Make sure no inconsistency is found in


the network.

4.

Create any kind of cross connect


from the EMS-XDM.

5.

Open the TCI window.

Verify inconsistency is found in the


network.

6.

Operate the TCI feature.

Make sure that the cross connect created


from the EMS-XDM appears in the trail
list after completion of the TCI test.

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Commissioning Tests

Optical Parameters Test


The purpose of this test is to verify that the user can view the optical parameter
levels (applicable only for cards that support this feature).
No.

Test procedure

1.

Select an optic card.

2.

Open the optical parameters of


this card from the management
station.

Expected results

Verify that the optical parameters


obtained from the management are the
same as those measured in the field
(deviation of up to 2 dB permissible).

RDR Test
The purpose of this test is to verify that the RDR station replicates the NMS
database and works properly.
No.

Test procedure

1.

Configure the RDR application.

2.

Shut down the primary


management station.

3.

Start the mirror management


station.

Expected results

Verify the mirror management station


starts from the last database.

Modem Connection Test


The purpose of this test is to verify that the modem operates properly.
No.

Test procedure

1.

Connect the modem to serial port


B of the Sun station.

2.

Connect the modem to the phone


line.

3.

Make sure the PPP is configured


and running.

4.

Perform the connection test with


ECI Customer Support.

417006-2304-0H3-B02

Expected results

ECI Customer Support logs in properly


to the Sun station.

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Commissioning Tests

XDM-500 Installation and


Maintenance Manual

Go-Global Test
The purpose of this test is to verify that the Go-Global software operates
properly.
No.

Test procedure

1.

Make sure the modem is working


properly.

2.

Configure the Go-Global package.

3.

Ask ECI Customer Support to log


in to the Sun station using the
Go-Global application.

Expected results

Customer Support logs in properly to


the Sun station and sees management
topology as per the Go-Global
application.

Orderwire Test
The purpose of this test is to verify that the orderwire network operates
properly.
No.

Test procedure

Expected results

1.

Create an OW connection between


two XDM NEs A and B.

2.

Use management to configure the


OW.

3.

Dial from site A to site B.

Make sure a ring sound is heard in site


B. The ring generates at the xECB or
Cisco ATA 186.

4.

Pick up the handset in site B.

Ring in site B stops.

5.

Check audio communication


between the two sites.

Make sure both engineers at site A and


B can converse freely via the OW
network without any noise.

External Alarm Test


The purpose of this test is to verify that the external alarm works properly.

8-42

No.

Test procedure

1.

Connect an external alarm relay


box to an XDM NE.

2.

Define the external alarm from the


XDM platform view in the EMS.

3.

Close the relay.

Expected results

A corresponding alarm is reported in the


management.

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9
Maintenance
In this chapter:
Overview ......................................................................................................... 9-1
Required Test Equipment, Tools, and Materials ............................................. 9-2
Preventive Maintenance .................................................................................. 9-2
Troubleshooting ............................................................................................. 9-11
Replacing a Network Element ....................................................................... 9-40
Replacing Cards, Modules, Fans, and Other Components ............................ 9-43

Overview
This chapter describes the maintenance procedures for XDM equipment.
Personnel involved in maintenance must be thoroughly familiar with the safety
issues (see "Installing XDM-500: Before You Start Safety Guidelines" page
1-1).
NOTE: Unless otherwise indicated, the procedures described
in these sections apply to all XDM platforms and to both
SDH and SONET.

CAUTION: XDM equipment has two power sources.


Disconnect both power sources before servicing.

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9-1

Maintenance

XDM-500 Installation and


Maintenance Manual

Required Test Equipment, Tools,


and Materials
For most maintenance activities described in this chapter, only an LCT-XDM
terminal and a multimeter are required. If you need to make measurements, it is
recommended to use equipment of the same type and models used for
commissioning and acceptance (see "Tools and Test Equipment" page 4-8).
The tools and materials necessary for equipment installation must also be
available during maintenance.

Preventive Maintenance
This section describes the XDM preventive maintenance procedures to be
performed periodically by network administrators. The purpose of these
procedures is to ensure optimal and uninterrupted operation of your network.
The information presented in this section includes:

Preventive Maintenance Procedures via EMS-XDM (page 9-4)

Hardware Preventive Maintenance (page 9-5)

Air Filter Preventive Maintenance (page 9-7)

Preventive Maintenance Checklists (page 9-9)

The procedures are software oriented and performed by the network


administration staff.
NOTES:

Many of the preventive procedures may affect traffic.


On-screen warnings alert you when necessary.
The information presented is based on EMS-XDM and
end management stations. Refer to the corresponding user
manuals for detailed explanations.

The purpose of the preventive maintenance activities is to keep the XDM


hardware in good condition, and as soon as possible to detect and correct any
condition that may lead to deterioration and equipment malfunction. Record the
execution of the various activities and their results according to the procedures
used in your organization.
The following table lists the preventive maintenance inspection and checks,
and specifies recommended intervals for execution. The frequency of checks
for equipment installed in unprotected environments should be increased as
required.

9-2

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Maintenance Manual

Legend:
Table 9-1:
Item

Maintenance

W weekly

M monthly

Q quarterly

Preventive maintenance inspection and checks

Inspection/Check

Intervals
W

1.

Visually inspect the condition of cables and fibers. Check


for correct routing (no sharp bends) and proper support to
avoid stress. Avoid touching fibers during the inspection,
except as required to correct problems.

2.

Check condition of rack front doors and RFI fingers. Clean


as necessary with approved cleaning agents.

3.

Check that all unused optical connectors are covered by


protective covers. Add covers as necessary.

4.

Check that cards and modules are securely attached: all


extractor handles must be in the storage position (parallel to
the card edge), and all module fastening screws appear tight
(tighten only manually).

5.

Check for proper operation of the xFCU unit (no abnormal


noise and vibrations).

6.

Check that the xFCU unit is fully inserted in their chassis


positions and that the screws are tight.

7.

Clean the xFCU unit and inspect the air filter.


CAUTION: To avoid overheating of the XDM-400
platform, do not remove its xFCU4 unit for more than 2-3
minutes.
While cleaning, check increase in speed of remaining xFCU
units when one xFCU is removed (not applicable to
xFCU4).
If necessary, clean or replace the air filters.

8.

Check proper attachment of xINF units to the platform.

9.

Check the DC supply voltage.

10.

Check DC power sources (main and backup), and make


sure that all the circuit breakers serving active equipment
units (located on the xRAP-D, xRAP-B, xRAP-HP,
xRAP-100, or user-provided power distribution panels) are
in the ON position.

11.

Check that there are no alarm indications on the cards and


modules.

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X
X
X

9-3

Maintenance

Item

XDM-500 Installation and


Maintenance Manual

Inspection/Check

Intervals
W

12.

Check that all xRAP-D, xRAP-B, xRAP-HP, or xRAP-100 X


LEDs turn on and the buzzer sounds while the POWER ON
pushbutton on the xRAP-D, xRAP-B, xRAP-HP or
xRAP-100 panel is pressed.
Note: The buzzer will not sound if ACO (alarm cut-off) is
active.

13.

Check that all card and module LEDs turn on when the
LED TEST pushbutton on the MECP panel is pressed.

14.

Perform a visual check of LED indications according to


Chapter 5.

15.

Inspect equipment racks and cases, connection terminals,


grounding, and so on, and pay special attention to any signs
of corrosion.

16.

Whenever applicable, inspect ancillary equipment (air


conditioners, lighting, distribution panels, and so on) and
their power sources.

Preventive Maintenance Procedures via


EMS-XDM
The following table outlines the preventive maintenance procedures performed
via the EMS-XDM.
Table 9-2:

Preventive maintenance procedures via EMS-XDM

Procedure

Should be performed

Save the NE database


configuration to hard
disk.

Once a week, or following


major changes in network
topology

Check version
correspondence.

Once a week, or whenever


major changes are made to the
system configuration

Delete old system files.

Once a week, or following


major changes in network
topology

Check performance.

Once a week or according to


working procedures

Check EMS-XDM to NE Once a week or according to


communication.
working procedures

9-4

ECI Telecom Ltd. Proprietary

Comments

Only in networks that


have a DCN (Data
Communication Network)
between the EMS-XDM
and the NEs

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Maintenance

Procedure

Should be performed

Save the EMS-XDM


configuration to hard
disk.

Once a week, or following


major changes in network
topology

Check switching to
protection.

Once a quarter, according to


the network administrator's
instructions

Comments

Traffic-affecting

Export cross-connections Once per month or according


data to XML files.
to the working procedures
Check optical parameters. Once per month or according
to the working procedures
Export topology data to
an XML file.

Once per month or according


to the working procedures

Export card inventory


data to an XML file.

Once per month or according


to the working procedures

Hardware Preventive Maintenance


The scope of the preventive maintenance activities is to keep the XDM
hardware in good condition, and as quickly as possible to detect and correct
any condition that may lead to deterioration and equipment malfunction.
Record the execution of the various activities and their results in accordance
with the organizational procedures.
The following table lists preventive maintenance inspections and checks and
specifies recommended intervals. The frequency of checks for equipment
installed in unprotected environments should be increased as required.
Table 9-3:
Item

Preventive maintenance inspection and checks

Inspection/Check

Intervals
W

1.

Visually inspect the condition of cables and fibers.


Check for correct routing (no sharp bends) and proper
support to avoid stress.
Avoid touching fibers during the inspection, except as
required to correct problems.

2.

Check condition of rack front doors and RFI fingers.


Clean as necessary with approved agents.

3.

Check that all unused optical connectors are covered by


protective covers. Add covers as necessary.

4.

Check that cards and modules are securely attached: all


extractor handles must be in the storage position (parallel
to the card edge), and all module fastening screws must
be tight (tighten only by hand).

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X
X
X

9-5

Maintenance

Item

XDM-500 Installation and


Maintenance Manual

Inspection/Check

Intervals
W

9-6

5.

Check for proper operation of the xFCU unit, without


abnormal noise and vibrations.

6.

Check that the xFCU unit is fully inserted in its chassis


position and the screws are tight.

7.

Clean the xFCU unit and inspect the air filter.


CAUTION: To avoid overheating of the XDM-400
platform, do not remove its xFCU4 unit for more than
2-3 minutes.
When cleaning, check increase in speed of remaining
xFCU units when one xFCU is removed (not applicable
to xFCU4).
Clean or replace the air filters if necessary.

8.

Check proper attachment of xINF, xINF-H, and xINF40


units to the platform.

9.

Check the DC supply voltage.

10.

Check DC power sources (main and backup) and make


X
sure that all the circuit breakers serving active equipment
units (located on the xRAP-D, xRAP-B, xRAP-HP or
xRAP-100 or on user-provided power distribution
panels) are in the ON position.

11.

Check that there are no alarm indications on the cards


and modules.

12

Check that all xRAP LEDs turn on and the buzzer


sounds while the POWER ON pushbutton on the xRAP
panel is pressed.

13.

Check that all card and module LEDs turn on when the
LED TEST pushbutton on the MECP panel is pressed.

14.

Perform a visual check of LED indications (see


"Commissioning Tests" page 8-1).

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Maintenance

Air Filter Preventive Maintenance


Air particles trapped by the air filter increase the resistance to airflow, and can
eventually decrease the airflow below the minimum required for proper cooling
of internal components. The resulting increase in the internal temperature of the
equipment reduces the equipment reliability and performance. Therefore,
whenever an air filter is installed, it must periodically be cleaned or replaced
with a clean filter.
It is accepted throughout the electronics equipment industry to recommend
cleaning or replacing air filters approximately every 90 days. However, the
cleaning intervals depend on the specific environmental conditions. In dusty
environments more frequent cleaning is required. Note that foam filters, which
are the type used in XDM platforms, efficiently trap particles without showing
face loading of contaminants, and therefore visual inspection cannot be used to
determine cleaning intervals.
CAUTION: Filter cleaning intervals must strictly be

observed, as clogging by trapped particles can severely impair


equipment reliability and performance.

Recommended Cleaning Methods


Use the following methods (listed in order of ascending efficiency) to clean air
filters:
1. Vacuum clean: A few passes of a vacuum cleaner remove accumulated
dust and dirt in seconds. Point the air nozzle in the direction of operating
airflow (vacuum from intake side toward exhaust side).
2. Blow with compressed air: Point a compressed air nozzle in the opposite
direction of the operating airflow (blow from the exhaust side toward the
intake side).
NOTE: Oily residues and moisture reduce cleaning efficiency
of the above methods; in such cases, clean the filter using
method No. 4, or replace the filter.

3. Cold water rinse: Under normal service conditions, the foam media used
in the filters require no oily adhesives. Therefore, collected dust and dirt
can be washed away using a standard hose nozzle with plain water. Stand
the filter until completely dry and free of moisture, and return to service.
4. Immersion in warm soapy water: Where stubborn airborne dirt is present,
the filter may be dipped in a solution of warm water and mild detergent.
Then simply rinse in clear water, stand until completely dry and free of
moisture, and return to service.
The recommended method is No. 4, as it ensures thorough cleaning of all types
of contaminants under any reasonable service conditions.
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9-7

Maintenance

XDM-500 Installation and


Maintenance Manual

Cleaning Procedure
For the procedure steps, refer to the following figure.
NOTE: The air filter can be removed and reinstalled while

the XDM platform operates, without opening its front door.


However, for clarity, the figure below shows the platform
without its front door.

Figure 9-1: Removing the filter for cleaning/replacement

To clean the air filter:


1. Release the two captive screws fastening the filter front panel, and remove
the panel. Keep the panel in a safe place until it can be reinstalled.
2. Pull the filter out.
3. Inspect the filter for damage. If any damage is evident (such as holes or
torn material), replace the filter with a new one.
4. Clean the filter using the method selected by your organization.
5. Identify the filter's air intake side, indicated by two coding tabs.
CAUTION: Replace the filter only with a filter of the original
type. Failure to do so can impair equipment reliability and
performance.

6. Insert the clean filter in the holding frame and reinstall the front panel.

9-8

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Maintenance

Preventive Maintenance Checklists


This section provides preventive maintenance checklists for the EMS-XDM,
LightSoft, and the hardware.

EMS-XDM Checklists
Weekly checklist
Procedure

Date

Result

Date

Result

Date

Result

Save NE database configuration to hard disk.


Check version correspondence.
Delete old system files.
Check performance.
Check EMS-XDM to NE communications.
Save EMS-XDM configuration to hard disk.

Monthly checklist
Procedure

Export cross-connection data to XML files.


Check optical parameters.
Export topology data to an XML file.
Export card inventory data to an XML file.

Quarterly checklist
Procedure

Check switch to protection.

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Maintenance

XDM-500 Installation and


Maintenance Manual

LightSoft Checklists
Weekly checklist
Procedure

Date

Result

Save LightSoft database.


Check NE status.
Synchronize LightSoft database with EMS
database.
Check LightSoft's hard drive capacity.

Quarterly checklist
Procedure

Date

Result

Perform batch trail operations.

Hardware Checklists
Weekly checklist
Procedure

Date

Result

Check that all unused optical connectors are


covered.
Check for proper operation of xFCU.
Check DC supply voltage.
Check DC power sources and xRAPs.
Check for alarms indications on cards and
modules.
Check the operation of xRAP alarm indications
and buzzer.
Check activation of LEDs on all cards and
modules.
Perform visual check of LED indications on
cards and modules.

Monthly checklist
Procedure

Date

Result

Inspect condition of rack front doors and RFI


fingers.

9-10

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Maintenance

Quarterly checklist
Procedure

Date

Result

Visually inspect condition of cables and fibers.


Check cards and modules attachment.
Check xFCU attachment.
Clean xFCU.
Check xINF attachment.

Troubleshooting
The purpose of onsite troubleshooting is to identify the hardware causing the
malfunction and return the equipment to normal operation as soon as possible.
Troubleshooting is usually initiated in response to one of the following
conditions:

Alarm or performance degradation reported by the management station.

Alarm or malfunction detected on site by maintenance personnel, either as


a result of a troubleshooting activity initiated by the management center
personnel or as a result of a periodical inspection or preventive
maintenance action. Many problems can be detected via the various
indicators available on the XDM system components.

This chapter assumes familiarity with the XDM and with SDH and DWDM
equipment, and with the LightSoft and EMS-XDM management stations. Refer
to the respective user manuals for details on the various capabilities of the
management stations, and for instructions on performing the desired activities.
The following sections provide procedures for performing onsite
troubleshooting for various trouble categories as well as for specific
subsystems, such as OADMs and Mux/DeMux subsystems. For each category,
you will find a troubleshooting table that provides the instructions for
identifying the problem.

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9-11

Maintenance

XDM-500 Installation and


Maintenance Manual

To use the troubleshooting table:


1. Identify the closest description of the trouble symptoms under Trouble
Symptoms.
2. Perform the required corrective actions listed under Corrective Actions in
the table in the order in which they appear until the problem is corrected.
The following index will help you find the troubleshooting information covered
in this chapter.

9-12

General troubleshooting procedures for cards and modules (page 9-13)

General troubleshooting procedures for optical transceiver plug-ins (page


9-15)

Troubleshooting procedures for electrical interface modules (page 9-16)

Troubleshooting procedure for optical OADM and Mux/DeMux (page


9-17)

Troubleshooting procedures for EIS cards (page 9-19)

Troubleshooting procedures for DIO cards (page 9-20)

Troubleshooting procedures for DIOB cards (page 9-22)

Troubleshooting procedures for MCS5/MCS10 cards (page 9-23)

Troubleshooting procedures for ROADM cards (page 9-25)

Troubleshooting procedures for Aurora-G cards (page 9-26)

Troubleshooting procedures for ATS cards (page 9-33)

Troubleshooting transmission and traffic alarms (page 9-34)

Troubleshooting power problems (page 9-35)

Troubleshooting the timing subsystem (page 9-38)

Troubleshooting management communication (page 9-39)

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XDM-500 Installation and


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Maintenance

Troubleshooting Using Component


Indicators
The management station will usually provide onsite personnel with a list of
suspected components.
Start troubleshooting a suspected component by checking its indicators. These
indicators, located on the various cards and modules, can help you to rapidly
and efficiently identify a malfunctioning component in accordance with the
procedures outlined in General troubleshooting procedures for cards and
modules (page 9-13) and General troubleshooting procedures for optical
transceiver plug-ins (page 9-15).
NOTE: The indicator functions and normal indicator states

are described in the XDM-1000 Product Line Reference


Manual.

CAUTION: All corrective actions listed below affect traffic.

General Troubleshooting Procedures for


Cards and Modules
The following table describes the general troubleshooting procedure for cards
and modules.
Table 9-4:

General troubleshooting procedures for cards/modules

No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator off.

Defective
card/module

1. Pull the component out and


wait a minute before
reinserting. Make sure that
you fully insert the card or
module in its slot.
2. If the ACTIVE indicator
does not turn on after
reinsertion, replace the
component.

2.

Red FAIL indicator Defective


not turning off after card/module
software download
(following power-on
and resetting).

1. Check the card assignment.


2. Reset the component by
removing and then
reinserting it after a few
minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.

417006-2304-0H3-B02

Corrective measures

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9-13

Maintenance

No.

XDM-500 Installation and


Maintenance Manual

Symptoms

Probable cause

Corrective measures

3. The FAIL indicator flashes


while software is
downloaded to the
component. Wait until the
software download is
complete and check that the
FAIL indicator turns off.
4. If the FAIL indicator turns
on again, replace the
component.
3.

Orange (traffic
carrying) indicator
off (when indicator
supported).

Card not configured


to carry traffic

1. Check with the management


station operator whether the
card has already been
configured and provisioned;
if not, ignore the state of the
orange indicator.

CAUTION: Before checking fiber break problems using an

OTDR (Optical Time-Domain Reflectometer), it is the user's


responsibility to disconnect the receiver port. Failure to do so
may damage the receiver irreparably.

9-14

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Maintenance

General Troubleshooting Procedures for


Optical Transceiver Plug-ins
The following table describes the procedures for troubleshooting optical
transceiver plug-ins.
CAUTION: Before checking fiber break problems using an

OTDR (Optical Time-Domain Reflectometer), it is the user's


responsibility to disconnect the receiver port. Failure to do so
may damage the receiver irreparably.

Table 9-5:

General troubleshooting procedures for optical transceiver plug-ins

No.

Symptoms

Probable cause

1.

Green transceiver
state indicator off.

Corresponding
optical transmitter
may have been
turned off by the
ALS function (see
note below).

1. When available, press the


laser-on pushbutton of the
card to activate the
corresponding laser.
2. If the problem still persists,
the laser automatically turns
off again after a few
seconds. Check that all the
fibers are properly connected
to the corresponding optical
transceiver.
3. Replace the transceiver if the
problem is not corrected
after the transceiver is
reinserted.

2.

Transceiver state
indicator lights in
red.

Test equipment
connected to the
monitoring connector
of the corresponding
plug-in.

1. For plug-in transceivers with


monitoring connector; the
test equipment is connected
to the monitoring connector.
This indication is provided
for identification purposes,
and does not necessarily
indicate a malfunction.

Defective
transceiver.

1. Remove the transceiver and


then reinsert it in position,
paying attention to fully
engage its connector to the
mating card connector.
2. Check the correction of the
transceiver assignment.
3. Replace the transceiver if the
problem persists.

417006-2304-0H3-B02

Corrective measures

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Maintenance

XDM-500 Installation and


Maintenance Manual

NOTE: An optical port with ALS capability turns off its

transmitter when the corresponding receive signal is lost.


Turning the transmitter off may cause a chain reaction that
turns the optical signals off in a whole section of the network
and generates a large number of alarms.
As a result, it may be difficult to identify the real cause of the
problem. Use the management station log records to identify
the port.

Troubleshooting Procedures for Electrical


Interface Modules
The following table describes the procedure for troubleshooting electrical
interface modules.
Table 9-6:

9-16

Troubleshooting procedures for electrical interface modules

No.

Symptoms

Probable cause

Corrective measures

1.

Green ACTIVE
indicator off.

Defective
card/module

1. Check the card assignment.


2. Pull the module out and wait a
minute before reinserting it.
Make sure that you fully insert
the module in its slot.
3. If the ACTIVE indicator does
not turn on after reinsertion,
replace the module.

2.

Red FAIL
Defective
indicator not
card/module
turning off after
software download
(following
power-on and
resetting).

1. Reset the module by removing


and then reinserting it after a
few minutes. Make sure the
ACTIVE indicator turns on
after the module is reinserted.
2. The FAIL indicator must flash
while software is downloaded
to the module. Wait until the
software download ends and
check that the FAIL indicator
turns off.
3. If the FAIL indicator turns on
again, replace the module.

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Maintenance

No.

Symptoms

Probable cause

3.

Orange PROT
indicator lights.

Problem on protected
card/module

Corrective measures

1. Check for proper connection


of cables to the module front
panel connectors and to
remote distribution frame.
Whenever possible, disconnect
and then reconnect each cable
to verify positive contact.
2. Use test equipment to check
the signals at the monitoring
points of the I/O card
connected to this interface
module.
3. Check the cable wiring.
Replace cables if in doubt.
4. Identify the I/O card
connected to this interface
module and check its proper
operation. Replace the card or
the interface module as
necessary.

Troubleshooting Procedure for Optical


OADM and Mux/DeMux
The following table describes the procedures for troubleshooting optical
OADM and Mux/DeMux.
CAUTION: Before checking fiber break problems using an

OTDR (Optical Time-Domain Reflectometer), it is the user's


responsibility to disconnect the receiver port. Failure to do so
may damage the receiver irreparably.

Table 9-7:

Troubleshooting procedure for optical OADM and Mux/DeMux

No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator off.

Defective
card/module

417006-2304-0H3-B02

Corrective measures

ECI Telecom Ltd. Proprietary

1. Pull the component out, and


wait a minute before
reinserting it. Make sure that
you fully insert the card or
module in its slot.
2. If the ACTIVE indicator does
not turn on after reinserting,
replace the component.

9-17

Maintenance

9-18

XDM-500 Installation and


Maintenance Manual

No.

Symptoms

Probable cause

Corrective measures

2.

Red FAIL
Defective
indicator not
card/module
turning off after
software download
(following
power-on and
resetting).

1. Reset the component by


removing and then reinserting
it after a few minutes. Make
sure the ACTIVE indicator
turns on after the component is
reinserted.
2. The FAIL indicator must flash
while software is downloaded
to the component. Wait until
the software download ends
and check that the FAIL
indicator turns off.
3. If the FAIL indicator turns on
again, replace the component.

3.

ERROR indicator
lights.

Loss of input signal

1. Check for proper connection


of all the fibers connected to
it. In particular, make sure that
the color of the optical
transceiver providing the input
signal matches the
corresponding input channel.

Incorrect channel

1. For dual-channel transceivers


and tunable transponders, you
must also check the optical
channel configured via the
management station.

Defective
card/module

1. If the problem persists, replace


the card.

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Maintenance

Troubleshooting Procedures for EIS Cards


The following table describes the troubleshooting procedures for EIS cards.
Table 9-8:

Troubleshooting procedures for EIS cards

No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and


wait a minute before
reinserting it. Make sure that
you fully insert the card in its
slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL
Defective card
indicator on base
card not turning off
after software
downloading
(following
power-on and
resetting).

1. Reset the card by removing


and then reinserting it after a
few minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.
2. The FAIL indicator flashes
while software is downloaded
to the card. Wait until the
software download is
completed and check that the
FAIL indicator turns off.
3. If the FAIL indicator turns on
again, replace the card.

3.

Orange TRAFFIC
CARRYING
indicator on base
card off.

Card not configured


to carry traffic

1. Check with the management


station operator whether the
card has already been
configured and provisioned; if
not, ignore the state of the
orange indicator.

4.

Green LINK
STATE indicator
of an Ethernet
optical port or
ME_8/ME_14
electrical port off.

Problem related to
port

1. Check port configuration.


2. Check connections to LAN.
3. Make sure at least one LAN
station is active.
4. Replace the ME_8/ME_14.

417006-2304-0H3-B02

Corrective measures

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Maintenance

XDM-500 Installation and


Maintenance Manual

No.

Symptoms

Probable cause

LINK STATE
indicator of an
ME_8/ME_14
10/100BaseT
Ethernet port off.

Problem related to
port

Orange
Problem related to
ACTIVITY
port
indicator of an
Ethernet port lights
steadily.

Corrective measures

1. Check port configuration.


2. Check connections to LAN.
3. Make sure at least one LAN
station is active.
4. Replace the ME_8/ME_14.
1. Check port configuration.
2. Check that the indicator color
corresponds to the required
data rate:
--Yellow for 10 Mbps
--Green for 100 Mbps
--Blue for 1000 Mbps

Troubleshooting Procedures for DIO Cards


The following table describes the procedures for troubleshooting the DIO
cards.
Table 9-9:

9-20

Troubleshooting procedures for DIO cards

No.

Symptoms

Probable cause

Corrective measures

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and wait


a minute before reinserting it.
Make sure you fully insert the
card in its slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL
indicator on base
card not turning
off after software
downloading
(following
power-on and
resetting).

Defective card

1. Reset the card by removing and


then reinserting it after a few
minutes. Make sure the ACTIVE
indicator turns on after the
component is reinserted.
2. The FAIL indicator flashes
while software is downloaded to
the card. Wait until the software
download ends and check that
the FAIL indicator turns off.
3. If FAIL indicator turns on again,
replace the card.

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Maintenance

No.

Symptoms

Probable cause

3.

Orange (traffic
carrying)
indicator on base
card off.

Card not
configured to carry
traffic

1. Check with the management


station operator whether the card
has already been configured and
provisioned; if not, ignore the
state of the orange indicator.

4.

Red FAIL
indicator of
plug-in module
lights.

Defective plug-in
module

1. Remove the plug-in module and


reinsert it after about one
minute.
2. If the red FAIL indicator lights
again, replace the plug-in
module.

5.

Status indicator of Loss of optical


GbE port lights
input signal
steadily in red.

1. This may be caused by a


problem at the remote peer GbE
port (for example, it may have
been turned off), or by a fault in
the interconnecting fiber. Check
state of GbE port link indicator
(Step 7 below) to collect
additional information on cause
of problem.

6.

Status indicator of Transmit problem


GbE port lights
steadily in red.

1. Remove the plug-in module and


reinsert it after about one
minute.
2. If the status indicator lights in
red again, replace the plug-in
module.

7.

Link indicator of
GbE port off.

1. Check for following sequence of


indications after power-on or
reset, or after reconnecting the
fiber to the port:
2. The indicator starts flashing in
red to indicate execution of the
autonegotiation process. After a
short time, the indicator must
turn green; this can happen only
when the port status indicator is
also green.
3. Continued red flashing means
that the autonegotiation process
failed. One of the reasons could
be incompatible configuration of
the remote peer port.
4. Steady red flashing means that
the peer port does not support
flow control. This does not
enable normal operation. Check
and reconfigure the peer port.

417006-2304-0H3-B02

Link is down

Corrective measures

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9-21

Maintenance

XDM-500 Installation and


Maintenance Manual

Troubleshooting Procedures for DIOB Cards


The following table describes the troubleshooting procedures for DIOB cards.
Table 9-10: Troubleshooting procedures for DIOB cards

9-22

No.

Symptoms

Probable cause

Corrective measures

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and


wait a minute before
reinserting it. Make sure you
fully insert the card in its slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL
indicator on base
card not turning
off after software
downloading
(following
power-on and
resetting).

Defective card

1. Reset the card by removing


and then reinserting it after a
few minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.
2. The FAIL indicator flashes
while software is downloaded
to the card. Wait until the
software download ends and
check that the FAIL indicator
turns off.
3. If FAIL indicator turns on
again, replace the card.

3.

Orange (traffic
carrying)
indicator on base
card off.

Card not configured


to carry traffic

1. Check with the management


station operator whether the
card has already been
configured and provisioned; if
not, ignore the state of the
orange indicator.

4.

Orange, Green, or Problem related to


Blue (link state)
port
indicator of an
Ethernet optical
port or ME16
electrical port is
off.

1. Check port configuration.


2. Check that the indicator color
corresponds to the required
data rate:
--Orange for 10 Mbps
--Green for 100 Mbps
--Blue for 1000 Mbps
3. Check connections to LAN.
4. Make sure at least one LAN
station is active.
5. Replace the ME16.

5.

Orange (activity)
indicator of an
Ethernet port
lights steadily.

1. Check port configuration.

Problem related to
port

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Maintenance

NOTE: The DIOB includes a reset control with a rotable

wing locking the card extractor handle. The card will not
operate if the reset control is not closed. If the card is not
working, be sure to verify that the reset control is closed
properly. After inserting the card and securing it in its slot
with the extractor handle, turn the reset control
counter-clockwise to enable the card to start operating.

Troubleshooting Procedures for


MCS5/MCS10 Cards
The following table describes the troubleshooting procedures for
MCS5/MCS10 cards.
Table 9-11: Troubleshooting procedures for MCS5/MCS10 cards
No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and


wait a minute before
reinserting it. Make sure you
fully insert the card in its slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL
Defective card
indicator on base
card not turning off
after software
downloading
(following
power-on and
resetting).

1. Reset the card by removing


and then reinserting it after a
few minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.
2. The FAIL indicator flashes
while software is downloaded
to the card. Wait until the
software download ends and
check that the FAIL indicator
turns off.
3. If FAIL indicator turns on
again, replace the card.

3.

Orange (traffic
carrying) indicator
on base card off.

Check with the management


station operator whether the card
has already been configured and
provisioned; if not, ignore the
state of the orange indicator.

417006-2304-0H3-B02

Card not configured


to carry traffic

Corrective measures

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9-23

Maintenance

XDM-500 Installation and


Maintenance Manual

No.

Symptoms

Probable cause

4.

Orange, Green, or
Blue (link state)
indicator of an
Ethernet optical
port or ME16
electrical port is
off.

Problem related to
specific port

5.

Orange (activity)
Problem related to
indicator of an
port
Ethernet port lights
steadily.

Corrective measures

1. Check port configuration.


2. Check that the indicator color
corresponds to the required
data rate:
--Orange for 10 Mbps
--Green for 100 Mbps
--Blue for 1000 Mbps
3. Check connections to LAN.
4. Make sure at least one LAN
station is active.
5. Replace the ME16.
Check port configuration.

NOTE: The MCS5/MCS10 includes a reset control with a

rotable wing locking the card extractor handle. The card will
not operate if the reset control is not closed. If the card is not
working, be sure to verify that the reset control is closed
properly. After inserting the card and securing it in its slot
with the extractor handle, turn the reset control
counter-clockwise to enable the card to start operating.

9-24

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Maintenance

Troubleshooting Procedures for ROADM


Cards
The following table describes the troubleshooting procedures for ROADM
cards.
Table 9-12: Troubleshooting procedures for ROADM cards
No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and wait


a minute before reinserting it.
Make sure you fully insert the
card in its slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL
Defective card
indicator on base
card not turning off
after software
downloading
(following
power-on and
resetting).

1. Reset the card by removing and


then reinserting it after a few
minutes. Make sure the ACTIVE
indicator turns on after the
component is reinserted.
2. The FAIL indicator flashes
while software is downloaded to
the card. Wait until the software
download ends and check that
the FAIL indicator turns off.
3. If FAIL indicator turns on again,
replace the card.

3.

Orange (traffic
carrying) indicator
on base card off.

Card not
configured to carry
traffic

1. Check with the management


station operator whether the card
has already been configured and
provisioned; if not, ignore the
state of the orange indicator.

4.

Red LOS ADD


lights.

Loss of input
signal for ADD
unit

1. Check for proper connection of


all the fibers connected to it. In
particular, make sure that the
color of the optical transceiver
providing the input signal
matches the corresponding input
channel.
2. Use an OPM (described in
Measuring Optical Levels (page
8-8)) to check the ADD input
power level of the fibers. Verify
that the input power level meets
the required optical power
standard.
3. If the problem persists, replace
the card.

417006-2304-0H3-B02

Corrective measures

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9-25

Maintenance

XDM-500 Installation and


Maintenance Manual

No.

Symptoms

Probable cause

5.

Red LOS DROP


lights.

Loss of input
signal for DROP
unit

Corrective measures

1. Check for proper connection of


all the fibers connected to it. In
particular, make sure that the
color of the optical transceiver
providing the input signal
matches the corresponding input
channel.
2. Use an OPM (described in
Measuring Optical Levels (page
8-8)) to check the DROP input
power level of the fibers. Verify
that the input power level meets
the required optical power
standard.
3. If the problem persists, replace
the card.

Troubleshooting Procedures for Aurora-G


Cards
Regular periodic maintenance is recommended for all cards and system
components. Keep components free of dust and other particulate matter.
Examine cables for damage and ensure that airflow requirements have been
met. The Aurora-G card does not require any special maintenance.
The Aurora-G card does not include any field-replaceable parts. If you
experience a card failure, contact customer support for a replacement. Install
the replacement card as described in Installing Aurora-G Cards (page 6-79).
This section provides detailed troubleshooting guidelines, grouped into the
following categories: LED indicator lights, built-in tests, diagnostic codes,
management access, configuration, traffic, certificates, and card failure. Topics
include a list of symptoms together with possible solutions.

9-26

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XDM-500 Installation and


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Maintenance

LED indicator lights


Table 9-13: Understanding the Aurora-G indicator lights
Symptom

No power light.

Explanation and possible solutions

Make sure the card is correctly seated in the cage.


Check the power to the XDM rack.

Card failure light


is lit.

The device diagnostics detected a critical error during the boot


process. Try rebooting again to clear the error. If the failure
persists, do one of the following:
If the operating system boots, check the Alarms view in
EMS-Aurora and the syslog server, if configured, for
information about the BIT error.
If the error occurs before the operating system boots, make
note of the diagnostic code (Diagnostic codes (page 9-28)) and
contact ECI for service.

No card activity
light.

Indicates the presence of a port alarm on the local or remote port.


Check the Alarms view in EMS-Aurora to verify the port alarm.
Then check the syslog server for details on the cause of the alarm.

No link status
lights.

No link activity
lights.

Check the network cable. Verify correct transmit and receive


cable polarity.
Check the operational status of the equipment being
connected.
Verify that the auto-negotiation and flow control settings on
the local or remote port in question match the settings of the
equipment to which they are connected.
If the problem is not resolved, the network may not be
functioning properly. Consult a local network administrator.
Check physical connectivity.
Check with the local network administrator to ensure proper
placement in the network.

Built-in tests
The Aurora-G embedded software performs a series of built-in tests to verify
that the Aurora-G hardware components are functioning properly and operating
under the correct conditions. Some of the BIT procedures are performed when
the card's software boots. Some BIT procedures are performed on a periodic
basis. The tests that run on a periodic basis are non-service affecting.
If any of the BIT procedures fail, a card failure alarm is generated. Details
about the failure are displayed in the EMS-Aurora Alarms view and, if
configured to do so, the alarms are sent to a syslog server.

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

9-27

Maintenance

XDM-500 Installation and


Maintenance Manual

The following areas are tested by the built-in procedures:

Memory modules

Compact flash

Application code integrity

Encryption and keying functions

Card operating temperature

Network processing unit

Real-time clock

Ethernet management interface

Diagnostic codes
When the Aurora-G powers up, the diagnostic code LED displays 88 to verify
that the diagnostic display segments are functioning. As the Aurora-G cycles
through the built-in test sequence, the corresponding diagnostic code is
displayed. After the tests are completed successfully, the diagnostic code
display is solidly illuminated with the code 00.
If a test fails, the card failure LED illuminates, which indicates that the
Aurora-G is in an error state. If the Aurora-G fails to boot properly, make a
note of the error code and contact customer support.
If the failure occurs after the serial port has been initialized, a card failure
alarm is sent to EMS-Aurora and a text message describing the boot failure is
displayed on the terminal. A message is also sent to the syslog server if the card
has been configured to send alarms to a syslog server.
The diagnostic code display indicates the number of the failed test. The
following table lists the test error codes.
Table 9-14: Diagnostic codes
Code

Built-in test

Terminal output

88

Diagnostic display test

None

01

Bootrom CRC

None

02

RAM test portion 1

None

03

RAM test portion 2

None

04

Network Processor initialization test

None

05

RDRAM initialization test

None

06

RDRAM test

None

Application image authentication

Code authentication
.... FAILED

Random Number test

Error. Detected two sets of


identical "random" number

07

9-28

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XDM-500 Installation and


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Code

Maintenance

Built-in test

Terminal output

BCM5821 self test

Testing BCM 5821


.... FAILED

File system missing

File system missing

08

CAM test

Initializing CAM .... FAILED

09

AES/SHA-1 algorithm test

Testing AES/SHA1 BCM584X


.... FAILED

00

Successful completion of all tests

Up and operational

NOTE: Remove the Aurora-G cover plate to expose the


diagnostic code display.

Management access
Table 9-15: Management access troubleshooting
Symptom

Explanation and possible solutions

Administrator
password is forgotten
or lost.

Not able to log in to


the CLI.

The management
workstation cant
communicate with the
Aurora-G.

Aurora-G is not
sending SNMP objects
to the management
workstation.

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Clear the configuration to restore factory defaults.


Contact ECI for service.
Verify the password.
Only one user at a time can access the CLI.
Check for a user conflict between the RS-232 port and
10/100 Ethernet management port.
Verify that the network connection to the management
port is in place (see Installing Aurora-G Cards (page 679)).
Check the management interface default gateway
configuration. Assign a default gateway if the
management workstation is on a different subnet than the
Aurora-G management port.
Verify that the Aurora-G is configured properly for the
management option you are using (IPSec and Telnet
enabled/disabled).
Enable SNMP functionality by setting the community
string.
Verify that the management workstations IP address is
configured as the SNMP trap host address.

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Symptom

Explanation and possible solutions

Cannot Telnet to the


management port.

Verify that the correct management port IP address is


being entered for the connection.
Verify that Telnet is enabled.
If IPSec is disabled on management port, make sure that
the IPSec client on the workstation is disabled.
If IPSec is enabled on the management port, verify that
the IPSec client is enabled on the workstation and that
matching policy settings have been configured on each.
Ensure the management port is connected to the network.
Verify that the default gateway is properly configured on
the 10/100 management port.

Configuration
Table 9-16: Configuration troubleshooting
Symptom

Explanation and possible solutions

The device on the


WAN side (remote port
connection) of the
Aurora-G is dropping
packets.

Set the PMTU size to a number that doesnt exceed the


MTU of the device with the smallest MTU in the path.
To get this number, run diagnostics on the device in
question or check with your network administrator.

Cannot download files


from an FTP server.

Verify that the FTP server software is active on the


specified host.
Verify the FTP client configuration and make any
necessary corrections, save the configuration, and retry
the command.
Ping the FTP server and Aurora-G management port. If
not successful, contact the Network Administrator.
Verify that the configuration of IPSec on the
management port is compatible with the FTP server.

Aurora-G configuration
settings revert to their
previous setting after
the unit is rebooted.

9-30

Save configuration changes (copy s n). Unsaved


configuration changes are lost when the unit is
rebooted.

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Maintenance

Traffic
Table 9-17: Traffic troubleshooting
Symptom

Encrypt All mode is


not passing packets
as expected.

Explanation and possible solution

Traffic is not being


passed.

Cannot establish a
link.

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Check the shared keys. In a point-to-point configuration,


make sure that precisely the same shared key is configured
on both Aurora-Gs in the pair. In a mesh configuration, the
cipher secret and hash secret must be entered identically
on each participating Aurora-G.
Check the Aurora-G roles. In a point-to-point
configuration, verify that the two Aurora-Gs have different
roles. One Aurora-G should be configured as primary
and the other secondary. In a mesh configuration, all
Aurora-Gs should be configured as mesh.
Check the group IDs. All Aurora-Gs in the group must
have the same ID. If the IDs are different or missing,
packets will be discarded.
Determine whether the network requires that a specific
VLAN tag be applied to all Ethernet traffic. If so, make
sure the vlan command is configured appropriately on the
Aurora-G.
Verify that the local and remote port SFP transceivers and
cables are properly seated. The Link status LEDs
illuminate when the link is active. The Link traffic LEDs
blink at a steady rate when traffic is passing on the port.
Ping end-to-end through the encrypted connection to
verify a valid end-to-end connection.
Check for alarm conditions on the local and remote ports.
If an alarm is present, determine the cause and try to
correct the condition that is triggering the alarm.
Set the Aurora-G to the Pass All security mode and verify
that it is able to pass unencrypted packets.
Check physical connectivity to ensure proper signal path.
Verify that compatible SFP transceivers and fiber type is
being used for connectivity.
Ensure that the auto-negotiation and flow control settings
on the local or remote port and the device to which they
connect have compatible settings.

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Certificates
Table 9-18: Certificate troubleshooting
Symptom

Explanation and possible solutions

Policies that use


certificates for
authentication are not
establishing SAs.

IKE negotiations are


failing when CRLs are
used.

Check the certificate expiration date in the Certificate


Editor.
Check for a corrupted certificate. When Aurora-G
detects a bad certificate it generates a message to the
console at boot time. Replace the corrupted certificate
with a valid one.
Verify that the IPSec peers certificate or CA certificate
is installed as an external certificate on the Aurora-G.

Issue the debug crl command and look for the following:
Verify that the URL for the CRL server is correct.
Check that the dns command is configured.
Make sure that the CRL URL is in the correct field in
the peers certificate (in the CRL distribution point
field).

Card failure
Table 9-19: Card failure troubleshooting

9-32

Symptom

Explanation and possible solutions

The Card failure


LED is
illuminated and
Card alarm is
issued.

If the Aurora-G enters an error state, a card alarm is sent to


EMS-Aurora and the card failure LED illuminates. The
Aurora-G can be configured while it is in an error state. To
recover:
Check the EMS-Aurora Alarm view for information about
the failure.
Reboot the Aurora-G.
If a failure occurs during the boot process, refer to
Diagnostic codes (page 9-28) for additional troubleshooting
information.
If rebooting the Aurora-G does not clear the error, contact
customer support.

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Maintenance

Troubleshooting Procedures for ATS Cards


The following table describes the troubleshooting procedures for ATS cards.
Table 9-20: Troubleshooting procedures for ATS cards
No.

Symptoms

Probable cause

1.

Green ACTIVE
indicator on base
card off.

Defective card

1. Pull the component out and


wait a minute before
reinserting it. Make sure that
you fully insert the card in its
slot.
2. If the ACTIVE indicator does
not turn on after reinsertion,
replace the component.

2.

Red FAIL indicator Defective card


on base card not
turning off after
software
downloading
(following
power-on and
resetting).

1. Reset the card by removing


and then reinserting it after a
few minutes. Make sure the
ACTIVE indicator turns on
after the component is
reinserted.
2. The FAIL indicator must flash
while software is downloaded
to the card. Wait until the
software download ends and
check that the FAIL indicator
turns off.
3. If the FAIL indicator turns on
again, replace the card.

3.

Orange (traffic
carrying) indicator
on base card off.

Check with the management


station operator whether the card
has already been configured and
provisioned; if not, ignore the state
of the orange indicator.

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Card not configured


to carry traffic

Corrective measures

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Troubleshooting Transmission and Traffic


Alarms
Before any other troubleshooting activity, check the management station log to
find whether a specific component is reported as faulty, and then replace it.
CAUTION: Before checking fiber break problems using an

OTDR (Optical Time-Domain Reflectometer), it is the user's


responsibility to disconnect the receiver port. Failure to do so
may damage the receiver irreparably.

Table 9-21: Troubleshooting transmission and traffic alarms


No.

Symptoms

Probable cause

1.

Alarm related to External problem


a tributary
signal

I/O card handling


the tributary signal
defective

9-34

Corrective measures

1. Check the proper operation of


the equipment providing the
tributary signal and its
connections to the XDM I/O
port.
2. Use the results of the
commissioning and acceptance
tests as a reference for the
required signal levels, and make
measurements of current levels
at all the relevant monitoring
points.
3. Compare the reference levels
with the measured values; a
significant discrepancy may
point to the failed component
(for example, low transmit
level, excessive fiber
attenuation due to physical
damage, and so on).
1. Force switching to the
protection path and reset the I/O
card. Use the results of the BIT
test to identify the faulty
component.
2. Replace the I/O card if suspect.

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Maintenance

No.

Symptoms

2.

Alarm related to External problem


an aggregate
signal

417006-2304-0H3-B02

Probable cause

Corrective measures

1. Check the proper operation of


the equipment providing the
aggregate signal and its
connections to the XDM port.
2. Use the network and site
documentation to identify the
path associated with the
reported alarm and all related
optical and/or electrical
components.
Use the results of the
commissioning and acceptance
tests as a reference for the
required signal levels, and make
measurements of current levels
at all the relevant monitoring
points.
3. Compare the reference levels
with the measured values; a
significant discrepancy may
point to the failed component
(for example, low transmit
level, excessive fiber
attenuation due to physical
damage, and so on).
4. Force switching to the
protection path, and reset each
component. Use the results of
the BIT test to identify the
faulty component.

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Troubleshooting Power Problems


The following table describes the troubleshooting procedures for power
problems.
Table 9-22: Troubleshooting power problems

9-36

No.

Symptoms

Probable
cause

Corrective measures

xRAP-D,
xRAP-B,
xRAP-HP, or
miniRAP
POWER ON
indicator on

Both the main


and backup
power sources
failed

Check the site power distribution system.


Check the DC voltage at the main and
backup power terminals of the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP.
If not within the correct range, check cable
connections up to the DC power distribution
panel, and make sure no circuit breakers are
blown.
Check the voltage supplied by the main and
backup power sources.
Check the power connections to the
xRAP-D, xRAP-B, xRAP-HP, or miniRAP.
Check the circuit breakers in the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP and
replace if necessary.
Check for correct input polarity.

Equipment
problem

Check the voltage at the xINF end of each


power cable. Replace the cable or repair the
xRAP-D, xRAP-B, xRAP-HP, or miniRAP
if there is no voltage present.
If the xINF ACTIVE (green) indicator does
not light, check for input voltage presence
and correct polarity.
If after checking (as explained above) and
reconnecting a cable to the equipment, the
circuit breaker trips again, replace the
corresponding xINF unit.
If the problem occurs again after Step 3,
remove all the cards and modules from the
platform and reinsert them one by one until
the component causing the circuit breaker to
trip is found. Replace that component.

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Maintenance

Probable
cause

Corrective measures

No.

Symptoms

2.

xINF ACTIVE No input power


indicator off
to the
corresponding
unit

Note: If an xRAP-D, xRAP-B, xRAP-HP,


or miniRAP is not used, perform Steps 1 and
2 on the circuit breakers on the power
distribution panel providing power to the
corresponding xINF.
Check the corresponding circuit breaker in
the xRAP-D, xRAP-B, xRAP-HP, or
miniRAP; reset any tripped breaker.
Check the circuit breakers in the xRAP-D,
xRAP-B, xRAP-HP, or miniRAP and
replace if necessary.
If the circuit breaker trips again, disconnect
the cable protected by the corresponding
circuit breaker from the equipment and
check voltage polarity.
Check the power cable condition and make
sure that the cable is not damaged and does
not cause short circuits.
Check proper cable connection at both ends.

3.

xINF FAIL
Technical
indicator lights failure in the
corresponding
unit

Replace the unit.

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Troubleshooting the Timing Subsystem


The following table describes the troubleshooting procedures for the timing
subsystem.
Table 9-23: Troubleshooting procedures for timing subsystem

9-38

Symptoms

Probable cause

Corrective measures

Switching to
standby TMU

Technical failure

Force switching of traffic to the other HLXC


or XIO card, and then replace the HLXC or
XIO card with the defective TMU.

Missing T3 external
reference signal

1. Check the equipment providing the


external reference signal and make sure it
operates normally.
2. Check the cable connected to the
corresponding xECB connector. Make
sure both ends are properly connected to
the mating connector.
3. Check the cable wiring. Replace the cable
if in doubt.
4. Replace the corresponding xECB.

Missing T4 external
reference signal

1. Check the cable connected to the


corresponding xECB connector. Make
sure both ends are properly connected to
the mating connector.
2. Check the cable wiring. Replace the cable
if in doubt.
3. Replace the corresponding xECB.
4. Force switching of traffic to the other
HLXC or XIO card, and then replace the
HLXC or XIO card with the defective
TMU.

Loss of reference
clock source
provided by a
tributary

Troubleshoot the corresponding card and


replace if found faulty.

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Maintenance

Troubleshooting Management
Communication
When it is not possible for the management station to manage an XDM
platform, use the following table to identify the cause of the problem.
NOTE: Whenever problems are detected during

commissioning and acceptance tests and also when


troubleshooting a new installation, the possibility of
configuration and/or provisioning errors must not be
overlooked. Under such circumstances, always start the
troubleshooting procedures by making a complete review of
all equipment configuration and provisioning parameters
against the original network design, and correct as necessary.

Table 9-24: Troubleshooting management communication


Symptoms

Probable cause

Management
traffic path

Defective card in
management traffic
path

1. Check for fault indications on the cards


processing the management communication.
2. Force switching to the protection path and
reset each component. Use the results of the
BIT test to identify the faulty component.

Problem in
transmission path

1. Use the network and site documentation to


identify the path of the management
communication to the corresponding XDM
platform and all the related optical and/or
electrical components.
2. Use the results of the commissioning and
acceptance tests as a reference for the
required signal levels, and make
measurements of current levels at all the
relevant monitoring points.
3. Compare the reference levels with the
measured values; a significant discrepancy
may point to the failed component (for
example, low transmit level, excessive fiber
attenuation due to physical damage, and so
on).

Other problems

Replace suspected components in the following


sequence:
1. Hubs and Ethernet cables used for
management traffic.
2. MECP card.
3. xMCP card.

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Corrective measures

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Replacing a Network Element


This section describes the procedure for replacing a network element.
NOTES:

This procedure is traffic-affecting. There should be no


traffic going through the platform being replaced for at
least one hour.
This procedure is applicable to systems supplied from
version 4.0 of the product.

Backing Up the LightSoft Database


Backing up the LightSoft database involves the following steps:

Saving EMS-XDM configuration files (page 9-40)

Uploading the NE database from the XDM-500 (page 9-40)

Backing up the database with the DBBackup function (page 9-41)

Saving EMS-XDM Configuration Files


To save the EMS-XDM configuration files:
1. In the EMS-XDM menu bar, select System > Save Configuration to File.
The Save File Name dialog box opens.
2. In the dialog box, enter the name of the file to be saved and click OK.

Uploading the NE Database from the XDM500


To upload the NE database from the XDM-500:
1. In the EMS-XDM menu bar, select System > NE Software Downloads >
Selected NE. The Software Download dialog box opens.
2. In the dropdown list, select Get DB from NE.
3. On the File menu, select Activate. A message appears asking you to
confirm the operation.
4. Click OK to confirm.

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Maintenance

Backing up the Database with the DBBackup


Function
Before you start:

The DBBackup function was released with LightSoft version V01.141.


This function will not operate with prior versions of the application.

Only administrators can perform this operation.

To back up the database using the DBBackup function:


1. On the Unix workspace, right-click anywhere on the screen to open the
Root Menu.
2. In the Root Menu, select Unix Window.
3. At the # prompt, type su nms.
4. At the nms prompt, type DBBackup. The following text appears.

5. Verify the backup has been completed successfully.

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Installing/Replacing the XDM-500 Platform


Follow these instructions to install or replace an XDM-500 platform.
To install the new XDM-500 platform:
1. Make sure the new unit is the same as the one to be replaced and install the
platform with all its cards.
2. Perform the Commissioning Tests (page 8-1).
3. Copy the contents of the NVM from the replaced platform to the new
platform.
4. Perform the following tests:
Test procedure

Expected results

Select one of the cross connects.


Connect the test equipment to one side
and make a fiber loopback on the other
side.

The test equipment shows no alarms.

Extract the central cross-connect matrix


card, for example, the HLXC with the
active TMU.

Insert the central cross-connect matrix


card, for example, the HLXC.

Extract the other central cross-connect


matrix card, for example, the HLXC.

Insert the central cross-connect matrix


card, for example, the HLXC.

The test equipment displays a short burst


of alarms (less than 50 msec).
The TMU switches to the other central
cross-connect matrix card, for example,
the HLXC.
The test equipment shows no alarms.
The TMUs orange LED remains active.
The test equipment shows a short burst of
alarms (less than 50 msec).
The TMW switches to the other central
cross-connect matrix card, for example,
the HLXC.
The test equipment shows no alarms.
The TMUs orange LED remains active.

To replace the XDM-500 platform:


1. Verify that all the fibers in the ODF are marked correctly.
2. Disconnect the fibers that connect to the XDM-500 you want to replace and
connect them to the replacement XDM-500 in the proper place in the ODF.
3. Verify traffic passes correctly.
4. Verify the replaced XDM-500 uploads LightSoft data.

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Maintenance

Replacing Cards, Modules, Fans,


and Other Components
This section provides instructions for replacing faulty XDM components
identified in troubleshooting procedures (page 9-11).

Safety and Workmanship


For safety and workmanship instructions, refer to Before You Start/Safety
Guidelines (page 1-1).

Replacing xRAP-D Circuit Breakers


xRAP-D circuit breakers can be replaced without disconnecting the power (hot
swapping).
To replace the xRAP-D circuit breakers:
1. Open the two captive screws fastening the xRAP-D front cover to its
chassis and remove the cover (see the following figure).
2. Identify the faulty circuit breaker and remove it by pulling it straight out of
its socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
WARNING: For continued protection against risk of fire,
replace only with a circuit breaker of the same type and
rating.

ATTENTION: Pour ne pas compromettre la protection


contre les risques dincendie, remplacer par un fusible de
mme type et de mmes caractristiques nominales.

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4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding xRAP-D power terminal board, as shown in the following
figures.
5. Reinstall the xRAP-D front cover and fasten it with its two captive screws.

Figure 9-2: Installation of xRAP-D circuit breakers

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Replacing xRAP-HP Circuit Breakers


xRAP-HP circuit breakers can be replaced without disconnecting the power
(hot swapping).
To replace xRAP-HP circuit breakers:
1. Open the two captive screws fastening the xRAP-HP front cover to the
xRAP-HP chassis and remove the cover.

Figure 9-3: Replacing xRAP-HP circuit breakers

2. Identify the faulty circuit breaker and remove it by pulling it straight out of
its socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
WARNING: For continued protection against risk of fire,
replace only with a circuit breaker of the same type and
rating.

ATTENTION: Pour ne pas compromettre la protection


contre les risques dincendie, remplacer par un fusible de
mme type et de mmes caractristiques nominales.

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4. Insert the replacement circuit breaker into the circuit breaker sockets
located on the corresponding xRAP-HP power terminal board as shown in
the previous figure.
5. Reinstall the xRAP-HP panel and fasten it with its two captive screws.

Replacing xRAP-100 Circuit Breakers


xRAP-100 circuit breakers can be replaced without disconnecting the power
(hot swapping).
To replace xRAP-100 circuit breakers:
1. If the xRAP-100 front panel has not been removed, open the two captive
screws fastening the xRAP-100 front cover to its chassis and remove the
cover (refer to the following figure).

Figure 9-4: Replacing xRAP-100 circuit breakers

2. Identify the circuit breaker and remove it by pulling it straight out of its
socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
WARNING: For continued protection against risk of fire,
replace only with a circuit breaker of the same type and
rating.

ATTENTION: Pour ne pas compromettre la protection


contre les risques dincendie, remplacer par un fusible de
mme type et de mmes caractristiques nominales.

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Maintenance

4. Insert the replacement circuit breaker into the circuit breaker sockets
located on the corresponding xRAP-100 power terminal board, as shown in
the previous figure.
5. Reinstall the xRAP-100 cover and fasten it with its two captive screws.

Replacing miniRAP Circuit Breakers


miniRAP circuit breakers can be replaced without disconnecting the power (hot
swapping).
To replace miniRAP circuit breakers:
1. Open the two captive screws fastening the miniRAP front cover to its
chassis, and remove the cover (see the following figure).
2. Identify the faulty circuit breaker and remove it by pulling it straight out of
its socket.
3. Check the replacement circuit breaker ratings against those of the replaced
circuit breaker.
WARNING: For continued protection against risk of fire,

replace only with the same type and rating of circuit breaker.

4. Insert the replacement circuit breaker into the circuit breaker sockets of the
corresponding miniRAP power terminal board, as shown in the following
figure.
5. Reinstall the miniRAP front cover and fasten it with its two captive screws.

Figure 9-5: Installing miniRAP circuit breakers

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Replacing XDM-500 Components


This section provides replacement procedures for the common components
installed in XDM-500 platforms. Replacement procedures for cards, modules,
and optical transceivers are provided in Replacing Cards (page 9-50) and
Replacing Modules in the Modules Cage (page 9-62).

Replacing the FCU


FCU units can be replaced without disconnecting the power from the XDM
platform.
CAUTION: To prevent platform overheating, the replacement
must be completed within 2 to 3 minutes.

IMPORTANT: In the XDM-3000 platform, if one FCU3000


unit is not working, it is essential that the working
FCU3000 unit be located in the lower FCU slot in the
platform.
The XDM-3000 platform can continue to operate for a short
period of time as long as there is a working FCU3000 unit in
the lower slot of the platform. Replace the nonfunctional
FCU3000 as soon as possible. In the meantime, if the
FCU3000 unit that is working is located in the upper FCU
slot, move the working FCU3000 unit down to the lower
FCU slot. Insert the replacement FCU3000 unit into the
empty upper FCU slot as soon as possible.

To replace the FCU:


1. Prepare the replacement FCU unit so you can install it immediately after
removing the old FCU unit. In particular, carefully inspect the interior of
the FCU unit to ensure that no foreign matter, such as packaging chips, is
present inside the unit.
2. Check that at least one FCU unit works properly.
3. Open the front panel door of the XDM platform.
4. Remove the FCU unit to be replaced from the platform by slowly pulling it
out. Be careful, as the internal fans may still be rotating.
5. Insert the replacement FCU unit in the corresponding platform guides, and
push it carefully in until the FCU unit fully engages the mating internal
connector of the XDM platform. Make sure that the FCU front panel is
flush with the platform frame front edges. As the FCU unit is plugged into
its mating connector, the green ACTIVE indicator on its panel should turn
on.
6. Close the XDM platform front door with its fasteners.
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Maintenance

Replacing xINF/xINF-H Units


xINF/xINF-H units can be replaced without disconnecting the power from the
XDM platform (hot swapping). Refer to the following figure while performing
the following procedure.

Figure 9-6: Replacing xINF/xINF-H unit

To replace xINF/xINF-H units:


1. Before starting, check that the second xINF/xINF-H unit of the same XDM
platform is connected to the power and working.
2. Disconnect the power cable from the xINF/xINF-H unit to be replaced.
3. Unscrew the three top screws fastening the xINF/xINF-H unit to be
replaced, and then remove the unit by pulling it straight up.
4. Orient the replacement unit as shown in the previous figure, slide it in
position, and push downward carefully to plug it into the mating internal
connector on the top printed circuit board of the XDM platform. Make sure
the unit is fully inserted in its place.
5. Secure the unit using its three captive screws.
6. Reconnect the power cable to the xINF/xINF-H unit POWER IN connector.
The green ACTIVE indicator on its front panel should turn on, indicating
that the xINF/xINF-H unit is operating properly.
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Replacing the xECB


The xECB unit can be replaced without stopping XDM operation. However,
the replacement process must be completed as soon as possible because the
xECB is used to connect the external reference clock signals to the platform.
Whenever possible, configure the XDM platform to use an alternative
reference source until the xECB unit is replaced.
To replace the xECB:
1. Disconnect the cables connected to the xECB connectors.
2. Unscrew the screws fastening the xECB unit to be replaced, and then
remove the unit by pulling it straight out.
3. Insert the replacement xECB unit in the platform guides, and push it
carefully in until the xECB unit fully engages the mating internal connector
of the XDM platform. Make sure that the xECB front panel is flush with
the platform frame front edges.
4. Secure the replacement unit using its captive screws.
5. Reconnect the cables disconnected in Step 1 above.

Replacing Cards
CAUTION: - STATIC SENSITIVE DEVICES
PROPER HANDLING AND GROUNDING
PRECAUTIONS REQUIRED
XDM equipment contains components sensitive to electrostatic
discharge (ESD). To prevent ESD damage, strictly observe all the
precautions listed in Protection against Electrostatic Discharge (page 126). Keep parts and cards in their antistatic packaging material until
you are ready to install them.
The use of an antistatic wrist strap connected to a grounded equipment
frame or rack is recommended when handling cards and modules
during installation, removal, or connection to internal connectors.

CAUTION: When inserting cards and modules, make sure to carefully


align the card with the platform guide rails. If resistance is felt during
insertion, immediately retract the card and then repeat the process.

Hold the card straight during insertion and removal, and pull or push it
slowly and carefully to avoid touching components located on adjacent
cards.
Do not use excessive torque when tightening the fastening screws of
cards and modules.

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Maintenance

CAUTION: Visually inspect the card and the mating

backplane connectors and make sure that there are no signs of


physical damage. In particular, check for bent connector pins.

Before you start:


Before replacing any card, module, NVM, or optical transceiver:
1. Check that the replacement component has not been physically damaged
during shipment.
2. Remove the replacement component from its antistatic protection
packaging and visually inspect the component for any damage during
shipment. Report any problems.
3. Record the hardware and software versions as indicated on the component
identification labels, and make sure they are compatible with those of the
component to be replaced.
After replacing a component:
1. Place the component in its antistatic protection packaging and close it.
2. Attach to the packaging a report explaining the reason for the replacement,
and identify the network site, physical location, platform, and time of
replacement.

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Replacing the NVM in the xMCP Card


CAUTION: To prevent disruption of data stored on the NVM,

make sure you do not press the NVM release pushbutton


while the xMCP accesses the NVM. Monitor the yellow
indicator before attempting to remove the NVM. Press the
release pushbutton only after the yellow xMCP indicator has
been off for at least two minutes.
When removing/inserting an NVM card, hold the card
straight and be careful to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP.
Such contact may reset the xMCP card.

Refer to the following figure when performing the procedure.

Figure 9-7: Replacing an NVM on xMCP card

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Maintenance

To replace the NVM in the xMCP card:


1. If the platform has two xMCP cards, first force switch to the other xMCP
card.
2. Wait until the yellow indicator of the xMCP (on which the NVM is
located) turns off and remains off for at least two minutes.
3. Press the NVM release pushbutton and carefully retract the card while
ensuring that it does not touch the xMCP PCB.
4. Position the replacement NVM card correctly and push it straight into its
socket, ensuring that it does not touch the xMCP.
This completes the NVM card replacement. At this stage, check your
instructions. You may decide to wait for the automatic updating of the database
stored on the new NVM card (this may take up to one hour), or immediately
force switch to the xMCP/xMCP-B on which the NVM card has been replaced.

Replacing the xMCP


CAUTION: If the platform has a single xMCP card, organize

your work to replace it as rapidly as possible. Management


communication with this platform is not possible when the
xMCP card is removed. Monitor its yellow indicator before
attempting to remove the card. Remove the card only after the
yellow xMCP indicator has been off for at least two minutes.

To replace the xMCP:


1. If the platform has two xMCP cards, first initiate a forced switching to the
other xMCP card.
2. Wait until the yellow indicator of the xMCP to be replaced turns off and
remains off for at least two minutes, and then remove the NVM card. It is
recommended to wait until the orange indicator of the other xMCP card
also turns off.
3. Remove the card to be replaced by bringing both its extractor handles to the
horizontal position.
4. If the NVM card is to be transferred from the replaced xMCP card to its
replacement, do this now (see "Replacing the NVM in the xMCP Card"
page 9-52).
5. Bring both extractor handles of the replacement card to the horizontal
position before inserting the card in its slot.
6. Insert the rear end of the replacement card into the corresponding card
guides.
7. Push the card in until it mates the chassis connectors. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
8. Press the ends of the two extractor handles to fully insert the card.

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Replacing the NVM in the xMCP-B Card


CAUTION: To prevent disruption of data stored on the NVM,

make sure you do not press the NVM release pushbutton


while the xMCP-B accesses the NVM. Monitor the yellow
indicator before attempting to remove the NVM. Press the
release pushbutton only after the yellow xMCP-B indicator
has been off for at least two minutes.

When removing/inserting an NVM card, hold the card


straight and be careful to prevent accidental contact between
the NVM card and the printed circuit board of the xMCP-B.
Such contact may reset the xMCP-B card.

Refer to the following figure when performing the procedure.

Figure 9-8: Replacing an NVM on xMCP-B card

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Maintenance

To replace the NVM in the xMCP-B card:


1. If the platform has two xMCP-B cards, first force switch to the other
xMCP-B card.
2. Open the two captive screws fastening the NVM cover to the chassis, and
remove the cover.
3. Use the thin edge of the NVM cover to press the NVM release pushbutton,
and carefully retract the card while ensuring that it does not touch the
xMCP-B PCB.
4. Position the replacement NVM card correctly and push it straight into its
socket, ensuring that it does not touch the xMCP-B PCB (when the card is
in place the release pushbutton is flush with the NVM).
5. Replace the NVM cover and fasten it with its two captive screws.
This completes the NVM card replacement. At this stage, check your
instructions. You may decide to wait for the automatic updating of the database
stored on the new NVM card (this may take up to one hour), or immediately
force switch to the xMCP-B on which the NVM card has been replaced.

Replacing the xMCP-B


CAUTION: If the platform has a single xMCP-B card,

organize your work to replace the xMCP-B as rapidly as


possible. Management communication with this platform is
not possible when the xMCP-B card is removed. Monitor its
yellow indicator before attempting to remove the card.
Remove the card only after the yellow xMCP-B indicator has
been off for at least two minutes.

To replace the xMCP-B:


1. If the platform has two xMCP-B cards, first force a switch to the other
xMCP-B card.
2. Push the card reset control and rotate it clockwise to unlock the lower
extractor handle.
3. Remove the card to be replaced by bringing both its extractor handles to the
horizontal position.
4. If the NVM card is to be transferred from the replaced xMCP-B card to its
replacement, do this now (see "Replacing the NVM in the xMCP-B Card"
page 9-54).
5. Bring both extractor handles of the replacement card to the horizontal
position before inserting the card in its slot.
6. Insert the rear end of the replacement card into the corresponding card
guides.

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7. Push the card in until it mates the chassis connectors. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
8. Press the ends of the two extractor handles to fully insert the card.
9. Push the card reset control and rotate it counter-clockwise to lock the lower
extractor handle.

Replacing the NVM in the ATS Card


Refer to the following figure while performing the procedure.

Figure 9-9: Replacing NVM on ATS card

To replace the NVM in the ATS card:


1. Release the screw that prevents NVM removal.
2. Press the NVM release pushbutton, and carefully retract the NVM while
ensuring that it does not touch the ATS PCB.
3. Orient the replacement NVM card in the correct position and push it
straight into its socket, while ensuring that it does not touch the PCB.
4. Reinstall the screw removed in Step 1.
This completes the NVM replacement.
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Maintenance

Replacing the MECP


This section provides replacement instructions for all the MECP versions:
MECP, MECP_OW, MECP_OSCxx, and MECP_OCxxOW. Refer to the
following figure while performing the procedure.
NOTE: The following figure illustrates the procedure on an
MECP_OSC card. The same procedure applies to the
MECP_OCxxOW cards.

Figure 9-10: Typical MECP_OSC card optical connections

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CAUTION: Organize your work to replace the MECP card as

rapidly as possible. While the MECP card is out, management


and OW communication with the platform and other tasks
supported by this card are not possible.
Moreover, when the replaced MECP_OSC5 or
MECP_OC5OW card is operating on a link with OFA_R
Raman optical amplifiers, these amplifiers may turn off while
no OSC signal is present. If you need additional details on
this issue, contact ECI' Customer Support team.
Before attempting to remove the card, monitor the yellow and
orange indicators of the xMCP card(s) installed in the
platform. Remove the MECP only after the xMCP indicators
have been off for at least two minutes.

To replace the MECP:


1. Prepare a sketch identifying each cable and, for the
MECP_OSCxx/MECP_OCxxOW, each fiber connected to the card.
2. When ready, disconnect the cables connected to the MECP.
3. For the MECP_OSCxx/MECP_OCxxOW, refer to the previous figure.
Press the handle to bring the optical connector assembly to the
CONNECTION position, and then disconnect the optical fibers connected
to the card.
4. Remove the card to be replaced by bringing its extractor handle to the
horizontal position.
5. Insert the rear end of the replacement card in the corresponding card
guides.
6. Push the card in until it mates the chassis connectors. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
7. Press the end of the MECP extractor handle to fully insert the card.
8. Reconnect the cables disconnected in Step 2 above to the replacement card.
9. For the MECP_OSCxx/MECP_OCxxOW, refer to the previous figure.
Press the handle to bring the optical connector assembly to the
CONNECTION position, and then reconnect the optical fibers to the
MECP_OSCxx/MECP_OCxxOW connectors.
10. Raise the handle to return the optical connector assembly to the NORMAL
position.

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Maintenance

Replacing I/O Cards


The following procedure applies to all I/O cards.
For cards with electrical interfaces that use electrical interface protection
modules, force a switch to the protection card (IOP) before replacing the card.
To replace an I/O card:
1. For cards with optical ports, prepare a sketch identifying each fiber
connected to the card.
2. For cards with reset control, for example HLXC, SIO164, DIOB, first turn
the reset control to the vertical position.
3. Disconnect any fibers from the card to be replaced.
4. Remove the card by bringing both extractor handles to the horizontal
position.
5. Bring both extractor handles of the replacement card to the horizontal
position before inserting the replacement card in its slot.
6. Insert the rear end of the replacement card into the corresponding card
guides.
7. Push the card in until it mates the chassis connectors. If you feel resistance
before the connectors are mated, pull the card out and repeat the procedure.
8. For cards with reset control, return the reset control to the horizontal
position to release the extractor handle.
9. Press the ends of the two extractor handles to fully insert the card.
10. Reconnect any fibers that were disconnected from the replaced card to the
replacement card.

Replacing Optical Transceivers


The following procedure explains how to replace an optical transceiver.
To replace an optical transceiver:
1. Identify the position of the transceiver to be replaced.
2. Disconnect the fibers connected to the transceiver. Refer to the following
figure.
3. Insert the prescribed SFPs in the optical module positions as explained in
Installing and removing optical transceivers (page 6-11).
4. Reconnect the fibers disconnected in Step 2 above.

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Optical transceiver replacement guidelines


ECI's Transport Networking Division supplies field-replaceable optical
transceivers in three versions as shown in the following figure. The optical
transceivers are designated OM1_4, OMS1_4, OM4_1, OMS4_1, OM16_1,
and OM16_1SFP.
Hot swapping is allowed, provided you observe all the safety precautions (see
"Installing XDM-500: Before You Start Safety Guidelines" page 1-1) during
the replacement procedure.
Before replacing any transceiver, prepare a sketch identifying each fiber
connected to the transceiver and use it as a guide when reconnecting the fibers.
NOTE: If the interfaces to be replaced are protected, it is
recommended to switch to protection before starting the
upgrade procedure.

Refer to the following figure when performing the procedure.

Figure 9-11: Replacing typical optical transceivers

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Maintenance

To replace a typical optical transceiver module:


1. Identify the position on the base card of the transceiver to be replaced.
2. Disconnect the fibers connected to the transceiver.
3. If necessary, remove the SFP(s) installed on the optical module in
accordance with the instructions in Installing and removing optical
transceivers (page 6-11).
4. Release the captive screws fastening the transceiver to the base card guides.
5. Pull out the transceiver to be replaced and remove it.
6. Insert the rear end of the replacement transceiver into the card guides and
push slowly backward to mate the connectors. If you feel resistance before
the connectors are fully mated, retract the transceiver and repeat the
insertion.
7. Fasten the transceiver with its captive screws.
8. For modules with removable SFP(s), install the required SFP(s) in
accordance with the instructions in Installing and removing optical
transceivers (page 6-11).
9. Reconnect the fibers disconnected in Step 2 above.

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Replacing Modules in the Modules Cage


Before you start:
When replacing the electrical connection module of an I/O card, whenever
possible force a switch to the protection card (IOP) before replacing the
module.
To replace a module located in the modules cage of an XDM
platform:
1. Remove the replacement module from its antistatic protection packaging
and visually inspect the replacement module to detect damage during
shipment. Report any problems.
2. Inspect the module and record its hardware and software versions.
3. Disconnect any cables or fibers connected to the module to be replaced.
Make a sketch identifying each cable and fiber and where it is connected.
4. Release any screws fastening the module to be replaced to the platform, and
then remove the module to be replaced by bringing both its extractor
handles to the horizontal position.
5. Insert the rear end of the replacement module in the corresponding guides.
6. Push the module in until it mates the chassis connectors. Make sure the two
fastening screws are free to move backward as the module slides in. If you
feel resistance before the connectors are mated, pull the module out and
repeat the procedure.
7. Press the ends of the two card extractors to fully insert the module, and then
fasten the module to the platform by tightening the two fastening screws.

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A
XDM Accessories
In this appendix:
Typical Installation Setup ............................................................................... A-2
Rack Alarm Panel Power and Alarm Connection Options ............................. A-4
Rap Features ................................................................................................... A-5
xRAP-D .......................................................................................................... A-7
xRAP-B ........................................................................................................ A-13
xRAP-HP ...................................................................................................... A-16
xRAP-100 ..................................................................................................... A-19
miniRAP ....................................................................................................... A-22
FST ............................................................................................................... A-25
Heat Buffer ................................................................................................... A-26
Cable and Fiber Guiding Accessories .......................................................... A-26
Optical Distribution Frames (ODFs) ............................................................ A-29
Digital Distribution Frames (DDF) .............................................................. A-33

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Typical Installation Setup


The following figure shows a typical installation of a single XDM-500 shelf in
a rack, together with a minimal set of installation accessories. In addition to the
XDM shelf itself, the equipment installed in the rack includes:

One XDM rack alarm panel (xRAP-D, xRAP-B, xRAP-HP, or xRAP-100)


installed at the top of the rack. The xRAP module connects external power
and alarm monitoring lines to the XDM shelves installed in the rack.

xRAP-D, xRAP-B, and xRAP-HP are each able to fully support two
shelves. The xRAP-HP also has the capability to chain alarm
monitoring lines from a third shelf.
xRAP-100 supports up to four XDM shelves, one of them a fully
equipped XDM-1000.
miniRAP supports one XDM shelf (not high-power).
In addition to the space needed for installing the xRAP unit, leave at
least 50 mm (2 in.) free space under the xRAP unit for routing cables.

Fiber Storage Trays (FSTs) for storing optical fiber. The FSTs are 1 U (44
mm/1.75 in.) high units that can store up to 48 2-mm (.08-in.) optical
fibers, each up to 2.5 meters (2.75 yards) long.
In general, FSTs are installed under the RAP. However, when there is not
enough space in the rack, install them just above the rack. For this purpose
ECI offers extendable installation rails.

A-2

ODF units, as required.

Cable guide. The cable guide is used to help route the coaxial cables neatly,
and is used in addition to the standard rack cable guides attached to the
rack side rails.

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XDM Accessories

Figure A-1: Typical installation of a single XDM-500 shelf

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Rack Alarm Panel Power and


Alarm Connection Options
The xRAP product family supports power supply and alarms connection to the
various types of XDM platforms. A mixture of big and small XDM platforms is
possible in accordance with the platforms power consumption and the xRAP
total power. All xRAPs support redundancy through connections to two
separate power sources for each protected platform (i.e., two independent
circuit breakers are provided on the xRAP for each connected platform).
NOTE: The generic name xRAP is used when the text is

applicable for any one of the ECI xRAP units (PRAP,


xRAP-D, xRAP-B, xRAP-HP, xRAP-100, or miniRAP).

NOTE: Beginning with V7.2, platform power supply

limitations are enforced by the management software. Upper


bound limits for total platform power usage are defined
through the management configuration variables. The upper
bound limits are enforced through software protection. For
more information, see the EMS-XDM User Manual.

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Rap Features
The following table lists the characteristics of the available xRAPs:
Table A-1: RAP features
Features

miniRAP

xRAP-100

PRAP

xRAP-D

xRAP-B (EOL)

xRAP-HP (EOL)

Number of XDM platforms with


redundant power support 17
(2 circuit breakers per platform 18)

1 + 3 19

Total power consumption

1.2 KW

3.2 KW

4.8 KW

4.5 KW

4.5 KW

4 KW

Severity alarms 20

Four alarms for Integrated, four


one platform
alarms from four
platforms (OR
gate)

Two separated groups Two separated groups


of four alarms each
of four alarms each
from one XDM-3000 from two platforms

Two separated groups


of four alarms each
from two platforms

Integrated, four alarms


from two platforms (OR
gate)

Separate buzzer signals

---

---

One buzzer signal that


reports on "Critical"
alarms toward the
user central monitor
system

Two separate buzzer


signals that report on
"Critical" alarms toward
the user central monitor
system

--Two separate buzzer


signals that report on
"Critical" alarms toward
the user central monitor
system

Separate buzzer shut-off signals

---

---

One buzzer shut off


signal that mutes the
buzzer in the user
central monitor
system

Two separate buzzer


shut off signals that
mute the buzzer in the
user central monitor
system

Two separate buzzer


shut off signals that
mute the buzzer in the
user central monitor
system

---

17

The number of supported shelves depends on their total power consumption.


The same type of circuit breaker is used in all xRAP versions. The value of the circuit breaker is defined by the power consumption requirements of the shelf and not by the type of
xRAP.
19
The 3-pin connectors for three shelves (shelf#1, shelf#2, and shelf#3) can only be used for the lower power consumption shelves. The 5-pin connectors for shelf#4 can be used either
for the lower power consumption shelves or for the higher power consumption shelves.
20
Critical, Major, Warning, and Minor alarms toward the customer central monitoring system.
18

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Features

XDM Accessories

miniRAP

xRAP-100

---

Fixed, four inputs Total eight inputs to


the XDM-3000
per platform,
total 16 per
xRAP-100

Number of output External alarms 23

---

Fixed, two
outputs per
platform, total
eight per
xRAP-100

Connector type
for power cable between xINF and
xRAP (xRAP side)
Cable size between xRAP and batteries
(connects with terminal lugs)

Number of input External alarms

21

xRAP-D

xRAP-B (EOL)

xRAP-HP (EOL)

Fixed, four inputs per


platform, total eight
inputs per xRAP-D

Fixed, four inputs per


platform, total eight
inputs per xRAP-B

Flexible 22, total eight


inputs per xRAP-HP
(up to Rev.C01)
For Rev.C02, fixed,
four inputs per platform,
total eight inputs

Total eight outputs


from the XDM-3000

Fixed, four outputs per


platform, total eight
outputs per xRAP-D

Fixed, four outputs per


platform, total eight
outputs per xRAP-B

Flexible 24, total eight


outputs per xRAP-HP
(up to Rev.C01)
For Rev.C02, fixed,
four outputs per
platform, total eight
outputs

3 pin connector 3 pin and 5 pin


connector

5 pin connector

5 pin connector

5 pin connector

Terminal lug

35 mm2
(1+1)

25 mm2
(1+1), (1+1), & (1+1)
Three inputs for side
A and three inputs for
side B

25 mm2 25
(1+1) & (1+1)
Two inputs for side A
and two inputs for side
B

50 mm2
(1+1)

50 mm2
(1+1)

35 mm2
(1+1)

PRAP

21

External Alarms input via Opto coupler.


Using dip switches.
23
External Alarms output via dry contacts.
24
Using dip switches.
25
Bridge option to work with a single 50mm2 power cable available.
22

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XDM Accessories

xRAP-D
The xRAP-D is a power distribution and alarm panel for XDM platforms
installed in racks. The xRAP-D performs the following main functions:

Redundant power distribution for one or two XDM platforms. The


xRAP-D can support either one or two XDM platforms. Each platform can
work with either one or two power inputs, where one is the main power
input (A) and the second is an optional protective backup power input (B).
The xRAP-D can work with up to two redundant input power sources,
depending on the user's electric infrastructure.
In the default configuration, the xRAP-D supplies independent streams of
power to two separate XDM platforms. Input power for one XDM platform
is kept completely separate from the input power for the second XDM
platform. Separate input power cables from the power sources feed into
independent circuit breakers on the xRAP-D unit. (There are a total of four
circuit breakers on the xRAP-D, supporting redundant power supplies for
up to two XDM platforms.) The power supply flow for two platforms is
illustrated in the following figure.

Figure A-2: xRAP-D power supply flow

The xRAP-D has four 5-pin DC output connectors for supplying redundant
power to any platform in the XDM-1000 or XDM-100 family of products.
The maximum power supplied to each XDM platform is up to 2250 W, in
accordance with the platform type and version.

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Note that with the default configuration, the power cables from the user's
power supply sources to the xRAP-D do not have to be more than 25 mm2
thick, and the circuit breakers do not have to be more than 55A, because the
maximum power consumption per cable is never more than 2250 W.
Previous xRAP units used a single heavy duty power cable to supply power
for up to two XDM platforms. The xRAP-D enables independent power
delivery to two shelves through separate cables, enabling use of thinner
cables and smaller circuit breakers. The xRAP-D was developed in
response to the needs of customers who are not able to support large
aggregate power feeding requirements when supporting two XDM
platforms.
NOTE: Users who prefer to work with a single power cable

from their main power supply (and optionally, a single power


cable from the protective power supply) can still work with a
single cable if they either:

Work with a single 25 mm2 power cable to support a single


XDM platform only, with a maximum of 2250 W for that
platform.
Work with a single 25 mm2 power cable to support two
XDM platforms, where each platform is limited to a
maximum of 1100 W for per platform. This configuration
option requires the use of an optional metal bridge
component designed by ECI for this purpose. (Note that
this configuration option is only available from V7.2, when
the management software enforces limitations on
maximum power consumption.)
Work with a single 50 mm2 power cable to support two
XDM platforms, with a maximum of 2250 W for each
platform. This configuration option requires the use of an
optional metal bridge component designed by ECI for this
purpose.

For more information about the bridge-component


configuration options, see Connecting DC Input Power Cable
to the xRAP-D with a Bridge Component (page 4-53).

The nominal DC power voltage is -48 VDC, ranging to -72 VDC. The
internal circuits of the xRAP-D are powered whenever at least one power
source is connected. The presence of DC power within the xRAP-D is
indicated by a POWER ON indicator.
Each DC power circuit of each platform is protected by a circuit breaker
that also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM-500 shelves, and therefore their current rating is in
accordance with the order requirements.

A-8

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The circuit breakers are installed during the xRAP-D installation. To


prevent accidental changing of a circuit breakers state, the circuit breakers
can be reached easily after opening the front cover of the xRAP-D. The
circuit breaker state (ON or OFF) can be seen through translucent covers.

Bay alarm indications. The xRAP-D includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Critical alarm is present in XDM
platforms connected to the xRAP-D.

Connecting external alarms from two XDM platforms, each platform


supporting up to four alarm inputs and four alarm outputs (via dry contacts)
to the customer's central alarm monitoring system. Customers who wish to
define external alarms should refer to the explanation of electrical capacity
requirements for external alarms in the XDM System Specification.
Note that the xRAP-D supports up to eight external alarms. These alarms
are by default allocated four to each platform. ECI offers the option, when
working with a single XDM-1000 platform, to define up to eight external
alarms for that XDM-1000 platform. A second XDM platform cannot be
used with the xRAP-D when working with this configuration, and a special
alarm connection cable must be used. Contact ECI technical support for
more information.

Exporting severity alarms. Two separate groups of severity alarms (a


group of four for each XDM platform) are provided via dry contacts for the
customer's central alarm monitoring system.
Exporting Critical buzzer signals. The Critical alarm signal is provided
via dry contacts to the customer's central alarm monitoring system for
activation of a Critical buzzer. A separate line is provided as well for
muting this buzzer, by connecting the line to a ground with a momentary
switch.
NOTE: Note that the xRAP-D supports the same alarm and
power functions as the xRAP-B and xRAP-HP. When
replacing an existing xRAP-HP with an xRAP-D you must
also use the appropriate xRAP-D accessory kit, including
cables.

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The following figure shows the front panel of the xRAP-D, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.

Figure A-3: xRAP-D front panel


Table A-2: xRAP-D front panel component functions

A-10

No.

Designation

Function

SOURCE A

Translucent cover for the two circuit breakers (designated


Shelf 1 and Shelf 2 one per XDM platform installed in
the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC
power source A.

TEST

Pushbutton, pressing it activates the buzzer and turns the


indicators on for test purposes.

POWER ON

Green indicator, lights whenever at least one DC power


source is connected to the xRAP-D.

CRITICAL

Red indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-D is Critical.

MAJOR

Orange indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-D is Major.

MINOR

Yellow indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-D is Minor.

WARNING

White indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-D is Warning.

Buzzer
(concealed under
cover)

Operates when at least one unacknowledged Major or


Critical alarm is present in the platforms connected to the
xRAP-D.

SOURCE B

Same as Item 1 for DC source B.

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The xRAP-D connectors are located on the circuit board, as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figures.

Figure A-4: xRAP-D connectors


Table A-3: xRAP-D connector functions
No.

Designation

Function

1, 2

Shelf 1 and Shelf 2 Two 5-pin D-type connectors, designated Shelf 1


DC input power
and Shelf 2, used to connect DC power to the
XDM platforms.

ALARMS

68-pin SCSI connector, used to connect an alarm


cable to the customer alarm monitoring system.
This alarm cable transmits the received from the
XDM platforms by the SHELF 1 and SHELF 2
connectors, including external alarm inputs,
external alarm outputs, and XDM severity alarms.

4, 5

SHELF 1 and
SHELF 2

Two 36-pin SCSI connectors, designated SHELF 1


and SHELF 2, used to connect alarm cables to the
XDM platforms installed in the rack. These cables
transmit alarms from the XDM platform to the
xRAP unit.

Alarm signals arrive at a SHELF connector on the xRAP unit from two
different connector sources on the XDM platform using a Y-Cable.

A 9-pin connector on the XDM platform labeled xRAP is used for the four
XDM severity alarms. (CRITICAL, MAJOR, MINOR, and WARNING)

A 50-pin connector on the XDM platform labeled ALARMS is used for


any external alarms defined by client request.

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A Y-Cable is used to link these two connector sources to the single SHELF
connection point on the xRAP, as illustrated in the following figure.

Figure A-5: Y-cable connection

The xRAP-D supports up to eight input plus eight output external alarms.
These alarms are by default allocated four to each platform. ECI offers the
option, when working with a single XDM-1000 platform, to define up to eight
external input plus eight external output alarms for that XDM-1000 platform.
When working with this configuration, a second XDM platform cannot be
connected to the xRAP-D and a special double-Y alarm connection cable
must be used, as illustrated in the following figure. Contact ECI technical
support for more information.

Figure A-6: Double-Y cable connection

A-12

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xRAP-B
NOTE: The xRAP-B is no longer included in new XDM
deliveries (EOL). This information is included here if needed
for a current installation.
The xRAP-B is a power distribution and alarm panel for XDM platforms
installed in racks. The xRAP-B performs the following main functions:

Power distribution for one or two XDM-500 platforms. The nominal


DC power voltage is -48 VDC, ranging to -72 VDC. Since XDM-500
platforms can use redundant power sources, the xRAP-B supports
connection to two separate DC power circuits. The internal circuits of the
xRAP-B are powered whenever at least one power source is connected.
The presence of DC power within the xRAP-B is indicated by a POWER
ON indicator.
The xRAP-B has two 5-pin DC output connectors for supplying power to
any platform in the XDM-1000 or XDM-100 family of products. The
maximum power that can be supplied to each XDM platform is up to 2250
W, in accordance with the platform type and version. The xRAP-B uses a
single 50 mm2 power cable to supply up to 4500 W in total to two XDM
platforms.
Each DC power circuit of each platform is protected by a circuit breaker
that also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM-500 platform, and therefore their current rating is in
accordance with the order requirements.
The circuit breakers are installed during the xRAP-B installation. To
prevent accidental changing of a circuit breakers state, the circuit breakers
can be reached only after opening the front cover of the xRAP-B. The
circuit breaker state (ON or OFF) can be seen through translucent covers.

Bay alarm indications. The xRAP-B includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the corresponding alarm indications light simultaneously.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM platforms installed in the rack.

Connecting alarms from two XDM platforms, each platform with


maximum four alarm inputs and four alarm outputs (via dry contacts) to the
customer's central alarm monitoring system.

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Exporting severity alarms. Two separate groups of severity alarms (a


group for each XDM platform) are provided via dry contacts for the
customer's central alarm monitoring system.
Exporting Critical buzzer signals. The Critical alarm signal is provided
via dry contacts to the customer's central alarm monitoring system for
activation of a Critical buzzer. A separate line is provided as well for
muting this buzzer, by connecting the line to a momentary switch.
NOTE: The xRAP-B is backwards compatible with the
xRAP-HP.

The following figure shows the front panel of the xRAP-B, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.

Figure A-7: xRAP-B front panel


Table A-4: xRAP-B front panel component functions

A-14

No.

Designation

Function

SOURCE A

Translucent cover for the two circuit breakers (designated


SHELF 1 and SHELF 2 one per XDM platform installed
in the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC power
source A.

TEST

Pushbutton, pressing it activates the buzzer and turns the


indicators on for test purposes.

POWER ON

Green indicator, lights whenever at least one DC power


source is connected to the xRAP-B.

CRITICAL

Red indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-B is Critical.

MAJOR

Orange indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-B is Major.

MINOR

Yellow indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-B is Minor.
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No.

Designation

Function

WARNING

White indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-B is Warning.

Buzzer
(concealed under
cover)

Operates when at least one unacknowledged Major or


Critical alarm is present in the platforms connected to the
xRAP-B.

SOURCE B

Same as Item 1 for DC source B.

The xRAP-B connectors are located on the circuit board, as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figures.

Figure A-8: xRAP-B connectors


Table A-5: xRAP-B connector functions
No.

Designation

Function

1, 2

Shelves DC input
power

Two 5-pin D-type connectors designated SHELF 1


and SHELF 2 for connecting DC power to XDM
platforms.

ALARMS

68-pin SCSI connector for connecting external


alarm inputs, external alarm outputs, and severity
alarms to the customer alarm monitoring system.

4, 5

SHELF alarms

Two 36-pin SCSI connectors designated SHELF 1


and SHELF 2 for connecting alarm input 26 and
output lines to XDM-500 platforms installed in the
rack.

26

Alarm input lines arrive through the ALARM connector and are connected to the corresponding SHELF
connector.
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xRAP-HP
NOTE: The xRAP-HP is no longer included in new XDM
deliveries (EOL). This information is included here if needed
for a current installation.
The xRAP-HP is a power distribution and alarm panel for any two XDM-500
platforms installed in racks. The xRAP-HP performs the following main
functions:

Power distribution to one or two XDM-500 platforms: The nominal DC


power voltage is -48 VDC, ranging to -72 VDC. Since XDM-500 platforms
can use redundant power sources, the xRAP-HP supports connection to two
separate DC power circuits. The internal circuits of the xRAP-HP are
powered whenever at least one power source is connected. The presence of
DC power within the xRAP-HP is indicated by a POWER ON indicator.
Each DC power circuit of each platform is protected by a circuit breaker,
which also serves as a power on/off switch for the corresponding circuit.
The required circuit breakers are included in the installation parts kit
supplied with the XDM-500 platforms, and therefore their current rating is
in accordance with the order requirements. The maximum current that can
be supplied to each XDM-500 platform is 60A.
The circuit breakers are installed during xRAP-HP installation. To prevent
the accidental changing of the circuit breaker state, the circuit breakers can
be reached only after opening the front cover of the xRAP-HP. The circuit
breaker state (ON or OFF) can be seen through translucent covers.

Bay alarm indications: The xRAP-HP includes four alarm indicators, one
for each alarm severity. At any time, only the indicator corresponding to
the highest unacknowledged alarm severity present in the XDM-500
platforms installed in the rack lights.
A buzzer is activated whenever an unacknowledged alarm is present in
XDM-500 platforms installed in the rack.

Connection of maximum eight external alarm sources to XDM-500


platforms installed in the rack, and maximum eight alarm outputs of XDM500 platforms to external alarm monitors, for example, an operator console.
In xRAP-HP units up to Rev.C01, alarm lines are allocated through internal
switches that are set during xRAP-HP installation.
The ground references of the input and output alarm lines on the two sides
of the xRAP-HP are isolated by active circuits located within the
xRAP-HP.

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The following figure shows the front panel of the xRAP-HP, and the table lists
the functions of the front panel components corresponding to the figure
callouts.

Figure A-9: xRAP-HP front panel


Table A-6: xRAP-HP front panel component functions
No.

Designation

Function

SOURCE A

Translucent cover for the two circuit breakers (designated


SHELF 1 and SHELF 2 one per XDM-500 platform installed
in the rack). These circuit breakers are used as ON/OFF power
switches and overcurrent protection for the DC power source A.

Buzzer

Operates when at least one unacknowledged alarm is present in


the platforms connected to the xRAP-HP.

POWER ON
(TEST)

Pushbutton with green indicator, which lights whenever at least


one DC power source is connected to the xRAP-HP.
Pressing the pushbutton activates the buzzer and turns the
indicators on for test purposes.

CRITICAL

Red indicator, lights when the severity of an unacknowledged


alarm in the platforms connected to the xRAP-HP is Critical.

MAJOR

Orange indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-HP is Major.

MINOR

Yellow indicator, lights when the severity of an


unacknowledged alarm in the platforms connected to the
xRAP-HP is Minor.

WARNING

White indicator, lights when the severity of an unacknowledged


alarm in the platforms connected to the xRAP-HP is Warning.

SOURCE B

Same as Item 1 for DC source B.

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The following figure shows the xRAP-HP connectors located on the rear side.

Figure A-10: xRAP-HP connector panel

Note that if you are using an xRAP-HP unit up to Rev.C01, the unit includes
slide switches used to allocate alarm lines. The following figure shows the
xRAP-HP connectors and slide switches located on the rear side.

Figure A-11: xRAP-HP connector and slide switch panel

The following table lists the xRAP-HP connector functions. The index numbers
in the table correspond to those in the preceding figures.
Table A-7: xRAP-HP connectors
No.

Designation

Function

1, 2, 3

EXTERNAL
Three 25-pin D-type connectors, designated SHELF 1,
ALARM/CONTROL SHELF 2, and SHELF 3, for connecting alarm input and output
lines to XDM-500 platforms and other equipment installed in
the rack.

4, 5, 6

RAP

Three 9-pin D-type connectors, designated SHELF 1, SHELF 2,


and SHELF 3, for connecting alarm relays and buzzer activation
lines to XDM-500 platforms and other equipment installed in
the rack.

CONTROL
CONNECTION

50-pin D-type connector for connecting alarm indications and


input and output alarm lines to the customer alarm monitoring
facility.

8, 9, 10, 11
(up to Rev.C01)

1 & 2, 3 & 4, 5 & 6,


7&8

Four slide switches used to route the facility alarm lines to the
input and output lines of the XDM platforms connected to the
xRAP-HP.

Connector pin assignments are defined in detail in Connector Pin Assignments


(page B-1).
A-18

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xRAP-100
The xRAP-100 is a power distribution and alarm panel for XDM and BG
shelves installed in racks. The xRAP-100 performs the following main
functions:

Power distribution for up to four XDM or BG shelves: The nominal DC


power voltage is -48 VDC or -60 VDC. Since XDM and BG shelves can
use redundant power sources, the xRAP-100 supports connection to two
separate DC power circuits. The internal circuits of the xRAP-100 are
powered whenever at least one power source is connected. The presence of
DC power within the xRAP-100 is indicated by a POWER ON indicator.
Each DC power circuit of each shelf is protected by a circuit breaker, which
also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the XDM or BG shelves, and therefore their current rating is in
accordance with the order requirements.
The xRAP-100 is designed to support three XDM or BG regular shelves
and one high-power XDM shelf, or four regular XDM or BG shelves. It has
three 3-pin D-type connectors and one 5-pin D-type high-power connector
for feeding the shelves. Each 3-pin connector can supply power to one of
the following regular shelves:

XDM-50

XDM-100

XDM-500

XDM-40

Any BG shelf

The 5-pin high-power connector can supply power to one of the above
regular shelves, or to one of the following high-power shelves:

XDM-300

XDM-900

XDM-1000

XDM-2000
NOTE: When a regular XDM or BG shelf has to be
connected to the 5-pin connector, use a 5-pin D-type male to
3-pin D-type female adapter cable.

The circuit breakers are installed during the xRAP-100 installation. To


prevent accidental changing of a circuit breakers state, the circuit breakers
can be reached only after opening the front cover of the xRAP-100. The
circuit breaker state (ON or OFF) can be seen through the cover.
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Bay alarm indications: The xRAP-100 includes four alarm indicators, one
for each alarm severity. When alarms of different severities are received
simultaneously, the different alarm indications light simultaneously.
NOTE: BG shelves support only two alarm indications:
Major and Minor.
A buzzer is activated whenever a Major or Critical alarm is present in
XDM shelves connected to the xRAP-100. In case of BG shelves connected
to the xRAP-100, the buzzer is activated whenever a Major alarm is present
in the BG shelves.

Connection of alarms from up to four XDM or BG shelves, each shelf


with maximum four alarm inputs and two alarm outputs.

The following figure shows the front panel of the xRAP-100, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.

Figure A-12: xRAP-100 front panel


Table A-8: xRAP-100 front panel component functions

A-20

No.

Designation

Function

SOURCE A

Four circuit breakers (designated SHELF 1, SHELF 2,


SHELF 3, and SHELF 4 one per XDM-500 shelf installed
in the rack). These circuit breakers are used as ON/OFF
power switches and overcurrent protection for the DC power
source A.

--

Buzzer
Operates when at least one unacknowledged Major or
(Concealed under Critical alarm is present in the shelves connected to the
cover)
xRAP-100.

TEST

Pushbutton, pressing it activates the buzzer and turns the


indicators on for test purposes.

POWER ON

Green indicator, lights whenever at least one DC power


source is connected to the xRAP-100.

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No.

Designation

Function

CRITICAL

Red indicator, lights when the severity of an alarm in the


shelves connected to the xRAP-100 is Critical.

MAJOR

Orange indicator, lights when the severity of an alarm in the


shelves connected to the xRAP-100 is Major.

MINOR

Yellow indicator, lights when the severity of an alarm in the


shelves connected to the xRAP-100 is Minor.

WARNING

White indicator, lights when the severity of an alarm in the


shelves connected to the xRAP-100 is Warning.

SOURCE B

Same as Item 1 for DC source B.

The xRAP-100 connectors are located on its circuit board, as shown in the
following figure. The table lists the connector functions. The index numbers in
the table correspond to those in the figure.

Figure A-13: xRAP-100 connectors


Table A-9: xRAP-100 connectors
No.

Designation

Function

1, 2, 3, 4

Shelf alarms

Four 36-pin SCSI connectors designated SHELF 1,


SHELF 2, SHELF 3, and SHELF 4, for connecting
alarm input and output lines to XDM or BG shelves
and other equipment installed in the rack

ALARM IN/OUT

68-pin SCSI connector, for connecting alarm input


and output lines to the customer alarm monitoring
facility

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No.

Designation

Function

6, 7, 8

Shelves DC input
power

Three 3-pin D-type connectors designated Shelf 1,


Shelf 2, and Shelf 3 for connecting DC power to
XDM or BG shelves

Shelf DC input,
high power

5-pin D-type connector designated Shelf 4 for


connecting a high-power XDM, or a regular XDM
or BG shelf

miniRAP
The miniRAP is a power distribution and alarm panel for low-power XDM
shelves and other low-power communication shelves installed in racks. The
miniRAP supports the following main functions:

Power distribution for a single shelf. The nominal DC power voltage is


-48 VDC, ranging to -72 VDC. To provide power input redundancy, the
miniRAP supports connection to two separate DC power circuits. The
internal circuits are powered whenever at least one power source is
connected. The presence of DC power within the miniRAP is indicated by
a POWER ON indicator.
Each DC power circuit of the shelf is protected by a circuit breaker, which
also serves as a power on/off switch for the corresponding circuit. The
required circuit breakers are included in the installation parts kit supplied
with the shelf, and therefore their current rating is in accordance with the
order requirements. The maximum current that can be supplied to the shelf
fed from the miniRAP is 30A.
The circuit breakers are installed with the miniRAP. To prevent an
accidental change to their state, they can be reached only after opening the
front cover of the miniRAP. The state (ON or OFF) can be seen through
translucent covers.

Bay alarm indications. The miniRAP has four alarm indicators, one for
each alarm severity. When alarms of different severities are received
simultaneously, the different indicators light simultaneously.
A buzzer is activated when a Major or Critical alarm is present in the shelf
installed in the rack.

A-22

Connection of the shelf's severity alarms. These alarms can also be


connected to a customer's alarm collection facility.

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The following figure shows the front panel of the miniRAP, and the table lists
the functions of the front panel components corresponding to the figure callout
numbers.

Figure A-14: miniRAP front panel


Table A-10: miniRAP component functions
No.

Designation

Function

SOURCE A

Translucent cover for the circuit breaker. The circuit breaker


is used as an ON/OFF power switch and overcurrent
protection for DC power source A.

TEST

Pushbutton, pressing it activates the buzzer and turns the


indicators on for test purposes.

POWER ON

Green indicator, lights when at least one DC power source is


connected to the miniRAP.

CRITICAL

Red indicator, lights when the severity of an


unacknowledged alarm in the shelf connected to the
miniRAP is Critical.

MAJOR

Orange indicator, lights when an unacknowledged alarm


severity present in the shelf connected to the miniRAP is
Major.

MINOR

Yellow indicator, lights when the severity of an


unacknowledged alarm in the shelf connected to the
miniRAP is Minor.

WARNING

White indicator, lights when the severity of an


unacknowledged alarm in the shelf connected to the
miniRAP is Warning.

SOURCE B

Same as Item 1 for DC power source B.

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The miniRAP connectors are located on its circuit board. The table lists the
connector functions. The index numbers in the table correspond to those in the
figure.

Figure A-15: miniRAP connectors


Table A-11: miniRAP connector functions

A-24

No.

Designation

Function

1, 4

Shelf DC input power

3-pin D-type connectors, for connecting DC


power to the communication shelf.

SEVERITY IN

9-pin D-type connector, for connecting the


shelf severity alarms output.

SEVERITY OUT

9-pin D-type connector, for connecting the


severity alarms to the customer's alarm
collecting facility.

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FST
The Fiber Storage Tray (FST) is used to store surplus optical fiber. The FST
can hold up to 48 2-mm (.08 in.) fibers, where each stored fiber can be up to
2.5 meters (8.1 feet) long.
The following figure shows a front view of the FST. The Fiber Storage Tray
top view (page A-25) shows a top view of the FST, together with typical paths
to be followed when fibers are inserted for storage in the tray.

Figure A-16: Fiber Storage Tray front view

The FST is opened simply by momentarily pressing on its panel. For


convenience, it can be opened in two positions:

Halfway, the first click when pulling the tray out

Completely, by pressing the release handles at the two sides (to enable
threading the fibers in the tray)

Figure A-17: Fiber Storage Tray top view

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Heat Buffer
Heat buffers must always be used in the following circumstances:

With the XDM-450 shelf

When using more than one shelf in a single rack

The heat buffer used for XDM-500 shelves is a 1U high unit installed below
the XDM-500 equipment shelf to provide thermal isolation. The heat buffer is
fastened to the rack rails under the shelf.
The following figure shows a typical XDM-500 heat buffer.

Figure A-18: Heat buffer

Cable and Fiber Guiding


Accessories
Different guides are available for the various XDM platforms.

Cable Guide
The cable guides for XDM-500 platforms are used to help neatly route E1
tributary cables connecting to the panels of M2_21 and M2_84 electrical
interface modules.
The cable guide is fastened to the rack side rails just over the top of the lower
card cage. To ease cable insertion, the top bar can be removed by pulling out
two spring-loaded knobs at the two sides.

Figure A-19: Typical cable guide

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Optical Fiber Guides


The optical fiber guides for XDM-500 platforms are used to help neatly route
the fibers that connect to the panels of the optical cards and modules installed
in the platforms and prevent sharp bends.
Two types of optical fiber guides are available: one for 19 in. racks, and
another for ETSI racks. Each of these guides is illustrated here.
The fiber guides are fastened to the rack side rails over the top of the lower
card cage.

Figure A-20: Fiber guide for 19-inch rack

Figure A-21: Fiber guide for ETSI rack

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Cable Guiding Rods


To keep the cables neatly arranged between the rack rails and prevent sharp
bends, ECI offers cable guiding rods. The following figure shows a typical
cable guiding rod, as supplied by ECI.
The supplied items include:

Clamp, attached with two screws to the rear rack rail.

The rod itself, which is inserted through the front rack rail into the clamp.

Plastic drum, needed only when the rod is used to route fibers. The drum,
which fits snugly over the rod, must be inserted over the rod before its rear
end is inserted into the clamp.

Figure A-22: Typical cable guiding rod

The following figure shows how to use the rod with fibers.

Figure A-23: Using the rod for guiding fibers

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The following figure shows how to use the rod with cables (in this case, the
plastic drum is not used and may be discarded).

Figure A-24: Using the rod for guiding cables

Optical Distribution Frames


(ODFs)
The large number of optical fibers that are typically connected to an XDM
platform requires reliable connection arrangements. ECI recommends using
ODFs installed in the XDM racks to terminate the external fibers with the
desired type of optical connectors. Two units are offered: a standard unit and a
high power unit.

Standard ODF
When there are a large number of optical fibers connected to an XDM,
additional connection arrangements may be required.
ECI recommends using an ODF installed in the XDM racks to terminate the
external fibers with the proper optical connectors.
The ODF provides a flexible and reliable solution for interfacing between
outside plant optical fiber cables and fiber optical terminal equipment. It is
designed to handle termination, splicing, and storage for excess length of
pigtails and patch cords.
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The unit is 1U high, and can be installed in ETSI A racks, as well as in 19"
racks using its configurable rack mounting brackets. An additional set of
brackets supplied with the installation kit enables installation in 23 in. 7 ft. bay
racks. The ODF is available with 12 or 24 ports, and SC, FC, or LC connectors.

Figure A-25: ODF internal view

All fiber connections are made on a swing-out tray that opens to the right at 90
and houses the splicing trays, optical adapter panels, and the fiber support. Left
side tray opening is available per order. The swing-out tray enables quick and
easy access to all internal parts for connection or maintenance activities. The
fiber connections are protected by a front cover, which latches to the assembly
and prevents unintended disconnection of fibers.

Figure A-26: ODF front panel

Optical terminal fibers can enter the ODF from the right or left side and be
connected to the optical adapters from one side. Pigtails connect to the adapters
from the other side. Excess length of pigtails and patch cords are threaded on a
fiber support that maintains the minimum bend radius to prevent fiber breaks.
A durable and robust tube leads the external fibers cable to the swing-out tray
and protects them from breaks. The adapters are arranged on panels in groups
of four or two (depending on the total number of ports). A large space between
the adapters enables easy access to each individual fiber and quick
reconfiguration.

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ODF_HP
Overview
ODF_HP is an optical distribution frame for fibers carrying high-power optical
signals (Hazard Level 3B). A typical application for the ODF_HP is to handle
the connections to the line side of the OFA_R Raman amplifiers.
The ODF_HP is a 1U high unit, ready for installation in 19 in. racks. ECI also
offers adapter brackets for installation in ETSI racks.
The following figure shows a general view of an ODF_HP ready for
installation in rack.

Figure A-27: ODF_HP general view

For safety, all fiber connections are made within the ODF_HP on special fiber
trays behind a lockable front panel.
The ODF_HP can be ordered with 1 or 2 fiber trays.
A fiber tray has twelve 250 mm (10 in.) fiber pigtails, each one terminating in
an E2000HP connector. The free ends of the pigtails are ready for splicing.
Therefore, ODF_HP has a capacity of up to 24 fibers in the 1U rack space.

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Physical description
The following figure shows a general view of a typical ODF_HP with its front
panel open, and identifies the various components.

Figure A-28: ODF_HP view with open panel

After the panel is opened, it is possible to slide out the internal fiber trays (the
previous figure shows the top tray in the fully retracted position). Fibers enter
the ODF_HP through a wide opening located on the right-hand side, and
connect to the connectors located on the fiber tray. Make sure the protective
caps are installed on the connectors at all times until fibers are connected to
them.
The connectors are terminated in pigtails stored within the tray (see detail in
the following figure). The other set of fibers, usually formed in a harness, enter
the ODF_HP through an opening on the left-hand side, and are spliced to the
pigtails. The tray has a support comb for splices.
For convenience, the fibers can be identified on the labels located on the lid of
the fiber tray.

Figure A-29: Detailed view of fiber tray with lid removed

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Digital Distribution Frames


(DDF)
fSThe DDF units offered by ECI are a convenient and reliable method for
connecting the large number of tributary cables that are typically connected to
an XDM platform, especially when handling E1 tributaries. All DDF versions
can be installed in both ETSI and 19 in. racks, and feature cable identification
arrangements.

DDF for Balanced Interfaces


ECI offers a 3U high DDF unit for connection to balanced E1 interfaces. The
following figure shows a general view of this unit.

Figure A-30: Typical 84-channel DDF unit for balanced E1 interfaces general view

This DDF has a capacity of 84 E1 lines. The E1 cables are terminated in


standard blocks; the blocks can also be ordered with terminations for the cable
shields.

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DDF for Unbalanced Interfaces


ECI offers 2U and 4U high DDF units for connection to unbalanced E1
interfaces. The following figure shows general views of a typical 2U high unit.
As seen in part B of the figure, the functions of the various connectors are
clearly marked.

Figure A-31: DDF general view with cover closed

Figure A-32: DDF general view with cover open

The 2U high DDF has a capacity of 14 E1 lines; the 4U high unit has a capacity
of 28 E1 lines. Each DDF can be ordered with BNC, BT43, or DIN 1.6/5.6 mm
connectors. The DDF has internal balanced/unbalanced (120 /75 )
impedance converters, and therefore allows connecting user's equipment with
unbalanced interfaces to the balanced interfaces of M2_84 electrical interface
modules. U links terminated in the appropriate connectors (BNC, BT43, or
DIN 1.6/5.6 mm) can be used to connect directly between the corresponding
sets of connectors. U links with monitoring connectors can also be ordered.

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DDF Units with Built-in Patch Panel


The DDF with built-in patch panel is available as 2U high units with a capacity
of 28 E1 lines. This DDF is similar to the regular DDF described previously,
except that it includes two sets of connectors for each E1 line: one set for the
user's equipment side and the other set for the XDM side. Customers can then
use short coaxial patch panels to route any incoming E1 line to any XDM E1
interface.

Patch Panel for Balanced Interfaces


ECI offers a 3U high patch panel unit for connection to balanced E1 interfaces.
The following figure shows general front and rear views of this unit.

Figure A-33: Typical 84-channel patch panel for balanced E1 interfaces general
views

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This patch panel has a capacity of 84 E1 lines:

The user's E1 cables are connected to standard 25-pin D-type male


connectors located on the front panel. Twelve pairs of connectors are used,
where each pair carries seven channels. For each group of channels, the
OUT/ab connector carries the transmit pairs and the IN/an connector
carries the receive pairs.

The E1 cables routed within the rack to E1 tributary modules, for example,
to the connectors located on the M2_84 panels, are connected to six 68-pin
SCSI female connectors. Each connector supports 14 E1 interfaces. The
tributaries supported by each connector are marked near each connector:
1-14, 15-28, 29-42, 43-56, 57-70, and 71-84.

For information on connector pin allocation, refer to Connector Pin


Assignments (page B-1).

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B
Connector Pin Assignments
In this appendix:
Overview ........................................................................................................ B-1
Platform Connectors ....................................................................................... B-2
xECB Connectors ........................................................................................... B-5
MECP Connectors ........................................................................................ B-10
ACP Connectors ........................................................................................... B-11
M2_84 Interface Module Connection Data .................................................. B-12
Alarms Handling Principles.......................................................................... B-19
xRAP-D Connectors ..................................................................................... B-21
xRAP-HP Connectors ................................................................................... B-28
xRAP-100 Connectors .................................................................................. B-34
miniRAP Connectors .................................................................................... B-40

Overview
This appendix provides connection data for user connectors located in XDM
platforms and associated ancillary equipment supplied by ECI. Optical and
coaxial connectors are described in the XDM-1000 Product Line Reference
Manual.
Any connectors not described in this appendix are reserved for use by ECI's
technical support personnel and/or for future expansion, and therefore no user
equipment may be connected to them.

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Connector Pin Assignments

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Platform Connectors
This section presents information on the platform connectors. See other
sections for information on connectors of the various cards and modules.

DC Input Power Connectors


The DC input power connectors, designated POWER IN, are 3-pin or 5-pin
D-type male connectors located on the xINF panel. The following figures
identify the functions of the POWER IN connector pins as seen when looking
into the connector.

Figure B-1: 3-pin power connector

Figure B-2: 5-pin power connector

B-2

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ALARMS Connector
This connector is a 50-pin D-type male connector that carries two groups of
lines:

Eight platform alarm output lines referenced to the platform ground. Each
output is provided by the open collector of an optocoupler, and its active
state is the low logic level.

Eight platform alarm input lines referenced to the platform ground


monitored by the XDM management subsystem. Each input is connected to
the input diode of an optocoupler.

The ALARMS connector connects to one of the SHELF EXTERNAL


ALARM/CONTROL connectors (page B-28).
The following figure identifies the connector pins as seen when looking into
the connector. The following table lists the pin assignment for the ALARMS
connector.

Figure B-3: ALARMS connector pin identification


Table B-1: ALARMS connector pin assignment
Pin

Designation

Function

Pin

Designation

Function

Direction

ALM_OP1

Alarm output 1 Output

Direction

34

ALM_IP1

Alarm input 1

Input

GND

Ground

35

GND

Ground

ALM_OP2

Alarm output 2 Output

36

ALM_IP2

Alarm input 2

Input

GND

Ground

37

GND

Ground

ALM_OP3

Alarm output 3 Output

38

ALM_IP3

Alarm input 3

Input

GND

Ground

39

GND

Ground

ALM_OP4

Alarm output 4 Output

40

ALM_IP4

Alarm input 4

Input

GND

Ground

41

GND

Ground

ALM_OP5

Alarm output 5 Output

42

ALM_IP5

Alarm input 5

Input

10

GND

Ground

43

GND

Ground

11

ALM_OP6

Alarm output 6 Output

44

ALM_IP6

Alarm input 6

Input

12

GND

Ground

45

GND

Ground

13

ALM_OP7

Alarm output 7 Output

46

ALM_IP7

Alarm input 7

Input

14

GND

Ground

47

GND

Ground

15

ALM_OP8

Alarm output 8 Output

48

ALM_IP8

Alarm input 8

Input

16

GND

Ground

49

GND

Ground

17-33

Not connected

50

Not connected

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xRAP Connector
The xRAP connector is a 9-pin D-type female connector that carries the
platform alarm outputs and a buzzer control line. All the outputs are referenced
to a common line, which is floating relative to the chassis ground.
This connector is intended for connection to one of the xRAP connectors.
The following figure identifies the connector pins as seen when looking into
the connector. The following table lists the pin assignment for the xRAP
connector.

Figure B-4: RAP connector pin identification


Table B-2: RAP connector pin assignment

B-4

Pin

Designation

Function

Direction

Critical

Critical alarm

Output

Not connected

Major

Major alarm

Output

Not connected

Minor

Minor alarm

Output

Common

Common reference for all the outputs

Warning

Warning

Output

Not connected

Buzzer

Audio alarm activation line

Output

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xECB Connectors
This section provides information on the connectors located on the xECB
panels.

F-CHANNEL Connector
The F-CHANNEL connector is a 9-pin D-type male connector that provides a
serial RS-232 communication channel supporting the SLIP protocol. This
connector is intended for connection to an LCT-XDM service terminal. The
connection is made using a crossed cable to one of the serial RS-232 ports of
the PC serving as an LCT-XDM terminal.
The following figure identifies the connector pins as seen when looking into
the connector. The following table lists the connector pin assignment, together
with the corresponding pin in the LCT-XDM serial RS-232 port (assuming that
this port uses a 9-pin connector).

Figure B-5: F-CHANNEL connector pin identification


Table B-3: F-CHANNEL connector pin assignment
Pin

Name

Function

Direction

LCT-XDM serial port pin

Not connected

Not connected

COM-F-RX

F-channel receive

Input

Pin 3 (transmit output)

COM-F-TX

F-channel transmit

Output

Pin 2 (receive input)

Not connected

Not connected

GND

Ground

Pin 5 (ground)

6, 7,
8, 9

Not connected

Not connected

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T3_1/T4_1 and T3_2/T4_2 Connectors


The T3_1/T4_1 and T3_2/T4_2 connectors are 9-pin D-type male connectors,
each with two groups of lines:

Clock input (T3 2.048 MHz/2.048 Mbps signal)

Clock output (T4 2.048 MHz/2.048 Mbps signal)

The MAIN connector serves the main TMU, and the PROTECT connector
serves the standby (protection) TMU. These connectors are intended for
connection to the site timing reference distribution subsystem.
The following figure identifies the connector pins as seen when looking into
the connector. The following table lists their pin assignment.

Figure B-6: T3_1/T4_1 and T3_2/T4_2 connector pin identification


Table B-4: T3_1/T4_1 and T3_2/T4_2 connector pin assignment

B-6

Pin

Name

Function

Direction

SHIELD

Shield

CK_2M_MIL

Clock input, low

Input

SHIELD

Shield

CK_2M_MOL

Clock output, low

Output

Not connected

CK_2M_MIH

Clock input, high

Input

SHIELD

Shield

CK_2M_MOH

Clock output, high

Output

Not connected

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OW Connector
The OW connector is an RJ-11 connector that provides access to the 4W
analog interface to the platform's engineering orderwire facility. The analog
signals are digitized using standard 64 kbps PCM for transmission in the SDH
overhead (bytes E1 and E2, as configured by the management station).
This connector enables the connection of a standard handset or other voice
frequency equipment serving the OW.
The following figure identifies the connector pins. The following table lists the
pin assignment for the OW connector.

Figure B-7: OW connector pin identification


Table B-5: OW connector pin assignment
Pin

Name

Function

Direction

OW_TX1

Orderwire transmit pair, wire +

Output

OW_TX2

Orderwire transmit pair, wire -

Output

OW_RX1

Orderwire receive pair, wire +

Input

Not connected

OW_RX2

Orderwire receive pair, wire -

Input

Not connected

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OHA Connector
The OHA connector is a 50-pin D-type male connector with the following
hardware interfaces:

Two data channels with V.11 interface operating at rates up to 768 kbps
(software configurable). These channels are intended to provide access to
the auxiliary DCC bytes in the SDH overhead, and therefore provide a clear
transmission path for user payload, for example, for carrying traffic of
management stations using proprietary protocols.

Two 64 kbps G.703 codirectional channels. These channels are intended to


provide digital access to the OW, subject to the corresponding management
station configuration.

The following figure identifies the connector pins as seen when looking into
the connector. The following table lists the pin assignment for the OHA
connector.
NOTE: Current XDM software versions do not support any
of the protocols of the OHA connector. This section is for
informative purposes only.

Figure B-8: OHA connector pin identification


Table B-6: OHA connector pin assignment

B-8

Pin

Name

Function

Direction

OHA-GRP1

OHA G.703 channel 1, receive pair, wire +

Input

OHA-GTN1

OHA G.703 channel 1, transmit pair, wire -

Output

GND

Ground

OHA-VTA1

OHA V.11 channel 1, transmit pair, wire A

Output

OHA-VTB1

OHA V.11 channel 1, transmit pair, wire B

Output

OHA-VIA1

OHA V.11 channel 1, indicator pair, wire A

Output

OHA-VTA2

OHA V.11 channel 2, transmit pair, wire A

Output

OHA-VTB2

OHA V.11 channel 2, transmit pair, wire B

Output

OHA-VIA2

OHA V.11 channel 2, indicator pair, wire A

Output

10

OHA-VDA2

OHA V.11 channel 2, clock pair, wire A

Output

11-17

Reserved for future use

18

OHA-GRP1

OHA G.703 channel 1, receive pair, wire +

Input

19

OHA-GRN1

OHA G.703 channel 1, receive pair, wire -

Input

20

OHA-GRN2

OHA G.703 channel 2, receive pair, wire -

Input

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Pin

Name

Function

Direction

21

OHA-VRA1

OHA V.11 channel 1, receive pair, wire A

Input

22

OHA-VRB1

OHA V.11 channel 1, receive pair, wire B

Input

23

OHA-VIB1

OHA V.11 channel 1, indicator pair, wire B

Output

24

OHA-VRA2

OHA V.11 channel 2, receive pair, wire A

Input

25

OHA-VRB2

OHA V.11 channel 2, receive pair, wire B

Input

26

OHA-VIB2

OHA V.11 channel 2, indicator pair, wire B

Output

27

OHA-VDB2

OHA V.11 channel 2, clock pair, wire B

Output

28-33

Reserved for future use

34

OHA-GTP2

OHA G.703 channel 2, transmit pair, wire +

Output

35

OHA-GTN2

OHA G.703 channel 2, transmit pair, wire -

Output

36

OHA-GRP2

OHA G.703 channel 2, receive pair, wire +

Input

37

OHA-VCA1

OHA V.11 channel 1, control pair, wire A

Input

38

OHA-VCB1

OHA V.11 channel 1, control pair, wire B

Input

39

OHA-VDA1

OHA V.11 channel 1, timing pair, wire A

Output

40

OHA-VDB1

OHA V.11 channel 1, timing pair, wire B

Output

41

OHA-VCA2

OHA V.11 channel 2, control pair, wire A

Input

42

OHA-VCB2

OHA V.11 channel 2, control pair, wire B

Input

43-46

Reserved for future use

47

SHIELD

Shield

48-50

Reserved for future use

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MECP Connectors
This section provides information on the connectors located on the MECP
panels.

Ethernet Connectors
The two ETHERNET connectors on the MECP panel, designated MNG MAIN
and MNG PROT, are 8-pin RJ-45 connectors that provide two Ethernet
10BaseT management interfaces (one for each xMCP card installed in the
XDM platform). At any time, only the interface connected to the xMCP card
serving as the current main card is active; the interface connected to the xMCP
card serving as the protection card is in standby to provide protection for the
out-of-band management traffic.
Each ETHERNET connector is wired as a station port for direct connection
through a straight cable to a port of a 10BaseT Ethernet hub.
The following figure identifies the connector pins as seen when looking into
the connector.

Figure B-9: MECP ETHERNET connector pin identification

The following table lists the pin assignment for a typical connector.
Table B-7: ETHERNET connector pin assignment

B-10

Pin

Designation

Function

Direction

TX+

Transmit + wire

Output

TX-

Transmit - wire

Output

RX+

Receive + wire

Input

4, 5

N/C

Not connected

RX-

Receive - wire

FGND

Frame ground

N/C

Not connected

Input

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OW Connector (MECP_OW and


MECP_OCxxOW)
The OW connector, included only on the MECP_OW and MECP_OCxxOW
versions, is an RJ-11 connector that is functionally connected in parallel with
the OW connector located on the xECB panel. For a description refer to OW
Connector (page B-7).

ACP Connectors
The Ethernet connectors on the ACP card are 10-pin RJ-45 connectors.
The following figure identifies the connector pins as seen when looking into
the connector.

Figure B-10: ACP900 connector pin identification

The following table lists the pin assignment for a typical connector.
Table B-8: ACP900 Ethernet connector pin assignments
Pin

Designation

Function

Direction

RX+

Receive + wire

Input

RX-

Receive - wire

Input

3, 4

VCC

Power 3.3 V

TX+

Transmit + wire

Output

TX-

Transmit - wire

Output

LED_RA

Indicator light

LED_RC

Indicator light

LED_LA

Indicator light

10

LED_LC

Indicator light

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M2_84 Interface Module


Connection Data
M2_84 Interface Module Connectors
The M2_84 electrical interface modules, which provide 84 balanced or
unbalanced E1 tributary interfaces for PIO2-84 cards, have six 68-pin SCSI
female connectors. Each connector supports 14 E1 interfaces. The tributaries
supported by each connector are marked alongside the connector: 1-14, 15-28,
28-42, 43-56, 57-70, and 71-84.
The following figure identifies the connector pins as seen when looking into
the connector.

Figure B-11: M2_84 14-tributary connector pin identification

The following table lists the pin assignment for a typical connector (for
unbalanced interfaces, wire A is the center (tip) conductor, and wire B is the
shield or ring). The table also lists the color of the wire connected to the
corresponding pin in the cables offered by ECI for connecting between the
tributary connector and a distribution frame.
The tributary numbers appearing in the table are given for the 1-14 connector.
To obtain the correct tributary numbers for other connectors, interpret the
numbers as representing the number of the tributary in its group (for example,
in connector 43-56, 6 represents E1 tributary 48).
Table B-9: M2_84B interface module, 14-tributary connector pin assignment

B-12

Pin

Name

Function

Direction

Wire color

RX1-A

Receive, tributary 1, wire A

Input

Brown

RX1-B

Receive, tributary 1, wire B

Input

Brown/gray ring

TX2-A

Transmit, tributary 2, wire A

Output

Red

TX2-B

Transmit, tributary 2, wire B

Output

Red/gray ring

GND

Shield

Light-gray/yellow ring

TX3-A

Transmit, tributary 3, wire A

Output

Orange

TX3-B

Transmit, tributary 3, wire B

Output

Orange/gray ring

RX4-A

Receive, tributary 4, wire A

Input

Yellow

RX4-B

Receive, tributary 4, wire B

Input

Yellow/gray ring

10

GND

Shield

White/yellow ring

11

RX5-A

Receive, tributary 5, wire A

Input

Green

12

RX5-B

Receive, tributary 5, wire B

Input

Green/gray ring

13

TXG-A

Transmit, tributary 6, wire A

Output

Blue

ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

Pin

Name

Function

Direction

Wire color

14

TXG-B

Transmit, tributary 6, wire B

Output

Blue/gray ring

15

GND

Shield

Brown/blue ring

16

TX7-A

Transmit, tributary 7, wire A

Output

Violet

17

TX7-B

Transmit, tributary 7, wire B

Output

Violet/gray ring

18

RX8-A

Receive, tributary 8, wire A

Input

White

19

RX8-B

Receive, tributary 8, wire B

Input

White/gray ring

20

GND

Shield

Red/blue ring

21

RX9-A

Receive, tributary 9, wire A

Input

Pink

22

RX9-B

Receive, tributary 9, wire B

Input

Pink/gray ring

23

TX10-A

Transmit, tributary 10, wire A

Output

Brown/white ring

24

TX10-B

Transmit, tributary 10, wire B

Output

Red/white ring

25

Not connected

26

TX11-A

Transmit, tributary 11, wire A

Output

Orange/white ring

27

TX11-B

Transmit, tributary 11, wire B

Output

Yellow/white ring

28

RX12-A

Receive, tributary 12, wire A

Input

Green/white ring

29

RX12-B

Receive, tributary 12, wire B

Input

Blue/white ring

30

Not connected

31

RX13-A

Receive, tributary 13, wire A

Input

Violet/white ring

32

RX13-B

Receive, tributary 13, wire B

Input

Light-gray/white ring

33

TX14-A

Transmit, tributary 14, wire A

Output

Red/brown ring

34

TX14-B

Transmit, tributary 14, wire B

Output

Yellow/brown ring

35

TX1-A

Transmit pair, tributary 1, wire A

Output

Orange/brown ring

36

TX1-B

Transmit, tributary 1, wire B

Output

Green/brown ring

37

RX2-A

Receive, tributary 2, wire A

Input

Blue/brown ring

38

RX2-B

Receive, tributary 2, wire B

Input

Violet/brown ring

39

Not connected

40

RX3-A

Receive, tributary 3, wire A

Input

Light-gray/brown ring

41

RX3-B

Receive, tributary 3, wire B

Input

Pink/brown ring

42

TX4-A

Transmit, tributary 4, wire A

Output

Brown/red ring

43

TX4-B

Transmit, tributary 4, wire B

Output

Light-gray/red ring

44

Not connected

45

TX5-A

Transmit, tributary 5, wire A

Output

Yellow/red ring

46

TX5-B

Transmit, tributary 5, wire B

Output

Green/red ring

47

RX6-A

Receive, tributary 6, wire A

Input

Blue/red ring

48

RX6-B

Receive, tributary 6, wire B

Input

Violet/red ring

49

Not connected

50

RX7-A

Receive, tributary 7, wire A

Input

White/red ring

51

RX7-B

Receive, tributary 7, wire B

Input

Pink/red ring

52

TX8A

Transmit, tributary 8, wire A

Output

Brown/green ring

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ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

XDM-500 Installation and


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Pin

Name

Function

Direction

Wire color

53

TX8-B

Transmit, tributary 8, wire B

Output

Light-gray/green ring

54

Not connected

55

TX9A

Transmit, tributary 9, wire A

Output

Yellow/green ring

56

TX9-B

Transmit, tributary 9, wire B

Output

Orange/green ring

57

RX10-A

Receive, tributary 10, wire A

Input

Violet/green ring

58

RX10-B

Receive, tributary 10, wire B

Input

Blue/green ring

59

Not connected

60

RX11-A

Receive, tributary 11, wire A

Input

Pink/green ring

61

RX11-B

Receive, tributary 11, wire B

Input

White/green ring

62

TX12A

Transmit, tributary 12, wire A

Output

Brown/yellow ring

63

TX12-B

Transmit, tributary 12, wire B

Output

Red/yellow ring

64

Not connected

65

TX13A

Transmit, tributary 13, wire A

Output

Orange/yellow ring

66

TX13-B

Transmit, tributary 13, wire B

Output

Green/yellow ring

67

RX14-A

Receive, tributary 14, wire A

Input

Blue/yellow ring

68

RX14-B

Receive, tributary 14, wire B

Input

Violet/yellow ring

E1 Patch Panel Data


ECI offers a dedicated patch panel for balanced E1 interfaces. This panel
supports all the 84 E1 interfaces available on M2-84B modules. The
connections to the patch panel are organized as follows:

B-14

Each group of 14 E1 interfaces is supported by one 68-SCSI female


connector on the rear wall of the patch panel for a total of six connectors.
Each of these connectors uses the same pin assignment as the 68-pin SCSI
connectors of the M2_84B modules.

Each 68-pin SCSI connector is connected to two pairs of 25-pin D-type


male connectors on the front side of the patch panel. Each pair supports
seven interfaces, with the transmit lines located in the OUT/ab connector
and the receive line in the IN/an connector.

ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

The following table lists the patch panel wiring, that is, the connections
between the 68-pin SCSI connectors and the 25-pin D-type connectors.
Table B-10: Patch panel wiring
SCSI pin

Name

Function

Direction

D-type pin

RX1-A

Receive, tributary 1,
wire A

Input

IN/an (1-7)

Pin 2

RX1-B

Receive, tributary 1,
wire B

Input

IN/an (1-7)

Pin 1

TX2-A

Transmit, tributary 2,
wire A

Output

OUT/ab (1-7)

Pin 16

TX2-B

Transmit, tributary 2,
wire B

Output

OUT/ab (1-7)

Pin 15

GND

Shield

OUT/ab (8-14)

Pin 13

TX3-A

Transmit, tributary 3,
wire A

Output

OUT/ab (1-7)

Pin 5

TX3-B

Transmit, tributary 3,
wire B

Output

OUT/ab (1-7)

Pin 4

RX4-A

Receive, tributary 4,
wire A

Input

IN/an (1-7)

Pin 19

RX4-B

Receive, tributary 4,
wire B

Input

IN/an (1-7)

Pin 18

10

GND

Shield

IN/an (8-14)

Pin 13

11

RX5-A

Receive, tributary 5,
wire A

Input

IN/an (1-7)

Pin 8

12

RX5-B

Receive, tributary 5,
wire B

Input

IN/an (1-7)

Pin 7

13

TXG-A

Transmit, tributary 6,
wire A

Output

OUT/ab (1-7)

Pin 22

14

TXG-B

Transmit, tributary 6,
wire B

Output

OUT/ab (1-7)

Pin 21

15

GND

Shield

OUT/ab (1-7)

Pins 3, 6, 9,
13, 14, 17, 20,
23

16

TX7-A

Transmit, tributary 7,
wire A

Output

OUT/ab (1-7)

Pin 11

17

TX7-B

Transmit, tributary 7,
wire B

Output

OUT/ab (1-7)

Pin 10

18

RX8-A

Receive, tributary 8,
wire A

Input

IN/an (8-14)

Pin 2

19

RX8-B

Receive, tributary 8,
wire B

Input

IN/an (8-14)

Pin 1

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ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

B-16

XDM-500 Installation and


Maintenance Manual

SCSI pin

Name

Function

Direction

D-type pin

20

GND

Shield

IN/an (1-7)

Pins 3, 6, 9,
13, 14, 17, 20,
23

21

RX9-A

Receive, tributary 9,
wire A

Input

IN/an (8-14)

Pin 16

22

RX9-B

Receive, tributary 9,
wire B

Input

IN/an (8-14)

Pin 15

23

TX10-A

Transmit, tributary 10,


wire A

Output

OUT/ab (8-14)

Pin 5

24

TX10-B

Transmit, tributary 10,


wire B

Output

OUT/ab (8-14)

Pin 4

25

Not connected

26

TX11-A

Transmit, tributary 11,


wire A

Output

OUT/ab (8-14)

Pin 19

27

TX11-B

Transmit, tributary 11,


wire B

Output

OUT/ab (8-14)

Pin 18

28

RX12-A Receive, tributary 12,


wire A

Input

IN/an (8-14)

Pin 8

29

RX12-B

Receive, tributary 12,


wire B

Input

IN/an (8-14)

Pin 7

30

Not connected

31

RX13-A Receive, tributary 13,


wire A

Input

IN/an (8-14)

Pin 22

32

RX13-B

Receive, tributary 13,


wire B

Input

IN/an (8-14)

Pin 21

33

TX14-A

Transmit, tributary 14,


wire A

Output

OUT/ab (8-14)

Pin 11

34

TX14-B

Transmit, tributary 14,


wire B

Output

OUT/ab (8-14)

Pin 10

35

TX1-A

Transmit pair,
tributary 1, wire A

Output

OUT/ab (1-7)

Pin 2

36

TX1-B

Transmit, tributary 1,
wire B

Output

OUT/ab (1-7)

Pin 1

37

RX2-A

Receive, tributary 2,
wire A

Input

IN/an (1-7)

Pin 16

38

RX2-B

Receive, tributary 2,
wire B

Input

IN/an (1-7)

Pin 15

39

Not connected

40

RX3-A

Receive, tributary 3,
wire A

Input

IN/an (1-7)

Pin 5

41

RX3-B

Receive, tributary 3,
wire B

Input

IN/an (1-7)

Pin 4

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


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Connector Pin Assignments

SCSI pin

Name

Function

Direction

D-type pin

42

TX4-A

Transmit, tributary 4,
wire A

Output

OUT/ab (1-7)

Pin 19

43

TX4-B

Transmit, tributary 4,
wire B

Output

OUT/ab (1-7)

Pin 18

44

Not connected

45

TX5-A

Transmit, tributary 5,
wire A

Output

OUT/ab (1-7)

Pin 8

46

TX5-B

Transmit, tributary 5,
wire B

Output

OUT/ab (1-7)

Pin 7

47

RX6-A

Receive, tributary 6,
wire A

Input

IN/an (1-7)

Pin 22

48

RX6-B

Receive, tributary 6,
wire B

Input

IN/an (1-7)

Pin 21

49

Not connected

50

RX7-A

Receive, tributary 7,
wire A

Input

IN/an (1-7)

Pin 11

51

RX7-B

Receive, tributary 7,
wire B

Input

IN/an (1-7)

Pin 10

52

TX8A

Transmit, tributary 8,
wire A

Output

OUT/ab (8-14)

Pin 2

53

TX8-B

Transmit, tributary 8,
wire B

Output

OUT/ab (8-14)

Pin 1

54

Not connected

55

TX9A

Transmit, tributary 9,
wire A

Output

OUT/ab (8-14)

Pin 16

56

TX9-B

Transmit, tributary 9,
wire B

Output

OUT/ab (8-14)

Pin 15

57

RX10-A Receive, tributary 10,


wire A

Input

IN/an (1-7)

Pin 5

58

RX10-B

Receive, tributary 10,


wire B

Input

IN/an (1-7)

Pin 4

59

Not connected

60

RX11-A Receive, tributary 11,


wire A

Input

IN/an (8-14)

Pin 19

61

RX11-B

Receive, tributary 11,


wire B

Input

IN/an (8-14)

Pin 18

62

TX12A

Transmit, tributary 12,


wire A

Output

OUT/ab (8-14)

Pin 8

63

TX12-B

Transmit, tributary 12,


wire B

Output

OUT/ab (8-14)

Pin 7

64

Not connected

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Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

SCSI pin

Name

Function

Direction

D-type pin

65

TX13A

Transmit, tributary 13,


wire A

Output

OUT/ab (8-14)

Pin 22

66

TX13-B

Transmit, tributary 13,


wire B

Output

OUT/ab (8-14)

Pin 21

67

RX14-A Receive, tributary 14,


wire A

Input

IN/an (8-14)

Pin 11

68

RX14-B

Receive, tributary 14,


wire B

Input

IN/an (8-14)

Pin 10

M2_21 Interface Module Connectors


The M2_21 electrical interface modules, which provide 21 balanced or
unbalanced E1 tributary interfaces for PIO2-21 cards, have two 68-pin SCSI
female connectors. One connector, designated 1-14, supports 14 E1 interfaces,
and the other connector, designated 15-21, supports the remaining 7 E1
interfaces.
M2_21 connectors are similar to those of the M2_84 modules. The table there
lists the pin assignment for the 1-14 connector (for unbalanced interfaces, wire
A is the center (tip) conductor, and wire B is the shield, or ring); the wiring of
the 15-21 connector is similar, except that only the pins of the first 7 interfaces
are actually connected.
The table also lists the color of the wire connected to the corresponding pin in
the cables offered by ECI for connecting between the tributary connector and a
distribution frame.

B-18

ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

Alarms Handling Principles


In order to facilitate understanding of alarms connection, the following sections
describe the principles of alarms handling in XDM platforms.

Alarm Input
Alarm input is implemented by an optocoupler circuit shown in the following
figure.

Figure B-12: Alarm In principle circuit

When an alarm is detected at the client side, it provides a closed dry contact at
the input (between the optocoupler's LED and ground), causing the LED to
conduct and light. The light activates the optocoupler's transistor output stage,
resulting in a low logic level at the collector. The output signal connected to the
XDM processor is handled as an input alarm.
The client's dry contact ratings are 12 V in open state, and 0.5A in closed state.

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

B-19

Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

Alarm Output
Alarm output is implemented by a change-over dry contact circuit shown in the
following figure.

Figure B-13: Alarm Out principle circuit

When an alarm is detected in the XDM, the processor sends a low logic level to
the relay, activating it. The state of the dry contact connected to the client side
changes and provides an alarm output signal to client's facility.
The relay contact ratings are 57.6 V in open state, and 1A in closed state.

B-20

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


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Connector Pin Assignments

xRAP-D Connectors
This section provides information on the connectors located on the xRAP-D
unit.

Platform DC Input Power Connectors


The SHELF DC input power connectors, designated Shelf 1 and Shelf 2, are
5-pin D-type male connectors. The following figure identifies the functions of
the platform DC input connector pins, as seen when looking into the connector.

Figure B-14: xRAP-D and xRAP-B shelf DC input power connector pin functions

SHELF Alarm Connectors


The SHELF alarm connectors are 36-pin SCSI female connectors. Each
connector is connected to the ALARMS connector of an XDM-500 platform.
Refer to ALARMS Connector (page B-3) for description. The following figure
identifies the connector pins as seen when looking into the connector, and the
table lists the pin assignment for this connector.

Figure B-15: SHELF alarm connector pin identification

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B-21

Connector Pin Assignments

XDM-500 Installation and


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Table B-11: SHELF alarm connector pin assignment

B-22

Pin

Name

Function

Direction

N/C

Not connected

--

ALM_IP1

Alarm input 1, + wire

Input

ALM_IN1

Alarm input 1, wire

Input

ALM_IP2

Alarm input 2, + wire

Input

ALM_IN2

Alarm input 2, wire

Input

ALM_IP3

Alarm input 3, + wire

Input

ALM_IN3

Alarm input 3, wire

Input

ALM_IP4

Alarm input 4, + wire

Input

ALM_IN4

Alarm input 4, wire

Input

10

ALM_O4

Alarm output 4

Output

11

N/C

Not connected

--

12

GND

Ground

--

13

ALM_O1

Alarm output 1

Output

14

N/C

Not connected

--

15

GND

Ground

--

16

ALM_O2

Alarm output 2

Output

17

N/C

Not connected

--

18

BUZZ

Buzzer

Input

19

N/C

Not connected

--

20

GND

Ground

--

21

CRIT_COM

Critical alarm

Output

22

N/C

Not connected

--

23

MAJ_COM

Major alarm

Output

24

GND

Ground

--

25

N/C

Not connected

--

26

GND

Ground

--

27

MIN_COM

Minor alarm

Output

28

N/C

Not connected

--

29

WARN_COM

Warning alarm

Output

30

GND

Ground

--

31

ALM_O3

Alarm output 3

Output

32

GND

Ground

--

33

N/C

Not connected

--

34

N/C

Not connected

--

35

GND

Ground

--

36

N/C

Not connected

--

ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

ALARMS Connector
The ALARMS connector is a SCSI 68-pin female connector that carries the
following groups of lines to the customer equipment:

Eight external alarm inputs connected to the ALARM inputs of the XDM500 platforms. Four inputs are allocated to each XDM-500 platform. Each
input is activated by closing a dry contact provided from the customers
facility.

Eight sets of change-over relay contacts floating with respect to platform


ground, which serve as rack (bay) status outputs. Four outputs are allocated
to each XDM-500 platform connected to the xRAP-B/xRAP-D.

Eight sets of change-over relay contacts (four per platform) floating with
respect to platform ground, which serve as rack (bay) alarm indication
lines. The relays, identified as critical, major, minor, and warning, are
activated by the corresponding alarm relays of XDM-500 platforms.

Two sets of change-over relay contacts floating with respect to platform


ground, which serve as Critical alarm buzzer activation signal. The relay is
activated whenever a Critical alarm is detected in the corresponding
platform. The signal can be used to activate a local buzzer (Critical buzzer)
in the customer's alarms collecting system.

Two lines for muting the Critical buzzer in the customer's alarms collecting
system.

Relay contact ratings are 72 V in open state, and 1A in closed state.


The following figure identifies the ALARMS connector pins as seen when
looking into the connector. The table lists the pin assignment for the ALARMS
connector. This table also lists the color of the wire connected to the
corresponding pin in the cables offered by ECIs Network Solutions Division
for connecting between the ALARMS connector and a distribution frame.

Figure B-16: ALARMS connector pin identification

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ECI Telecom Ltd. Proprietary

B-23

Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

Table B-12: ALARMS connector pin assignment

B-24

Assignment

Pin

Designation

Function

Shelf 2

CRIT_NC

Critical alarm relay, Output


normally closed
contact

Black

CRIT_COM

Critical alarm relay, Output


common contact

Brown

CRIT_NO

Critical alarm relay, Output


normally open
contact

Red

MAJ_NC

Major alarm relay,


normally closed
contact

Output

Orange

MAJ_COM

Major alarm relay,


common contact

Output

Yellow

MAJ_NO

Major alarm relay,


normally open
contact

Output

Green

MIN_NC

Minor alarm relay,


normally closed
contact

Output

Blue

MIN_COM

Minor alarm relay,


common contact

Output

Violet

MIN_NO

Minor alarm relay,


normally open
contact

Output

Gray

10

WARN_NC

Warning alarm
relay, normally
closed contact

Output

White

11

WARN_COM

Warning alarm
relay, common
contact

Output

Pink

12

WARN_NO

Warning alarm
Output
relay, normally open
contact

Light green

13

BUZZ_NC

Buzzer relay,
normally closed
contact

Output

Black/white

14

BUZZ_COM

Buzzer relay,
common contact

Output

Brown/
white

15

BUZZ_NO

Buzzer relay,
normally open
contact

Output

Red/white

16

ALMO1_NC

Output relay 1,
normally closed
contact

Output

Orange/
white

17

ALMO1_COM

Output relay 1,
common contact

Output

Green/
white

ECI Telecom Ltd. Proprietary

Direction

Wire color

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual
Assignment

417006-2304-0H3-B02

Connector Pin Assignments

Pin

Designation

Function

Direction

Wire color

18

ALMO1_NO

Output relay 1,
normally open
contact

Output

Blue/white

19

ALMO2_NC

Output relay 2,
normally closed
contact

Output

Violet/
white

20

ALMO2_COM

Output relay 2,
common contact

Output

Red/black

21

ALMO2_NO

Output relay 2,
normally open
contact

Output

Orange/
black

22

ALMO3_NC

Output relay 3,
normally closed
contact

Output

Yellow/
black

23

ALMO3_COM

Output relay 3,
common contact

Output

Green/
black

24

ALMO3_NO

Output relay 3,
normally open
contact

Output

Gray/black

25

ALMO4_NC

Output relay 4,
normally closed
contact

Output

Pink/black

26

ALMO4_COM

Output relay 4,
common contact

Output

Pink/green

27

ALMO4_NO

Output relay 4,
normally open
contact

Output

Pink/red

28

ALMIN_1

External alarm input Input


1

Pink/violet

29

ALMIN_2

External alarm input Input


2

Light blue

30

GND

ground

Light
blue/brown

31

ALMIN_3

External alarm input Input


3

Light blue/red

32

ALMIN_4

External alarm input Input


4

Light
blue/violet

33

GND

ground

Light
blue/black

34

BUZZ_OFF

Buzzer mute

ECI Telecom Ltd. Proprietary

Output

Gray/green

B-25

Connector Pin Assignments

B-26

XDM-500 Installation and


Maintenance Manual

Assignment

Pin

Designation

Function

Shelf 1

35

CRIT_NC

Critical alarm relay, Output


normally closed
contact

Gray/red

36

CRIT_COM

Critical alarm relay, Output


common contact

Gray/violet

37

CRIT_NO

Critical alarm relay, Output


normally open
contact

Light
green/black

38

MAJ_NC

Major alarm relay,


normally closed
contact

Output

Violet/black

39

MAJ_COM

Major alarm relay,


common contact

Output

Black/white
dots

40

MAJ_NO

Major alarm relay,


normally open
contact

Output

Brown/
white dots

41

MIN_NC

Minor alarm relay,


normally closed
contact

Output

Red/white
dots

42

MIN_COM

Minor alarm relay,


common contact

Output

Orange/
white dots

43

MIN_NO

Minor alarm relay,


normally open
contact

Output

Green/
white dots

44

WARN_NC

Warning alarm
relay, normally
closed contact

Output

Blue/white
dots

45

WARN_COM

Warning alarm
relay, common
contact

Output

Violet/
white dots

46

WARN_NO

Warning alarm
Output
relay, normally open
contact

White/
black dots

47

BUZZ_NC

Buzzer relay,
normally closed
contact

Output

Yellow/
black dots

48

BUZZ_COM

Buzzer relay,
common contact

Output

Green/
black dots

49

BUZZ_NO

Buzzer relay,
normally open
contact

Output

Light blue/
black dots

50

ALMO1_NC

Output relay 1,
normally closed
contact

Output

Pink/black
dots

51

ALMO1_COM

Output relay 1,
common contact

Output

Red/black
dots

52

ALMO1_NO

Output relay 1,
normally open
contact

Output

Orange/
black dots

ECI Telecom Ltd. Proprietary

Direction

Wire color

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual
Assignment

417006-2304-0H3-B02

Connector Pin Assignments

Pin

Designation

Function

Direction

Wire color

53

ALMO2_NC

Output relay 2,
normally closed
contact

Output

Violet/black
dots

54

ALMO2_COM

Output relay 2,
common contact

Output

Gray/black
dots

55

ALMO2_NO

Output relay 2,
normally open
contact

Output

Orange/red
dots

56

ALMO3_NC

Output relay 3,
normally closed
contact

Output

Yellow/red
dots

57

ALMO3_COM

Output relay 3,
common contact

Output

Green/red
dots

58

ALMO3_NO

Output relay 3,
normally open
contact

Output

Blue/red dots

59

ALMO4_NC

Output relay 4,
normally closed
contact

Output

Violet/red
dots

60

ALMO4_COM

Output relay 4,
common contact

Output

Gray/red dots

61

ALMO4_NO

Output relay 4,
normally open
contact

Output

White/red
dots

62

ALMIN_1

External alarm input Input


1

Pink/red dots

63

ALMIN_2

External alarm input Input


2

Yellow/
white

64

GND

ground

Gray/white

65

ALMIN_3

External alarm input Input


3

Pink/white

66

ALMIN_4

External alarm input Input


4

Brown/
black

67

GND

ground

Blue/black

68

BUZZ_OFF

Buzzer mute

ECI Telecom Ltd. Proprietary

Output

Gray/white
dots

B-27

Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

xRAP-HP Connectors
This section provides information on the connectors located on the xRAP-HP
units.

SHELF EXTERNAL ALARM/CONTROL


Connectors
The three SHELF EXTERNAL ALARM/CONTROL connectors are 25-pin
D-type female connectors. Each connector is intended to be connected to the
ALARMS connector of an XDM platfprm. The following figure identifies the
connector pins as seen when looking into the connector.

Figure B-17: SHELF EXTERNAL ALARM/CONTROL connector pin identification

The following table lists the pin assignment for this connector.
Table B-13: SHELF EXTERNAL ALARM/CONTROL connector pin assignment

B-28

Pin

Designation

Function

Direction

ALM_IP1

Connection to XDM alarm input 1

Output

ALM_IP2

Connection to XDM alarm input 2

Output

ALM_IP3

Connection to XDM alarm input 3

Output

ALM_IP4

Connection to XDM alarm input 4

Output

ALM_IP5

Connection to XDM alarm input 5

Output

ALM_IP6

Connection to XDM alarm input 6

Output

ALM_IP7

Connection to XDM alarm input 7

Output

ALM_IP8

Connection to XDM alarm input 8

Output

Not connected

10

GND

Ground

11-13

Not connected

14

ALM_OP1

Connection to XDM alarm output 1

15

ALM_OP2

Connection to XDM alarm output 2

Input

16

ALM_OP3

Connection to XDM alarm output 3

Input

17

ALM_OP4

Connection to XDM alarm output 4

Input

18

ALM_OP5

Connection to XDM alarm output 5

Input

19

ALM_OP6

Connection to XDM alarm output 6

Input

20

ALM_OP7

Connection to XDM alarm output 7

Input

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Connector Pin Assignments

Pin

Designation

Function

Direction

21

ALM_OP8

Connection to XDM alarm output 8

Input

22

Not connected

23

GND

Ground

Not connected

24, 25 -

The connection between each SHELF EXTERNAL ALARM/CONTROL


connector and the corresponding ALARMS connector is performed by means
of a cable terminated in a 25-pin D-type male connector at the RAP side, and a
50-pin D-type female connector at the XDM platform side. Cable wiring is
listed in the following table.
Table B-14: SHELF EXTERNAL ALARM/CONTROL - ALARMS cable wiring
xRAP-HP side

Line function

XDM side

XDM alarm input 1

34

XDM alarm input 2

36

XDM alarm input 3

38

XDM alarm input 4

40

XDM alarm input 5

42

XDM alarm input 6

44

XDM alarm input 7

46

XDM alarm input 8

48

Not connected

10

Ground

35, 37, 39, 41, 43, 45, 47, 49

11-13

Not connected

14

XDM alarm output 1

15

XDM alarm output 2

16

XDM alarm output 3

17

XDM alarm output 4

18

XDM alarm output 5

19

XDM alarm output 6

11

20

XDM alarm output 7

13

21

XDM alarm output 8

15

22

Not connected

23

Ground

2, 4, 6, 8, 10, 12, 14, 16

24, 25

Not connected

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ECI Telecom Ltd. Proprietary

B-29

Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

RAP Connectors
The three RAP connectors are 9-pin D-type female connectors. Each of these
connectors is intended to be connected to an xRAP connector (page B-4) that
carries the alarm relay outputs and buzzer control line of the platform.
The following figure identifies the connector pins as seen when looking into
the connector.

Figure B-18: RAP connector pin identification

The following table lists the pin assignment for the RAP connector.
Table B-15: RAP connector pin assignments
Pin

Designation

Function

Direction

Critical

Critical alarm relay

Input

Major

Major alarm relay

Input

Minor

Minor alarm relay

Input

Warning

Warning relay

Input

Buzzer

Audio alarm activation line

Input

6-8

Not connected

Common

Common reference for all the outputs

The connection between each RAP connector and the corresponding XDM
platform connector is performed by means of a cable terminated in a 9-pin
D-type female connector at the xRAP-HP side, and a 9-pin D-type male
connector at the XDM platform side. Cable wiring is listed in the following
table.
Table B-16: RAP shelf cable wiring diagram

B-30

xRAP-HP side

Function

XDM side

Critical alarm indication

Major alarm indication

Minor alarm indication

Warning indication

Audio alarm activation line

6, 7, 8

Not connected

2, 4, 8

Common reference for all the inputs

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


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Connector Pin Assignments

CONTROL CONNECTION Connector


The CONTROL CONNECTION connector is a 50-pin D-type female
connector that carries three groups of lines:

Eight external alarm inputs, connected through optocouplers in the


xRAP-HP to the ALARM inputs of the XDM platform. Each input is
connected to the input diode of an optocoupler, referenced to the platform
ground.

Eight sets of change-over relay contacts, floating with respect to platform


ground, that serve as rack (bay) status outputs. Internal xRAP-HP switches
can be used to assign each of the eight relays to one of the output alarm
lines of any XDM platform connected to the xRAP-HP.

Four sets of change-over relay contacts, floating with respect to platform


ground, that serve as rack (bay) alarm indication lines. The relays,
identified as critical, major, minor, and warning, are activated by the
corresponding alarm relays of XDM shelves.

Relay contact ratings are 57.6 V in open state, and 1A in closed state.
The following figure identifies the CONTROL CONNECTION connector pins
as seen when looking into the connector.

Figure B-19: CONTROL CONNECTION connector pin identification

The following table lists the pin assignment for the CONTROL
CONNECTION connector. The table also lists the color of the wire connected
to the corresponding pin in the cables offered by ECI for connecting between
the CONTROL CONNECTION connector and a distribution frame.
Table B-17: CONTROL CONNECTION connector pin assignment
Pin

Designation

Function

Direction

Wire color

ALARM_IN1

External alarm input 1

Input

Brown

ALARM_IN4

External alarm input 4

Input

Brown/gray-ring

ALARM_IN7

External alarm input 7

Input

Red

Not used

Red/gray-ring

OUT1_COM

Output relay 1, common


contact

Output

Orange

OUT2_COM

Output relay 2, common


contact

Output

Orange/gray-ring

OUT3_COM

Output relay 3, common


contact

Output

Yellow

OUT4_COM

Output relay 4, common


contact

Output

Yellow/gray-ring

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

B-31

Connector Pin Assignments

B-32

XDM-500 Installation and


Maintenance Manual

Pin

Designation

Function

Direction

Wire color

OUT5_COM

Output relay 5, common


contact

Output

Green

10

OUT6_COM

Output relay 6, common


contact

Output

Green/gray-ring

11

OUT7_COM

Output relay 7, common


contact

Output

Blue

12

OUT8_COM

Output relay 8, common


contact

Output

Blue/gray-ring

13

Not used

Violet

14

CRIT_COM

Critical alarm relay,


common contact

Output

Violet/gray-ring

15

MAJOR_COM

Major alarm relay, common Output


contact

White

16

MINOR_COM

Minor alarm relay, common Output


contact

White/gray-ring

17

WARN_COM

Warning relay, common


contact

Output

Pink

18

ALARM_IN2

External alarm input 2

Input

Pink/gray-ring

19

ALARM_IN5

External alarm input 5

Input

Brown/white-ring

20

ALARM_IN8

External alarm input 8

Input

Red/white-ring

21

Not used

Orange/white-ring

22

OUT1NO

Output relay 1, normally


open contact

Output

Yellow/white-ring

23

OUT2NO

Output relay 2, normally


open contact

Output

Green/white-ring

24

OUT3NO

Output relay 3, normally


open contact

Output

Blue/white-ring

25

OUT4NO

Output relay 4, normally


open contact

Output

Violet/white-ring

26

OUT5NO

Output relay 5, normally


open contact

Output

Light-gray/white-rin
g

27

OUT6NO

Output relay 6, normally


open contact

Output

Red/brown-ring

28

OUT7NO

Output relay 7, normally


open contact

Output

Yellow/brown-ring

29

OUT8NO

Output relay 8, normally


open contact

Output

Orange/brown-ring

30

CRIT_NC

Critical alarm relay,


normally closed contact

Output

Green/brown-ring

31

MAJOR_NC

Major alarm relay,


normally closed contact

Output

Blue/brown-ring

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Connector Pin Assignments

Pin

Designation

Function

Direction

Wire color

32

MINOR_NC

Minor alarm relay,


normally closed contact

Output

Violet/brown-ring

33

WARN_NC

Warning relay, normally


closed contact

Output

Light-gray/brown-ri
ng

34

ALARM_IN3

External alarm input 3

Input

Pink/brown-ring

35

ALARM_IN6

External alarm input 6

Input

Brown/red-ring

36

GNDPS

Ground

Light-gray/red-ring

37

Not used

Yellow/red-ring

38

OUT1NC

Output relay 1, normally


closed contact

Output

Green/red-ring

39

OUT2NC

Output relay 2, normally


closed contact

Output

Blue/red-ring

40

OUT3NC

Output relay 3, normally


closed contact

Output

Violet/red-ring

41

OUT4NC

Output relay 4, normally


closed contact

Output

White/red-ring

42

OUT5NC

Output relay 5, normally


closed contact

Output

Pink/red-ring

43

OUT6NC

Output relay 6, normally


closed contact

Output

Brown/green-ring

44

OUT7NC

Output relay 7, normally


closed contact

Output

Light-gray/green-rin
g

45

OUT8NC

Output relay 8, normally


closed contact

Output

Yellow/green-ring

46

Not used

Orange/green-ring

47

CRIT_NO

Critical alarm relay,


normally open contact

Output

Violet/green-ring

48

MAJOR_NO

Major alarm relay,


normally open contact

Output

Blue/green-ring

49

MINOR_NO

Minor alarm relay,


normally open contact

Output

Brown/blue-ring

50

WARN_NO

Warning relay, normally


open contact

Output

Red/blue-ring

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

B-33

Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

xRAP-100 Connectors
This section provides information on the connectors located on the xRAP-100
units.

SHELF DC Power Connectors


The SHELF DC power connectors, designated SHELF 1, SHELF 2, SHELF 3,
and SHELF 4, are 3-pin D-type male connectors.
The SHELF 4 connector lines are also connected to a 5-pin D-type connector
for connecting to an XDM-1000 or XDM-2000 platform. The following figure
identifies the functions of the connector pins, as seen when looking into the
connector.

Figure B-20: 3-pin power connector

Figure B-21: 5-pin power connector

B-34

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Connector Pin Assignments

SHELF ALARM Connectors


The four ALARMS connectors are 36-pin SCSI female connectors. Each
connector can be connected to the ALARMS connector of an XDM platform or
to a BG platform. The following figure identifies the connector pins (as seen
when looking into the connector).

Figure B-22: xRAP-100 SHELF ALARM connector pin identification

The following table lists the pin assignment for this connector.
Table B-18: xRAP-100 SHELF ALARM connector pin assignment
Pin

Name

Function

Direction

N/C

--

--

ALM_IP1

Alarm input 1, + wire

Input

ALM_IN1

Alarm input 1, - wire

Input

ALM_IP2

Alarm input 2, + wire

Input

ALM_IN2

Alarm input 2, - wire

Input

ALM_IP3

Alarm input 3, + wire

Input

ALM_IN3

Alarm input 3, - wire

Input

ALM_IP4

Alarm input 4, + wire

Input

ALM_IN4

Alarm input 4, - wire

Input

10

N/C

--

--

11

N/C

--

--

12

GND

Ground

--

13

ALM_O1

Alarm output 1 common

Output

14

N/C

--

--

15

GND

Ground

--

16

ALM_O2

Alarm output 2 common

Output

17

N/C

--

--

18

BUZ_COM

Buzzer common

Input

19

N/C

--

--

20

GND

Ground

--

21

CRIT_COM

Critical alarm common

--

22

N/C

--

--

23

MAJ_COM

Major alarm common

Input

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ECI Telecom Ltd. Proprietary

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Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

Pin

Name

Function

Direction

24

GND

Ground

--

25

N/C

--

--

26

GND

Ground

--

27

MIN_COM

Minor alarm common

Input

28

N/C

--

--

29

WARN_COM

Warning alarm common

--

30

GND

Ground

--

31

N/C

--

--

32

N/C

--

--

33

N/C

--

--

34

N/C

--

--

35

GND

Ground

--

36

N/C

--

--

ALARM IN/OUT Connector


The ALARM IN/OUT connector is a 68-pin SCSI female connector that carries
three groups of lines to the customer equipment:

Sixteen external alarm inputs connected to the ALARM inputs of the XDM
shelves. Four inputs are allocated to each XDM platform. Each input is
activated by closing a dry contact provided from the customer's facility.

Eight sets of change-over relay contacts, floating with respect to platform


ground, which serve as rack (bay) status outputs. Each couple of the eight
relays is assigned to the two output alarm lines of each XDM platform
connected to the xRAP-100.

Four sets of change-over relay contacts, floating with respect to platform


ground, which serve as rack (bay) alarm indication lines. The relays,
identified as critical, major, minor, and warning, are activated by the
corresponding alarm relays of XDM shelves.

Relay contact ratings are 72 V in open state, and 1A in closed state.


The following figure identifies the ALARM IN/OUT connector pins, as seen
when looking into the connector.

Figure B-23: xRAP-100 ALARM IN/OUT connector pin identification

The following table lists the pin assignment for the ALARM IN/OUT
connector.
B-36

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Connector Pin Assignments

Table B-19: xRAP-100 ALARM IN/OUT connector pin assignment


Assignment

Pin

Designation

Function

Shelf 1

ALM_01NO

Output relay 1, normally open Output


contact

Black

ALM_01COM

Output relay 1, common


contact

Output

Brown

ALM_01NC

Output relay 1, normally


closed contact

Output

Red

ALM_02NO

Output relay 2, normally open Output


contact

Orange

ALM_02COM

Output relay 2, common


contact

Output

Yellow

ALM_02NC

Output relay 2, normally


closed contact

Output

Green

ALM_03NO

Output relay 3, normally open Output


contact

Blue

ALM_03COM

Output relay 3, common


contact

Output

Violet

ALM_03NC

Output relay 3, normally


closed contact

Output

Gray

10

ALM_04NO

Output relay 4, normally open Output


contact

White

11

ALM_04COM

Output relay 4, common


contact

Output

Pink

12

ALM_04NC

Output relay 4, normally


closed contact

Output

Light Green

13

ALM_05NO

Output relay 5, normally open Output


contact

Black/White

14

ALM_05COM

Output relay 5, common


contact

Output

Brown/White

15

ALM_05NC

Output relay 5, normally


closed contact

Output

Red/White

16

ALM_06NO

Output relay 6, normally open Output


contact

Orange/White

17

ALM_06COM

Output relay 6, common


contact

Output

Green/White

18

ALM_06NC

Output relay 6, normally


closed contact

Output

Blue/White

19

ALM_07NO

Output relay 7, normally open Output


contact

Violet/White

20

ALM_07COM

Output relay 7, common


contact

Output

Red/Black

21

ALM_07NC

Output relay 7, normally


closed contact

Output

Orange/Black

22

ALM_08NO

Output relay 8, normally open Output


contact

Yellow/Black

23

ALM_08COM

Output relay 8, common


contact

Output

Green/Black

24

ALM_08NC

Output relay 8, normally


closed contact

Output

Gray/Black

Shelf 2

Shelf 3

Shelf 4

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

Direction

Wire color

B-37

Connector Pin Assignments

Assignment

Pin

Designation

Function

Direction

Wire color

All shelves

25

CRIT_NC

Critical alarm relay, normally


closed contact

Output

Pink/Black

26

CRIT_NO

Critical alarm relay, normally


open contact

Output

Pink/Green

27

CRIT_COM

Critical alarm relay, common


contact

Output

Pink/Red

28

MAJ_NC

Major alarm relay, normally


closed contact

Output

Pink/Violet

29

MAJ_NO

Major alarm relay, normally


open contact

Output

Light Blue

30

MAJ_COM

Major alarm relay, common


contact

Output

Light Blue/Brown

31

MIN_NC

Minor alarm relay, normally


closed contact

Output

Light Blue/Red

32

MIN_NO

Minor alarm relay, normally


open contact

Output

Light Blue/Violet

33

MIN_COM

Minor alarm relay, common


contact

Output

Light Blue/Black

34

WARN_COM

Warning alarm relay,


common contact

Output

Gray/Green

35

ALMIN1

External alarm input 1

Input

Gray/Red

36

ALM_IN1

External alarm input 1

Input

Gray/Violet

37

ALMIN2

External alarm input 2

Input

Light Green/Black

38

ALM_IN2

External alarm input 2

Input

Violet/Black

39

ALMIN3

External alarm input 3

Input

Black/White dots

40

ALM_IN3

External alarm input 3

Input

Brown/White dots

41

ALMIN4

External alarm input 4

Input

Red/White dots

42

ALM_IN4

External alarm input 4

Input

Orange/White dots

43

ALMIN5

External alarm input 5

Input

Green/White dots

44

ALM_IN5

External alarm input 5

Input

Blue/White dots

45

ALMIN6

External alarm input 6

Input

Violet/White dots

46

ALM_IN6

External alarm input 6

Input

White/Black dots

47

ALMIN7

External alarm input 7

Input

Yellow/Black dots

48

ALM_IN7

External alarm input 7

Input

Green/Black dots

49

ALMIN8

External alarm input 8

Input

Light Blue/Black dots

50

ALM_IN8

External alarm input 8

Input

Pink/Black dots

Shelf 1

Shelf 2

B-38

XDM-500 Installation and


Maintenance Manual

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


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Connector Pin Assignments

Assignment

Pin

Designation

Function

Direction

Wire color

Shelf 3

51

ALMIN9

External alarm input 9

Input

Red/Black dots

52

ALM_IN9

External alarm input 9

Input

Orange/Black dots

53

ALMIN10

External alarm input 10

Input

Violet/Black dots

54

ALM_IN10

External alarm input 10

Input

Gray/Black dots

55

ALMIN11

External alarm input 11

Input

56

ALM_IN11

External alarm input 11

Input

Orange/Red dots

57

ALMIN12

External alarm input 12

Input

Yellow/Red dots

58

ALM_IN12

External alarm input 12

Input

Green/Red dots

59

ALMIN13

External alarm input 13

Input

Violet/Red dots

60

ALM_IN13

External alarm input 13

Input

Gray/Red dots

61

ALMIN14

External alarm input 14

Input

White/Red dots

62

ALM_IN14

External alarm input 14

Input

Pink/Red dots

63

ALMIN15

External alarm input 15

Input

Yellow/White

64

ALM_IN15

External alarm input 15

Input

Gray/White

65

ALMIN16

External alarm input 16

Input

Pink/White

66

ALM_IN16

External alarm input 16

Input

Brown/Black

67

WARN_NC

Warning alarm relay,


normally closed contact

Output

Blue/Black

68

WARN_NO

Warning alarm relay,


normally open contact

Output

Gray/White dots

Shelf 4

All shelves

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Connector Pin Assignments

XDM-500 Installation and


Maintenance Manual

miniRAP Connectors
Shelf DC Input Power Connectors
The shelf DC input power connectors are 3-pin D-type female connectors. The
following figure identifies the functions of the shelf DC input connector pins,
as seen when looking into the connector.

Figure B-24: miniRAP shelf DC input connector pin functions

SEVERITY IN Connector
The SEVERITY IN alarm connector is a 9-pin D-type female connector. It is
connected to the ALARMS connector of an XDM-500 shelf (see ALARMS
Connector (page B-3) for a detailed description). The following figure
identifies the connector pins, as seen when looking into the connector, and the
table lists its pin assignments.

Figure B-25: SEVERITY IN alarm connector pin identification


Table B-20: SEVERITY IN alarm connector pin assignment

B-40

Pin

Name

Function

Critical

Critical alarm input

Major

Major alarm input

Minor

Minor alarm input

Warning

Warning alarm input

Buzzer

Buzzer activation input

N/C

Not used

N/C

Not used

N/C

Not used

GND

Ground

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


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Connector Pin Assignments

SEVERITY OUT Connector


The SEVERITY OUT alarm connector is a 9-pin D-type female connector. It is
connected to the customer's alarm collecting facility. The following figure
identifies the connector pins as seen when looking into the connector, and the
table lists its pin assignments.

Figure B-26: SEVERITY OUT alarm connector pin identification


Table B-21: SEVERITY OUT alarm connector pin assignment
Pin

Name

Function

Critical_com

Critical alarm common

Critical_NO

Critical alarm NO

Major_NC

Major alarm NC

Major_com

Major alarm common

Major_NO

Major alarm NO

Critical_NC

Critical alarm NC

Minor_NO

Minor alarm NO

Minor_com

Minor alarm common

Minor_NC

Minor alarm NC

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

B-41

Connector Pin Assignments

B-42

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C
Upgrades and Expansions
In this appendix:
Overview ........................................................................................................ C-1
16- to 32-Channel Mux/DeMux Expansion ................................................... C-2
Upgrading and Expanding Optical Networks ................................................. C-3
Matrix and SDH Data Card Upgrades ............................................................ C-7

Overview
Various upgrade and expansion options are always available, given the
modular, build-as-you-grow nature of the XDM product line. This includes
matrix upgrades, SDH data card upgrades, and optical component upgrades. A
few examples are provided in this section. For more information, contact the
ECI technical support team.

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Upgrades and Expansions

XDM-500 Installation and


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16- to 32-Channel Mux/DeMux


Expansion
To expand the number of channels from 16 to 32, the two units are operated in
tandem. For this purpose, the 16-channel red band Mux/DeMux has a
Mux/DeMux for the blue band signal, which connects the blue band
Mux/DeMux to the line signal.
The following figure shows the connections needed for expanding the number
of Mux/DeMux channels from 16 to 32.

Figure C-1: Connections for 16- to 32-channel expansion

To expand from 16 to 32 channels:


1. When expansion is foreseen, design the initial configuration to include one
red band 16-channel Mux/DeMux with an expansion port.
2. When making the actual expansion, install the blue band 16-channel
Mux/DeMux, and then connect it to the expansion (UPGR) ports of the red
band Mux/DeMux (see previous figure).
3. Connect the additional channels to the blue band Mux/DeMux.
The connections can be made without disrupting the traffic transported by the
red band unit.
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Upgrading and Expanding


Optical Networks
ECI's Transport Networking Division XDM systems are modular systems that
have been specifically designed to permit incremental expansion of their
traffic-handling capacity without any disruption to the flow of traffic already
carried by the system.
Any increase in the traffic-handling capacity includes two main activities:

Expansion of the optical transport capacity among XDM sites. This is a


critical stage requiring advance planning.

Addition of equipment needed to support additional users at each site. For


example:

In XDM networks, additional users are supported by adding the


appropriate types of I/O cards (PDH, SDH, and/or data).
In integrated XDM/SYNCOM networks, additional users are supported
by adding SYNCOM platforms with appropriate optical aggregate
interfaces.
In networks with equipment from other vendors, additional users are
supported by adding equipment platforms with appropriate optical
aggregate interfaces. SDH I/O cards may also have to be added to
consolidate traffic from lower-level aggregates before transmission
over the optical network.
Software upgrading, when required. The standard implementation of
XDM sites ensures that, after the optical transport capacity expansion
has been installed, any additional user-support equipment can be added
at any time without disrupting existing traffic.

This section describes recommended procedures for preparing and


implementing the expansion of the XDM optical transport capacity in a way
that takes advantage of its built-in non-traffic-affecting capabilities. These
procedures primarily apply to XDM systems and integrated XDM/SYNCOM
networks.

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Outline of Optical Traffic Capacity Expansion


Activities
To take advantage of the XDM non-traffic-affecting expansion capabilities, it
is necessary during the initial system planning stages to plan ahead and prepare
the infrastructure needed for future expansion.
Planning activities must consider the following aspects:

Planning the optical network for the capacity required initially. This must
take into consideration the allocation of wavelengths necessary to meet the
initial traffic capacity requirements and the power budget for optical
amplifiers.

Planning the network for the additional capacity envisioned at each


expansion stage with respect to additional wavelengths and power budget,
up to the maximum available capacity.

Planning the external infrastructure needed at each stage. An important


aspect of this activity is to lay out enough fibers to support the maximum
planned capacity, because in networks using large numbers of wavelengths
it is not possible to add fibers without disrupting existing traffic.
NOTE: One possible approach to expansion is to start

network operation using only channels in the red band, and


then add channels in the blue band. See, for example, the 16
to 32 channels expansion method explained in the XDM-1000
Product Line Reference Manual.

C-4

Planning the equipment installation requirements at each site in accordance


with the site installation plans. This includes:

Number and type of XDM platforms and equipment racks needed for
the initial site capacity.

Number and type of XDM platforms and equipment racks needed for
the final (maximum) site capacity.

Distribution of transponders and ancillary units in the platforms, taking


into consideration that it is necessary to leave enough empty slots to
accommodate the number of wavelengths that must be added at each
expansion stage.

Number of ODFs needed for the final (maximum) site capacity.

Planning and installing the full optical cabling for the final (maximum)
site capacity. This includes the fibers needed to carry the local
customer's signals to the ODFs, the fibers between the ODFs and the
transponders, and from the transponders to the optical support modules
(OADMs and DWDM modules).

Planning the site power and cooling requirements for the final
(maximum) site capacity.

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Upgrades and Expansions

The site configurations for each expansion stage must be fully documented in
the network and site installation manuals, in accordance with the standard
procedures.
NOTE: ECI recommends documenting the installation details

for each site and network installation. The documentation


should include the site survey information, rack and platform
diagrams, connections table, platform slot assignment
information, and network planning inputs. The documentation
should be updated after each change in the network.

If you are interested in obtaining design assistance or a network installation


plan from ECI's Customer Support team, contact your ECI sales representative.

Expansion Process
The actual expansion process is based on the preplanned expansion steps
described in the installation procedures. The following required activities are
listed in the order of execution.
To expand your system:
1. Insert additional transponder cards in the XDM platforms in accordance
with the installation procedures.
2. Perform a preliminary configuration of the transponders (slot assignment
definition and wavelength setting) using the LCT-XDM.
3. Use an OPM to measure optical output power (see "Measuring Optical
Levels" page 8-8).
NOTE: Record all the measurement results in the
commissioning document.

4. Connect the transponder to the required channel to the OADM by


connecting the corresponding fibers to the appropriate OADM connectors,
according to the wavelength indicated in the connector labels.
5. Perform an optical measurement of the link optical levels at the optical
monitor points, using an OPM card or an optical spectrum analyzer.
6. Before connecting live traffic, perform a 12-hour stability test for each new
optical trail.

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Expansion Checklist
The following checklist is provided to help execute the expansion activities:
1. Check wavelength availability on the optical link.
2. Check that the link power budget does not exceed the specification of any
optical trail.
3. Check slot availability in the XDM platforms.
4. Check the installation records.
5. Check the required optical fibers:

Between the customer's equipment and the ODF

Between the ODF and each transponder card

Between each transponder card and the corresponding OADM


6. Insert each transponder card in the prescribed slot.
7. Use the LCT-XDM to configure the slot assignment and wavelength setting
of each transponder card.
8. Check the optical output power of each transponder with an OPM.
9. Connect the customer's equipment to the transponders.
10. Update the power control parameters in accordance with the new
equipment configuration.
11. Connect the transponders to the OADM or Mux/DeMux connectors.
12. Using an optical spectrum analyzer or an OPM card, check each output for
proper wavelength and required power, and check the OSNR on the line.
Record the test results in the commissioning document.
13. Perform the 12-hour stability check. Record the results in the
commissioning document.
14. Record the changes at each site in the installation documentation.

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Upgrades and Expansions

Matrix and SDH Data Card


Upgrades
ECI offers the option of upgrading your current HLXC384 to the more
powerful HLXC768 matrix. Similarly, you could choose to increase capacity
by replacing up to four SIO16_2 cards with the greater capacity of an SIO164
card. The data card upgrade is non-traffic affecting, and has been simplified
with the XDM's automatic Move Trails feature, with which active traffic trails
can be moved automatically from the old cards to the new card.
The SDH advanced service cards support a convenient trail shift capability that
enables operators to transfer SDH links (STMx) from one slot to another within
the same platform. All SDH link configurations and XCs are preserved. SDH
links are moved to a new service card by an on-site ECI technical team, with no
interruption in service, leaving the original service card free for other use or for
upgrading, depending on operator preferences.
The ability to easily move SDH links to a different service card allows
operators to allocate their platform slots more efficiently. More important, the
move trails feature allows operators to replace their current cards with
higher-capacity cards and increase bandwidth as needed, based on service
demand, with no interruption to service and no need to add extra platforms for
more slots. For example, the move trails feature would allow operators to
increase the line rate from STM-16 (2.5 Gbps) to STM-64 (10 Gbps), simply
by switching the STM-16 trails in a single movement to one STM-64 link. Note
that link trails must be moved simultaneously on both sides of the link. For
more information, speak to the ECI technical support team.

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C-7

Upgrades and Expansions

C-8

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D
Integrating XDM
Equipment in SYNCOM
Networks
In this appendix:
Overview ........................................................................................................ D-1
Network Implementation Considerations ....................................................... D-2
Network Timing Considerations .................................................................... D-5
Network Management Considerations ........................................................... D-5
Recommended Integration Procedures ........................................................... D-8

Overview
This appendix provides recommendations and guidelines for integrating XDM
equipment in existing SYNCOM networks.
The information presented in this appendix assumes familiarity with the
technical characteristics and management capabilities of SYNCOM and XDM
equipment. Refer to the equipment management user manuals for additional
information and detailed management procedures.

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Integrating XDM Equipment in


SYNCOM Networks

XDM-500 Installation and


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Network Implementation
Considerations
Existing SYNCOM networks can benefit from the addition of XDM equipment
in two ways:

By using the optical transport capabilities of the XDM to carry SYNCOM


payload. This approach leads to limited integration between the XDM and
SYNCOM networks (see "Using XDM Equipment to Transport SYNCOM
Traffic" page D-2).

By using the whole range of XDM capabilities to carry and distribute


payload traffic originating at SYNCOM equipment, as well as traffic
originating at XDM equipment. This approach leads to full integration of
XDM equipment into the existing SYNCOM network, and results in an
integrated network with expanded capabilities and flexibility.

Using XDM Equipment to Transport SYNCOM


Traffic
The XDM can be used to transparently transport traffic originating in
SYNCOM equipment. In a typical implementation, the SYNCOM optical
aggregate ports are connected to the XDM transport network through an
OADM facility.
SYNCOM equipment has STM-4 and STM-16 optical aggregate ports (these
ports are located on ASF4 and ASF16 cards, respectively). Both types of ports
can be connected to TRP25_2 transponders. When XDM and SYNCOM
equipment is located at the same site, the XDM transponders and the
SYNCOM optical ports can be equipped with low-cost intra-office interfaces.
When the SYNCOM equipment is connected through an OADM, the
SYNCOM optical aggregate signals are transparently transferred without
passing through an HLXC or XIO card in the XDM platform. Since the XDM
HLXC or XIO cards do not process the SYNCOM signals, the XDM platform
need not be equipped with such cards for the sole purpose of supporting
SYNCOM signals. Therefore, XDM-2000 shelves can also be used for housing
the OADM.
The implementation described above is suitable for applications in which XDM
equipment is phased in parallel with the existing SYNCOM network, or when
an XDM network is overlaid on the existing SYNCOM network. The only
XDM network planning requirement specific for this application is to provide
the capacity needed for transporting the SYNCOM signals.

D-2

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Integrating XDM Equipment in


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Building an Integrated Network


In an integrated network, XDM shelves are installed at various locations and
connected to SYNCOM equipment. Given the topological characteristics of
communication networks that concentrate equipment in communication nodes,
the XDM equipment is effectively inserted into links between existing
SYNCOM network nodes.
In integrated networks, therefore, the SYNCOM aggregate signals are handled
as payload connected to XDM I/O cards and routed through the HLXC or XIO
cards. As a result, XDM-1000, XDM-500, and XDM-400 shelves are
recommended for installing the XDM cards, although XDM-2000 shelves can
also be used if necessary.
The following are the cards needed for interconnecting SYNCOM and XDM
equipment:

At the STM-16 level: Connect an ASF16 optical aggregate port to an I/O


port of the SIO16_XX card.

At the STM-4 level: Connect an ASF4 optical aggregate port to an STM-4


I/O port of an SIO1&4_XX or XIO card.

At the STM-1 level:

For optical interfacing: Connect an ATRO or SDM-1 optical


aggregate port or TRSO optical tributary port to an optical I/O port of
an SIO1&4_XX or XIO card.
For electrical interfacing: Connect an ATRE electrical aggregate port or
TRSE electrical tributary port to an electrical I/O port of the
SIO1&4_XX card. The connection requires the installation of an
MI1_16 electrical interface module.
At the E1 level: Connect SYNCOM E1 interfaces to XDM E1
interfaces (via M2_84 or M2_21 interface modules). The physical
connection can be facilitated using patch panels of the type described in
the XDM-1000 Product Line Reference Manual and XDM System
Specifications. The following figure shows a rack layout with a typical
patch panel.

A link through the XDM network is not necessarily symmetrical, that is,
between endpoints at the same level. For example, an SYNCOM STM-4
endpoint can be connected through an ASF16 aggregate to an XDM
SIO16_XX or XIO card and dropped through an XDM SIO1&4_XX or XIO
STM-4 port.

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Integrating XDM Equipment in


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XDM-500 Installation and


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The XDM equipment used in an integrated network permits consolidation of


SYNCOM traffic, and in particular enables better utilization of existing fibers
as XDM equipment using SIO64_XX cards can transmit at up to 10 Gbps
(STM-64/OC-192) per fiber.

Figure D-1: Typical rack layout with a patch panel

D-4

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Network Timing Considerations


When XDM equipment is integrated into an existing SYNCOM network (see
"Building an Integrated Network" page D-3), the existing flow of timing
signals should not be changed. Therefore, the XDM network must be
configured to lock its timing to the SYNCOM network timing.
This can readily be achieved by supplying T3 timing signals from the
SYNCOM equipment to one of the XDM shelves, and configuring the XDM
network for using this timing reference.
For reliability, it is recommended to select two points of connection to
SYNCOM timing signals to ensure that, in case of a transmission fault in the
network (for example, fiber damage), an alternative path for timing signals is
available. Therefore, each XDM platform must be configured to use the signal
from the preferred source as the highest priority source, and the signal from the
alternative source as the next priority.

Network Management
Considerations
An XDM network has its own management facilities, and therefore it can
always be managed independently of the SYNCOM network. However, any
existing SYNCOM network has a management infrastructure deployed with
significant investments in establishing the required facilities and procedures.
Therefore, when XDM equipment is integrated into the network, it is necessary
to integrate the XDM management functions as smoothly as possible into those
of the existing network.
Follow these main guidelines:

Provide appropriate management communication paths.

Provide compatible management functionality and integrate the


management functionality of the two networks.

Prevent problems that may occur when the traffic flows through different
types of equipment.

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D-5

Integrating XDM Equipment in


SYNCOM Networks

XDM-500 Installation and


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Flow of Management Traffic


SYNCOM NEs support two basic types of management communication:

Inband management communication through the DCC SDH overhead


channel. Each SYNCOM NE can be configured to use either the RS-DCC
or the MS-DCC; this selection applies to all its ports.

Out-of-band management communication. This approach uses an


independent DCN to provide communication paths between the
out-of-band management ports of SYNCOM shelves and SYNCOM
management facilities.

XDM NEs support the same basic types of management communication and in
addition has an optical supervisory channel (OSC) that uses a separate optical
carrier to carry the management channel through the fibers used to carry the
payload, without occupying wavelengths in the payload bands. Note, however,
that for XDM NEs, the type of DCC used for management (RS-DCC or
MS-DCC) is independently selected for each port.
Most SYNCOM networks use the DCC for management communication.
Therefore, when an XDM NE is integrated in an SYNCOM network, it must
also use the DCC for management communication. This is always possible,
provided the following conditions are met:

D-6

An XDM NE is inserted in a SYNCOM link that carries the DCC


accessed by the management station (that is, one of the XDM platform
ports is connected to a SYNCOM port that carries the DCC accessed by the
management station).

The XDM NE is configured to cross connect the DCC between the relevant
ports. Make sure to check the type of DCC used by the SYNCOM NE RS-DCC or MS-DCC.

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Management Facilities for Integrated


Networks
SYNCOM NEs are managed by the EMS-SYNCOM management system and
XDM NEs are managed by the EMS-XDM. EMS-SYNCOM and EMS-XDM
may be integrated under the LightSoft NMS. Information regarding these
management systems is provided in the related documentation listed in the
section About This Manual.
To support integrated networks, the latest software versions should be used:

SYNCOM NEs require embedded software version 8.0.

SDM-1 NEs require embedded software version 7.5.

EMS-XDM systems require software version 4.0 or higher.


NOTE: The preliminary configuration of XDM NEs is

performed using an LCT-XDM terminal. The LCT-XDM


terminal functionality is described in the LCT-XDM User
Manual.

The EMS-XDM can be installed on a separate station or on the same station


running the EMS-SYNCOM or LightSoft applications. If a separate EMSXDM station is used, it must be configured as a slave manager of LightSoft.
Because of the critical functions performed by management facilities, it is
necessary to use special methods based on equipment redundancy and
alternative management communication facilities to increase their availability,
and ensure that management capabilities are not affected by transmission or
equipment faults.
Networks integrating SYNCOM and XDM NEs can use the remote database
replication (RDR) approach. The RDR uses two management stations:

At any time, one of these stations serves as the primary station and actively
manages the NEs.

The other station, the mirror station, does not manage the NEs but is
continuously in session with the primary station. The primary station
updates the mirror station database to keep it synchronized with its
database.

Therefore, at any time only one station manages the network, but the other
station can take over immediately when the primary station or its management
communication links fail.

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Integrating XDM Equipment in


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XDM-500 Installation and


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Preventing Configuration Problems in the


Integrated Network
This section presents several issues related to the configuration of the
SYNCOM and XDM equipment to ensure interoperability. This is in addition
to the standard configuration and management procedures for each equipment
family.

The first issue is ensuring continuity of the DCC throughout the integrated
network (see "Flow of Management Traffic" page D-6).

The second issue is related to alarm severity configuration requirements for


XDM ports. XDM NEs, which are used in networks with large numbers of
trails, support the J0 trace string (part of the SDH overhead) because it can
help detect routing errors.
SYNCOM NEs do not support the J0 trace string. Therefore, any XDM
port carrying traffic from SYNCOM ports must be specifically configured
to ignore the J0 string because this is not the default. If the detection of the
J0 string is not cancelled, the port generates a Trace Id Mismatch alarm
and stops transferring the traffic received from the SYNCOM equipment.
The relevant alarm configuration parameter is RS-Snk, appearing in the
port alarm Severity Assignment window. Make the following selections:

Set the Trace Id Mismatch alarm to NonRep.


Select Inhibit for all the Consequent Actions (for example,
downstream AIS and RDI).

Recommended Integration
Procedures
This section presents a checklist of the tasks needed for a smooth integration of
XDM equipment in SYNCOM networks.
Use this checklist to supplement the normal network planning activities.
1. Update the embedded software versions of the various equipment units as
follows:

SYNCOM NEs to version 8.0

SDM-1 NEs to version 7.5

XDM NEs to version 4.0 or higher


2. Update the software versions of the various management applications as
follows:

All the eNM applications to EMS-SYNCOM

EMS-XDM applications to version 4.0 or higher

Install LightSoft if needed


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Integrating XDM Equipment in


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3. If the current management backup configuration is not based on the RDR


method, plan and implement the required changes.
4. Install any additional infrastructure needed for expanding the management
network to include the XDM equipment.
5. Install the XDM equipment in accordance with the network expansion plan.
6. Perform the preliminary configuration of the XDM equipment by means of
the LCT-XDM.
7. Perform the activities needed to enable the EMS-XDM station to manage
the XDM NEs in the integrated network.
8. Create the additional NEs (the XDM NEs) on the LightSoft station to
reflect the new network topology.
9. Create the new trails in the integrated network. This activity is facilitated
by enabling the use of automatic creation of server trails in response to the
insertion of an NE in an existing link.
10. Configure the timing sources and their priorities for each element in the
integrated network.
11. Perform a check of the management capabilities in the integrated network.

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D-10

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E
Slot Designation
Conversion Table
In this appendix:
Slot Designation Conversion Table .................................................................E-1

Slot Designation Conversion


Table
This appendix provides the recommended list of codes for identifying XDM
platform slots instead of the standard slot designations.
Table E-1: Conversion from XDM-1000 slot marking to slot codes
Actual slot
marking

Slot code number

Actual slot
marking

Slot code number

PW1

101

13

304

PW2

102

14

305

M1

201

15

306

M2

202

16

307

M3

203

C1

308

M4

204

C2

309

M5

205

17

310

M6

206

18

311

M7

207

19

312

M8

208

110

313

M9

209

111

314

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Slot Designation Conversion Table

XDM-500 Installation and


Maintenance Manual

Actual slot
marking

Slot code number

Actual slot
marking

Slot code number

M10

210

112

315

M11

211

X2

316

C0

300

F1

401

X1

301

F2

402

11

302

F3

403

12

303

Table E-2: Conversion from XDM-500 slot marking to slot codes

E-2

Actual slot marking

Slot code number

PW1

101

PW2

102

X1

201

C1

202

C2

203

IC1

204

IC2

205

IC3

206

MC1

207

MC2

208

MC3

209

MC4

210

IC4

211

IC5

212

IC6

213

X2

214

C0

300

F1

301

F2

302

F3

303

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F
Standards and References
In this appendix:
Overview ......................................................................................................... F-1
Broadband Forum ............................................................................................ F-1
Environmental Standards ................................................................................. F-2
ETSI: European Telecommunications Standards Institute .............................. F-2
IEC: International Electrotechnical Commission ............................................ F-3
IEEE: Institute of Electrical and Electronic Engineers.................................... F-4
IETF: Internet Engineering Task Force ........................................................... F-5
ISO: International Organization for Standardization ....................................... F-7
ITU-T: International Telecommunication Union ............................................ F-7
MEF: Metro Ethernet Forum ......................................................................... F-12
NIST: National Institute of Standards and Technology................................. F-12
North American Standards ............................................................................ F-13
OMG: Object Management Group ................................................................ F-14
TMF: TeleManagement Forum ..................................................................... F-14
Web Protocol Standards ................................................................................ F-14

Overview
The following is a list of standards and reference documents that relate to the
XDM platform families. The standards are listed alphabetically by groups.

Broadband Forum

Af-phy-0064.000 ATM Forum E1 Physical Layer Interface.

Af-phy-0086.000 ATM Forum IMA V1.0.

Af-phy-0086.001 ATM Forum IMA V1.1.

Af-phy-00121.00 ATM Forum Traffic Management Specifications V4.1.

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F-1

Standards and References

XDM-500 Installation and


Maintenance Manual

Environmental Standards

EuP Directive 2005/32/EC: Ecodesign Requirements for Energy-Using


Products.

OHSAS 18001: Occupational Health and Safety Management Systems Requirements.

REACh Directive 2005/32/EC: Registration, Evaluation, Authorization,


and Restriction of Chemicals.

RoHS Directive 2005/747/EC: Restriction of the Use of Certain Hazardous


Substances in Electrical and Electronic Equipment.

WEEE Directive 2002/96/EC: Waste from Electrical and Electronic


Equipment.

ETSI: European
Telecommunications Standards
Institute

F-2

EN 300 019-1-1 Class 1.2: Environmental Engineering (EE);


Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-1: Classification of Environmental
Conditions; Storage.

EN 300 019-1-2 Class 2.3: Environmental Engineering (EE);


Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-2: Classification of Environmental
Conditions; Transportation.

EN 300 019-1-3 Classes 3.2 and 3.3: Environmental Engineering (EE);


Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 1-3: Classification of Environmental
Conditions; Stationary use at weather-protected locations.

EN 300 019-2-4 Class 4.1: Environmental Engineering (EE);


Environmental Conditions and Environmental Tests for
Telecommunications Equipment; Part 2-4: Specification of Environmental
Tests; Stationary use at non-weather-protected locations.

EN 300 132 -2: Environmental Engineering (EE); Power Supply Interface


at the Input to Telecommunications Equipment.

EN 300-166: Physical and electrical characteristics of hierarchical digital


interfaces for equipment using the 2 048 kbit/s based plesiochronous or
synchronous digital hierarchies.

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XDM-500 Installation and


Maintenance Manual

Standards and References

EN 300 386: Electromagnetic compatibility and Radio spectrum Matters


(ERM); Telecommunication network equipment; Electromagnetic
Compatibility (EMC) requirements.

EN 300-417-2-1: Transmission and Multiplexing (TM); Generic


requirements of transport functionality of equipment.

EN 300-417-5-1: Generic requirements of transport functionality of


equipment.

EN 300-462-5-1: Transmission and Multiplexing (TM); Generic


requirements for synchronization networks.

EN 300-689: 34 Mbit/s digital leased lines (D34U and D34S); Terminal


equipment interface.

EN 301-164: SDH leased lines connection characteristics.

EN 301-165: SDH leased lines Network and Terminal interface


presentation.

EN 55022: Radio Disturbance Characteristics of Information Technology


Equipment.

ETR 114: Functional Architecture of SDH Transport Networks.

ETR 275: Considerations on Transmission Delay and Transmission Delay


value for components on connections supporting speech communication
over evolving digital networks.

FTZ 1TR9: Deutsche Telekom A.G. EMC Requirements.

FTZ 153 TL 1part 1: Synchronous Multiplexing Equipment (SM) for


Synchronous Multiplex Hierarchy.

IEC: International
Electrotechnical Commission

IEC 68: Environmental Testing.

IEC 917: Modular Order for the Development of Mechanical Structures for
Electronic Equipment Practices.

IEC 3309: Information Technology Telecommunications and Information


Exchange between Systems High-Level Data Link Control (HDLC)
Procedures Frame Structure.

IEC 9314-3: Information Processing Systems - Fiber Distributed Data


Interface (FDDI) Multiplex.

IEC 9595, Information Technology: Open Systems Interconnection,


Common Management Information Services.

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ECI Telecom Ltd. Proprietary

F-3

Standards and References

XDM-500 Installation and


Maintenance Manual

IEC 9596, Information Technology: Open Systems Interconnection,


Common Management Information Protocol.

IEC 13239: Information technology Telecommunications and


information exchange between systems High-level data link control
(HDLC) procedures.

IEC 17025: General Requirements for Competence of Testing and


Calibration Laboratories.

IEC 60825-1: Safety of Laser Products Part 1: Equipment Classification


and Requirements.

IEC 60825-2 (AS/NZS 2211.2): Safety of Laser Products Part 2: Safety


of Optical Fiber Communication System (OFCS).

IEC/EN/UL 60950-1: Information Technology Equipment - Safety General Requirements.

IS 1249-1: Safety of Laser products: Equipment classification requirements


and users guide.

IEEE: Institute of Electrical and


Electronic Engineers

F-4

IEEE 802.1ad: Virtual Bridged Local Area NetworksRevision


Amendment 4: Provider Bridges.

IEEE 802.1ag: Virtual Bridged Local Area Networks Amendment 5:


Connectivity Fault Management.

IEEE 802.1D: Media access control (MAC) Bridges (Incorporates IEEE


802.1t and IEEE 802.1w).

IEEE 802.1P: Traffic Class Expediting and Dynamic Multicast Filtering.

IEEE 802.1Q: Virtual Bridged Local Area NetworksRevision.

IEEE 802.1w: Rapid Reconfiguration of Spanning Tree.

IEEE 802.3: Carrier Sense Multiple Access with Collision Detection


(CSMA/CD) Access Method and Physical Layer Specifications.

IEEE 802.3ad: Link Aggregation.

IEEE 802.3ah: Ethernet in the First Mile (Link OAM).

IEEE 802.3x: Full Duplex Operation and Flow Control Protocol.

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


Maintenance Manual

Standards and References

IETF: Internet Engineering Task


Force

RFC 1493: Definition of Managed Objects for Bridges.

RFC 1643: Ethernet-like Interfaces.

RFC 1662: PPP in HDLC-Life Framing.

RFC 1757: Remote Network Monitoring Management Information Base.

RFC 1823: LDAP Application Program Interface (API).

RFC 1901: Introduction to Community-based SNMPv2.

RFC 2108: Definitions of Managed Objects for IEEE 802.3 Repeater


Devices using SMIv2.

RFC 2251: Lightweight Directory Access Protocol (v3) [specification of


the LDAP on-the-wire protocol].

RFC 2252: Lightweight Directory Access Protocol (v3): Attribute Syntax


Definitions.

RFC 2253: Lightweight Directory Access Protocol (v3): UTF-8 String


Representation of Distinguished Names.

RFC 2254: The String Representation of LDAP Search Filters.

RFC 2255: The LDAP URL Format.

RFC 2256: A Summary of the X.500(96) User Schema for use with
LDAPv3.

RFC 2401: Security Architecture for the Internet Protocol.

RFC 2409: Internet Key Exchange Protocol (IKE).

RFC 2474: Definition of the Differentiated Services Field (DS Field) in the
IPv4 and IPv6 Headers.

RFC 2597: Assured Forwarding PHB Group.

RFC 2615: PPP over SONET/SDH.

RFC 2665: Definitions of Managed Objects for the Ethernet-like Interface


Types.

RFC 2674: Bridge MIB with VLAN/Traffic Classes/Multicast Extensions.

RFC 2702: Requirements for Traffic Engineering Over MPLS.

RFC 2737: Entity MIB (Version 2).

RFC 2819: Remote Network Monitoring Management Information Base.

RFC 2829: Authentication Methods for LDAP.

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ECI Telecom Ltd. Proprietary

F-5

Standards and References

F-6

XDM-500 Installation and


Maintenance Manual

RFC 2830: Lightweight Directory Access Protocol (v3): Extension for


Transport Layer Security.

RFC 2863: Interfaces Group MIB.

RFC 3014: Notification Log MIB.

RFC 3031: Multiprotocol Label Switching Architecture.

RFC 3032: MPLS Label Stack Encoding.

RFC 3246: An Expedited Forwarding PHB (Per-Hop Behavior).

RFC 3270: Multi-Protocol Label Switching (MPLS) Support of


Differentiated Services.

RFC 3377: Lightweight Directory Access Protocol (v3): Technical


Specification.

RFC 3411: SNMP Framework MIB.

RFC 3414: SNMP User-Based SM MIB.

RFC 3415: SNMP Vies-Based ACM MIB.

RFC 3443: Time To Live (TTL) Processing in Multi-Protocol Label


Switching (MPLS) Networks.

RFC 3812: Multiprotocol Label Switching (MPLS) Traffic Engineering


(TE) Management Information Base (MIB).

RFC 3813: Multiprotocol Label Switching (MPLS) Label Switching Router


(LSR) Management Information Base (MIB).

RFC 3916: Requirements for Pseudo-Wire Emulation Edge-to-Edge


(PWE3).

RFC 3985: Pseudo Wire Emulation Edge-to-Edge (PWE3) Architecture.

RFC 4090: Fast Reroute Extensions to RSVP-TE for LSP Tunnels.

RFC 4125: Maximum Allocation Bandwidth Constraints Model for


Diffserv-aware MPLS Traffic Engineering.

RFC 4126: Max Allocation with Reservation Bandwidth Constraints Model


for Diffserv-aware MPLS Traffic Engineering & Performance
Comparisons.

RFC 4379: Detecting Multi-Protocol Label Switched (MPLS) Data Plane


Failures.

RFC 4448: Encapsulation Methods for Transport of Ethernet over MPLS


Networks.

RFC 5462: Multiprotocol Label Switching (MPLS) Label Stack Entry:


"EXP" Field Renamed to "Traffic Class" Field.

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


Maintenance Manual

Standards and References

IETF Drafts:

draft-ietf-l2vpn-vpls-ldp.

draft-ietf-l2vpn-vpls-mcast-reqts.

draft-ietf-magma-snoop.

draft-ietf-mpls-rsvp-te-p2mp.

draft-ietf-mpls-tp-nm-framework.

draft-ietf-mpls-tp-nm-req.

draft-ietf-pwe3-ethernet-encap.

draft-martini-l2circuit-encap-mpls.

draft-sajassi-l2vpn-vpls-multicast-congruency.

draft-vasseur-mpls-backup-computation.

ISO: International Organization


for Standardization

A2LA: Accredited Laboratory for Electrical and Mechanical Testing.

ISO 9001: Quality Management System Requirements.

ISO 14001: Environmental Management Systems Requirements With


Guidance for Use.

ISO 27001: Information Security Management Systems Requirements.

TL 9000, QuEST Forum: Quality Management System Requirements &


Measurements Handbooks for the Telecom Industry.

ITU-T: International
Telecommunication Union

G.650: Definition and Test Methods for the Relevant Parameters of


Single-Mode Fibers.

G.651: Characteristics of a 50/125 m Multimode Graded Index Optical


Fiber Cable.

G.652: Characteristics of a Single-Mode Optical Fiber Cable.

G.653: Characteristics of a Dispersion-Shifted Single-Mode Optical Fiber


Cable.

G.654: Characteristics of a Cut-off Shifted Single-Mode Optical Fiber


Cable.

417006-2304-0H3-B02

ECI Telecom Ltd. Proprietary

F-7

Standards and References

F-8

XDM-500 Installation and


Maintenance Manual

G.655: Characteristics of a Non-Zero Dispersion Shifted Single-Mode


Optical Fiber Cable.

G.661: Definition and Test Methods for the Relevant Generic Parameters of
Optical Amplifier Devices and Subsystems.

G.662: Generic Characteristics of Optical Fiber Amplifier Devices and


Subsystems.

G.663: Application Related Aspects of Optical Fiber Amplifier Devices


and Subsystems.

G.664: Optical Safety Procedures and Requirements for Optical Transport


Systems.

G.671: Transmission Characteristics of Passive Optical Components.

G.691: Optical Interfaces for Single Channel SDH Systems with Optical
Amplifiers and STM-64 Systems (Draft).

G.692: Optical Interfaces for Multi-Channel Systems with Optical


Amplifiers.

G.694.1: Spectral Grids for WDM Applications: DWDM Frequency Grid.

G.694.2: Spectral Grids for WDM Applications: CWDM Wavelength Grid.

G.695: Optical Interfaces for Coarse Wavelength Division Multiplexing


Applications.

G.703: Physical/Electrical Characteristics of Hierarchical Digital


Interfaces.

G.704: Synchronous Frame Structures Used at 1544, 6312, 2048, 8448 and
44 736 kbps Hierarchical Levels.

G.706: Frame Alignment and CRC Procedures Relating to Basic Frame


Structure Defined in Rec G.704.

G.707: Network Node Interface for the Synchronous Digital Hierarchy.

G.709: Interfaces for the Optical Transport Network (OTN).

G.752: Characteristics of digital multiplex equipments based on a second


order bit rate of 6312 kbit/s and using positive justification.

G.772: Protected Monitoring Points Provided on Digital Transmission


Systems.

G.774 & G774.n: SDH Information Model.

G.775: Loss of Signal (LOS), Alarm Indication Signal (AIS) and Remote
Defect Indication (RDI) defect detection and clearance criteria for PDH
signals.

G.781: Synchronization Layer Functions.

G.783: Characteristics of SDH Equipment Functional Blocks.

G.784: Synchronous Digital Hierarchy (SDH) Management.


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XDM-500 Installation and


Maintenance Manual

Standards and References

G.798: Characteristics of OTN Hierarchy Equipment Functional Blocks.

G.803: Architectures of Transport Networks based on the Synchronous


Digital Hierarchy.

G.805: Generic Functional Architecture of Transport Networks.

G.806: Characteristics of Transport Equipment Description Methodology


and Generic Functionality.

G.809: Functional Architecture of Connectionless Layer Networks.

G.811: Timing Characteristics of Primary Reference Clocks.

G.812: Timing Requirements of Slave Clocks Suitable for Use as Node


Clocks in Synchronization Networks.

G.813: Timing Characteristics of SDH Equipment Slave Clocks (SEC).

G.823: The Control of Jitter and Wander within Digital Networks Based on
the 2048 kbit/s Hierarchy.

G.825: The Control of Jitter and Wander within Digital Networks Based on
the SDH (Draft).

G.8251: The Control of Jitter and Wander within the Optical Transport
Network (OTN).

G.826: Error Performance Parameters and Objectives for International,


Constant Bit Rate Digital Paths at or above the Primary Rate.

G.828: Error Performance Parameters and Objectives for International,


Constant Bit Rate Synchronous Digital Paths.

G.829: Error Performance Events for SDH Multiplex and Regenerator


Sections.

G.831: Management Capabilities of Transport Networks Based on the


Synchronous Digital Hierarchy (SDH).

G.841: Types and Characteristics of SDH Network Protection


Architectures.

G.842: Inter-Working of SDH Protection Architectures.

G.872: Architecture of Optical Transport Networks.

G.874: Management Aspects of the Optical Transport Network Element.

G.874.1: Optical Transport Network (OTN): Protocol-Neutral Management


Information Model for the Network Element View.

G.957: Optical Interfaces for Equipment and Systems relating to the


Synchronous Digital Hierarchy.

G.959.1: Optical Transport Network Physical Layer Interfaces.

G.975: Forward Error Correction for Submarine Systems.

G.985: 100 Mbit/s point-to-point Ethernet based optical access system.

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ECI Telecom Ltd. Proprietary

F-9

Standards and References

F-10

XDM-500 Installation and


Maintenance Manual

G.7041: Generic Framing Procedure (GFP).

G.7042: Link Capacity Adjustment Scheme (LCAS) for Virtual


Concatenated Signals.

G.7713: Distributed Connection Management.

G.7713.2: RSVP-TE Implementation.

G.7714: Generalized Automatic Discovery Techniques.

G.7714.1: Protocol for Automatic Discovery in SDH & OTN network.

G.7715: ASON Routing.

G.7715.1: Based on PNNI, OSPF or IS_IS.

G.8001/Y.1354: Terms and definitions for Ethernet frames over transport.

G.8010/Y.1306: Architecture of Ethernet Layer Networks.

G.8011/Y.1307: Ethernet Services Framework.

G.8011.1/Y.1307.1: Ethernet Private Line Service.

G.8011.2/Y.1307.2: Ethernet Virtual Private Line Service.

G.8012/Y.1308: Ethernet UNI and Ethernet NNI.

G.8080/Y.1304: Architecture for the automatically switched optical


network (ASON)

G.8201/Y.1354: Error performance parameters and objectives for multioperator international paths within the Optical Transport Network (OTN)

G.8261/Y. 1361: Timing and synchronization aspects in packet network.

G.8262/Y. 1362: Timing characteristics of synchronous Ethernet


equipment slave clock (EEC).

G.8080: Architecture for ASON.

I.356: ATM Layer Cell Transfer Performance.

I.361: ATM Layer Specification.

I.371: Traffic Control and Congestion Control.

I.610: ATM Operation and Maintenance Principles.

M.2140: Transport Network Event Correlation.

M.3010: Principles for a Telecommunications Management Network.

M.3013: Considerations for a Telecommunications Management Network.

M.3016.0: Security for the management plane: Overview.

M.3017: Framework for the integrated management of hybrid circuit/packet


networks.

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


Maintenance Manual

Standards and References

M.3100: Generic Network Information Model.

M.3180: Catalogue of TMN Management Information.

M.3200: TMN Management Services and Telecommunications Managed


Areas: Overview.

M.3300: TMN F Interface Requirements.

M.3400: TMN Management Functions.

Q.821: Alarm Surveillance.

Q.822: Performance Monitoring.

X.217: Open Systems Interconnection, Service Definition for the


Association Control Service Element.

X.219: Remote Operations - Model, Notation and Service Definition.

X.227: Open Systems Interconnection, Connection-Oriented Protocol for


the Association Control Service Element - Protocol Specification.

X.229: Remote Operations: Protocol Specification.

X.710: Open Systems Interconnection, Common Management Information


Service.

X.720: Open Systems Interconnection, Structure of Management


Information - Management Information Model.

X.721 Information Technology: Open Systems Interconnection, Structure


of Management Information - Definition of Management Information.

X.722: Open Systems Interconnection, Structure of Management


Information - Guidelines for the Definition of Managed Objects.

X.731: Open Systems Interconnection, Systems Management - State


Management Function.

X.733: Open Systems Interconnection, Systems Management - Alarm


Reporting Function.

X.743: Open Systems Interconnection, Systems Management - Time


Management Function.

X.744: Open Systems Interconnection, Systems Management - Software


Management Function.

Y.1311: Network-based VPNs - Generic architecture and service


requirements.

Y.1710: Requirements for Operation & Maintenance functionality for


MPLS networks.

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ECI Telecom Ltd. Proprietary

F-11

Standards and References

XDM-500 Installation and


Maintenance Manual

Y.1711: Operation & Maintenance mechanism for MPLS networks.

Z.351: Data oriented human-machine interface specification technique


introduction.

Z.352: Data oriented human-machine interface specification technique


scope, approach and usage.

Z.361: Design guidelines for Human-Computer Interfaces (HCI) for the


management of telecommunications networks.

MEF: Metro Ethernet Forum

MEF4 Metro Ethernet Network Architecture Framework Part 1: Generic


Framework.

MEF6 Metro Ethernet Services Definitions.

MEF7 EMS-NMS Information Model.

MEF9 Test Suite for Ethernet Services at the UNI.

MEF10 Ethernet Service Attributes.

MEF11 User Network Interface (UNI) Requirements and Framework.

MEF12 Metro Ethernet Network Architecture Framework Part 2: Ethernet


Services Layer.

MEF14 Test Suite for Ethernet Traffic Management.

MPLS-TP Network Management requirements (draft-ietf-mpls-tp-nm-req)

MPLS-TP NM Framework (draft-ietf-mpls-tp-nm-framework)

NIST: National Institute of


Standards and Technology

F-12

FIPS PUB 197: Advanced Encryption Standard (AES).

FIPS PUB 140-2: Security Requirements for Cryptographic Modules.

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


Maintenance Manual

Standards and References

North American Standards

ANSI FCF1-2: Fiber Channel Physical Interface REV 10.

ANSI T1.102: Digital hierarchy electrical interface.

ANSI T1.105: Synchronous Optical Network (SONET) - Basic Description


including Multiplex Structure, Rates, and Formats.

ANSI X3.296: Single-Byte Command code sets CONnection (SBCON)


architecture.

FCC CFR Title 47 Part 15: Radio Emission.

FCC Part 101.147 Fixed microwave services: (i8, i7, K7, 7)

NEBS GR1089 and GR63 (temperature aspect)

NEBS Level 3 support for N.A. platforms.

Rural Utility Service (RUS) Certification.

Telcordia GR-63-CORE: Network Equipment Building System (NEBS)


Requirements: Physical Protection.

Telcordia GR-253-CORE: Synchronous Optical Network (SONET)


Transport Systems: Common Generic Criteria.

Telcordia GR-383-CORE: COMMON LANGUAGE Equipment Codes


(CLEI Codes) Generic Requirements for Bar Code Labels.

Telcordia GR-487-CORE: Generic Requirements for Electronic Equipment


Cabinets.

Telcordia GR-499-CORE: Transport System Generic Requirements


(TSGR): Common Requirements.

Telcordia GR-1089-CORE: Electromagnetic Compatibility and Electrical


Safety Generic Criteria for Network Telecommunications Equipment.

Telcordia GR-1209-CORE: Generic Requirements for Passive Optical


Components.

Telcordia GR-1230-CORE: SONET Bidirectional Line-Switched Ring


Equipment Generic Criteria.

Telcordia GD-1244-CORE: Clock for the synchronization network:


Common generic criteria.

Telcordia GR-1312-CORE: Generic Requirements for Optical Fiber


Amplifiers and Proprietary Dense Wavelength-Division Multiplexed
Systems.

Telcordia GR-1400-CORE: SONET Dual-Fed Unidirectional Path


Switched Ring (UPSR) Equipment Generic Criteria.

Telcordia GD-2979-CORE: Common Generic Requirements for Optical


Add-Drop Multiplexers (OADMs) and Optical Terminal Multiplexers
(OTMs).

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F-13

Standards and References

XDM-500 Installation and


Maintenance Manual

OMG: Object Management Group

Notification Service Specification V 1.0.

The Common Object Request Broker: Architecture and Specification V 2.6.

TMF: TeleManagement Forum

TMF 513: MTNM Business Agreement Release 3.5.

TMF 518: Framework Document Delivery Package (DDP) Business


Agreement (BA) V1.1.

TMF 518: Resource Provisioning DDP BA V1.0.

TMF 608: Multi Technology Network Management Information


Agreement V 2.1 and V 3.5.

TMF 814: Multi Technology Network Management Solution Set V 2.1 and
V 3.5.

TMF 854: The MTOSI XML Solution Set Package Release 1.1.

Web Protocol Standards


W3C: World Wide Web Consortium

SOAP 1.1: Simple Object Access Protocol.

WSDL 1.1: Web Services Description Language.

WS-I: Web Services Interoperability Organization

F-14

WS-I Basic Profile 1.1: Web Services Interoperability.

ECI Telecom Ltd. Proprietary

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Index
16- to 32-Channel Mux/DeMux
Expansion C-2

Attaching Protective Covers 4-57, 4-67


Attaching Suspended Overhead Trays
4-41
AUX, installation 6-64

About This Manual xv


ACP Connectors B-11
Additional Safety Precautions for High
Power Raman and EDFA Amplifiers
1-25
Air Filter Preventive Maintenance 9-7
Air filters, installation 5-6
description 5-6
procedure 5-7
installing air filter in frame 5-9
installing filter frame 5-8
Alarm cables
connecting to XDM shelves 5-10
connecting to xRAP 4-81
connecting to xRAP-100 4-90
preparation 4-30
Alarm Cables 4-30
Alarm Handling Test 8-31
ALARM IN/OUT Connector B-36
Alarm Input B-19
Alarm Log Test 8-39
Alarm Output B-20
ALARMS Connector B-3, B-23
Alarms Handling Principles B-19
Ancillary units
installing DDF units 4-101
installing the FST 4-96
installing the xRAP 4-73
installing the xRAP-100 4-82
Assembling the XDM Platform in a Rack
5-2
ATS cards 7-21
417006-2304-0H3-B02

Backing up the Database with the


DBBackup Function 9-41
Backing Up the LightSoft Database
9-40
BER and Stability Test 8-38
Broadband Forum F-1
Building an Integrated Network D-3
Built-in tests 9-27

C
Cable and fiber guiding accessories
A-26
cable guide A-26
cable guiding rods A-28
optical fiber guides A-27
Cable and Fiber Guiding Accessories
A-26
Cable and Fiber Preparation 4-23
Cable Guide A-26
Cable Guiding Rods A-28
Cable preparation
alarm 4-30
DC power 4-28
grounding 4-24
management 4-31
timing (clock) 4-31
Cable routes, xRAP-100 4-82
Card and Module Installation 6-1
Card failure 9-32
Card Installation Precautions 6-3
Cards and modules
installation, general 6-1
preparation 6-10

ECI Telecom Ltd. Proprietary

I-1

Index

XDM-500 Installation and


Maintenance Manual

Cards and Modules 2-5


Certificates 9-32
Checking and/or Changing Slide Switch
Settings 4-74
Checking Cards and Modules Installed in
Each Platform 8-5
Checking Site Grounding Wiring 5-10
Circuit breakers
xRAP, installation 4-80
xRAP, replacing 9-45
xRAP-100, installation 4-88
xRAP-100, replacing 9-46
Cisco ATA 186/Cisco2600/CallManager
Test 8-25
Cleaning Optical Connectors 4-8
Cleaning Procedure 9-8
Client-provided power distribution panel
5-13
Clock cables 7-20
Coaxial cables 7-19
Commissioning test 8-1
prerequisites 8-3
site commissioning tests 8-5
installed cards and modules 8-5
optical level measurement 8-8
shelf power-up 8-10
tools and equipment 8-2
Commissioning Tests 8-1
Configuration 9-30
Configuring the Management IP Address
6-86
Connecting Alarm Cables to the xRAP100 4-90
Connecting Cables 7-1
Connecting DC Input Power Cable to the
xRAP-D with a Bridge Component
4-53
Connecting DC Input Power Cables to the
miniRAP 4-92
Connecting DC Input Power Cables to the
xRAP-D 4-49
Connecting Electrical Cables to ATS
Cards 7-21
I-2

Connecting Fibers to the MECP_OSCxx


and MECP_OCxxOW 7-7
Connecting Fibers to the OADM1&4
7-8
Connecting Fibers to the ODF_HP 7-13
Connecting Fibers to the
OFA_R/RM/HRM 7-9
Connecting Fibers to the SIO16 7-9
Connecting Management Cables 7-22
Connecting Power and Rack Alarm
Cables to the Platforms 5-10
Connecting the Alarm Cables to the
miniRAP 4-96
Connecting the DC Input Power Cables to
the xRAP-100 4-85
Connecting the DC Power Cable 4-94
Connecting the DC Power Cable for an
XDM Platform 4-87
Connecting Traffic Cables to Electrical
Interfaces 7-17
Connecting Traffic Cables to Optical
Interfaces 7-2
Connecting via Client-provided Power
Distribution Panel 5-13
Connecting via XDM-500 xRAP 5-11
Connection data B-1
M2_84 interface module connection
data B-12
E1 patch panel B-14
M2_84 interface module B-12
MECP connectors B-10
ETHERNET B-10
shelf connectors B-2
ALARMS B-3
DC input power B-2
RAP B-4
xECB B-5
F-CHANNEL B-5
OHA B-8
OW B-7
T3_1/T4_1 B-6
T3_2/T4_2 B-6
xRAP connectors B-28

ECI Telecom Ltd. Proprietary

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XDM-500 Installation and


Maintenance Manual

Index

CONTROL CONNECTION B31


RAP B-30
SHELF EXTERNAL
ALARM/CONTROL B-28
xRAP-100 connectors B-34
ALARM IN/OUT B-36
SHELF ALARM B-35
SHELF DC power B-34
Connection instructions 7-11, 7-14
Connection via RAP 1-11
Connection via User-provided Power
Distribution Panel 1-11
Connector Pin Assignments B-1
Considerations for Installing Multiple
Shelves in a Single Rack 4-19
CONTROL CONNECTION Connector
B-31
Customer Assistance 8-4

D
Data network commissioning tests 8-27
required equipment 8-27
test sequence 8-27
tests
alarm handling 8-31
frame loss rate 8-29
stability 8-30
system recovery and reset 8-30
throughput and latency 8-28
Data Network Commissioning Tests
8-27
DC Input Power Connectors B-2
DC power cables 4-28
input power cables
connecting to xRAP 4-78
connecting to xRAP-100 4-85
preparation 4-76
preparation for xRAP-100 4-83
shelf power cables
xRAP 4-79
xRAP-100 4-87
DC Power Cables 4-28
417006-2304-0H3-B02

DC Power Warnings 1-12


DC Supply Circuit Connection to the
Grounding Conductor 1-20
DDF A-33
installation 4-101
DDF for Balanced Interfaces A-33
DDF for Unbalanced Interfaces A-34
DDF Units with Built-in Patch Panel
A-35
Deep Doors vs. Standard Doors 4-3
Diagnostic codes 9-28
Digital Distribution Frames See DDF
Digital Distribution Frames (DDF) A-33
Document Conventions xvi
Document Organization xvi
Door Installation 4-5

E
E1 Patch Panel Data B-14
EIS 6-34
optical transceiver installation 6-34
Electrical interface, connecting traffic
cables 7-17
Electricity Safety Warning 1-16
EMS-XDM Checklists 9-9
Environmental and Health Concerns
1-31
Environmental Considerations 4-17
Environmental requirements 4-2
Environmental Requirements 4-2
Environmental Standards F-2
EPA 1-28
Equipment grounding 1-10
Equipment Grounding Requirements
1-10, 1-18
Equipment Power-on Test 8-16, 8-34
Equipment racks, installation 4-37
extendable rails 4-42
floor marking 4-37
installation on concrete floors 4-40
installation on raised floors 4-41
installation on wooden floors 4-40

ECI Telecom Ltd. Proprietary

I-3

Index

XDM-500 Installation and


Maintenance Manual

suspended overhead tray assembly


4-41
ESD protection
general 1-27
personnel training 1-27
Ethernet Connectors B-10
Ethernet Port Precautions 1-19
ETS1 racks 4-14
ETSI
European Telecommunications
Standards Institute F-2
ETSI A Rack 4-14
Expansion Checklist C-6
Expansion Process C-5
Expansions See Upgrades and
Expansions
External Alarm Test 8-42
Extractor Tool for Optical Connectors
4-8

F
F-CHANNEL Connector B-5
Features and Functions 2-3
Fiber Storage Tray See FST
Flow of Management Traffic D-6
Frame Loss Rate Test 8-29
FST A-25
installation 4-96

G
General 1-27
General Safety Requirements 1-5
General Troubleshooting Procedures for
Cards and Modules 9-13
General Troubleshooting Procedures for
Optical Transceiver Plug-ins 9-15
Go-Global Test 8-42
Grounded Conductors Requirements
1-19
Grounding
cable preparation 4-24
equipment 1-10
requirements 1-7
I-4

xRAP 4-77
xRAP-100 4-84
Grounding Cables 4-24
Grounding Requirements 1-7
Grounding the Platform 5-3
Grounding the Rack 4-42

H
Handling Transmission Alarms Test
8-22
Hardware Checklists 9-10
Hardware Preventive Maintenance 9-5
Heat Buffer A-26
HLXC/XIO Redundancy Test 8-25

I
I/O cards and modules 6-90
IEC
International Electrotechnical
Commission F-3
IEEE
Institute of Electrical and Electronic
Engineers F-4
IETF
Internet Engineering Task Force F-5
Implementation Principles 2-4
Input Power Cables 4-28
Input power cables for user-provided
distribution panel 4-29
Input Sensitivity Test 8-14, 8-35
Installation Data for XDM-500 I/O Cards
and Associated Modules 6-6
Installation Warning 1-4
Installing
AUX 6-64
cards and modules installation,
general 6-1
EIS 6-34
equipment racks 4-37
FST 4-96
I/O cards 6-90
MECP 6-78
modules 6-92

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Index

OADM1&4 6-66
safety 1-1
XDM accessories A-1
DDF 4-101, A-33
ETSI rack 4-14
FST A-25
ODF A-29
ODF_HP A-31
xRAP A-4
XDM Shelf
connecting cables to electrical
interfaces
ATS cards 7-21
clock cables 7-20
coaxial cables 7-19
multicoax cables 7-18
multipair cables 7-17
connecting cables to optical
interfaces 7-2
connecting fibers to
MECP_OSC 7-7
connecting fibers to
OADM1&4 7-8
connecting fibers to ODF_HP
7-13
connecting fibers to OFA_R
7-9
connecting fibers to SIO16
7-9
ETSI 7-2
optical fibers 7-6
racks 7-5
connecting cables, general 7-1
installing 5-1
air filters 5-6
assembling in rack 5-2
connecting power and bay
alarm cables 5-10
xMCP 6-73
xRAP installation 4-73
xRAP-100 installation 4-82
Installing a Card in the CCP Cage 6-92
Installing Air Filters 5-6
417006-2304-0H3-B02

Installing Ancillary Units in Racks 4-44


Installing and Removing Optical
Transceivers 6-11
Installing Aurora-G Cards 6-79
Installing CMBR40 and TRP40_2 Cards
for Different Configuration Options
6-69
Installing DDF Units 4-101
Installing Equipment Racks 4-37
Installing Extendable Rails 4-42
Installing Extractable Modules in AUX
Cards 6-64
Installing Extractable Modules in
MO_CW2 Modules 6-68
Installing Extractable Modules in
OADM1&4 Cards 6-66
Installing Extractable Modules in
SIO1&4 Cards 6-13
Installing Extractable Modules in SIO16
Cards 6-18
Installing Extractable Modules in SIO164
in 1 x STM-64 or OTU2
Configuration 6-23
Installing Extractable Modules in SIO164
in 4 x STM-16/OTU1 Configuration
6-22
Installing Extractable Modules in
XIO384F Cards 6-28
Installing I/O Cards and Modules 6-90
Installing MECP Cards 6-78
Installing Optical Transceivers in DIO
Cards 6-36
Installing Optical Transceivers in DIOB
Cards 6-38
Installing Optical Transceivers in EIS
Cards 6-34
Installing Optical Transceivers in
MCS30_X10G Cards 6-42
Installing Optical Transceivers in
MCS5/MCS10 Cards 6-40
Installing Optical Transceivers in
SIO1&4B Cards 6-29
Installing Optical Transceivers in
SIO16_2B Cards 6-31

ECI Telecom Ltd. Proprietary

I-5

Index

XDM-500 Installation and


Maintenance Manual

Installing Optical Transceivers in


SIO16_4B Cards 6-32
Installing Optical Transceivers in SIO64B
Cards 6-33
Installing Optical Transceivers in XIO192
Cards 6-26
Installing Racks on Concrete Floors
4-40
Installing Racks on Raised Floors 4-41
Installing Racks on Wooden Floors 4-40
Installing the Air Filter 5-7
Installing the Aurora-G Card 6-81
Installing the Filter Frame 5-8
Installing the FST 4-96
Installing the miniRAP 4-90
Installing the ODF 4-98
Installing the xRAP-100 4-82
Installing the xRAP-100 Circuit Breakers
4-88
Installing the xRAP-B 4-63
Installing the xRAP-D 4-45
Installing the xRAP-HP 4-73, 4-77
Installing TRP40_2 Cards for
Regenerator Mode 6-69
Installing Two TRP40_2 or CMBR40
Cards as an OCH 1+1 Protection Pair
6-71
Installing XDM-500
Before You Start Safety Guidelines
1-1
Installing xMCP Cards 6-73
Installing xMCP-B/B2G Cards 6-75
Installing/Replacing the XDM-500
Platform 9-42
Integrating XDM Equipment in
SYNCOM Networks D-1
Intended Audience xv
Introduction to the XDM Platform 2-1
IOP Hardware Protection Test 8-20
ISO
International Organization for
Standardization F-7

I-6

ITU-T
International Telecommunication
Union F-7
ITU-T/Telcordia Statutory Warnings and
Requirements 1-19

J
Jewelry Removal Warning 1-6

L
Laser
classification 1-21
information 1-21
operating precautions 1-23
safety 1-22
Raman amplifiers 1-25
statutory warning 1-22
training 1-22
Laser Classification 1-21
Laser Device Operating Precautions
1-23
Laser Information 1-21
Laser Safety Requirements 1-21
Laser Safety Statutory Warning 1-22
LED indicator lights 9-27
LightSoft Checklists 9-10
LOS Detection Test 8-34
Loss of Signal (LOS) Detection Test
8-14

M
M2_21 Interface Module Connectors
B-18
M2_84 interface module B-12
M2_84 Interface Module Connection
Data B-12
M2_84 Interface Module Connectors
B-12
Main Equipment Dimensions 4-2
Maintenance 9-1
air filter preventative maintenance
9-7
preventative maintenance 9-2

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Index

procedures performed via EMS-XDM


9-4
Maintenance Handling Test 8-23
Maintenance Test 8-37
Management access 9-29
Management cable preparation 4-31
Management Cables 4-31
Management commissioning tests 8-39
Management Commissioning Tests 8-39
Management Facilities for Integrated
Networks D-7
Management IP Address Guidelines
6-87
Management Power-off and Recovery
Test 8-40
Management Requirements 8-3
Management to NEs Communication Test
8-39
Marking the Rack Floor 4-37
Matrix and SDH Data Card Upgrades
C-7
Measuring Optical Levels 8-8
Measuring Optical Power 8-33
Measuring Signals at Monitoring Points
8-9
MECP
connectors B-10
installation 6-78
MECP Connectors B-10
MECP_OSC, connecting fibers 7-7
MEF
Metro Ethernet Forum F-12
MET/TUV Listing Identification 1-17
miniRAP A-22
miniRAP Connectors B-40
Modem Connection Test 8-41
Modules
installing 6-92
replacing 9-62
Monthly checklist 9-9, 9-10
MSP 1+1 Test 8-19
MS-SPRing Protection Test 8-26

417006-2304-0H3-B02

Multicoax cables 7-18


Multipair cables 7-17

N
Network Commissioning 8-10
Network commissioning tests 8-10
Network Configuration 8-31
Network Implementation Considerations
D-2
Network Management Considerations
D-5
Network Timing Considerations D-5
Network Timing Synchronization Test
8-13
NIST
National Institute of Standards and
Technology F-12
North American Standards F-13

O
OADM1&4
connecting fibers 7-8
installation 6-66
Obtaining Technical Documentation
xviii
ODF A-29
ODF_HP A-31
overview A-31
physical description A-32
ODF_HP A-31
connecting fibers 7-13
instructions 7-14
safety 7-13
Optical Distribution Frames See
ODF
overview A-31
physical description A-32
OFA_R, connecting fibers 7-9
instructions 7-11
safety precautions 7-10
OHA Connector B-8
OMG
Object Management Group F-14

ECI Telecom Ltd. Proprietary

I-7

Index

XDM-500 Installation and


Maintenance Manual

Optical connectors
extractor tool 4-8
Optical Distribution Frames (ODFs)
A-29
Optical Fiber and Cable Installation and
Routing 7-1
Optical Fiber Guides A-27
Optical Fibers
connecting to MECP_OSC 7-7
connecting to OADM1&4 7-8
connecting to ODF_HP 7-13
connecting to OFA_R 7-9
connecting to SIO16 7-9
Optical fibers installation and routing,
general 7-1
routing and connecting 7-6
Optical interface, connecting traffic
cables 7-2
Optical network commissioning tests
8-31
network configuration 8-31
test setup and required equipment
8-32
tests
BER and stability 8-38
equipment power-up 8-34
input sensitivity 8-35
LOS detection 8-34
maintenance action 8-37
optical power measurement 8-33
path protection 8-36
Optical Network Commissioning Tests
8-31
Optical Networks, upgrading and
expansion C-3
expansion checklist C-6
expansion process C-5
optical traffic capacity C-4
Optical Parameters Test 8-41
Optical Rack 4-13
optical transceiver 9-15
Optical transceiver replacement
guidelines 9-60
I-8

Optical Transceiver, replacing


optical plug-in transceiver 9-60
Orderwire Test 8-42
Outline of Installation Procedure 3-5
Outline of Optical Traffic Capacity
Expansion Activities C-4
Overcurrent Protection Requirements
1-18
Overview xv, 1-1, 2-1, 3-1, 4-1, 5-1,
6-1, 8-1, 9-1, A-31, B-1, C-1, D-1,
F-1
OW Connector B-7
OW Connector (MECP_OW and
MECP_OCxxOW) B-11

P
Patch Panel for Balanced Interfaces
A-35
Path Protection and Nonretrieval
Operation Test 8-18
Path Protection Test 8-36
Personnel Training 1-27
Physical description A-32
Physical location 4-5
Physical Location 4-5
Platform Connectors B-2
Platform DC Input Power Connectors
B-21
Platform Power Cables 4-29
Platform Power-On Test Procedure 8-10
Power
consumption 4-6
Power cables
connecting to XDM shelves 5-10
DC input to xRAP-100 4-82
Power Consumption Data 4-6
Power supply requirements 1-11
Connection via User-Provided Power
Distribution Panel 1-11
Connection via xRAP/xRAP-100
1-11
Power Supply Requirements 1-11
Preliminary Preparations 3-2

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Index

Preparations for Test 8-12


Preparing a DC Power Cable for
xRAP-100 4-83
Preparing Cards and Modules for
Installation 6-10
Preparing CMBR10_x Cards for
Installation 6-44
Preparing CMBR25_2/2O Cards for
Installation 6-49
Preparing CMBR40 Cards for Installation
6-53
Preparing CMTR25 Cards for Installation
6-51
Preparing DC Input Power Cables 4-46,
4-76
Preparing SIO1&4 Cards for Installation
6-13
Preparing SIO16 Cards for Installation
6-17
Preparing SIO164 Cards for Installation
6-21
Preparing the AoC Card for Installation
6-61
Preparing the DC Power Cables 4-91
Preparing Transponders and Combiners
for Installation 6-44
Preparing TRP10_2B Cards for
Installation 6-54
Preparing TRP10_4M/R Cards for
Installation 6-55
Preparing TRP10_LAN Cards for
Installation 6-57
Preparing TRP25_4 Cards for Installation
6-59
Prerequisites 8-3
Preventing Configuration Problems in the
Integrated Network D-8
Preventive Maintenance 9-2
Preventive Maintenance Checklists 9-9
Preventive Maintenance Procedures via
EMS-XDM 9-4
Protection Against Electrostatic
Discharge 1-26

417006-2304-0H3-B02

Q
Qualified Personnel Warning 1-3
Quarterly checklist 9-9, 9-10, 9-11

R
Rack
assembling XDM shelves 5-2
cable routing 7-5
ETS1 4-14
installing 4-37
Rack Alarm Panel Power and Alarm
Connection Options A-4
Rack Grounding Requirements 1-8
Rack Space Requirements 4-12
RAP Connectors B-30
Rap Features A-5
RDR Test 8-41
Recommended Cleaning Methods 9-7
Recommended Integration Procedures
D-8
Related Documentation xvii
Replacement
components
cards, modules, fans , and other
components 9-43
I/O cards 9-59
MECP 9-57
NVM 9-52, 9-56
optical transceivers 9-59
optical plug-in transceiver
9-60
xECB 9-50
xFCU 9-48
xINF 9-49
xINF-H 9-49
xMCP 9-53
xRAP circuit breakers 9-45
xRAP-100 circuit breakers
9-46
modules 9-62
network element 9-40
Replacing a Network Element 9-40

ECI Telecom Ltd. Proprietary

I-9

Index

XDM-500 Installation and


Maintenance Manual

Replacing Cards 9-50


Replacing Cards, Modules, Fans, and
Other Components 9-43
Replacing I/O Cards 9-59
Replacing miniRAP Circuit Breakers
9-47
Replacing Modules in the Modules Cage
9-62
Replacing Optical Transceivers 9-59
Replacing the FCU 9-48
Replacing the MECP 9-57
Replacing the NVM in the ATS Card
9-56
Replacing the NVM in the xMCP Card
9-52
Replacing the NVM in the xMCP-B Card
9-54
Replacing the xECB 9-50
Replacing the xMCP 9-53
Replacing the xMCP-B 9-55
Replacing XDM-500 Components 9-48
Replacing xINF/xINF-H Units 9-49
Replacing xRAP-100 Circuit Breakers
9-46
Replacing xRAP-D Circuit Breakers
9-43
Replacing xRAP-HP Circuit Breakers
9-45
Required Test Equipment 8-10, 8-27
Required Test Equipment, Tools, and
Materials 9-2
Routing and Connecting Clock Cables
7-20
Routing and Connecting Coaxial Cables
7-19
Routing and Connecting Ethernet Cables
7-19
Routing and Connecting Multicoax
Cables 7-18
Routing and Connecting Multipair Cables
7-17
Routing and Connecting Optical Fibers
7-6

I-10

Routing Guidelines for Type A ETSI


Rack 7-2
Routing in Standard Racks 7-5

S
Safety
ESD protection 1-26
general 1-27
personnel training 1-27
temporary EPA 1-28
work arrangements in temporary
EPA 1-30
general requirements 1-5
grounding 1-7
equipment grounding 1-10
laser 1-21
information 1-21
operating precautions 1-23
Raman amplifiers 1-25
training 1-22
warning labels 1-21
power supply 1-11
user-provided power distribution
panel 1-11
xRAP/xRAP-100 1-11
UL statutory warnings and
requirements 1-17
equipment grounding 1-18
grounded conductors 1-19
UL 1-17
UL overcurrent protection 1-18
warning label 1-17
Safety and Workmanship 9-43
Saving EMS-XDM Configuration Files
9-40
SDH Network Commissioning Tests
8-10
Security Test 8-39
Severity Assignment Test 8-21
SEVERITY IN Connector B-40
SEVERITY OUT Connector B-41
SHELF Alarm Connectors B-21
SHELF ALARM Connectors B-35

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Index

Shelf connectors B-2


ALARMS B-3
DC input power B-2
RAP B-4
Shelf DC Input Power Connectors B-40
SHELF DC Power Connectors B-34
SHELF EXTERNAL
ALARM/CONTROL Connectors
B-28
Shelf View 9-4
SIO16
connecting fibers 7-9
Site commissioning tests 8-5
installed cards and modules 8-5
optical level measurement 8-8
shelf power-up 8-10
Site Commissioning Tests 8-5
Site installation and physical inspection
4-1
racks 4-10
requirements 4-1
physical location 4-5
tools and test equipment 4-8
Site Preparation 4-1
Site Preparation and Rack Installation
4-1
Slot designation conversion table E-1
Slot Designation Conversion Table E-1
Specific safety precautions 7-13
Specific safety precautions for
OFA_R/RM/HRM cards 7-10
Stability Test 8-17, 8-30
Stages of a Typical Installation 3-3
Standard ODF A-29
Standard test conditions for DS-3 ports
8-11
Standard test conditions for E1 ports
8-10
Standard test conditions for E3 ports
8-11
Standard test conditions for SDH ports
8-11

417006-2304-0H3-B02

Standard test conditions for SONET ports


8-12
Standards and References F-1
Support xviii
System Recovery and Reset Test 8-30

T
T3_1/T4_1 and T3_2/T4_2 Connectors
B-6
Technical Assistance xviii
Technical support xviii
Test Sequence 8-12, 8-27
Test Setup and Required Test Equipment
8-32
Tests
commissioning tests 8-1
data network commissioning tests
8-27
management commissioning tests
8-39
network commissioning tests 8-10
optical network commissioning tests
8-31
site commissioning tests 8-5
Throughput and Latency Tests 8-28
Timing (clock) cable preparation 4-31
Timing (Clock) Cables 4-31
TMF
TeleManagement Forum F-14
Tools and Equipment 8-2
Tools and test equipment
extractor tool for optical connectors
4-8
traffic cable tools 4-8
unpacking 4-9
visual inspection after unpacking
4-9
Tools and Test Equipment 4-8
Tools for Traffic Cable Assembly 4-8
Traffic 9-31
Traffic cables
connecting to optical interfaces 7-2
tools 4-8

ECI Telecom Ltd. Proprietary

I-11

Index

XDM-500 Installation and


Maintenance Manual

Traffic Cables 4-32


Trail Consistency Indication (TCI) Test
8-40
Trail Creation Test 8-40
Training for Laser Safety 1-22
Troubleshooting 9-11
ATS cards 9-33
card/module 9-13
DCC/management channel
malfunctions
management communication
9-39
DIO cards 9-20
EIS cards 9-19
electrical interface modules 9-16
optical OADM, mux/demux and
VMUX 9-17
optical transceivers 9-15
power problems 9-36
timing subsystem 9-38
transmission and traffic alarms 9-34
Troubleshooting Management
Communication 9-39
Troubleshooting Power Problems 9-36
Troubleshooting Procedure for Optical
OADM and Mux/DeMux 9-17
Troubleshooting Procedures for ATS
Cards 9-33
Troubleshooting Procedures for Aurora-G
Cards 9-26
Troubleshooting Procedures for DIO
Cards 9-20
Troubleshooting Procedures for DIOB
Cards 9-22
Troubleshooting Procedures for EIS
Cards 9-19
Troubleshooting Procedures for Electrical
Interface Modules 9-16
Troubleshooting Procedures for
MCS5/MCS10 Cards 9-23
Troubleshooting Procedures for ROADM
Cards 9-25

I-12

Troubleshooting the Timing Subsystem


9-38
Troubleshooting Transmission and
Traffic Alarms 9-34
Troubleshooting Using Component
Indicators 9-13
TUV Statutory Warnings and
Requirements 1-17
Typical Installation Setup A-2
Typical XDM Installations in Racks
4-20

U
UL
equipment grounding requirements
1-18
listing 1-17
overcurrent protection safety 1-18
requirements for grounded conductors
1-19
warning label 1-17
Understanding the Aurora-G LED
Indicators 6-85
Unpacking 4-9
Unpacking and Visual Inspection 4-9,
6-80
Upgrades and Expansions C-1
16-channel to 32-channel mux/demux
C-2
optical networks C-3
Upgrading and Expanding Optical
Networks C-3
Upgrading to an Optical Module with a
Removable SFP 6-19
Upgrading to Optical Modules with
Removable SFPs 6-15
Uploading the NE Database from the
XDM-500 9-40
Use of Temporary EPA 1-28
Using Electrical Interface Protection
Modules 6-9
Using XDM Equipment to Transport
SYNCOM Traffic D-2

ECI Telecom Ltd. Proprietary

417006-2304-0H3-B02

XDM-500 Installation and


Maintenance Manual

Index

V
Visual Inspection and Mechanical Checks
8-6
Voltage test
xRAP 4-81
xRAP-100 4-89

W
Warning Definition 1-2
Warning Label 1-17
Warning labels 1-17
Warning Labels for Laser Products 1-21
Web Protocol Standards F-14
Weekly checklist 9-9, 9-10
Work Arrange