ACS758 Datasheet PDF

ACS758xCB
Thermally Enhanced, Fully Integrated, Hall Effect-Based

Linear Current Sensor IC with 100 Current Conductor
FEATURES AND BENEFITS DESCRIPTION
Industry-leading noise performance through proprietary The Allegro ACS758 family of current sensor ICs provides
amplifier and filter design techniques economical and precise solutions for AC or DC current sensing.
Integrated shield greatly reduces capacitive coupling Typical applications include motor control, load detection and
from current conductor to die due to high dV/dt signals, management, power supply and DC-to-DC converter control,
and prevents offset drift in high-side, high voltage inverter control, and overcurrent fault detection.
applications
The device consists of a precision, low-offset linear Hall
Total output error improvement through gain and offset
circuit with a copper conduction path located near the die.
trim over temperature
Applied current flowing through this copper conduction path
Small package size, with easy mounting capability
generates a magnetic field which the Hall IC converts into a
Monolithic Hall IC for high reliability
proportional voltage. Device accuracy is optimized through the
Ultra-low power loss:100 internal conductor
close proximity of the magnetic signal to the Hall transducer.
resistance
A precise, proportional output voltage is provided by the
Galvanic isolation allows use in economical, high-side
low-offset, chopper-stabilized BiCMOS Hall IC, which is
current sensing in high voltage systems
programmed for accuracy at the factory.
AEC Q-100 qualified
High level immunity to current conductor dV/dt and stray
Continued on the next page
electric fields, offered by Allegro proprietary integrated shield
pe d
Ty ste
te
TV America technology, provides low output voltage ripple and low offset
Certificate Number:
U8V 14 05 54214 028 drift in high-side, high voltage applications.
UL Certified
File No.: E316429 The output of the device has a positive slope (>VCC/2) when an
increasing current flows through the primary copper conduction
PACKAGE: 5-PIN CB PACAKGE path (from terminal 4 to terminal 5), which is the path used
for current sampling. The internal resistance of this conductive
path is 100 typical, providing low power loss.
The thickness of the copper conductor allows survival of the
device at high overcurrent conditions. The terminals of the
conductive path are electrically isolated from the signal leads
PFF PSF PSS

Continued on the next page
Leadform Leadform Leadform
+3.3 or 5 V
1
4 VCC
IP+ CBYP
ACS758 0.1 F
2
IP GND
CF
5
IP 3
VIOUT VOUT
RF
Application 1: The ACS758 outputs an analog signal, VOUT,
that varies linearly with the uni- or bi-directional AC or DC
primary sampled current, IP, within the range specified. CF is
for optimal noise management, with values that depend on
the application.
Typical Application
ACS758-DS, Rev. 9
ACS758xCB Linear Current Sensor IC with 100 Current Conductor
FEATURES AND BENEFITS (CONTINUED) DESCRIPTION (CONTINUED)

3.0 to 5.5 V, single supply operation (pins 1 through 3). This allows the ACS758 family of sensor ICs
120 kHz typical bandwidth to be used in applications requiring electrical isolation without the
3 s output rise time in response to step input current use of opto-isolators or other costly isolation techniques.
Output voltage proportional to AC or DC currents
The device is fully calibrated prior to shipment from the factory.
Factory-trimmed for accuracy
The ACS758 family is lead (Pb) free. All leads are plated with 100%
Extremely stable output offset voltage
matte tin, and there is no Pb inside the package. The heavy gauge
Nearly zero magnetic hysteresis
leadframe is made of oxygen-free copper.
Selection Guide
Package Primary Sampled Sensitivity
Sens (Typ.) Current TOP
Part Number1 Current , IP Packing2
Terminals Signal Pins Directionality (C)
(A) (mV/A)
ACS758LCB-050B-PFF-T Formed Formed 50 40. Bidirectional
ACS758LCB-050U-PFF-T Formed Formed 50 60. Unidirectional
ACS758LCB-100B-PFF-T Formed Formed 100 20. Bidirectional 40 to 150
ACS758LCB-100B-PSF-T Straight Formed 100 20. Bidirectional
ACS758LCB-100U-PFF-T Formed Formed 100 40. Unidirectional
ACS758KCB-150B-PFF-T Formed Formed 150 13.3 Bidirectional 34 pieces
ACS758KCB-150B-PSS-T Straight Straight 150 13.3 Bidirectional 40 to 125 per tube
ACS758KCB-150U-PFF-T Formed Formed 150 26.7 Unidirectional
ACS758ECB-200B-PFF-T Formed Formed 200 10. Bidirectional
ACS758ECB-200B-PSF-T Straight Formed 200 10. Bidirectional
40 to 85
ACS758ECB-200B-PSS-T Straight Straight 200 10. Bidirectional
ACS758ECB-200U-PFF-T Formed Formed 200 20. Unidirectional
1Additional leadform options available for qualified volumes.
2Contact Allegro for additional packing options.
Allegro MicroSystems, LLC 2

115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
SPECIFICATIONS
Absolute Maximum Ratings

Characteristic Symbol Notes Rating Units
Forward Supply Voltage VCC 8 V
Reverse Supply Voltage VRCC 0.5 V
Forward Output Voltage VIOUT 28 V
Reverse Output Voltage VRIOUT 0.5 V
Output Source Current IOUT(Source) VIOUT to GND 3 mA
Output Sink Current IOUT(Sink) VCC to VIOUT 1 mA
Range E 40 to 85 C
Nominal Operating Ambient Temperature TOP Range K 40 to 125 C
Range L 40 to 150 C
Maximum Junction TJ(max) 165 C
Storage Temperature Tstg 65 to 165 C
Isolation Characteristics
Characteristic Symbol Notes Rating Unit
Agency type-tested for 60 seconds per
Dielectric Strength Test Voltage* VISO 4800 VAC
UL standard 60950-1, 2nd Edition
For basic (single) isolation per UL standard 60950-1, 2nd 990 VDC or Vpk
Working Voltage for Basic Isolation VWFSI
Edition 700 Vrms
For reinforced (double) isolation per UL standard 60950- 636 VDC or Vpk
Working Voltage for Reinforced Isolation VWFRI
1, 2nd Edition 450 Vrms
* Allegro does not conduct 60-second testing. It is done only during the UL certification process.

Thermal Characteristics may require derating at maximum conditions

Characteristic Symbol Test Conditions* Value Unit
Mounted on the Allegro evaluation board with 2800mm2
(1400mm2 on component side and 1400mm2 on opposite
side) of 4 oz. copper connected to the primary leadframe
Package Thermal Resistance RJA and with thermal vias connecting the copper layers. 7 C/W
Performance is based on current flowing through the
primary leadframe and includes the power consumed by
the PCB.
*Additional thermal information available on the Allegro website
Typical Overcurrent Capabilities1,2

Characteristic Symbol Notes Rating Units
TA = 25C, 1s duration, 1% duty cycle 1200 A
Overcurrent IPOC TA = 85C, 1s duration, 1% duty cycle 900 A
TA = 150C, 1s duration, 1% duty cycle 600 A
1Testwas done with Allegro evaluation board. The maximum allowed current is limited by TJ(max) only.
2For more overcurrent profiles, please see FAQ on the Allegro website, www.allegromicro.com.

+3.3 to 5 V
IP+ VCC
To all subcircuits
Dynamic Offset
Cancellation
VIOUT
Filter
Amp Out
0.1 F
Gain Offset
Gain Temperature Offset Temperature
Coefficient Coefficient
Trim Control
IP GND
Functional Block Diagram
Terminal List Table

IP+ 4
3 VIOUT Number Name Description
2 GND
1 VCC Device power supply terminal
1 VCC
IP 5 2 GND Signal ground terminal
3 VIOUT Analog output signal
Pin-out Diagram
4 IP+ Terminal for current being sampled
5 IP Terminal for current being sampled

COMMON OPERATING CHARACTERISTICS1 valid at TOP = 40C to 150C and VCC = 5 V, unless otherwise
specified
Characteristic Symbol Test Conditions Min. Typ. Max. Units
Supply Voltage2 VCC 3 5.0 5.5 V
Supply Current ICC Output open 10 13.5 mA
Power-On Delay tPOD TA = 25C 10 s
IP step = 60% of IP+, 10% to 90% rise time, TA = 25C,
Rise Time3 tr 3 s
COUT = 0.47 nF
Propagation Delay Time3 tPROP TA = 25C, COUT = 0.47 nF 1 s
Response Time tRESPONSE Measured as sum of tPROP and tr 4 s
Internal Bandwidth4 BWi 3 dB; TA = 25C, COUT = 0.47 nF 120 kHz
Output Load Resistance RLOAD(MIN) VIOUT to GND 4.7 k
Output Load Capacitance CLOAD(MAX) VIOUT to GND 10 nF
Primary Conductor Resistance RPRIMARY TA = 25C 100
Symmetry3 ESYM Over half-scale of Ip 99 100 101 %
VIOUT(QBI) Bidirectional variant, IP = 0 A, TA = 25C VCC/2 V
Quiescent Output Voltage5 Unidirectional variant, IP = 0 A, TA = 25C, VIOUT(QUNI) is
VIOUT(QUNI) 0.6 V
ratiometric to VCC
Ratiometry3 VRAT VCC = 4.5 to 5.5 V 100 %
1Device is factory-trimmed at 5 V, for optimal accuracy.
2Devices are programmed for maximum accuracy at 5.0 V V
CC levels. The device contains ratiometry circuits that accurately alter the 0 A Output Voltage and Sensitivity
level of the device in proportion to the applied VCC level. However, as a result of minor nonlinearities in the ratiometry circuit additional output error will result when VCC
varies from the 5 V VCC level. Customers that plan to operate the device from a 3.3 V regulated supply should contact their local Allegro sales representative regarding
expected device accuracy levels under these bias conditions.
3See Characteristic Definitions section of this datasheet.
4Calculated using the formula BW = 0.35 / t .
i r
5V
IOUT(Q) may drift over the lifetime of the device by as much as 25 mV.

X050B PERFORMANCE CHARACTERISTICS1: TOP = 40C to 150C, VCC= 5 V, unless otherwise specified
Primary Sampled Current IP 50 50 A
SensTA Full scale of IP applied for 5 ms, TA = 25C 40 mV/A
Sensitivity Sens(TOP)HT Full scale of IP applied for 5 ms, TOP = 25C to 150C 39.4 mV/A
Sens(TOP)LT Full scale of IP applied for 5 ms,TOP = 40C to 25C 41 mV/A
Noise2 VNOISE TA= 25C, 10 nF on VIOUT pin to GND 10 mV
Nonlinearity ELIN Up to full scale of IP, IP applied for 5 ms 1 1 %
VOE(TA) IP = 0 A, TA = 25C 5 mV
Electrical Offset Voltage3 VOE(TOP)HT IP = 0 A, TOP = 25C to 150C 15 mV
VOE(TOP)LT IP = 0 A, TOP = 40C to 25C 35 mV
Magnetic Offset Error IERROM IP = 0 A, TA = 25C, after excursion of 50 A 100 mA
ETOT(HT) Over full scale of IP, IP applied for 5 ms, TOP = 25C to 150C 1.2 %
Total Output Error4
ETOT(LT) Over full scale of IP, IP applied for 5 ms, TOP = 40C to 25C 2 %
1See Characteristic Performance Data page for parameter distributions over temperature range.
23 sigma noise voltage.
3V
OE(TOP) drift is referred to ideal VIOUT(Q) = 2.5 V.
4Percentage of I . Output filtered.
P
X050U PERFORMANCE CHARACTERISTICS1: TOP = 40C to 150C, VCC= 5 V, unless otherwise specified
Sensitivity Sens(TOP)HT Full scale of IP applied for 5 ms, TOP = 25C to 150C 59 mV/A
Sens(TOP)LT Full scale of IP applied for 5 ms,TOP = 40C to 25C 61 mV/A
Total Output Error4
ETOT(LT) Over full scale of IP, IP applied for 5 ms, TOP = 40C to 25C 2 %
3V
P

Sens(TOP)LT Full scale of IP applied for 5 ms, TOP = 40C to 25C 20.5 mV/A
Nonlinearity ELIN Up to full scale of IP, IP applied for 5 ms 1.25 1.25 %
Total Output Error4
ETOT(LT) Over full scale of IP, IP applied for 5 ms, TOP = 40C to 25C 2.4 %
3V
P
Sens(TOP)LT Full scale of IP applied for 5 ms, TOP = 40C to 25C 41 mV/A
Nonlinearity ELIN Up to full scale of IP, IP applied for 5 ms 1.25 1.25 %
Total Output Error4
3V
P

SensTA Full scale of IP applied for 5 ms, TA = 25C 13.3 mV/A
Total Output Error4
3V
P
SensTA Full scale of IP applied for 5 ms, TA = 25C 26.6 mV/A
Total Output Error4
3V
P

Total Output Error4
3V
P
Total Output Error4
3V
P

CHARACTERISTIC PERFORMANCE DATA

Data taken using the ACS758LCB-50B
Accuracy Data
Electrical Offset Voltage versus Ambient Temperature Sensitivity versus Ambient Temperature
30 42.0
20 42.5
10
Sens (mV/A)
41.0
0
VOE (mV)
40.5
-10
40.0
-20
39.5
-30
-40 39.0
-50 38.5
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)
Nonlinearity versus Ambient Temperature Symmetry versus Ambient Temperature

0.45 100.40
0.40 100.35
0.35 100.30
0.30 100.25
ESYM (%)
ELIN (%)
0.25 100.20
0.20 100.15
0.15 100.10
0.10 100.05
0.05 100.00
0 99.95
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)
Magnetic Offset Error versus Ambient Temperature Total Output Error versus Ambient Temperature
140 6
5
120
4
100 3
2
IERROM (mA)
80
ETOT (%)
1
60 0
40 -1
-2
20
-3
0 -4
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)
Typical Maximum Limit Mean Typical Minimum Limit


Accuracy Data
25 21.2
20 21.0
15 20.8
Sens (mV/A)
10 20.6
VOE (mV)
5 20.4
0 20.2
-5 20.0
-10 19.8
-15 19.6
-20 19.4
-25 19.2
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)

0.40 100.6
0.35 100.5
0.30 100.4
100.3
0.25
ESYM (%)
ELIN (%)
100.2
0.20
100.1
0.15
100.0
0.10 99.9
0.05 99.8
0 99.7
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)
200 6
190 5
4
180
3
170 2
IERROM (mA)
160 1
ETOT (%)
150 0
130 -1
-2
120
-3
110 -4
100 -5
50 -25 0 25 50 75 100 125 150 50 -25 0 25 50 75 100 125 150
TA (C) TA (C)


Data taken using the ACS758KCB-150B
Accuracy Data
20 14.0
15
13.8
10
Sens (mV/A)
5 13.6
VOE (mV)
0 13.4
-5
-10 13.2
-15 13.0
-20
12.8
-25
-30 12.6
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)

0.30 100.7
100.6
0.25
100.5
02.0 100.4
ESYM (%)
ELIN (%)
100.3
0.15
100.2
0.10 100.1
100.0
0.05
99.9
0 99.8
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)
300 5
4
250 3
2
200
1
IERROM (mA)
0
ETOT (%)
150
-1
100 -2
-3
50 -4
-5
0 -6
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)


Data taken using the ACS758ECB-200B
Accuracy Data
25 10.4
20 10.3
15
10.2
Sens (mV/A)
10
10.1
5
VOE (mV)
0 10.0
-5 9.9
-10 9.8
-15
9.7
-20
-25 9.6
-30 9.5
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)

0.16 100.8
0.14
0.12 100.6
0.10
100.4
0.08
ESYM (%)
ELIN (%)
0.06
100.2
0.04
0.02 100.0
0
-0.02 99.8
-0.04
-0.06 99.6
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)
350 4
3
300
2
250 1
0
IERROM (mA)
200
ETOT (%)
-1
150 -2
100 -3
-4
50
-5
0 -6
60 40 20 0 20 40 60 80 100 120 140 60 40 20 0 20 40 60 80 100 120 140
TA (C) TA (C)


Timing Data
Rise Time Propagation Delay Time
IP (20 A/div.) IP (20 A/div.)
VIOUT (0.5 V/div.) VIOUT (0.5 V/div.)
2.988 s 997 ns
t (2 s/div.) t (2 s/div.)
Response Time Power-on Delay
VCC
IP (20 A/div.)
VIOUT (0.5 V/div.)

9.034 s
VIOUT (1 V/div.)
(IP = 60 A DC)
3.960 s
t (2 s/div.) t (2 s/div.)

CHARACTERISTIC DEFINITIONS
Definitions of Accuracy Characteristics

Sensitivity (Sens). The change in device output in response to a The ratiometric change (%) in the quiescent voltage output is
1A change through the primary conductor. The sensitivity is the defined as:
product of the magnetic circuit sensitivity (G/A) and the linear VIOUTQ(VCC) VIOUTQ(5V)
VIOUTQ(V) = 100%
IC amplifier gain (mV/G). The linear IC amplifier gain is pro- VCC 5V
grammed at the factory to optimize the sensitivity (mV/A) for the
and the ratiometric change (%) in sensitivity is defined as:
half-scale current of the device.
Sens(VCC) Sens(5V)
Noise (VNOISE). The noise floor is derived from the thermal and Sens(V) = 100%
shot noise observed in Hall elements. Dividing the noise (mV) VCC 5V
by the sensitivity (mV/A) provides the smallest current that the Quiescent output voltage (VIOUT(Q)). Quiescent output voltage
device is able to resolve. (VIOUT(Q)). The output of the device when the primary current is
zero. For bidirectional devices, it nominally remains at VCC2.
Nonlinearity (ELIN). The degree to which the voltage output Thus, VCC = 5 V translates into VIOUT(QBI) = 2.5V. For unidirec-
from the IC varies in direct proportion to the primary current tional devices, it nominally remains at 0.12 VCC. Thus, VCC
through its half-scale amplitude. Nonlinearity in the output can be =5V translates into VIOUT(QUNI) = 0.6V. Variation in VIOUT(Q)
attributed to the saturation of the flux concentrator approaching can be attributed to the resolution of the Allegro linear IC quies-
cent voltage trim, magnetic hysteresis, and thermal drift.
the half-scale current. The following equation is used to derive
the linearity: Electrical offset voltage (VOE). The deviation of the device out-
put from its ideal quiescent value of VCC 2 for bidirectional and
{ [
100 1
gain % sat ( VIOUT_half-scale amperes VIOUT(Q) )
2 (VIOUT_quarter-scale amperes VIOUT(Q) ) [{ 0.1 VCC for unidirectional devices, due to nonmagnetic causes.
Magnetic offset error (IERROM). The magnetic offset is due to
where the residual magnetism (remnant field) of the core material. The
magnetic offset error is highest when the magnetic circuit has
gain = the gain variation as a function of temperature changes been saturated, usually when the device has been subjected to a
from 25C, full-scale or high-current overload condition. The magnetic offset
% sat = the percentage of saturation of the flux concentra- is largely dependent on the material used as a flux concentrator.
tor, which becomes significant as the current being sampled The larger magnetic offsets are observed at the lower operating
temperatures.
approaches half-scale IP , and
VIOUT_half-scale amperes = the output voltage (V) when the sampled Total Output Error (ETOT). The maximum deviation of the
current approximates half-scale IP . actual output from its ideal value, also referred to as accuracy,
illustrated graphically in the output voltage versus current chart
Symmetry (ESYM). The degree to which the absolute voltage on the following page.
output from the IC varies in proportion to either a positive or ETOT is divided into four areas:
negative half-scale primary current. The following equation is
0 A at 25C. Accuracy at the zero current flow at 25C,
used to derive symmetry: without the effects of temperature.
VIOUT_+ half-scale amperes VIOUT(Q) 0 A over temperature. Accuracy at the zero current flow

100 including temperature effects.
VIOUT(Q) VIOUT_half-scale amperes
Half-scale current at 25C. Accuracy at the the half-scale
Ratiometry. The device features a ratiometric output. This current at 25C, without the effects of temperature.
means that the quiescent voltage output, VIOUTQ, and the mag- Half-scale current over temperature. Accuracy at the half-
netic sensitivity, Sens, are proportional to the supply voltage, VCC. scale current flow including temperature effects.

Definitions of Dynamic Response Characteristics

Power-On Time (tPO). When the supply is ramped to its operat-
ing voltage, the device requires a finite time to power its internal
components before responding to an input magnetic field.
Power-On Time, tPO , is defined as the time it takes for the output
voltage to settle within 10% of its steady state value under an
applied magnetic field, after the power supply has reached its
minimum specified operating voltage, VCC(min), as shown in the
chart at right.
Rise time (tr). The time interval between a) when the device
reaches 10% of its full scale value, and b) when it reaches 90%
of its full scale value. The rise time to a step response is used to
derive the bandwidth of the device, in which (3 dB) = 0.35/tr.
Both tr and tRESPONSE are detrimentally affected by eddy current
losses observed in the conductive IC ground plane. Output Voltage versus Sampled Current
Total Output Error at 0 A and at Half-Scale Current
Accuracy
Primary Current Increasing VIOUT(V) Over Temp erature
I (%)
90 Accuracy
25C Only
Bidirectional
Average
Transducer Output VIOUT
10
0 Accuracy
t Over Temp erature
Rise Time, tr
Accuracy
Propagation delay (tPROP). The time required for the device IP(min)
25C Only
output to reflect a change in the primary current signal. Propaga-

IP (A) +IP (A)
tion delay is attributed to inductive loading within the linear IC Half Scale
package, as well as in the inductive loop formed by the primary IP(max)
conductor geometry. Propagation delay can be considered as a 0A

fixed time offset and may be compensated.
Decreasing VIOUT(V)
I (%) Primary Current

Accuracy
25C Only
90
Accuracy
Over Temp erature
Transducer Output Accuracy

Increasing VIOUT(V) Over Temp erature
0
t
Propagation Time, tPROP Accuracy
25C Only
Unidirectional
Average
VIOUT
Accuracy
Over Temp erature
Accuracy
25C Only
IP (A) +IP (A)
Full Scale
0A IP(max)
Decreasing VIOUT(V)

Chopper Stabilization Technique

Chopper Stabilization is an innovative circuit technique that is ponents which are beyond the users frequency range of interest.
used to minimize the offset voltage of a Hall element and an asso-
As a result of this chopper stabilization approach, the output
ciated on-chip amplifier. Allegro patented a Chopper Stabiliza-
voltage from the Hall IC is desensitized to the effects of tempera-
tion technique that nearly eliminates Hall IC output drift induced
by temperature or package stress effects. ture and mechanical stress. This technique produces devices that
have an extremely stable Electrical Offset Voltage, are immune to
This offset reduction technique is based on a signal modulation- thermal stress, and have precise recoverability after temperature
demodulation process. Modulation is used to separate the unde- cycling.
sired DC offset signal from the magnetically induced signal in the
frequency domain. Then, using a low-pass filter, the modulated This technique is made possible through the use of a BiCMOS
DC offset is suppressed while the magnetically induced signal process that allows the use of low-offset and low-noise amplifiers
passes through the filter. The anti-aliasing filter prevents aliasing in combination with high-density logic integration and sample
from happening in applications with high frequency signal com- and hold circuits.
Regulator
Clock/Logic
Low-Pass
Hall Element
Filter
Sample and
Anti-aliasing
Hold
Filter
Amp
Concept of Chopper Stabilization Technique

PACKAGE OUTLINE DRAWING
For Reference Only Not for Tooling Use

(Reference DWG-9111 & DWG-9110)
Dimensions in millimeters NOT TO SCALE
Dimensions exclusive of mold flash, gate burs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
14.0 0.2 0.5

4.0 0.2 3.5 0.2 R1
R2
3.0 0.2 R3
1.50 0.10 12
5 4
0.5 B
3 4
17.5 0.2
21.4
13.00 0.10
Branded
Face
4.40 0.10
0.8
1.9 0.2 1.5

2.9 0.2
0.51 0.10
1 2 3
+0.060 1.91
0.381
0.030 55
10.00 0.10 B PCB Layout Reference View
3.5 0.2
NNNNNNN
7.00 0.10 TTT-AAA
LLLLLLL
A Dambar removal intrusion
B Perimeter through-holes recommended YYWW
C Branding scale and appearance at supplier discretion 1

C Standard Branding Reference View
N = Device part number
T = Temperature code
A = Amperage range
L = Lot number
Y = Last two digits of year of
manufacture
W = Week of manufacture
= Supplier emblem
Creepage distance, current terminals to signal pins: 7.25 mm

Clearance distance, current terminals to signal pins: 7.25 mm
Package mass: 4.63 g typical
Package CB, 5-pin Package, Leadform PFF


(Reference DWG-9111, DWG-9110)
14.0 0.2
4.0 0.2
3.0 0.2
0.8
5 4 1.5
1.50 0.10
1.91
2.75 0.10 B PCB Layout Reference View

A
23.50 0.5
NNNNNNN
TTT-AAA
13.00 0.10
4.40 0.10 Branded LLLLLLL

Face
YYWW
1.9 0.2
2.9 0.2
0.51 0.10 1
1 2 3 B Standard Branding Reference View
+0.060 N = Device part number
0.381
0.030 55 T = Temperature code
A = Amperage range
3.5 0.2 L = Lot number
Y = Last two digits of year of
manufacture
10.00 0.10 = Supplier emblem
7.00 0.10
B Branding scale and appearance at supplier discretion
Package CB, 5-pin Package, Leadform PSF


(Reference DWG-9111, DWG-9110)
14.0 0.2
4.0 0.2
3.0 0.2
5 4
1.50 0.10
2.75 0.10
A NNNNNNN
TTT-AAA
23.50 0.5
LLLLLLL
13.00 0.10
YYWW
4.40 0.10 Branded 1

Face
B Standard Branding Reference View
1 2 3 N = Device part number
3.18 0.10 T = Temperature code
11.0 0.05 1.9 0.2 A = Amperage range
L = Lot number
+0.060
0.51 0.10 0.381 Y = Last two digits of year of
0.030
manufacture
= Supplier emblem
10.00 0.10
7.00 0.10
B Branding scale and appearance at supplier discretion
Creepage distance, current terminals to signal pins: 7.25 mm

Clearance distance, current terminals to signal pins: 7.25 mm
Package mass: 4.63 g typical
Package CB, 5-pin Package, Leadform PSS

Revision History
Revision Revision Date Description of Revision
8 January 17, 2014 Update features list and product offering
9 April 7, 2015 Updated TUV certification and refomratted document
Copyright 2008-2015, Allegro MicroSystems, LLC

The products described herein are protected by U.S. patents: 6,781,359, 7,265,531, and 8,080,994.
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegros products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegros product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
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ACS758 Datasheet PDF

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ACS758xCB

Thermally Enhanced, Fully Integrated, Hall Effect-Based

PFF PSF PSS

FEATURES AND BENEFITS (CONTINUED) DESCRIPTION (CONTINUED)

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Absolute Maximum Ratings

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Thermal Characteristics may require derating at maximum conditions

Typical Overcurrent Capabilities1,2

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Functional Block Diagram

Terminal List Table

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CHARACTERISTIC PERFORMANCE DATA

Nonlinearity versus Ambient Temperature Symmetry versus Ambient Temperature

Typical Maximum Limit Mean Typical Minimum Limit

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CHARACTERISTIC PERFORMANCE DATA

Nonlinearity versus Ambient Temperature Symmetry versus Ambient Temperature

Typical Maximum Limit Mean Typical Minimum Limit

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CHARACTERISTIC PERFORMANCE DATA

Nonlinearity versus Ambient Temperature Symmetry versus Ambient Temperature

Typical Maximum Limit Mean Typical Minimum Limit

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CHARACTERISTIC PERFORMANCE DATA

Nonlinearity versus Ambient Temperature Symmetry versus Ambient Temperature

Typical Maximum Limit Mean Typical Minimum Limit

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CHARACTERISTIC PERFORMANCE DATA

Rise Time Propagation Delay Time

IP (20 A/div.) IP (20 A/div.)

VIOUT (0.5 V/div.) VIOUT (0.5 V/div.)

Response Time Power-on Delay

VIOUT (0.5 V/div.)

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Definitions of Accuracy Characteristics

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Definitions of Dynamic Response Characteristics

output to reflect a change in the primary current signal. Propaga-

conductor geometry. Propagation delay can be considered as a 0A

I (%) Primary Current

Transducer Output Accuracy

IP (A) +IP (A)

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Chopper Stabilization Technique

Concept of Chopper Stabilization Technique

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PACKAGE OUTLINE DRAWING

For Reference Only Not for Tooling Use

14.0 0.2 0.5

1.9 0.2 1.5

C Branding scale and appearance at supplier discretion 1

Creepage distance, current terminals to signal pins: 7.25 mm

Package CB, 5-pin Package, Leadform PFF

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For Reference Only Not for Tooling Use

2.75 0.10 B PCB Layout Reference View